{"meta":{"query_hash":"b4a16a220b7e","filters":{"topic":"Copper Interconnects and Reliability"},"cohort_total":175,"direct_labels_cover":0,"predictions_cover":175,"exported":175,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/b4a16a220b7e","api":"https://metacan.xera.ac/api/v1/cohort?topic=Copper+Interconnects+and+Reliability"},"results":[{"id":"W1527696353","doi":"10.1109/irws.2004.1422743","title":"Effects of capillary forces on the global thinning of copper metallization under electromigration stress","year":2005,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Void (composites); Copper; Materials science; Electric field; Capillary action; Mechanics; Instability; Dielectric; Finite element method; Boundary value problem; Composite material; Condensed matter physics; Metallurgy; Optoelectronics; Structural engineering; Physics; Engineering","score_opus":0.007610294167431161,"score_gpt":0.24131467820565225,"score_spread":0.23370438403822108,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1527696353","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99642086,0.00010047501,0.0025618915,0.000014661647,0.0000032640012,0.000002875114,0.0000113337155,0.00003439094,0.00085039693],"genre_scores_gemma":[0.99951005,0.0000583711,0.00023843213,0.0000031071736,0.0000013558634,0.0000017413964,0.000004642169,0.0000043749988,0.00017799066],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999285,0.00000998527,0.0000023592972,0.000011231495,0.000019760033,0.000028118544],"domain_scores_gemma":[0.99979657,0.00008999416,0.000046247555,0.000014423363,0.000024417812,0.000028412625],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011488418,0.00029486127,0.00024920923,0.00021704801,0.00018115138,0.00029231719,0.00014781098,0.00023686528,0.00050793594],"category_scores_gemma":[0.0005445207,0.00013668386,0.00020924589,0.0001320129,0.0005308545,0.00024258507,0.0003924763,0.00018904082,0.00006140312],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040204532,0.0000799162,0.008888987,0.00009359381,0.00004230581,0.0019577837,0.000259165,0.41361183,0.5464619,0.0027562808,0.00023312955,0.025213193],"study_design_scores_gemma":[0.000036286612,0.0005993562,0.01510342,0.000017243054,0.000055804132,0.00041761715,0.00015867097,0.7852807,0.1967678,0.0009016798,0.0006227197,0.000038689723],"about_ca_topic_score_codex":0.0016692217,"about_ca_topic_score_gemma":0.0017510661,"teacher_disagreement_score":0.0016692217,"about_ca_system_score_codex":0.0003174059,"about_ca_system_score_gemma":0.00015858933,"threshold_uncertainty_score":0.003319025},"labels":[],"label_agreement":null},{"id":"W1580141928","doi":"10.1002/0470009403.ch18","title":"Interdiffusion in Thin Films","year":2005,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Windsor","funders":"","keywords":"Waviness; Electromigration; Diffusion; Materials science; Thin film; Welding; Surface diffusion; Metallurgy; Composite material; Nanotechnology; Thermodynamics; Chemistry; Physics; Adsorption","score_opus":0.008081511453186559,"score_gpt":0.25215835310514784,"score_spread":0.24407684165196128,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1580141928","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.1727072,0.14546639,0.1961759,0.0042257216,0.0047816,0.000279566,0.00095215125,0.0014653647,0.4739461],"genre_scores_gemma":[0.47427425,0.07248497,0.040334243,0.0007079349,0.00059188996,0.00024532,0.0007862062,0.00053005747,0.41004512],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998585,0.0000118104745,0.0000052619703,0.000042276948,0.0000667883,0.000015357353],"domain_scores_gemma":[0.9999474,0.000020020621,0.0000051267375,0.0000090476815,0.000014867737,0.0000034874504],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012379186,0.0004588534,0.00044225113,0.00041348557,0.00041487598,0.0009614369,0.0005861936,0.00054886204,0.008458663],"category_scores_gemma":[0.00024211853,0.00036611946,0.00027515893,0.00047110568,0.00040783294,0.0015614369,0.00053784717,0.000829407,0.0017516646],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000088579654,0.000089876215,0.0003441026,0.0017234557,0.000048226706,0.0005527005,0.00066466903,0.0042617475,0.30783543,0.52951837,0.016900985,0.13797183],"study_design_scores_gemma":[0.00004236261,0.00013144902,0.0015116126,0.00031233273,0.000050941177,0.0010753863,0.0002358741,0.015513664,0.36075982,0.15051068,0.46980137,0.0000544635],"about_ca_topic_score_codex":0.0004868632,"about_ca_topic_score_gemma":0.0004882889,"teacher_disagreement_score":0.008458663,"about_ca_system_score_codex":0.0005533501,"about_ca_system_score_gemma":0.00021531823,"threshold_uncertainty_score":0.028297067},"labels":[],"label_agreement":null},{"id":"W1581170550","doi":"10.1023/a:1008375423418","title":"A 0.8 μm BiCMOS Gate Driver for IGBT Power Switch","year":2000,"lang":"en","type":"article","venue":"Analog Integrated Circuits and Signal Processing","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Insulated-gate bipolar transistor; Gate driver; Electrical engineering; BiCMOS; Bipolar junction transistor; Voltage; High voltage; Gate voltage; Electronic engineering; Transistor; Materials science; Engineering","score_opus":0.013425287337960855,"score_gpt":0.2450639432631991,"score_spread":0.23163865592523825,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1581170550","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9252096,0.00033303475,0.04052107,0.00081273937,0.00036505566,0.00017482419,0.00088427216,0.0034574629,0.028242001],"genre_scores_gemma":[0.97737736,0.00008874288,0.008031391,0.00016796651,0.000034216366,0.000031801253,0.00017221461,0.00006639427,0.014029881],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999293,0.0000049810133,0.0000026987711,0.00001568197,0.00002840415,0.000018968001],"domain_scores_gemma":[0.99984884,0.000025959449,0.000013749852,0.000015960408,0.00007077039,0.000024720674],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008821043,0.00022034925,0.0001461615,0.00021074638,0.00033454227,0.0002867808,0.0007011299,0.0002717965,0.0035212126],"category_scores_gemma":[0.00017050853,0.00013234299,0.000094441006,0.00014769644,0.000109975095,0.00024020803,0.00018613896,0.00022474719,0.0009281669],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00028836782,0.000083867904,0.0011497767,0.000088847824,0.000016152824,0.0003878647,0.00017172018,0.0006487779,0.9622458,0.001587423,0.0053403163,0.027990997],"study_design_scores_gemma":[0.00009620225,0.0018806973,0.013787449,0.0000459054,0.000076357486,0.0015181743,0.00021669012,0.026749056,0.9005345,0.0012705743,0.05377316,0.000051252602],"about_ca_topic_score_codex":0.0017963441,"about_ca_topic_score_gemma":0.0037266286,"teacher_disagreement_score":0.0035212126,"about_ca_system_score_codex":0.0004533337,"about_ca_system_score_gemma":0.0003688515,"threshold_uncertainty_score":0.011779606},"labels":[],"label_agreement":null},{"id":"W1871803452","doi":"10.1109/icpadm.1994.413980","title":"Dual-frequency plasma deposition of high quality insulating thin films","year":2002,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Materials science; Dielectric; Substrate (aquarium); Analytical Chemistry (journal); Hexamethyldisiloxane; Plasma-enhanced chemical vapor deposition; Amorphous solid; Deposition (geology); Dissipation factor; Electrical resistivity and conductivity; Plasma; Thin film; Microwave; Permittivity; Chemical vapor deposition; Optoelectronics; Nanotechnology; Electrical engineering; Physics; Crystallography; Chemistry","score_opus":0.031253195010215354,"score_gpt":0.2684792935558295,"score_spread":0.23722609854561416,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1871803452","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97729856,0.00080485764,0.017130567,0.000055446955,0.00003694874,0.000025074693,0.00032995368,0.00015281099,0.0041658473],"genre_scores_gemma":[0.9612667,0.0006758096,0.034690432,0.00003666635,0.000012534714,0.000025416964,0.00034496313,0.0000646797,0.0028827465],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999219,0.000005594241,0.000005355777,0.000022892267,0.00002949478,0.000014821744],"domain_scores_gemma":[0.9998721,0.000028604822,0.000032065956,0.000024539675,0.000030255733,0.000012364745],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000111656394,0.00023694908,0.00016401787,0.00019861154,0.00013086261,0.00028140692,0.00023934933,0.00016579246,0.0009429331],"category_scores_gemma":[0.00022840867,0.0001842896,0.000104789506,0.00016747523,0.00018000208,0.00019209173,0.000224204,0.00026217682,0.0002690884],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009001783,0.0000020024568,0.000049999206,0.000016709697,0.0000015364458,0.00001996638,0.000007322385,0.00006560994,0.9985839,0.000058498266,0.000026021133,0.0011593484],"study_design_scores_gemma":[0.0000034271727,0.000029866074,0.00044449215,0.0000015594222,0.000004055904,0.000053368414,0.000005207124,0.00051019824,0.9978696,0.000019852412,0.0010569688,0.000001377388],"about_ca_topic_score_codex":0.00031646076,"about_ca_topic_score_gemma":0.00058325264,"teacher_disagreement_score":0.0009429331,"about_ca_system_score_codex":0.00020871725,"about_ca_system_score_gemma":0.00012016375,"threshold_uncertainty_score":0.0031544566},"labels":[],"label_agreement":null},{"id":"W1899832544","doi":"10.1109/vmic.1990.127894","title":"A contact electromigration study of Al-Si-Cu alloys","year":2002,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Electromigration; Materials science; Silicon; Alloy; Contact resistance; Aluminium; Metallurgy; Current density; Copper; Optoelectronics; Nanotechnology; Composite material","score_opus":0.02119953276220001,"score_gpt":0.2564882317802021,"score_spread":0.23528869901800206,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1899832544","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99450797,0.001436345,0.00095944264,0.0000255852,0.000023771368,0.000027083339,0.00009417723,0.000035324447,0.0028902453],"genre_scores_gemma":[0.99619675,0.00034706638,0.00063828524,0.000015133003,0.0000095182695,0.000016087399,0.00013451162,0.000011238078,0.002631458],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99980575,0.000024576642,0.000007980222,0.000043156473,0.00007649912,0.0000420692],"domain_scores_gemma":[0.9997626,0.000045252138,0.000035008317,0.000030504758,0.0001084215,0.000018208691],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011745045,0.00024404703,0.00032949838,0.0004286066,0.00046591094,0.00038138786,0.0004143392,0.00038914804,0.0018881083],"category_scores_gemma":[0.0004932113,0.00018274556,0.00015279179,0.0006322938,0.00017916066,0.00033622407,0.00021230397,0.00016952936,0.0005257998],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004354058,0.00016280233,0.0037792763,0.00031765777,0.000046619585,0.0009937618,0.0003938402,0.0020128565,0.9798338,0.001077426,0.00073505536,0.010211479],"study_design_scores_gemma":[0.00005923104,0.0034716183,0.027427953,0.000029002442,0.000076384524,0.0011821424,0.0006333016,0.024372485,0.93312824,0.0004037575,0.00918954,0.000026349091],"about_ca_topic_score_codex":0.00225661,"about_ca_topic_score_gemma":0.0019312386,"teacher_disagreement_score":0.00225661,"about_ca_system_score_codex":0.00033279142,"about_ca_system_score_gemma":0.00015097052,"threshold_uncertainty_score":0.006316304},"labels":[],"label_agreement":null},{"id":"W1965852723","doi":"10.1007/s11664-001-0038-7","title":"Microstructural characterization of inlaid copper interconnect lines","year":2001,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":70,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Trench; Microstructure; Annealing (glass); Grain size; Copper; Texture (cosmology); Diffraction; Composite material; Grain boundary; Metallurgy; Optics","score_opus":0.008954485509622353,"score_gpt":0.24996902846438349,"score_spread":0.24101454295476113,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1965852723","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9941089,0.00015726798,0.00247931,0.000035607583,0.000008441305,0.000010438133,0.00019663203,0.000071629875,0.002931877],"genre_scores_gemma":[0.9974451,0.000033663782,0.0009808723,0.000007951592,0.000003668826,0.0000064372343,0.00014826776,0.000010844663,0.0013632909],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99987173,0.000013868284,0.0000062755107,0.000025838992,0.000056875037,0.000025327141],"domain_scores_gemma":[0.99949384,0.000050875242,0.00011414248,0.0000630754,0.00024744167,0.000030520587],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012446487,0.0001619332,0.00015421449,0.00062824396,0.0005082517,0.00037721242,0.00030655653,0.00029995988,0.0013606936],"category_scores_gemma":[0.00048522378,0.0001986409,0.000070193535,0.00042220714,0.00022770154,0.00038836052,0.00016263836,0.00016987711,0.00015217748],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00037316067,0.00006175113,0.0074591683,0.000095436655,0.000013938377,0.00024986203,0.0003742466,0.0025446522,0.9781139,0.0005496169,0.00072102394,0.009443225],"study_design_scores_gemma":[0.000021941009,0.00053764955,0.12661715,0.00001735579,0.000036976067,0.0006547998,0.0006904779,0.02820942,0.8349265,0.00022836514,0.008033138,0.000026280593],"about_ca_topic_score_codex":0.003094885,"about_ca_topic_score_gemma":0.0069557023,"teacher_disagreement_score":0.003094885,"about_ca_system_score_codex":0.0005144697,"about_ca_system_score_gemma":0.00020533321,"threshold_uncertainty_score":0.0061537623},"labels":[],"label_agreement":null},{"id":"W1967073963","doi":"10.1007/bf03027341","title":"Evolution of interface voids under current and temperature stress in integrated circuit metallization","year":2004,"lang":"en","type":"article","venue":"Metals and Materials International","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Materials science; Void (composites); Copper; Isotropy; Finite element method; Dielectric; Composite material; Boundary value problem; Short circuit; Mechanics; Stress (linguistics); Conductor; Metallurgy; Voltage; Optoelectronics; Structural engineering; Electrical engineering","score_opus":0.014814883801921383,"score_gpt":0.2705647128364119,"score_spread":0.25574982903449056,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1967073963","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99891555,0.00022408094,0.00040858152,0.000012566391,0.0000035492728,0.0000023154948,0.00007374881,0.000034922694,0.00032469534],"genre_scores_gemma":[0.9995384,0.000039623068,0.00012177814,0.000005580109,0.0000024461294,0.0000021286826,0.00006618179,0.000009021824,0.00021481974],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999936,0.0000059536064,0.0000030359683,0.000016429705,0.000018122986,0.000020564039],"domain_scores_gemma":[0.99948967,0.00009781909,0.00015515985,0.00004000912,0.00015304888,0.00006429919],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011912361,0.000083668114,0.00018319917,0.00031543328,0.0002166814,0.0004348265,0.00020793325,0.00023242497,0.0010983973],"category_scores_gemma":[0.0005469449,0.000109834145,0.00008918513,0.00028388904,0.00040332502,0.00047110362,0.00015118992,0.00018229308,0.00010760353],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000900082,0.00008902327,0.015903553,0.00005091959,0.000014867678,0.00018857067,0.00027451996,0.0014777676,0.9719849,0.00047789322,0.00019871989,0.008439211],"study_design_scores_gemma":[0.000031127114,0.00068463857,0.21618721,0.000012228863,0.000045694374,0.0003806799,0.0006187696,0.017845865,0.7617732,0.00063961407,0.0017526203,0.000028312143],"about_ca_topic_score_codex":0.0015749511,"about_ca_topic_score_gemma":0.0014607663,"teacher_disagreement_score":0.0015749511,"about_ca_system_score_codex":0.0002760863,"about_ca_system_score_gemma":0.00015012443,"threshold_uncertainty_score":0.0036745071},"labels":[],"label_agreement":null},{"id":"W1967077032","doi":"10.1016/j.micron.2013.11.002","title":"In situ TEM study of stability of TaRhx diffusion barriers using a novel sample preparation method","year":2013,"lang":"en","type":"article","venue":"Micron","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Institute for Nanotechnology; University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Materials science; Diffusion barrier; Nucleation; Transmission electron microscopy; Diffusion; Focused ion beam; Atomic diffusion; Analytical Chemistry (journal); Grain size; Surface diffusion; Void (composites); Layer (electronics); Composite material; Crystallography; Nanotechnology; Ion; Chemistry","score_opus":0.030514685576470826,"score_gpt":0.318507289268438,"score_spread":0.2879926036919672,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1967077032","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99560094,0.0002613971,0.0034325155,0.00004036833,0.000015882844,0.000008532371,0.000089201334,0.000036171758,0.00051492057],"genre_scores_gemma":[0.99401206,0.00020573259,0.00434424,0.00001373842,0.000007768376,0.000015240888,0.00009773905,0.000021792437,0.0012816002],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999199,0.000008071102,0.0000052101555,0.000029638128,0.000023981416,0.000013187031],"domain_scores_gemma":[0.9998524,0.00002989678,0.00004410749,0.000021821488,0.00004251589,0.000009192741],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017352247,0.00018578043,0.0001602146,0.000106192965,0.000199488,0.00021917942,0.00028984618,0.00025153166,0.001259804],"category_scores_gemma":[0.00018729868,0.00020217897,0.000084479456,0.00011309646,0.00018105381,0.00027058492,0.00013390664,0.00027979267,0.00017143779],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032499607,0.000006615673,0.00009954121,0.000021298767,0.000002267085,0.000018268098,0.00002720664,0.00003371187,0.9992987,0.000039402006,0.000017265202,0.00040320226],"study_design_scores_gemma":[0.000006159155,0.00008443762,0.0019383583,0.0000019484644,0.0000073924666,0.00006513438,0.00003231651,0.00083738676,0.996473,0.000011067876,0.0005389242,0.0000037625],"about_ca_topic_score_codex":0.00041075182,"about_ca_topic_score_gemma":0.00080012286,"teacher_disagreement_score":0.001259804,"about_ca_system_score_codex":0.00015666593,"about_ca_system_score_gemma":0.000099958146,"threshold_uncertainty_score":0.0042144656},"labels":[],"label_agreement":null},{"id":"W1969226800","doi":"10.1116/1.2013311","title":"Silver coplanar waveguides as the passive components of choice for microwave integrated circuits","year":2005,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Coplanar waveguide; Monolithic microwave integrated circuit; Microwave; Materials science; Electromigration; Resistive touchscreen; Optoelectronics; Fabrication; Electronic circuit; Electrical engineering; Electronic component; Broadband; Integrated circuit; Electronic engineering; CMOS; Telecommunications; Computer science; Engineering; Composite material; Amplifier","score_opus":0.01967539731710649,"score_gpt":0.2536848253871493,"score_spread":0.23400942807004282,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1969226800","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.62252635,0.028652044,0.2919318,0.0020503146,0.0017870732,0.00029021353,0.0009004704,0.0023611628,0.04950051],"genre_scores_gemma":[0.77228135,0.012475124,0.17112648,0.0005342372,0.0003291211,0.00017679413,0.00075967854,0.00049579074,0.041821435],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99968505,0.00003175318,0.00001480103,0.00010457581,0.00013350153,0.000030439509],"domain_scores_gemma":[0.99968135,0.00005028573,0.00008534391,0.000041297062,0.0001156783,0.000026073241],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024947646,0.00055415527,0.0002792578,0.00033668242,0.00024884834,0.0007894976,0.00046432682,0.0005097983,0.0017693082],"category_scores_gemma":[0.00054821867,0.0002973991,0.00019402102,0.00055791653,0.0003449204,0.0005399841,0.00022391132,0.000767627,0.002037376],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007163037,0.000033217064,0.00061895576,0.00023570683,0.000008852154,0.0001513833,0.000062465566,0.00033237995,0.9578772,0.005736806,0.0017623903,0.03310888],"study_design_scores_gemma":[0.000022039347,0.0004916485,0.0019822563,0.000036144957,0.00004381016,0.0013548239,0.00008350857,0.0028326395,0.9392347,0.001504468,0.052393015,0.00002096257],"about_ca_topic_score_codex":0.00029369272,"about_ca_topic_score_gemma":0.0006730186,"teacher_disagreement_score":0.0017693082,"about_ca_system_score_codex":0.00032358884,"about_ca_system_score_gemma":0.00019158724,"threshold_uncertainty_score":0.00591892},"labels":[],"label_agreement":null},{"id":"W1969230856","doi":"10.1007/s10854-013-1662-8","title":"Stability of TaRhx as a potential diffusion barrier for Cu metallization: capacitance–voltage tests after bias temperature stress","year":2013,"lang":"en","type":"article","venue":"Journal of Materials Science Materials in Electronics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"National Research Council Canada; Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Capacitor; Materials science; Diffusion barrier; Capacitance; Analytical Chemistry (journal); Barrier layer; Diffusion; Stress (linguistics); Optoelectronics; Composite material; Voltage; Layer (electronics); Chemistry; Electrical engineering; Electrode; Thermodynamics","score_opus":0.010332411263483254,"score_gpt":0.25049008616885027,"score_spread":0.24015767490536702,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1969230856","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99857056,0.00034312063,0.00045148362,0.0000433305,0.000030047153,0.0000066457965,0.00016256107,0.00003667934,0.00035565367],"genre_scores_gemma":[0.9987326,0.00008508617,0.0002488614,0.000010783739,0.0000042819174,0.000004350298,0.00010483579,0.000012996685,0.0007960851],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996973,0.000021272908,0.000018659308,0.00008367348,0.00009944056,0.00007966709],"domain_scores_gemma":[0.9991117,0.0001889931,0.0001640329,0.00012663277,0.00031099224,0.000097721415],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028690713,0.00021309937,0.00021116876,0.00026956448,0.00030854892,0.0004847109,0.0006066779,0.00046797463,0.002508337],"category_scores_gemma":[0.0009481307,0.00020236296,0.00012771715,0.0003284659,0.00037944043,0.0005228354,0.00022712695,0.00039931474,0.00033807335],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005074877,0.000036918398,0.0009941936,0.000044118675,0.000018131166,0.00013537353,0.00016573363,0.00021171107,0.9957652,0.000091896596,0.0001333887,0.0018959072],"study_design_scores_gemma":[0.000010616722,0.00031705882,0.004675318,0.000006229796,0.000017874478,0.000061765684,0.00010019596,0.0011828651,0.9929222,0.000020226025,0.0006777225,0.000007911565],"about_ca_topic_score_codex":0.0018881345,"about_ca_topic_score_gemma":0.0023024795,"teacher_disagreement_score":0.002508337,"about_ca_system_score_codex":0.0003361885,"about_ca_system_score_gemma":0.00025853535,"threshold_uncertainty_score":0.008391261},"labels":[],"label_agreement":null},{"id":"W1973820040","doi":"10.1557/jmr.2001.0458","title":"Effect of material properties on integration damage in organosilicate glass films","year":2001,"lang":"en","type":"article","venue":"Journal of materials research/Pratt's guide to venture capital sources","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":24,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Photoresist; Dielectric; Chemical vapor deposition; Plasma; Deposition (geology); Chemical engineering; Moiety; Thin film; Mesoporous material; Composite material; Nanotechnology; Optoelectronics; Layer (electronics); Organic chemistry","score_opus":0.023967585899613304,"score_gpt":0.3296358317462998,"score_spread":0.3056682458466865,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1973820040","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9973794,0.0010447282,0.00020501697,0.000045412682,0.000025147185,0.000010076448,0.00014920322,0.000033036158,0.0011080316],"genre_scores_gemma":[0.9985997,0.0004110911,0.00016563751,0.000029056466,0.000007917119,0.0000061279065,0.00011627332,0.00002224563,0.0006418232],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983156,0.000017490873,0.000013463859,0.00003628464,0.000047176018,0.0000539808],"domain_scores_gemma":[0.9995571,0.00016890002,0.00012126469,0.000035511337,0.000077431076,0.000039712824],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023171931,0.00026110368,0.0002426989,0.00022944085,0.00038159647,0.00039362418,0.00030971068,0.0005072044,0.0031898452],"category_scores_gemma":[0.00056481117,0.00030988702,0.00020964388,0.00030404693,0.00023092996,0.00043502115,0.00020746788,0.00036798994,0.00036386246],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00051583,0.000048694863,0.0011166761,0.000093963994,0.00003574793,0.0002494793,0.000089751156,0.00079974957,0.99486095,0.00006446231,0.00017328784,0.0019514676],"study_design_scores_gemma":[0.000015651534,0.00058637257,0.009777752,0.000016919197,0.00004497699,0.00009973083,0.000089331654,0.0015293313,0.98722667,0.000020251926,0.00058432075,0.000008781658],"about_ca_topic_score_codex":0.0015710621,"about_ca_topic_score_gemma":0.0024246755,"teacher_disagreement_score":0.0031898452,"about_ca_system_score_codex":0.00036487274,"about_ca_system_score_gemma":0.00015590533,"threshold_uncertainty_score":0.010671079},"labels":[],"label_agreement":null},{"id":"W1974364079","doi":"10.1016/j.tsf.2007.08.071","title":"Plasma ash processing solutions for advanced interconnect technology","year":2007,"lang":"en","type":"article","venue":"Thin Solid Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Interconnection; Plasma; Engineering physics; Materials science; Process engineering; Computer science; Nanotechnology; Engineering; Telecommunications; Physics","score_opus":0.021500699061331806,"score_gpt":0.30461115949745987,"score_spread":0.2831104604361281,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1974364079","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22887139,0.14884903,0.41315112,0.009037937,0.006500482,0.0009250994,0.00095828815,0.0044981195,0.18720858],"genre_scores_gemma":[0.3846407,0.06042016,0.2789373,0.0011261684,0.0012274372,0.0003819026,0.0016870148,0.00059487135,0.2709844],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995414,0.000041864398,0.000020462434,0.000050368722,0.0003148039,0.000031129974],"domain_scores_gemma":[0.99973685,0.000035415276,0.000031745625,0.000038840764,0.00014134977,0.000015846004],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005928297,0.00048460835,0.00037042968,0.0006762278,0.0009108733,0.0010660595,0.000753509,0.0011798054,0.009584841],"category_scores_gemma":[0.0004931037,0.0003639157,0.00026112708,0.0008532863,0.0002668674,0.0014907598,0.0007268244,0.0012280588,0.003478039],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00023253965,0.00015858037,0.0006319667,0.0012444512,0.000043709202,0.00036206926,0.0003369595,0.0010229978,0.5154002,0.022050017,0.02563507,0.4328815],"study_design_scores_gemma":[0.0000653767,0.0004951866,0.0012988077,0.00011560563,0.00008337711,0.0012711558,0.00038272375,0.004263334,0.5567903,0.008767968,0.426435,0.00003109125],"about_ca_topic_score_codex":0.00045047526,"about_ca_topic_score_gemma":0.0011046702,"teacher_disagreement_score":0.009584841,"about_ca_system_score_codex":0.0004936177,"about_ca_system_score_gemma":0.0007998191,"threshold_uncertainty_score":0.032064497},"labels":[],"label_agreement":null},{"id":"W1980943939","doi":"10.1021/cm051910o","title":"XRD and XPS Study of Cu−Ni Interactions on Reduced Copper−Nickel−Aluminum Oxide Solid Solution Catalysts","year":2006,"lang":"en","type":"article","venue":"Chemistry of Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":236,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Copper; Nickel; Alloy; Materials science; Solid solution; Catalysis; Inorganic chemistry; Hydrogen; Oxide; Aluminium; X-ray photoelectron spectroscopy; Metallurgy; Chemistry; Chemical engineering","score_opus":0.016460775421120243,"score_gpt":0.2780758528358391,"score_spread":0.26161507741471884,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1980943939","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99622947,0.0009030605,0.0011945242,0.000023724364,0.00001275458,0.000009415604,0.0002465992,0.00002992792,0.0013505835],"genre_scores_gemma":[0.9959115,0.0005535691,0.0013740383,0.000015996657,0.000006019193,0.000016457856,0.00051847554,0.00001164863,0.0015923377],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983156,0.000016399374,0.000009954961,0.000027372214,0.0000873785,0.000027212118],"domain_scores_gemma":[0.9999105,0.000019597232,0.000011186972,0.000005291694,0.000044126922,0.000009286859],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013040073,0.00031584798,0.00032202853,0.00048546624,0.0001887323,0.0002452621,0.00043820887,0.00029993927,0.001021258],"category_scores_gemma":[0.00020379371,0.00020899127,0.00019545542,0.00056013203,0.00017619139,0.00014900562,0.00011348754,0.0003829092,0.00019986591],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007749593,0.000013294645,0.00024597408,0.00007696116,0.00001130538,0.00006734472,0.000052027466,0.0001483741,0.9974915,0.0000878443,0.000052813626,0.0016751252],"study_design_scores_gemma":[0.0000068234367,0.00008681806,0.003879346,0.0000062654562,0.000013500372,0.00006871542,0.000107635846,0.0013250867,0.9934376,0.00003861462,0.0010227814,0.0000067243664],"about_ca_topic_score_codex":0.0012789048,"about_ca_topic_score_gemma":0.0012208633,"teacher_disagreement_score":0.0012789048,"about_ca_system_score_codex":0.00023343322,"about_ca_system_score_gemma":0.00012620448,"threshold_uncertainty_score":0.0034164786},"labels":[],"label_agreement":null},{"id":"W1983076843","doi":"10.1063/1.1779343","title":"Influence of overlayer thickness on the density of Lomer dislocations in nanoscale Ni–Cu bilayer thin films","year":2004,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Overlayer; Materials science; Dislocation; Condensed matter physics; Partial dislocations; Crystallography; Thin film; Bilayer; Nanotechnology; Composite material; Chemistry; Physics; Membrane","score_opus":0.010847821250794526,"score_gpt":0.22540056602261638,"score_spread":0.21455274477182185,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1983076843","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9995111,0.00013948696,0.00014046156,0.000008173076,0.0000018446814,0.0000014171152,0.000017665196,0.0000073716988,0.00017257208],"genre_scores_gemma":[0.9993037,0.000154392,0.0003513505,0.0000061439405,0.000003002023,0.0000026925698,0.000027693872,0.00000770273,0.0001433313],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998759,0.000017552773,0.000010649018,0.00002556565,0.00004283924,0.00002756432],"domain_scores_gemma":[0.9995515,0.00019970913,0.0001067337,0.00003873436,0.00006517709,0.000038093567],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014049579,0.00022697714,0.00020695655,0.00020325094,0.00025345705,0.0004735836,0.00015758195,0.00018571649,0.0006227333],"category_scores_gemma":[0.00067187013,0.00028895034,0.0001127663,0.00016113657,0.00031503147,0.0003097278,0.00019688875,0.0003378702,0.0000882445],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017437333,0.000019477187,0.0011943781,0.000033592543,0.000012688197,0.00007869071,0.000062363026,0.0005100333,0.996896,0.000036869886,0.00001536498,0.0009662288],"study_design_scores_gemma":[0.000010428078,0.00015300616,0.006188331,0.0000051218904,0.000027407414,0.000060815055,0.00007103446,0.0029110229,0.99035925,0.000017684371,0.00018742628,0.000008520027],"about_ca_topic_score_codex":0.0017707066,"about_ca_topic_score_gemma":0.0016656092,"teacher_disagreement_score":0.0017707066,"about_ca_system_score_codex":0.00024872096,"about_ca_system_score_gemma":0.000112470654,"threshold_uncertainty_score":0.0035208464},"labels":[],"label_agreement":null},{"id":"W1984274279","doi":"10.1063/1.2037947","title":"High-throughput resistivity apparatus for thin-film combinatorial libraries","year":2005,"lang":"en","type":"article","venue":"Review of Scientific Instruments","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Dalhousie University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electrical resistivity and conductivity; Materials science; Van der Pauw method; Temperature coefficient; Thin film; Sputter deposition; Sputtering; Composite material; Electrical engineering; Nanotechnology; Hall effect","score_opus":0.02059520625959138,"score_gpt":0.2766120540725946,"score_spread":0.2560168478130032,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1984274279","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2134264,0.0018128413,0.72028345,0.0006116149,0.00035065695,0.002298439,0.01351726,0.025621086,0.022078225],"genre_scores_gemma":[0.48792684,0.0028626334,0.46315318,0.00034635552,0.00022610485,0.0057985415,0.0131317135,0.0018456499,0.02470903],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99790406,0.0004461819,0.00014314734,0.00040281969,0.0009427222,0.00016108064],"domain_scores_gemma":[0.99865204,0.0003924898,0.00011395394,0.00042772136,0.00031683562,0.00009702111],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0010661168,0.0010245295,0.0008902993,0.0023920848,0.0009169241,0.0006928431,0.0016919224,0.0006260724,0.008762721],"category_scores_gemma":[0.0020286737,0.0006703192,0.00053080136,0.0020747415,0.0003570312,0.0005851455,0.0007768062,0.0014975271,0.005964729],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016399042,0.00021418756,0.00067552674,0.00034096595,0.000060536528,0.00027265077,0.00017741589,0.0015140587,0.9562551,0.0016763321,0.0045943833,0.034054797],"study_design_scores_gemma":[0.000057737936,0.0005405529,0.0016292483,0.00004040348,0.000052982803,0.0005272805,0.000057183373,0.014896946,0.96024793,0.00064382213,0.021254782,0.00005110085],"about_ca_topic_score_codex":0.0003316569,"about_ca_topic_score_gemma":0.00085497834,"teacher_disagreement_score":0.008762721,"about_ca_system_score_codex":0.0003808242,"about_ca_system_score_gemma":0.00037176395,"threshold_uncertainty_score":0.02931422},"labels":[],"label_agreement":null},{"id":"W1985068714","doi":"10.4028/www.scientific.net/msf.426-432.3551","title":"Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines","year":2003,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Copper interconnect; Materials science; Interconnection; Microstructure; Texture (cosmology); Stress (linguistics); Metallurgy; Engineering physics; Composite material; Optoelectronics; Copper; Computer science; Engineering; Artificial intelligence","score_opus":0.015148206190518687,"score_gpt":0.2661528791625257,"score_spread":0.251004672972007,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1985068714","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99927706,0.00008415573,0.00013672323,0.000007372939,0.000002016307,0.0000024716117,0.00003383159,0.000007862274,0.00044848546],"genre_scores_gemma":[0.9991171,0.00004944728,0.00019484991,0.00000534685,0.0000026626628,0.0000027742078,0.000034122673,0.000003706732,0.0005901928],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999943,0.000003412687,0.000002426877,0.000012218784,0.000022582368,0.000016397198],"domain_scores_gemma":[0.9998356,0.000019657607,0.000057564626,0.000014618801,0.00005433119,0.00001817619],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006497975,0.000066929555,0.0001187386,0.00024941817,0.00029106328,0.00021913409,0.00019437508,0.00015001983,0.0007118884],"category_scores_gemma":[0.00018656203,0.00014305388,0.00006234332,0.000261906,0.00025715964,0.00021156197,0.0001344154,0.00013452503,0.00008507705],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016144765,0.000025614276,0.0021857673,0.000025013598,0.000002442059,0.000118616226,0.00018590984,0.0002214072,0.995083,0.00012319101,0.000059343845,0.0018081599],"study_design_scores_gemma":[0.00004724209,0.0008925447,0.17105491,0.000009550826,0.000021641406,0.00047590258,0.000620352,0.003906968,0.82005143,0.00011170292,0.002789935,0.000017813843],"about_ca_topic_score_codex":0.0045481212,"about_ca_topic_score_gemma":0.006820921,"teacher_disagreement_score":0.0045481212,"about_ca_system_score_codex":0.00038990908,"about_ca_system_score_gemma":0.0001296422,"threshold_uncertainty_score":0.009043336},"labels":[],"label_agreement":null},{"id":"W1987363894","doi":"10.1116/1.1329124","title":"Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator","year":2001,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Deposition (geology); Monte Carlo method; Normalization (sociology); Materials science; Thin film; Sticking coefficient; Diffusion; Feature (linguistics); Physical vapor deposition; Simulation; Computer science; Computational science; Nanotechnology; Chemistry; Thermodynamics; Physics; Geology","score_opus":0.016602171461732308,"score_gpt":0.272232331330958,"score_spread":0.25563015986922566,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1987363894","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.19490196,0.00017191618,0.79092735,0.00030819507,0.000046321962,0.00019042187,0.0005197091,0.0018620074,0.011072155],"genre_scores_gemma":[0.7927869,0.0002442451,0.20162454,0.00005931195,0.000015252004,0.00044050618,0.00037369964,0.00027961834,0.0041758646],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99988925,0.00002119198,0.000006451556,0.0000111525205,0.000057578694,0.000014413205],"domain_scores_gemma":[0.99961936,0.00021900066,0.000034280212,0.000039142662,0.00006626755,0.0000218636],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00032047727,0.00035694052,0.00041875974,0.00026388664,0.00044633858,0.0005604687,0.0009407139,0.0008685266,0.0019619893],"category_scores_gemma":[0.0010958784,0.0004240828,0.00051372655,0.00031967807,0.00035398468,0.00046214517,0.00034959937,0.000535216,0.00026668832],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011902963,0.000009728803,0.00025677896,0.000015111425,0.000007375488,0.00003283703,0.000021211232,0.9925634,0.003330084,0.0018925769,0.00011875054,0.0017402061],"study_design_scores_gemma":[0.000002876882,0.0000027153897,0.000033094097,5.909954e-7,0.0000010878088,0.000003569397,0.0000017401875,0.99910104,0.0005161897,0.00017432256,0.0001614371,0.0000014722655],"about_ca_topic_score_codex":0.01090619,"about_ca_topic_score_gemma":0.00878133,"teacher_disagreement_score":0.01090619,"about_ca_system_score_codex":0.0009748353,"about_ca_system_score_gemma":0.0015774342,"threshold_uncertainty_score":0.021685421},"labels":[],"label_agreement":null},{"id":"W1989603230","doi":"10.1149/2.029312jes","title":"Accelerated Recrystallization in Electrodeposited Dual-Layer Copper Thin Films","year":2013,"lang":"en","type":"article","venue":"Journal of The Electrochemical Society","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Recrystallization (geology); Materials science; Copper; Electron backscatter diffraction; Electrical resistivity and conductivity; Current density; Diffraction; Metallurgy; Thin film; Composite material; Microstructure; Optics; Nanotechnology; Electrical engineering; Geology","score_opus":0.013282076294691742,"score_gpt":0.2451804561688304,"score_spread":0.23189837987413867,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1989603230","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9947331,0.0015924099,0.0028118873,0.00003960005,0.000021382357,0.000025007976,0.000108350956,0.00012956922,0.00053886254],"genre_scores_gemma":[0.99155277,0.0010734462,0.004893239,0.00001637455,0.000009421335,0.000020345715,0.00015587771,0.000060573613,0.0022177785],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997466,0.000031236235,0.000021155782,0.00007405631,0.00007482914,0.00005197891],"domain_scores_gemma":[0.99955446,0.00012955106,0.00009809599,0.00007169728,0.0001082643,0.00003785134],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023613132,0.0004516252,0.00053717935,0.0002350251,0.00013413167,0.00035544168,0.00046794384,0.00030646916,0.0008699139],"category_scores_gemma":[0.0007569989,0.0004694974,0.00020217935,0.00029797608,0.00019103891,0.00047248811,0.0002181339,0.00067570887,0.00028906437],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000042666295,0.000007880173,0.00006126095,0.000059807157,0.000005121628,0.00006440378,0.00002777792,0.00008407723,0.99850684,0.000015169688,0.000020373682,0.0011046608],"study_design_scores_gemma":[0.0000051879274,0.00007449205,0.0005620644,0.0000024243777,0.0000040285113,0.000049736867,0.00001010324,0.00037047765,0.99864465,0.000003821695,0.00027039624,0.0000024506476],"about_ca_topic_score_codex":0.0009954026,"about_ca_topic_score_gemma":0.0020371645,"teacher_disagreement_score":0.0009954026,"about_ca_system_score_codex":0.00025668,"about_ca_system_score_gemma":0.00020448683,"threshold_uncertainty_score":0.0029100776},"labels":[],"label_agreement":null},{"id":"W1990196925","doi":"10.1116/1.1463083","title":"Characterization of low permittivity (low-<i>k</i>) polymeric dielectric films for low temperature device integration","year":2002,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":25,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Chemical-mechanical planarization; Materials science; Dielectric; Permittivity; Thin-film transistor; Capacitance; Wafer; Optoelectronics; Amorphous solid; Fourier transform infrared spectroscopy; Annealing (glass); Benzocyclobutene; Electronic engineering; Composite material; Polishing; Optics","score_opus":0.009057465954702719,"score_gpt":0.23633417803593917,"score_spread":0.22727671208123645,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1990196925","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99612194,0.0005530786,0.002513513,0.000023638157,0.000009864051,0.0000114671,0.00012411781,0.000018273331,0.00062413514],"genre_scores_gemma":[0.9947798,0.0006549461,0.0037829755,0.000016605769,0.000003890836,0.000014692939,0.00019485386,0.00001836959,0.0005337743],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99993217,0.0000079027495,0.000004397251,0.0000118124035,0.000028748591,0.000014978874],"domain_scores_gemma":[0.99979776,0.000039824536,0.00005902255,0.000016061897,0.00006585157,0.00002145371],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000120207405,0.00025372423,0.00011829942,0.00019195038,0.00015735476,0.00023734433,0.00016429617,0.00022120326,0.0006388129],"category_scores_gemma":[0.00031644537,0.00012064423,0.00009241197,0.00017383297,0.00013970213,0.00018523175,0.00007510354,0.0002300325,0.00018571755],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009314487,0.0000029951495,0.00014519099,0.000011398492,0.0000010423939,0.000011166689,0.0000072329367,0.000024197228,0.99941945,0.000008063632,0.0000054196375,0.00035450468],"study_design_scores_gemma":[0.0000025067013,0.00007443814,0.003914604,0.0000032722214,0.000006024026,0.000073519084,0.000023302797,0.0003167547,0.99521047,0.0000075287335,0.00036518322,0.0000023755276],"about_ca_topic_score_codex":0.00040041155,"about_ca_topic_score_gemma":0.0006374309,"teacher_disagreement_score":0.0006388129,"about_ca_system_score_codex":0.00012597843,"about_ca_system_score_gemma":0.00007426438,"threshold_uncertainty_score":0.002137065},"labels":[],"label_agreement":null},{"id":"W1992732435","doi":"10.1088/1009-0630/11/6/08","title":"Effect of CHF<sub>3</sub>Plasma Treatment on the Characteristics of SiCOH Low-<i>k</i>Film","year":2009,"lang":"en","type":"article","venue":"Plasma Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"National Research Council Canada","keywords":"Contact angle; Materials science; Analytical Chemistry (journal); Dielectric; Electron cyclotron resonance; Fourier transform infrared spectroscopy; Surface roughness; Deposition (geology); Capacitance; Surface finish; Chemistry; Composite material; Chemical engineering; Electrode; Optoelectronics; Ion; Chromatography","score_opus":0.005811197024774402,"score_gpt":0.22547297757722412,"score_spread":0.21966178055244973,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1992732435","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99791855,0.00053742534,0.0006219972,0.000039968592,0.000013384611,0.000007552345,0.00012739928,0.000031864372,0.0007017879],"genre_scores_gemma":[0.9984106,0.00025731165,0.0006947739,0.000027045493,0.0000047527624,0.000008464107,0.0001170601,0.000016306687,0.00046367277],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999114,0.0000063535526,0.000005680165,0.000017571552,0.000027961818,0.000030857693],"domain_scores_gemma":[0.9997533,0.000081586106,0.0000613675,0.000017796736,0.000066733846,0.000019194178],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000081562095,0.00018456692,0.0002169938,0.00014713305,0.00015959205,0.00020512089,0.000117567324,0.00026903042,0.00094067],"category_scores_gemma":[0.00033523026,0.00015329964,0.00015284178,0.00016929852,0.00019624626,0.00020823462,0.00006690396,0.0002605859,0.0001917296],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008097698,0.0000039006527,0.00028150275,0.00003714722,0.0000045493352,0.000056840694,0.00003323114,0.000048180347,0.99853826,0.0000121309595,0.000029343333,0.0008739844],"study_design_scores_gemma":[0.0000064928017,0.0001550082,0.007360376,0.0000033966019,0.000011545874,0.00015249227,0.00003917072,0.00039667907,0.991314,0.000008326378,0.0005477291,0.0000046985574],"about_ca_topic_score_codex":0.0009865857,"about_ca_topic_score_gemma":0.0010128833,"teacher_disagreement_score":0.0009865857,"about_ca_system_score_codex":0.0002044603,"about_ca_system_score_gemma":0.00011252182,"threshold_uncertainty_score":0.0031468868},"labels":[],"label_agreement":null},{"id":"W1993435986","doi":"10.1021/cm030029c","title":"Synthesis and Characterization of Ruthenium Complexes with Two Fluorinated Amino Alkoxide Chelates. The Quest To Design Suitable MOCVD Source Reagents","year":2003,"lang":"en","type":"article","venue":"Chemistry of Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada; Steacie Institute for Molecular Sciences","funders":"","keywords":"Alkoxide; Chemistry; Ruthenium; X-ray photoelectron spectroscopy; Homoleptic; Chelation; Ligand (biochemistry); Reagent; Octahedron; Alcohol oxidation; Crystallography; Inorganic chemistry; Metal; Alcohol; Crystal structure; Organic chemistry; Catalysis","score_opus":0.015190704490135853,"score_gpt":0.2269943103381422,"score_spread":0.21180360584800637,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1993435986","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9730864,0.0027906923,0.02024731,0.00013531485,0.00004615422,0.00017125263,0.0007216389,0.0004425934,0.0023586706],"genre_scores_gemma":[0.96709186,0.0010490615,0.0280752,0.00006691366,0.000015482397,0.000115930205,0.00069766265,0.00012370895,0.0027642504],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997055,0.000032158237,0.000027678861,0.000071901355,0.00011045422,0.00005230436],"domain_scores_gemma":[0.99975556,0.000042199852,0.00006630958,0.000039088904,0.000067093904,0.000029735624],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002579774,0.0005059851,0.0005724505,0.00032247033,0.0001700604,0.0004575741,0.00060157414,0.00072365004,0.0008223981],"category_scores_gemma":[0.00046566626,0.0003334825,0.00024372755,0.00027426894,0.00022301752,0.0002632875,0.00027863283,0.00042522498,0.0004356906],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000027821738,0.0000071004347,0.000033683507,0.00006347504,0.000005046167,0.000031114207,0.000012317538,0.00006603892,0.99894756,0.00003078029,0.000030169409,0.0007448406],"study_design_scores_gemma":[0.000008203336,0.000067378394,0.0003343576,0.0000029976907,0.000008219287,0.00010551284,0.0000053673853,0.00040787592,0.9979863,0.000010839666,0.0010580814,0.0000049034597],"about_ca_topic_score_codex":0.00055838574,"about_ca_topic_score_gemma":0.0008096394,"teacher_disagreement_score":0.0008223981,"about_ca_system_score_codex":0.00048549817,"about_ca_system_score_gemma":0.00013515454,"threshold_uncertainty_score":0.0035225153},"labels":[],"label_agreement":null},{"id":"W1994438562","doi":"10.5555/2561828.2561933","title":"Redundancy-aware electromigration checking for mesh power grids","year":2013,"lang":"en","type":"article","venue":"TSpace","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":31,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Redundancy (engineering); Reliability (semiconductor); Grid; Computer science; Interconnection; Reliability engineering; Power grid; Margin (machine learning); Power (physics); Electronic engineering; Electrical engineering; Engineering; Mathematics; Telecommunications; Physics; Geometry","score_opus":0.01488651409076685,"score_gpt":0.304143746510279,"score_spread":0.2892572324195121,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1994438562","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.28347182,0.00009870075,0.7138499,0.00010244282,0.0000147222745,0.000027353164,0.00013488812,0.0016644684,0.00063567783],"genre_scores_gemma":[0.947335,0.00002694353,0.052057255,0.000019123087,0.0000065710924,0.000015615416,0.0001185599,0.000055114768,0.00036593803],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.999329,0.00022018628,0.00004167968,0.00012238252,0.00022031546,0.00006657689],"domain_scores_gemma":[0.99446243,0.00288996,0.0009059782,0.0010947877,0.0005697734,0.00007710124],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009993522,0.00037499057,0.0005302335,0.00095831504,0.00029110932,0.00053978234,0.0011348028,0.00052167306,0.00076773786],"category_scores_gemma":[0.008990708,0.00029885976,0.000493841,0.0005193326,0.00061938073,0.0012299721,0.00066070183,0.00039732122,0.00010834278],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00019510776,0.000034874636,0.014141494,0.00005336646,0.000052868556,0.00017379859,0.000078658464,0.93052363,0.011061844,0.012214336,0.0006249304,0.030844988],"study_design_scores_gemma":[0.0000024013555,0.00001189428,0.00028291187,0.0000018029991,0.0000022869665,0.000020659158,0.0000046192836,0.9960908,0.001611756,0.0019228397,0.00004586924,0.0000020856414],"about_ca_topic_score_codex":0.004269931,"about_ca_topic_score_gemma":0.0040942985,"teacher_disagreement_score":0.004269931,"about_ca_system_score_codex":0.0008171545,"about_ca_system_score_gemma":0.0006962035,"threshold_uncertainty_score":0.008490145},"labels":[],"label_agreement":null},{"id":"W1994752359","doi":"10.1021/ic050845h","title":"New CVD Precursors Capable of Depositing Copper Metal under Mixed O<sub>2</sub>/Ar Atmosphere","year":2005,"lang":"en","type":"article","venue":"Inorganic Chemistry","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":37,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada; Steacie Institute for Molecular Sciences","funders":"Australian Collaborative Education Network","keywords":"Chemistry; Copper; Metal; Ligand (biochemistry); Dihedral angle; Crystallography; Steric effects; Melting point; Inorganic chemistry; Substrate (aquarium); Analytical Chemistry (journal); Stereochemistry; Molecule; Organic chemistry","score_opus":0.006709229098595246,"score_gpt":0.20878643141399567,"score_spread":0.2020772023154004,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1994752359","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96695673,0.003565304,0.02174086,0.00007633471,0.00012009801,0.00016330446,0.00051339227,0.0006395384,0.00622434],"genre_scores_gemma":[0.9252604,0.0012449889,0.068232775,0.000047826947,0.000032517997,0.00009662581,0.0005435552,0.00015159592,0.00438966],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99989295,0.00000914858,0.000009547846,0.000029933253,0.00004294649,0.000015559306],"domain_scores_gemma":[0.9998266,0.000030558364,0.00005286517,0.000021064843,0.000044279062,0.000024482693],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000100623,0.00030702946,0.00019897091,0.00020435,0.00014053653,0.00023212799,0.00039600115,0.00023693823,0.0009934386],"category_scores_gemma":[0.0003559257,0.00022021358,0.00007115349,0.00020105534,0.00012549035,0.00023485016,0.00017813977,0.00024914867,0.00029982463],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000034178385,0.0000072123084,0.00018377896,0.00011943259,0.0000033346626,0.00008036399,0.000026703607,0.000055530825,0.99582434,0.00011783409,0.00013542832,0.0034118267],"study_design_scores_gemma":[0.0000074338755,0.00010194609,0.0011739028,0.0000042285346,0.000009093888,0.00026084637,0.000015929418,0.0005070007,0.99185693,0.000023548306,0.0060343426,0.00000479148],"about_ca_topic_score_codex":0.00040613752,"about_ca_topic_score_gemma":0.001212552,"teacher_disagreement_score":0.0009934386,"about_ca_system_score_codex":0.0002007592,"about_ca_system_score_gemma":0.00013536362,"threshold_uncertainty_score":0.0033233762},"labels":[],"label_agreement":null},{"id":"W1995652121","doi":"10.1007/s10853-012-6763-x","title":"Thermal and electrical stability of TaN x diffusion barriers for Cu metallization","year":2012,"lang":"en","type":"article","venue":"Journal of Materials Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":19,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Materials science; Amorphous solid; Analytical Chemistry (journal); Crystallization; Diffusion barrier; Electrical resistivity and conductivity; Thin film; Crystallite; Scanning electron microscope; Composite material; Metallurgy; Crystallography; Nanotechnology; Electrical engineering; Layer (electronics); Chemical engineering","score_opus":0.018612398985453905,"score_gpt":0.27502039526492755,"score_spread":0.25640799627947364,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1995652121","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99893767,0.00032003885,0.00020675402,0.000017344764,0.000008511439,0.000002676369,0.000052586918,0.000017213266,0.00043727478],"genre_scores_gemma":[0.99931157,0.00007447415,0.00009946372,0.0000034909508,0.0000019563176,0.0000024828857,0.000045455632,0.0000058866694,0.00045513632],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991417,0.0000084899275,0.0000048885213,0.000020059517,0.000024747671,0.000027578288],"domain_scores_gemma":[0.9997371,0.000071097646,0.00006588037,0.000027123247,0.00008100178,0.000017729093],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017764179,0.00016098486,0.00014731822,0.00016161344,0.0002702544,0.0003125321,0.00022783293,0.00020445972,0.0020106416],"category_scores_gemma":[0.0006021096,0.00014199439,0.00009547945,0.00016101063,0.00020204793,0.0003679891,0.0001432309,0.00019517327,0.00023964983],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008983106,0.00003055909,0.0014135349,0.000070666494,0.000012452364,0.000094174604,0.00018051518,0.00069182675,0.99344605,0.00026572452,0.00020201612,0.0026942368],"study_design_scores_gemma":[0.000023887842,0.0005527935,0.009022782,0.000009688614,0.000022489397,0.000091352085,0.00014875481,0.003548194,0.98536855,0.00005730018,0.0011411259,0.0000132771365],"about_ca_topic_score_codex":0.0011673422,"about_ca_topic_score_gemma":0.0013022741,"teacher_disagreement_score":0.0020106416,"about_ca_system_score_codex":0.00031544743,"about_ca_system_score_gemma":0.00020218977,"threshold_uncertainty_score":0.006726265},"labels":[],"label_agreement":null},{"id":"W1995877457","doi":"10.1002/polb.20014","title":"X‐ray photoelectron spectroscopy of miscible poly(methyl methacrylate)/poly(styrene‐<i>co</i>‐acrylonitrile) and immiscible poly(methyl methacrylate)/polyacrylonitrile polymer surfaces metallized by nickel","year":2004,"lang":"en","type":"article","venue":"Journal of Polymer Science Part B Polymer Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université Laval","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Polyacrylonitrile; Materials science; Poly(methyl methacrylate); Methyl methacrylate; Nickel; Polymer chemistry; X-ray photoelectron spectroscopy; Acrylonitrile; Polymer; Chemical engineering; Styrene; Methacrylate; Composite material; Polymerization; Metallurgy; Copolymer","score_opus":0.012863065599859764,"score_gpt":0.2786239358990391,"score_spread":0.26576087029917933,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1995877457","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9980421,0.00025250303,0.0008466399,0.000008692454,0.0000043307464,0.000004041873,0.000047929658,0.0000186882,0.0007750907],"genre_scores_gemma":[0.9970782,0.00021534729,0.0008496913,0.00001040645,0.0000026794191,0.000007923917,0.00012335081,0.000018000017,0.001694428],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999051,0.000008579283,0.0000032630558,0.000019698215,0.000041924544,0.000021415619],"domain_scores_gemma":[0.99987626,0.000028965485,0.000033049637,0.0000134703305,0.000026648653,0.000021589178],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000115501054,0.00032173944,0.00017108979,0.00022717068,0.00016673004,0.00025291753,0.00019924124,0.00026961716,0.0013162838],"category_scores_gemma":[0.00018105605,0.00022587438,0.00011611449,0.0001939439,0.00018453119,0.00020971165,0.00016280875,0.00026018123,0.00021481379],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007421871,0.0000086763885,0.00020320721,0.000014141836,0.0000031624052,0.0000363827,0.000017196593,0.00006862853,0.9991109,0.000035076097,0.000011488923,0.00041683007],"study_design_scores_gemma":[0.0000068264903,0.00009429909,0.005789806,0.0000040068608,0.000008879162,0.000079041056,0.00003118275,0.0007313265,0.9928249,0.000032104155,0.00039437076,0.000003259447],"about_ca_topic_score_codex":0.00027955134,"about_ca_topic_score_gemma":0.00028535575,"teacher_disagreement_score":0.0013162838,"about_ca_system_score_codex":0.0001572931,"about_ca_system_score_gemma":0.00006330987,"threshold_uncertainty_score":0.0044034123},"labels":[],"label_agreement":null},{"id":"W1997579699","doi":"10.1016/j.msea.2007.06.032","title":"Effect of annealing on preferred orientations in the Cu/SiO2 and Cu/SiO2/Si(100) interfaces","year":2007,"lang":"en","type":"article","venue":"Materials Science and Engineering A","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Annealing (glass); Copper; Materials science; Diffraction; Scanning electron microscope; Crystallography; Recrystallization (geology); Thin film; Analytical Chemistry (journal); Composite material; Optics; Metallurgy; Chemistry; Nanotechnology","score_opus":0.011732761242731983,"score_gpt":0.2757061328169992,"score_spread":0.2639733715742672,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1997579699","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9983682,0.00038197718,0.00018718829,0.000030527764,0.000029044302,0.0000050072067,0.00012195185,0.000025318303,0.00085089036],"genre_scores_gemma":[0.999079,0.00016496926,0.00022730503,0.000025116298,0.000008969415,0.0000040165423,0.00010762021,0.000021652553,0.00036134353],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998549,0.000017132337,0.000013440145,0.000029155457,0.000020971049,0.00006435533],"domain_scores_gemma":[0.9993079,0.00038182345,0.00010326468,0.000052399315,0.00010165131,0.000053039534],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002206623,0.00029722787,0.00030434944,0.00019326714,0.00037507727,0.00055845256,0.00020288053,0.0002978443,0.0039690547],"category_scores_gemma":[0.00085595204,0.00035456155,0.00018134028,0.0002953449,0.00039761697,0.00035688,0.00014152305,0.00038952573,0.00026756164],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0044522667,0.00014426919,0.0031594944,0.00029268072,0.00008021409,0.00026833286,0.0002925543,0.002061982,0.98431116,0.0003452839,0.00043381922,0.004157773],"study_design_scores_gemma":[0.000070236034,0.0006043228,0.0175359,0.000014841053,0.00007316505,0.000059116366,0.00017169528,0.0036254732,0.97692376,0.000066762484,0.00083113374,0.000023586152],"about_ca_topic_score_codex":0.0031613412,"about_ca_topic_score_gemma":0.0052154306,"teacher_disagreement_score":0.0039690547,"about_ca_system_score_codex":0.00032456455,"about_ca_system_score_gemma":0.00027803838,"threshold_uncertainty_score":0.013277769},"labels":[],"label_agreement":null},{"id":"W2007031005","doi":"10.4028/www.scientific.net/msf.495-497.1449","title":"New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Copper interconnect; Materials science; Texture (cosmology); Dislocation; Interpretation (philosophy); Interconnection; Line (geometry); Shear (geology); Condensed matter physics; Crystallography; Composite material; Metallurgy; Copper; Geometry; Artificial intelligence; Computer science; Physics; Mathematics; Chemistry; Telecommunications","score_opus":0.006792590341629162,"score_gpt":0.2492869921997546,"score_spread":0.24249440185812543,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007031005","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94318146,0.001646996,0.04332081,0.00019598396,0.00009884247,0.000025513235,0.0002251884,0.00039314065,0.010912011],"genre_scores_gemma":[0.9961563,0.00030777697,0.0024862196,0.000015621321,0.000019843706,0.0000044570043,0.000042399784,0.000041379888,0.0009260969],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99994123,0.000005992915,0.0000024503288,0.000015030467,0.000024948058,0.000010291309],"domain_scores_gemma":[0.9998739,0.000036256424,0.00003570348,0.000019469175,0.000025488838,0.000009161711],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006468201,0.00020552163,0.00018608358,0.0002841005,0.00019631232,0.00045341408,0.00023787397,0.00017592599,0.0010642406],"category_scores_gemma":[0.0003242865,0.00013294454,0.0001233547,0.00021310343,0.00027425823,0.00032230804,0.00017084248,0.00029643436,0.000115310344],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00023275637,0.000028947346,0.0046894643,0.00012927926,0.000014768003,0.000866136,0.00018970387,0.012072247,0.94933546,0.003807591,0.0002544685,0.028379222],"study_design_scores_gemma":[0.000036925732,0.00033124158,0.06209443,0.000027960039,0.000086266016,0.0016766116,0.00039146416,0.1512775,0.7668329,0.0058778794,0.011278588,0.00008821243],"about_ca_topic_score_codex":0.00048256374,"about_ca_topic_score_gemma":0.0008203795,"teacher_disagreement_score":0.0010642406,"about_ca_system_score_codex":0.0002864324,"about_ca_system_score_gemma":0.00007920818,"threshold_uncertainty_score":0.003560245},"labels":[],"label_agreement":null},{"id":"W2007387568","doi":"10.1063/1.2937188","title":"The influence of surface roughness on electrical conductance of thin Cu films: An <i>ab initio</i> study","year":2008,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":148,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Semiconductor Research Corporation","keywords":"Conductance; Monolayer; Surface roughness; Materials science; Electrical resistivity and conductivity; Thin film; Ab initio quantum chemistry methods; Isotropy; Ab initio; Surface finish; Condensed matter physics; Atomic units; Fermi level; Electrical resistance and conductance; Chemistry; Nanotechnology; Composite material; Optics; Electron; Molecule; Physics","score_opus":0.024995155642128956,"score_gpt":0.2747132382898998,"score_spread":0.24971808264777084,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007387568","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99556303,0.0008469344,0.0016011638,0.000076824384,0.000016355232,0.000012783346,0.000046488927,0.000055721368,0.0017807207],"genre_scores_gemma":[0.99853194,0.00038085374,0.0008097438,0.000008826254,0.000011629165,0.000006182567,0.00003721152,0.000012877703,0.00020074616],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.999879,0.00002236924,0.000004612695,0.000016277181,0.000050571074,0.000027120164],"domain_scores_gemma":[0.99966395,0.00017060341,0.00004353663,0.000048813385,0.000060164326,0.000012918702],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018504428,0.00038429722,0.00044622284,0.00028635678,0.00033112863,0.00050603744,0.00033954968,0.00044271155,0.00081163924],"category_scores_gemma":[0.0007975613,0.00027760793,0.00039369098,0.0002930304,0.0003595515,0.0003570806,0.00018583304,0.00039913034,0.00012682601],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00047646256,0.00021867295,0.0050966,0.0008912548,0.0002023075,0.0014226342,0.00034239344,0.118494935,0.8529671,0.005054209,0.0010748699,0.013758583],"study_design_scores_gemma":[0.00008263794,0.000863987,0.008608366,0.000040276016,0.00015686503,0.00039412707,0.00016767021,0.6589698,0.3281379,0.0010357043,0.001490679,0.000052036405],"about_ca_topic_score_codex":0.0022482204,"about_ca_topic_score_gemma":0.0010850494,"teacher_disagreement_score":0.0022482204,"about_ca_system_score_codex":0.00028028418,"about_ca_system_score_gemma":0.00014106107,"threshold_uncertainty_score":0.0044702888},"labels":[],"label_agreement":null},{"id":"W2009484617","doi":"10.1063/1.2937249","title":"Modeling self-annealing kinetics in electroplated Cu thin films","year":2008,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada; Allianz Industrie Forschung","keywords":"Electroplating; Annealing (glass); Materials science; Kinetics; Electrolyte; Recrystallization (geology); Thin film; Microstructure; Copper; Metallurgy; Composite material; Electrode; Nanotechnology; Chemistry; Physical chemistry","score_opus":0.016807451429015838,"score_gpt":0.2375673745109718,"score_spread":0.22075992308195597,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2009484617","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9263808,0.0008684604,0.066332795,0.00011587148,0.000047038335,0.00006870489,0.00021130573,0.00037905067,0.0055959406],"genre_scores_gemma":[0.9893115,0.00055506954,0.007326471,0.000013567732,0.0000092532455,0.00006260018,0.00010819301,0.00006095563,0.0025525186],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9999343,0.000008953846,0.000004798136,0.000015671298,0.000021190672,0.000015096863],"domain_scores_gemma":[0.9997955,0.00009647691,0.00003589497,0.000021520793,0.00004026538,0.000010409257],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019307909,0.00048027045,0.00036684895,0.00029401208,0.00018688498,0.00042214393,0.0007108191,0.00087176636,0.0005853734],"category_scores_gemma":[0.0006959166,0.0005482404,0.00050314324,0.00025049824,0.0003111339,0.00054386066,0.00015700601,0.0003469055,0.0001580225],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000047964426,0.000056758803,0.001047191,0.000067416884,0.00001902172,0.0001372435,0.00004786833,0.9493328,0.044894487,0.0018840578,0.0001009464,0.0023643335],"study_design_scores_gemma":[0.0000033362003,0.000009792611,0.00025507674,0.0000014230925,0.0000033620522,0.000009850364,0.000002205731,0.9953956,0.0041308687,0.000096132346,0.00009001074,0.0000022325448],"about_ca_topic_score_codex":0.009199608,"about_ca_topic_score_gemma":0.0041882955,"teacher_disagreement_score":0.009199608,"about_ca_system_score_codex":0.0007606554,"about_ca_system_score_gemma":0.00045399534,"threshold_uncertainty_score":0.018292129},"labels":[],"label_agreement":null},{"id":"W2012050805","doi":"10.1002/adma.200305740","title":"Direct Writing of Patterned Ceramics Using Electron‐Beam Lithography and Metallopolymer Resists","year":2004,"lang":"en","type":"article","venue":"Advanced Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":79,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta; University of Toronto","funders":"","keywords":"Materials science; Resist; Electron-beam lithography; Lithography; Ceramic; Scanning electron microscope; Cathode ray; X-ray lithography; Focused ion beam; Nanotechnology; Electron beam-induced deposition; Ion beam lithography; Electron; Optoelectronics; Scanning transmission electron microscopy; Ion; Composite material; Chemistry","score_opus":0.01012461892369488,"score_gpt":0.2663083647633207,"score_spread":0.25618374583962583,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2012050805","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97484744,0.0006529843,0.016301187,0.00014890738,0.00013268685,0.000054288386,0.00042962117,0.00048002705,0.006952888],"genre_scores_gemma":[0.9630577,0.00062815286,0.029339612,0.000050791783,0.00003917025,0.0000483831,0.00032857707,0.00008913701,0.0064185928],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99986136,0.000005654047,0.00001018215,0.000040155435,0.00004858206,0.000034032193],"domain_scores_gemma":[0.9997751,0.00006377687,0.0000520412,0.000051607316,0.000025810883,0.000031614294],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009478934,0.00028181178,0.0002481565,0.00022514699,0.00022562513,0.00039002098,0.0004244504,0.00018417032,0.0017950902],"category_scores_gemma":[0.00032414522,0.0003689549,0.00022402687,0.0001863899,0.00038729608,0.00021793846,0.00037944134,0.000385958,0.0006280904],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026178843,0.0000057221937,0.00006725018,0.000038403603,0.0000025048,0.00008440124,0.000021458605,0.000100262696,0.9978557,0.00017241118,0.00008208041,0.0015435226],"study_design_scores_gemma":[0.00001576812,0.000049386574,0.00087558705,0.0000033345523,0.00000610525,0.00016739574,0.00001723676,0.00081046746,0.99612194,0.000055746477,0.0018710132,0.0000060605303],"about_ca_topic_score_codex":0.00058427,"about_ca_topic_score_gemma":0.0015978416,"teacher_disagreement_score":0.0017950902,"about_ca_system_score_codex":0.00030132712,"about_ca_system_score_gemma":0.00025514772,"threshold_uncertainty_score":0.006005168},"labels":[],"label_agreement":null},{"id":"W2014074276","doi":"10.1149/1.1786072","title":"Characterization of Ultrathin Electroless Barriers Grown by Self-Aligned Deposition on Silicon-Based Dielectric Films","year":2004,"lang":"en","type":"article","venue":"Journal of The Electrochemical Society","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Feng Chia University; National Science Council; Ryerson University","keywords":"Materials science; Chemical engineering; Copper; Crystallite; Amorphous solid; Crystallization; Annealing (glass); Metallurgy; Crystallography; Chemistry","score_opus":0.002949880210470723,"score_gpt":0.20052503107353103,"score_spread":0.19757515086306032,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2014074276","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99666166,0.0002448038,0.0026885965,0.000012178409,0.0000052873133,0.0000067246965,0.00007176274,0.000024604418,0.00028427463],"genre_scores_gemma":[0.9931136,0.00037215604,0.0053887614,0.000011468964,0.000004751498,0.000013546335,0.00022223407,0.000017487613,0.000855905],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999925,0.0000057121892,0.0000040435903,0.000013246694,0.000042353375,0.000009593571],"domain_scores_gemma":[0.9997718,0.000045392593,0.00007150471,0.000028715294,0.000056722838,0.000025897809],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008635122,0.00016635541,0.00012741609,0.00014868443,0.00009289553,0.00022005028,0.00020484687,0.00017612304,0.00026630313],"category_scores_gemma":[0.0002496047,0.000157949,0.00007080524,0.00013783471,0.00015305412,0.00018520596,0.000103512815,0.0001796033,0.00011468966],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000068411746,0.0000030353563,0.00018638205,0.000011120781,0.0000013918002,0.000022386726,0.000010236291,0.00004147442,0.99940455,0.000017197513,0.0000063428206,0.00028901958],"study_design_scores_gemma":[0.0000039612437,0.00008361896,0.0053570704,0.000002421675,0.0000055219207,0.00011118864,0.000017714487,0.001007707,0.9929261,0.000013360252,0.00046926684,0.0000021087985],"about_ca_topic_score_codex":0.0004045837,"about_ca_topic_score_gemma":0.00076490914,"teacher_disagreement_score":0.0004045837,"about_ca_system_score_codex":0.00015310447,"about_ca_system_score_gemma":0.0001067806,"threshold_uncertainty_score":0.0011109114},"labels":[],"label_agreement":null},{"id":"W2015941658","doi":"10.1016/j.sse.2006.06.014","title":"Application of PVD silver for integrated microwave passives in silicon technology","year":2006,"lang":"en","type":"article","venue":"Solid-State Electronics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Materials science; Electromigration; Silicon; Microwave; Monolithic microwave integrated circuit; Optoelectronics; Deposition (geology); Broadband; Copper; Electronic engineering; Metallurgy; Composite material; Computer science; Telecommunications; Engineering","score_opus":0.004420832403206465,"score_gpt":0.2486937233043471,"score_spread":0.24427289090114065,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2015941658","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.90831935,0.0066513023,0.06197529,0.0004688824,0.0004279936,0.00003990992,0.000074138596,0.0010836372,0.020959536],"genre_scores_gemma":[0.9804524,0.00094124896,0.012411496,0.000047245743,0.000030305288,0.000008651449,0.0000346224,0.000057072455,0.006016991],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991786,0.000009747888,0.000004176532,0.000018983601,0.00003456467,0.000014651829],"domain_scores_gemma":[0.9998579,0.000035832323,0.000019503765,0.000029819294,0.000045779878,0.000011060246],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001430712,0.00018141083,0.00017598705,0.00022413817,0.00022784834,0.00051980827,0.0003363097,0.00031965523,0.00076331117],"category_scores_gemma":[0.00035880893,0.00015655722,0.0001835331,0.00021866115,0.00022578049,0.000352592,0.00034376915,0.00025465657,0.00031076334],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014500637,0.00003491389,0.00064499443,0.00018753715,0.000009811392,0.00024091204,0.000086727916,0.0008509183,0.9676105,0.0030314194,0.00046916358,0.026688164],"study_design_scores_gemma":[0.000016932041,0.0002659693,0.0008243806,0.000012988412,0.000019787141,0.0004091952,0.00003642517,0.006847044,0.984512,0.0007619051,0.006287154,0.0000062386875],"about_ca_topic_score_codex":0.00024900355,"about_ca_topic_score_gemma":0.0005191708,"teacher_disagreement_score":0.00076331117,"about_ca_system_score_codex":0.00023095684,"about_ca_system_score_gemma":0.00018466268,"threshold_uncertainty_score":0.002553463},"labels":[],"label_agreement":null},{"id":"W2016489274","doi":"10.1007/s11664-005-0180-8","title":"Texture investigation of copper interconnects with a different line width","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Materials science; Electron backscatter diffraction; Copper interconnect; Microstructure; Annealing (glass); Line width; Texture (cosmology); Diffraction; Grain boundary; Interconnection; Composite material; Copper; Optics; Metallurgy","score_opus":0.008532280155451485,"score_gpt":0.23428638282725167,"score_spread":0.22575410267180018,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2016489274","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99841106,0.000097657634,0.000721723,0.000011573273,0.0000071389377,0.0000035476457,0.00003241186,0.00001593349,0.0006990628],"genre_scores_gemma":[0.99910754,0.00003806561,0.0004492141,0.0000068453996,0.0000045793995,0.0000029851537,0.00003683111,0.000008644042,0.00034522646],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998871,0.000012803556,0.0000044818785,0.000021071603,0.00004167465,0.00003271992],"domain_scores_gemma":[0.99965847,0.000057585392,0.00007719288,0.00003802904,0.00012997727,0.00003874516],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000112626054,0.00009087152,0.00017938801,0.00027788096,0.00023059708,0.00032574034,0.00017078026,0.00022611658,0.0009285414],"category_scores_gemma":[0.00044682898,0.00013364258,0.00010346989,0.00037620423,0.00024897367,0.0001803749,0.00010720727,0.00019780512,0.00008966847],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00081977266,0.000041952666,0.0026239317,0.000043236407,0.000009458134,0.00013960569,0.000095307376,0.00045955376,0.99231684,0.00015286855,0.00012188208,0.0031755373],"study_design_scores_gemma":[0.00010069203,0.00097305956,0.03733992,0.0000072544663,0.00005511246,0.00043899048,0.00030077316,0.008143242,0.9507292,0.000071428716,0.00182462,0.000015803966],"about_ca_topic_score_codex":0.00095856894,"about_ca_topic_score_gemma":0.0009996102,"teacher_disagreement_score":0.00095856894,"about_ca_system_score_codex":0.00023827123,"about_ca_system_score_gemma":0.00011470192,"threshold_uncertainty_score":0.003106296},"labels":[],"label_agreement":null},{"id":"W2017787810","doi":"10.1016/s0151-9107(00)88716-4","title":"Precursors and operating conditions for the metal-organic chemical vapor deposition of nickel films","year":2000,"lang":"en","type":"article","venue":"Annales de Chimie Science des Matériaux","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":32,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Nickel; Metalorganic vapour phase epitaxy; Chemical vapor deposition; Thin film; Chemistry; Metal; Mineralogy; Materials science; Metallurgy; Nanotechnology; Epitaxy; Layer (electronics)","score_opus":0.024970865071503045,"score_gpt":0.2855550360407474,"score_spread":0.26058417096924436,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2017787810","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9493305,0.008907559,0.016291304,0.0004011528,0.00026474407,0.0007846434,0.0027131038,0.0007208964,0.0205862],"genre_scores_gemma":[0.9492902,0.008536215,0.027379671,0.00013952608,0.000115174196,0.0008797123,0.0032737732,0.000374175,0.010011519],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99966025,0.000029761952,0.000028649973,0.00006875767,0.00014152103,0.00007106169],"domain_scores_gemma":[0.99982613,0.000054420852,0.000026008793,0.000026983678,0.000048579375,0.000017885539],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028717096,0.0006247873,0.00046639927,0.00060121587,0.0009821773,0.00043858206,0.000781515,0.00044899216,0.0028795048],"category_scores_gemma":[0.00069577136,0.0005761901,0.00019386699,0.0006048797,0.00024002715,0.0005043456,0.00043225777,0.0008705279,0.000969158],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00024920524,0.000037609694,0.0004104611,0.00052258756,0.000013607603,0.00018851837,0.00021722329,0.00032297877,0.9898796,0.00063907,0.00075906276,0.00676009],"study_design_scores_gemma":[0.000012048398,0.00005619248,0.0008871741,0.000010962285,0.000009334641,0.000054515895,0.000053509717,0.00038188335,0.99196,0.000041043717,0.0065235603,0.000009817518],"about_ca_topic_score_codex":0.0047373693,"about_ca_topic_score_gemma":0.012438713,"teacher_disagreement_score":0.0047373693,"about_ca_system_score_codex":0.0006326812,"about_ca_system_score_gemma":0.0007664747,"threshold_uncertainty_score":0.009632885},"labels":[],"label_agreement":null},{"id":"W2019893422","doi":"10.4028/www.scientific.net/ssp.145-146.319","title":"Surface Energy and Wetting Behaviour of Plasma Etched Porous SiCOH Surfaces and Plasma Etch Residue Cleaning Solutions","year":2009,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Freistaat Sachsen; European Commission","keywords":"Wetting; Materials science; Contact angle; Wet cleaning; Surface energy; Plasma; Plasma etching; Porosity; Plasma cleaning; Solid surface; Etching (microfabrication); Chemical engineering; Polymer; Composite material; Chemical physics; Organic chemistry; Chemistry","score_opus":0.0389297405943981,"score_gpt":0.29216092539560296,"score_spread":0.2532311848012049,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2019893422","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9983559,0.0004011391,0.00045641107,0.000012922436,0.000007367534,0.0000045384304,0.00016170579,0.00001840994,0.0005815132],"genre_scores_gemma":[0.9979157,0.00034837748,0.00075393275,0.000012777021,0.0000061911505,0.000009199152,0.00030811125,0.000012192779,0.0006334601],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997216,0.000020840782,0.00001690041,0.000037909915,0.00013441565,0.000068247806],"domain_scores_gemma":[0.9996289,0.00014923172,0.000084267616,0.000031722222,0.000081769664,0.000024144825],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015533583,0.00020399394,0.00021474375,0.00041120665,0.0001676115,0.000242863,0.0002062055,0.00031848287,0.0014324869],"category_scores_gemma":[0.0005775972,0.00016409437,0.00024515647,0.00041941175,0.00021389856,0.00019807613,0.00014196393,0.00031575433,0.00019883568],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011479913,0.000016710463,0.000632585,0.000052394567,0.000013738824,0.00007700916,0.000058896498,0.0005380411,0.996167,0.000061689636,0.00004528158,0.0022218255],"study_design_scores_gemma":[0.000006478005,0.00027644154,0.010719769,0.000006253957,0.000011887635,0.00011005463,0.00009066438,0.0029238355,0.9853887,0.000047020992,0.00040720528,0.000011687117],"about_ca_topic_score_codex":0.0010011785,"about_ca_topic_score_gemma":0.00074208516,"teacher_disagreement_score":0.0014324869,"about_ca_system_score_codex":0.00016622698,"about_ca_system_score_gemma":0.000097578064,"threshold_uncertainty_score":0.004792094},"labels":[],"label_agreement":null},{"id":"W2020646746","doi":"10.1143/jjap.39.2189","title":"Measurement of Copper Drift in Methylsilsesquiazane-Methylsilsesquioxane Dielectric Films","year":2000,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Time-dependent gate oxide breakdown; Dielectric; Dielectric strength; Ion; Analytical Chemistry (journal); Leakage (economics); Capacitor; Electric field; Threshold voltage; Polyimide; Copper; Chemical vapor deposition; Stress (linguistics); Voltage; Optoelectronics; Gate dielectric; Composite material; Electrical engineering; Transistor; Metallurgy; Chemistry","score_opus":0.014789672024946037,"score_gpt":0.24529565945956622,"score_spread":0.23050598743462017,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2020646746","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99869764,0.00027787482,0.0006895874,0.000017099032,0.000005606511,0.000004601782,0.00006673398,0.000018246214,0.00022251981],"genre_scores_gemma":[0.9972378,0.000368538,0.0015319571,0.000015789217,0.0000040668106,0.000015209588,0.00008843448,0.0000072794564,0.00073093525],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998797,0.000010617592,0.000008967286,0.000035227844,0.000042646512,0.000022855982],"domain_scores_gemma":[0.9996387,0.000068077425,0.00013134124,0.000027008558,0.00009675679,0.00003817432],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016197414,0.0002951622,0.0001616253,0.0002751109,0.00018385977,0.00021073474,0.00024095994,0.00024212663,0.00062632817],"category_scores_gemma":[0.0003668565,0.00019190482,0.00009391044,0.00029492113,0.00017741343,0.0002480723,0.00013858287,0.0002654643,0.00010675931],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031976553,0.0000034289658,0.00031428863,0.000014213007,0.0000018651037,0.000024293766,0.000026890568,0.000024551762,0.99887925,0.000010423508,0.000005040287,0.00066367845],"study_design_scores_gemma":[0.0000035746775,0.00014055145,0.0040314756,0.0000035958217,0.000004769663,0.00006008843,0.00003086925,0.0003542242,0.9951443,0.000008628938,0.00021541039,0.000002404713],"about_ca_topic_score_codex":0.0008866616,"about_ca_topic_score_gemma":0.0014597547,"teacher_disagreement_score":0.0008866616,"about_ca_system_score_codex":0.00030359218,"about_ca_system_score_gemma":0.00013205483,"threshold_uncertainty_score":0.0022027493},"labels":[],"label_agreement":null},{"id":"W2022602619","doi":"10.1016/j.microrel.2008.06.025","title":"Simulation of migration effects in nanoscaled copper metallizations","year":2008,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Bundesministerium für Forschung und Technologie; Bundesministerium für Bildung, Wissenschaft, Forschung und Technologie; Bundesministerium für Bildung und Forschung","keywords":"Copper; Interconnection; Materials science; Electrical resistivity and conductivity; Aluminium; Void (composites); Copper interconnect; Electromigration; Metallurgy; Composite material; Electrical engineering; Computer science; Engineering","score_opus":0.010152594568213713,"score_gpt":0.25054092103797004,"score_spread":0.24038832646975633,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2022602619","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97404283,0.00028470217,0.008455233,0.0004199023,0.0000976027,0.00003148892,0.00020216865,0.00029346155,0.01617249],"genre_scores_gemma":[0.9968135,0.000064700595,0.0017383315,0.000030792995,0.000010802751,0.000019502395,0.000052690273,0.0000363397,0.0012333214],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99987376,0.000026118656,0.0000038524868,0.000019000838,0.000026355208,0.00005096491],"domain_scores_gemma":[0.99923205,0.0004493215,0.00009096895,0.000061697356,0.00009236477,0.0000736422],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001956249,0.00056411553,0.00069628406,0.00044958876,0.0006512685,0.0005911514,0.0010581616,0.0013970062,0.0035734265],"category_scores_gemma":[0.0015497053,0.00053263555,0.0004352601,0.00056172523,0.0008159097,0.0005715662,0.0004666287,0.0005967731,0.00019009967],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006653274,0.00004627813,0.00087154453,0.000037898335,0.000018358991,0.00011741729,0.000037483573,0.99370724,0.0017964947,0.0018763847,0.0003629467,0.0010614356],"study_design_scores_gemma":[0.00001925075,0.000030199502,0.00029580208,0.0000033229069,0.0000054595416,0.000008868009,0.000018801167,0.9985222,0.0006090957,0.00031486436,0.0001673312,0.000004849093],"about_ca_topic_score_codex":0.021520056,"about_ca_topic_score_gemma":0.013154259,"teacher_disagreement_score":0.021520056,"about_ca_system_score_codex":0.0013250716,"about_ca_system_score_gemma":0.0009597831,"threshold_uncertainty_score":0.04278958},"labels":[],"label_agreement":null},{"id":"W2023699907","doi":"10.1016/s0169-4332(01)00339-7","title":"The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering","year":2001,"lang":"en","type":"article","venue":"Applied Surface Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada); Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"X-ray photoelectron spectroscopy; Adhesion; Copper; Metal; Materials science; Annealing (glass); Sputtering; Surface energy; Reactivity (psychology); Ultimate tensile strength; Composite material; Chemical engineering; Nanotechnology; Metallurgy; Thin film","score_opus":0.01689406205976454,"score_gpt":0.26471969010194707,"score_spread":0.24782562804218253,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2023699907","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9692684,0.0025922924,0.017120147,0.00026623107,0.00016798303,0.000109830595,0.00012151389,0.0005155278,0.009838079],"genre_scores_gemma":[0.98141575,0.0013794275,0.00825423,0.00007809565,0.000038532755,0.00005830509,0.00016194824,0.000104685365,0.008509075],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996995,0.000027277294,0.000016465594,0.000042304022,0.00011600741,0.00009858264],"domain_scores_gemma":[0.9997998,0.00004693319,0.00003566235,0.000042026048,0.000054549524,0.000021015137],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00026862393,0.00044830833,0.0004415443,0.00034099404,0.00029544625,0.00042217734,0.00037807465,0.00046911265,0.002347937],"category_scores_gemma":[0.0005376747,0.00038704547,0.00027176153,0.00030872753,0.00026479544,0.00028079265,0.00043745385,0.00046050604,0.00083043426],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000025187155,0.000006062086,0.000082747676,0.000043149215,0.0000033714407,0.00005884102,0.00003175718,0.000030740106,0.99777836,0.000091142225,0.000106107946,0.0017425732],"study_design_scores_gemma":[0.0000033356127,0.00006423528,0.0011151992,0.0000026130388,0.000004108285,0.00010466385,0.0000141249975,0.00024640953,0.9966288,0.0000120746445,0.0018014063,0.000002959143],"about_ca_topic_score_codex":0.001032206,"about_ca_topic_score_gemma":0.0019186822,"teacher_disagreement_score":0.002347937,"about_ca_system_score_codex":0.000299911,"about_ca_system_score_gemma":0.00020595241,"threshold_uncertainty_score":0.0078546405},"labels":[],"label_agreement":null},{"id":"W2024206334","doi":"10.1088/0953-8984/14/30/301","title":"The quantitative correlation of nanoscopic and macroscopic measurements of adhesion: copper clusters on a low-permittivity polymer","year":2002,"lang":"en","type":"article","venue":"Journal of Physics Condensed Matter","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Copper; Coalescence (physics); Materials science; Permittivity; Polymer; Nanoscopic scale; Adhesion; Composite material; Nanoclusters; Nanotechnology; Dielectric; Metallurgy; Optoelectronics; Physics","score_opus":0.034026352207625635,"score_gpt":0.2738590712804393,"score_spread":0.23983271907281367,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2024206334","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98932403,0.00023470807,0.008752686,0.00004330981,0.000012172436,0.000017021292,0.00008532287,0.000094544295,0.0014362147],"genre_scores_gemma":[0.9983358,0.00010110066,0.0009455202,0.000018168563,0.000006889855,0.000019386722,0.000055389344,0.000011128133,0.0005066392],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996885,0.000017606448,0.000008756631,0.000051722276,0.00017856773,0.000054981207],"domain_scores_gemma":[0.99890363,0.00042878147,0.00027628496,0.00010686165,0.00019170159,0.000092768576],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020995033,0.0002379316,0.00022486574,0.00056622416,0.0002438189,0.0004713051,0.00031167068,0.00033833663,0.0013287574],"category_scores_gemma":[0.0011170534,0.00021463995,0.00009108129,0.00029251736,0.0005356309,0.0003128663,0.0003734587,0.0005782973,0.00037240365],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006645249,0.000020808353,0.0019271148,0.00003229319,0.0000093134395,0.00006151979,0.00007679069,0.00053248816,0.9943656,0.0001729393,0.000058340218,0.0026763557],"study_design_scores_gemma":[0.000008313155,0.00019264835,0.02498649,0.0000041584867,0.000019358107,0.00014155949,0.0001040963,0.008257892,0.9657609,0.00014016536,0.0003697834,0.000014610328],"about_ca_topic_score_codex":0.00094175455,"about_ca_topic_score_gemma":0.0009544129,"teacher_disagreement_score":0.0013287574,"about_ca_system_score_codex":0.0002526375,"about_ca_system_score_gemma":0.00011006355,"threshold_uncertainty_score":0.004445195},"labels":[],"label_agreement":null},{"id":"W2032056278","doi":"10.1016/j.tsf.2008.05.022","title":"Optical and chemical characterization of expanding thermal plasma-deposited carbon-containing silicon dioxide-like films","year":2008,"lang":"en","type":"article","venue":"Thin Solid Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Silicon dioxide; Characterization (materials science); Carbon dioxide; Silicon; Carbon film; Materials science; Thin film; Plasma; Chemical engineering; Thermal; Nanotechnology; Chemistry; Analytical Chemistry (journal); Optoelectronics; Environmental chemistry; Composite material; Organic chemistry","score_opus":0.015088569553896272,"score_gpt":0.24217691412026254,"score_spread":0.22708834456636628,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2032056278","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9976528,0.00023364072,0.00043044498,0.000017183931,0.0000065264103,0.000007636304,0.00008172087,0.000016092285,0.001553972],"genre_scores_gemma":[0.99719393,0.00016128653,0.0011037455,0.000016757853,0.000008123097,0.000008196151,0.00016138486,0.000008021527,0.0013385057],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999902,0.0000076689375,0.0000042252564,0.000018069028,0.00005144639,0.00001660655],"domain_scores_gemma":[0.9998149,0.00005765046,0.000035976645,0.000016126147,0.0000553692,0.000019960113],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011797936,0.00020081834,0.0001258693,0.000294505,0.00021005428,0.00020915434,0.00018133855,0.00023385181,0.00080310804],"category_scores_gemma":[0.00026579836,0.00014777729,0.00007249016,0.00025738825,0.00021006768,0.00017319451,0.00007997597,0.00019053227,0.00007712117],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000290741,0.000006842978,0.00016695859,0.000013841835,0.0000018820847,0.000031527572,0.000012291638,0.00007099605,0.9991714,0.000026056734,0.000026565313,0.00044260643],"study_design_scores_gemma":[0.0000073697443,0.00012032557,0.008054948,0.000001711269,0.0000066794673,0.00008307315,0.000035043493,0.0009552465,0.99026793,0.000010544939,0.00045379743,0.0000033317408],"about_ca_topic_score_codex":0.0017943922,"about_ca_topic_score_gemma":0.0027458104,"teacher_disagreement_score":0.0017943922,"about_ca_system_score_codex":0.00019353878,"about_ca_system_score_gemma":0.00015614337,"threshold_uncertainty_score":0.003567934},"labels":[],"label_agreement":null},{"id":"W2032584242","doi":"10.1007/s11664-005-0158-6","title":"Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Electron backscatter diffraction; Materials science; Texture (cosmology); Scanning electron microscope; Copper; Electron diffraction; Dislocation; Diffraction; Substrate (aquarium); Composite material; Silicon; Crystallography; Condensed matter physics; Analytical Chemistry (journal); Optics; Microstructure; Chemistry; Metallurgy; Geology","score_opus":0.005200924861074285,"score_gpt":0.25440586543738014,"score_spread":0.24920494057630585,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2032584242","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9968382,0.00076552626,0.00082394975,0.00004713321,0.000024923967,0.00000639027,0.00011809576,0.00002918173,0.0013465029],"genre_scores_gemma":[0.99851257,0.0003617202,0.0005048032,0.00001922125,0.000006993469,0.0000051727566,0.000097283366,0.000026414427,0.00046573085],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998498,0.000023440536,0.0000097011525,0.00003403225,0.000041446743,0.00004153506],"domain_scores_gemma":[0.99933064,0.00035498384,0.000086622036,0.00007419229,0.00011693322,0.000036567428],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001988063,0.00029758344,0.00043133597,0.00016170823,0.0003215705,0.00068382843,0.00023738277,0.0002960951,0.0018630497],"category_scores_gemma":[0.0006292435,0.00042379647,0.00014755539,0.00028982325,0.00038340362,0.00041882542,0.00018759143,0.00042221116,0.00026973517],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004084273,0.000020726264,0.001334462,0.00010311455,0.000022080738,0.0002709601,0.00015143289,0.00029461712,0.99579775,0.00009787775,0.00010623081,0.0013923127],"study_design_scores_gemma":[0.000012921226,0.00015505479,0.008306762,0.0000075115618,0.000020704634,0.00011057271,0.00011217546,0.0013265854,0.98941857,0.000026723967,0.0004939283,0.000008425493],"about_ca_topic_score_codex":0.0012970194,"about_ca_topic_score_gemma":0.002173254,"teacher_disagreement_score":0.0018630497,"about_ca_system_score_codex":0.0002958093,"about_ca_system_score_gemma":0.00018005616,"threshold_uncertainty_score":0.0062325597},"labels":[],"label_agreement":null},{"id":"W2033426489","doi":"10.1063/1.3187931","title":"Water diffusion and fracture behavior in nanoporous low-k dielectric film stacks","year":2009,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":31,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Texas Instruments; National Science Foundation","keywords":"Nanoporous; Materials science; Dielectric; Microelectronics; Diffusion; Low-k dielectric; Composite material; Fracture (geology); Chemical engineering; Nanotechnology; Optoelectronics","score_opus":0.005643433779466343,"score_gpt":0.2293324392828302,"score_spread":0.22368900550336385,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2033426489","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9995146,0.00012678475,0.00025174656,0.0000047526123,0.0000010023293,0.0000012890025,0.000025257057,0.000007199352,0.000067414156],"genre_scores_gemma":[0.99933976,0.00011508055,0.00035528615,0.0000033534438,8.8208725e-7,0.0000027043943,0.00003595242,0.0000039790407,0.00014313498],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999473,0.0000035437106,0.0000026185885,0.000014577608,0.000016856497,0.000015163403],"domain_scores_gemma":[0.99989307,0.000027900865,0.000038585862,0.000006469855,0.00002241303,0.000011556599],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006619598,0.00016909589,0.0001275756,0.00021995924,0.00017159805,0.00019233824,0.000157475,0.00020124024,0.00028485994],"category_scores_gemma":[0.0002124589,0.00013030837,0.00011125942,0.000093365044,0.00025091416,0.00034748425,0.00015145008,0.00016409687,0.00005858277],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000067720415,0.000008583024,0.001137105,0.000020834117,0.0000066703224,0.00007748295,0.00006094828,0.00032684568,0.9973272,0.00003235698,0.0000090933445,0.00092516805],"study_design_scores_gemma":[0.000007903035,0.00019656308,0.008147271,0.000006007497,0.000016176866,0.00015601573,0.0001231005,0.00482129,0.98619425,0.000048420363,0.0002700336,0.000012948999],"about_ca_topic_score_codex":0.0016426492,"about_ca_topic_score_gemma":0.0016516399,"teacher_disagreement_score":0.0016426492,"about_ca_system_score_codex":0.00023179247,"about_ca_system_score_gemma":0.00007449902,"threshold_uncertainty_score":0.0032661557},"labels":[],"label_agreement":null},{"id":"W2035785945","doi":"10.4028/www.scientific.net/msf.467-470.1339","title":"Abnormal Grain Growth in Electrochemically Deposited Cu Films","year":2004,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Materials science; Grain growth; Nanocrystalline material; Annealing (glass); Grain size; Abnormal grain growth; Grain boundary; Microstructure; Metallurgy; Chemical engineering; Nanotechnology","score_opus":0.0058028005671492315,"score_gpt":0.23119897046014856,"score_spread":0.22539616989299932,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2035785945","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9937861,0.0009123524,0.0042591305,0.000041672596,0.000021823958,0.000007681239,0.00004524346,0.000058766433,0.0008673615],"genre_scores_gemma":[0.9964502,0.00038364416,0.002357602,0.000010530969,0.000005678253,0.0000036517445,0.000042560754,0.000011777682,0.0007342994],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99984527,0.000015330284,0.000014148721,0.000034298162,0.00006946243,0.000021418462],"domain_scores_gemma":[0.99968636,0.00010366006,0.00009194446,0.000051898114,0.00005326526,0.000012825009],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014354086,0.000108258304,0.00015608234,0.00015014074,0.0001501784,0.00035636235,0.00025774998,0.0002556218,0.00022228937],"category_scores_gemma":[0.0006319212,0.0001890794,0.000087098415,0.00019018307,0.00021074757,0.0004059256,0.00011378683,0.00022859318,0.0000645187],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000044482073,0.000011627382,0.0015591092,0.00006205835,0.000007685911,0.00020210989,0.000058590704,0.0011917317,0.99229336,0.00056392234,0.00009886725,0.0039065275],"study_design_scores_gemma":[0.000004124036,0.00007614549,0.004217011,0.0000028682657,0.000008292931,0.0002499218,0.000025556137,0.012792849,0.981457,0.0001684127,0.0009925843,0.000005333328],"about_ca_topic_score_codex":0.0013010275,"about_ca_topic_score_gemma":0.0024346982,"teacher_disagreement_score":0.0013010275,"about_ca_system_score_codex":0.0004191785,"about_ca_system_score_gemma":0.000100092155,"threshold_uncertainty_score":0.0030413866},"labels":[],"label_agreement":null},{"id":"W2046371518","doi":"10.5555/2561828.2561935","title":"A vectorless framework for power grid electromigration checking","year":2013,"lang":"en","type":"article","venue":"International Conference on Computer Aided Design","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Reliability (semiconductor); Computer science; Grid; Workload; Conservatism; Power (physics); Very-large-scale integration; Power integrity; Pessimism; Reliability engineering; Chip; Interconnection; Series (stratigraphy); Electronic engineering; Power grid; Electronic circuit; Electrical engineering; Engineering; Telecommunications; Embedded system; Physics; Mathematics","score_opus":0.06380763957094039,"score_gpt":0.30919855127540236,"score_spread":0.24539091170446198,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2046371518","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0010081871,0.000056212455,0.99682367,0.000052906675,0.000018533277,0.000032639215,0.00006791797,0.00089578435,0.0010441566],"genre_scores_gemma":[0.15115981,0.00032143207,0.8417628,0.0002294426,0.00009602584,0.00028726683,0.0005010679,0.0006012924,0.0050408556],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9977216,0.00071926706,0.00018642325,0.00033672233,0.0008435103,0.00019246097],"domain_scores_gemma":[0.99714607,0.0014250834,0.00020883729,0.00071001763,0.0004467526,0.00006323936],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0028173767,0.001019058,0.0008190548,0.0014773654,0.00069781096,0.002549023,0.0040446566,0.0009554556,0.0061327037],"category_scores_gemma":[0.007106929,0.0008400181,0.0018578891,0.0013074434,0.0020255886,0.0044882908,0.0025337527,0.002108886,0.0011577985],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000084205654,0.00006535405,0.000659646,0.00018388822,0.000043505544,0.0002348622,0.00016029504,0.31273255,0.0030776383,0.5954744,0.0036981192,0.0835854],"study_design_scores_gemma":[0.00002360188,0.000034223587,0.00005415503,0.000033701454,0.00001879839,0.00006680395,0.0000205115,0.79669666,0.002014645,0.19261652,0.008404157,0.000016274871],"about_ca_topic_score_codex":0.004118559,"about_ca_topic_score_gemma":0.004818097,"teacher_disagreement_score":0.0061327037,"about_ca_system_score_codex":0.001304588,"about_ca_system_score_gemma":0.0015484978,"threshold_uncertainty_score":0.020515919},"labels":[],"label_agreement":null},{"id":"W2051362204","doi":"10.4028/www.scientific.net/msf.519-521.1391","title":"Electrical Resistivity Measurements: A Sensitive Tool for Studying Aluminium Alloys","year":2006,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":33,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electrical resistivity and conductivity; Materials science; Alloy; Microstructure; Aluminium; Dislocation; Metallurgy; Characterization (materials science); Electrical conductor; Composite material; Nanotechnology; Electrical engineering","score_opus":0.029072118113376857,"score_gpt":0.27820456858156467,"score_spread":0.24913245046818783,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2051362204","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.21901856,0.021946203,0.72596365,0.0022338114,0.0006202579,0.00021347939,0.0013290952,0.0042764056,0.02439845],"genre_scores_gemma":[0.8288043,0.008451235,0.15335771,0.0004728064,0.0003295339,0.00015319578,0.00035352798,0.0002003371,0.0078774365],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985519,0.00035775133,0.00007092152,0.00018781933,0.0007669085,0.00006466278],"domain_scores_gemma":[0.99902236,0.00034234035,0.00023850473,0.00015426082,0.00020474788,0.00003771649],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008110382,0.000519344,0.00046600972,0.001362871,0.00032999474,0.0008399688,0.0008033231,0.001025953,0.0012830574],"category_scores_gemma":[0.0013911176,0.00039665063,0.00016852688,0.0010000713,0.0006684306,0.0011220232,0.0006331734,0.0011537046,0.0011572896],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000041452608,0.000016131773,0.0012049928,0.00025022356,0.000014673684,0.00015746341,0.00011476626,0.00039082367,0.96482664,0.0014946618,0.0008525683,0.030635577],"study_design_scores_gemma":[0.000011957874,0.00023533903,0.0059230113,0.00006249283,0.00004482444,0.001772584,0.00019860444,0.0060015833,0.9495709,0.002608925,0.033516373,0.000053431642],"about_ca_topic_score_codex":0.00015594295,"about_ca_topic_score_gemma":0.00031649633,"teacher_disagreement_score":0.001362871,"about_ca_system_score_codex":0.00020792868,"about_ca_system_score_gemma":0.0001762418,"threshold_uncertainty_score":0.0042922497},"labels":[],"label_agreement":null},{"id":"W2055574202","doi":"10.1016/j.micron.2004.01.003","title":"Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines","year":2004,"lang":"en","type":"article","venue":"Micron","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Misorientation; Materials science; Grain boundary; Microstructure; Aspect ratio (aeronautics); Annealing (glass); Copper interconnect; Grain size; Composite material; Trench; Condensed matter physics; Physics","score_opus":0.007781704212738953,"score_gpt":0.2672483520397015,"score_spread":0.25946664782696255,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2055574202","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9989543,0.0002654803,0.00025876943,0.0000133228305,0.000007738206,0.0000036239649,0.000057181907,0.000022749948,0.00041675082],"genre_scores_gemma":[0.99931014,0.0000674248,0.00018293926,0.000007739213,0.000003186628,0.0000023435625,0.00004780747,0.00001304539,0.00036540674],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998709,0.000013408457,0.0000073203983,0.000035387508,0.000040228264,0.00003271009],"domain_scores_gemma":[0.9996425,0.00010621325,0.00010452012,0.000029343022,0.00008308732,0.00003434881],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001764895,0.00012481678,0.00023676861,0.00016452772,0.00024955353,0.0004169676,0.00025954694,0.00023007394,0.0009654068],"category_scores_gemma":[0.000521039,0.00028615043,0.000086122694,0.00020267887,0.00023419566,0.00029208206,0.00015961213,0.00019188652,0.00011893508],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00051315146,0.000046148278,0.0025999486,0.000055555403,0.000022697013,0.00022543367,0.0001369368,0.0022495915,0.9915249,0.00012393904,0.000112367314,0.0023893057],"study_design_scores_gemma":[0.000039298495,0.0008909664,0.04164735,0.000006308962,0.000048988666,0.00014388096,0.00016808865,0.007506543,0.9486239,0.000047411533,0.0008590817,0.000018220959],"about_ca_topic_score_codex":0.002773031,"about_ca_topic_score_gemma":0.0091925515,"teacher_disagreement_score":0.002773031,"about_ca_system_score_codex":0.000499096,"about_ca_system_score_gemma":0.00025075919,"threshold_uncertainty_score":0.0055137873},"labels":[],"label_agreement":null},{"id":"W2056542301","doi":"10.1557/opl.2012.92","title":"Strain Analysis of Copper Films During Wet-Chemical Deposition.","year":2012,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mount Allison University","funders":"","keywords":"Materials science; Copper; Galvanic cell; Polyethylene terephthalate; Copper plating; Polyimide; Composite material; Metallurgy; Recrystallization (geology); Layer (electronics); Electroplating","score_opus":0.011692170809886646,"score_gpt":0.24642165105596284,"score_spread":0.2347294802460762,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2056542301","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99205303,0.0011078004,0.0020299074,0.00005211394,0.00005083361,0.000021620484,0.0003782888,0.00005112254,0.004255315],"genre_scores_gemma":[0.99618834,0.00053962076,0.00076496624,0.00001917991,0.000011749775,0.000015015341,0.00033128395,0.000018967306,0.0021108289],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99988174,0.000008184024,0.000003949825,0.000015504222,0.00006696793,0.000023601513],"domain_scores_gemma":[0.99985206,0.000026732669,0.000031042036,0.000019978203,0.000060789593,0.000009388069],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010347038,0.00023347732,0.00012435597,0.00029235202,0.0002967007,0.00018409624,0.0002935625,0.00022058806,0.001862462],"category_scores_gemma":[0.00026361932,0.00016105393,0.00008271804,0.0004061069,0.00017990787,0.00021889978,0.00011053463,0.00029074488,0.00027957105],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007365505,0.000013258699,0.00058857206,0.000051366627,0.000009540898,0.00009672352,0.000067964764,0.0001670423,0.9959687,0.00006261268,0.00015871969,0.0027418744],"study_design_scores_gemma":[0.000006690638,0.00017489579,0.023867691,0.000007515086,0.000011752282,0.00016085841,0.00012104688,0.001525421,0.9725251,0.000026547244,0.0015645707,0.0000079235515],"about_ca_topic_score_codex":0.002714126,"about_ca_topic_score_gemma":0.0036912204,"teacher_disagreement_score":0.002714126,"about_ca_system_score_codex":0.00022432311,"about_ca_system_score_gemma":0.00012474493,"threshold_uncertainty_score":0.0062305927},"labels":[],"label_agreement":null},{"id":"W2059711083","doi":"10.1016/j.tsf.2012.07.039","title":"The effect of nickel on the strain evolution in chemical copper films","year":2012,"lang":"en","type":"article","venue":"Thin Solid Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":17,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mount Allison University","funders":"","keywords":"Nickel; Copper; Strain (injury); Metallurgy; Materials science; Chemistry; Biology","score_opus":0.011876888644918818,"score_gpt":0.26882028483247433,"score_spread":0.2569433961875555,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2059711083","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9952284,0.0006943186,0.00021385589,0.000069887355,0.000023135632,0.000006368722,0.00005207444,0.000024972822,0.0036870306],"genre_scores_gemma":[0.997922,0.00027291046,0.00015930206,0.000015240213,0.0000081901435,0.000003643655,0.000048315196,0.00002081037,0.0015496305],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99987745,0.00001746682,0.0000070153005,0.000021131245,0.00004620844,0.00003070192],"domain_scores_gemma":[0.99973136,0.00010905793,0.000043663986,0.000035572884,0.00005802356,0.00002234321],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014676999,0.00017147488,0.00016979726,0.0001499882,0.00041379785,0.0005190104,0.00030385132,0.00023315007,0.0017288465],"category_scores_gemma":[0.000725297,0.00019022259,0.00008051054,0.00021362789,0.0004376768,0.0003602528,0.00015359036,0.00034704147,0.0001877822],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008266561,0.000053824173,0.0011399848,0.00013071262,0.000015424826,0.00024351402,0.00032232844,0.0005778273,0.9891685,0.00059395086,0.00026221215,0.0066649998],"study_design_scores_gemma":[0.000010088884,0.00013549167,0.00308982,0.00000462883,0.000008108433,0.00004969092,0.000078253404,0.0012969285,0.9940883,0.00003257679,0.0011993913,0.0000067797996],"about_ca_topic_score_codex":0.0028557016,"about_ca_topic_score_gemma":0.0039456636,"teacher_disagreement_score":0.0028557016,"about_ca_system_score_codex":0.0004650273,"about_ca_system_score_gemma":0.00017960777,"threshold_uncertainty_score":0.0057834983},"labels":[],"label_agreement":null},{"id":"W2060301273","doi":"10.1016/s0167-9317(02)00816-x","title":"Modelling roughness, grain and confinement effects on transport in embedded metallic films","year":2002,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Materials science; Surface finish; Metal; Grain size; Surface roughness; Composite material; Nanotechnology; Metallurgy","score_opus":0.008055728145105676,"score_gpt":0.19343183692374938,"score_spread":0.1853761087786437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2060301273","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9825366,0.00051120826,0.012292,0.00018612752,0.000045000612,0.000020175637,0.00010168897,0.00015268875,0.0041544116],"genre_scores_gemma":[0.99577713,0.0001984288,0.0021432845,0.000016751448,0.000014487964,0.0000125889455,0.000055244967,0.00004221825,0.0017399292],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9999168,0.000015079072,0.0000037643576,0.000014244782,0.000020839365,0.000029165576],"domain_scores_gemma":[0.99935895,0.00044190304,0.000059692426,0.00003727286,0.000070368005,0.000031805976],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023649269,0.000457,0.00052392896,0.0002902184,0.00034133537,0.0006507722,0.00061867,0.0012645923,0.000882455],"category_scores_gemma":[0.0014183944,0.00045689323,0.00042775538,0.00032243988,0.0004414385,0.0006120253,0.00025633542,0.0004441574,0.00011150253],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000054312317,0.00004875345,0.0007580322,0.000039001196,0.000018621138,0.000078194884,0.000026460017,0.9864958,0.0096016815,0.0014286815,0.00016012159,0.0012903285],"study_design_scores_gemma":[0.00000818184,0.0000190571,0.00034314234,0.0000014523001,0.000006240885,0.000005590528,0.000005830024,0.99857426,0.00081575155,0.00015794908,0.000058973772,0.0000035820551],"about_ca_topic_score_codex":0.023869826,"about_ca_topic_score_gemma":0.01612351,"teacher_disagreement_score":0.023869826,"about_ca_system_score_codex":0.001040494,"about_ca_system_score_gemma":0.0006570347,"threshold_uncertainty_score":0.047461748},"labels":[],"label_agreement":null},{"id":"W2061176162","doi":"10.1007/s00216-004-2602-5","title":"Comparison of the annealing behavior of thin Ta films deposited onto Si and SiO2 substrates","year":2004,"lang":"en","type":"article","venue":"Analytical and Bioanalytical Chemistry","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":14,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Bundesministerium für Bildung und Forschung","keywords":"Annealing (glass); Tetragonal crystal system; Silicide; Materials science; Nucleation; Crystallography; Metastability; Thin film; Sputtering; Silicon; Analytical Chemistry (journal); Chemical engineering; Chemistry; Metallurgy; Nanotechnology; Crystal structure","score_opus":0.021396462813250257,"score_gpt":0.2939623506323591,"score_spread":0.27256588781910884,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2061176162","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9965661,0.0005844223,0.00086394633,0.000026132495,0.00001789466,0.000009045707,0.00013484604,0.0000432307,0.0017544678],"genre_scores_gemma":[0.99595875,0.00035657056,0.0010284476,0.000013779984,0.0000074998184,0.0000072160547,0.00026540918,0.000030149016,0.002332222],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999225,0.000006683727,0.00000607611,0.000015843325,0.000022689059,0.000026187698],"domain_scores_gemma":[0.9997186,0.00009368281,0.000038265545,0.000031644755,0.000101391146,0.00001640838],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000105995794,0.00017798952,0.00018668642,0.00019912825,0.00023067271,0.00027166025,0.00016055317,0.00020953377,0.0018986632],"category_scores_gemma":[0.00043907587,0.00018152659,0.00015015663,0.00020794496,0.000111309404,0.00020097887,0.00006029375,0.00027639495,0.00034006088],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020449585,0.0000104576075,0.00056363584,0.00004872452,0.000011799321,0.000041881445,0.000051015355,0.00018013698,0.9973475,0.000055721353,0.00006516929,0.0014194954],"study_design_scores_gemma":[0.0000047554895,0.00019551009,0.011434049,0.0000055513906,0.00002065978,0.00005084625,0.000046756693,0.0013245343,0.9860293,0.000009929237,0.00087401964,0.0000040671316],"about_ca_topic_score_codex":0.002494024,"about_ca_topic_score_gemma":0.0037267422,"teacher_disagreement_score":0.002494024,"about_ca_system_score_codex":0.00020344461,"about_ca_system_score_gemma":0.00017519912,"threshold_uncertainty_score":0.0063517094},"labels":[],"label_agreement":null},{"id":"W2061755246","doi":"10.1109/tcad.2015.2419215","title":"Redundancy-Aware Power Grid Electromigration Checking Under Workload Uncertainties","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electromigration; Computer science; Grid; Exploit; Power integrity; Redundancy (engineering); Reliability (semiconductor); Speedup; Multithreading; Netlist; Reliability engineering; Interconnection; Electronic engineering; Parallel computing; Power (physics); Electrical engineering; Telecommunications; Embedded system; Signal integrity; Engineering","score_opus":0.04971213364321367,"score_gpt":0.2528883529949298,"score_spread":0.20317621935171612,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2061755246","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4040936,0.00013138502,0.59299797,0.000113920694,0.000016146207,0.000034135748,0.00011136708,0.0017107632,0.0007907603],"genre_scores_gemma":[0.9745787,0.000019124576,0.025118973,0.00001612881,0.0000046164973,0.000012535867,0.000055115015,0.000035699817,0.00015902253],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993279,0.00022386663,0.00003710438,0.0001282318,0.00021220266,0.00007081207],"domain_scores_gemma":[0.9961831,0.00202314,0.00062575383,0.00066806166,0.00041728976,0.000082602215],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00082237145,0.000471628,0.0005595757,0.000571178,0.00024605755,0.0004967166,0.0011243504,0.00036736042,0.00043739655],"category_scores_gemma":[0.0054977126,0.00026767212,0.000392064,0.00040181546,0.0004153894,0.0010218901,0.00061403663,0.00035034772,0.0000712569],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016873932,0.000027907105,0.0049841926,0.00003651545,0.000030651772,0.00011370674,0.000049184073,0.9572695,0.010316938,0.002592365,0.0002940835,0.024116226],"study_design_scores_gemma":[0.0000026352925,0.00001610548,0.0001965525,0.0000010259702,0.000002617559,0.000012525401,0.000004224858,0.99735355,0.0018067472,0.00057694095,0.00002577571,0.0000013299978],"about_ca_topic_score_codex":0.002769763,"about_ca_topic_score_gemma":0.0032017073,"teacher_disagreement_score":0.002769763,"about_ca_system_score_codex":0.0006611248,"about_ca_system_score_gemma":0.00076143356,"threshold_uncertainty_score":0.0055072904},"labels":[],"label_agreement":null},{"id":"W2062795510","doi":"10.1007/s11664-005-0157-7","title":"Effect of film thickness on the evolution of annealing texture in sputtered copper films","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":36,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Annealing (glass); Grain boundary; Electron backscatter diffraction; Materials science; Crystal twinning; Condensed matter physics; Copper; Sputtering; Diffraction; Texture (cosmology); Grain size; Electron diffraction; Microstructure; Thin film; Crystallography; Composite material; Optics; Metallurgy; Chemistry; Nanotechnology; Physics","score_opus":0.0056073387672300875,"score_gpt":0.25205405644024315,"score_spread":0.24644671767301307,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2062795510","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9981698,0.0005713774,0.00032888606,0.000041784828,0.000021150028,0.000007451881,0.000102620186,0.000026135638,0.00073082204],"genre_scores_gemma":[0.99877435,0.00024614952,0.00031229304,0.000020393585,0.000011016559,0.000005444135,0.000076007804,0.000027296008,0.0005270199],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998938,0.000011586724,0.000009200402,0.000024543908,0.0000272543,0.000033561813],"domain_scores_gemma":[0.99953747,0.00020447031,0.00009709954,0.00004100739,0.00008040773,0.00003954602],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015184368,0.00018308373,0.00026014826,0.00014469188,0.000240151,0.00049840735,0.00022219127,0.00026019983,0.001828728],"category_scores_gemma":[0.00079781556,0.0003640571,0.00012811858,0.00024130501,0.00025136647,0.00028979563,0.00012328343,0.00040105413,0.00015616481],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000699107,0.000020604755,0.0009446739,0.00005784961,0.00001587144,0.0001368143,0.00008375071,0.00027892797,0.9958895,0.00003665241,0.000083428175,0.0017528313],"study_design_scores_gemma":[0.00003671515,0.00035861522,0.010020581,0.0000074271015,0.000033844073,0.00008650988,0.000064973276,0.0014038224,0.9874371,0.000017494644,0.00052405806,0.000008806714],"about_ca_topic_score_codex":0.0019809287,"about_ca_topic_score_gemma":0.0025889063,"teacher_disagreement_score":0.0019809287,"about_ca_system_score_codex":0.0003305688,"about_ca_system_score_gemma":0.00016900981,"threshold_uncertainty_score":0.0061177015},"labels":[],"label_agreement":null},{"id":"W2063558949","doi":"10.1063/1.371839","title":"Texture of Al thin films deposited by magnetron sputtering onto epitaxial W(001)","year":2000,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Stiftelsen för Strategisk Forskning; Stiftelsen för Strategisk Forskning; McGill University; Strategic Research Council; U.S. Department of Energy","keywords":"Materials science; Epitaxy; Tetragonal crystal system; Sputter deposition; Electromigration; Transmission electron microscopy; Lattice constant; Lattice (music); Electron diffraction; Diffraction; Condensed matter physics; Thin film; Crystallography; Layer (electronics); Sputtering; Composite material; Crystal structure; Optics; Nanotechnology; Chemistry","score_opus":0.005684454967060308,"score_gpt":0.2186227641762802,"score_spread":0.2129383092092199,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2063558949","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9988656,0.00010894448,0.00030280917,0.000008906442,0.0000046699156,0.0000031070424,0.000065152315,0.000020188614,0.00062076974],"genre_scores_gemma":[0.99863225,0.000097954464,0.0004724576,0.000008675119,0.0000026933972,0.0000030438625,0.00009037406,0.00001124015,0.0006811947],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999435,0.0000035062917,0.0000021393444,0.000014363024,0.000019281499,0.00001722889],"domain_scores_gemma":[0.999951,0.000009083091,0.000018691404,0.0000050120184,0.000008884789,0.0000071902246],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004234349,0.00010902513,0.00012373604,0.000111749694,0.00012935943,0.0003281041,0.0001910706,0.00013399514,0.0006923645],"category_scores_gemma":[0.00015422082,0.00019110522,0.00008060164,0.00012178725,0.00010558068,0.000117740776,0.000077576784,0.00012578735,0.000137202],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005643799,0.0000054862676,0.00046598996,0.000021979773,0.0000031740817,0.00006281276,0.000018589564,0.00013177267,0.99851507,0.000035751935,0.00003321858,0.00064965774],"study_design_scores_gemma":[0.000018860239,0.000099262055,0.009357635,0.0000026658843,0.000011394651,0.000093841416,0.00004515835,0.0025821717,0.98684895,0.000024298202,0.00091121,0.000004599418],"about_ca_topic_score_codex":0.0015941286,"about_ca_topic_score_gemma":0.0020902518,"teacher_disagreement_score":0.0015941286,"about_ca_system_score_codex":0.00029434613,"about_ca_system_score_gemma":0.00007512474,"threshold_uncertainty_score":0.0031697154},"labels":[],"label_agreement":null},{"id":"W2066712831","doi":"10.1109/tdmr.2014.2343793","title":"Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Device and Materials Reliability","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"National Chung-Hsing University; Ministry of Science and Technology, Taiwan; National Chiao Tung University; University of Texas at Austin","keywords":"Benzocyclobutene; Materials science; Adhesion; Titanium; Polymer; Layer (electronics); Copper; Composite material; Metal; Metallurgy","score_opus":0.014649236734903759,"score_gpt":0.24736632346612117,"score_spread":0.2327170867312174,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2066712831","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9951126,0.0016451888,0.0019703095,0.00003367428,0.00001825396,0.000009391263,0.000035163357,0.000018017497,0.0011572931],"genre_scores_gemma":[0.9968925,0.0007966727,0.0015831857,0.000019837475,0.000006834283,0.000008110101,0.000038145005,0.0000048744087,0.00064984965],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998072,0.000014454885,0.000006365796,0.000033515855,0.00009455525,0.000043998494],"domain_scores_gemma":[0.99987864,0.000029148754,0.000035469377,0.000007275605,0.00003434415,0.000015086465],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013866389,0.00026971407,0.00021417631,0.00028194752,0.00032129072,0.00031732753,0.00027211235,0.00036751071,0.00075504073],"category_scores_gemma":[0.00027441018,0.00020152173,0.00019456698,0.00030361186,0.000138377,0.00032874907,0.00029867887,0.00028528093,0.00019834188],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031463194,0.000010483948,0.00059397455,0.00008817922,0.000008713158,0.00007800253,0.000033519784,0.0002235152,0.9964858,0.00005680198,0.000031337422,0.0023582294],"study_design_scores_gemma":[0.0000042486568,0.00021954469,0.011823544,0.000008070904,0.000032229014,0.00016337892,0.00012251206,0.0032026365,0.9829207,0.000033479777,0.0014608828,0.000008807612],"about_ca_topic_score_codex":0.00096250325,"about_ca_topic_score_gemma":0.0016824988,"teacher_disagreement_score":0.00096250325,"about_ca_system_score_codex":0.0002522466,"about_ca_system_score_gemma":0.00013193136,"threshold_uncertainty_score":0.002525866},"labels":[],"label_agreement":null},{"id":"W2067850086","doi":"10.4028/www.scientific.net/msf.495-497.1377","title":"Texture Investigation in Cu Damascene Interconnects during Annealing","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Materials science; Copper interconnect; Annealing (glass); Electron backscatter diffraction; Diffraction; Line width; Interconnection; Composite material; Surface finish; Finite element method; Metallurgy; Optics; Copper; Structural engineering; Microstructure","score_opus":0.010328192340505981,"score_gpt":0.24993172348952378,"score_spread":0.2396035311490178,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2067850086","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99883705,0.00017174878,0.00043139444,0.0000072737957,0.0000024901253,0.0000036921756,0.000080556856,0.000017406977,0.00044829698],"genre_scores_gemma":[0.9987206,0.000077135766,0.00032946886,0.0000063716498,0.00000194898,0.0000056269846,0.000102524566,0.000010407351,0.00074598775],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999187,0.000006135117,0.0000040792916,0.000022426608,0.000027119846,0.000021557256],"domain_scores_gemma":[0.99980885,0.000030342526,0.000064751584,0.000020064961,0.00005619967,0.000019811067],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006804332,0.00011415025,0.00015748371,0.00021954438,0.00022530074,0.00023064435,0.000116291005,0.0001472595,0.00083826174],"category_scores_gemma":[0.0003019687,0.00015141252,0.000093751616,0.00027990554,0.00017587314,0.00018924748,0.00009498063,0.00019426724,0.00011636766],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012788453,0.000009204454,0.0012151845,0.000021243162,0.0000035487787,0.00010762755,0.00014862421,0.000160384,0.9966024,0.000030315474,0.000022354105,0.0015511994],"study_design_scores_gemma":[0.000009853075,0.000348251,0.056370504,0.000005905453,0.000020331003,0.00022696724,0.0001845653,0.0016897228,0.9396302,0.00002928871,0.0014702801,0.000014041261],"about_ca_topic_score_codex":0.0014926788,"about_ca_topic_score_gemma":0.0020423692,"teacher_disagreement_score":0.0014926788,"about_ca_system_score_codex":0.00022242167,"about_ca_system_score_gemma":0.000063631865,"threshold_uncertainty_score":0.0029679537},"labels":[],"label_agreement":null},{"id":"W2068154593","doi":"10.1007/s11664-010-1342-x","title":"Recrystallization of Electrodeposited Copper Thin Films During Annealing","year":2010,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Recrystallization (geology); Copper; Isothermal process; Annealing (glass); Materials science; Thermodynamics; Microstructure; Kinetics; Metallurgy; Thin film; Nanotechnology","score_opus":0.00482495346902307,"score_gpt":0.23298060703243897,"score_spread":0.2281556535634159,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2068154593","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99315953,0.0012301652,0.0013396499,0.00008079829,0.000044132965,0.000021871687,0.0002801245,0.00014994055,0.0036937334],"genre_scores_gemma":[0.99483716,0.0004273209,0.0010553594,0.000017957815,0.000010535543,0.000010189908,0.00031736627,0.00007595413,0.0032482238],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998642,0.000009636763,0.000008815253,0.000026687092,0.00004158548,0.00004907248],"domain_scores_gemma":[0.9998425,0.000044492645,0.00002502826,0.000035779256,0.000041473406,0.000010650348],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001240012,0.0002542061,0.00031191146,0.00028926838,0.0003284189,0.00032613124,0.00044387,0.00027837444,0.0031959552],"category_scores_gemma":[0.00046738575,0.0003033367,0.00013489138,0.0004024185,0.00021795655,0.00028425088,0.00011884926,0.00056688517,0.00047848266],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00018175837,0.00001637564,0.00020213379,0.00009626425,0.000011916634,0.00018825765,0.00012423481,0.00017640398,0.9962502,0.000084520005,0.00020675348,0.0024612434],"study_design_scores_gemma":[0.000007679621,0.00007557419,0.0014737183,0.0000041091353,0.0000068350682,0.000045373738,0.00003109369,0.0002455957,0.9971583,0.000011389613,0.00093718164,0.0000030566418],"about_ca_topic_score_codex":0.0030992918,"about_ca_topic_score_gemma":0.004786287,"teacher_disagreement_score":0.0031959552,"about_ca_system_score_codex":0.00028354768,"about_ca_system_score_gemma":0.00021514052,"threshold_uncertainty_score":0.010691464},"labels":[],"label_agreement":null},{"id":"W2069425306","doi":"10.1016/j.colsurfa.2008.04.036","title":"Effect of amine and thiol addition on the surface chemistry and agglomeration of fine Cu powders","year":2008,"lang":"en","type":"article","venue":"Colloids and Surfaces A Physicochemical and Engineering Aspects","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Economies of agglomeration; Chemistry; Propylamine; Copper; Thiol; Amine gas treating; Particle size; Butylamine; Chemical engineering; Inorganic chemistry; Organic chemistry; Physical chemistry","score_opus":0.00471665972614281,"score_gpt":0.19016599227205788,"score_spread":0.18544933254591509,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2069425306","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9986039,0.000282906,0.00032334033,0.000024191135,0.0000171125,0.0000093039935,0.00006279043,0.000024152294,0.0006522886],"genre_scores_gemma":[0.998494,0.0001569119,0.0004885421,0.000027909962,0.000012135582,0.000008862728,0.000085829546,0.000017612481,0.00070824276],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997086,0.000051691262,0.000038399692,0.000068886555,0.000062427964,0.00006998124],"domain_scores_gemma":[0.99949396,0.00024143422,0.00006734286,0.000056069086,0.00008540387,0.00005577299],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00035545268,0.00030355164,0.00028552857,0.0001772136,0.00021362932,0.00030991214,0.00026932888,0.0003482678,0.0015680798],"category_scores_gemma":[0.0007475609,0.0003025015,0.00023351535,0.0001586028,0.0003112253,0.00030273924,0.00017793592,0.00041755475,0.00027654917],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006403436,0.00003518682,0.00025898818,0.00006258573,0.000018302182,0.00007716633,0.0000771241,0.00012905047,0.9974579,0.000029699444,0.000047773814,0.0011659865],"study_design_scores_gemma":[0.000013005522,0.00022128086,0.0021592116,0.000001869582,0.000013425952,0.00003580339,0.000021810372,0.0004817329,0.99675983,0.00000778,0.00027913976,0.00000522313],"about_ca_topic_score_codex":0.0013835304,"about_ca_topic_score_gemma":0.002193115,"teacher_disagreement_score":0.0015680798,"about_ca_system_score_codex":0.0002714839,"about_ca_system_score_gemma":0.00018493315,"threshold_uncertainty_score":0.005245745},"labels":[],"label_agreement":null},{"id":"W2072548313","doi":"10.4028/www.scientific.net/ssp.105.101","title":"Texture Control in Manufacturing of ULSI Devices","year":2005,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada)","funders":"","keywords":"Copper interconnect; Materials science; Microstructure; Electromigration; Wafer; Electroplating; Texture (cosmology); Process control; Copper; Optoelectronics; Composite material; Metallurgy; Process (computing); Computer science; Layer (electronics)","score_opus":0.026200229848109574,"score_gpt":0.2980135146658638,"score_spread":0.27181328481775424,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2072548313","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.59539783,0.005843663,0.3494507,0.00071096694,0.0005709939,0.00030933888,0.00071318104,0.0062307892,0.040772546],"genre_scores_gemma":[0.84647757,0.0010136967,0.1451364,0.00012578123,0.0000818777,0.00008016779,0.0003565705,0.0003193698,0.0064085503],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993319,0.00003476233,0.000035974088,0.00011561669,0.00040991826,0.00007175011],"domain_scores_gemma":[0.99943906,0.00008723548,0.00013905216,0.00013831732,0.00016764864,0.000028756289],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000489143,0.00028107254,0.00029097087,0.00055591715,0.00042103615,0.00078335626,0.00073757407,0.00025304488,0.0015307422],"category_scores_gemma":[0.00097256945,0.0002738436,0.00015656231,0.00052355306,0.00038995722,0.00038583326,0.0005202365,0.0004070321,0.00054569024],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012734298,0.000027802736,0.0013088846,0.00021565016,0.0000094306,0.00021487886,0.00024169598,0.006409194,0.91862833,0.0032572406,0.0012725829,0.06828698],"study_design_scores_gemma":[0.00003334313,0.00045660816,0.007391637,0.00003339032,0.00002337226,0.00045768937,0.00014084138,0.041589875,0.913375,0.0012212897,0.035235308,0.00004163279],"about_ca_topic_score_codex":0.0019872899,"about_ca_topic_score_gemma":0.0028459392,"teacher_disagreement_score":0.0019872899,"about_ca_system_score_codex":0.0011859349,"about_ca_system_score_gemma":0.00034896203,"threshold_uncertainty_score":0.008604646},"labels":[],"label_agreement":null},{"id":"W2075042583","doi":"10.4028/www.scientific.net/msf.495-497.1443","title":"Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Electromigration; Electron backscatter diffraction; Materials science; Microstructure; Hillock; Copper interconnect; Texture (cosmology); Interconnection; Composite material; Metallurgy; Copper","score_opus":0.006763865838040981,"score_gpt":0.2594350419184351,"score_spread":0.2526711760803941,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2075042583","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9988232,0.00024604963,0.00052389037,0.000006667338,0.000001824098,0.0000029345954,0.00003940952,0.000016265765,0.00033972258],"genre_scores_gemma":[0.99922323,0.000096888754,0.0002566226,0.00000627052,0.0000016735288,0.0000019731103,0.00004997018,0.000005166949,0.00035819077],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999405,0.000003952058,0.0000025372194,0.000012755465,0.000026683325,0.0000135851415],"domain_scores_gemma":[0.99977034,0.000024216368,0.00010465637,0.000024394569,0.00006128807,0.000015108457],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000041850115,0.00008210241,0.00007439366,0.00017564038,0.00010309141,0.00013245523,0.00008449871,0.000072592746,0.0004516065],"category_scores_gemma":[0.00022451866,0.00010497053,0.00004796504,0.00012486154,0.00015319997,0.00014707583,0.0001005947,0.000116797884,0.00007835289],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000047089936,0.000011910243,0.0030509683,0.000022907556,0.000004955434,0.00011495998,0.000051583847,0.00042436738,0.9940897,0.00003942557,0.00002595729,0.0021162059],"study_design_scores_gemma":[0.000006464698,0.0003142645,0.15177307,0.00000434081,0.000014690205,0.00057309406,0.000074804564,0.0028358651,0.8435487,0.000045417844,0.00080099015,0.000008296547],"about_ca_topic_score_codex":0.0009568768,"about_ca_topic_score_gemma":0.0021193882,"teacher_disagreement_score":0.0009568768,"about_ca_system_score_codex":0.00018714122,"about_ca_system_score_gemma":0.00004703718,"threshold_uncertainty_score":0.0019026399},"labels":[],"label_agreement":null},{"id":"W2075825080","doi":"10.1103/physrevb.81.045406","title":"Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles","year":2010,"lang":"en","type":"article","venue":"Physical Review B","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":74,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Electrical resistivity and conductivity; Specular reflection; Materials science; Scattering; Surface roughness; Condensed matter physics; Thin film; Surface finish; Composite material; Nanotechnology; Optics; Physics","score_opus":0.016178955460565792,"score_gpt":0.27733224126518924,"score_spread":0.26115328580462344,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2075825080","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9123563,0.0015850231,0.04113183,0.0011395114,0.00015102135,0.0001192909,0.0008658027,0.000588207,0.04206288],"genre_scores_gemma":[0.98800373,0.00062411383,0.008559441,0.000085460226,0.000024186587,0.000109837594,0.00036014535,0.00006903259,0.0021642358],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99978596,0.000044012664,0.000004891826,0.000015148904,0.000100438156,0.000049555943],"domain_scores_gemma":[0.99967086,0.00017503754,0.000028129482,0.000037446414,0.000073950345,0.000014573203],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00039998183,0.0004751384,0.0008910528,0.00076595036,0.0008529237,0.00083049125,0.0010176644,0.0011491467,0.0015146537],"category_scores_gemma":[0.0014479873,0.000619062,0.00068639155,0.0006856629,0.00088241213,0.0004794887,0.00028413383,0.00073423487,0.00024408732],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012274474,0.00006069165,0.001602443,0.00047913188,0.000083222134,0.00051135017,0.00023642417,0.94565576,0.019969901,0.022249872,0.0019711156,0.007057231],"study_design_scores_gemma":[0.000048343496,0.0000633898,0.0011439944,0.000031042924,0.000024938268,0.00007316035,0.00004719206,0.98972756,0.004194474,0.0038059335,0.00081844686,0.000021613128],"about_ca_topic_score_codex":0.009279286,"about_ca_topic_score_gemma":0.0069063203,"teacher_disagreement_score":0.009279286,"about_ca_system_score_codex":0.0013560543,"about_ca_system_score_gemma":0.0008758098,"threshold_uncertainty_score":0.018450558},"labels":[],"label_agreement":null},{"id":"W2076098397","doi":"10.1063/1.1764942","title":"Effects of capillary forces on copper∕dielectric interfacial void evolution","year":2004,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Void (composites); Copper; Materials science; Electric field; Capillary action; Instability; Rotational symmetry; Mechanics; Dielectric; Composite material; Condensed matter physics; Metallurgy; Optoelectronics; Physics","score_opus":0.005144367690911782,"score_gpt":0.20628970237629315,"score_spread":0.20114533468538137,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2076098397","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99269015,0.00011575412,0.006109787,0.00002429647,0.0000054340144,0.000004740251,0.0000141604805,0.00005726453,0.0009783694],"genre_scores_gemma":[0.99937624,0.00004332739,0.00037727063,0.0000032279793,0.0000010434042,0.000002580906,0.0000044176995,0.000005627264,0.00018626341],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99992204,0.00001172926,0.0000027408425,0.00001133135,0.00002293965,0.000029218347],"domain_scores_gemma":[0.99967957,0.00017774603,0.000048860067,0.000018307766,0.000034307854,0.000041252664],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016229058,0.00023648527,0.00021076806,0.00026653046,0.00028143643,0.00047332433,0.00023978631,0.0003943613,0.0005121954],"category_scores_gemma":[0.00093036174,0.0001735635,0.000236234,0.00014971629,0.00062258734,0.00037165903,0.00042314513,0.00022742426,0.00005670412],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004174315,0.00010552172,0.008355596,0.0000951952,0.00003356457,0.0013282535,0.0003422383,0.63416654,0.3264332,0.0063271266,0.00021302614,0.022182342],"study_design_scores_gemma":[0.000016869211,0.0001073294,0.0020664828,0.000005667538,0.000014273934,0.000103228296,0.0000428177,0.94556326,0.051246177,0.0005769039,0.00023935903,0.000017649236],"about_ca_topic_score_codex":0.0036368351,"about_ca_topic_score_gemma":0.0027990323,"teacher_disagreement_score":0.0036368351,"about_ca_system_score_codex":0.00057344633,"about_ca_system_score_gemma":0.00034012197,"threshold_uncertainty_score":0.0072313547},"labels":[],"label_agreement":null},{"id":"W2077851897","doi":"10.1143/jjap.44.2294","title":"Effects of the Metallurgical Properties of Upper Cu Film on Stress-Induced Voiding (SIV) in Cu Dual-Damascene Interconnects","year":2005,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada; Macquarie University","keywords":"Materials science; Void (composites); Annealing (glass); Copper; Vacancy defect; Stress (linguistics); Composite material; Copper interconnect; Metallurgy; Diffusion barrier; Crystallography; Chemistry","score_opus":0.014874199039206976,"score_gpt":0.23462044754135516,"score_spread":0.2197462485021482,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2077851897","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9991443,0.00019332246,0.0003477233,0.000011670538,0.000004018824,0.0000016991523,0.000022147044,0.000020902335,0.00025420458],"genre_scores_gemma":[0.9995166,0.00009393178,0.00023219957,0.0000039643805,0.0000015937305,0.0000016183034,0.000016088863,0.0000057140455,0.0001283211],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999923,0.000006338804,0.0000049395994,0.000013956513,0.000027623066,0.00002411966],"domain_scores_gemma":[0.9997378,0.00007128183,0.00008516701,0.000019937093,0.00004730657,0.000038488364],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007728881,0.000276386,0.00018238486,0.00023347106,0.00017631406,0.0002574749,0.00015901483,0.00015681943,0.0006673946],"category_scores_gemma":[0.00034660666,0.00021113032,0.00012629562,0.000162444,0.00017354579,0.00025780528,0.00021095946,0.00017148993,0.00009140165],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006787357,0.000015617248,0.000751058,0.00003793553,0.0000061467044,0.00010971808,0.000035636996,0.0008232193,0.9965958,0.00006679714,0.000028122819,0.0014619608],"study_design_scores_gemma":[0.000008729609,0.00025536751,0.0062011806,0.0000060129523,0.000023253751,0.00010400936,0.000039336646,0.008517635,0.984388,0.000030414432,0.00041670335,0.000009538135],"about_ca_topic_score_codex":0.0008091265,"about_ca_topic_score_gemma":0.0014266832,"teacher_disagreement_score":0.0008091265,"about_ca_system_score_codex":0.00021279076,"about_ca_system_score_gemma":0.00008301389,"threshold_uncertainty_score":0.0022326708},"labels":[],"label_agreement":null},{"id":"W2078423352","doi":"10.1143/jjap.45.2992","title":"AC Power Loss and Signal Coupling in Very Large Scale Integration Backend Interconnects","year":2006,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Coupling (piping); Materials science; Coupling loss; SIGNAL (programming language); Power (physics); Dielectric; Dielectric loss; Optoelectronics; Metal; Electrical engineering; Physics; Composite material; Optics; Computer science; Engineering","score_opus":0.006935371733267827,"score_gpt":0.22764538440143872,"score_spread":0.2207100126681709,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2078423352","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96463513,0.0013488746,0.020778537,0.0001580996,0.00011138026,0.000020855545,0.000063800566,0.00029234763,0.012590893],"genre_scores_gemma":[0.9952769,0.00018088323,0.0007613957,0.000020090392,0.000029640381,0.0000049322584,0.00004501702,0.00004682016,0.0036342677],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997962,0.00003606677,0.0000050663302,0.000035884073,0.00009049407,0.00003629997],"domain_scores_gemma":[0.99885607,0.00052962627,0.00016357312,0.000092388225,0.00027687923,0.00008149657],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023642824,0.00028756604,0.00022075638,0.00083406555,0.00033941778,0.00061589055,0.00043320778,0.00032946194,0.0032861894],"category_scores_gemma":[0.00173426,0.00022637132,0.00015287164,0.0007198238,0.0004918027,0.0013102556,0.00032070893,0.0003759599,0.00047760748],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.007912904,0.0014980217,0.056022923,0.0008838648,0.00034914666,0.003609752,0.0012710114,0.09704698,0.6250276,0.044927686,0.012709587,0.14874047],"study_design_scores_gemma":[0.00017801946,0.0022542034,0.1080994,0.000072537376,0.00037135466,0.0029981784,0.0007692006,0.5262959,0.3377071,0.012101283,0.0090272855,0.00012563886],"about_ca_topic_score_codex":0.000655274,"about_ca_topic_score_gemma":0.0005125717,"teacher_disagreement_score":0.0032861894,"about_ca_system_score_codex":0.00035971915,"about_ca_system_score_gemma":0.00010552693,"threshold_uncertainty_score":0.0109933615},"labels":[],"label_agreement":null},{"id":"W2078813529","doi":"10.1007/s11664-005-0058-9","title":"Textural and microstructural transformation of Cu damascene interconnects after annealing","year":2005,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":12,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Annealing (glass); Copper interconnect; Materials science; Electron backscatter diffraction; Diffraction; Microstructure; Grain boundary; Composite material; Metallurgy; Copper; Optics","score_opus":0.005182863311793434,"score_gpt":0.23839266541615833,"score_spread":0.2332098021043649,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2078813529","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99836,0.00018059694,0.00021035378,0.000012338324,0.0000044834146,0.0000028958973,0.00013976428,0.000026614409,0.0010629578],"genre_scores_gemma":[0.9983816,0.000045193898,0.00013156784,0.000004062252,0.0000017454275,0.000002986355,0.00013050142,0.0000133695885,0.0012889433],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999198,0.0000044446697,0.0000036993727,0.000017403327,0.000025820724,0.000028870883],"domain_scores_gemma":[0.9998036,0.00004001321,0.00006369571,0.000028346842,0.000045789224,0.000018635965],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007648589,0.00012304267,0.00013248138,0.00032424662,0.00033998437,0.00023939203,0.00023258725,0.00018032554,0.0029732976],"category_scores_gemma":[0.00032067287,0.0001617013,0.00007915925,0.00037123324,0.000266127,0.00035358116,0.000116525225,0.00021326116,0.00023907654],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00038066055,0.00002485862,0.0012324131,0.000046020745,0.000009383875,0.00018746823,0.00023900523,0.00053347566,0.9947178,0.00016076073,0.00015668562,0.002311524],"study_design_scores_gemma":[0.000010420479,0.00027042348,0.04701543,0.00000618895,0.000019223748,0.00012202897,0.00020162547,0.0020584164,0.9484632,0.00005686717,0.0017595213,0.000016756669],"about_ca_topic_score_codex":0.0027230254,"about_ca_topic_score_gemma":0.005388193,"teacher_disagreement_score":0.0029732976,"about_ca_system_score_codex":0.0002648414,"about_ca_system_score_gemma":0.0001412829,"threshold_uncertainty_score":0.009946644},"labels":[],"label_agreement":null},{"id":"W2083196491","doi":"10.4028/www.scientific.net/ssp.105.391","title":"Effects of Dielectric Roughness on Texture of Both PVD Seed Layers and EP Copper","year":2005,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada)","funders":"","keywords":"Materials science; Dielectric; Texture (cosmology); Surface finish; Surface roughness; Wafer; Composite material; Copper; Diffractometer; Silicon nitride; Electroplating; Chemical vapor deposition; Fiber; Layer (electronics); Optoelectronics; Metallurgy; Scanning electron microscope","score_opus":0.01862030315393946,"score_gpt":0.28444293677012344,"score_spread":0.26582263361618397,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2083196491","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9984175,0.00029594742,0.00071887346,0.000013732658,0.0000084013245,0.000006233066,0.000055360502,0.000024304103,0.00045965228],"genre_scores_gemma":[0.99908984,0.00014063835,0.00048339134,0.000011290499,0.0000028531174,0.000004185967,0.000059328497,0.000015180715,0.00019326454],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997931,0.000026403846,0.000016051363,0.000039838364,0.00007479617,0.000049668004],"domain_scores_gemma":[0.99940455,0.00025224898,0.00011792651,0.0000722984,0.00010848121,0.000044470697],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015025189,0.00021099005,0.00018804523,0.00017117528,0.00012246023,0.00034935298,0.00011547661,0.00017317073,0.0006214044],"category_scores_gemma":[0.0008816195,0.00026590482,0.00016731372,0.00014616847,0.00018503952,0.00013093237,0.00015255857,0.00027555195,0.00010717558],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008659241,0.0000058286137,0.0012898534,0.000031198902,0.00001046285,0.000085388485,0.000026591739,0.00026534247,0.9971053,0.000018144628,0.000023430965,0.0010519824],"study_design_scores_gemma":[0.00001504901,0.00026194812,0.029078502,0.0000051343673,0.00003314524,0.00018575542,0.00008019547,0.0024336155,0.96737355,0.000014329467,0.0005094868,0.000009303861],"about_ca_topic_score_codex":0.00095585943,"about_ca_topic_score_gemma":0.0012115563,"teacher_disagreement_score":0.00095585943,"about_ca_system_score_codex":0.00021899851,"about_ca_system_score_gemma":0.00009224354,"threshold_uncertainty_score":0.0020788312},"labels":[],"label_agreement":null},{"id":"W2086305156","doi":"10.4028/www.scientific.net/msf.778-780.1104","title":"SiC Power Devices as Enabler for High Power Density - Aspects and Prospects","year":2014,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Enabling; Materials science; Power (physics); Power density; Power semiconductor device; Current (fluid); Path (computing); Engineering physics; Focus (optics); Electrical engineering; State (computer science); Power module; Silicon carbide; Computer science; Engineering; Voltage","score_opus":0.00711601703046544,"score_gpt":0.2393528065489845,"score_spread":0.23223678951851906,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2086305156","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.048386727,0.47982535,0.029470414,0.013672059,0.0033998287,0.00007860788,0.00027212233,0.0005326333,0.4243622],"genre_scores_gemma":[0.45447466,0.43835092,0.025852937,0.0025456788,0.004401584,0.00007742878,0.00040958452,0.00017159511,0.07371553],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.99969304,0.000049814065,0.000009159601,0.000032591623,0.00016506862,0.00005036488],"domain_scores_gemma":[0.99969065,0.000103208724,0.00002505672,0.000033968863,0.00010727527,0.000039921637],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008537727,0.00037870955,0.00028289747,0.00071414956,0.00037647597,0.0018934392,0.0005052769,0.0012803082,0.006643554],"category_scores_gemma":[0.00055395486,0.00017239033,0.00021446875,0.00068768143,0.0006988139,0.0024232895,0.0006277885,0.0010357043,0.0017818749],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020460233,0.00012157054,0.0015431651,0.001987655,0.000026346415,0.00079876307,0.00039736592,0.00245119,0.029055094,0.5788918,0.0353695,0.34915295],"study_design_scores_gemma":[0.000016227996,0.0005392216,0.0028392447,0.00061061326,0.000033055327,0.0014993534,0.00043925035,0.0031922364,0.023384454,0.099647604,0.8677466,0.000052188443],"about_ca_topic_score_codex":0.00023924164,"about_ca_topic_score_gemma":0.00038512406,"teacher_disagreement_score":0.006643554,"about_ca_system_score_codex":0.00032937966,"about_ca_system_score_gemma":0.00032383204,"threshold_uncertainty_score":0.022224963},"labels":[],"label_agreement":null},{"id":"W2087488503","doi":"10.1016/j.mee.2012.02.035","title":"Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films","year":2012,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":28,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electron backscatter diffraction; Annealing (glass); Electrical resistivity and conductivity; Materials science; Microstructure; Grain size; Copper; Composite material; Thin film; Metallurgy; Nanotechnology","score_opus":0.0033478172311345905,"score_gpt":0.19812944473971175,"score_spread":0.19478162750857717,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2087488503","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9981365,0.00023164865,0.00052949967,0.000016628848,0.0000075014013,0.0000032091589,0.00013763605,0.00003491027,0.000902437],"genre_scores_gemma":[0.99901104,0.000073150906,0.00034414092,0.000004033796,0.0000046596333,0.0000025195493,0.00012766605,0.0000061745486,0.00042655997],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99989593,0.000011088877,0.0000039990564,0.000025073054,0.000043874257,0.000019983083],"domain_scores_gemma":[0.99975663,0.000059881444,0.0000645881,0.000025004758,0.0000820228,0.000011926617],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009600423,0.000104725375,0.00012485024,0.00033386357,0.00012137441,0.00024995048,0.00018965284,0.00018054887,0.0008224083],"category_scores_gemma":[0.0004298894,0.00015310213,0.00006935967,0.00029088045,0.00016567457,0.00016093237,0.00007960542,0.00020848673,0.00009930924],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000096096795,0.000017319186,0.002717618,0.000028098626,0.000010981388,0.00009753826,0.000060075992,0.00054128683,0.99400795,0.000105382474,0.00013524875,0.002182317],"study_design_scores_gemma":[0.000009067326,0.00023227888,0.06963605,0.0000054937445,0.000023387112,0.000108622684,0.00008100987,0.0071591157,0.9219753,0.000033284836,0.0007278988,0.000008449089],"about_ca_topic_score_codex":0.0024793537,"about_ca_topic_score_gemma":0.0038915626,"teacher_disagreement_score":0.0024793537,"about_ca_system_score_codex":0.00026361807,"about_ca_system_score_gemma":0.00009035471,"threshold_uncertainty_score":0.0049299},"labels":[],"label_agreement":null},{"id":"W2091960683","doi":"10.1007/s11664-002-0173-9","title":"Effect of the underlayer on the microstructure and surface evolution in Al-0.5wt.%Cu polycrystalline thin films","year":2002,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":7,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Crystallite; Thin film; Microstructure; Deposition (geology); Texture (cosmology); Composite material; Coalescence (physics); Grain size; Surface finish; Grain growth; Sputter deposition; Sputtering; Metallurgy; Nanotechnology; Geology","score_opus":0.006050005988310131,"score_gpt":0.2288986451714663,"score_spread":0.22284863918315617,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2091960683","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9992163,0.00026370966,0.00008787317,0.000018487342,0.000008828985,0.0000021586834,0.000051167033,0.000013969811,0.00033759006],"genre_scores_gemma":[0.9992716,0.00013841712,0.00015019077,0.000012233903,0.000004793877,0.0000033982917,0.00004896932,0.000012443269,0.00035791477],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991643,0.000006899757,0.0000065642903,0.00002157037,0.000020283711,0.000028213457],"domain_scores_gemma":[0.99976367,0.000061666404,0.000063502666,0.000022640932,0.00005579379,0.00003277059],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008384407,0.00016852866,0.00019567563,0.00012046663,0.00027248226,0.0004968435,0.00024524576,0.00025883305,0.0012687034],"category_scores_gemma":[0.00033565782,0.00030771756,0.00010743006,0.00016369196,0.00019381283,0.0002567001,0.00013790057,0.00025647893,0.00014251309],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00026879602,0.000019041861,0.00076968333,0.00005077195,0.000016406018,0.00012161254,0.000044824723,0.00026617802,0.99728763,0.000040559848,0.00006889744,0.0010455196],"study_design_scores_gemma":[0.000029304376,0.00024920504,0.010083939,0.000009884932,0.000049249633,0.000103456216,0.00009957802,0.0020549637,0.98660094,0.000020475904,0.0006917545,0.000007258884],"about_ca_topic_score_codex":0.003311862,"about_ca_topic_score_gemma":0.007210054,"teacher_disagreement_score":0.003311862,"about_ca_system_score_codex":0.00039779232,"about_ca_system_score_gemma":0.00017672897,"threshold_uncertainty_score":0.0065851808},"labels":[],"label_agreement":null},{"id":"W2092141857","doi":"10.1007/s11664-003-0221-0","title":"New copper seed-layer enhancement process metrology for advanced dual-damascene interconnects","year":2003,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Copper interconnect; Electroplating; Copper; Plating (geology); Copper plating; Layer (electronics); Materials science; Deposition (geology); Metrology; Electrochemistry; Surface roughness; Ion chromatography; Electrode; Chemical engineering; Analytical Chemistry (journal); Optoelectronics; Chemistry; Chromatography; Nanotechnology; Metallurgy; Composite material; Optics","score_opus":0.01202037644450073,"score_gpt":0.29190433710604224,"score_spread":0.27988396066154153,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2092141857","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.46075627,0.0022556297,0.51971924,0.00047907498,0.00026706597,0.0003389804,0.0002498305,0.0038790205,0.012054997],"genre_scores_gemma":[0.6236863,0.0003013826,0.3716711,0.000088069,0.000058743753,0.00009817745,0.00013325749,0.00010754421,0.003855472],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988696,0.00014291737,0.0000534193,0.00023052731,0.00060699665,0.00009648137],"domain_scores_gemma":[0.99880075,0.00022000252,0.00020803852,0.00025248638,0.00042964987,0.00008911008],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0010346811,0.0005733644,0.0005530503,0.0010710724,0.00064003264,0.0008677242,0.0013955795,0.00070911366,0.0012830365],"category_scores_gemma":[0.0013973196,0.0005023001,0.00019510405,0.0005472836,0.00067140034,0.0016827575,0.0013086238,0.0007009706,0.00039810775],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016463421,0.00005396549,0.0013449886,0.000105464205,0.000014881711,0.000115162395,0.00019017133,0.00064009166,0.9498341,0.004692905,0.00061800715,0.042225625],"study_design_scores_gemma":[0.000043067746,0.00030742094,0.0021343722,0.000020040667,0.000032258038,0.0007404222,0.000059971535,0.03435022,0.95081586,0.0010001116,0.0104429275,0.000053214542],"about_ca_topic_score_codex":0.0006839944,"about_ca_topic_score_gemma":0.0030663176,"teacher_disagreement_score":0.0013955795,"about_ca_system_score_codex":0.0011267419,"about_ca_system_score_gemma":0.0008295604,"threshold_uncertainty_score":0.008175075},"labels":[],"label_agreement":null},{"id":"W2093235814","doi":"10.1016/s0169-4332(02)01322-3","title":"Cu cluster adhesion enhancement on the modified Dow Cyclotene surface through low energy N2+ beam irradiation at grazing angles","year":2003,"lang":"en","type":"article","venue":"Applied Surface Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"X-ray photoelectron spectroscopy; Materials science; Irradiation; Beam (structure); Cluster (spacecraft); Evaporation; Coalescence (physics); Contact angle; Polymer; Analytical Chemistry (journal); Beam energy; Surface energy; Adhesion; Atomic physics; Optics; Composite material; Chemistry; Physics; Nuclear magnetic resonance; Nuclear physics","score_opus":0.017930894538173033,"score_gpt":0.2426618815341946,"score_spread":0.22473098699602156,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2093235814","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9965281,0.0002663713,0.00055716134,0.000028819035,0.000017820763,0.0000059752506,0.00004629064,0.000030090368,0.002519407],"genre_scores_gemma":[0.9959473,0.00021173121,0.0006094461,0.000015349215,0.00000564546,0.000006978922,0.000080163096,0.000016191034,0.0031071776],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99987555,0.000008234132,0.000003936924,0.000026756967,0.000035737707,0.000049809285],"domain_scores_gemma":[0.9999387,0.000012363317,0.0000147815645,0.000011630854,0.00001450172,0.000008005488],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010314746,0.0002176519,0.00021339033,0.00014309562,0.0002571371,0.00027177864,0.00029428385,0.00023652564,0.0019887818],"category_scores_gemma":[0.000120501776,0.00022055903,0.00015656141,0.00016253775,0.000176205,0.0001620095,0.00022387331,0.00022690961,0.00032828274],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011504978,0.000007339247,0.00016288369,0.0000341002,0.0000033916679,0.000046507015,0.000050577768,0.00007368376,0.99817824,0.00006707102,0.00012475655,0.0011363825],"study_design_scores_gemma":[0.000006016613,0.000076571625,0.0025018316,0.0000021159633,0.0000057409998,0.00005745527,0.000036466045,0.0003665719,0.9957819,0.0000104374885,0.0011512158,0.0000036948234],"about_ca_topic_score_codex":0.0020041363,"about_ca_topic_score_gemma":0.003957262,"teacher_disagreement_score":0.0020041363,"about_ca_system_score_codex":0.0002673148,"about_ca_system_score_gemma":0.00013359824,"threshold_uncertainty_score":0.0066530704},"labels":[],"label_agreement":null},{"id":"W2099276265","doi":"10.1109/iitc.2008.4546943","title":"Integration Aspects of CoWP Capping Layers for Electromigration Enhancement","year":2008,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Freistaat Sachsen; European Commission","keywords":"Electromigration; Materials science; Time-dependent gate oxide breakdown; Dielectric strength; Copper; Dielectric; Reliability (semiconductor); Degradation (telecommunications); Node (physics); Electronic engineering; Optoelectronics; Composite material; Metallurgy; Electrical engineering; Power (physics); Transistor; Gate dielectric","score_opus":0.02494026678946528,"score_gpt":0.2631892212517321,"score_spread":0.23824895446226682,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2099276265","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97790295,0.0018075415,0.015102223,0.00009907764,0.00007937361,0.00010477227,0.0001326969,0.00033551612,0.0044357996],"genre_scores_gemma":[0.9760015,0.0009764291,0.020329237,0.000046935507,0.00002438019,0.00004352,0.00014941786,0.00005212911,0.0023764535],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983585,0.000016388032,0.0000070722135,0.000032740212,0.00007569227,0.000032260148],"domain_scores_gemma":[0.9997186,0.000039427025,0.000088732544,0.000047089878,0.00008371477,0.000022453702],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018729278,0.00049864827,0.00019266274,0.00017682285,0.00019083792,0.00040696785,0.00042137963,0.0003995565,0.00070889003],"category_scores_gemma":[0.0005273658,0.00027683118,0.00018537205,0.00026352133,0.0001460641,0.00037202294,0.0002773143,0.00030915075,0.00020791819],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000044851982,0.000023930023,0.0004695387,0.00009984707,0.000017509967,0.00020081222,0.00004218017,0.00088281365,0.99249285,0.00024485422,0.00016306623,0.0053177937],"study_design_scores_gemma":[0.000009096713,0.0003821299,0.002958232,0.000008154514,0.000038352948,0.00031825274,0.000025538317,0.0031125022,0.98963344,0.000055080596,0.0034500374,0.000009222281],"about_ca_topic_score_codex":0.00041468852,"about_ca_topic_score_gemma":0.00071814616,"teacher_disagreement_score":0.00070889003,"about_ca_system_score_codex":0.00020418795,"about_ca_system_score_gemma":0.00015475746,"threshold_uncertainty_score":0.0023714304},"labels":[],"label_agreement":null},{"id":"W2102901745","doi":"10.4028/www.scientific.net/kem.508.48","title":"Interface Reaction Behavior between Mn and SiO&lt;sub&gt;2&lt;/sub&gt; Formed by RF Sputter Deposition","year":2012,"lang":"en","type":"article","venue":"Key engineering materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hatch (Canada)","funders":"","keywords":"Annealing (glass); Materials science; Adsorption; Moisture; Chemical engineering; Sputtering; Sputter deposition; Layer (electronics); Thin film; Composite material; Nanotechnology; Chemistry; Physical chemistry","score_opus":0.009909376646999748,"score_gpt":0.22841225977112867,"score_spread":0.2185028831241289,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2102901745","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99879897,0.00019050277,0.0006501013,0.0000059823824,0.00000447648,0.0000041320995,0.000021959537,0.0000149281905,0.0003089306],"genre_scores_gemma":[0.9984877,0.00013396518,0.00083225867,0.0000041159005,0.0000020430796,0.0000035038393,0.000043237167,0.0000084997055,0.00048472008],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999943,0.0000065330373,0.000002700582,0.000015929005,0.000017747461,0.000014000238],"domain_scores_gemma":[0.99989605,0.000040473253,0.000029290291,0.00000945042,0.000014716122,0.000010047168],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008900748,0.00023390667,0.00012288614,0.00007905357,0.00009150813,0.00016916283,0.00016903835,0.00012937965,0.0010361528],"category_scores_gemma":[0.00022287978,0.00014929801,0.00009854024,0.00005946385,0.00013318841,0.00023413404,0.00010645698,0.00016377345,0.00015866934],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004745277,0.000003929543,0.00029998829,0.000021098529,0.0000038389876,0.0000351129,0.000022218514,0.000048731345,0.9990208,0.000024388095,0.000008215756,0.0004641759],"study_design_scores_gemma":[0.0000034292893,0.00007229616,0.0022208968,0.0000011532759,0.000006184818,0.000038510985,0.000019414469,0.00072510913,0.99666685,0.0000057511893,0.0002388322,0.0000015581815],"about_ca_topic_score_codex":0.00057298824,"about_ca_topic_score_gemma":0.0009208509,"teacher_disagreement_score":0.0010361528,"about_ca_system_score_codex":0.00013049688,"about_ca_system_score_gemma":0.00007022072,"threshold_uncertainty_score":0.0034663081},"labels":[],"label_agreement":null},{"id":"W2105437211","doi":"10.1063/1.1622517","title":"Texture and stress analysis in as-deposited and annealed damascene Cu interconnects using XRD &amp; OIM","year":2003,"lang":"en","type":"article","venue":"AIP conference proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Annealing (glass); Materials science; Laser linewidth; Electron backscatter diffraction; Copper interconnect; Diffraction; Texture (cosmology); Scanning electron microscope; Composite material; Analytical Chemistry (journal); Optics; Microstructure; Chemistry; Physics","score_opus":0.0238145279441399,"score_gpt":0.27674577170406306,"score_spread":0.25293124375992315,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2105437211","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99853873,0.00018893857,0.000637863,0.000009304753,0.0000041821345,0.0000027141252,0.0001760386,0.000022012182,0.0004203347],"genre_scores_gemma":[0.997083,0.00015580667,0.0011220033,0.000009055226,0.0000037285897,0.0000101294445,0.00033600797,0.000012455604,0.001267891],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999263,0.0000039070515,0.0000044859758,0.000020330624,0.000031955202,0.000012900644],"domain_scores_gemma":[0.9998547,0.00002055237,0.000047505066,0.000013997064,0.00004642236,0.000016774515],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000060393533,0.00012655841,0.000119724085,0.0002632855,0.00012000092,0.0001983084,0.00023184532,0.00013445027,0.00071632484],"category_scores_gemma":[0.00018469155,0.00014873406,0.0000679552,0.00034132073,0.00015421509,0.00014363178,0.00007737959,0.00015348158,0.000076485965],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004101234,0.000006714359,0.00062897045,0.000018608162,0.000001845111,0.000046062934,0.000045376008,0.00009162998,0.9981006,0.000024997644,0.000020543801,0.00097363396],"study_design_scores_gemma":[0.000007574664,0.00012739967,0.039547615,0.000004586526,0.000009817152,0.00011548843,0.00009107718,0.001589945,0.9571955,0.000021041094,0.0012811151,0.000008919715],"about_ca_topic_score_codex":0.0019656976,"about_ca_topic_score_gemma":0.0033388836,"teacher_disagreement_score":0.0019656976,"about_ca_system_score_codex":0.00029012878,"about_ca_system_score_gemma":0.00008451701,"threshold_uncertainty_score":0.003908515},"labels":[],"label_agreement":null},{"id":"W2113358852","doi":"10.1557/proc-812-f7.5","title":"Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation","year":2004,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":32,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Electromigration; Materials science; Copper; Copper interconnect; Void (composites); Interconnection; Grain boundary; Microstructure; Metallurgy; Composite material","score_opus":0.0076786313264735305,"score_gpt":0.24344975488493356,"score_spread":0.23577112355846003,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2113358852","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978003,0.00069698144,0.0006334539,0.00005000163,0.000015795878,0.000005880929,0.000076150216,0.000044370827,0.00067699223],"genre_scores_gemma":[0.9987993,0.00019278373,0.00023420833,0.000017971277,0.0000098525115,0.0000038502894,0.000049135873,0.000022287028,0.0006704389],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997967,0.000032839936,0.000011447553,0.000043957683,0.000047387926,0.000067710935],"domain_scores_gemma":[0.99919575,0.00038721078,0.00011224941,0.00006043505,0.00018185054,0.00006254321],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00045331297,0.00036914067,0.000549029,0.00035299698,0.0005470664,0.00060885824,0.00029761097,0.0005918908,0.002674691],"category_scores_gemma":[0.001090634,0.00025790214,0.00028390854,0.00030889237,0.00047524413,0.0006428108,0.000310798,0.00036097734,0.0002813825],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0045571206,0.0001542985,0.0053319084,0.00015441597,0.00006037837,0.0006357495,0.0002644714,0.006887878,0.97360724,0.00037307886,0.00024848178,0.007725001],"study_design_scores_gemma":[0.00004819382,0.0012350067,0.0077753332,0.0000135213895,0.00010153923,0.00022146653,0.00014206348,0.012688478,0.9768828,0.000112374284,0.0007672475,0.000011910789],"about_ca_topic_score_codex":0.0024267328,"about_ca_topic_score_gemma":0.0018759515,"teacher_disagreement_score":0.002674691,"about_ca_system_score_codex":0.0006776875,"about_ca_system_score_gemma":0.0002909337,"threshold_uncertainty_score":0.00894773},"labels":[],"label_agreement":null},{"id":"W2120594247","doi":"10.1016/j.actamat.2008.06.007","title":"PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties","year":2008,"lang":"en","type":"article","venue":"Acta Materialia","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":59,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Harvard School of Engineering and Applied Sciences; Semiconductor Research Corporation","keywords":"Materials science; Composite material; Adhesion; Fracture (geology); Silicon nitride; Stiffness; Layer (electronics)","score_opus":0.02077567065390722,"score_gpt":0.2287376467655254,"score_spread":0.20796197611161818,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2120594247","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.997401,0.0012046525,0.0005750927,0.000019881996,0.000014888514,0.0000042563984,0.000049868966,0.000009132318,0.00072119955],"genre_scores_gemma":[0.9972199,0.0005241515,0.0006364536,0.00001575114,0.000007425971,0.0000038336093,0.00010375152,0.00000864265,0.0014800497],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99977845,0.000017480503,0.00001108952,0.000030439449,0.0001064299,0.00005608889],"domain_scores_gemma":[0.9997124,0.00008071409,0.000058172944,0.000037490277,0.00008843859,0.0000227387],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024862564,0.0002640175,0.00019721342,0.0002773085,0.00023557544,0.00032722877,0.00032871272,0.00056289794,0.00077891507],"category_scores_gemma":[0.00046894385,0.00032635953,0.00019947297,0.00028035286,0.00029513685,0.00024094568,0.00016509819,0.0004017726,0.00020174954],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012359841,0.000019235411,0.0006007481,0.000028104507,0.0000075019684,0.000063748914,0.000027555556,0.00017027099,0.9968382,0.000031424566,0.000052695952,0.0020369394],"study_design_scores_gemma":[0.000007701036,0.00021601212,0.008670697,0.000003389356,0.000013426004,0.000100975645,0.000040383075,0.0008541877,0.9897683,0.000016050077,0.00030354367,0.0000053722997],"about_ca_topic_score_codex":0.0015067762,"about_ca_topic_score_gemma":0.0025735167,"teacher_disagreement_score":0.0015067762,"about_ca_system_score_codex":0.00025711503,"about_ca_system_score_gemma":0.00013191186,"threshold_uncertainty_score":0.002996087},"labels":[],"label_agreement":null},{"id":"W2121846914","doi":"10.1557/opl.2011.1201","title":"Amorphous Ta-N as a Diffusion Barrier for Cu Metallization","year":2011,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Materials science; Amorphous solid; Diffusion barrier; Sputter deposition; Copper; Diffusion; Silicon; Sputtering; Electron energy loss spectroscopy; Electron diffraction; Analytical Chemistry (journal); Chemical engineering; Thin film; Diffraction; Crystallography; Transmission electron microscopy; Metallurgy; Nanotechnology; Layer (electronics); Optics","score_opus":0.026967732370828404,"score_gpt":0.2478468248768005,"score_spread":0.2208790925059721,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2121846914","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9784185,0.0021812017,0.010004486,0.00020260098,0.00015244489,0.0000434043,0.00020306368,0.00027645222,0.008517855],"genre_scores_gemma":[0.9914692,0.0004354674,0.004130055,0.000019248422,0.0000094942625,0.000012068557,0.00006305287,0.000033729044,0.0038276375],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999279,0.000008591203,0.0000049863766,0.00002049351,0.000021077947,0.00001692674],"domain_scores_gemma":[0.9999305,0.000010331439,0.000014426754,0.00001561708,0.000016961592,0.000012204307],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010441019,0.00017651272,0.00019447852,0.00016714436,0.00031928974,0.0004496387,0.0004594883,0.00026471115,0.0010763914],"category_scores_gemma":[0.00018477927,0.00018333616,0.00009909356,0.00014805204,0.00016692377,0.00034729217,0.0002536952,0.00027713168,0.0004047212],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010089929,0.00001482133,0.00016150037,0.00008789252,0.0000056115628,0.000091564056,0.000042863423,0.00017980057,0.9956377,0.0013073044,0.0003760931,0.001994001],"study_design_scores_gemma":[0.000019484969,0.00014365569,0.0007031756,0.000011646474,0.00001634946,0.00016398002,0.000047928195,0.004491645,0.98841,0.00017146306,0.0058128457,0.000007844758],"about_ca_topic_score_codex":0.0011319041,"about_ca_topic_score_gemma":0.003061786,"teacher_disagreement_score":0.0011319041,"about_ca_system_score_codex":0.00028058898,"about_ca_system_score_gemma":0.0002593001,"threshold_uncertainty_score":0.0036008954},"labels":[],"label_agreement":null},{"id":"W2125685179","doi":"10.1149/1.2408858","title":"Current Challenges with Copper Interconnects","year":2007,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Electromigration; Interconnection; Integrated circuit; Copper interconnect; Process (computing); Materials science; Finite element method; Copper; Computer science; Electronic engineering; Engineering physics; Electrical engineering; Engineering; Optoelectronics; Telecommunications; Metallurgy; Composite material; Structural engineering","score_opus":0.02504435212440666,"score_gpt":0.2720743911533106,"score_spread":0.24703003902890394,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2125685179","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.027735041,0.55896,0.0964413,0.16062531,0.008753746,0.00008269989,0.00036142877,0.0022111088,0.1448293],"genre_scores_gemma":[0.22283648,0.60692686,0.06160327,0.014725584,0.010166577,0.0002702843,0.00064266234,0.0005615797,0.0822667],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9976484,0.00036960878,0.000116115596,0.00028983268,0.0013490709,0.0002269722],"domain_scores_gemma":[0.99583733,0.0012362872,0.00036285858,0.00034108656,0.0019534202,0.00026902428],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.004125984,0.00078421296,0.0008536559,0.0011185639,0.0017473333,0.0035519234,0.0029198285,0.003971617,0.013265422],"category_scores_gemma":[0.006267057,0.00049168064,0.00043357463,0.0018307258,0.0023179816,0.008167041,0.0022330806,0.0023464719,0.00623045],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001614589,0.0001076485,0.001639208,0.0034556314,0.00004989053,0.0005854341,0.0010046395,0.008831719,0.010436915,0.26170495,0.12927954,0.5827429],"study_design_scores_gemma":[0.000015284008,0.0002681858,0.0006023177,0.0009825774,0.000039922867,0.0011179217,0.0012243083,0.0051420275,0.0045622336,0.076858625,0.9091124,0.0000742419],"about_ca_topic_score_codex":0.0023057999,"about_ca_topic_score_gemma":0.00271,"teacher_disagreement_score":0.013265422,"about_ca_system_score_codex":0.0020231456,"about_ca_system_score_gemma":0.0019311971,"threshold_uncertainty_score":0.044377267},"labels":[],"label_agreement":null},{"id":"W2129239789","doi":"10.1557/opl.2012.1356","title":"Understanding the Impact of Porosity and Pore Structure in Ultra Low Dielectric Constant Organosilicate Glasses","year":2012,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Intertek (Canada)","funders":"University of Michigan","keywords":"Materials science; Porosity; Dielectric; Chemical engineering; Chemical vapor deposition; Interconnectivity; Composite material; Low-k dielectric; Plasma-enhanced chemical vapor deposition; X-ray photoelectron spectroscopy; Nanotechnology; Optoelectronics","score_opus":0.028505901048342247,"score_gpt":0.26515095802429617,"score_spread":0.23664505697595392,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2129239789","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9971011,0.00046857668,0.0016421732,0.00008055157,0.000004538189,0.0000025973288,0.000027676877,0.000020301932,0.00065250933],"genre_scores_gemma":[0.9986935,0.0004985035,0.0006143747,0.000013311225,0.0000034179468,0.0000022412235,0.000029432093,0.000006100638,0.00013908964],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999441,0.000006365411,0.000002710976,0.000010347632,0.00001793124,0.000018518778],"domain_scores_gemma":[0.9998184,0.00008918284,0.000041588173,0.000012572447,0.000025466577,0.000012761681],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016048108,0.00014976328,0.00015968764,0.00014610129,0.00017220977,0.00047991026,0.00025820994,0.0003059734,0.00033629462],"category_scores_gemma":[0.00034585275,0.00018914755,0.00009476396,0.00011324421,0.0005555201,0.00086645223,0.00020477598,0.00035193618,0.00006550261],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014353095,0.000039145292,0.004013123,0.00011266271,0.000013304625,0.00015477657,0.00011001459,0.010695065,0.9763984,0.0037604305,0.00011814103,0.004441458],"study_design_scores_gemma":[0.000025213008,0.00030253,0.018605014,0.000025600166,0.0000650106,0.0002279532,0.0008546477,0.08565021,0.88599706,0.005825257,0.0023789497,0.000042436226],"about_ca_topic_score_codex":0.0021080761,"about_ca_topic_score_gemma":0.0029697348,"teacher_disagreement_score":0.0021080761,"about_ca_system_score_codex":0.00035831775,"about_ca_system_score_gemma":0.00035841033,"threshold_uncertainty_score":0.004191637},"labels":[],"label_agreement":null},{"id":"W2131801010","doi":"10.1016/j.mee.2009.07.019","title":"Microstructure in copper interconnects – Influence of plating additive concentration","year":2009,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":17,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Copper; Microstructure; Annealing (glass); Materials science; Grain size; Impurity; Grain growth; Electrical resistivity and conductivity; Copper plating; Metallurgy; Analytical Chemistry (journal); Electrolyte; Chemical engineering; Composite material; Electroplating; Chemistry; Electrode; Chromatography","score_opus":0.002655850460544988,"score_gpt":0.20365759792537616,"score_spread":0.20100174746483118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2131801010","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99634796,0.0014370516,0.00059643545,0.000043913635,0.000018274233,0.0000069891375,0.000057755984,0.000037611364,0.0014539717],"genre_scores_gemma":[0.99865097,0.00050892605,0.0003388265,0.0000108892555,0.00000905714,0.0000031474071,0.000023968349,0.000011612741,0.00044273125],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983895,0.00003568167,0.000010420276,0.00003143241,0.000049851704,0.000033729648],"domain_scores_gemma":[0.99949217,0.00018324464,0.0001259213,0.000038136743,0.00012918361,0.000031296204],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029697042,0.0001539703,0.00025015575,0.0002539827,0.0002616402,0.0005862964,0.00026140158,0.00030623373,0.00082222925],"category_scores_gemma":[0.0008078499,0.0003221575,0.0001254632,0.00025313755,0.00030098573,0.0003114497,0.0001365243,0.00022675649,0.00020094686],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00057622447,0.000069426445,0.001440865,0.00013594049,0.000020631347,0.00022071379,0.00008496747,0.004478701,0.9886479,0.00048036114,0.0001561596,0.0036881515],"study_design_scores_gemma":[0.0000412411,0.00087118155,0.017443765,0.00002003642,0.00007112807,0.00018048675,0.00012502083,0.0154602,0.96450657,0.00015635505,0.001100318,0.00002363931],"about_ca_topic_score_codex":0.0032096289,"about_ca_topic_score_gemma":0.004988744,"teacher_disagreement_score":0.0032096289,"about_ca_system_score_codex":0.00047725457,"about_ca_system_score_gemma":0.00037437765,"threshold_uncertainty_score":0.0063818693},"labels":[],"label_agreement":null},{"id":"W2133495728","doi":"10.1109/led.2005.854356","title":"Temporary extrusion failures in accelerated lifetime tests of copper interconnects","year":2005,"lang":"en","type":"article","venue":"IEEE Electron Device Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Electromigration; Extrusion; Copper interconnect; Materials science; Failure mode and effects analysis; Copper; Short circuit; Metallurgy; Leakage (economics); Composite material; Voltage; Electrical engineering; Engineering","score_opus":0.016416075749833246,"score_gpt":0.27326759386079946,"score_spread":0.25685151811096624,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2133495728","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99789715,0.00020683256,0.0016178153,0.000008881046,0.000006875252,0.0000073048614,0.000030438548,0.000046213605,0.00017848898],"genre_scores_gemma":[0.99877304,0.00004256106,0.00066973397,0.0000074643685,0.0000028293987,0.000007920381,0.000051993604,0.000008900055,0.00043558443],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994661,0.00008797456,0.000035806774,0.000092641996,0.00023171755,0.000085711385],"domain_scores_gemma":[0.9986388,0.0003577973,0.00034422506,0.00018512894,0.00035766407,0.000116336996],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00052041456,0.0002875493,0.00033568262,0.00041096192,0.00027599654,0.00020990852,0.00042267345,0.0005074184,0.00079760235],"category_scores_gemma":[0.0015849672,0.0002562531,0.00025871018,0.00033402405,0.00036614685,0.0004917767,0.00039139873,0.00036604985,0.00015204927],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0010421266,0.000078118435,0.009791746,0.00014097181,0.00004034437,0.00112255,0.000666891,0.001902578,0.9712064,0.00023525291,0.0002230561,0.013550078],"study_design_scores_gemma":[0.000057741363,0.009915774,0.051769543,0.000029601715,0.000072533374,0.0020606408,0.00023513885,0.007548139,0.9257109,0.000115007,0.002431709,0.000053297674],"about_ca_topic_score_codex":0.00033685676,"about_ca_topic_score_gemma":0.00064404676,"teacher_disagreement_score":0.00079760235,"about_ca_system_score_codex":0.0002476016,"about_ca_system_score_gemma":0.00011209923,"threshold_uncertainty_score":0.0027521849},"labels":[],"label_agreement":null},{"id":"W2134869583","doi":"10.1557/jmr.2009.0005","title":"The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates","year":2009,"lang":"en","type":"article","venue":"Journal of materials research/Pratt's guide to venture capital sources","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":46,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Materials science; Composite material; Porosity; Stiffness; Nanoindentation; Dielectric; Plasma-enhanced chemical vapor deposition; Brittleness; Low-k dielectric; Permittivity; Chemical vapor deposition; Nanotechnology; Optoelectronics","score_opus":0.011695889578765788,"score_gpt":0.3028561806854454,"score_spread":0.2911602911066796,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2134869583","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9988445,0.00013575099,0.00019326757,0.0000142604795,0.000004570869,0.000002332377,0.000050587743,0.0000095775495,0.00074510725],"genre_scores_gemma":[0.99922395,0.00007797012,0.00010914083,0.000007786695,0.000001778513,0.0000025826153,0.00003972383,0.000010196932,0.0005268447],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99981874,0.000022323184,0.000014755792,0.000025517009,0.00006450698,0.000054175776],"domain_scores_gemma":[0.9993906,0.0003674899,0.000090591166,0.00004558313,0.00006984092,0.000035974826],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023669211,0.00022665101,0.00019204484,0.00024360768,0.00023780776,0.00031042635,0.00022117584,0.0003378214,0.0042389478],"category_scores_gemma":[0.00065022876,0.0002741419,0.00018076798,0.00024196968,0.0004691542,0.00040605658,0.00020470902,0.00034895225,0.00037548583],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0009485937,0.000050709255,0.0009102809,0.0000576418,0.0000095529895,0.00011803655,0.0000686891,0.0024904201,0.9908897,0.00016239639,0.00006584426,0.004228017],"study_design_scores_gemma":[0.000008017595,0.0003883735,0.006520572,0.0000049228915,0.000008354155,0.000048841084,0.00008196802,0.0036990996,0.98884124,0.00007670214,0.00030822126,0.000013645804],"about_ca_topic_score_codex":0.0005091691,"about_ca_topic_score_gemma":0.0010338948,"teacher_disagreement_score":0.0042389478,"about_ca_system_score_codex":0.0001776948,"about_ca_system_score_gemma":0.00013801121,"threshold_uncertainty_score":0.01418066},"labels":[],"label_agreement":null},{"id":"W2146029244","doi":"10.1109/iitc.1998.704912","title":"Modelling microstructure development in trench-interconnect structures","year":2002,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Trench; Copper interconnect; Materials science; Microstructure; Aspect ratio (aeronautics); Texture (cosmology); Energy minimization; Surface energy; Grain size; Interconnection; Anisotropy; Surface finish; Composite material; Optics; Layer (electronics); Computer science; Computational chemistry","score_opus":0.029002340345293823,"score_gpt":0.23212438562453241,"score_spread":0.2031220452792386,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2146029244","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.92446506,0.00043995955,0.06713699,0.000103511265,0.000018901728,0.000053934204,0.00046840266,0.00029974952,0.007013427],"genre_scores_gemma":[0.9808313,0.000332588,0.015629679,0.000013928559,0.0000037649438,0.000046386267,0.00022066785,0.00005814569,0.0028634428],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99993193,0.000011987989,0.0000022949623,0.000015794007,0.00002180342,0.000016186585],"domain_scores_gemma":[0.9997948,0.00009884011,0.000043195865,0.000016317526,0.00003434045,0.000012559161],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012314526,0.00028925654,0.00025143742,0.00022201931,0.00017445415,0.0004927534,0.00058029714,0.000785255,0.0012002108],"category_scores_gemma":[0.0006053945,0.00036148957,0.0002851939,0.00026319566,0.00029737412,0.00031697287,0.00025006442,0.0002942639,0.00018441967],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010380864,0.0000073491688,0.000697917,0.000019285928,0.000005122441,0.000049652208,0.000015010974,0.9909655,0.0062935906,0.0006771838,0.000038706075,0.0012202533],"study_design_scores_gemma":[0.000002968926,0.000014440021,0.00085451966,0.0000020690304,0.0000031965037,0.000017600196,0.0000066431535,0.997145,0.0013567552,0.00029485737,0.00029875155,0.000003121495],"about_ca_topic_score_codex":0.010525043,"about_ca_topic_score_gemma":0.013137886,"teacher_disagreement_score":0.010525043,"about_ca_system_score_codex":0.00088982814,"about_ca_system_score_gemma":0.0006643976,"threshold_uncertainty_score":0.020927548},"labels":[],"label_agreement":null},{"id":"W2146992540","doi":"10.1007/s11664-007-0289-z","title":"Influence of Ta-based Diffusion Barriers on the Microstructure of Copper Thin Films","year":2007,"lang":"en","type":"article","venue":"Journal of Electronic Materials","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Deutsche Forschungsgemeinschaft; Deutscher Akademischer Austauschdienst","keywords":"Microstructure; Copper; Materials science; Electroplating; Diffusion barrier; Recrystallization (geology); Thin film; Copper interconnect; Interconnection; Diffusion; Layer (electronics); Physical vapor deposition; Barrier layer; Metallurgy; Composite material; Nanotechnology","score_opus":0.005065075584577547,"score_gpt":0.23876065449638426,"score_spread":0.2336955789118067,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2146992540","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9981982,0.00063392683,0.00035396314,0.00003909268,0.000019798137,0.0000038076419,0.00006154859,0.000017623997,0.00067210326],"genre_scores_gemma":[0.99897265,0.0003165045,0.00030494365,0.000009798202,0.0000054750367,0.0000046925475,0.000043122203,0.000014386458,0.00032838807],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999249,0.000009253716,0.000004615362,0.000016234304,0.000019538338,0.00002542597],"domain_scores_gemma":[0.9996939,0.00011346589,0.00007341182,0.000025708214,0.00006945111,0.000024097097],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012934019,0.000168846,0.00022130096,0.00014680876,0.0002994507,0.00055080664,0.00021966101,0.00021323819,0.0011182437],"category_scores_gemma":[0.0005908005,0.0002592304,0.000091263864,0.00017744287,0.0002387877,0.00033062804,0.0001332921,0.00033536117,0.00014010689],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00030058925,0.00001796965,0.00034368696,0.00007483628,0.00001132274,0.00008751284,0.00006584155,0.00039837253,0.9973678,0.0002922483,0.00009860854,0.0009412986],"study_design_scores_gemma":[0.000027997012,0.00015159439,0.003032041,0.000011351215,0.000026640619,0.000061976156,0.00007672289,0.002765113,0.9929061,0.00004731103,0.00088635297,0.000006788406],"about_ca_topic_score_codex":0.0024749942,"about_ca_topic_score_gemma":0.002948343,"teacher_disagreement_score":0.0024749942,"about_ca_system_score_codex":0.0004026848,"about_ca_system_score_gemma":0.00025401564,"threshold_uncertainty_score":0.0049212575},"labels":[],"label_agreement":null},{"id":"W2149175241","doi":"10.1109/itherm.2010.5501252","title":"Thermal characterization of planar interconnect architectures under different rapid transient currents using the transmission line matrix and finite element methods","year":2010,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Semiconductor Research Corporation","keywords":"Transient (computer programming); Transmission line; Microelectronics; Resistor; Interconnection; Joule heating; Finite element method; Materials science; Transmission-line matrix method; Matrix (chemical analysis); Reliability (semiconductor); Electronic engineering; Planar; Electromigration; Joule effect; Topology (electrical circuits); Computational physics; Computer science; Physics; Electrical engineering; Optoelectronics; Engineering; Voltage; Computational electromagnetics; Thermodynamics; Telecommunications; Composite material","score_opus":0.02766125215865767,"score_gpt":0.33008264098806567,"score_spread":0.302421388829408,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2149175241","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6561909,0.00036294412,0.33963975,0.00007008782,0.000015560188,0.000049142855,0.0001766788,0.00062371924,0.0028711257],"genre_scores_gemma":[0.9357873,0.00015941534,0.062979326,0.0000075868656,0.000004438372,0.00004894006,0.00011022093,0.00003675396,0.0008660429],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9999026,0.000020270572,0.000004229791,0.000021028967,0.00004367217,0.0000082776905],"domain_scores_gemma":[0.999731,0.00012823143,0.00003549073,0.000043856646,0.000054140448,0.000007327504],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021387593,0.00032614026,0.00023173413,0.00027551778,0.00013887337,0.00024040324,0.00032330456,0.00031295817,0.0006757807],"category_scores_gemma":[0.00062784326,0.00017003657,0.00024555225,0.00029216116,0.00028910878,0.00044725297,0.00016404288,0.00017638384,0.00012911456],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011065643,0.0000649818,0.0025596223,0.00023378585,0.000036786463,0.00014013558,0.00033876044,0.6104966,0.3455919,0.0032881876,0.0002865471,0.03685209],"study_design_scores_gemma":[0.0000045101397,0.000093359224,0.0013497459,0.0000040533637,0.000007937176,0.000044783694,0.000046252673,0.9548191,0.04274504,0.00027940632,0.0005951265,0.000010746487],"about_ca_topic_score_codex":0.0009137452,"about_ca_topic_score_gemma":0.0015195285,"teacher_disagreement_score":0.0009137452,"about_ca_system_score_codex":0.00028169923,"about_ca_system_score_gemma":0.00021067685,"threshold_uncertainty_score":0.002260685},"labels":[],"label_agreement":null},{"id":"W2155642509","doi":"10.1109/mwsym.1992.187947","title":"Calculation of frequency-dependent S-parameters of CPW air-bridges considering finite metallization thickness and conductivity","year":2003,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Classification of discontinuities; Coplanar waveguide; Conductivity; Air gap (plumbing); Bridge (graph theory); Materials science; Structural engineering; Acoustics; Optoelectronics; Electrical engineering; Composite material; Physics; Engineering; Telecommunications; Mathematical analysis; Mathematics","score_opus":0.030489052137423086,"score_gpt":0.2605426448613729,"score_spread":0.23005359272394982,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2155642509","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6167346,0.00064968574,0.36152053,0.0002255579,0.00004957189,0.000030321768,0.00019290615,0.0008398479,0.019756835],"genre_scores_gemma":[0.9650012,0.0001571218,0.031148493,0.000015821834,0.000007244731,0.000020835923,0.00010420038,0.000057459096,0.0034875374],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99996746,0.000008522391,0.0000011177249,0.0000045538573,0.000014444592,0.0000039461916],"domain_scores_gemma":[0.9998435,0.000084816114,0.000019185698,0.000017740214,0.000030272473,0.000004444305],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014847462,0.0001928127,0.00017158528,0.00021683415,0.00013851166,0.00028410295,0.00029140228,0.00041814006,0.0019504052],"category_scores_gemma":[0.00042291768,0.0001290983,0.00014856539,0.00023884326,0.00017220172,0.00032072942,0.00010997269,0.0001648641,0.00034459145],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00029109715,0.000038714952,0.0027029326,0.0003718442,0.000048218444,0.00048958306,0.00017923547,0.7440439,0.17800649,0.019032815,0.0021948738,0.05260039],"study_design_scores_gemma":[0.000012889254,0.00005432974,0.00070167746,0.000014685624,0.000007110469,0.000096879005,0.00002797493,0.96549845,0.029821208,0.0014587212,0.002298716,0.0000072794014],"about_ca_topic_score_codex":0.0010014895,"about_ca_topic_score_gemma":0.0010522171,"teacher_disagreement_score":0.0019504052,"about_ca_system_score_codex":0.00024226726,"about_ca_system_score_gemma":0.00017711123,"threshold_uncertainty_score":0.0065248013},"labels":[],"label_agreement":null},{"id":"W2159296063","doi":"10.1149/2.0081501jss","title":"Toward Successful Integration of Porous Low-k Materials: Strategies Addressing Plasma Damage","year":2014,"lang":"en","type":"article","venue":"ECS Journal of Solid State Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":56,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Copper interconnect; Back end of line; Materials science; Anticipation (artificial intelligence); Low-k dielectric; Dielectric; Porosity; Plasma; Nanotechnology; Blanket; Engineering physics; Porous medium; Computer science; Optoelectronics; Composite material; Engineering; Physics; Artificial intelligence","score_opus":0.020757805334162025,"score_gpt":0.2931338338311918,"score_spread":0.27237602849702974,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2159296063","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8860158,0.0066004666,0.08450966,0.0010688443,0.00018186032,0.0001910737,0.00013692798,0.0006507559,0.02064448],"genre_scores_gemma":[0.96117425,0.0026962194,0.032439727,0.00011110222,0.000023932313,0.00005814657,0.00007675522,0.00006791484,0.0033519138],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983823,0.000009277089,0.0000073127076,0.000028962784,0.00006166253,0.000054554795],"domain_scores_gemma":[0.9997929,0.000029422568,0.000058250076,0.000023214803,0.00006643561,0.000029831319],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004000642,0.00035523044,0.00033243405,0.0002498959,0.0004856574,0.0014284601,0.0006210639,0.00067935226,0.0014744546],"category_scores_gemma":[0.00046993123,0.00020786824,0.00021387245,0.00022425168,0.00047528924,0.001569209,0.0011020032,0.0006187385,0.0006569235],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009543675,0.000120530545,0.00079357583,0.00036108284,0.000016010037,0.00018108779,0.0002465964,0.0022972503,0.9653661,0.006680565,0.0005701738,0.023271602],"study_design_scores_gemma":[0.00001981065,0.000552284,0.00095190876,0.00003225137,0.00002558625,0.00029262822,0.0003701812,0.010834724,0.9721006,0.0019955023,0.012805872,0.000018645824],"about_ca_topic_score_codex":0.00032765052,"about_ca_topic_score_gemma":0.00087808765,"teacher_disagreement_score":0.0014744546,"about_ca_system_score_codex":0.00045541336,"about_ca_system_score_gemma":0.0004526348,"threshold_uncertainty_score":0.004932523},"labels":[],"label_agreement":null},{"id":"W2162899915","doi":"10.4028/www.scientific.net/msf.408-412.1627","title":"Texture Investigations In Damascene Copper Interconnects","year":2002,"lang":"en","type":"article","venue":"Materials science forum","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada); McGill University","funders":"","keywords":"Copper interconnect; Materials science; Copper; Texture (cosmology); Metallurgy; Composite material; Artificial intelligence; Computer science","score_opus":0.02051387113556971,"score_gpt":0.25058974458614863,"score_spread":0.23007587345057892,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2162899915","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9953312,0.00035133824,0.0005182938,0.000027849428,0.0000084226285,0.0000075570983,0.00007447216,0.000019183815,0.003661678],"genre_scores_gemma":[0.99765885,0.00015468361,0.00038870436,0.000012326886,0.0000057116877,0.000004067077,0.00005993386,0.000012182807,0.0017035176],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998658,0.000008252354,0.0000031549644,0.000020478426,0.000063262705,0.000039132337],"domain_scores_gemma":[0.99981576,0.000033051987,0.0000530243,0.000019292425,0.00006190721,0.0000169638],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000082669074,0.000083723266,0.00012353314,0.00043177206,0.0004345862,0.00034946657,0.00020063404,0.00016394157,0.0019641323],"category_scores_gemma":[0.00030214668,0.00013413922,0.0000631148,0.0005288208,0.00029859005,0.00024769673,0.00020221349,0.00026008053,0.0001629942],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00037135507,0.000038557282,0.002082295,0.00008011549,0.0000050801564,0.00022622981,0.00036510022,0.00052900234,0.98997587,0.00075742597,0.00027748194,0.005291525],"study_design_scores_gemma":[0.000044671655,0.00047621463,0.044125564,0.000013400129,0.000017553768,0.0005192805,0.0007524093,0.004985504,0.94069076,0.00021652447,0.008140339,0.00001771873],"about_ca_topic_score_codex":0.0032287561,"about_ca_topic_score_gemma":0.00403798,"teacher_disagreement_score":0.0032287561,"about_ca_system_score_codex":0.00039726196,"about_ca_system_score_gemma":0.0001554591,"threshold_uncertainty_score":0.006570637},"labels":[],"label_agreement":null},{"id":"W2168983090","doi":"10.1149/1.3700943","title":"Scaled Micro-Relay Structure with Low Strain Gradient for Reduced Operating Voltage","year":2012,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Semtech (Canada)","funders":"Semiconductor Research Corporation; National Science Foundation","keywords":"Relay; Materials science; Hysteresis; Voltage; Electrical engineering; Low voltage; Power (physics); Electronic circuit; Optoelectronics; Electronic engineering; Engineering; Physics; Condensed matter physics","score_opus":0.010166054715528335,"score_gpt":0.24340172192108142,"score_spread":0.23323566720555308,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2168983090","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95382166,0.00171159,0.033850465,0.00049360615,0.00037770954,0.00016419828,0.0007319158,0.0016145234,0.007234295],"genre_scores_gemma":[0.9452021,0.0007546332,0.048817668,0.0000897708,0.00005763045,0.000101987076,0.00039760213,0.00013805683,0.0044407365],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99987197,0.000007198204,0.000006826207,0.00003915853,0.000062217405,0.000012663603],"domain_scores_gemma":[0.9997155,0.000029196157,0.00008628644,0.0000550351,0.00007871716,0.00003520634],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010331815,0.0004520499,0.00044308475,0.00029838088,0.00018657536,0.00041194487,0.0010508382,0.0005791735,0.0018916711],"category_scores_gemma":[0.0003479462,0.00029910402,0.00017214657,0.0002130825,0.00027709443,0.0006105964,0.00022825084,0.0007398937,0.0009929498],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016274724,0.0000134387465,0.00005953376,0.000055060405,0.0000056497306,0.000102065285,0.000025182926,0.00018057521,0.997783,0.00032158487,0.0002881536,0.0011495207],"study_design_scores_gemma":[0.000041151936,0.00042287252,0.001355904,0.000008319792,0.000025852894,0.0005231254,0.000026428446,0.004563512,0.98769903,0.00008982095,0.005224077,0.000019756575],"about_ca_topic_score_codex":0.00059164996,"about_ca_topic_score_gemma":0.0011030671,"teacher_disagreement_score":0.0018916711,"about_ca_system_score_codex":0.00042490062,"about_ca_system_score_gemma":0.00027487418,"threshold_uncertainty_score":0.0063282847},"labels":[],"label_agreement":null},{"id":"W2177893790","doi":"10.1116/1.4932533","title":"Modification of porous SiOCH by first contact with water vapor after plasma process","year":2015,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Agence Nationale de la Recherche","keywords":"Silanol; Water vapor; Desorption; Adsorption; Relative humidity; Plasma; Porosity; Humidity; Molecule; Chemical engineering; Chemistry; Materials science; Analytical Chemistry (journal); Environmental chemistry; Organic chemistry; Meteorology","score_opus":0.014153175623433769,"score_gpt":0.23370046523152407,"score_spread":0.2195472896080903,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2177893790","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99823487,0.0001391535,0.00094863767,0.00001266981,0.000008995987,0.0000071079526,0.00006965937,0.000029406629,0.00054936064],"genre_scores_gemma":[0.9988796,0.00008056345,0.0005203492,0.0000071046593,0.0000024514723,0.000004333273,0.00006632532,0.000010361083,0.00042883228],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99992967,0.0000035163494,0.0000029253183,0.00001845995,0.00002196805,0.000023466588],"domain_scores_gemma":[0.9999083,0.000026174417,0.000026320902,0.000013707608,0.000014251944,0.000011150223],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000052452615,0.00020882474,0.00014688633,0.000099991885,0.00013147523,0.00017994837,0.00019048832,0.00017110154,0.0009511128],"category_scores_gemma":[0.00019419038,0.00012246105,0.00015516173,0.0000909244,0.00025735536,0.00026225107,0.00019995798,0.00021749444,0.00012084077],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039134295,0.0000040712494,0.00017605704,0.000019637708,0.000003209362,0.00004741698,0.000023074968,0.00005284795,0.9990711,0.00003141555,0.000009775851,0.0005221764],"study_design_scores_gemma":[0.000002204702,0.000057410616,0.0015322367,8.9858725e-7,0.0000030100812,0.000049112317,0.000017361544,0.00023547982,0.9977228,0.000011722643,0.0003656825,0.0000020395821],"about_ca_topic_score_codex":0.0005862779,"about_ca_topic_score_gemma":0.0008285306,"teacher_disagreement_score":0.0009511128,"about_ca_system_score_codex":0.0001523924,"about_ca_system_score_gemma":0.000100283134,"threshold_uncertainty_score":0.0031817555},"labels":[],"label_agreement":null},{"id":"W2193212110","doi":"10.4071/isom-2015-tp42","title":"Main Impact Factors on Internal Stress of Electroless Deposited Copper Films","year":2015,"lang":"en","type":"article","venue":"IMAPSource Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mount Allison University","funders":"","keywords":"Materials science; Layer (electronics); Delamination (geology); Substrate (aquarium); Composite material; Adhesion; Copper; Stress (linguistics); Diffusion barrier; Metallurgy","score_opus":0.0172828331060582,"score_gpt":0.27200875219098075,"score_spread":0.25472591908492254,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2193212110","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9957354,0.0010944112,0.0011277053,0.000041474148,0.000031388903,0.000020927135,0.00024113448,0.0000472174,0.001660344],"genre_scores_gemma":[0.9983895,0.00048794106,0.00024798475,0.000016033307,0.000011577813,0.0000152665,0.00017117859,0.000029790355,0.000630746],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995914,0.000026717442,0.00002443057,0.00011602197,0.00016403607,0.00007737971],"domain_scores_gemma":[0.9990891,0.00032378538,0.00017732909,0.000056860066,0.00025379646,0.00009903992],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023031096,0.0005888984,0.00038885025,0.00028225733,0.00025136335,0.00066964084,0.00024825943,0.00032750156,0.0023333712],"category_scores_gemma":[0.0008513388,0.00026191724,0.00022313578,0.00033228763,0.00049792277,0.00031299697,0.00030867718,0.00035388043,0.0003547386],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00024613028,0.000033725202,0.00257563,0.00016172357,0.000018701074,0.0002029757,0.00019294112,0.00066548627,0.9915132,0.0000842776,0.00014244574,0.0041629463],"study_design_scores_gemma":[0.000009791314,0.00035769452,0.020799119,0.00001832644,0.000036518253,0.00008853762,0.0001384146,0.0016308161,0.9760862,0.00003422185,0.00078351697,0.000016870586],"about_ca_topic_score_codex":0.000691762,"about_ca_topic_score_gemma":0.0006138702,"teacher_disagreement_score":0.0023333712,"about_ca_system_score_codex":0.00040288732,"about_ca_system_score_gemma":0.00020735335,"threshold_uncertainty_score":0.007805884},"labels":[],"label_agreement":null},{"id":"W2217997521","doi":"10.1116/1.4935447","title":"Novel copper compounds for vapor deposition: Characterization and thermolysis","year":2015,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Thermogravimetric analysis; Copper; Benzamide; Volatility (finance); Thermal stability; Thermal decomposition; Chemistry; Amide; Chemical vapor deposition; Reactivity (psychology); Metal; Inorganic chemistry; Organic chemistry; Materials science","score_opus":0.02145633356951332,"score_gpt":0.266823989299445,"score_spread":0.2453676557299317,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2217997521","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9678334,0.0051245075,0.014630831,0.00011007192,0.00005384574,0.00026143587,0.00065453997,0.0002941893,0.011037061],"genre_scores_gemma":[0.9779871,0.0023338376,0.015817732,0.000028105593,0.000024125127,0.0001517949,0.00048064577,0.000083584586,0.0030931581],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997875,0.000020181076,0.0000130783355,0.000037383914,0.00010309408,0.00003875652],"domain_scores_gemma":[0.9998258,0.000032860033,0.00004236084,0.00002444581,0.000058284946,0.000016312335],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021625211,0.000363204,0.0002577797,0.00035042522,0.00034854977,0.00036411767,0.00043963103,0.00029851205,0.001457467],"category_scores_gemma":[0.00041897874,0.0002092004,0.00011055149,0.00032584628,0.00022050856,0.0002524338,0.00015572511,0.00031345026,0.00041756948],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020841497,0.00000840537,0.00013679787,0.0000783872,0.0000038050828,0.000086608736,0.000040629646,0.00008548974,0.99691296,0.00012014219,0.000104024686,0.002402003],"study_design_scores_gemma":[0.0000030042386,0.000054440243,0.000443462,0.000004785552,0.0000028137904,0.00011349308,0.000011881621,0.0003205507,0.9971462,0.000012102869,0.00188463,0.000002663967],"about_ca_topic_score_codex":0.0010388463,"about_ca_topic_score_gemma":0.002637302,"teacher_disagreement_score":0.001457467,"about_ca_system_score_codex":0.0004352968,"about_ca_system_score_gemma":0.00026864596,"threshold_uncertainty_score":0.00487566},"labels":[],"label_agreement":null},{"id":"W2241869039","doi":"10.1088/1009-0630/12/6/08","title":"Dependence of Decamethylcyclopentasiloxane (DMCPS) Dissociation on Ionized Energy by Using Quadrupole Mass Spectrum","year":2010,"lang":"en","type":"article","venue":"Plasma Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Dissociation (chemistry); Ionization; Chemistry; Mass spectrometry; Ion; Atomic physics; Mass spectrum; Collision-induced dissociation; Analytical Chemistry (journal); Physical chemistry; Tandem mass spectrometry; Physics; Organic chemistry; Chromatography","score_opus":0.006954221191753973,"score_gpt":0.24649801467001883,"score_spread":0.23954379347826485,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2241869039","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98986596,0.0013976136,0.0044597224,0.000083383675,0.00001921924,0.00001953471,0.00044030402,0.00011692291,0.0035974048],"genre_scores_gemma":[0.9938326,0.0010267029,0.002459814,0.00008034204,0.000007117018,0.000017421762,0.0004817097,0.000030563755,0.002063821],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99976283,0.000014306297,0.0000105984145,0.000056905137,0.00010018299,0.00005506968],"domain_scores_gemma":[0.99968183,0.000113523616,0.00007980196,0.000017560315,0.000082344806,0.000024867151],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020041112,0.00047235098,0.0001396438,0.0004491362,0.00020225321,0.00030877462,0.0002499383,0.00032606345,0.0033559084],"category_scores_gemma":[0.00034964003,0.00022614699,0.00017288383,0.00028772125,0.00029588572,0.00029577684,0.00023642709,0.00039788993,0.000419903],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013873984,0.000010233914,0.0012048852,0.000042478467,0.00001296682,0.00008447997,0.00004772381,0.00015195261,0.99601763,0.00010334062,0.00007843325,0.0021072382],"study_design_scores_gemma":[0.000004809316,0.00009550408,0.0065473574,0.0000038193148,0.000006815498,0.00017491601,0.000037138558,0.0007288876,0.991561,0.000033956876,0.0007990265,0.0000066452544],"about_ca_topic_score_codex":0.0008999681,"about_ca_topic_score_gemma":0.0012162281,"teacher_disagreement_score":0.0033559084,"about_ca_system_score_codex":0.00027508312,"about_ca_system_score_gemma":0.0001670612,"threshold_uncertainty_score":0.011226654},"labels":[],"label_agreement":null},{"id":"W2281414570","doi":"10.1149/ma2013-02/49/2722","title":"Development of All-Solid Thin Film Electro-Chromic Devices and Applications","year":2013,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Optoelectronics; Engineering physics; Engineering","score_opus":0.014716970032573948,"score_gpt":0.26188294831848935,"score_spread":0.2471659782859154,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2281414570","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7418888,0.021156786,0.11472844,0.001262537,0.0021645774,0.0010311712,0.0026301763,0.0019135806,0.11322399],"genre_scores_gemma":[0.8205363,0.010274957,0.09630307,0.00024814464,0.000110275774,0.0002611272,0.00192717,0.00019132042,0.07014753],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998975,0.000008136852,0.000004373119,0.000019735127,0.000052619525,0.000017701253],"domain_scores_gemma":[0.9998661,0.000012873445,0.000012657771,0.000016540078,0.00006590904,0.000025899712],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023298297,0.0003777607,0.00017658797,0.0003048399,0.00025950762,0.0005834792,0.00044868264,0.0003397744,0.0030399573],"category_scores_gemma":[0.00020304095,0.00020093902,0.00022734034,0.00023371987,0.0001649896,0.00034499427,0.0002472338,0.00048345444,0.0014316945],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000049510196,0.000059836315,0.0003305501,0.00024093829,0.000017901863,0.00014400932,0.0000300314,0.00039712267,0.9549369,0.0032654488,0.0027309111,0.037796833],"study_design_scores_gemma":[0.000016739143,0.00033697,0.0011168303,0.000027528207,0.000023889042,0.00019334437,0.000026263391,0.0027104397,0.944568,0.0003740947,0.050598178,0.000007759994],"about_ca_topic_score_codex":0.000724495,"about_ca_topic_score_gemma":0.0017397818,"teacher_disagreement_score":0.0030399573,"about_ca_system_score_codex":0.00038069516,"about_ca_system_score_gemma":0.00060494745,"threshold_uncertainty_score":0.010169685},"labels":[],"label_agreement":null},{"id":"W2289365991","doi":"10.1021/acs.jpcc.5b10711","title":"Hydrogen Solubility of Magnetron Co-Sputtered FCC and BCC PdCuAu Thin Films","year":2016,"lang":"en","type":"article","venue":"The Journal of Physical Chemistry C","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"Natural Sciences and Engineering Research Council of Canada; Air Liquide","keywords":"Cavity magnetron; Materials science; Hydrogen; Solubility; Thin film; Sputter deposition; Metallurgy; Composite material; Nanotechnology; Chemistry; Sputtering; Physical chemistry; Organic chemistry","score_opus":0.009507690477124815,"score_gpt":0.24705139268990803,"score_spread":0.2375437022127832,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2289365991","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9972723,0.0006319231,0.000598264,0.000031469208,0.000010721664,0.0000058360597,0.00010332408,0.00003011824,0.0013160621],"genre_scores_gemma":[0.99800485,0.0002657042,0.00080135925,0.0000059923977,0.0000034532984,0.0000057148677,0.000091218746,0.000009053594,0.0008126735],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998876,0.000009010733,0.0000063234675,0.000023185848,0.000052927164,0.000020968095],"domain_scores_gemma":[0.9999049,0.000019053217,0.000018239389,0.000008207138,0.000042138385,0.000007459042],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009443713,0.00016660272,0.00018135842,0.00027287874,0.00022943036,0.00029779543,0.00026141427,0.00023722349,0.00061683956],"category_scores_gemma":[0.00027857066,0.00019492331,0.00006476639,0.0002690212,0.00018645567,0.00020039582,0.00012909745,0.00020790749,0.00011750792],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005958457,0.0000056257063,0.00027478076,0.0000604426,0.000003534606,0.00006510718,0.000058311245,0.000109938446,0.99801767,0.00012697962,0.00006521475,0.0011527489],"study_design_scores_gemma":[0.0000023502687,0.000027944741,0.00094473525,0.0000028528164,0.000003941699,0.000043343,0.000041455005,0.00073226256,0.99756587,0.000010107932,0.0006232794,0.0000018384559],"about_ca_topic_score_codex":0.0035098535,"about_ca_topic_score_gemma":0.004751627,"teacher_disagreement_score":0.0035098535,"about_ca_system_score_codex":0.0005329019,"about_ca_system_score_gemma":0.00018784827,"threshold_uncertainty_score":0.00697881},"labels":[],"label_agreement":null},{"id":"W2302003665","doi":"10.71781/17202","title":"Dynamique de croissance par plasma RF magnétron des couches minces à base d’oxyde de zinc","year":2015,"lang":"fr","type":"dissertation","venue":"Papyrus : Institutional Repository (Université de Montréal)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Fonds de recherche du Québec – Nature et technologies; Natural Sciences and Engineering Research Council of Canada","keywords":"Zinc; Plasma; Materials science; Chemistry; Physics; Metallurgy","score_opus":0.009391236885636716,"score_gpt":0.20009008438450773,"score_spread":0.190698847498871,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2302003665","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99046105,0.0009916268,0.005753154,0.0001349031,0.00006153043,0.000020587466,0.00018598506,0.000115624345,0.0022754727],"genre_scores_gemma":[0.9936179,0.0004297739,0.0011553013,0.00004265601,0.0000127318235,0.000017015565,0.00011690384,0.00003624577,0.0045715454],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998871,0.000005041212,0.000003091159,0.000030897252,0.000046399833,0.00002748698],"domain_scores_gemma":[0.9998683,0.000042544794,0.00002963332,0.000013058976,0.000036050453,0.000010436725],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014719857,0.00017089168,0.00026791953,0.0001628387,0.00023698682,0.0005363434,0.00030964456,0.00034876115,0.0025288537],"category_scores_gemma":[0.00026613814,0.00017007158,0.00024687508,0.00015704599,0.0002779764,0.00044574327,0.0001916384,0.00033216793,0.00032471743],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017224603,0.000010330751,0.0017383496,0.000103696664,0.000013504546,0.0001498879,0.00015571463,0.0012664606,0.9909671,0.0006719438,0.0002023559,0.004548484],"study_design_scores_gemma":[0.000031222855,0.00020714452,0.012784675,0.000011558705,0.000020163356,0.00017928281,0.0002412758,0.010935499,0.96756625,0.0002988462,0.0077069253,0.000017016548],"about_ca_topic_score_codex":0.0014821973,"about_ca_topic_score_gemma":0.002020174,"teacher_disagreement_score":0.0025288537,"about_ca_system_score_codex":0.00057800196,"about_ca_system_score_gemma":0.00016644014,"threshold_uncertainty_score":0.008459806},"labels":[],"label_agreement":null},{"id":"W2314603238","doi":"10.1109/nano.2014.6968101","title":"Molecular dynamics study of nano-scale Ag surface electromigration and effect of Pd coating layer","year":2014,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Electromigration; Microelectronics; Materials science; Coating; Nanoscopic scale; Molecular dynamics; Electrical conductor; Nano-; Layer (electronics); Condensed matter physics; Nanotechnology; Chemical physics; Composite material; Chemistry; Computational chemistry; Physics","score_opus":0.004275280109964536,"score_gpt":0.23829440882846303,"score_spread":0.2340191287184985,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2314603238","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9910121,0.00030193833,0.0032115418,0.00046180552,0.000035286484,0.000019268504,0.00035775505,0.00012220685,0.0044781114],"genre_scores_gemma":[0.99611723,0.00023998923,0.0022647197,0.00006374955,0.000009350351,0.0000392129,0.00041801773,0.00002514021,0.0008225917],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9999417,0.000007342691,0.000001780052,0.000012849516,0.000013018713,0.000023351051],"domain_scores_gemma":[0.99981004,0.00006717766,0.000028267492,0.000014610525,0.00003564925,0.000044260385],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014712675,0.0003922188,0.00048087534,0.00036156454,0.00080715085,0.00047593983,0.0006580132,0.0007919646,0.0030941276],"category_scores_gemma":[0.00042493263,0.0002696971,0.0005532839,0.00031181867,0.0004906233,0.00070211885,0.00027489042,0.0007449378,0.00018332778],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003131717,0.00037680945,0.0069689346,0.00018174005,0.0001748494,0.000532157,0.00023016418,0.941572,0.032999054,0.009894591,0.0020783998,0.00467807],"study_design_scores_gemma":[0.000034784967,0.00007386866,0.001518804,0.000006444964,0.00001484579,0.000012800911,0.000031110296,0.9959265,0.0016290147,0.00043796987,0.00030163385,0.000012136209],"about_ca_topic_score_codex":0.011004969,"about_ca_topic_score_gemma":0.007124393,"teacher_disagreement_score":0.011004969,"about_ca_system_score_codex":0.0011023406,"about_ca_system_score_gemma":0.0007284988,"threshold_uncertainty_score":0.021881819},"labels":[],"label_agreement":null},{"id":"W2319278046","doi":"10.1557/proc-812-f8.9","title":"Textural Evolution of Cu Damascene Interconnects after Annealing","year":2004,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Materials science; Copper interconnect; Annealing (glass); Electron backscatter diffraction; Line width; Grain boundary; Diffraction; Composite material; Finite element method; Metallurgy; Copper; Optics; Thermodynamics; Microstructure","score_opus":0.007779861412161076,"score_gpt":0.23007017951293143,"score_spread":0.22229031810077035,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2319278046","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9980726,0.00016637356,0.00016510765,0.0000174161,0.0000049572295,0.0000028710742,0.00016449783,0.00003483799,0.0013712416],"genre_scores_gemma":[0.99772483,0.00006053872,0.00017922651,0.0000072977864,0.0000022213476,0.000003793125,0.00016469538,0.00001961407,0.0018377586],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.999915,0.0000054462785,0.000003570987,0.000017810311,0.000029553423,0.000028557775],"domain_scores_gemma":[0.99977845,0.000044461463,0.00006814034,0.000028234323,0.000056902827,0.000023869445],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000078490644,0.0001281016,0.00012831482,0.00033341954,0.00040883975,0.00035275696,0.0002695953,0.00022819836,0.0035870178],"category_scores_gemma":[0.0004066741,0.00015482328,0.000065946784,0.00043075127,0.00029874608,0.00035290408,0.0001323291,0.00023449819,0.00030012324],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004195798,0.000036898928,0.0014082976,0.000063857915,0.00001153923,0.00024316135,0.00035866527,0.001059496,0.99237484,0.0002326078,0.00028748575,0.0035035713],"study_design_scores_gemma":[0.00001426972,0.00035311835,0.035917073,0.000010151221,0.000019178085,0.00011148464,0.00028412158,0.0038366418,0.956487,0.00007301788,0.0028718272,0.000022212138],"about_ca_topic_score_codex":0.0027678262,"about_ca_topic_score_gemma":0.004878218,"teacher_disagreement_score":0.0035870178,"about_ca_system_score_codex":0.0003513614,"about_ca_system_score_gemma":0.00015430951,"threshold_uncertainty_score":0.011999726},"labels":[],"label_agreement":null},{"id":"W2324213395","doi":"10.1149/ma2015-01/40/2116","title":"(Invited) Design and Characterization of a New Low Cost Thick Film Copper Metallization Transfer Process Onto PDMS Enabling Stretchable Electronics","year":2015,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Photoresist; Fabrication; Electroplating; Layer (electronics); Copper plating; Polydimethylsiloxane; Electrical conductor; Flexible electronics; Electronics; Nanotechnology; Stretchable electronics; Microfabrication; Copper; Transfer printing; Optoelectronics; Composite material; Electrical engineering; Metallurgy","score_opus":0.03131915685775215,"score_gpt":0.2595191247277276,"score_spread":0.22819996786997543,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2324213395","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.69038093,0.0024480713,0.28928292,0.00063222053,0.0005561856,0.0007922675,0.0010876452,0.0017237159,0.01309607],"genre_scores_gemma":[0.76590323,0.0015858616,0.21573521,0.00019032253,0.00013303886,0.00038184744,0.00078216946,0.0002177257,0.015070651],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99965525,0.000018365185,0.000015322956,0.000071515744,0.00019610093,0.000043387703],"domain_scores_gemma":[0.99980766,0.00002787965,0.000057302193,0.000028842356,0.0000565469,0.000021825737],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00031141465,0.00042250927,0.00022100446,0.00032212067,0.00025582756,0.0004580102,0.00047152754,0.0004217992,0.0014881592],"category_scores_gemma":[0.00038419847,0.00020756143,0.00021924211,0.00021019671,0.0003080363,0.00058264006,0.00027942983,0.00032178118,0.00077025464],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002939124,0.00001747572,0.0002113368,0.00009107557,0.000003910443,0.00014599571,0.000053800628,0.000552588,0.9875815,0.0003301599,0.00039725582,0.010585581],"study_design_scores_gemma":[0.0000128811735,0.00024259463,0.0011615494,0.0000032395235,0.000007380434,0.0002021115,0.00001781881,0.002389493,0.9877457,0.000044903878,0.008161975,0.000010399905],"about_ca_topic_score_codex":0.0006706566,"about_ca_topic_score_gemma":0.0005940039,"teacher_disagreement_score":0.0014881592,"about_ca_system_score_codex":0.00038625833,"about_ca_system_score_gemma":0.0003137956,"threshold_uncertainty_score":0.0049783587},"labels":[],"label_agreement":null},{"id":"W2441613964","doi":"10.1364/oic.2016.tc.6","title":"Asymmetry in Waveguide Facet Coating","year":2016,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Asymmetry; Facet (psychology); Materials science; Coating; Reflectivity; Waveguide; Dielectric; Optics; Optoelectronics; Work (physics); Nanotechnology; Physics; Engineering; Mechanical engineering","score_opus":0.014463939073871685,"score_gpt":0.2564477888609387,"score_spread":0.24198384978706702,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2441613964","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9018656,0.0020369985,0.05086866,0.0003894619,0.00021632027,0.000060606035,0.00016951634,0.00042213927,0.043970685],"genre_scores_gemma":[0.9928409,0.00056486094,0.0043604844,0.000060543374,0.000024259476,0.000011666095,0.00005332595,0.0000693215,0.002014708],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993799,0.000053410866,0.000024713696,0.000105211715,0.00025098948,0.00018580811],"domain_scores_gemma":[0.9996166,0.000110362176,0.00006972241,0.00007920017,0.00010528271,0.000018737115],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003181827,0.00041448264,0.00028626152,0.00021429826,0.0002733399,0.00091957604,0.0004575867,0.00043407155,0.0012238135],"category_scores_gemma":[0.0007480925,0.00023452862,0.0002526777,0.00012752574,0.0007114517,0.0005859134,0.00040113842,0.00050934264,0.0003508894],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000086614426,0.00000979675,0.00046665932,0.00008558681,0.000007742982,0.0001538987,0.00007467435,0.0012141536,0.98686427,0.0063538128,0.0002177007,0.004465093],"study_design_scores_gemma":[0.000025805699,0.00008267027,0.0016303477,0.00001470677,0.00002125105,0.00047234082,0.00006602732,0.013854136,0.9788592,0.0016141782,0.003334953,0.000024450223],"about_ca_topic_score_codex":0.0007769635,"about_ca_topic_score_gemma":0.00064931443,"teacher_disagreement_score":0.0012238135,"about_ca_system_score_codex":0.0005508473,"about_ca_system_score_gemma":0.00023040653,"threshold_uncertainty_score":0.0040940046},"labels":[],"label_agreement":null},{"id":"W2485564250","doi":"10.1021/bk-2004-0874.ch013","title":"Ultra Low-k Dielectric Films with Ultra Small Pores Using Poragens Chemically Bonded to Siloxane Resin","year":2004,"lang":"en","type":"book-chapter","venue":"ACS symposium series","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Ministère de l'Économie, de la Science et de l'Innovation - Québec","keywords":"Siloxane; Materials science; Curing (chemistry); Dielectric; Composite material; Porosity; Coating; Low-k dielectric; Polymer chemistry; Polymer; Optoelectronics","score_opus":0.012799966005288608,"score_gpt":0.21374120852710776,"score_spread":0.20094124252181916,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2485564250","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.52247465,0.0852695,0.20138876,0.0012735685,0.0006915534,0.00013449881,0.00097234815,0.0048382743,0.18295695],"genre_scores_gemma":[0.67030996,0.05618397,0.111586966,0.00039996344,0.00012054926,0.00007874744,0.00096854445,0.0005238282,0.15982746],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999709,0.0000017927555,0.0000016785227,0.0000072426446,0.00001421091,0.0000041661156],"domain_scores_gemma":[0.99996316,0.000010447803,0.000009450044,0.0000048887237,0.000007426095,0.000004678022],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000049067614,0.00024979943,0.00014936396,0.0002240574,0.00010554293,0.0005437287,0.00028994653,0.00015203621,0.001859401],"category_scores_gemma":[0.000060739727,0.00022796394,0.00011947353,0.00024557966,0.00019458312,0.00065026496,0.00015958778,0.00037278264,0.001471596],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000018475901,0.000008500369,0.000059159098,0.00030864435,0.0000043944005,0.000109319575,0.000069620146,0.00029123796,0.9444443,0.0029033653,0.0011937144,0.050589386],"study_design_scores_gemma":[0.000008712727,0.00013317219,0.0007946007,0.00004143976,0.000015496946,0.001474425,0.000041827272,0.0015201435,0.86139214,0.0011069959,0.13345774,0.000013281433],"about_ca_topic_score_codex":0.00013333277,"about_ca_topic_score_gemma":0.00037075666,"teacher_disagreement_score":0.001859401,"about_ca_system_score_codex":0.0002580561,"about_ca_system_score_gemma":0.00010439993,"threshold_uncertainty_score":0.006220281},"labels":[],"label_agreement":null},{"id":"W2508763482","doi":"10.1021/acs.jpcc.5b04613","title":"Structural Changes in Tungsten and Tantalum Wires in Catalytic Chemical Vapor Deposition Using 1,3-Disilacyclobutane","year":2015,"lang":"en","type":"article","venue":"The Journal of Physical Chemistry C","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Foundation for Innovation; University of Calgary","keywords":"Tungsten; Tantalum; Materials science; Chemical vapor deposition; Catalysis; Carbide; Alloy; Metal; Deposition (geology); Protein filament; Chemical engineering; Refractory metals; Atmospheric temperature range; Metallurgy; Composite material; Nanotechnology; Chemistry; Organic chemistry; Thermodynamics","score_opus":0.02119860346216011,"score_gpt":0.27014028913523797,"score_spread":0.24894168567307787,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2508763482","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99832577,0.0004176538,0.0004803447,0.000014633104,0.00000825898,0.000005958867,0.00008159145,0.000026244232,0.0006395678],"genre_scores_gemma":[0.99763346,0.00027349193,0.00053657877,0.000015866712,0.0000030441463,0.000013789893,0.00016642823,0.000024910238,0.00133246],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99990475,0.000007786763,0.000006032813,0.000023636068,0.000035279558,0.000022418148],"domain_scores_gemma":[0.99989355,0.000019830777,0.000035581168,0.000014087495,0.000024437839,0.000012415039],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008384719,0.00018951474,0.00015991819,0.0001507809,0.00016119574,0.00023592157,0.00023103127,0.0002829684,0.0006128901],"category_scores_gemma":[0.0002198588,0.00028033816,0.00017125365,0.0001689072,0.00019431558,0.00016166353,0.00012919128,0.00026852434,0.00013070759],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003579883,0.0000052817127,0.00037596063,0.000030886782,0.000006761956,0.00005885019,0.00005364404,0.000086800435,0.9984194,0.000026245967,0.000021723774,0.00087856955],"study_design_scores_gemma":[0.0000028360434,0.00012448087,0.010067155,0.000004212913,0.000014780657,0.000094409064,0.000048445007,0.0005672349,0.9884546,0.000015116731,0.0006029395,0.0000037973484],"about_ca_topic_score_codex":0.0007392076,"about_ca_topic_score_gemma":0.0013199402,"teacher_disagreement_score":0.0007392076,"about_ca_system_score_codex":0.00019252098,"about_ca_system_score_gemma":0.0000875626,"threshold_uncertainty_score":0.0020502806},"labels":[],"label_agreement":null},{"id":"W2527855557","doi":"10.1103/physrevlett.117.155901","title":"Phase-Field-Crystal Model for Electromigration in Metal Interconnects","year":2016,"lang":"en","type":"article","venue":"Physical Review Letters","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs","keywords":"Electromigration; Nucleation; Void (composites); Materials science; Condensed matter physics; Atomic units; Electric field; Dipole; Scattering; Phase (matter); Electrical resistivity and conductivity; Crystal (programming language); Physics; Thermodynamics; Optics","score_opus":0.02463910974843159,"score_gpt":0.3267458933549282,"score_spread":0.3021067836064966,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2527855557","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.09778343,0.0016122732,0.8561466,0.0018071908,0.0002838813,0.00009943915,0.00027442919,0.00030111993,0.041691694],"genre_scores_gemma":[0.88308585,0.0018515444,0.09494623,0.00039911113,0.00024141955,0.00033527054,0.00015649985,0.00011777547,0.01886633],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9999318,0.00001913546,0.0000018670405,0.0000085657775,0.000027840624,0.000010739323],"domain_scores_gemma":[0.9999025,0.00003830735,0.000014702063,0.00001171289,0.000022246246,0.000010482749],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020495392,0.00031744098,0.00044641533,0.00043356538,0.00047065032,0.0003959036,0.001288955,0.0009479387,0.0022697214],"category_scores_gemma":[0.00040695214,0.00018437396,0.0004627769,0.00041981778,0.0008398852,0.0008289337,0.00039651926,0.00055805,0.00035425834],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001725502,0.00003087125,0.00020478333,0.000060491417,0.000010115368,0.00019968193,0.000061305946,0.3915908,0.0056119193,0.59807783,0.0012679448,0.0028669084],"study_design_scores_gemma":[0.000011996367,0.000018242537,0.00006584857,0.0000034325387,0.000003017024,0.00005295888,0.000009357859,0.9428149,0.0003050283,0.055024035,0.0016847827,0.0000062897693],"about_ca_topic_score_codex":0.0025995688,"about_ca_topic_score_gemma":0.0018913911,"teacher_disagreement_score":0.0025995688,"about_ca_system_score_codex":0.0006822479,"about_ca_system_score_gemma":0.00075325556,"threshold_uncertainty_score":0.007592976},"labels":[],"label_agreement":null},{"id":"W2535242961","doi":"10.1017/9781139939508.063","title":"CDw75 (LN-1)","year":2016,"lang":"en","type":"book-chapter","venue":"Cambridge University Press eBooks","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"History","score_opus":0.01928237660754486,"score_gpt":0.19886672920601156,"score_spread":0.1795843525984667,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2535242961","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0006633922,0.0033671348,0.0022863382,0.0007972661,0.0018050574,0.00014957423,0.003052972,0.0031483145,0.98472995],"genre_scores_gemma":[0.0010136467,0.0014829917,0.0005837472,0.00028614243,0.00017456207,0.00008930787,0.0019779939,0.00027119336,0.9941204],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99937636,0.000027283928,0.000015607475,0.00021778996,0.00023513097,0.00012786056],"domain_scores_gemma":[0.99916255,0.00023767077,0.00004397713,0.00007398976,0.00026047378,0.00022140912],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005244496,0.002625185,0.0021253524,0.003792306,0.0015916881,0.004190543,0.0031745154,0.0020759562,0.91988206],"category_scores_gemma":[0.0014556152,0.0010178854,0.0010954489,0.00296776,0.0006246265,0.002610767,0.0022734238,0.0025806956,0.84646064],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00031983104,0.0001403807,0.000077787685,0.00061297475,0.000017111219,0.00021410176,0.000053613723,0.000177252,0.0113403695,0.0046689645,0.80381036,0.17856723],"study_design_scores_gemma":[0.00006529178,0.000077603,0.0003805729,0.00017423349,0.000013236082,0.00022754692,0.000020752861,0.00013704703,0.0017046207,0.0012536609,0.99592566,0.000019807014],"about_ca_topic_score_codex":0.001888875,"about_ca_topic_score_gemma":0.0045246673,"teacher_disagreement_score":0.91988206,"about_ca_system_score_codex":0.0012083368,"about_ca_system_score_gemma":0.0011109583,"threshold_uncertainty_score":0.114278436},"labels":[],"label_agreement":null},{"id":"W2536650897","doi":"10.1145/2966986.2967041","title":"Fast physics-based electromigration checking for on-die power grids","year":2016,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":28,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; Mentor Graphics","keywords":"Electromigration; IBM; Computer science; Grid; Die (integrated circuit); Interconnection; Power (physics); Power grid; Scaling; Computational science; Computer engineering; Parallel computing; Algorithm; Electrical engineering; Physics; Engineering; Mathematics; Telecommunications","score_opus":0.016017979578558942,"score_gpt":0.2629600156232294,"score_spread":0.24694203604467047,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2536650897","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.18805625,0.0003775081,0.7902195,0.00024154804,0.000061780556,0.000083442465,0.00028488605,0.01680291,0.0038722653],"genre_scores_gemma":[0.81019217,0.00015522675,0.18648489,0.000092845745,0.000017787952,0.000065775865,0.00030457816,0.0005815624,0.0021052533],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9995115,0.00015139987,0.000018116276,0.000070093934,0.00019935195,0.000049588423],"domain_scores_gemma":[0.99825543,0.0007860666,0.00019565066,0.00046378197,0.00024920577,0.000049878094],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00066084287,0.0008462552,0.00057512126,0.00072831725,0.0005582679,0.00075360126,0.0013301382,0.0006976005,0.0033039546],"category_scores_gemma":[0.003233211,0.0005763032,0.0005863011,0.00047603645,0.00053366716,0.0017696501,0.000867306,0.0009956439,0.0005825781],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022366777,0.00011523052,0.007492228,0.00016095197,0.00009875326,0.00018789968,0.00013628691,0.83886945,0.020971833,0.0097150365,0.0037361046,0.11829261],"study_design_scores_gemma":[0.00000744088,0.000023824898,0.00038161466,0.000004746543,0.0000047490557,0.000018557983,0.000011009804,0.9925264,0.0040544495,0.0024713262,0.000490405,0.0000055562664],"about_ca_topic_score_codex":0.005681924,"about_ca_topic_score_gemma":0.008629385,"teacher_disagreement_score":0.005681924,"about_ca_system_score_codex":0.00086882006,"about_ca_system_score_gemma":0.0014921773,"threshold_uncertainty_score":0.011297703},"labels":[],"label_agreement":null},{"id":"W2582843339","doi":"10.1007/s10836-016-5639-4","title":"Fast and Automated Electromigration Analysis for CMOS RF PA Design","year":2017,"lang":"en","type":"article","venue":"Journal of Electronic Testing","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"National Natural Science Foundation of China","keywords":"Reliability (semiconductor); Electromigration; Parametric statistics; Electronic engineering; CMOS; Process (computing); Parametric model; Sampling (signal processing); Engineering; Power (physics); Radio frequency; Computer science; Electrical engineering","score_opus":0.04114188414690397,"score_gpt":0.30825217548876577,"score_spread":0.2671102913418618,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2582843339","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.12869464,0.00060032256,0.85800445,0.00014893472,0.000044606335,0.00009141433,0.00024317157,0.008133402,0.004039216],"genre_scores_gemma":[0.7711134,0.00015619758,0.22445141,0.00007107697,0.00003111357,0.000083824656,0.00027517317,0.0003351693,0.0034827436],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99971396,0.00007125777,0.000013111115,0.000036357404,0.00013265583,0.000032665244],"domain_scores_gemma":[0.9992091,0.00037270613,0.00008864784,0.00011242928,0.00020106841,0.00001611533],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021793204,0.0008180341,0.00036555293,0.0009773048,0.00033441372,0.0005899685,0.0006882505,0.00037123237,0.0036466173],"category_scores_gemma":[0.0010461585,0.00033079198,0.00028267907,0.0003605806,0.00018019116,0.00068451016,0.00043048873,0.0003836698,0.00078391406],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003866503,0.000177143,0.004524172,0.0002587913,0.00017004025,0.00029067535,0.00015028614,0.13333608,0.31064215,0.006943649,0.006222232,0.5368982],"study_design_scores_gemma":[0.000029467861,0.0002590679,0.0027147923,0.000015479633,0.000052895855,0.0002364863,0.00004970319,0.8996809,0.08715975,0.0043525076,0.005426038,0.000022883396],"about_ca_topic_score_codex":0.0013331986,"about_ca_topic_score_gemma":0.0033396534,"teacher_disagreement_score":0.0036466173,"about_ca_system_score_codex":0.00041995363,"about_ca_system_score_gemma":0.0007336323,"threshold_uncertainty_score":0.012199104},"labels":[],"label_agreement":null},{"id":"W2583201768","doi":"10.1557/proc-721-j5.6","title":"Influence of Line-Width on Microstructure and Texture of Damascene Copper Interconnects","year":2002,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Misorientation; Materials science; Grain boundary; Pole figure; Microstructure; Grain size; Transverse plane; Texture (cosmology); Condensed matter physics; Full width at half maximum; Optics; Composite material; Physics; Optoelectronics","score_opus":0.010852490984004669,"score_gpt":0.22779610696492683,"score_spread":0.21694361598092216,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2583201768","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9986879,0.0002013885,0.00027249943,0.000016452352,0.0000059382355,0.0000023150997,0.000042805157,0.000020444842,0.0007502784],"genre_scores_gemma":[0.9994205,0.0000735358,0.00014947179,0.0000070393653,0.0000035081596,0.0000015640488,0.000029832669,0.000014154369,0.0003004362],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999224,0.000008778416,0.000004133978,0.00001471759,0.000023776614,0.000026193513],"domain_scores_gemma":[0.99957687,0.00012344065,0.00013761452,0.00003465948,0.00006163636,0.000065855864],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011057384,0.00014691785,0.00017249753,0.00017344802,0.00026677275,0.0004715718,0.00018159064,0.00014724997,0.0014051562],"category_scores_gemma":[0.0005694689,0.00020219208,0.00006425027,0.00024037572,0.00022514677,0.00025532756,0.00015823467,0.0001989102,0.0001657931],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00048411704,0.00003418051,0.00095130043,0.000032571817,0.000007788669,0.00011386758,0.00005127889,0.0010540409,0.9954325,0.00011035414,0.00006202639,0.0016658442],"study_design_scores_gemma":[0.000042655618,0.000548537,0.014498408,0.0000060353427,0.000023807177,0.00011064901,0.00009601963,0.004553431,0.97927105,0.00005497892,0.0007823378,0.000012117079],"about_ca_topic_score_codex":0.0013502924,"about_ca_topic_score_gemma":0.002877166,"teacher_disagreement_score":0.0014051562,"about_ca_system_score_codex":0.00028839245,"about_ca_system_score_gemma":0.0001728957,"threshold_uncertainty_score":0.0047007203},"labels":[],"label_agreement":null},{"id":"W2592122550","doi":"10.1103/physrevapplied.7.024032","title":"Role of Stress-Driven Interfacial Instability in the Failure of Confined Electric Interconnects","year":2017,"lang":"en","type":"article","venue":"Physical Review Applied","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Compute Canada","keywords":"Electromigration; Instability; Materials science; Breakage; Interconnection; Stress (linguistics); Dielectric; Engineering physics; Composite material; Mechanics; Nanotechnology; Optoelectronics; Computer science; Physics; Telecommunications","score_opus":0.015260709571262004,"score_gpt":0.2944009128838825,"score_spread":0.27914020331262046,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2592122550","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95375043,0.01822338,0.0138071,0.0011317076,0.0002715883,0.000040703468,0.00005138398,0.00011501308,0.012608651],"genre_scores_gemma":[0.9954668,0.0023635533,0.0005704103,0.00006338273,0.000068766465,0.000008623204,0.000011369892,0.0000056111135,0.0014415288],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999236,0.000017163866,0.000006562534,0.000015810165,0.00001815634,0.000018807707],"domain_scores_gemma":[0.9997173,0.00012358533,0.000054003158,0.000019192717,0.000057022822,0.000028975192],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00030824606,0.00029107352,0.00027862217,0.00040063437,0.00055754464,0.00081869576,0.0003659954,0.00070155907,0.0012896612],"category_scores_gemma":[0.0004984166,0.00015819076,0.00020580087,0.00012826441,0.000707843,0.0006821895,0.00043104845,0.0003763743,0.00020194353],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0009268781,0.00030227893,0.009094566,0.00078130467,0.000117047486,0.0049034776,0.0009851438,0.018539116,0.82941425,0.07861362,0.0018367475,0.054485552],"study_design_scores_gemma":[0.0003161217,0.0035145578,0.039890368,0.00025080203,0.0003102073,0.004729463,0.0016351212,0.18508573,0.62693167,0.10626347,0.030752735,0.00031973704],"about_ca_topic_score_codex":0.00030994404,"about_ca_topic_score_gemma":0.0003329885,"teacher_disagreement_score":0.0012896612,"about_ca_system_score_codex":0.00037116598,"about_ca_system_score_gemma":0.00021660517,"threshold_uncertainty_score":0.004314363},"labels":[],"label_agreement":null},{"id":"W2604397886","doi":"10.1116/1.4979709","title":"Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applications","year":2017,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":22,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Canadian Light Source (Canada)","funders":"Division of Materials Research; National Institute of General Medical Sciences; Western Economic Diversification Canada; Natural Sciences and Engineering Research Council of Canada; Canadian Institutes of Health Research; National Research Council Canada; Canada Foundation for Innovation; National Science Foundation; National Institutes of Health; University of Saskatchewan; Canadian Light Source","keywords":"Materials science; Overlayer; Diffusion barrier; Atomic layer deposition; Silicide; Barrier layer; Ruthenium; Tantalum nitride; Tin; Chemical engineering; Annealing (glass); Chemical vapor deposition; Crystallinity; Nitride; Nanotechnology; Layer (electronics); Optoelectronics; Composite material; Metallurgy; Chemistry","score_opus":0.016172453726377763,"score_gpt":0.29118334616042146,"score_spread":0.2750108924340437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2604397886","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97420645,0.0046246783,0.014676851,0.00013546993,0.00012024427,0.000044445136,0.0002615551,0.00041816916,0.0055122455],"genre_scores_gemma":[0.9822488,0.0017601933,0.013179757,0.000035902085,0.000012402353,0.00001930248,0.00017601873,0.000038238348,0.0025294526],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999293,0.000006756145,0.0000042917322,0.000014910847,0.00002876532,0.000015970312],"domain_scores_gemma":[0.9999093,0.00001492738,0.0000308498,0.000018118148,0.000019548826,0.000007289636],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000107995686,0.00022680039,0.00015080348,0.00017702917,0.00011851406,0.0002786389,0.00036602316,0.00024689696,0.0010202738],"category_scores_gemma":[0.00014412896,0.00021667253,0.00018144975,0.00011819997,0.000073094074,0.00026231885,0.00018243564,0.00026842934,0.00049075653],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011959155,0.000006323862,0.00014221996,0.000058218073,0.0000047206427,0.000059843693,0.0000137566485,0.00014280927,0.99741083,0.00010175213,0.00008672069,0.001960757],"study_design_scores_gemma":[0.000005539522,0.00016973609,0.001749363,0.000007532693,0.000014835136,0.00016597549,0.000020441681,0.0020305268,0.9914131,0.00004001531,0.0043745963,0.000008343403],"about_ca_topic_score_codex":0.00048799947,"about_ca_topic_score_gemma":0.0015324004,"teacher_disagreement_score":0.0010202738,"about_ca_system_score_codex":0.00025524918,"about_ca_system_score_gemma":0.00017212785,"threshold_uncertainty_score":0.0034132004},"labels":[],"label_agreement":null},{"id":"W2621372888","doi":"10.1149/ma2006-01/10/411","title":"Copper Resistivity in Electrodeposited Dual Damascene Interconnects - An Integrated Circuit Perspective","year":2006,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Copper interconnect; Copper; Dual (grammatical number); Materials science; Electrical resistivity and conductivity; Interconnection; Perspective (graphical); Copper wire; Metallurgy; Electrical engineering; Engineering physics; Composite material; Engineering; Computer science; Telecommunications; Art","score_opus":0.014579624805372875,"score_gpt":0.25545355231632544,"score_spread":0.24087392751095257,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2621372888","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.925648,0.016942268,0.020477518,0.0018807002,0.0003447668,0.00003421688,0.0002839904,0.00036945593,0.03401921],"genre_scores_gemma":[0.9921274,0.0020673005,0.0022168579,0.00004457166,0.000051399216,0.0000081195785,0.00004879071,0.000024067755,0.003411495],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99984515,0.000022219527,0.0000038725775,0.000031613945,0.00006922125,0.00002798464],"domain_scores_gemma":[0.99985147,0.00007114628,0.000022559248,0.00001779814,0.000029279965,0.000007700457],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018526355,0.00019782606,0.00023043771,0.00024477995,0.0002377801,0.0008050185,0.0006297274,0.00053767825,0.0014475927],"category_scores_gemma":[0.00053921924,0.0002459405,0.00007853189,0.0003463845,0.0004741148,0.00078169414,0.00023681603,0.00043163705,0.00022112927],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00032562102,0.000064559776,0.0005288338,0.00032587993,0.000016336115,0.00063489773,0.00017522878,0.0059494516,0.9603047,0.016555889,0.0012773459,0.013841375],"study_design_scores_gemma":[0.0000316906,0.0006241684,0.0023503215,0.000032361593,0.000037605787,0.00031482885,0.00018874813,0.02290969,0.9572446,0.002807305,0.013435939,0.000022659506],"about_ca_topic_score_codex":0.0006107189,"about_ca_topic_score_gemma":0.0009896453,"teacher_disagreement_score":0.0014475927,"about_ca_system_score_codex":0.00066614844,"about_ca_system_score_gemma":0.00012238645,"threshold_uncertainty_score":0.004842639},"labels":[],"label_agreement":null},{"id":"W2626864102","doi":"","title":"Parallelized FMM and Dedicated PEEC Method to Model Industrial Power Interconnections - Application to Boost Chopper","year":2011,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Center for Diagnosis and Research on Alzheimer's Disease","funders":"","keywords":"Chopper; Computer science; Power (physics); Electronic engineering; Electrical engineering; Engineering; Voltage; Physics","score_opus":0.02958489217375302,"score_gpt":0.2734088464919442,"score_spread":0.24382395431819118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2626864102","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.08628963,0.0006750954,0.8950248,0.00022746292,0.00013427073,0.00012932184,0.0003475771,0.00076738285,0.016404433],"genre_scores_gemma":[0.8758322,0.0003031366,0.11103552,0.00008492685,0.00006161073,0.00028219566,0.00021058983,0.00031562173,0.011874182],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99988925,0.00004492023,0.0000040480986,0.000020043834,0.000025380199,0.000016328268],"domain_scores_gemma":[0.99943024,0.0003007338,0.000050649807,0.000061285806,0.0001300985,0.000027014132],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041262558,0.0008234968,0.0008133395,0.00043864877,0.00042937996,0.0004874116,0.0011499658,0.0015368132,0.0044603143],"category_scores_gemma":[0.001288518,0.00041521958,0.00064618635,0.00045148315,0.00054865936,0.00052790495,0.000386362,0.0010775344,0.00035812735],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020691912,0.000016810762,0.00009353525,0.00002677066,0.000007904491,0.000036251906,0.0000129913915,0.9927489,0.0007626284,0.0038615249,0.00021738868,0.0021945043],"study_design_scores_gemma":[0.0000024796122,0.0000026282505,0.000019870251,0.0000010197041,0.0000011328247,0.0000023195225,0.0000012975715,0.9993875,0.00009962328,0.00038127115,0.000100171834,6.9510793e-7],"about_ca_topic_score_codex":0.011855909,"about_ca_topic_score_gemma":0.009080591,"teacher_disagreement_score":0.011855909,"about_ca_system_score_codex":0.00072128605,"about_ca_system_score_gemma":0.0008061082,"threshold_uncertainty_score":0.023573756},"labels":[],"label_agreement":null},{"id":"W2724566967","doi":"","title":"Thin dielectric films with low dielectric constants for quarter micron devices","year":2009,"lang":"en","type":"dissertation","venue":"DR-NTU (Nanyang Technological University)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Dielectric; Materials science; Quarter (Canadian coin); High-κ dielectric; Optoelectronics; Engineering physics; Electrical engineering; Engineering; Geography","score_opus":0.00699865017722182,"score_gpt":0.21113575740149826,"score_spread":0.20413710722427644,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2724566967","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.45841226,0.1742129,0.07326753,0.008891821,0.0050745816,0.0004287194,0.0017268275,0.0017628815,0.27622247],"genre_scores_gemma":[0.5476627,0.10040279,0.057868164,0.0008055068,0.0004901985,0.0002697338,0.0013098335,0.00038810968,0.29080307],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99997044,0.0000020964742,0.000001443594,0.000005601816,0.000014983505,0.0000054190327],"domain_scores_gemma":[0.9999548,0.0000062845493,0.0000073572546,0.000006408238,0.000017113049,0.000007937031],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000102743215,0.00024358864,0.0001114564,0.00024090482,0.00030780467,0.00046592095,0.00020868322,0.00025251973,0.009897269],"category_scores_gemma":[0.00016414242,0.00026746982,0.00010248371,0.00018814656,0.000087319284,0.0003772162,0.00017830054,0.0006379356,0.003487956],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010940227,0.00011423304,0.0002241755,0.0010064696,0.000013883625,0.0002577819,0.0002720617,0.00090023817,0.8299726,0.013677585,0.02508437,0.12836713],"study_design_scores_gemma":[0.00005594857,0.00025646837,0.0015453288,0.0002032589,0.000026250815,0.0004999842,0.00013577745,0.0023575262,0.5428305,0.005771017,0.44629145,0.000026466445],"about_ca_topic_score_codex":0.00028538267,"about_ca_topic_score_gemma":0.0007965288,"teacher_disagreement_score":0.009897269,"about_ca_system_score_codex":0.00030732146,"about_ca_system_score_gemma":0.00022023226,"threshold_uncertainty_score":0.033109665},"labels":[],"label_agreement":null},{"id":"W2725365564","doi":"10.1299/jsmetohoku.2014.50.69","title":"323 Effect of Base Material on the Crystallinity of Electroplated Copper Thin Films","year":2014,"lang":"en","type":"article","venue":"The Proceedings of Autumn Conference of Tohoku Branch","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Geomechanica (Canada)","funders":"","keywords":"Copper; Electroplating; Crystallinity; Materials science; Base (topology); Metallurgy; Thin film; Composite material; Nanotechnology; Layer (electronics); Mathematics","score_opus":0.01390261383869407,"score_gpt":0.22925856023690191,"score_spread":0.21535594639820785,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2725365564","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99785393,0.00049031683,0.00020268849,0.00003101808,0.000018804663,0.000004787606,0.00008445076,0.000018083889,0.0012958419],"genre_scores_gemma":[0.998993,0.00022806624,0.00021417612,0.000013363252,0.0000060609163,0.0000044438034,0.00007262098,0.000021224861,0.00044706085],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998877,0.000013411188,0.0000094644465,0.00002821391,0.000036622932,0.000024657404],"domain_scores_gemma":[0.99973434,0.00011152074,0.000049938415,0.000021879277,0.000053524156,0.00002876528],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001399931,0.00017223803,0.00019948551,0.00019109355,0.00019496513,0.0003332451,0.00018853211,0.00017729524,0.0017371948],"category_scores_gemma":[0.00045571494,0.0002559835,0.00010628111,0.00022821622,0.00018411115,0.00020225222,0.00012776892,0.00032750278,0.00022183372],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00023541071,0.000010820438,0.00048838655,0.000036645026,0.0000062525423,0.00008931034,0.000051150288,0.00007966755,0.9980609,0.000035880534,0.000050987182,0.00085447583],"study_design_scores_gemma":[0.0000059021836,0.00008676985,0.0027460728,0.0000037125797,0.0000100834195,0.000028308008,0.000029512044,0.00033569577,0.9964982,0.000005934366,0.00024683092,0.0000028827833],"about_ca_topic_score_codex":0.0010075859,"about_ca_topic_score_gemma":0.0015555115,"teacher_disagreement_score":0.0017371948,"about_ca_system_score_codex":0.00022616897,"about_ca_system_score_gemma":0.0001442882,"threshold_uncertainty_score":0.0058115125},"labels":[],"label_agreement":null},{"id":"W2761711607","doi":"10.1139/cjp-2017-0484","title":"Electrical resistivity of gold thin film as a function of film thickness","year":2017,"lang":"en","type":"article","venue":"Canadian Journal of Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":39,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Electrical resistivity and conductivity; Thin film; Condensed matter physics; Function (biology); Physics; Composite material; Materials science; Nanotechnology","score_opus":0.018816820514383138,"score_gpt":0.2510574208077511,"score_spread":0.232240600293368,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2761711607","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9840524,0.0013886986,0.0030676837,0.00033911294,0.00009830308,0.000018818202,0.00090309244,0.0004255697,0.0097063165],"genre_scores_gemma":[0.9943725,0.0009076967,0.0017357772,0.000059440365,0.000020233829,0.000018429613,0.00033088736,0.000030190897,0.0025248087],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997838,0.000029764667,0.000009371335,0.000045065364,0.00008956953,0.000042322157],"domain_scores_gemma":[0.9988965,0.0006383231,0.0001518407,0.00009592084,0.0001770737,0.000040355128],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019624757,0.00032495777,0.0002722021,0.00037270537,0.00020428434,0.00039538593,0.00032921514,0.00044681338,0.0024502175],"category_scores_gemma":[0.00097456924,0.00025099624,0.00010435972,0.00060418056,0.00035800072,0.000470203,0.00017487002,0.0007007051,0.00045586485],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00025231772,0.000065997636,0.002231424,0.00023453175,0.000036605048,0.0005257319,0.00039192638,0.003138524,0.9834419,0.00070545403,0.0007370947,0.008238557],"study_design_scores_gemma":[0.000037739803,0.0007369383,0.019564198,0.00007277785,0.000052827527,0.00060616026,0.00045855262,0.014050203,0.96042967,0.00050010066,0.003446557,0.000044289332],"about_ca_topic_score_codex":0.0008482344,"about_ca_topic_score_gemma":0.0008304272,"teacher_disagreement_score":0.0024502175,"about_ca_system_score_codex":0.00025576295,"about_ca_system_score_gemma":0.00017654385,"threshold_uncertainty_score":0.008196831},"labels":[],"label_agreement":null},{"id":"W2762098545","doi":"10.1364/oe.25.026124","title":"Aperiodic nature of nanograting inscribed by femtosecond pulses","year":2017,"lang":"en","type":"article","venue":"Optics Express","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Fonds de recherche du Québec – Nature et technologies; Natural Sciences and Engineering Research Council of Canada; Canada Foundation for Innovation","keywords":"Quasiperiodic function; Optics; Aperiodic graph; Inscribed figure; Femtosecond; Groove (engineering); Pulse (music); Quasicrystal; Amplitude; Apodization; Dielectric; Physics; Materials science; Geometry; Mathematics; Laser; Optoelectronics; Condensed matter physics","score_opus":0.012591444754167696,"score_gpt":0.2715321367564544,"score_spread":0.2589406920022867,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2762098545","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99306256,0.0002146795,0.005816043,0.0000086011705,0.0000035859116,0.000008020247,0.000023499822,0.000022835706,0.00084021577],"genre_scores_gemma":[0.9974535,0.00007502988,0.002234216,0.0000024204792,0.0000015102662,0.000004598926,0.000022156824,0.0000059025256,0.0002006162],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991107,0.000008308384,0.0000046258383,0.000023762968,0.000038389706,0.000013780062],"domain_scores_gemma":[0.9996915,0.0001231573,0.000079777616,0.00004926313,0.000040707662,0.000015678314],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001289053,0.00011899509,0.00009572103,0.0001679481,0.00014477567,0.00018088592,0.00015517534,0.00016196471,0.00035650164],"category_scores_gemma":[0.00033656467,0.00013452554,0.00007424639,0.00012456972,0.00036663847,0.00018210545,0.00009144489,0.00020093289,0.000040553914],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029788767,0.000009300525,0.0012494301,0.000048118305,0.000004396903,0.00009376263,0.000075816744,0.0009828348,0.99410087,0.00076726405,0.000011450056,0.0026269362],"study_design_scores_gemma":[0.000009684344,0.00022623806,0.017021567,0.000006631666,0.000011410859,0.00039480368,0.00008425856,0.013343859,0.96746397,0.0006072185,0.0008210328,0.000009266273],"about_ca_topic_score_codex":0.00021113374,"about_ca_topic_score_gemma":0.00027903848,"teacher_disagreement_score":0.00035650164,"about_ca_system_score_codex":0.00021124267,"about_ca_system_score_gemma":0.00012900232,"threshold_uncertainty_score":0.0015326738},"labels":[],"label_agreement":null},{"id":"W2801245496","doi":"10.1109/iscas.2018.8351507","title":"Electromigration and Parasitic-Aware ILP Router for Analog and RF Circuits","year":2018,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Electromigration; Parasitic extraction; Radio frequency; Electronic engineering; Interconnection; Electronic circuit; Router; Routing (electronic design automation); Computer science; Analogue electronics; Integer programming; Electrical engineering; Engineering; Telecommunications; Computer network; Algorithm","score_opus":0.01465050959956306,"score_gpt":0.2710560251966954,"score_spread":0.25640551559713237,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2801245496","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.011191344,0.00016693973,0.9856296,0.000082286155,0.000020422822,0.000024113195,0.000019923584,0.00039247586,0.002472779],"genre_scores_gemma":[0.42518473,0.00026000172,0.57003695,0.00016717285,0.000038051014,0.000119365206,0.00010920679,0.00011653219,0.003968012],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998204,0.00005903188,0.0000075648622,0.00003758806,0.000050363375,0.00002508264],"domain_scores_gemma":[0.9998443,0.00006720014,0.000033429984,0.00001877054,0.000028355187,0.000007974703],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00026832495,0.0005827881,0.0003632587,0.0003006344,0.00023938676,0.00044383042,0.0007628004,0.0004276141,0.002126108],"category_scores_gemma":[0.00044665797,0.00022675865,0.00037213266,0.00032974003,0.00022914857,0.00063639466,0.00042176645,0.00059025176,0.0002652801],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009475016,0.000121700374,0.0007653476,0.00026021322,0.00005179235,0.00023162787,0.00007452524,0.766538,0.041306365,0.017682385,0.003134088,0.16973917],"study_design_scores_gemma":[0.0000048425077,0.000044175016,0.000051213672,0.000004412022,0.000011733266,0.00005109932,0.000007851272,0.9931346,0.0041902936,0.0013848644,0.0011110953,0.0000037395703],"about_ca_topic_score_codex":0.0005320135,"about_ca_topic_score_gemma":0.0012265992,"teacher_disagreement_score":0.002126108,"about_ca_system_score_codex":0.0003567505,"about_ca_system_score_gemma":0.00046905898,"threshold_uncertainty_score":0.007112503},"labels":[],"label_agreement":null},{"id":"W2803662606","doi":"10.1149/ma2018-01/22/1376","title":"Cu/Cu Barrier Interconnect with Low Resistivity for the Application to the Next-Generation and High-Resolution Display Fabricated Using Microwave-Assisted Sputter","year":2018,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Kootenay Association for Science & Technology","funders":"","keywords":"Materials science; Capacitance; Interconnection; Optoelectronics; Resistor; Electrical resistivity and conductivity; Capacitor; Electrical engineering; SIGNAL (programming language); Microwave; Electrode; Computer science; Voltage; Telecommunications; Physics; Engineering","score_opus":0.034041549135702724,"score_gpt":0.2699488834718074,"score_spread":0.23590733433610467,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2803662606","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.756477,0.028626807,0.14739993,0.0022843874,0.0022637392,0.0003923278,0.0016121713,0.0076892846,0.05325437],"genre_scores_gemma":[0.9292591,0.0041813804,0.05002995,0.00027825692,0.00017718878,0.00023657332,0.000780705,0.00026212414,0.0147946365],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99979585,0.000019967749,0.000009973211,0.00004462306,0.00008615572,0.00004335174],"domain_scores_gemma":[0.9995946,0.0000257982,0.00010911095,0.00005095938,0.00018201857,0.000037353075],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016143879,0.00056732545,0.0003567337,0.0008315702,0.00056298403,0.0005846655,0.00076889613,0.0005749681,0.0020619123],"category_scores_gemma":[0.0006836587,0.0002891821,0.00024349295,0.001245103,0.00018725492,0.0008481903,0.00036971102,0.0004999635,0.001274608],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021059622,0.00013967218,0.0021781726,0.0016102445,0.00008476564,0.001847256,0.00033262218,0.0025730336,0.90397346,0.0059491587,0.022389648,0.05871135],"study_design_scores_gemma":[0.00007417483,0.0010311251,0.0054885326,0.00015434525,0.00017653478,0.0020420377,0.00034885804,0.02758102,0.8401874,0.0009590267,0.121873766,0.000083089064],"about_ca_topic_score_codex":0.0022080757,"about_ca_topic_score_gemma":0.003775826,"teacher_disagreement_score":0.0022080757,"about_ca_system_score_codex":0.0007372283,"about_ca_system_score_gemma":0.00058394845,"threshold_uncertainty_score":0.0068977475},"labels":[],"label_agreement":null},{"id":"W2808261674","doi":"10.1109/tvlsi.2018.2839698","title":"Electromigration- and Parasitic-Aware ILP-Based Analog Router","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"Natural Sciences and Engineering Research Council of Canada; Memorial University of Newfoundland; Research and Development Corporation of Newfoundland and Labrador; Canada Foundation for Innovation","keywords":"Parasitic extraction; Routing (electronic design automation); Computer science; Electromigration; Router; Integer programming; Interconnection; Electronic engineering; Electronic circuit; Sensitivity (control systems); Radio frequency; Analogue electronics; Computer engineering; Algorithm; Electrical engineering; Engineering; Computer network; Telecommunications","score_opus":0.010740142439606673,"score_gpt":0.2511543537369035,"score_spread":0.24041421129729681,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2808261674","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.018545853,0.00014330898,0.9757506,0.000078782105,0.000023580711,0.000031560918,0.00003072807,0.0006975359,0.0046980833],"genre_scores_gemma":[0.5859373,0.00017956065,0.40875185,0.00014760243,0.000029925772,0.00008936947,0.000110131674,0.00011991138,0.0046344534],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9997651,0.000050932944,0.000011508688,0.00005077881,0.00009088459,0.000030707342],"domain_scores_gemma":[0.9998047,0.000057804013,0.00004164793,0.0000346726,0.00005021032,0.000011110558],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000261519,0.0005661748,0.00040290694,0.00039619466,0.00025194063,0.00054251374,0.0011640842,0.00037218168,0.0020925615],"category_scores_gemma":[0.0004191993,0.00025391346,0.0003911285,0.00031191265,0.00026361807,0.00057495956,0.0005319308,0.00039069567,0.00035995585],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008476738,0.000073562245,0.00054120977,0.00015059025,0.000041844647,0.00014319434,0.000054249776,0.8286712,0.0493244,0.008968308,0.0019263632,0.110020354],"study_design_scores_gemma":[0.0000070745746,0.0000419498,0.000060883758,0.0000038598982,0.00001471459,0.000038900627,0.0000061503733,0.9922671,0.0056235404,0.0010228124,0.0009081323,0.000004898788],"about_ca_topic_score_codex":0.000805271,"about_ca_topic_score_gemma":0.0015143321,"teacher_disagreement_score":0.0020925615,"about_ca_system_score_codex":0.0004982128,"about_ca_system_score_gemma":0.0005374766,"threshold_uncertainty_score":0.007000327},"labels":[],"label_agreement":null},{"id":"W2887351321","doi":"10.1557/proc-863-b9.7","title":"Characterization of Temporary Extrusion Failures in Quarter-Micron Copper Interconnects","year":2005,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Extrusion; Electromigration; Copper interconnect; Failure mode and effects analysis; Void (composites); Copper; Dissolution; Composite material; Metallurgy","score_opus":0.009281660038167092,"score_gpt":0.23020862835280406,"score_spread":0.22092696831463698,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2887351321","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9967013,0.00021184747,0.0024580958,0.000013244192,0.0000074321106,0.000009672983,0.000082022525,0.000071238625,0.00044504975],"genre_scores_gemma":[0.9976272,0.00006008705,0.0011987536,0.000008992765,0.0000037036973,0.000010197205,0.00015196697,0.000023293402,0.0009158268],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997075,0.000031119354,0.00001646783,0.000057162735,0.00012514635,0.000062584906],"domain_scores_gemma":[0.99902904,0.00018709296,0.00022800948,0.00019362413,0.00031939178,0.000042727792],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029853053,0.00022486616,0.0003865484,0.0005679403,0.00046485598,0.00032685805,0.00044379258,0.0005070804,0.0013434042],"category_scores_gemma":[0.0007793323,0.00016525631,0.0001732368,0.0004652069,0.0005018629,0.0004610812,0.00021672604,0.00027522954,0.00021503141],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008335612,0.000057441306,0.008020493,0.00012188956,0.0000153919,0.0005548406,0.0005468977,0.0011588379,0.9780989,0.00017643142,0.00033265774,0.010082624],"study_design_scores_gemma":[0.000024436726,0.0019275555,0.08353832,0.000015319525,0.00003732358,0.0013731116,0.00058549567,0.007677773,0.9017063,0.00007644744,0.0030103629,0.000027702561],"about_ca_topic_score_codex":0.00073601597,"about_ca_topic_score_gemma":0.0014190327,"teacher_disagreement_score":0.0013434042,"about_ca_system_score_codex":0.00025908265,"about_ca_system_score_gemma":0.0001735074,"threshold_uncertainty_score":0.0044941306},"labels":[],"label_agreement":null},{"id":"W2907399282","doi":"10.1002/pssa.201800728","title":"Characteristics of Ultrathin Ni Films","year":2019,"lang":"en","type":"article","venue":"physica status solidi (a)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Ministero degli Affari Esteri e della Cooperazione Internazionale","keywords":"Materials science; X-ray reflectivity; Refractive index; Thin film; Molar absorptivity; X-ray photoelectron spectroscopy; Sputtering; Ellipsometry; Nickel; Optics; Metal; Reflection (computer programming); Oxide; Optoelectronics; Analytical Chemistry (journal); Metallurgy; Chemical engineering; Nanotechnology; Chemistry","score_opus":0.009669618505424618,"score_gpt":0.24753128631735913,"score_spread":0.23786166781193452,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2907399282","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9735448,0.0019632871,0.005904489,0.00020027187,0.000059109483,0.000036662765,0.0009004185,0.0002795919,0.017111477],"genre_scores_gemma":[0.9907464,0.0006863088,0.0023610964,0.000039728253,0.000020508161,0.000042060834,0.00063685735,0.000046071164,0.0054208688],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998945,0.0000046154814,0.0000065573136,0.00002711919,0.000046640278,0.000020641699],"domain_scores_gemma":[0.9996637,0.00008027238,0.000075354284,0.000044301625,0.00010350302,0.000032817974],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000089176545,0.00025223216,0.0001962124,0.00028498462,0.00023299098,0.0004273963,0.00024252449,0.00025996624,0.0029667474],"category_scores_gemma":[0.00039694377,0.00014442916,0.00010276546,0.0003636856,0.00013450156,0.00031935272,0.0001988719,0.0003291866,0.00051174086],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009844124,0.0000106364605,0.0008980559,0.00008355014,0.0000073639653,0.00016189435,0.00013327866,0.00016233002,0.99223185,0.00021610786,0.00028311834,0.0057134014],"study_design_scores_gemma":[0.0000095972955,0.00018613762,0.014391141,0.000025935791,0.000025888741,0.00072587206,0.00015594858,0.0023865367,0.9697911,0.0001225345,0.012164566,0.000014777176],"about_ca_topic_score_codex":0.00088118,"about_ca_topic_score_gemma":0.00065518066,"teacher_disagreement_score":0.0029667474,"about_ca_system_score_codex":0.0002701995,"about_ca_system_score_gemma":0.00011109616,"threshold_uncertainty_score":0.009924829},"labels":[],"label_agreement":null},{"id":"W2921972586","doi":"10.6000/2369-3355.2018.05.03.1","title":"New Simple Modification of Dip, Spray and Cathodic Electrodeposition Coating Methods for Wire Coating (3D Coating)","year":2018,"lang":"en","type":"article","venue":"Journal of Coating Science and Technology","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Coating; Cathodic protection; Materials science; Dip-coating; Composite material; Metallurgy; Electrochemistry; Chemistry; Electrode","score_opus":0.021933020620744877,"score_gpt":0.3578377713867886,"score_spread":0.3359047507660437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2921972586","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.39503673,0.038928714,0.53573346,0.00057546055,0.0017116553,0.00069762877,0.0010241964,0.0028436661,0.023448516],"genre_scores_gemma":[0.6082456,0.012952703,0.3578901,0.0003955078,0.00016256969,0.0004434347,0.0009553557,0.00031452804,0.018640202],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994149,0.000034401175,0.00004197615,0.00014153932,0.00032956587,0.000037653383],"domain_scores_gemma":[0.99972886,0.000041903964,0.00005397814,0.000063970605,0.00008987683,0.000021452783],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028560916,0.00076147064,0.0004029277,0.0007576297,0.000253055,0.0004995436,0.0006749401,0.0006872313,0.0014286675],"category_scores_gemma":[0.0005147144,0.00038835345,0.0004776134,0.00055040326,0.0002884909,0.0004338701,0.00038064073,0.0009785541,0.00076804106],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000037261027,0.000033572127,0.00037014263,0.00056137145,0.000035356443,0.00016607944,0.000065081455,0.00025415883,0.95375425,0.0008037272,0.000659154,0.043259837],"study_design_scores_gemma":[0.000011837412,0.00020678893,0.002744639,0.000020559992,0.00004951876,0.0015973987,0.000027276557,0.0030583176,0.96016616,0.00013429795,0.03194085,0.00004242675],"about_ca_topic_score_codex":0.000851237,"about_ca_topic_score_gemma":0.0020311996,"teacher_disagreement_score":0.0014286675,"about_ca_system_score_codex":0.0003446412,"about_ca_system_score_gemma":0.00028840677,"threshold_uncertainty_score":0.004779339},"labels":[],"label_agreement":null},{"id":"W2942656638","doi":"10.5006/c2018-11023","title":"Effect of Soil and Disbondment Configuration on CP Penetration into Coating Disbondment","year":2018,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Natural Resources Canada","funders":"","keywords":"Penetration (warfare); Coating; Materials science; Composite material; Engineering","score_opus":0.007851708352016241,"score_gpt":0.27441353222589865,"score_spread":0.2665618238738824,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2942656638","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99809605,0.00042494078,0.0009093137,0.0000107760325,0.000012086655,0.000023673281,0.00007419376,0.00002099722,0.00042803356],"genre_scores_gemma":[0.9971679,0.00035346343,0.0014918261,0.000022809369,0.0000041950066,0.000013421346,0.000086478336,0.0000161476,0.00084383285],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995499,0.00007796701,0.000040001076,0.00009217852,0.00015026583,0.00008959906],"domain_scores_gemma":[0.9986817,0.0005211138,0.00023592092,0.00006543107,0.0003863968,0.00010937389],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00034224693,0.0007484141,0.00034896174,0.00031896876,0.00021029635,0.00036845612,0.00029579207,0.0004656794,0.00203785],"category_scores_gemma":[0.0010478147,0.00036067926,0.00026425396,0.000323262,0.00019400938,0.00041042911,0.00031936826,0.00045815867,0.0002520449],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040804563,0.000044985143,0.0021580714,0.00015625563,0.000022498803,0.0001404405,0.00010786766,0.00024002456,0.9920353,0.0000142788695,0.00003194232,0.004640366],"study_design_scores_gemma":[0.00001535804,0.0030079784,0.028597418,0.000018009046,0.000068172834,0.00019360718,0.00027593574,0.0011030305,0.9657304,0.00001676153,0.0009574333,0.000015844485],"about_ca_topic_score_codex":0.0015434318,"about_ca_topic_score_gemma":0.0026112266,"teacher_disagreement_score":0.00203785,"about_ca_system_score_codex":0.00019942655,"about_ca_system_score_gemma":0.00016249591,"threshold_uncertainty_score":0.0068172812},"labels":[],"label_agreement":null},{"id":"W2953268685","doi":"10.1002/masy.200450511","title":"Synthesis and lithographic applications of highly metallized cluster‐based polyferrocenylsilanes","year":2004,"lang":"en","type":"article","venue":"Macromolecular Symposia","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Materials science; Resist; Reactive-ion etching; Etching (microfabrication); Ferromagnetism; Electron-beam lithography; Lithography; Ceramic; Cobalt; Photolithography; Pyrolytic carbon; Nanoparticle; Dry etching; Nanotechnology; Optoelectronics; Pyrolysis; Chemical engineering; Composite material; Metallurgy","score_opus":0.005219152369602254,"score_gpt":0.22348537557269155,"score_spread":0.2182662232030893,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2953268685","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9693298,0.0022292177,0.020468097,0.00018845052,0.00010347777,0.000088841494,0.00022677664,0.00041523474,0.0069501707],"genre_scores_gemma":[0.9769414,0.0008052137,0.019741938,0.000033826385,0.00002629542,0.000024982292,0.000120798235,0.000028450682,0.002277202],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999242,0.000007090837,0.0000060832517,0.000019008505,0.00002528469,0.000018302871],"domain_scores_gemma":[0.99986744,0.000033429867,0.000042868505,0.000023583536,0.000016012484,0.0000166938],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011743768,0.00032359932,0.00009000378,0.00021939163,0.0002118389,0.00020194142,0.00019704181,0.00020896239,0.0012973568],"category_scores_gemma":[0.0001720148,0.00017769956,0.00018270739,0.0001254931,0.00022419439,0.00020211845,0.000168033,0.00019448408,0.00032022866],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024914492,0.0000067409737,0.00005616367,0.00004098725,0.0000018774539,0.000098059696,0.000014720861,0.00013095695,0.99698776,0.00014987851,0.00004153265,0.00244631],"study_design_scores_gemma":[0.0000059859176,0.000068175286,0.00038927456,0.0000015656623,0.0000026118237,0.00011335323,0.0000059326153,0.00024424965,0.99784636,0.000022095694,0.0012980262,0.000002398617],"about_ca_topic_score_codex":0.00033442426,"about_ca_topic_score_gemma":0.0006762278,"teacher_disagreement_score":0.0012973568,"about_ca_system_score_codex":0.0002717167,"about_ca_system_score_gemma":0.00013565939,"threshold_uncertainty_score":0.004340112},"labels":[],"label_agreement":null},{"id":"W2988153346","doi":"","title":"Post-porosity Plasma protection (P4): a promising strategy against v-UV damage in porous, low-k materials","year":2015,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Porosity; Materials science; Plasma; Porous medium; Composite material; Chemical engineering; Engineering; Physics","score_opus":0.020144205247501552,"score_gpt":0.23954071069350133,"score_spread":0.21939650544599978,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2988153346","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9381653,0.0034360618,0.045336656,0.00048140096,0.0001638542,0.00009440852,0.00024511354,0.0010008068,0.011076363],"genre_scores_gemma":[0.99171937,0.000584037,0.0045923283,0.00006170245,0.000020359439,0.00002220405,0.000070039234,0.000052494597,0.0028775532],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999137,0.0000062546465,0.0000031867953,0.000024810139,0.000023608683,0.000028414654],"domain_scores_gemma":[0.99987495,0.000028694465,0.000041538286,0.000024003013,0.000020023293,0.000010797266],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012487882,0.0002650268,0.00025576734,0.0001201351,0.00031778254,0.0005705824,0.00052297075,0.000581211,0.0015853763],"category_scores_gemma":[0.00024773026,0.00015547956,0.0002460029,0.00012546618,0.00044671845,0.000606571,0.00044716793,0.00040844223,0.00035785418],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020377712,0.000028426539,0.00037059907,0.0002974399,0.000016998756,0.00015831283,0.00010233462,0.0010888847,0.9827948,0.0023986234,0.00049995154,0.01203981],"study_design_scores_gemma":[0.00001606281,0.00026151142,0.0008161652,0.000009640577,0.000011834941,0.00025663784,0.000057448084,0.0021199,0.9907245,0.0007599248,0.00495774,0.000008598943],"about_ca_topic_score_codex":0.0002862585,"about_ca_topic_score_gemma":0.00034120443,"teacher_disagreement_score":0.0015853763,"about_ca_system_score_codex":0.00022941439,"about_ca_system_score_gemma":0.00019877769,"threshold_uncertainty_score":0.0053035617},"labels":[],"label_agreement":null},{"id":"W2999864622","doi":"","title":"Interaction of humidity with plasma-damaged porous low-k","year":2018,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Humidity; Plasma; Materials science; Porosity; Composite material; Physics; Thermodynamics; Nuclear physics","score_opus":0.015225072285049825,"score_gpt":0.2410400876668896,"score_spread":0.2258150153818398,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2999864622","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978377,0.00020265003,0.00058564235,0.00004272289,0.000020699556,0.000006634475,0.0000682296,0.00003767324,0.0011980768],"genre_scores_gemma":[0.9992692,0.000048052654,0.00011458904,0.000009380851,0.00000331246,0.0000014134806,0.000029670578,0.0000067557426,0.00051761017],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997811,0.000017613655,0.0000062074696,0.000051766543,0.000064844084,0.00007846801],"domain_scores_gemma":[0.99981564,0.00007291418,0.000041423475,0.000022887869,0.00002736896,0.00001965208],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010917161,0.00013911458,0.00023571224,0.00012322361,0.0003719779,0.000475405,0.0003012714,0.0004053023,0.002426015],"category_scores_gemma":[0.0004305109,0.00013766828,0.00012764703,0.00015061982,0.00052892667,0.00040510856,0.00031903354,0.00027509913,0.0002553502],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0007136569,0.000027845255,0.0011044103,0.00010615227,0.00001671607,0.00035166368,0.00024147303,0.00085417036,0.99408937,0.0002696268,0.00017895721,0.0020460938],"study_design_scores_gemma":[0.000013765637,0.00014970894,0.0030969526,0.0000037710831,0.000008643603,0.00016149216,0.00017708441,0.0018530608,0.9934929,0.00005439407,0.0009800447,0.000008173942],"about_ca_topic_score_codex":0.0019113536,"about_ca_topic_score_gemma":0.0012317729,"teacher_disagreement_score":0.002426015,"about_ca_system_score_codex":0.00035783762,"about_ca_system_score_gemma":0.00012436131,"threshold_uncertainty_score":0.008115888},"labels":[],"label_agreement":null},{"id":"W3034467193","doi":"","title":"Charge ordering in quarter-filled ladder systems coupled to the lattice","year":2004,"lang":"en","type":"article","venue":"APS","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Quarter (Canadian coin); Charge (physics); Lattice (music); Physics; Condensed matter physics; Quantum mechanics; History","score_opus":0.01348259517256665,"score_gpt":0.24617560261098947,"score_spread":0.23269300743842283,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3034467193","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9514713,0.00040905,0.02205012,0.00043744635,0.00012545845,0.000025753683,0.000062617066,0.00036433394,0.025053933],"genre_scores_gemma":[0.9910652,0.00015388858,0.00453945,0.00008886696,0.000032358203,0.000027906115,0.000034908564,0.000043209384,0.0040142424],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.99979526,0.00005848205,0.000009117585,0.000019738867,0.00005821395,0.00005930616],"domain_scores_gemma":[0.9992729,0.00022094861,0.000092638744,0.00012664184,0.00011641019,0.00017052951],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00039444567,0.00025561522,0.0007163099,0.001174194,0.0011046628,0.001589116,0.0007884421,0.0009579869,0.0044179694],"category_scores_gemma":[0.0012539924,0.0003728418,0.00019378068,0.00094338687,0.0016092008,0.0012016944,0.00088295795,0.00060894445,0.00034794587],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":"theoretical_or_conceptual","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00062199635,0.00030847496,0.0016967622,0.00024057379,0.000049516028,0.00076568243,0.00055596494,0.07079107,0.056328338,0.85154575,0.0035933505,0.01350237],"study_design_scores_gemma":[0.00011847869,0.00022768558,0.0014369382,0.0000436238,0.000028351267,0.0002783473,0.0002660993,0.6542442,0.0075624976,0.3334016,0.0023066427,0.00008564077],"about_ca_topic_score_codex":0.0011366485,"about_ca_topic_score_gemma":0.001861838,"teacher_disagreement_score":0.0044179694,"about_ca_system_score_codex":0.0008306278,"about_ca_system_score_gemma":0.0006889412,"threshold_uncertainty_score":0.014779508},"labels":[],"label_agreement":null},{"id":"W3087764137","doi":"10.1149/09807.0117ecst","title":"Influence of Glass Surface Modification on Thin Film Copper Electrodes","year":2020,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Copper; Composite material; Microstructure; Transmission electron microscopy; Sheet resistance; Surface modification; Electrode; Hydrofluoric acid; Scanning electron microscope; Microfabrication; Layer (electronics); Metallurgy; Nanotechnology; Chemical engineering; Chemistry","score_opus":0.021980890559213425,"score_gpt":0.25915289509638656,"score_spread":0.23717200453717313,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3087764137","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99763715,0.00076085946,0.0005602989,0.00003565009,0.000027811857,0.000015423679,0.0000806706,0.000024931196,0.0008570954],"genre_scores_gemma":[0.99780875,0.00058318255,0.0008061138,0.000026445196,0.000009972868,0.000011599064,0.000092049624,0.000015249618,0.00064660434],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998529,0.000017644494,0.0000117771615,0.00003515307,0.000038538048,0.000044019056],"domain_scores_gemma":[0.9998535,0.0000468823,0.000041561325,0.000021497794,0.000024966146,0.000011551822],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000099756646,0.00034576276,0.00021350042,0.0001329074,0.0001787772,0.00033151777,0.00019521588,0.00025479693,0.0011608165],"category_scores_gemma":[0.0002589999,0.00018407921,0.00022269986,0.00014566313,0.0001974117,0.00016029067,0.00016864215,0.00026115697,0.00021433791],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008204816,0.000009040395,0.00019450056,0.000041021358,0.00001281843,0.00007689467,0.000027724509,0.00012593952,0.9984629,0.000020705611,0.000016843676,0.0009295174],"study_design_scores_gemma":[0.0000037371728,0.00020861687,0.0018550496,0.000002897632,0.000017266444,0.000044687018,0.000029269093,0.0003308323,0.99709725,0.0000075935086,0.0003994814,0.0000033479296],"about_ca_topic_score_codex":0.0016417737,"about_ca_topic_score_gemma":0.0019178286,"teacher_disagreement_score":0.0016417737,"about_ca_system_score_codex":0.00017341082,"about_ca_system_score_gemma":0.00015010654,"threshold_uncertainty_score":0.0038833618},"labels":[],"label_agreement":null},{"id":"W3088682504","doi":"10.1149/09807.0097ecst","title":"(Invited) Improved Copper Electrode Integration for Thin Film Electronics on Glass","year":2020,"lang":"en","type":"article","venue":"ECS Transactions","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Annealing (glass); Alloy; Electrode; Electrical resistivity and conductivity; Layer (electronics); Copper; Thin film; Metallurgy; Stack (abstract data type); Composite material; Nanotechnology; Electrical engineering; Chemistry","score_opus":0.017317980840918453,"score_gpt":0.25067526943243196,"score_spread":0.2333572885915135,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3088682504","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9616793,0.0021245803,0.022868523,0.00023732471,0.00028500325,0.000061707666,0.00026104873,0.0013521375,0.011130562],"genre_scores_gemma":[0.97145754,0.00084568176,0.019139469,0.00005447345,0.000043431926,0.000025965024,0.00014565635,0.00007385483,0.008213932],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998908,0.000007867771,0.0000048733027,0.000029322167,0.00003811224,0.000028963754],"domain_scores_gemma":[0.9999418,0.000007469825,0.000011569227,0.000014124807,0.000017698105,0.0000073234596],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008642816,0.00028235503,0.0001944329,0.00024577384,0.00017397724,0.00034127827,0.0004407703,0.0003057967,0.0016645122],"category_scores_gemma":[0.00012316064,0.0001470761,0.00020512812,0.00021822375,0.00017965092,0.00030769495,0.00026073598,0.00016394486,0.0005956639],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000043897773,0.0000071082177,0.0003381187,0.00006216781,0.0000073354104,0.00014738906,0.000038719998,0.00022389901,0.9917115,0.00022503936,0.00040555405,0.006789256],"study_design_scores_gemma":[0.0000053774543,0.00012468598,0.002675077,0.000004323255,0.000016248745,0.00018330099,0.000018735449,0.0023302506,0.989398,0.000035306504,0.0051997947,0.000008784487],"about_ca_topic_score_codex":0.0028831337,"about_ca_topic_score_gemma":0.00663369,"teacher_disagreement_score":0.0028831337,"about_ca_system_score_codex":0.00034279193,"about_ca_system_score_gemma":0.00017395667,"threshold_uncertainty_score":0.005732715},"labels":[],"label_agreement":null},{"id":"W3093939401","doi":"10.1116/6.0000476","title":"Electromigration simulation and design considerations for integrated circuit power grids","year":2020,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; Semiconductor Research Corporation","keywords":"Electromigration; Reliability (semiconductor); Scaling; Reliability engineering; Computer science; Electronic engineering; Power (physics); Voltage; Grid; Electronic circuit; Integrated circuit; Electrical engineering; Materials science; Engineering physics; Engineering; Physics","score_opus":0.043906172779094275,"score_gpt":0.2636865563665477,"score_spread":0.21978038358745342,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3093939401","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.028631072,0.0028286676,0.9263204,0.002777947,0.0002139778,0.00007919874,0.0002032779,0.00052400917,0.038421456],"genre_scores_gemma":[0.73885906,0.004542708,0.23057581,0.0007651337,0.0003303044,0.00035514237,0.0002636336,0.00041965887,0.023888545],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9997167,0.00010894127,0.000009913158,0.000023622117,0.00012215489,0.000018676565],"domain_scores_gemma":[0.99957377,0.0002502689,0.000031332533,0.00004096565,0.000092277995,0.00001148261],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004425033,0.00040699187,0.00041432443,0.00030308665,0.0004309782,0.0008575231,0.0008467924,0.00077333365,0.0040150387],"category_scores_gemma":[0.001715258,0.00043218402,0.00042867733,0.000436614,0.00051886676,0.0010689405,0.00045192603,0.00096453476,0.00069695764],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024231358,0.000019378891,0.0005317261,0.000120188386,0.000012242237,0.00012767804,0.0000872782,0.8640564,0.0049618534,0.112680696,0.0017195252,0.015658824],"study_design_scores_gemma":[0.0000069514754,0.000033755026,0.00014849805,0.0000211213,0.000005001109,0.000046122514,0.000026801512,0.9562051,0.0010246434,0.032807894,0.009668059,0.000006055302],"about_ca_topic_score_codex":0.001980955,"about_ca_topic_score_gemma":0.0019477338,"teacher_disagreement_score":0.0040150387,"about_ca_system_score_codex":0.00070964947,"about_ca_system_score_gemma":0.0005314844,"threshold_uncertainty_score":0.013431609},"labels":[],"label_agreement":null},{"id":"W3118188372","doi":"10.1116/6.0000617","title":"Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks","year":2020,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Voltage drop; Interconnection; Monte Carlo method; Power network design; Voltage; Drop (telecommunication); Grid; Electronic circuit; Electronic engineering; Materials science; Computer science; Electrical engineering; Engineering","score_opus":0.023027731940211467,"score_gpt":0.2609483451757494,"score_spread":0.23792061323553793,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3118188372","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.094231926,0.00022250952,0.8572342,0.000120623576,0.00007556123,0.0005979386,0.001368626,0.037648086,0.008500501],"genre_scores_gemma":[0.6097356,0.00014075225,0.3812794,0.000078347904,0.00002132805,0.00069385656,0.0010805702,0.001663724,0.0053064106],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996444,0.00007260224,0.000018331704,0.0000566515,0.0001772761,0.00003070516],"domain_scores_gemma":[0.9993357,0.0003087711,0.00004737972,0.00013098252,0.00014750655,0.000029578865],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00060050806,0.0008547641,0.00042923505,0.0004559281,0.00018841207,0.00043288933,0.0021237684,0.0006046829,0.007628026],"category_scores_gemma":[0.0013297987,0.0003686833,0.00035237696,0.0002711722,0.00021301222,0.0006737136,0.00038000045,0.00047018033,0.00103046],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000995148,0.0008926083,0.0072547854,0.0011014907,0.00021357526,0.0013436043,0.0004943214,0.38017365,0.31271926,0.017359821,0.020148722,0.25730297],"study_design_scores_gemma":[0.00020721434,0.0006396075,0.0029290307,0.000043855085,0.000037791277,0.00052117463,0.00003432888,0.8480316,0.11955395,0.0033198574,0.024627017,0.00005458316],"about_ca_topic_score_codex":0.0008394183,"about_ca_topic_score_gemma":0.00085011485,"teacher_disagreement_score":0.007628026,"about_ca_system_score_codex":0.0004377582,"about_ca_system_score_gemma":0.0005341516,"threshold_uncertainty_score":0.025518298},"labels":[],"label_agreement":null},{"id":"W3137700632","doi":"10.5555/1326073.3256496","title":"Session details: Advances in model order reduction techniques for interconnect analysis","year":2007,"lang":"en","type":"article","venue":"International Conference on Computer Aided Design","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Session (web analytics); Computer science; Reduction (mathematics); Model order reduction; Interconnection; Computer architecture; Reliability engineering; Telecommunications; Engineering; Algorithm; World Wide Web; Mathematics","score_opus":0.06004631226412029,"score_gpt":0.3506074278184081,"score_spread":0.2905611155542878,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3137700632","genre_codex":"methods","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0062336815,0.013252233,0.84636825,0.0055219643,0.012334371,0.0003482601,0.0020797711,0.009971926,0.10388956],"genre_scores_gemma":[0.09867734,0.021732219,0.41034514,0.0014792276,0.010694504,0.0004647317,0.0069191228,0.008208665,0.441479],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994423,0.00013541433,0.000026276439,0.00008927588,0.00026482387,0.00004188692],"domain_scores_gemma":[0.9984717,0.00051146117,0.000035795103,0.000413617,0.00048751984,0.00007986332],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009893606,0.0012568011,0.0012911188,0.0008964651,0.00073429925,0.0018455804,0.001352255,0.0016708337,0.16024385],"category_scores_gemma":[0.0025102333,0.0005290555,0.0011583958,0.0014847444,0.00032351792,0.0021087113,0.0010794742,0.0027549812,0.05367015],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00032557,0.00029916337,0.00037154852,0.0006416303,0.00009507973,0.000121271354,0.000118539516,0.025603326,0.025699383,0.021955227,0.37199724,0.552772],"study_design_scores_gemma":[0.00013156852,0.00034983407,0.0012426028,0.0001318456,0.00014610494,0.0005390473,0.000048182643,0.27884182,0.037383217,0.041035272,0.64003724,0.00011321265],"about_ca_topic_score_codex":0.0008915722,"about_ca_topic_score_gemma":0.0019513497,"teacher_disagreement_score":0.16024385,"about_ca_system_score_codex":0.0004577946,"about_ca_system_score_gemma":0.00077720673,"threshold_uncertainty_score":0.5360691},"labels":[],"label_agreement":null},{"id":"W3163941397","doi":"","title":"Patterning Platinum using CMP and plasma etching industrially compatible processes","year":2019,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Platinum; Etching (microfabrication); Plasma; Plasma etching; Materials science; Reactive-ion etching; Nanotechnology; Computer science; Chemistry; Catalysis; Physics; Organic chemistry","score_opus":0.030688973877463464,"score_gpt":0.253146134811115,"score_spread":0.2224571609336515,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3163941397","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8314321,0.0033883944,0.101206236,0.00095338316,0.00092070503,0.00034534195,0.000869568,0.001083839,0.059800535],"genre_scores_gemma":[0.91258556,0.0010650718,0.06535046,0.0001505305,0.00007522029,0.0001043302,0.0005404263,0.00022995227,0.019898472],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99958044,0.000027500859,0.000026584428,0.00013721113,0.00017742389,0.00005081385],"domain_scores_gemma":[0.9997389,0.00005418623,0.00004905833,0.00008547272,0.00005741646,0.000014925363],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024262925,0.00035873492,0.00032191648,0.0002567346,0.00032808562,0.00065220584,0.0005984925,0.0007074141,0.00332772],"category_scores_gemma":[0.0008551898,0.0002585267,0.00023499395,0.00040833224,0.00023882458,0.000512818,0.00050005957,0.00053269265,0.0013230029],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000047174934,0.000011154863,0.00016316155,0.000104572864,0.0000037222915,0.00015455575,0.000044213113,0.00017513127,0.99057674,0.0008413507,0.00036111494,0.0075170854],"study_design_scores_gemma":[0.000011312932,0.00010910394,0.0015323829,0.0000061155583,0.0000063906423,0.0005090514,0.000034222776,0.0014987622,0.985957,0.0003600119,0.009969465,0.000006234845],"about_ca_topic_score_codex":0.00029180708,"about_ca_topic_score_gemma":0.00052577496,"teacher_disagreement_score":0.00332772,"about_ca_system_score_codex":0.00037309408,"about_ca_system_score_gemma":0.00023716268,"threshold_uncertainty_score":0.0111323595},"labels":[],"label_agreement":null},{"id":"W3183308010","doi":"","title":"The Effect of Large-Scale Power on Very-Small-Scale Structure in CDM Simulations","year":2005,"lang":"en","type":"article","venue":"Journal of the Royal Astronomical Society of Canada","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Scale (ratio); Environmental science; Scale effects; Atmospheric sciences; Physics; Geography; Cartography","score_opus":0.0024044357544553167,"score_gpt":0.20014348048437353,"score_spread":0.1977390447299182,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3183308010","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9498992,0.00056718034,0.016260058,0.0022898035,0.00017513172,0.000054763434,0.00040497415,0.00043251077,0.029916372],"genre_scores_gemma":[0.996804,0.00008721799,0.0015746208,0.0001344348,0.000027584769,0.00002228769,0.00006618271,0.00013051942,0.001153256],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9995915,0.00020262052,0.000012319027,0.000035963294,0.00006729249,0.000090330876],"domain_scores_gemma":[0.9912846,0.006541907,0.0004099603,0.00058365375,0.0006913401,0.0004886673],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013589751,0.000728546,0.00093451154,0.0007806687,0.0014432459,0.0012917805,0.0015508167,0.0026391088,0.0042428034],"category_scores_gemma":[0.015373055,0.0009500509,0.0006247304,0.00087635865,0.0022819964,0.0020431555,0.0012082671,0.0017420034,0.00032299245],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000057181736,0.000039926905,0.0011022242,0.00002458704,0.000014442524,0.00006787579,0.00005202679,0.99133146,0.0005848743,0.005535409,0.00049540575,0.00069456233],"study_design_scores_gemma":[0.000027084045,0.000015270138,0.0003521183,0.000005844574,0.0000065686877,0.0000046460605,0.000016247197,0.9978248,0.00030988778,0.001341672,0.00008923704,0.00000670163],"about_ca_topic_score_codex":0.026428556,"about_ca_topic_score_gemma":0.018130569,"teacher_disagreement_score":0.026428556,"about_ca_system_score_codex":0.0018220813,"about_ca_system_score_gemma":0.0011514166,"threshold_uncertainty_score":0.05254942},"labels":[],"label_agreement":null},{"id":"W3201033383","doi":"10.33774/chemrxiv-2021-1kgg7","title":"Tuning the Dielectric Response in a Nanocomposite Material through Nanoparticle Morphology","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Western Canada Research Grid; University of Victoria","keywords":"Materials science; Dielectric; Nanocomposite; Nanoparticle; Chemical physics; Polarization (electrochemistry); Molecular dynamics; Periodic boundary conditions; Nanotechnology; Oxide; Condensed matter physics; Optoelectronics; Boundary value problem; Computational chemistry; Physics; Chemistry; Physical chemistry; Quantum mechanics","score_opus":0.02185536796540981,"score_gpt":0.2789385442757863,"score_spread":0.25708317631037647,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3201033383","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9878869,0.00012045068,0.008761657,0.000050707833,0.000012082959,0.0000062845866,0.000044413413,0.00010461144,0.0030129016],"genre_scores_gemma":[0.9952739,0.00007085656,0.0035487798,0.0000058488895,0.0000015384244,0.0000059015015,0.000021082073,0.000014309071,0.0010577956],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99997497,0.0000021705303,9.38869e-7,0.000007909452,0.000009428722,0.0000045664556],"domain_scores_gemma":[0.99995923,0.000017204433,0.00000945226,0.0000031144425,0.000007070496,0.000004025183],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005654547,0.00010549444,0.00007108892,0.00012248837,0.00008642446,0.0002791654,0.00018377985,0.00020329648,0.00069686165],"category_scores_gemma":[0.00016292272,0.00008556367,0.000081860366,0.000072252966,0.00014897806,0.0002255791,0.00009134771,0.0001244854,0.000108364686],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005469562,0.00004228691,0.00045291107,0.00004902028,0.000004484944,0.00008029116,0.000030355754,0.017876597,0.9776259,0.0015826394,0.00006787436,0.0021330158],"study_design_scores_gemma":[0.000019825258,0.00023882114,0.0017108724,0.000008664658,0.000013358958,0.00011960998,0.000045636705,0.38680178,0.60809594,0.000769454,0.002160005,0.000016036774],"about_ca_topic_score_codex":0.00035318715,"about_ca_topic_score_gemma":0.0005357348,"teacher_disagreement_score":0.00069686165,"about_ca_system_score_codex":0.00020454162,"about_ca_system_score_gemma":0.000085501764,"threshold_uncertainty_score":0.0023312569},"labels":[],"label_agreement":null},{"id":"W3214533306","doi":"","title":"PE-CVD with organometallic precursors: contribution of aerosol assisted processes","year":2021,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Montréal","funders":"","keywords":"Organosilicon; Aerosol; Group 2 organometallic chemistry; Chemical engineering; Materials science; Organometallic chemistry; Thin film; Zinc; Nickel; Molecule; Organic chemistry; Catalysis; Inorganic chemistry; Chemistry; Polymer chemistry; Nanotechnology; Metallurgy","score_opus":0.01283184591378959,"score_gpt":0.22831813261867837,"score_spread":0.21548628670488879,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3214533306","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9480961,0.008305409,0.016716918,0.00027984596,0.00036593285,0.00013523719,0.00022471252,0.00032455148,0.025551291],"genre_scores_gemma":[0.9821739,0.00235333,0.007201557,0.000057137888,0.00007883104,0.000027594819,0.00014192294,0.00008505705,0.0078805825],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99979466,0.000022468734,0.000009685863,0.00006479001,0.000068295565,0.00004012321],"domain_scores_gemma":[0.9997011,0.00015061139,0.000030492236,0.000041520998,0.00005694918,0.000019282781],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024334187,0.00034767546,0.00039674272,0.00017137534,0.00026660875,0.0006075577,0.0004267079,0.00047457215,0.0035059282],"category_scores_gemma":[0.00059504824,0.0001549135,0.00021511425,0.00015376724,0.00020303323,0.00048331553,0.0003639757,0.00065581384,0.00071346754],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00019611556,0.000054198965,0.00021283515,0.00042880964,0.000017442104,0.00027048,0.00008972174,0.0004183609,0.9858613,0.00074046565,0.00029735896,0.011412895],"study_design_scores_gemma":[0.000013954017,0.00014794504,0.00053832226,0.000010251788,0.000014242839,0.00017995614,0.000027508435,0.00202515,0.99314547,0.0001467481,0.0037431295,0.0000072809435],"about_ca_topic_score_codex":0.000391638,"about_ca_topic_score_gemma":0.0007027013,"teacher_disagreement_score":0.0035059282,"about_ca_system_score_codex":0.00021768303,"about_ca_system_score_gemma":0.00019098553,"threshold_uncertainty_score":0.011728466},"labels":[],"label_agreement":null},{"id":"W33690698","doi":"10.1371/journal.pone.0247996","title":"Correlation between the Thickness and Variation of Dielectric Conatant on SiOC thin film","year":2009,"lang":"en","type":"article","venue":"The Journal of the Korean Institute of Information and Communication Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Teck Resources; Fondazione Centro Studi Enel; Kungliga Tekniska Högskolan","keywords":"Dielectric; Refractive index; Materials science; Annealing (glass); Thin film; Composite material; Chemical vapor deposition; Optics; Optoelectronics; Nanotechnology","score_opus":0.008272444782447774,"score_gpt":0.2122534416369541,"score_spread":0.20398099685450632,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W33690698","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9972197,0.0001333782,0.001114768,0.000030151079,0.000012621619,0.0000033504105,0.0003313557,0.000060156344,0.0010945218],"genre_scores_gemma":[0.9992385,0.00004735406,0.00029694787,0.000004742558,0.0000041351955,0.0000020710384,0.00014864007,0.000003871542,0.00025375257],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991536,0.000007994146,0.0000060749885,0.000023378934,0.000033219992,0.000013918074],"domain_scores_gemma":[0.9991013,0.00024654286,0.00029310488,0.000064589054,0.00025192607,0.000042546188],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012755857,0.00016026944,0.00009991078,0.0006128881,0.0001599952,0.00027566205,0.0001932749,0.00016844801,0.0012314335],"category_scores_gemma":[0.001101075,0.00012232963,0.00006618846,0.0004964832,0.00016176622,0.00024963514,0.00014484291,0.00018975596,0.00015283462],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003825559,0.000080389764,0.26949123,0.0002173662,0.00019567744,0.0011595977,0.00041850307,0.0118813915,0.68552417,0.00066825055,0.0014652173,0.02851572],"study_design_scores_gemma":[0.000010694838,0.00019904523,0.6871805,0.0000278629,0.00011822408,0.0009940823,0.00080650585,0.05997557,0.2480482,0.0004037139,0.0021572907,0.00007823022],"about_ca_topic_score_codex":0.0021686566,"about_ca_topic_score_gemma":0.004729406,"teacher_disagreement_score":0.0021686566,"about_ca_system_score_codex":0.00014795439,"about_ca_system_score_gemma":0.00006456794,"threshold_uncertainty_score":0.0043120384},"labels":[],"label_agreement":null},{"id":"W4230603972","doi":"10.1149/ma2020-02281934mtgabs","title":"Influence of Glass Surface Modification on Thin Film Copper Electrodes","year":2020,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Sheet resistance; Composite material; Substrate (aquarium); Electrode; Surface roughness; Layer (electronics); Copper; Crystallization; Nanotechnology; Metallurgy; Chemical engineering","score_opus":0.023425681569793997,"score_gpt":0.26414114925187576,"score_spread":0.24071546768208177,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4230603972","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99636465,0.0011248293,0.00067321694,0.00004665824,0.000056094323,0.000026349691,0.00012867688,0.000038492737,0.0015410699],"genre_scores_gemma":[0.99634176,0.0010187913,0.0011613667,0.0000474574,0.000012782236,0.000021283246,0.00017242612,0.00002846202,0.0011955239],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997811,0.000025651043,0.000021943093,0.000055723984,0.000055117915,0.000060581737],"domain_scores_gemma":[0.99976426,0.00007418054,0.00006549051,0.000035005236,0.000045308523,0.000015708581],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001339452,0.0004292328,0.00021999743,0.0001883977,0.00023508315,0.00040892628,0.0002585388,0.0003374141,0.0013857102],"category_scores_gemma":[0.00040312303,0.0002413927,0.0002865102,0.0002292318,0.00022100129,0.00022352673,0.0001988958,0.00033977634,0.00027132864],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011133912,0.000015369067,0.00032602588,0.00006640416,0.000021586151,0.00011632584,0.000052520296,0.00015729252,0.9976284,0.000034931985,0.00003998972,0.0014298299],"study_design_scores_gemma":[0.000004615946,0.0002330166,0.0025744997,0.0000059375893,0.00002634655,0.00005326567,0.00005468767,0.00035427688,0.9960454,0.000008201676,0.0006350215,0.0000046788864],"about_ca_topic_score_codex":0.002177047,"about_ca_topic_score_gemma":0.0024134608,"teacher_disagreement_score":0.002177047,"about_ca_system_score_codex":0.00023754693,"about_ca_system_score_gemma":0.00017101165,"threshold_uncertainty_score":0.0046356916},"labels":[],"label_agreement":null},{"id":"W4231098174","doi":"10.32920/ryerson.14656692","title":"Variable time domain discretization methodology for molecular dynamics simulation of metallic compounds","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Molecular dynamics; Discretization; Work (physics); Computer science; Computation; Variable (mathematics); Time domain; Kinetic energy; Statistical physics; Simulation; Computational chemistry; Mechanical engineering; Chemistry; Algorithm; Physics; Mathematics; Classical mechanics; Engineering","score_opus":0.03537261406876413,"score_gpt":0.32133208087110465,"score_spread":0.2859594668023405,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231098174","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.015664002,0.00041851055,0.9766257,0.00016040358,0.00014035348,0.00011064126,0.00023172068,0.0004436887,0.006205042],"genre_scores_gemma":[0.2613957,0.0009181924,0.7304754,0.00014392947,0.00005407505,0.0009125888,0.0005094489,0.00028097865,0.005309701],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998079,0.00006451711,0.000009494101,0.000019993788,0.0000773468,0.000020722355],"domain_scores_gemma":[0.999775,0.00009929258,0.000024201521,0.000034093177,0.000052483087,0.000015008933],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00040294166,0.00034170444,0.00047486718,0.0003003299,0.000384516,0.00050864235,0.001156976,0.0007748747,0.0026438371],"category_scores_gemma":[0.0008305649,0.00023717215,0.0006158929,0.0004675123,0.00037781277,0.00040929814,0.00045928312,0.0010587404,0.0005877908],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006424086,0.000067927365,0.0013030454,0.0002285953,0.00005701763,0.00013164635,0.00012357527,0.8622867,0.016450256,0.07624235,0.0017927865,0.0412518],"study_design_scores_gemma":[0.000013001271,0.000019559648,0.00011599882,0.000010317074,0.0000041101935,0.000020410633,0.000008778871,0.99086493,0.0016359064,0.0026389528,0.0046621417,0.0000058227906],"about_ca_topic_score_codex":0.003420244,"about_ca_topic_score_gemma":0.002443403,"teacher_disagreement_score":0.003420244,"about_ca_system_score_codex":0.00052393146,"about_ca_system_score_gemma":0.0010295896,"threshold_uncertainty_score":0.008844495},"labels":[],"label_agreement":null},{"id":"W4231663537","doi":"10.1149/ma2020-02281932mtgabs","title":"(Invited) Improved Copper Electrode Integration for Thin Film Electronics on Glass","year":2020,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Research & Development Corporation","funders":"","keywords":"Materials science; Optoelectronics; Alloy; Transistor; Dry etching; Electrical resistivity and conductivity; Etching (microfabrication); Interconnection; Diffusion barrier; Nanotechnology; Layer (electronics); Composite material; Electrical engineering; Voltage; Computer science","score_opus":0.01842807111169205,"score_gpt":0.25583824121521326,"score_spread":0.23741017010352122,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231663537","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.35052633,0.06397886,0.07641223,0.013914992,0.04608253,0.00075803994,0.0026667588,0.008881367,0.4367789],"genre_scores_gemma":[0.28643247,0.01367119,0.030553672,0.0017496359,0.0022429954,0.00011376805,0.0012353947,0.00089285354,0.663108],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998592,0.000009858734,0.000005054555,0.000028927892,0.00006557741,0.000031472075],"domain_scores_gemma":[0.99990046,0.000013254467,0.0000069673497,0.00000929373,0.000054779615,0.000015223055],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018184674,0.0003850642,0.00023501256,0.00038679852,0.0002810369,0.00056237506,0.0005264984,0.00074850186,0.021560794],"category_scores_gemma":[0.00017371864,0.0001644893,0.00038830665,0.0003093719,0.00015278641,0.0006527711,0.00031539027,0.0004924592,0.007917098],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003345296,0.00009495556,0.00080065633,0.00096240116,0.000065643704,0.00096448645,0.0001638399,0.0006347324,0.6097871,0.0037978026,0.17658733,0.20580651],"study_design_scores_gemma":[0.000055276214,0.0005266087,0.005846707,0.00006537069,0.000117614065,0.0009619492,0.00016964166,0.0059488006,0.44148943,0.00063260156,0.54411983,0.00006614214],"about_ca_topic_score_codex":0.0015674827,"about_ca_topic_score_gemma":0.00574675,"teacher_disagreement_score":0.021560794,"about_ca_system_score_codex":0.00038064236,"about_ca_system_score_gemma":0.00019832939,"threshold_uncertainty_score":0.072128},"labels":[],"label_agreement":null},{"id":"W4231816337","doi":"10.1149/ma2009-01/24/982","title":"The Effect of Trench Sidewall Conformality on Cu Electroplating Uniformity.","year":2009,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mitel (Canada)","funders":"","keywords":"Trench; Electroplating; Materials science; Geology; Computer science; Composite material","score_opus":0.008351779551137292,"score_gpt":0.2542649779908166,"score_spread":0.2459131984396793,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231816337","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9896409,0.0017117643,0.001867185,0.00009511946,0.00009571293,0.000028064054,0.0002955753,0.00011968499,0.006146126],"genre_scores_gemma":[0.9989544,0.00025360374,0.0002616912,0.00001867933,0.000013081689,0.0000030471597,0.000037493523,0.000024757515,0.0004332581],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998041,0.000031460644,0.0000105546815,0.000054533895,0.000057258178,0.00004213442],"domain_scores_gemma":[0.9986305,0.0007215334,0.00022354088,0.00015966469,0.00017594366,0.0000888356],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025405223,0.0001641784,0.00013368936,0.00013015748,0.00014239547,0.00045898685,0.00022774127,0.00019565251,0.0026715307],"category_scores_gemma":[0.0025546483,0.00021482402,0.00007589615,0.00019806047,0.00022413964,0.00027217122,0.00019486627,0.00017183644,0.00028391666],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006339929,0.000054701915,0.0032947233,0.00015138146,0.00003362549,0.0002126855,0.000098767305,0.0018311456,0.98173827,0.00032166508,0.00054890505,0.011080271],"study_design_scores_gemma":[0.000045606906,0.0005070236,0.022467965,0.000014244807,0.00008541556,0.00019346821,0.000069673464,0.0035263957,0.9706917,0.000064276246,0.0023177217,0.000016586346],"about_ca_topic_score_codex":0.0010756042,"about_ca_topic_score_gemma":0.0014207162,"teacher_disagreement_score":0.0026715307,"about_ca_system_score_codex":0.00028912033,"about_ca_system_score_gemma":0.00018644519,"threshold_uncertainty_score":0.00893718},"labels":[],"label_agreement":null},{"id":"W4233374653","doi":"10.1149/ma2010-01/25/1278","title":"Recrystallization of Electrodeposited Copper-Silver Thin Films","year":2010,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Recrystallization (geology); Copper; Metallurgy; Materials science; Thin film; Geology; Nanotechnology; Petrology","score_opus":0.010181734902345578,"score_gpt":0.24209570395327878,"score_spread":0.2319139690509332,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4233374653","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9599795,0.0045856987,0.011463947,0.0003261499,0.00051995064,0.00018563578,0.0015435137,0.0010831562,0.020312605],"genre_scores_gemma":[0.9749485,0.0018282068,0.0048880163,0.00005639125,0.000043173713,0.000040585343,0.0016348636,0.0002991453,0.016261168],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998853,0.000008642525,0.000008316953,0.000026961996,0.00003841333,0.00003233114],"domain_scores_gemma":[0.9998425,0.0000418004,0.000018379491,0.000031153548,0.000051779156,0.000014367108],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012311473,0.00046956431,0.00034897288,0.0004221721,0.0002702477,0.0002572739,0.00043365813,0.00020544542,0.007039353],"category_scores_gemma":[0.00045800806,0.00020920418,0.00020196088,0.00048394362,0.00016739892,0.00022385924,0.00012592283,0.0008120903,0.0014792721],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000078730445,0.000015675818,0.000060107024,0.00011172205,0.000009376871,0.0001344071,0.00004295369,0.00007942834,0.99594986,0.000094009265,0.0004474454,0.0029762432],"study_design_scores_gemma":[0.000009467918,0.000080939804,0.00049335265,0.000006127475,0.000008052286,0.000059430855,0.00002191587,0.00022586371,0.99633574,0.000026968039,0.0027289717,0.0000030889992],"about_ca_topic_score_codex":0.0023225434,"about_ca_topic_score_gemma":0.003661316,"teacher_disagreement_score":0.007039353,"about_ca_system_score_codex":0.00019549641,"about_ca_system_score_gemma":0.0002173769,"threshold_uncertainty_score":0.02354896},"labels":[],"label_agreement":null},{"id":"W4234782056","doi":"10.1149/ma2005-01/30/1201","title":"Development of a CuFe2O4 Interconnect Coating","year":2006,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University; University of Toronto","funders":"","keywords":"Interconnection; Coating; Materials science; Business; Engineering; Telecommunications; Nanotechnology","score_opus":0.01805107291105392,"score_gpt":0.2528359961521706,"score_spread":0.2347849232411167,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4234782056","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.90058976,0.0021258658,0.067326605,0.0003661098,0.0006270264,0.0005834382,0.0005164718,0.00097360293,0.026891151],"genre_scores_gemma":[0.88547236,0.0015819812,0.080711015,0.00012904596,0.00005154713,0.00014271273,0.0008741864,0.00013887005,0.03089837],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998548,0.00000810343,0.00000902728,0.000022087403,0.00007261032,0.000033330918],"domain_scores_gemma":[0.9997985,0.0000117779355,0.000029061624,0.000025055553,0.0001051717,0.000030453733],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024686282,0.00040012578,0.00018823556,0.00034074107,0.0002606259,0.00024907527,0.00033396418,0.00049191335,0.002158767],"category_scores_gemma":[0.0002694198,0.00021193465,0.00021713701,0.00017853445,0.000100974416,0.00026050938,0.00021228088,0.00041472295,0.00086640276],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017487308,0.000023561362,0.00013354406,0.000047472367,0.000005000564,0.000089497065,0.000008399228,0.00016538605,0.9934144,0.00011159461,0.00019033022,0.00579328],"study_design_scores_gemma":[0.000009829015,0.0002176861,0.001346586,0.0000055862793,0.000011477286,0.00016556721,0.000009134194,0.0014390561,0.98819005,0.000017922404,0.00858203,0.000005177275],"about_ca_topic_score_codex":0.0013044793,"about_ca_topic_score_gemma":0.0017913294,"teacher_disagreement_score":0.002158767,"about_ca_system_score_codex":0.00024383818,"about_ca_system_score_gemma":0.00034339476,"threshold_uncertainty_score":0.0072217584},"labels":[],"label_agreement":null},{"id":"W4241013126","doi":"10.1002/9781119093435.ch72","title":"Novelis High‐Speed can End Coating Line – Operational Results","year":2015,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Novelis (Canada)","funders":"","keywords":"Coating; Line (geometry); Computer science; Environmental science; Materials science; Mathematics; Composite material; Geometry","score_opus":0.02829310122328886,"score_gpt":0.27648290679070214,"score_spread":0.24818980556741327,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4241013126","genre_codex":"empirical","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7029296,0.0008534223,0.0226017,0.00031431718,0.00037467983,0.00037108077,0.007111096,0.006918913,0.25852516],"genre_scores_gemma":[0.911148,0.00019170092,0.006314699,0.00008817127,0.00004392166,0.000076922246,0.008441318,0.00068378326,0.0730116],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99927646,0.000066908055,0.000017266497,0.00006776986,0.0004343706,0.0001372851],"domain_scores_gemma":[0.99909353,0.00006432184,0.00004470259,0.00018295263,0.0005270049,0.00008749572],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007790539,0.00066265796,0.0004398389,0.00060371513,0.00064591883,0.0012560346,0.0007025074,0.00061887293,0.015317095],"category_scores_gemma":[0.0005318444,0.00014703852,0.00031313245,0.0005105827,0.00047091956,0.000977817,0.00031250555,0.00049464026,0.006498147],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.009480399,0.0027721801,0.03763913,0.00082734105,0.00040780308,0.0013551736,0.001298549,0.061225515,0.45504248,0.010088092,0.14444128,0.27542204],"study_design_scores_gemma":[0.0004665016,0.00601923,0.0670802,0.00008101629,0.00021359997,0.00058837794,0.00071077223,0.06653718,0.6596133,0.0015308723,0.19699252,0.0001664094],"about_ca_topic_score_codex":0.0046555963,"about_ca_topic_score_gemma":0.0047509433,"teacher_disagreement_score":0.015317095,"about_ca_system_score_codex":0.0010530299,"about_ca_system_score_gemma":0.0003946651,"threshold_uncertainty_score":0.051240742},"labels":[],"label_agreement":null},{"id":"W4245330910","doi":"10.1149/ma2012-02/13/1629","title":"Measurement of Capillary Presuure Curves in GDLs at Elevated Temperatures","year":2012,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Capillary action; Materials science; Composite material","score_opus":0.024164265027259824,"score_gpt":0.25675233190986335,"score_spread":0.23258806688260353,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4245330910","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9806635,0.0009043599,0.010739412,0.00022080165,0.000060748433,0.000042224085,0.00048048978,0.00044453552,0.0064440314],"genre_scores_gemma":[0.99247324,0.00044488296,0.0022815682,0.000043252912,0.000012258509,0.000025568695,0.00020807859,0.00005348091,0.004457637],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99974984,0.000019101348,0.0000055130567,0.000039651564,0.00013145221,0.000054412132],"domain_scores_gemma":[0.99932027,0.00030264468,0.000058544756,0.00004791709,0.00022393133,0.000046730867],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023906084,0.00027795756,0.00018956914,0.0003984933,0.00039997668,0.0004355197,0.0004270646,0.00035591418,0.0027131217],"category_scores_gemma":[0.00094679644,0.00016471012,0.00009396266,0.0004301815,0.0006300897,0.00042222725,0.00023234409,0.0006642678,0.00056322233],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000048594593,0.000009911977,0.0002899521,0.000037699832,0.0000035983776,0.00006333791,0.00016149887,0.00009452895,0.9959286,0.00042234396,0.0002465619,0.0026934855],"study_design_scores_gemma":[0.0000025262764,0.00005080694,0.0015467323,0.0000036906033,0.0000022068766,0.000037244958,0.000050780927,0.0006068701,0.99638957,0.00005057774,0.0012523246,0.0000065405125],"about_ca_topic_score_codex":0.003774246,"about_ca_topic_score_gemma":0.0061919424,"teacher_disagreement_score":0.003774246,"about_ca_system_score_codex":0.0007366767,"about_ca_system_score_gemma":0.0003223526,"threshold_uncertainty_score":0.009076297},"labels":[],"label_agreement":null},{"id":"W4247657185","doi":"10.26434/chemrxiv-2021-1kgg7","title":"Tuning the Dielectric Response in a Nanocomposite Material through Nanoparticle Morphology","year":2021,"lang":"en","type":"preprint","venue":"ChemRxiv","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Western Canada Research Grid; University of Victoria","keywords":"Materials science; Dielectric; Nanocomposite; Nanoparticle; Chemical physics; Polarization (electrochemistry); Molecular dynamics; Periodic boundary conditions; Oxide; Condensed matter physics; Nanotechnology; Optoelectronics; Boundary value problem; Computational chemistry; Physical chemistry; Physics; Chemistry; Quantum mechanics","score_opus":0.022835551776713623,"score_gpt":0.2740290278744246,"score_spread":0.251193476097711,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4247657185","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9873046,0.00012507399,0.009234392,0.00005562556,0.000011738072,0.0000062784393,0.000051816445,0.00011669791,0.0030937593],"genre_scores_gemma":[0.99513936,0.00007588321,0.003635634,0.000006020173,0.0000015595101,0.0000060665334,0.00002391356,0.00001599116,0.0010956344],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999757,0.0000021683531,9.112402e-7,0.000007638078,0.00000906618,0.000004493781],"domain_scores_gemma":[0.9999591,0.000017297449,0.000009432331,0.0000032270295,0.000007203124,0.0000038046878],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005789671,0.00010718632,0.00007055175,0.00012650847,0.000086291206,0.00027636942,0.00018471359,0.00020014949,0.00071227056],"category_scores_gemma":[0.00016246957,0.00008685954,0.00008169146,0.000076264994,0.00014324034,0.00022088988,0.00009222815,0.00012521328,0.00010960847],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000059751343,0.000044864246,0.000533462,0.000055412154,0.0000051182733,0.00008214157,0.000033404503,0.021262359,0.97370446,0.0017755902,0.0000825975,0.0023608012],"study_design_scores_gemma":[0.000019328963,0.0002248889,0.0017552993,0.000009044705,0.0000135782675,0.000112695125,0.00004583111,0.39901537,0.595795,0.00081687485,0.0021766715,0.00001549838],"about_ca_topic_score_codex":0.00038249625,"about_ca_topic_score_gemma":0.00055898185,"teacher_disagreement_score":0.00071227056,"about_ca_system_score_codex":0.00022363056,"about_ca_system_score_gemma":0.00008748389,"threshold_uncertainty_score":0.002382815},"labels":[],"label_agreement":null},{"id":"W4251368852","doi":"10.1109/iccad.2013.6691170","title":"A Vectorless framework for power grid electromigration checking","year":2013,"lang":"en","type":"article","venue":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Computer science; Reliability (semiconductor); Workload; Conservatism; Grid; Pessimism; Power (physics); Power integrity; Very-large-scale integration; Reliability engineering; Chip; Power grid; Interconnection; Electronic engineering; Electrical engineering; Telecommunications; Engineering; Embedded system; Physics; Mathematics","score_opus":0.07865958355693928,"score_gpt":0.3138129411733506,"score_spread":0.23515335761641135,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4251368852","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0010163743,0.000058597838,0.99671555,0.00005587154,0.000019879704,0.0000345158,0.000072384275,0.0010001032,0.0010268184],"genre_scores_gemma":[0.14899838,0.0003329206,0.8437396,0.00025174735,0.00010373382,0.00029979274,0.0005437291,0.00068818574,0.005041813],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99740064,0.00082116603,0.00021319087,0.0003847961,0.0009599456,0.00022022653],"domain_scores_gemma":[0.9966979,0.0016581628,0.00024292749,0.0008242306,0.0005056896,0.0000710585],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.003108754,0.0010823336,0.0008771636,0.0015911554,0.00073209405,0.0027361964,0.004367988,0.0010169196,0.0063459114],"category_scores_gemma":[0.008009974,0.00089853845,0.0020107192,0.0013836464,0.0021483267,0.0048317895,0.002699779,0.0022605064,0.0012329515],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000089874055,0.00006839084,0.0007027032,0.00019369098,0.00004682577,0.00024246958,0.00016894574,0.31408814,0.0030582892,0.59467983,0.0039763604,0.082684524],"study_design_scores_gemma":[0.000024711353,0.000035677655,0.000055131197,0.000036557532,0.00002005458,0.00006971796,0.00002163666,0.7853538,0.002089096,0.20369941,0.008576543,0.000017695322],"about_ca_topic_score_codex":0.004257406,"about_ca_topic_score_gemma":0.005001378,"teacher_disagreement_score":0.0063459114,"about_ca_system_score_codex":0.0014014422,"about_ca_system_score_gemma":0.0016788153,"threshold_uncertainty_score":0.021229148},"labels":[],"label_agreement":null},{"id":"W4251821671","doi":"10.1109/iccad.2013.6691168","title":"Redundancy-aware Electromigration checking for mesh power grids","year":2013,"lang":"en","type":"article","venue":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Redundancy (engineering); Reliability (semiconductor); Grid; Computer science; Interconnection; Power grid; Reliability engineering; Circuit reliability; Algorithm; Power (physics); Electrical engineering; Mathematics; Engineering; Physics; Geometry; Telecommunications","score_opus":0.06861736363377133,"score_gpt":0.30015611039975176,"score_spread":0.23153874676598044,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4251821671","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.161491,0.00015289937,0.8340496,0.00013027314,0.000021806627,0.000046394667,0.00020796731,0.0031636907,0.0007363497],"genre_scores_gemma":[0.8582201,0.000046858782,0.14055277,0.000039031707,0.000011034858,0.000039705472,0.00031099241,0.00012446461,0.0006550682],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.999131,0.00025094347,0.00006195668,0.00017998356,0.00029547617,0.000080667916],"domain_scores_gemma":[0.9939312,0.0031508761,0.00085367827,0.0011392982,0.0008238653,0.00010112791],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009593607,0.00051734963,0.000665461,0.0012258068,0.00038332614,0.0006649332,0.0013904792,0.00058976363,0.0011099962],"category_scores_gemma":[0.009207282,0.0003923807,0.00058353646,0.000671473,0.00053328247,0.0014339492,0.0009277566,0.00044602723,0.00022486273],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040920367,0.00006310064,0.01914936,0.00012522594,0.00009309284,0.00032252466,0.00014700525,0.83471626,0.017653631,0.014123742,0.0022368038,0.110959984],"study_design_scores_gemma":[0.0000047031226,0.000016660635,0.0003013988,0.0000030893668,0.0000039421616,0.000031279233,0.000009768935,0.99446267,0.0023996234,0.0026367125,0.00012737844,0.0000026762466],"about_ca_topic_score_codex":0.0036472306,"about_ca_topic_score_gemma":0.003997547,"teacher_disagreement_score":0.0036472306,"about_ca_system_score_codex":0.00082910556,"about_ca_system_score_gemma":0.00083506515,"threshold_uncertainty_score":0.0072520375},"labels":[],"label_agreement":null},{"id":"W4312108683","doi":"","title":"Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging","year":2022,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microfabrication; Etching (microfabrication); Copper; Plasma etching; Plasma; Materials science; Electronic packaging; Integrated circuit packaging; Optoelectronics; Nanotechnology; Metallurgy; Composite material; Integrated circuit; Fabrication","score_opus":0.012914413680345418,"score_gpt":0.24297934356051457,"score_spread":0.23006492988016913,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4312108683","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.82202005,0.025661098,0.10408173,0.0014885035,0.0009914171,0.0002765944,0.0004186602,0.0010394977,0.044022422],"genre_scores_gemma":[0.9401003,0.0049993973,0.031231342,0.0001009119,0.0001914356,0.0000758192,0.00020686553,0.00018272348,0.022911252],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999772,0.000033073782,0.0000073029823,0.000033979337,0.00011319665,0.000040449482],"domain_scores_gemma":[0.99983025,0.00006912067,0.000023372017,0.000027637261,0.000040204577,0.000009470276],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00047394648,0.0003269637,0.00037572376,0.00036292762,0.000518512,0.0006194864,0.0003685749,0.0006418227,0.0033085805],"category_scores_gemma":[0.00060991675,0.00029979093,0.00021050879,0.0004327098,0.00036683655,0.00049758446,0.00040736742,0.0004197151,0.00059300463],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00019780248,0.000041481035,0.0004944301,0.0005904126,0.000029499719,0.0002784914,0.00033310705,0.0037916808,0.94843084,0.0035340684,0.0038786987,0.038399525],"study_design_scores_gemma":[0.00003742868,0.00044632328,0.0034465056,0.000026818958,0.0000321617,0.00052679685,0.00017367658,0.018769948,0.94583344,0.0014860354,0.029201819,0.000019008603],"about_ca_topic_score_codex":0.001172569,"about_ca_topic_score_gemma":0.0016638547,"teacher_disagreement_score":0.0033085805,"about_ca_system_score_codex":0.0005256685,"about_ca_system_score_gemma":0.0002889101,"threshold_uncertainty_score":0.011068344},"labels":[],"label_agreement":null},{"id":"W4353031946","doi":"10.1145/3569052.3578922","title":"Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution","year":2023,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Agence Nationale de la Recherche; Semiconductor Research Corporation","keywords":"Electromigration; Resistor; Voltage drop; Void (composites); Interconnection; Ball grid array; Materials science; Voltage; Redundancy (engineering); Grid; Power network design; Electronic circuit; Power (physics); Electronic engineering; Electrical engineering; Computer science; Engineering; Physics; Composite material; Reliability engineering; Soldering; Telecommunications; Mathematics","score_opus":0.004491865934672131,"score_gpt":0.2494645945321798,"score_spread":0.24497272859750768,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4353031946","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8835345,0.00010601957,0.114743136,0.000022727942,0.000006442163,0.00002385546,0.00006346876,0.0002756697,0.001224238],"genre_scores_gemma":[0.9936139,0.000025123447,0.0061830236,0.00000252479,0.0000010378382,0.000006524806,0.000022379678,0.00001059618,0.00013495477],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998939,0.000032063508,0.000003901444,0.000024801368,0.000033003384,0.0000122519405],"domain_scores_gemma":[0.9997012,0.000096237636,0.000057785463,0.00006777126,0.0000671608,0.000009772002],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024889223,0.0003734311,0.00020508823,0.00030748587,0.00009903054,0.00018939245,0.0002835174,0.00022951393,0.0002871258],"category_scores_gemma":[0.00061901717,0.00012252225,0.00016154781,0.00022882236,0.00021762408,0.00029038807,0.00023171093,0.00011041474,0.00006204292],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015855934,0.000050104045,0.018036833,0.00010180735,0.0000407839,0.00036912115,0.00012576711,0.81172717,0.14687482,0.0014607415,0.00017271239,0.020881576],"study_design_scores_gemma":[0.00001035571,0.0002799573,0.007874442,0.000004287403,0.000017876724,0.00014445312,0.000034305358,0.9426956,0.04811954,0.00052407617,0.00028654194,0.0000085571155],"about_ca_topic_score_codex":0.000656052,"about_ca_topic_score_gemma":0.000772214,"teacher_disagreement_score":0.000656052,"about_ca_system_score_codex":0.0002786947,"about_ca_system_score_gemma":0.00016472331,"threshold_uncertainty_score":0.0020220876},"labels":[],"label_agreement":null},{"id":"W4377969795","doi":"10.1109/isqed57927.2023.10129371","title":"Fast Electromigration Simulation for Chip Power Grids","year":2023,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Electromigration; Speedup; Chip; Computer science; Grid; Void (composites); Voltage; Power grid; Electronic engineering; Power (physics); Parallel computing; Electrical engineering; Materials science; Engineering; Physics; Telecommunications","score_opus":0.019478784452025933,"score_gpt":0.2983218237216289,"score_spread":0.27884303926960297,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4377969795","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.19759299,0.0008413256,0.7636015,0.0005804626,0.00017068344,0.000116621326,0.0011822429,0.004267078,0.03164706],"genre_scores_gemma":[0.8378946,0.0005985601,0.15005486,0.00013768405,0.000053696425,0.0002963028,0.0012004138,0.00071605376,0.009047806],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99985063,0.000044507393,0.000005880977,0.000018464954,0.000057137833,0.000023435123],"domain_scores_gemma":[0.9994711,0.0003069335,0.000032540913,0.000060376457,0.000101823745,0.000027230575],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002625931,0.00057502754,0.0005956946,0.00033836163,0.0003437559,0.00044555002,0.00090872427,0.0008133212,0.0049104406],"category_scores_gemma":[0.0014701916,0.0003842454,0.000532892,0.0005827139,0.0003328333,0.0005623726,0.00055603345,0.000725503,0.0005568232],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019276915,0.000013691375,0.00042357921,0.00003495955,0.000012842662,0.00004073096,0.00003388422,0.98779315,0.0015728116,0.0044713714,0.0008589148,0.0047247866],"study_design_scores_gemma":[0.000008195995,0.0000075102444,0.00006937681,0.0000021781502,0.0000019649367,0.000007286951,0.00000528879,0.9972767,0.000526315,0.0011391998,0.0009541324,0.000001878453],"about_ca_topic_score_codex":0.006395507,"about_ca_topic_score_gemma":0.0041564135,"teacher_disagreement_score":0.006395507,"about_ca_system_score_codex":0.0005613787,"about_ca_system_score_gemma":0.00072970113,"threshold_uncertainty_score":0.01642704},"labels":[],"label_agreement":null},{"id":"W4385893389","doi":"10.1109/ectc51909.2023.00234","title":"Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging","year":2023,"lang":"en","type":"preprint","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microfabrication; Etching (microfabrication); Plasma etching; Materials science; Fabrication; Plasma; Nanotechnology; Process (computing); Copper; Layer (electronics); Optoelectronics; Computer science; Metallurgy; Physics","score_opus":0.032839523158386806,"score_gpt":0.3064589801797166,"score_spread":0.27361945702132984,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4385893389","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.540927,0.006959364,0.42936516,0.00040598042,0.0004679879,0.00060693093,0.0004647319,0.0021928065,0.018610166],"genre_scores_gemma":[0.6675671,0.002927095,0.32149407,0.0000884811,0.0000907144,0.00021582498,0.00032813623,0.00023769066,0.007050899],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996214,0.000041947562,0.000018251389,0.00007572931,0.00019729519,0.00004533926],"domain_scores_gemma":[0.9997793,0.000038228256,0.00005035948,0.000053151012,0.00006199428,0.000016960954],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005384119,0.00048357423,0.0003599267,0.00029861197,0.00040085558,0.00057419343,0.0005471994,0.0006428043,0.00075760076],"category_scores_gemma":[0.00044966012,0.00028286886,0.00028716575,0.0003536577,0.00033316726,0.00053263985,0.00035888766,0.0005108867,0.00060519803],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024039105,0.000038692266,0.0003330763,0.00023696666,0.00001038942,0.0002592468,0.000119544726,0.0010267578,0.9766668,0.0014921047,0.00046839868,0.019323975],"study_design_scores_gemma":[0.00001472166,0.00029616148,0.0013446622,0.000011227548,0.000012497625,0.00056420406,0.00002526266,0.0071385126,0.97902715,0.000198199,0.011353848,0.000013646859],"about_ca_topic_score_codex":0.0006184392,"about_ca_topic_score_gemma":0.0008136476,"teacher_disagreement_score":0.00075760076,"about_ca_system_score_codex":0.00044546035,"about_ca_system_score_gemma":0.0005810499,"threshold_uncertainty_score":0.0032320023},"labels":[],"label_agreement":null},{"id":"W4386072888","doi":"10.11159/mmme23.112","title":"Sputtering of Ultra-thin Cu Nano-twinned Films on Si Wafers for Application in Advanced 3D-IC Packaging","year":2023,"lang":"en","type":"article","venue":"Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"Hsinchu Science Park Bureau, Ministry of Science and Technology, Taiwan","keywords":"Wafer; Materials science; Sputtering; Optoelectronics; Nano-; Sputter deposition; Thin film; Nanotechnology; Composite material","score_opus":0.007679251785211376,"score_gpt":0.22854187085747016,"score_spread":0.2208626190722588,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4386072888","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.992485,0.0016129834,0.0038882946,0.00004030586,0.00007117227,0.000022627117,0.00013106049,0.000058760957,0.0016897119],"genre_scores_gemma":[0.9898149,0.0007820075,0.00825887,0.000024418177,0.000011044071,0.000015640277,0.0001338725,0.000017681697,0.00094151957],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999535,0.0000028729894,0.0000037091206,0.0000131709085,0.00001836963,0.000008432662],"domain_scores_gemma":[0.99994564,0.000009776386,0.000012077591,0.000008777497,0.000017514036,0.0000061871947],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006873245,0.00018183685,0.00013721063,0.00012480965,0.0001231906,0.0001534835,0.00020833511,0.00017844017,0.00052182947],"category_scores_gemma":[0.00016080552,0.00022113304,0.00011987568,0.000120219665,0.00010179413,0.00017188674,0.00013592263,0.00018786745,0.000121488934],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000101454625,0.0000020883342,0.00012301412,0.00004259887,0.0000040889,0.00006263975,0.000012687514,0.0000698629,0.9986131,0.000026550217,0.0000394742,0.0009936673],"study_design_scores_gemma":[0.000004211673,0.000079864956,0.0037671467,0.0000062794215,0.000012399709,0.00015252025,0.000030758314,0.0014998415,0.99331313,0.00001635574,0.0011132814,0.000004180994],"about_ca_topic_score_codex":0.0005843076,"about_ca_topic_score_gemma":0.0017635538,"teacher_disagreement_score":0.0005843076,"about_ca_system_score_codex":0.00013112604,"about_ca_system_score_gemma":0.00011310315,"threshold_uncertainty_score":0.0017457008},"labels":[],"label_agreement":null},{"id":"W4386612148","doi":"10.11159/ijmmme.2023.001","title":"Characterization of High Density (111)-oriented Ag Nanotwinned Films Deposited on Sapphire Wafers","year":2023,"lang":"en","type":"article","venue":"International Journal of Mining Materials and Metallurgical Engineering","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"Hsinchu Science Park Bureau, Ministry of Science and Technology, Taiwan; Ministry of Science and Technology, Taiwan","keywords":"Wafer; Materials science; Sapphire; Characterization (materials science); Optoelectronics; Composite material; Nanotechnology; Optics; Laser","score_opus":0.008988602200030511,"score_gpt":0.22448632468704188,"score_spread":0.21549772248701138,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4386612148","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9971992,0.00029099087,0.0011500244,0.00001856588,0.000010935467,0.000010766956,0.0003124983,0.000045976063,0.00096107705],"genre_scores_gemma":[0.99483746,0.00028985075,0.003181699,0.000017431545,0.0000053842537,0.000017459979,0.00043867686,0.000022373328,0.0011896496],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999941,0.00000218344,0.0000041256117,0.000015433236,0.000026333313,0.000010849851],"domain_scores_gemma":[0.9999008,0.000024676167,0.000021194408,0.000013833207,0.000030346677,0.000009063185],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000044874683,0.00021216474,0.00014805191,0.00029658587,0.00012925363,0.00019367115,0.00022062383,0.00022860168,0.0010581566],"category_scores_gemma":[0.00016796157,0.00018738586,0.000114313094,0.00024011597,0.000099957004,0.00013932672,0.000083326304,0.00020229176,0.00017587047],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000091537395,0.0000027475626,0.00030984235,0.000021979151,0.0000025938439,0.0001009431,0.000013698787,0.000046789326,0.9989343,0.000009553204,0.000016652077,0.00053161127],"study_design_scores_gemma":[0.000005834683,0.00016829243,0.054470748,0.000007950022,0.00002159186,0.00042058466,0.00011271724,0.001775668,0.942035,0.000019756406,0.0009534939,0.000008376006],"about_ca_topic_score_codex":0.001215759,"about_ca_topic_score_gemma":0.002297386,"teacher_disagreement_score":0.001215759,"about_ca_system_score_codex":0.00010546457,"about_ca_system_score_gemma":0.000073690986,"threshold_uncertainty_score":0.0035399199},"labels":[],"label_agreement":null},{"id":"W4390545031","doi":"10.3390/coatings14010068","title":"Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect","year":2024,"lang":"en","type":"article","venue":"Coatings","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"Government of Jiangsu Province; China Postdoctoral Science Foundation; Jiangsu Science and Technology Department; National Natural Science Foundation of China","keywords":"Materials science; Diffusion barrier; Alloy; Silicon; Sputter deposition; Substrate (aquarium); Doping; Analytical Chemistry (journal); Copper; Layer (electronics); Barrier layer; Photoemission spectroscopy; Diffusion; Carbon fibers; Metallurgy; X-ray photoelectron spectroscopy; Sputtering; Chemical engineering; Thin film; Composite material; Nanotechnology; Optoelectronics; Chemistry; Composite number","score_opus":0.010805766205916072,"score_gpt":0.2803619920229363,"score_spread":0.26955622581702027,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4390545031","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9945403,0.0031481981,0.0006482365,0.0000572716,0.00006125419,0.000013305872,0.00006463245,0.00005297965,0.001413776],"genre_scores_gemma":[0.99623483,0.0011549637,0.0014894285,0.000027547017,0.000010706374,0.0000075280777,0.000057980153,0.000016692122,0.0010002669],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999349,0.0000059318654,0.0000046120817,0.000014942405,0.000023626553,0.000015969033],"domain_scores_gemma":[0.9998746,0.000019312558,0.000026114243,0.000008924701,0.000048471313,0.00002259478],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005267417,0.00033559254,0.00018508628,0.00019968285,0.00018397147,0.0002648058,0.00025156306,0.00025740493,0.0007613273],"category_scores_gemma":[0.00019956732,0.0001627195,0.00010941026,0.00020052235,0.000085487256,0.00025590882,0.000107410495,0.0001816116,0.00014743599],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000064323736,0.000012653236,0.00014647283,0.00009556945,0.000007569108,0.00009449973,0.000014838771,0.00007460431,0.9981268,0.000025754423,0.000056360335,0.0012805113],"study_design_scores_gemma":[0.0000058237283,0.00014981312,0.001104124,0.0000067938267,0.000019323012,0.00008717214,0.000021375206,0.0006602001,0.9969681,0.0000050406798,0.00096876547,0.0000034739735],"about_ca_topic_score_codex":0.0015086426,"about_ca_topic_score_gemma":0.0039644726,"teacher_disagreement_score":0.0015086426,"about_ca_system_score_codex":0.00021686431,"about_ca_system_score_gemma":0.00013740992,"threshold_uncertainty_score":0.002999723},"labels":[],"label_agreement":null},{"id":"W4394994524","doi":"10.1109/mmm.2024.3369795","title":"Call for Papers EPEPS 2024","year":2024,"lang":"en","type":"paratext","venue":"IEEE Microwave Magazine","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Computer science; Telecommunications","score_opus":0.017299512702674845,"score_gpt":0.2759164976571757,"score_spread":0.25861698495450086,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4394994524","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00046610314,0.00097540574,0.00075908704,0.009751282,0.038653903,0.00035488806,0.0032880083,0.0012209427,0.9445303],"genre_scores_gemma":[0.00047702214,0.00024284456,0.0001073458,0.0016019352,0.0017140874,0.00005585089,0.0006488138,0.00022921084,0.99492294],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9993331,0.000059061324,0.00003459648,0.00008531671,0.00039509984,0.000092770315],"domain_scores_gemma":[0.9965893,0.00037415902,0.00009968249,0.00022827777,0.0015843398,0.0011242925],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0010114571,0.0009839348,0.0009007186,0.0011270886,0.0014633951,0.0053317603,0.001108265,0.0033019718,0.85349715],"category_scores_gemma":[0.005002275,0.0004135151,0.000565075,0.0011450911,0.0003077504,0.002889445,0.0017349593,0.0027633943,0.82197785],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000018483734,0.000012981189,0.000021918997,0.000037042475,7.505584e-7,0.000023761439,0.0000031185562,0.00001632916,0.000052927826,0.00042819566,0.98531383,0.0140706785],"study_design_scores_gemma":[0.00001110095,0.000014819069,0.00014684067,0.000033270422,9.872603e-7,0.000022024113,0.00002231635,0.000034484132,0.000052447653,0.00040083847,0.99925727,0.000003574926],"about_ca_topic_score_codex":0.0011849327,"about_ca_topic_score_gemma":0.0024001594,"teacher_disagreement_score":0.85349715,"about_ca_system_score_codex":0.0010611407,"about_ca_system_score_gemma":0.0014301676,"threshold_uncertainty_score":0.20896846},"labels":[],"label_agreement":null},{"id":"W4396758818","doi":"10.1109/mmm.2024.3385195","title":"EPEPS 2024 Call for Papers","year":2024,"lang":"en","type":"paratext","venue":"IEEE Microwave Magazine","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Computer science; Telecommunications","score_opus":0.017299512702674845,"score_gpt":0.2759164976571757,"score_spread":0.25861698495450086,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4396758818","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00041814765,0.0008422892,0.0005537254,0.005406521,0.018366784,0.000248334,0.0041282014,0.0010822729,0.9689538],"genre_scores_gemma":[0.0005365239,0.00022979714,0.000104911924,0.0010250711,0.0010427047,0.000049712806,0.0011011906,0.00026699065,0.99564314],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.999153,0.00007198282,0.000037888967,0.00009360124,0.0005189717,0.0001245462],"domain_scores_gemma":[0.9967782,0.00032931453,0.00010913731,0.00023024085,0.0014588103,0.0010944034],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0010324371,0.0010350021,0.0008102634,0.0015333958,0.0015744847,0.0059915567,0.0011633525,0.0029943006,0.86582536],"category_scores_gemma":[0.0048538023,0.00043099484,0.00062886643,0.0015623978,0.00032461842,0.0027051677,0.0019078365,0.0025659134,0.8461943],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021000003,0.000012397672,0.00002206144,0.000038317026,8.614772e-7,0.000020707615,0.0000030695026,0.000018401654,0.000050813396,0.0004742521,0.9867077,0.012630356],"study_design_scores_gemma":[0.000012567597,0.000014145202,0.00015373352,0.000034778037,9.965846e-7,0.000019376785,0.00001842006,0.000040548508,0.000056201457,0.0003715044,0.99927443,0.0000031859731],"about_ca_topic_score_codex":0.0020608765,"about_ca_topic_score_gemma":0.0041783317,"teacher_disagreement_score":0.86582536,"about_ca_system_score_codex":0.0013752733,"about_ca_system_score_gemma":0.001712749,"threshold_uncertainty_score":0.19138384},"labels":[],"label_agreement":null},{"id":"W4401975984","doi":"10.1139/cjc-2024-0006","title":"Synthesis, characterization, volatility, and thermal stability of fluorinated copper(II) aminoalkoxide complexes as potential vapour deposition precursors","year":2024,"lang":"en","type":"article","venue":"Canadian Journal of Chemistry","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Chemistry; Copper; Volatility (finance); Thermal stability; Thermal; Inorganic chemistry; Chemical vapor deposition; Organic chemistry; Chemical engineering; Thermodynamics","score_opus":0.008174001067976857,"score_gpt":0.21345910289793227,"score_spread":0.2052851018299554,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401975984","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9940959,0.0010757475,0.0034615765,0.00002668646,0.000011867913,0.00003855217,0.00024192019,0.000054443073,0.0009932513],"genre_scores_gemma":[0.9939725,0.00092509395,0.003671705,0.000011005223,0.000006832673,0.00003097886,0.0002068347,0.000025383773,0.0011495447],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998436,0.000018102952,0.000017395067,0.000030476289,0.000068102294,0.00002230731],"domain_scores_gemma":[0.9997851,0.000042293526,0.000059430455,0.000030516181,0.000059706144,0.000022865439],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025720967,0.00029930798,0.00019931213,0.00020231222,0.00014033512,0.00030135154,0.0002700411,0.00022511199,0.0005184534],"category_scores_gemma":[0.00039762416,0.00016420691,0.00012041449,0.00018019165,0.000152518,0.00015946092,0.00013070734,0.0002315623,0.0001860953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032447522,0.000005952623,0.0001062359,0.000031901425,0.000002886808,0.000034859713,0.000021590091,0.000104232095,0.9988416,0.000036662746,0.00002703416,0.000754501],"study_design_scores_gemma":[0.0000028109819,0.00006256228,0.0006302648,0.0000023692683,0.0000053621293,0.000056779038,0.000008687838,0.00038488794,0.9982097,0.000008558384,0.0006245858,0.0000034096643],"about_ca_topic_score_codex":0.0006855299,"about_ca_topic_score_gemma":0.000843934,"teacher_disagreement_score":0.0006855299,"about_ca_system_score_codex":0.00030778063,"about_ca_system_score_gemma":0.00012342882,"threshold_uncertainty_score":0.0022331476},"labels":[],"label_agreement":null},{"id":"W4404577368","doi":"10.1109/epeps61853.2024.10754302","title":"Analysis and Modeling of Controlled Silicon Substrate Roughness for Silver-Based Backside Metallization in Power Electronics Packaging","year":2024,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Moncton","funders":"","keywords":"Materials science; Silicon; Substrate (aquarium); Optoelectronics; Power electronics; Electronics; Surface roughness; Electronic packaging; Surface finish; Engineering physics; Electrical engineering; Composite material; Engineering; Voltage","score_opus":0.015919696167484978,"score_gpt":0.27880754377037653,"score_spread":0.2628878476028916,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404577368","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.36978704,0.0007422306,0.61968225,0.00011915252,0.00006181209,0.000111912625,0.00018656987,0.0009794272,0.008329567],"genre_scores_gemma":[0.96271175,0.0003191663,0.03516927,0.0000116188485,0.000010312388,0.000040069222,0.00008185854,0.000060855193,0.0015951629],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998889,0.000012976317,0.0000037864131,0.000021276803,0.00005803171,0.00001497704],"domain_scores_gemma":[0.9998963,0.00003701059,0.000017117416,0.000022075597,0.000023429422,0.0000039273978],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018503069,0.0003306394,0.00024398284,0.00014719508,0.00011003793,0.00035158673,0.00048273953,0.00048687385,0.0005259241],"category_scores_gemma":[0.0003393513,0.00022154604,0.00051764556,0.00009357531,0.00016120604,0.00028687678,0.00011525746,0.0002103535,0.00020268661],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000045921934,0.000050616076,0.0013364486,0.00013002339,0.000032765012,0.00021295942,0.00007928827,0.70919394,0.27127358,0.0027463809,0.00037736815,0.014520657],"study_design_scores_gemma":[0.0000020076786,0.000022716256,0.0005096213,0.0000014435992,0.000004540202,0.00001663008,0.000004782265,0.987966,0.011072917,0.00010601236,0.00028968835,0.0000035772384],"about_ca_topic_score_codex":0.0024501602,"about_ca_topic_score_gemma":0.0021800252,"teacher_disagreement_score":0.0024501602,"about_ca_system_score_codex":0.00034583002,"about_ca_system_score_gemma":0.00029175004,"threshold_uncertainty_score":0.0048717856},"labels":[],"label_agreement":null},{"id":"W4406243282","doi":"10.1063/5.0241912","title":"Electron scattering at interfaces in Ru(0001)/Co(0001) multilayers","year":2025,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Empire State Development's Division of Science, Technology and Innovation; Semiconductor Research Corporation; Canadian Light Source; National Science Foundation","keywords":"Materials science; Scattering; Electron scattering; Condensed matter physics; Chemistry; Crystallography; Physics; Optics","score_opus":0.00990852362814767,"score_gpt":0.27710731717213366,"score_spread":0.267198793543986,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4406243282","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9976351,0.00033905372,0.0010627859,0.000016376476,0.000005136758,0.000004099949,0.00008352094,0.0000853552,0.00076848577],"genre_scores_gemma":[0.99848205,0.00020132856,0.0007828005,0.000013471679,0.0000033136564,0.0000059985005,0.00007911827,0.000014903059,0.00041706738],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99984,0.000012201201,0.0000070668825,0.000040329815,0.000054347805,0.000046091358],"domain_scores_gemma":[0.9998567,0.000035073135,0.000040290353,0.000012379704,0.000039727798,0.000015892127],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015528695,0.00036707512,0.00034373047,0.00044058778,0.0003147361,0.0004740926,0.00024342355,0.0002618945,0.00083089137],"category_scores_gemma":[0.000298874,0.00029435428,0.00018727242,0.00026635925,0.0002037018,0.00034054669,0.0002535177,0.0002570101,0.00020335717],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006293704,0.000009350921,0.0010793814,0.00003824346,0.000011409645,0.00012795615,0.000059162234,0.0003433008,0.99698573,0.000096971795,0.000038509937,0.0011469888],"study_design_scores_gemma":[0.000014617669,0.0000925771,0.023112444,0.000015884076,0.000043199263,0.00021998755,0.00018958397,0.008530295,0.96689224,0.00009076261,0.0007790107,0.000019453964],"about_ca_topic_score_codex":0.002516543,"about_ca_topic_score_gemma":0.0017482792,"teacher_disagreement_score":0.002516543,"about_ca_system_score_codex":0.00051719457,"about_ca_system_score_gemma":0.00011059916,"threshold_uncertainty_score":0.00500381},"labels":[],"label_agreement":null},{"id":"W4410153284","doi":"10.1109/tcad.2025.3567885","title":"Novel Partitioning-Based Approach for Electromigration Assessment With Neural Networks","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"China Scholarship Council; Natural Sciences and Engineering Research Council of Canada; National Natural Science Foundation of China","keywords":"Electromigration; Artificial neural network; Computer science; Artificial intelligence; Materials science","score_opus":0.027018342445498528,"score_gpt":0.2539284508299839,"score_spread":0.22691010838448536,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410153284","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.015444713,0.00014911787,0.9825515,0.00007791338,0.000015117713,0.00004697844,0.000037243823,0.00038618594,0.0012912407],"genre_scores_gemma":[0.60987586,0.00025659445,0.38524923,0.00017507901,0.000057933823,0.00037247816,0.0002784212,0.00010638521,0.003628073],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9997423,0.000057806585,0.000017878465,0.000070104914,0.00007558557,0.00003633424],"domain_scores_gemma":[0.9995944,0.00016617654,0.00004786327,0.000023270126,0.00014833198,0.00001993705],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00051807996,0.0009653944,0.0006010824,0.0009040667,0.0004268452,0.00075104256,0.0013027616,0.0011021082,0.0015735616],"category_scores_gemma":[0.0016313035,0.0004500182,0.0005394166,0.0006124299,0.00035779207,0.0008176145,0.0010401753,0.00063170324,0.00030237695],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006390283,0.00003706102,0.0007850859,0.00003574294,0.000036975372,0.00005666349,0.0000558114,0.8691722,0.0044095917,0.0026876258,0.0005280014,0.12213125],"study_design_scores_gemma":[0.0000010360193,0.0000062081776,0.0000513527,0.0000015595444,0.0000027550118,0.0000036474767,0.000003135162,0.99905056,0.00033104594,0.00046282847,0.00008422681,0.0000016127323],"about_ca_topic_score_codex":0.0071794917,"about_ca_topic_score_gemma":0.0075200954,"teacher_disagreement_score":0.0071794917,"about_ca_system_score_codex":0.0007431269,"about_ca_system_score_gemma":0.0007047924,"threshold_uncertainty_score":0.014275432},"labels":[],"label_agreement":null},{"id":"W4414310101","doi":"10.1109/icept67137.2025.11157529","title":"Electrolytic Cu plating and anti-tarnish influence on Cu Layer oxidation","year":2025,"lang":"en","type":"article","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nexen (Canada)","funders":"","keywords":"Copper; Plating (geology); Lead frame; Layer (electronics); X-ray photoelectron spectroscopy; Scanning electron microscope; Electrolyte; Copper plating","score_opus":0.009782971303297774,"score_gpt":0.26853252972154623,"score_spread":0.2587495584182485,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4414310101","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9916345,0.0031335864,0.0038062292,0.00005046432,0.00004213879,0.000019180141,0.00004838041,0.0000652997,0.0012001836],"genre_scores_gemma":[0.9949818,0.0013977226,0.0025568234,0.000022925862,0.000012135549,0.0000071707505,0.00003695915,0.00001993888,0.00096457114],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99976355,0.00002900562,0.000016932645,0.00006172017,0.00009414092,0.000034634522],"domain_scores_gemma":[0.9995896,0.00013129134,0.00009126884,0.00003472324,0.00012765656,0.000025422489],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018818406,0.00043426896,0.00028399707,0.00023793818,0.00015915195,0.00038699052,0.00026848362,0.0002911865,0.0009052705],"category_scores_gemma":[0.00066639675,0.00026798542,0.00021061579,0.00019358199,0.00023875583,0.00036532697,0.00019755594,0.00026023382,0.00017549205],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014405712,0.000019699542,0.0012973669,0.00025386707,0.000016754682,0.00009976147,0.00007476856,0.0003512714,0.9893824,0.00009087995,0.00007812309,0.008191127],"study_design_scores_gemma":[0.000003352978,0.00018128403,0.0024211477,0.000005481832,0.000039944156,0.00007151161,0.000039559483,0.000898585,0.99569845,0.000017471739,0.0006178449,0.0000054158795],"about_ca_topic_score_codex":0.00077264605,"about_ca_topic_score_gemma":0.0014388566,"teacher_disagreement_score":0.0009052705,"about_ca_system_score_codex":0.00021298074,"about_ca_system_score_gemma":0.00019963032,"threshold_uncertainty_score":0.0030284524},"labels":[],"label_agreement":null},{"id":"W642366636","doi":"10.1016/b978-1-78548-015-7.50002-0","title":"Interaction Plasma/Dielectric","year":2015,"lang":"en","type":"book-chapter","venue":"Elsevier eBooks","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Materials science; Plasma-enhanced chemical vapor deposition; Plasma; Etching (microfabrication); Dielectric; Fabrication; Plasma etching; Chemical vapor deposition; Porosity; Interconnection; Low-k dielectric; Plasma processing; Deposition (geology); Nanotechnology; Optoelectronics; Chemical engineering; Composite material; Computer science; Layer (electronics)","score_opus":0.029959948292560823,"score_gpt":0.2695906245235766,"score_spread":0.2396306762310158,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W642366636","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0011967468,0.018061053,0.010145047,0.0005984659,0.0016577145,0.00004791031,0.0002381457,0.0006789467,0.96737593],"genre_scores_gemma":[0.0036474504,0.0066055455,0.0029211997,0.00018870902,0.00019800315,0.000033811088,0.00020001376,0.00016431983,0.986041],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99980086,0.000010107773,0.0000055827986,0.00004470055,0.00012103809,0.000017660594],"domain_scores_gemma":[0.9999225,0.000014022532,0.0000048467464,0.000017937675,0.000029114304,0.000011571387],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017378226,0.0011231798,0.0005719196,0.0013675414,0.0009481677,0.0020311514,0.00086671737,0.0011866157,0.13522267],"category_scores_gemma":[0.000307524,0.00046628702,0.000370067,0.0015755382,0.0005372167,0.002229289,0.001793237,0.0015469026,0.08901297],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029545778,0.00005242868,0.00010279183,0.00046773718,0.0000080477475,0.00017947811,0.00020757949,0.00066277746,0.0096550975,0.06595799,0.25721636,0.6654601],"study_design_scores_gemma":[0.0000025062275,0.000013576606,0.00014120527,0.00008674178,0.0000031884947,0.000238558,0.00003232447,0.0003082313,0.0013772524,0.008349223,0.9894422,0.000004979354],"about_ca_topic_score_codex":0.0013281084,"about_ca_topic_score_gemma":0.0026204274,"teacher_disagreement_score":0.13522267,"about_ca_system_score_codex":0.00082473713,"about_ca_system_score_gemma":0.0006429842,"threshold_uncertainty_score":0.45236492},"labels":[],"label_agreement":null},{"id":"W6892702729","doi":"10.5281/zenodo.11926633","title":"Conrad elektronik katalog pdf","year":2024,"lang":"en","type":"other","venue":"Zenodo (CERN European Organization for Nuclear Research)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Collectable; BELLA; Jungle; Order (exchange); Ice cream; Caucus","score_opus":0.022462261085395358,"score_gpt":0.24782347786550177,"score_spread":0.2253612167801064,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6892702729","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00043256584,0.0010009579,0.00062722573,0.0011477298,0.0014580418,0.00009282804,0.006939427,0.0071756,0.9811257],"genre_scores_gemma":[0.0018523922,0.00051246886,0.0002271559,0.00038767344,0.00020503573,0.00003252454,0.0024807148,0.002084612,0.99221754],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9993461,0.000055080225,0.00003937409,0.00011116531,0.00033123867,0.00011708578],"domain_scores_gemma":[0.9986053,0.00017674746,0.000093428316,0.00028931524,0.0004785738,0.0003566623],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005874674,0.0010965968,0.0007752905,0.0022926563,0.0013559802,0.007616354,0.0011528383,0.0018030368,0.92108595],"category_scores_gemma":[0.0022513631,0.0007783441,0.0004978447,0.0020052409,0.0004027827,0.004997528,0.0031772812,0.0016449615,0.9206227],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040987292,0.000023406677,0.00008373672,0.000080168065,0.00000201698,0.000040118815,0.000018777291,0.000033709344,0.00020388962,0.0011497467,0.9544904,0.043832973],"study_design_scores_gemma":[0.000008569692,0.000006062247,0.00018435635,0.00003777489,0.0000012327295,0.000050421808,0.000028732988,0.000028220107,0.00020632248,0.000255426,0.9991874,0.000005492842],"about_ca_topic_score_codex":0.0017737378,"about_ca_topic_score_gemma":0.0027513704,"teacher_disagreement_score":0.07891405,"about_ca_system_score_codex":0.000969722,"about_ca_system_score_gemma":0.00092139194,"threshold_uncertainty_score":0},"labels":[],"label_agreement":null},{"id":"W6987125901","doi":"","title":"Schneider Electric and Alfa Laval Extend Collaboration","year":2021,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Work (physics); Government (linguistics); Context (archaeology); Field (mathematics)","score_opus":0.007968983316591835,"score_gpt":0.25647935366346464,"score_spread":0.2485103703468728,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6987125901","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.002169325,0.0009840874,0.007179246,0.0047831726,0.0015872278,0.00014528568,0.010717186,0.004483615,0.9679509],"genre_scores_gemma":[0.011608533,0.00066060084,0.0071935393,0.0010225987,0.00033480112,0.00012563296,0.017413057,0.003239077,0.9584022],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9977812,0.00023554394,0.000035084115,0.0002550128,0.0011453092,0.0005478258],"domain_scores_gemma":[0.993334,0.00046704014,0.00022089163,0.0011727859,0.0027324941,0.0020728142],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.004239151,0.002141348,0.001023763,0.0023507546,0.0024622339,0.0034017344,0.0025583727,0.0026340617,0.3895266],"category_scores_gemma":[0.0037293686,0.00043573088,0.0009515328,0.0017634076,0.00061539037,0.0025447686,0.003931185,0.0024362796,0.2892453],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00023869971,0.00009421765,0.00032114767,0.00012358294,0.000016524558,0.00007149547,0.00007759769,0.00044676752,0.001112062,0.029778413,0.87525624,0.09246331],"study_design_scores_gemma":[0.000031639418,0.000020826299,0.00026644574,0.000026587499,0.000006641432,0.00003588462,0.000033403703,0.00034743655,0.0010084684,0.0044368426,0.9937797,0.000006115673],"about_ca_topic_score_codex":0.012160715,"about_ca_topic_score_gemma":0.017367598,"teacher_disagreement_score":0.3895266,"about_ca_system_score_codex":0.003095481,"about_ca_system_score_gemma":0.007719436,"threshold_uncertainty_score":0.8707662},"labels":[],"label_agreement":null},{"id":"W6990482413","doi":"","title":"Direct laser deposition of graded W/Cu layers","year":2005,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"","score_opus":0.012753741471957014,"score_gpt":0.24531149454848783,"score_spread":0.23255775307653082,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6990482413","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9446453,0.001530617,0.011096084,0.00044186783,0.00077881257,0.00030267294,0.0005721792,0.001218564,0.039413854],"genre_scores_gemma":[0.9422789,0.0004927897,0.011999036,0.000116762945,0.00006162395,0.0001010451,0.00035057229,0.00024163457,0.04435763],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996642,0.000016280856,0.000019545749,0.000084194675,0.00015336771,0.00006244085],"domain_scores_gemma":[0.9995555,0.000046263307,0.000050664177,0.0001142299,0.00019985283,0.000033465556],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028840537,0.00020100512,0.00034038926,0.00039564417,0.0005158923,0.00059479335,0.00042057564,0.000376975,0.0085053975],"category_scores_gemma":[0.0006967102,0.0002945502,0.0001561526,0.000307891,0.00020114605,0.0004527783,0.00042089005,0.0004490119,0.0017607681],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015289838,0.000029376344,0.0006795831,0.00020305258,0.000013139643,0.00018974619,0.0001456092,0.00020249565,0.97954327,0.00059348554,0.0039139725,0.014333309],"study_design_scores_gemma":[0.000018202296,0.000121396624,0.002824383,0.000011902799,0.000013766795,0.00012462832,0.000091494476,0.0011000976,0.98072994,0.000091124915,0.014859648,0.000013351979],"about_ca_topic_score_codex":0.0017787386,"about_ca_topic_score_gemma":0.0060809194,"teacher_disagreement_score":0.0085053975,"about_ca_system_score_codex":0.00041341578,"about_ca_system_score_gemma":0.00066987664,"threshold_uncertainty_score":0.02845341},"labels":[],"label_agreement":null},{"id":"W6996059206","doi":"","title":"Preparation of the Ru-Pt alloyed thin-films by chemical vapor deposition using single source precursor","year":2002,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Chemical vapor deposition; Deposition (geology); Process (computing); Substrate (aquarium); Decomposition","score_opus":0.019186915604825567,"score_gpt":0.25239091617998216,"score_spread":0.23320400057515658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6996059206","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9272766,0.0021374535,0.029198974,0.0007352768,0.00051837636,0.0010059295,0.0020081836,0.001369538,0.035749592],"genre_scores_gemma":[0.886755,0.0018310107,0.05229877,0.00013934974,0.00010893871,0.00031931623,0.0021684996,0.00050139625,0.055877697],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998828,0.000007432718,0.0000087552435,0.000029413797,0.000055490418,0.000016033006],"domain_scores_gemma":[0.9997732,0.000033584594,0.00002303859,0.00004772405,0.00010136913,0.000021013055],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015076682,0.00022222729,0.0004714543,0.00035651287,0.0004449041,0.0003256537,0.00041225168,0.0003616247,0.008143275],"category_scores_gemma":[0.0005276916,0.0004165167,0.00018494073,0.00026032713,0.00011699072,0.00030084173,0.00014989442,0.00057309173,0.0025525738],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004272585,0.000011477069,0.00013222863,0.00012377527,0.0000062993713,0.000139778,0.00004167517,0.00007404618,0.99409026,0.0002133662,0.00073330826,0.0043910304],"study_design_scores_gemma":[0.000011776906,0.00007558364,0.0011899818,0.0000074920345,0.000010644907,0.00013014201,0.000024669274,0.0005621264,0.9901979,0.000049099,0.007733851,0.000006688237],"about_ca_topic_score_codex":0.000908597,"about_ca_topic_score_gemma":0.0023127715,"teacher_disagreement_score":0.008143275,"about_ca_system_score_codex":0.00022379075,"about_ca_system_score_gemma":0.00036629627,"threshold_uncertainty_score":0.027241945},"labels":[],"label_agreement":null},{"id":"W70003066","doi":"","title":"VIBRATIONAL SPECTRA AND STRUCTURE OF HEXACHLORO-DISILOXANE","year":2006,"lang":"en","type":"article","venue":"The Knowledge Bank (The Ohio State University)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Disiloxane; Spectral line; Chemistry; Physics; Organic chemistry; Catalysis","score_opus":0.007585979510271019,"score_gpt":0.1994402726598114,"score_spread":0.1918542931495404,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W70003066","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9912743,0.000627422,0.0024670952,0.000057394023,0.000013476602,0.0000075390976,0.00059767574,0.000026884622,0.0049282387],"genre_scores_gemma":[0.99272996,0.00047816525,0.0013044485,0.000023039773,0.0000033849078,0.0000075270045,0.00090461253,0.000011004251,0.0045376793],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999124,0.000005808332,0.0000028614418,0.000016479531,0.000034449196,0.000028020466],"domain_scores_gemma":[0.99989724,0.000025313684,0.000019689347,0.0000069684834,0.000031670937,0.00001908286],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007189158,0.00019492481,0.00008034028,0.00044498759,0.0003343216,0.00019057571,0.00019424799,0.00014089531,0.0044400166],"category_scores_gemma":[0.00010581664,0.00010769016,0.000064480075,0.00045097026,0.0002049897,0.00011210093,0.00016694097,0.000174834,0.00038983105],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014580441,0.000017773305,0.0018610994,0.000084657484,0.0000050369126,0.00019575085,0.00020955507,0.0010496957,0.9879632,0.00080725714,0.00030065223,0.0073594577],"study_design_scores_gemma":[0.0000068753343,0.00024075428,0.03013092,0.000016312051,0.000008105389,0.00017940908,0.0005936639,0.0042489343,0.9585035,0.00031523567,0.0057320828,0.000024181889],"about_ca_topic_score_codex":0.0024531973,"about_ca_topic_score_gemma":0.0029817203,"teacher_disagreement_score":0.0044400166,"about_ca_system_score_codex":0.0002192436,"about_ca_system_score_gemma":0.00014413337,"threshold_uncertainty_score":0.014853299},"labels":[],"label_agreement":null},{"id":"W7000625034","doi":"","title":"FY2018 EPS Estimates for Power Co. of Canada Cut by Desjardins (POW)","year":2017,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Power (physics); Government (linguistics); Estimation; Margin (machine learning)","score_opus":0.011099714902549442,"score_gpt":0.27289794583076127,"score_spread":0.2617982309282118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7000625034","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.005716097,0.0036255482,0.0013838689,0.015040159,0.004339215,0.00021925531,0.06359499,0.001013922,0.9050669],"genre_scores_gemma":[0.007850516,0.001407297,0.0005781175,0.000560003,0.000099822944,0.00004063984,0.0073073586,0.00022526705,0.981931],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9984597,0.00003218102,0.000020994217,0.00007130648,0.0011070479,0.000308808],"domain_scores_gemma":[0.99750525,0.00005140478,0.000051450683,0.0000491946,0.0020630767,0.0002795513],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0010674415,0.0010792629,0.00041726325,0.0019747026,0.0026409319,0.0038754628,0.0009398928,0.0017827589,0.17212878],"category_scores_gemma":[0.0024941235,0.00044132656,0.00042899678,0.0014119544,0.00059400784,0.0016672838,0.0013702341,0.0022821256,0.05990335],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000058049747,0.000015239074,0.0004066771,0.00007101627,0.0000035559847,0.000037913254,0.00003545922,0.00021290673,0.00023717782,0.0056524053,0.9750186,0.01825096],"study_design_scores_gemma":[0.000007702205,0.000011091577,0.0027492382,0.00007213584,0.0000035744222,0.00002498565,0.00016188795,0.0001259435,0.00036775018,0.00062814186,0.99583936,0.000008159882],"about_ca_topic_score_codex":0.7893501,"about_ca_topic_score_gemma":0.90603703,"teacher_disagreement_score":0.21064991,"about_ca_system_score_codex":0.01931663,"about_ca_system_score_gemma":0.032335676,"threshold_uncertainty_score":0.57582814},"labels":[],"label_agreement":null},{"id":"W7009198451","doi":"","title":"Developments in materials and processes: key to advances in thin film design","year":2004,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Key (lock); Thin film; Troubleshooting","score_opus":0.016638802078575644,"score_gpt":0.26505558346900104,"score_spread":0.2484167813904254,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7009198451","genre_codex":"review","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.012068638,0.4540459,0.121025756,0.087369986,0.040783633,0.0004942815,0.00087399303,0.001190038,0.28214774],"genre_scores_gemma":[0.071015544,0.42906177,0.20535944,0.010057784,0.018413879,0.00029115877,0.0009852686,0.0009908956,0.2638243],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99859804,0.00019228477,0.000111587186,0.0002125048,0.00076287496,0.00012284298],"domain_scores_gemma":[0.99547994,0.0010171916,0.0002739919,0.0004253653,0.0023863923,0.0004171038],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00368206,0.00088685256,0.00081214524,0.0011122338,0.00093241385,0.0032970132,0.0013848896,0.003126737,0.02322644],"category_scores_gemma":[0.0044859415,0.00070853275,0.00042368498,0.0015332403,0.0016468061,0.005607672,0.0010977534,0.0060405065,0.012390452],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004161389,0.00039053653,0.0005821856,0.0033947446,0.000038288446,0.00033638388,0.00029892605,0.001765669,0.05049753,0.21179639,0.19979368,0.53068954],"study_design_scores_gemma":[0.00004532247,0.00026181337,0.00048569898,0.00033049664,0.000024557974,0.00037126042,0.000050850525,0.0017373117,0.028081056,0.026211068,0.94236475,0.000035726534],"about_ca_topic_score_codex":0.0011483808,"about_ca_topic_score_gemma":0.0019873192,"teacher_disagreement_score":0.02322644,"about_ca_system_score_codex":0.0016603534,"about_ca_system_score_gemma":0.0032208287,"threshold_uncertainty_score":0.0777002},"labels":[],"label_agreement":null},{"id":"W7010492101","doi":"","title":"The influence of texture on the reliability of aluminum and copper interconnects /","year":2000,"lang":"en","type":"dissertation","venue":"eScholarship@McGill (McGill)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Texture (cosmology); Reliability (semiconductor); Field (mathematics); Copper","score_opus":0.00918848473978877,"score_gpt":0.23440923680700101,"score_spread":0.22522075206721223,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7010492101","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9950159,0.000967678,0.00048335333,0.0000994016,0.00003532867,0.0000050268295,0.000064024265,0.00003282735,0.0032964507],"genre_scores_gemma":[0.998075,0.00012420531,0.00013298407,0.00000976561,0.000011795042,0.00000250898,0.000033551187,0.000018923007,0.0015912158],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998381,0.000030792256,0.0000051381203,0.000023099687,0.00005780385,0.000045076715],"domain_scores_gemma":[0.9992366,0.00022084157,0.00019617102,0.000042284595,0.00023678025,0.0000673051],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020326527,0.000104759034,0.000107250526,0.00025184866,0.0002631106,0.00050902815,0.00013662601,0.00016589748,0.0022533692],"category_scores_gemma":[0.0018071188,0.00012725813,0.000094633826,0.00016217766,0.00020900222,0.00017539569,0.00018191332,0.00016183102,0.0004306129],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0065437253,0.00022846663,0.08533988,0.00038080147,0.000120478675,0.0017056643,0.00066104095,0.019486278,0.76997906,0.0017380121,0.00415125,0.109665275],"study_design_scores_gemma":[0.00024144274,0.0042032315,0.2428188,0.00006817211,0.00025259756,0.0016566692,0.0009771255,0.06604762,0.6715657,0.0012052685,0.010875883,0.00008746746],"about_ca_topic_score_codex":0.0022015371,"about_ca_topic_score_gemma":0.0027665552,"teacher_disagreement_score":0.0022533692,"about_ca_system_score_codex":0.00042280846,"about_ca_system_score_gemma":0.00013443592,"threshold_uncertainty_score":0.0075383186},"labels":[],"label_agreement":null},{"id":"W7014706127","doi":"","title":"Production of capacitive films from Mn thin films: Effects of current density and film thickness","year":2006,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Capacitive sensing; Current density; Current (fluid); Production (economics); Thin film","score_opus":0.00992188567349074,"score_gpt":0.2350951766599173,"score_spread":0.22517329098642658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7014706127","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9785895,0.0010086277,0.006913232,0.00059888465,0.00028346383,0.00016015982,0.00043425526,0.00033241996,0.011679449],"genre_scores_gemma":[0.96571434,0.0008727725,0.01028496,0.0001261908,0.00009536589,0.000052301068,0.0007514461,0.00023065708,0.021872092],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99975556,0.000019982142,0.000015205963,0.00006164732,0.00011471798,0.00003274171],"domain_scores_gemma":[0.9993174,0.00011705641,0.00009827711,0.00010877818,0.00027680985,0.00008158966],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003741511,0.00025410453,0.00025239045,0.00025889842,0.00049730163,0.00052525406,0.00045238633,0.00037257498,0.005022384],"category_scores_gemma":[0.0010289502,0.00023185038,0.00016119068,0.00023899427,0.00011720086,0.0006577953,0.00024571503,0.00045295333,0.0013121039],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000043655637,0.000015796946,0.00020405359,0.00005204277,0.0000026548962,0.000049646493,0.000028879114,0.000022833476,0.99719137,0.000047016638,0.0003237855,0.0020183534],"study_design_scores_gemma":[0.000009815545,0.00009964211,0.0010425944,0.0000039643564,0.0000065359195,0.000048286354,0.000022311111,0.00020038716,0.9959462,0.00001251738,0.0026045232,0.0000031335169],"about_ca_topic_score_codex":0.00078175706,"about_ca_topic_score_gemma":0.0024228215,"teacher_disagreement_score":0.005022384,"about_ca_system_score_codex":0.00023690052,"about_ca_system_score_gemma":0.00018156657,"threshold_uncertainty_score":0.016801536},"labels":[],"label_agreement":null},{"id":"W7017102914","doi":"","title":"Application des systèmes de calcul à haute performance dans les études électrothermiques à l'échelle nanoscopique","year":2011,"lang":"fr","type":"dissertation","venue":"Le dépôt institutionnel (Université du Québec à Trois-Rivières)","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"Université du Québec à Trois-Rivières","keywords":"Field (mathematics); Process (computing); Stability (learning theory)","score_opus":0.015375869805732526,"score_gpt":0.21463869960210377,"score_spread":0.19926282979637125,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7017102914","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.08350463,0.0024716035,0.8895793,0.0005763101,0.00026256026,0.00028206967,0.0003389051,0.0093252035,0.013659395],"genre_scores_gemma":[0.48086873,0.0019425107,0.49431723,0.00041239656,0.00009753479,0.000430645,0.00049567834,0.00050908874,0.020926155],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99916196,0.00012738188,0.00004346492,0.00018202813,0.0004295889,0.000055543565],"domain_scores_gemma":[0.99852765,0.0006165381,0.00013337062,0.00020827101,0.00048105276,0.00003316373],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014256062,0.00060392893,0.0006739191,0.0008259774,0.0006764744,0.001844948,0.000723244,0.0010067174,0.0059777456],"category_scores_gemma":[0.0029723183,0.00045687714,0.000448667,0.00091406435,0.00058242545,0.0015265937,0.0008905605,0.0009904456,0.0015113077],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040995248,0.00015128702,0.0050337114,0.0012920554,0.00011154791,0.00036078467,0.0013236634,0.044092946,0.5764958,0.017504375,0.0042721555,0.34895173],"study_design_scores_gemma":[0.00005322235,0.00037382447,0.0061937277,0.00013135425,0.00009273878,0.00062210154,0.00025303988,0.31207982,0.575864,0.0045611053,0.09967615,0.00009891631],"about_ca_topic_score_codex":0.002879684,"about_ca_topic_score_gemma":0.0034326548,"teacher_disagreement_score":0.0059777456,"about_ca_system_score_codex":0.0009612275,"about_ca_system_score_gemma":0.0009973533,"threshold_uncertainty_score":0.019997537},"labels":[],"label_agreement":null},{"id":"W7025151048","doi":"","title":"Tailoring the microstructure and surface morphology of metal thin films for nano-electro-mechanical systems applications","year":2008,"lang":"en","type":"article","venue":"NPARC","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Microstructure; Thin film; Morphology (biology); Metal; Surface (topology)","score_opus":0.017709702594726384,"score_gpt":0.246645939101016,"score_spread":0.22893623650628964,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7025151048","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95798403,0.0020423105,0.010243115,0.0026088762,0.0010469671,0.000142951,0.00027936502,0.0006196187,0.025032824],"genre_scores_gemma":[0.95314735,0.0014110463,0.010685391,0.00036359165,0.00024275322,0.000050009945,0.0002773381,0.00025114982,0.033571426],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998523,0.000021847516,0.000008769533,0.000026573429,0.000069284884,0.000021151118],"domain_scores_gemma":[0.9994031,0.00008413762,0.000059329555,0.000060339193,0.0003519784,0.00004115851],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029717942,0.00014018625,0.00022454478,0.00017352792,0.00037457078,0.0005800467,0.00024205346,0.00043115573,0.0074267974],"category_scores_gemma":[0.001129118,0.00019469374,0.00010592718,0.00017287393,0.00013243059,0.00047276926,0.00015577798,0.0003255187,0.0025859147],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008119326,0.000026288597,0.0013538174,0.00011173213,0.0000058967394,0.000101735684,0.000051965864,0.00014301583,0.97381955,0.00025765543,0.003251995,0.020795185],"study_design_scores_gemma":[0.00003569903,0.00020618351,0.007476636,0.000012712408,0.000018206332,0.0002140092,0.00013824749,0.0031095233,0.9661067,0.00023908608,0.022428023,0.000014906457],"about_ca_topic_score_codex":0.00031542094,"about_ca_topic_score_gemma":0.001179206,"teacher_disagreement_score":0.0074267974,"about_ca_system_score_codex":0.0001667596,"about_ca_system_score_gemma":0.00019608352,"threshold_uncertainty_score":0.024845123},"labels":[],"label_agreement":null},{"id":"W7043455354","doi":"","title":"Schneider Electric : and Alfa Laval Extend Collaboration","year":2021,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Work (physics); Government (linguistics); Context (archaeology); Field (mathematics)","score_opus":0.007901326200605772,"score_gpt":0.2556463170323327,"score_spread":0.24774499083172694,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7043455354","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0012275048,0.0011002138,0.0036189752,0.006122284,0.0017037246,0.00007405965,0.007480523,0.0037682436,0.9749044],"genre_scores_gemma":[0.0048090913,0.0005173473,0.00262814,0.00072695693,0.0002204519,0.000044186014,0.0064491355,0.002003559,0.9826011],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9984316,0.00012909959,0.000027807528,0.0001885292,0.0008900153,0.0003328438],"domain_scores_gemma":[0.996256,0.00028852312,0.0001375107,0.0005355203,0.0016779943,0.0011044719],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0025164962,0.0020062241,0.0008767123,0.0019629223,0.002115037,0.0038613474,0.0020721378,0.0027217888,0.51163775],"category_scores_gemma":[0.0028749066,0.00045839572,0.00082137366,0.0017051924,0.0006325346,0.0029565645,0.003148952,0.0024606325,0.4046343],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000106311345,0.000046686724,0.0001450779,0.00008333093,0.0000076774595,0.000044352888,0.000037888225,0.00025870057,0.0005088904,0.01670413,0.912635,0.0694219],"study_design_scores_gemma":[0.000016625252,0.000011852762,0.00014285064,0.000027358486,0.0000042547267,0.000026119247,0.000027373937,0.00020940632,0.00053737976,0.0029705444,0.996021,0.0000052463456],"about_ca_topic_score_codex":0.013112376,"about_ca_topic_score_gemma":0.018920776,"teacher_disagreement_score":0.48836225,"about_ca_system_score_codex":0.0030271958,"about_ca_system_score_gemma":0.0059374403,"threshold_uncertainty_score":0.69658947},"labels":[],"label_agreement":null},{"id":"W7151270643","doi":"10.1002/j.1538-9235.2000.tb03056.x","title":"(CL‐166) <b>SEVERITY AND MANAGEMENT OF CL RELATED COMPLICATIONS WITH CONTINUOUS WEAR OF HIGH DK SILICONE HYDROGEL LENSES.</b>","year":2000,"lang":"en","type":"article","venue":"Optometry and Vision Science","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Silicone; Silicone hydrogel; Silicone Elastomers","score_opus":0.009307609835372207,"score_gpt":0.33053453859749116,"score_spread":0.32122692876211895,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7151270643","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9103036,0.007843289,0.0033802511,0.0063725784,0.0007711471,0.0002501844,0.0030843385,0.00031946733,0.06767524],"genre_scores_gemma":[0.9886079,0.0012396496,0.0026118667,0.0013815635,0.00027827377,0.00009899341,0.0010625544,0.000028357868,0.0046909694],"study_design_codex":"design_other","study_design_gemma":"observational","domain_scores_codex":[0.9999312,0.000015954298,0.000013784348,0.000005920269,0.000019887755,0.000013179561],"domain_scores_gemma":[0.9995716,0.00011932742,0.00014131279,0.000017033088,0.000071614384,0.00007909659],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001813631,0.00010878129,0.000100787875,0.000481703,0.00016483376,0.00020827395,0.00016076473,0.0004491546,0.008026697],"category_scores_gemma":[0.0014585471,0.00005045257,0.0001980195,0.00019131106,0.0001284387,0.00019847883,0.00012028412,0.00033261187,0.0010566254],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.018688263,0.0014615204,0.27266508,0.00089600944,0.00015594948,0.01545962,0.00017002468,0.0014077962,0.019762568,0.0011501627,0.14655685,0.5216262],"study_design_scores_gemma":[0.000832866,0.0061473036,0.8825133,0.00047401988,0.00013018788,0.06426529,0.00026726988,0.0021452915,0.009991886,0.0010021011,0.032155566,0.000075031676],"about_ca_topic_score_codex":0.0028063236,"about_ca_topic_score_gemma":0.0040728003,"teacher_disagreement_score":0.008026697,"about_ca_system_score_codex":0.00023568729,"about_ca_system_score_gemma":0.00020759946,"threshold_uncertainty_score":0.026851952},"labels":[],"label_agreement":null},{"id":"W968404511","doi":"10.1017/cbo9781139021128.023","title":"Technology parameters","year":2013,"lang":"en","type":"other","venue":"","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Computer science; Content (measure theory); World Wide Web; Database; Mathematics","score_opus":0.010447549254215328,"score_gpt":0.23698706640531847,"score_spread":0.22653951715110315,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W968404511","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.013834461,0.00934238,0.034248237,0.0023774216,0.004159154,0.0016626932,0.11319633,0.012278998,0.80890024],"genre_scores_gemma":[0.10259153,0.01774956,0.02730254,0.0027883835,0.00084978703,0.0037773894,0.21021411,0.010539986,0.62418664],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99888545,0.00007867664,0.000075567536,0.00017094723,0.000649794,0.00013947292],"domain_scores_gemma":[0.99843615,0.00020909493,0.00008217768,0.00033324616,0.00081766053,0.00012163341],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014126982,0.0018372053,0.0014936883,0.0038588813,0.0012572716,0.0023283982,0.0024029515,0.0019203712,0.29577288],"category_scores_gemma":[0.004191126,0.0006308504,0.0010180576,0.0032656575,0.0002966693,0.003937215,0.0014361708,0.001985251,0.2726127],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005843566,0.00019243473,0.0014285875,0.0029801135,0.00006386683,0.0003155202,0.0001792767,0.004622531,0.055041928,0.022472136,0.7844856,0.12763365],"study_design_scores_gemma":[0.00003112125,0.00017210396,0.0008962287,0.00017066648,0.00004332926,0.000315587,0.00008205278,0.0007586005,0.017747706,0.003594888,0.9761404,0.000047408867],"about_ca_topic_score_codex":0.0016358154,"about_ca_topic_score_gemma":0.0015295285,"teacher_disagreement_score":0.29577288,"about_ca_system_score_codex":0.001755255,"about_ca_system_score_gemma":0.0011141081,"threshold_uncertainty_score":0.98945886},"labels":[],"label_agreement":null}]}