{"meta":{"query_hash":"b4a16a220b7e","filters":{"topic":"Copper Interconnects and Reliability"},"cohort_total":175,"direct_labels_cover":0,"predictions_cover":175,"exported":175,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/b4a16a220b7e","api":"https://metacan.xera.ac/api/v1/cohort?topic=Copper+Interconnects+and+Reliability"},"results":[{"id":"W1527696353","doi":"10.1109/irws.2004.1422743","title":"Effects of capillary forces on the global thinning of copper metallization under electromigration stress","year":2005,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Void (composites); Copper; Materials science; Electric field; Capillary action; Mechanics; Instability; Dielectric; Finite element method; Boundary value problem; Composite material; Condensed matter physics; Metallurgy; Optoelectronics; Structural engineering; Physics; Engineering","score_opus":0.007610294167431161,"score_gpt":0.24131467820565225,"score_spread":0.23370438403822108,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1527696353","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9950636,0.0001744304,0.001592098,0.00069114234,0.00009864791,0.0002085972,0.000004349784,0.000022336368,0.002144794],"genre_scores_gemma":[0.99940825,0.000021344027,0.0002365963,0.00022711973,0.000030708827,0.0000051715474,0.0000024039934,0.000003606649,0.00006482648],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99926764,0.00009343673,0.00020191458,0.00013531992,0.00019398697,0.00010769408],"domain_scores_gemma":[0.99943364,0.00021463922,0.00009726592,0.00015578685,0.00008119971,0.00001747513],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002533306,0.00007659526,0.000128542,0.000015521253,0.0000491032,0.000019158317,0.00013278601,0.000042402873,0.00023531502],"category_scores_gemma":[0.00008896049,0.000040442334,0.00004995519,0.000088562774,0.00006958365,0.00010728475,0.000028882185,0.000032749933,0.00000921906],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000035368303,0.00009380816,0.00045850538,0.00005443691,0.000013470203,1.01027155e-7,0.00027835314,0.0026336156,0.9420716,0.053750828,0.00032465588,0.00028525697],"study_design_scores_gemma":[0.00012992571,0.0001348871,0.0029201782,0.000041243544,0.000019395735,5.7318385e-7,0.00013010789,0.0012334293,0.9940006,0.0012792523,0.00006008541,0.000050324303],"about_ca_topic_score_codex":0.00023912202,"about_ca_topic_score_gemma":0.00031446613,"teacher_disagreement_score":0.052471578,"about_ca_system_score_codex":0.00004660674,"about_ca_system_score_gemma":0.000025351794,"threshold_uncertainty_score":0.25765345},"labels":[],"label_agreement":null},{"id":"W1580141928","doi":"10.1002/0470009403.ch18","title":"Interdiffusion in Thin Films","year":2005,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Windsor","funders":"","keywords":"Waviness; Electromigration; Diffusion; Materials science; Thin film; Welding; Surface diffusion; Metallurgy; Composite material; Nanotechnology; Thermodynamics; Chemistry; Physics; Adsorption","score_opus":0.008081511453186559,"score_gpt":0.25215835310514784,"score_spread":0.24407684165196128,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1580141928","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0048098415,0.00033166632,0.000052307554,0.00022626066,0.0010326736,0.00018110375,0.000016190577,0.00019317183,0.9931568],"genre_scores_gemma":[0.0108278105,0.000052624328,0.0013710787,0.00022421998,0.0002088459,0.000009200858,0.000004401594,0.000116269664,0.98718554],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9991373,0.000039707553,0.00019050809,0.00033040534,0.00012313317,0.00017898055],"domain_scores_gemma":[0.9995356,0.000023351642,0.00005587514,0.0003391777,0.00000740237,0.000038597882],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00018838499,0.00015354015,0.00022953638,0.000121326164,0.000010702418,0.00003325882,0.00025704448,0.00021987715,0.36552903],"category_scores_gemma":[0.00002751801,0.00010127809,0.000052800853,0.0000485623,0.000049851616,0.000026018814,0.00012158431,0.0001309566,0.0028642828],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000072115845,0.00009314832,0.000037001406,0.000042449174,0.0000017932354,0.0000047110957,0.00013360965,0.0000022267461,0.03276512,0.0002474226,0.9617557,0.0049096076],"study_design_scores_gemma":[0.00018918501,0.00002536038,0.000059165795,0.000264945,0.0000030201866,0.0000026350726,0.00006235213,0.000071304064,0.0065547423,0.000057880003,0.9925043,0.00020511875],"about_ca_topic_score_codex":0.002240514,"about_ca_topic_score_gemma":0.0061789416,"teacher_disagreement_score":0.36266473,"about_ca_system_score_codex":0.000035026434,"about_ca_system_score_gemma":0.000021614343,"threshold_uncertainty_score":0.9979121},"labels":[],"label_agreement":null},{"id":"W1581170550","doi":"10.1023/a:1008375423418","title":"A 0.8 μm BiCMOS Gate Driver for IGBT Power Switch","year":2000,"lang":"en","type":"article","venue":"Analog Integrated Circuits and Signal Processing","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Insulated-gate bipolar transistor; Gate driver; Electrical engineering; BiCMOS; Bipolar junction transistor; Voltage; High voltage; Gate voltage; Electronic engineering; Transistor; Materials science; Engineering","score_opus":0.013425287337960855,"score_gpt":0.2450639432631991,"score_spread":0.23163865592523825,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1581170550","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9870703,0.00087389915,0.0055288533,0.0002480226,0.00011430805,0.00031107498,0.000046016976,0.00012781126,0.0056797164],"genre_scores_gemma":[0.99801284,0.000036070443,0.0001565638,0.00061118125,0.00008219191,0.000032078657,0.00001525429,0.000026616975,0.001027185],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998271,0.00005558517,0.00039505205,0.000598917,0.00019888689,0.0004805596],"domain_scores_gemma":[0.9991935,0.00009119753,0.0000926989,0.00016956104,0.00029537026,0.00015770303],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00046269997,0.00026300497,0.0003365904,0.000080026555,0.00042111508,0.00036822166,0.00022568322,0.00015199604,0.004130762],"category_scores_gemma":[0.00004035287,0.00018260337,0.0000965338,0.00024433882,0.00020997177,0.00036336473,0.000016429525,0.00019808619,0.00007206581],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001095428,0.00016277934,0.00049635477,0.00015625174,0.000029370996,0.000018757497,0.0019019445,0.000110001725,0.593345,0.00039388903,0.0012386179,0.4020375],"study_design_scores_gemma":[0.009135085,0.0044409246,0.009208439,0.00389204,0.00075941125,0.00059795997,0.008200608,0.09420684,0.6345123,0.049888242,0.17930734,0.005850832],"about_ca_topic_score_codex":0.0002188669,"about_ca_topic_score_gemma":0.000048166152,"teacher_disagreement_score":0.39618665,"about_ca_system_score_codex":0.000045095083,"about_ca_system_score_gemma":0.0001452392,"threshold_uncertainty_score":0.9967796},"labels":[],"label_agreement":null},{"id":"W1871803452","doi":"10.1109/icpadm.1994.413980","title":"Dual-frequency plasma deposition of high quality insulating thin films","year":2002,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Materials science; Dielectric; Substrate (aquarium); Analytical Chemistry (journal); Hexamethyldisiloxane; Plasma-enhanced chemical vapor deposition; Amorphous solid; Deposition (geology); Dissipation factor; Electrical resistivity and conductivity; Plasma; Thin film; Microwave; Permittivity; Chemical vapor deposition; Optoelectronics; Nanotechnology; Electrical engineering; Physics; Crystallography; Chemistry","score_opus":0.031253195010215354,"score_gpt":0.2684792935558295,"score_spread":0.23722609854561416,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1871803452","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98612326,0.000029109817,0.00035198085,0.00032272033,0.00037356405,0.00011049529,0.000021651425,0.000087533364,0.012579681],"genre_scores_gemma":[0.9886432,0.000005573926,0.010911412,0.00007687388,0.000035036952,0.000005081089,0.0000032286787,0.0000063582456,0.00031323222],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99878275,0.00012006731,0.00045630315,0.00024885143,0.00021997352,0.00017207723],"domain_scores_gemma":[0.99925023,0.0001657908,0.00013225559,0.00031219577,0.000090211215,0.00004932085],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00045811536,0.00009760429,0.00019250915,0.000029130837,0.000080643666,0.000034649445,0.00012317552,0.00007372943,0.00898037],"category_scores_gemma":[0.00022905464,0.00007141517,0.00005802953,0.00009165351,0.000084226485,0.00018679598,0.000065816654,0.00007096983,0.00015810943],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009043591,0.00013915011,0.0017861084,0.000059764534,0.0000039190986,0.0000023552109,0.0006334961,0.00013584948,0.98778397,0.0077460688,0.0002853754,0.0014149151],"study_design_scores_gemma":[0.00042755198,0.00015601207,0.012418527,0.00005557448,0.000010560754,0.000013789246,0.0002642797,0.008948363,0.9741757,0.0032935413,0.000021579484,0.00021454935],"about_ca_topic_score_codex":0.004688487,"about_ca_topic_score_gemma":0.00027411053,"teacher_disagreement_score":0.013608283,"about_ca_system_score_codex":0.000027535747,"about_ca_system_score_gemma":0.000008757106,"threshold_uncertainty_score":0.99192554},"labels":[],"label_agreement":null},{"id":"W1899832544","doi":"10.1109/vmic.1990.127894","title":"A contact electromigration study of Al-Si-Cu alloys","year":2002,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Electromigration; Materials science; Silicon; Alloy; Contact resistance; Aluminium; Metallurgy; Current density; Copper; Optoelectronics; Nanotechnology; Composite material","score_opus":0.02119953276220001,"score_gpt":0.2564882317802021,"score_spread":0.23528869901800206,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1899832544","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9938222,0.000030567368,0.000071517024,0.00043776372,0.00015600298,0.00027826702,0.000001774451,0.000048894763,0.005152998],"genre_scores_gemma":[0.998823,0.000006516002,0.00008650389,0.00017810315,0.000019244304,0.000010578117,4.6252765e-7,0.000004738521,0.00087083876],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99919397,0.000068231326,0.00023067115,0.00020638644,0.00016233671,0.0001384194],"domain_scores_gemma":[0.9995247,0.000064701766,0.000054659035,0.00025450942,0.000067186156,0.000034255652],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00023817395,0.00007481107,0.00015142688,0.000028432909,0.000042221192,0.000028768722,0.00013210175,0.00002587844,0.00580917],"category_scores_gemma":[0.000064569795,0.0000507125,0.000035895,0.00006963731,0.000019410969,0.00010234524,0.000034263223,0.000043415806,0.00014238794],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001736358,0.0007744625,0.0016946224,0.000005339275,0.000006557499,0.000001356989,0.0014705351,0.000004036582,0.989219,0.0002852426,0.0061551267,0.00036633515],"study_design_scores_gemma":[0.0030955214,0.0060378974,0.031185796,0.000030328236,0.00006685042,0.000015025626,0.0051000454,0.006514707,0.9404996,0.0004412928,0.006494126,0.0005188154],"about_ca_topic_score_codex":0.0009611447,"about_ca_topic_score_gemma":0.0015842412,"teacher_disagreement_score":0.04871943,"about_ca_system_score_codex":0.000024311521,"about_ca_system_score_gemma":0.0000066797334,"threshold_uncertainty_score":0.99509966},"labels":[],"label_agreement":null},{"id":"W1965852723","doi":"10.1007/s11664-001-0038-7","title":"Microstructural characterization of inlaid copper interconnect lines","year":2001,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":70,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Trench; Microstructure; Annealing (glass); Grain size; Copper; Texture (cosmology); Diffraction; Composite material; Grain boundary; Metallurgy; Optics","score_opus":0.008954485509622353,"score_gpt":0.24996902846438349,"score_spread":0.24101454295476113,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1965852723","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99734396,0.00018684674,0.000099833225,0.00042035998,0.0017093637,0.00013208995,0.0000333514,0.000013993861,0.00006022644],"genre_scores_gemma":[0.9988979,0.0002707999,0.00008506993,0.00010310008,0.00049219275,0.0000020632326,0.000008594518,0.000017252045,0.00012301358],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9979892,0.00017692275,0.0010643135,0.00016705458,0.00023517628,0.00036737596],"domain_scores_gemma":[0.99835545,0.000062606094,0.00088112295,0.0002133677,0.00042195243,0.0000655142],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0010365547,0.00017275968,0.00055029336,0.00012498171,0.00004958574,0.00008743063,0.0003582246,0.00009680445,0.0031749555],"category_scores_gemma":[0.00019028205,0.00011924826,0.00011255771,0.00012788564,0.00009631598,0.00037298584,0.000065198416,0.00012478391,0.000021235464],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00047158252,0.00005483376,0.0003098607,0.00004863962,0.000023465884,0.000006834703,0.0001810019,0.0000041169797,0.9979617,0.000272064,0.00012196802,0.00054391794],"study_design_scores_gemma":[0.00051635003,0.0005858624,0.0024838573,0.000111143476,0.000034125507,0.0004908775,0.000039148123,0.0000037507532,0.9905422,0.0005717572,0.004491372,0.00012956088],"about_ca_topic_score_codex":0.000033431155,"about_ca_topic_score_gemma":0.000011045357,"teacher_disagreement_score":0.007419519,"about_ca_system_score_codex":0.00011292452,"about_ca_system_score_gemma":0.00019437989,"threshold_uncertainty_score":0.9977363},"labels":[],"label_agreement":null},{"id":"W1967073963","doi":"10.1007/bf03027341","title":"Evolution of interface voids under current and temperature stress in integrated circuit metallization","year":2004,"lang":"en","type":"article","venue":"Metals and Materials International","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Materials science; Void (composites); Copper; Isotropy; Finite element method; Dielectric; Composite material; Boundary value problem; Short circuit; Mechanics; Stress (linguistics); Conductor; Metallurgy; Voltage; Optoelectronics; Structural engineering; Electrical engineering","score_opus":0.014814883801921383,"score_gpt":0.2705647128364119,"score_spread":0.25574982903449056,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1967073963","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99409646,0.0010362746,0.002141677,0.00021653782,0.0019822689,0.00018194814,0.00022631418,0.000022063725,0.00009646713],"genre_scores_gemma":[0.9993388,0.00022835842,0.00023002611,0.000017787288,0.00007238123,0.00001578317,0.00003823422,0.000009707112,0.000048923917],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99882114,0.00008835552,0.0004412989,0.00031531858,0.00019634358,0.00013753152],"domain_scores_gemma":[0.99952275,0.000030499832,0.00013621764,0.000120074015,0.0001475409,0.000042944994],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00046302436,0.00015217031,0.00027457008,0.00013128323,0.000036181562,0.00012163692,0.0001461867,0.0000811593,0.0005374204],"category_scores_gemma":[0.000083533334,0.00011587892,0.000028623157,0.000087466055,0.00013772235,0.0003336279,0.000119251396,0.000075804506,0.000005718839],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004844186,0.00011574023,0.00029861263,0.00007212182,0.000015106834,8.194855e-7,0.00020717924,0.00039182772,0.96534854,0.033290494,0.0000070084375,0.00020408131],"study_design_scores_gemma":[0.000867156,0.00007376736,0.018809494,0.0003137939,0.000025307567,0.000011881339,0.0002593211,0.00003922752,0.9643147,0.014787561,0.00032209663,0.00017569627],"about_ca_topic_score_codex":0.00051703077,"about_ca_topic_score_gemma":0.00014655296,"teacher_disagreement_score":0.01851088,"about_ca_system_score_codex":0.00012091761,"about_ca_system_score_gemma":0.00004860872,"threshold_uncertainty_score":0.5884377},"labels":[],"label_agreement":null},{"id":"W1967077032","doi":"10.1016/j.micron.2013.11.002","title":"In situ TEM study of stability of TaRhx diffusion barriers using a novel sample preparation method","year":2013,"lang":"en","type":"article","venue":"Micron","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Institute for Nanotechnology; University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Materials science; Diffusion barrier; Nucleation; Transmission electron microscopy; Diffusion; Focused ion beam; Atomic diffusion; Analytical Chemistry (journal); Grain size; Surface diffusion; Void (composites); Layer (electronics); Composite material; Crystallography; Nanotechnology; Ion; Chemistry","score_opus":0.030514685576470826,"score_gpt":0.318507289268438,"score_spread":0.2879926036919672,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1967077032","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99527395,0.000013667955,0.003759289,0.000025501873,0.00015344407,0.00071036787,0.00002034968,0.000008746943,0.000034685785],"genre_scores_gemma":[0.9875605,4.24164e-7,0.012394614,0.000010814921,0.000010068811,0.000012083898,0.0000013474937,0.0000053983676,0.0000047240114],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99882895,0.00019082199,0.00042755448,0.0002761238,0.00013880024,0.0001377448],"domain_scores_gemma":[0.9992041,0.0001713901,0.00014511257,0.00032735703,0.000112527836,0.000039498143],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008213063,0.00008950187,0.00024735744,0.00005208733,0.00003661152,0.000016030352,0.00013250111,0.000051578165,0.0008862085],"category_scores_gemma":[0.0002589814,0.000070202695,0.0000365428,0.00011767893,0.00005666809,0.00018578961,0.00011664724,0.00005388544,0.0000030488154],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000058809892,0.00051048934,0.012160358,0.00004444946,0.0000025086044,7.104765e-8,0.0070243436,0.0001492634,0.97991556,0.0000059590193,0.000010205655,0.0001179584],"study_design_scores_gemma":[0.0005587539,0.00031841468,0.016243888,0.00002219681,0.000010452428,6.9302405e-7,0.00357066,0.001881133,0.97715616,0.00013209568,0.000025204612,0.00008031797],"about_ca_topic_score_codex":0.02456936,"about_ca_topic_score_gemma":0.0020728088,"teacher_disagreement_score":0.022496551,"about_ca_system_score_codex":0.00009218527,"about_ca_system_score_gemma":0.000047762198,"threshold_uncertainty_score":0.98192614},"labels":[],"label_agreement":null},{"id":"W1969226800","doi":"10.1116/1.2013311","title":"Silver coplanar waveguides as the passive components of choice for microwave integrated circuits","year":2005,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Coplanar waveguide; Monolithic microwave integrated circuit; Microwave; Materials science; Electromigration; Resistive touchscreen; Optoelectronics; Fabrication; Electronic circuit; Electrical engineering; Electronic component; Broadband; Integrated circuit; Electronic engineering; CMOS; Telecommunications; Computer science; Engineering; Composite material; Amplifier","score_opus":0.01967539731710649,"score_gpt":0.2536848253871493,"score_spread":0.23400942807004282,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1969226800","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9838733,0.012869256,0.0010678418,0.0017048656,0.00016852094,0.0002604749,0.0000085084785,0.000013001155,0.000034197645],"genre_scores_gemma":[0.9979412,0.00021682546,0.001576821,0.00016354925,0.000072452014,0.0000058074565,6.496498e-7,0.000010578492,0.000012102992],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9980861,0.000037101407,0.0006133699,0.00035098236,0.00043761806,0.0004748465],"domain_scores_gemma":[0.99793994,0.00006587192,0.00066655903,0.00019608668,0.0010428656,0.00008869778],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0015977155,0.00022160771,0.00040487148,0.0004627855,0.00051588763,0.00017755036,0.00066945667,0.00010355653,0.000012463999],"category_scores_gemma":[0.00021656287,0.00012777963,0.000068465284,0.0005527291,0.0012435832,0.00031770035,0.00011776945,0.0002870373,2.9825722e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000059182203,0.00004254924,0.00028015528,0.0000553253,0.000027458771,4.2482813e-7,0.0005027993,0.000004440231,0.94286305,0.00052000885,0.000037531685,0.055607054],"study_design_scores_gemma":[0.0009672517,0.00093941484,0.0011028721,0.00015374119,0.000102603706,0.00019568192,0.00038599403,0.00022329806,0.978137,0.011418091,0.006157237,0.00021678997],"about_ca_topic_score_codex":0.0000101629075,"about_ca_topic_score_gemma":0.00001928055,"teacher_disagreement_score":0.055390265,"about_ca_system_score_codex":0.00021013038,"about_ca_system_score_gemma":0.00048771978,"threshold_uncertainty_score":0.5210702},"labels":[],"label_agreement":null},{"id":"W1969230856","doi":"10.1007/s10854-013-1662-8","title":"Stability of TaRhx as a potential diffusion barrier for Cu metallization: capacitance–voltage tests after bias temperature stress","year":2013,"lang":"en","type":"article","venue":"Journal of Materials Science Materials in Electronics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"National Research Council Canada; Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Capacitor; Materials science; Diffusion barrier; Capacitance; Analytical Chemistry (journal); Barrier layer; Diffusion; Stress (linguistics); Optoelectronics; Composite material; Voltage; Layer (electronics); Chemistry; Electrical engineering; Electrode; Thermodynamics","score_opus":0.010332411263483254,"score_gpt":0.25049008616885027,"score_spread":0.24015767490536702,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1969230856","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9936754,0.00043523754,0.00011255153,0.00021692709,0.0042009493,0.0009994891,0.00031789235,0.000020953688,0.000020567806],"genre_scores_gemma":[0.99810195,0.000109086446,0.0011519793,0.00009886026,0.0003721238,0.00009196744,0.000007958358,0.000034181172,0.00003190972],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99503344,0.00036774302,0.0020153618,0.00061301293,0.0010401749,0.00093025353],"domain_scores_gemma":[0.99625367,0.00019197322,0.0012395119,0.000606503,0.0014876089,0.00022074417],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.005639601,0.00039579847,0.0010610644,0.00032508065,0.00020767775,0.00073018606,0.0011088098,0.00024315182,0.0053331186],"category_scores_gemma":[0.0014058375,0.00028031855,0.00016416352,0.00046379358,0.0007998151,0.001557147,0.00018682996,0.00018966873,0.000021944055],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000622094,0.00029311524,0.00040162343,0.00026516186,0.000010650215,0.000007232738,0.00035991322,0.00007755184,0.99743146,0.0004362987,0.000035373916,0.000059505364],"study_design_scores_gemma":[0.00090388383,0.00090392196,0.0042094286,0.00023547941,0.000043472075,0.000052524076,0.00027658694,0.00001795753,0.986671,0.006320946,0.00006005801,0.00030478032],"about_ca_topic_score_codex":0.00021594539,"about_ca_topic_score_gemma":0.00006418123,"teacher_disagreement_score":0.010760518,"about_ca_system_score_codex":0.0004045127,"about_ca_system_score_gemma":0.00094236643,"threshold_uncertainty_score":0.9999649},"labels":[],"label_agreement":null},{"id":"W1973820040","doi":"10.1557/jmr.2001.0458","title":"Effect of material properties on integration damage in organosilicate glass films","year":2001,"lang":"en","type":"article","venue":"Journal of materials research/Pratt's guide to venture capital sources","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":24,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Photoresist; Dielectric; Chemical vapor deposition; Plasma; Deposition (geology); Chemical engineering; Moiety; Thin film; Mesoporous material; Composite material; Nanotechnology; Optoelectronics; Layer (electronics); Organic chemistry","score_opus":0.023967585899613304,"score_gpt":0.3296358317462998,"score_spread":0.3056682458466865,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1973820040","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99593294,0.00020200267,0.000007696562,0.0012482669,0.0015769454,0.00072605157,0.000070151706,0.000022558705,0.00021339086],"genre_scores_gemma":[0.9988264,0.00009046123,0.000108477594,0.0000631538,0.0005545583,0.00003335604,0.000007106201,0.00003948921,0.00027703715],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9943966,0.0019228179,0.0014404374,0.0004124309,0.0012069367,0.00062072487],"domain_scores_gemma":[0.9977226,0.00040235659,0.00049472303,0.0004621498,0.0006777793,0.00024036596],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.008557452,0.0003261701,0.0008688654,0.0005507887,0.0001411086,0.00044993983,0.0009137202,0.00021689327,0.0028948411],"category_scores_gemma":[0.0024783583,0.00019680879,0.00014836504,0.00038972741,0.00032479118,0.00045158056,0.00031093459,0.0004046868,0.00016008293],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.004915148,0.00022687353,0.0002686512,0.00021192958,0.000018477174,0.00010041294,0.0015970721,0.00029388946,0.98747236,0.000060492384,0.0042763585,0.0005583166],"study_design_scores_gemma":[0.0008324611,0.0050620376,0.0016324939,0.00079627824,0.000017352202,0.00007666957,0.0008269638,0.000011162703,0.9875621,0.00009617976,0.0028903661,0.00019591331],"about_ca_topic_score_codex":0.00057909684,"about_ca_topic_score_gemma":0.00010514617,"teacher_disagreement_score":0.0060790936,"about_ca_system_score_codex":0.00022806671,"about_ca_system_score_gemma":0.0001366839,"threshold_uncertainty_score":0.99801666},"labels":[],"label_agreement":null},{"id":"W1974364079","doi":"10.1016/j.tsf.2007.08.071","title":"Plasma ash processing solutions for advanced interconnect technology","year":2007,"lang":"en","type":"article","venue":"Thin Solid Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Interconnection; Plasma; Engineering physics; Materials science; Process engineering; Computer science; Nanotechnology; Engineering; Telecommunications; Physics","score_opus":0.021500699061331806,"score_gpt":0.30461115949745987,"score_spread":0.2831104604361281,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1974364079","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96120197,0.00034058566,0.03211627,0.0012260599,0.0013325345,0.00053677027,0.000032377207,0.0004885989,0.0027248429],"genre_scores_gemma":[0.98395675,0.000006964499,0.015121808,0.00018332904,0.000097697004,0.00006151905,0.0000062727595,0.0000232367,0.0005424359],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99830395,0.000017551787,0.00039834756,0.00043366745,0.00013556881,0.0007108933],"domain_scores_gemma":[0.9991219,0.00012719198,0.00012269244,0.00036136206,0.0001835929,0.00008325558],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014713675,0.00017239907,0.0002589325,0.00013510142,0.0003810793,0.00006575413,0.00040317734,0.00019145948,0.0003407351],"category_scores_gemma":[0.00033975948,0.00014138753,0.00008869169,0.00021974782,0.00025397682,0.00021224174,0.00020422458,0.00018354223,0.00012821397],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000114915776,0.00012130375,0.00006457417,0.0000865232,0.0000074940313,0.000004679343,0.0010029273,0.00027579133,0.9404964,0.00339066,0.0013210246,0.05311373],"study_design_scores_gemma":[0.0010472101,0.0003844655,0.00015932994,0.00017487923,0.000026758751,0.000054163043,0.0027697047,0.0073286872,0.9696448,0.008951487,0.009045624,0.0004128813],"about_ca_topic_score_codex":0.000021011141,"about_ca_topic_score_gemma":0.00017891583,"teacher_disagreement_score":0.052700847,"about_ca_system_score_codex":0.00007446416,"about_ca_system_score_gemma":0.000072454146,"threshold_uncertainty_score":0.5765616},"labels":[],"label_agreement":null},{"id":"W1980943939","doi":"10.1021/cm051910o","title":"XRD and XPS Study of Cu−Ni Interactions on Reduced Copper−Nickel−Aluminum Oxide Solid Solution Catalysts","year":2006,"lang":"en","type":"article","venue":"Chemistry of Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":236,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Copper; Nickel; Alloy; Materials science; Solid solution; Catalysis; Inorganic chemistry; Hydrogen; Oxide; Aluminium; X-ray photoelectron spectroscopy; Metallurgy; Chemistry; Chemical engineering","score_opus":0.016460775421120243,"score_gpt":0.2780758528358391,"score_spread":0.26161507741471884,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1980943939","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9980754,0.000029172004,0.0000017402208,0.00008203334,0.00055955595,0.00026873397,0.00013296316,0.00003920502,0.0008111807],"genre_scores_gemma":[0.9992295,0.000004683267,0.00006449811,0.0000074474433,0.00012749452,0.000027490792,0.00003283632,0.000015277908,0.000490786],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99836034,0.000074709445,0.00071276724,0.00040776999,0.00022461962,0.0002197751],"domain_scores_gemma":[0.9988747,0.00007968366,0.00036687887,0.0004843641,0.00013909533,0.000055231183],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00044421383,0.00019272995,0.00047543025,0.000033769906,0.00008725786,0.000047530077,0.00021262578,0.00009215497,0.0004463388],"category_scores_gemma":[0.00014327357,0.0001656368,0.00004869546,0.000060913157,0.00019368151,0.000108834916,0.00014132756,0.00006507473,0.000019287683],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016739513,0.0006478648,0.0001268015,0.0002606828,0.000014596227,0.0000025071895,0.00029553272,0.000014645702,0.9969186,0.0000052192813,0.0015199379,0.000026191465],"study_design_scores_gemma":[0.00055472506,0.00013148495,0.003270115,0.00013426658,0.00004340108,0.00001650485,0.0007105001,0.000004778949,0.99486357,0.00006221694,0.000054115826,0.00015432361],"about_ca_topic_score_codex":0.002068979,"about_ca_topic_score_gemma":0.00006908252,"teacher_disagreement_score":0.0031433136,"about_ca_system_score_codex":0.00006413266,"about_ca_system_score_gemma":0.000042277163,"threshold_uncertainty_score":0.6754473},"labels":[],"label_agreement":null},{"id":"W1983076843","doi":"10.1063/1.1779343","title":"Influence of overlayer thickness on the density of Lomer dislocations in nanoscale Ni–Cu bilayer thin films","year":2004,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Overlayer; Materials science; Dislocation; Condensed matter physics; Partial dislocations; Crystallography; Thin film; Bilayer; Nanotechnology; Composite material; Chemistry; Physics; Membrane","score_opus":0.010847821250794526,"score_gpt":0.22540056602261638,"score_spread":0.21455274477182185,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1983076843","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9972738,0.0000031669074,0.0003079928,0.0016430347,0.00010147688,0.00029348847,0.000016879705,0.000015743057,0.00034442657],"genre_scores_gemma":[0.9976277,0.0000017464151,0.00016612084,0.0021299077,0.000024552006,0.00003201754,0.000002173226,0.000010477129,0.000005353825],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99893504,0.00004140755,0.00029134704,0.00026914547,0.00027397476,0.00018910927],"domain_scores_gemma":[0.9990274,0.00020404172,0.0001437045,0.0005425682,0.000055883316,0.00002646036],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029580973,0.00013501974,0.00021971334,0.000028335255,0.000066678134,0.000015379297,0.00032933775,0.000049842776,0.000036967176],"category_scores_gemma":[0.000031702464,0.00008885633,0.00005845392,0.00025119714,0.00033724407,0.00008402322,0.000092895476,0.00016681106,0.0000447917],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028196637,0.00015984978,0.0018628738,0.000027750591,0.0000054232705,4.358581e-7,0.0014010747,0.0801037,0.8968773,0.019374032,0.00012745906,0.00003192602],"study_design_scores_gemma":[0.00027820887,0.000019705634,0.041514207,0.0000657443,0.000010154633,4.6222152e-7,0.00014521673,0.000029367122,0.95408535,0.0037123123,0.000012252043,0.0001270422],"about_ca_topic_score_codex":0.0011933236,"about_ca_topic_score_gemma":0.00008414257,"teacher_disagreement_score":0.08007433,"about_ca_system_score_codex":0.000043868644,"about_ca_system_score_gemma":0.0000459881,"threshold_uncertainty_score":0.3623456},"labels":[],"label_agreement":null},{"id":"W1984274279","doi":"10.1063/1.2037947","title":"High-throughput resistivity apparatus for thin-film combinatorial libraries","year":2005,"lang":"en","type":"article","venue":"Review of Scientific Instruments","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Dalhousie University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electrical resistivity and conductivity; Materials science; Van der Pauw method; Temperature coefficient; Thin film; Sputter deposition; Sputtering; Composite material; Electrical engineering; Nanotechnology; Hall effect","score_opus":0.02059520625959138,"score_gpt":0.2766120540725946,"score_spread":0.2560168478130032,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1984274279","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98152536,0.0045335223,0.000052614123,0.0011049374,0.009722408,0.0012107069,0.0003443024,0.00006501114,0.001441113],"genre_scores_gemma":[0.9908383,0.0009134897,0.006563874,0.00028055068,0.00026845728,0.00007110254,0.00007229405,0.000015337228,0.0009765794],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99753225,0.00012952981,0.00073746184,0.0006483151,0.0005598983,0.00039251716],"domain_scores_gemma":[0.9984228,0.00011179054,0.00034209524,0.0007439883,0.00027077636,0.00010852266],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0022922964,0.00020235899,0.00055704394,0.000061752165,0.0003841036,0.0002345272,0.0006077329,0.000079635465,0.0011063699],"category_scores_gemma":[0.00048075418,0.00015249089,0.00019978225,0.00029547763,0.0005894661,0.00066757156,0.00024185062,0.000094432624,0.0001974046],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00047516444,0.0025160688,0.0006050335,0.033570662,0.0001175588,0.000002794812,0.0008399109,0.000028257004,0.19846793,0.23161028,0.29628617,0.23548016],"study_design_scores_gemma":[0.001215668,0.00018986431,0.0003279586,0.004610761,0.00009002837,0.000004032007,0.000028656055,0.00032882876,0.4788937,0.008640707,0.5052871,0.0003826793],"about_ca_topic_score_codex":0.00003978075,"about_ca_topic_score_gemma":0.000009485317,"teacher_disagreement_score":0.2804258,"about_ca_system_score_codex":0.00008887411,"about_ca_system_score_gemma":0.000210777,"threshold_uncertainty_score":0.99980676},"labels":[],"label_agreement":null},{"id":"W1985068714","doi":"10.4028/www.scientific.net/msf.426-432.3551","title":"Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines","year":2003,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Copper interconnect; Materials science; Interconnection; Microstructure; Texture (cosmology); Stress (linguistics); Metallurgy; Engineering physics; Composite material; Optoelectronics; Copper; Computer science; Engineering; Artificial intelligence","score_opus":0.015148206190518687,"score_gpt":0.2661528791625257,"score_spread":0.251004672972007,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1985068714","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9957107,0.00015523238,0.00006675525,0.0008229109,0.0020518682,0.00033913914,0.00021254372,0.00006350844,0.0005773658],"genre_scores_gemma":[0.9976748,0.00002191363,0.0017439321,0.00034284653,0.00005942332,0.000026775044,0.000008342771,0.00001587763,0.00010607628],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9975779,0.00015354254,0.0005009758,0.00076782785,0.00029947283,0.000700276],"domain_scores_gemma":[0.9989733,0.00008023323,0.00013139984,0.00049148244,0.00013071187,0.0001928625],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0014163998,0.00025541542,0.00034354092,0.00021750684,0.00036679496,0.00064285856,0.0005452543,0.00011598441,0.0014972938],"category_scores_gemma":[0.00093578605,0.00019152653,0.000032947824,0.0004830359,0.0013725525,0.0006784554,0.0002831714,0.000114191236,0.000051057687],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011950965,0.000035252404,0.009126365,0.000041654377,0.0000010683532,0.000003945269,0.00035674253,0.000023102957,0.9865898,0.003441533,0.00018181761,0.00018678508],"study_design_scores_gemma":[0.00032982274,0.00007433494,0.010298643,0.00012185464,0.0000056128324,0.000049943123,0.0006896918,0.000044150413,0.98036534,0.006424977,0.0013200694,0.00027554503],"about_ca_topic_score_codex":0.0003792144,"about_ca_topic_score_gemma":0.00054019573,"teacher_disagreement_score":0.006224427,"about_ca_system_score_codex":0.00008882963,"about_ca_system_score_gemma":0.00020177338,"threshold_uncertainty_score":0.99941546},"labels":[],"label_agreement":null},{"id":"W1987363894","doi":"10.1116/1.1329124","title":"Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator","year":2001,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Deposition (geology); Monte Carlo method; Normalization (sociology); Materials science; Thin film; Sticking coefficient; Diffusion; Feature (linguistics); Physical vapor deposition; Simulation; Computer science; Computational science; Nanotechnology; Chemistry; Thermodynamics; Physics; Geology","score_opus":0.016602171461732308,"score_gpt":0.272232331330958,"score_spread":0.25563015986922566,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1987363894","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.979064,0.0008384571,0.018768676,0.00032831557,0.0007056912,0.00023949673,0.00002288502,0.00002943074,0.0000030850128],"genre_scores_gemma":[0.9698749,0.000012221949,0.030034125,0.000031181633,0.000031278683,0.0000016617581,3.952002e-7,0.000010926084,0.000003314871],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9978779,0.000025705118,0.00078269164,0.000391957,0.00044831316,0.00047342645],"domain_scores_gemma":[0.99820524,0.00013843755,0.00055821036,0.00024334317,0.0007404961,0.00011429131],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0015216932,0.00020438027,0.00046828427,0.00050700165,0.0005143066,0.00009617224,0.0005268617,0.00018593999,0.000040912684],"category_scores_gemma":[0.00021179432,0.00014422653,0.00012876106,0.0006112897,0.0008553464,0.00029235167,0.00023543373,0.00025464562,8.0633345e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010710229,0.00004968019,0.0011501986,0.000024301724,0.0000067856795,0.0000061769892,0.00011651695,0.37552518,0.6227725,0.000102961465,0.0000021509982,0.00013641913],"study_design_scores_gemma":[0.00053406315,0.00033355318,0.0003324824,0.00021488438,0.00004008993,0.00044647433,0.0003231752,0.83521867,0.16068187,0.0017235681,0.000002902543,0.00014825445],"about_ca_topic_score_codex":0.000050666902,"about_ca_topic_score_gemma":0.000010664623,"teacher_disagreement_score":0.46209067,"about_ca_system_score_codex":0.00008253026,"about_ca_system_score_gemma":0.00026005766,"threshold_uncertainty_score":0.5881387},"labels":[],"label_agreement":null},{"id":"W1989603230","doi":"10.1149/2.029312jes","title":"Accelerated Recrystallization in Electrodeposited Dual-Layer Copper Thin Films","year":2013,"lang":"en","type":"article","venue":"Journal of The Electrochemical Society","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Recrystallization (geology); Materials science; Copper; Electron backscatter diffraction; Electrical resistivity and conductivity; Current density; Diffraction; Metallurgy; Thin film; Composite material; Microstructure; Optics; Nanotechnology; Electrical engineering; Geology","score_opus":0.013282076294691742,"score_gpt":0.2451804561688304,"score_spread":0.23189837987413867,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1989603230","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99591136,0.00020444693,0.00063917646,0.0026206141,0.00022696209,0.00020699624,9.778405e-7,0.000018671228,0.00017079928],"genre_scores_gemma":[0.9966716,0.000053806423,0.0020422644,0.0009145359,0.00012374067,0.0000069929424,0.0000017242743,0.000014087405,0.00017120637],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99838495,0.00013318544,0.00056481716,0.00018454816,0.00036279217,0.00036971728],"domain_scores_gemma":[0.99895555,0.0001116616,0.00029868126,0.00020752675,0.0003413606,0.00008520577],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005679599,0.00014826309,0.00026277438,0.000021191205,0.00009928096,0.000116697796,0.00040381713,0.00017208878,0.0007493912],"category_scores_gemma":[0.00023934507,0.00008490353,0.00028488162,0.0003756421,0.00007973311,0.00028843377,0.00008957595,0.0005875162,0.000018620682],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000333931,0.00010765893,0.00076066115,0.000010933779,0.00001624005,4.591561e-7,0.00036735926,0.000031903768,0.98371506,0.000017629736,0.01491106,0.000027644965],"study_design_scores_gemma":[0.00044210974,0.00009404411,0.002948381,0.000051266652,0.000017338845,0.000059927148,0.00009471424,0.0015572094,0.9934831,0.0009042825,0.00022597115,0.000121631405],"about_ca_topic_score_codex":0.00006639661,"about_ca_topic_score_gemma":0.000007624233,"teacher_disagreement_score":0.01468509,"about_ca_system_score_codex":0.00025806008,"about_ca_system_score_gemma":0.00011878883,"threshold_uncertainty_score":0.82053083},"labels":[],"label_agreement":null},{"id":"W1990196925","doi":"10.1116/1.1463083","title":"Characterization of low permittivity (low-<i>k</i>) polymeric dielectric films for low temperature device integration","year":2002,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":25,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Chemical-mechanical planarization; Materials science; Dielectric; Permittivity; Thin-film transistor; Capacitance; Wafer; Optoelectronics; Amorphous solid; Fourier transform infrared spectroscopy; Annealing (glass); Benzocyclobutene; Electronic engineering; Composite material; Polishing; Optics","score_opus":0.009057465954702719,"score_gpt":0.23633417803593917,"score_spread":0.22727671208123645,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1990196925","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9953513,0.0009760812,0.00079063,0.0016219909,0.0007822411,0.00034445597,0.000052825446,0.000049984515,0.000030477297],"genre_scores_gemma":[0.997588,0.00049401383,0.0016030055,0.000108730084,0.000045654975,0.000012343684,0.0000024270125,0.000014576659,0.00013124697],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99770296,0.000063516345,0.00081091275,0.00048454182,0.00043884362,0.00049924967],"domain_scores_gemma":[0.9977539,0.00014191032,0.00085234735,0.00035150582,0.0007681245,0.00013217638],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013384336,0.0002701589,0.0005979451,0.0007221562,0.00042964608,0.00015249941,0.00074928085,0.00030707172,0.00021028586],"category_scores_gemma":[0.00038208673,0.00018866452,0.00014250833,0.0018337569,0.00091203593,0.0010132162,0.0001374456,0.0004072512,0.00000538175],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006298684,0.00023616257,0.0010207931,0.00007277627,0.000009949067,0.0000038407447,0.0004290016,0.000013245608,0.99420244,0.00017267014,0.000067731155,0.0037084126],"study_design_scores_gemma":[0.00051707716,0.0009179787,0.004867386,0.0002289322,0.000035952522,0.0001348985,0.0004531938,0.00801058,0.9843366,0.00018460971,0.00008282502,0.0002299614],"about_ca_topic_score_codex":0.000012146222,"about_ca_topic_score_gemma":0.000007857202,"teacher_disagreement_score":0.009865825,"about_ca_system_score_codex":0.0000580154,"about_ca_system_score_gemma":0.00015542975,"threshold_uncertainty_score":0.76935154},"labels":[],"label_agreement":null},{"id":"W1992732435","doi":"10.1088/1009-0630/11/6/08","title":"Effect of CHF<sub>3</sub>Plasma Treatment on the Characteristics of SiCOH Low-<i>k</i>Film","year":2009,"lang":"en","type":"article","venue":"Plasma Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"National Research Council Canada","keywords":"Contact angle; Materials science; Analytical Chemistry (journal); Dielectric; Electron cyclotron resonance; Fourier transform infrared spectroscopy; Surface roughness; Deposition (geology); Capacitance; Surface finish; Chemistry; Composite material; Chemical engineering; Electrode; Optoelectronics; Ion; Chromatography","score_opus":0.005811197024774402,"score_gpt":0.22547297757722412,"score_spread":0.21966178055244973,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1992732435","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99711645,0.000018148769,0.000003402959,0.0017762666,0.00029759353,0.0003049671,0.000023579347,0.000054256558,0.00040535876],"genre_scores_gemma":[0.99981457,0.000059312395,0.000032042255,0.000048170114,0.000014476112,0.00001515594,6.142715e-7,0.0000040942323,0.000011594126],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986384,0.00004832382,0.00029282982,0.0003999047,0.00029652883,0.00032399799],"domain_scores_gemma":[0.99874455,0.0003674541,0.00017410972,0.000510281,0.00015154974,0.000052033156],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009435792,0.00016905132,0.0003531721,0.00021555618,0.00018574749,0.000031092095,0.0004878765,0.00011370605,0.000019016701],"category_scores_gemma":[0.00073297304,0.00009016414,0.000043192416,0.0006104566,0.0019006683,0.00008810002,0.00009965774,0.00010622702,0.000027232874],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006840589,0.000120182456,0.0006042693,0.00001837606,0.0000029206185,0.000003051227,0.00007686773,0.000002193981,0.9360465,0.0029990887,0.000025872692,0.060032293],"study_design_scores_gemma":[0.00031239318,0.0036894542,0.0018517768,0.000054913413,0.000016771488,0.00001915778,0.00003854095,0.00069546304,0.9926743,0.0004547101,0.000102383805,0.00009014434],"about_ca_topic_score_codex":0.000010606786,"about_ca_topic_score_gemma":0.000007339578,"teacher_disagreement_score":0.05994215,"about_ca_system_score_codex":0.00005745805,"about_ca_system_score_gemma":0.00009524015,"threshold_uncertainty_score":0.70030916},"labels":[],"label_agreement":null},{"id":"W1993435986","doi":"10.1021/cm030029c","title":"Synthesis and Characterization of Ruthenium Complexes with Two Fluorinated Amino Alkoxide Chelates. The Quest To Design Suitable MOCVD Source Reagents","year":2003,"lang":"en","type":"article","venue":"Chemistry of Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada; Steacie Institute for Molecular Sciences","funders":"","keywords":"Alkoxide; Chemistry; Ruthenium; X-ray photoelectron spectroscopy; Homoleptic; Chelation; Ligand (biochemistry); Reagent; Octahedron; Alcohol oxidation; Crystallography; Inorganic chemistry; Metal; Alcohol; Crystal structure; Organic chemistry; Catalysis","score_opus":0.015190704490135853,"score_gpt":0.2269943103381422,"score_spread":0.21180360584800637,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1993435986","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99884874,0.000022585271,0.00029060047,0.00009182863,0.00009995035,0.0003049862,0.00010686804,0.000030009087,0.00020442747],"genre_scores_gemma":[0.9989171,0.000011091934,0.00053614174,0.000021116548,0.000027964421,0.000038559323,0.000010091918,0.000019178497,0.00041875753],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986872,0.00016096974,0.00043039685,0.0003096773,0.00018241239,0.00022933206],"domain_scores_gemma":[0.99891293,0.00019832012,0.00026612444,0.00040152308,0.00014897823,0.00007214414],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0010062072,0.00018191541,0.00039598497,0.000017546918,0.00008462137,0.000069577865,0.00024068666,0.00007463987,0.0009897047],"category_scores_gemma":[0.0003213736,0.0001171611,0.00002478396,0.00008835608,0.00022548797,0.000087051194,0.00007583359,0.00003831807,0.0000075102726],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014124734,0.000061095896,0.00014705119,0.00023528097,0.000016287355,8.331583e-7,0.0002763854,0.000023946746,0.9990029,0.000021639484,0.000028591418,0.000044749257],"study_design_scores_gemma":[0.00022806137,0.00004366739,0.0009778492,0.00016867132,0.000040085662,0.000016131009,0.00010758984,0.0000065532504,0.9979529,0.000039639825,0.00027615594,0.00014274512],"about_ca_topic_score_codex":0.00012537991,"about_ca_topic_score_gemma":0.0000013456103,"teacher_disagreement_score":0.0010500418,"about_ca_system_score_codex":0.000026271342,"about_ca_system_score_gemma":0.000040571795,"threshold_uncertainty_score":0.9999235},"labels":[],"label_agreement":null},{"id":"W1994438562","doi":"10.5555/2561828.2561933","title":"Redundancy-aware electromigration checking for mesh power grids","year":2013,"lang":"en","type":"article","venue":"TSpace","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":31,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Redundancy (engineering); Reliability (semiconductor); Grid; Computer science; Interconnection; Reliability engineering; Power grid; Margin (machine learning); Power (physics); Electronic engineering; Electrical engineering; Engineering; Mathematics; Telecommunications; Physics; Geometry","score_opus":0.01488651409076685,"score_gpt":0.304143746510279,"score_spread":0.2892572324195121,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1994438562","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99037844,0.00007154359,0.0033724422,0.0027773096,0.0005521676,0.00047538136,0.0000035716787,0.00010952344,0.0022596375],"genre_scores_gemma":[0.9952168,0.000004543159,0.0011837258,0.00018645884,0.00011424111,0.000100614074,0.0000053918607,0.0000140059365,0.0031742163],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99916637,0.000029098323,0.0001489697,0.00026545816,0.00011380178,0.0002762905],"domain_scores_gemma":[0.99941933,0.000064372696,0.000056572164,0.0002593468,0.00014207071,0.00005829898],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000251067,0.00010413697,0.000134148,0.000024889901,0.00011931273,0.00012670488,0.0001465686,0.00006387344,0.0027887546],"category_scores_gemma":[0.00010972939,0.00007981791,0.000065274995,0.00006116713,0.0000410521,0.00017799006,0.000036668094,0.00006111871,0.00028312186],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016200289,0.00003203604,0.00010209635,0.000022522661,0.0000034694506,2.3253459e-7,0.0015487842,0.0000042560914,0.97540736,0.00080255145,0.021597773,0.0004627152],"study_design_scores_gemma":[0.00041751825,0.0003872743,0.0020567554,0.000045640045,0.000014175695,0.0000062787253,0.001275717,0.0012047663,0.9751829,0.0030495399,0.016074352,0.0002851172],"about_ca_topic_score_codex":0.00038472444,"about_ca_topic_score_gemma":0.00006737921,"teacher_disagreement_score":0.0055234204,"about_ca_system_score_codex":0.00006342859,"about_ca_system_score_gemma":0.00004199367,"threshold_uncertainty_score":0.9981228},"labels":[],"label_agreement":null},{"id":"W1994752359","doi":"10.1021/ic050845h","title":"New CVD Precursors Capable of Depositing Copper Metal under Mixed O<sub>2</sub>/Ar Atmosphere","year":2005,"lang":"en","type":"article","venue":"Inorganic Chemistry","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":37,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada; Steacie Institute for Molecular Sciences","funders":"Australian Collaborative Education Network","keywords":"Chemistry; Copper; Metal; Ligand (biochemistry); Dihedral angle; Crystallography; Steric effects; Melting point; Inorganic chemistry; Substrate (aquarium); Analytical Chemistry (journal); Stereochemistry; Molecule; Organic chemistry","score_opus":0.006709229098595246,"score_gpt":0.20878643141399567,"score_spread":0.2020772023154004,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1994752359","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.995683,0.0006365174,0.0001777458,0.0003359936,0.00025021457,0.000121670506,0.000018622814,0.00010586849,0.0026703386],"genre_scores_gemma":[0.99767387,0.000017193457,0.0012632138,0.00008027319,0.0003245422,0.0000050257195,0.000007808259,0.00003497708,0.00059309835],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99826133,0.000035032044,0.0004909549,0.00049192103,0.0003082426,0.00041252884],"domain_scores_gemma":[0.99888426,0.00009877291,0.00018972614,0.0005269112,0.00010894698,0.00019137986],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00024067004,0.00024755995,0.00035361477,0.0000050721405,0.00009892496,0.000057559606,0.00040259832,0.00020326654,0.0028808846],"category_scores_gemma":[0.000121749086,0.00022117687,0.00013942074,0.00015450487,0.00012176002,0.00017837521,0.00019124316,0.00020612341,0.00019298118],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021790458,0.000082952836,0.0002441259,0.00011871767,0.000027059345,0.0000025979334,0.00023249301,0.00022300624,0.9952507,0.000016812375,0.0026550598,0.0011246629],"study_design_scores_gemma":[0.00043684593,0.000022509084,0.00031154763,0.00007872409,0.000057152283,0.000053305637,0.0003500972,0.0000918783,0.9977538,0.00011443348,0.00046938856,0.00026031552],"about_ca_topic_score_codex":0.00027928414,"about_ca_topic_score_gemma":0.00014664083,"teacher_disagreement_score":0.0026879034,"about_ca_system_score_codex":0.00018927097,"about_ca_system_score_gemma":0.0002625567,"threshold_uncertainty_score":0.9980306},"labels":[],"label_agreement":null},{"id":"W1995652121","doi":"10.1007/s10853-012-6763-x","title":"Thermal and electrical stability of TaN x diffusion barriers for Cu metallization","year":2012,"lang":"en","type":"article","venue":"Journal of Materials Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":19,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Materials science; Amorphous solid; Analytical Chemistry (journal); Crystallization; Diffusion barrier; Electrical resistivity and conductivity; Thin film; Crystallite; Scanning electron microscope; Composite material; Metallurgy; Crystallography; Nanotechnology; Electrical engineering; Layer (electronics); Chemical engineering","score_opus":0.018612398985453905,"score_gpt":0.27502039526492755,"score_spread":0.25640799627947364,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1995652121","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9974016,0.00014977834,0.0009361058,0.00009188022,0.0011986595,0.00016614972,0.000016179287,0.0000055924074,0.000034046345],"genre_scores_gemma":[0.99765486,0.000018967801,0.002140367,0.000028626466,0.00014589656,0.0000023217067,2.4844255e-7,0.0000051119387,0.0000036194403],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984691,0.00012019812,0.00055954076,0.00014975992,0.00040911665,0.00029225997],"domain_scores_gemma":[0.99865586,0.00014846041,0.0004382301,0.0001528435,0.00039218023,0.00021241757],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0056386287,0.00009209508,0.00029456842,0.00008948886,0.00015073699,0.0000854682,0.00029540804,0.00004463448,0.0004315207],"category_scores_gemma":[0.0014272862,0.000057988338,0.0000516501,0.00015916093,0.00050968287,0.0007799808,0.0000912172,0.00004239844,0.0000012990711],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014230501,0.000061738145,0.003511607,0.000036565438,0.0000020627563,1.5567988e-7,0.0004977638,0.000005806154,0.99503285,0.00046586565,0.000013189788,0.00023011267],"study_design_scores_gemma":[0.00026058513,0.00026949632,0.018647887,0.000021890548,0.000022004913,0.000015998097,0.00012064619,0.00006889797,0.9801668,0.00025673487,0.0000790896,0.00006996255],"about_ca_topic_score_codex":0.000017687633,"about_ca_topic_score_gemma":0.0000010693017,"teacher_disagreement_score":0.015136279,"about_ca_system_score_codex":0.00006690635,"about_ca_system_score_gemma":0.0001712592,"threshold_uncertainty_score":0.4724849},"labels":[],"label_agreement":null},{"id":"W1995877457","doi":"10.1002/polb.20014","title":"X‐ray photoelectron spectroscopy of miscible poly(methyl methacrylate)/poly(styrene‐<i>co</i>‐acrylonitrile) and immiscible poly(methyl methacrylate)/polyacrylonitrile polymer surfaces metallized by nickel","year":2004,"lang":"en","type":"article","venue":"Journal of Polymer Science Part B Polymer Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université Laval","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Polyacrylonitrile; Materials science; Poly(methyl methacrylate); Methyl methacrylate; Nickel; Polymer chemistry; X-ray photoelectron spectroscopy; Acrylonitrile; Polymer; Chemical engineering; Styrene; Methacrylate; Composite material; Polymerization; Metallurgy; Copolymer","score_opus":0.012863065599859764,"score_gpt":0.2786239358990391,"score_spread":0.26576087029917933,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1995877457","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.83214355,0.16130118,0.001433042,0.0012830788,0.0022356086,0.000497135,0.00032425948,0.00010593039,0.00067623],"genre_scores_gemma":[0.99392265,0.0015990727,0.0018281547,0.0004518859,0.0006735728,0.000028015993,0.000010853876,0.00016107559,0.0013246886],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.987749,0.0007114111,0.0031647445,0.0020392733,0.0034786055,0.0028569947],"domain_scores_gemma":[0.9921231,0.0007529961,0.0030126856,0.001850999,0.0007660443,0.0014941691],"candidate_categories":["metaepi_narrow","sts","insufficient_payload"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.005412885,0.0014729245,0.0028535658,0.0010013846,0.0011485189,0.00076029525,0.0029595988,0.00047401516,0.0010077842],"category_scores_gemma":[0.00028571748,0.001183511,0.0010948892,0.0033895508,0.00465006,0.0031321652,0.00059431343,0.0013587273,0.00010218996],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00062668155,0.0009775882,0.00046365187,0.00010042499,0.00028081515,0.000023932991,0.0015249121,0.00003504262,0.99187106,0.00073427876,0.0004474736,0.0029141617],"study_design_scores_gemma":[0.0034451322,0.0015305503,0.00009497078,0.00025416526,0.00053189736,0.00018195306,0.000842676,0.00009863902,0.9898934,0.0014063143,0.00042985062,0.001290496],"about_ca_topic_score_codex":0.0048369057,"about_ca_topic_score_gemma":0.000057503523,"teacher_disagreement_score":0.16177914,"about_ca_system_score_codex":0.0005075892,"about_ca_system_score_gemma":0.0024776268,"threshold_uncertainty_score":0.9999054},"labels":[],"label_agreement":null},{"id":"W1997579699","doi":"10.1016/j.msea.2007.06.032","title":"Effect of annealing on preferred orientations in the Cu/SiO2 and Cu/SiO2/Si(100) interfaces","year":2007,"lang":"en","type":"article","venue":"Materials Science and Engineering A","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Annealing (glass); Copper; Materials science; Diffraction; Scanning electron microscope; Crystallography; Recrystallization (geology); Thin film; Analytical Chemistry (journal); Composite material; Optics; Metallurgy; Chemistry; Nanotechnology","score_opus":0.011732761242731983,"score_gpt":0.2757061328169992,"score_spread":0.2639733715742672,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1997579699","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9984796,0.00007250557,0.00007571174,0.00009259552,0.0008346722,0.0002492092,0.000011613003,0.00003102398,0.00015304839],"genre_scores_gemma":[0.9997183,0.000013632441,0.00015296719,0.000035044115,0.00005164928,0.000014169832,8.633956e-7,0.000006469814,0.0000068948125],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99874824,0.000056278623,0.0002923893,0.0003078307,0.00028720195,0.00030808008],"domain_scores_gemma":[0.9992646,0.00035322356,0.000055941644,0.00021621263,0.000050339524,0.000059663013],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.004963323,0.0001366978,0.00021197753,0.00015948132,0.00013152474,0.00019761571,0.00025849932,0.00004198431,0.000027544764],"category_scores_gemma":[0.00049632456,0.000082160885,0.000013672065,0.00030152456,0.0002793258,0.00022543212,0.000101368525,0.00006490401,0.0000050055846],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000070033486,0.000015709467,0.00020886723,0.000119714416,9.883149e-7,0.0000022389609,0.0015550222,0.0003080161,0.9969823,0.00019262863,0.00001217926,0.00053231715],"study_design_scores_gemma":[0.000248945,0.00041947034,0.013976477,0.00016908179,0.0000072733455,0.000012101712,0.00030215885,0.0006074339,0.98401797,0.000043180607,0.00008108698,0.00011482333],"about_ca_topic_score_codex":0.00028532665,"about_ca_topic_score_gemma":0.000020469408,"teacher_disagreement_score":0.01376761,"about_ca_system_score_codex":0.000034879205,"about_ca_system_score_gemma":0.000021503036,"threshold_uncertainty_score":0.33504236},"labels":[],"label_agreement":null},{"id":"W2007031005","doi":"10.4028/www.scientific.net/msf.495-497.1449","title":"New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Copper interconnect; Materials science; Texture (cosmology); Dislocation; Interpretation (philosophy); Interconnection; Line (geometry); Shear (geology); Condensed matter physics; Crystallography; Composite material; Metallurgy; Copper; Geometry; Artificial intelligence; Computer science; Physics; Mathematics; Chemistry; Telecommunications","score_opus":0.006792590341629162,"score_gpt":0.2492869921997546,"score_spread":0.24249440185812543,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007031005","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9965842,0.000027341948,0.00062002573,0.0011470506,0.0010653129,0.0003652236,0.000029214301,0.00002397807,0.0001376543],"genre_scores_gemma":[0.99849784,0.0000042728407,0.0012322471,0.00017635967,0.000037113983,0.0000103237935,8.634768e-7,0.00000857786,0.000032401666],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9978624,0.00013606301,0.00069901795,0.0004418532,0.00047209425,0.00038857828],"domain_scores_gemma":[0.9986998,0.000117671494,0.00035824758,0.0005903666,0.00016730974,0.000066616914],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013556954,0.00017589219,0.0003287321,0.00019929463,0.000097636046,0.000085960906,0.0009829053,0.00008472867,0.00017285967],"category_scores_gemma":[0.0008546309,0.000110831636,0.000070449954,0.00055222143,0.0006397046,0.00059266074,0.00030022318,0.00009263115,0.00002936617],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013730169,0.000067503126,0.0015041704,0.00003254018,0.000001480098,2.3852462e-7,0.0008811813,0.015728986,0.977885,0.0009844756,0.000034382727,0.0027427294],"study_design_scores_gemma":[0.00026599533,0.0002149097,0.05069749,0.00037002907,0.0000069237126,0.0000055744663,0.00019741058,0.0010763464,0.9453203,0.0016861107,0.000029284523,0.00012959467],"about_ca_topic_score_codex":0.0018204844,"about_ca_topic_score_gemma":0.0006815903,"teacher_disagreement_score":0.04919332,"about_ca_system_score_codex":0.00021390634,"about_ca_system_score_gemma":0.00026616754,"threshold_uncertainty_score":0.4519583},"labels":[],"label_agreement":null},{"id":"W2007387568","doi":"10.1063/1.2937188","title":"The influence of surface roughness on electrical conductance of thin Cu films: An <i>ab initio</i> study","year":2008,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":148,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Semiconductor Research Corporation","keywords":"Conductance; Monolayer; Surface roughness; Materials science; Electrical resistivity and conductivity; Thin film; Ab initio quantum chemistry methods; Isotropy; Ab initio; Surface finish; Condensed matter physics; Atomic units; Fermi level; Electrical resistance and conductance; Chemistry; Nanotechnology; Composite material; Optics; Electron; Molecule; Physics","score_opus":0.024995155642128956,"score_gpt":0.2747132382898998,"score_spread":0.24971808264777084,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007387568","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99899423,0.000039149683,0.000023650367,0.000022475308,0.00015353628,0.00020516702,0.000010475886,0.000007186235,0.00054409856],"genre_scores_gemma":[0.9995359,0.000048379403,0.0002382546,0.000075283395,0.00008261592,0.0000022226147,3.1954605e-7,0.0000104478495,0.0000065593576],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983238,0.00010233222,0.00066035957,0.0001629859,0.0005688172,0.00018170514],"domain_scores_gemma":[0.9980301,0.00041259584,0.0007124817,0.0003693625,0.00041106998,0.00006435017],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00072936964,0.00013493637,0.0004000581,0.000017030343,0.00014302041,0.000021328879,0.0005361765,0.00004491175,0.000013942839],"category_scores_gemma":[0.000065227854,0.00008117975,0.00008315919,0.00023482785,0.00029196675,0.00019847386,0.00004206844,0.00029554626,0.0000049133646],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006901569,0.0014133909,0.0009317248,0.000020564004,0.000029059776,0.000007985838,0.002958373,0.07672993,0.9149302,0.0018102225,0.00031667808,0.00016170219],"study_design_scores_gemma":[0.0013428594,0.0022210088,0.014005222,0.00006880048,0.00005238616,0.000022670369,0.0016352361,0.0007974226,0.9728044,0.006719502,0.00010296514,0.0002275002],"about_ca_topic_score_codex":0.000029947576,"about_ca_topic_score_gemma":0.000003877871,"teacher_disagreement_score":0.07593251,"about_ca_system_score_codex":0.00003134235,"about_ca_system_score_gemma":0.00017118915,"threshold_uncertainty_score":0.33104143},"labels":[],"label_agreement":null},{"id":"W2009484617","doi":"10.1063/1.2937249","title":"Modeling self-annealing kinetics in electroplated Cu thin films","year":2008,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada; Allianz Industrie Forschung","keywords":"Electroplating; Annealing (glass); Materials science; Kinetics; Electrolyte; Recrystallization (geology); Thin film; Microstructure; Copper; Metallurgy; Composite material; Electrode; Nanotechnology; Chemistry; Physical chemistry","score_opus":0.016807451429015838,"score_gpt":0.2375673745109718,"score_spread":0.22075992308195597,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2009484617","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9959792,0.000066176755,0.0024269917,0.000031046424,0.00024697668,0.000087046894,0.000001952196,0.000025316582,0.0011353042],"genre_scores_gemma":[0.99402076,0.00007542235,0.005546588,0.000094054754,0.00023877523,0.0000014518813,9.453923e-7,0.000016232181,0.0000057460015],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9986936,0.000026579462,0.0005594294,0.0001548628,0.00030703095,0.000258485],"domain_scores_gemma":[0.9993432,0.000055840923,0.00020969579,0.00016664239,0.00015097625,0.000073609066],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003650338,0.00013547386,0.00031487885,0.000051324714,0.00007119438,0.000031396426,0.00024668494,0.000073298754,0.000046611352],"category_scores_gemma":[0.000017195207,0.00010581888,0.00008906914,0.00019034393,0.000034890665,0.00012409464,0.000035762772,0.00035880686,0.000018188735],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000776489,0.00014598417,0.000032357206,0.0000123517175,0.000008086926,0.000017229275,0.0012186695,0.45176423,0.54628676,0.00023904645,0.00011329902,0.000084326755],"study_design_scores_gemma":[0.00086527935,0.0001871871,0.00009423421,0.000054560023,0.00002777325,0.00008354539,0.00021958486,0.5540722,0.43811598,0.005952789,0.00009516782,0.0002317053],"about_ca_topic_score_codex":0.000025395713,"about_ca_topic_score_gemma":0.000004344522,"teacher_disagreement_score":0.10817078,"about_ca_system_score_codex":0.00008565165,"about_ca_system_score_gemma":0.0001021307,"threshold_uncertainty_score":0.4315169},"labels":[],"label_agreement":null},{"id":"W2012050805","doi":"10.1002/adma.200305740","title":"Direct Writing of Patterned Ceramics Using Electron‐Beam Lithography and Metallopolymer Resists","year":2004,"lang":"en","type":"article","venue":"Advanced Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":79,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta; University of Toronto","funders":"","keywords":"Materials science; Resist; Electron-beam lithography; Lithography; Ceramic; Scanning electron microscope; Cathode ray; X-ray lithography; Focused ion beam; Nanotechnology; Electron beam-induced deposition; Ion beam lithography; Electron; Optoelectronics; Scanning transmission electron microscopy; Ion; Composite material; Chemistry","score_opus":0.01012461892369488,"score_gpt":0.2663083647633207,"score_spread":0.25618374583962583,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2012050805","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99789774,0.0006947849,0.0002542519,0.000051386098,0.0004605713,0.00024156044,0.000076035205,0.00007332587,0.0002503163],"genre_scores_gemma":[0.99415815,0.00011645163,0.0055237133,0.00007513024,0.000064872176,0.000013076237,0.0000052881505,0.000027130272,0.000016186896],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99837255,0.000084100866,0.00052979443,0.00042568133,0.00022089675,0.00036696126],"domain_scores_gemma":[0.9991795,0.00007597582,0.00022998583,0.0003219152,0.00012275184,0.00006990766],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00063426176,0.00020429202,0.00047096136,0.00008234383,0.000108418244,0.00008387366,0.00015857609,0.00007719895,0.00016996832],"category_scores_gemma":[0.00011700946,0.00017122325,0.00006791935,0.0001278353,0.00019923762,0.0002790038,0.000111767295,0.00004687983,0.0000047187577],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000092420436,0.00004768069,0.00008471886,0.00012739988,0.000014218284,0.0000034227726,0.0001501975,0.00012338828,0.99863577,0.0004323072,0.0000011159881,0.00028738703],"study_design_scores_gemma":[0.00052754726,0.00010829579,0.00067211286,0.00014951114,0.000036728365,0.000012995131,0.00007593535,0.0000015315404,0.99650466,0.0016234879,0.000081936785,0.00020522813],"about_ca_topic_score_codex":0.00028458814,"about_ca_topic_score_gemma":0.000019622854,"teacher_disagreement_score":0.005269462,"about_ca_system_score_codex":0.00006080048,"about_ca_system_score_gemma":0.00004665995,"threshold_uncertainty_score":0.6982282},"labels":[],"label_agreement":null},{"id":"W2014074276","doi":"10.1149/1.1786072","title":"Characterization of Ultrathin Electroless Barriers Grown by Self-Aligned Deposition on Silicon-Based Dielectric Films","year":2004,"lang":"en","type":"article","venue":"Journal of The Electrochemical Society","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Feng Chia University; National Science Council; Ryerson University","keywords":"Materials science; Chemical engineering; Copper; Crystallite; Amorphous solid; Crystallization; Annealing (glass); Metallurgy; Crystallography; Chemistry","score_opus":0.002949880210470723,"score_gpt":0.20052503107353103,"score_spread":0.19757515086306032,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2014074276","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9927614,0.00007543032,0.0052936,0.0014773328,0.00017024734,0.00015978176,0.000009286291,0.000025600617,0.000027359421],"genre_scores_gemma":[0.9982276,0.000034809054,0.00067412533,0.00092989084,0.000097751166,0.000004679669,0.0000065459335,0.000015203623,0.000009372841],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99832934,0.0001120312,0.0005444079,0.00020296342,0.00048216805,0.00032908842],"domain_scores_gemma":[0.99876547,0.000109281216,0.0005686436,0.00020913739,0.00022140417,0.00012603603],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00052421546,0.00017736286,0.0003105366,0.000024005665,0.00015638988,0.00004332206,0.0004444475,0.00017841325,0.00005575785],"category_scores_gemma":[0.00016092267,0.00011274905,0.000464325,0.00030976502,0.00009146458,0.00012637697,0.000020543057,0.00034014168,0.0000018933463],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017956963,0.00023839605,0.00006999543,0.000030679897,0.000033588673,3.760518e-7,0.0002676556,0.000022054674,0.9988868,0.00005445036,0.00018890973,0.000027517735],"study_design_scores_gemma":[0.0008143928,0.00056493573,0.00018231917,0.00007109924,0.00006057532,0.000019324621,0.000025786358,0.0003379768,0.9974713,0.00029258264,0.000032782813,0.00012694197],"about_ca_topic_score_codex":0.000010949587,"about_ca_topic_score_gemma":8.96302e-7,"teacher_disagreement_score":0.00546626,"about_ca_system_score_codex":0.00038703682,"about_ca_system_score_gemma":0.00031493086,"threshold_uncertainty_score":0.45977727},"labels":[],"label_agreement":null},{"id":"W2015941658","doi":"10.1016/j.sse.2006.06.014","title":"Application of PVD silver for integrated microwave passives in silicon technology","year":2006,"lang":"en","type":"article","venue":"Solid-State Electronics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Materials science; Electromigration; Silicon; Microwave; Monolithic microwave integrated circuit; Optoelectronics; Deposition (geology); Broadband; Copper; Electronic engineering; Metallurgy; Composite material; Computer science; Telecommunications; Engineering","score_opus":0.004420832403206465,"score_gpt":0.2486937233043471,"score_spread":0.24427289090114065,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2015941658","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9882325,0.00057059614,0.009730191,0.0005123768,0.000093288334,0.0005735396,0.000044764653,0.00007050823,0.00017226573],"genre_scores_gemma":[0.9988853,0.000041149473,0.0006965267,0.00003179683,0.000022915981,0.00012099859,0.000033956174,0.000017729917,0.00014965616],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986348,0.00003586543,0.00043296994,0.0003581575,0.00008826074,0.0004499488],"domain_scores_gemma":[0.99925333,0.00008612372,0.00016189436,0.0003005859,0.0001759417,0.000022099459],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028843313,0.00014846942,0.00027539104,0.00015198899,0.00004438442,0.000018477684,0.00023861982,0.00013686968,0.000020938924],"category_scores_gemma":[0.000066517416,0.00012527472,0.00006488316,0.0003228859,0.00016012645,0.00007406201,0.00004386661,0.00015137649,0.000013416931],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000077844044,0.00013142177,0.00064927683,0.00003923158,0.000004421657,5.2477327e-7,0.00007773864,0.00044549146,0.9872631,0.006038647,0.00018726732,0.005085052],"study_design_scores_gemma":[0.00046431043,0.00021203414,0.00032700066,0.000016814776,0.0000084603225,0.000002907742,0.000085392494,0.003823755,0.9412571,0.046806764,0.0068539553,0.00014148324],"about_ca_topic_score_codex":0.00028125133,"about_ca_topic_score_gemma":0.0024012846,"teacher_disagreement_score":0.04600596,"about_ca_system_score_codex":0.00019709616,"about_ca_system_score_gemma":0.00015785257,"threshold_uncertainty_score":0.51085544},"labels":[],"label_agreement":null},{"id":"W2016489274","doi":"10.1007/s11664-005-0180-8","title":"Texture investigation of copper interconnects with a different line width","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Materials science; Electron backscatter diffraction; Copper interconnect; Microstructure; Annealing (glass); Line width; Texture (cosmology); Diffraction; Grain boundary; Interconnection; Composite material; Copper; Optics; Metallurgy","score_opus":0.008532280155451485,"score_gpt":0.23428638282725167,"score_spread":0.22575410267180018,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2016489274","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99747795,0.00037247725,0.0002220324,0.0013124029,0.00035796565,0.00016685716,0.000014830893,0.000014554796,0.000060945233],"genre_scores_gemma":[0.9988679,0.00005085739,0.0003312229,0.00019093294,0.0004502608,0.000004040585,0.0000029067128,0.000018422466,0.00008343715],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99807775,0.00018707132,0.000859391,0.00018380971,0.0003405719,0.0003514119],"domain_scores_gemma":[0.9984258,0.0000978607,0.0008019454,0.00023597243,0.0003345059,0.00010394262],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00096586236,0.00019691933,0.0005726609,0.0001098854,0.000051527208,0.00009144372,0.00030480316,0.00009296632,0.0016171323],"category_scores_gemma":[0.00012029783,0.00011197004,0.00007768246,0.00009560552,0.0001588361,0.00028713825,0.000049258924,0.00017588078,0.00001138842],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00052045414,0.00009158425,0.00021002197,0.000076134966,0.000036912876,0.0000031401203,0.00044388365,0.00009357235,0.9968664,0.00063290977,0.00056278775,0.000462205],"study_design_scores_gemma":[0.0008634996,0.0017574369,0.0008516371,0.0002717461,0.00006213406,0.00017113703,0.000051195904,0.000017474547,0.9934778,0.0012437416,0.0010938941,0.00013826907],"about_ca_topic_score_codex":0.000024757874,"about_ca_topic_score_gemma":0.00009768369,"teacher_disagreement_score":0.0033885592,"about_ca_system_score_codex":0.00018253888,"about_ca_system_score_gemma":0.00031504265,"threshold_uncertainty_score":0.99929553},"labels":[],"label_agreement":null},{"id":"W2017787810","doi":"10.1016/s0151-9107(00)88716-4","title":"Precursors and operating conditions for the metal-organic chemical vapor deposition of nickel films","year":2000,"lang":"en","type":"article","venue":"Annales de Chimie Science des Matériaux","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":32,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Nickel; Metalorganic vapour phase epitaxy; Chemical vapor deposition; Thin film; Chemistry; Metal; Mineralogy; Materials science; Metallurgy; Nanotechnology; Epitaxy; Layer (electronics)","score_opus":0.024970865071503045,"score_gpt":0.2855550360407474,"score_spread":0.26058417096924436,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2017787810","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9975243,0.00023274787,0.00081686984,0.0004737613,0.00008741293,0.00031501154,0.00006593483,0.000029777239,0.0004541861],"genre_scores_gemma":[0.99350685,0.000058919988,0.0060370546,0.00017285488,0.00003243015,0.000044030465,0.000004784423,0.000007939657,0.00013514669],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99888664,0.000035890444,0.0002464114,0.00031681312,0.0001962556,0.0003179851],"domain_scores_gemma":[0.9991979,0.00025409818,0.00006422038,0.0002498515,0.00013988273,0.00009405765],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0008602518,0.00011073069,0.00015837059,0.000037530324,0.00054202945,0.0001477461,0.0003822855,0.000041801723,0.0012416445],"category_scores_gemma":[0.00033405432,0.00007119868,0.000061771614,0.00019955682,0.001643343,0.00034753553,0.00006968135,0.00006872063,0.000024067302],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015799598,0.000045937617,0.00006651468,0.000041271618,0.000005702221,4.0884171e-7,0.00085157383,0.0001724422,0.99691117,0.0005703544,0.00016499746,0.0011538503],"study_design_scores_gemma":[0.00020742022,0.00011534173,0.0026301953,0.00004065032,0.00006481732,0.000068900474,0.00057185977,0.012615319,0.98128057,0.0021915527,0.0000814694,0.00013193455],"about_ca_topic_score_codex":0.00006500781,"about_ca_topic_score_gemma":0.00002153709,"teacher_disagreement_score":0.015630608,"about_ca_system_score_codex":0.000033734308,"about_ca_system_score_gemma":0.00014058729,"threshold_uncertainty_score":0.99967134},"labels":[],"label_agreement":null},{"id":"W2019893422","doi":"10.4028/www.scientific.net/ssp.145-146.319","title":"Surface Energy and Wetting Behaviour of Plasma Etched Porous SiCOH Surfaces and Plasma Etch Residue Cleaning Solutions","year":2009,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Freistaat Sachsen; European Commission","keywords":"Wetting; Materials science; Contact angle; Wet cleaning; Surface energy; Plasma; Plasma etching; Porosity; Plasma cleaning; Solid surface; Etching (microfabrication); Chemical engineering; Polymer; Composite material; Chemical physics; Organic chemistry; Chemistry","score_opus":0.0389297405943981,"score_gpt":0.29216092539560296,"score_spread":0.2532311848012049,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2019893422","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.965498,0.001852699,0.0008000163,0.0005415628,0.00068599405,0.00097505684,0.028848544,0.00031935738,0.00047882146],"genre_scores_gemma":[0.982998,0.00970273,0.0012859385,0.00034813394,0.00019623301,0.000026454987,0.0048741912,0.00015054745,0.0004177281],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.98964185,0.0009024545,0.0025259352,0.0033928312,0.0011057367,0.0024311973],"domain_scores_gemma":[0.9928565,0.0009714461,0.0012022933,0.0034310604,0.00039440047,0.0011442722],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0036360056,0.0013970776,0.0021157842,0.0003781851,0.0015301176,0.0010249916,0.0018497439,0.00023627476,0.000173958],"category_scores_gemma":[0.00037053603,0.0012567224,0.00013445776,0.0005859577,0.001103366,0.0023032308,0.004792294,0.00069911714,0.00003235262],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.008044932,0.0065561365,0.018079355,0.002532737,0.0015479249,0.0006060032,0.062637806,0.021867685,0.74459,0.001333933,0.02405248,0.108151026],"study_design_scores_gemma":[0.045257155,0.012641531,0.05442073,0.003771589,0.0033461363,0.0011618604,0.036145873,0.5768502,0.14418091,0.0313771,0.070650764,0.020196171],"about_ca_topic_score_codex":0.0020884972,"about_ca_topic_score_gemma":0.003068706,"teacher_disagreement_score":0.6004091,"about_ca_system_score_codex":0.00017499218,"about_ca_system_score_gemma":0.00032093577,"threshold_uncertainty_score":0.9998779},"labels":[],"label_agreement":null},{"id":"W2020646746","doi":"10.1143/jjap.39.2189","title":"Measurement of Copper Drift in Methylsilsesquiazane-Methylsilsesquioxane Dielectric Films","year":2000,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Time-dependent gate oxide breakdown; Dielectric; Dielectric strength; Ion; Analytical Chemistry (journal); Leakage (economics); Capacitor; Electric field; Threshold voltage; Polyimide; Copper; Chemical vapor deposition; Stress (linguistics); Voltage; Optoelectronics; Gate dielectric; Composite material; Electrical engineering; Transistor; Metallurgy; Chemistry","score_opus":0.014789672024946037,"score_gpt":0.24529565945956622,"score_spread":0.23050598743462017,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2020646746","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9917184,0.00014135311,0.00003309259,0.00006409514,0.00015835541,0.0002040438,0.0000026658124,0.000013900894,0.0076640835],"genre_scores_gemma":[0.9991449,0.00003722358,0.0005596534,0.000089103516,0.00012301879,0.000008946753,4.5677317e-7,0.00001722126,0.000019455669],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.997439,0.00010333332,0.00095901603,0.00025030973,0.00087961426,0.00036867036],"domain_scores_gemma":[0.9986355,0.00015116308,0.0003843009,0.000343471,0.0003527964,0.00013280244],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0018061665,0.00021729757,0.00062616175,0.000109569606,0.000056822155,0.0000319039,0.0004513037,0.000078912795,0.00088365085],"category_scores_gemma":[0.00006953974,0.00015788386,0.00018888792,0.0005405552,0.00013750678,0.00021633963,0.000030996922,0.00029159395,0.000056282923],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00054145826,0.00054817606,0.0001767332,0.000044183616,0.000022730339,0.000007281056,0.0018829264,0.008060509,0.97798467,0.0003008773,0.000096288866,0.010334181],"study_design_scores_gemma":[0.0014065548,0.00038556836,0.0028328141,0.000077574754,0.000043700227,0.00002593271,0.0006138774,0.0002931096,0.9918492,0.001953903,0.00028894522,0.0002288298],"about_ca_topic_score_codex":0.00009028151,"about_ca_topic_score_gemma":0.000014419192,"teacher_disagreement_score":0.013864536,"about_ca_system_score_codex":0.00010661828,"about_ca_system_score_gemma":0.00012754684,"threshold_uncertainty_score":0.9675357},"labels":[],"label_agreement":null},{"id":"W2022602619","doi":"10.1016/j.microrel.2008.06.025","title":"Simulation of migration effects in nanoscaled copper metallizations","year":2008,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Bundesministerium für Forschung und Technologie; Bundesministerium für Bildung, Wissenschaft, Forschung und Technologie; Bundesministerium für Bildung und Forschung","keywords":"Copper; Interconnection; Materials science; Electrical resistivity and conductivity; Aluminium; Void (composites); Copper interconnect; Electromigration; Metallurgy; Composite material; Electrical engineering; Computer science; Engineering","score_opus":0.010152594568213713,"score_gpt":0.25054092103797004,"score_spread":0.24038832646975633,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2022602619","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9921312,0.0003837243,0.0063388776,0.00016601525,0.00019368962,0.0005595374,0.000011107401,0.0000560013,0.00015990132],"genre_scores_gemma":[0.99874794,0.000055417124,0.0009973188,0.00004345616,0.000018398165,0.00003087773,0.000016852706,0.0000142173985,0.000075540265],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981133,0.0002700932,0.0005839419,0.00045119843,0.00022963392,0.0003518403],"domain_scores_gemma":[0.9984824,0.0005729183,0.00013917127,0.00050138356,0.00024999233,0.000054116626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000639114,0.00017082393,0.00035388724,0.00009778489,0.000111159265,0.000013624308,0.00020554345,0.00013796965,0.0001464912],"category_scores_gemma":[0.00084091834,0.00014777243,0.00012150464,0.00037991378,0.00021542514,0.00019627628,0.000058446392,0.00017251223,0.000038677223],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007958117,0.0004347538,0.016831292,0.00011295148,0.000005089073,0.0000017162637,0.0005291616,0.10928029,0.8722298,0.00025305245,0.00009089817,0.00015142986],"study_design_scores_gemma":[0.00097299414,0.00036899588,0.026268728,0.000052003375,0.000029767472,0.0000052912683,0.000023480332,0.08179488,0.88569754,0.0026423715,0.0018344241,0.00030953597],"about_ca_topic_score_codex":0.00039096596,"about_ca_topic_score_gemma":0.0006073188,"teacher_disagreement_score":0.027485408,"about_ca_system_score_codex":0.0003045828,"about_ca_system_score_gemma":0.00019428933,"threshold_uncertainty_score":0.6025985},"labels":[],"label_agreement":null},{"id":"W2023699907","doi":"10.1016/s0169-4332(01)00339-7","title":"The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering","year":2001,"lang":"en","type":"article","venue":"Applied Surface Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada); Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"X-ray photoelectron spectroscopy; Adhesion; Copper; Metal; Materials science; Annealing (glass); Sputtering; Surface energy; Reactivity (psychology); Ultimate tensile strength; Composite material; Chemical engineering; Nanotechnology; Metallurgy; Thin film","score_opus":0.01689406205976454,"score_gpt":0.26471969010194707,"score_spread":0.24782562804218253,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2023699907","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9921344,0.00006368902,0.00045832002,0.001067732,0.0006660032,0.0004289281,0.000004863904,0.00001642756,0.0051596244],"genre_scores_gemma":[0.997826,0.00003580484,0.0017453458,0.00019062166,0.00001472149,0.000011177497,1.1933584e-7,0.000006544403,0.00016971065],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9979921,0.000044837212,0.0003657101,0.00042266943,0.00077020354,0.0004044767],"domain_scores_gemma":[0.99871475,0.00015206652,0.00015883532,0.00077911065,0.00013015345,0.00006509737],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0018345427,0.0001323678,0.00020132774,0.000018382723,0.00047528814,0.000057034686,0.0012149188,0.000030179459,0.00013693052],"category_scores_gemma":[0.00010577461,0.00006711141,0.00006782052,0.0006491271,0.0010798067,0.00014049956,0.00061532174,0.00008194011,0.000047672154],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003950225,0.000038082748,0.000212211,0.000008820244,0.0000023974844,2.027901e-7,0.00083106675,0.0015283057,0.9953269,0.0012806264,0.00009326862,0.00063866784],"study_design_scores_gemma":[0.00010818354,0.00006178761,0.0017699335,0.000025260968,0.0000070152664,0.0000019636946,0.0006234351,0.0000930545,0.99439704,0.00041614092,0.0024011787,0.000095019146],"about_ca_topic_score_codex":0.00030537872,"about_ca_topic_score_gemma":0.000054732755,"teacher_disagreement_score":0.0056915428,"about_ca_system_score_codex":0.00007536923,"about_ca_system_score_gemma":0.000118590164,"threshold_uncertainty_score":0.39785928},"labels":[],"label_agreement":null},{"id":"W2024206334","doi":"10.1088/0953-8984/14/30/301","title":"The quantitative correlation of nanoscopic and macroscopic measurements of adhesion: copper clusters on a low-permittivity polymer","year":2002,"lang":"en","type":"article","venue":"Journal of Physics Condensed Matter","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Copper; Coalescence (physics); Materials science; Permittivity; Polymer; Nanoscopic scale; Adhesion; Composite material; Nanoclusters; Nanotechnology; Dielectric; Metallurgy; Optoelectronics; Physics","score_opus":0.034026352207625635,"score_gpt":0.2738590712804393,"score_spread":0.23983271907281367,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2024206334","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978278,0.00032069715,0.00015370692,0.00061336975,0.00061597134,0.000119354896,0.0000080729815,0.00000243468,0.00033854067],"genre_scores_gemma":[0.9993926,0.000014341285,0.00008867827,0.00025261138,0.000040062732,0.0000013747564,2.0712991e-7,0.000009057275,0.00020106288],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986483,0.00018671289,0.0004983972,0.00012802226,0.00040073373,0.00013784645],"domain_scores_gemma":[0.9985297,0.00034911366,0.0006091623,0.0001929597,0.0002724601,0.00004664789],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00044813997,0.000118308264,0.0002976965,0.000035692963,0.000088976754,0.000032192762,0.0001474516,0.000047419337,0.00025815217],"category_scores_gemma":[0.00005991345,0.000072180075,0.0000974716,0.00006419557,0.0002709202,0.00016606941,0.00004036915,0.00013967801,0.000030501194],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00019131483,0.00018638598,0.008078467,0.00008011899,0.00004040287,0.0000014325927,0.0014294551,0.00003660792,0.98723984,0.0001089201,0.0020435345,0.00056349445],"study_design_scores_gemma":[0.0009692788,0.00055612903,0.009097321,0.0003740451,0.000048734742,0.000007411755,0.00024905486,0.0002042435,0.9880255,0.00035852368,0.000018770485,0.00009097687],"about_ca_topic_score_codex":0.000014139506,"about_ca_topic_score_gemma":0.0000033303525,"teacher_disagreement_score":0.002024764,"about_ca_system_score_codex":0.000034046057,"about_ca_system_score_gemma":0.00002713968,"threshold_uncertainty_score":0.2943418},"labels":[],"label_agreement":null},{"id":"W2032056278","doi":"10.1016/j.tsf.2008.05.022","title":"Optical and chemical characterization of expanding thermal plasma-deposited carbon-containing silicon dioxide-like films","year":2008,"lang":"en","type":"article","venue":"Thin Solid Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Silicon dioxide; Characterization (materials science); Carbon dioxide; Silicon; Carbon film; Materials science; Thin film; Plasma; Chemical engineering; Thermal; Nanotechnology; Chemistry; Analytical Chemistry (journal); Optoelectronics; Environmental chemistry; Composite material; Organic chemistry","score_opus":0.015088569553896272,"score_gpt":0.24217691412026254,"score_spread":0.22708834456636628,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2032056278","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99840105,0.000028799195,0.000051517483,0.00007981042,0.00036611108,0.00018637306,0.000015795466,0.0000939276,0.0007766257],"genre_scores_gemma":[0.9991146,0.00001625171,0.00057503703,0.00009485848,0.0000708859,0.00001372655,0.000019900672,0.00002107457,0.00007366467],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985823,0.000053823598,0.00043733345,0.0003745874,0.00023996075,0.00031199306],"domain_scores_gemma":[0.99930763,0.00010541596,0.00013667929,0.00027060075,0.00006188278,0.00011779331],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00033340987,0.00018683614,0.00037185094,0.00005001867,0.00010902258,0.000034514018,0.00018739948,0.0001608343,0.00022913734],"category_scores_gemma":[0.000082452374,0.00015240966,0.00006320255,0.000091823815,0.00029181075,0.00021239145,0.00016805744,0.00016996663,0.00000827219],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000122046295,0.000060099013,0.0038724288,0.000033918754,0.000009655081,0.000014691289,0.002474821,0.000024698937,0.9931999,0.000066831286,0.000007970431,0.00011294496],"study_design_scores_gemma":[0.00047793356,0.00012073196,0.011589392,0.00007342002,0.000017314953,0.00007486304,0.0001352917,0.010466509,0.9768377,0.000010728746,0.000007249285,0.00018886881],"about_ca_topic_score_codex":0.00014856149,"about_ca_topic_score_gemma":0.0000023692473,"teacher_disagreement_score":0.016362196,"about_ca_system_score_codex":0.000026105874,"about_ca_system_score_gemma":0.000039339164,"threshold_uncertainty_score":0.62150854},"labels":[],"label_agreement":null},{"id":"W2032584242","doi":"10.1007/s11664-005-0158-6","title":"Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Electron backscatter diffraction; Materials science; Texture (cosmology); Scanning electron microscope; Copper; Electron diffraction; Dislocation; Diffraction; Substrate (aquarium); Composite material; Silicon; Crystallography; Condensed matter physics; Analytical Chemistry (journal); Optics; Microstructure; Chemistry; Metallurgy; Geology","score_opus":0.005200924861074285,"score_gpt":0.25440586543738014,"score_spread":0.24920494057630585,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2032584242","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9987058,0.00028187555,5.498844e-7,0.0004256179,0.0002488422,0.00025746477,0.000041851614,0.000007125812,0.000030873205],"genre_scores_gemma":[0.9994254,0.0001961092,0.000026562062,0.00010684413,0.00013975767,0.000011317202,0.0000054170177,0.000017833932,0.00007076876],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9973989,0.00024777954,0.0012462952,0.00024000439,0.00040349408,0.0004635215],"domain_scores_gemma":[0.9983101,0.00011229556,0.00096321036,0.00025996333,0.0002940758,0.000060354727],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0012418044,0.00022244692,0.0007130289,0.00014741163,0.00003666042,0.00004110553,0.00032118705,0.00016045672,0.0005792499],"category_scores_gemma":[0.00009799319,0.00016173319,0.00008958811,0.00014952253,0.000090794216,0.00035166234,0.000034009907,0.0003121253,0.000014421192],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00076194154,0.0005326695,0.00038663967,0.00005567115,0.000022239454,0.0000035490827,0.00011590891,0.0008135843,0.9962278,0.00011590189,0.00092354236,0.00004055451],"study_design_scores_gemma":[0.0009739182,0.0012758345,0.024150757,0.0001471792,0.00004886532,0.000029685114,0.000030097148,5.411641e-7,0.97289044,0.000096811185,0.00021253625,0.00014333785],"about_ca_topic_score_codex":0.00010914774,"about_ca_topic_score_gemma":0.0001377878,"teacher_disagreement_score":0.023764119,"about_ca_system_score_codex":0.00031091535,"about_ca_system_score_gemma":0.00021066274,"threshold_uncertainty_score":0.6595288},"labels":[],"label_agreement":null},{"id":"W2033426489","doi":"10.1063/1.3187931","title":"Water diffusion and fracture behavior in nanoporous low-k dielectric film stacks","year":2009,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":31,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Texas Instruments; National Science Foundation","keywords":"Nanoporous; Materials science; Dielectric; Microelectronics; Diffusion; Low-k dielectric; Composite material; Fracture (geology); Chemical engineering; Nanotechnology; Optoelectronics","score_opus":0.005643433779466343,"score_gpt":0.2293324392828302,"score_spread":0.22368900550336385,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2033426489","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9989324,0.000056119938,0.00009119391,0.00011493784,0.00013864732,0.00011841141,0.0000019549782,0.0000072562952,0.0005390849],"genre_scores_gemma":[0.99931747,0.00003526755,0.00012118355,0.0003221768,0.00017469034,0.0000017503417,0.0000011817749,0.0000069032876,0.000019351817],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991029,0.000016961234,0.0003174607,0.00014191528,0.00021223488,0.00020850796],"domain_scores_gemma":[0.9995822,0.000030430918,0.0001334381,0.00012706983,0.000058966096,0.00006791318],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002234709,0.000119403594,0.0002521229,0.000044077125,0.000052409006,0.00005554491,0.00013575047,0.0000729759,0.000094817064],"category_scores_gemma":[0.000005835119,0.00006957688,0.00005209155,0.00007153204,0.000034092165,0.000116256815,0.000025039597,0.00025720595,0.00000845927],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015313644,0.00034008588,0.0001538588,0.000010814264,0.0000019069262,0.0000201641,0.0009178795,0.0005589989,0.99115163,0.00006878284,0.00016722218,0.0064555365],"study_design_scores_gemma":[0.00083505164,0.00040994995,0.012341866,0.000035386412,0.000030447909,0.000023953058,0.00011409936,0.00025807397,0.9779959,0.0071498994,0.0006287399,0.00017665575],"about_ca_topic_score_codex":0.000009190561,"about_ca_topic_score_gemma":0.0000025918207,"teacher_disagreement_score":0.013155737,"about_ca_system_score_codex":0.000047429858,"about_ca_system_score_gemma":0.000025334104,"threshold_uncertainty_score":0.28372627},"labels":[],"label_agreement":null},{"id":"W2035785945","doi":"10.4028/www.scientific.net/msf.467-470.1339","title":"Abnormal Grain Growth in Electrochemically Deposited Cu Films","year":2004,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Materials science; Grain growth; Nanocrystalline material; Annealing (glass); Grain size; Abnormal grain growth; Grain boundary; Microstructure; Metallurgy; Chemical engineering; Nanotechnology","score_opus":0.0058028005671492315,"score_gpt":0.23119897046014856,"score_spread":0.22539616989299932,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2035785945","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9959308,0.00002418533,0.00021049107,0.0013374028,0.0011836238,0.00031050935,0.000026905938,0.00013082255,0.0008452915],"genre_scores_gemma":[0.99637735,0.0000066468247,0.002976004,0.00048769856,0.000052697815,0.00004005071,0.000005135751,0.000015977472,0.000038451893],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99696404,0.000056662317,0.000550174,0.000734566,0.00054212275,0.0011524125],"domain_scores_gemma":[0.99911064,0.000037605554,0.000117759635,0.00039810943,0.0001510537,0.00018481206],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0015635793,0.00023716595,0.00032228138,0.0002180814,0.00028964426,0.00043105506,0.0010164906,0.000104008584,0.0008009639],"category_scores_gemma":[0.00046634267,0.0001867051,0.0000534059,0.000725799,0.00074053794,0.00074072304,0.0003622354,0.00011449445,0.00028375132],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005779583,0.000102899234,0.00078052323,0.0000201427,8.0471165e-7,0.000014163695,0.00021678551,0.000021629161,0.99576086,0.0028988554,0.0000996125,0.000025938776],"study_design_scores_gemma":[0.0005246841,0.00016315444,0.0035836536,0.00005789689,0.0000033343601,0.00004878018,0.00012133755,0.00001953221,0.98886234,0.006314513,0.00003486844,0.0002658933],"about_ca_topic_score_codex":0.00151225,"about_ca_topic_score_gemma":0.00021664237,"teacher_disagreement_score":0.006898497,"about_ca_system_score_codex":0.0002478682,"about_ca_system_score_gemma":0.0003141126,"threshold_uncertainty_score":0.8769993},"labels":[],"label_agreement":null},{"id":"W2046371518","doi":"10.5555/2561828.2561935","title":"A vectorless framework for power grid electromigration checking","year":2013,"lang":"en","type":"article","venue":"International Conference on Computer Aided Design","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Reliability (semiconductor); Computer science; Grid; Workload; Conservatism; Power (physics); Very-large-scale integration; Power integrity; Pessimism; Reliability engineering; Chip; Interconnection; Series (stratigraphy); Electronic engineering; Power grid; Electronic circuit; Electrical engineering; Engineering; Telecommunications; Embedded system; Physics; Mathematics","score_opus":0.06380763957094039,"score_gpt":0.30919855127540236,"score_spread":0.24539091170446198,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2046371518","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.17890547,0.000007414051,0.8140364,0.0024491916,0.0031618206,0.00062408467,0.000016513994,0.000114817994,0.00068427046],"genre_scores_gemma":[0.90679306,0.0000040823265,0.09139347,0.0009804947,0.0004900624,0.0002048842,0.000014366547,0.000017151186,0.00010244431],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984368,0.00010515585,0.00034489305,0.00049150584,0.00032756306,0.00029408213],"domain_scores_gemma":[0.99841624,0.00049854635,0.00013908208,0.00027803742,0.00058381434,0.00008427338],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00036864288,0.00020241561,0.00020751676,0.000100495665,0.000109563,0.00054240966,0.0005553915,0.00011117378,0.0027565805],"category_scores_gemma":[0.00014534009,0.00016627985,0.00010335849,0.00006416577,0.000056789344,0.00032547914,0.00007151681,0.00016937619,0.00047305578],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003474017,0.00035118754,0.00013840041,0.000024864703,0.00007558285,0.0000049446585,0.0008812595,0.0009854417,0.5581848,0.40593767,0.019042986,0.0140254535],"study_design_scores_gemma":[0.0013008472,0.0017785556,0.0036055646,0.00049059826,0.000021719412,0.000024399995,0.00011070929,0.31859946,0.35216734,0.31805578,0.0029347353,0.00091030094],"about_ca_topic_score_codex":0.000078864636,"about_ca_topic_score_gemma":0.0000053717367,"teacher_disagreement_score":0.7278876,"about_ca_system_score_codex":0.00012649516,"about_ca_system_score_gemma":0.0000922697,"threshold_uncertainty_score":0.99815506},"labels":[],"label_agreement":null},{"id":"W2051362204","doi":"10.4028/www.scientific.net/msf.519-521.1391","title":"Electrical Resistivity Measurements: A Sensitive Tool for Studying Aluminium Alloys","year":2006,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":33,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electrical resistivity and conductivity; Materials science; Alloy; Microstructure; Aluminium; Dislocation; Metallurgy; Characterization (materials science); Electrical conductor; Composite material; Nanotechnology; Electrical engineering","score_opus":0.029072118113376857,"score_gpt":0.27820456858156467,"score_spread":0.24913245046818783,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2051362204","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9929785,0.000020217114,0.0024454817,0.0007165044,0.0019485164,0.0009893504,0.00012479993,0.00015455579,0.00062207744],"genre_scores_gemma":[0.9957415,0.0000010405378,0.0033997898,0.00023625173,0.00026879561,0.00013035395,0.000007950031,0.000020833957,0.00019350176],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99633443,0.00015823153,0.00058530556,0.0009539899,0.0008391365,0.0011289198],"domain_scores_gemma":[0.99850893,0.00018429331,0.00019580044,0.00050614844,0.00050039456,0.00010445158],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0049370127,0.00026657173,0.0004177729,0.00014299988,0.0009035533,0.0006350782,0.00059376034,0.00008812336,0.00021866342],"category_scores_gemma":[0.00070829416,0.00020951979,0.000094186325,0.0003893432,0.0006813254,0.0006071516,0.00029232574,0.00006422346,0.00010994719],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015525043,0.0001626779,0.00063994294,0.000022012033,0.0000030730657,0.0000027575018,0.00006010272,0.00001950496,0.9954864,0.0015230705,0.0016431371,0.0002820635],"study_design_scores_gemma":[0.00047586707,0.00024934908,0.010050822,0.000032053773,0.00002005016,0.000010472485,0.000095105686,0.00010482788,0.9861602,0.0014712336,0.0010126281,0.00031737128],"about_ca_topic_score_codex":0.00048173196,"about_ca_topic_score_gemma":0.00010209304,"teacher_disagreement_score":0.00941088,"about_ca_system_score_codex":0.0003250977,"about_ca_system_score_gemma":0.0002802487,"threshold_uncertainty_score":0.8543969},"labels":[],"label_agreement":null},{"id":"W2055574202","doi":"10.1016/j.micron.2004.01.003","title":"Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines","year":2004,"lang":"en","type":"article","venue":"Micron","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Misorientation; Materials science; Grain boundary; Microstructure; Aspect ratio (aeronautics); Annealing (glass); Copper interconnect; Grain size; Composite material; Trench; Condensed matter physics; Physics","score_opus":0.007781704212738953,"score_gpt":0.2672483520397015,"score_spread":0.25946664782696255,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2055574202","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9988191,0.00017790514,0.00009545183,0.000249649,0.00021713269,0.00024381229,0.000043464443,0.000028427,0.00012504826],"genre_scores_gemma":[0.9994462,0.000023478313,0.00035896918,0.000055730234,0.000056261815,0.000004403615,0.00001528887,0.0000117076725,0.000027957383],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99893194,0.00007757307,0.0003340686,0.00035755188,0.000096242875,0.00020261006],"domain_scores_gemma":[0.9994537,0.0000611066,0.00011406747,0.00025175596,0.00006944748,0.000049895214],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022203506,0.00017524417,0.0002727576,0.0001286812,0.000047355712,0.000064242995,0.00013247083,0.000115345094,0.00022924946],"category_scores_gemma":[0.00011812613,0.00012731197,0.00007589655,0.00016109654,0.000074553165,0.00012918333,0.00005087182,0.000119968805,0.00001780221],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021872333,0.0001261112,0.0051171063,0.000030165691,0.000009024928,0.000005515803,0.001572034,0.00043992305,0.9919025,0.00007273286,0.000027815713,0.00047836578],"study_design_scores_gemma":[0.0012755155,0.00073154253,0.3433804,0.00013060012,0.000011778173,0.000035085908,0.000042756707,0.00010485967,0.6536245,0.00049949734,0.000013201244,0.00015027919],"about_ca_topic_score_codex":0.004805152,"about_ca_topic_score_gemma":0.0009782183,"teacher_disagreement_score":0.338278,"about_ca_system_score_codex":0.0001933546,"about_ca_system_score_gemma":0.00007530928,"threshold_uncertainty_score":0.7263984},"labels":[],"label_agreement":null},{"id":"W2056542301","doi":"10.1557/opl.2012.92","title":"Strain Analysis of Copper Films During Wet-Chemical Deposition.","year":2012,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mount Allison University","funders":"","keywords":"Materials science; Copper; Galvanic cell; Polyethylene terephthalate; Copper plating; Polyimide; Composite material; Metallurgy; Recrystallization (geology); Layer (electronics); Electroplating","score_opus":0.011692170809886646,"score_gpt":0.24642165105596284,"score_spread":0.2347294802460762,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2056542301","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9970228,0.000068045156,0.000018308523,0.00014294157,0.0001350273,0.000087935514,0.00003660143,0.00005586278,0.0024324744],"genre_scores_gemma":[0.99851567,0.000003042781,0.0012336124,0.00006287166,0.00007250747,0.000012055073,0.0000057634124,0.000009157544,0.00008534384],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989475,0.00000654824,0.00028266324,0.00022575555,0.00022364514,0.00031388295],"domain_scores_gemma":[0.9994936,0.000027263959,0.00009732076,0.000106595624,0.00012308525,0.00015215404],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00033809824,0.0001132494,0.0002599792,0.00011434219,0.00006503933,0.00004144749,0.00017319646,0.0000802917,0.0011928095],"category_scores_gemma":[0.00013765728,0.00009037241,0.00013705074,0.000374672,0.00010730723,0.00028405755,0.00008942486,0.00008103593,0.000035277448],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016294412,0.000089658206,0.023449617,0.000062835,0.0000510524,1.97733e-7,0.0010307592,0.0000046239193,0.97431093,0.000329992,0.00059903867,0.000054989923],"study_design_scores_gemma":[0.00013998256,0.000020999489,0.028607316,0.00002436368,0.00023681432,0.0000060435273,0.00048679984,0.00021916884,0.97000766,0.000036288933,0.000080064936,0.00013452742],"about_ca_topic_score_codex":0.00004853621,"about_ca_topic_score_gemma":0.0000016889528,"teacher_disagreement_score":0.0051577,"about_ca_system_score_codex":0.00004300156,"about_ca_system_score_gemma":0.000013015524,"threshold_uncertainty_score":0.9997202},"labels":[],"label_agreement":null},{"id":"W2059711083","doi":"10.1016/j.tsf.2012.07.039","title":"The effect of nickel on the strain evolution in chemical copper films","year":2012,"lang":"en","type":"article","venue":"Thin Solid Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":17,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mount Allison University","funders":"","keywords":"Nickel; Copper; Strain (injury); Metallurgy; Materials science; Chemistry; Biology","score_opus":0.011876888644918818,"score_gpt":0.26882028483247433,"score_spread":0.2569433961875555,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2059711083","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9949341,0.00018952783,0.000007158088,0.00078540127,0.0007424967,0.00033018342,0.000026700025,0.000025847869,0.0029586097],"genre_scores_gemma":[0.9995562,0.0000056574204,0.000039856073,0.00009849984,0.00007599999,0.000035812438,0.0000026261755,0.000009658992,0.00017569093],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986297,0.00028143826,0.00028294342,0.00017348392,0.00025962375,0.00037284795],"domain_scores_gemma":[0.99852043,0.0008418684,0.000084693726,0.00047400084,0.00002525806,0.00005373349],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0030045493,0.00013393628,0.0001954005,0.000018547498,0.00011133403,0.000030771113,0.00039437032,0.00009880704,0.0006137127],"category_scores_gemma":[0.00047005762,0.000059129434,0.00008697145,0.0000981091,0.00028944045,0.00008728013,0.000112916336,0.00023798633,0.00021733408],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013715147,0.0000806446,0.002564314,0.000026809868,0.0000063032926,4.443321e-7,0.0010146019,0.00008990717,0.98409915,0.003940927,0.0076474412,0.00039229708],"study_design_scores_gemma":[0.0004298829,0.00027271602,0.010239099,0.00008884938,0.000013221262,0.0000054261313,0.00046091928,0.001283412,0.9860893,0.00059025286,0.00037611555,0.00015081665],"about_ca_topic_score_codex":0.00015810526,"about_ca_topic_score_gemma":0.000016361253,"teacher_disagreement_score":0.0076747853,"about_ca_system_score_codex":0.000054629334,"about_ca_system_score_gemma":0.000023214494,"threshold_uncertainty_score":0.6719724},"labels":[],"label_agreement":null},{"id":"W2060301273","doi":"10.1016/s0167-9317(02)00816-x","title":"Modelling roughness, grain and confinement effects on transport in embedded metallic films","year":2002,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Materials science; Surface finish; Metal; Grain size; Surface roughness; Composite material; Nanotechnology; Metallurgy","score_opus":0.008055728145105676,"score_gpt":0.19343183692374938,"score_spread":0.1853761087786437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2060301273","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99183,0.0023382627,0.0050432887,0.000112139205,0.00016984015,0.00025686083,0.000002505775,0.00008579571,0.00016128935],"genre_scores_gemma":[0.9988475,0.00017103521,0.00072586566,0.000038676124,0.000030286328,0.00003919286,0.0000028324607,0.000022806676,0.00012180024],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99878645,0.000022423435,0.00023850691,0.0003602851,0.00011435339,0.00047795294],"domain_scores_gemma":[0.9996381,0.00007050134,0.000025522302,0.00019466858,0.0000122739175,0.000058974645],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021379335,0.0001997758,0.0002559988,0.00008916301,0.000038471346,0.000029121718,0.00012416094,0.00006435009,0.0002401541],"category_scores_gemma":[0.000013945158,0.00017889257,0.000051775216,0.000117271244,0.000019292858,0.000071026094,0.00001758894,0.00020757409,0.000022572953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012345921,0.000059562397,0.000017865785,0.00015349581,0.000010612853,0.00002040228,0.0004744966,0.081571124,0.9159163,0.0007679828,0.000026455762,0.00096932496],"study_design_scores_gemma":[0.00071031955,0.00016406897,0.000067648056,0.00013994054,0.000016672757,0.000016215234,0.00001795793,0.3092206,0.68803215,0.00006563018,0.0012671708,0.000281629],"about_ca_topic_score_codex":0.00009637028,"about_ca_topic_score_gemma":0.000025792855,"teacher_disagreement_score":0.22788419,"about_ca_system_score_codex":0.00009131883,"about_ca_system_score_gemma":0.000010602858,"threshold_uncertainty_score":0.72950274},"labels":[],"label_agreement":null},{"id":"W2061176162","doi":"10.1007/s00216-004-2602-5","title":"Comparison of the annealing behavior of thin Ta films deposited onto Si and SiO2 substrates","year":2004,"lang":"en","type":"article","venue":"Analytical and Bioanalytical Chemistry","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":14,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Bundesministerium für Bildung und Forschung","keywords":"Annealing (glass); Tetragonal crystal system; Silicide; Materials science; Nucleation; Crystallography; Metastability; Thin film; Sputtering; Silicon; Analytical Chemistry (journal); Chemical engineering; Chemistry; Metallurgy; Nanotechnology; Crystal structure","score_opus":0.021396462813250257,"score_gpt":0.2939623506323591,"score_spread":0.27256588781910884,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2061176162","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9984047,0.0002976587,0.000019431272,0.0005346387,0.000027677475,0.00007902327,0.00003030524,0.000013016589,0.00059354486],"genre_scores_gemma":[0.99964297,0.000011860637,0.00020267621,0.000037847072,0.00002192921,0.0000018761265,0.0000031567795,0.0000054966576,0.00007217155],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986884,0.000020938094,0.00050098414,0.000318693,0.00025669447,0.00021430042],"domain_scores_gemma":[0.99921626,0.0001479008,0.00010823785,0.00026782075,0.00010562362,0.00015414048],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020903602,0.00015273751,0.00040738037,0.000013845073,0.00007841821,0.0000393476,0.00020528513,0.00014823688,0.0002139478],"category_scores_gemma":[0.00019948605,0.000088835375,0.000102334845,0.00015573124,0.0009274538,0.00004768203,0.00016778377,0.00017124566,0.0000014153462],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000041134528,0.00028751438,0.051176447,0.00019330149,0.00002300308,0.0000030401736,0.000093921764,0.000033062075,0.9475262,0.0005070411,0.000022408849,0.00009288386],"study_design_scores_gemma":[0.00030549653,0.00007378683,0.016258493,0.00009858947,0.00022530256,0.0000127911035,0.0003267507,0.004520953,0.9776643,0.00036607365,0.000014130639,0.00013333482],"about_ca_topic_score_codex":0.00034112233,"about_ca_topic_score_gemma":0.000046457757,"teacher_disagreement_score":0.034917958,"about_ca_system_score_codex":0.000017805252,"about_ca_system_score_gemma":0.000043949578,"threshold_uncertainty_score":0.36226016},"labels":[],"label_agreement":null},{"id":"W2061755246","doi":"10.1109/tcad.2015.2419215","title":"Redundancy-Aware Power Grid Electromigration Checking Under Workload Uncertainties","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electromigration; Computer science; Grid; Exploit; Power integrity; Redundancy (engineering); Reliability (semiconductor); Speedup; Multithreading; Netlist; Reliability engineering; Interconnection; Electronic engineering; Parallel computing; Power (physics); Electrical engineering; Telecommunications; Embedded system; Signal integrity; Engineering","score_opus":0.04971213364321367,"score_gpt":0.2528883529949298,"score_spread":0.20317621935171612,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2061755246","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2500841,0.0003871674,0.7455065,0.00007043447,0.003247546,0.0004603986,0.00003261464,0.00013611009,0.00007511617],"genre_scores_gemma":[0.9990506,0.00005074268,0.00047173328,0.00006401024,0.00011022837,0.000047635054,0.0000047183494,0.000029077462,0.00017121964],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9974545,0.00046017574,0.0007421246,0.0005591455,0.00041178588,0.000372216],"domain_scores_gemma":[0.99828815,0.0002513381,0.00023951608,0.00040988423,0.00061721646,0.00019388253],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0009939859,0.0003370306,0.000557226,0.00023016123,0.00020303913,0.0002799635,0.00025861184,0.00021315539,0.000060579816],"category_scores_gemma":[0.000015175693,0.00025628286,0.00011545171,0.00034818213,0.00016845978,0.00028617942,0.000002997779,0.00029993034,0.000024594265],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003992345,0.0006436472,0.00002971931,0.00020892879,0.00022277808,0.000017905348,0.0035560243,0.415463,0.5596739,0.000653991,0.0023110465,0.01681983],"study_design_scores_gemma":[0.0032433076,0.005266093,0.00012864424,0.0031292678,0.00020607057,0.00034315017,0.007769958,0.51203114,0.46462998,0.0011039661,0.00062532275,0.0015231225],"about_ca_topic_score_codex":0.0010962335,"about_ca_topic_score_gemma":0.000048493686,"teacher_disagreement_score":0.7489665,"about_ca_system_score_codex":0.00025405598,"about_ca_system_score_gemma":0.0002974969,"threshold_uncertainty_score":0.9999889},"labels":[],"label_agreement":null},{"id":"W2062795510","doi":"10.1007/s11664-005-0157-7","title":"Effect of film thickness on the evolution of annealing texture in sputtered copper films","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":36,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Annealing (glass); Grain boundary; Electron backscatter diffraction; Materials science; Crystal twinning; Condensed matter physics; Copper; Sputtering; Diffraction; Texture (cosmology); Grain size; Electron diffraction; Microstructure; Thin film; Crystallography; Composite material; Optics; Metallurgy; Chemistry; Nanotechnology; Physics","score_opus":0.0056073387672300875,"score_gpt":0.25205405644024315,"score_spread":0.24644671767301307,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2062795510","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978433,0.00041284965,0.00003122422,0.0008300336,0.00046492202,0.0002353165,0.000022634797,0.0000051377483,0.0001545601],"genre_scores_gemma":[0.9996289,0.00003277007,0.00003855647,0.00006700063,0.00018344048,0.000004434508,8.98412e-7,0.00001105029,0.000032958225],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9976012,0.0006873056,0.0009078033,0.00014695391,0.00033358808,0.0003231181],"domain_scores_gemma":[0.9982866,0.00050998264,0.00074978825,0.00026115403,0.00015926595,0.000033205164],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0048965383,0.00015395903,0.0005614151,0.0001145805,0.00004037477,0.00003127836,0.00038130023,0.000114538794,0.0015392605],"category_scores_gemma":[0.0004938733,0.00008157939,0.00011191854,0.00013609978,0.00009389051,0.00014213269,0.000043786633,0.00021613127,0.000010316738],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008850196,0.00006588798,0.00015577849,0.00012086062,0.000015601274,0.0000017534072,0.00022649932,0.0017150951,0.9949699,0.0007669971,0.0008043966,0.00027218863],"study_design_scores_gemma":[0.0006942309,0.001532535,0.0007737294,0.00035205865,0.000029195047,0.00004634432,0.00007645463,0.00011943095,0.9957537,0.0003210463,0.00021970714,0.00008156583],"about_ca_topic_score_codex":0.00013015776,"about_ca_topic_score_gemma":0.000044194632,"teacher_disagreement_score":0.004402665,"about_ca_system_score_codex":0.00024472282,"about_ca_system_score_gemma":0.00020033447,"threshold_uncertainty_score":0.9993735},"labels":[],"label_agreement":null},{"id":"W2063558949","doi":"10.1063/1.371839","title":"Texture of Al thin films deposited by magnetron sputtering onto epitaxial W(001)","year":2000,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Stiftelsen för Strategisk Forskning; Stiftelsen för Strategisk Forskning; McGill University; Strategic Research Council; U.S. Department of Energy","keywords":"Materials science; Epitaxy; Tetragonal crystal system; Sputter deposition; Electromigration; Transmission electron microscopy; Lattice constant; Lattice (music); Electron diffraction; Diffraction; Condensed matter physics; Thin film; Crystallography; Layer (electronics); Sputtering; Composite material; Crystal structure; Optics; Nanotechnology; Chemistry","score_opus":0.005684454967060308,"score_gpt":0.2186227641762802,"score_spread":0.2129383092092199,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2063558949","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99461687,0.000098081066,0.00020338902,0.000094670024,0.00027857948,0.00009793207,0.00003199648,0.000012869684,0.004565645],"genre_scores_gemma":[0.99812365,0.000025085892,0.001164256,0.00026949073,0.00026601861,0.00000147617,0.0000042122406,0.000015260784,0.00013052748],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987193,0.000027650949,0.00051000743,0.00016674036,0.0003612825,0.00021503119],"domain_scores_gemma":[0.999237,0.0000550912,0.0003173229,0.0002090139,0.00009013143,0.0000914156],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00027501307,0.00015276589,0.00035132575,0.00002235947,0.000059591086,0.000051684234,0.00031357646,0.00007360346,0.0015666641],"category_scores_gemma":[0.0000065224485,0.00011400501,0.00012456442,0.000092731054,0.00008493944,0.00015510968,0.000033471693,0.00024760014,0.000040292154],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00030766136,0.00024409368,0.000036220117,0.000031169788,0.00001691267,0.0000037808572,0.00043210198,0.0024980148,0.97688365,0.00009861036,0.011776718,0.0076710433],"study_design_scores_gemma":[0.0011945623,0.00043213088,0.00060083234,0.00007701623,0.00005971871,0.000026435711,0.00014168474,0.0014266395,0.98507196,0.001400964,0.0093217995,0.00024627775],"about_ca_topic_score_codex":0.00007716314,"about_ca_topic_score_gemma":0.0000051024954,"teacher_disagreement_score":0.008188265,"about_ca_system_score_codex":0.000043062704,"about_ca_system_score_gemma":0.000038669892,"threshold_uncertainty_score":0.999346},"labels":[],"label_agreement":null},{"id":"W2066712831","doi":"10.1109/tdmr.2014.2343793","title":"Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Device and Materials Reliability","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"National Chung-Hsing University; Ministry of Science and Technology, Taiwan; National Chiao Tung University; University of Texas at Austin","keywords":"Benzocyclobutene; Materials science; Adhesion; Titanium; Polymer; Layer (electronics); Copper; Composite material; Metal; Metallurgy","score_opus":0.014649236734903759,"score_gpt":0.24736632346612117,"score_spread":0.2327170867312174,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2066712831","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9770858,0.00005165919,0.020720745,0.00059837237,0.00042702808,0.0008136451,0.00014335485,0.000108239634,0.000051123774],"genre_scores_gemma":[0.9985329,0.00016002948,0.0006465395,0.00016358688,0.00011014417,0.00030794612,0.000027972152,0.000022942748,0.000027969772],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99732065,0.00058369135,0.0007607439,0.00075207313,0.00021759383,0.00036527272],"domain_scores_gemma":[0.99870366,0.00040576622,0.00016583112,0.0004540981,0.00010008514,0.00017054238],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0019600794,0.00030658487,0.00055713265,0.00018409886,0.00025990675,0.00018542245,0.00015293376,0.00023547548,0.00024741556],"category_scores_gemma":[0.00006044001,0.00024741428,0.000049345563,0.0002496963,0.00022672758,0.00041120444,0.000009730173,0.0001541215,0.00004753283],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000086184315,0.00009753805,0.00017220216,0.00014531588,0.0000066677735,2.2986335e-7,0.00019574334,0.0000117614645,0.9861989,0.00022040663,0.000004983523,0.012860037],"study_design_scores_gemma":[0.0004217662,0.00022187935,0.010258591,0.00006915685,0.00007449673,0.000004661097,0.000059123748,0.00007699911,0.9865415,0.0018126082,0.00019187377,0.00026733763],"about_ca_topic_score_codex":0.0018430256,"about_ca_topic_score_gemma":0.00021258388,"teacher_disagreement_score":0.021447036,"about_ca_system_score_codex":0.00012844204,"about_ca_system_score_gemma":0.000037995727,"threshold_uncertainty_score":0.9999978},"labels":[],"label_agreement":null},{"id":"W2067850086","doi":"10.4028/www.scientific.net/msf.495-497.1377","title":"Texture Investigation in Cu Damascene Interconnects during Annealing","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Materials science; Copper interconnect; Annealing (glass); Electron backscatter diffraction; Diffraction; Line width; Interconnection; Composite material; Surface finish; Finite element method; Metallurgy; Optics; Copper; Structural engineering; Microstructure","score_opus":0.010328192340505981,"score_gpt":0.24993172348952378,"score_spread":0.2396035311490178,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2067850086","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99463296,0.000059044025,0.00003334688,0.002870603,0.0015278293,0.0003092782,0.000023551402,0.00013400051,0.00040936432],"genre_scores_gemma":[0.9981775,0.0000073478473,0.0010053418,0.0004119552,0.00024309802,0.000030421348,0.0000044491876,0.000017726485,0.00010211716],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9972073,0.000100075034,0.0005982651,0.00076864846,0.0004540247,0.00087170355],"domain_scores_gemma":[0.9989999,0.00004434277,0.00015661193,0.00050107745,0.00011579126,0.00018228556],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0020342146,0.00023154201,0.00030989456,0.00029007145,0.00037523636,0.00051042123,0.0007689258,0.00010253074,0.0012168861],"category_scores_gemma":[0.0003869448,0.00018800565,0.000041441468,0.0005384947,0.0006279586,0.0014577345,0.00041396669,0.000118443844,0.00035704314],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003165842,0.000030150148,0.0022576952,0.000036696885,6.523901e-7,0.0000045479787,0.000920217,0.00032510937,0.9953594,0.00052456657,0.000074085925,0.0004351921],"study_design_scores_gemma":[0.00036480208,0.00004984053,0.012511366,0.00014969289,0.0000028889099,0.000022310565,0.0004622173,0.0005141509,0.98467517,0.0007673794,0.00022282553,0.00025736325],"about_ca_topic_score_codex":0.00039677953,"about_ca_topic_score_gemma":0.00051046483,"teacher_disagreement_score":0.010684266,"about_ca_system_score_codex":0.0003316015,"about_ca_system_score_gemma":0.00015333868,"threshold_uncertainty_score":0.99969614},"labels":[],"label_agreement":null},{"id":"W2068154593","doi":"10.1007/s11664-010-1342-x","title":"Recrystallization of Electrodeposited Copper Thin Films During Annealing","year":2010,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Recrystallization (geology); Copper; Isothermal process; Annealing (glass); Materials science; Thermodynamics; Microstructure; Kinetics; Metallurgy; Thin film; Nanotechnology","score_opus":0.00482495346902307,"score_gpt":0.23298060703243897,"score_spread":0.2281556535634159,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2068154593","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9980539,0.00016670836,0.00015403294,0.00019027143,0.0011443909,0.0001419436,0.000013523898,0.000021351796,0.00011388421],"genre_scores_gemma":[0.998997,0.00007334911,0.0005518993,0.000038723716,0.00024089031,0.0000024879137,0.0000036548356,0.000020725422,0.000071289665],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9979368,0.00015194158,0.0009867925,0.00017994869,0.0003232591,0.00042128845],"domain_scores_gemma":[0.99829304,0.00007271627,0.0008559492,0.00025557049,0.00042406176,0.000098637815],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0016789295,0.00015619454,0.0004568722,0.00012854274,0.000089107416,0.00009303149,0.0003448308,0.00013360949,0.0023996034],"category_scores_gemma":[0.00049199356,0.00011607792,0.000095016454,0.00014625437,0.00006888346,0.00029101755,0.00004933971,0.00027494595,0.0000075100975],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00030792537,0.00006460931,0.00011538371,0.00008361906,0.000021818343,0.0000045496217,0.00017414123,0.00015489067,0.9981129,0.0006940333,0.00023804764,0.000028038658],"study_design_scores_gemma":[0.000488612,0.00034460393,0.00042617708,0.000076641765,0.000035086152,0.00023641756,0.000032179185,0.00004327635,0.99720365,0.0007001473,0.0002897882,0.00012340043],"about_ca_topic_score_codex":0.00005421617,"about_ca_topic_score_gemma":0.000029402396,"teacher_disagreement_score":0.0023920932,"about_ca_system_score_codex":0.00006877026,"about_ca_system_score_gemma":0.00031691886,"threshold_uncertainty_score":0.9985123},"labels":[],"label_agreement":null},{"id":"W2069425306","doi":"10.1016/j.colsurfa.2008.04.036","title":"Effect of amine and thiol addition on the surface chemistry and agglomeration of fine Cu powders","year":2008,"lang":"en","type":"article","venue":"Colloids and Surfaces A Physicochemical and Engineering Aspects","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Economies of agglomeration; Chemistry; Propylamine; Copper; Thiol; Amine gas treating; Particle size; Butylamine; Chemical engineering; Inorganic chemistry; Organic chemistry; Physical chemistry","score_opus":0.00471665972614281,"score_gpt":0.19016599227205788,"score_spread":0.18544933254591509,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2069425306","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9989671,0.0006510083,0.000008262763,0.000100450045,0.000030553227,0.00011319333,0.0000258794,0.00001644116,0.000087095126],"genre_scores_gemma":[0.9996864,0.00019240314,0.00006072971,0.0000060125167,0.000022275679,0.000003797484,0.0000043864516,0.0000061749024,0.000017811932],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99945545,0.000017299139,0.00013173334,0.00019370919,0.00009610365,0.000105673964],"domain_scores_gemma":[0.99943227,0.00034968855,0.000042943073,0.00009723988,0.000027338587,0.0000505462],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014403295,0.00012276988,0.00023457856,0.0000072184416,0.000060089515,0.00001664484,0.000037238417,0.000049225797,0.000010928032],"category_scores_gemma":[0.000087735294,0.000080512844,0.000022739814,0.00006157141,0.00018914096,0.000049450453,0.00004605274,0.00007618797,2.0206568e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005056835,0.000022701643,0.00022712667,0.00030228143,0.00000870854,6.563586e-7,0.00016357766,0.0002353872,0.99860966,0.00007762923,0.000046097768,0.000255605],"study_design_scores_gemma":[0.0003377295,0.00024366353,0.0026042094,0.00012250943,0.000014583215,0.000008949481,0.000026933427,0.0075123264,0.988963,0.000046410267,0.000021577202,0.00009811888],"about_ca_topic_score_codex":0.000038723654,"about_ca_topic_score_gemma":8.886213e-7,"teacher_disagreement_score":0.009646671,"about_ca_system_score_codex":0.0000071078,"about_ca_system_score_gemma":0.0000064556584,"threshold_uncertainty_score":0.32832184},"labels":[],"label_agreement":null},{"id":"W2072548313","doi":"10.4028/www.scientific.net/ssp.105.101","title":"Texture Control in Manufacturing of ULSI Devices","year":2005,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada)","funders":"","keywords":"Copper interconnect; Materials science; Microstructure; Electromigration; Wafer; Electroplating; Texture (cosmology); Process control; Copper; Optoelectronics; Composite material; Metallurgy; Process (computing); Computer science; Layer (electronics)","score_opus":0.026200229848109574,"score_gpt":0.2980135146658638,"score_spread":0.27181328481775424,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2072548313","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9382714,0.0021507891,0.002110341,0.0006607733,0.0010971718,0.0020146505,0.05223772,0.00029265732,0.0011644975],"genre_scores_gemma":[0.98668134,0.004256448,0.0005150668,0.001224849,0.0005619788,0.00010310513,0.0059727347,0.00018237882,0.0005021237],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9887485,0.0008788091,0.0031032683,0.0034306718,0.0012851773,0.0025535617],"domain_scores_gemma":[0.99157053,0.000815466,0.0011979392,0.0051253024,0.00029092585,0.0009998118],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0036723714,0.0014642727,0.0024245298,0.00064271333,0.00065668154,0.00074010063,0.0035546261,0.00021781227,0.0010118242],"category_scores_gemma":[0.00025991513,0.0012255255,0.00022311964,0.0005432949,0.000825907,0.0029686482,0.0043762964,0.0008750287,0.00033832015],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.015182737,0.015118989,0.02342291,0.008149366,0.0029200215,0.0008497098,0.07021695,0.05508905,0.4214215,0.00038555148,0.062081378,0.32516184],"study_design_scores_gemma":[0.036585227,0.0029643124,0.025020776,0.0021476247,0.0010967382,0.00021475609,0.007995219,0.15748481,0.06284789,0.008836231,0.6844439,0.010362486],"about_ca_topic_score_codex":0.0010191709,"about_ca_topic_score_gemma":0.004638509,"teacher_disagreement_score":0.62236255,"about_ca_system_score_codex":0.0003283664,"about_ca_system_score_gemma":0.00032296847,"threshold_uncertainty_score":0.9999014},"labels":[],"label_agreement":null},{"id":"W2075042583","doi":"10.4028/www.scientific.net/msf.495-497.1443","title":"Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Electromigration; Electron backscatter diffraction; Materials science; Microstructure; Hillock; Copper interconnect; Texture (cosmology); Interconnection; Composite material; Metallurgy; Copper","score_opus":0.006763865838040981,"score_gpt":0.2594350419184351,"score_spread":0.2526711760803941,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2075042583","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.997992,0.00006410426,0.00019341976,0.0007412514,0.0006204091,0.00025762402,0.000037126356,0.00002941456,0.000064659514],"genre_scores_gemma":[0.9973508,0.000026439866,0.0023903074,0.000109872715,0.00006524962,0.00001193598,0.000006062626,0.000008068402,0.0000312274],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9982233,0.00007347921,0.0004936225,0.00051639066,0.00028328344,0.00040989817],"domain_scores_gemma":[0.99926966,0.000048017864,0.00017661967,0.0002971197,0.00014114636,0.000067429384],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013163819,0.00015384691,0.00025546085,0.00018864093,0.00013908086,0.00021061882,0.0003821972,0.000070027134,0.00043714585],"category_scores_gemma":[0.00028418328,0.00012030155,0.000022640146,0.00033521987,0.0005277971,0.0009931842,0.00019357624,0.00006277405,0.000016747745],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006074544,0.00003139302,0.0032286479,0.000028741673,6.238179e-7,8.184391e-7,0.00075940444,0.000042964162,0.99389434,0.00073836464,0.000028797012,0.0011851772],"study_design_scores_gemma":[0.00028754747,0.00012754917,0.023396872,0.000056437817,0.00000405691,0.000017935256,0.00037676157,0.0003364036,0.97437584,0.00077703485,0.00010494529,0.00013861487],"about_ca_topic_score_codex":0.00049905374,"about_ca_topic_score_gemma":0.0018426746,"teacher_disagreement_score":0.020168224,"about_ca_system_score_codex":0.0001046906,"about_ca_system_score_gemma":0.000108156455,"threshold_uncertainty_score":0.49057546},"labels":[],"label_agreement":null},{"id":"W2075825080","doi":"10.1103/physrevb.81.045406","title":"Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles","year":2010,"lang":"en","type":"article","venue":"Physical Review B","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":74,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Electrical resistivity and conductivity; Specular reflection; Materials science; Scattering; Surface roughness; Condensed matter physics; Thin film; Surface finish; Composite material; Nanotechnology; Optics; Physics","score_opus":0.016178955460565792,"score_gpt":0.27733224126518924,"score_spread":0.26115328580462344,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2075825080","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99591297,0.0020072947,0.000011511251,0.0008673176,0.00011318693,0.0002820633,0.00011858161,0.000028961233,0.00065809157],"genre_scores_gemma":[0.9978909,0.0011762348,0.00047086328,0.00034254603,0.00004701795,0.000019776064,0.0000069893254,0.000010153344,0.000035516572],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99896437,0.00007681921,0.00022449328,0.00035666116,0.00021484961,0.00016282818],"domain_scores_gemma":[0.99888694,0.00033004233,0.00012621019,0.00045446205,0.000086700034,0.00011564145],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003543612,0.0001461535,0.00044732893,0.0000087185645,0.00007567403,0.00002909381,0.00019634535,0.00003120663,0.00074733107],"category_scores_gemma":[0.00051080296,0.000086523905,0.000069797214,0.00008186507,0.0003135748,0.000106842854,0.00012489063,0.00017776774,0.000051464005],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010128503,0.0003439066,0.0036016973,0.001189716,0.000026596781,0.000005331235,0.00030670234,0.00000815017,0.98682517,0.0019058521,0.0043878285,0.001297764],"study_design_scores_gemma":[0.0013841398,0.0007220454,0.10656066,0.008216754,0.0004673455,0.00001029755,0.0000770903,0.005003124,0.6246581,0.0027988388,0.24886464,0.0012369591],"about_ca_topic_score_codex":0.00073067483,"about_ca_topic_score_gemma":0.00063450035,"teacher_disagreement_score":0.36216706,"about_ca_system_score_codex":0.000008390647,"about_ca_system_score_gemma":0.000042274896,"threshold_uncertainty_score":0.8182751},"labels":[],"label_agreement":null},{"id":"W2076098397","doi":"10.1063/1.1764942","title":"Effects of capillary forces on copper∕dielectric interfacial void evolution","year":2004,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Void (composites); Copper; Materials science; Electric field; Capillary action; Instability; Rotational symmetry; Mechanics; Dielectric; Composite material; Condensed matter physics; Metallurgy; Optoelectronics; Physics","score_opus":0.005144367690911782,"score_gpt":0.20628970237629315,"score_spread":0.20114533468538137,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2076098397","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99371195,0.0000403393,0.0040677185,0.00031102906,0.00047136418,0.00036888602,0.0000051064753,0.000066520945,0.0009570636],"genre_scores_gemma":[0.9986546,0.000004604506,0.00013752119,0.00091960974,0.00022151037,0.000036241236,0.0000041093863,0.000017775808,0.000004003024],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99886453,0.00002845384,0.00022021796,0.0003423225,0.00025198326,0.00029250575],"domain_scores_gemma":[0.99942833,0.0001217339,0.00011190747,0.00025789574,0.000029828883,0.000050286533],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000114143746,0.00018348443,0.00024861254,0.00004651113,0.0000931632,0.00002473702,0.00023018538,0.000059457012,0.000014727098],"category_scores_gemma":[0.000016835787,0.00015369494,0.0000925621,0.000176304,0.00015650834,0.00007648711,0.000059978778,0.00014036625,0.00014220316],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000922344,0.0001375253,0.000018836747,0.000100079225,0.000012060089,0.0000019466547,0.00041510683,0.00267173,0.98285925,0.012333505,0.000415536,0.00094219705],"study_design_scores_gemma":[0.0006702733,0.00016031711,0.0005280442,0.000047333622,0.000022869881,8.7611124e-7,0.000030138359,0.000015557065,0.9955298,0.0027469757,0.000069208276,0.00017862214],"about_ca_topic_score_codex":0.00020890492,"about_ca_topic_score_gemma":0.0000063187254,"teacher_disagreement_score":0.012670541,"about_ca_system_score_codex":0.00017935756,"about_ca_system_score_gemma":0.00003675304,"threshold_uncertainty_score":0.6267498},"labels":[],"label_agreement":null},{"id":"W2077851897","doi":"10.1143/jjap.44.2294","title":"Effects of the Metallurgical Properties of Upper Cu Film on Stress-Induced Voiding (SIV) in Cu Dual-Damascene Interconnects","year":2005,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada; Macquarie University","keywords":"Materials science; Void (composites); Annealing (glass); Copper; Vacancy defect; Stress (linguistics); Composite material; Copper interconnect; Metallurgy; Diffusion barrier; Crystallography; Chemistry","score_opus":0.014874199039206976,"score_gpt":0.23462044754135516,"score_spread":0.2197462485021482,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2077851897","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99865246,0.000038785096,0.000008601269,0.00022533075,0.00025434626,0.00030702725,0.000002309057,0.000008223077,0.000502942],"genre_scores_gemma":[0.9995689,0.0000072433922,0.00008607049,0.00009413159,0.00020566785,0.000009389585,2.0728106e-7,0.000016161768,0.000012265552],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981217,0.00013997697,0.0007539467,0.00021413412,0.00051362853,0.00025662108],"domain_scores_gemma":[0.9985553,0.0003362954,0.0005375445,0.00030943064,0.00018496517,0.000076439814],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006381416,0.00020712904,0.00057997066,0.00007113936,0.000059919563,0.00002957023,0.0004607444,0.000077753284,0.000044857803],"category_scores_gemma":[0.0001835607,0.00011121437,0.00023515965,0.00023607707,0.0001577456,0.00021259829,0.00013819772,0.00033805464,0.000010670577],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004655857,0.00067676,0.00017898293,0.000173189,0.000029952016,0.0000029530402,0.006562098,0.0076672123,0.9829284,0.00059577805,0.000008061926,0.00071105774],"study_design_scores_gemma":[0.0010622289,0.0002227454,0.0032417395,0.00047200007,0.000033913537,0.00000998406,0.0013829152,0.0008565913,0.9922074,0.00036629123,0.000014110267,0.00013005701],"about_ca_topic_score_codex":0.000040322426,"about_ca_topic_score_gemma":0.0000148664985,"teacher_disagreement_score":0.009279054,"about_ca_system_score_codex":0.00008404998,"about_ca_system_score_gemma":0.00006740168,"threshold_uncertainty_score":0.45351905},"labels":[],"label_agreement":null},{"id":"W2078423352","doi":"10.1143/jjap.45.2992","title":"AC Power Loss and Signal Coupling in Very Large Scale Integration Backend Interconnects","year":2006,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Coupling (piping); Materials science; Coupling loss; SIGNAL (programming language); Power (physics); Dielectric; Dielectric loss; Optoelectronics; Metal; Electrical engineering; Physics; Composite material; Optics; Computer science; Engineering","score_opus":0.006935371733267827,"score_gpt":0.22764538440143872,"score_spread":0.2207100126681709,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2078423352","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978059,0.000027387256,0.00077817903,0.00006637762,0.00018569427,0.00010728223,0.000004281739,0.000011617166,0.0010132993],"genre_scores_gemma":[0.99936324,0.0000038703442,0.00033515398,0.000070255664,0.00020292317,0.000003175963,0.0000019316856,0.000011440865,0.000007994702],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988386,0.000021950988,0.00047347922,0.00019053892,0.00023803678,0.00023739872],"domain_scores_gemma":[0.99931455,0.00014481647,0.00021697608,0.00012997526,0.00012768594,0.000065997934],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00071778457,0.00014481884,0.00029161558,0.00006036572,0.00007057234,0.000088379464,0.00015897385,0.000059503076,0.00011501826],"category_scores_gemma":[0.000014648112,0.00010638116,0.00006684393,0.00014845814,0.000096946605,0.00033557802,0.000053076998,0.00022449931,0.000017238652],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00029082363,0.000289646,0.0015925174,0.000018679124,0.0000047999006,0.000011056606,0.0027842927,0.0043889857,0.98850995,0.0017919602,0.00005416868,0.00026312325],"study_design_scores_gemma":[0.0025087527,0.00029183584,0.013142253,0.00017840086,0.000028479075,0.000075073985,0.0070717055,0.010013534,0.94473857,0.021442281,0.00012722479,0.00038189307],"about_ca_topic_score_codex":0.000037732687,"about_ca_topic_score_gemma":0.00006580274,"teacher_disagreement_score":0.043771382,"about_ca_system_score_codex":0.000071584174,"about_ca_system_score_gemma":0.000033256605,"threshold_uncertainty_score":0.43380976},"labels":[],"label_agreement":null},{"id":"W2078813529","doi":"10.1007/s11664-005-0058-9","title":"Textural and microstructural transformation of Cu damascene interconnects after annealing","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":12,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Annealing (glass); Copper interconnect; Materials science; Electron backscatter diffraction; Diffraction; Microstructure; Grain boundary; Composite material; Metallurgy; Copper; Optics","score_opus":0.005182863311793434,"score_gpt":0.23839266541615833,"score_spread":0.2332098021043649,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2078813529","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9972877,0.0011786973,0.00010696772,0.0007469557,0.0004890154,0.00012377594,0.000026018592,0.000008947699,0.000031958796],"genre_scores_gemma":[0.99908745,0.00012308954,0.00037664926,0.0001127558,0.00026931884,0.0000021379992,0.000001970926,0.000010772836,0.000015834346],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99835646,0.00011744517,0.00087794976,0.00013326414,0.00018732605,0.00032753585],"domain_scores_gemma":[0.99912,0.00005452566,0.00044270576,0.00012597021,0.00018909539,0.0000676967],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0009803453,0.00015106794,0.00042139378,0.00009518922,0.00004259647,0.000091206224,0.00017756711,0.00007773261,0.0011854701],"category_scores_gemma":[0.00006775706,0.00010346058,0.00007703741,0.000056547036,0.00009207933,0.0005633797,0.00003418417,0.000121935,0.000005521718],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005019823,0.000021083588,0.00005178594,0.0000942428,0.000017116194,0.0000019461472,0.0010529945,0.000022910346,0.99569225,0.00024098091,0.000047462447,0.0022552297],"study_design_scores_gemma":[0.000683122,0.00040517916,0.0012142933,0.00012991167,0.000039011982,0.00033669142,0.00012622145,0.00003847958,0.9954329,0.00058722333,0.0008852831,0.000121693396],"about_ca_topic_score_codex":0.00004053985,"about_ca_topic_score_gemma":0.000039257055,"teacher_disagreement_score":0.0021335364,"about_ca_system_score_codex":0.000104406485,"about_ca_system_score_gemma":0.000095387906,"threshold_uncertainty_score":0.9997276},"labels":[],"label_agreement":null},{"id":"W2083196491","doi":"10.4028/www.scientific.net/ssp.105.391","title":"Effects of Dielectric Roughness on Texture of Both PVD Seed Layers and EP Copper","year":2005,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada)","funders":"","keywords":"Materials science; Dielectric; Texture (cosmology); Surface finish; Surface roughness; Wafer; Composite material; Copper; Diffractometer; Silicon nitride; Electroplating; Chemical vapor deposition; Fiber; Layer (electronics); Optoelectronics; Metallurgy; Scanning electron microscope","score_opus":0.01862030315393946,"score_gpt":0.28444293677012344,"score_spread":0.26582263361618397,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2083196491","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9646135,0.0029261291,0.0011466955,0.00038838095,0.0009158583,0.002178861,0.026655775,0.00022105173,0.00095375825],"genre_scores_gemma":[0.9850979,0.008768979,0.0004409672,0.0007997674,0.00036164047,0.000091692746,0.0036600516,0.00018651102,0.00059250393],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9905285,0.0008619455,0.002339284,0.0029793254,0.0012673679,0.002023561],"domain_scores_gemma":[0.9923031,0.001305108,0.0012005455,0.0038899165,0.00035037924,0.00095095875],"candidate_categories":["metaepi_narrow"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0024240315,0.0013877683,0.0023972713,0.00057547214,0.0006457061,0.00042138775,0.0022787338,0.00021870813,0.00023030357],"category_scores_gemma":[0.0004315438,0.0011231614,0.00020455055,0.00080000696,0.0010336945,0.001699069,0.0035825246,0.0007676117,0.000117387106],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.013129589,0.011460176,0.0051885415,0.010003757,0.0022778357,0.00027642425,0.041080926,0.008595757,0.7607157,0.0008807004,0.03953468,0.10685591],"study_design_scores_gemma":[0.057429336,0.01694842,0.042729665,0.004720061,0.0033466525,0.00029096907,0.005723201,0.16416992,0.3538621,0.014340582,0.3202972,0.016141862],"about_ca_topic_score_codex":0.00064052676,"about_ca_topic_score_gemma":0.0005236913,"teacher_disagreement_score":0.4068536,"about_ca_system_score_codex":0.00021514762,"about_ca_system_score_gemma":0.00030020624,"threshold_uncertainty_score":0.9998873},"labels":[],"label_agreement":null},{"id":"W2086305156","doi":"10.4028/www.scientific.net/msf.778-780.1104","title":"SiC Power Devices as Enabler for High Power Density - Aspects and Prospects","year":2014,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Enabling; Materials science; Power (physics); Power density; Power semiconductor device; Current (fluid); Path (computing); Engineering physics; Focus (optics); Electrical engineering; State (computer science); Power module; Silicon carbide; Computer science; Engineering; Voltage","score_opus":0.00711601703046544,"score_gpt":0.2393528065489845,"score_spread":0.23223678951851906,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2086305156","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9918364,0.000034399258,0.0002285943,0.0015571056,0.0031991855,0.0007199688,0.00003554982,0.00013676625,0.002252027],"genre_scores_gemma":[0.9974324,0.000002635146,0.0011413328,0.0009558232,0.00010477039,0.00005585698,0.0000027272954,0.000022624457,0.00028184018],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99710554,0.00007432928,0.00039894838,0.0009776178,0.000492693,0.00095084857],"domain_scores_gemma":[0.9985466,0.00014300064,0.00018286439,0.0005979307,0.00029080975,0.00023879475],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0025691905,0.000278892,0.00042036135,0.000114944945,0.00075644435,0.00094919273,0.0006220886,0.000103678656,0.001694441],"category_scores_gemma":[0.0007678655,0.00020140724,0.000046869874,0.00021649688,0.000954846,0.0008005557,0.00047966847,0.00005883996,0.00032221686],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006624215,0.000052506577,0.0004057198,0.000052341216,0.000002201652,0.0000017887038,0.00021635657,0.000001773923,0.9479458,0.05074272,0.0004416223,0.00007094796],"study_design_scores_gemma":[0.00040366637,0.00057864236,0.00970917,0.000048362337,0.000012046187,0.000024046529,0.00017621771,0.000017635653,0.9538819,0.03153811,0.0032854788,0.00032469412],"about_ca_topic_score_codex":0.00034015154,"about_ca_topic_score_gemma":0.00008656277,"teacher_disagreement_score":0.019204611,"about_ca_system_score_codex":0.00008971665,"about_ca_system_score_gemma":0.00015826886,"threshold_uncertainty_score":0.99921817},"labels":[],"label_agreement":null},{"id":"W2087488503","doi":"10.1016/j.mee.2012.02.035","title":"Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films","year":2012,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":28,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electron backscatter diffraction; Annealing (glass); Electrical resistivity and conductivity; Materials science; Microstructure; Grain size; Copper; Composite material; Thin film; Metallurgy; Nanotechnology","score_opus":0.0033478172311345905,"score_gpt":0.19812944473971175,"score_spread":0.19478162750857717,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2087488503","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99177736,0.004171962,0.0029150685,0.000047958158,0.000491943,0.00021547692,0.000014522394,0.00022485925,0.00014087932],"genre_scores_gemma":[0.9966893,0.00004707647,0.0029947944,0.000023369234,0.000105654486,0.000010999723,0.00001753527,0.000033447785,0.00007779419],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99845356,0.000054868746,0.0003447753,0.00026490836,0.00016585908,0.00071603013],"domain_scores_gemma":[0.9992965,0.000100106794,0.00010617662,0.00032678657,0.00007730077,0.00009314466],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00039549795,0.00022115406,0.00029291218,0.00009316325,0.00008125984,0.00003208709,0.00021165138,0.00014862104,0.00023485853],"category_scores_gemma":[0.00008269182,0.00019650468,0.00009998709,0.00022350004,0.000029820421,0.00022852262,0.000062224084,0.00031171108,0.000038090497],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003151151,0.00006279815,0.0007174891,0.000090714224,0.000022585597,7.10808e-7,0.00044195153,0.0026012084,0.9950374,0.00047479733,0.00043592788,0.000082946295],"study_design_scores_gemma":[0.00031310652,0.00009008322,0.004594052,0.00004121637,0.000043085096,0.00006321527,0.00001582736,0.0069657536,0.9857429,0.000016018528,0.0018767779,0.00023794353],"about_ca_topic_score_codex":0.000051752217,"about_ca_topic_score_gemma":0.000011919068,"teacher_disagreement_score":0.009294439,"about_ca_system_score_codex":0.00023569127,"about_ca_system_score_gemma":0.000065399516,"threshold_uncertainty_score":0.8013229},"labels":[],"label_agreement":null},{"id":"W2091960683","doi":"10.1007/s11664-002-0173-9","title":"Effect of the underlayer on the microstructure and surface evolution in Al-0.5wt.%Cu polycrystalline thin films","year":2002,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":7,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Crystallite; Thin film; Microstructure; Deposition (geology); Texture (cosmology); Composite material; Coalescence (physics); Grain size; Surface finish; Grain growth; Sputter deposition; Sputtering; Metallurgy; Nanotechnology; Geology","score_opus":0.006050005988310131,"score_gpt":0.2288986451714663,"score_spread":0.22284863918315617,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2091960683","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99557745,0.00091571745,0.0000063974844,0.002561025,0.00060652837,0.00025586496,0.000018555662,0.0000046700266,0.00005381087],"genre_scores_gemma":[0.99953973,0.000093931056,0.000015442942,0.00018012644,0.00005877655,0.000001349424,2.6335124e-7,0.000010273513,0.00010009075],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99803513,0.00070458703,0.0005473025,0.00014928385,0.00026660127,0.00029707132],"domain_scores_gemma":[0.9988278,0.00037360008,0.00044414043,0.00025945314,0.00006357225,0.000031397598],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0025238458,0.0001534229,0.00035915372,0.00003750683,0.00008159,0.000067681955,0.00032732903,0.00008414189,0.0015831218],"category_scores_gemma":[0.00029480734,0.00006642748,0.00007640653,0.0001164587,0.00012751349,0.00009377525,0.000066150154,0.00023992182,0.000004816056],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002515189,0.000033597287,0.00019176494,0.000038591068,0.000011493181,0.000001456861,0.00015107632,0.00022092712,0.9974011,0.0005148289,0.001159908,0.000023716975],"study_design_scores_gemma":[0.000654,0.0010165774,0.0021400275,0.00015794544,0.000027333203,0.00010838812,0.000038679435,0.00013689793,0.9941338,0.0011511644,0.00034622964,0.00008900291],"about_ca_topic_score_codex":0.00010788244,"about_ca_topic_score_gemma":0.000047586276,"teacher_disagreement_score":0.003962316,"about_ca_system_score_codex":0.00013457426,"about_ca_system_score_gemma":0.000057470093,"threshold_uncertainty_score":0.99932957},"labels":[],"label_agreement":null},{"id":"W2092141857","doi":"10.1007/s11664-003-0221-0","title":"New copper seed-layer enhancement process metrology for advanced dual-damascene interconnects","year":2003,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Copper interconnect; Electroplating; Copper; Plating (geology); Copper plating; Layer (electronics); Materials science; Deposition (geology); Metrology; Electrochemistry; Surface roughness; Ion chromatography; Electrode; Chemical engineering; Analytical Chemistry (journal); Optoelectronics; Chemistry; Chromatography; Nanotechnology; Metallurgy; Composite material; Optics","score_opus":0.01202037644450073,"score_gpt":0.29190433710604224,"score_spread":0.27988396066154153,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2092141857","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9895594,0.0008627101,0.005217682,0.0007573813,0.002733632,0.0005205306,0.000014226139,0.000023038067,0.0003113632],"genre_scores_gemma":[0.9964552,0.000094275456,0.002021718,0.00035465197,0.00038566836,0.000035868223,0.0000029194052,0.00003502046,0.0006147132],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9970428,0.00025834874,0.0011395374,0.0003802785,0.00032496025,0.000854098],"domain_scores_gemma":[0.9979864,0.0002164739,0.0007917017,0.00030036017,0.00051462377,0.00019048824],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0023855136,0.00029532626,0.00080685475,0.00013656575,0.000105460735,0.00013000883,0.00039052998,0.0001471613,0.0045572426],"category_scores_gemma":[0.0008570112,0.00021304739,0.00016364541,0.00013087306,0.000054612556,0.0003654336,0.000043915148,0.00017549635,0.000043209366],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008639659,0.00013574027,0.000019527384,0.00010302181,0.000065353976,0.0000052291957,0.00023394912,0.00006534656,0.9933198,0.0030589236,0.0017931261,0.00033600174],"study_design_scores_gemma":[0.00223999,0.0022443144,0.000024623381,0.00008531636,0.00008252511,0.00019358577,0.00013648985,0.0000030671465,0.9701254,0.0072305654,0.017394437,0.00023970465],"about_ca_topic_score_codex":0.000014290427,"about_ca_topic_score_gemma":0.000023018834,"teacher_disagreement_score":0.023194432,"about_ca_system_score_codex":0.0003063978,"about_ca_system_score_gemma":0.0008867606,"threshold_uncertainty_score":0.99635273},"labels":[],"label_agreement":null},{"id":"W2093235814","doi":"10.1016/s0169-4332(02)01322-3","title":"Cu cluster adhesion enhancement on the modified Dow Cyclotene surface through low energy N2+ beam irradiation at grazing angles","year":2003,"lang":"en","type":"article","venue":"Applied Surface Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"X-ray photoelectron spectroscopy; Materials science; Irradiation; Beam (structure); Cluster (spacecraft); Evaporation; Coalescence (physics); Contact angle; Polymer; Analytical Chemistry (journal); Beam energy; Surface energy; Adhesion; Atomic physics; Optics; Composite material; Chemistry; Physics; Nuclear magnetic resonance; Nuclear physics","score_opus":0.017930894538173033,"score_gpt":0.2426618815341946,"score_spread":0.22473098699602156,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2093235814","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9814474,0.00012729487,0.002668723,0.00084626925,0.0009345104,0.00049870735,0.000009279011,0.00009660217,0.01337124],"genre_scores_gemma":[0.99646235,0.00007460016,0.0015580606,0.0011979892,0.000035093704,0.000028635777,0.0000037125128,0.00002221754,0.00061735185],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99639165,0.00015713001,0.00045851362,0.0011116805,0.0010714857,0.00080951094],"domain_scores_gemma":[0.99804854,0.0004454922,0.0002255131,0.00098825,0.00014378276,0.00014839417],"candidate_categories":["sts"],"consensus_categories":[],"category_scores_codex":[0.002578679,0.00033450007,0.00029020957,0.000039624654,0.0013049892,0.00027994302,0.000844987,0.0001095674,0.00034367276],"category_scores_gemma":[0.00018222442,0.00021564266,0.000083402796,0.00070362684,0.00082964444,0.00036800993,0.0002840782,0.00016150145,0.00033563597],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000055507517,0.000110790475,0.000055742214,0.000011719401,0.0000030570482,8.074228e-7,0.0006239436,0.031778194,0.94599235,0.020566326,0.00057493296,0.00022660043],"study_design_scores_gemma":[0.00031950284,0.000090452144,0.00046232477,0.000037042246,0.000008958877,0.0000023691118,0.00032427203,0.0028571386,0.9913648,0.0024664525,0.0017379989,0.00032869904],"about_ca_topic_score_codex":0.00033252744,"about_ca_topic_score_gemma":0.00011874215,"teacher_disagreement_score":0.04537241,"about_ca_system_score_codex":0.00046108096,"about_ca_system_score_gemma":0.00016670646,"threshold_uncertainty_score":0.9999952},"labels":[],"label_agreement":null},{"id":"W2099276265","doi":"10.1109/iitc.2008.4546943","title":"Integration Aspects of CoWP Capping Layers for Electromigration Enhancement","year":2008,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Freistaat Sachsen; European Commission","keywords":"Electromigration; Materials science; Time-dependent gate oxide breakdown; Dielectric strength; Copper; Dielectric; Reliability (semiconductor); Degradation (telecommunications); Node (physics); Electronic engineering; Optoelectronics; Composite material; Metallurgy; Electrical engineering; Power (physics); Transistor; Gate dielectric","score_opus":0.02494026678946528,"score_gpt":0.2631892212517321,"score_spread":0.23824895446226682,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2099276265","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93341106,0.00002540148,0.06145946,0.00019130413,0.00020502687,0.00028171923,0.000003817641,0.000026737422,0.0043954663],"genre_scores_gemma":[0.99623555,0.00002029218,0.0033988543,0.0000640139,0.000037585552,0.000030368059,0.0000070103456,0.0000037318857,0.00020259088],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999386,0.000018622779,0.00020379774,0.00015631082,0.00010090486,0.00013434535],"domain_scores_gemma":[0.99963313,0.000054568507,0.00006574055,0.00011909724,0.0001056909,0.00002178317],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022142133,0.00006127596,0.000110016816,0.000028308928,0.000081816,0.000009854517,0.0000663496,0.000029577252,0.00036509839],"category_scores_gemma":[0.00007441974,0.00004436633,0.0000453845,0.000050714465,0.000041943542,0.00009806589,0.000012531056,0.000024211842,0.000013774825],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003116836,0.000042485157,0.000029951005,0.000015438076,0.0000022173626,1.3339307e-7,0.00043399792,0.000012479938,0.99048495,0.007829725,0.000588893,0.0005285643],"study_design_scores_gemma":[0.00017614274,0.00023599787,0.0003135519,0.000014185413,0.000004380137,0.0000022844745,0.00013106667,0.0011317258,0.9968776,0.0006532103,0.00040190754,0.000057961464],"about_ca_topic_score_codex":0.00018664912,"about_ca_topic_score_gemma":0.00032556313,"teacher_disagreement_score":0.06282449,"about_ca_system_score_codex":0.000052104773,"about_ca_system_score_gemma":0.000040884028,"threshold_uncertainty_score":0.39975715},"labels":[],"label_agreement":null},{"id":"W2102901745","doi":"10.4028/www.scientific.net/kem.508.48","title":"Interface Reaction Behavior between Mn and SiO&lt;sub&gt;2&lt;/sub&gt; Formed by RF Sputter Deposition","year":2012,"lang":"en","type":"article","venue":"Key engineering materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hatch (Canada)","funders":"","keywords":"Annealing (glass); Materials science; Adsorption; Moisture; Chemical engineering; Sputtering; Sputter deposition; Layer (electronics); Thin film; Composite material; Nanotechnology; Chemistry; Physical chemistry","score_opus":0.009909376646999748,"score_gpt":0.22841225977112867,"score_spread":0.2185028831241289,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2102901745","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9937977,0.00023215932,0.0021968477,0.00011169671,0.002631712,0.0004601567,0.00024318785,0.0002758572,0.00005069059],"genre_scores_gemma":[0.9983253,0.00003689779,0.00071354053,0.00003033081,0.0005805365,0.000110195666,0.000089126566,0.000060250055,0.00005382674],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99808556,0.000071759685,0.0005560656,0.00041810574,0.00025497566,0.0006135088],"domain_scores_gemma":[0.99910533,0.000101685,0.00014388896,0.00036606067,0.00006034966,0.00022270248],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0007831786,0.000339099,0.00044432518,0.00009249603,0.000111635316,0.0002431688,0.0001883792,0.0002306657,0.00026099163],"category_scores_gemma":[0.000100907375,0.00029949014,0.00006031322,0.00007966858,0.000056607303,0.0006924956,0.00017265529,0.000110761066,0.00017458876],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029588344,0.000060551713,0.00025006788,0.00015126844,0.0000133384365,0.0000017189806,0.00026464576,0.000009864616,0.99754685,0.00002851505,0.0010216791,0.0006218942],"study_design_scores_gemma":[0.00029601777,0.000090938935,0.014498742,0.00012487879,0.00008568162,0.000032341482,0.000012714749,0.000023638988,0.9816723,0.000015315716,0.0027809923,0.0003664647],"about_ca_topic_score_codex":0.000050874653,"about_ca_topic_score_gemma":0.000004311761,"teacher_disagreement_score":0.015874594,"about_ca_system_score_codex":0.00015247655,"about_ca_system_score_gemma":0.000012305178,"threshold_uncertainty_score":0.9999457},"labels":[],"label_agreement":null},{"id":"W2105437211","doi":"10.1063/1.1622517","title":"Texture and stress analysis in as-deposited and annealed damascene Cu interconnects using XRD &amp; OIM","year":2003,"lang":"en","type":"article","venue":"AIP conference proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Annealing (glass); Materials science; Laser linewidth; Electron backscatter diffraction; Copper interconnect; Diffraction; Texture (cosmology); Scanning electron microscope; Composite material; Analytical Chemistry (journal); Optics; Microstructure; Chemistry; Physics","score_opus":0.0238145279441399,"score_gpt":0.27674577170406306,"score_spread":0.25293124375992315,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2105437211","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99711007,0.00025977197,0.0007251894,0.00024241171,0.000096350544,0.00025397126,0.000017934834,0.00005745693,0.0012368583],"genre_scores_gemma":[0.99843967,0.00007777789,0.001166664,0.00015523424,0.000022464608,0.000013428922,0.0000050169037,0.000015223943,0.00010450315],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.9981731,0.00004882653,0.00038787563,0.000760958,0.00020778595,0.0004214297],"domain_scores_gemma":[0.9991186,0.00008258819,0.00014520483,0.00017756906,0.00029135926,0.00018465541],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00053610274,0.00027789993,0.00049159967,0.0002913742,0.00013947001,0.00044528756,0.00020370854,0.00017500686,0.0003790031],"category_scores_gemma":[0.00048531638,0.00023155414,0.000057057645,0.0006131544,0.00022913089,0.00045372674,0.00015313023,0.00022979711,0.000010180919],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000045423072,0.00008490214,0.46991804,0.00014009446,0.000045679244,0.0000052282207,0.004178705,0.000005824152,0.5236329,0.001538524,0.000020866095,0.00038382874],"study_design_scores_gemma":[0.0064673494,0.0011683818,0.4588942,0.0026291057,0.002074554,0.0006556925,0.022972362,0.11445574,0.36963886,0.014783003,0.0018551322,0.004405608],"about_ca_topic_score_codex":0.0010065238,"about_ca_topic_score_gemma":0.00075889047,"teacher_disagreement_score":0.15399401,"about_ca_system_score_codex":0.00006433471,"about_ca_system_score_gemma":0.00006633958,"threshold_uncertainty_score":0.9442504},"labels":[],"label_agreement":null},{"id":"W2113358852","doi":"10.1557/proc-812-f7.5","title":"Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation","year":2004,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":32,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Electromigration; Materials science; Copper; Copper interconnect; Void (composites); Interconnection; Grain boundary; Microstructure; Metallurgy; Composite material","score_opus":0.0076786313264735305,"score_gpt":0.24344975488493356,"score_spread":0.23577112355846003,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2113358852","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9972994,0.0000920511,0.0000892172,0.0005841895,0.0005925407,0.00031848525,0.000012927169,0.000078876954,0.0009323476],"genre_scores_gemma":[0.9994828,0.000011620605,0.00026178398,0.000064220156,0.000032307653,0.000022930406,0.0000031069944,0.000015928976,0.00010527837],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99885446,0.000017882709,0.00031287986,0.00038009355,0.00021083636,0.00022383672],"domain_scores_gemma":[0.99958575,0.000051754658,0.00010699029,0.00009635629,0.00009415092,0.00006498226],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008645488,0.00019670295,0.00030846402,0.000083936415,0.00014812557,0.00014608321,0.00017186388,0.000085904816,0.00006742711],"category_scores_gemma":[0.000190799,0.00013858825,0.00006004442,0.00010333009,0.00045385252,0.000327563,0.00003331247,0.0001224959,0.000016424025],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00042704912,0.00005641799,0.008697569,0.0005154755,0.000015803755,0.0000021228989,0.0044444758,0.00000479949,0.9794395,0.0030736679,0.00025029576,0.00307283],"study_design_scores_gemma":[0.0007700709,0.0017222216,0.0018507513,0.00031841238,0.00003207676,0.0000110967085,0.0004432066,0.000016573558,0.992607,0.0012794151,0.0007807779,0.00016841684],"about_ca_topic_score_codex":0.00032746777,"about_ca_topic_score_gemma":0.000049296457,"teacher_disagreement_score":0.013167487,"about_ca_system_score_codex":0.000072097406,"about_ca_system_score_gemma":0.000036226862,"threshold_uncertainty_score":0.56514645},"labels":[],"label_agreement":null},{"id":"W2120594247","doi":"10.1016/j.actamat.2008.06.007","title":"PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties","year":2008,"lang":"en","type":"article","venue":"Acta Materialia","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":59,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Harvard School of Engineering and Applied Sciences; Semiconductor Research Corporation","keywords":"Materials science; Composite material; Adhesion; Fracture (geology); Silicon nitride; Stiffness; Layer (electronics)","score_opus":0.02077567065390722,"score_gpt":0.2287376467655254,"score_spread":0.20796197611161818,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2120594247","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9955829,0.000053677923,0.000018204495,0.0021456124,0.0016002982,0.00030645722,0.00002845215,0.00019317406,0.00007125652],"genre_scores_gemma":[0.9980882,0.000051999225,0.0001989432,0.0007369151,0.0002536883,0.000031787422,0.000006957573,0.000030592262,0.00060094113],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99819005,0.00017403388,0.00038932136,0.00059313985,0.00026889885,0.0003845604],"domain_scores_gemma":[0.9990657,0.00003838617,0.00013205613,0.00048673188,0.00012328442,0.00015385135],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0004044544,0.00026655308,0.00038576807,0.000033200147,0.00035238752,0.00017948139,0.00031614545,0.0001916224,0.0017730412],"category_scores_gemma":[0.00028778648,0.0001795794,0.000054903274,0.00007397877,0.00030654753,0.00035181936,0.0002774658,0.00013324202,0.00020755474],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012010085,0.00010248284,0.00042210208,0.0000793311,0.000004577099,0.000014704204,0.00062771555,1.8649256e-7,0.99166477,0.0000552992,0.0068690614,0.00003969872],"study_design_scores_gemma":[0.00036474122,0.00012389285,0.0064594992,0.000071096554,0.000015646394,0.00009802975,0.0000790533,0.000026513972,0.98303014,0.00014628547,0.009309361,0.00027573234],"about_ca_topic_score_codex":0.0004145123,"about_ca_topic_score_gemma":0.00002010708,"teacher_disagreement_score":0.008634592,"about_ca_system_score_codex":0.000047633082,"about_ca_system_score_gemma":0.00006823135,"threshold_uncertainty_score":0.9991395},"labels":[],"label_agreement":null},{"id":"W2121846914","doi":"10.1557/opl.2011.1201","title":"Amorphous Ta-N as a Diffusion Barrier for Cu Metallization","year":2011,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Materials science; Amorphous solid; Diffusion barrier; Sputter deposition; Copper; Diffusion; Silicon; Sputtering; Electron energy loss spectroscopy; Electron diffraction; Analytical Chemistry (journal); Chemical engineering; Thin film; Diffraction; Crystallography; Transmission electron microscopy; Metallurgy; Nanotechnology; Layer (electronics); Optics","score_opus":0.026967732370828404,"score_gpt":0.2478468248768005,"score_spread":0.2208790925059721,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2121846914","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98877376,0.0000347681,0.0006688081,0.000117530755,0.00046884772,0.00044605244,0.000009395351,0.00014106811,0.009339742],"genre_scores_gemma":[0.99559104,0.000008345998,0.002474255,0.0002572696,0.000101073274,0.000102251455,0.0000028496092,0.000021961543,0.0014409524],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989949,0.000005061226,0.00021892208,0.00036134548,0.00016588862,0.00025390612],"domain_scores_gemma":[0.9994485,0.00001977146,0.0000901725,0.00010310142,0.00024153222,0.00009691756],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00036516716,0.00013337226,0.000167082,0.000049973478,0.00015667352,0.00008120626,0.0002152307,0.00008543417,0.0019080492],"category_scores_gemma":[0.00028695638,0.00009870408,0.00008110699,0.00009738499,0.000079082725,0.00027662708,0.00008825444,0.0000526322,0.00017155767],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000087492284,0.00009124486,0.0011297412,0.00007864635,0.0000055135997,8.0989287e-7,0.0032692894,2.0032952e-7,0.9869922,0.005341254,0.002333553,0.0006700906],"study_design_scores_gemma":[0.000625614,0.00048408398,0.002139027,0.00005596078,0.000064176566,0.000023202241,0.0007255165,0.0005750238,0.95390266,0.01586009,0.025202041,0.00034258177],"about_ca_topic_score_codex":0.00019979097,"about_ca_topic_score_gemma":0.000009955713,"teacher_disagreement_score":0.03308948,"about_ca_system_score_codex":0.000040286322,"about_ca_system_score_gemma":0.000026258149,"threshold_uncertainty_score":0.99900436},"labels":[],"label_agreement":null},{"id":"W2125685179","doi":"10.1149/1.2408858","title":"Current Challenges with Copper Interconnects","year":2007,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Electromigration; Interconnection; Integrated circuit; Copper interconnect; Process (computing); Materials science; Finite element method; Copper; Computer science; Electronic engineering; Engineering physics; Electrical engineering; Engineering; Optoelectronics; Telecommunications; Metallurgy; Composite material; Structural engineering","score_opus":0.02504435212440666,"score_gpt":0.2720743911533106,"score_spread":0.24703003902890394,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2125685179","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94549364,0.0021645115,0.04076269,0.0016227644,0.0017392377,0.0002327583,0.00001748858,0.00021819647,0.0077486984],"genre_scores_gemma":[0.9988848,0.00023179516,0.0005549152,0.000040917374,0.00009231233,0.000015148433,0.0000010019547,0.0000150965,0.00016399003],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99897283,0.00003278268,0.00019622793,0.0003161634,0.00017291048,0.00030908207],"domain_scores_gemma":[0.99934465,0.00013164036,0.00003442975,0.00028394628,0.00008044704,0.0001248992],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0004396658,0.00013770351,0.00014614257,0.00006965867,0.00015658648,0.000035692847,0.00015323628,0.00004166631,0.0013365475],"category_scores_gemma":[0.000010002102,0.00009700473,0.00006612442,0.00009676117,0.0001246144,0.0001731695,0.0000061975484,0.00018116411,0.00025424562],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0011607626,0.003842074,0.0007857775,0.0007776325,0.00016221555,0.00010009368,0.027294079,0.0015489979,0.53786635,0.0076651457,0.003924089,0.4148728],"study_design_scores_gemma":[0.0015742197,0.00055954413,0.008501424,0.00037262932,0.00011882185,0.00014791913,0.0043433835,0.00012844599,0.7453383,0.0007892605,0.23725209,0.000873961],"about_ca_topic_score_codex":0.000051247847,"about_ca_topic_score_gemma":0.0016280067,"teacher_disagreement_score":0.41399884,"about_ca_system_score_codex":0.000057860503,"about_ca_system_score_gemma":0.000037651538,"threshold_uncertainty_score":0.9995764},"labels":[],"label_agreement":null},{"id":"W2129239789","doi":"10.1557/opl.2012.1356","title":"Understanding the Impact of Porosity and Pore Structure in Ultra Low Dielectric Constant Organosilicate Glasses","year":2012,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Intertek (Canada)","funders":"University of Michigan","keywords":"Materials science; Porosity; Dielectric; Chemical engineering; Chemical vapor deposition; Interconnectivity; Composite material; Low-k dielectric; Plasma-enhanced chemical vapor deposition; X-ray photoelectron spectroscopy; Nanotechnology; Optoelectronics","score_opus":0.028505901048342247,"score_gpt":0.26515095802429617,"score_spread":0.23664505697595392,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2129239789","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9985244,0.00022322028,0.000016471433,0.00017887793,0.00008423995,0.00020952942,0.00002011133,0.000024074767,0.000719041],"genre_scores_gemma":[0.99985975,0.000033610544,0.00002423197,0.000026746677,0.000035584366,0.0000027956196,0.0000010122614,0.000008840183,0.0000074469644],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990932,0.000013077674,0.00021604258,0.00019543259,0.00014192976,0.00034031854],"domain_scores_gemma":[0.99956936,0.00008131006,0.0001178717,0.000087938686,0.00006657646,0.000076956436],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041940258,0.00013579863,0.00020732435,0.000060738763,0.00010279128,0.000066394736,0.0001591835,0.00007464979,0.00013541705],"category_scores_gemma":[0.00016450004,0.00007382759,0.0000423578,0.00028940348,0.00023670113,0.00027140445,0.000052925596,0.00014608585,0.0000011953376],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028376078,0.00004003559,0.21923897,0.00005367145,0.000005419051,2.664979e-7,0.0024888488,0.0000016777185,0.77625805,0.0016815332,0.0001625071,0.000040652092],"study_design_scores_gemma":[0.00040129301,0.00019641015,0.24814576,0.00009053416,0.000022472994,0.00006933652,0.0026721836,0.0001171018,0.7427333,0.005316706,0.000013452534,0.00022143283],"about_ca_topic_score_codex":0.00022008152,"about_ca_topic_score_gemma":0.000015879652,"teacher_disagreement_score":0.033524733,"about_ca_system_score_codex":0.0001877154,"about_ca_system_score_gemma":0.00004506824,"threshold_uncertainty_score":0.3010602},"labels":[],"label_agreement":null},{"id":"W2131801010","doi":"10.1016/j.mee.2009.07.019","title":"Microstructure in copper interconnects – Influence of plating additive concentration","year":2009,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":17,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Copper; Microstructure; Annealing (glass); Materials science; Grain size; Impurity; Grain growth; Electrical resistivity and conductivity; Copper plating; Metallurgy; Analytical Chemistry (journal); Electrolyte; Chemical engineering; Composite material; Electroplating; Chemistry; Electrode; Chromatography","score_opus":0.002655850460544988,"score_gpt":0.20365759792537616,"score_spread":0.20100174746483118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2131801010","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99872303,0.0004915744,0.00027297056,0.00008861046,0.000095554125,0.0001688832,0.000012433821,0.00005085622,0.000096075084],"genre_scores_gemma":[0.99934137,0.000022122817,0.00051437295,0.00006183228,0.00003225215,0.0000045782754,0.0000066093485,0.000009518471,0.000007363261],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99889004,0.000023736478,0.0003349658,0.00026171523,0.00009286624,0.0003966555],"domain_scores_gemma":[0.9995831,0.00007767737,0.000074633346,0.00016567112,0.000060390877,0.00003852458],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015974407,0.00015383738,0.00022657255,0.00006221115,0.000025722016,0.000026784855,0.00017327095,0.00008145382,0.0000702852],"category_scores_gemma":[0.00014102047,0.00014399267,0.000045046912,0.000170738,0.000033168475,0.0001946922,0.000025562404,0.00021995702,0.000007066283],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020626387,0.00001782716,0.00011809544,0.000023505763,0.0000027532371,0.0000035737055,0.0006702037,0.020336404,0.9774573,0.00041715984,0.000018893674,0.00091365795],"study_design_scores_gemma":[0.00035543717,0.00013899372,0.0070601003,0.00017665625,0.0000043498508,0.000023193754,0.00005311711,0.0024272078,0.9893307,0.000107869535,0.00016196481,0.00016038271],"about_ca_topic_score_codex":0.000056044228,"about_ca_topic_score_gemma":0.00003820563,"teacher_disagreement_score":0.017909197,"about_ca_system_score_codex":0.00020187027,"about_ca_system_score_gemma":0.000064995555,"threshold_uncertainty_score":0.5871851},"labels":[],"label_agreement":null},{"id":"W2133495728","doi":"10.1109/led.2005.854356","title":"Temporary extrusion failures in accelerated lifetime tests of copper interconnects","year":2005,"lang":"en","type":"article","venue":"IEEE Electron Device Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Extrusion; Copper interconnect; Materials science; Failure mode and effects analysis; Copper; Short circuit; Metallurgy; Leakage (economics); Composite material; Voltage; Electrical engineering; Engineering","score_opus":0.016416075749833246,"score_gpt":0.27326759386079946,"score_spread":0.25685151811096624,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2133495728","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9852592,0.0002946797,0.000027735081,0.013274166,0.0003498579,0.0003393127,0.0000067866767,0.00010316616,0.0003451382],"genre_scores_gemma":[0.99471766,0.00001489766,0.0003854073,0.0045344834,0.00021670295,0.000025357145,0.0000068241598,0.0000309771,0.000067678644],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.997712,0.00021292626,0.0006340972,0.0005525942,0.00030203917,0.00058635336],"domain_scores_gemma":[0.9989684,0.00022121507,0.00018524883,0.00044657022,0.000081570506,0.000096987205],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005761703,0.000276293,0.00041254947,0.0002213926,0.00006151961,0.0000661944,0.00048293147,0.00013432551,0.0005520914],"category_scores_gemma":[0.00009809929,0.00023246038,0.0000971824,0.0003674715,0.00013011458,0.00048305257,0.0000781196,0.00031538427,0.00021279485],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010998793,0.00014503422,0.004827532,0.00004924133,0.0000079917645,0.000012155463,0.00040396673,0.0004269885,0.9831536,0.00001535308,0.009964649,0.0008835417],"study_design_scores_gemma":[0.0006602553,0.00016940694,0.006363261,0.00015292059,0.000011183984,0.000016168391,0.000050905368,0.00029021056,0.9870055,0.00002373886,0.0049464875,0.00030998717],"about_ca_topic_score_codex":0.0007902907,"about_ca_topic_score_gemma":0.0015001677,"teacher_disagreement_score":0.009458514,"about_ca_system_score_codex":0.00019436397,"about_ca_system_score_gemma":0.00008654625,"threshold_uncertainty_score":0.94794595},"labels":[],"label_agreement":null},{"id":"W2134869583","doi":"10.1557/jmr.2009.0005","title":"The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates","year":2009,"lang":"en","type":"article","venue":"Journal of materials research/Pratt's guide to venture capital sources","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":46,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Materials science; Composite material; Porosity; Stiffness; Nanoindentation; Dielectric; Plasma-enhanced chemical vapor deposition; Brittleness; Low-k dielectric; Permittivity; Chemical vapor deposition; Nanotechnology; Optoelectronics","score_opus":0.011695889578765788,"score_gpt":0.3028561806854454,"score_spread":0.2911602911066796,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2134869583","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.989328,0.0024253163,0.000009853525,0.007469251,0.00036434198,0.00027471952,0.00003381193,0.000007692287,0.00008697154],"genre_scores_gemma":[0.99916583,0.00020190656,0.000020543715,0.00015487512,0.00034511677,0.0000060686284,0.0000011127698,0.000016791266,0.00008776649],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9964798,0.0010768787,0.00085539074,0.00024449828,0.000940782,0.00040266052],"domain_scores_gemma":[0.99630874,0.0020221244,0.0005311267,0.00041787565,0.0005501321,0.00017000959],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.005854769,0.0002110856,0.0005628587,0.00013057144,0.00031903977,0.00031622848,0.0008963849,0.00013059612,0.00039667464],"category_scores_gemma":[0.0023186617,0.00009421278,0.00012982757,0.00020011741,0.00044177368,0.00014616769,0.00020269769,0.00026819133,0.0000093595145],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00095953146,0.000059985636,0.000071449904,0.00006255125,0.000036655412,0.000012419017,0.00081630645,0.00008925841,0.98832566,0.00046764285,0.0078140795,0.0012844778],"study_design_scores_gemma":[0.00033042248,0.0019901206,0.002984731,0.00026484785,0.000024809175,0.00005386742,0.00062348845,0.000002220529,0.9832621,0.0010624677,0.009300733,0.00010015684],"about_ca_topic_score_codex":0.00022827614,"about_ca_topic_score_gemma":0.000014662138,"teacher_disagreement_score":0.009837776,"about_ca_system_score_codex":0.00006068142,"about_ca_system_score_gemma":0.000075354066,"threshold_uncertainty_score":0.4343309},"labels":[],"label_agreement":null},{"id":"W2146029244","doi":"10.1109/iitc.1998.704912","title":"Modelling microstructure development in trench-interconnect structures","year":2002,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Trench; Copper interconnect; Materials science; Microstructure; Aspect ratio (aeronautics); Texture (cosmology); Energy minimization; Surface energy; Grain size; Interconnection; Anisotropy; Surface finish; Composite material; Optics; Layer (electronics); Computer science; Computational chemistry","score_opus":0.029002340345293823,"score_gpt":0.23212438562453241,"score_spread":0.2031220452792386,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2146029244","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99143195,0.00029841124,0.002247219,0.00019672472,0.00046555404,0.00013126574,0.0000040536806,0.00007708861,0.0051477067],"genre_scores_gemma":[0.9890478,0.000012008026,0.009846331,0.00017828176,0.00004499847,0.0000076184597,0.0000019093532,0.000010746719,0.0008502544],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987114,0.00004228178,0.00035333127,0.0004063766,0.00015385362,0.00033275672],"domain_scores_gemma":[0.99954593,0.000050114377,0.00004204953,0.00025543754,0.00003698623,0.00006945725],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00017745995,0.00017358898,0.0002069377,0.00008725229,0.000080632584,0.00008808103,0.00025959534,0.00009169472,0.012456439],"category_scores_gemma":[0.000024952073,0.00012097214,0.000047686703,0.00010645461,0.00005930131,0.00013126829,0.00008673858,0.00013460708,0.0001923424],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000082075814,0.0002947807,0.0024129476,0.00016700114,0.000024728326,0.00006555701,0.018305203,0.07639618,0.8517968,0.005988247,0.004687549,0.039778937],"study_design_scores_gemma":[0.0011732591,0.00009127358,0.0013497624,0.00010043808,0.000009176178,0.00006462059,0.0006468438,0.10529237,0.8558425,0.0066269482,0.027911872,0.0008909874],"about_ca_topic_score_codex":0.0002675814,"about_ca_topic_score_gemma":0.00032999882,"teacher_disagreement_score":0.038887948,"about_ca_system_score_codex":0.00009074395,"about_ca_system_score_gemma":0.000017335762,"threshold_uncertainty_score":0.9884463},"labels":[],"label_agreement":null},{"id":"W2146992540","doi":"10.1007/s11664-007-0289-z","title":"Influence of Ta-based Diffusion Barriers on the Microstructure of Copper Thin Films","year":2007,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Deutsche Forschungsgemeinschaft; Deutscher Akademischer Austauschdienst","keywords":"Microstructure; Copper; Materials science; Electroplating; Diffusion barrier; Recrystallization (geology); Thin film; Copper interconnect; Interconnection; Diffusion; Layer (electronics); Physical vapor deposition; Barrier layer; Metallurgy; Composite material; Nanotechnology","score_opus":0.005065075584577547,"score_gpt":0.23876065449638426,"score_spread":0.2336955789118067,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2146992540","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99874437,0.00012778376,0.000024959343,0.00038590093,0.00043290356,0.00017430524,0.00004339702,0.0000058119554,0.000060573573],"genre_scores_gemma":[0.9994436,0.000019954165,0.00010646799,0.0003192042,0.00007324684,0.0000010326715,9.1581455e-7,0.000011854046,0.000023734028],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99785507,0.0002034196,0.0009994748,0.0001469506,0.0004287177,0.0003663444],"domain_scores_gemma":[0.99785846,0.00036457312,0.0010305202,0.0003226096,0.00034137146,0.00008248871],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0034034373,0.00016081163,0.00046033604,0.000092287184,0.000078015255,0.000033622517,0.00050498033,0.000115709874,0.0022058042],"category_scores_gemma":[0.000705406,0.00008470774,0.000119324206,0.00012425531,0.00022687993,0.000093551855,0.000047456015,0.00020040908,0.0000045723154],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0007982149,0.000047543654,0.00019115828,0.00006073702,0.000014927715,0.000003239757,0.00022950488,0.0010344484,0.99618566,0.00079557253,0.0006215051,0.00001747188],"study_design_scores_gemma":[0.00045601648,0.00079984,0.0039165523,0.00017985146,0.000027075395,0.000026353928,0.00011309504,0.000009046179,0.9930899,0.000791728,0.0005020958,0.00008840561],"about_ca_topic_score_codex":0.00006798337,"about_ca_topic_score_gemma":0.000015014869,"teacher_disagreement_score":0.003725394,"about_ca_system_score_codex":0.00008829164,"about_ca_system_score_gemma":0.00038556015,"threshold_uncertainty_score":0.99870634},"labels":[],"label_agreement":null},{"id":"W2149175241","doi":"10.1109/itherm.2010.5501252","title":"Thermal characterization of planar interconnect architectures under different rapid transient currents using the transmission line matrix and finite element methods","year":2010,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Semiconductor Research Corporation","keywords":"Transient (computer programming); Transmission line; Microelectronics; Resistor; Interconnection; Joule heating; Finite element method; Materials science; Transmission-line matrix method; Matrix (chemical analysis); Reliability (semiconductor); Electronic engineering; Planar; Electromigration; Joule effect; Topology (electrical circuits); Computational physics; Computer science; Physics; Electrical engineering; Optoelectronics; Engineering; Voltage; Computational electromagnetics; Thermodynamics; Telecommunications; Composite material","score_opus":0.02766125215865767,"score_gpt":0.33008264098806567,"score_spread":0.302421388829408,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2149175241","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7833342,0.0000718321,0.21512398,0.0006517194,0.00046796587,0.00028237398,0.00002575754,0.000022345559,0.000019801244],"genre_scores_gemma":[0.9937375,0.000029575847,0.0060484055,0.00007738652,0.000053641626,0.0000074431177,0.000010744137,0.0000120825725,0.000023210921],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99864286,0.00030110852,0.00039467032,0.00028351837,0.00017658132,0.00020128429],"domain_scores_gemma":[0.9992839,0.00023728619,0.00010635953,0.00026022503,0.000039398536,0.000072832816],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0006936135,0.00017852905,0.00023800928,0.000060832856,0.00011615711,0.000051061532,0.00019660992,0.000070208196,0.0013240803],"category_scores_gemma":[0.000024242961,0.000087475164,0.000083799656,0.000058648362,0.00014897433,0.00005221169,0.00004473922,0.00019612466,9.774044e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000095353134,0.000103389466,0.00005872319,0.000058721,0.000011595254,2.1288812e-7,0.0016343304,0.00024059511,0.96296746,0.00020799295,0.0000010154129,0.034620643],"study_design_scores_gemma":[0.00043930262,0.00017542971,0.0064352173,0.000064757085,0.000048242448,0.0000064235537,0.00015666532,0.026204072,0.9654535,0.00031246344,0.0005509059,0.00015301992],"about_ca_topic_score_codex":0.00006507996,"about_ca_topic_score_gemma":0.000030901785,"teacher_disagreement_score":0.2104033,"about_ca_system_score_codex":0.000011838253,"about_ca_system_score_gemma":0.000019424186,"threshold_uncertainty_score":0.99958885},"labels":[],"label_agreement":null},{"id":"W2155642509","doi":"10.1109/mwsym.1992.187947","title":"Calculation of frequency-dependent S-parameters of CPW air-bridges considering finite metallization thickness and conductivity","year":2003,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Classification of discontinuities; Coplanar waveguide; Conductivity; Air gap (plumbing); Bridge (graph theory); Materials science; Structural engineering; Acoustics; Optoelectronics; Electrical engineering; Composite material; Physics; Engineering; Telecommunications; Mathematical analysis; Mathematics","score_opus":0.030489052137423086,"score_gpt":0.2605426448613729,"score_spread":0.23005359272394982,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2155642509","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98030573,0.00012999133,0.01833217,0.00006909921,0.0002316324,0.00016407017,0.000011121786,0.000020378795,0.0007357781],"genre_scores_gemma":[0.993878,0.000017608496,0.0060266983,0.00002177933,0.000003410639,0.0000037684802,0.000001496144,0.0000054567827,0.000041774398],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990305,0.0001552436,0.000314451,0.00022323756,0.00016962965,0.00010694531],"domain_scores_gemma":[0.9991877,0.00027471193,0.00014623046,0.00019595817,0.00015950939,0.000035863304],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006515217,0.00009182918,0.0002308453,0.000047956706,0.000038733557,0.000014051975,0.000054400978,0.000059913742,0.00024148387],"category_scores_gemma":[0.0006062447,0.00007112775,0.00003840429,0.00007010016,0.00020779503,0.000207195,0.000030846168,0.000043914075,0.0000022941229],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000090046815,0.000050148366,0.0062640114,0.00009871643,0.000010353627,6.077964e-7,0.00035337373,0.0021777824,0.9818488,0.009025908,0.0000043137043,0.00015700448],"study_design_scores_gemma":[0.0002115263,0.000053291824,0.003378957,0.000031173866,0.00002514239,0.0000081315375,0.00024523446,0.0007330107,0.99228173,0.0029244793,0.000013890844,0.0000934114],"about_ca_topic_score_codex":0.0007610539,"about_ca_topic_score_gemma":0.00013962638,"teacher_disagreement_score":0.013572249,"about_ca_system_score_codex":0.000020302296,"about_ca_system_score_gemma":0.000042957843,"threshold_uncertainty_score":0.29005054},"labels":[],"label_agreement":null},{"id":"W2159296063","doi":"10.1149/2.0081501jss","title":"Toward Successful Integration of Porous Low-k Materials: Strategies Addressing Plasma Damage","year":2014,"lang":"en","type":"article","venue":"ECS Journal of Solid State Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":56,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Copper interconnect; Back end of line; Materials science; Anticipation (artificial intelligence); Low-k dielectric; Dielectric; Porosity; Plasma; Nanotechnology; Blanket; Engineering physics; Porous medium; Computer science; Optoelectronics; Composite material; Engineering; Physics; Artificial intelligence","score_opus":0.020757805334162025,"score_gpt":0.2931338338311918,"score_spread":0.27237602849702974,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2159296063","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99708813,0.00006508859,0.0010276791,0.0007603495,0.0006868915,0.000067407695,0.000013829334,0.000025868196,0.00026476962],"genre_scores_gemma":[0.9987121,0.00007259648,0.0011400388,0.000018262608,0.00003833184,0.0000011053021,2.5895068e-7,0.000005751296,0.000011525972],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984333,0.00005988274,0.0006019257,0.00022981684,0.00038230498,0.00029277682],"domain_scores_gemma":[0.9983268,0.00006512658,0.00053707795,0.00021135282,0.0007880433,0.000071618124],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0023840095,0.0001252291,0.00036103878,0.00045746533,0.00016399304,0.00021515717,0.0005989847,0.000075575124,0.000067797024],"category_scores_gemma":[0.00064008334,0.00008478913,0.000024303914,0.00045577993,0.001917264,0.0010209212,0.00016973923,0.00017449286,0.0000041028256],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000036054727,0.00003728993,0.00009343691,0.00004229284,0.0000030054327,0.00001142944,0.0004931245,0.0000497372,0.9894202,0.001767232,0.000024972558,0.00802127],"study_design_scores_gemma":[0.00028595628,0.00048802944,0.0004214245,0.0001740262,0.000009052341,0.00018019498,0.002034921,0.00038128244,0.97974676,0.016074574,0.00010624354,0.00009755294],"about_ca_topic_score_codex":0.000028328615,"about_ca_topic_score_gemma":0.000020377922,"teacher_disagreement_score":0.0143073425,"about_ca_system_score_codex":0.00004490503,"about_ca_system_score_gemma":0.00031268818,"threshold_uncertainty_score":0.7064239},"labels":[],"label_agreement":null},{"id":"W2162899915","doi":"10.4028/www.scientific.net/msf.408-412.1627","title":"Texture Investigations In Damascene Copper Interconnects","year":2002,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada); McGill University","funders":"","keywords":"Copper interconnect; Materials science; Copper; Texture (cosmology); Metallurgy; Composite material; Artificial intelligence; Computer science","score_opus":0.02051387113556971,"score_gpt":0.25058974458614863,"score_spread":0.23007587345057892,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2162899915","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98844004,0.00008807547,0.0000293737,0.0045452337,0.0023450397,0.00034002002,0.00004901304,0.0001252071,0.004038025],"genre_scores_gemma":[0.9978071,0.000012645564,0.0006759749,0.00095753476,0.00009353815,0.00004846705,0.000003445983,0.000017154853,0.00038417458],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9972421,0.00010906744,0.00054133614,0.0007572954,0.00047206975,0.0008781327],"domain_scores_gemma":[0.998821,0.000074174386,0.000118814474,0.00064532994,0.00012289658,0.00021775416],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0013929524,0.00023532912,0.00032855407,0.00027663077,0.00036225814,0.0005119674,0.00094178197,0.00010540435,0.008168187],"category_scores_gemma":[0.0006347732,0.00018264077,0.00004717495,0.00071895326,0.0011884833,0.00097466825,0.00040397383,0.00012349836,0.0014655651],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007955947,0.00009157747,0.001227534,0.000018880462,7.7611446e-7,0.0000072914645,0.00073241885,0.0000342038,0.9917904,0.002592076,0.0031424367,0.0003544441],"study_design_scores_gemma":[0.00036574106,0.00010973799,0.002852394,0.000110603374,0.000004349562,0.000027175518,0.0005000676,0.00056369544,0.9893503,0.0025060945,0.0032894406,0.00032039479],"about_ca_topic_score_codex":0.00030587046,"about_ca_topic_score_gemma":0.00024584404,"teacher_disagreement_score":0.009367052,"about_ca_system_score_codex":0.00019251535,"about_ca_system_score_gemma":0.00008441435,"threshold_uncertainty_score":0.9993119},"labels":[],"label_agreement":null},{"id":"W2168983090","doi":"10.1149/1.3700943","title":"Scaled Micro-Relay Structure with Low Strain Gradient for Reduced Operating Voltage","year":2012,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Semtech (Canada)","funders":"Semiconductor Research Corporation; National Science Foundation","keywords":"Relay; Materials science; Hysteresis; Voltage; Electrical engineering; Low voltage; Power (physics); Electronic circuit; Optoelectronics; Electronic engineering; Engineering; Physics; Condensed matter physics","score_opus":0.010166054715528335,"score_gpt":0.24340172192108142,"score_spread":0.23323566720555308,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2168983090","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9425649,0.000062122555,0.054999486,0.00026300756,0.00094248983,0.00047692208,0.00049410237,0.00007566942,0.000121306744],"genre_scores_gemma":[0.9901197,0.0000018833714,0.00920474,0.000064795146,0.00015947878,0.000057669367,0.0000141591445,0.000021628026,0.00035593397],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989726,0.000035468245,0.0002132579,0.00026470068,0.0001191618,0.00039483444],"domain_scores_gemma":[0.9994188,0.0000755288,0.000044971017,0.00024520612,0.00007554348,0.00013996173],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00023309882,0.00015608117,0.00017129979,0.000037334023,0.0003811045,0.000077852346,0.00013125966,0.000080875405,0.0012368272],"category_scores_gemma":[0.000017075514,0.00010940887,0.00007730978,0.00009537947,0.00009715411,0.00025883407,0.000004200846,0.00014550531,0.00001687321],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000030499792,0.000116492694,0.000057138703,0.000043715307,0.000014549465,3.9937916e-7,0.0014708454,0.0014222953,0.9958426,0.00006137966,0.00009377754,0.00084631727],"study_design_scores_gemma":[0.0007485463,0.00016299389,0.0015514562,0.000058692836,0.00006634635,0.000037132886,0.0006637105,0.00048497724,0.99425375,0.000056774716,0.0016490078,0.00026658142],"about_ca_topic_score_codex":0.00005106706,"about_ca_topic_score_gemma":0.00015764643,"teacher_disagreement_score":0.047554817,"about_ca_system_score_codex":0.000066581095,"about_ca_system_score_gemma":0.00005003016,"threshold_uncertainty_score":0.99967617},"labels":[],"label_agreement":null},{"id":"W2177893790","doi":"10.1116/1.4932533","title":"Modification of porous SiOCH by first contact with water vapor after plasma process","year":2015,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Agence Nationale de la Recherche","keywords":"Silanol; Water vapor; Desorption; Adsorption; Relative humidity; Plasma; Porosity; Humidity; Molecule; Chemical engineering; Chemistry; Materials science; Analytical Chemistry (journal); Environmental chemistry; Organic chemistry; Meteorology","score_opus":0.014153175623433769,"score_gpt":0.23370046523152407,"score_spread":0.2195472896080903,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2177893790","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9925185,0.0043698032,0.00050631136,0.002096484,0.00017173086,0.00025523128,0.0000070903266,0.0000592495,0.000015637062],"genre_scores_gemma":[0.9991211,0.00019146003,0.0005806902,0.000031911903,0.000023784176,0.000024670331,9.5031703e-7,0.000016467295,0.000008953273],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9976253,0.00003938996,0.0007266618,0.00047701687,0.0005211273,0.0006104879],"domain_scores_gemma":[0.9976988,0.00001256176,0.00064360135,0.0002618639,0.0012714318,0.00011175017],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002939456,0.00027082436,0.0005742051,0.0006085204,0.00029218761,0.00012515186,0.0005844215,0.00029029977,0.00001604455],"category_scores_gemma":[0.00012410711,0.00016529071,0.000021546082,0.00048518382,0.0015639775,0.0005135602,0.00014751237,0.0002870639,0.0000016681472],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00065055117,0.00015719404,0.0004020657,0.00014663498,0.000017492785,0.0000049943055,0.00066470087,0.000004066452,0.9951074,0.00019649889,0.000013565062,0.0026348175],"study_design_scores_gemma":[0.0011778267,0.0019741724,0.0000565929,0.00020219803,0.000071288756,0.00038897205,0.00049069745,0.000020268722,0.99092317,0.004080428,0.00039267197,0.00022172846],"about_ca_topic_score_codex":0.000009786711,"about_ca_topic_score_gemma":0.000014726433,"teacher_disagreement_score":0.00660265,"about_ca_system_score_codex":0.0002160191,"about_ca_system_score_gemma":0.00063657045,"threshold_uncertainty_score":0.67403597},"labels":[],"label_agreement":null},{"id":"W2193212110","doi":"10.4071/isom-2015-tp42","title":"Main Impact Factors on Internal Stress of Electroless Deposited Copper Films","year":2015,"lang":"en","type":"article","venue":"IMAPSource Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mount Allison University","funders":"","keywords":"Materials science; Layer (electronics); Delamination (geology); Substrate (aquarium); Composite material; Adhesion; Copper; Stress (linguistics); Diffusion barrier; Metallurgy","score_opus":0.0172828331060582,"score_gpt":0.27200875219098075,"score_spread":0.25472591908492254,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2193212110","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9954284,0.000046702295,0.00003256167,0.00012126668,0.00021567497,0.0001939186,0.00007518432,0.00009422868,0.0037921076],"genre_scores_gemma":[0.9994729,0.0000014828623,0.00013089157,0.00007610769,0.0000726573,0.000008581923,0.0000064049727,0.000027651122,0.00020330728],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99829787,0.000022098255,0.0003685435,0.00040682362,0.0004569628,0.0004476926],"domain_scores_gemma":[0.99897593,0.00008130988,0.00020371744,0.00016953419,0.00030903728,0.00026048877],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00043228499,0.00025740964,0.00035082086,0.00012211257,0.00006100243,0.0001377114,0.000467144,0.000112618975,0.00025157796],"category_scores_gemma":[0.00037712025,0.0001735932,0.00014276335,0.00018082178,0.0001451398,0.00021534685,0.00013107128,0.0002157804,0.00004644609],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003272116,0.00021270882,0.10543919,0.000059749444,0.000020170262,0.0000022560314,0.0034570391,0.000058442754,0.8832665,0.0001408394,0.0069276253,0.00008826799],"study_design_scores_gemma":[0.00067714055,0.0009376531,0.014491179,0.000147344,0.000023300452,0.000024039333,0.0019888938,0.0004802863,0.9806049,0.00014476826,0.000225166,0.0002553444],"about_ca_topic_score_codex":0.0006102788,"about_ca_topic_score_gemma":0.00001238732,"teacher_disagreement_score":0.097338386,"about_ca_system_score_codex":0.00016923054,"about_ca_system_score_gemma":0.00006806689,"threshold_uncertainty_score":0.70789254},"labels":[],"label_agreement":null},{"id":"W2217997521","doi":"10.1116/1.4935447","title":"Novel copper compounds for vapor deposition: Characterization and thermolysis","year":2015,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Thermogravimetric analysis; Copper; Benzamide; Volatility (finance); Thermal stability; Thermal decomposition; Chemistry; Amide; Chemical vapor deposition; Reactivity (psychology); Metal; Inorganic chemistry; Organic chemistry; Materials science","score_opus":0.02145633356951332,"score_gpt":0.266823989299445,"score_spread":0.2453676557299317,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2217997521","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9880124,0.00056711136,0.0066345762,0.0038241209,0.0006553787,0.0001883282,0.000033226293,0.00003917913,0.00004570797],"genre_scores_gemma":[0.9892633,0.000097081465,0.0104064625,0.00011305768,0.00004405782,0.000007189502,0.0000016340018,0.000009207811,0.00005803112],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985179,0.000022653396,0.00047569987,0.00034062858,0.00031951652,0.00032363358],"domain_scores_gemma":[0.9984842,0.000071542934,0.0003974186,0.00021330769,0.0006478761,0.00018564463],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0017141409,0.00016572203,0.00036977354,0.00037976183,0.00035683194,0.00021059066,0.00042627633,0.0001605635,0.000020026748],"category_scores_gemma":[0.00014706283,0.00011424151,0.000055964003,0.00056415633,0.0010441807,0.0007000509,0.00018284377,0.00017040223,0.000002364679],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008155631,0.000090647125,0.003382447,0.00001579057,0.000009979387,0.000003709133,0.00034420518,0.000008025183,0.9939259,0.0006586041,0.00008257105,0.0013965587],"study_design_scores_gemma":[0.0038399815,0.0034294296,0.025923274,0.00023702784,0.0002023249,0.0030054373,0.0035235994,0.010357232,0.94098514,0.0039569065,0.003799767,0.0007398946],"about_ca_topic_score_codex":0.000012409638,"about_ca_topic_score_gemma":0.0000045660963,"teacher_disagreement_score":0.052940782,"about_ca_system_score_codex":0.0000514654,"about_ca_system_score_gemma":0.0001989925,"threshold_uncertainty_score":0.46586338},"labels":[],"label_agreement":null},{"id":"W2241869039","doi":"10.1088/1009-0630/12/6/08","title":"Dependence of Decamethylcyclopentasiloxane (DMCPS) Dissociation on Ionized Energy by Using Quadrupole Mass Spectrum","year":2010,"lang":"en","type":"article","venue":"Plasma Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Dissociation (chemistry); Ionization; Chemistry; Mass spectrometry; Ion; Atomic physics; Mass spectrum; Collision-induced dissociation; Analytical Chemistry (journal); Physical chemistry; Tandem mass spectrometry; Physics; Organic chemistry; Chromatography","score_opus":0.006954221191753973,"score_gpt":0.24649801467001883,"score_spread":0.23954379347826485,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2241869039","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9970837,0.000029967083,0.00026234184,0.0013758158,0.0005671129,0.00009190994,0.000016758748,0.000067759036,0.0005046208],"genre_scores_gemma":[0.99826556,0.000022406337,0.0015971193,0.000042643507,0.000015502934,0.0000065766217,9.113566e-7,0.0000060194184,0.0000432517],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99848104,0.000025044472,0.0002498419,0.0004946271,0.0003912069,0.00035824336],"domain_scores_gemma":[0.9991433,0.00011353465,0.00016524796,0.00035755272,0.00014590738,0.00007445566],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00084109354,0.00012426105,0.00021401708,0.0002615927,0.00029453752,0.00006589785,0.00053977675,0.00016436762,0.00012570541],"category_scores_gemma":[0.0006425913,0.000098962584,0.00002160042,0.0007320458,0.0014843673,0.00023499623,0.00016383083,0.00018770747,0.000011498496],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000014807007,0.000053412114,0.0022872176,0.0000044411236,0.0000015591849,0.0000013631189,0.000040856365,0.0000030760714,0.9824433,0.011567296,0.000031728876,0.003550954],"study_design_scores_gemma":[0.00021884932,0.00012887616,0.00029217478,0.000013612788,0.0000065586532,0.000017652212,0.00017988413,0.0018684807,0.9900809,0.0065328763,0.00053738005,0.00012274973],"about_ca_topic_score_codex":0.00042614815,"about_ca_topic_score_gemma":0.00029586154,"teacher_disagreement_score":0.007637617,"about_ca_system_score_codex":0.00006527387,"about_ca_system_score_gemma":0.00015335753,"threshold_uncertainty_score":0.5469213},"labels":[],"label_agreement":null},{"id":"W2281414570","doi":"10.1149/ma2013-02/49/2722","title":"Development of All-Solid Thin Film Electro-Chromic Devices and Applications","year":2013,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Optoelectronics; Engineering physics; Engineering","score_opus":0.014716970032573948,"score_gpt":0.26188294831848935,"score_spread":0.2471659782859154,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2281414570","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9866878,0.0001451742,0.000014962131,0.0001683816,0.000075118616,0.0002699552,0.0000027469982,0.000051403924,0.01258448],"genre_scores_gemma":[0.9899021,0.0000072339053,0.009824132,0.0000754313,0.000049437636,0.000058048605,0.0000037217258,0.000009038799,0.000070896785],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989396,0.000023803243,0.00040998723,0.00025574808,0.00014187537,0.00022903118],"domain_scores_gemma":[0.9993107,0.00014374137,0.00018607304,0.00018962425,0.000088904446,0.000081006816],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00054114946,0.000107828164,0.00015819332,0.000032361204,0.00012099843,0.000073359355,0.00017157634,0.000057906527,0.00021559103],"category_scores_gemma":[0.00009159723,0.0000863606,0.000021902606,0.000047571004,0.00006482741,0.00011618695,0.00007779389,0.00008366981,0.00021171715],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000025167556,0.000047693866,0.00022228398,0.000068498775,0.0000069896364,2.2295539e-7,0.00073932775,0.0006361482,0.99743056,0.000012893325,0.00028547941,0.0005473794],"study_design_scores_gemma":[0.000096184645,0.000017694052,0.02358024,0.000064984226,0.000008699166,0.0000046653695,0.0002338598,0.00033312195,0.9682078,0.00027438506,0.007052584,0.00012579758],"about_ca_topic_score_codex":0.00030386756,"about_ca_topic_score_gemma":0.0000620447,"teacher_disagreement_score":0.029222783,"about_ca_system_score_codex":0.000031731764,"about_ca_system_score_gemma":0.000073272175,"threshold_uncertainty_score":0.3521683},"labels":[],"label_agreement":null},{"id":"W2289365991","doi":"10.1021/acs.jpcc.5b10711","title":"Hydrogen Solubility of Magnetron Co-Sputtered FCC and BCC PdCuAu Thin Films","year":2016,"lang":"en","type":"article","venue":"The Journal of Physical Chemistry C","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"Natural Sciences and Engineering Research Council of Canada; Air Liquide","keywords":"Cavity magnetron; Materials science; Hydrogen; Solubility; Thin film; Sputter deposition; Metallurgy; Composite material; Nanotechnology; Chemistry; Sputtering; Physical chemistry; Organic chemistry","score_opus":0.009507690477124815,"score_gpt":0.24705139268990803,"score_spread":0.2375437022127832,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2289365991","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99842125,0.000084788124,0.000022957029,0.00070698635,0.000044849792,0.00004578449,0.000026166785,0.0000066280286,0.00064059155],"genre_scores_gemma":[0.99955684,0.000012637427,0.000039258237,0.0000235396,0.00019365882,5.461212e-7,2.417834e-7,0.0000060277466,0.00016726313],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990448,0.00008340181,0.00033098905,0.000121586316,0.0002590457,0.00016020796],"domain_scores_gemma":[0.9988669,0.00036688114,0.0002781458,0.00029140292,0.000105755666,0.00009089045],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007178633,0.00010912489,0.00027761984,0.0000065132604,0.000046315556,0.0000132912655,0.00034493709,0.000043784767,0.00061003654],"category_scores_gemma":[0.00018070194,0.000048416332,0.00011556914,0.00003342562,0.0004119276,0.000105899984,0.00009858645,0.00013012048,0.00001099288],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013533051,0.00012427873,0.00014088767,0.000060411858,0.000010571639,0.0000012645561,0.00028821785,0.000008103719,0.99815124,0.00000623828,0.00047446386,0.00059896143],"study_design_scores_gemma":[0.00037773882,0.00015873653,0.00062942714,0.0000624148,0.000034186654,0.000029912344,0.000077022516,0.00011241889,0.99675137,0.0015535821,0.00014350456,0.00006967724],"about_ca_topic_score_codex":0.000019574678,"about_ca_topic_score_gemma":7.201758e-7,"teacher_disagreement_score":0.0015473439,"about_ca_system_score_codex":0.000030218378,"about_ca_system_score_gemma":0.000044336775,"threshold_uncertainty_score":0.66794723},"labels":[],"label_agreement":null},{"id":"W2302003665","doi":"10.71781/17202","title":"Dynamique de croissance par plasma RF magnétron des couches minces à base d’oxyde de zinc","year":2015,"lang":"fr","type":"dissertation","venue":"Papyrus : Institutional Repository (Université de Montréal)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Fonds de recherche du Québec – Nature et technologies; Natural Sciences and Engineering Research Council of Canada","keywords":"Zinc; Plasma; Materials science; Chemistry; Physics; Metallurgy","score_opus":0.009391236885636716,"score_gpt":0.20009008438450773,"score_spread":0.190698847498871,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2302003665","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96381944,0.013722927,0.0004345377,0.00079067005,0.0021662973,0.00051886425,0.00030771695,0.00013584286,0.018103715],"genre_scores_gemma":[0.9522964,0.0007623144,0.0042691324,0.00009803405,0.00031085624,0.000056741024,0.00018893364,0.000050607065,0.04196702],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99573463,0.0004957454,0.0006890413,0.0011476452,0.0008139717,0.0011189792],"domain_scores_gemma":[0.9967535,0.00036161224,0.0005818079,0.0006602576,0.0007586554,0.00088418124],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":[],"category_scores_codex":[0.0011000147,0.0007542652,0.0007175261,0.00023950954,0.006750177,0.00024759298,0.00097378157,0.0008506944,0.00034448312],"category_scores_gemma":[0.00047311303,0.0008037236,0.00041140013,0.0003171783,0.0016145381,0.00078364817,0.00028369375,0.0006197189,0.00019653299],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_system_candidate":true,"about_ca_system_consensus":true,"study_design_scores_codex":[0.0028633426,0.0008076495,0.04996257,0.0013043381,0.0002713763,0.0036461975,0.059331123,0.011292286,0.8570032,0.008685802,0.0026282168,0.0022039148],"study_design_scores_gemma":[0.0032662065,0.0009031456,0.15481286,0.0027847537,0.001194312,0.0034809632,0.09026105,0.031766023,0.6614837,0.0050230715,0.04228672,0.002737204],"about_ca_topic_score_codex":0.15956408,"about_ca_topic_score_gemma":0.11283811,"teacher_disagreement_score":0.19551949,"about_ca_system_score_codex":0.016515108,"about_ca_system_score_gemma":0.006312429,"threshold_uncertainty_score":0.9994414},"labels":[],"label_agreement":null},{"id":"W2314603238","doi":"10.1109/nano.2014.6968101","title":"Molecular dynamics study of nano-scale Ag surface electromigration and effect of Pd coating layer","year":2014,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Electromigration; Microelectronics; Materials science; Coating; Nanoscopic scale; Molecular dynamics; Electrical conductor; Nano-; Layer (electronics); Condensed matter physics; Nanotechnology; Chemical physics; Composite material; Chemistry; Computational chemistry; Physics","score_opus":0.004275280109964536,"score_gpt":0.23829440882846303,"score_spread":0.2340191287184985,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2314603238","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9979261,0.000015306956,0.0011789128,0.00002663731,0.00006455955,0.00028267349,0.000002249994,0.000017493603,0.00048606633],"genre_scores_gemma":[0.999648,8.3307316e-7,0.0002905746,0.000008551007,0.000004649254,0.0000026707069,0.0000011608737,0.0000056922854,0.00003791063],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991191,0.00023016975,0.00022293124,0.00018435836,0.00013834015,0.0001050857],"domain_scores_gemma":[0.99943024,0.00019290751,0.00008922139,0.0001974723,0.00006521874,0.00002496917],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008227613,0.000080667276,0.00022171761,0.000016991855,0.000031482192,0.000015886488,0.00008112021,0.00003584301,0.0000382639],"category_scores_gemma":[0.00010899081,0.000054588465,0.000026564585,0.000058216883,0.000042440977,0.000050222738,0.0000543597,0.00003583603,0.0000018487053],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000030989708,0.000081163176,0.035428394,0.000056746787,0.000004160261,1.2254483e-7,0.00040084394,0.00030765572,0.96336293,0.0001207368,0.0000053087288,0.00020094392],"study_design_scores_gemma":[0.00042974213,0.0016290378,0.0052835797,0.0000146488965,0.000021598144,9.379683e-7,0.00021165259,0.01723235,0.97505856,0.00005244909,0.0000019476568,0.000063495376],"about_ca_topic_score_codex":0.00089164125,"about_ca_topic_score_gemma":0.0010273883,"teacher_disagreement_score":0.030144816,"about_ca_system_score_codex":0.000020333224,"about_ca_system_score_gemma":0.00001042098,"threshold_uncertainty_score":0.2226053},"labels":[],"label_agreement":null},{"id":"W2319278046","doi":"10.1557/proc-812-f8.9","title":"Textural Evolution of Cu Damascene Interconnects after Annealing","year":2004,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Materials science; Copper interconnect; Annealing (glass); Electron backscatter diffraction; Line width; Grain boundary; Diffraction; Composite material; Finite element method; Metallurgy; Copper; Optics; Thermodynamics; Microstructure","score_opus":0.007779861412161076,"score_gpt":0.23007017951293143,"score_spread":0.22229031810077035,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2319278046","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99681664,0.0002626416,0.00023207541,0.0005238988,0.0004875957,0.00018652405,0.000008670069,0.000098827826,0.0013831591],"genre_scores_gemma":[0.9985436,0.0000049406854,0.0011164821,0.000088098604,0.00014062297,0.000022831171,9.993789e-7,0.000015424424,0.00006696093],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987475,0.0000065015215,0.00034217437,0.0003672914,0.0002250668,0.00031141366],"domain_scores_gemma":[0.99938536,0.000018135062,0.00012012783,0.00012928646,0.00026383536,0.00008327104],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003638376,0.00015810727,0.00022884598,0.000085381456,0.000070209135,0.00006610818,0.00023951146,0.000092904214,0.00027958112],"category_scores_gemma":[0.00017374459,0.00012365403,0.000091383394,0.00018038557,0.00015872647,0.00041065877,0.00013110178,0.000116046,0.00008217964],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010446862,0.00008242428,0.007627497,0.00019160766,0.0000066152475,0.0000022169609,0.002489129,0.00003533246,0.9856757,0.0032050791,0.00017388935,0.00040605673],"study_design_scores_gemma":[0.0009706198,0.00037899974,0.03032491,0.00053766643,0.00003475837,0.00003745695,0.0016760295,0.00021977206,0.95454293,0.010367268,0.0005283157,0.00038128495],"about_ca_topic_score_codex":0.0003935433,"about_ca_topic_score_gemma":0.000029935496,"teacher_disagreement_score":0.031132765,"about_ca_system_score_codex":0.0002332404,"about_ca_system_score_gemma":0.00005207605,"threshold_uncertainty_score":0.5042465},"labels":[],"label_agreement":null},{"id":"W2324213395","doi":"10.1149/ma2015-01/40/2116","title":"(Invited) Design and Characterization of a New Low Cost Thick Film Copper Metallization Transfer Process Onto PDMS Enabling Stretchable Electronics","year":2015,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Photoresist; Fabrication; Electroplating; Layer (electronics); Copper plating; Polydimethylsiloxane; Electrical conductor; Flexible electronics; Electronics; Nanotechnology; Stretchable electronics; Microfabrication; Copper; Transfer printing; Optoelectronics; Composite material; Electrical engineering; Metallurgy","score_opus":0.03131915685775215,"score_gpt":0.2595191247277276,"score_spread":0.22819996786997543,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2324213395","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99560606,0.00021137048,0.0024461092,0.0004757266,0.0002306585,0.0005390209,0.000011203231,0.00007775704,0.0004020883],"genre_scores_gemma":[0.9987095,0.000063214,0.0008305216,0.00014910285,0.00009011082,0.0000149460075,0.000032934295,0.00002686679,0.0000828019],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99828625,0.000116579096,0.00050117867,0.00039275966,0.00035164275,0.00035157087],"domain_scores_gemma":[0.9989668,0.00012913602,0.00017389351,0.00020326463,0.00032555297,0.00020135913],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0015276622,0.00019547287,0.0002896547,0.00006755664,0.00009581826,0.0001441832,0.00016778817,0.0001484795,0.000042365446],"category_scores_gemma":[0.0005037639,0.00016794962,0.000037186684,0.00017689628,0.00006180312,0.0004422277,0.000026778425,0.00015233699,0.000010889272],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012641073,0.000092658454,0.00023294847,0.00015052277,0.000010345605,0.0000015389342,0.0033777826,0.048918456,0.94664574,0.000006555885,0.00012764016,0.00030942733],"study_design_scores_gemma":[0.00055717526,0.00014584452,0.0006962613,0.00027524194,0.00004034921,0.000007172318,0.00030624794,0.008932961,0.98787737,0.00025440907,0.00069789134,0.0002090626],"about_ca_topic_score_codex":0.00025893006,"about_ca_topic_score_gemma":0.000055691988,"teacher_disagreement_score":0.04123167,"about_ca_system_score_codex":0.000080052385,"about_ca_system_score_gemma":0.0002490744,"threshold_uncertainty_score":0.68487865},"labels":[],"label_agreement":null},{"id":"W2441613964","doi":"10.1364/oic.2016.tc.6","title":"Asymmetry in Waveguide Facet Coating","year":2016,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Asymmetry; Facet (psychology); Materials science; Coating; Reflectivity; Waveguide; Dielectric; Optics; Optoelectronics; Work (physics); Nanotechnology; Physics; Engineering; Mechanical engineering","score_opus":0.014463939073871685,"score_gpt":0.2564477888609387,"score_spread":0.24198384978706702,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2441613964","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9564991,0.00001511714,0.0010413091,0.0015546244,0.00028249936,0.00006485974,0.000004071834,0.00005261031,0.040485833],"genre_scores_gemma":[0.9966508,0.0000028369525,0.0010953796,0.0002128315,0.000033605444,0.000004043,1.4843339e-7,0.000004321614,0.001996012],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99930316,0.00003947825,0.0001842721,0.00019553608,0.00009318073,0.00018438628],"domain_scores_gemma":[0.99961674,0.00010958263,0.00002362719,0.00018766859,0.000024621473,0.00003773776],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00047034677,0.000059047703,0.00009621794,0.000031098207,0.000023909592,0.000022556102,0.00012695596,0.000035244906,0.0034866373],"category_scores_gemma":[0.0002958768,0.00002893674,0.000023563261,0.00005662902,0.000046236153,0.00010398919,0.000080369064,0.000027972672,0.0005948679],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000033089773,0.000019024561,0.003945234,0.00000468079,4.249018e-7,0.0000020105035,0.000056990204,8.8701705e-7,0.98703086,0.0015518578,0.0010928359,0.0062919087],"study_design_scores_gemma":[0.00034078697,0.000034461373,0.009321889,0.000053735126,0.000001003459,0.0000033130916,0.00013208049,0.00008152865,0.984948,0.0014504289,0.0035185928,0.00011418022],"about_ca_topic_score_codex":0.00030642928,"about_ca_topic_score_gemma":0.0002492422,"teacher_disagreement_score":0.040151745,"about_ca_system_score_codex":0.00004724718,"about_ca_system_score_gemma":0.00001813561,"threshold_uncertainty_score":0.9974243},"labels":[],"label_agreement":null},{"id":"W2485564250","doi":"10.1021/bk-2004-0874.ch013","title":"Ultra Low-k Dielectric Films with Ultra Small Pores Using Poragens Chemically Bonded to Siloxane Resin","year":2004,"lang":"en","type":"book-chapter","venue":"ACS symposium series","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Ministère de l'Économie, de la Science et de l'Innovation - Québec","keywords":"Siloxane; Materials science; Curing (chemistry); Dielectric; Composite material; Porosity; Coating; Low-k dielectric; Polymer chemistry; Polymer; Optoelectronics","score_opus":0.012799966005288608,"score_gpt":0.21374120852710776,"score_spread":0.20094124252181916,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2485564250","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8179128,0.00043588653,0.00009878661,0.0022554481,0.00092533906,0.00149144,0.00035655746,0.000489255,0.17603445],"genre_scores_gemma":[0.8747735,0.0002954944,0.0051578046,0.0008335105,0.0004924521,0.000047389418,0.00014961748,0.0003040901,0.11794614],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99641377,0.000038191643,0.0007998797,0.0013132243,0.0005968152,0.000838126],"domain_scores_gemma":[0.99762154,0.00013068349,0.00038096012,0.0011316605,0.0003904551,0.00034470198],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0003092309,0.00088571943,0.0009845361,0.00021349726,0.00028817833,0.00033865173,0.0007769017,0.0005799136,0.0011671657],"category_scores_gemma":[0.00009022184,0.00069045817,0.0002009644,0.00014976764,0.0004632498,0.00028036782,0.00014640727,0.0005177111,0.00016143528],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00058514916,0.0000670088,0.000011938179,0.00030431175,0.0000552966,0.00016126355,0.0006982801,0.0003609272,0.9926969,0.004599735,0.00042463056,0.000034561013],"study_design_scores_gemma":[0.00041974874,0.00088883564,0.000021921911,0.0009787148,0.00017243868,0.00027861565,0.00006804179,0.0000026770185,0.98919326,0.0025858972,0.0042191315,0.0011707357],"about_ca_topic_score_codex":0.00046835592,"about_ca_topic_score_gemma":0.00029187824,"teacher_disagreement_score":0.058088303,"about_ca_system_score_codex":0.00034135094,"about_ca_system_score_gemma":0.0006032129,"threshold_uncertainty_score":0.9997459},"labels":[],"label_agreement":null},{"id":"W2508763482","doi":"10.1021/acs.jpcc.5b04613","title":"Structural Changes in Tungsten and Tantalum Wires in Catalytic Chemical Vapor Deposition Using 1,3-Disilacyclobutane","year":2015,"lang":"en","type":"article","venue":"The Journal of Physical Chemistry C","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Foundation for Innovation; University of Calgary","keywords":"Tungsten; Tantalum; Materials science; Chemical vapor deposition; Catalysis; Carbide; Alloy; Metal; Deposition (geology); Protein filament; Chemical engineering; Refractory metals; Atmospheric temperature range; Metallurgy; Composite material; Nanotechnology; Chemistry; Organic chemistry; Thermodynamics","score_opus":0.02119860346216011,"score_gpt":0.27014028913523797,"score_spread":0.24894168567307787,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2508763482","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9993622,0.00013810533,0.0000019456895,0.0003373749,0.00004934525,0.00004479252,0.0000043806876,0.000003723188,0.00005814969],"genre_scores_gemma":[0.9996908,0.0000034551492,0.000045137473,0.000017995268,0.00023132113,4.7531387e-7,8.014258e-7,0.0000055862993,0.00000445466],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992735,0.000043169828,0.00021879945,0.00010196169,0.00020522307,0.0001573784],"domain_scores_gemma":[0.9995252,0.00008879631,0.0001313857,0.00010809592,0.00005710087,0.0000894257],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00034636163,0.00009800787,0.00022143523,0.000015038326,0.000019942892,0.000027563548,0.00017798436,0.0000408499,0.000010954084],"category_scores_gemma":[0.00011099629,0.000058489244,0.000031247844,0.00008118983,0.000149398,0.00011627323,0.00008361776,0.00020089651,7.5689945e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013677505,0.000041426232,0.00036428854,0.000035107634,0.0000026808048,0.000020107287,0.0009626984,0.00021245779,0.9980535,0.0000014698177,0.000007096741,0.00016240266],"study_design_scores_gemma":[0.0004655524,0.000053195377,0.00089059776,0.00010474739,0.000021522956,0.00041993108,0.0005716023,0.0076297796,0.98903084,0.0007264467,0.0000013691002,0.00008441558],"about_ca_topic_score_codex":0.00015322208,"about_ca_topic_score_gemma":0.000022220507,"teacher_disagreement_score":0.009022649,"about_ca_system_score_codex":0.00013993283,"about_ca_system_score_gemma":0.000047639114,"threshold_uncertainty_score":0.23851222},"labels":[],"label_agreement":null},{"id":"W2527855557","doi":"10.1103/physrevlett.117.155901","title":"Phase-Field-Crystal Model for Electromigration in Metal Interconnects","year":2016,"lang":"en","type":"article","venue":"Physical Review Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs","keywords":"Electromigration; Nucleation; Void (composites); Materials science; Condensed matter physics; Atomic units; Electric field; Dipole; Scattering; Phase (matter); Electrical resistivity and conductivity; Crystal (programming language); Physics; Thermodynamics; Optics","score_opus":0.02463910974843159,"score_gpt":0.3267458933549282,"score_spread":0.3021067836064966,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2527855557","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9486183,0.0005604839,0.034037232,0.016000219,0.00012135576,0.0005702431,0.00001810784,0.000036362824,0.00003769442],"genre_scores_gemma":[0.99126095,0.00022638321,0.00032033122,0.007881757,0.00009939318,0.00017726328,0.00000336834,0.00001280664,0.00001773666],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998818,0.00007828301,0.00029201206,0.0003665651,0.00014156001,0.00030361168],"domain_scores_gemma":[0.9992103,0.0003652332,0.00007616106,0.0002509854,0.00003774797,0.00005959842],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037360706,0.00015178454,0.00036632587,0.00003052293,0.00003128614,0.000020783062,0.00020253049,0.000013129925,0.00007842496],"category_scores_gemma":[0.0003749061,0.00008784499,0.00020169704,0.00007912938,0.000045343844,0.00025598594,0.000041598956,0.000067835674,0.000053719355],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003830005,0.00021096235,0.0000044782864,0.00022717877,0.0000042649667,7.401173e-7,0.000084583546,0.000013374469,0.9908598,0.00066712825,0.0022536675,0.0056355246],"study_design_scores_gemma":[0.0039226217,0.0011799028,0.000028119815,0.0034786426,0.00013829146,0.0000053534727,0.000011634386,0.07065507,0.9079516,0.007530013,0.004351231,0.0007475455],"about_ca_topic_score_codex":0.000015041603,"about_ca_topic_score_gemma":0.00003334005,"teacher_disagreement_score":0.08290822,"about_ca_system_score_codex":0.00008017717,"about_ca_system_score_gemma":0.000025893052,"threshold_uncertainty_score":0.35822147},"labels":[],"label_agreement":null},{"id":"W2535242961","doi":"10.1017/9781139939508.063","title":"CDw75 (LN-1)","year":2016,"lang":"en","type":"book-chapter","venue":"Cambridge University Press eBooks","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"History","score_opus":0.01928237660754486,"score_gpt":0.19886672920601156,"score_spread":0.1795843525984667,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2535242961","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0014645609,0.000107158114,0.0001903599,0.000060885715,0.0010110361,0.00033163145,0.00061646756,0.00022813922,0.99598974],"genre_scores_gemma":[0.006680315,0.00005267554,0.00005508397,0.000076838565,0.00026647447,5.704196e-7,0.000008756863,0.000045650617,0.99281365],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.99832135,0.000045619705,0.0002272051,0.00074186147,0.0002973526,0.0003666122],"domain_scores_gemma":[0.9983964,0.00011188714,0.00020291176,0.0008822884,0.00019426156,0.00021224214],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001791571,0.00039130036,0.00045079913,0.000106335705,0.00019780741,0.00006299826,0.0007602138,0.00041649604,0.000247261],"category_scores_gemma":[0.000018058256,0.00032965018,0.00027700572,0.0000035473063,0.00047889483,0.00010534899,0.000631491,0.0002822516,0.00044875327],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009881946,0.000009656857,8.647577e-7,0.000076676195,0.000036928355,0.00018040247,0.000027083419,2.493006e-7,0.01085306,0.9361181,0.05109706,0.0015010454],"study_design_scores_gemma":[0.000403856,0.00005957653,0.000005220819,0.00024888178,0.00009962126,0.00001586421,0.000009650511,0.0000032270173,0.011098235,0.000058902133,0.9875221,0.00047482358],"about_ca_topic_score_codex":0.000098914,"about_ca_topic_score_gemma":0.0000036608587,"teacher_disagreement_score":0.9364251,"about_ca_system_score_codex":0.0002688424,"about_ca_system_score_gemma":0.00012869763,"threshold_uncertainty_score":0.99991554},"labels":[],"label_agreement":null},{"id":"W2536650897","doi":"10.1145/2966986.2967041","title":"Fast physics-based electromigration checking for on-die power grids","year":2016,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":28,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; Mentor Graphics","keywords":"Electromigration; IBM; Computer science; Grid; Die (integrated circuit); Interconnection; Power (physics); Power grid; Scaling; Computational science; Computer engineering; Parallel computing; Algorithm; Electrical engineering; Physics; Engineering; Mathematics; Telecommunications","score_opus":0.016017979578558942,"score_gpt":0.2629600156232294,"score_spread":0.24694203604467047,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2536650897","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9127755,0.0000060740326,0.08165105,0.0021384973,0.00046206967,0.00026080373,0.000022001886,0.000103174454,0.0025807894],"genre_scores_gemma":[0.9972987,7.539834e-7,0.0009546268,0.00060761534,0.00013725767,0.000037577356,0.000002204027,0.000010214565,0.0009510625],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992484,0.000020763773,0.00013681507,0.00026299516,0.00011107577,0.00021998073],"domain_scores_gemma":[0.9994417,0.00017028335,0.000040449315,0.00022472191,0.000084204585,0.000038658567],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00023363219,0.00009571854,0.00010803096,0.000017289454,0.000080671525,0.000044343775,0.00011356721,0.000039190523,0.00097164256],"category_scores_gemma":[0.00008820127,0.000049580976,0.00007745699,0.00002954938,0.000043065073,0.00014124888,0.000014484317,0.000024606426,0.00016235403],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000072645744,0.0000680804,0.000064136504,0.000006907659,0.0000020411353,1.7503892e-7,0.000034280944,0.0000106144,0.9897503,0.0046969457,0.0016399103,0.0036539135],"study_design_scores_gemma":[0.00047732683,0.00042953744,0.00033874798,0.000029591996,0.000003956739,2.0076355e-7,0.0000129517275,0.00030494278,0.9927024,0.0021215621,0.003466385,0.00011235281],"about_ca_topic_score_codex":0.000026306396,"about_ca_topic_score_gemma":0.00004463001,"teacher_disagreement_score":0.08452314,"about_ca_system_score_codex":0.00006760439,"about_ca_system_score_gemma":0.000044152097,"threshold_uncertainty_score":0.9999416},"labels":[],"label_agreement":null},{"id":"W2582843339","doi":"10.1007/s10836-016-5639-4","title":"Fast and Automated Electromigration Analysis for CMOS RF PA Design","year":2017,"lang":"en","type":"article","venue":"Journal of Electronic Testing","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"National Natural Science Foundation of China","keywords":"Reliability (semiconductor); Electromigration; Parametric statistics; Electronic engineering; CMOS; Process (computing); Parametric model; Sampling (signal processing); Engineering; Power (physics); Radio frequency; Computer science; Electrical engineering","score_opus":0.04114188414690397,"score_gpt":0.30825217548876577,"score_spread":0.2671102913418618,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2582843339","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94911027,0.00031367532,0.04981646,0.00042422325,0.0000964198,0.00014267195,0.0000019635509,0.000043430617,0.000050898892],"genre_scores_gemma":[0.9897318,0.0000072481134,0.010060699,0.000023684539,0.00012882144,0.0000042852917,4.2769938e-7,0.0000086998625,0.00003433202],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99886763,0.00006367096,0.00040029074,0.00016852234,0.00014811994,0.00035177727],"domain_scores_gemma":[0.9981353,0.0004716638,0.00076836377,0.00020966298,0.0003492301,0.00006573098],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0017999308,0.00010729025,0.00029982533,0.0001024825,0.0004472303,0.00031254056,0.00026349505,0.000050767456,0.000025077523],"category_scores_gemma":[0.0023166584,0.00007866829,0.00010789841,0.00010871827,0.00005659297,0.00032424444,0.000031748186,0.00014856172,0.0000014900448],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011090991,0.000048499605,0.006504038,0.00002101233,0.00014933966,0.0000040459163,0.00013338105,0.0059604472,0.98192394,0.00011504444,0.00019317816,0.0048361477],"study_design_scores_gemma":[0.0014376186,0.0029307904,0.051410496,0.00013921187,0.0010971043,0.00026024933,0.000088414046,0.7142125,0.22298291,0.0048966156,0.0001854194,0.00035866894],"about_ca_topic_score_codex":0.000051443167,"about_ca_topic_score_gemma":0.00007901305,"teacher_disagreement_score":0.75894105,"about_ca_system_score_codex":0.00012544179,"about_ca_system_score_gemma":0.000239971,"threshold_uncertainty_score":0.34397793},"labels":[],"label_agreement":null},{"id":"W2583201768","doi":"10.1557/proc-721-j5.6","title":"Influence of Line-Width on Microstructure and Texture of Damascene Copper Interconnects","year":2002,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Misorientation; Materials science; Grain boundary; Pole figure; Microstructure; Grain size; Transverse plane; Texture (cosmology); Condensed matter physics; Full width at half maximum; Optics; Composite material; Physics; Optoelectronics","score_opus":0.010852490984004669,"score_gpt":0.22779610696492683,"score_spread":0.21694361598092216,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2583201768","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99771893,0.00023652914,0.0000012219369,0.0004864104,0.00010813247,0.00018645053,0.000026667663,0.00003269706,0.0012029829],"genre_scores_gemma":[0.99920297,0.000047286016,0.0002699263,0.00027194657,0.00004654303,0.0000047911835,6.2895054e-7,0.000013812769,0.0001421248],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99886686,0.000008542224,0.00034469925,0.0003636382,0.0002000352,0.00021621087],"domain_scores_gemma":[0.9992557,0.000056592522,0.00018346925,0.00015565418,0.00027164514,0.00007694178],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020084619,0.0001773373,0.00031866218,0.000075871256,0.00005150256,0.00003608201,0.00025377865,0.00013340187,0.00025957378],"category_scores_gemma":[0.0002975572,0.00012758601,0.000051949886,0.0001472978,0.00030294518,0.00018354958,0.00012507854,0.0001572847,0.000014857953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004590881,0.00006691443,0.005840461,0.0003123222,0.000006531669,7.3360343e-7,0.0022822164,0.000034950295,0.9884147,0.0005216945,0.001569911,0.0009036791],"study_design_scores_gemma":[0.0005222451,0.00060624006,0.021428544,0.0004254359,0.000021013795,0.000023775048,0.0002627431,0.00023386643,0.9743605,0.00081782654,0.0010847965,0.00021301706],"about_ca_topic_score_codex":0.00004101268,"about_ca_topic_score_gemma":0.0000038690027,"teacher_disagreement_score":0.015588082,"about_ca_system_score_codex":0.000022280032,"about_ca_system_score_gemma":0.00000940437,"threshold_uncertainty_score":0.52028066},"labels":[],"label_agreement":null},{"id":"W2592122550","doi":"10.1103/physrevapplied.7.024032","title":"Role of Stress-Driven Interfacial Instability in the Failure of Confined Electric Interconnects","year":2017,"lang":"en","type":"article","venue":"Physical Review Applied","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Compute Canada","keywords":"Electromigration; Instability; Materials science; Breakage; Interconnection; Stress (linguistics); Dielectric; Engineering physics; Composite material; Mechanics; Nanotechnology; Optoelectronics; Computer science; Physics; Telecommunications","score_opus":0.015260709571262004,"score_gpt":0.2944009128838825,"score_spread":0.27914020331262046,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2592122550","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9938548,0.0006433916,0.000012677301,0.00045014863,0.000047868798,0.00075833785,0.000020127749,0.000010736935,0.0042018737],"genre_scores_gemma":[0.9995858,0.00016444709,0.000026373833,0.00008645379,0.00005197593,0.00007378139,0.0000026438677,0.000007196765,0.0000013210507],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99856716,0.0001414909,0.00048987864,0.0003246684,0.0002615318,0.00021526653],"domain_scores_gemma":[0.9982045,0.00027089717,0.00039181884,0.0010050165,0.00008873813,0.000038970982],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006289559,0.00016462604,0.00068275165,0.000025156605,0.000068099216,0.00003327806,0.0010831297,0.00003785462,0.00015367883],"category_scores_gemma":[0.0005452592,0.00009744138,0.00016090933,0.00011115325,0.00028720513,0.00008973868,0.0002230645,0.0001970575,0.000027363487],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000058503112,0.00046621502,0.0005838113,0.0011916376,0.00000760798,4.068549e-7,0.0007733955,0.0000034444301,0.97519344,0.01356534,0.000043780055,0.008112403],"study_design_scores_gemma":[0.000649562,0.00026034642,0.024662929,0.0015794156,0.00008741081,0.0000012812383,0.000345389,0.00031667404,0.9551183,0.015828935,0.0008785052,0.0002712541],"about_ca_topic_score_codex":0.00021976713,"about_ca_topic_score_gemma":0.00028240704,"teacher_disagreement_score":0.024079118,"about_ca_system_score_codex":0.000026558197,"about_ca_system_score_gemma":0.000052338706,"threshold_uncertainty_score":0.3973544},"labels":[],"label_agreement":null},{"id":"W2604397886","doi":"10.1116/1.4979709","title":"Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applications","year":2017,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Canadian Light Source (Canada)","funders":"Division of Materials Research; National Institute of General Medical Sciences; Western Economic Diversification Canada; Natural Sciences and Engineering Research Council of Canada; Canadian Institutes of Health Research; National Research Council Canada; Canada Foundation for Innovation; National Science Foundation; National Institutes of Health; University of Saskatchewan; Canadian Light Source","keywords":"Materials science; Overlayer; Diffusion barrier; Atomic layer deposition; Silicide; Barrier layer; Ruthenium; Tantalum nitride; Tin; Chemical engineering; Annealing (glass); Chemical vapor deposition; Crystallinity; Nitride; Nanotechnology; Layer (electronics); Optoelectronics; Composite material; Metallurgy; Chemistry","score_opus":0.016172453726377763,"score_gpt":0.29118334616042146,"score_spread":0.2750108924340437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2604397886","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9912032,0.000947782,0.003493785,0.0028527032,0.0008239547,0.00042008996,0.000059077618,0.000064019405,0.00013537856],"genre_scores_gemma":[0.99153006,0.00015010448,0.007985227,0.0000950694,0.0000652834,0.000038341816,6.258162e-7,0.000017339282,0.000117942785],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99777323,0.000038766895,0.0007092601,0.0005529769,0.00035388407,0.00057191035],"domain_scores_gemma":[0.99734676,0.0001938716,0.0008515559,0.00079097174,0.00059271645,0.0002241112],"candidate_categories":["sts"],"consensus_categories":[],"category_scores_codex":[0.0024582744,0.00025881943,0.00053385895,0.0005500401,0.0015988138,0.000519024,0.0019917514,0.00025396422,0.000103876366],"category_scores_gemma":[0.00053241086,0.00018399068,0.00019626817,0.00037244367,0.0020633687,0.0010430752,0.00038305292,0.00041460982,0.000015544745],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009494536,0.00007692536,0.0036508862,0.000023336392,0.000028705426,0.000007427424,0.0002396772,0.0000126669365,0.9928048,0.0019584724,0.00011536929,0.0009867869],"study_design_scores_gemma":[0.0009519037,0.0005525235,0.0017387826,0.000079077145,0.00011342025,0.0004105865,0.001382361,0.0011610567,0.98221546,0.00827645,0.002791663,0.00032671203],"about_ca_topic_score_codex":0.000048381662,"about_ca_topic_score_gemma":0.000034048753,"teacher_disagreement_score":0.010589338,"about_ca_system_score_codex":0.000066732035,"about_ca_system_score_gemma":0.00029871342,"threshold_uncertainty_score":0.99970096},"labels":[],"label_agreement":null},{"id":"W2621372888","doi":"10.1149/ma2006-01/10/411","title":"Copper Resistivity in Electrodeposited Dual Damascene Interconnects - An Integrated Circuit Perspective","year":2006,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Copper interconnect; Copper; Dual (grammatical number); Materials science; Electrical resistivity and conductivity; Interconnection; Perspective (graphical); Copper wire; Metallurgy; Electrical engineering; Engineering physics; Composite material; Engineering; Computer science; Telecommunications; Art","score_opus":0.014579624805372875,"score_gpt":0.25545355231632544,"score_spread":0.24087392751095257,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2621372888","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9430653,0.00014881487,0.000010036153,0.0003813039,0.00049992756,0.00030005866,0.000027752194,0.00027169692,0.055295136],"genre_scores_gemma":[0.998907,0.000003903123,0.00046514694,0.000089565394,0.00027169834,0.00002089159,0.000033931592,0.000042217383,0.00016562002],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9967586,0.00039659336,0.00071356015,0.0009878757,0.00037844307,0.0007649659],"domain_scores_gemma":[0.9983466,0.00037376973,0.00024118791,0.0005408411,0.0003398676,0.00015768637],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0018130569,0.00035843646,0.0004453356,0.00021138307,0.00020904644,0.00027440386,0.00037541182,0.00022079558,0.00017671495],"category_scores_gemma":[0.0012089453,0.00031716176,0.000096368756,0.00039194277,0.00018184654,0.0005361946,0.00011003464,0.00053133257,0.00013120107],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015425772,0.00061035727,0.002834413,0.000027517839,0.000007616102,0.00012471949,0.0010323456,0.0043266783,0.99000674,0.000314702,0.00046453532,0.000096095115],"study_design_scores_gemma":[0.0007904946,0.00027474525,0.14120674,0.00027493548,0.00002317881,0.000055177363,0.0015562761,0.0005350447,0.8523927,0.0019533867,0.0003954289,0.00054188725],"about_ca_topic_score_codex":0.029645272,"about_ca_topic_score_gemma":0.010817751,"teacher_disagreement_score":0.13837233,"about_ca_system_score_codex":0.0006347296,"about_ca_system_score_gemma":0.0001804782,"threshold_uncertainty_score":0.99992806},"labels":[],"label_agreement":null},{"id":"W2626864102","doi":"","title":"Parallelized FMM and Dedicated PEEC Method to Model Industrial Power Interconnections - Application to Boost Chopper","year":2011,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Center for Diagnosis and Research on Alzheimer's Disease","funders":"","keywords":"Chopper; Computer science; Power (physics); Electronic engineering; Electrical engineering; Engineering; Voltage; Physics","score_opus":0.02958489217375302,"score_gpt":0.2734088464919442,"score_spread":0.24382395431819118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2626864102","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3536965,0.00011562823,0.61923134,0.013775165,0.00041715265,0.0014253502,0.00015450078,0.00029793248,0.010886427],"genre_scores_gemma":[0.8543482,0.00004652913,0.14144793,0.00050186843,0.00004299059,0.00051934656,0.00013209923,0.00005964304,0.0029014065],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9935542,0.0032094961,0.00080768164,0.0015234251,0.00041251953,0.00049269234],"domain_scores_gemma":[0.9941336,0.0008067273,0.000366063,0.0023727696,0.0017487191,0.00057215546],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0071143764,0.00046037888,0.0006001929,0.00030863387,0.0004003841,0.00046606804,0.0013699149,0.00045558385,0.0006498831],"category_scores_gemma":[0.002138324,0.00043856015,0.00018893435,0.0003657131,0.0001974122,0.00016192396,0.0027364143,0.0007312683,0.00021249734],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005968369,0.0024959396,0.0012613102,0.00029508612,0.00024151408,0.000005480869,0.070538856,0.004150982,0.7396199,0.069667086,0.020753622,0.09037339],"study_design_scores_gemma":[0.0034354485,0.0000133458725,0.0028861456,0.0036457393,0.0003760911,0.00005303817,0.0010452424,0.10620145,0.7773509,0.03007534,0.07161394,0.0033033493],"about_ca_topic_score_codex":0.0049821893,"about_ca_topic_score_gemma":0.0025095993,"teacher_disagreement_score":0.5006517,"about_ca_system_score_codex":0.00022447716,"about_ca_system_score_gemma":0.0003398165,"threshold_uncertainty_score":0.99980664},"labels":[],"label_agreement":null},{"id":"W2724566967","doi":"","title":"Thin dielectric films with low dielectric constants for quarter micron devices","year":2009,"lang":"en","type":"dissertation","venue":"DR-NTU (Nanyang Technological University)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Dielectric; Materials science; Quarter (Canadian coin); High-κ dielectric; Optoelectronics; Engineering physics; Electrical engineering; Engineering; Geography","score_opus":0.00699865017722182,"score_gpt":0.21113575740149826,"score_spread":0.20413710722427644,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2724566967","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9826008,0.00050366006,0.00064774434,0.00042163322,0.00034886578,0.0011839826,0.00009847186,0.00087384967,0.013321012],"genre_scores_gemma":[0.9906507,0.0001478158,0.001115854,0.000103038925,0.000034503413,0.000012134439,0.00021665738,0.000030872114,0.007688426],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9975726,0.00008002084,0.00031858153,0.001028663,0.000286589,0.0007135419],"domain_scores_gemma":[0.99854046,0.00022722564,0.00033456687,0.0005273159,0.00026223663,0.000108187116],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00024110636,0.00050033414,0.00066450494,0.0006178694,0.00038941056,0.00011597688,0.0010444127,0.0010358559,0.0002605626],"category_scores_gemma":[0.00014847168,0.00036955552,0.00021996282,0.001111623,0.00025102307,0.00019449876,0.00006683215,0.0005860679,0.000064694075],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.008733111,0.003441065,0.001027007,0.001959371,0.00047953892,0.0012767563,0.0009329115,0.00006083313,0.8012958,0.073030576,0.021316469,0.08644655],"study_design_scores_gemma":[0.006543385,0.011476431,0.0072284173,0.0023943905,0.0013669392,0.000098816265,0.009573467,0.0014507778,0.7819312,0.009737392,0.16254205,0.0056567406],"about_ca_topic_score_codex":0.00006656414,"about_ca_topic_score_gemma":0.00066121336,"teacher_disagreement_score":0.14122558,"about_ca_system_score_codex":0.00023647337,"about_ca_system_score_gemma":0.00017349207,"threshold_uncertainty_score":0.99987566},"labels":[],"label_agreement":null},{"id":"W2725365564","doi":"10.1299/jsmetohoku.2014.50.69","title":"323 Effect of Base Material on the Crystallinity of Electroplated Copper Thin Films","year":2014,"lang":"en","type":"article","venue":"The Proceedings of Autumn Conference of Tohoku Branch","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Geomechanica (Canada)","funders":"","keywords":"Copper; Electroplating; Crystallinity; Materials science; Base (topology); Metallurgy; Thin film; Composite material; Nanotechnology; Layer (electronics); Mathematics","score_opus":0.01390261383869407,"score_gpt":0.22925856023690191,"score_spread":0.21535594639820785,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2725365564","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99361444,0.0000147704,0.00001858865,0.0007224071,0.00027093134,0.0005695955,0.00007572341,0.00003180747,0.004681744],"genre_scores_gemma":[0.9996968,0.0000140998345,0.000088119865,0.000044008957,0.000046275312,0.000019107243,0.0000025036584,0.000017093145,0.00007201932],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99797136,0.00012238666,0.0007580786,0.00032873504,0.0005115627,0.00030785284],"domain_scores_gemma":[0.9972794,0.0007712805,0.00076728844,0.00038193338,0.0007448078,0.000055270764],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.002962525,0.0002560426,0.00072418293,0.00006588367,0.00009527957,0.000047776794,0.0010207186,0.00013487518,0.0014232117],"category_scores_gemma":[0.0012179365,0.00012824417,0.0001734552,0.00019187485,0.000764117,0.00015064962,0.00018957144,0.00022046447,0.000009429628],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0010592744,0.00011431875,0.00047606925,0.0005609647,0.000027723288,7.070075e-8,0.00083691545,0.000016296222,0.9885115,0.007217586,0.0008957043,0.00028357602],"study_design_scores_gemma":[0.0005287283,0.001905597,0.0015318115,0.00037574084,0.00005301447,0.000003089318,0.00013389037,0.0006780938,0.99170244,0.0029118874,0.000043423428,0.00013228663],"about_ca_topic_score_codex":0.0003384671,"about_ca_topic_score_gemma":0.000007748689,"teacher_disagreement_score":0.0060823406,"about_ca_system_score_codex":0.000016396227,"about_ca_system_score_gemma":0.00008364686,"threshold_uncertainty_score":0.9994896},"labels":[],"label_agreement":null},{"id":"W2761711607","doi":"10.1139/cjp-2017-0484","title":"Electrical resistivity of gold thin film as a function of film thickness","year":2017,"lang":"en","type":"article","venue":"Canadian Journal of Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":39,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Electrical resistivity and conductivity; Thin film; Condensed matter physics; Function (biology); Physics; Composite material; Materials science; Nanotechnology","score_opus":0.018816820514383138,"score_gpt":0.2510574208077511,"score_spread":0.232240600293368,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2761711607","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9957122,0.00010864319,0.00036314715,0.0003302857,0.00080348225,0.000056033266,0.000044421733,0.0000022097956,0.002579562],"genre_scores_gemma":[0.9994321,0.000005476685,0.00009228101,0.000047240213,0.00020859424,5.107821e-7,5.9826783e-7,0.000006981128,0.00020622315],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990707,0.00007895772,0.000332636,0.00011482929,0.00021143697,0.00019144663],"domain_scores_gemma":[0.9982509,0.000097564574,0.0005975467,0.0003774329,0.00044201288,0.00023455871],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006346075,0.000087744345,0.0002938242,0.000052301362,0.00014583011,0.000060254235,0.0004439739,0.00007249756,0.0002453801],"category_scores_gemma":[0.0007615829,0.000069628644,0.00013803961,0.00006509568,0.00026440874,0.00025057382,0.000019998944,0.00020417944,0.0000100082425],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006316537,0.0002869441,0.016743561,0.00035477156,0.00014572326,0.000120581055,0.002407727,0.0018362335,0.87937534,0.032754563,0.02816304,0.03717989],"study_design_scores_gemma":[0.0015748647,0.0020151462,0.3199901,0.0007286854,0.00027960632,0.00010053248,0.00038215448,0.0015179114,0.6027757,0.06355964,0.0065327813,0.0005429144],"about_ca_topic_score_codex":0.012524056,"about_ca_topic_score_gemma":0.009028928,"teacher_disagreement_score":0.30324653,"about_ca_system_score_codex":0.000084880776,"about_ca_system_score_gemma":0.0011895819,"threshold_uncertainty_score":0.99405164},"labels":[],"label_agreement":null},{"id":"W2762098545","doi":"10.1364/oe.25.026124","title":"Aperiodic nature of nanograting inscribed by femtosecond pulses","year":2017,"lang":"en","type":"article","venue":"Optics Express","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Fonds de recherche du Québec – Nature et technologies; Natural Sciences and Engineering Research Council of Canada; Canada Foundation for Innovation","keywords":"Quasiperiodic function; Optics; Aperiodic graph; Inscribed figure; Femtosecond; Groove (engineering); Pulse (music); Quasicrystal; Amplitude; Apodization; Dielectric; Physics; Materials science; Geometry; Mathematics; Laser; Optoelectronics; Condensed matter physics","score_opus":0.012591444754167696,"score_gpt":0.2715321367564544,"score_spread":0.2589406920022867,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2762098545","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99148124,0.00034850222,0.000041705905,0.00017638462,0.0008585061,0.00011696807,0.000109164306,0.00002562757,0.006841924],"genre_scores_gemma":[0.99731034,0.000021504533,0.0019205107,0.00005577748,0.00006695402,0.000009303425,0.0000060154703,0.000012019408,0.0005975998],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990441,0.00003276817,0.00024857445,0.00027041804,0.00018654043,0.00021758887],"domain_scores_gemma":[0.99872744,0.0000710258,0.00021986007,0.0008001008,0.00011605191,0.00006551582],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002498397,0.00012568955,0.00022398785,0.000019489355,0.00035192037,0.00030170652,0.0006734709,0.00015713969,0.0004141405],"category_scores_gemma":[0.0004130581,0.00009768907,0.00006416291,0.000019272245,0.00029310037,0.00025235943,0.0002585559,0.00017582596,0.000017300195],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000014696463,0.000057632424,0.00096038193,0.000059972404,0.0000048048123,0.0000014521626,0.000381392,0.0000041148896,0.99625313,0.00040443885,0.0013650047,0.00049299723],"study_design_scores_gemma":[0.000263465,0.000063922846,0.0009138369,0.00008284065,0.000010133193,0.0000026491773,0.00019637196,0.00017550499,0.99295974,0.00024182859,0.0049371365,0.00015254488],"about_ca_topic_score_codex":0.000095637806,"about_ca_topic_score_gemma":0.000023096118,"teacher_disagreement_score":0.006244324,"about_ca_system_score_codex":0.000013280757,"about_ca_system_score_gemma":0.000029599405,"threshold_uncertainty_score":0.4534548},"labels":[],"label_agreement":null},{"id":"W2801245496","doi":"10.1109/iscas.2018.8351507","title":"Electromigration and Parasitic-Aware ILP Router for Analog and RF Circuits","year":2018,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Electromigration; Parasitic extraction; Radio frequency; Electronic engineering; Interconnection; Electronic circuit; Router; Routing (electronic design automation); Computer science; Analogue electronics; Integer programming; Electrical engineering; Engineering; Telecommunications; Computer network; Algorithm","score_opus":0.01465050959956306,"score_gpt":0.2710560251966954,"score_spread":0.25640551559713237,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2801245496","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9893824,0.000038663376,0.008873783,0.00058499695,0.00015142906,0.00019820005,0.000012338435,0.000035598267,0.0007226337],"genre_scores_gemma":[0.9987861,0.000007224414,0.00037191226,0.0003542994,0.00013038114,0.000013940108,0.0000032212993,0.000004868383,0.00032808832],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999416,0.00001679158,0.00011208863,0.0002430421,0.000052492847,0.0001596103],"domain_scores_gemma":[0.9996584,0.0000665244,0.000022466995,0.00011536399,0.00008595913,0.000051278945],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020962331,0.00007090784,0.000099213554,0.000020747133,0.00011376345,0.00009661301,0.000046182566,0.000044214572,0.00025660387],"category_scores_gemma":[0.000043980835,0.000049433274,0.000016304495,0.00002806326,0.00011228839,0.00012798602,0.000017499997,0.00002146475,0.0000148613],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028520353,0.00002930604,0.0035628444,0.000037776095,0.0000057786146,4.6765132e-7,0.0005433097,1.9914211e-7,0.98447293,0.002409126,0.0029182269,0.0059915422],"study_design_scores_gemma":[0.0007864015,0.0012782356,0.046271387,0.000028465744,0.000037746857,0.000024512308,0.00021848762,0.003005638,0.93567485,0.0082553765,0.00410081,0.00031811584],"about_ca_topic_score_codex":0.000111016845,"about_ca_topic_score_gemma":0.0005762598,"teacher_disagreement_score":0.04879808,"about_ca_system_score_codex":0.000013166502,"about_ca_system_score_gemma":0.000015252767,"threshold_uncertainty_score":0.28096327},"labels":[],"label_agreement":null},{"id":"W2803662606","doi":"10.1149/ma2018-01/22/1376","title":"Cu/Cu Barrier Interconnect with Low Resistivity for the Application to the Next-Generation and High-Resolution Display Fabricated Using Microwave-Assisted Sputter","year":2018,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Kootenay Association for Science & Technology","funders":"","keywords":"Materials science; Capacitance; Interconnection; Optoelectronics; Resistor; Electrical resistivity and conductivity; Capacitor; Electrical engineering; SIGNAL (programming language); Microwave; Electrode; Computer science; Voltage; Telecommunications; Physics; Engineering","score_opus":0.034041549135702724,"score_gpt":0.2699488834718074,"score_spread":0.23590733433610467,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2803662606","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9765436,0.000051305706,0.019517578,0.0023369712,0.00045152364,0.00084577326,0.000028254979,0.00005111285,0.000173879],"genre_scores_gemma":[0.99484456,0.0000019504557,0.003984884,0.00039127635,0.0006202302,0.00007859679,0.000013017107,0.000021821646,0.000043680364],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985616,0.00013002449,0.00032260217,0.0004988231,0.00018589725,0.00030106012],"domain_scores_gemma":[0.99852324,0.00047522553,0.00020919536,0.0004529425,0.00025895043,0.00008046392],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0015340035,0.0001801529,0.0001623597,0.000037911333,0.00087521155,0.00034519707,0.00023524334,0.00008131388,0.000014734594],"category_scores_gemma":[0.00055000343,0.00009717059,0.000039125385,0.00014680356,0.00022140749,0.00018228823,0.000095495,0.00011253809,0.000028233171],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014602521,0.00003263866,0.0001273735,0.000023597111,0.000010919765,4.0765775e-7,0.0005377477,0.002905493,0.99320626,0.000016855298,0.00046805685,0.00252464],"study_design_scores_gemma":[0.00036634944,0.00018489509,0.034746185,0.000159178,0.00008509157,0.000020248164,0.00022171301,0.07468305,0.88654906,0.00006205067,0.0026657975,0.00025641773],"about_ca_topic_score_codex":0.0020918087,"about_ca_topic_score_gemma":0.0028479088,"teacher_disagreement_score":0.106657214,"about_ca_system_score_codex":0.0000973341,"about_ca_system_score_gemma":0.000050422932,"threshold_uncertainty_score":0.67315084},"labels":[],"label_agreement":null},{"id":"W2808261674","doi":"10.1109/tvlsi.2018.2839698","title":"Electromigration- and Parasitic-Aware ILP-Based Analog Router","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"Natural Sciences and Engineering Research Council of Canada; Memorial University of Newfoundland; Research and Development Corporation of Newfoundland and Labrador; Canada Foundation for Innovation","keywords":"Parasitic extraction; Routing (electronic design automation); Computer science; Electromigration; Router; Integer programming; Interconnection; Electronic engineering; Electronic circuit; Sensitivity (control systems); Radio frequency; Analogue electronics; Computer engineering; Algorithm; Electrical engineering; Engineering; Computer network; Telecommunications","score_opus":0.010740142439606673,"score_gpt":0.2511543537369035,"score_spread":0.24041421129729681,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2808261674","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.48855865,0.0000411441,0.5083703,0.00025306104,0.0019294902,0.0003708333,0.00013386774,0.00014515853,0.00019748372],"genre_scores_gemma":[0.9981913,0.000010079954,0.0002671411,0.00031350076,0.00027365464,0.00014527117,0.00002028647,0.00002877129,0.00074996817],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99768,0.00029992076,0.00057785003,0.0006334743,0.00037899188,0.00042977274],"domain_scores_gemma":[0.99861795,0.0001735858,0.00013392857,0.00051186816,0.00039649408,0.00016620489],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00062928593,0.00030479656,0.00035829726,0.0002043787,0.0005643242,0.00035318412,0.00019502357,0.00021876444,0.0006614499],"category_scores_gemma":[0.000016797308,0.00023966444,0.00014684802,0.0002645996,0.00021049152,0.0004422487,0.0000015072101,0.00025435485,0.00036322486],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0007151205,0.0013410035,0.0005820129,0.00027138673,0.00009893579,0.000013199648,0.0035186957,0.0032952977,0.98286027,0.0006184763,0.003559125,0.0031264832],"study_design_scores_gemma":[0.0013153491,0.0012732702,0.0007638823,0.000425594,0.00010984807,0.000040681138,0.0014738207,0.20817189,0.7836338,0.0000923107,0.0020461832,0.00065333577],"about_ca_topic_score_codex":0.0006496585,"about_ca_topic_score_gemma":0.003785089,"teacher_disagreement_score":0.50963265,"about_ca_system_score_codex":0.00019428736,"about_ca_system_score_gemma":0.00011452913,"threshold_uncertainty_score":0.97732323},"labels":[],"label_agreement":null},{"id":"W2887351321","doi":"10.1557/proc-863-b9.7","title":"Characterization of Temporary Extrusion Failures in Quarter-Micron Copper Interconnects","year":2005,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Extrusion; Electromigration; Copper interconnect; Failure mode and effects analysis; Void (composites); Copper; Dissolution; Composite material; Metallurgy","score_opus":0.009281660038167092,"score_gpt":0.23020862835280406,"score_spread":0.22092696831463698,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2887351321","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9958712,0.0000366049,0.00002062556,0.0020068758,0.00022167822,0.00027368014,0.0000097404745,0.00006700771,0.0014926075],"genre_scores_gemma":[0.99921817,0.000012749504,0.00028982607,0.00017512596,0.00012187874,0.000020005229,0.000008439654,0.000015931635,0.00013788498],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987194,0.000016225758,0.0004688638,0.00036656298,0.00018302925,0.0002459145],"domain_scores_gemma":[0.9994996,0.000023315439,0.00017232606,0.000121784025,0.00012619141,0.00005678208],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000441748,0.000158615,0.0002559486,0.00015266331,0.000046889723,0.00006568327,0.00023761948,0.00011004729,0.00046976],"category_scores_gemma":[0.00006521236,0.00013067463,0.000053564803,0.00018053039,0.00008849393,0.0006848488,0.00010557869,0.000115112336,0.00007519235],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000537339,0.00012256195,0.012383459,0.00009967807,0.0000016429142,5.979128e-7,0.0024309892,0.0000010325348,0.98268366,0.00019769988,0.0007102533,0.0013146935],"study_design_scores_gemma":[0.0004186804,0.00015452356,0.020383358,0.00022845941,0.0000041665444,0.000007608364,0.00064285187,0.0002353251,0.9715744,0.00012418916,0.006038309,0.00018807358],"about_ca_topic_score_codex":0.0001309359,"about_ca_topic_score_gemma":0.000053002477,"teacher_disagreement_score":0.011109203,"about_ca_system_score_codex":0.00008228938,"about_ca_system_score_gemma":0.000028952623,"threshold_uncertainty_score":0.53287566},"labels":[],"label_agreement":null},{"id":"W2907399282","doi":"10.1002/pssa.201800728","title":"Characteristics of Ultrathin Ni Films","year":2019,"lang":"en","type":"article","venue":"physica status solidi (a)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Ministero degli Affari Esteri e della Cooperazione Internazionale","keywords":"Materials science; X-ray reflectivity; Refractive index; Thin film; Molar absorptivity; X-ray photoelectron spectroscopy; Sputtering; Ellipsometry; Nickel; Optics; Metal; Reflection (computer programming); Oxide; Optoelectronics; Analytical Chemistry (journal); Metallurgy; Chemical engineering; Nanotechnology; Chemistry","score_opus":0.009669618505424618,"score_gpt":0.24753128631735913,"score_spread":0.23786166781193452,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2907399282","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9930044,0.000024093228,0.000025996296,0.00009014281,0.0008734315,0.00018094627,0.00017788321,0.00004897005,0.0055741365],"genre_scores_gemma":[0.99894154,0.000022250442,0.00030416122,0.000074014526,0.000078089484,0.0000067878377,0.000014220644,0.000014948744,0.00054396584],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988309,0.0000474293,0.00027078294,0.00028577095,0.00022216211,0.0003429134],"domain_scores_gemma":[0.9990909,0.000103742204,0.00014738656,0.0004647497,0.00011032154,0.00008287522],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0001532678,0.00013234428,0.00031633282,0.000022649449,0.000038645103,0.000034590663,0.00020897739,0.00004385701,0.0014523411],"category_scores_gemma":[0.00006219468,0.000104836115,0.000087509216,0.00008464591,0.00010053245,0.00013452943,0.00008002356,0.000101313184,0.0008283256],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003715532,0.00017036649,0.0031629037,0.00009417566,0.0000063643133,9.122201e-7,0.0008256683,0.000007891884,0.9923075,0.0017052765,0.0012410213,0.00044080435],"study_design_scores_gemma":[0.0004481209,0.00031191244,0.04096531,0.00007391273,0.000024204568,0.00000204375,0.0002827147,0.0005204395,0.950015,0.0012391028,0.005803104,0.0003141206],"about_ca_topic_score_codex":0.00020150511,"about_ca_topic_score_gemma":0.0000040548643,"teacher_disagreement_score":0.04229245,"about_ca_system_score_codex":0.000023104729,"about_ca_system_score_gemma":0.00006959691,"threshold_uncertainty_score":0.99994963},"labels":[],"label_agreement":null},{"id":"W2921972586","doi":"10.6000/2369-3355.2018.05.03.1","title":"New Simple Modification of Dip, Spray and Cathodic Electrodeposition Coating Methods for Wire Coating (3D Coating)","year":2018,"lang":"en","type":"article","venue":"Journal of Coating Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Coating; Cathodic protection; Materials science; Dip-coating; Composite material; Metallurgy; Electrochemistry; Chemistry; Electrode","score_opus":0.021933020620744877,"score_gpt":0.3578377713867886,"score_spread":0.3359047507660437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2921972586","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.79796016,0.00023314172,0.20044084,0.0008703967,0.0001892617,0.00018491456,0.0000024837666,0.000030820116,0.00008795064],"genre_scores_gemma":[0.7570246,0.000014256814,0.24279688,0.000042904965,0.000102673315,0.000004132332,3.9350545e-7,0.000007359815,0.000006817644],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981287,0.00009786048,0.000762035,0.0003467217,0.0003065849,0.0003580826],"domain_scores_gemma":[0.99666375,0.0005257849,0.0010967137,0.00022592807,0.0013869726,0.00010087162],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.005280706,0.00014063831,0.0003775042,0.00037114846,0.0006027582,0.00012237736,0.00037589553,0.00013149591,0.000011948369],"category_scores_gemma":[0.004800653,0.00011067072,0.000037312064,0.00070011854,0.0011437453,0.00045118874,0.00014336247,0.00020629975,5.3033017e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024578056,0.000019527193,0.0011600804,0.00004009782,0.0000026462099,3.9227487e-7,0.00059800537,0.000005761037,0.9145563,0.0019885094,0.000037782745,0.081566274],"study_design_scores_gemma":[0.00039269295,0.0012013467,0.00033458028,0.00013711856,0.000035160574,0.00016377689,0.0009771335,0.0049803914,0.9821608,0.009340329,0.00015336323,0.00012330586],"about_ca_topic_score_codex":0.00008753472,"about_ca_topic_score_gemma":0.000026118258,"teacher_disagreement_score":0.08144297,"about_ca_system_score_codex":0.0000767133,"about_ca_system_score_gemma":0.00039709712,"threshold_uncertainty_score":0.5747177},"labels":[],"label_agreement":null},{"id":"W2942656638","doi":"10.5006/c2018-11023","title":"Effect of Soil and Disbondment Configuration on CP Penetration into Coating Disbondment","year":2018,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Natural Resources Canada","funders":"","keywords":"Penetration (warfare); Coating; Materials science; Composite material; Engineering","score_opus":0.007851708352016241,"score_gpt":0.27441353222589865,"score_spread":0.2665618238738824,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2942656638","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9922127,0.0000135372775,0.0014226936,0.00029829895,0.00031086674,0.00027630516,0.000002381347,0.000027674349,0.0054355515],"genre_scores_gemma":[0.9995409,0.000003051591,0.00013736902,0.00007112163,0.00007361879,0.000015995698,0.0000044547255,0.000004742993,0.00014874185],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991311,0.00011458061,0.00023202154,0.00023457743,0.00017831847,0.00010941437],"domain_scores_gemma":[0.9994605,0.00018174636,0.000080746955,0.00017189194,0.00006246376,0.000042661173],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006913659,0.000098101715,0.00014157976,0.000027101436,0.000106044376,0.000050580922,0.000061204795,0.00003851286,0.00064167153],"category_scores_gemma":[0.000116548064,0.00006181359,0.000024959272,0.00003860705,0.00014517379,0.00009889727,0.000039684823,0.00003278758,0.000047103247],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010336208,0.00003610827,0.0006057052,0.000067060966,0.0000010644305,1.7153367e-7,0.00060614827,0.000010559338,0.9919634,0.0015485828,0.00014668195,0.0049111727],"study_design_scores_gemma":[0.0003169555,0.0023002215,0.0011201426,0.000047273825,0.000010084892,7.236718e-7,0.000079902165,0.00093822496,0.99477595,0.0002400176,0.00009513994,0.000075382806],"about_ca_topic_score_codex":0.0004442663,"about_ca_topic_score_gemma":0.00026038341,"teacher_disagreement_score":0.0073282127,"about_ca_system_score_codex":0.000041913383,"about_ca_system_score_gemma":0.000014037008,"threshold_uncertainty_score":0.7025853},"labels":[],"label_agreement":null},{"id":"W2953268685","doi":"10.1002/masy.200450511","title":"Synthesis and lithographic applications of highly metallized cluster‐based polyferrocenylsilanes","year":2004,"lang":"en","type":"article","venue":"Macromolecular Symposia","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Materials science; Resist; Reactive-ion etching; Etching (microfabrication); Ferromagnetism; Electron-beam lithography; Lithography; Ceramic; Cobalt; Photolithography; Pyrolytic carbon; Nanoparticle; Dry etching; Nanotechnology; Optoelectronics; Pyrolysis; Chemical engineering; Composite material; Metallurgy","score_opus":0.005219152369602254,"score_gpt":0.22348537557269155,"score_spread":0.2182662232030893,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2953268685","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98158675,0.0010915846,0.015277365,0.0008070075,0.0000661681,0.00042893458,0.00004282518,0.000084062835,0.0006153263],"genre_scores_gemma":[0.99602395,0.000030916955,0.0035860501,0.00016459628,0.000018445147,0.00013591789,0.0000056371823,0.000019817986,0.000014672591],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998753,0.00009166113,0.00031944638,0.00039481936,0.00021395422,0.0002271239],"domain_scores_gemma":[0.99913096,0.00009736155,0.00010801374,0.0004723676,0.000086432985,0.00010488752],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029918336,0.00017373326,0.00029787963,0.000116901996,0.000104952036,0.00005952823,0.00025775572,0.00008803427,0.00008692957],"category_scores_gemma":[0.000050535968,0.00014244766,0.000126376,0.00024128184,0.00025435447,0.000056924197,0.00008140264,0.00006432585,0.000024172858],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040840365,0.0001494407,0.00021353143,0.000133831,0.000020588886,0.0000071684203,0.00010821978,0.00010925482,0.99519974,0.0034948494,0.000004849599,0.0005176702],"study_design_scores_gemma":[0.00058871583,0.00008415154,0.0007920907,0.00007631686,0.0001051312,0.00002707774,0.000030278057,0.00012649996,0.99495405,0.0015427787,0.0014727232,0.00020020088],"about_ca_topic_score_codex":0.0003399013,"about_ca_topic_score_gemma":0.00004735288,"teacher_disagreement_score":0.01443722,"about_ca_system_score_codex":0.0000223176,"about_ca_system_score_gemma":0.000057596455,"threshold_uncertainty_score":0.58088475},"labels":[],"label_agreement":null},{"id":"W2988153346","doi":"","title":"Post-porosity Plasma protection (P4): a promising strategy against v-UV damage in porous, low-k materials","year":2015,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Porosity; Materials science; Plasma; Porous medium; Composite material; Chemical engineering; Engineering; Physics","score_opus":0.020144205247501552,"score_gpt":0.23954071069350133,"score_spread":0.21939650544599978,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2988153346","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9840487,0.0001546613,0.0014657566,0.0026257636,0.0007887607,0.0016785787,0.0003663136,0.00032191188,0.008549513],"genre_scores_gemma":[0.9930133,0.000070745285,0.004189837,0.00006154893,0.000054031334,0.0001875715,0.00048537977,0.00006333212,0.0018742391],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.98984057,0.006523334,0.0010814652,0.0013604731,0.00058902643,0.00060514925],"domain_scores_gemma":[0.9935179,0.00036515787,0.0008074705,0.0023089168,0.0027501415,0.00025044673],"candidate_categories":["metaepi_narrow","scholarly_communication"],"consensus_categories":[],"category_scores_codex":[0.010714988,0.0005305071,0.0007201157,0.0002517681,0.0003187976,0.0011161421,0.001379996,0.0005758167,0.0005109966],"category_scores_gemma":[0.002331071,0.0005113225,0.0001498177,0.00028570095,0.0003448694,0.00035990938,0.0018845195,0.00081482483,0.000117932505],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000108538115,0.0008675457,0.00030893768,0.0005735305,0.000019375339,0.000020394971,0.00636655,0.00040832287,0.9837209,0.0012443411,0.00022589261,0.0061356914],"study_design_scores_gemma":[0.0009130074,0.000002894992,0.0050415215,0.0031681955,0.000027949905,0.000016551912,0.00029517984,0.004299071,0.98254377,0.0025457293,0.00041740196,0.0007287346],"about_ca_topic_score_codex":0.011961334,"about_ca_topic_score_gemma":0.01062564,"teacher_disagreement_score":0.008964575,"about_ca_system_score_codex":0.00056191103,"about_ca_system_score_gemma":0.0008632965,"threshold_uncertainty_score":0.9999208},"labels":[],"label_agreement":null},{"id":"W2999864622","doi":"","title":"Interaction of humidity with plasma-damaged porous low-k","year":2018,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Humidity; Plasma; Materials science; Porosity; Composite material; Physics; Thermodynamics; Nuclear physics","score_opus":0.015225072285049825,"score_gpt":0.2410400876668896,"score_spread":0.2258150153818398,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2999864622","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96383417,0.00009589282,0.011050259,0.0015836267,0.00070384366,0.0004372683,0.00010310137,0.00018112974,0.022010723],"genre_scores_gemma":[0.98443663,0.00007652808,0.013305313,0.000032080345,0.000044222612,0.000039780043,0.00014210946,0.0000378199,0.0018855362],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99423224,0.0034524805,0.00065048394,0.000869679,0.00047412718,0.00032100984],"domain_scores_gemma":[0.99270046,0.0010432719,0.0008223925,0.0023430432,0.0029486367,0.0001421884],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0051645217,0.00033968413,0.0004968166,0.0001398195,0.00024899706,0.00027274436,0.0011745401,0.00028127473,0.0012586855],"category_scores_gemma":[0.0012881616,0.0002852008,0.00016135679,0.0001983932,0.00067112077,0.00018829886,0.0013169799,0.00057147996,0.000094603995],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0007525561,0.005415274,0.0096512595,0.0032027722,0.00032612297,0.0000315268,0.042984433,0.00071160623,0.88432664,0.015067665,0.0068601896,0.030669933],"study_design_scores_gemma":[0.0005000655,0.000002801086,0.003363349,0.0029243804,0.00005920626,0.00001766536,0.00021760943,0.003186415,0.9859817,0.0012017506,0.0021257438,0.0004193141],"about_ca_topic_score_codex":0.0027981577,"about_ca_topic_score_gemma":0.0033304843,"teacher_disagreement_score":0.101655036,"about_ca_system_score_codex":0.00015628999,"about_ca_system_score_gemma":0.00031958395,"threshold_uncertainty_score":0.99996},"labels":[],"label_agreement":null},{"id":"W3034467193","doi":"","title":"Charge ordering in quarter-filled ladder systems coupled to the lattice","year":2004,"lang":"en","type":"article","venue":"APS","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Quarter (Canadian coin); Charge (physics); Lattice (music); Physics; Condensed matter physics; Quantum mechanics; History","score_opus":0.01348259517256665,"score_gpt":0.24617560261098947,"score_spread":0.23269300743842283,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3034467193","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9934067,0.00012094576,0.00024781603,0.003577203,0.0010761562,0.00037245042,0.0000055617807,0.000050964223,0.0011422082],"genre_scores_gemma":[0.9991333,0.0000037688164,0.0000881319,0.00037807916,0.00011166236,0.000053689688,9.3572964e-7,0.00000872292,0.00022170776],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9991038,0.000049647533,0.00021343323,0.00023477158,0.00014641506,0.0002519544],"domain_scores_gemma":[0.9994584,0.00007675637,0.00003233489,0.00033668923,0.000041591386,0.00005425818],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005783933,0.0000931782,0.0001514071,0.000030453428,0.00008354725,0.000093584335,0.00024577253,0.000040939438,0.00033794553],"category_scores_gemma":[0.00010017056,0.000056220746,0.00002919091,0.00014318324,0.000026786189,0.00007541522,0.00006649059,0.00008163258,0.0010997582],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015963885,0.00048549756,0.0021886826,0.00024788096,0.000026912461,0.000060937837,0.017634787,0.013829944,0.94643724,0.012891228,0.005607242,0.00043002344],"study_design_scores_gemma":[0.023215478,0.0030276706,0.07915555,0.0038205674,0.00022221646,0.00040440375,0.034791373,0.036036965,0.37526378,0.00732424,0.43075904,0.0059787203],"about_ca_topic_score_codex":0.0026777585,"about_ca_topic_score_gemma":0.000961529,"teacher_disagreement_score":0.5711734,"about_ca_system_score_codex":0.00006713236,"about_ca_system_score_gemma":0.00003258601,"threshold_uncertainty_score":0.999678},"labels":[],"label_agreement":null},{"id":"W3087764137","doi":"10.1149/09807.0117ecst","title":"Influence of Glass Surface Modification on Thin Film Copper Electrodes","year":2020,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Copper; Composite material; Microstructure; Transmission electron microscopy; Sheet resistance; Surface modification; Electrode; Hydrofluoric acid; Scanning electron microscope; Microfabrication; Layer (electronics); Metallurgy; Nanotechnology; Chemical engineering; Chemistry","score_opus":0.021980890559213425,"score_gpt":0.25915289509638656,"score_spread":0.23717200453717313,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3087764137","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99037063,0.00003493971,0.0054494343,0.0030314657,0.00009274029,0.00015050576,0.00007850928,0.00008257432,0.00070918055],"genre_scores_gemma":[0.9992484,0.000020300675,0.00039557795,0.00022435706,0.000018815741,0.0000075385824,0.000002860242,0.000008376679,0.00007377349],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99916786,0.000057856356,0.00021588302,0.00024913665,0.00016587554,0.00014341252],"domain_scores_gemma":[0.99947596,0.00009815007,0.000053475887,0.00021376852,0.00008641445,0.00007223489],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013560636,0.000092347436,0.00013576222,0.000017186043,0.000101052945,0.00002266451,0.00016735651,0.00005539374,0.0003904115],"category_scores_gemma":[0.00004466292,0.00007717482,0.000062004336,0.00015415373,0.00008417399,0.00014865343,0.0000037306359,0.00012983796,0.00016688716],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000036998164,0.00005675399,0.000040939132,0.000019060722,0.0000036038607,1.9018475e-7,0.00068656617,0.39407203,0.60471106,0.0001737608,0.00016044569,0.000038589005],"study_design_scores_gemma":[0.00017322591,0.0001860299,0.0021764003,0.00001885289,0.000016439915,0.0000010518173,0.00009540215,0.011773389,0.9840038,0.00014987272,0.0013018323,0.00010370485],"about_ca_topic_score_codex":0.00017523575,"about_ca_topic_score_gemma":0.000026066622,"teacher_disagreement_score":0.38229865,"about_ca_system_score_codex":0.000030503712,"about_ca_system_score_gemma":0.000049792146,"threshold_uncertainty_score":0.42747322},"labels":[],"label_agreement":null},{"id":"W3088682504","doi":"10.1149/09807.0097ecst","title":"(Invited) Improved Copper Electrode Integration for Thin Film Electronics on Glass","year":2020,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Annealing (glass); Alloy; Electrode; Electrical resistivity and conductivity; Layer (electronics); Copper; Thin film; Metallurgy; Stack (abstract data type); Composite material; Nanotechnology; Electrical engineering; Chemistry","score_opus":0.017317980840918453,"score_gpt":0.25067526943243196,"score_spread":0.2333572885915135,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3088682504","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.40514976,0.00014105989,0.5271825,0.06380107,0.0009209651,0.0012799985,0.00032778352,0.00044955782,0.0007472779],"genre_scores_gemma":[0.99402297,0.00002439669,0.0016754761,0.0037738583,0.00011970718,0.0001257204,0.000021506761,0.000024017338,0.00021238123],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988364,0.000047471778,0.00026750108,0.0003937192,0.0001277746,0.00032711253],"domain_scores_gemma":[0.99940085,0.0001301122,0.00005480937,0.00020934238,0.00009392003,0.00011094652],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018752279,0.00016212321,0.00019096366,0.00003357431,0.00024304619,0.00008627848,0.00017661563,0.00010543837,0.0004726547],"category_scores_gemma":[0.0000821353,0.00013049137,0.00014556512,0.00014485967,0.000045279972,0.0001626991,0.0000037286625,0.00025876754,0.00007040561],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00024393566,0.00012115862,0.0000010840567,0.00002559512,0.00001641723,2.7962233e-7,0.00071621954,0.0028103467,0.98855096,0.00033717588,0.006162665,0.0010141637],"study_design_scores_gemma":[0.0005098024,0.0009404993,0.000016026119,0.000007909544,0.00007455505,0.0000023602618,0.0001513684,0.0897414,0.86847806,0.0004422747,0.039439563,0.0001961695],"about_ca_topic_score_codex":0.00003818473,"about_ca_topic_score_gemma":0.00024552373,"teacher_disagreement_score":0.58887315,"about_ca_system_score_codex":0.00011611436,"about_ca_system_score_gemma":0.000060277387,"threshold_uncertainty_score":0.53212833},"labels":[],"label_agreement":null},{"id":"W3093939401","doi":"10.1116/6.0000476","title":"Electromigration simulation and design considerations for integrated circuit power grids","year":2020,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; Semiconductor Research Corporation","keywords":"Electromigration; Reliability (semiconductor); Scaling; Reliability engineering; Computer science; Electronic engineering; Power (physics); Voltage; Grid; Electronic circuit; Integrated circuit; Electrical engineering; Materials science; Engineering physics; Engineering; Physics","score_opus":0.043906172779094275,"score_gpt":0.2636865563665477,"score_spread":0.21978038358745342,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3093939401","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9193396,0.003953398,0.07017321,0.0058722403,0.0001411805,0.00042375803,0.000006250053,0.00008659394,0.0000037859443],"genre_scores_gemma":[0.99438095,0.00024349535,0.0050977394,0.00020772571,0.00003778864,0.000017342558,5.445848e-7,0.000012642938,0.0000017466042],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9982217,0.00006212383,0.0006038482,0.0004473922,0.00022534808,0.00043960146],"domain_scores_gemma":[0.99836755,0.00008004858,0.00047993934,0.000121965495,0.0008607382,0.00008975015],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0024756694,0.0002160365,0.00042810806,0.00046480063,0.0006463598,0.0002588479,0.00023342806,0.00025595241,0.000017482302],"category_scores_gemma":[0.00092208915,0.00016917755,0.000023753562,0.00048272603,0.0010036883,0.00053236575,0.0000877651,0.000264068,6.1095164e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015750463,0.000036848436,0.000025267207,0.000052058454,0.000013346828,0.0000012147229,0.00046790915,0.00003475635,0.9907628,0.0039740955,0.000015809861,0.004458337],"study_design_scores_gemma":[0.0007815862,0.0018155145,0.000027611895,0.0000677635,0.00006737763,0.00013007595,0.0002681973,0.00088955264,0.9583321,0.03698234,0.00044741627,0.0001904273],"about_ca_topic_score_codex":0.0000017384191,"about_ca_topic_score_gemma":0.0000037732916,"teacher_disagreement_score":0.07504139,"about_ca_system_score_codex":0.00013997755,"about_ca_system_score_gemma":0.0006629965,"threshold_uncertainty_score":0.68988603},"labels":[],"label_agreement":null},{"id":"W3118188372","doi":"10.1116/6.0000617","title":"Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks","year":2020,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Voltage drop; Interconnection; Monte Carlo method; Power network design; Voltage; Drop (telecommunication); Grid; Electronic circuit; Electronic engineering; Materials science; Computer science; Electrical engineering; Engineering","score_opus":0.023027731940211467,"score_gpt":0.2609483451757494,"score_spread":0.23792061323553793,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3118188372","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9226598,0.002234742,0.06717492,0.0070747873,0.00019658857,0.0005827827,0.0000059566796,0.000066997214,0.0000033925874],"genre_scores_gemma":[0.9925915,0.00017767245,0.0067253103,0.00037155347,0.00006708084,0.000047622158,0.0000012429824,0.000017307122,7.308462e-7],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9977052,0.000048317186,0.00074704416,0.0005199161,0.00031394785,0.0006655698],"domain_scores_gemma":[0.9985372,0.00003719698,0.00059872196,0.00018036332,0.0005720337,0.00007452435],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0028188685,0.00026838575,0.00057427865,0.000435913,0.00042084715,0.00018846673,0.0005549902,0.00030344195,0.000008829268],"category_scores_gemma":[0.00017302533,0.00021986064,0.000045539466,0.00082684204,0.00086575974,0.00039405032,0.00013335735,0.0004885936,4.03224e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003583427,0.00016450453,0.0002455025,0.00008195953,0.000010435212,0.0000014805631,0.000119504686,0.00006230583,0.98723364,0.0021495088,0.000008747648,0.009564095],"study_design_scores_gemma":[0.0018760506,0.00258021,0.00034552443,0.00014566189,0.000051127565,0.000038205693,0.000118899276,0.0017298062,0.9878852,0.0045406893,0.00040978714,0.00027888207],"about_ca_topic_score_codex":0.000005703501,"about_ca_topic_score_gemma":0.00001709303,"teacher_disagreement_score":0.06993165,"about_ca_system_score_codex":0.00031077059,"about_ca_system_score_gemma":0.0010077979,"threshold_uncertainty_score":0.8965657},"labels":[],"label_agreement":null},{"id":"W3137700632","doi":"10.5555/1326073.3256496","title":"Session details: Advances in model order reduction techniques for interconnect analysis","year":2007,"lang":"en","type":"article","venue":"International Conference on Computer Aided Design","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Session (web analytics); Computer science; Reduction (mathematics); Model order reduction; Interconnection; Computer architecture; Reliability engineering; Telecommunications; Engineering; Algorithm; World Wide Web; Mathematics","score_opus":0.06004631226412029,"score_gpt":0.3506074278184081,"score_spread":0.2905611155542878,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3137700632","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.07090304,0.000031403935,0.92585367,0.0005299151,0.0008686847,0.00045087622,0.000016369797,0.00012608628,0.0012199507],"genre_scores_gemma":[0.83896554,0.00004607976,0.16041148,0.00020439246,0.0001706847,0.00006458327,0.000018392891,0.000012298169,0.000106558175],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99802995,0.00010660809,0.0005970343,0.0006324835,0.00033385796,0.000300087],"domain_scores_gemma":[0.9985272,0.00032824176,0.000184194,0.0002819996,0.00060569163,0.00007265536],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0015921127,0.00022062298,0.00032768518,0.00060476206,0.00007543851,0.00016199263,0.0004670471,0.000117687516,0.00026767282],"category_scores_gemma":[0.00011793997,0.00018168431,0.00014427915,0.00033406817,0.00007999758,0.00055964355,0.00009067826,0.00015921456,0.000019804802],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0028778352,0.00091129134,0.00041597785,0.00007055163,0.00020715667,0.000022186645,0.001449834,0.16981745,0.43490776,0.055133965,0.001031898,0.3331541],"study_design_scores_gemma":[0.00042529815,0.00033087455,0.00014227683,0.00014881293,0.000036600544,0.000006998071,0.000103790466,0.7987036,0.17916125,0.020209828,0.0004458362,0.00028481343],"about_ca_topic_score_codex":0.00004529666,"about_ca_topic_score_gemma":0.000110510744,"teacher_disagreement_score":0.7680625,"about_ca_system_score_codex":0.00021585885,"about_ca_system_score_gemma":0.000090115114,"threshold_uncertainty_score":0.74088717},"labels":[],"label_agreement":null},{"id":"W3163941397","doi":"","title":"Patterning Platinum using CMP and plasma etching industrially compatible processes","year":2019,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Platinum; Etching (microfabrication); Plasma; Plasma etching; Materials science; Reactive-ion etching; Nanotechnology; Computer science; Chemistry; Catalysis; Physics; Organic chemistry","score_opus":0.030688973877463464,"score_gpt":0.253146134811115,"score_spread":0.2224571609336515,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3163941397","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96382904,0.00041790752,0.027248902,0.0015206471,0.000637239,0.00055400596,0.000097487486,0.00017944926,0.005515344],"genre_scores_gemma":[0.97865766,0.00009035884,0.020134425,0.000056326353,0.000049788567,0.000021641856,0.00010297568,0.000045310502,0.00084148085],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99483615,0.002702046,0.00064970437,0.0009892754,0.00042186936,0.00040097456],"domain_scores_gemma":[0.9945009,0.0019276728,0.00068269146,0.0013513167,0.0013812647,0.00015618502],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0049838186,0.0003792444,0.0005575832,0.00014776904,0.00041234674,0.0009854051,0.0009465679,0.00037514936,0.00031687418],"category_scores_gemma":[0.002315476,0.00035890017,0.000098454104,0.00019923915,0.00023164069,0.00024143163,0.0021980605,0.00080840697,0.000037402013],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00023147766,0.0020619975,0.11721612,0.009058626,0.00032152582,0.00004540363,0.1144166,0.017425694,0.66029024,0.009457596,0.0016474267,0.067827284],"study_design_scores_gemma":[0.0024707324,0.0000034850134,0.0049872436,0.018876888,0.00020316923,0.000086584856,0.0012361571,0.20980486,0.7516492,0.0039062914,0.004659182,0.002116203],"about_ca_topic_score_codex":0.003355287,"about_ca_topic_score_gemma":0.0014499347,"teacher_disagreement_score":0.19237916,"about_ca_system_score_codex":0.00013171592,"about_ca_system_score_gemma":0.00061815744,"threshold_uncertainty_score":0.9998863},"labels":[],"label_agreement":null},{"id":"W3183308010","doi":"","title":"The Effect of Large-Scale Power on Very-Small-Scale Structure in CDM Simulations","year":2005,"lang":"en","type":"article","venue":"Journal of the Royal Astronomical Society of Canada","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Scale (ratio); Environmental science; Scale effects; Atmospheric sciences; Physics; Geography; Cartography","score_opus":0.0024044357544553167,"score_gpt":0.20014348048437353,"score_spread":0.1977390447299182,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3183308010","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99600345,0.00005912601,0.000021603712,0.0032147127,0.0004797848,0.00010374324,0.000066320266,0.000001274991,0.00004998466],"genre_scores_gemma":[0.9992918,4.349372e-7,0.00040839196,0.00007796044,0.00011740469,4.1250144e-7,3.0368105e-7,0.0000059774206,0.0000973239],"study_design_codex":"simulation_or_modeling","study_design_gemma":"observational","domain_scores_codex":[0.99876004,0.00013563142,0.00048293397,0.0001011005,0.00029023088,0.00023003707],"domain_scores_gemma":[0.9988661,0.00045907535,0.0003248094,0.00021137856,0.00006378996,0.000074871736],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00059296936,0.00010644046,0.00028259543,0.000008014452,0.00012378207,0.000017741822,0.0004379517,0.0000606152,0.00023519406],"category_scores_gemma":[0.0000710187,0.00005263005,0.00028493264,0.00004851635,0.000123567,0.000036466536,0.0000876474,0.0002997368,3.9206384e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040649556,0.00009975549,0.04299007,0.00003006016,0.000062668834,1.8587977e-7,0.00048716168,0.9100339,0.025650438,0.000017481974,0.019419726,0.0008020801],"study_design_scores_gemma":[0.0042026658,0.0013674493,0.48927012,0.00031046884,0.00012141781,0.0000034892842,0.0010339184,0.06229452,0.4070554,0.0001520252,0.033806972,0.0003815436],"about_ca_topic_score_codex":0.006734113,"about_ca_topic_score_gemma":0.10715759,"teacher_disagreement_score":0.84773934,"about_ca_system_score_codex":0.00035950541,"about_ca_system_score_gemma":0.00030109292,"threshold_uncertainty_score":0.99988014},"labels":[],"label_agreement":null},{"id":"W3201033383","doi":"10.33774/chemrxiv-2021-1kgg7","title":"Tuning the Dielectric Response in a Nanocomposite Material through Nanoparticle Morphology","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Western Canada Research Grid; University of Victoria","keywords":"Materials science; Dielectric; Nanocomposite; Nanoparticle; Chemical physics; Polarization (electrochemistry); Molecular dynamics; Periodic boundary conditions; Nanotechnology; Oxide; Condensed matter physics; Optoelectronics; Boundary value problem; Computational chemistry; Physics; Chemistry; Physical chemistry; Quantum mechanics","score_opus":0.02185536796540981,"score_gpt":0.2789385442757863,"score_spread":0.25708317631037647,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3201033383","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99323934,0.00026008507,0.0001863181,0.0028861598,0.0022414103,0.00044717608,0.000017077597,0.000092766284,0.0006296571],"genre_scores_gemma":[0.99792475,0.000030402703,0.00095308706,0.00058393716,0.00009780898,0.000111802525,0.000008737189,0.00002049717,0.00026898092],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9968254,0.0012382369,0.00052242284,0.0007303459,0.00020293708,0.00048065823],"domain_scores_gemma":[0.99845344,0.0004004971,0.0001247621,0.00089475664,0.00008284782,0.000043723718],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0015863788,0.00025346127,0.00042509078,0.00005692709,0.00013183922,0.00036080924,0.0006378957,0.00025294954,0.0027243022],"category_scores_gemma":[0.00024820544,0.00015835518,0.00012023102,0.00020475355,0.00018190856,0.000104281506,0.0015857175,0.0004204728,0.000076873956],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00074920186,0.0000999556,0.00011987376,0.000033395405,0.000007222343,0.00009358891,0.0019216898,0.00037083655,0.9962351,0.00014590925,0.00013600814,0.000087228116],"study_design_scores_gemma":[0.0002795402,0.00012945842,0.0035508338,0.000096442716,0.000018042962,0.00005799617,0.0003535694,0.0008631016,0.99305195,0.00085661135,0.00047925522,0.0002632202],"about_ca_topic_score_codex":0.002873582,"about_ca_topic_score_gemma":0.00029777267,"teacher_disagreement_score":0.004685397,"about_ca_system_score_codex":0.00015576318,"about_ca_system_score_gemma":0.00024927311,"threshold_uncertainty_score":0.99818736},"labels":[],"label_agreement":null},{"id":"W3214533306","doi":"","title":"PE-CVD with organometallic precursors: contribution of aerosol assisted processes","year":2021,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Montréal","funders":"","keywords":"Organosilicon; Aerosol; Group 2 organometallic chemistry; Chemical engineering; Materials science; Organometallic chemistry; Thin film; Zinc; Nickel; Molecule; Organic chemistry; Catalysis; Inorganic chemistry; Chemistry; Polymer chemistry; Nanotechnology; Metallurgy","score_opus":0.01283184591378959,"score_gpt":0.22831813261867837,"score_spread":0.21548628670488879,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3214533306","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95996743,0.0015998048,0.029790958,0.0027370004,0.00026058924,0.0006719634,0.00013473294,0.0001838633,0.004653648],"genre_scores_gemma":[0.98504984,0.00028591594,0.012399448,0.000029586286,0.000018690174,0.000099163924,0.00053708215,0.00003782328,0.001542465],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9940464,0.0033493105,0.00071127,0.0009777059,0.00055713014,0.0003582011],"domain_scores_gemma":[0.9882579,0.0011856118,0.0008511356,0.0020350586,0.0075167334,0.00015359093],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0038655195,0.0003592308,0.00065050385,0.00011190913,0.00023268815,0.00048184767,0.0010834327,0.00030649157,0.0009022766],"category_scores_gemma":[0.004429928,0.00030149202,0.0001643972,0.0005357088,0.0004961237,0.00020890568,0.0011078932,0.00044540688,0.000020559663],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017994399,0.0036007955,0.0038438237,0.0035596518,0.00027354472,0.000018056178,0.018464861,0.00020014147,0.956093,0.006429461,0.0004084134,0.0069282996],"study_design_scores_gemma":[0.00052378693,0.000001995915,0.0019632278,0.0039978093,0.00010529988,0.000018461065,0.00027325787,0.00041231795,0.9914399,0.00027900396,0.0005889883,0.00039595223],"about_ca_topic_score_codex":0.0011805507,"about_ca_topic_score_gemma":0.0042637284,"teacher_disagreement_score":0.03534689,"about_ca_system_score_codex":0.00014880324,"about_ca_system_score_gemma":0.001004647,"threshold_uncertainty_score":0.99994373},"labels":[],"label_agreement":null},{"id":"W33690698","doi":"10.1371/journal.pone.0247996","title":"Correlation between the Thickness and Variation of Dielectric Conatant on SiOC thin film","year":2009,"lang":"en","type":"article","venue":"The Journal of the Korean Institute of Information and Communication Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Teck Resources; Fondazione Centro Studi Enel; Kungliga Tekniska Högskolan","keywords":"Dielectric; Refractive index; Materials science; Annealing (glass); Thin film; Composite material; Chemical vapor deposition; Optics; Optoelectronics; Nanotechnology","score_opus":0.008272444782447774,"score_gpt":0.2122534416369541,"score_spread":0.20398099685450632,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W33690698","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98275,0.00024309222,0.01383464,0.0023954958,0.00017188514,0.00014517836,0.000005269513,0.000007061092,0.00044738877],"genre_scores_gemma":[0.99924374,0.00032236744,0.00032463903,0.000087946915,0.000014375458,4.9922386e-7,0.0000015640572,0.0000015004395,0.0000033425524],"study_design_codex":"simulation_or_modeling","study_design_gemma":"observational","domain_scores_codex":[0.99921095,0.00007950219,0.00046048046,0.000022291477,0.00017604651,0.000050742605],"domain_scores_gemma":[0.9987619,0.00024850894,0.0005334976,0.00028428243,0.0001548508,0.000016946527],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014472562,0.000060564515,0.000115461604,0.000058129473,0.00014671727,0.000029463496,0.0003252226,0.000034371093,0.000004443845],"category_scores_gemma":[0.00028709872,0.000028417093,0.000030110234,0.00012523578,0.00008459235,0.00052916567,0.00005731326,0.0001871402,5.015018e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00035699044,0.000095728734,0.00062500284,0.00018830776,0.00008731239,1.1685257e-7,0.03332413,0.7709084,0.04551088,0.115700826,0.00022848356,0.032973815],"study_design_scores_gemma":[0.0015851769,0.000603978,0.53085583,0.0010663845,0.00023510789,0.00013461044,0.0013379786,0.41613567,0.038499173,0.0059959027,0.0032737646,0.0002764254],"about_ca_topic_score_codex":0.00003233083,"about_ca_topic_score_gemma":0.0000022036731,"teacher_disagreement_score":0.5302308,"about_ca_system_score_codex":0.000022268867,"about_ca_system_score_gemma":0.000028259155,"threshold_uncertainty_score":0.11588155},"labels":[],"label_agreement":null},{"id":"W4230603972","doi":"10.1149/ma2020-02281934mtgabs","title":"Influence of Glass Surface Modification on Thin Film Copper Electrodes","year":2020,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Sheet resistance; Composite material; Substrate (aquarium); Electrode; Surface roughness; Layer (electronics); Copper; Crystallization; Nanotechnology; Metallurgy; Chemical engineering","score_opus":0.023425681569793997,"score_gpt":0.26414114925187576,"score_spread":0.24071546768208177,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4230603972","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98537505,0.00004536143,0.0000021221447,0.0017466804,0.000103762824,0.00014627316,0.00001963392,0.00009809076,0.012463052],"genre_scores_gemma":[0.9990698,0.000007707114,0.0004919856,0.00031712453,0.00006157106,0.000002805617,0.0000042456227,0.000012814906,0.00003196023],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998624,0.00008180307,0.00040190056,0.0003633599,0.00028875566,0.00024013378],"domain_scores_gemma":[0.99896514,0.00029681952,0.00022869768,0.00026585686,0.00013924539,0.0001042175],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006575509,0.00013431968,0.00019650167,0.000016822589,0.0000847974,0.00004809921,0.0002767657,0.0000784057,0.00004417085],"category_scores_gemma":[0.001304861,0.0001107282,0.000048124355,0.000112430884,0.00008177517,0.00012815544,0.000047845348,0.00016831228,0.00024937053],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003343617,0.00003086799,0.00038579557,0.00003370558,0.0000017428414,9.224845e-7,0.0004098658,0.4543953,0.54429185,0.00001994575,0.00038841847,0.000008148319],"study_design_scores_gemma":[0.00013641866,0.00014183966,0.017542606,0.00009183935,0.0000068830686,0.0000010894463,0.000082681116,0.0041551604,0.97719926,0.00012571414,0.00039333352,0.0001231619],"about_ca_topic_score_codex":0.0004191541,"about_ca_topic_score_gemma":0.00000861802,"teacher_disagreement_score":0.45024014,"about_ca_system_score_codex":0.00003611975,"about_ca_system_score_gemma":0.000061010232,"threshold_uncertainty_score":0.45153648},"labels":[],"label_agreement":null},{"id":"W4231098174","doi":"10.32920/ryerson.14656692","title":"Variable time domain discretization methodology for molecular dynamics simulation of metallic compounds","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Molecular dynamics; Discretization; Work (physics); Computer science; Computation; Variable (mathematics); Time domain; Kinetic energy; Statistical physics; Simulation; Computational chemistry; Mechanical engineering; Chemistry; Algorithm; Physics; Mathematics; Classical mechanics; Engineering","score_opus":0.03537261406876413,"score_gpt":0.32133208087110465,"score_spread":0.2859594668023405,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231098174","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.32277548,0.000060108247,0.6747237,0.00015739966,0.0005146847,0.00049692777,0.00011878431,0.000041852323,0.0011110681],"genre_scores_gemma":[0.60645485,0.000002225107,0.39233956,0.000051374453,0.0000307014,0.000041389914,0.0007084527,0.000020918284,0.00035053838],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9978434,0.00056097604,0.00059418724,0.0005979682,0.0001966012,0.0002068558],"domain_scores_gemma":[0.99767345,0.00088856404,0.00031149967,0.00061377283,0.00046591967,0.000046797304],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0017696675,0.0002176441,0.00065967615,0.00007300343,0.000052238418,0.00009506567,0.00030961624,0.00035468696,0.0012630472],"category_scores_gemma":[0.0005581669,0.00018315914,0.00021385978,0.00010283158,0.00010906765,0.000073073235,0.000541045,0.00013501947,0.000005634399],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000048475522,0.00008648216,0.000009860438,0.00040816166,0.0000545766,7.022726e-7,0.00020184283,0.22814411,0.7337071,0.03723649,0.000015032006,0.00008722165],"study_design_scores_gemma":[0.00029514657,0.00008268415,0.000018385559,0.000092034716,0.00016151709,0.0000020691118,0.00013216304,0.6785548,0.16619731,0.1539905,0.00018377308,0.0002896539],"about_ca_topic_score_codex":0.00027699384,"about_ca_topic_score_gemma":0.000048991227,"teacher_disagreement_score":0.5675097,"about_ca_system_score_codex":0.00018331206,"about_ca_system_score_gemma":0.0002463352,"threshold_uncertainty_score":0.99964994},"labels":[],"label_agreement":null},{"id":"W4231663537","doi":"10.1149/ma2020-02281932mtgabs","title":"(Invited) Improved Copper Electrode Integration for Thin Film Electronics on Glass","year":2020,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Optoelectronics; Alloy; Transistor; Dry etching; Electrical resistivity and conductivity; Etching (microfabrication); Interconnection; Diffusion barrier; Nanotechnology; Layer (electronics); Composite material; Electrical engineering; Voltage; Computer science","score_opus":0.01842807111169205,"score_gpt":0.25583824121521326,"score_spread":0.23741017010352122,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231663537","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9771157,0.00009647892,0.00014121583,0.01607791,0.00044541643,0.0005438485,0.000038304224,0.00023415565,0.0053069945],"genre_scores_gemma":[0.99287736,0.000009007285,0.0018918447,0.0046859933,0.00034255124,0.00004332828,0.00002876415,0.000033629713,0.00008754304],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981519,0.00006575322,0.00048183146,0.0005574122,0.00021797515,0.0005251121],"domain_scores_gemma":[0.9988466,0.00037237807,0.00022093812,0.00025696759,0.00014759372,0.00015550578],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00083880103,0.00022861292,0.00026919146,0.000032248627,0.00020015647,0.00017161354,0.0002845666,0.00014453361,0.00005701774],"category_scores_gemma":[0.0020647761,0.00018168498,0.00011149215,0.000106602885,0.000044318607,0.00013988468,0.00004329011,0.00032592245,0.00010485902],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021776142,0.000067987865,0.000010324693,0.00004503481,0.000008089699,0.000001292713,0.0005271458,0.0084264465,0.9771701,0.00004194667,0.013271804,0.00021207708],"study_design_scores_gemma":[0.00039344595,0.0006983029,0.00013345672,0.000036738198,0.000030980602,0.000002125395,0.00011686429,0.03245905,0.95208824,0.0003554195,0.013458733,0.00022662123],"about_ca_topic_score_codex":0.00009182146,"about_ca_topic_score_gemma":0.00008070869,"teacher_disagreement_score":0.025081826,"about_ca_system_score_codex":0.00013218631,"about_ca_system_score_gemma":0.00007272342,"threshold_uncertainty_score":0.74088985},"labels":[],"label_agreement":null},{"id":"W4231816337","doi":"10.1149/ma2009-01/24/982","title":"The Effect of Trench Sidewall Conformality on Cu Electroplating Uniformity.","year":2009,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mitel (Canada)","funders":"","keywords":"Trench; Electroplating; Materials science; Geology; Computer science; Composite material","score_opus":0.008351779551137292,"score_gpt":0.2542649779908166,"score_spread":0.2459131984396793,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231816337","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.88635105,0.00005344261,7.6285414e-7,0.00035502893,0.00028242078,0.00018323788,0.0000039133542,0.00006776525,0.112702355],"genre_scores_gemma":[0.999649,0.000004842561,0.000073545605,0.00006436404,0.000091814254,0.0000034171999,0.000002143793,0.000006959628,0.00010395417],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99826795,0.00016607938,0.00055486447,0.00025071178,0.00033310128,0.00042726478],"domain_scores_gemma":[0.9976062,0.001511123,0.0003320948,0.00039538732,0.00007559315,0.000079595586],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0028266525,0.0001777645,0.00025679858,0.000030816966,0.0003281389,0.00010148344,0.00030718895,0.00008489303,0.0000350883],"category_scores_gemma":[0.0017279614,0.00010171572,0.000102249665,0.00009719865,0.000098380566,0.0001094096,0.00003643601,0.00024748978,0.000056363602],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00025464565,0.000060195558,0.0020845865,0.00005650727,0.000008472978,0.000006666013,0.00028159007,0.0049664383,0.98532534,0.00013066069,0.00034732663,0.00647759],"study_design_scores_gemma":[0.00030273243,0.0011101145,0.0238998,0.000116836156,0.000012904014,0.000007831207,0.000059341277,0.00031633847,0.97313327,0.00037479412,0.0005369588,0.00012909964],"about_ca_topic_score_codex":0.00050443277,"about_ca_topic_score_gemma":0.000073512,"teacher_disagreement_score":0.11329789,"about_ca_system_score_codex":0.000056739747,"about_ca_system_score_gemma":0.00004241223,"threshold_uncertainty_score":0.41478467},"labels":[],"label_agreement":null},{"id":"W4233374653","doi":"10.1149/ma2010-01/25/1278","title":"Recrystallization of Electrodeposited Copper-Silver Thin Films","year":2010,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Recrystallization (geology); Copper; Metallurgy; Materials science; Thin film; Geology; Nanotechnology; Petrology","score_opus":0.010181734902345578,"score_gpt":0.24209570395327878,"score_spread":0.2319139690509332,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4233374653","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95208925,0.000031194562,0.0000058564938,0.00016627953,0.0008677904,0.00013977362,0.000008585538,0.00010174029,0.046589546],"genre_scores_gemma":[0.9965655,0.0000042921006,0.0030493906,0.000055320732,0.000092295486,0.0000045191796,0.000009796807,0.000016491234,0.00020237263],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987015,0.000052171636,0.00043563446,0.00029328122,0.00025246953,0.0002649433],"domain_scores_gemma":[0.9989723,0.00018503793,0.00023876554,0.00034026877,0.00018271219,0.00008093062],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009613668,0.00012846322,0.00018387316,0.00004833304,0.00010648978,0.000063006766,0.00023063802,0.00013726357,0.00048328142],"category_scores_gemma":[0.0009037843,0.000106000945,0.000059351063,0.000118805845,0.000090945185,0.00013636755,0.00005335001,0.0002446531,0.0000762384],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023809363,0.00007766796,0.0008642848,0.000037098365,0.000003486622,0.0000023561024,0.0003017764,0.002947008,0.994518,0.000031088446,0.0011382445,0.00005518345],"study_design_scores_gemma":[0.00016330015,0.000057130583,0.006985144,0.00006236927,0.000011046853,0.000010284643,0.000047948743,0.0007697257,0.9904415,0.00019511626,0.0011273115,0.00012909622],"about_ca_topic_score_codex":0.000541233,"about_ca_topic_score_gemma":0.00017618696,"teacher_disagreement_score":0.046387173,"about_ca_system_score_codex":0.000015949916,"about_ca_system_score_gemma":0.000059482987,"threshold_uncertainty_score":0.52915925},"labels":[],"label_agreement":null},{"id":"W4234782056","doi":"10.1149/ma2005-01/30/1201","title":"Development of a CuFe2O4 Interconnect Coating","year":2006,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University; University of Toronto","funders":"","keywords":"Interconnection; Coating; Materials science; Business; Engineering; Telecommunications; Nanotechnology","score_opus":0.01805107291105392,"score_gpt":0.2528359961521706,"score_spread":0.2347849232411167,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4234782056","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.92519873,0.00007040843,0.000022362037,0.0000746306,0.00044203192,0.00010016616,0.0000037482628,0.00008654447,0.0740014],"genre_scores_gemma":[0.979358,5.226712e-7,0.020353025,0.00002178801,0.00011603168,0.000006834206,0.0000037926231,0.000014110557,0.00012587986],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983881,0.00004391885,0.00073267525,0.00029446173,0.0002419663,0.00029884794],"domain_scores_gemma":[0.99906677,0.00023820839,0.00029693826,0.00022140333,0.00012460553,0.000052045805],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0012920107,0.00014263413,0.00022313106,0.000053211665,0.00013694172,0.000052419644,0.00021837911,0.00006699554,0.0001809444],"category_scores_gemma":[0.00046068296,0.000119116645,0.000058595855,0.00008135014,0.00007150144,0.00009348474,0.000106924,0.000107020394,0.00013526552],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000110699675,0.00008825579,0.00055126037,0.00006762842,0.0000030834826,0.000003924482,0.00080211525,0.0018556608,0.99572706,0.000025525342,0.00017012197,0.0006942972],"study_design_scores_gemma":[0.0001708309,0.000020860372,0.008484488,0.00023983514,0.0000058460973,0.00000573138,0.00034782835,0.00009915819,0.9868849,0.00022554015,0.0033634866,0.00015148362],"about_ca_topic_score_codex":0.0006704739,"about_ca_topic_score_gemma":0.00021668931,"teacher_disagreement_score":0.073875524,"about_ca_system_score_codex":0.00006162671,"about_ca_system_score_gemma":0.00009402972,"threshold_uncertainty_score":0.48574358},"labels":[],"label_agreement":null},{"id":"W4241013126","doi":"10.1002/9781119093435.ch72","title":"Novelis High‐Speed can End Coating Line – Operational Results","year":2015,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Novelis (Canada)","funders":"","keywords":"Coating; Line (geometry); Computer science; Environmental science; Materials science; Mathematics; Composite material; Geometry","score_opus":0.02829310122328886,"score_gpt":0.27648290679070214,"score_spread":0.24818980556741327,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4241013126","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0043635075,0.00009515054,0.000057921374,0.0022825582,0.0023541849,0.0003203171,0.0031113096,0.00030292428,0.9871121],"genre_scores_gemma":[0.05102835,0.000008416779,0.0025700189,0.0005528643,0.0012540556,0.0000055118876,0.00056580204,0.00014113457,0.9438738],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99843496,0.000060857048,0.00037299868,0.0005119328,0.00038870279,0.000230524],"domain_scores_gemma":[0.9990356,0.000071874645,0.00014864505,0.0004320305,0.00018567195,0.00012618832],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00059684814,0.0002279269,0.00031628972,0.00007708094,0.00005312167,0.00011946194,0.00028487173,0.00022861348,0.039733388],"category_scores_gemma":[0.00040746466,0.00015629263,0.000041803105,0.00007598796,0.00010858122,0.000036543774,0.00014572265,0.00013345237,0.00071758544],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019972973,0.000055533994,0.0000018682077,0.00002196316,0.000007854131,0.0000036920228,0.000099672536,0.00002832884,0.027296485,0.0006158675,0.9717151,0.00013368244],"study_design_scores_gemma":[0.00088731275,0.00010903121,0.0000106667885,0.00013097891,0.000016497688,0.000006797711,0.00006957146,0.00021106095,0.021040285,0.00012695469,0.9770079,0.00038290725],"about_ca_topic_score_codex":0.014635149,"about_ca_topic_score_gemma":0.0113135455,"teacher_disagreement_score":0.04666484,"about_ca_system_score_codex":0.000084688865,"about_ca_system_score_gemma":0.0002943796,"threshold_uncertainty_score":0.9919265},"labels":[],"label_agreement":null},{"id":"W4245330910","doi":"10.1149/ma2012-02/13/1629","title":"Measurement of Capillary Presuure Curves in GDLs at Elevated Temperatures","year":2012,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Capillary action; Materials science; Composite material","score_opus":0.024164265027259824,"score_gpt":0.25675233190986335,"score_spread":0.23258806688260353,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4245330910","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9838998,0.006378405,7.9744694e-8,0.0002645587,0.0006434138,0.00021989678,0.000009258556,0.00004609629,0.008538492],"genre_scores_gemma":[0.9995051,0.000082979415,0.00012604478,0.000083381485,0.00010601478,0.000009848858,0.0000034114144,0.000013376112,0.0000698279],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99819,0.00014444749,0.0005254547,0.00023942196,0.0004918832,0.000408827],"domain_scores_gemma":[0.9991128,0.00011614532,0.00019639982,0.00030440715,0.00016038936,0.00010990115],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0029597494,0.00015306892,0.00025180686,0.000050611197,0.00006832794,0.000021269798,0.00019164436,0.00008767309,0.0001959535],"category_scores_gemma":[0.0012351099,0.00011807036,0.00005497593,0.00010152272,0.00006822767,0.0001493043,0.000103940736,0.0001493868,0.00005829972],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000030023479,0.0001556164,0.019689316,0.00032856947,0.0000054050297,0.000003177201,0.00043922622,0.00060979667,0.97621703,0.000002237342,0.0025097355,0.000009852244],"study_design_scores_gemma":[0.00017242364,0.000026877859,0.12852858,0.0009423172,0.000009651752,0.000006561291,0.000059292677,0.0000070162555,0.86891294,0.000014299711,0.001192802,0.00012720935],"about_ca_topic_score_codex":0.0006645757,"about_ca_topic_score_gemma":0.00017813727,"teacher_disagreement_score":0.108839266,"about_ca_system_score_codex":0.0001301161,"about_ca_system_score_gemma":0.000052266823,"threshold_uncertainty_score":0.48147696},"labels":[],"label_agreement":null},{"id":"W4247657185","doi":"10.26434/chemrxiv-2021-1kgg7","title":"Tuning the Dielectric Response in a Nanocomposite Material through Nanoparticle Morphology","year":2021,"lang":"en","type":"preprint","venue":"ChemRxiv","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Western Canada Research Grid; University of Victoria","keywords":"Materials science; Dielectric; Nanocomposite; Nanoparticle; Chemical physics; Polarization (electrochemistry); Molecular dynamics; Periodic boundary conditions; Oxide; Condensed matter physics; Nanotechnology; Optoelectronics; Boundary value problem; Computational chemistry; Physical chemistry; Physics; Chemistry; Quantum mechanics","score_opus":0.022835551776713623,"score_gpt":0.2740290278744246,"score_spread":0.251193476097711,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4247657185","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9947284,0.0004967049,0.00005179283,0.002021302,0.0019859145,0.00036851704,0.0000059963613,0.0000780614,0.00026333952],"genre_scores_gemma":[0.99876976,0.00003978334,0.00040569098,0.00035383902,0.00014598182,0.00013186876,0.000010854945,0.00002579787,0.000116445866],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.997415,0.0007005987,0.00047684382,0.00073874387,0.00018599606,0.00048281235],"domain_scores_gemma":[0.9984575,0.00032047575,0.00015151636,0.0009393509,0.00008209228,0.00004905974],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0013364514,0.0002652843,0.0004360342,0.000049617836,0.00013044098,0.0002844285,0.0006649419,0.00027870017,0.0010501089],"category_scores_gemma":[0.00031262814,0.00018432438,0.00013391039,0.00022278426,0.00022294484,0.0000928365,0.0012428999,0.00047543357,0.00006684291],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00056111324,0.00010191257,0.00018504019,0.00005834182,0.000008579067,0.0001007448,0.002174953,0.00016845635,0.99640733,0.000042118267,0.00012622222,0.00006518902],"study_design_scores_gemma":[0.0002645253,0.00006743841,0.0033757333,0.00012835243,0.000019759222,0.00003993823,0.00018885206,0.00034098522,0.9942591,0.0005839464,0.0004900004,0.00024135176],"about_ca_topic_score_codex":0.00063373154,"about_ca_topic_score_gemma":0.000052919942,"teacher_disagreement_score":0.004041366,"about_ca_system_score_codex":0.0001669716,"about_ca_system_score_gemma":0.00022965176,"threshold_uncertainty_score":0.9998631},"labels":[],"label_agreement":null},{"id":"W4251368852","doi":"10.1109/iccad.2013.6691170","title":"A Vectorless framework for power grid electromigration checking","year":2013,"lang":"en","type":"article","venue":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Computer science; Reliability (semiconductor); Workload; Conservatism; Grid; Pessimism; Power (physics); Power integrity; Very-large-scale integration; Reliability engineering; Chip; Power grid; Interconnection; Electronic engineering; Electrical engineering; Telecommunications; Engineering; Embedded system; Physics; Mathematics","score_opus":0.07865958355693928,"score_gpt":0.3138129411733506,"score_spread":0.23515335761641135,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4251368852","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.33170366,0.000025917736,0.65496695,0.0042570126,0.007017428,0.0012322225,0.000039017006,0.00021917875,0.0005386083],"genre_scores_gemma":[0.90618914,0.000032107942,0.09092475,0.00100471,0.0010677328,0.000396289,0.00003745509,0.000045237295,0.00030254686],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99682486,0.00023052101,0.00072074385,0.00095949165,0.0006406796,0.00062370073],"domain_scores_gemma":[0.9965135,0.0010043524,0.00036265777,0.0008039538,0.0011133092,0.00020226846],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00071162946,0.00044952089,0.00045687845,0.00021554303,0.00023727404,0.0008849653,0.0015425099,0.0002774171,0.004042198],"category_scores_gemma":[0.00038629214,0.0003820443,0.00021883103,0.00014300563,0.00013228248,0.0006395722,0.00017860453,0.0003967722,0.0012841602],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00048531758,0.00062357105,0.000194641,0.00006208411,0.00014527561,0.000008399397,0.0009777566,0.0017531974,0.7879107,0.13443805,0.06499452,0.008406496],"study_design_scores_gemma":[0.0021312258,0.002633223,0.0030677693,0.00087507267,0.000054519074,0.000049509825,0.00018609605,0.33160338,0.40595794,0.24683973,0.00488362,0.001717919],"about_ca_topic_score_codex":0.00035128742,"about_ca_topic_score_gemma":0.000028560302,"teacher_disagreement_score":0.5744855,"about_ca_system_score_codex":0.0002649303,"about_ca_system_score_gemma":0.00019464729,"threshold_uncertainty_score":0.99986315},"labels":[],"label_agreement":null},{"id":"W4251821671","doi":"10.1109/iccad.2013.6691168","title":"Redundancy-aware Electromigration checking for mesh power grids","year":2013,"lang":"en","type":"article","venue":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Redundancy (engineering); Reliability (semiconductor); Grid; Computer science; Interconnection; Power grid; Reliability engineering; Circuit reliability; Algorithm; Power (physics); Electrical engineering; Mathematics; Engineering; Physics; Geometry; Telecommunications","score_opus":0.06861736363377133,"score_gpt":0.30015611039975176,"score_spread":0.23153874676598044,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4251821671","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3916137,0.000032876807,0.59164953,0.0063783987,0.0066876197,0.0017994519,0.000060352926,0.0003275079,0.0014505662],"genre_scores_gemma":[0.969997,0.000043834494,0.026594581,0.0009193381,0.00080497185,0.00040353253,0.00006596882,0.000049930346,0.0011208412],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9966024,0.00023472254,0.00080623495,0.0010317402,0.0006767355,0.00064814603],"domain_scores_gemma":[0.9966385,0.0005644709,0.00036852743,0.00082927116,0.0013876325,0.000211643],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00079536607,0.00047575857,0.00047413117,0.00023314547,0.00027033413,0.00086859515,0.0015639418,0.0002409308,0.004466299],"category_scores_gemma":[0.00021876865,0.00040505093,0.00023506898,0.0001374995,0.0001472065,0.0008047467,0.00019470141,0.0003229003,0.0012191349],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00038172823,0.00051349984,0.0001221631,0.00005776278,0.00012489442,0.000007738567,0.00074638345,0.001241337,0.81175196,0.030402802,0.14600441,0.00864532],"study_design_scores_gemma":[0.0026200165,0.0032238003,0.0015930212,0.00058800494,0.000053163985,0.00006092945,0.00019546194,0.4874001,0.43113658,0.06610082,0.00545593,0.001572157],"about_ca_topic_score_codex":0.000338556,"about_ca_topic_score_gemma":0.00003947901,"teacher_disagreement_score":0.5783833,"about_ca_system_score_codex":0.00029702246,"about_ca_system_score_gemma":0.0002519165,"threshold_uncertainty_score":0.99984014},"labels":[],"label_agreement":null},{"id":"W4312108683","doi":"","title":"Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging","year":2022,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microfabrication; Etching (microfabrication); Copper; Plasma etching; Plasma; Materials science; Electronic packaging; Integrated circuit packaging; Optoelectronics; Nanotechnology; Metallurgy; Composite material; Integrated circuit; Fabrication","score_opus":0.012914413680345418,"score_gpt":0.24297934356051457,"score_spread":0.23006492988016913,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4312108683","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96744746,0.0004881741,0.024812596,0.0046840925,0.00059470197,0.00088318484,0.00015663712,0.000048885577,0.00088425126],"genre_scores_gemma":[0.98264617,0.0001653332,0.01651784,0.00003855959,0.000010426246,0.00014384274,0.000106575375,0.000027059737,0.0003442085],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99538165,0.002590908,0.00079040375,0.0006580101,0.0003150813,0.00026391522],"domain_scores_gemma":[0.9917871,0.00431426,0.0008493882,0.0017892559,0.0012084325,0.00005158666],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.007567006,0.00023121192,0.00049415004,0.0001555805,0.0002239199,0.00008705001,0.0013375052,0.00013680884,0.000206413],"category_scores_gemma":[0.0026011185,0.00019639316,0.0002102234,0.00024305901,0.00027049583,0.00010735326,0.0017104041,0.00046193344,0.0000028116765],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020574505,0.00091194804,0.004461524,0.0011343274,0.00007121966,0.0000013663796,0.030214533,0.0032674994,0.88264024,0.0313544,0.0004290722,0.045308147],"study_design_scores_gemma":[0.00076604664,0.0000018564164,0.009353908,0.0014618239,0.000048283284,0.0000030500182,0.0011227388,0.010064777,0.9708771,0.0049878187,0.0010291422,0.00028344028],"about_ca_topic_score_codex":0.00566329,"about_ca_topic_score_gemma":0.003482691,"teacher_disagreement_score":0.0882369,"about_ca_system_score_codex":0.00017962148,"about_ca_system_score_gemma":0.0002146773,"threshold_uncertainty_score":0.85612386},"labels":[],"label_agreement":null},{"id":"W4353031946","doi":"10.1145/3569052.3578922","title":"Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution","year":2023,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Agence Nationale de la Recherche; Semiconductor Research Corporation","keywords":"Electromigration; Resistor; Voltage drop; Void (composites); Interconnection; Ball grid array; Materials science; Voltage; Redundancy (engineering); Grid; Power network design; Electronic circuit; Power (physics); Electronic engineering; Electrical engineering; Computer science; Engineering; Physics; Composite material; Reliability engineering; Soldering; Telecommunications; Mathematics","score_opus":0.004491865934672131,"score_gpt":0.2494645945321798,"score_spread":0.24497272859750768,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4353031946","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99829066,0.000007677596,0.0002064181,0.0005866518,0.00009169016,0.00017827844,0.000028966955,0.000031699794,0.0005779419],"genre_scores_gemma":[0.99952024,0.000018452603,0.00023683037,0.000019669113,0.000011419553,0.000013654892,0.00004738351,0.000003960634,0.0001284163],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.9993488,0.000018815166,0.00016580292,0.00018310109,0.00013950597,0.00014393668],"domain_scores_gemma":[0.99970335,0.000026579719,0.00003964644,0.00013676245,0.00006907197,0.0000245798],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00036532505,0.00007392044,0.00012148973,0.000037576872,0.000040682728,0.00004747793,0.000057130168,0.000050922,0.00012166369],"category_scores_gemma":[0.000017496397,0.000045211156,0.000014034231,0.00023205971,0.000048143924,0.00016716935,0.00003299873,0.000082168495,0.000005420083],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000048414313,0.00005837094,0.00784226,0.00003429127,0.0000026708112,0.0000021682422,0.00024709324,0.0000416401,0.9892772,0.0014451516,0.00089955085,0.00010123212],"study_design_scores_gemma":[0.00065905944,0.00067591533,0.5767975,0.00010479714,0.000008259155,0.0000075061675,0.00086403254,0.0014309168,0.41831923,0.000639478,0.000311345,0.00018195638],"about_ca_topic_score_codex":0.0002717295,"about_ca_topic_score_gemma":0.000678897,"teacher_disagreement_score":0.5709579,"about_ca_system_score_codex":0.00007098827,"about_ca_system_score_gemma":0.00007594592,"threshold_uncertainty_score":0.18436573},"labels":[],"label_agreement":null},{"id":"W4377969795","doi":"10.1109/isqed57927.2023.10129371","title":"Fast Electromigration Simulation for Chip Power Grids","year":2023,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Speedup; Chip; Computer science; Grid; Void (composites); Voltage; Power grid; Electronic engineering; Power (physics); Parallel computing; Electrical engineering; Materials science; Engineering; Physics; Telecommunications","score_opus":0.019478784452025933,"score_gpt":0.2983218237216289,"score_spread":0.27884303926960297,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4377969795","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98512536,0.0000040184846,0.01149263,0.0005927276,0.0004648428,0.00029481295,0.000009960437,0.00023106787,0.0017845507],"genre_scores_gemma":[0.9976522,0.000001030688,0.00033501553,0.000108785585,0.000076233926,0.000029966384,0.00001875075,0.000006812759,0.0017712227],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994176,0.000017518694,0.00013435658,0.00017893265,0.000086598004,0.00016498913],"domain_scores_gemma":[0.9996077,0.00014605821,0.000024233152,0.00013125152,0.00006400725,0.000026746922],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00032425675,0.000057362162,0.00006980733,0.00003671537,0.00008440316,0.000053045813,0.00006891478,0.000037852835,0.0008190321],"category_scores_gemma":[0.00013385771,0.000040953404,0.000046956666,0.000109410124,0.000016499542,0.00010943491,0.00001978148,0.000022884482,0.00036593262],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000063193715,0.000023203926,0.00016486952,0.00001299042,0.0000023446196,1.9839732e-7,0.00030482397,0.0059883413,0.9843107,0.0025605,0.0053932965,0.0011755426],"study_design_scores_gemma":[0.0011858006,0.0005504544,0.014993204,0.000014877434,0.000014638359,0.0000013166625,0.0003182444,0.23151277,0.7259101,0.009592559,0.015572059,0.00033392644],"about_ca_topic_score_codex":0.000026006124,"about_ca_topic_score_gemma":0.000050778905,"teacher_disagreement_score":0.25840053,"about_ca_system_score_codex":0.000023936173,"about_ca_system_score_gemma":0.000016886652,"threshold_uncertainty_score":0.8967827},"labels":[],"label_agreement":null},{"id":"W4385893389","doi":"10.1109/ectc51909.2023.00234","title":"Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging","year":2023,"lang":"en","type":"preprint","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microfabrication; Etching (microfabrication); Plasma etching; Materials science; Fabrication; Plasma; Nanotechnology; Process (computing); Copper; Layer (electronics); Optoelectronics; Computer science; Metallurgy; Physics","score_opus":0.032839523158386806,"score_gpt":0.3064589801797166,"score_spread":0.27361945702132984,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4385893389","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9887925,0.00004391691,0.008854773,0.00035456175,0.0007261979,0.0011082136,0.000045082674,0.000034772154,0.000039995015],"genre_scores_gemma":[0.98072195,0.000015074865,0.01901334,0.00001449625,0.000015142006,0.00014063163,0.000014698766,0.000020156796,0.0000444964],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99795437,0.000063452935,0.0010352695,0.00049272995,0.0002406619,0.0002135373],"domain_scores_gemma":[0.997661,0.0007043473,0.00066921907,0.0005144493,0.00042445265,0.000026555814],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014847709,0.00020304619,0.0006065526,0.00014348752,0.000049701863,0.00001775774,0.00057318166,0.00013945907,0.000030605257],"category_scores_gemma":[0.000556775,0.00013527532,0.00010959261,0.00014920274,0.00012368493,0.000069749854,0.0006437818,0.00018986194,0.0000027389494],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00026561707,0.00016221307,0.001005692,0.0035703592,0.00004358522,3.271859e-7,0.014573268,0.0034650182,0.9682828,0.00034022238,0.00004635306,0.008244511],"study_design_scores_gemma":[0.00040067232,0.000032954005,0.006746812,0.0011507189,0.000023574456,6.445554e-7,0.0031270466,0.0017118071,0.9845492,0.0020803139,0.000018813445,0.0001574274],"about_ca_topic_score_codex":0.0010162155,"about_ca_topic_score_gemma":0.0019296684,"teacher_disagreement_score":0.016266381,"about_ca_system_score_codex":0.00010421485,"about_ca_system_score_gemma":0.000331659,"threshold_uncertainty_score":0.5516367},"labels":[],"label_agreement":null},{"id":"W4386072888","doi":"10.11159/mmme23.112","title":"Sputtering of Ultra-thin Cu Nano-twinned Films on Si Wafers for Application in Advanced 3D-IC Packaging","year":2023,"lang":"en","type":"article","venue":"Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"Hsinchu Science Park Bureau, Ministry of Science and Technology, Taiwan","keywords":"Wafer; Materials science; Sputtering; Optoelectronics; Nano-; Sputter deposition; Thin film; Nanotechnology; Composite material","score_opus":0.007679251785211376,"score_gpt":0.22854187085747016,"score_spread":0.2208626190722588,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4386072888","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99807566,0.000003066806,0.000008428806,0.00022989785,0.00092147733,0.0005492295,0.000039674025,0.0001148445,0.00005768732],"genre_scores_gemma":[0.998406,0.000017284912,0.0012278132,0.000038952163,0.000069340764,0.0001560271,0.0000044917424,0.00003416739,0.000045901554],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985374,0.0000055431747,0.0004896207,0.00043047586,0.00020533668,0.00033158832],"domain_scores_gemma":[0.9993052,0.00017570003,0.00018879311,0.00018050084,0.00008505638,0.000064766165],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00046588632,0.00022022137,0.00040038896,0.0001426791,0.00005320044,0.000057197347,0.00038199828,0.00008776517,0.000017467995],"category_scores_gemma":[0.00030046725,0.00017018362,0.00008139258,0.00029509582,0.00006330009,0.00011736095,0.00014446351,0.00012395594,0.0000020574296],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00027219285,0.000040993127,0.000017420518,0.00066613185,0.00000730741,1.5753497e-7,0.00002695134,0.00061861717,0.9961901,0.0017982174,0.00009670115,0.00026521907],"study_design_scores_gemma":[0.0005560528,0.0000766314,0.000021522252,0.00072010903,0.000013630204,0.0000010408347,0.00008114639,0.007546447,0.9902149,0.00037610385,0.00020874022,0.00018367039],"about_ca_topic_score_codex":0.000013652624,"about_ca_topic_score_gemma":0.0000026973585,"teacher_disagreement_score":0.0069278297,"about_ca_system_score_codex":0.0000460299,"about_ca_system_score_gemma":0.0000098191595,"threshold_uncertainty_score":0.6939886},"labels":[],"label_agreement":null},{"id":"W4386612148","doi":"10.11159/ijmmme.2023.001","title":"Characterization of High Density (111)-oriented Ag Nanotwinned Films Deposited on Sapphire Wafers","year":2023,"lang":"en","type":"article","venue":"International Journal of Mining Materials and Metallurgical Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"Hsinchu Science Park Bureau, Ministry of Science and Technology, Taiwan; Ministry of Science and Technology, Taiwan","keywords":"Wafer; Materials science; Sapphire; Characterization (materials science); Optoelectronics; Composite material; Nanotechnology; Optics; Laser","score_opus":0.008988602200030511,"score_gpt":0.22448632468704188,"score_spread":0.21549772248701138,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4386612148","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9951867,0.000011332586,0.0012506556,0.0002613661,0.003125769,0.00006812204,0.00004251057,0.00004055437,0.000013023975],"genre_scores_gemma":[0.9987857,0.00005827949,0.00082963816,0.000038134436,0.0002040283,0.000002737342,0.000027879889,0.000015581982,0.00003801833],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99854296,0.000051033432,0.0006526942,0.0001746319,0.00041297902,0.00016571039],"domain_scores_gemma":[0.99906135,0.0001509793,0.00031953672,0.000096503914,0.0002824839,0.000089148125],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006477753,0.00014881842,0.00037992361,0.00022678955,0.00003734907,0.00007604542,0.00021417749,0.000078662655,0.00031225485],"category_scores_gemma":[0.0003021521,0.00011329909,0.000083881234,0.0001188486,0.00004345649,0.00017709662,0.00010456752,0.00007752642,0.000010331128],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00031829588,0.000043671673,0.0000223913,0.000032829364,0.00006843095,0.00006963337,0.00021777589,0.0015565485,0.9967601,0.00062314584,0.0000115893345,0.00027560393],"study_design_scores_gemma":[0.0007048764,0.00022417615,0.010185147,0.0003111771,0.000033798617,0.00010821649,0.000061787876,0.0016291313,0.9862392,0.00001926111,0.0003472642,0.0001359893],"about_ca_topic_score_codex":0.00002684077,"about_ca_topic_score_gemma":8.3598195e-7,"teacher_disagreement_score":0.010520909,"about_ca_system_score_codex":0.00003535755,"about_ca_system_score_gemma":0.00002417426,"threshold_uncertainty_score":0.46202025},"labels":[],"label_agreement":null},{"id":"W4390545031","doi":"10.3390/coatings14010068","title":"Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect","year":2024,"lang":"en","type":"article","venue":"Coatings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"Government of Jiangsu Province; China Postdoctoral Science Foundation; Jiangsu Science and Technology Department; National Natural Science Foundation of China","keywords":"Materials science; Diffusion barrier; Alloy; Silicon; Sputter deposition; Substrate (aquarium); Doping; Analytical Chemistry (journal); Copper; Layer (electronics); Barrier layer; Photoemission spectroscopy; Diffusion; Carbon fibers; Metallurgy; X-ray photoelectron spectroscopy; Sputtering; Chemical engineering; Thin film; Composite material; Nanotechnology; Optoelectronics; Chemistry; Composite number","score_opus":0.010805766205916072,"score_gpt":0.2803619920229363,"score_spread":0.26955622581702027,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4390545031","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9937289,0.0005157397,0.00015392111,0.00028281932,0.0021652349,0.00060789275,0.00008044922,0.00016182143,0.0023032231],"genre_scores_gemma":[0.99866664,0.0000066265293,0.00018730956,0.0000807908,0.00016143628,0.00012215113,0.000008659725,0.000035016896,0.0007313493],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984686,0.00014055216,0.0004014843,0.000487914,0.00018494338,0.00031653777],"domain_scores_gemma":[0.998152,0.0012236439,0.00007474419,0.00035095378,0.00011153391,0.00008710109],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014691866,0.00021124326,0.0004026565,0.00006845793,0.00006933348,0.00011701403,0.00032306765,0.000103128186,0.0004665873],"category_scores_gemma":[0.00096436724,0.00014857203,0.00018487057,0.00012999192,0.00016109875,0.000117672906,0.00014874001,0.00012717475,0.00004425432],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012334718,0.000020098485,0.00030677972,0.0012404638,0.000015668971,0.000005205188,0.0013258096,0.000017739769,0.9887626,0.0004721284,0.004671746,0.0030383943],"study_design_scores_gemma":[0.00047035888,0.00094463036,0.000035363144,0.00050170656,0.0000663219,0.000009569033,0.00015816597,0.005601732,0.98640454,0.00023484854,0.0053656576,0.00020712594],"about_ca_topic_score_codex":0.0003613195,"about_ca_topic_score_gemma":0.000047331727,"teacher_disagreement_score":0.005583992,"about_ca_system_score_codex":0.000061814324,"about_ca_system_score_gemma":0.00007512218,"threshold_uncertainty_score":0.60585916},"labels":[],"label_agreement":null},{"id":"W4394994524","doi":"10.1109/mmm.2024.3369795","title":"Call for Papers EPEPS 2024","year":2024,"lang":"en","type":"paratext","venue":"IEEE Microwave Magazine","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Computer science; Telecommunications","score_opus":0.017299512702674845,"score_gpt":0.2759164976571757,"score_spread":0.25861698495450086,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4394994524","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.01695027,0.0124547295,0.0011365733,0.002759907,0.11337581,0.0024677091,0.0073271873,0.00027213737,0.8432557],"genre_scores_gemma":[0.01566212,0.00034698297,0.0009688093,0.00075035944,0.0031032236,0.0002196715,0.00031609338,0.0001749954,0.97845775],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99676293,0.000075713455,0.0007176597,0.0013620259,0.0002894784,0.00079221657],"domain_scores_gemma":[0.9983292,0.0002444809,0.00016709113,0.0008432045,0.00022343583,0.00019259356],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0005523309,0.0006744361,0.0008529884,0.00017319963,0.00012413353,0.00038469478,0.0006759661,0.0005961073,0.021945028],"category_scores_gemma":[0.00007501265,0.0005182455,0.00055953994,0.00018117581,0.0002630486,0.0000650962,0.00021478329,0.0005765833,0.13516733],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003882214,0.000032343592,1.2062222e-7,0.00076924806,0.00003149408,0.0000134011225,0.00006568557,0.000012940881,0.48812357,0.000025344541,0.509984,0.0009029826],"study_design_scores_gemma":[0.0002698006,0.00015085327,0.0000013886922,0.00036012306,0.0001283475,0.000032960914,0.000010940908,0.00003197266,0.24415435,0.0002486118,0.75409037,0.0005202895],"about_ca_topic_score_codex":0.00007064049,"about_ca_topic_score_gemma":0.00023751167,"teacher_disagreement_score":0.24410632,"about_ca_system_score_codex":0.00027225263,"about_ca_system_score_gemma":0.00030157535,"threshold_uncertainty_score":0.9997269},"labels":[],"label_agreement":null},{"id":"W4396758818","doi":"10.1109/mmm.2024.3385195","title":"EPEPS 2024 Call for Papers","year":2024,"lang":"en","type":"paratext","venue":"IEEE Microwave Magazine","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Computer science; Telecommunications","score_opus":0.017299512702674845,"score_gpt":0.2759164976571757,"score_spread":0.25861698495450086,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4396758818","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.016748514,0.012428116,0.001179715,0.0027291793,0.11320187,0.002468261,0.007323535,0.00027225073,0.84364855],"genre_scores_gemma":[0.015193741,0.00034694193,0.0009839236,0.00074946793,0.003100907,0.00021990211,0.00031618038,0.00017521862,0.9789137],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9967641,0.00007573596,0.0007172637,0.0013614864,0.0002893544,0.0007920296],"domain_scores_gemma":[0.99832976,0.0002445599,0.0001670321,0.00084301643,0.00022305547,0.00019256695],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0005519866,0.0006743131,0.00085265405,0.00017311292,0.00012433862,0.00038445415,0.00067585864,0.0005953936,0.021940418],"category_scores_gemma":[0.000074789816,0.0005182026,0.0005594254,0.00018103702,0.00026296254,0.00006526311,0.00021472381,0.00057590153,0.13171081],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000038644434,0.000032201584,1.19025685e-7,0.0007659047,0.000031340733,0.000013344183,0.00006541011,0.000012892298,0.4902729,0.000025135292,0.5078639,0.00087820936],"study_design_scores_gemma":[0.00027112197,0.00014963331,0.000001604893,0.00036177805,0.00012891488,0.00003313165,0.000010988883,0.00003164783,0.24020948,0.0002494415,0.7580292,0.0005230164],"about_ca_topic_score_codex":0.000070613736,"about_ca_topic_score_gemma":0.00023739629,"teacher_disagreement_score":0.25016537,"about_ca_system_score_codex":0.0002722008,"about_ca_system_score_gemma":0.0003015171,"threshold_uncertainty_score":0.99972695},"labels":[],"label_agreement":null},{"id":"W4401975984","doi":"10.1139/cjc-2024-0006","title":"Synthesis, characterization, volatility, and thermal stability of fluorinated copper(II) aminoalkoxide complexes as potential vapour deposition precursors","year":2024,"lang":"en","type":"article","venue":"Canadian Journal of Chemistry","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Chemistry; Copper; Volatility (finance); Thermal stability; Thermal; Inorganic chemistry; Chemical vapor deposition; Organic chemistry; Chemical engineering; Thermodynamics","score_opus":0.008174001067976857,"score_gpt":0.21345910289793227,"score_spread":0.2052851018299554,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401975984","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99782753,0.00052808487,0.000049750004,0.0006852312,0.00036461125,0.00007821288,0.00020632015,0.000012540279,0.00024774164],"genre_scores_gemma":[0.99971294,0.0000124847975,0.00006234427,0.00001736193,0.0001256159,0.0000020801317,0.000010985082,0.000011751515,0.000044458706],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988485,0.00006867054,0.0004859222,0.00020497231,0.00017921106,0.00021274031],"domain_scores_gemma":[0.9989604,0.00008124463,0.00016151684,0.00017364904,0.00029042628,0.00033278228],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00046784827,0.00013573689,0.0002582144,0.000051623054,0.00012588169,0.00012119497,0.00020441243,0.000106472995,0.0015878072],"category_scores_gemma":[0.00026465746,0.00011522847,0.00009036757,0.00009183479,0.0002702769,0.00023463133,0.00003207993,0.00017250772,0.0000025056595],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040228424,0.00002456523,0.0016613052,0.00032963444,0.000023319997,0.000044491408,0.00052162795,0.0000059096105,0.9961656,0.000010293281,0.00008318656,0.0010898662],"study_design_scores_gemma":[0.00010755264,0.00005564882,0.010232264,0.0002706184,0.000045060042,0.00025114603,0.00018041347,0.00044935188,0.98787636,0.00010448949,0.00031389738,0.000113207796],"about_ca_topic_score_codex":0.0013863235,"about_ca_topic_score_gemma":0.00034128196,"teacher_disagreement_score":0.008570959,"about_ca_system_score_codex":0.0001416209,"about_ca_system_score_gemma":0.0007631541,"threshold_uncertainty_score":0.99932486},"labels":[],"label_agreement":null},{"id":"W4404577368","doi":"10.1109/epeps61853.2024.10754302","title":"Analysis and Modeling of Controlled Silicon Substrate Roughness for Silver-Based Backside Metallization in Power Electronics Packaging","year":2024,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Moncton","funders":"","keywords":"Materials science; Silicon; Substrate (aquarium); Optoelectronics; Power electronics; Electronics; Surface roughness; Electronic packaging; Surface finish; Engineering physics; Electrical engineering; Composite material; Engineering; Voltage","score_opus":0.015919696167484978,"score_gpt":0.27880754377037653,"score_spread":0.2628878476028916,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404577368","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8722317,0.0006968246,0.12626769,0.00017626656,0.00008338121,0.00032985484,0.00001063467,0.000037710506,0.00016593537],"genre_scores_gemma":[0.9992402,0.000019185763,0.0006039439,0.000033968026,0.0000078207595,0.000030606087,0.000009788573,0.000009511286,0.00004497408],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988666,0.000060560356,0.0004138642,0.00033743013,0.00011645784,0.00020506227],"domain_scores_gemma":[0.99937016,0.00028995203,0.000047247944,0.0001567575,0.00010436682,0.00003153844],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009455089,0.00011453674,0.00041295993,0.00020463837,0.000030783474,0.00010674635,0.00007742836,0.000055487944,0.00019429097],"category_scores_gemma":[0.000096824784,0.00008198587,0.00015583803,0.00038568265,0.000032264685,0.00016350875,0.000016895125,0.00005255381,0.0000012968648],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004036008,0.000085533604,0.0019996474,0.00022325234,0.00017403941,0.0000017028117,0.00031266996,0.27198508,0.72055864,0.0040079895,0.0000037155605,0.00024409672],"study_design_scores_gemma":[0.00090449594,0.0000552872,0.00013880296,0.000030151388,0.0002366386,2.4501512e-7,0.00011087454,0.8772069,0.120079406,0.0011346465,0.000007721793,0.00009483505],"about_ca_topic_score_codex":0.00022173753,"about_ca_topic_score_gemma":0.001176392,"teacher_disagreement_score":0.6052218,"about_ca_system_score_codex":0.000049215603,"about_ca_system_score_gemma":0.000088058114,"threshold_uncertainty_score":0.33432868},"labels":[],"label_agreement":null},{"id":"W4406243282","doi":"10.1063/5.0241912","title":"Electron scattering at interfaces in Ru(0001)/Co(0001) multilayers","year":2025,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Empire State Development's Division of Science, Technology and Innovation; Semiconductor Research Corporation; Canadian Light Source; National Science Foundation","keywords":"Materials science; Scattering; Electron scattering; Condensed matter physics; Chemistry; Crystallography; Physics; Optics","score_opus":0.00990852362814767,"score_gpt":0.27710731717213366,"score_spread":0.267198793543986,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4406243282","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9917721,0.000075528136,0.000196787,0.00016218815,0.0004878886,0.00011677055,0.0000033423958,0.000014184609,0.0071712197],"genre_scores_gemma":[0.9992063,0.000025988946,0.0003069763,0.00019196462,0.00013781387,0.0000044804897,6.484511e-7,0.000010901113,0.00011490044],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987866,0.000030324496,0.00049591204,0.00020069646,0.00020772261,0.00027869001],"domain_scores_gemma":[0.99932814,0.000105150226,0.00024483967,0.00020339666,0.000064823704,0.000053624437],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00044657546,0.00015263408,0.00033713877,0.00008444815,0.000070607086,0.000067840076,0.00034990546,0.000060515096,0.00012298755],"category_scores_gemma":[0.000015618554,0.00012009317,0.000092449234,0.00017020205,0.00009074536,0.00013929172,0.00009301533,0.00027954427,0.000053604414],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00030187398,0.0001269516,0.00048935274,0.00005028559,0.000015901782,0.000003856765,0.00072431937,0.005001363,0.9899531,0.00037981497,0.0009105947,0.0020425874],"study_design_scores_gemma":[0.00060591503,0.0000687221,0.00094846735,0.0001177152,0.000016631264,0.000004529235,0.00023296775,0.000434354,0.9929223,0.0027827984,0.0017419129,0.00012371014],"about_ca_topic_score_codex":0.000023399367,"about_ca_topic_score_gemma":0.000019040765,"teacher_disagreement_score":0.007434235,"about_ca_system_score_codex":0.00031469352,"about_ca_system_score_gemma":0.000081818325,"threshold_uncertainty_score":0.48972577},"labels":[],"label_agreement":null},{"id":"W4410153284","doi":"10.1109/tcad.2025.3567885","title":"Novel Partitioning-Based Approach for Electromigration Assessment With Neural Networks","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"China Scholarship Council; Natural Sciences and Engineering Research Council of Canada; National Natural Science Foundation of China","keywords":"Electromigration; Artificial neural network; Computer science; Artificial intelligence; Materials science","score_opus":0.027018342445498528,"score_gpt":0.2539284508299839,"score_spread":0.22691010838448536,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410153284","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.03138329,0.00006297635,0.9662705,0.000050700408,0.0008026887,0.0012470762,0.00004763656,0.00009622397,0.00003887626],"genre_scores_gemma":[0.98702794,0.000004032858,0.012432974,0.00008343533,0.00003816119,0.00033201685,0.000018000219,0.000015907313,0.000047538975],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9983655,0.00019847976,0.00051572354,0.00047326327,0.00017925886,0.00026772724],"domain_scores_gemma":[0.99870884,0.0003991198,0.00016676617,0.00027187323,0.0003865017,0.000066916706],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00061345927,0.00024169718,0.0004214242,0.00017433916,0.00025709017,0.00020892906,0.0001562861,0.0001323049,0.000008636654],"category_scores_gemma":[0.0000045673864,0.00017111658,0.00008811382,0.00029918266,0.000106515705,0.00012259635,9.4216637e-7,0.00019534999,2.8153605e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014743512,0.00035878338,0.000011158943,0.00013535311,0.00005491467,4.4554702e-7,0.00003989912,0.87700856,0.11847352,0.0004277343,0.0000793605,0.0032628353],"study_design_scores_gemma":[0.0011693329,0.0012489142,0.00004060997,0.00025580288,0.00007506055,0.000011993767,0.000089230605,0.9648133,0.032092217,0.000015396383,0.000014121981,0.00017403161],"about_ca_topic_score_codex":0.0003354013,"about_ca_topic_score_gemma":0.000025012823,"teacher_disagreement_score":0.95564467,"about_ca_system_score_codex":0.00012160623,"about_ca_system_score_gemma":0.00019938129,"threshold_uncertainty_score":0.6977932},"labels":[],"label_agreement":null},{"id":"W4414310101","doi":"10.1109/icept67137.2025.11157529","title":"Electrolytic Cu plating and anti-tarnish influence on Cu Layer oxidation","year":2025,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nexen (Canada)","funders":"","keywords":"Copper; Plating (geology); Lead frame; Layer (electronics); X-ray photoelectron spectroscopy; Scanning electron microscope; Electrolyte; Copper plating","score_opus":0.009782971303297774,"score_gpt":0.26853252972154623,"score_spread":0.2587495584182485,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4414310101","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98807657,0.00004087467,0.0002694816,0.0007199398,0.00015225216,0.00013027592,0.0000012800532,0.00007597631,0.010533342],"genre_scores_gemma":[0.9980461,0.000008346092,0.00025744678,0.00079828384,0.0000195485,0.000006012593,9.997503e-7,0.000003718356,0.00085955893],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992275,0.00003785702,0.00017364118,0.00028349055,0.0001021814,0.00017529892],"domain_scores_gemma":[0.99954283,0.00014949757,0.000036433197,0.00018742522,0.00005259086,0.00003124472],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002943833,0.000087976536,0.00011801416,0.000048028058,0.0001199208,0.00011373674,0.00010003138,0.0000486711,0.0002827786],"category_scores_gemma":[0.0002364168,0.000064736814,0.000019660642,0.000101169775,0.000050906696,0.00015845861,0.000061313025,0.00008329147,0.00006895157],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013880815,0.000023095281,0.006701125,0.000024731688,0.0000025847182,6.88025e-7,0.0000906478,0.00012852825,0.988736,0.0024565074,0.00027778014,0.0015444779],"study_design_scores_gemma":[0.00031966963,0.00010334447,0.0691459,0.000099312725,0.0000126370405,0.0000029899222,0.000088930836,0.0029610407,0.924192,0.0019215907,0.0009929782,0.00015956943],"about_ca_topic_score_codex":0.00029280232,"about_ca_topic_score_gemma":0.00007208412,"teacher_disagreement_score":0.06454392,"about_ca_system_score_codex":0.000042766445,"about_ca_system_score_gemma":0.000053086602,"threshold_uncertainty_score":0.30962273},"labels":[],"label_agreement":null},{"id":"W642366636","doi":"10.1016/b978-1-78548-015-7.50002-0","title":"Interaction Plasma/Dielectric","year":2015,"lang":"en","type":"book-chapter","venue":"Elsevier eBooks","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Materials science; Plasma-enhanced chemical vapor deposition; Plasma; Etching (microfabrication); Dielectric; Fabrication; Plasma etching; Chemical vapor deposition; Porosity; Interconnection; Low-k dielectric; Plasma processing; Deposition (geology); Nanotechnology; Optoelectronics; Chemical engineering; Composite material; Computer science; Layer (electronics)","score_opus":0.029959948292560823,"score_gpt":0.2695906245235766,"score_spread":0.2396306762310158,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W642366636","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.002366505,0.0006963645,0.000002105158,0.000075441414,0.0026140145,0.0003983345,0.00003690989,0.00015542358,0.9936549],"genre_scores_gemma":[0.021195883,0.000034919536,0.0000954678,0.00012390458,0.00058449974,0.000023097382,0.000015764024,0.0000702101,0.9778563],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99811304,0.000040276092,0.00048593068,0.00062436727,0.00040975242,0.00032663342],"domain_scores_gemma":[0.998583,0.00008674955,0.00026407625,0.00063943054,0.00025025549,0.00017649257],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00047694857,0.00040589322,0.0005155569,0.00014611687,0.00009895391,0.000107581305,0.0003765067,0.00038303668,0.0035843246],"category_scores_gemma":[0.000063888,0.0003254071,0.00021456824,0.000011788497,0.00013159751,0.000080328784,0.00018852693,0.0005313056,0.0032858085],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000060463106,0.000013431385,5.2699147e-7,0.000074161675,0.000027220467,0.000025257876,0.00020031292,0.0000026968537,0.004766968,0.0031627903,0.0034108856,0.98825526],"study_design_scores_gemma":[0.00018766541,0.00014715585,0.0000010497308,0.00023863108,0.00006817939,0.00004857511,0.000010025456,0.000033216766,0.003171279,0.010872135,0.98482805,0.00039401665],"about_ca_topic_score_codex":0.0000030304338,"about_ca_topic_score_gemma":0.000058937945,"teacher_disagreement_score":0.9878613,"about_ca_system_score_codex":0.0003253033,"about_ca_system_score_gemma":0.00020237976,"threshold_uncertainty_score":0.9999198},"labels":[],"label_agreement":null},{"id":"W6892702729","doi":"10.5281/zenodo.11926633","title":"Conrad elektronik katalog pdf","year":2024,"lang":"en","type":"other","venue":"Zenodo (CERN European Organization for Nuclear Research)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Collectable; BELLA; Jungle; Order (exchange); Ice cream; Caucus","score_opus":0.022462261085395358,"score_gpt":0.24782347786550177,"score_spread":0.2253612167801064,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6892702729","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00035785348,0.00080218154,0.00024961057,0.00046268723,0.0008474665,0.00044495636,0.0008779735,0.0018611723,0.9940961],"genre_scores_gemma":[0.013909172,0.00016618353,0.00016188463,0.00015863808,0.00074228016,7.287071e-8,0.0014985346,0.00978646,0.9735768],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99794304,0.00024455183,0.0002640134,0.0007431847,0.00037483205,0.00043035927],"domain_scores_gemma":[0.99880135,0.0000149571515,0.00011230935,0.00073257147,0.00017157818,0.000167206],"candidate_categories":["scholarly_communication","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00061620714,0.00024500093,0.00026267878,0.0002517721,0.00050188927,0.0011144938,0.0012052122,0.00018885113,0.5220983],"category_scores_gemma":[0.00029914733,0.00021752657,0.00009410122,0.00024490163,0.0003045842,0.00008389508,0.0014671051,0.00037428894,0.50739187],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013640856,0.000057920424,7.733813e-8,0.00024968002,0.000028944267,0.00002243765,0.0002061914,0.0000010830455,0.008485164,0.0018635293,0.98371816,0.0053531765],"study_design_scores_gemma":[0.00017293297,0.0001306173,0.0000033732265,0.0001753655,0.000027692306,0.00007153255,0.000083602754,0.00001943981,0.0007661731,0.00033069542,0.99796504,0.0002535453],"about_ca_topic_score_codex":0.00009593638,"about_ca_topic_score_gemma":0.0000027257684,"teacher_disagreement_score":0.020519324,"about_ca_system_score_codex":0.00015688542,"about_ca_system_score_gemma":0.0000063440207,"threshold_uncertainty_score":0.99992245},"labels":[],"label_agreement":null},{"id":"W6987125901","doi":"","title":"Schneider Electric and Alfa Laval Extend Collaboration","year":2021,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Work (physics); Government (linguistics); Context (archaeology); Field (mathematics)","score_opus":0.007968983316591835,"score_gpt":0.25647935366346464,"score_spread":0.2485103703468728,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6987125901","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.029078975,0.009341285,0.00013665637,0.00076872227,0.0013586681,0.00038421192,0.000035651523,0.00022778568,0.95866805],"genre_scores_gemma":[0.021116141,0.00076464197,0.0012691148,0.00024051682,0.0003448255,0.000016831016,0.00002210303,0.00012888374,0.9760969],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9990853,0.00005850665,0.00014198686,0.00040503553,0.00014606043,0.00016313142],"domain_scores_gemma":[0.9995242,0.000030580533,0.00006435141,0.0002635564,0.000062597544,0.00005471724],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00014870103,0.0001506409,0.0002226284,0.00007637706,0.000037787515,0.0001446432,0.0000883086,0.00018961918,0.041688785],"category_scores_gemma":[0.000070549606,0.00011039891,0.000027198417,0.000157945,0.00004575897,0.00003257977,0.00006826679,0.00007950186,0.0001134605],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000006216034,0.000040394705,0.00006131248,0.00010780704,0.000011477349,0.000009167452,0.000039106035,2.7584397e-7,0.2474968,0.00101159,0.7497175,0.0014983659],"study_design_scores_gemma":[0.00024438495,0.00007027011,0.00033739215,0.00013174846,0.000029804152,0.000018575643,0.00010854758,0.000059854865,0.05297258,0.00030381675,0.94537014,0.00035288246],"about_ca_topic_score_codex":0.0008978671,"about_ca_topic_score_gemma":0.0019793261,"teacher_disagreement_score":0.19565265,"about_ca_system_score_codex":0.000027096612,"about_ca_system_score_gemma":0.00012193904,"threshold_uncertainty_score":0.95918727},"labels":[],"label_agreement":null},{"id":"W6990482413","doi":"","title":"Direct laser deposition of graded W/Cu layers","year":2005,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"","score_opus":0.012753741471957014,"score_gpt":0.24531149454848783,"score_spread":0.23255775307653082,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6990482413","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96527696,0.000019347091,0.00008138782,0.0005326405,0.00018739431,0.000071704686,0.000010537209,0.000042383348,0.03377762],"genre_scores_gemma":[0.9963407,0.0000047470667,0.0031706495,0.00012648608,0.000077451725,0.000005381161,0.000001805301,0.0000052065907,0.0002675637],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994112,0.000041641077,0.00015073539,0.00014773075,0.00012438721,0.00012425314],"domain_scores_gemma":[0.9996552,0.000045884248,0.00004128153,0.00017657623,0.00004173384,0.000039336654],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00018241693,0.000058771504,0.00010991001,0.00002260682,0.000036101184,0.0000150606575,0.00010337773,0.000036360332,0.0020972693],"category_scores_gemma":[0.00004254109,0.000044691995,0.00004199183,0.00005820335,0.000060391932,0.00008837047,0.00003049751,0.00003520568,0.00011760877],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019705647,0.00005959575,0.00017051956,0.000014508468,0.000002301036,6.296098e-7,0.00014351316,0.00004218978,0.99569595,0.00032057147,0.0014754528,0.0020550885],"study_design_scores_gemma":[0.00015087845,0.000045823923,0.00084090425,0.00001873429,0.0000075114644,0.000002580975,0.000026792684,0.00018422709,0.9960503,0.00064776046,0.0019619735,0.000062541876],"about_ca_topic_score_codex":0.000059976923,"about_ca_topic_score_gemma":0.000052017374,"teacher_disagreement_score":0.033510055,"about_ca_system_score_codex":0.000028208426,"about_ca_system_score_gemma":0.000016502912,"threshold_uncertainty_score":0.99881494},"labels":[],"label_agreement":null},{"id":"W6996059206","doi":"","title":"Preparation of the Ru-Pt alloyed thin-films by chemical vapor deposition using single source precursor","year":2002,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Chemical vapor deposition; Deposition (geology); Process (computing); Substrate (aquarium); Decomposition","score_opus":0.019186915604825567,"score_gpt":0.25239091617998216,"score_spread":0.23320400057515658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6996059206","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9952154,0.00004727994,0.00060734403,0.00027058835,0.00026780806,0.00022212022,0.000013726524,0.00004013749,0.0033155503],"genre_scores_gemma":[0.9975718,0.0000015155075,0.0019294536,0.00007871234,0.00004262112,0.0000066465877,0.000002843685,0.000009142952,0.00035721916],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99906373,0.00008467446,0.0002393523,0.00022563782,0.00022730145,0.00015932965],"domain_scores_gemma":[0.99944633,0.000044930333,0.00012212292,0.00028782012,0.00006048405,0.000038324702],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00017799926,0.00009238555,0.00012668523,0.000011726032,0.00008875223,0.000045162506,0.0001959875,0.000081025595,0.0012938754],"category_scores_gemma":[0.00010337411,0.000061730236,0.000069694695,0.00007269708,0.00011850494,0.00012003343,0.00007482831,0.00007284546,0.000022503335],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024543344,0.0001647074,0.000055576646,0.00001887772,0.0000032667224,1.4964154e-7,0.00073505903,0.000097111944,0.99425846,0.00002359718,0.0041780183,0.0004406121],"study_design_scores_gemma":[0.00015431123,0.000060649567,0.000022108916,0.00003826223,0.00001826922,0.000008961607,0.00003618155,0.027227744,0.97171015,0.00023804023,0.00040446155,0.00008087352],"about_ca_topic_score_codex":0.00004821545,"about_ca_topic_score_gemma":0.00000536269,"teacher_disagreement_score":0.027130632,"about_ca_system_score_codex":0.000053540047,"about_ca_system_score_gemma":0.000011506792,"threshold_uncertainty_score":0.99961907},"labels":[],"label_agreement":null},{"id":"W70003066","doi":"","title":"VIBRATIONAL SPECTRA AND STRUCTURE OF HEXACHLORO-DISILOXANE","year":2006,"lang":"en","type":"article","venue":"The Knowledge Bank (The Ohio State University)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Disiloxane; Spectral line; Chemistry; Physics; Organic chemistry; Catalysis","score_opus":0.007585979510271019,"score_gpt":0.1994402726598114,"score_spread":0.1918542931495404,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W70003066","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98337674,0.00016239569,0.00048364064,0.0005655382,0.00018674851,0.00016463567,0.000072325936,0.000029779316,0.014958194],"genre_scores_gemma":[0.9968796,0.000018389226,0.00015908218,0.000015654321,0.00007875498,1.3341159e-7,0.000004819509,0.000006655244,0.0028369252],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99922866,0.0001308217,0.0001400406,0.00020759758,0.000117362615,0.00017553622],"domain_scores_gemma":[0.99930114,0.00018998403,0.000081010796,0.00029221957,0.00010285872,0.000032810036],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018024017,0.00011841813,0.00014348888,0.000058434856,0.00026255785,0.000034752324,0.00037254154,0.000037010836,0.00071265834],"category_scores_gemma":[0.00001580191,0.0000675257,0.000051205338,0.00021551568,0.00046091934,0.0001259112,0.0001693614,0.00010877662,0.00003316017],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016015487,0.00010966705,0.00064163265,0.000052276988,0.00002402575,0.0000075885155,0.0022310088,0.00035091705,0.91846424,0.07571305,0.0012260851,0.0010193472],"study_design_scores_gemma":[0.0016373132,0.000275818,0.056388617,0.00007078829,0.00017454757,0.000046061345,0.0013115406,0.0011544682,0.83055186,0.041591614,0.06621989,0.0005774533],"about_ca_topic_score_codex":0.00017133441,"about_ca_topic_score_gemma":0.0008812754,"teacher_disagreement_score":0.08791235,"about_ca_system_score_codex":0.000049392413,"about_ca_system_score_gemma":0.000063201034,"threshold_uncertainty_score":0.7803109},"labels":[],"label_agreement":null},{"id":"W7000625034","doi":"","title":"FY2018 EPS Estimates for Power Co. of Canada Cut by Desjardins (POW)","year":2017,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Power (physics); Government (linguistics); Estimation; Margin (machine learning)","score_opus":0.011099714902549442,"score_gpt":0.27289794583076127,"score_spread":0.2617982309282118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7000625034","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0015494354,0.0004772439,0.0005196971,0.0002146625,0.0018732623,0.0005242967,0.002347569,0.00007296048,0.99242085],"genre_scores_gemma":[0.028621087,0.000018237964,0.0015119191,0.000120138975,0.00009405577,0.000031303887,0.000041175732,0.00015798531,0.9694041],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99884224,0.000016481039,0.00021914177,0.0003881757,0.00021435913,0.0003195786],"domain_scores_gemma":[0.9987191,0.00011891791,0.00026403362,0.00071727496,0.00008311085,0.00009759411],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00022702612,0.00023831674,0.0004914157,0.000034403056,0.00008994342,0.000052324376,0.0005411525,0.00019296265,0.03657645],"category_scores_gemma":[0.00022245322,0.00016471317,0.00009302698,0.000013465553,0.00020136235,0.000033206186,0.00007866821,0.00005830937,0.000035146913],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010836225,0.000029116181,0.000053055028,0.00014280198,0.00002529556,0.000001035836,0.000012148407,3.0525402e-7,0.012632262,0.00010838546,0.98694205,0.000042706804],"study_design_scores_gemma":[0.0001814456,0.00006447266,0.000012948562,0.00013824996,0.000014401681,0.000001808015,0.00001529294,0.000012345776,0.09009687,0.00009350715,0.9091507,0.00021792896],"about_ca_topic_score_codex":0.37540093,"about_ca_topic_score_gemma":0.41435933,"teacher_disagreement_score":0.07779132,"about_ca_system_score_codex":0.00008176313,"about_ca_system_score_gemma":0.00053136883,"threshold_uncertainty_score":0.96430427},"labels":[],"label_agreement":null},{"id":"W7009198451","doi":"","title":"Developments in materials and processes: key to advances in thin film design","year":2004,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Key (lock); Thin film; Troubleshooting","score_opus":0.016638802078575644,"score_gpt":0.26505558346900104,"score_spread":0.2484167813904254,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7009198451","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99665993,0.0001241712,0.00041681985,0.00035713156,0.00019285927,0.00033027263,0.000006813908,0.000022347129,0.0018896724],"genre_scores_gemma":[0.9805257,0.0000756332,0.019105604,0.00016990873,0.000013328564,0.000060406972,6.800695e-7,0.0000063516495,0.00004240391],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990839,0.000050923652,0.00024325843,0.0002856702,0.0001164589,0.00021978794],"domain_scores_gemma":[0.9997233,0.000055587352,0.00003066665,0.00010415081,0.000033278713,0.0000529781],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005734506,0.00009624626,0.00016604268,0.00006921125,0.000031312626,0.00006497212,0.0001477041,0.000042349857,0.00026528805],"category_scores_gemma":[0.0002918679,0.0000745338,0.0000049979767,0.00016621473,0.000037464302,0.00025260466,0.000064120824,0.000039620427,0.00006509184],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009476623,0.00007732707,0.00087295566,0.00013923329,6.37175e-7,0.0000107785345,0.004067944,0.00086188375,0.9925845,0.00038128192,0.000037165664,0.000871477],"study_design_scores_gemma":[0.0005058285,0.000078608056,0.005134261,0.00026891447,0.0000010419909,0.000004516869,0.00023753302,0.000003593448,0.9776858,0.014494224,0.0014267603,0.00015891113],"about_ca_topic_score_codex":0.00009016113,"about_ca_topic_score_gemma":0.0004932383,"teacher_disagreement_score":0.018688783,"about_ca_system_score_codex":0.000078900615,"about_ca_system_score_gemma":0.00013391703,"threshold_uncertainty_score":0.30394},"labels":[],"label_agreement":null},{"id":"W7010492101","doi":"","title":"The influence of texture on the reliability of aluminum and copper interconnects /","year":2000,"lang":"en","type":"dissertation","venue":"eScholarship@McGill (McGill)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Texture (cosmology); Reliability (semiconductor); Field (mathematics); Copper","score_opus":0.00918848473978877,"score_gpt":0.23440923680700101,"score_spread":0.22522075206721223,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7010492101","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.981124,0.00029144005,6.627877e-9,0.000129004,0.00080779166,0.0009377868,0.00078200013,0.000056585068,0.015871378],"genre_scores_gemma":[0.99778295,0.0003994072,0.000026293766,0.00020749266,0.000024233876,0.000088735505,0.000035114233,0.000065535976,0.0013702482],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9955558,0.0007907557,0.0012623952,0.0010251194,0.0008209707,0.00054493913],"domain_scores_gemma":[0.994336,0.0023492528,0.0007930683,0.0016916376,0.0006706334,0.00015940182],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0026826188,0.0006185601,0.00082043075,0.00011105996,0.0009612057,0.000093582086,0.0013237626,0.00060937915,0.0004671517],"category_scores_gemma":[0.0034806833,0.00034609548,0.0003236945,0.00031534737,0.0007069491,0.00034318684,0.00021255981,0.0012205645,0.000081486956],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.002520948,0.00049465697,0.00012257864,0.0011522917,0.00012431887,0.000010663787,0.00023560907,0.00036463287,0.9081613,0.04598612,0.00008583724,0.040741067],"study_design_scores_gemma":[0.0006485486,0.0007821085,0.012238059,0.0018638817,0.00019742944,0.000018238365,0.001467949,0.000022467266,0.9289274,0.029688962,0.023291178,0.0008537633],"about_ca_topic_score_codex":0.0006267429,"about_ca_topic_score_gemma":0.0012250709,"teacher_disagreement_score":0.0398873,"about_ca_system_score_codex":0.0002062562,"about_ca_system_score_gemma":0.000090237474,"threshold_uncertainty_score":0.9998991},"labels":[],"label_agreement":null},{"id":"W7014706127","doi":"","title":"Production of capacitive films from Mn thin films: Effects of current density and film thickness","year":2006,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Capacitive sensing; Current density; Current (fluid); Production (economics); Thin film","score_opus":0.00992188567349074,"score_gpt":0.2350951766599173,"score_spread":0.22517329098642658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7014706127","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99767196,0.00019454792,0.0001216654,0.000055483022,0.0012004828,0.00025800432,0.000068921385,0.000024249788,0.00040465425],"genre_scores_gemma":[0.9986646,0.000013707272,0.001142048,0.000008378298,0.000073644354,0.0000097700995,0.0000119213,0.0000057851,0.00007010155],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990097,0.000116502364,0.00024068297,0.00030747923,0.00019420509,0.00013138165],"domain_scores_gemma":[0.9992167,0.00020379391,0.00013860887,0.00025448774,0.00015532848,0.000031134434],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028376016,0.0001067015,0.00024620313,0.000029564686,0.000051733816,0.000013626518,0.00009873476,0.00006106611,0.00029856528],"category_scores_gemma":[0.00028847196,0.00008124678,0.000045601904,0.00006601621,0.00027828958,0.00009965526,0.00007462635,0.000096734904,0.000006987002],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004338712,0.00011541277,0.0028165926,0.00025862764,0.000004646245,0.0000010763146,0.00082130515,0.000021715878,0.9922886,0.00044613253,0.0026733172,0.0005092208],"study_design_scores_gemma":[0.00019929153,0.00008264344,0.02627497,0.00020984003,0.000025375897,0.0000023048128,0.00012787548,0.00014224832,0.96565086,0.00713546,0.000059471462,0.00008967269],"about_ca_topic_score_codex":0.0007978038,"about_ca_topic_score_gemma":0.00008050168,"teacher_disagreement_score":0.026637718,"about_ca_system_score_codex":0.000015249471,"about_ca_system_score_gemma":0.00002689645,"threshold_uncertainty_score":0.33131474},"labels":[],"label_agreement":null},{"id":"W7017102914","doi":"","title":"Application des systèmes de calcul à haute performance dans les études électrothermiques à l'échelle nanoscopique","year":2011,"lang":"fr","type":"dissertation","venue":"Le dépôt institutionnel (Université du Québec à Trois-Rivières)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"Université du Québec à Trois-Rivières","keywords":"Field (mathematics); Process (computing); Stability (learning theory)","score_opus":0.015375869805732526,"score_gpt":0.21463869960210377,"score_spread":0.19926282979637125,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7017102914","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.88029677,0.0013253591,0.109286815,0.0005398767,0.0007406143,0.0010849629,0.00010544245,0.00037925446,0.0062409258],"genre_scores_gemma":[0.9864646,0.0010760742,0.0017299658,0.00009460729,0.0003038973,0.00017622138,0.00019596593,0.00009509931,0.009863534],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.9960905,0.00038551207,0.00077155576,0.0012936158,0.0004468016,0.0010120511],"domain_scores_gemma":[0.9972483,0.00016663945,0.0006389473,0.0009276303,0.0006475142,0.00037094852],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":[],"category_scores_codex":[0.0006338935,0.00089790765,0.0008922031,0.00034094424,0.0029309548,0.00021161526,0.0014228917,0.00085274386,0.0008783295],"category_scores_gemma":[0.000174203,0.00088541344,0.00045035212,0.00051272317,0.0016402942,0.0012858143,0.0002461772,0.00066746905,0.00037898053],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0009523411,0.0017290225,0.10395613,0.0043133204,0.00037628578,0.00009348894,0.13051291,0.015529787,0.5824475,0.14611493,0.00019018946,0.013784064],"study_design_scores_gemma":[0.0025252637,0.0010019151,0.4707993,0.003520603,0.0009696956,0.00027982282,0.029415132,0.06430824,0.41467994,0.0014999261,0.008018368,0.0029818087],"about_ca_topic_score_codex":0.7501368,"about_ca_topic_score_gemma":0.78675705,"teacher_disagreement_score":0.36684316,"about_ca_system_score_codex":0.002604386,"about_ca_system_score_gemma":0.0030379458,"threshold_uncertainty_score":0.99935967},"labels":[],"label_agreement":null},{"id":"W7025151048","doi":"","title":"Tailoring the microstructure and surface morphology of metal thin films for nano-electro-mechanical systems applications","year":2008,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Microstructure; Thin film; Morphology (biology); Metal; Surface (topology)","score_opus":0.017709702594726384,"score_gpt":0.246645939101016,"score_spread":0.22893623650628964,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7025151048","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.996303,0.00025146714,0.0020451609,0.0003243926,0.00026152932,0.00052522705,0.00007142106,0.000022777016,0.00019500754],"genre_scores_gemma":[0.996061,0.000021600003,0.003585222,0.000039319017,0.000045925142,0.00006423918,0.0000031159784,0.000007476362,0.00017210076],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99926543,0.000053832286,0.00019790328,0.00022427786,0.000087244945,0.00017132814],"domain_scores_gemma":[0.9993547,0.00020601723,0.00007357868,0.00025829702,0.00007468138,0.00003269848],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00032620074,0.00008145997,0.00018330276,0.000010811147,0.00018278263,0.0000167657,0.00020062602,0.00007101752,0.00011052002],"category_scores_gemma":[0.000053108877,0.000048752856,0.000046889705,0.000055036864,0.00019383167,0.000038582217,0.00006991077,0.00007667245,0.000004906904],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021299864,0.000016390553,0.000046115085,0.000034827422,0.000006423184,3.6475024e-7,0.00015899386,0.000047745976,0.9923147,0.0066683576,0.0006513089,0.000033489658],"study_design_scores_gemma":[0.00024247244,0.00012208914,0.00015094805,0.000008575265,0.000022430997,0.00015750527,0.00018077304,0.0014216909,0.9905375,0.0032951266,0.0037672576,0.00009358796],"about_ca_topic_score_codex":0.000060202554,"about_ca_topic_score_gemma":0.0000037345148,"teacher_disagreement_score":0.003373231,"about_ca_system_score_codex":0.000012223509,"about_ca_system_score_gemma":0.000031906988,"threshold_uncertainty_score":0.19880837},"labels":[],"label_agreement":null},{"id":"W7043455354","doi":"","title":"Schneider Electric : and Alfa Laval Extend Collaboration","year":2021,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Work (physics); Government (linguistics); Context (archaeology); Field (mathematics)","score_opus":0.007901326200605772,"score_gpt":0.2556463170323327,"score_spread":0.24774499083172694,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7043455354","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.028866276,0.009294554,0.00013556726,0.0008240996,0.0013348352,0.00038714358,0.000035127952,0.00023070126,0.9588917],"genre_scores_gemma":[0.022203106,0.0007439538,0.0012188286,0.00023135298,0.00033704046,0.000017214525,0.000021324293,0.00012870276,0.9750985],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99907184,0.000059701102,0.0001439391,0.00041078345,0.00014740595,0.00016635937],"domain_scores_gemma":[0.9995163,0.00003130681,0.00006495601,0.0002679573,0.000063504674,0.000055960743],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00015095578,0.00015306819,0.00022528958,0.00007782472,0.000038591348,0.00014390679,0.00008980556,0.00019020209,0.04315593],"category_scores_gemma":[0.000071347065,0.00011236952,0.000027687605,0.00016163499,0.000045746456,0.00003278814,0.00007083984,0.00008109987,0.00010963781],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000064529813,0.00004206122,0.00006391166,0.000111692476,0.000011942872,0.000009601361,0.000043844237,2.7972433e-7,0.24145558,0.000992472,0.7554683,0.0017938798],"study_design_scores_gemma":[0.00023850148,0.000069699825,0.00035684282,0.0001308486,0.00002983677,0.000017997096,0.00011311771,0.00005930438,0.047797572,0.00030397504,0.9505332,0.00034906773],"about_ca_topic_score_codex":0.00091100065,"about_ca_topic_score_gemma":0.0021447288,"teacher_disagreement_score":0.19506495,"about_ca_system_score_codex":0.000027680047,"about_ca_system_score_gemma":0.00012774862,"threshold_uncertainty_score":0.95771873},"labels":[],"label_agreement":null},{"id":"W7151270643","doi":"10.1002/j.1538-9235.2000.tb03056.x","title":"(CL‐166) <b>SEVERITY AND MANAGEMENT OF CL RELATED COMPLICATIONS WITH CONTINUOUS WEAR OF HIGH DK SILICONE HYDROGEL LENSES.</b>","year":2000,"lang":"en","type":"article","venue":"Optometry and Vision Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Silicone; Silicone hydrogel; Silicone Elastomers","score_opus":0.009307609835372207,"score_gpt":0.33053453859749116,"score_spread":0.32122692876211895,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7151270643","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9969916,0.00014221635,0.00012553307,0.00018493971,0.000055598102,0.00022429739,0.000026033631,0.00002337337,0.0022264326],"genre_scores_gemma":[0.99779856,0.00023471897,0.0016886108,0.00003554742,0.0000030044494,0.000004170027,0.0000010667475,0.0000044025146,0.00022993685],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99858207,0.000033534263,0.00032755782,0.00047936087,0.0003764775,0.00020098],"domain_scores_gemma":[0.9991303,0.000088162604,0.00012461143,0.00041889568,0.00012862266,0.000109408626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008888244,0.00011126477,0.00025358613,0.0001275693,0.00022241157,0.000055717996,0.0002800286,0.000043491124,0.00037684198],"category_scores_gemma":[0.000025907704,0.00007809082,0.00002301827,0.0008397806,0.001640285,0.00030343398,0.00015966236,0.00006867316,0.000012948548],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00024973194,0.0005889595,0.01714784,0.00032329778,0.000019833064,0.000005603752,0.00083573966,0.0000819505,0.93767214,0.004419102,0.000047844023,0.038607955],"study_design_scores_gemma":[0.0014377395,0.0008930205,0.65693146,0.00054320385,0.00005168901,0.00006615503,0.00066870934,0.001618106,0.33591157,0.00093271374,0.000605583,0.00034006583],"about_ca_topic_score_codex":0.00009606354,"about_ca_topic_score_gemma":0.0000019459585,"teacher_disagreement_score":0.6397836,"about_ca_system_score_codex":0.000015241482,"about_ca_system_score_gemma":0.000022628545,"threshold_uncertainty_score":0.6043699},"labels":[],"label_agreement":null},{"id":"W968404511","doi":"10.1017/cbo9781139021128.023","title":"Technology parameters","year":2013,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Computer science; Content (measure theory); World Wide Web; Database; Mathematics","score_opus":0.010447549254215328,"score_gpt":0.23698706640531847,"score_spread":0.22653951715110315,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W968404511","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0032159032,0.0002755757,0.00020089024,0.00055018865,0.0010744366,0.00023290799,0.000010441054,0.00076011627,0.9936795],"genre_scores_gemma":[0.0021424573,0.000023515624,0.005400186,0.00015043387,0.000058018548,0.000032824955,0.0000017552594,0.0001342395,0.99205655],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99930567,0.000014344834,0.000111372334,0.00030374693,0.000078500656,0.00018637959],"domain_scores_gemma":[0.99940604,0.00001575114,0.000057259596,0.00047092073,0.000013735599,0.00003629475],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.000055395605,0.00013725163,0.00020501562,0.00014582649,0.000013830298,0.00003323808,0.00028828278,0.00033043654,0.1415672],"category_scores_gemma":[0.000031552667,0.000087584296,0.000041924657,0.00006331974,0.00016775787,0.000014513424,0.000106080544,0.000090281705,0.015613283],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[4.6129958e-7,0.000014614694,0.000013268148,0.000019744031,0.0000045953734,0.000001320195,0.0000035429573,1.18613606e-7,0.008146803,0.0021088135,0.9875285,0.0021582225],"study_design_scores_gemma":[0.000054795182,0.000029033452,0.0000019964723,0.00004294,0.000006327684,0.000003711391,0.000024129458,0.0000072461066,0.0145245185,0.0007394893,0.984405,0.00016083832],"about_ca_topic_score_codex":0.0009976601,"about_ca_topic_score_gemma":0.000095876334,"teacher_disagreement_score":0.12595391,"about_ca_system_score_codex":0.000016763963,"about_ca_system_score_gemma":0.0000163372,"threshold_uncertainty_score":0.9851532},"labels":[],"label_agreement":null}]}