{"meta":{"query_hash":"eb89e626f34e","filters":{"topic":"Integrated Circuits and Semiconductor Failure Analysis"},"cohort_total":352,"direct_labels_cover":0,"predictions_cover":352,"exported":352,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/eb89e626f34e","api":"https://metacan.xera.ac/api/v1/cohort?topic=Integrated+Circuits+and+Semiconductor+Failure+Analysis"},"results":[{"id":"W1011275229","doi":"10.1007/1-84628-235-7_39","title":"Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section","year":2006,"lang":"en","type":"book-chapter","venue":"Engineering materials and processes","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Electron backscatter diffraction; Cross section (physics); Backscatter (email); Diffraction; Section (typography); Materials science; Electron diffraction; Electron; Optics; Physics; Computer science; Nuclear physics; Telecommunications; Astronomy","score_opus":0.00463241910086786,"score_gpt":0.20000278907922778,"score_spread":0.1953703699783599,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1011275229","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.963573,0.00966674,0.007219092,0.00012487023,0.0012739747,0.00087390584,0.00011759184,0.000647466,0.016503353],"genre_scores_gemma":[0.9917465,0.0014564757,0.000060646507,0.000040549738,0.00059051963,0.00008586652,0.00013218114,0.00010465268,0.0057826205],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9990563,0.0000038789294,0.0003326183,0.0003135853,0.00008237136,0.00021129534],"domain_scores_gemma":[0.99967676,0.000028272758,0.0000471079,0.00013158834,0.00006263125,0.00005365091],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000090469475,0.0003346215,0.0003993822,0.00024465474,0.00003203274,0.00020249636,0.00006717805,0.00026369948,0.000089409805],"category_scores_gemma":[0.000011889576,0.00032978645,0.000023862878,0.00008370048,0.000011655105,0.0001661612,0.000017235981,0.00019920232,0.000013461019],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000043525084,0.000025878264,0.00016600752,0.011050383,0.00033354538,0.000019376372,0.0006819551,0.03351057,0.93992907,0.0038116728,0.0026625653,0.007765477],"study_design_scores_gemma":[0.0008179329,0.00024951686,0.0023922683,0.0033064107,0.00037612702,0.00017668972,0.000034470715,0.0026518188,0.3056486,0.0018294447,0.6790434,0.0034733198],"about_ca_topic_score_codex":0.000092892464,"about_ca_topic_score_gemma":0.00009578997,"teacher_disagreement_score":0.6763808,"about_ca_system_score_codex":0.00007384166,"about_ca_system_score_gemma":0.000012237628,"threshold_uncertainty_score":0.9999154},"labels":[],"label_agreement":null},{"id":"W1026180213","doi":"10.1017/cbo9780511534850.004","title":"Characterization of extended defects in semiconductors","year":2007,"lang":"en","type":"book-chapter","venue":"Cambridge University Press eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Characterization (materials science); Semiconductor; Materials science; Optoelectronics; Psychology; Nanotechnology","score_opus":0.01864021792277217,"score_gpt":0.187409026573162,"score_spread":0.16876880865038982,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1026180213","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.097041145,0.00008420704,0.00018951883,4.881046e-7,0.00020293621,0.0001937959,0.0001696886,0.00012031197,0.9019979],"genre_scores_gemma":[0.17550261,0.00020989055,0.00001517725,0.000012810127,0.000070951275,3.8516478e-7,0.000285704,0.00007863981,0.8238238],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.9989769,0.000014989354,0.00030859155,0.0002780692,0.00017745922,0.0002440233],"domain_scores_gemma":[0.9992855,0.000025321813,0.00014243813,0.0003339359,0.00012986982,0.0000829418],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0000849355,0.0003306547,0.0005187698,0.0006390959,0.000027466012,0.000012954961,0.0002621167,0.0004931743,0.000014636109],"category_scores_gemma":[0.000004039342,0.00039762715,0.00020123116,0.00003084506,0.00008235566,0.00009815279,0.00003977149,0.0004848877,0.000005101484],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003663082,0.000015684393,0.0000173675,0.00033697597,0.0004714341,0.00028870115,0.0002204003,0.00010093645,0.48044583,0.51523143,0.0012282045,0.0016064128],"study_design_scores_gemma":[0.001026808,0.00006853564,0.00017869932,0.0008405223,0.00074256916,0.00001885509,0.0001301851,0.001049664,0.25158235,0.000014239266,0.7428218,0.0015257483],"about_ca_topic_score_codex":0.00009122013,"about_ca_topic_score_gemma":0.000018747873,"teacher_disagreement_score":0.7415936,"about_ca_system_score_codex":0.00024384647,"about_ca_system_score_gemma":0.000040945957,"threshold_uncertainty_score":0.99984753},"labels":[],"label_agreement":null},{"id":"W1430515085","doi":"10.1096/fasebj.29.1_supplement.558.9","title":"Cyclophilin A, a Novel Component of <i>Listeria monocytogenes</i> Comet Tails","year":2015,"lang":"en","type":"article","venue":"The FASEB Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Cell biology; Cypa; Intracellular; Listeria; Actin; Motility; Comet; Biology; Cyclophilin A; Cell; Chemistry; Listeria monocytogenes; Biochemistry; Bacteria; Molecular biology; Astrobiology; Genetics","score_opus":0.045637390754815016,"score_gpt":0.23467358359842785,"score_spread":0.18903619284361284,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1430515085","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9896361,0.00094725256,0.006001936,0.00015479879,0.00054957764,0.000062486055,0.000048381513,0.000039938463,0.0025595315],"genre_scores_gemma":[0.99915636,0.000054387096,0.00032547856,0.00009395566,0.00021119436,0.00000193953,0.000011356786,0.00002270817,0.0001226535],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99900585,0.000044677403,0.00038821262,0.00007635747,0.00026358402,0.00022133725],"domain_scores_gemma":[0.99929696,0.00003280261,0.00010299508,0.0002420035,0.00017452567,0.0001506811],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00049024617,0.00014901054,0.00027653694,0.00011719917,0.00006640087,0.000060608534,0.00034934038,0.00005957901,0.00008412241],"category_scores_gemma":[0.000020728168,0.00009576923,0.00014786146,0.00019292715,0.000054359654,0.00010469085,0.0000207951,0.0003086426,0.000023406144],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001671736,0.000033210217,0.0002802473,0.0000086481205,0.00026192036,0.00001117531,0.00084407954,0.021984886,0.9715471,0.00020849315,0.004090801,0.00071269466],"study_design_scores_gemma":[0.0024228732,0.00017820369,0.0004617187,0.00012254465,0.00048673264,0.0012663039,0.0029752264,0.035223823,0.9262399,0.0015255419,0.028481668,0.00061546086],"about_ca_topic_score_codex":0.00003903744,"about_ca_topic_score_gemma":0.000026369802,"teacher_disagreement_score":0.045307223,"about_ca_system_score_codex":0.0000854394,"about_ca_system_score_gemma":0.000046856207,"threshold_uncertainty_score":0.3905356},"labels":[],"label_agreement":null},{"id":"W1451158137","doi":"10.7567/jjap.54.096602","title":"Effects of coating material on the fabrication accuracy of focused ion beam machining of insulators","year":2015,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Fabrication; Machining; Coating; Materials science; Ion beam; Focused ion beam; Beam (structure); Ion; Composite material; Metallurgy; Optics; Chemistry; Physics","score_opus":0.013761374474948372,"score_gpt":0.21193288451543799,"score_spread":0.1981715100404896,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1451158137","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9986955,0.000012129121,0.00043905954,0.00000547421,0.00012544119,0.000095471514,0.000002625041,0.000009104798,0.00061520044],"genre_scores_gemma":[0.9997155,0.000003971172,0.000099920435,0.0000090651165,0.00014882335,0.0000025553427,0.000002792545,0.000016673324,7.044355e-7],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989953,0.000027785649,0.0005154718,0.00005770133,0.00030477927,0.00009896613],"domain_scores_gemma":[0.9986794,0.00027154217,0.0005894764,0.00014273278,0.00027547037,0.000041383886],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00031576402,0.000114865994,0.00034684627,0.00008131177,0.000021615451,0.000010271428,0.00018259474,0.000047211885,0.0000046536466],"category_scores_gemma":[0.00010014814,0.000075591015,0.00010523953,0.00030467432,0.000032606487,0.00010726702,0.000011046464,0.00016876112,0.000001028964],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000682809,0.00005238998,0.00008068159,0.00006485526,0.0001319081,3.5107664e-7,0.004518982,0.0449052,0.94671124,0.0017927178,0.000023000739,0.0016503974],"study_design_scores_gemma":[0.00045128076,0.000101404316,0.00030070878,0.00007072947,0.00009481134,0.0000013524083,0.0011208109,0.0037929225,0.99288684,0.0011027616,0.0000065868207,0.000069780726],"about_ca_topic_score_codex":0.000023629545,"about_ca_topic_score_gemma":3.3941203e-7,"teacher_disagreement_score":0.046175618,"about_ca_system_score_codex":0.000036056794,"about_ca_system_score_gemma":0.000027267777,"threshold_uncertainty_score":0.3082512},"labels":[],"label_agreement":null},{"id":"W1519290835","doi":"10.1007/0-387-46547-2","title":"Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits","year":2007,"lang":"en","type":"book","venue":"Frontiers in electronic testing","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":53,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Very-large-scale integration; CMOS; Nano-; Metric (unit); Electronic circuit; Computer science; Electronic engineering; Materials science; Embedded system; Engineering; Electrical engineering; Composite material","score_opus":0.013518676340707617,"score_gpt":0.21189447028364705,"score_spread":0.19837579394293944,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1519290835","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0046436866,0.07036091,0.29682523,0.000027643555,0.006197215,0.0035701292,0.0002082901,0.0035443718,0.61462253],"genre_scores_gemma":[0.42531088,0.0009429572,0.111637525,0.0014916036,0.0070412233,0.0015426239,0.0042450167,0.004830505,0.44295767],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9950572,0.00004282536,0.0011566025,0.00095252576,0.00048539962,0.0023054273],"domain_scores_gemma":[0.99747634,0.0009479811,0.00035008846,0.0005763357,0.0004720554,0.00017719125],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0010155195,0.0009496129,0.0012724298,0.0023686693,0.00021000285,0.000099302546,0.00061769225,0.0008655018,0.000020337538],"category_scores_gemma":[0.0018744029,0.001066597,0.00045628127,0.0030382,0.00008067697,0.00019650284,0.00003676765,0.0021944253,0.000016102022],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":true,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000025101537,0.00012620748,0.006565286,0.0014897928,0.0030021768,0.00014488876,0.0005356106,0.032980908,0.011689057,0.0031381822,0.4462602,0.49404258],"study_design_scores_gemma":[0.002956953,0.0010102518,0.00010714111,0.0028080991,0.0020318737,0.00018781159,0.0003497971,0.28684515,0.0022482318,0.0155319115,0.68049395,0.0054288134],"about_ca_topic_score_codex":0.000060851733,"about_ca_topic_score_gemma":0.00009962122,"teacher_disagreement_score":0.48861375,"about_ca_system_score_codex":0.0040435237,"about_ca_system_score_gemma":0.00096435164,"threshold_uncertainty_score":0.99977976},"labels":[],"label_agreement":null},{"id":"W1522130534","doi":"10.1109/iscas.1998.706911","title":"Arbitrary band-limited pulse generation for built-in self-test applications","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Pulse generator; Computer science; Pulse (music); Generator (circuit theory); Electronic engineering; Chip; CMOS; Transmission (telecommunications); Electrical engineering; Engineering; Telecommunications; Physics; Power (physics)","score_opus":0.02099509564814714,"score_gpt":0.21230277478708234,"score_spread":0.1913076791389352,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1522130534","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.55850446,0.0034872948,0.20105028,0.001462167,0.0005145923,0.0031319389,0.00015845604,0.0031710148,0.22851981],"genre_scores_gemma":[0.99617183,0.00013429766,0.002102276,0.00014614132,0.00019021342,0.00029285153,0.00011272437,0.000026666048,0.000823027],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993732,0.0000057224674,0.00021250646,0.00016141571,0.000061697676,0.00018547158],"domain_scores_gemma":[0.99964625,0.000046858044,0.000014268029,0.00019867477,0.000049712304,0.0000442515],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000052644853,0.000115321935,0.00012815512,0.00014931938,0.00004667788,0.000041146086,0.00009496556,0.00008943394,0.0005592539],"category_scores_gemma":[0.000010962646,0.000106596075,0.000069281276,0.0003385392,0.000005947536,0.00012485536,0.000002316829,0.00009844059,0.00006833115],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000015295072,0.0003792906,0.0015293357,0.00009441928,0.00024951872,0.0000042284078,0.00062909856,0.009422946,0.8895568,0.011013495,0.06907287,0.018046437],"study_design_scores_gemma":[0.00031242304,0.000020553702,0.00006967013,0.0000046737605,0.00005673215,0.0000032270357,0.000053617758,0.8982787,0.060822733,0.00022697225,0.039909583,0.00024108819],"about_ca_topic_score_codex":0.000028469181,"about_ca_topic_score_gemma":0.00023821241,"teacher_disagreement_score":0.88885576,"about_ca_system_score_codex":0.00005498723,"about_ca_system_score_gemma":0.0000046205973,"threshold_uncertainty_score":0.6123438},"labels":[],"label_agreement":null},{"id":"W1531479582","doi":"10.1109/ipfa.2015.7224371","title":"Optimization and application of Electron Beam Absorbed Current technique","year":2015,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Tungsten; Scanning electron microscope; Materials science; Resistive touchscreen; Current (fluid); Optoelectronics; Electromigration; Electron; Cathode ray; Contact resistance; Beam (structure); Voltage; Nanotechnology; Optics; Electrical engineering; Physics; Composite material; Engineering; Metallurgy","score_opus":0.008242698553805824,"score_gpt":0.22262253557214032,"score_spread":0.2143798370183345,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1531479582","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.025689086,0.0006971644,0.96950626,0.000011354382,0.00002818323,0.00014588711,0.0000016343514,0.00014084246,0.0037796136],"genre_scores_gemma":[0.9979201,0.00011014135,0.0018663916,0.0000037406953,0.000016738697,0.000026501131,0.000025607238,0.000009079337,0.000021718854],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996949,0.000004317537,0.00011169016,0.00006648375,0.000056841123,0.00006580958],"domain_scores_gemma":[0.9997864,0.0000040076425,0.000017559592,0.00008446182,0.00007535798,0.00003221264],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006890049,0.000055827644,0.00008309141,0.00007043544,0.000007193598,0.0000067717106,0.000036315476,0.000039456103,0.000008258848],"category_scores_gemma":[0.0000049856485,0.000047835823,0.0000150854885,0.00014629813,0.000009366631,0.00005904139,0.0000033614892,0.000056698118,0.0000020828707],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000037343602,0.000036749454,0.00026125825,0.00005962604,0.00006512069,1.2281672e-7,0.00022602941,0.55100447,0.4278066,0.0047739465,0.002860988,0.012901342],"study_design_scores_gemma":[0.00012010052,0.000029103287,0.00001269188,0.000007826188,0.000035015517,0.0000021027117,0.000049241702,0.41889897,0.5761724,0.00039564693,0.00415948,0.00011742404],"about_ca_topic_score_codex":0.000033938926,"about_ca_topic_score_gemma":0.000007852461,"teacher_disagreement_score":0.972231,"about_ca_system_score_codex":0.000027617649,"about_ca_system_score_gemma":0.000008422792,"threshold_uncertainty_score":0.19506884},"labels":[],"label_agreement":null},{"id":"W1551107378","doi":"10.1109/nssmic.1990.693474","title":"Etching of anode wire deposits with CF/sub 4//isobutane (80:20) avalanches","year":2005,"lang":"en","type":"article","venue":"1990 IEEE Nuclear Science Symposium Conference Record","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"TRIUMF","funders":"","keywords":"Isobutane; Anode; Etching (microfabrication); Materials science; Geology; Composite material; Chemistry; Electrode","score_opus":0.009274807012949223,"score_gpt":0.19674731098084425,"score_spread":0.18747250396789503,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1551107378","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98634166,0.00003057695,0.0009989531,0.00024187243,0.00035134875,0.00015138573,0.000013370361,0.00028446477,0.011586359],"genre_scores_gemma":[0.9953333,0.0002106801,0.0040356214,0.00009050197,0.00013726228,0.0000062697495,0.000003567349,0.000058867237,0.0001239418],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9976113,0.0000332083,0.00047557618,0.0005504002,0.0006255988,0.0007039295],"domain_scores_gemma":[0.9986642,0.000038241218,0.0001460866,0.0005537628,0.00035078856,0.000246892],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00033099498,0.00036044815,0.0004871975,0.0003829069,0.0002569812,0.00025927759,0.0008516511,0.00014459061,0.00015161335],"category_scores_gemma":[0.000017300372,0.00029741455,0.00011450774,0.0010528411,0.000450933,0.0010369846,0.00003854794,0.00042661227,0.000120563716],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000131589995,0.000033343997,0.00068239326,0.000038443886,0.00005669134,0.000008077362,0.0013361747,0.00522877,0.9716963,0.00044533776,0.00021955764,0.020241734],"study_design_scores_gemma":[0.00043543088,0.00029985257,0.00038194936,0.0003586826,0.00015917016,0.00011090667,0.0010631594,0.5514829,0.43962353,0.000058804464,0.005095228,0.0009303801],"about_ca_topic_score_codex":0.00017167082,"about_ca_topic_score_gemma":0.0005965772,"teacher_disagreement_score":0.54625416,"about_ca_system_score_codex":0.00018233739,"about_ca_system_score_gemma":0.00018839876,"threshold_uncertainty_score":0.9999478},"labels":[],"label_agreement":null},{"id":"W1556817027","doi":"10.1109/ipfa.2015.7224321","title":"Combining design simulations with nano-probing to root-cause a processor device glitch issue","year":2015,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Glitch; Root cause; Root (linguistics); Root cause analysis; Computer science; Isolation (microbiology); Reliability engineering; Microarchitecture; Embedded system; Engineering; Detector","score_opus":0.046690788301150914,"score_gpt":0.25602726143329396,"score_spread":0.20933647313214304,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1556817027","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.54990673,0.00020386849,0.42872658,0.00036699936,0.00019578988,0.00065667904,0.0000069247185,0.0011074515,0.018828964],"genre_scores_gemma":[0.99239624,7.8601676e-7,0.0060525844,0.00017538911,0.00006116961,0.000030719944,0.000012816663,0.000052106032,0.0012182039],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99898225,0.000025482412,0.00023416993,0.00022599567,0.00021214302,0.000319949],"domain_scores_gemma":[0.9991293,0.000058117126,0.000025640307,0.0002441976,0.00032413547,0.000218614],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016148035,0.0002093941,0.00023695805,0.00017969236,0.000078283585,0.00012228945,0.00016977236,0.00007939542,0.00014603553],"category_scores_gemma":[0.000056431367,0.00016137796,0.00003026207,0.00083216344,0.000011619039,0.0002743221,0.000013229227,0.00014771508,0.00018838349],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013054117,0.000025338735,0.0004780781,0.00002748956,0.0002447143,0.000008822097,0.004134251,0.9566051,0.033221763,0.00040084976,0.0042476486,0.0005929053],"study_design_scores_gemma":[0.0013824928,0.00036881154,0.000038177976,0.00024319314,0.00046246452,0.000030840736,0.0048050513,0.7955933,0.16440533,0.00031288675,0.031046003,0.0013114536],"about_ca_topic_score_codex":0.00014015677,"about_ca_topic_score_gemma":0.0005260923,"teacher_disagreement_score":0.4424895,"about_ca_system_score_codex":0.000104666884,"about_ca_system_score_gemma":0.00007751871,"threshold_uncertainty_score":0.6580802},"labels":[],"label_agreement":null},{"id":"W1585201048","doi":"10.1007/978-3-032-13094-5_10","title":"Modulation and Detection","year":2010,"lang":"en","type":"book-chapter","venue":"Signals and communication technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Modulation (music); Computer science; Content (measure theory); Telecommunications; Physics; Mathematics; Acoustics","score_opus":0.006984334365158525,"score_gpt":0.18421785139519148,"score_spread":0.17723351703003296,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1585201048","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.08208989,0.081577204,0.021368079,0.0024875342,0.0004678543,0.0011683127,0.00008162588,0.003925881,0.8068336],"genre_scores_gemma":[0.98442954,0.007441069,0.00035207014,0.00002174848,0.000020035808,0.000014916055,0.00003881657,0.000037218,0.0076446026],"study_design_codex":"design_other","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.9995118,0.000006177619,0.00019802849,0.00014444198,0.000051675383,0.00008792429],"domain_scores_gemma":[0.99935114,0.000023018543,0.00006778661,0.000455023,0.0000775869,0.000025449348],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007184385,0.00016623674,0.0002155459,0.00034683125,0.00011242034,0.000030585434,0.00014152574,0.00078934303,0.00011402368],"category_scores_gemma":[0.000006748428,0.00016687735,0.000031275005,0.000050000286,0.00014777575,0.000055301836,0.000043883563,0.0007209148,0.0000112871185],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000020478144,0.0000044920534,0.000011132308,0.000040702234,0.00020198234,8.492095e-7,0.000095195595,0.000043930737,0.35425326,0.17891227,0.00008885676,0.46634528],"study_design_scores_gemma":[0.00027944066,0.000086853375,0.000041028892,0.00016460149,0.00027188263,0.000070042646,0.00012639003,0.018652767,0.054959293,0.6019643,0.32256058,0.0008227943],"about_ca_topic_score_codex":0.000011676532,"about_ca_topic_score_gemma":0.00015973911,"teacher_disagreement_score":0.90233964,"about_ca_system_score_codex":0.000018235614,"about_ca_system_score_gemma":0.0000051969805,"threshold_uncertainty_score":0.6805061},"labels":[],"label_agreement":null},{"id":"W1602501894","doi":"10.1109/natw.2015.16","title":"Satisfiability-Based Analysis of Failing Traces during Post-silicon Debug","year":2015,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Compute Canada; CMC Microsystems","keywords":"Debugging; Computer science; Software bug; Programming language; Satisfiability; Identification (biology); Boolean satisfiability problem; Chip; Parallel computing; Embedded system; Algorithm; Theoretical computer science; Software","score_opus":0.013328053409330526,"score_gpt":0.2127490984037214,"score_spread":0.19942104499439087,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1602501894","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99427605,0.00020052795,0.001919715,0.000037775968,0.000065568,0.00006400177,0.000022694981,0.00022864183,0.003185023],"genre_scores_gemma":[0.9993591,0.000004411454,0.00041668455,0.000027905291,0.000021467285,0.000003789439,0.00004831925,0.000020019485,0.00009834134],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988658,0.000035775407,0.00042138243,0.00020989688,0.00023446136,0.00023270074],"domain_scores_gemma":[0.99913883,0.00006458328,0.000048024005,0.00035127313,0.00027070835,0.00012659359],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023820734,0.00017719468,0.00046691822,0.0006362624,0.000029489058,0.00003281972,0.00015977302,0.00010323578,0.000412276],"category_scores_gemma":[0.00007526991,0.00014999125,0.00029489413,0.0013390647,0.0000358427,0.00015672196,0.0000079129195,0.00013514089,0.000012758259],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000014607962,0.000046851543,0.035688102,0.0000817496,0.0024383352,0.000004840122,0.0010863352,0.54748356,0.41095695,0.0003109211,0.00008590568,0.0018018485],"study_design_scores_gemma":[0.00048436777,0.00004766589,0.009398534,0.000018199415,0.0021092957,0.0000011379483,0.0024827772,0.47518158,0.5096258,0.00006321727,0.00017345516,0.00041399844],"about_ca_topic_score_codex":0.0008218553,"about_ca_topic_score_gemma":0.0016730768,"teacher_disagreement_score":0.09866883,"about_ca_system_score_codex":0.00008722502,"about_ca_system_score_gemma":0.000045632252,"threshold_uncertainty_score":0.61164653},"labels":[],"label_agreement":null},{"id":"W1624047868","doi":"10.1109/iscas.1993.394044","title":"Towards built-in-self-test for SNR testing of a mixed-signal IC","year":2002,"lang":"en","type":"article","venue":"1993 IEEE International Symposium on Circuits and Systems","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Mixed-signal integrated circuit; Computer science; Built-in self-test; Very-large-scale integration; Analog signal; Chip; Noise (video); Microprocessor; SIGNAL (programming language); Digital signal; Electronic engineering; Analogue electronics; Analog-to-digital converter; Signal-to-noise ratio (imaging); Computer hardware; Integrated circuit; Embedded system; Digital signal processing; Engineering; Electronic circuit; Electrical engineering; Artificial intelligence; Telecommunications","score_opus":0.03415078841264174,"score_gpt":0.23741656290345914,"score_spread":0.2032657744908174,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1624047868","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9512536,0.0011359304,0.003006679,0.00021045297,0.0034625658,0.0007085493,0.0003504818,0.00026997738,0.03960175],"genre_scores_gemma":[0.9989352,0.00010538816,0.000037372483,0.00002641276,0.0004082764,0.000081974205,0.000018383322,0.00004242591,0.00034454346],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9983773,0.000026679048,0.00063879153,0.0003081655,0.000353279,0.00029577254],"domain_scores_gemma":[0.9990314,0.0003329468,0.00012848878,0.00017850516,0.00024376831,0.000084867555],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028086407,0.00024773122,0.00040803594,0.00027257833,0.0000520854,0.00010237163,0.0002803129,0.00014188349,0.00004646232],"category_scores_gemma":[0.000058308127,0.0002266668,0.00012340586,0.00025173067,0.000026660637,0.00014806181,0.000009078605,0.00017354796,0.000014626675],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015813339,0.0007880846,0.028348813,0.0011246498,0.001444354,0.00006781374,0.0027021933,0.052992344,0.861467,0.013694502,0.009835331,0.027519077],"study_design_scores_gemma":[0.0018385923,0.0004655831,0.0015011997,0.00084514497,0.00014733836,0.00012617101,0.00037085637,0.9463049,0.029742839,0.00019256285,0.017612021,0.0008527669],"about_ca_topic_score_codex":0.0003355311,"about_ca_topic_score_gemma":0.000054950706,"teacher_disagreement_score":0.8933126,"about_ca_system_score_codex":0.00016084632,"about_ca_system_score_gemma":0.000013817904,"threshold_uncertainty_score":0.92432034},"labels":[],"label_agreement":null},{"id":"W1666433991","doi":"10.1109/ipfa.2003.1222743","title":"Application of memory tester for non-destructive detection of micro-crack and crack patterns in flash memory devices","year":2004,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Flash memory; Computer science; Non-volatile memory; Memory leak; Memory cell; Flash (photography); Semiconductor memory; Memory management; Computer hardware; Electrical engineering; Engineering; Transistor; Optics; Voltage; Physics","score_opus":0.005243827254258779,"score_gpt":0.2032787527368597,"score_spread":0.1980349254826009,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1666433991","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97818166,0.000048078025,0.02086446,0.0000104132505,0.000037669357,0.00024347953,0.000014284973,0.0000230199,0.00057690917],"genre_scores_gemma":[0.99918485,0.000013860821,0.00068034267,0.000017823659,0.00002486319,0.000032400334,0.000009347296,0.000017024118,0.000019480125],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999388,0.0000054772972,0.0002832511,0.00014870196,0.000061737075,0.00011287906],"domain_scores_gemma":[0.9996537,0.000035627392,0.000067251116,0.00013015686,0.00009023107,0.000023014325],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007524514,0.00011147266,0.00021420974,0.00016710807,0.000014242783,0.000008618252,0.0000647969,0.000091552,0.000008720899],"category_scores_gemma":[0.00000691598,0.0001007813,0.000053440144,0.00017202855,0.000025577465,0.00015066311,0.000006920565,0.0000775771,0.0000020274547],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000087166645,0.000018795708,0.0024282401,0.00021295012,0.000061497565,2.1712637e-7,0.00080540293,0.0038816535,0.98384607,0.000046114408,0.0000035405787,0.008686782],"study_design_scores_gemma":[0.0004889781,0.00004309349,0.008970654,0.00004734606,0.00005658458,0.0000026394057,0.0010985818,0.0067625134,0.9817979,0.00058530475,0.000019835097,0.00012658368],"about_ca_topic_score_codex":0.0005249868,"about_ca_topic_score_gemma":0.0022410292,"teacher_disagreement_score":0.021003172,"about_ca_system_score_codex":0.000053171145,"about_ca_system_score_gemma":0.000009574234,"threshold_uncertainty_score":0.4109742},"labels":[],"label_agreement":null},{"id":"W1673785895","doi":"10.1063/1.2401449","title":"The Role of Ion Beam Technology in the Development of Integrated Optical Monitors Suitable for Applications in Silicon Photonics","year":2006,"lang":"en","type":"article","venue":"AIP conference proceedings","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"McMaster University; Ontario Centres of Excellence","keywords":"Photocurrent; Ion implantation; Optoelectronics; Materials science; Photonics; Silicon photonics; Silicon; Optical isolator; Diode; Focused ion beam; Ion beam; Optics; Ion; Beam (structure); Optical fiber; Chemistry; Physics","score_opus":0.008190605933231678,"score_gpt":0.2137208397743589,"score_spread":0.20553023384112723,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1673785895","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99629194,0.00024355024,0.0011149313,0.00006708757,0.000015500997,0.0003905427,0.0000046481005,0.00003111028,0.0018406989],"genre_scores_gemma":[0.9990738,0.000021920961,0.0005073609,0.0000021551607,0.000007529911,0.00034643212,0.000014947927,0.000009809349,0.000016029415],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991278,0.000002718777,0.00041900607,0.00012780813,0.0001032731,0.000219371],"domain_scores_gemma":[0.9994876,0.00007337834,0.00006733045,0.00009155409,0.0002686847,0.000011448983],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028855522,0.00011526285,0.00019175268,0.00019535793,0.00005437951,0.0000279412,0.00033340085,0.00013926088,0.0000029601329],"category_scores_gemma":[0.000042417985,0.00007304881,0.000034079516,0.0007442084,0.00007861231,0.000066574365,0.000013311563,0.00021865462,6.919965e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007495751,0.00008213444,0.037512794,0.000048242888,0.00003123274,6.060935e-8,0.0019825175,0.00012700788,0.8743283,0.08086996,0.000032271113,0.0049779764],"study_design_scores_gemma":[0.00021619567,0.00004105395,0.0023280687,0.00007003132,0.000028007853,0.0000010470727,0.028012054,0.029559536,0.92087656,0.013210807,0.005494091,0.00016251643],"about_ca_topic_score_codex":0.00012935809,"about_ca_topic_score_gemma":0.00035010406,"teacher_disagreement_score":0.067659155,"about_ca_system_score_codex":0.000073883326,"about_ca_system_score_gemma":0.000082606966,"threshold_uncertainty_score":0.2978844},"labels":[],"label_agreement":null},{"id":"W1697534005","doi":"10.1109/icwsi.1994.291238","title":"Comparison of laser link crossbar and Omega network switching for wafer-scale integration defect avoidance","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Laser; Crossbar switch; Network switch; Computer science; Flexibility (engineering); Transistor; SIGNAL (programming language); Wafer; Scale (ratio); Electronic engineering; Topology (electrical circuits); Electrical engineering; Engineering; Computer network; Physics; Voltage; Mathematics; Optics","score_opus":0.022379115024303314,"score_gpt":0.2513231531634081,"score_spread":0.22894403813910477,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1697534005","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8469779,0.0017688659,0.14484535,0.0000828904,0.00021658516,0.00019453594,0.000009177994,0.0001624718,0.0057422025],"genre_scores_gemma":[0.99715537,0.00006246973,0.002089057,0.000049816033,0.00015703523,0.0000145174945,0.000013753855,0.000023469054,0.00043454207],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99922174,0.000014106089,0.00031391848,0.00015401002,0.000081479484,0.00021476902],"domain_scores_gemma":[0.9995935,0.0000907084,0.00004475151,0.00014856349,0.000075732045,0.000046776997],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012355049,0.0001458681,0.00030858457,0.00006104081,0.000085702806,0.000052659732,0.00007878599,0.00009210614,0.00010921819],"category_scores_gemma":[0.000019848063,0.00011947059,0.00012025208,0.00019095116,0.00001967847,0.00014287273,0.0000072240464,0.00017328479,0.000007705182],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000045887893,0.00016869105,0.033170983,0.00051215757,0.0010331036,0.0000021481412,0.009709638,0.3405492,0.35705742,0.0061595812,0.06971322,0.18187796],"study_design_scores_gemma":[0.00034191666,0.00007771828,0.00030925882,0.00006955497,0.00011680226,0.0000017619714,0.00037967792,0.89824027,0.092562005,0.0003913368,0.007252073,0.0002576094],"about_ca_topic_score_codex":0.000038600472,"about_ca_topic_score_gemma":0.00040000165,"teacher_disagreement_score":0.5576911,"about_ca_system_score_codex":0.000025778161,"about_ca_system_score_gemma":0.0000026820464,"threshold_uncertainty_score":0.48718694},"labels":[],"label_agreement":null},{"id":"W1716351663","doi":"10.1109/mwsym.2003.1212529","title":"Low RF loss and noise of transmission lines on Si substrates using an improved ion implantation process","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Materials science; Ion implantation; Optoelectronics; Noise (video); Electric power transmission; Electrical engineering; Transmission (telecommunications); Very-large-scale integration; Silicon; Proton; Insertion loss; Ion; Physics; Computer science; Engineering","score_opus":0.013183633519284171,"score_gpt":0.23840008177448807,"score_spread":0.2252164482552039,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1716351663","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9938314,0.00009002986,0.0052737147,0.000004365464,0.000042185027,0.000077104254,0.0000047298795,0.000057068406,0.0006194234],"genre_scores_gemma":[0.99962854,0.000047614507,0.0002323782,0.000011276312,0.000020240743,0.0000018993121,0.000020159338,0.000017426131,0.00002043393],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994415,0.000014198342,0.00019997977,0.00013859941,0.000077147066,0.00012858809],"domain_scores_gemma":[0.9997273,0.000013986065,0.00003068975,0.00008466378,0.00008710386,0.000056257435],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007017137,0.00012916351,0.00015772508,0.00010093643,0.000037064463,0.00002698928,0.000039805866,0.00008768012,0.000049528044],"category_scores_gemma":[0.0000061168103,0.000098974226,0.000032406995,0.00016971695,0.000016121307,0.00019975033,5.999685e-7,0.00008057761,6.8630084e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008979036,0.000035683715,0.0002536114,0.00011256383,0.000026671809,0.0000014119199,0.0003985658,0.013970853,0.9819362,0.00013265226,0.0000022694135,0.0031205106],"study_design_scores_gemma":[0.0001893686,0.00005614597,0.00009002842,0.000044854107,0.000041195963,0.000008594832,0.00031395335,0.13962337,0.8593636,0.00013697524,0.000009842477,0.00012203509],"about_ca_topic_score_codex":0.000064490414,"about_ca_topic_score_gemma":0.00004225415,"teacher_disagreement_score":0.12565252,"about_ca_system_score_codex":0.000013484194,"about_ca_system_score_gemma":0.000016789167,"threshold_uncertainty_score":0.40360516},"labels":[],"label_agreement":null},{"id":"W1794805256","doi":"10.1109/ats.1995.485327","title":"A new method for testing mixed analog and digital circuits","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Multiplexer; Sample and hold; Analog signal; Shift register; Analogue electronics; Mixed-signal integrated circuit; Analog multiplier; Computer science; Electronic engineering; Voltage; Electronic circuit; Analog device; Path (computing); SIGNAL (programming language); Built-in self-test; Electrical engineering; Multiplexing; Computer hardware; Engineering; Digital signal processing","score_opus":0.031535000811736096,"score_gpt":0.23333358709209948,"score_spread":0.20179858628036337,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1794805256","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.01897277,0.0007286186,0.89379644,0.00009527949,0.00014550262,0.00016429926,0.00002349453,0.00047762695,0.085595995],"genre_scores_gemma":[0.9667758,0.000010439832,0.02869696,0.00006741894,0.00013265148,0.000007955564,0.000010339462,0.000033272005,0.0042651645],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994163,0.000004670301,0.00015560066,0.00015497328,0.00006072954,0.00020770685],"domain_scores_gemma":[0.9995749,0.0001557302,0.000014493354,0.00010649688,0.000049625367,0.00009877448],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000054331595,0.00012554268,0.00017216834,0.000091784896,0.000041497777,0.00012730504,0.00006763064,0.000063598236,0.00021173117],"category_scores_gemma":[0.00009724408,0.00010675519,0.00005888481,0.00025267075,0.0000066218095,0.00018079269,0.000006106559,0.00007750646,0.000018497394],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[3.7485762e-7,0.000008342829,0.00024709335,0.000030311934,0.00019565539,0.0000034629254,0.00024772136,0.0008510567,0.0375739,0.0018486303,0.03195167,0.92704177],"study_design_scores_gemma":[0.00054434605,0.00007158439,0.00012327144,0.00002569711,0.00011948003,0.000049816448,0.00026012197,0.9485545,0.009749423,0.0019969433,0.038002685,0.0005021045],"about_ca_topic_score_codex":0.000050051774,"about_ca_topic_score_gemma":0.00002550127,"teacher_disagreement_score":0.947803,"about_ca_system_score_codex":0.000017930102,"about_ca_system_score_gemma":0.00000472254,"threshold_uncertainty_score":0.43533504},"labels":[],"label_agreement":null},{"id":"W1807221034","doi":"10.1109/iciprm.1995.522218","title":"Focused ion beam implantation-induced disordering in InGaAsP MQW heterostructures [studied by photoluminescence]","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Photoluminescence; Materials science; Ion implantation; Heterojunction; Optoelectronics; Gallium arsenide; Doping; Quantum well; Focused ion beam; Ion; Optics; Chemistry; Laser","score_opus":0.011713780630475039,"score_gpt":0.1893645981288084,"score_spread":0.17765081749833336,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1807221034","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.992753,0.00027328488,0.00020515037,0.00003113592,0.00026137586,0.00013261633,0.000010454992,0.00022554588,0.0061074123],"genre_scores_gemma":[0.9994288,0.000120223085,0.00004739005,0.00006549114,0.000046530677,0.000023695999,0.000032477285,0.00003332128,0.00020206014],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989271,0.000015103201,0.00033147432,0.00023761987,0.00014874406,0.00033995108],"domain_scores_gemma":[0.9996619,0.000033426226,0.000031931428,0.00018302587,0.000032022166,0.00005766227],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000491684,0.00022946874,0.0002735662,0.00019077581,0.00006839681,0.0000651089,0.0001508955,0.000118606105,0.00040818314],"category_scores_gemma":[0.000017309925,0.0002028295,0.000072507566,0.00043054007,0.000015364649,0.00019237738,0.00001210658,0.00023296005,0.00003118484],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000020199836,0.00002475564,0.0025251189,0.000023600856,0.00007801557,0.000005176271,0.00097650575,0.00067599735,0.98698235,0.000032296302,0.005025901,0.0036482401],"study_design_scores_gemma":[0.001463246,0.00007745406,0.0018102432,0.00007395613,0.00006712872,0.000020441359,0.0013851573,0.047839046,0.94389683,0.00008556699,0.0022621308,0.0010188251],"about_ca_topic_score_codex":0.0005644048,"about_ca_topic_score_gemma":0.001015285,"teacher_disagreement_score":0.047163047,"about_ca_system_score_codex":0.00008571101,"about_ca_system_score_gemma":0.0000031040288,"threshold_uncertainty_score":0.8271147},"labels":[],"label_agreement":null},{"id":"W1833136901","doi":"10.1109/eptc.1998.755970","title":"Testing for reliability-relevant or misleading?","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Reliability (semiconductor); Competition (biology); Electronics; Computer science; Reliability engineering; Risk analysis (engineering); Electronic systems; Business; Engineering; Electrical engineering; Physics; Electronic engineering","score_opus":0.036777118003474676,"score_gpt":0.22408735492093038,"score_spread":0.18731023691745569,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1833136901","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5578215,0.0007892299,0.044085063,0.00087858015,0.0012970208,0.00104344,0.000055433295,0.003693276,0.39033645],"genre_scores_gemma":[0.98078465,0.0000091589645,0.008323629,0.00012320497,0.00012733178,0.000029591694,0.0000041145763,0.000035951372,0.010562357],"study_design_codex":"not_applicable","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99929255,0.000005815966,0.0002128627,0.00016318342,0.00007266479,0.00025291202],"domain_scores_gemma":[0.99941725,0.00021473173,0.000014164973,0.00019961732,0.000098282486,0.000055961933],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00009926512,0.00012477743,0.00016595935,0.000067003464,0.00005893081,0.000038634975,0.000107155596,0.00006987866,0.0015267413],"category_scores_gemma":[0.00030662055,0.00008661809,0.00007979068,0.00027573833,0.000014234368,0.00008865546,0.0000043085697,0.00010086132,0.000121201694],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000014657459,0.00014848536,0.001986694,0.00047358574,0.00048418844,0.000023187276,0.0014560365,0.023456935,0.3825762,0.0035640658,0.46849218,0.11732379],"study_design_scores_gemma":[0.00031864754,0.00010993195,0.000034760145,0.000035824218,0.000090721514,0.000013289748,0.000244216,0.86535543,0.016959406,0.0004617143,0.115994655,0.00038140567],"about_ca_topic_score_codex":0.000025135982,"about_ca_topic_score_gemma":0.00003082171,"teacher_disagreement_score":0.8418985,"about_ca_system_score_codex":0.000049230886,"about_ca_system_score_gemma":0.00000418996,"threshold_uncertainty_score":0.999386},"labels":[],"label_agreement":null},{"id":"W1897791702","doi":"10.1109/olt.2002.1030215","title":"An off-chip sensor circuit for on-line transient current testing","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Resistor; Transient (computer programming); CMOS; Waveform; Electrical engineering; Voltage; Electronic circuit; Electronic engineering; Chip; Voltage drop; Transient voltage suppressor; Very-large-scale integration; Engineering; Computer science","score_opus":0.06325998106889481,"score_gpt":0.2682508727687827,"score_spread":0.20499089169988788,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1897791702","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.73439354,0.00085959234,0.1964867,0.000056223824,0.0012797515,0.0006848003,0.00008809128,0.0011025616,0.06504874],"genre_scores_gemma":[0.99843127,0.000017384391,0.0010400462,0.00008728366,0.0001268354,0.00002690078,0.000031732172,0.000046379828,0.00019215203],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.998988,0.000023252958,0.0002704449,0.00024557608,0.00013159633,0.00034113292],"domain_scores_gemma":[0.99937814,0.000095749085,0.000020935744,0.00026062486,0.00012150773,0.00012304046],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016396325,0.00020745426,0.0002223867,0.00012637452,0.000075565695,0.000048316728,0.00010532633,0.00006992968,0.00020750304],"category_scores_gemma":[0.00007386285,0.00017217846,0.00012016884,0.00026521418,0.0000131917495,0.00008411704,9.1567483e-7,0.00018436903,0.000033591776],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011493385,0.0004589322,0.0004251318,0.00022426104,0.00040209453,0.000011347708,0.0011812941,0.30118647,0.37232208,0.059002753,0.0049877563,0.2597864],"study_design_scores_gemma":[0.001573183,0.00071011815,0.00011815119,0.0001381981,0.00036540272,0.000028790633,0.0010132362,0.6290415,0.17733754,0.0017507505,0.18645975,0.0014633692],"about_ca_topic_score_codex":0.000010558346,"about_ca_topic_score_gemma":0.000025307207,"teacher_disagreement_score":0.32785505,"about_ca_system_score_codex":0.000055023644,"about_ca_system_score_gemma":0.000022933862,"threshold_uncertainty_score":0.70212334},"labels":[],"label_agreement":null},{"id":"W1933168394","doi":"10.1109/mtdt.1999.782681","title":"Failure mechanisms detected in memory chips during routine construction analysis","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Chipworks (Canada)","funders":"","keywords":"Passivation; Classification of discontinuities; Mechanism (biology); Delamination (geology); Failure mechanism; Electrical conductor; Corrosion; Adhesion; Computer science; Materials science; Composite material; Geology; Layer (electronics); Physics","score_opus":0.0042576588772634556,"score_gpt":0.16880685559343847,"score_spread":0.16454919671617502,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1933168394","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96630687,0.000066804576,0.024352102,0.000015141985,0.00012211809,0.000086850385,0.000004873409,0.0003398561,0.008705394],"genre_scores_gemma":[0.99678534,0.000014566574,0.0028524285,0.00001235257,0.000017719482,0.00001082571,0.000018868799,0.000024778825,0.0002631184],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99888664,0.00005427602,0.00034813827,0.00024519666,0.00014891043,0.0003168455],"domain_scores_gemma":[0.99956226,0.000016481734,0.000033462366,0.0002564261,0.000059330843,0.00007206462],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00014492018,0.00020743806,0.00034212388,0.00079043914,0.00005767109,0.00004437744,0.00009707577,0.00015408664,0.0011384793],"category_scores_gemma":[0.0000338877,0.00019001238,0.00015878344,0.0023961733,0.000020751275,0.00015008982,0.000005613168,0.0002747504,0.000028758486],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008306542,0.000047804013,0.010256559,0.00006568765,0.0031087897,0.000053784064,0.0006453746,0.13925733,0.8181107,0.027381543,0.000103676786,0.0009604673],"study_design_scores_gemma":[0.0011458967,0.000021794005,0.005256118,0.000026637574,0.001178017,0.000065800756,0.004790159,0.052538514,0.9321875,0.001691393,0.00018630162,0.00091184606],"about_ca_topic_score_codex":0.00012133711,"about_ca_topic_score_gemma":0.0017520636,"teacher_disagreement_score":0.114076845,"about_ca_system_score_codex":0.00011789949,"about_ca_system_score_gemma":0.00001453689,"threshold_uncertainty_score":0.99977463},"labels":[],"label_agreement":null},{"id":"W1935573476","doi":"10.1109/mtdt.1994.397200","title":"Mega bit CMOS SRAM chip failure analysis using external electrical testing and internal contactless laser beam testing","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Static random-access memory; Chip; CMOS; Electronic engineering; Embedded system; Capacitive coupling; Computer science; Computer hardware; Engineering; Electrical engineering; Voltage","score_opus":0.028936070705265837,"score_gpt":0.2166298617703281,"score_spread":0.1876937910650623,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1935573476","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97638977,0.00039499963,0.015543629,0.000019727662,0.000075815005,0.000099543584,0.000008909595,0.0003609335,0.007106656],"genre_scores_gemma":[0.99193335,0.0000099529,0.007308438,0.00009215573,0.00022921411,0.000006252367,0.0000049195796,0.0000537128,0.00036198832],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9980843,0.000040676165,0.0005378909,0.00043655123,0.0003019132,0.00059867784],"domain_scores_gemma":[0.9989432,0.00027222448,0.00009588877,0.0002659129,0.00020228514,0.00022046977],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001812736,0.00038516012,0.00059620076,0.0006164226,0.00017691201,0.00031681504,0.00024034498,0.00018268783,0.00082334527],"category_scores_gemma":[0.00025878684,0.00033269016,0.00020032153,0.0022821617,0.00004484458,0.00031989923,0.00003919359,0.0005870063,0.000016100897],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000068585605,0.00012915146,0.2187218,0.000073259616,0.004073865,0.00021641911,0.000640601,0.1327379,0.61585045,0.00023299087,0.00089357473,0.026423095],"study_design_scores_gemma":[0.000301224,0.000047040467,0.0020432593,0.000064959175,0.001161019,0.000121193014,0.00012968284,0.9788515,0.016607642,0.00005739617,0.00012352664,0.0004915541],"about_ca_topic_score_codex":0.000858818,"about_ca_topic_score_gemma":0.00021606157,"teacher_disagreement_score":0.8461136,"about_ca_system_score_codex":0.00013624188,"about_ca_system_score_gemma":0.0000129571,"threshold_uncertainty_score":0.9999125},"labels":[],"label_agreement":null},{"id":"W1941106138","doi":"10.1109/iciprm.1999.773653","title":"Re-growth over grating-etched InGaAsP","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada); McMaster University","funders":"McMaster University","keywords":"Secondary ion mass spectrometry; Molecular beam epitaxy; Materials science; Grating; Transmission electron microscopy; Optoelectronics; Focused ion beam; Epitaxy; Analytical Chemistry (journal); Mass spectrometry; Ion; Nanotechnology; Chemistry; Layer (electronics); Environmental chemistry; Chromatography","score_opus":0.008924029077885915,"score_gpt":0.19805951045273334,"score_spread":0.18913548137484743,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1941106138","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.39337602,0.00026024104,0.005807105,0.000059311373,0.0003610335,0.00008308057,0.0000049266046,0.0006402715,0.599408],"genre_scores_gemma":[0.9973112,0.000020295982,0.00043251424,0.00021159135,0.00004051235,0.000005312354,0.0000068254717,0.000027870743,0.0019439226],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99931145,0.00002017064,0.00018468079,0.00013920349,0.00011508247,0.0002293951],"domain_scores_gemma":[0.9996578,0.00002609029,0.000015021387,0.0001826222,0.00005551661,0.00006295735],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000108108696,0.00014371847,0.0001605375,0.000092924114,0.00004304381,0.000049305258,0.000088062785,0.00008959622,0.0019567797],"category_scores_gemma":[0.0000614035,0.00011692075,0.00008712998,0.0003220136,0.000012853334,0.0001154185,0.0000036054703,0.00017571486,0.00008587893],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000037601683,0.00009294947,0.0120149255,0.00010726214,0.0009732699,0.00004677009,0.0029577145,0.004902314,0.5038022,0.21928716,0.25370866,0.002103027],"study_design_scores_gemma":[0.001144255,0.000083866296,0.00058645266,0.00005822961,0.00026730978,0.000016621832,0.0036337466,0.03872638,0.84057367,0.007083245,0.10604034,0.0017858763],"about_ca_topic_score_codex":0.00009147293,"about_ca_topic_score_gemma":0.0001747273,"teacher_disagreement_score":0.6039351,"about_ca_system_score_codex":0.000042386742,"about_ca_system_score_gemma":0.000012027109,"threshold_uncertainty_score":0.99895555},"labels":[],"label_agreement":null},{"id":"W1951725840","doi":"10.1109/icecs.2000.911572","title":"Comparing defect coverage for current-mode logic and CMOS VLSI cells","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada); Royal Military College of Canada","funders":"","keywords":"CMOS; Very-large-scale integration; BiCMOS; Electronic engineering; Logic gate; Current-mode logic; Integrated injection logic; Transistor; Computer science; Electrical engineering; Pass transistor logic; Engineering; Voltage","score_opus":0.03355018350318178,"score_gpt":0.23164089926614492,"score_spread":0.19809071576296314,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1951725840","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.824834,0.0058043553,0.10808227,0.000045413693,0.0007124269,0.0004322786,0.000039322244,0.0006141153,0.05943584],"genre_scores_gemma":[0.9988395,0.00035363,0.00021418599,0.00004793053,0.00006540623,0.000013016525,0.000011800784,0.00002034751,0.0004342081],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993794,0.0000081245535,0.00015644885,0.00016024565,0.000064312066,0.00023149808],"domain_scores_gemma":[0.99971765,0.00004594024,0.000015527996,0.00012781327,0.000030963263,0.00006207668],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000044176937,0.00014569948,0.00021516289,0.00007304957,0.000056537516,0.000064335014,0.0000777676,0.00005481487,0.00034951392],"category_scores_gemma":[0.0000067354763,0.000121066536,0.00011282128,0.0001026778,0.000013904684,0.00009909653,0.00000865858,0.00012473311,0.000053061405],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016574255,0.00029909023,0.007540439,0.0010838625,0.0016048707,0.000018134066,0.0028902458,0.12804218,0.502035,0.036384292,0.20375319,0.1163321],"study_design_scores_gemma":[0.00057583454,0.00003712438,0.000045554105,0.000029531393,0.00016127345,0.0000053340223,0.00007953942,0.92645705,0.02683671,0.0007785873,0.044565056,0.0004284361],"about_ca_topic_score_codex":0.000029053646,"about_ca_topic_score_gemma":0.000057465855,"teacher_disagreement_score":0.7984148,"about_ca_system_score_codex":0.000030316667,"about_ca_system_score_gemma":0.0000017563258,"threshold_uncertainty_score":0.49369502},"labels":[],"label_agreement":null},{"id":"W1954777664","doi":"10.1109/irws.1999.830551","title":"Signal margin test to identify process sensitivities relevant to DRAM reliability and functionality at low temperatures","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Dram; Reliability (semiconductor); Margin (machine learning); Computer science; Reliability engineering; SIGNAL (programming language); Electronic engineering; Process (computing); Amplifier; Circuit reliability; Engineering; Computer hardware; CMOS; Power (physics); Physics","score_opus":0.007461854835778328,"score_gpt":0.2296505193560114,"score_spread":0.2221886645202331,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1954777664","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.993898,0.000068483154,0.0009085949,0.00021766163,0.00014721396,0.00021429622,0.00004497486,0.00020039143,0.0043003852],"genre_scores_gemma":[0.9962124,0.0000066550156,0.0002674013,0.0004298822,0.00005670864,0.000026747695,0.000016876615,0.000025826594,0.0029574789],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987706,0.000045942637,0.00026599268,0.00037665232,0.00024003733,0.00030075235],"domain_scores_gemma":[0.9991726,0.00015390124,0.00001599379,0.00024255474,0.0002163619,0.00019856846],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003266659,0.0002286156,0.00026319,0.0001217156,0.00013519172,0.00012670748,0.000068063564,0.00009795544,0.0007025538],"category_scores_gemma":[0.00025972424,0.0001881111,0.00006706353,0.00038636342,0.000035114444,0.00015343771,0.000017892631,0.0001930788,0.000090735884],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028009572,0.00009921953,0.013427634,0.00028834294,0.00016814869,0.00002988,0.0017917808,0.028360669,0.9219675,0.001332258,0.032184545,0.0003219991],"study_design_scores_gemma":[0.00057711184,0.00023451824,0.023566024,0.00018932833,0.00019835064,0.00014296421,0.0047627264,0.0060008466,0.93294346,0.0016980028,0.027943341,0.0017433316],"about_ca_topic_score_codex":0.00008517692,"about_ca_topic_score_gemma":0.00028876594,"teacher_disagreement_score":0.022359822,"about_ca_system_score_codex":0.00014795654,"about_ca_system_score_gemma":0.000030370837,"threshold_uncertainty_score":0.7692471},"labels":[],"label_agreement":null},{"id":"W1965379283","doi":"10.1016/j.ultramic.2012.01.001","title":"Effects of small specimen tilt and probe convergence angle on ADF-STEM image contrast of Si0.8Ge0.2 epitaxial strained layers on (100) Si","year":2012,"lang":"en","type":"article","venue":"Ultramicroscopy","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Acadia University; Institute for Microstructural Sciences","funders":"","keywords":"Materials science; Tilt (camera); Scanning transmission electron microscopy; Zone axis; Epitaxy; Optics; Transmission electron microscopy; Orientation (vector space); Diffraction; Layer (electronics); Electron diffraction; Geometry; Physics; Nanotechnology; Mathematics","score_opus":0.007841054021582236,"score_gpt":0.20658653111194863,"score_spread":0.19874547709036638,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1965379283","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9951577,0.00034018757,0.0011046983,0.000013793945,0.00033916088,0.00035357298,0.000103098835,0.000074468575,0.0025132718],"genre_scores_gemma":[0.9990612,0.00007528844,0.00049553596,0.000045732464,0.00009576961,0.0000109742305,0.000021451833,0.000044632758,0.00014937282],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99876326,0.000048096168,0.00037114043,0.00022720866,0.0001655481,0.00042474116],"domain_scores_gemma":[0.99923056,0.00019428383,0.000112512214,0.00024546898,0.00008633593,0.00013085728],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00015588832,0.0002881253,0.00048603106,0.00013725272,0.00003739453,0.000023090295,0.00016443942,0.00015458449,0.000092033726],"category_scores_gemma":[0.000039609524,0.00025355714,0.000117199874,0.00018653943,0.00013060667,0.0001246431,0.000009564127,0.00023961828,0.000030820913],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000045353434,0.0001320941,0.00088788196,0.00030295472,0.00018377797,0.000004008275,0.0008716553,0.00008343339,0.995052,0.0016607693,0.00025953073,0.0005165432],"study_design_scores_gemma":[0.00068887306,0.0002666191,0.0022255383,0.0001644281,0.0001125887,0.000003073381,0.00033793793,0.00048697056,0.99516577,0.000026052061,0.00027131417,0.00025085357],"about_ca_topic_score_codex":0.0001132521,"about_ca_topic_score_gemma":0.000014115635,"teacher_disagreement_score":0.0039034947,"about_ca_system_score_codex":0.00007888471,"about_ca_system_score_gemma":0.000019983909,"threshold_uncertainty_score":0.99999166},"labels":[],"label_agreement":null},{"id":"W1966652900","doi":"10.1116/1.1701853","title":"Focused ion beam and transmission electron microscopy method for root cause analysis of InP ridge laser devices","year":2004,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Materials science; Transmission electron microscopy; Laser; Focused ion beam; Ridge; Optoelectronics; Ceramic; Oak Ridge National Laboratory; Reliability (semiconductor); Ion milling machine; Semiconductor; Optics; Nanotechnology; Ion; Composite material; Chemistry; Geology","score_opus":0.008287619513458452,"score_gpt":0.2729832515976118,"score_spread":0.2646956320841533,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1966652900","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9655367,0.0035950067,0.030122356,0.00046670434,0.000084615385,0.00011717344,0.000022932505,0.000043607044,0.0000108970125],"genre_scores_gemma":[0.9811106,0.0007816891,0.018042127,0.000021099617,0.000010911964,0.000003742105,0.0000031392462,0.000015655254,0.000011069172],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99841714,0.000017611706,0.0006155388,0.0002905169,0.00025388674,0.00040532372],"domain_scores_gemma":[0.99898183,0.00007192431,0.000292438,0.00019622502,0.00033280853,0.00012477078],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00093069446,0.00023319722,0.0007165705,0.002122402,0.00020342732,0.00007007031,0.0003847721,0.00026503336,0.000012931022],"category_scores_gemma":[0.00003177312,0.0001727,0.00018815855,0.003218301,0.0002885067,0.00044788345,0.00002632364,0.0003703234,2.7765336e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003054362,0.000043193304,0.0028920148,0.000036094654,0.0006496803,0.0000046381915,0.00037352377,0.007415503,0.9865494,0.000278437,0.000031959025,0.0016950428],"study_design_scores_gemma":[0.0007717503,0.0005419979,0.0023483464,0.00008159877,0.0015914602,0.00005195086,0.00049082586,0.017773021,0.97464615,0.00086554594,0.0006013659,0.0002360049],"about_ca_topic_score_codex":0.00004723478,"about_ca_topic_score_gemma":0.00009578433,"teacher_disagreement_score":0.01557386,"about_ca_system_score_codex":0.000070348775,"about_ca_system_score_gemma":0.0001143989,"threshold_uncertainty_score":0.70425016},"labels":[],"label_agreement":null},{"id":"W1970193084","doi":"10.1063/1.2201730","title":"High spatial resolution mapping of partially strain-compensated SiGe:C films in the presence of postannealed defects","year":2006,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Alzheimer Society Research Program; Australian Synchrotron","keywords":"Materials science; Annealing (glass); Synchrotron radiation; X-ray crystallography; Diffraction; Crystallography; Crystal structure; Single crystal; Crystal (programming language); Optoelectronics; Optics; Chemistry; Composite material; Physics","score_opus":0.01037610803447998,"score_gpt":0.19585829276070638,"score_spread":0.1854821847262264,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1970193084","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99249667,0.000064638225,0.0058468073,0.00001008812,0.0000818027,0.000107307285,0.000019009585,0.000008782329,0.001364902],"genre_scores_gemma":[0.9993927,0.000011795225,0.00039048778,0.000010436665,0.00016277083,0.0000016953151,0.000014525995,0.000013178094,0.0000024035342],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987768,0.00003102501,0.00062965555,0.0000741109,0.00031715367,0.00017125008],"domain_scores_gemma":[0.99921924,0.000095433534,0.0003474003,0.00015016083,0.00016652538,0.000021258056],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029185225,0.00012621602,0.0003567082,0.00010139903,0.000022724082,0.000015863232,0.00022390518,0.000068836765,0.000015725893],"category_scores_gemma":[0.00000882998,0.00009344135,0.00013063666,0.00043675455,0.000043652155,0.00008286026,0.000007532638,0.00029921875,8.826361e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023845296,0.000045871922,0.00008235732,0.000028768358,0.0000542878,0.0000046387554,0.0005334834,0.507001,0.4886409,0.003101541,0.00019168248,0.0002916197],"study_design_scores_gemma":[0.0020472202,0.00024904628,0.012902631,0.0003249845,0.00032740989,0.000016281228,0.0025747323,0.22110002,0.7450004,0.014745861,0.00025435473,0.0004570534],"about_ca_topic_score_codex":0.00021593057,"about_ca_topic_score_gemma":0.00009788251,"teacher_disagreement_score":0.28590098,"about_ca_system_score_codex":0.000032426633,"about_ca_system_score_gemma":0.000044592358,"threshold_uncertainty_score":0.38104278},"labels":[],"label_agreement":null},{"id":"W1970221660","doi":"10.1109/cicc.2008.4672014","title":"Session 4 - High-speed test, characterization, and debug","year":2008,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"CMOS; Signal integrity; Electronic engineering; Electrostatic discharge; Computer science; Session (web analytics); Electrical engineering; Engineering; Voltage; Printed circuit board","score_opus":0.00895152402583203,"score_gpt":0.18034961485520587,"score_spread":0.17139809082937385,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1970221660","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9923685,0.00004787454,0.003755049,0.00006357048,0.000077898534,0.000034849407,0.0000065706768,0.00025746095,0.0033881813],"genre_scores_gemma":[0.99627143,0.00022067541,0.00011012907,0.000096747295,0.00006003788,0.0000013342083,0.00006111239,0.000015217875,0.0031633433],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99961317,0.0000047114136,0.000114505834,0.00009491792,0.000063720756,0.000109000706],"domain_scores_gemma":[0.9997904,0.000016789025,0.0000106776215,0.00009412755,0.000040437943,0.000047591133],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00002062368,0.000088434455,0.000109186105,0.000066412926,0.0000654687,0.00001762307,0.000041079216,0.000055249136,0.00042860518],"category_scores_gemma":[0.000011210996,0.000068402085,0.000019669993,0.00015374771,0.000017277393,0.00014068448,0.0000053614035,0.000067954585,0.000040740677],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[5.6937597e-7,0.000011014576,0.0059270477,0.000008011653,0.000030298355,0.000008682339,0.00020476933,0.00008466426,0.98845077,0.00039227348,0.0027542324,0.002127699],"study_design_scores_gemma":[0.0012131198,0.00010956857,0.15903217,0.00007934643,0.00016052871,0.00026484302,0.00028746997,0.15082689,0.60496294,0.00024323382,0.08140325,0.0014166661],"about_ca_topic_score_codex":0.000039827864,"about_ca_topic_score_gemma":0.0000064165797,"teacher_disagreement_score":0.38348782,"about_ca_system_score_codex":0.000013402494,"about_ca_system_score_gemma":0.000006221682,"threshold_uncertainty_score":0.4692926},"labels":[],"label_agreement":null},{"id":"W1970873312","doi":"10.1143/jjap.40.6446","title":"Evaluation of Silicide Morphology by Near-Infrared-Laser Optical-Beam-Induced-Current Technique","year":2001,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Silicide; Materials science; Optoelectronics; Schottky diode; Infrared; Laser; Diode; Optics; Silicon; Physics","score_opus":0.020340101839183115,"score_gpt":0.25561419971341026,"score_spread":0.23527409787422715,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1970873312","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9910297,0.00012349342,0.0026113177,0.000011088099,0.000110928195,0.00017840986,0.000003444591,0.000029971343,0.0059016477],"genre_scores_gemma":[0.9994826,0.000043548465,0.00023137745,0.000025729536,0.00014992435,0.000023076966,0.0000099178405,0.00002761067,0.000006249308],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983671,0.000034965502,0.0005929952,0.00012623238,0.0006470488,0.00023168593],"domain_scores_gemma":[0.99872947,0.000060171118,0.0002301108,0.00023525106,0.00064348726,0.000101537706],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00080328225,0.0001909663,0.00040602704,0.00009052372,0.000044271907,0.000024375237,0.00021920196,0.000105914754,0.0001159605],"category_scores_gemma":[0.000028903854,0.00015954018,0.0001597015,0.00046456425,0.0000501349,0.00017111695,0.000012606168,0.00042543854,0.000014483902],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021445136,0.00011169286,0.000031628235,0.000011099301,0.00016385873,0.0000026994242,0.0004964904,0.05748598,0.9204392,0.0001734886,0.00061361404,0.020448796],"study_design_scores_gemma":[0.00065612036,0.00009213605,0.00010865668,0.000028508575,0.0004262998,0.000046835852,0.00038944487,0.017790454,0.97611,0.003508078,0.0006263508,0.00021711687],"about_ca_topic_score_codex":0.000007785467,"about_ca_topic_score_gemma":0.0000011673217,"teacher_disagreement_score":0.055670794,"about_ca_system_score_codex":0.0001430789,"about_ca_system_score_gemma":0.00007357482,"threshold_uncertainty_score":0.650586},"labels":[],"label_agreement":null},{"id":"W1971720502","doi":"10.2741/2855","title":"Cellular cardiomyoplasty: routes of cell delivery and retention","year":2007,"lang":"en","type":"review","venue":"Frontiers in bioscience","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":46,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Therapeutic modalities; Retention time; Cell; Medicine; Cell therapy; Cancer research; Chemistry; Internal medicine","score_opus":0.021018124032572198,"score_gpt":0.22586416436787507,"score_spread":0.20484604033530288,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1971720502","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00049053546,0.99028283,0.0069515747,4.4264456e-7,0.0009791906,0.00014771572,0.00002925488,0.000032026695,0.001086405],"genre_scores_gemma":[0.0019919625,0.9957961,0.0019999645,0.0000027831902,0.000034171302,0.00000537321,0.000022381082,0.000023039036,0.00012421721],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.998696,0.000036850357,0.000465204,0.00031906288,0.00020314394,0.00027972157],"domain_scores_gemma":[0.99952894,0.000025903875,0.00010642104,0.00024009777,0.000039646853,0.000058957194],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00035344003,0.00025852842,0.0009622202,0.00074584363,0.000029658448,0.000031055704,0.0002756001,0.0002756358,0.000005719294],"category_scores_gemma":[0.000013747295,0.00022124207,0.00022379725,0.0010311487,0.00014162055,0.00012902223,0.00002712857,0.0002871887,0.0000027121296],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000010459173,0.0000175073,0.0001865803,0.008701541,0.000121683544,0.000028416756,0.0001447672,0.000081096914,0.0024257884,0.000042892556,0.002720714,0.985528],"study_design_scores_gemma":[0.00009731784,0.000026842381,0.0000062026493,0.0031168119,0.0005270265,0.0000075767243,0.00022539425,0.0024624716,0.0020427601,0.000029618384,0.9909124,0.0005456196],"about_ca_topic_score_codex":0.000033213688,"about_ca_topic_score_gemma":0.0000051933002,"teacher_disagreement_score":0.98819166,"about_ca_system_score_codex":0.00012290767,"about_ca_system_score_gemma":0.000048871105,"threshold_uncertainty_score":0.902199},"labels":[],"label_agreement":null},{"id":"W1974626281","doi":"10.1109/ipfa.2010.5531991","title":"Combining High Resolution Pulsed TIVA and nanoprobing techniques to identify drive strength issues in mixed signal circuits","year":2010,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Electronic circuit; SIGNAL (programming language); High resolution; Mixed-signal integrated circuit; Process (computing); Computer science; Signal strength; Materials science; Resolution (logic); Signal processing; Electronic engineering; Electrical engineering; Engineering; Digital signal processing; Artificial intelligence; Telecommunications","score_opus":0.008448147297610757,"score_gpt":0.24019348089669867,"score_spread":0.23174533359908792,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1974626281","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99497646,0.00005134952,0.0011003974,0.00012774004,0.00020058955,0.00018333424,0.0000061062824,0.0003764473,0.0029775766],"genre_scores_gemma":[0.99840474,0.000022005768,0.0011174745,0.000047898,0.000077284974,0.0000276132,0.00002572134,0.0000332996,0.00024395836],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988884,0.000031238204,0.00031669953,0.00028273824,0.00015635276,0.00032457084],"domain_scores_gemma":[0.99954575,0.0000463784,0.000029788953,0.00019624547,0.00008292841,0.00009888395],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002529253,0.00020542431,0.00028060502,0.0004147253,0.00007063136,0.00012508623,0.00014824794,0.00019379446,0.00018508376],"category_scores_gemma":[0.000039893584,0.00019300036,0.000043178374,0.0004376056,0.00003015078,0.00025557113,0.000028291668,0.00044954693,0.000017393046],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000015052332,0.000015866071,0.00039650453,0.000013955581,0.00003784387,0.0000074279037,0.0007089904,0.00019347208,0.9853845,0.0023202086,0.0005526081,0.010367104],"study_design_scores_gemma":[0.00025392536,0.000055762244,0.002566664,0.000108758206,0.00003494686,0.000007813516,0.00074335793,0.009545692,0.98331004,0.0008179195,0.0021317145,0.00042342572],"about_ca_topic_score_codex":0.0009943972,"about_ca_topic_score_gemma":0.001902483,"teacher_disagreement_score":0.009943678,"about_ca_system_score_codex":0.00005610159,"about_ca_system_score_gemma":0.000012329142,"threshold_uncertainty_score":0.7870326},"labels":[],"label_agreement":null},{"id":"W1975090825","doi":"10.4028/www.scientific.net/ssp.178-179.473","title":"Bistable Defects as the Cause for NBTI and RTN","year":2011,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Bistability; Metastability; Materials science; Reliability (semiconductor); Noise (video); Oxide; Trapping; Condensed matter physics; Engineering physics; Optoelectronics; Physics; Thermodynamics; Computer science; Metallurgy; Quantum mechanics","score_opus":0.05912648181995889,"score_gpt":0.27987690802267107,"score_spread":0.22075042620271218,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1975090825","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8703619,0.008650984,0.012741561,0.0002545554,0.002427673,0.00484409,0.09061163,0.001463654,0.008643947],"genre_scores_gemma":[0.921058,0.03617477,0.0007319472,0.0018145128,0.00087197335,0.0005724999,0.035286646,0.00077701826,0.0027126402],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99173415,0.00037182684,0.0019019316,0.002534458,0.0008209946,0.0026366399],"domain_scores_gemma":[0.99271584,0.000580071,0.00051895616,0.0046760365,0.0003870618,0.0011220098],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0019479144,0.0016430754,0.0018506746,0.000614697,0.0013382146,0.0010144649,0.0025199186,0.000222473,0.00032696937],"category_scores_gemma":[0.00020309229,0.001285737,0.00025734544,0.000951991,0.000630483,0.0021986263,0.0019337386,0.0010112982,0.0002230504],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.007669777,0.006126513,0.007432543,0.009080657,0.03422578,0.0014368865,0.21942206,0.019645648,0.09483188,0.0062914863,0.4410196,0.15281719],"study_design_scores_gemma":[0.011227659,0.001801542,0.0009446472,0.00054612296,0.0033503703,0.00023725684,0.009196623,0.18005612,0.007220242,0.021647574,0.7565831,0.0071887453],"about_ca_topic_score_codex":0.0008923481,"about_ca_topic_score_gemma":0.001784578,"teacher_disagreement_score":0.31556353,"about_ca_system_score_codex":0.00020393841,"about_ca_system_score_gemma":0.00023119015,"threshold_uncertainty_score":0.9999619},"labels":[],"label_agreement":null},{"id":"W1975396157","doi":"10.1007/s11340-012-9626-0","title":"Hole-Drilling Residual Stress Measurement with Artifact Correction Using Full-Field DIC","year":2012,"lang":"en","type":"article","venue":"Experimental Mechanics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":67,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Residual stress; Solid mechanics; Residual; Computation; Materials science; Deformation (meteorology); Artifact (error); Hole drilling method; Digital image correlation; Sensitivity (control systems); Computer science; Optics; Artificial intelligence; Algorithm; Electronic engineering; Engineering; Composite material; Physics","score_opus":0.02940971102133445,"score_gpt":0.23383089125097695,"score_spread":0.2044211802296425,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1975396157","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9358729,0.002111756,0.0584271,0.0000081219205,0.0022374229,0.0001696476,0.00000488488,0.0002620572,0.0009061213],"genre_scores_gemma":[0.999064,0.00001379626,0.00046046576,0.0000378974,0.00032946977,0.000015479744,0.000010519961,0.000052912685,0.00001545225],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99875236,0.00002961684,0.00021839929,0.00017653388,0.0004136266,0.00040949212],"domain_scores_gemma":[0.999527,0.000013445652,0.000047178215,0.0002076977,0.000076186836,0.0001284895],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016204089,0.00023431118,0.00020190323,0.00010773529,0.00012530516,0.000055728768,0.00009611016,0.0001093493,0.0002540834],"category_scores_gemma":[0.000013369535,0.00020338559,0.00006588907,0.00019730032,0.0000075838566,0.00030204502,0.000016345079,0.00022831089,0.000025351434],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023914363,0.000080472106,0.00006750409,0.000010286837,0.00016773626,0.0000031185516,0.0009870087,0.013886894,0.9832121,0.00049976545,0.00030148606,0.00075970637],"study_design_scores_gemma":[0.00018249056,0.0001243948,0.000003249715,0.0000617563,0.00006905225,0.000014358684,0.0036799987,0.0845314,0.9106878,0.0000063883595,0.00036954228,0.0002695914],"about_ca_topic_score_codex":0.00009685418,"about_ca_topic_score_gemma":0.000054301923,"teacher_disagreement_score":0.07252433,"about_ca_system_score_codex":0.00048127,"about_ca_system_score_gemma":0.000017931927,"threshold_uncertainty_score":0.8293823},"labels":[],"label_agreement":null},{"id":"W1978017600","doi":"10.1117/12.566894","title":"1.5- to 0.8-μm optical upconversion by wafer fusion","year":2004,"lang":"en","type":"article","venue":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institute for Microstructural Sciences","funders":"","keywords":"Photon upconversion; Wafer; Materials science; Optoelectronics; Fusion; Doping","score_opus":0.007602733775040166,"score_gpt":0.20415883951084635,"score_spread":0.19655610573580617,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1978017600","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99238694,0.00013046974,0.00022131919,0.0021254155,0.00033761587,0.0004007749,0.000061729814,0.00019177192,0.0041439496],"genre_scores_gemma":[0.96015006,0.00018380236,0.038415518,0.00023157385,0.00042695604,0.00014964613,0.000025043677,0.0001247882,0.00029259047],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9976248,9.182256e-9,0.0007022893,0.00041354567,0.0007315763,0.0005277616],"domain_scores_gemma":[0.9982878,0.00007547916,0.00013146595,0.0000790135,0.0011850918,0.0002411558],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003839447,0.0004103746,0.00050310267,0.00016961826,0.000089358204,0.00012732176,0.00091064937,0.0002970403,0.000046335408],"category_scores_gemma":[0.0002912196,0.00034073557,0.00069327996,0.0005520298,0.00012525627,0.0005033453,0.000112901434,0.00043992585,0.000013262919],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032567303,0.00007582499,0.00004676964,0.00020364129,0.00042341492,1.441659e-7,0.00021911968,0.0016961701,0.813735,0.1694397,0.013692921,0.0004346931],"study_design_scores_gemma":[0.0011280616,0.00029665613,0.00010685495,0.00040004367,0.00031611684,0.000016289998,0.0015819999,0.016493991,0.9603508,0.00104594,0.017595857,0.00066735473],"about_ca_topic_score_codex":0.000023037055,"about_ca_topic_score_gemma":3.4287172e-7,"teacher_disagreement_score":0.16839376,"about_ca_system_score_codex":0.0003703986,"about_ca_system_score_gemma":0.000028530298,"threshold_uncertainty_score":0.99990445},"labels":[],"label_agreement":null},{"id":"W1979080919","doi":"10.1116/1.1387458","title":"Calibrated scanning spreading resistance microscopy profiling of carriers in III–V structures","year":2001,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":37,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada); Simon Fraser University","funders":"","keywords":"Spreading resistance profiling; Materials science; Optoelectronics; Heterojunction; Secondary ion mass spectrometry; Molecular beam epitaxy; Microscopy; Electron beam-induced current; Doping; Dopant; Analytical Chemistry (journal); Epitaxy; Common emitter; Schottky diode; Silicon; Mass spectrometry; Chemistry; Nanotechnology; Optics; Diode","score_opus":0.010268201176234901,"score_gpt":0.22473680976958985,"score_spread":0.21446860859335495,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1979080919","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96697366,0.030972395,0.0016517919,0.000063978325,0.00009668773,0.000095493684,0.0000027191754,0.000027074791,0.0001161698],"genre_scores_gemma":[0.9972984,0.0007020077,0.0019244881,0.00001542604,0.000030223859,0.0000018668734,8.355352e-7,0.000019477997,0.0000072263974],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99810106,0.000016596616,0.0006680747,0.00029114893,0.00037610764,0.00054702826],"domain_scores_gemma":[0.99899644,0.000010873621,0.00034207504,0.00014621827,0.00041023936,0.00009415061],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007450067,0.00025853995,0.00050801306,0.0017969817,0.00021912098,0.00018010462,0.00040130693,0.00014306915,0.000004188614],"category_scores_gemma":[0.000036075606,0.00020778725,0.000050164865,0.0022427477,0.0004741315,0.0005110247,0.000038826412,0.00053423893,2.8783923e-8],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000042247382,0.000007769135,0.005296622,0.000089873865,0.000063851876,0.0000055902087,0.00070982584,0.00018667811,0.98473597,0.0006259655,0.0000045985803,0.00823099],"study_design_scores_gemma":[0.0011745088,0.00025479586,0.0008477029,0.00046864123,0.00013554357,0.00018592714,0.0018977529,0.0018826363,0.976119,0.016107365,0.00043935352,0.000486769],"about_ca_topic_score_codex":0.0000066854345,"about_ca_topic_score_gemma":0.000025375492,"teacher_disagreement_score":0.030324759,"about_ca_system_score_codex":0.00026648398,"about_ca_system_score_gemma":0.00031477236,"threshold_uncertainty_score":0.84733176},"labels":[],"label_agreement":null},{"id":"W1988879398","doi":"10.1109/rtp.2007.4383814","title":"Review on Process-Induced Strain Techniques for Advanced Logic Technologies","year":2007,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"PMOS logic; NMOS logic; Materials science; Optoelectronics; Node (physics); Silicon on insulator; Reliability (semiconductor); CMOS; Logic gate; Electronic engineering; Engineering physics; Electrical engineering; Engineering; Transistor; Silicon; Voltage","score_opus":0.02264766312346742,"score_gpt":0.2930053963317276,"score_spread":0.2703577332082602,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1988879398","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.07268489,0.06908016,0.28455168,0.0057952306,0.0009204817,0.009429312,0.00016301224,0.044855222,0.51252],"genre_scores_gemma":[0.9917949,0.0028173055,0.0040465477,0.0009077995,0.00003520848,0.00015024138,0.000028402344,0.000038598315,0.00018102542],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99915653,0.0000034960524,0.00026637907,0.00019147115,0.000088752815,0.00029334726],"domain_scores_gemma":[0.9995456,0.0000460359,0.000033702752,0.00023544954,0.00011310691,0.000026135267],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00026490403,0.0001834627,0.00027353692,0.00015728595,0.000039245577,0.000013992428,0.00019606744,0.00014762212,0.000052866755],"category_scores_gemma":[0.00010850178,0.00013195389,0.00010150179,0.00037128283,0.000016574246,0.0000870963,0.0000048290694,0.00018891481,0.000012744436],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000077920095,0.000036796602,0.0000065285467,0.0013225072,0.00010478784,0.0000053864387,0.00004412415,0.000084147,0.374231,0.017938351,0.0060231704,0.6001954],"study_design_scores_gemma":[0.000110599336,0.00018317043,0.0000023704588,0.0008291615,0.000054809818,0.0000043028863,0.0005973972,0.0002013293,0.96310645,0.0058599957,0.028701948,0.00034845804],"about_ca_topic_score_codex":0.0000018678286,"about_ca_topic_score_gemma":0.000018072982,"teacher_disagreement_score":0.91911,"about_ca_system_score_codex":0.000055935703,"about_ca_system_score_gemma":0.000010120548,"threshold_uncertainty_score":0.5380923},"labels":[],"label_agreement":null},{"id":"W1989415659","doi":"10.1149/1.3597657","title":"Visualization of Single Atomic Steps on An Ultra-Flat Si(100) Surface by Advanced Differential Interference Contrast Microscopy","year":2011,"lang":"en","type":"article","venue":"Electrochemical and Solid-State Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hatch (Canada)","funders":"","keywords":"Differential interference contrast microscopy; Materials science; Interference (communication); Contrast (vision); Atomic force microscopy; Confocal; Etching (microfabrication); Visualization; Optics; Microscope; Differential (mechanical device); Isotropic etching; Optical microscope; Microscopy; Optoelectronics; Nanotechnology; Scanning electron microscope; Computer science; Physics; Artificial intelligence; Composite material; Telecommunications","score_opus":0.008138482072783584,"score_gpt":0.22138678117172417,"score_spread":0.21324829909894058,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1989415659","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9804099,0.00008599879,0.018981062,0.000029256124,0.0000728519,0.00009769705,0.00002720926,0.0001023203,0.00019368497],"genre_scores_gemma":[0.9993372,0.00007431452,0.000066826906,0.00029150926,0.000023581173,0.000005644239,0.00013016832,0.00003976464,0.00003098321],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99879587,0.00003704294,0.00033726534,0.00030787024,0.00012539241,0.00039657624],"domain_scores_gemma":[0.99956286,0.000033841545,0.00006936717,0.00016562021,0.000051504743,0.00011682977],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00003859227,0.0002719521,0.00035965152,0.00006665177,0.000042903357,0.000036668465,0.00016119306,0.000101624326,0.00007793236],"category_scores_gemma":[0.000008521541,0.0002457111,0.00007153706,0.00015247114,0.000092452225,0.00016043529,0.0000062526287,0.00023028452,0.0000042461697],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009503316,0.00006661084,0.00014889493,0.000029057863,0.00010145656,0.0000017604535,0.00078388385,0.00003889794,0.9979558,0.0000656433,0.0004772557,0.0002356823],"study_design_scores_gemma":[0.0004128678,0.00021604117,0.00002662529,0.00004109393,0.000045497956,0.0000032165626,0.0000615794,0.0020117569,0.9967528,0.00008313433,0.00006517469,0.0002802007],"about_ca_topic_score_codex":0.00003350882,"about_ca_topic_score_gemma":0.000011998375,"teacher_disagreement_score":0.018927287,"about_ca_system_score_codex":0.00006550608,"about_ca_system_score_gemma":0.000007309297,"threshold_uncertainty_score":0.9999995},"labels":[],"label_agreement":null},{"id":"W1990151894","doi":"10.1109/ipfa.2008.4588203","title":"Understanding Soft Defect Localization set-points for reducing cause-not-founds in integrated circuits","year":2008,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Set (abstract data type); Process (computing); Computer science; Relation (database); Fault (geology); Isolation (microbiology); Soft error; Electronic circuit; Materials science; Electronic engineering; Engineering; Electrical engineering; Data mining","score_opus":0.0998978950533247,"score_gpt":0.2528786591323474,"score_spread":0.15298076407902272,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1990151894","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.19283661,0.0001431944,0.8001246,0.000054125372,0.0003822471,0.00033923922,0.000021019403,0.0005484262,0.005550528],"genre_scores_gemma":[0.99891776,0.00007261647,0.0002081655,0.00012961891,0.000065443885,0.000030722073,0.00014399615,0.000069022266,0.000362659],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9985624,0.000037176236,0.00045257653,0.0003216406,0.00017673135,0.00044946902],"domain_scores_gemma":[0.9994086,0.00011827082,0.000044828015,0.00023233816,0.00011042148,0.000085563355],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00024826638,0.0002680157,0.0003494813,0.0004809357,0.00016287022,0.00005888975,0.0001464597,0.0002041023,0.00019163551],"category_scores_gemma":[0.00011710101,0.00024812928,0.00016690131,0.0009136886,0.000045023564,0.00029908546,0.000008776233,0.00025031323,0.000023588755],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005967951,0.00015787265,0.015598225,0.000502699,0.0018880414,0.00017594054,0.013414082,0.7562486,0.12647088,0.030131895,0.050240926,0.0051111444],"study_design_scores_gemma":[0.001320928,0.00008687099,0.0001761232,0.00022252122,0.00017690062,0.00008261875,0.0032918183,0.9589062,0.030090975,0.0016922384,0.0030137843,0.0009390306],"about_ca_topic_score_codex":0.0003207741,"about_ca_topic_score_gemma":0.00078606285,"teacher_disagreement_score":0.8060812,"about_ca_system_score_codex":0.0007977573,"about_ca_system_score_gemma":0.00007025966,"threshold_uncertainty_score":0.9999971},"labels":[],"label_agreement":null},{"id":"W1990830768","doi":"10.1016/j.exphem.2013.05.119","title":"Profiling of microrna expression involved in iPSC generation, maintenance and differentiation using a high throughput, LNA™-enhanced qPCR method","year":2013,"lang":"en","type":"article","venue":"Experimental Hematology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Ottawa; Ottawa Hospital","funders":"","keywords":"microRNA; Profiling (computer programming); Throughput; Gene expression profiling; Computational biology; Biology; Gene expression; Computer science; Genetics; Gene; Telecommunications; Operating system; Wireless","score_opus":0.019151278100408516,"score_gpt":0.2628236885265208,"score_spread":0.24367241042611232,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1990830768","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95815754,0.0020520044,0.03928545,0.00001354392,0.00015945146,0.00021389718,0.0000025222018,0.000037705762,0.000077907476],"genre_scores_gemma":[0.9769806,0.000023201414,0.022827974,0.0000233287,0.00002928136,0.00005342046,0.000030600226,0.000021867487,0.000009713999],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99903005,0.00006576906,0.00038868695,0.00023065812,0.00007511686,0.0002096989],"domain_scores_gemma":[0.9996583,0.000024571453,0.000083933344,0.00014282744,0.000055035758,0.000035374396],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000059838643,0.0001648514,0.00035913842,0.00012247398,0.000040994822,0.000019120665,0.000073364776,0.00013165532,0.000115993724],"category_scores_gemma":[0.000009683409,0.00014523952,0.000041879473,0.0001475546,0.00003884342,0.00021925039,0.00002648877,0.00011635784,0.0000034053858],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000003631632,0.000033983324,0.0005573789,0.000032553147,0.000027235,0.0000012537563,0.000931854,0.000664538,0.9938732,0.0037190025,0.00006895974,0.000086420914],"study_design_scores_gemma":[0.00036317212,0.000018290777,0.00008908511,0.000055285105,0.00000909886,0.000009643329,0.001340368,0.08354968,0.91427815,0.0001518951,0.0000029212806,0.00013243359],"about_ca_topic_score_codex":0.00026360655,"about_ca_topic_score_gemma":0.00003595197,"teacher_disagreement_score":0.082885146,"about_ca_system_score_codex":0.000076426026,"about_ca_system_score_gemma":0.000011595983,"threshold_uncertainty_score":0.5922696},"labels":[],"label_agreement":null},{"id":"W1994356874","doi":"10.1109/mdt.2002.1033790","title":"Leakage and process variation effects in current testing on future CMOS circuits","year":2002,"lang":"en","type":"article","venue":"IEEE Design & Test of Computers","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":34,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Leakage (economics); CMOS; Process variation; Transistor; Electronic engineering; Iddq testing; Electronic circuit; Sensitivity (control systems); Scaling; Integrated circuit; Computer science; Electrical engineering; Engineering; Voltage","score_opus":0.02343515816398593,"score_gpt":0.21238047146986502,"score_spread":0.1889453133058791,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1994356874","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8287337,0.0014945215,0.1667784,0.00004709335,0.0013684084,0.0005749105,0.0000063655875,0.00031451986,0.000682099],"genre_scores_gemma":[0.9990674,0.00003972242,0.000645456,0.000030943433,0.00017490437,0.000013351001,0.0000020310806,0.000023728784,0.0000024384885],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99913627,0.000042702417,0.00024865856,0.00020358276,0.00015985713,0.00020895789],"domain_scores_gemma":[0.99921423,0.00046444175,0.00006251373,0.00013548364,0.00007061794,0.00005269971],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000121624835,0.00018833317,0.00025919738,0.00022599219,0.000031612813,0.00003533189,0.00012361234,0.00007958064,0.000004032643],"category_scores_gemma":[0.000058246842,0.00017964031,0.000034651595,0.0005007067,0.000017040978,0.00013128041,0.0000035038543,0.00024158754,0.000006864979],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000005235162,0.00037152995,0.0033439093,0.001157275,0.00015190574,0.00005925026,0.0049931253,0.38961333,0.22549036,0.0003240598,0.002530588,0.37195945],"study_design_scores_gemma":[0.0006458384,0.00025107406,0.006453431,0.0005854161,0.000051731695,0.000012228207,0.000032626558,0.9731778,0.018105924,0.00023981139,0.00007057214,0.00037354644],"about_ca_topic_score_codex":0.000006603852,"about_ca_topic_score_gemma":0.0000022191557,"teacher_disagreement_score":0.58356446,"about_ca_system_score_codex":0.000052046325,"about_ca_system_score_gemma":0.000008084803,"threshold_uncertainty_score":0.7325519},"labels":[],"label_agreement":null},{"id":"W1994591411","doi":"10.1063/1.4772207","title":"Quantitative self-calibrating lock-in carrierographic lifetime imaging of silicon wafers","year":2012,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":32,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Wafer; Calibration; Materials science; Optics; Silicon; Optoelectronics; Detector; Photoluminescence; Image resolution; Physics","score_opus":0.0076910739320512995,"score_gpt":0.2031501246518159,"score_spread":0.1954590507197646,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1994591411","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9945063,0.00018904496,0.00213932,0.00004812582,0.00010927937,0.0001247047,0.000007843903,0.00015404238,0.002721314],"genre_scores_gemma":[0.9988294,0.000008997365,0.0006592449,0.00028866495,0.00011561262,0.0000225384,0.000024885496,0.000049454284,0.0000011486643],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99890006,0.000024342926,0.00030835049,0.00016882793,0.0001667315,0.00043171569],"domain_scores_gemma":[0.9995381,0.000079583115,0.000070479065,0.00021341181,0.0000222494,0.00007612743],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013336066,0.00022236865,0.0003173498,0.00014732282,0.00003696567,0.000022841521,0.00014537179,0.00004875543,0.000017551936],"category_scores_gemma":[0.0000033400745,0.00022686442,0.000119882985,0.0006363302,0.000056866247,0.00024927087,0.000014404636,0.0002699786,0.000015780164],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000036966828,0.000035603032,0.01093319,0.00005247973,0.00020269539,0.00000126561,0.0033819098,0.017346473,0.9565287,0.010264672,0.0003675319,0.00088176114],"study_design_scores_gemma":[0.0014343315,0.000034696754,0.0046926937,0.00016100146,0.00051754265,0.0000040103364,0.0072509693,0.078745164,0.9039989,0.0005269887,0.00072302035,0.0019106539],"about_ca_topic_score_codex":0.0000779423,"about_ca_topic_score_gemma":0.00000400982,"teacher_disagreement_score":0.061398692,"about_ca_system_score_codex":0.000053557644,"about_ca_system_score_gemma":0.000008986109,"threshold_uncertainty_score":0.92512625},"labels":[],"label_agreement":null},{"id":"W1997074374","doi":"10.4028/www.scientific.net/msf.483-485.925","title":"Influence of Overgrown Micropipes in the Active Area of SiC Schottky Diodes on Long Term Reliability","year":2005,"lang":"en","type":"article","venue":"Materials science forum","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Materials science; Silicon carbide; Optoelectronics; Leakage (economics); Schottky diode; Composite material; Diode","score_opus":0.0072460372806089106,"score_gpt":0.2198018907262922,"score_spread":0.21255585344568328,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1997074374","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99920565,0.000024981677,0.00001310762,0.000083495164,0.0000880568,0.00011837344,0.000038194426,0.00001818024,0.00040996337],"genre_scores_gemma":[0.99986225,0.000017158653,0.000037002646,0.00004150763,0.000016366825,0.000008441265,0.000002515941,0.000006166263,0.000008593865],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99888474,0.00003384108,0.0003384145,0.00019085103,0.0002715902,0.000280593],"domain_scores_gemma":[0.99940157,0.000049039543,0.00008070613,0.00034966864,0.00009406368,0.000024978968],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00054379884,0.00012163332,0.00024596343,0.00017327664,0.000055600474,0.000050283583,0.0005124302,0.0000490705,0.00006673452],"category_scores_gemma":[0.00010259043,0.00007840878,0.00004332776,0.00051811326,0.00032865495,0.00043781236,0.000026457157,0.00008651333,0.0000072407647],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009175054,0.00003105286,0.0041087866,0.00002424076,0.000005593475,5.9295553e-7,0.00068426755,0.01732063,0.97699547,0.00027047237,0.000014406266,0.0005352936],"study_design_scores_gemma":[0.000073450785,0.000037045447,0.06930855,0.00007473841,0.000008402165,0.0000010678921,0.00031293108,0.0001617244,0.9297905,0.00012002949,0.00002767041,0.00008390805],"about_ca_topic_score_codex":0.00018324384,"about_ca_topic_score_gemma":0.00016538058,"teacher_disagreement_score":0.06519976,"about_ca_system_score_codex":0.00008436228,"about_ca_system_score_gemma":0.0000392799,"threshold_uncertainty_score":0.31974173},"labels":[],"label_agreement":null},{"id":"W1997783441","doi":"10.1109/ipfa.2010.5532244","title":"Absorbed-specimen current imaging implementation and characterization in nano-prober for resistive interconnects isolation in 45-nm silicon-on-insulator microprocessors","year":2010,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Resistive touchscreen; Silicon; Absorbed dose; Silicon on insulator; Optoelectronics; Interconnection; Electron beam-induced current; Scanning electron microscope; Current (fluid); Characterization (materials science); Optics; Nanotechnology; Computer science; Electrical engineering; Composite material; Radiation","score_opus":0.006836204399586146,"score_gpt":0.249713418283695,"score_spread":0.24287721388410885,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1997783441","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9969864,0.00004908935,0.0019077958,0.00008863629,0.00026311362,0.0003849986,0.00003887877,0.00005816123,0.00022294842],"genre_scores_gemma":[0.9992935,0.000040167506,0.00012805234,0.00004868826,0.000070010254,0.00007874848,0.00028780938,0.000028233537,0.000024811197],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99906987,0.000015311805,0.00035467884,0.0002621995,0.0000759614,0.00022195322],"domain_scores_gemma":[0.99966824,0.000044103315,0.00005636785,0.00010820225,0.00008317379,0.00003990486],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001684601,0.00017117333,0.00018396295,0.00039113668,0.00003730345,0.0000724719,0.00006622551,0.000066868815,0.00010805037],"category_scores_gemma":[0.000024529229,0.00016201238,0.000034320416,0.000255504,0.000015364152,0.00034899687,0.000009152178,0.00020923864,0.0000056455333],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000014894013,0.000022742865,0.01458582,0.000046276466,0.000015147624,4.741202e-7,0.001176615,0.00006028434,0.96334714,0.0012124275,0.000053465366,0.019464737],"study_design_scores_gemma":[0.0028666025,0.00007491076,0.1375383,0.00021642366,0.00006295111,0.000004332634,0.0031527218,0.12728302,0.72374254,0.0009679085,0.0031993538,0.00089092116],"about_ca_topic_score_codex":0.00010414928,"about_ca_topic_score_gemma":0.0020031382,"teacher_disagreement_score":0.23960456,"about_ca_system_score_codex":0.00009282147,"about_ca_system_score_gemma":0.00001700813,"threshold_uncertainty_score":0.6606673},"labels":[],"label_agreement":null},{"id":"W1999969834","doi":"10.1109/tcad.2012.2218602","title":"Charge-Controlled Readout and BIST Circuit for MEMS Sensors","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Windsor","funders":"","keywords":"Microelectromechanical systems; Built-in self-test; Capacitive sensing; Capacitance; CMOS; Electronic engineering; Voltage; Electrical engineering; Engineering; Materials science; Optoelectronics; Physics; Electrode","score_opus":0.02551879320145099,"score_gpt":0.20649947258255194,"score_spread":0.18098067938110096,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1999969834","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.061669808,0.00089722953,0.9336166,0.000025957974,0.0011914963,0.001905132,0.00013202695,0.00029465833,0.00026710122],"genre_scores_gemma":[0.99789613,0.00035866897,0.0003362308,0.000042848016,0.000117562675,0.0004339295,0.000017281018,0.000088250395,0.000709089],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99751383,0.00015184152,0.0010395639,0.0005306543,0.00026785574,0.000496231],"domain_scores_gemma":[0.9981059,0.0005306556,0.00018517431,0.00038476646,0.0005537808,0.00023976527],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004542465,0.0005536078,0.0012471419,0.0006130265,0.00020618175,0.00030682064,0.00020916456,0.0003439778,0.000079066886],"category_scores_gemma":[0.0000113497235,0.00044177676,0.0002616014,0.00043288723,0.00011183116,0.00029009403,9.716847e-7,0.00038951685,0.000024374625],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000151031,0.0003516455,0.000021451251,0.00097123475,0.0044726226,0.000017051663,0.002211768,0.18210158,0.5884517,0.0019834691,0.0053883004,0.21387815],"study_design_scores_gemma":[0.0032511177,0.0005476885,0.00000995651,0.0003906503,0.00036594144,0.00008969789,0.00061978825,0.96590775,0.027488759,0.00011301957,0.0005604275,0.000655219],"about_ca_topic_score_codex":0.0006182357,"about_ca_topic_score_gemma":0.000010663536,"teacher_disagreement_score":0.9362263,"about_ca_system_score_codex":0.00010236861,"about_ca_system_score_gemma":0.000056932575,"threshold_uncertainty_score":0.9998034},"labels":[],"label_agreement":null},{"id":"W2000803296","doi":"10.1063/1.2135897","title":"Blistering of GaAs by low keV H, D, and He ions","year":2005,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Fluence; Ion; Materials science; Impact crater; Exfoliation joint; Cleavage (geology); Blisters; Saturation (graph theory); Ion implantation; Analytical Chemistry (journal); Radiochemistry; Molecular physics; Chemistry; Composite material; Nanotechnology; Fracture (geology); Graphene; Physics","score_opus":0.005525123668646857,"score_gpt":0.17639688341805437,"score_spread":0.17087175974940752,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2000803296","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9891166,0.000093536524,0.006167465,0.00021387463,0.000038104143,0.00006202902,0.00001835274,0.000078641024,0.0042113904],"genre_scores_gemma":[0.9990342,0.000023850822,0.00022125474,0.000504468,0.00012748815,0.000009382926,0.000026932223,0.000026154123,0.000026272599],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99946,0.0000037026277,0.00014934878,0.0001275363,0.00009023238,0.00016917447],"domain_scores_gemma":[0.9997402,0.000018199607,0.000027402186,0.00016194824,0.000011404678,0.000040835755],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000027862912,0.00013019165,0.00017214348,0.000035209625,0.000031123323,0.000024435089,0.00008774275,0.000037887887,0.000026836802],"category_scores_gemma":[6.628903e-7,0.00012918556,0.00004776407,0.000144477,0.00004183289,0.000078511206,0.000011499467,0.00013257744,0.000015487423],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[9.269683e-7,0.00000979802,0.000018767882,0.000024104069,0.00009288955,3.016594e-7,0.00028120892,0.010312524,0.9739668,0.0009067196,0.008928508,0.005457497],"study_design_scores_gemma":[0.00040980784,0.00000765486,0.000047888392,0.000030964373,0.00013696437,0.0000015411924,0.00016194163,0.006701837,0.97185904,0.00010858062,0.020080809,0.00045297397],"about_ca_topic_score_codex":0.000020226109,"about_ca_topic_score_gemma":0.000004665186,"teacher_disagreement_score":0.0111523,"about_ca_system_score_codex":0.00002365839,"about_ca_system_score_gemma":0.0000026011555,"threshold_uncertainty_score":0.5268034},"labels":[],"label_agreement":null},{"id":"W2000839619","doi":"10.1002/jbm.10387","title":"Long‐term stability of a coronary stent coating post‐implantation","year":2002,"lang":"en","type":"article","venue":"Journal of Biomedical Materials Research","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":50,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Materials science; Term (time); Coronary stent; Coating; Stent; Biomedical engineering; Medicine; Internal medicine; Composite material; Restenosis","score_opus":0.0661457140540915,"score_gpt":0.314319832922729,"score_spread":0.24817411886863752,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2000839619","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9986937,0.00031763813,0.0001908707,0.00015589385,0.00036347052,0.000085817446,0.00006173016,0.0000127308,0.000118161835],"genre_scores_gemma":[0.99930245,0.00032218473,0.00009937406,0.000010019539,0.0002182849,0.0000021584788,0.00001696082,0.00001516852,0.000013431335],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99751,0.00025946295,0.0008651641,0.00009742755,0.0009625505,0.000305395],"domain_scores_gemma":[0.9986115,0.00021238723,0.00014658169,0.00014835793,0.00070667773,0.00017450133],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0019047144,0.00010191566,0.0003811257,0.00041941332,0.000049795628,0.000056129775,0.00026222665,0.00012896961,0.0044059483],"category_scores_gemma":[0.00028828034,0.00007391951,0.00009298947,0.00036360003,0.00017639551,0.00016668094,0.00003046134,0.00034266195,0.00002430694],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004336672,0.00010798316,0.0006947708,0.00021915346,0.00012852399,0.000091139475,0.000520124,0.0000057431093,0.99098605,0.000022729995,0.00075675105,0.006423651],"study_design_scores_gemma":[0.0009214651,0.0009972015,0.014168368,0.00038800103,0.00007359124,0.00043049423,0.0010366763,0.0006050515,0.9807879,0.000080877864,0.0003222601,0.00018816908],"about_ca_topic_score_codex":0.000035150282,"about_ca_topic_score_gemma":0.000005596683,"teacher_disagreement_score":0.013473596,"about_ca_system_score_codex":0.000122014615,"about_ca_system_score_gemma":0.0000429206,"threshold_uncertainty_score":0.9965042},"labels":[],"label_agreement":null},{"id":"W2001402339","doi":"10.1109/iolts.2013.6604052","title":"Accelerating post silicon debug of deep electrical faults","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Debugging; Tree traversal; Computer science; Root cause; TRACE (psycholinguistics); Reduction (mathematics); Embedded system; Benchmark (surveying); Automatic test pattern generation; State (computer science); Chip; Crash; Path (computing); Reliability engineering; Engineering; Electrical engineering; Algorithm; Electronic circuit; Telecommunications","score_opus":0.007583373675053533,"score_gpt":0.19194783953761402,"score_spread":0.18436446586256047,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2001402339","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9624864,0.00014666832,0.0015105994,0.000039764152,0.00005157057,0.000086202584,0.0000011995813,0.00016876051,0.035508867],"genre_scores_gemma":[0.9991929,0.000009946631,0.0003811267,0.00009272857,0.000041387244,0.000009266351,0.000010772173,0.000018185603,0.00024367557],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99929625,0.000010957411,0.00025462636,0.00011193364,0.00010590782,0.00022032284],"domain_scores_gemma":[0.99956876,0.000040967872,0.000022366597,0.00014782368,0.00016143892,0.000058650912],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00003766366,0.00011823099,0.00019003535,0.00010633285,0.000026572156,0.000027795582,0.00012235956,0.0000875129,0.00224792],"category_scores_gemma":[0.00003318931,0.00009166724,0.000084714084,0.0002701848,0.000011998941,0.00017395608,0.000007249941,0.00014765392,0.00016172195],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[7.719254e-7,0.000017043116,0.00074253033,0.000013530774,0.00010763649,0.0000010688887,0.00021062924,0.0013511755,0.9677124,0.0014719844,0.001390374,0.026980834],"study_design_scores_gemma":[0.00021303781,0.00006725791,0.0020798428,0.000010758363,0.00004979391,0.000007759045,0.00045874843,0.58394593,0.41224536,0.00019752773,0.00040912483,0.0003148467],"about_ca_topic_score_codex":0.00056117837,"about_ca_topic_score_gemma":0.00012428405,"teacher_disagreement_score":0.58259475,"about_ca_system_score_codex":0.000028373332,"about_ca_system_score_gemma":0.000007886735,"threshold_uncertainty_score":0.99866414},"labels":[],"label_agreement":null},{"id":"W2001795517","doi":"10.1109/vts.2013.6548945","title":"Special session 12B: Panel post-silicon validation &amp; test in huge variance era","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Session (web analytics); Computer science; Transistor; Die (integrated circuit); Electronics; Variance (accounting); Resolution (logic); Voltage; Test (biology); Reliability engineering; Embedded system; Electronic engineering; Electrical engineering; Engineering; Operating system","score_opus":0.015434654838912567,"score_gpt":0.212330639826775,"score_spread":0.19689598498786243,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2001795517","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89945954,0.00004671674,0.0009876761,0.00026645174,0.0006055531,0.00020433345,0.000012328692,0.00022971908,0.09818767],"genre_scores_gemma":[0.9943331,0.00005056954,0.000356375,0.0001899646,0.0010218268,0.000023226661,0.00013305157,0.000029148245,0.0038627516],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990806,0.00002252686,0.0002962344,0.00019758017,0.00014620165,0.00025687806],"domain_scores_gemma":[0.9994893,0.000064386695,0.000028715896,0.0002280248,0.00012628087,0.00006328622],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00009683359,0.00016692426,0.00019062884,0.00017572682,0.000038216935,0.00010498947,0.0001316529,0.00013891184,0.00818442],"category_scores_gemma":[0.00007853272,0.00013930578,0.00006206003,0.00034449657,0.00001268425,0.00043256045,0.0000115302155,0.00025195634,0.0013332153],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000025753466,0.0000895458,0.0049897484,0.000075606564,0.000047827893,0.000005397625,0.000752975,0.0024023072,0.93906313,0.0016256651,0.035788666,0.015156524],"study_design_scores_gemma":[0.0036176117,0.00027432395,0.15144373,0.0011330678,0.00025246132,0.00006706727,0.003667717,0.12346224,0.4189,0.0044438257,0.28829166,0.0044462527],"about_ca_topic_score_codex":0.0010152941,"about_ca_topic_score_gemma":0.00048527395,"teacher_disagreement_score":0.5201631,"about_ca_system_score_codex":0.000100350284,"about_ca_system_score_gemma":0.000021960777,"threshold_uncertainty_score":0.99944437},"labels":[],"label_agreement":null},{"id":"W2002234294","doi":"10.1023/a:1027418704942","title":"On Faster IDDQ Measurements","year":2003,"lang":"en","type":"article","venue":"Journal of Electronic Testing","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Key (lock); Computer science; Algorithm; Operating system","score_opus":0.03105263204613115,"score_gpt":0.21953119749502248,"score_spread":0.18847856544889133,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2002234294","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9563751,0.0011235842,0.0025113577,0.000022235254,0.00028436998,0.000039436323,3.4775326e-7,0.00004831994,0.03959523],"genre_scores_gemma":[0.999448,0.0000039918154,0.0003030145,0.000061840234,0.0000788166,5.5515403e-7,2.1498286e-7,0.000021617972,0.000081949474],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99900115,0.00003535332,0.0003266094,0.00006573385,0.0002404945,0.0003306893],"domain_scores_gemma":[0.9994701,0.000084811094,0.00010974521,0.00009106461,0.00018795174,0.00005631878],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004388076,0.000118152566,0.0001881116,0.00015205235,0.000039946997,0.000033159737,0.00011055007,0.000045787398,0.00009758883],"category_scores_gemma":[0.00039450126,0.00009367864,0.00009290005,0.00027864394,0.0000066705047,0.00011080195,0.0000016224275,0.0004667094,0.000015224471],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002339688,0.00017781027,0.0063100685,0.0000765984,0.0017954892,0.00008642348,0.00054795895,0.38951132,0.5576953,0.013571916,0.006613149,0.02359053],"study_design_scores_gemma":[0.009693112,0.0073527466,0.0022476958,0.0030758951,0.0025098003,0.005003031,0.0016596436,0.10951087,0.7034565,0.06412403,0.08695795,0.004408683],"about_ca_topic_score_codex":0.0000019358927,"about_ca_topic_score_gemma":0.00000477162,"teacher_disagreement_score":0.28000045,"about_ca_system_score_codex":0.0002280564,"about_ca_system_score_gemma":0.00008814508,"threshold_uncertainty_score":0.3820104},"labels":[],"label_agreement":null},{"id":"W2002748415","doi":"10.1109/ipfa.2012.6306300","title":"Failure analysis challenges and solution for thin package","year":2012,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Soldering; Flip chip; Joint (building); Materials science; Integrated circuit packaging; Die (integrated circuit); Electronic packaging; Mechanical engineering; Packaging engineering; Structural engineering; Integrated circuit; Engineering; Composite material; Optoelectronics; Layer (electronics)","score_opus":0.021643224800167126,"score_gpt":0.21981539836617855,"score_spread":0.19817217356601144,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2002748415","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.48578826,0.0594697,0.38545194,0.002338423,0.0007421227,0.0007215348,0.00009448546,0.0016662565,0.06372727],"genre_scores_gemma":[0.99746215,0.0005664919,0.0013651815,0.0000308388,0.00011800628,0.000016875942,0.000031094252,0.000015032083,0.00039430417],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994424,0.0000104226,0.0001224622,0.000106342704,0.00006471719,0.00025368648],"domain_scores_gemma":[0.9996947,0.000034111286,0.000014363153,0.00014155368,0.000036936963,0.0000783485],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001577146,0.00011425696,0.00019624078,0.0001790636,0.000043770728,0.00002169192,0.000049997587,0.00009586897,0.00012882559],"category_scores_gemma":[0.00001108911,0.00009043578,0.00012511772,0.00019027214,0.000012702061,0.00021944517,0.000006021247,0.00007109703,0.000012437647],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020417838,0.00025025214,0.00869656,0.0006955467,0.025244595,0.0000030060958,0.026408816,0.004338223,0.2994045,0.3765298,0.0532313,0.20517698],"study_design_scores_gemma":[0.0015483912,0.00016401107,0.017008847,0.000047296347,0.013308036,0.000022043612,0.013329431,0.60287994,0.0698785,0.003598066,0.2754414,0.0027740302],"about_ca_topic_score_codex":0.000020101366,"about_ca_topic_score_gemma":0.00038221298,"teacher_disagreement_score":0.59854174,"about_ca_system_score_codex":0.000022389082,"about_ca_system_score_gemma":0.0000021946432,"threshold_uncertainty_score":0.36878642},"labels":[],"label_agreement":null},{"id":"W2008135793","doi":"10.1116/1.2172931","title":"Time resolved electroluminescence measurements on GaAs and GaN devices","year":2006,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University; National Research Council Canada","funders":"","keywords":"Electroluminescence; Optoelectronics; Materials science; Heterojunction; Transistor; Bipolar junction transistor; Semiconductor; Heterojunction bipolar transistor; Semiconductor device; Voltage; Physics; Nanotechnology","score_opus":0.007881926262937777,"score_gpt":0.2047649881692307,"score_spread":0.19688306190629293,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2008135793","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9953913,0.0028923824,0.00012187989,0.0005007069,0.000122825,0.00006916789,0.0000032732594,0.000086685286,0.00081177056],"genre_scores_gemma":[0.99891126,0.00026767128,0.0005932169,0.000045929813,0.000033205684,0.0000016941206,7.1990405e-7,0.00001538573,0.00013094473],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983593,0.000017717592,0.0004624683,0.00027262344,0.00042608826,0.00046177156],"domain_scores_gemma":[0.99918693,0.00003294882,0.00019084442,0.0002023651,0.00028525924,0.00010164305],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00072620925,0.00023336407,0.00040128984,0.0009746474,0.0002558464,0.00012662419,0.00045282274,0.00018467265,0.000034419423],"category_scores_gemma":[0.000035681267,0.0001759082,0.00006257517,0.0014094027,0.000543532,0.00043312385,0.000030001698,0.00045431385,0.000007980781],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012221215,0.000034438883,0.007218562,0.000011395395,0.00005347919,0.000015466123,0.00006267354,0.0005707833,0.9902883,0.00026943046,0.00070639484,0.00075682823],"study_design_scores_gemma":[0.0015305962,0.0014915467,0.01688393,0.0003969175,0.00034386877,0.0007837397,0.0012401914,0.045520604,0.9224607,0.002395864,0.0058894274,0.0010626699],"about_ca_topic_score_codex":0.000018686793,"about_ca_topic_score_gemma":0.000025569017,"teacher_disagreement_score":0.06782768,"about_ca_system_score_codex":0.00006357767,"about_ca_system_score_gemma":0.00006678862,"threshold_uncertainty_score":0.7173328},"labels":[],"label_agreement":null},{"id":"W2009416906","doi":"10.1017/s1431927605507001","title":"The Power of Low kV Microscopy in Sub-Micron Size Defect Analysis","year":2005,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"JDSU (Canada)","funders":"","keywords":"Microanalysis; Microscopy; Materials science; Analytical Chemistry (journal); Chemistry; Optics; Physics; Chromatography","score_opus":0.0035602736809977518,"score_gpt":0.2147580950000403,"score_spread":0.21119782131904255,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2009416906","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9830137,0.015173982,0.0008484178,0.00013289948,0.00008150569,0.00014789397,0.00007945007,0.00006637133,0.00045580414],"genre_scores_gemma":[0.99564344,0.0030956403,0.0006047204,0.0001096976,0.000038957114,0.000015491903,0.00004508261,0.000047574245,0.00039937385],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9975706,0.00011081466,0.0009408957,0.00051190343,0.0002014053,0.0006644331],"domain_scores_gemma":[0.99858683,0.00027691343,0.00016759789,0.00070188905,0.00014547362,0.00012128045],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005790631,0.00045050835,0.0009650288,0.0007221758,0.00021155187,0.0001721906,0.00042840245,0.0002400015,0.00022565156],"category_scores_gemma":[0.000053171072,0.00034980234,0.00087681157,0.0029094103,0.00024211891,0.00019795635,0.000051015515,0.00041129295,0.00004065034],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026519905,0.00006458165,0.007792036,0.000034879195,0.0033524497,0.000004141461,0.0007330483,0.003105878,0.98151445,0.000027729555,0.0012636721,0.0020806354],"study_design_scores_gemma":[0.0006099685,0.00004017066,0.003137601,0.000051555056,0.0033171058,0.000007531957,0.00073237496,0.0038727333,0.9785601,0.000035681453,0.009037235,0.0005979243],"about_ca_topic_score_codex":0.00036851835,"about_ca_topic_score_gemma":0.0044618356,"teacher_disagreement_score":0.0126297865,"about_ca_system_score_codex":0.0001677931,"about_ca_system_score_gemma":0.000039786875,"threshold_uncertainty_score":0.9998954},"labels":[],"label_agreement":null},{"id":"W2012627669","doi":"10.1117/12.810907","title":"Free carrier lifetime modification in silicon","year":2009,"lang":"en","type":"article","venue":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Engineering and Physical Sciences Research Council","keywords":"Silicon; Materials science; Carrier lifetime; Optoelectronics; Free carrier absorption; Ion implantation; Absorption (acoustics); Diode; Free carrier; Raman spectroscopy; Raman amplification; Ion; Optics; Raman scattering; Chemistry","score_opus":0.010223278994061535,"score_gpt":0.21665963253925605,"score_spread":0.20643635354519452,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2012627669","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99270207,0.00019666791,0.000026769452,0.0014608435,0.00016147844,0.00033652037,0.00008020727,0.00013787637,0.0048975903],"genre_scores_gemma":[0.99194366,0.00012915359,0.007246469,0.00010067565,0.00029205714,0.000069298214,0.000017206725,0.00005310344,0.00014835766],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9980278,1.113248e-8,0.0007378451,0.00032421557,0.0005074327,0.000402689],"domain_scores_gemma":[0.9986618,0.000062557156,0.0001692706,0.00009412708,0.00090500317,0.00010721144],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00041767195,0.00032306797,0.0004443397,0.00020196309,0.00004450208,0.00009656177,0.00096770935,0.00025466297,0.000019877682],"category_scores_gemma":[0.00031532938,0.0002810077,0.0005293826,0.0005420531,0.00009164303,0.00052839087,0.000040541567,0.00040840605,0.0000013632214],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020801908,0.00006101527,0.0002124487,0.00012788261,0.00023971453,9.1449124e-8,0.0002882525,0.0017980691,0.74691266,0.24589206,0.0039751213,0.00047186317],"study_design_scores_gemma":[0.0022812686,0.00041628847,0.0041674697,0.0005522203,0.00038908765,0.000019168257,0.0026941102,0.35597524,0.617063,0.007994857,0.007324915,0.0011223938],"about_ca_topic_score_codex":0.000016983711,"about_ca_topic_score_gemma":6.385665e-7,"teacher_disagreement_score":0.35417718,"about_ca_system_score_codex":0.00022600428,"about_ca_system_score_gemma":0.00002132161,"threshold_uncertainty_score":0.99996424},"labels":[],"label_agreement":null},{"id":"W2013408570","doi":"10.1557/opl.2013.416","title":"Read Back of Stored Data in Non Volatile Memory Devices by Scanning Capacitance Microscopy","year":2013,"lang":"en","type":"article","venue":"MRS Proceedings","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Chipworks (Canada); University of Waterloo","funders":"","keywords":"Materials science; Transistor; Optoelectronics; Capacitance; Reading (process); Flash (photography); Flash memory; Non-volatile memory; NAND gate; Charge (physics); Computer hardware; Logic gate; Electrical engineering; Computer science; Voltage; Optics; Electrode; Physics","score_opus":0.011824179820809523,"score_gpt":0.22029145422795857,"score_spread":0.20846727440714904,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2013408570","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9886783,0.0006830099,0.00009435107,0.00004232477,0.000092611146,0.00016832307,0.000038318507,0.000059374925,0.010143425],"genre_scores_gemma":[0.99820435,0.000034626097,0.0009037755,0.00004532882,0.00004272134,0.000016426648,0.00006359032,0.000037352616,0.00065184245],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988947,0.0000031884388,0.00035387248,0.000291792,0.00015644594,0.00030002647],"domain_scores_gemma":[0.99945796,0.000015410616,0.00008629406,0.00023190856,0.00014834602,0.000060071052],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015639498,0.00018925215,0.00031359727,0.00015346693,0.0000303229,0.00007287244,0.0004912485,0.00011906456,0.00036769608],"category_scores_gemma":[0.000028128003,0.00017932635,0.00003401068,0.00045514145,0.00004670647,0.00087217527,0.000027600065,0.00023429989,0.000067534056],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000021145702,0.000012930053,0.0064224675,0.00016429671,0.000048128615,3.6651872e-7,0.0014047432,0.000050796385,0.9211273,0.000010001754,0.069910675,0.0008461765],"study_design_scores_gemma":[0.0007465577,0.00007268431,0.0036083895,0.0008098841,0.000109432396,0.000006243758,0.007006192,0.15042022,0.8252814,0.0001172212,0.010882672,0.0009390968],"about_ca_topic_score_codex":0.0015048775,"about_ca_topic_score_gemma":0.00011558896,"teacher_disagreement_score":0.15036942,"about_ca_system_score_codex":0.00007454569,"about_ca_system_score_gemma":0.000014288224,"threshold_uncertainty_score":0.7312716},"labels":[],"label_agreement":null},{"id":"W2016055653","doi":"10.4028/www.scientific.net/ssp.103-104.237","title":"Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication","year":2005,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mitel (Canada)","funders":"","keywords":"Materials science; Fabrication; Wafer; Contamination; Copper; Process (computing); Wafer fabrication; Metallurgy; Nanotechnology; Computer science","score_opus":0.023145036788852297,"score_gpt":0.30513392735571954,"score_spread":0.28198889056686727,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2016055653","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97353524,0.0009595456,0.0062790327,0.00008522506,0.00049663475,0.0015548776,0.015308918,0.00035063684,0.0014298793],"genre_scores_gemma":[0.9671349,0.005266274,0.00014457578,0.00017627138,0.00036768723,0.000168747,0.025894443,0.00020893027,0.00063819136],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99318784,0.00024286735,0.0020862862,0.002052706,0.0010229636,0.0014073378],"domain_scores_gemma":[0.9951793,0.00020686247,0.0008019769,0.0024540722,0.0007533603,0.0006044147],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0014033393,0.0011838025,0.0015254625,0.00079158664,0.0005825067,0.0006419879,0.0014028869,0.00021195304,0.00012198202],"category_scores_gemma":[0.0001464135,0.0011023083,0.00015344193,0.0009987915,0.00037940874,0.0031845113,0.00058724376,0.00074695953,0.000098292905],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0041835345,0.00809818,0.018805286,0.012124328,0.008745392,0.00012164854,0.09076469,0.21988104,0.12018228,0.00044390032,0.039809704,0.47684002],"study_design_scores_gemma":[0.013353012,0.001982782,0.0128396535,0.0014477561,0.0015674069,0.00005892706,0.0069775837,0.8801362,0.034013763,0.0050679455,0.036581077,0.0059739165],"about_ca_topic_score_codex":0.00017083864,"about_ca_topic_score_gemma":0.0006489571,"teacher_disagreement_score":0.66025513,"about_ca_system_score_codex":0.0002600079,"about_ca_system_score_gemma":0.00019401571,"threshold_uncertainty_score":0.9991427},"labels":[],"label_agreement":null},{"id":"W2016396677","doi":"10.4028/www.scientific.net/msf.573-574.387","title":"Advanced Annealing Schemes for High-Performance SOI Logic Technologies","year":2008,"lang":"en","type":"article","venue":"Materials science forum","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Annealing (glass); Silicon on insulator; Transistor; Optoelectronics; Scaling; Logic gate; Node (physics); Nanotechnology; Electronic engineering; Engineering physics; Electrical engineering; Silicon; Engineering; Voltage","score_opus":0.013298549939348725,"score_gpt":0.21530471564569353,"score_spread":0.2020061657063448,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2016396677","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99571514,0.00016809476,0.0021247438,0.0001244455,0.00070725236,0.00016779407,0.000029192017,0.0007179909,0.00024532087],"genre_scores_gemma":[0.9962645,0.00015819252,0.0033475668,0.000035460922,0.00003565842,0.000065505956,0.000012018715,0.000018883165,0.000062166335],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986991,0.0000037973139,0.0002543436,0.00026874692,0.0001831507,0.0005908232],"domain_scores_gemma":[0.99950767,0.000014717563,0.00004792186,0.00027461,0.00012111012,0.00003397956],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002238214,0.00017009371,0.00026065428,0.00022259356,0.000424861,0.00008554832,0.00047234623,0.00008585417,0.0000461249],"category_scores_gemma":[0.000068099296,0.0001353793,0.00003369077,0.00052944967,0.00032832814,0.0005801189,0.000042397995,0.00006424859,0.000032556454],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000041805756,0.000004553736,0.00010643904,0.000026493346,0.000008462289,0.0000014141037,0.000053552834,0.0024194857,0.99055207,0.0029551906,0.00016272113,0.003705415],"study_design_scores_gemma":[0.00013408223,0.00005111249,0.000077354656,0.000022087528,0.0000076447095,0.000007541636,0.00048788,0.003090066,0.9934861,0.0007930754,0.0016367453,0.00020632712],"about_ca_topic_score_codex":0.000011645151,"about_ca_topic_score_gemma":0.0000032311248,"teacher_disagreement_score":0.0034990879,"about_ca_system_score_codex":0.00007120291,"about_ca_system_score_gemma":0.000041660132,"threshold_uncertainty_score":0.5520608},"labels":[],"label_agreement":null},{"id":"W2016630350","doi":"10.1116/1.1651542","title":"Use of the focused ion beam to locate failure sites within electrically erasable read only memory microcircuits","year":2004,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Materials science; Transistor; Focused ion beam; Optoelectronics; Oxide; Leakage (economics); Quantum tunnelling; Dielectric; Gate oxide; Etching (microfabrication); Transmission electron microscopy; Electrical engineering; Nanotechnology; Ion; Voltage; Chemistry; Engineering","score_opus":0.014347651230931622,"score_gpt":0.20765092487762934,"score_spread":0.19330327364669772,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2016630350","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9960712,0.0009270891,0.0007143817,0.0017567702,0.0002390359,0.00016566702,0.000010307942,0.00007319112,0.000042320935],"genre_scores_gemma":[0.996509,0.00017109879,0.003034785,0.00011858357,0.00002190858,0.0000023068583,6.021871e-7,0.000022934177,0.00011874527],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9979424,0.000021544616,0.0007310184,0.0003052481,0.00047612243,0.0005236566],"domain_scores_gemma":[0.99842256,0.0000517092,0.00035793582,0.00040880285,0.00060203276,0.00015696479],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00068892026,0.0002748477,0.00053812336,0.001074411,0.00028208306,0.00013673925,0.0009685172,0.0002911081,0.00002236641],"category_scores_gemma":[0.00017647026,0.00017964617,0.00015236365,0.004008612,0.00042898665,0.00065813155,0.0000938996,0.0007889727,0.0000053004246],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010592678,0.000043493048,0.0019434413,0.000015712125,0.000091007794,0.000011294314,0.0005431781,0.019262759,0.97634554,0.0006108058,0.00042500463,0.0006971446],"study_design_scores_gemma":[0.00044305585,0.00042001723,0.0013327819,0.0001894041,0.0001370297,0.0003507963,0.0009133296,0.001230689,0.99245447,0.0014844674,0.00073214405,0.0003117983],"about_ca_topic_score_codex":0.00005933379,"about_ca_topic_score_gemma":0.00015003928,"teacher_disagreement_score":0.01803207,"about_ca_system_score_codex":0.00013912572,"about_ca_system_score_gemma":0.00038043954,"threshold_uncertainty_score":0.73257583},"labels":[],"label_agreement":null},{"id":"W2018988510","doi":"10.1016/j.mee.2008.08.011","title":"Location of current carrying failure sites in integrated circuits by magnetic force microscopy at large probe-to-sample separation","year":2008,"lang":"en","type":"article","venue":"Microelectronic Engineering","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Manitoba","funders":"","keywords":"Electrical conductor; Magnetic field; Current (fluid); Integrated circuit; Electronic circuit; Materials science; Power (physics); Fault (geology); Micrometer; Electrical engineering; Optoelectronics; Optics; Physics; Engineering; Geology","score_opus":0.007345730112185613,"score_gpt":0.22344821355418318,"score_spread":0.21610248344199756,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2018988510","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8517764,0.013681607,0.13383898,0.000013469609,0.000096823205,0.00033892257,0.00004277355,0.0001890505,0.000021946185],"genre_scores_gemma":[0.99852896,0.00038294625,0.00050096615,0.000009720466,0.000034339628,0.00006376658,0.0003400855,0.00007100182,0.00006822104],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998282,0.00002104386,0.000505692,0.00032630473,0.00016340124,0.0007015451],"domain_scores_gemma":[0.9993984,0.000046366808,0.000051913037,0.00025350376,0.00015987037,0.00008995848],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00010985988,0.0003333083,0.00039042748,0.00047037107,0.00006797563,0.00002341225,0.00020587165,0.00013662543,0.00006149958],"category_scores_gemma":[0.00005938752,0.00036360434,0.00008004202,0.0015511385,0.000015532243,0.00016640907,0.00002298115,0.00041255268,0.000025026899],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000044656967,0.00002864115,0.00066751085,0.00019047578,0.000036644728,0.0000018038891,0.0007869649,0.06430898,0.932713,0.0000674309,0.00081167417,0.00038244677],"study_design_scores_gemma":[0.0005680237,0.000113848524,0.00014004634,0.00025267113,0.000043437325,0.000027753775,0.00007362913,0.12803712,0.8596768,0.0000070165306,0.010540687,0.00051896187],"about_ca_topic_score_codex":0.00011044212,"about_ca_topic_score_gemma":0.00061054557,"teacher_disagreement_score":0.14675252,"about_ca_system_score_codex":0.00078681833,"about_ca_system_score_gemma":0.00008212982,"threshold_uncertainty_score":0.99988157},"labels":[],"label_agreement":null},{"id":"W2026604036","doi":"10.1017/s1431927604884848","title":"Spatially-resolved EELS and EDS Analysis of HfO<sub>x</sub>N<sub>y</sub> Gate Dielectrics Deposited by MOCVD using [(C<sub>2</sub>H<sub>5</sub>)<sub>2</sub>N]<sub>4</sub>Hf with NO and O<sub>2</sub>","year":2004,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto; McMaster University; National Research Council Canada","funders":"","keywords":"Metalorganic vapour phase epitaxy; Microanalysis; Materials science; Dielectric; Analytical Chemistry (journal); Chemical vapor deposition; Crystallography; Optoelectronics; Nanotechnology; Chemistry; Epitaxy","score_opus":0.0055113367263998495,"score_gpt":0.19823160958169686,"score_spread":0.192720272855297,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2026604036","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95744914,0.014692079,0.022116916,0.00022075517,0.0006244096,0.0020617137,0.0018070721,0.0009184487,0.000109440414],"genre_scores_gemma":[0.96445066,0.028526757,0.0009545236,0.00077812304,0.0006574129,0.00027266357,0.0032289398,0.001113205,0.000017709204],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9786033,0.0011791759,0.005940218,0.005930864,0.0027500982,0.0055963146],"domain_scores_gemma":[0.98714405,0.00086631253,0.0030306485,0.003802523,0.0026755102,0.0024809479],"candidate_categories":["metaepi_narrow","sts","scholarly_communication","research_integrity"],"consensus_categories":["metaepi_narrow","research_integrity"],"category_scores_codex":[0.002422649,0.005478494,0.008077795,0.007372414,0.0025814744,0.0023085624,0.0020689517,0.003202437,0.0000350998],"category_scores_gemma":[0.0004523531,0.005599063,0.0034648625,0.015596038,0.0018203896,0.0024225614,0.0007483163,0.0040088724,0.00015068756],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00090374285,0.0009880537,0.0033091425,0.0009558045,0.021558074,0.00045761265,0.0019463506,0.018380044,0.93277013,0.000032306263,0.001150874,0.017547863],"study_design_scores_gemma":[0.0054611843,0.00076948374,0.0013015472,0.0010658073,0.03250548,0.0003164057,0.0007104195,0.02691514,0.924924,0.00011987302,0.0002471489,0.0056634857],"about_ca_topic_score_codex":0.0014385357,"about_ca_topic_score_gemma":0.010668682,"teacher_disagreement_score":0.021162393,"about_ca_system_score_codex":0.001960545,"about_ca_system_score_gemma":0.0010094588,"threshold_uncertainty_score":0.99872714},"labels":[],"label_agreement":null},{"id":"W2032057811","doi":"10.1080/14628840050516082","title":"DNA integrity and transgene expression after passage through the NOGA needle catheter used for therapeutic myocardial angiogenesis","year":2000,"lang":"en","type":"article","venue":"International Journal of Cardiovascular Interventions","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"University of Toronto; St. Michael's Hospital","funders":"Biosense Webster","keywords":"Transfection; DNA; Catheter; Transgene; Molecular biology; Medicine; Plasmid; Surgery; Biology; Gene; Genetics","score_opus":0.023731622305797496,"score_gpt":0.25841864351637167,"score_spread":0.23468702121057416,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2032057811","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7775182,0.03374595,0.18463595,0.0008894828,0.0018049937,0.00036255736,0.0002050776,0.00006134073,0.0007764526],"genre_scores_gemma":[0.9973223,0.001415038,0.00041944414,0.000084744286,0.0005296333,0.000050867664,0.000015558104,0.000034485016,0.000127893],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99852407,0.00011926703,0.0005587656,0.00015292711,0.00046416916,0.00018082562],"domain_scores_gemma":[0.9991821,0.000074855845,0.000074078234,0.00025098666,0.00036179123,0.000056176035],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00047375224,0.00019521978,0.00037888388,0.00014567471,0.00007742354,0.00014432399,0.0003892817,0.00010935084,0.0004222157],"category_scores_gemma":[0.000015753129,0.00013317444,0.0035598874,0.0001197507,0.0000666631,0.00035593985,0.000013712443,0.00029752616,0.0000073348792],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0012451193,0.0015041003,0.0024134328,0.0005624468,0.21798427,0.00044164862,0.02466261,0.16392754,0.092659466,0.0021690766,0.014305119,0.47812518],"study_design_scores_gemma":[0.006576056,0.0005884081,0.0040250146,0.001567827,0.01097275,0.0012439195,0.00249701,0.004406062,0.09249641,0.006515549,0.86774,0.0013709848],"about_ca_topic_score_codex":0.000041844898,"about_ca_topic_score_gemma":0.000022359229,"teacher_disagreement_score":0.85343486,"about_ca_system_score_codex":0.0000784389,"about_ca_system_score_gemma":0.000021679904,"threshold_uncertainty_score":0.5430696},"labels":[],"label_agreement":null},{"id":"W2034421244","doi":"10.1109/ipfa.2008.4588162","title":"Conductive Atomic Force Microscopy failure analysis for SOI devices","year":2008,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Conductive atomic force microscopy; Electrical conductor; Silicon on insulator; Materials science; Silicon; Substrate (aquarium); Optoelectronics; Current (fluid); Atomic force microscopy; Nanotechnology; Node (physics); Microscopy; Electrical engineering; Engineering; Optics; Composite material; Physics","score_opus":0.01612578259339391,"score_gpt":0.23175004577180217,"score_spread":0.21562426317840827,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2034421244","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9347735,0.000384336,0.06048825,0.0000738388,0.00012283906,0.00020679814,0.000062681764,0.00033988143,0.0035478726],"genre_scores_gemma":[0.9931057,0.000042177588,0.0039480226,0.00016028798,0.00007021702,0.0000438284,0.00012551445,0.00003931415,0.0024649377],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99889356,0.000013606014,0.00030309925,0.000297112,0.00012205573,0.00037054438],"domain_scores_gemma":[0.9993268,0.000066145854,0.000044498105,0.00028932263,0.00017960291,0.0000935808],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007675691,0.00025162217,0.00046801605,0.0003744331,0.00016473986,0.000043860506,0.00021217235,0.00015176724,0.000515729],"category_scores_gemma":[0.000012723396,0.00021153409,0.00045643933,0.00092633895,0.00005857179,0.00024944724,0.00000959455,0.00014820202,0.0000610865],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003156212,0.00008243773,0.026061062,0.00013680103,0.019358553,0.000023052557,0.0038699037,0.043680638,0.8432801,0.0071423235,0.055720948,0.00061262515],"study_design_scores_gemma":[0.0016715056,0.00013655062,0.002900736,0.000028950399,0.005733778,0.000059369708,0.0036675008,0.20873754,0.70195544,0.0013030897,0.07171546,0.0020901025],"about_ca_topic_score_codex":0.00015302424,"about_ca_topic_score_gemma":0.00086547894,"teacher_disagreement_score":0.1650569,"about_ca_system_score_codex":0.00008431017,"about_ca_system_score_gemma":0.000033399905,"threshold_uncertainty_score":0.862611},"labels":[],"label_agreement":null},{"id":"W2035798543","doi":"10.1002/ccd.10189","title":"One core laboratory at two international sites, is that feasible? An inter‐core laboratory and intra‐observer variability study","year":2002,"lang":"en","type":"article","venue":"Catheterization and Cardiovascular Interventions","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":27,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"Montreal Heart Institute","funders":"","keywords":"Medicine; Intraclass correlation; Core (optical fiber); Statistics; Random error; Reliability (semiconductor); Medical physics; Mathematics; Computer science","score_opus":0.07099850884836509,"score_gpt":0.2613104081464115,"score_spread":0.1903118992980464,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2035798543","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99094397,0.0021336398,0.005107479,0.00004060189,0.00039306047,0.00035051012,0.00034041848,0.00021596356,0.00047437567],"genre_scores_gemma":[0.99862564,0.0005014308,0.000104560684,0.00010116513,0.000111496694,0.00006490167,0.00024541342,0.00005067515,0.00019474275],"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99836403,0.00017649759,0.000420304,0.0005180432,0.0003003599,0.00022078097],"domain_scores_gemma":[0.9987842,0.00002059782,0.00006587277,0.0006594684,0.0003017136,0.00016814498],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005264892,0.00028000496,0.00042911884,0.00022225738,0.00018394593,0.00019774713,0.00021906034,0.00012636092,0.0013756243],"category_scores_gemma":[0.000045694265,0.0002945067,0.00048101152,0.00037844313,0.00009894862,0.0005055995,0.000091677604,0.00023044727,0.00002534624],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000088886445,0.0060004024,0.645925,0.0018332314,0.048186377,0.00016644615,0.0418332,0.004501011,0.15181711,0.0044069476,0.009346089,0.08589529],"study_design_scores_gemma":[0.028022317,0.0033397286,0.33391532,0.0027883828,0.024699027,0.00033015863,0.031319425,0.3756291,0.03580038,0.0024581074,0.14973989,0.011958188],"about_ca_topic_score_codex":0.000033383996,"about_ca_topic_score_gemma":0.00011025387,"teacher_disagreement_score":0.37112808,"about_ca_system_score_codex":0.00012941207,"about_ca_system_score_gemma":0.0000085840375,"threshold_uncertainty_score":0.9999507},"labels":[],"label_agreement":null},{"id":"W2038079268","doi":"10.1140/epjst/e2008-00447-y","title":"Characterization of nano-depth junctions in silicon by using Photo-Carrier Radiometry (PCR)","year":2008,"lang":"en","type":"article","venue":"The European Physical Journal Special Topics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Public Health","funders":"","keywords":"Wafer; Materials science; Silicon; Optoelectronics; Characterization (materials science); Radiometry; Semiconductor; Ion implantation; p–n junction; Laser; Optics; Ion; Nanotechnology; Chemistry","score_opus":0.01816204518382748,"score_gpt":0.2164660798407281,"score_spread":0.19830403465690064,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2038079268","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9611692,0.000040901916,0.00023181684,0.000026110944,0.0005114564,0.000048782294,0.00001274771,0.00002096091,0.037938014],"genre_scores_gemma":[0.98519206,0.00014669992,0.000009839555,0.00003134884,0.014224556,3.345525e-7,0.000010099697,0.00003108066,0.00035396856],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999119,0.00014153287,0.00029338792,0.0000887207,0.0001830384,0.00017435101],"domain_scores_gemma":[0.999649,0.000014181157,0.00008230585,0.00013792227,0.000057686757,0.000058938556],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013622415,0.00012603568,0.00021716749,0.00011423495,0.00012682198,0.000029996221,0.00019145511,0.0000294719,0.00006677786],"category_scores_gemma":[0.000016394202,0.000092245005,0.00013076559,0.00049029593,0.00006541396,0.00015234941,0.000014776168,0.00039167114,0.000010810263],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000055129126,0.00005977626,0.00024087653,0.0000047806952,0.000071176866,0.000022283719,0.0012976822,0.0010556746,0.96122557,0.00006243247,0.0012798469,0.034674387],"study_design_scores_gemma":[0.0025306894,0.00028675227,0.031062834,0.00025741104,0.00049285,0.00065573066,0.0010379112,0.021801068,0.60178727,0.0009303845,0.33757386,0.0015832615],"about_ca_topic_score_codex":0.000011481892,"about_ca_topic_score_gemma":0.0000045407032,"teacher_disagreement_score":0.3594383,"about_ca_system_score_codex":0.00008371237,"about_ca_system_score_gemma":0.000016601141,"threshold_uncertainty_score":0.3761642},"labels":[],"label_agreement":null},{"id":"W2039474514","doi":"10.1109/eptc.2011.6184498","title":"Lock-in thermography application in flip-chip packaging for short defect localization","year":2011,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Flip chip; Thermography; Chip; Materials science; Optoelectronics; Infrared; Infrared microscopy; Fault detection and isolation; Integrated circuit packaging; Integrated circuit; Electrical engineering; Engineering; Optics; Nanotechnology; Physics","score_opus":0.017652635226994663,"score_gpt":0.20673982391038548,"score_spread":0.1890871886833908,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2039474514","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.49387148,0.0001834544,0.4851849,0.000008349648,0.00006205071,0.00038653682,0.0000035971266,0.00018935151,0.02011027],"genre_scores_gemma":[0.9994031,0.000019655512,0.00033429379,0.000040867206,0.000021000556,0.000101046484,0.000036841167,0.000024434587,0.00001873188],"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993741,0.00001193719,0.00021271559,0.00015891201,0.00005604172,0.00018629398],"domain_scores_gemma":[0.99976295,0.000017778568,0.000011377775,0.00015093369,0.000031334097,0.000025643678],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014640889,0.00011065508,0.00013832674,0.0003184072,0.00001775586,0.000012573756,0.000085421554,0.00008047583,0.000051282175],"category_scores_gemma":[0.000005950224,0.00009902129,0.00009168551,0.0005402299,0.000009997879,0.00009782929,0.0000032946587,0.00008365972,0.000006574254],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004357347,0.00026627994,0.6012462,0.00023275003,0.0004505544,0.000007753265,0.011834439,0.061506577,0.1270945,0.030371148,0.00095917174,0.16598706],"study_design_scores_gemma":[0.0005494491,0.00004600392,0.019520085,0.00006327449,0.00009643203,0.0000022288846,0.00112206,0.90846074,0.06311623,0.0034652133,0.002894525,0.00066377],"about_ca_topic_score_codex":0.00037764153,"about_ca_topic_score_gemma":0.0023357214,"teacher_disagreement_score":0.84695417,"about_ca_system_score_codex":0.00004137411,"about_ca_system_score_gemma":0.000005297819,"threshold_uncertainty_score":0.4037971},"labels":[],"label_agreement":null},{"id":"W2040154115","doi":"10.4236/jbm.2013.12001","title":"A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera","year":2013,"lang":"en","type":"article","venue":"Journal of Biosciences and Medicines","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Outaouais","funders":"Natural Sciences and Engineering Research Council of Canada; Mitacs; CMC Microsystems","keywords":"Wafer; Context (archaeology); Scale (ratio); Infrared; SIGNAL (programming language); Stress (linguistics); Signal processing; Computer science; Electronic engineering; Materials science; Engineering; Optics; Optoelectronics; Digital signal processing","score_opus":0.011166233568668572,"score_gpt":0.2428000942560667,"score_spread":0.2316338606873981,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2040154115","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96251166,0.0015260915,0.035164565,0.00029398888,0.00023046926,0.0001705642,0.000006270184,0.000023136903,0.000073273855],"genre_scores_gemma":[0.9980399,0.00016180669,0.001376044,0.000031788084,0.0003307173,0.000012919637,0.0000017190459,0.000009424755,0.00003566584],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991704,0.000013936596,0.00032040212,0.00010338235,0.00021454597,0.00017728614],"domain_scores_gemma":[0.9994497,0.00002784501,0.0001190945,0.000051793897,0.00020680651,0.00014478818],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002711166,0.00011277834,0.00023518744,0.00013814129,0.000087565124,0.000087756634,0.00015861535,0.000073702846,0.000025685073],"category_scores_gemma":[0.000016194404,0.00006913267,0.000047553756,0.0001947228,0.00007920757,0.0005083001,0.0000058474307,0.00014728271,1.7055335e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000003341871,0.000018739862,0.0014024887,0.000043679753,0.000015957692,0.000001308206,0.00055265997,0.00002744088,0.96743023,0.0000035552675,0.0006112429,0.029889356],"study_design_scores_gemma":[0.00079336687,0.0015280871,0.0020576806,0.0009031367,0.00018098229,0.00012275405,0.014062199,0.046061683,0.9310385,0.0011534572,0.0016292525,0.00046891157],"about_ca_topic_score_codex":0.000073719886,"about_ca_topic_score_gemma":0.0000076142974,"teacher_disagreement_score":0.046034243,"about_ca_system_score_codex":0.000020166855,"about_ca_system_score_gemma":0.000040902934,"threshold_uncertainty_score":0.28191486},"labels":[],"label_agreement":null},{"id":"W2040308040","doi":"10.1309/v8bt-064v-cdxt-7h1c","title":"Minimally Invasive Testing Expands Beyond Glucose","year":2000,"lang":"en","type":"article","venue":"Laboratory Medicine","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"WiLAN (Canada)","funders":"","keywords":"Chemistry","score_opus":0.011299881481510093,"score_gpt":0.21056183747253504,"score_spread":0.19926195599102495,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2040308040","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93498844,0.0027052923,0.0000109507655,0.00015348896,0.00023477382,0.00007594195,0.00002122292,0.000348016,0.061461892],"genre_scores_gemma":[0.9972428,0.0002757226,0.00022029792,0.0008529875,0.00061211514,0.000014753118,0.00003435917,0.000048718884,0.0006982531],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988763,0.000030295865,0.00033556012,0.00021822947,0.00022900598,0.0003106553],"domain_scores_gemma":[0.99917245,0.00013343166,0.000031294952,0.00029515603,0.00020810225,0.00015955119],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00017892115,0.00022975984,0.00033486646,0.00013694186,0.000072654635,0.000018858367,0.00018418029,0.00011281217,0.004205592],"category_scores_gemma":[0.00016813987,0.00018464003,0.000035737386,0.001002295,0.00009153443,0.00016058372,0.000005437608,0.0002660038,0.00021324286],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010010373,0.000022151095,0.001428753,0.00007349021,0.0002089017,0.00016132186,0.0016906668,0.0011532294,0.93691045,0.00017992333,0.033170067,0.024991048],"study_design_scores_gemma":[0.0050657107,0.0011146268,0.0052362755,0.0012100408,0.0010830238,0.00007469418,0.0049707294,0.012695906,0.50167596,0.001164076,0.46310395,0.0026049954],"about_ca_topic_score_codex":0.000045825724,"about_ca_topic_score_gemma":0.000064738924,"teacher_disagreement_score":0.43523446,"about_ca_system_score_codex":0.0000599298,"about_ca_system_score_gemma":0.00006591857,"threshold_uncertainty_score":0.9967047},"labels":[],"label_agreement":null},{"id":"W2041650838","doi":"10.1063/1.1445824","title":"Jitter-free subpicosecond streak cameras (invited)","year":2002,"lang":"en","type":"article","venue":"Review of Scientific Instruments","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Axis Photonique (Canada); Institut National de la Recherche Scientifique","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Streak camera; Jitter; Optics; Laser; Streak; Supercontinuum; Temporal resolution; Picosecond; Materials science; Sapphire; Dynamic range; Physics; Optoelectronics; Computer science; Optical fiber; Telecommunications","score_opus":0.016385361823913144,"score_gpt":0.21035340105885666,"score_spread":0.19396803923494352,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2041650838","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95440435,0.021059316,0.000012493977,0.0002622959,0.0014005182,0.00031744517,0.00014511922,0.00012108441,0.022277387],"genre_scores_gemma":[0.98261696,0.014906307,0.00016549502,0.00041888116,0.000048259048,0.000015343201,0.00008493966,0.000030168998,0.0017136662],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9983619,0.000032775795,0.0005662766,0.00029970607,0.00040938784,0.00032996084],"domain_scores_gemma":[0.9988213,0.000012030431,0.000107300184,0.0008171389,0.00013804223,0.0001041584],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00030523873,0.00021073375,0.00043111932,0.00022521729,0.00009540438,0.00008350211,0.0005454479,0.00006513413,0.0044628424],"category_scores_gemma":[0.00004721414,0.0001795843,0.00020891718,0.0008636723,0.00012292102,0.00026799252,0.000040452065,0.00016857746,0.00030057735],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[9.013384e-7,0.00016221082,0.0012745404,0.0074911746,0.00047894954,0.000010717414,0.00037120644,0.000017445509,0.046090983,0.0005510998,0.45165613,0.49189463],"study_design_scores_gemma":[0.0012004749,0.00009654963,0.0003721197,0.013149844,0.0006568837,0.000048561902,0.0002283736,0.017646622,0.10526369,0.00040873853,0.85963583,0.0012923185],"about_ca_topic_score_codex":0.000015652813,"about_ca_topic_score_gemma":0.0000113759415,"teacher_disagreement_score":0.4906023,"about_ca_system_score_codex":0.000072556584,"about_ca_system_score_gemma":0.000008414778,"threshold_uncertainty_score":0.9964472},"labels":[],"label_agreement":null},{"id":"W2044459268","doi":"10.1021/jp064649n","title":"Carrier Relaxation and Lattice Heating Dynamics in Silicon Revealed by Femtosecond Electron Diffraction","year":2006,"lang":"en","type":"article","venue":"The Journal of Physical Chemistry B","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":98,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Femtosecond; Diffraction; Silicon; Materials science; Electron diffraction; Relaxation (psychology); Electron; Phonon; Bragg peak; Lattice constant; Atomic physics; Molecular physics; Condensed matter physics; Optics; Chemistry; Optoelectronics; Physics; Laser","score_opus":0.00284298583411951,"score_gpt":0.193818961532182,"score_spread":0.1909759756980625,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2044459268","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9981154,0.00023444144,0.00008650422,0.000071372284,0.000011508854,0.000021527134,0.0000044568374,0.000009638964,0.0014451186],"genre_scores_gemma":[0.9995751,0.000022298958,0.0000048902225,0.000008266227,0.00018926029,6.155358e-7,0.000011032529,0.0000115555595,0.00017701302],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99946856,0.000022819591,0.0002244017,0.00005331823,0.00010960531,0.00012126747],"domain_scores_gemma":[0.99965537,0.000088557805,0.000111510795,0.000070358146,0.000047076413,0.000027108525],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014072334,0.000092935785,0.00016374473,0.000018971774,0.00003300072,0.000020651494,0.00006731807,0.00005294116,0.000009801211],"category_scores_gemma":[0.000023065822,0.000067608664,0.00004712744,0.00012460774,0.000020159765,0.00012739796,0.0000039586844,0.00042779435,4.7329695e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00000885651,0.000020967867,0.00034634882,0.000026375557,0.000027494372,0.0000011471635,0.00011994857,0.004301989,0.99455893,0.000039249957,0.000245128,0.0003035648],"study_design_scores_gemma":[0.00054105395,0.000044851393,0.0016026467,0.00009496624,0.00017779683,0.00006190887,0.0007391702,0.27643183,0.718428,0.001428626,0.00022334828,0.00022580578],"about_ca_topic_score_codex":0.00008797461,"about_ca_topic_score_gemma":0.00004436655,"teacher_disagreement_score":0.27613094,"about_ca_system_score_codex":0.00020387625,"about_ca_system_score_gemma":0.000009494855,"threshold_uncertainty_score":0.27570012},"labels":[],"label_agreement":null},{"id":"W2044645291","doi":"10.1109/vlsid.2013.145","title":"Tutorial T10: Post - Silicon Validation, Debug and Diagnosis","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Debugging; Computer science; Observability; Embedded system; Overhead (engineering); Software engineering; Software bug; Reliability engineering; Systems engineering; Software; Computer architecture; Engineering; Programming language","score_opus":0.004924946839020679,"score_gpt":0.17387329710856755,"score_spread":0.16894835026954688,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2044645291","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9892359,0.0001545155,0.00014881615,0.00022736151,0.00037092148,0.000103199956,0.000004922775,0.00022985073,0.009524509],"genre_scores_gemma":[0.998884,0.00009586165,0.000074411466,0.00012196136,0.00022198349,0.00004663378,0.00002563313,0.000017474182,0.0005120329],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994744,0.000010668287,0.0001534359,0.00012431692,0.00008148896,0.00015570359],"domain_scores_gemma":[0.9996303,0.00004689593,0.000011574505,0.00012915087,0.00011097397,0.00007112776],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000040111277,0.00011421718,0.0001285496,0.0000770455,0.0000425531,0.00012371142,0.00006545554,0.000078589146,0.0035297372],"category_scores_gemma":[0.00003165049,0.000091286776,0.000041635143,0.000125371,0.00001628427,0.00027550283,0.000008050497,0.00008401728,0.00027386626],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000004054956,0.00008765928,0.034148462,0.000094144605,0.0008210204,0.000007375034,0.0017754487,0.0016725005,0.5656402,0.013453848,0.32286617,0.059429098],"study_design_scores_gemma":[0.0015984983,0.00021396881,0.022112729,0.00007092855,0.0005006257,0.000030431602,0.0021819724,0.04114049,0.7695629,0.003666591,0.15680577,0.002115092],"about_ca_topic_score_codex":0.0012557615,"about_ca_topic_score_gemma":0.00007940825,"teacher_disagreement_score":0.20392269,"about_ca_system_score_codex":0.00002341564,"about_ca_system_score_gemma":0.0000063234415,"threshold_uncertainty_score":0.99738115},"labels":[],"label_agreement":null},{"id":"W2045839684","doi":"10.1109/ipfa.2011.5992753","title":"Fault localization using infra-red lock-in thermography for SOI-based advanced microprocessors","year":2011,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Thermography; Fault (geology); Microscopy; Squid; Infrared; Materials science; Usability; Infrared microscopy; Computer science; Optoelectronics; Optics; Physics; Geology","score_opus":0.023747115932590917,"score_gpt":0.21732432860328255,"score_spread":0.19357721267069164,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2045839684","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5088119,0.00022434129,0.48629767,0.000008908201,0.00013085922,0.00028029495,0.000011026628,0.00025225303,0.003982769],"genre_scores_gemma":[0.99543613,0.000010268714,0.004279604,0.00010574979,0.000018212644,0.000024863786,0.000032403208,0.000042051375,0.000050702656],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9992094,0.000010306173,0.00026409587,0.00018054477,0.00007759364,0.00025803174],"domain_scores_gemma":[0.9996267,0.000015755957,0.000035363322,0.0001566593,0.00012293957,0.000042576492],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000072716066,0.0001710456,0.00019856307,0.00031532993,0.000043173248,0.000019644727,0.000119498436,0.00011740636,0.00020432025],"category_scores_gemma":[0.000012187524,0.00014911349,0.00011485167,0.0006127865,0.000021643886,0.00014465144,0.0000032538212,0.00008742691,0.0000035881937],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005355274,0.00009977028,0.005962364,0.00019831093,0.00020514018,0.00000450269,0.0012639234,0.5435529,0.43957517,0.00067305047,0.0005501222,0.007861253],"study_design_scores_gemma":[0.0006257715,0.000024936933,0.0001233465,0.00004609979,0.000057958237,6.527779e-7,0.0004196563,0.7256087,0.27099884,0.00044992674,0.0013381453,0.00030599427],"about_ca_topic_score_codex":0.00015436318,"about_ca_topic_score_gemma":0.0003141981,"teacher_disagreement_score":0.48662424,"about_ca_system_score_codex":0.00004659077,"about_ca_system_score_gemma":0.000021068186,"threshold_uncertainty_score":0.60806715},"labels":[],"label_agreement":null},{"id":"W2046692117","doi":"10.1109/ipfa.2013.6599166","title":"Recent advances in fault isolation for semiconductor industry","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Root cause; Isolation (microbiology); Fault (geology); Semiconductor industry; Wafer; Computer science; Product (mathematics); Process (computing); Reliability engineering; sort; Wafer testing; Wafer fabrication; Engineering; Manufacturing engineering; Electrical engineering","score_opus":0.012222813455929479,"score_gpt":0.23264990596013035,"score_spread":0.22042709250420087,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2046692117","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95951885,0.0061665447,0.0042024856,0.00034132804,0.00060156645,0.00059848605,0.000013140936,0.00031572883,0.02824188],"genre_scores_gemma":[0.9969146,0.0010534446,0.0004217982,0.00011092032,0.00006967067,0.00011534993,0.000038619884,0.000022716482,0.0012528477],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9993957,0.000007312105,0.0002117357,0.00012883388,0.00005193376,0.00020443597],"domain_scores_gemma":[0.999713,0.000028942663,0.00001803436,0.00011251911,0.000092750066,0.000034730045],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00005116744,0.00011240111,0.00013847205,0.00011948429,0.000019390007,0.000036163463,0.00007937284,0.0001958392,0.0019753976],"category_scores_gemma":[0.000024926587,0.00009365699,0.00003973365,0.0002387784,0.000008515403,0.000525865,0.000003642612,0.00022763082,0.00007282058],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000004677981,0.000057443256,0.0044563883,0.0000961743,0.00011950453,8.542006e-7,0.00064125785,0.03657137,0.5091275,0.0020404565,0.054200187,0.39268422],"study_design_scores_gemma":[0.0009078252,0.00005537999,0.00064380595,0.00006749409,0.000044042452,0.000003768449,0.0026070033,0.21975984,0.11352677,0.0024248578,0.6592241,0.00073513336],"about_ca_topic_score_codex":0.00004238475,"about_ca_topic_score_gemma":0.0001291746,"teacher_disagreement_score":0.60502386,"about_ca_system_score_codex":0.00007292402,"about_ca_system_score_gemma":0.0000105319605,"threshold_uncertainty_score":0.99893695},"labels":[],"label_agreement":null},{"id":"W2049200620","doi":"10.1109/mdt.2009.92","title":"An Overview of Mixed-Signal Production Test from a Measurement Principle Perspective","year":2009,"lang":"en","type":"article","venue":"IEEE Design and Test","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Perspective (graphical); Test (biology); Production (economics); SIGNAL (programming language); Computer science; Artificial intelligence; Economics; Geology; Programming language","score_opus":0.06178323379218632,"score_gpt":0.26780698135869924,"score_spread":0.20602374756651293,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2049200620","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9625773,0.010533332,0.023827128,0.00022085485,0.00042412092,0.0006765929,0.00006779783,0.00043041378,0.001242486],"genre_scores_gemma":[0.99898416,0.0002267279,0.0005809644,0.000023724973,0.00014141417,0.0000068283907,0.0000058217843,0.000014215041,0.000016122453],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991778,0.000034784905,0.00019669445,0.00023046615,0.00020943192,0.00015082238],"domain_scores_gemma":[0.9993777,0.000063110725,0.000041584848,0.00019984994,0.0002478908,0.00006985735],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022565661,0.00015467689,0.00021905078,0.00008591598,0.00004585063,0.00003248765,0.00008729797,0.00006579096,0.000044169563],"category_scores_gemma":[0.00009081685,0.0001353005,0.000049456885,0.00020450597,0.000024904542,0.00015474965,0.0000016889558,0.000121220204,0.0000063318635],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000048124793,0.00017063867,0.00051169586,0.000013364786,0.000073442934,0.0000037978837,0.0005332871,0.001887483,0.9919141,0.0005580905,0.00058181555,0.0037474951],"study_design_scores_gemma":[0.00040096202,0.0006694238,0.011490398,0.00017837828,0.0002864833,0.000012919484,0.0005202848,0.022820907,0.9590144,0.0035153395,0.000628171,0.00046231184],"about_ca_topic_score_codex":0.00013374999,"about_ca_topic_score_gemma":0.000050087452,"teacher_disagreement_score":0.03640691,"about_ca_system_score_codex":0.00010077487,"about_ca_system_score_gemma":0.000030431886,"threshold_uncertainty_score":0.55173945},"labels":[],"label_agreement":null},{"id":"W2049292642","doi":"10.1109/ofs.1992.763331","title":"A fault locator for integrated optics","year":2005,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"LEAPS; Fault (geology); Optical fiber; Power (physics); Computer science; Adaptive optics; Integrated optics; Optics; Resolution (logic); Physics; Telecommunications; Geology; Artificial intelligence","score_opus":0.010123869531030576,"score_gpt":0.2141230077032579,"score_spread":0.2039991381722273,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2049292642","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.25770038,0.00088298507,0.62059206,0.0009173209,0.00069253653,0.0006275452,0.00009782034,0.0022661,0.116223246],"genre_scores_gemma":[0.98648584,0.000027508768,0.008811388,0.00023271862,0.00019576418,0.000028546378,0.000047795133,0.00003392369,0.004136539],"study_design_codex":"not_applicable","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994284,0.000003588978,0.00017931695,0.00011155018,0.00006456597,0.00021259682],"domain_scores_gemma":[0.9996451,0.000023794759,0.000010621539,0.00014863905,0.000110537854,0.000061278304],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000055085722,0.00012799552,0.0001487707,0.00008857246,0.000031000047,0.000040092928,0.00011242369,0.00008800062,0.00040453763],"category_scores_gemma":[0.000018022172,0.00009945771,0.000093642884,0.0001941142,0.000012787176,0.000102189464,0.0000034246807,0.00010418796,0.0001304361],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019058045,0.00012629027,0.0000915025,0.0001125676,0.0011774838,0.0000048016204,0.0010388759,0.16228953,0.2504743,0.07822632,0.33195597,0.17448327],"study_design_scores_gemma":[0.00022273509,0.000020582904,0.000002355659,0.00000790255,0.00005545257,0.000003046037,0.00034493397,0.60067403,0.07232723,0.000116369025,0.32601383,0.00021150323],"about_ca_topic_score_codex":0.000018138162,"about_ca_topic_score_gemma":0.00013057471,"teacher_disagreement_score":0.72878546,"about_ca_system_score_codex":0.00006315327,"about_ca_system_score_gemma":0.00001589455,"threshold_uncertainty_score":0.44294032},"labels":[],"label_agreement":null},{"id":"W2051918271","doi":"10.1007/s10765-014-1599-z","title":"Camera-Based Lock-in and Heterodyne Carrierographic Photoluminescence Imaging of Crystalline Silicon Wafers","year":2014,"lang":"en","type":"article","venue":"International Journal of Thermophysics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Heterodyne (poetry); Optics; Materials science; Wafer; Optoelectronics; Photoluminescence; Semiconductor; Heterodyne detection; Detector; Silicon; Laser; Physics; Acoustics","score_opus":0.0034966150702371215,"score_gpt":0.19545657601263047,"score_spread":0.19195996094239334,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2051918271","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9951525,0.00018055442,0.0039890446,0.00009746037,0.00024895548,0.000027131606,0.000009751182,0.000010108041,0.0002845135],"genre_scores_gemma":[0.99962586,0.00005449835,0.000119710494,0.00006913737,0.00010386852,8.2089116e-7,0.0000050134386,0.000016996251,0.0000040750365],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9991256,0.000028689565,0.00039232214,0.000081966245,0.00026164338,0.00010979243],"domain_scores_gemma":[0.99932563,0.000059426366,0.00016679202,0.00009420295,0.0003078921,0.000046082645],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015794941,0.00011882254,0.00024177475,0.0002591766,0.000010176686,0.000028168999,0.00025079414,0.00003165103,0.000019599991],"category_scores_gemma":[0.000028006658,0.00010484398,0.00012966331,0.00015087436,0.0000607177,0.00014795296,0.000009299005,0.00018389898,4.2017444e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039882,0.000058264275,0.013084369,0.000030752457,0.00027318273,0.00002660235,0.00032307862,0.031888153,0.93973655,0.00025144592,0.000041262374,0.014246483],"study_design_scores_gemma":[0.0030261287,0.00018576566,0.009455067,0.0006748312,0.00017817362,0.00009613341,0.0006228174,0.74074006,0.24150066,0.0016982295,0.0011712399,0.0006508713],"about_ca_topic_score_codex":0.000075532174,"about_ca_topic_score_gemma":0.000019929343,"teacher_disagreement_score":0.70885193,"about_ca_system_score_codex":0.000046586352,"about_ca_system_score_gemma":0.000019102781,"threshold_uncertainty_score":0.42754135},"labels":[],"label_agreement":null},{"id":"W2052784626","doi":"10.1016/j.jpowsour.2013.09.022","title":"Building a “smart nail” for penetration tests on Li-ion cells","year":2013,"lang":"en","type":"article","venue":"Journal of Power Sources","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":75,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Dalhousie University","funders":"","keywords":"Thermocouple; Penetration (warfare); Nail (fastener); Materials science; Composite material; Forensic engineering; Nuclear engineering; Engineering; Metallurgy","score_opus":0.007828276480375835,"score_gpt":0.21204449765097505,"score_spread":0.2042162211705992,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2052784626","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9908902,0.00027088917,0.0068257744,0.00015097007,0.0006593701,0.00009597176,0.0000023463633,0.000029442675,0.0010750374],"genre_scores_gemma":[0.9983645,0.000023641329,0.0010191008,0.00009441787,0.00028925054,0.000004216845,0.0000010591817,0.000023831772,0.00018000048],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991956,0.000016008496,0.00034817628,0.000079250705,0.00018477521,0.00017624258],"domain_scores_gemma":[0.9993856,0.00008503017,0.00013858813,0.00009437668,0.00021926417,0.00007715491],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018416518,0.00012844292,0.00020712875,0.00022656212,0.000054531116,0.0001293855,0.00014161762,0.000084783125,0.00022414046],"category_scores_gemma":[0.00003936405,0.000097046985,0.00018107456,0.0001300265,0.000011733376,0.00028377838,0.0000036974236,0.0002020727,0.000034040175],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010512463,0.000041370142,0.00028520174,0.000027921833,0.00023427639,0.000004505507,0.0010323252,0.014334329,0.9495463,0.0003974063,0.029565834,0.004520028],"study_design_scores_gemma":[0.0013178986,0.0014131085,0.0034528894,0.00042514628,0.00033210052,0.000082927494,0.0019240645,0.024352426,0.80263674,0.002264357,0.16100186,0.0007964987],"about_ca_topic_score_codex":0.00001595766,"about_ca_topic_score_gemma":0.0000072512785,"teacher_disagreement_score":0.14690958,"about_ca_system_score_codex":0.000056007968,"about_ca_system_score_gemma":0.000014832427,"threshold_uncertainty_score":0.3957461},"labels":[],"label_agreement":null},{"id":"W2054903919","doi":"10.1109/iedm.2008.4796687","title":"Session 14: Characterization, reliability, and yield - ESD/memory reliability","year":2008,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Reliability (semiconductor); Electrostatic discharge; Reliability engineering; Non-volatile memory; Session (web analytics); Flash memory; Computer science; Leakage (economics); CMOS; Electrical engineering; Voltage; Engineering; Embedded system; Physics","score_opus":0.012504978808285593,"score_gpt":0.19740348768703236,"score_spread":0.18489850887874676,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2054903919","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98532677,0.00005368407,0.0028494967,0.00018693414,0.00022271392,0.00010741431,0.00000929075,0.0003743678,0.01086934],"genre_scores_gemma":[0.9966843,0.00026514192,0.00018371912,0.00014356419,0.00007655107,0.000008647978,0.000047525242,0.000023194169,0.0025673679],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990821,0.000023852417,0.00028795638,0.00026351537,0.0001448143,0.00019777408],"domain_scores_gemma":[0.999344,0.00005474068,0.000024788742,0.00035359766,0.00012839177,0.00009447278],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015527436,0.00016588495,0.00022221444,0.000079872036,0.0001210116,0.000026322861,0.00009575859,0.00014744254,0.00079136895],"category_scores_gemma":[0.00010261139,0.00013224113,0.00006312447,0.00023549444,0.00006965335,0.00028163288,0.000021989148,0.00020849227,0.000044610108],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019306222,0.00015363116,0.047258683,0.00024682627,0.00013099668,0.00003065356,0.002428323,0.0036981648,0.9151963,0.000604438,0.021521453,0.008711235],"study_design_scores_gemma":[0.0017367871,0.00028373217,0.22398023,0.00029702354,0.00036979656,0.00031422055,0.0012846917,0.17409572,0.49210763,0.0018091775,0.1002554,0.0034655756],"about_ca_topic_score_codex":0.00012320753,"about_ca_topic_score_gemma":0.000019315206,"teacher_disagreement_score":0.42308867,"about_ca_system_score_codex":0.000045518755,"about_ca_system_score_gemma":0.000019587853,"threshold_uncertainty_score":0.86649346},"labels":[],"label_agreement":null},{"id":"W2056382502","doi":"10.1063/1.1849512","title":"Publisher’s Note: “Effect of electron temperature fluctuations on slowly swept Langmuir probe measurements” [Rev. Sci. Instrum. 75, 4334 (2004)]","year":2004,"lang":"en","type":"article","venue":"Review of Scientific Instruments","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Langmuir probe; Plasma; Electron temperature; Plasma diagnostics; Physics; Electron; Atomic physics; Computational physics; Nuclear physics","score_opus":0.01245621720349122,"score_gpt":0.24396197729383956,"score_spread":0.23150576009034834,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2056382502","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9778982,0.008996374,0.00004272351,0.00019099591,0.0023581865,0.0013157207,0.00006993549,0.00014593318,0.008981926],"genre_scores_gemma":[0.9973822,0.0013276421,0.00031958122,0.00011302855,0.000053815093,0.00005750023,0.00029325497,0.00004317059,0.00040977861],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9970074,0.00010316904,0.0008577612,0.00048324905,0.0010551874,0.0004931775],"domain_scores_gemma":[0.9983824,0.00002062705,0.0002534708,0.0007422183,0.0004711312,0.00013016391],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0013231388,0.00038135925,0.00075907906,0.00048277518,0.00017401212,0.00015653226,0.00056397234,0.0001683947,0.00016525917],"category_scores_gemma":[0.0002535565,0.00029401653,0.00034739217,0.0019712865,0.00015659361,0.0005284978,0.000029901734,0.0004136338,0.00010261414],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028907853,0.0003945772,0.0008532046,0.014120021,0.00092382624,0.0000044257035,0.0004465942,0.0009568412,0.854673,0.0020640555,0.039170116,0.08636438],"study_design_scores_gemma":[0.0017966935,0.00055362965,0.0004438068,0.017313639,0.00068469555,0.000015319261,0.000035659305,0.00015812067,0.95499307,0.00049709337,0.022732565,0.0007757224],"about_ca_topic_score_codex":0.000040472518,"about_ca_topic_score_gemma":0.000028568074,"teacher_disagreement_score":0.100320004,"about_ca_system_score_codex":0.00041712736,"about_ca_system_score_gemma":0.0001987011,"threshold_uncertainty_score":0.9999512},"labels":[],"label_agreement":null},{"id":"W2057948294","doi":"10.1016/s0038-1101(02)00008-4","title":"Dynamic finite element approach for analyzing stress and distortion in multilevel devices","year":2002,"lang":"en","type":"article","venue":"Solid-State Electronics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec à Trois-Rivières; Université du Québec en Outaouais","funders":"","keywords":"Finite element method; Residual stress; Distortion (music); Thermal; Stress (linguistics); Transient (computer programming); Deformation (meteorology); Materials science; Structural engineering; Electronic engineering; Computer science; Engineering; Composite material; Physics","score_opus":0.010919470811700032,"score_gpt":0.22741427579387896,"score_spread":0.21649480498217893,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2057948294","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7428415,0.011702633,0.24408266,0.000041138865,0.00009107063,0.0004886743,0.00012863029,0.00018232923,0.00044140848],"genre_scores_gemma":[0.997143,0.0016260444,0.00076571206,0.000019647896,0.000016003587,0.00005929488,0.00016227106,0.000037847127,0.00017019968],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99881846,0.00001882704,0.00031199577,0.00025144665,0.000098728306,0.00050052116],"domain_scores_gemma":[0.999664,0.00004020736,0.00004937554,0.00014706799,0.000045101806,0.00005423568],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001240143,0.00019846516,0.0002463796,0.00019861224,0.000068470625,0.000054526103,0.0001036955,0.00007510936,0.000019695439],"category_scores_gemma":[0.00001351526,0.00019417543,0.000068083675,0.00022911304,0.000017342125,0.00014897797,0.0000090606045,0.00023412313,0.000002318919],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017105005,0.00017589425,0.0035998214,0.00049189397,0.0005474245,0.0000057920347,0.0032106077,0.91343606,0.009104955,0.00050168653,0.00020204268,0.06870674],"study_design_scores_gemma":[0.00037334522,0.000046306974,0.0001926852,0.00002222346,0.000057737197,0.000001075623,0.00015970788,0.9957875,0.0018223854,0.00015222041,0.0011420702,0.0002427549],"about_ca_topic_score_codex":0.000025309651,"about_ca_topic_score_gemma":0.0012948045,"teacher_disagreement_score":0.25430152,"about_ca_system_score_codex":0.00028064102,"about_ca_system_score_gemma":0.000011930629,"threshold_uncertainty_score":0.79182446},"labels":[],"label_agreement":null},{"id":"W2059240780","doi":"10.1117/12.873111","title":"A low temperature fabrication process utilizing FIB implantation for CMOS compatible photovoltaic cells","year":2010,"lang":"en","type":"article","venue":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"CMOS; Fabrication; Photovoltaic system; Materials science; Wafer; Optoelectronics; Ion implantation; Focused ion beam; Die (integrated circuit); Integrated circuit; Electrical engineering; Nanotechnology; Ion; Engineering","score_opus":0.008586554157591466,"score_gpt":0.2224455500662653,"score_spread":0.21385899590867383,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2059240780","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9971337,0.00004356931,0.000094354946,0.00019930274,0.0005226088,0.0007987876,0.00014757339,0.00018223331,0.0008778905],"genre_scores_gemma":[0.9765269,0.000048047856,0.0222994,0.000057839727,0.0004882763,0.00033322631,0.000065588996,0.00008972987,0.000090965645],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99799514,1.37433895e-8,0.0007029456,0.0003782717,0.0004888357,0.0004348122],"domain_scores_gemma":[0.99685436,0.00012686821,0.0002770329,0.00007541001,0.0025482066,0.00011812826],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00039179024,0.0003772963,0.00046068028,0.00016735971,0.00012247315,0.00018254333,0.0007338029,0.00032119517,0.000021010856],"category_scores_gemma":[0.00025054917,0.00032153368,0.0005843259,0.00048999506,0.0001107683,0.00063105155,0.000031838354,0.00053857424,0.0000018245414],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000034830504,0.00006826774,0.00009868537,0.00094607857,0.00041642226,3.905001e-8,0.00042348777,0.00087050314,0.9524634,0.041156195,0.0032965923,0.00022551077],"study_design_scores_gemma":[0.00060803734,0.00010102642,0.00011232926,0.00017440964,0.00019231021,0.000008547032,0.0015160292,0.10116168,0.8938907,0.0005710101,0.001328125,0.00033582907],"about_ca_topic_score_codex":0.0000125291435,"about_ca_topic_score_gemma":0.0000016159435,"teacher_disagreement_score":0.10029118,"about_ca_system_score_codex":0.00011081935,"about_ca_system_score_gemma":0.000039047325,"threshold_uncertainty_score":0.99992365},"labels":[],"label_agreement":null},{"id":"W2062753030","doi":"10.1109/isqed.2007.63","title":"DFT and Test: Ensuring Product Quality","year":2007,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Design for manufacturability; Automatic test pattern generation; Reliability engineering; Design for testing; Computer science; Test (biology); Yield (engineering); Quality (philosophy); Product (mathematics); Engineering; Electronic circuit; Electrical engineering","score_opus":0.012451625177842375,"score_gpt":0.23418898756495735,"score_spread":0.22173736238711497,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2062753030","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94676054,0.000376647,0.0012441635,0.000041089468,0.00008849799,0.00004500023,0.0000018644727,0.00026744104,0.051174752],"genre_scores_gemma":[0.998455,0.000024816098,0.00033329628,0.00004023504,0.000090824156,8.780172e-7,0.0000025962331,0.0000125881415,0.0010397814],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994171,0.000005100859,0.0001790038,0.00012944704,0.00007897341,0.00019033703],"domain_scores_gemma":[0.99966145,0.00008753106,0.0000108859,0.00014607153,0.000037398448,0.0000566791],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00035231886,0.00009146247,0.00011974549,0.000070319235,0.000033050765,0.00002659383,0.0000478531,0.000036961264,0.0001264939],"category_scores_gemma":[0.00008017617,0.00007433116,0.000029821962,0.00014948372,0.000016699149,0.00007715996,0.0000066291623,0.000110841,0.000021812975],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000002620664,0.000034079916,0.05486418,0.0000965547,0.00016257526,0.000016765462,0.0007864409,0.00022320266,0.8870153,0.008101881,0.0028928276,0.04580361],"study_design_scores_gemma":[0.00037570033,0.00003511581,0.092857234,0.000030190231,0.00008430581,0.000038825332,0.0011577053,0.002551638,0.86551523,0.0005106882,0.036008403,0.00083497417],"about_ca_topic_score_codex":0.00012231682,"about_ca_topic_score_gemma":0.00021997078,"teacher_disagreement_score":0.05169444,"about_ca_system_score_codex":0.000021175989,"about_ca_system_score_gemma":0.0000036779265,"threshold_uncertainty_score":0.30311367},"labels":[],"label_agreement":null},{"id":"W2063854814","doi":"10.1021/jp0501648","title":"Ballistic Electron Emission Microscopy Studies of Au/Molecule/n-GaAs Diodes","year":2005,"lang":"en","type":"article","venue":"The Journal of Physical Chemistry B","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":31,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Diode; Materials science; Electron microscope; Electron; Ballistic conduction; Resolution (logic); Optoelectronics; Molecule; Microscopy; Gallium arsenide; Nanometre; Molecular physics; Optics; Chemistry; Physics","score_opus":0.010471758402867268,"score_gpt":0.2653741007390247,"score_spread":0.2549023423361574,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2063854814","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9969005,0.0015945594,0.00020265339,0.00010043406,0.000023958846,0.00001850385,0.0000029093155,0.000012804705,0.0011436664],"genre_scores_gemma":[0.99901956,0.00018660609,0.00003398109,0.000014044391,0.0005499935,4.947627e-7,0.0000014011232,0.000015423666,0.00017850153],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992191,0.000021782056,0.00031320204,0.00005850239,0.00020387657,0.0001835021],"domain_scores_gemma":[0.99935967,0.0001105241,0.00014242386,0.00014982502,0.00017758306,0.00005999402],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000148479,0.00014612089,0.00034218287,0.0000208386,0.00004439482,0.000009481272,0.00025698348,0.000044293392,0.000024143948],"category_scores_gemma":[0.00006489881,0.00008735528,0.0001833347,0.00013989182,0.0000844554,0.00007065486,0.000014204824,0.00035383494,0.0000032909397],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016237524,0.00004322657,0.000009897785,0.00007446269,0.0002992046,0.0000017466746,0.00079540705,0.005544652,0.9918878,0.000016527041,0.0010639781,0.00024685517],"study_design_scores_gemma":[0.0001395091,0.000042478572,0.000008898753,0.000095704716,0.00024898208,0.000017261316,0.00032059892,0.0027860245,0.99555284,0.00015051145,0.00054488686,0.00009227692],"about_ca_topic_score_codex":0.000004276781,"about_ca_topic_score_gemma":0.0000011653274,"teacher_disagreement_score":0.0036650621,"about_ca_system_score_codex":0.00013460412,"about_ca_system_score_gemma":0.00003964408,"threshold_uncertainty_score":0.3562245},"labels":[],"label_agreement":null},{"id":"W2065345886","doi":"10.1088/0268-1242/29/8/085002","title":"Electrical characterization of in-place bonded interfaces","year":2014,"lang":"en","type":"article","venue":"Semiconductor Science and Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University; University of Victoria; McGill University","funders":"","keywords":"Characterization (materials science); Materials science; Nanotechnology; Chemistry; Optoelectronics","score_opus":0.004450078551940596,"score_gpt":0.19474840618270492,"score_spread":0.19029832763076432,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2065345886","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99874717,0.00009300706,0.00008753979,0.00014510367,0.00010600904,0.000056078592,0.000001727233,0.00011369539,0.0006496523],"genre_scores_gemma":[0.9997926,0.00007092763,0.000060010432,0.00001917358,0.000011629444,0.000004935748,0.0000023818277,0.0000076546485,0.00003073522],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991761,0.000009494693,0.00021253205,0.00021688618,0.00013412617,0.0002508959],"domain_scores_gemma":[0.9995901,0.000016159396,0.000039353912,0.00018429829,0.00013564408,0.000034415963],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00027759327,0.00010264857,0.00020944129,0.0009145915,0.000036088273,0.000020856187,0.00026676123,0.00012784591,0.000017451363],"category_scores_gemma":[0.00013047166,0.00008986993,0.000012317661,0.0020979175,0.00037130062,0.0002413868,0.000028736089,0.00019390711,0.000004319871],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[7.5682624e-7,0.0000067401415,0.0015961133,0.0000070059555,0.0000048720326,3.6679754e-7,0.000088055356,0.0000043460427,0.9851363,0.0063578417,0.000016745533,0.00678086],"study_design_scores_gemma":[0.000116794086,0.00004970698,0.00043972832,0.000016783177,0.00000710845,0.000009644655,0.00010306472,0.013564232,0.98380363,0.0007934902,0.0009810908,0.00011470449],"about_ca_topic_score_codex":0.000012222781,"about_ca_topic_score_gemma":0.000016990673,"teacher_disagreement_score":0.013559886,"about_ca_system_score_codex":0.00005161111,"about_ca_system_score_gemma":0.00004300529,"threshold_uncertainty_score":0.36647892},"labels":[],"label_agreement":null},{"id":"W2066798195","doi":"10.1002/sia.3638","title":"Investigation of a connector electrical failure","year":2010,"lang":"en","type":"article","venue":"Surface and Interface Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Cable gland; Materials science; Coating; Soldering; Potting; Composite material; Electrical engineering; Engineering","score_opus":0.00727940962039508,"score_gpt":0.20719949359112616,"score_spread":0.19992008397073108,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2066798195","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99718183,0.00037392217,0.0014823722,0.00009754098,0.00006432801,0.000049417446,0.000014652971,0.00008397094,0.0006519618],"genre_scores_gemma":[0.999164,0.0000803052,0.0005422583,0.000025161737,0.000022766944,0.000001981747,0.000020380976,0.000016088426,0.00012709509],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99912006,0.000025581066,0.0003088602,0.00020858576,0.00014057745,0.00019634736],"domain_scores_gemma":[0.9993966,0.000058771057,0.0000568383,0.00025214648,0.00013728521,0.00009834552],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014997412,0.00017029949,0.00040850145,0.00030009274,0.000038027836,0.000042032043,0.00013359073,0.00015128945,0.0004929667],"category_scores_gemma":[0.000032677992,0.00014661116,0.00018711078,0.0014123279,0.00008887552,0.0002289114,0.000013641781,0.0003422811,0.000016326305],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000029942591,0.0000047428575,0.018152218,0.000014356854,0.0014333559,5.8429356e-7,0.00036684095,0.0038243213,0.97449505,0.000699886,0.00074204436,0.00026360215],"study_design_scores_gemma":[0.00021438053,0.00006246267,0.0025492497,0.000012574798,0.002093602,0.000003695066,0.0004429503,0.13155776,0.85929906,0.00026313803,0.0031131415,0.00038798995],"about_ca_topic_score_codex":0.00015496316,"about_ca_topic_score_gemma":0.00088553375,"teacher_disagreement_score":0.12773344,"about_ca_system_score_codex":0.0000142656645,"about_ca_system_score_gemma":0.000016522832,"threshold_uncertainty_score":0.59786296},"labels":[],"label_agreement":null},{"id":"W2069369742","doi":"10.4028/www.scientific.net/kem.326-328.517","title":"Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)","year":2006,"lang":"en","type":"article","venue":"Key engineering materials","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Kootenay Association for Science & Technology","funders":"","keywords":"Materials science; Composite material; Thermal expansion; Interferometry; Residual stress; Reliability (semiconductor); Glass transition; Stress (linguistics); Shear stress; Electronic engineering; Optics; Polymer","score_opus":0.0019396269868289383,"score_gpt":0.1730947294412429,"score_spread":0.17115510245441395,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2069369742","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9980945,0.000039211933,0.00042154468,0.000010112242,0.00062190695,0.00020772537,0.00022762595,0.00013880621,0.00023854004],"genre_scores_gemma":[0.99941844,0.0000072751573,0.0002025422,0.0000031967527,0.00013239238,0.000025612422,0.00013752363,0.00004703505,0.000026004132],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989048,0.00004656709,0.0004615514,0.00020215017,0.00016837624,0.00021655794],"domain_scores_gemma":[0.99942577,0.00009375677,0.00006203588,0.00029761824,0.00008832982,0.000032475014],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002771057,0.00027287644,0.00063179655,0.00017154883,0.00001735463,0.000021265329,0.00012022014,0.00020812372,0.00015231625],"category_scores_gemma":[0.000037696795,0.00022663146,0.00012376714,0.00023561035,0.000025499814,0.00011732,0.0000056257672,0.00013972692,0.0000081303615],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000025093392,0.000014756408,0.000004507028,0.00041736875,0.000055698405,0.000001934036,0.00009131899,0.2591661,0.73980314,0.00018828985,0.00020667253,0.000025157675],"study_design_scores_gemma":[0.00034047084,0.00019576032,0.0006019016,0.00016058976,0.000096049895,0.000002243202,0.000011321223,0.0027423897,0.99556196,0.00003039199,0.000061495506,0.00019539872],"about_ca_topic_score_codex":0.00032844942,"about_ca_topic_score_gemma":0.000002470783,"teacher_disagreement_score":0.2564237,"about_ca_system_score_codex":0.000066582594,"about_ca_system_score_gemma":0.000008492551,"threshold_uncertainty_score":0.9241763},"labels":[],"label_agreement":null},{"id":"W2069826124","doi":"10.1063/1.2189189","title":"Spectroscopic strain measurement methodology: Degree-of-polarization photoluminescence versus photocurrent spectroscopy","year":2006,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Photocurrent; Photoluminescence; Materials science; Polarization (electrochemistry); Optoelectronics; Spectroscopy; Degree of polarization; Diode; Semiconductor laser theory; Semiconductor; Laser; Optics; Chemistry; Physics","score_opus":0.051620158870339425,"score_gpt":0.24738022308869073,"score_spread":0.1957600642183513,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2069826124","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.72781336,0.00014507737,0.2652673,0.00005390421,0.00063443696,0.0004123076,0.000031045463,0.00021858064,0.005423959],"genre_scores_gemma":[0.9939425,0.00000768745,0.0054815854,0.00007564712,0.00029654527,0.00004337303,0.00010318811,0.00004347623,0.0000060010125],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985766,0.000036364687,0.00034995525,0.00028483357,0.00038261001,0.0003696322],"domain_scores_gemma":[0.9994305,0.00004762311,0.00010226983,0.00031117658,0.00006551538,0.000042940446],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00019505422,0.00027790174,0.0003648378,0.00009199973,0.00005561834,0.00003174271,0.00021320993,0.00007700851,0.000057387562],"category_scores_gemma":[0.00000638478,0.00028551734,0.00012344214,0.0004353261,0.00007827122,0.000078159275,0.000012123032,0.0002583504,0.000024144929],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013482638,0.000036354733,0.000107240514,0.000040865372,0.00013465059,0.0000010083205,0.000082178296,0.0030981982,0.9906216,0.0042933435,0.00070904015,0.0008620102],"study_design_scores_gemma":[0.0005921778,0.000022990977,0.0002780882,0.000018341096,0.0001419342,2.7782045e-7,0.000051033898,0.0009976014,0.99699545,0.0003439227,0.00027394638,0.0002842358],"about_ca_topic_score_codex":0.00015137937,"about_ca_topic_score_gemma":0.00005527817,"teacher_disagreement_score":0.2661291,"about_ca_system_score_codex":0.00021029456,"about_ca_system_score_gemma":0.000025992404,"threshold_uncertainty_score":0.9999597},"labels":[],"label_agreement":null},{"id":"W2073073621","doi":"10.4161/chan.3.5.10269","title":"Single particle imaging of a mammalian BK channel: Extending primary sequence to tertiary structure","year":2009,"lang":"en","type":"article","venue":"Channels","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"","keywords":"Protein tertiary structure; Sequence (biology); Primary (astronomy); Chemistry; Biophysics; Biology; Physics; Biochemistry","score_opus":0.015892831540927712,"score_gpt":0.22477046429812841,"score_spread":0.2088776327572007,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2073073621","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99505347,0.0005094456,0.0027768542,0.00036606254,0.00032936592,0.00013835561,0.000032442298,0.00020829898,0.0005857211],"genre_scores_gemma":[0.998864,0.0000083957075,0.0002471337,0.0005406229,0.00017806048,0.0000048524107,0.000021450755,0.00003084757,0.00010463627],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99885035,0.0000182566,0.00029902635,0.00024250438,0.00017040702,0.00041948044],"domain_scores_gemma":[0.9994542,0.000013830868,0.000035757283,0.0002780512,0.00007592476,0.00014220635],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008698603,0.00020961811,0.00027921566,0.0001585841,0.00005266039,0.000053155472,0.00022318421,0.00006668831,0.00009775904],"category_scores_gemma":[0.000019565965,0.00019607921,0.00009610542,0.00044466386,0.000024466297,0.00026107527,0.000017251657,0.00015405433,0.0000152324],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000029283142,0.000019254534,0.00013251518,0.00003124968,0.000028285393,0.00002414381,0.0013948298,0.012522996,0.974197,0.000118417935,0.0005101581,0.01101827],"study_design_scores_gemma":[0.00016483846,0.00004727998,0.0006233493,0.00011364922,0.00004516005,0.000028757935,0.00035082572,0.022095796,0.9748923,0.00093421247,0.0003711681,0.00033262614],"about_ca_topic_score_codex":0.000027224745,"about_ca_topic_score_gemma":0.000006815549,"teacher_disagreement_score":0.010685644,"about_ca_system_score_codex":0.00011122885,"about_ca_system_score_gemma":0.000012743089,"threshold_uncertainty_score":0.79958785},"labels":[],"label_agreement":null},{"id":"W2073622602","doi":"10.4028/www.scientific.net/ssp.92.247","title":"Alternative Post-Etch Polymer Removal in a Single-Wafer Platform","year":2003,"lang":"en","type":"article","venue":"Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mitel (Canada)","funders":"","keywords":"Materials science; Wafer; Polymer; Composite material; Nanotechnology; Engineering physics; Optoelectronics","score_opus":0.0393537213553159,"score_gpt":0.2694391710927541,"score_spread":0.23008544973743822,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2073622602","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9164779,0.0055501405,0.00472305,0.00012672927,0.0021378146,0.00199787,0.054235585,0.00084919255,0.013901722],"genre_scores_gemma":[0.9499829,0.010358732,0.00038482645,0.0009294103,0.00052582053,0.00014578948,0.035029538,0.00056942354,0.0020735878],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.98932713,0.0005112321,0.002712556,0.0029996608,0.0012821906,0.0031672413],"domain_scores_gemma":[0.99294984,0.00041309246,0.00057960517,0.0044391663,0.00041182863,0.0012064653],"candidate_categories":["metaepi_narrow"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0018325385,0.0019705864,0.0023560156,0.0013476758,0.00063421024,0.000967705,0.0025093486,0.00027980746,0.00067182764],"category_scores_gemma":[0.00021999131,0.001830227,0.00029330247,0.0016577501,0.00045217306,0.0032447185,0.0014398774,0.0015849482,0.0004049338],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.006119075,0.012761485,0.0064653507,0.0046677967,0.023215694,0.0077088093,0.12301303,0.107661635,0.39990562,0.0069389637,0.07528711,0.22625543],"study_design_scores_gemma":[0.023953456,0.0023887472,0.00094093685,0.001419962,0.0018995078,0.00081703643,0.01373246,0.3258972,0.037031427,0.017354302,0.55969936,0.01486564],"about_ca_topic_score_codex":0.0013558056,"about_ca_topic_score_gemma":0.0032157768,"teacher_disagreement_score":0.48441222,"about_ca_system_score_codex":0.00063065323,"about_ca_system_score_gemma":0.0003080644,"threshold_uncertainty_score":0.9993037},"labels":[],"label_agreement":null},{"id":"W2073793348","doi":"10.1096/fj.02-1202fje","title":"Matrix metalloproteinase‐2 (MMP‐2) is present in the nucleus of cardiac myocytes and is capable of cleaving poly (ADP‐ribose) polymerase (PARP) in vitro","year":2004,"lang":"en","type":"article","venue":"The FASEB Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":258,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Prince Edward Island; Heritage Medical Research Clinic; University of Alberta","funders":"Canadian Institutes of Health Research","keywords":"Poly ADP ribose polymerase; Matrix metalloproteinase; Nuclear matrix; Cell biology; Nucleus; Proteases; Polymerase; PARP inhibitor; PARP1; Cleavage (geology); Chemistry; Biology; Biochemistry; Molecular biology; Enzyme; DNA; Chromatin","score_opus":0.009305824363118538,"score_gpt":0.21585033538935464,"score_spread":0.2065445110262361,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2073793348","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9886475,0.009988922,0.000055921948,0.0005686764,0.000082381106,0.00014856545,0.000073710195,0.000009862994,0.00042443475],"genre_scores_gemma":[0.998981,0.0005745306,0.00017011419,0.00007864619,0.00011464736,0.0000052268265,0.0000026474806,0.000023412516,0.000049801332],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985899,0.00011499768,0.00052239525,0.00012783866,0.00032531653,0.0003195783],"domain_scores_gemma":[0.9993732,0.00007487938,0.0001350865,0.00029721722,0.000059040816,0.0000605709],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00068834255,0.00018867836,0.00041991624,0.0002527164,0.00007921708,0.00006391885,0.0003435955,0.000081615435,0.00008085553],"category_scores_gemma":[0.00002433938,0.00011546577,0.00020138586,0.00046934484,0.00008829499,0.00018319243,0.000025813388,0.00053373876,0.0000030044691],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000033457425,0.00004509711,0.00030301017,0.000036197456,0.00026981192,0.000023278742,0.0069278725,0.002050767,0.98790455,0.0001397393,0.00020737301,0.0020588704],"study_design_scores_gemma":[0.00046089603,0.000042370342,0.00035849502,0.00009372045,0.00015724474,0.00006048783,0.0039650295,0.0012375949,0.9927003,0.00047184064,0.00031046377,0.00014160525],"about_ca_topic_score_codex":0.003620177,"about_ca_topic_score_gemma":0.000059004156,"teacher_disagreement_score":0.010333449,"about_ca_system_score_codex":0.000086889384,"about_ca_system_score_gemma":0.000057042373,"threshold_uncertainty_score":0.54726493},"labels":[],"label_agreement":null},{"id":"W2080426093","doi":"10.1088/0960-1317/16/8/020","title":"Processing of a semiconductor wafer using the femtosecond laser directly from an oscillator","year":2006,"lang":"en","type":"article","venue":"Journal of Micromechanics and Microengineering","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Femtosecond; Wafer; Materials science; Laser; Optoelectronics; Semiconductor; Semiconductor device fabrication; Pulse (music); Focused ion beam; Electronic engineering; Optics; Engineering; Ion; Physics","score_opus":0.006926244384385589,"score_gpt":0.1961763855448144,"score_spread":0.18925014116042882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2080426093","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98413914,0.0066342372,0.0087563,0.000015921994,0.00030619802,0.000056819325,0.00003942805,0.000027012522,0.000024915593],"genre_scores_gemma":[0.9967486,0.00017682055,0.002712247,0.000020828536,0.00026301827,6.332917e-7,0.000005857447,0.000053055093,0.000018888808],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988468,0.00001890193,0.00060461543,0.00013617106,0.00014395479,0.00024954564],"domain_scores_gemma":[0.99933547,0.000030844138,0.00020353026,0.00016458028,0.00018986466,0.00007569293],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022273,0.00023044606,0.00042690054,0.00021666313,0.00006591278,0.00008882502,0.00021455539,0.00011075033,0.00003443599],"category_scores_gemma":[0.000008531691,0.00016879592,0.00013712443,0.00024196462,0.000024298446,0.00030463762,0.000020675787,0.00032804033,4.3660643e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000049698874,0.000016170752,0.000029118637,0.000045171564,0.0001158524,0.000008701554,0.00030591807,0.007484418,0.9903229,0.000041180047,0.00011734763,0.0015082407],"study_design_scores_gemma":[0.00037349947,0.00004238156,0.000046202425,0.00019768422,0.00022553212,0.00018046204,0.0005388682,0.07755079,0.9178261,0.00022864631,0.0025325986,0.0002572029],"about_ca_topic_score_codex":0.00010746655,"about_ca_topic_score_gemma":0.000031794676,"teacher_disagreement_score":0.07249678,"about_ca_system_score_codex":0.000069583926,"about_ca_system_score_gemma":0.000039236013,"threshold_uncertainty_score":0.68832976},"labels":[],"label_agreement":null},{"id":"W2084639291","doi":"10.1364/wsof.2013.f3.1","title":"When a Friend Becomes a Foe: The Optical Fiber Fuse","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Fuse (electrical); Optical fiber; Fiber; Computer science; Optical fiber cable; Optoelectronics; Materials science; Electrical engineering; Optics; Telecommunications; Physics; Engineering; Composite material","score_opus":0.008160954343534838,"score_gpt":0.18495644643996095,"score_spread":0.17679549209642612,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2084639291","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.59845996,0.0003863684,0.0019328806,0.0037352454,0.00024434435,0.00028986848,0.000004860309,0.0005480053,0.3943985],"genre_scores_gemma":[0.9862818,0.000011376398,0.0006017781,0.00026395355,0.00008531528,0.000037140162,0.000004874016,0.00002124855,0.0126925055],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9994038,0.000010024107,0.00014569864,0.00010703388,0.00010610544,0.00022733964],"domain_scores_gemma":[0.99956274,0.000055443223,0.000008078442,0.00025868055,0.000051576335,0.00006346799],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.000052682193,0.00011826541,0.00012826279,0.00004439114,0.000047318612,0.00012035397,0.00017812029,0.0000675861,0.020240873],"category_scores_gemma":[0.000015059882,0.00006396813,0.000091267655,0.000114765164,0.00003138408,0.00015403995,0.000014653655,0.000173592,0.0024005512],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000014622312,0.000043015723,0.00027051268,0.000022799399,0.000750456,0.00000863782,0.0028569885,0.0012390917,0.024075849,0.028766157,0.90764135,0.034323674],"study_design_scores_gemma":[0.0006502679,0.00007033928,0.0012884917,0.000029818126,0.00034234242,0.000045544453,0.0044725393,0.10306951,0.030672729,0.010823864,0.8474331,0.0011014855],"about_ca_topic_score_codex":0.00028420403,"about_ca_topic_score_gemma":0.00009490541,"teacher_disagreement_score":0.38782188,"about_ca_system_score_codex":0.000021932696,"about_ca_system_score_gemma":0.0000069724856,"threshold_uncertainty_score":0.9983762},"labels":[],"label_agreement":null},{"id":"W2084904434","doi":"10.1117/12.878118","title":"Photon quantum shot noise limited array in amorphous silicon technology for protein crystallography applications","year":2011,"lang":"en","type":"article","venue":"Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"CMOS; Pixel; Fixed-pattern noise; Noise (video); Optoelectronics; Antenna array; Materials science; Physics; Antenna (radio); Computer science; Optics; Electrical engineering; Electronic engineering; Engineering; Image (mathematics)","score_opus":0.014275184716774301,"score_gpt":0.20923700212058313,"score_spread":0.19496181740380883,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2084904434","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9948268,0.00016616749,0.0004213172,0.0002899628,0.00010074818,0.001468808,0.0000797682,0.00024491898,0.002401532],"genre_scores_gemma":[0.9653876,0.00007258148,0.03240342,0.000035534973,0.00013173127,0.0018075235,0.000020731584,0.00009409072,0.000046795507],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9979034,1.598749e-8,0.0008127795,0.0004225476,0.0003549176,0.00050630694],"domain_scores_gemma":[0.99829245,0.000052080286,0.00023749514,0.00009813801,0.0012198704,0.00009996254],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00038800263,0.00038649404,0.0005294785,0.00048610428,0.000090110305,0.000054490756,0.0010047302,0.00037417942,0.000016506705],"category_scores_gemma":[0.00016923592,0.0003421308,0.0006790838,0.0010441752,0.00021715256,0.0003599285,0.00007620461,0.00043549112,0.0000010585569],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000041407482,0.00011658429,0.00024114785,0.00036318903,0.00040163167,6.8174465e-8,0.0002590436,0.000093841016,0.7340367,0.2640262,0.0002606226,0.00015962165],"study_design_scores_gemma":[0.001149853,0.00034498775,0.00025014745,0.00032937064,0.00025551528,0.000010481428,0.002470137,0.034081463,0.9461905,0.009808442,0.004479055,0.0006300437],"about_ca_topic_score_codex":0.000026407668,"about_ca_topic_score_gemma":0.0000017386719,"teacher_disagreement_score":0.25421774,"about_ca_system_score_codex":0.0001575499,"about_ca_system_score_gemma":0.000024270495,"threshold_uncertainty_score":0.9999031},"labels":[],"label_agreement":null},{"id":"W2085057648","doi":"10.1116/1.582228","title":"Optical breakdown of InGaAsP/InP based multiquantum well optical attenuators","year":2000,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology A Vacuum Surfaces and Films","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Materials science; Optoelectronics; Optical microscope; Gallium arsenide; Ion implantation; Waveguide; Optics; Ion; Scanning electron microscope; Chemistry; Composite material","score_opus":0.0050815253762541085,"score_gpt":0.2087097161630062,"score_spread":0.2036281907867521,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2085057648","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9962377,0.00093657937,0.00071185536,0.0007640433,0.00021150356,0.00007976704,0.000011197207,0.00008762811,0.0009597284],"genre_scores_gemma":[0.99453884,0.00039263195,0.004892619,0.00005911921,0.000025627829,0.0000018830607,9.827954e-7,0.000021812639,0.000066452034],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99777156,0.000020918918,0.0008308794,0.0003036205,0.0005022936,0.00057072664],"domain_scores_gemma":[0.9988171,0.00009608792,0.00018701625,0.00033161818,0.00034556724,0.00022262063],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008775123,0.0002846589,0.0006661339,0.0011022994,0.0001742221,0.00007408282,0.00076062785,0.0003212112,0.0005276268],"category_scores_gemma":[0.00007051039,0.0002146639,0.00017787942,0.0020297372,0.001163334,0.00044811133,0.000043528336,0.00081494055,0.000018895249],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005702802,0.00019662383,0.0069671865,0.00005315298,0.00019549063,0.0001062786,0.00025297032,0.009070234,0.9703669,0.0021805773,0.0007567049,0.009796839],"study_design_scores_gemma":[0.0019260774,0.0013426905,0.0053469017,0.00036133543,0.0004490932,0.0008058388,0.002360844,0.2693348,0.71011096,0.0012134972,0.005771923,0.0009760153],"about_ca_topic_score_codex":0.000014045455,"about_ca_topic_score_gemma":0.0000054728307,"teacher_disagreement_score":0.26026458,"about_ca_system_score_codex":0.000056855068,"about_ca_system_score_gemma":0.00016087026,"threshold_uncertainty_score":0.875374},"labels":[],"label_agreement":null},{"id":"W2089377766","doi":"10.1109/ipfa.2007.4378091","title":"Soft Defects: Challenge and Chance for Failure Analysis","year":2007,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"SIGNAL (programming language); Computer science; Reliability engineering; Signal-flow graph; Logic gate; Electronic engineering; Engineering; Algorithm; Electrical engineering; Programming language","score_opus":0.009139399611611324,"score_gpt":0.21648177648966616,"score_spread":0.20734237687805485,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2089377766","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3560796,0.0026071507,0.6234097,0.00019369653,0.00013937996,0.0002586131,0.000022920669,0.0005289841,0.016759926],"genre_scores_gemma":[0.997966,0.00009042889,0.0013346797,0.00006997223,0.00008523795,0.000011688179,0.000021621845,0.00002050754,0.00039986387],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99925995,0.0000039411907,0.0001798781,0.00018790756,0.00008001765,0.0002882913],"domain_scores_gemma":[0.99959403,0.00007266855,0.000018572702,0.0001643951,0.00006913026,0.00008120876],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020061634,0.00014450964,0.00025030246,0.0002885911,0.00005370387,0.00003283733,0.00007769848,0.00008765027,0.00013044108],"category_scores_gemma":[0.000015316886,0.00012117048,0.00016176404,0.00053142797,0.000019683566,0.00009563783,0.000006072023,0.00009321199,0.000008063375],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010857106,0.00037708832,0.022840524,0.0014235781,0.04208613,0.000119529104,0.009907361,0.03623404,0.40925503,0.2155785,0.030599562,0.2314701],"study_design_scores_gemma":[0.0029628123,0.0004900531,0.0043799607,0.00008965626,0.011408025,0.000032412343,0.010009904,0.462306,0.16584109,0.006220246,0.332181,0.0040788534],"about_ca_topic_score_codex":0.000026233247,"about_ca_topic_score_gemma":0.002096251,"teacher_disagreement_score":0.6418864,"about_ca_system_score_codex":0.000026745893,"about_ca_system_score_gemma":0.0000037668983,"threshold_uncertainty_score":0.4941189},"labels":[],"label_agreement":null},{"id":"W2094627020","doi":"10.1109/tro.2014.2298551","title":"Robotic Probing of Nanostructures inside Scanning Electron Microscopy","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Robotics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":31,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Metrology; Scanning electron microscope; Visual servoing; Materials science; Chip; Rendering (computer graphics); Computer science; Noise (video); Artificial intelligence; Computer vision; Electronic engineering; Robot; Optics; Engineering; Physics; Image (mathematics)","score_opus":0.008243030797639309,"score_gpt":0.22185601794094342,"score_spread":0.21361298714330412,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2094627020","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.114897475,0.00008959897,0.8832348,0.00003547074,0.0006650614,0.0001112083,0.0000051628895,0.0002136061,0.00074761815],"genre_scores_gemma":[0.9955182,0.000034147597,0.0041633556,0.000050744628,0.00004106922,0.0000056647145,0.0000039397632,0.00005082631,0.00013203976],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99900126,0.00003273235,0.00032354833,0.0001815965,0.00015562824,0.00030521644],"domain_scores_gemma":[0.9994803,0.000054441567,0.000050207713,0.00027088093,0.00007944568,0.00006469153],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007612669,0.0002155084,0.00031093907,0.00025842598,0.00010279098,0.00003305095,0.00014987684,0.00013582224,0.000037648213],"category_scores_gemma":[0.0000046247155,0.00020564614,0.00014479285,0.00036739273,0.000045861296,0.000097185184,4.1471196e-7,0.00037553313,0.000013823775],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000028214035,0.000013977895,0.0000052479836,0.000032256383,0.00008731702,4.7287998e-7,0.00015126907,0.6742369,0.32425088,0.00016183096,0.000063721105,0.0009933002],"study_design_scores_gemma":[0.00017608365,0.00008688771,0.000014349967,0.00007900289,0.00016516403,0.000008358316,0.00005907127,0.18050447,0.81845844,0.00015090134,0.00007274381,0.000224551],"about_ca_topic_score_codex":0.000040867224,"about_ca_topic_score_gemma":0.00007332822,"teacher_disagreement_score":0.8806207,"about_ca_system_score_codex":0.0000819334,"about_ca_system_score_gemma":0.000025603797,"threshold_uncertainty_score":0.8386006},"labels":[],"label_agreement":null},{"id":"W2095003784","doi":"10.1007/s10854-008-9634-0","title":"Laser-induced defect creation in 300 mm SOI-wafer analyzed by use of photoelastic imaging","year":2008,"lang":"en","type":"article","venue":"Journal of Materials Science Materials in Electronics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Millisecond; Wafer; Laser; Silicon on insulator; Microsecond; Nucleation; Optoelectronics; Annealing (glass); Optics; Photoluminescence; Silicon; Dopant; Doping; Composite material; Chemistry","score_opus":0.012638142876116086,"score_gpt":0.22645624575827042,"score_spread":0.21381810288215433,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2095003784","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9989296,0.00019122826,0.00011745687,0.000013846179,0.0005346855,0.000121549594,0.00003259993,0.000019203595,0.000039791074],"genre_scores_gemma":[0.9992174,0.000445347,0.00019888757,0.000020593792,0.000065877204,0.000004891919,0.000008725568,0.000029724471,0.00000856774],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9971856,0.00016197645,0.0013383903,0.00022386524,0.0004931159,0.0005970746],"domain_scores_gemma":[0.9989236,0.00008429281,0.00045242463,0.00019405647,0.00026551602,0.00008012746],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0017960921,0.0002464673,0.0007735833,0.0009215416,0.00006939384,0.00017709362,0.00041877426,0.0001019369,0.00018899715],"category_scores_gemma":[0.0002640845,0.00021085974,0.000093331895,0.0009882442,0.00014850787,0.0010366499,0.00002599338,0.0002018262,0.000004866953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000049125134,0.00004979466,0.00035427551,0.000024253224,0.000028706107,0.00003626088,0.00021071106,0.003942249,0.9950478,0.00003264707,0.00006342739,0.00016071413],"study_design_scores_gemma":[0.0005205011,0.000107124346,0.000594669,0.00011671689,0.000047053505,0.0001450962,0.000066504675,0.0015355459,0.99651474,0.000092289054,0.000054821634,0.00020494044],"about_ca_topic_score_codex":0.00026105807,"about_ca_topic_score_gemma":0.00005164262,"teacher_disagreement_score":0.002406703,"about_ca_system_score_codex":0.00051768677,"about_ca_system_score_gemma":0.0003030141,"threshold_uncertainty_score":0.8598611},"labels":[],"label_agreement":null},{"id":"W2096555062","doi":"10.1109/eptc.2002.1185700","title":"Single current source Tj control","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Diode; Temperature control; Current source; PID controller; Junction temperature; Thermocouple; Calibration; Voltage; Materials science; Temperature measurement; SIGNAL (programming language); Current (fluid); Controller (irrigation); Control theory (sociology); Optoelectronics; Electronic engineering; Computer science; Electrical engineering; Engineering; Physics; Power (physics); Control (management); Mechanical engineering","score_opus":0.010211358662638916,"score_gpt":0.18934113645831657,"score_spread":0.17912977779567765,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2096555062","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.20604254,0.0046415054,0.3500888,0.00007166209,0.0013769119,0.00020218454,0.000008863138,0.0012192505,0.4363483],"genre_scores_gemma":[0.99863476,0.000017222263,0.000070566144,0.00006501656,0.000043656943,0.0000042783136,0.0000029912435,0.000018334184,0.0011431894],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99948436,0.000015915977,0.00013120935,0.00009669094,0.00007997225,0.00019184925],"domain_scores_gemma":[0.99974084,0.000017932745,0.0000095747855,0.00013828068,0.00003635858,0.000057011293],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000057663823,0.00010464628,0.00013025002,0.000059823917,0.000027947535,0.000033966782,0.00006177872,0.00004113549,0.0011362355],"category_scores_gemma":[0.000018496145,0.000084453015,0.00007684509,0.00014205468,0.000010616229,0.00005726059,0.0000013229753,0.00011898415,0.0002011241],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000046694922,0.0002836523,0.0024864338,0.00008776179,0.0008920738,0.000011700302,0.00093949575,0.054252263,0.5985804,0.07140476,0.11234262,0.15871418],"study_design_scores_gemma":[0.00034969248,0.000016916048,0.000013018824,0.000009054351,0.00006728424,0.000005798866,0.00016656704,0.015335512,0.048889738,0.00025005027,0.9346413,0.00025508346],"about_ca_topic_score_codex":0.000010013245,"about_ca_topic_score_gemma":0.000016480259,"teacher_disagreement_score":0.82229865,"about_ca_system_score_codex":0.00003759316,"about_ca_system_score_gemma":0.0000068285567,"threshold_uncertainty_score":0.99977684},"labels":[],"label_agreement":null},{"id":"W2098361002","doi":"10.1023/b:hype.0000004246.64007.24","title":"Design Studies of an Electrostatic Storage Ring","year":2003,"lang":"en","type":"article","venue":"Hyperfine Interactions","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"Studienstiftung des Deutschen Volkes; Bundesministerium für Bildung und Forschung","keywords":"Storage ring; Ring (chemistry); Ion; Quarter (Canadian coin); Atomic physics; Electrostatics; Materials science; Physics; Chemistry; Optics; Quantum mechanics; Geography","score_opus":0.04345951585550022,"score_gpt":0.2832219065478133,"score_spread":0.2397623906923131,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2098361002","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9552304,0.0012006861,0.036132593,0.000030312412,0.00054088613,0.00011047005,0.0000062462623,0.00018612601,0.006562237],"genre_scores_gemma":[0.9971707,0.000084360334,0.0022789908,0.000023011457,0.000029834402,0.000015873671,0.0000056938916,0.000023004586,0.00036853002],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993781,0.000055625165,0.00022434008,0.00010884333,0.0000752902,0.00015779982],"domain_scores_gemma":[0.9995225,0.00009387202,0.000033164808,0.00018070814,0.0001312799,0.000038470112],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001069452,0.00011796535,0.00020390525,0.00016870801,0.000058578167,0.00001682578,0.000065657805,0.000026370584,0.00025911094],"category_scores_gemma":[0.000090935595,0.00010646888,0.000056001805,0.00027157037,0.000021472099,0.00023227558,0.0000028351162,0.0001789839,0.000025379395],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000003831856,0.00006238946,0.000027370512,0.000032382683,0.0005193904,0.0000070809742,0.0014106422,0.08580082,0.9083391,0.0014390609,0.0013382266,0.0010197443],"study_design_scores_gemma":[0.00034038385,0.00019607868,0.000042105294,0.00009417706,0.00033321817,0.00011278159,0.006136856,0.08883767,0.886586,0.0007968837,0.01609993,0.0004239269],"about_ca_topic_score_codex":0.000016418267,"about_ca_topic_score_gemma":0.00005184968,"teacher_disagreement_score":0.041940257,"about_ca_system_score_codex":0.0000704862,"about_ca_system_score_gemma":0.000016746253,"threshold_uncertainty_score":0.43416747},"labels":[],"label_agreement":null},{"id":"W2102729553","doi":"10.1109/tcsi.2008.918011","title":"Embedded Measurement of GHz Digital Signals With Time Amplification in CMOS","year":2008,"lang":"en","type":"article","venue":"IEEE Transactions on Circuits and Systems I Regular Papers","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"CMOS; Electronic circuit; Digital electronics; Electronic engineering; Capacitive sensing; Detector; Computer science; Power (physics); Dissipation; Electrical engineering; Engineering; Physics","score_opus":0.01749080955614375,"score_gpt":0.18042187090510908,"score_spread":0.16293106134896534,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2102729553","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9269794,0.0007647091,0.06348561,0.000025594913,0.00022137737,0.0006488341,0.00008280523,0.00018954408,0.0076020905],"genre_scores_gemma":[0.99946547,0.00008123173,0.0000062944628,0.0000072465104,0.000016562106,0.00003970469,0.000006037929,0.000031768122,0.00034571392],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99872595,0.000039215698,0.00039253672,0.00023604081,0.00039935077,0.00020688251],"domain_scores_gemma":[0.9994371,0.000028753799,0.00005936144,0.00024795317,0.00012616569,0.000100661426],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017023507,0.0002040069,0.00036957627,0.00025079038,0.0000806263,0.000040745592,0.000085680105,0.00011137553,0.00003716685],"category_scores_gemma":[0.0000038512567,0.00016788716,0.000083629406,0.00035654614,0.00006992552,0.00016606905,2.1494628e-7,0.00015315338,0.000012162758],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001524804,0.00012727229,0.000093478695,0.00015621692,0.0005079927,0.000019433424,0.0016408449,0.25132117,0.73662496,0.000052531177,0.0001307724,0.0093100825],"study_design_scores_gemma":[0.009644952,0.002050378,0.0027206272,0.004149942,0.0013279375,0.0014030919,0.01426303,0.25321573,0.6958925,0.0000690025,0.010112817,0.0051499684],"about_ca_topic_score_codex":0.000054097753,"about_ca_topic_score_gemma":0.000026863108,"teacher_disagreement_score":0.072486006,"about_ca_system_score_codex":0.00010950085,"about_ca_system_score_gemma":0.00004687845,"threshold_uncertainty_score":0.684624},"labels":[],"label_agreement":null},{"id":"W2103075918","doi":"10.1039/c5cp04250j","title":"Quantum mechanical study of the β- and δ-lyase reactions during the base excision repair process: application to FPG","year":2015,"lang":"en","type":"article","venue":"Physical Chemistry Chemical Physics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lethbridge College; University of Lethbridge","funders":"Compute Canada; Francis Crick Institute","keywords":"Quantum; Base (topology); Process (computing); Base excision repair; Chemistry; Lyase; Computer science; Biochemistry; Physics; DNA repair; Quantum mechanics; Gene; Enzyme; Mathematics; Operating system","score_opus":0.013236014155655429,"score_gpt":0.23697869521233753,"score_spread":0.2237426810566821,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2103075918","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99883395,0.000011313726,0.000390094,0.000072110946,0.000022041555,0.00024841088,0.000008214971,0.00013340492,0.00028044346],"genre_scores_gemma":[0.99951255,0.0000011160748,0.00000911693,0.000017587881,0.00031141302,0.00008621,0.0000075473868,0.000027830954,0.000026625488],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99888456,0.000019393252,0.00025895008,0.0002979989,0.00034818923,0.00019090826],"domain_scores_gemma":[0.9989675,0.0000718619,0.00006247898,0.0005717008,0.00017142687,0.00015502534],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008331135,0.00019918586,0.00025159464,0.000008146114,0.00007494643,0.000022010856,0.00028745347,0.000065674605,0.0000028787188],"category_scores_gemma":[0.000112369315,0.00012576925,0.00012849491,0.0004909153,0.00005925791,0.00008957353,0.0000820323,0.00039314388,0.00000479247],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015228755,0.00034079587,0.000030932908,0.00008374014,0.0000626106,4.7642163e-7,0.00071019004,0.002848531,0.9954319,0.00014889835,0.00014295867,0.00018371695],"study_design_scores_gemma":[0.000291789,0.000019405918,0.000026127513,0.000024094335,0.00011116366,0.0000027097728,0.0013073469,0.059023898,0.9358918,0.0030471487,0.000082228915,0.00017225435],"about_ca_topic_score_codex":0.00003884026,"about_ca_topic_score_gemma":0.0000018189708,"teacher_disagreement_score":0.059540085,"about_ca_system_score_codex":0.00008340035,"about_ca_system_score_gemma":0.000023824936,"threshold_uncertainty_score":0.5128721},"labels":[],"label_agreement":null},{"id":"W2106092081","doi":"10.1109/ipfa.2008.4588164","title":"Device-level fault isolation of advanced flip-chip devices using scanning SQUID microscopy","year":2008,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Flip chip; Microprocessor; Materials science; Chip; Fault detection and isolation; Fault (geology); Isolation (microbiology); Die (integrated circuit); Squid; Optoelectronics; Computer science; Electronic engineering; Computer hardware; Electrical engineering; Engineering; Nanotechnology; Geology","score_opus":0.03951082032654887,"score_gpt":0.26327056990062314,"score_spread":0.22375974957407427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2106092081","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96898335,0.00054614485,0.025720613,0.000008918997,0.00014985159,0.00007977397,0.000010916478,0.00013916039,0.004361275],"genre_scores_gemma":[0.981502,0.00003506287,0.018043311,0.00005007221,0.000056018474,0.0000026903328,0.00002158645,0.000034357843,0.0002548987],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989991,0.000016287015,0.00038894845,0.00018058046,0.0001589778,0.0002560726],"domain_scores_gemma":[0.99947584,0.000030504718,0.0000756667,0.00019163109,0.00016866133,0.000057683803],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007371972,0.00019219045,0.00029114066,0.00019607252,0.00011064729,0.00001899485,0.00013983015,0.00010784935,0.00020691889],"category_scores_gemma":[0.00001712628,0.00017562648,0.000109860135,0.0004368915,0.00003766842,0.00034271475,0.000011541309,0.00014412997,0.00001954885],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000042579236,0.000009369935,0.0019900454,0.00003227616,0.0000920497,0.000003084703,0.00066178665,0.068997785,0.9273144,0.00007843342,0.00015718052,0.00065930566],"study_design_scores_gemma":[0.0004113601,0.000031300275,0.001785616,0.00013107731,0.00010980939,0.00003741206,0.001385909,0.25019866,0.7440756,0.000023496887,0.0013497984,0.00045998054],"about_ca_topic_score_codex":0.00034356842,"about_ca_topic_score_gemma":0.0001544132,"teacher_disagreement_score":0.18323885,"about_ca_system_score_codex":0.00007155015,"about_ca_system_score_gemma":0.000037462636,"threshold_uncertainty_score":0.716184},"labels":[],"label_agreement":null},{"id":"W2107360972","doi":"10.1109/tdmr.2003.815285","title":"Nondestructive void size determination in copper metallization under passivation","year":2003,"lang":"en","type":"article","venue":"IEEE Transactions on Device and Materials Reliability","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Ministry of Education, India; Université de Sherbrooke","keywords":"Passivation; Materials science; Void (composites); Electromigration; Nondestructive testing; Copper; Cathode ray; Wedge (geometry); Finite element method; Scanning electron microscope; Current (fluid); Composite material; Voltage; Metallurgy; Electron; Optics; Structural engineering; Electrical engineering; Engineering","score_opus":0.009546360701110401,"score_gpt":0.21927508062869086,"score_spread":0.20972871992758046,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2107360972","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8981614,0.000017082468,0.100877844,0.000033699635,0.00037636328,0.00018909891,0.00001824442,0.000072471055,0.0002537612],"genre_scores_gemma":[0.99923307,0.00009770924,0.00048383657,0.00006296028,0.000011840611,0.00005187117,0.0000071393374,0.000019198556,0.000032360505],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99904126,0.000122029276,0.00032115256,0.00022928648,0.00010939464,0.00017689301],"domain_scores_gemma":[0.99954706,0.000113487346,0.000036224774,0.00016729641,0.00009065402,0.000045293753],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00030388072,0.00016170299,0.00022719703,0.00011580736,0.00006736703,0.000056401273,0.000040899955,0.00014507266,0.00026651024],"category_scores_gemma":[0.000026614596,0.0001500253,0.00004114538,0.00026799887,0.000033031465,0.0003033522,2.6922436e-7,0.000115966475,0.00001270164],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003454482,0.00014959564,0.00009629963,0.00016748715,0.00008618578,0.0000021180663,0.0007206973,0.055704713,0.9359478,0.00091020664,0.000023221004,0.006157181],"study_design_scores_gemma":[0.00043361366,0.000045006385,0.0013008582,0.00003719031,0.00010370089,0.000006308565,0.00047990077,0.0031960336,0.99183416,0.0020194463,0.00026175723,0.0002820224],"about_ca_topic_score_codex":0.00014745035,"about_ca_topic_score_gemma":0.00027785377,"teacher_disagreement_score":0.10107165,"about_ca_system_score_codex":0.00020197689,"about_ca_system_score_gemma":0.00002162027,"threshold_uncertainty_score":0.6117854},"labels":[],"label_agreement":null},{"id":"W2107483082","doi":"10.1109/sim.1992.752701","title":"Scanning birefringence mapping of semi-insulating GaAs wafers","year":2005,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Wafer; Birefringence; Materials science; Substrate (aquarium); Optics; Wavelength; Optoelectronics; Physics","score_opus":0.013552065693227177,"score_gpt":0.20435960299561698,"score_spread":0.1908075373023898,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2107483082","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9110694,0.0004101983,0.011348475,0.000043125285,0.000090921254,0.000047907542,0.0000021506692,0.00029633477,0.076691486],"genre_scores_gemma":[0.9964622,0.000027524313,0.0028532334,0.00004008231,0.000098678036,0.0000027058766,0.0000033552344,0.000023889437,0.00048827953],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99915653,0.000008339003,0.00031775652,0.00013603576,0.00013772018,0.0002436333],"domain_scores_gemma":[0.99964535,0.000025568295,0.00003817271,0.00017541768,0.000062631276,0.00005285656],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011747318,0.00013345276,0.00019933903,0.00018374842,0.00004553442,0.000021090851,0.00013486331,0.000066036955,0.00037696317],"category_scores_gemma":[0.000018593788,0.0001207619,0.00008724067,0.00040700941,0.00002006638,0.00017734167,0.000012956923,0.00014432335,0.000035409328],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[8.1207116e-7,0.000009363498,0.0024481607,0.000055892368,0.00017108601,0.0000023439611,0.0015878886,0.19617575,0.7683799,0.0012935612,0.000754182,0.029121047],"study_design_scores_gemma":[0.00019220707,0.000012839819,0.0006160793,0.00015425787,0.000049755363,0.000007854477,0.0020717585,0.6515432,0.3349166,0.000057978537,0.009963976,0.00041349712],"about_ca_topic_score_codex":0.0000957575,"about_ca_topic_score_gemma":0.00004108975,"teacher_disagreement_score":0.45536748,"about_ca_system_score_codex":0.00006639789,"about_ca_system_score_gemma":0.000011488037,"threshold_uncertainty_score":0.4924527},"labels":[],"label_agreement":null},{"id":"W2108643792","doi":"10.1109/icmens.2004.1508953","title":"An Integrated Test Platform for Nanostructure Electrical Characterization","year":2006,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Regroupement Québécois sur les Matériaux de Pointe; Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs","keywords":"CMOS; Capacitance; Inductance; Chip; Integrated circuit; Voltage; Materials science; Electronic engineering; Electronics; Electrical engineering; Characterization (materials science); Parasitic capacitance; Parasitic element; Computer science; Optoelectronics; Engineering; Nanotechnology; Physics","score_opus":0.00509640053037385,"score_gpt":0.19174166674661539,"score_spread":0.18664526621624153,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2108643792","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8431557,0.000033852437,0.15153545,0.00003757767,0.00023782955,0.00028183585,0.00014696213,0.00085846434,0.003712356],"genre_scores_gemma":[0.9962524,0.000004774435,0.00073551945,0.000061484,0.00019525358,0.000018466788,0.002011928,0.000032966545,0.0006872182],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99934804,0.0000034946686,0.00020160124,0.00014606828,0.00007551781,0.00022526833],"domain_scores_gemma":[0.99966717,0.000026614212,0.000020415739,0.00013530834,0.00010785244,0.00004263228],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000035790446,0.00015033841,0.00015430464,0.000122020734,0.000054550983,0.00007743731,0.00010480613,0.00014754737,0.00021648646],"category_scores_gemma":[0.000014321954,0.000115450086,0.00006301172,0.00034165438,0.000009430919,0.00023829176,0.0000014820588,0.00011768572,0.000010900499],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000028542604,0.000020940952,0.000418357,0.00000613836,0.000021937765,7.6765343e-7,0.000021328735,0.00054817175,0.9851758,0.0036288654,0.0019350676,0.008219779],"study_design_scores_gemma":[0.0003911733,0.0001508347,0.0028141267,0.0000086391765,0.00007947414,0.000012063672,0.000058793812,0.4737003,0.45850262,0.0008403599,0.062967785,0.00047379595],"about_ca_topic_score_codex":0.00006861407,"about_ca_topic_score_gemma":0.000109993256,"teacher_disagreement_score":0.5266732,"about_ca_system_score_codex":0.00006230279,"about_ca_system_score_gemma":0.000015666186,"threshold_uncertainty_score":0.4707918},"labels":[],"label_agreement":null},{"id":"W2109495827","doi":"10.1109/tsm.2007.907613","title":"A Fab-Wide APC Sampling Application","year":2007,"lang":"en","type":"article","venue":"IEEE Transactions on Semiconductor Manufacturing","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":32,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Metrology; Reliability engineering; Sampling (signal processing); Event (particle physics); Process (computing); Computer science; Process variation; Duration (music); Fault detection and isolation; Engineering; Semiconductor device fabrication; Microprocessor; Manufacturing engineering; Real-time computing; Embedded system; Wafer; Artificial intelligence; Operating system; Detector; Mathematics; Telecommunications","score_opus":0.016039179816445755,"score_gpt":0.2311549802360548,"score_spread":0.21511580041960904,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2109495827","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5003232,0.00005630274,0.49653783,0.000016403645,0.00061381166,0.00016210879,0.000017917235,0.0005798231,0.0016926421],"genre_scores_gemma":[0.99843985,0.000056936406,0.00069129077,0.00017821166,0.00017080359,0.000035918543,0.000016374877,0.000101090875,0.0003095249],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9980731,0.000018206534,0.00053590967,0.00044803423,0.00029764313,0.00062712503],"domain_scores_gemma":[0.99895203,0.00019258515,0.00006563096,0.000524762,0.00005903917,0.00020593396],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00028106748,0.00040473763,0.0003391227,0.00053141906,0.00023068103,0.000086716966,0.00028742335,0.0002545431,0.00030748494],"category_scores_gemma":[0.0000042975657,0.0004051582,0.00024980246,0.00031278955,0.000046126694,0.0003470327,0.0000010836969,0.00075107504,0.00024180247],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017356822,0.000055084198,0.000020174723,0.000054594042,0.0002662258,0.000008495263,0.0005262332,0.086265594,0.87013555,0.000051161493,0.0001925126,0.042407002],"study_design_scores_gemma":[0.00026186346,0.000022840688,0.000099407815,0.000038217546,0.00010127034,0.000020482257,0.00042601142,0.0026455983,0.9887403,0.00016506876,0.006995185,0.00048371116],"about_ca_topic_score_codex":0.00011125749,"about_ca_topic_score_gemma":0.00020507487,"teacher_disagreement_score":0.49811667,"about_ca_system_score_codex":0.0003274467,"about_ca_system_score_gemma":0.000018614614,"threshold_uncertainty_score":0.99984},"labels":[],"label_agreement":null},{"id":"W2115543310","doi":"10.1109/icra.2013.6630759","title":"Automated nanoprobing under scanning electron microscopy","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Metrology; Materials science; Scanning electron microscope; Chip; Computer science; Microscope; Optics; Physics","score_opus":0.006388731156896212,"score_gpt":0.22279045298207997,"score_spread":0.21640172182518377,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2115543310","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9665245,0.00023843083,0.002448619,0.00007359947,0.0001508798,0.0001077595,7.488953e-7,0.0024582802,0.027997188],"genre_scores_gemma":[0.9974148,0.000009980528,0.0006821495,0.00014497376,0.000037448044,0.00001795323,0.00001369024,0.000037839694,0.0016411138],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99920785,0.000009938601,0.00018496923,0.00014686851,0.00008469516,0.00036569417],"domain_scores_gemma":[0.999681,0.000011739887,0.000015667198,0.00016212111,0.00006660467,0.000062857325],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000045355435,0.00015651507,0.00015881022,0.00012303932,0.00006418433,0.00012726699,0.00011723842,0.00009169984,0.001336301],"category_scores_gemma":[0.0000034610703,0.00012998306,0.00006335934,0.00030008226,0.000015018589,0.00023606696,0.000007366219,0.000159125,0.00066744926],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[1.9226009e-7,0.0000041933695,0.000055101507,0.0000072084013,0.00008596435,8.094812e-7,0.00007720219,0.0066257045,0.9730899,0.00072935905,0.019099701,0.00022467686],"study_design_scores_gemma":[0.00013348112,0.000017220576,0.00021472629,0.000024382438,0.000033664553,0.000010386884,0.00031671676,0.26682818,0.73026407,0.00028771747,0.0015461174,0.00032337426],"about_ca_topic_score_codex":0.00041193067,"about_ca_topic_score_gemma":0.000028554405,"teacher_disagreement_score":0.26020247,"about_ca_system_score_codex":0.00009563901,"about_ca_system_score_gemma":0.000014572205,"threshold_uncertainty_score":0.9995766},"labels":[],"label_agreement":null},{"id":"W2117669489","doi":"10.1109/ipfa.2013.6599176","title":"Non-destructive open fault isolation in flip-chip devices with space-domain reflectometry","year":2013,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Reflectometry; Fault detection and isolation; Chip; Squid; Electronic engineering; Fault (geology); Device under test; Materials science; Computer science; Time domain; Optoelectronics; Electrical engineering; Engineering; Scattering parameters; Geology; Computer vision","score_opus":0.009127275687461866,"score_gpt":0.2285428053394108,"score_spread":0.21941552965194894,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2117669489","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89902484,0.00003126041,0.002715482,0.00010321559,0.000046506328,0.0003051371,0.00000174724,0.00008099436,0.0976908],"genre_scores_gemma":[0.99504614,0.0000063397415,0.0041662925,0.00008653184,0.00003732373,0.000050330364,0.00001699533,0.000032931486,0.0005571442],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9991393,0.000020244806,0.00021490958,0.00022595999,0.00013160253,0.00026800044],"domain_scores_gemma":[0.99955285,0.000029498651,0.000036286216,0.00021972039,0.00009454198,0.0000671033],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00010136705,0.00018969883,0.00025879315,0.00031242074,0.00004255764,0.00021682247,0.00026575802,0.00010620687,0.0009323111],"category_scores_gemma":[0.000007234484,0.00013778383,0.000034455337,0.00092232047,0.000021369571,0.00079048506,0.000024419855,0.00023343072,0.00016846592],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000071750175,0.00016585906,0.15840276,0.00015659699,0.0014145076,0.000045183566,0.008798228,0.029284714,0.7630477,0.01586074,0.009370761,0.013381225],"study_design_scores_gemma":[0.008212563,0.0010121197,0.33717474,0.000877054,0.00041119746,0.00011572241,0.054921433,0.38195702,0.1799086,0.01992674,0.009794254,0.0056885383],"about_ca_topic_score_codex":0.003323955,"about_ca_topic_score_gemma":0.0047372268,"teacher_disagreement_score":0.58313906,"about_ca_system_score_codex":0.00011532324,"about_ca_system_score_gemma":0.000024388546,"threshold_uncertainty_score":0.999981},"labels":[],"label_agreement":null},{"id":"W2122079084","doi":"10.1109/dbt.2000.843688","title":"Impact of technology scaling on bridging fault detections in sequential and combinational CMOS circuits","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"University of Dar es Salaam","keywords":"Bridging (networking); CMOS; Digital electronics; Logic gate; Electronic engineering; Scaling; Electronic circuit; Combinational logic; Computer science; Integrated circuit; Engineering; Electrical engineering; Mathematics","score_opus":0.014863282388743002,"score_gpt":0.23260691615595416,"score_spread":0.21774363376721118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2122079084","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99412817,0.00009923213,0.0015210083,0.000041566458,0.00004595891,0.000049553666,0.000006596672,0.00010069966,0.004007226],"genre_scores_gemma":[0.99984264,0.000026605569,0.000025824427,0.000006860371,0.000014612818,0.0000045298298,0.0000034492493,0.0000114772265,0.00006402617],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994583,0.000008204587,0.00018656897,0.00011386064,0.00008146985,0.00015158976],"domain_scores_gemma":[0.9997946,0.000019975418,0.00001988673,0.00009105264,0.00004760014,0.00002689465],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000452993,0.00009662069,0.00015176475,0.0005816535,0.000032841726,0.00001540494,0.000055877146,0.00010061708,0.00034508476],"category_scores_gemma":[0.000023430177,0.00008705634,0.000060259285,0.00052167434,0.000030568575,0.00007571323,0.0000060076222,0.00018968011,0.000008813324],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000018067632,0.00017649193,0.019108497,0.000038576007,0.0004760442,0.000017845325,0.00060556585,0.15669478,0.6634662,0.0076221838,0.0005070952,0.15128486],"study_design_scores_gemma":[0.0008693989,0.00013839315,0.010756352,0.00008436672,0.000051975,0.00006193399,0.0002538502,0.929535,0.057104502,0.0007026819,0.000081953345,0.00035960457],"about_ca_topic_score_codex":0.00012846975,"about_ca_topic_score_gemma":0.000057686284,"teacher_disagreement_score":0.7728402,"about_ca_system_score_codex":0.00009386016,"about_ca_system_score_gemma":0.000005345225,"threshold_uncertainty_score":0.37784362},"labels":[],"label_agreement":null},{"id":"W2123189957","doi":"10.1109/icwsi.1995.515436","title":"Test vehicle for a wafer-scale field programmable gate array","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Field-programmable gate array; Macrocell array; Programmable logic array; Wafer; Logic block; Redundancy (engineering); Lookup table; Gate array; Routing (electronic design automation); Programmable logic device; Wafer-scale integration; Erasable programmable logic device; Programmable Array Logic; Electronic engineering; Embedded system; Computer science; Logic gate; Interconnection; Engineering; Logic synthesis; Electrical engineering; Logic family","score_opus":0.01210860847353651,"score_gpt":0.1916078935011113,"score_spread":0.17949928502757478,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2123189957","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.33972156,0.0015313843,0.09457302,0.002698779,0.00095488114,0.0015441299,0.00006934344,0.003346803,0.5555601],"genre_scores_gemma":[0.9840503,0.00003443541,0.0014954224,0.00021085243,0.000094714276,0.000074022195,0.000009093217,0.000030561383,0.0140005965],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99928945,0.0000037368861,0.00016832401,0.00014964887,0.00007621145,0.00031260052],"domain_scores_gemma":[0.99958766,0.00007952666,0.0000129041055,0.00019251995,0.000057380654,0.00007002155],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0000503388,0.00013022225,0.00016006474,0.00005644172,0.000060534978,0.00006430471,0.000117531265,0.000089717585,0.0016425735],"category_scores_gemma":[0.000026452859,0.00010669364,0.00011743225,0.00019821731,0.000010016925,0.00010889153,0.0000036183524,0.00011466601,0.00017494084],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00000666396,0.00024194241,0.0020126265,0.00014605699,0.00036034174,0.0000070741903,0.0012505817,0.0030779294,0.6537687,0.0012565005,0.25534916,0.08252241],"study_design_scores_gemma":[0.00052824547,0.00020816455,0.000023522543,0.000023323983,0.00010043794,0.0000056408967,0.00028578562,0.27912715,0.41426414,0.00040420363,0.3045591,0.00047026566],"about_ca_topic_score_codex":0.000059981154,"about_ca_topic_score_gemma":0.00020603568,"teacher_disagreement_score":0.6443287,"about_ca_system_score_codex":0.00002506942,"about_ca_system_score_gemma":0.0000028101283,"threshold_uncertainty_score":0.9992701},"labels":[],"label_agreement":null},{"id":"W2123442619","doi":"10.1002/pssa.201532033","title":"Camera‐based high frequency heterodyne lock‐in carrierographic (frequency‐domain photoluminescence) imaging of crystalline silicon wafers","year":2015,"lang":"en","type":"article","venue":"physica status solidi (a)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Recruitment Program of Global Experts; Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Canada Foundation for Innovation","keywords":"Heterodyne (poetry); Optics; Materials science; Wafer; Amplitude; Frequency modulation; SIGNAL (programming language); Heterodyne detection; Amplitude modulation; Physics; Optoelectronics; Radio frequency; Acoustics; Computer science; Telecommunications; Laser","score_opus":0.011112608699764062,"score_gpt":0.21838743627248108,"score_spread":0.20727482757271704,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2123442619","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9956216,0.0008108254,0.00083365734,0.00009585376,0.0002343522,0.00025775383,0.00015643556,0.00021157665,0.0017778949],"genre_scores_gemma":[0.99857587,0.00005488782,0.0008537809,0.00006402333,0.000110548266,0.000046807516,0.00019339667,0.00009017356,0.000010523611],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9973803,0.000096101205,0.0006740578,0.00047746478,0.00046554004,0.0009064971],"domain_scores_gemma":[0.99852836,0.00005929276,0.00014749583,0.0006315079,0.00030212908,0.00033119667],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00020621163,0.0004677426,0.00076182693,0.0004652198,0.000052776057,0.000051643896,0.00034363623,0.000109396635,0.000054623986],"category_scores_gemma":[0.0000436978,0.00046709276,0.00026875403,0.0012550573,0.00020588828,0.0003401819,0.000020935062,0.00042857154,0.000012165706],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021257034,0.00018147111,0.0241464,0.00014164721,0.00019551374,0.000064164495,0.0016497548,0.010499297,0.961107,0.0012337702,0.00045040686,0.00030928143],"study_design_scores_gemma":[0.013189889,0.0008114234,0.011971355,0.0012891889,0.0011045712,0.000037136862,0.014290934,0.22003187,0.7045514,0.024718046,0.0015219488,0.006482254],"about_ca_topic_score_codex":0.0069231954,"about_ca_topic_score_gemma":0.0010231643,"teacher_disagreement_score":0.25655565,"about_ca_system_score_codex":0.00030308307,"about_ca_system_score_gemma":0.00018786102,"threshold_uncertainty_score":0.9997781},"labels":[],"label_agreement":null},{"id":"W2129274929","doi":"10.1116/1.1521736","title":"Copper device editing: Strategy for focused ion beam milling of copper","year":2002,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":30,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Focused ion beam; Materials science; Crystallite; Copper; Ion milling machine; Crystal (programming language); Ion beam; Etching (microfabrication); Phase (matter); Beam (structure); Ion; Optoelectronics; Layer (electronics); Metallurgy; Composite material; Optics; Chemistry","score_opus":0.02875813764714724,"score_gpt":0.22852715737584398,"score_spread":0.19976901972869673,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2129274929","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9541939,0.043255974,0.0019332861,0.00017773494,0.00016026256,0.00013530078,0.000005139951,0.000030244588,0.00010818995],"genre_scores_gemma":[0.9979509,0.00081525056,0.001082617,0.00002662821,0.000094089664,0.0000037426069,7.740877e-7,0.000019494884,0.0000064649626],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983567,0.000009855341,0.000553805,0.00024571127,0.00035547675,0.0004784287],"domain_scores_gemma":[0.9987224,0.000015650525,0.00032085073,0.00012437666,0.0007298402,0.00008688732],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007230674,0.0002306629,0.00043324128,0.0010089299,0.00028005175,0.0001287781,0.0003348719,0.00013911803,0.000007218644],"category_scores_gemma":[0.000035274832,0.00017671214,0.00007447421,0.0009575354,0.0003235015,0.0003376559,0.000023571129,0.00034835166,9.794704e-8],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001065373,0.000018259207,0.00020511614,0.00011999616,0.00009764873,6.380915e-7,0.00034110455,0.00018328188,0.95701474,0.00034054805,0.00007991042,0.041588124],"study_design_scores_gemma":[0.0014173494,0.0013713721,0.00010464369,0.00028676185,0.00036930374,0.00014072076,0.00083962874,0.0077180476,0.97696185,0.007298691,0.0029938964,0.0004977502],"about_ca_topic_score_codex":0.0000013090344,"about_ca_topic_score_gemma":0.0000043632726,"teacher_disagreement_score":0.04375707,"about_ca_system_score_codex":0.00014491894,"about_ca_system_score_gemma":0.000111158944,"threshold_uncertainty_score":0.7206112},"labels":[],"label_agreement":null},{"id":"W2131270307","doi":"10.1109/test.1994.528017","title":"Application of optoelectronic techniques to high speed testing","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Computer science; Multiplexing; Encoding (memory); Architecture; Electronic engineering; Optical performance monitoring; Computer architecture; Optical switch; Optoelectronics; Computer hardware; Wavelength-division multiplexing; Materials science; Engineering; Telecommunications; Artificial intelligence","score_opus":0.012147533848752242,"score_gpt":0.20193956817009695,"score_spread":0.1897920343213447,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2131270307","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.64660937,0.0002777113,0.17197126,0.00024091356,0.000062936604,0.0004641891,0.000006952221,0.0017095308,0.17865713],"genre_scores_gemma":[0.99467134,0.000008100974,0.0048919427,0.00004467231,0.00003654712,0.000008664895,0.000003165735,0.000014454549,0.00032110533],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99954915,0.0000037611264,0.00015234023,0.00009131455,0.000067873734,0.00013556203],"domain_scores_gemma":[0.99971414,0.000017147508,0.000015507874,0.00015346982,0.00006936992,0.000030395928],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004197789,0.00007497706,0.00011655708,0.0001081194,0.000014314344,0.000009117507,0.00009454327,0.000043444452,0.00024043143],"category_scores_gemma":[0.000014549573,0.000066079505,0.000028288041,0.00045953965,0.000005946192,0.000044682234,0.000004885045,0.000071332586,0.000059452286],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[2.2156215e-7,0.0000092717255,0.000105906416,0.000009392608,0.000027313612,1.9408147e-7,0.000046896464,0.0019503845,0.9356993,0.0025567373,0.0018795681,0.057714812],"study_design_scores_gemma":[0.000033371034,0.000043892756,0.00005346379,0.000009490926,0.000023168597,0.0000019923543,0.000026883477,0.113529,0.8814047,0.00021174338,0.004529415,0.00013287162],"about_ca_topic_score_codex":0.00020576603,"about_ca_topic_score_gemma":0.000019926487,"teacher_disagreement_score":0.34806198,"about_ca_system_score_codex":0.000043096927,"about_ca_system_score_gemma":0.0000021468754,"threshold_uncertainty_score":0.2694644},"labels":[],"label_agreement":null},{"id":"W2131403703","doi":"10.3139/147.100317","title":"FIB-Präparation und TEM-Analytik an AlSi1-Bondkontakten","year":2006,"lang":"de","type":"article","venue":"Practical Metallography","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Physics","score_opus":0.023631243122075672,"score_gpt":0.2921246550396514,"score_spread":0.26849341191757575,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2131403703","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.42667267,0.112499505,0.10330682,0.010230864,0.012155117,0.0036044682,0.0007496332,0.003649129,0.3271318],"genre_scores_gemma":[0.9890963,0.0006461121,0.006567744,0.00031578995,0.0016286812,0.00004457123,0.00063902367,0.00014037723,0.0009213962],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.99578226,0.0004313107,0.0011510318,0.00092029874,0.0007564032,0.00095868285],"domain_scores_gemma":[0.99767023,0.00033083782,0.00031125703,0.0009579931,0.00034220293,0.00038747073],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0008298453,0.0007365867,0.000991383,0.00090771436,0.00027238848,0.00068916637,0.0003990321,0.0006211087,0.0016551169],"category_scores_gemma":[0.00018635507,0.0006782679,0.0009925707,0.0020309137,0.000207189,0.001630004,0.00004248364,0.0011782849,0.00082358764],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003545285,0.004719229,0.0089711435,0.00046643027,0.042336747,0.0011048646,0.00079205894,0.029115593,0.33171108,0.50490415,0.06446874,0.011055441],"study_design_scores_gemma":[0.0013075044,0.0006646481,0.0044223433,0.00008673163,0.024814764,0.000052683125,0.0004601022,0.08601398,0.009553858,0.02058355,0.8493578,0.0026820777],"about_ca_topic_score_codex":0.0021421886,"about_ca_topic_score_gemma":0.00081134774,"teacher_disagreement_score":0.78488904,"about_ca_system_score_codex":0.00011463439,"about_ca_system_score_gemma":0.000094804585,"threshold_uncertainty_score":0.9999544},"labels":[],"label_agreement":null},{"id":"W2131924388","doi":"10.1017/s1431927602101589","title":"Gallium Phase Formation in Cu and Other FCC Metals During Near-Normal Incidence Ga-FIB Milling and Techniques to Avoid this Phenomenon","year":2002,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Suite; Library science; Materials science; Art history; Art; History; Computer science; Archaeology","score_opus":0.011399551461825128,"score_gpt":0.23842038489853712,"score_spread":0.22702083343671198,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2131924388","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9899794,0.006053961,0.0030785997,0.00006153761,0.000020864949,0.00016964276,0.000031821823,0.00008890478,0.00051525614],"genre_scores_gemma":[0.9945161,0.0018854848,0.00300124,0.0001946938,0.00003357989,0.000023313758,0.0000114573995,0.000034028162,0.0003001394],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986812,0.000043742268,0.00045458975,0.00034705325,0.00010674356,0.00036667695],"domain_scores_gemma":[0.99952954,0.00002646445,0.000067132045,0.0002023574,0.000049628536,0.00012489087],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002437734,0.0002876239,0.00046479463,0.00048368488,0.00020099294,0.0002547303,0.00010797581,0.00013008609,0.0002475614],"category_scores_gemma":[0.000014793391,0.0002734019,0.000076968674,0.00059195946,0.00006788568,0.00045389618,0.000042093812,0.0002293728,0.00001284992],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011477971,0.000025488655,0.0006290176,0.000113729315,0.00015209799,0.0000082334245,0.0039217146,0.00014401595,0.9916173,0.000007704825,0.00015642731,0.0032127616],"study_design_scores_gemma":[0.0005774525,0.00006700962,0.000060209328,0.0001648843,0.00038702512,0.000055454882,0.0007099555,0.016617509,0.97523236,0.000021725325,0.005590021,0.000516403],"about_ca_topic_score_codex":0.0004998744,"about_ca_topic_score_gemma":0.00041236382,"teacher_disagreement_score":0.016473493,"about_ca_system_score_codex":0.00008011876,"about_ca_system_score_gemma":0.000003971183,"threshold_uncertainty_score":0.9999718},"labels":[],"label_agreement":null},{"id":"W2132528324","doi":"10.1109/newcas.2012.6329049","title":"A bandwidth enhancement technique for CMOS TIAs driven by large photodiodes","year":2012,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"Natural Sciences and Engineering Research Council of Canada; Alberta Innovates","keywords":"Transimpedance amplifier; Photodiode; Bandwidth (computing); CMOS; Capacitance; Optoelectronics; Ripple; Amplifier; Electronic engineering; Computer science; Materials science; Electrical engineering; Operational amplifier; Physics; Engineering; Telecommunications; Voltage","score_opus":0.009020766565236878,"score_gpt":0.22386998780810963,"score_spread":0.21484922124287276,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2132528324","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.026638236,0.0012111053,0.9381611,0.00004977369,0.00026355556,0.0007517677,0.00010606541,0.00038418398,0.032434218],"genre_scores_gemma":[0.99433243,0.000052160813,0.0023010457,0.00014517143,0.000088720335,0.0003619876,0.000091417314,0.00003164528,0.0025954053],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991888,0.0000085832235,0.00017596544,0.00011560568,0.00009001624,0.00042103382],"domain_scores_gemma":[0.99966234,0.000020782356,0.00001823053,0.00016882959,0.000043854834,0.00008598331],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00014880921,0.00015359292,0.00018228617,0.00006293929,0.000052963205,0.000024148565,0.000107510525,0.000099110504,0.001502912],"category_scores_gemma":[0.000007690184,0.00012361423,0.00010633255,0.00011724067,0.00000892184,0.0001521038,0.000008363628,0.000095889925,0.000054170483],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00000192261,0.000056375153,0.00026247973,0.000029776755,0.00015284489,1.8080972e-7,0.00022697859,0.000018116061,0.88952845,0.0021489647,0.10719863,0.0003752898],"study_design_scores_gemma":[0.00014656094,0.000019998224,0.0000050992167,0.000009757658,0.00004545459,0.000001204159,0.00010537223,0.0019547872,0.8213205,0.00003566114,0.17617777,0.0001778775],"about_ca_topic_score_codex":0.00002237919,"about_ca_topic_score_gemma":0.00001724907,"teacher_disagreement_score":0.9676942,"about_ca_system_score_codex":0.000063073865,"about_ca_system_score_gemma":0.0000067153273,"threshold_uncertainty_score":0.99940985},"labels":[],"label_agreement":null},{"id":"W2133311033","doi":"10.1109/ccece.1993.332264","title":"Canada's new intellectual property statute: the Integrated Circuit Topography Act","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"Dominion Astrophysical Observatory","funders":"","keywords":"Statute; Scope (computer science); Intellectual property; Law; Computer science; Political science; Law and economics; Sociology; Programming language","score_opus":0.01765198381765043,"score_gpt":0.16390250546240215,"score_spread":0.14625052164475172,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2133311033","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.17943053,0.0050902697,0.013247931,0.0054511246,0.002546195,0.0011625371,0.00012416812,0.0021719,0.79077536],"genre_scores_gemma":[0.9744324,0.00025087217,0.000038883143,0.00080727343,0.00012260287,0.000009258577,0.000021392314,0.000040577237,0.024276754],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9987577,0.000034447283,0.00029025492,0.00022012004,0.00026385588,0.0004335737],"domain_scores_gemma":[0.9992348,0.00009419503,0.00002272086,0.00038618207,0.00009898429,0.00016312627],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0000746788,0.00027191185,0.00024053296,0.00012643015,0.0001196712,0.00011912358,0.00040423585,0.00009306902,0.010569719],"category_scores_gemma":[0.000071036535,0.00012999543,0.00013266444,0.0009966249,0.00004414105,0.0001481718,0.000013461064,0.0004876197,0.00010351764],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000015527377,0.000012961597,0.00009876839,0.000006880371,0.00034188837,0.000010992519,0.0009510501,0.00074317877,0.003916114,0.0006746309,0.9584167,0.034825288],"study_design_scores_gemma":[0.00014748274,0.000025872712,0.000057585177,0.000013732588,0.00007098919,0.000015805284,0.000885658,0.024787849,0.0047558425,0.00004187204,0.96885455,0.00034274094],"about_ca_topic_score_codex":0.55065566,"about_ca_topic_score_gemma":0.72262096,"teacher_disagreement_score":0.79500186,"about_ca_system_score_codex":0.00017684151,"about_ca_system_score_gemma":0.0002157858,"threshold_uncertainty_score":0.99033475},"labels":[],"label_agreement":null},{"id":"W2135375598","doi":"10.1109/ipfa.1997.638324","title":"Scanning acoustic microscope (SAM)-a measurement tool for plastic IC packages","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Microscope; Die (integrated circuit); Gauge (firearms); Materials science; Scanning acoustic microscope; Transducer; Acoustics; Tilt (camera); Paddle; Displacement (psychology); Optical microscope; Acoustic microscopy; Microscopy; Optics; Scanning electron microscope; Mechanical engineering; Engineering; Composite material; Physics; Nanotechnology","score_opus":0.027803518173167854,"score_gpt":0.20662807944794037,"score_spread":0.17882456127477253,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2135375598","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.25610134,0.004318075,0.7163368,0.00018000665,0.0019269432,0.00077575137,0.0000545971,0.0013568131,0.018949706],"genre_scores_gemma":[0.9974653,0.00004915584,0.00078115345,0.00008917599,0.00013033689,0.000047615384,0.000008166758,0.00004830122,0.001380778],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989176,0.000010020315,0.00026766447,0.00020950515,0.00020653645,0.0003886958],"domain_scores_gemma":[0.9994716,0.00007495513,0.000023995202,0.00020465138,0.0001568197,0.00006799041],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00014238429,0.0002144263,0.0002386166,0.00013102368,0.00009793768,0.00009836657,0.00014444388,0.000089045505,0.0012079121],"category_scores_gemma":[0.000119656055,0.00018118694,0.00012893307,0.00020439133,0.000019450248,0.000121064695,0.000007651493,0.0001339052,0.00016753071],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000002460404,0.000028895047,0.00011739298,0.00011133061,0.00030890762,0.000004064629,0.00024708337,0.018919254,0.9009966,0.00016752354,0.0751995,0.0038969896],"study_design_scores_gemma":[0.001335608,0.00018728597,0.00024865413,0.00026010655,0.00079295086,0.000017997316,0.0006832115,0.64578974,0.31452397,0.00013755585,0.034612197,0.0014106988],"about_ca_topic_score_codex":0.00001715007,"about_ca_topic_score_gemma":0.000046528585,"teacher_disagreement_score":0.741364,"about_ca_system_score_codex":0.00014747835,"about_ca_system_score_gemma":0.0000095752175,"threshold_uncertainty_score":0.99970514},"labels":[],"label_agreement":null},{"id":"W2135399025","doi":"10.1109/dftvs.1994.630041","title":"Using Fourier analyses to enhance IC testability","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Testability; Fast Fourier transform; Voltage; Computer science; Design for testing; Fourier transform; Electronic engineering; Current (fluid); Electrical engineering; Algorithm; Engineering; Reliability engineering; Mathematics","score_opus":0.10217486899647242,"score_gpt":0.3344565467037363,"score_spread":0.23228167770726388,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2135399025","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9089092,0.0003085158,0.047296196,0.000068695685,0.000121426616,0.000078597994,0.0000048095962,0.00028693074,0.042925656],"genre_scores_gemma":[0.9948085,0.000010781776,0.0039902413,0.00012919772,0.00006213767,0.000003623319,0.0000013507911,0.000017824743,0.0009763541],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99926215,0.000013554265,0.00019070502,0.0001785851,0.000121955476,0.00023305765],"domain_scores_gemma":[0.99949914,0.0000262515,0.000010937835,0.00029963165,0.00006794599,0.00009609996],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00006606853,0.00013151698,0.00018082511,0.00011969719,0.000045115554,0.000042403746,0.00011129455,0.00005434365,0.0047611184],"category_scores_gemma":[0.000041610732,0.00010837191,0.00008955472,0.0005674311,0.000013632916,0.000120496494,0.000008975576,0.00010593192,0.00024672796],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[7.0732943e-7,0.000032319353,0.00076026,0.000018393945,0.00017891572,0.0000060717994,0.00046439224,0.03595751,0.94449186,0.000156524,0.007371146,0.010561873],"study_design_scores_gemma":[0.000056046363,0.000022831737,0.00016193406,0.000017938886,0.00013682517,0.0000055551154,0.0002723297,0.5659284,0.4225041,0.00013313422,0.010285731,0.00047518866],"about_ca_topic_score_codex":0.00015814377,"about_ca_topic_score_gemma":0.00012134182,"teacher_disagreement_score":0.5299709,"about_ca_system_score_codex":0.00007634817,"about_ca_system_score_gemma":0.0000035356613,"threshold_uncertainty_score":0.99614865},"labels":[],"label_agreement":null},{"id":"W2136838928","doi":"10.1109/holm.1989.77944","title":"Metallurgic and contact resistance studies of sleeve connectors in aluminium cable splices","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hydro-Québec","funders":"","keywords":"Cable gland; Aluminium; Crimp; Soldering; Microstructure; Scanning electron microscope; Materials science; Contact resistance; Composite material; Optical microscope; Structural engineering; Electrical engineering; Engineering","score_opus":0.019460442180950235,"score_gpt":0.2369207233395046,"score_spread":0.21746028115855437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2136838928","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9515651,0.00842657,0.00008754792,0.000024286157,0.00009168384,0.000072379735,0.0000032976902,0.000040751114,0.039688412],"genre_scores_gemma":[0.9978352,0.000618538,0.00018881333,0.00001950127,0.0000059179533,0.0000067789665,0.0000013609438,0.0000115862995,0.0013123017],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993413,0.000028704419,0.00025423706,0.0001360422,0.000076985845,0.00016274027],"domain_scores_gemma":[0.99964714,0.000106077816,0.000030615345,0.00012463827,0.000060784037,0.00003076335],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018442924,0.00012500593,0.00035718217,0.00012356561,0.000018775396,0.000011421349,0.000052906078,0.000051202893,0.00017848822],"category_scores_gemma":[0.000055220014,0.00009891002,0.00004300668,0.00026009974,0.000036112942,0.00010855259,0.0000045128527,0.00008629828,0.0000032132707],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000044321067,0.00016987258,0.01484729,0.0013799203,0.0056047216,0.00010269748,0.01744431,0.016976757,0.51540744,0.4170673,0.01056136,0.0003939927],"study_design_scores_gemma":[0.0028024153,0.00019257468,0.0023137203,0.00045256424,0.0005915099,0.000019238269,0.08093373,0.009390523,0.8290344,0.0051730433,0.06736666,0.0017296455],"about_ca_topic_score_codex":0.00016900517,"about_ca_topic_score_gemma":0.0027514228,"teacher_disagreement_score":0.41189423,"about_ca_system_score_codex":0.000033014232,"about_ca_system_score_gemma":0.000010109088,"threshold_uncertainty_score":0.40334335},"labels":[],"label_agreement":null},{"id":"W2136897274","doi":"10.1016/j.cellbi.2004.07.012","title":"Cytoskeletal actin degradation induced by lovastatin in cardiomyocytes is mediated through caspase‐2","year":2004,"lang":"en","type":"article","venue":"Cell Biology International","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Lovastatin; Cytoskeleton; Actin; Cell biology; Actin cytoskeleton; Fragmentation (computing); Apoptosis; Biology; Mevalonate pathway; Caspase; Biochemistry; Chemistry; Programmed cell death; Cell; Enzyme; Cholesterol; Biosynthesis","score_opus":0.010896608172929182,"score_gpt":0.23028243678494584,"score_spread":0.21938582861201666,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2136897274","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9852962,0.00020242191,0.0023505788,0.00036389893,0.0005834087,0.00008043417,0.00015854483,0.00009167111,0.010872852],"genre_scores_gemma":[0.9979483,0.00010563694,0.000229824,0.00024323186,0.00008984956,0.000018049072,0.0012120068,0.00002054593,0.0001325575],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99907434,0.00002871406,0.00030425875,0.00024239834,0.00011625319,0.00023402896],"domain_scores_gemma":[0.99965054,0.000056370995,0.000054770153,0.00012450236,0.000076341625,0.000037478032],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000085120446,0.00018180505,0.00020655188,0.00017463333,0.000027300553,0.000025576333,0.00021788344,0.00020899893,0.00045282522],"category_scores_gemma":[0.000036011235,0.00017209661,0.00008816991,0.00024043552,0.000038945076,0.0001783578,0.0000161885,0.00029440757,0.00014694518],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000006879931,0.0000436887,0.0010471601,0.00000647441,0.0001932999,0.000011283388,0.00059575954,0.0014651358,0.9927292,0.00061891216,0.0022281012,0.0010541236],"study_design_scores_gemma":[0.0016434381,0.000069441885,0.00037740855,0.000024736511,0.000042145548,0.000013625928,0.00063326466,0.0034263274,0.96738833,0.0012092149,0.024678055,0.0004940257],"about_ca_topic_score_codex":0.00080311723,"about_ca_topic_score_gemma":0.00015278361,"teacher_disagreement_score":0.025340866,"about_ca_system_score_codex":0.0002453913,"about_ca_system_score_gemma":0.000039085473,"threshold_uncertainty_score":0.7017896},"labels":[],"label_agreement":null},{"id":"W2140904634","doi":"10.1145/2024724.2024805","title":"The state-of-the-art in semiconductor reverse engineering","year":2011,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":271,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Chipworks (Canada)","funders":"","keywords":"Reverse engineering; State (computer science); Computer science; Semiconductor; Optoelectronics; Materials science; Operating system; Programming language","score_opus":0.01058364575650305,"score_gpt":0.165514287477925,"score_spread":0.15493064172142193,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2140904634","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9797843,0.00029274405,0.0003664509,0.000034325185,0.00058997684,0.00013315573,0.00000491316,0.00011472683,0.018679375],"genre_scores_gemma":[0.99751145,0.00006262992,0.00014554561,0.000025286885,0.000014719616,0.000007673257,9.409536e-7,0.000020621314,0.002211114],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99933785,0.000013074056,0.0002514068,0.00008933623,0.00009446391,0.00021389146],"domain_scores_gemma":[0.9995788,0.000035660123,0.000023020402,0.00029699897,0.00003586754,0.000029688394],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013979067,0.00011334924,0.00013111427,0.00006678853,0.000026623906,0.000012039997,0.00026377657,0.000041880056,0.00018176768],"category_scores_gemma":[0.000029636743,0.00006376159,0.00008797282,0.0003467621,0.000027086844,0.00009149176,0.00001769156,0.00020746916,0.000034779427],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015915653,0.00007547363,0.006084558,0.00013425903,0.00068657653,0.000024850377,0.009236754,0.029540667,0.88808805,0.011856053,0.044613425,0.009643436],"study_design_scores_gemma":[0.00049958954,0.000034117504,0.0031288175,0.0001340881,0.00008984519,0.000018476056,0.0011300029,0.06609233,0.83563405,0.001227819,0.09130774,0.0007031132],"about_ca_topic_score_codex":0.00019510051,"about_ca_topic_score_gemma":0.0004749905,"teacher_disagreement_score":0.052453972,"about_ca_system_score_codex":0.00004224753,"about_ca_system_score_gemma":0.000013619684,"threshold_uncertainty_score":0.2600122},"labels":[],"label_agreement":null},{"id":"W2142888710","doi":"10.1109/vtest.1995.512647","title":"Detection and location of faults and defects using digital signal processing","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":30,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Resistive touchscreen; Computer science; Digital signal processing; Signal processing; SIGNAL (programming language); Electronic engineering; Simple (philosophy); Current (fluid); Voltage; Digital signal; Electrical engineering; Computer hardware; Engineering; Computer vision","score_opus":0.012883423854795588,"score_gpt":0.18949395019603413,"score_spread":0.17661052634123853,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2142888710","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96095073,0.0007704035,0.03650621,0.0000015490172,0.000009647748,0.000028069599,6.1354984e-7,0.000043633834,0.001689153],"genre_scores_gemma":[0.99984753,0.000015152399,0.000081774975,0.0000032689845,0.0000147228575,5.7723e-7,8.1068396e-7,0.000007399244,0.00002875006],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9997221,0.0000027227534,0.000092041664,0.000070424816,0.00004670493,0.000065991124],"domain_scores_gemma":[0.9998493,0.0000072933803,0.000016139233,0.000029672596,0.000075223295,0.00002234697],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000018650262,0.000058788257,0.00007479258,0.00006869488,0.000028702136,0.000035557234,0.000013005364,0.0000387002,0.0000167581],"category_scores_gemma":[0.0000064298606,0.00005099547,0.0000088106735,0.00022412933,0.000017900566,0.00025133134,0.000002948999,0.0000423806,8.291753e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000018056533,0.000012949159,0.0017179645,0.00020845194,0.000049296046,0.0000010772117,0.000731816,0.007218372,0.64965236,0.00004088364,0.000011575007,0.34035346],"study_design_scores_gemma":[0.00008298145,0.000015228026,0.00019015295,0.000033604778,0.000029765899,0.0000134968595,0.00021243117,0.9501404,0.049135875,0.000030148225,0.00003743823,0.00007845431],"about_ca_topic_score_codex":0.000018807816,"about_ca_topic_score_gemma":0.000016210552,"teacher_disagreement_score":0.94292206,"about_ca_system_score_codex":0.000012980964,"about_ca_system_score_gemma":0.0000022351505,"threshold_uncertainty_score":0.20795348},"labels":[],"label_agreement":null},{"id":"W2143570349","doi":"10.1109/ipfa.2009.5232667","title":"High-temperature Conductive-AFM technique for resolution of soft failures","year":2009,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Transistor; Electrical conductor; Static random-access memory; Optoelectronics; Silicon on insulator; Leakage (economics); Conductive atomic force microscopy; Insulator (electricity); Oxide; Nanotechnology; Silicon; Electrical engineering; Atomic force microscopy; Voltage; Composite material; Engineering","score_opus":0.007598691356578762,"score_gpt":0.21132710038238436,"score_spread":0.2037284090258056,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2143570349","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6661598,0.0018694116,0.3089766,0.0022697744,0.00094171515,0.002740908,0.00029701184,0.0020916953,0.014653108],"genre_scores_gemma":[0.99247086,0.0000119152155,0.0068219556,0.000063454674,0.00007079118,0.00003246437,0.0000558092,0.000017865359,0.00045491173],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993021,0.000012028853,0.00023954935,0.00015488759,0.00009661915,0.00019483644],"domain_scores_gemma":[0.99952435,0.000026130676,0.000032883836,0.00019694323,0.00018124346,0.00003845659],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010658531,0.00015294117,0.00025635603,0.00014941764,0.00004123508,0.000020302072,0.00012107708,0.0001985484,0.000112940324],"category_scores_gemma":[0.000026890308,0.00012386979,0.00012651346,0.0002448273,0.000024200537,0.00014948622,0.000003144958,0.00014871296,0.000003558524],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000064350447,0.000014826198,0.000003285271,0.000019649118,0.00006147424,5.624259e-7,0.00005340163,0.0035972223,0.95323175,0.029814055,0.012834059,0.00036329177],"study_design_scores_gemma":[0.0001961578,0.00010782501,0.000042297874,0.00002643782,0.000056264646,0.0000041769354,0.00014613658,0.0012146056,0.9888643,0.0038373352,0.005311777,0.00019268101],"about_ca_topic_score_codex":0.00006578869,"about_ca_topic_score_gemma":0.000044138647,"teacher_disagreement_score":0.32631102,"about_ca_system_score_codex":0.00004244141,"about_ca_system_score_gemma":0.000016524786,"threshold_uncertainty_score":0.50512636},"labels":[],"label_agreement":null},{"id":"W2143621442","doi":"10.5555/1874620.1874787","title":"Contactless testing: possibility or pipe-dream?","year":2009,"lang":"en","type":"article","venue":"Design, Automation, and Test in Europe","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":33,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Scanimetrics (Canada)","funders":"","keywords":"Printed circuit board; System in package; Wireless; Computer science; Electronic systems; 3d printed; Electronics; Electronic circuit; System testing; Electrical engineering; Embedded system; Engineering; Electronic engineering; Telecommunications; Manufacturing engineering; Chip","score_opus":0.028406822925657077,"score_gpt":0.2300963141229737,"score_spread":0.20168949119731663,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2143621442","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96984667,0.00039484177,0.016477965,0.00017466319,0.00015597016,0.00038503352,0.000016524393,0.0010928968,0.011455419],"genre_scores_gemma":[0.99827874,0.000052402433,0.0011746117,0.00015348653,0.00004868382,0.000004818923,0.000014092059,0.00002033825,0.00025280644],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99902844,0.00006409301,0.00034951756,0.00022130804,0.00011248166,0.00022417052],"domain_scores_gemma":[0.9990865,0.0003940086,0.000044105855,0.00020926178,0.00019429921,0.000071807335],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028501035,0.00018347356,0.00023024992,0.00015142148,0.000072134506,0.00010625103,0.00012010095,0.00007394967,0.00006384964],"category_scores_gemma":[0.0007769535,0.00014516302,0.000021809996,0.00086636795,0.000026290752,0.00022703594,0.0000049161017,0.0001544121,0.00002553045],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008178403,0.0012030422,0.16226661,0.00040055622,0.00025448072,0.0005608535,0.008882801,0.020361364,0.5474432,0.0064086122,0.016803501,0.23533316],"study_design_scores_gemma":[0.0013753192,0.0005934009,0.531807,0.00023649476,0.00012068679,0.00012922296,0.00020610564,0.43346214,0.02383803,0.0017089582,0.0054423986,0.0010802523],"about_ca_topic_score_codex":0.000055013807,"about_ca_topic_score_gemma":0.00004845889,"teacher_disagreement_score":0.52360517,"about_ca_system_score_codex":0.000041564283,"about_ca_system_score_gemma":0.00004926827,"threshold_uncertainty_score":0.5919576},"labels":[],"label_agreement":null},{"id":"W2144901044","doi":"10.1109/dftvs.1995.476935","title":"Wafer-scale integration defect avoidance tradeoffs between laser links and Omega network switching","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Laser; Interconnection; Laser power scaling; Wafer; CMOS; SIGNAL (programming language); Power (physics); Wafer-scale integration; Computer science; Optical switch; Electronic engineering; Materials science; Optoelectronics; Optics; Engineering; Physics; Telecommunications","score_opus":0.013668162413403557,"score_gpt":0.18804043443985619,"score_spread":0.17437227202645264,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2144901044","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9433095,0.0012008662,0.03280914,0.0001953763,0.00019515505,0.00011905275,0.000004611569,0.0004295834,0.021736711],"genre_scores_gemma":[0.99766654,0.0001797014,0.00057294726,0.00016233473,0.00043171766,0.000008315602,0.000017793845,0.000035936286,0.00092470174],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99900347,0.000031628962,0.0002801271,0.00023042118,0.00012539027,0.00032895734],"domain_scores_gemma":[0.9995637,0.00007974624,0.000028237178,0.00019534832,0.000032268326,0.00010069853],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014574511,0.00021824284,0.0002839402,0.0000907337,0.000116844625,0.00010659502,0.00010944664,0.00021679697,0.00029968738],"category_scores_gemma":[0.000011878595,0.00017808018,0.00012193302,0.00033062705,0.000017859353,0.0002477101,0.000010039848,0.00062581873,0.00006840171],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016820271,0.00014345325,0.08617439,0.00025874106,0.0026925663,0.000047601294,0.013877564,0.07437435,0.15848868,0.005316452,0.12792867,0.5306807],"study_design_scores_gemma":[0.0013107626,0.00020145641,0.007364963,0.0003395361,0.00087621686,0.00003607416,0.0013569627,0.88309187,0.057362862,0.0021640866,0.043700535,0.002194694],"about_ca_topic_score_codex":0.000052177453,"about_ca_topic_score_gemma":0.0003483176,"teacher_disagreement_score":0.8087175,"about_ca_system_score_codex":0.000046918318,"about_ca_system_score_gemma":0.0000029092746,"threshold_uncertainty_score":0.7261899},"labels":[],"label_agreement":null},{"id":"W2153491737","doi":"10.1109/dftvs.1995.476958","title":"FFT-based test of a yield monitor circuit","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Fast Fourier transform; Reduction (mathematics); Chip; Voltage; Identification (biology); Computer science; Electronic engineering; Yield (engineering); Factor (programming language); Simple (philosophy); Engineering; Algorithm; Electrical engineering; Mathematics; Materials science; Telecommunications","score_opus":0.024356921793374845,"score_gpt":0.18631495903824324,"score_spread":0.1619580372448684,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2153491737","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.48063886,0.0013219921,0.012767263,0.00026281638,0.0005292403,0.00023316003,0.00006019403,0.0010243704,0.5031621],"genre_scores_gemma":[0.9982714,0.000017592687,0.00011748763,0.000051433777,0.00005482398,0.000005191649,0.0000030089052,0.000019442425,0.0014596131],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994167,0.0000034199754,0.00019946972,0.00009967574,0.00011561916,0.00016511265],"domain_scores_gemma":[0.99956244,0.00009378171,0.000019180292,0.00021624895,0.000058087608,0.000050262457],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000027544882,0.00011170331,0.00017386307,0.00011812591,0.000018623676,0.000015285163,0.00012112405,0.000079814665,0.0046605063],"category_scores_gemma":[0.000044209915,0.00009449476,0.000102249316,0.0002793258,0.000019091347,0.00005574289,0.0000028264733,0.00011217466,0.00015187041],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[5.8267915e-7,0.000101010766,0.0029001425,0.000063162515,0.00013966915,0.000012475125,0.00019853299,0.0023940017,0.9614559,0.0006419367,0.025258878,0.0068337196],"study_design_scores_gemma":[0.0003441788,0.00009950875,0.00031071444,0.00007224456,0.00014037741,0.000006488416,0.00028243446,0.34160092,0.6491082,0.000097010896,0.007462695,0.0004752452],"about_ca_topic_score_codex":0.00008874245,"about_ca_topic_score_gemma":0.00002805805,"teacher_disagreement_score":0.51763254,"about_ca_system_score_codex":0.000023428538,"about_ca_system_score_gemma":0.0000037301777,"threshold_uncertainty_score":0.9962494},"labels":[],"label_agreement":null},{"id":"W2158514380","doi":"10.1109/commad.1996.610086","title":"Ion beam induced intermixing of quantum well heterostructures for optoelectronic applications","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institute for Microstructural Sciences; National Research Council Canada; Western University","funders":"","keywords":"Optoelectronics; Heterojunction; Wafer; Materials science; Band gap; Quantum well; Diode; Laser; Focused ion beam; Ion implantation; Wide-bandgap semiconductor; Ion beam; Ion; Beam (structure); Optics; Physics","score_opus":0.014030290232158635,"score_gpt":0.21312520914028515,"score_spread":0.19909491890812653,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2158514380","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9041956,0.0005913203,0.08436141,0.000039026676,0.00018207506,0.00046454757,0.000017721639,0.00027868233,0.0098696],"genre_scores_gemma":[0.9993977,0.000038647606,0.00015146163,0.000027317852,0.000067469766,0.000063277235,0.000019822528,0.000023470404,0.0002108232],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99936515,0.0000048534166,0.00023332753,0.0001325031,0.00006454936,0.00019960669],"domain_scores_gemma":[0.999652,0.000028346527,0.000034293313,0.00019207103,0.000059843802,0.00003343312],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003712732,0.00011885886,0.00017779828,0.00012242765,0.000039561666,0.000019428888,0.00014088087,0.000084514526,0.0004323869],"category_scores_gemma":[0.0000052860387,0.00010218113,0.00011569833,0.00018183657,0.000013266886,0.00007466997,0.000006042373,0.00011747367,0.000013497229],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000012976138,0.00001471469,0.00002205529,0.000044852946,0.00011747388,9.1912064e-8,0.0001397233,0.0016586513,0.9860025,0.005737741,0.0017276395,0.004533276],"study_design_scores_gemma":[0.00019560059,0.00007136288,0.000016467691,0.000013407858,0.00006197826,0.0000034227667,0.00014460436,0.13722162,0.85330063,0.00089201564,0.007885079,0.00019378867],"about_ca_topic_score_codex":0.000021610767,"about_ca_topic_score_gemma":0.000020221269,"teacher_disagreement_score":0.13556297,"about_ca_system_score_codex":0.000043041975,"about_ca_system_score_gemma":0.000003952623,"threshold_uncertainty_score":0.47343332},"labels":[],"label_agreement":null},{"id":"W2159320170","doi":"10.1109/jlt.2008.927752","title":"Modeling Defect Enhanced Detection at 1550 nm in Integrated Silicon Waveguide Photodetectors","year":2009,"lang":"en","type":"article","venue":"Journal of Lightwave Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":45,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Responsivity; Silicon on insulator; Photodetector; Optoelectronics; Detector; Silicon; Materials science; Sensitivity (control systems); Electronic engineering; Waveguide; Optics; Physics; Engineering","score_opus":0.006276933071066678,"score_gpt":0.20544343152653577,"score_spread":0.1991664984554691,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2159320170","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9828406,0.0008600447,0.014597169,0.00011449576,0.0002913983,0.00009181018,0.0000015231791,0.00021958511,0.0009833912],"genre_scores_gemma":[0.9992724,0.00022581784,0.00030472275,0.00004186584,0.000071444105,0.0000034296518,0.0000019985916,0.000029806022,0.000048487367],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9982756,0.00003690391,0.00089841353,0.00019958992,0.0001929902,0.0003965517],"domain_scores_gemma":[0.999218,0.000028121565,0.00016967302,0.00025351968,0.00025792277,0.000072750576],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028164557,0.00027687073,0.0005891917,0.0018079277,0.000054735923,0.000024533492,0.0002947088,0.0004962469,0.000071598246],"category_scores_gemma":[0.00013275698,0.00022805388,0.0002755429,0.0012650993,0.000033880948,0.00019756165,0.000014890998,0.0009609883,0.000017318169],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029569299,0.000025577003,0.000041095267,0.0000063853754,0.00010749314,0.000052994383,0.000141206,0.029226927,0.95630544,0.000059791328,0.00003135218,0.013972153],"study_design_scores_gemma":[0.0004622068,0.0002891663,0.000026024803,0.000090124726,0.000070784154,0.00020581603,0.00024843257,0.12246081,0.87442553,0.0010837567,0.00041452,0.00022280533],"about_ca_topic_score_codex":0.000035748868,"about_ca_topic_score_gemma":0.0006220791,"teacher_disagreement_score":0.09323388,"about_ca_system_score_codex":0.0006571498,"about_ca_system_score_gemma":0.00003605314,"threshold_uncertainty_score":0.9299767},"labels":[],"label_agreement":null},{"id":"W2163553312","doi":"10.1109/ccece.2000.849698","title":"Impact of technology scaling on bridging fault detections","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Bridging (networking); Scaling; Logic gate; Interconnection; Voltage; Integrated circuit; Electronic engineering; Fault tolerance; Logic synthesis; Electronic circuit; Computer science; Electrical engineering; Engineering; Reliability engineering; Mathematics","score_opus":0.012072581617132717,"score_gpt":0.22283929741315534,"score_spread":0.21076671579602263,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2163553312","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9718566,0.00011233892,0.0044024084,0.00002992616,0.000057898138,0.000030230149,0.000003848003,0.00032726084,0.023179522],"genre_scores_gemma":[0.99955696,0.000028144044,0.00011585136,0.0000071860077,0.000026438727,0.0000026126684,0.0000010563596,0.000014722161,0.00024705767],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9995397,0.000003707091,0.00014804481,0.000088844085,0.000060678198,0.00015906592],"domain_scores_gemma":[0.9997353,0.0000118057715,0.000015762173,0.00016529496,0.000044314173,0.000027512047],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000024114775,0.000093445684,0.00014100221,0.00039358836,0.000034361936,0.000010424405,0.000077241086,0.000088951616,0.00097101205],"category_scores_gemma":[0.00001808401,0.00007324683,0.00012957971,0.00055616867,0.00001851947,0.00004589187,0.0000039343136,0.0001641851,0.00007572464],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000016387432,0.00006952663,0.0025147842,0.000016403084,0.0006641806,0.0000070830533,0.00026581032,0.24826045,0.6107096,0.0018714761,0.004267509,0.1313515],"study_design_scores_gemma":[0.00022139546,0.00013245043,0.0004929608,0.000044532284,0.00007302215,0.000024711031,0.00025039003,0.775668,0.22183464,0.00016360213,0.0007967589,0.00029749627],"about_ca_topic_score_codex":0.00009642938,"about_ca_topic_score_gemma":0.000019148516,"teacher_disagreement_score":0.5274076,"about_ca_system_score_codex":0.00006286654,"about_ca_system_score_gemma":0.000002407659,"threshold_uncertainty_score":0.99994224},"labels":[],"label_agreement":null},{"id":"W2164600273","doi":"10.1109/fpga.1997.624626","title":"Laser defect correction applications to FPGA based custom computers","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Field-programmable gate array; Routing (electronic design automation); Computer science; Limit (mathematics); Laser; Embedded system; Set (abstract data type); Chip; Computer hardware; Optics; Physics; Telecommunications","score_opus":0.012305384966342788,"score_gpt":0.1964800862611355,"score_spread":0.18417470129479271,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2164600273","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0152200395,0.0000617977,0.9009141,0.00016275627,0.000579164,0.00025670868,0.0000068124687,0.0008784548,0.081920184],"genre_scores_gemma":[0.9960275,0.0000048963607,0.0010395902,0.00050894415,0.00008455188,0.000057399608,0.000015863803,0.000020223484,0.002240992],"study_design_codex":"not_applicable","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9995048,0.000009264751,0.00011921181,0.00013689909,0.000078290934,0.0001515534],"domain_scores_gemma":[0.9996455,0.00003219079,0.00000880176,0.00018764196,0.000045051016,0.00008081759],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00003245304,0.00010374036,0.0001056685,0.00014966099,0.000051903953,0.000038466143,0.000087842265,0.000052354746,0.0013715485],"category_scores_gemma":[0.0000033810697,0.0000938367,0.000095767515,0.00044850472,0.0000067455053,0.000055193155,0.000003759133,0.00009780763,0.0010844766],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[8.619353e-7,0.000053519187,0.00013615479,0.0000119367,0.00014350022,0.0000021822732,0.0001631994,0.380344,0.009095438,0.0002193447,0.4830334,0.12679648],"study_design_scores_gemma":[0.00009684548,0.000015287225,0.000026699758,0.000006773731,0.000043172684,0.00000213739,0.000051973504,0.8024742,0.018009795,0.0000054667066,0.17908835,0.00017930013],"about_ca_topic_score_codex":0.000053894786,"about_ca_topic_score_gemma":0.00009171293,"teacher_disagreement_score":0.9808075,"about_ca_system_score_codex":0.00006497748,"about_ca_system_score_gemma":0.0000027157164,"threshold_uncertainty_score":0.9996933},"labels":[],"label_agreement":null},{"id":"W2166862857","doi":"10.1109/iscas.2005.1465432","title":"Characterization of Laser-Induced Photoexcitation Effect on a Surrounding CMOS Ring Oscillator","year":2005,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Photoexcitation; Materials science; Laser; Ring oscillator; Optoelectronics; CMOS; Ring laser; Laser power scaling; Resistor; Characterization (materials science); Optics; Electrical engineering; Physics; Voltage; Nanotechnology; Engineering; Excitation","score_opus":0.009987823674488423,"score_gpt":0.2144442124193661,"score_spread":0.20445638874487768,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2166862857","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9924148,0.000003751666,0.0006091909,0.000016450085,0.00015797559,0.00012318091,0.000005958236,0.0001687738,0.006499945],"genre_scores_gemma":[0.99955195,0.000005596761,0.000049811377,0.000037023605,0.00010963169,0.000010546561,0.00004680327,0.000025353173,0.00016326539],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99930173,0.000026647695,0.00023489285,0.00013146148,0.00014851222,0.00015676575],"domain_scores_gemma":[0.999669,0.000051781448,0.000044934568,0.00014204388,0.00005190597,0.000040299907],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014885572,0.00013850331,0.00020286266,0.0001999622,0.000036468955,0.000030472227,0.0000673555,0.000079725,0.00020128077],"category_scores_gemma":[0.00002539821,0.00011813385,0.00007859844,0.000287218,0.0000059229033,0.00021875632,0.0000036301474,0.00010669554,0.000060225015],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000004939263,0.000008822991,0.00021452583,0.000025855565,0.000054873482,4.6329987e-7,0.00019046929,0.0011885344,0.99104095,0.00023946149,0.000019516601,0.007011598],"study_design_scores_gemma":[0.00021038669,0.00007324021,0.00047758638,0.00004166362,0.000031185384,9.706446e-7,0.00003382847,0.046106834,0.9522988,0.000004231247,0.00058729574,0.0001339597],"about_ca_topic_score_codex":0.000029514413,"about_ca_topic_score_gemma":0.000035674573,"teacher_disagreement_score":0.0449183,"about_ca_system_score_codex":0.00009695581,"about_ca_system_score_gemma":0.0000070584565,"threshold_uncertainty_score":0.48173586},"labels":[],"label_agreement":null},{"id":"W2253032726","doi":"10.5539/apr.v8n1p149","title":"Defect Diffusion Model of InGaAs/InP Semiconductor Laser Degradation","year":2016,"lang":"en","type":"article","venue":"Applied Physics Research","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Materials science; Cladding (metalworking); Optoelectronics; Laser; Indium gallium arsenide; Semiconductor laser theory; Diode; Diffusion; Degradation (telecommunications); Reliability (semiconductor); Semiconductor; Optics; Gallium arsenide; Computer science; Physics; Telecommunications; Composite material","score_opus":0.06371809189327989,"score_gpt":0.2845326598337979,"score_spread":0.22081456794051801,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2253032726","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97755456,0.000041996434,0.012703785,0.000041547028,0.000042134456,0.00018425242,0.00003818917,0.0000926699,0.009300857],"genre_scores_gemma":[0.9989801,0.00011871818,0.0001701481,0.000019707039,0.0000753253,0.00004480111,0.000030602638,0.00005002816,0.00051055977],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984995,0.000040656418,0.00024607868,0.00026083988,0.00054230157,0.00041061494],"domain_scores_gemma":[0.99901944,0.00018344849,0.00003396472,0.00042662062,0.0002502887,0.00008620689],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037255735,0.00016318887,0.00023989873,0.00018819455,0.00008526686,0.000027015612,0.00027011274,0.00010493713,0.000096987416],"category_scores_gemma":[0.0000247525,0.00011375449,0.00011801936,0.00060677587,0.00010261274,0.0001508449,0.000052187424,0.0003218446,0.00013117041],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008500848,0.000034145174,0.00006449476,0.000026626685,0.00008027046,3.2850917e-7,0.00018062608,0.005233092,0.96899223,0.009310191,0.0038347787,0.012234698],"study_design_scores_gemma":[0.0003457791,0.000018068453,0.000014580535,0.000040747098,0.00002340946,2.7433205e-7,0.00011591707,0.062072493,0.9271304,0.009406664,0.00063540717,0.0001962688],"about_ca_topic_score_codex":0.00004425544,"about_ca_topic_score_gemma":0.000013431012,"teacher_disagreement_score":0.0568394,"about_ca_system_score_codex":0.0001266658,"about_ca_system_score_gemma":0.000054619755,"threshold_uncertainty_score":0.46387735},"labels":[],"label_agreement":null},{"id":"W2279809312","doi":"10.1049/pbcs019e_ch5","title":"DFT and BIST techniques for analogue and mixed-signal test","year":2008,"lang":"en","type":"book-chapter","venue":"Institution of Engineering and Technology eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Bottleneck; High fidelity; Built-in self-test; Fidelity; Embedded system; Automatic test equipment; Engineering; Electronic engineering; SIGNAL (programming language); Bandwidth (computing); Mixed-signal integrated circuit; Interface (matter); Chip; Computer science; Computer hardware; Electrical engineering; Integrated circuit; Telecommunications; Reliability engineering; Operating system","score_opus":0.0085849620039667,"score_gpt":0.18058542309676365,"score_spread":0.17200046109279696,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2279809312","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.11579583,0.10405036,0.13556804,0.00053280045,0.0025075588,0.0055117332,0.0031408172,0.014963486,0.61792934],"genre_scores_gemma":[0.9888068,0.0026244519,0.0027765837,0.000009654084,0.00010096412,0.00005866935,0.000046138714,0.0000820158,0.005494752],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.9991955,0.0000011584677,0.00030281,0.00026068324,0.000064663196,0.0001751667],"domain_scores_gemma":[0.9995731,0.000047037003,0.00006152677,0.00016875012,0.00009769165,0.000051887535],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000058056332,0.00031819977,0.00046124405,0.0007826277,0.000077026154,0.00001527779,0.00008361262,0.00072244444,0.0000024382805],"category_scores_gemma":[0.000024865649,0.00031866183,0.00005510486,0.00003858334,0.0003816605,0.000037735652,0.000028844604,0.00037742883,4.200628e-7],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009667049,0.000017734452,0.000106377855,0.0013080774,0.0010422012,0.00007192785,0.00012658788,0.00026078208,0.10906595,0.64386034,0.0012981155,0.24283226],"study_design_scores_gemma":[0.0008284848,0.0005502334,0.000021194053,0.0014710985,0.0006704337,0.00071485434,0.00004441086,0.014551285,0.17410195,0.0069049518,0.7984642,0.00167691],"about_ca_topic_score_codex":0.000009203148,"about_ca_topic_score_gemma":0.000021231133,"teacher_disagreement_score":0.87301093,"about_ca_system_score_codex":0.000030405525,"about_ca_system_score_gemma":0.000023616329,"threshold_uncertainty_score":0.99992657},"labels":[],"label_agreement":null},{"id":"W2280572835","doi":"10.1088/0253-6102/61/5/19","title":"Effects of Density and Thickness of Interlayer on RT Instability of Interfaces","year":2014,"lang":"en","type":"article","venue":"Communications in Theoretical Physics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Geomechanica (Canada)","funders":"","keywords":"Instability; Materials science; Condensed matter physics; Physics; Mechanics","score_opus":0.008646286915264397,"score_gpt":0.2345801377015732,"score_spread":0.22593385078630882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2280572835","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98820084,0.00012373051,0.0073303445,0.00002959242,0.000023046618,0.000072196206,0.0000030248436,0.000012636646,0.0042045596],"genre_scores_gemma":[0.9994511,0.00007668694,0.0004437723,0.000008713427,0.000004286563,0.000004112845,0.0000030222398,0.0000076034416,7.287259e-7],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99938494,0.00015192424,0.00025801416,0.00007248368,0.00006695388,0.00006569932],"domain_scores_gemma":[0.998292,0.00083517015,0.000049505037,0.0007071068,0.00009903678,0.000017133798],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023148015,0.000078102625,0.00026953736,0.000046576042,0.000013240709,0.000003147738,0.00033561248,0.00005657617,0.000005373845],"category_scores_gemma":[0.00020122952,0.00006630116,0.00004457483,0.00018216053,0.0007802023,0.00003646084,0.000087120265,0.00021250862,6.992065e-7],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008757185,0.00013920132,0.0007073045,0.00018395224,0.00004105472,2.3553605e-8,0.001039599,0.00026650788,0.09102903,0.90111035,0.0000035731662,0.0054706107],"study_design_scores_gemma":[0.00021563709,0.0000936564,0.0012478814,0.0002652839,0.00006327539,2.4195253e-7,0.00021615911,0.034203157,0.7590526,0.20452769,0.000012945117,0.00010149299],"about_ca_topic_score_codex":0.000017364504,"about_ca_topic_score_gemma":0.000010759049,"teacher_disagreement_score":0.6965827,"about_ca_system_score_codex":0.00001547024,"about_ca_system_score_gemma":0.0000055278074,"threshold_uncertainty_score":0.2874688},"labels":[],"label_agreement":null},{"id":"W2314077839","doi":"10.31399/asm.cp.istfa2015p0388","title":"Plasma FIB DualBeam Delayering for Atomic Force NanoProbing of 14 nm FinFET Devices in an SRAM Array","year":2015,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Chipworks (Canada); Mediprobe Research (Canada)","funders":"","keywords":"Materials science; Flatness (cosmology); Nanoscopic scale; Static random-access memory; Plasma; Optoelectronics; Electrical conductor; Voltage; Conductive atomic force microscopy; Nano-; Conductivity; Atomic force microscopy; Nanotechnology; Analytical Chemistry (journal); Electrical engineering; Composite material; Chemistry; Engineering","score_opus":0.022900250965041172,"score_gpt":0.24413563686307346,"score_spread":0.2212353858980323,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2314077839","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9918237,0.000088772875,0.006416962,0.00015953954,0.00012408617,0.00027845218,0.00006512718,0.00014103098,0.0009023271],"genre_scores_gemma":[0.98717487,0.000009618098,0.012197928,0.00002719833,0.00016474476,0.00013901334,0.0001281408,0.00004653033,0.00011194536],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99827766,0.0000061852666,0.0006624423,0.0004353874,0.000257717,0.00036063103],"domain_scores_gemma":[0.99850905,0.00018353752,0.00023666138,0.00010443756,0.00082412246,0.00014217186],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00051658,0.00029585985,0.0005361687,0.0006618863,0.00009436051,0.00020352936,0.0003221137,0.0001640924,0.000005098317],"category_scores_gemma":[0.00033551626,0.00028851602,0.00022485443,0.00092025317,0.000040772567,0.0006472085,0.000025509491,0.0001655077,8.235237e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009185643,0.00012603382,0.14550805,0.0004457915,0.0037415843,0.0000018247584,0.004999352,0.14822902,0.6913539,0.0020054362,0.00042091392,0.0030762493],"study_design_scores_gemma":[0.001161109,0.0002097053,0.000545938,0.0001780224,0.001346483,0.000013909173,0.0014235731,0.9527662,0.039029077,0.0011774566,0.0015769774,0.0005715588],"about_ca_topic_score_codex":0.00016114778,"about_ca_topic_score_gemma":0.0005305049,"teacher_disagreement_score":0.8045372,"about_ca_system_score_codex":0.000145836,"about_ca_system_score_gemma":0.000031151703,"threshold_uncertainty_score":0.9999567},"labels":[],"label_agreement":null},{"id":"W2314806106","doi":"10.1109/tcpmt.2015.2512985","title":"Effect of Bond Geometry on Shear Strength and HTS Reliability for Au Ball Bond on Al Pad","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Innovation, Science and Economic Development Canada","keywords":"Materials science; Bond strength; Bond; Piezoresistive effect; Composite material; Structural engineering; Adhesive; Engineering","score_opus":0.0070798529946751775,"score_gpt":0.21885552709643177,"score_spread":0.2117756741017566,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2314806106","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9758528,0.00003149645,0.022590606,0.0004735373,0.00031491314,0.0002411709,0.00008683914,0.00032204916,0.000086611675],"genre_scores_gemma":[0.99954844,0.00008647209,0.00019015254,0.000030265965,0.000016206022,0.00003745154,0.000003722978,0.000036235968,0.00005105203],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988061,0.000028290331,0.00026791604,0.00040900192,0.00013095033,0.00035771597],"domain_scores_gemma":[0.99904376,0.00041845464,0.000051018487,0.00038552392,0.000022852006,0.0000783985],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002130935,0.00029671143,0.0004202779,0.00067464955,0.0001563975,0.000016853448,0.00012939378,0.00023048486,0.000010517326],"category_scores_gemma":[0.000014089315,0.00020993143,0.00010651643,0.00011636912,0.00014860001,0.000069607406,0.0000027466135,0.00034878214,0.0000051762686],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006911659,0.0004411463,0.00073934474,0.0007203396,0.0010403757,0.000015194103,0.00026110755,0.0063416814,0.46245435,0.0005193406,0.00073530327,0.5260406],"study_design_scores_gemma":[0.0011547414,0.00081879454,0.0002928484,0.00022906599,0.00010562185,0.000009358615,0.000028904205,0.001058243,0.99443734,0.0003022819,0.0013187277,0.00024406472],"about_ca_topic_score_codex":0.000056494544,"about_ca_topic_score_gemma":0.000017191811,"teacher_disagreement_score":0.53198296,"about_ca_system_score_codex":0.00011601121,"about_ca_system_score_gemma":0.000007205892,"threshold_uncertainty_score":0.8560755},"labels":[],"label_agreement":null},{"id":"W2321462866","doi":"10.1017/s1551929513000941","title":"A Modest Proposal for the Propagation of Information Concerning Radiation Damage in the TEM, and as Fodder for Pasturized Professors","year":2013,"lang":"en","type":"article","venue":"Microscopy Today","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Radiation damage; Ionization; Displacement (psychology); Materials science; Radiation; Irradiation; Atomic physics; Chemistry; Optics; Physics; Nuclear physics; Ion","score_opus":0.010113782118050325,"score_gpt":0.24762394360820877,"score_spread":0.23751016149015844,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2321462866","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9610168,0.00016979937,0.03480731,0.0007953247,0.00011308546,0.0027600867,0.000026802536,0.000032686698,0.0002781078],"genre_scores_gemma":[0.99814546,0.000018478406,0.00089341623,0.00009199952,0.000033179207,0.0006764126,0.000078906305,0.000011040767,0.000051097948],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994389,0.000028981745,0.0002507446,0.00006907185,0.00007502435,0.0001372858],"domain_scores_gemma":[0.99954706,0.00013993413,0.00007898965,0.00011020409,0.00011214896,0.0000116740575],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00031221204,0.00009485434,0.00012238667,0.00006726554,0.00009195521,0.00009449445,0.00010477042,0.00006538285,0.000013663861],"category_scores_gemma":[0.00006350569,0.000053688393,0.00003860261,0.00012922905,0.000033210395,0.00043395333,0.000005165255,0.00009548519,0.0000032304317],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006128432,0.000036100628,0.0011848653,0.0004851165,0.00016456089,1.0069697e-7,0.032048047,0.009306612,0.9268056,0.0066544614,0.007066068,0.016187195],"study_design_scores_gemma":[0.0021478927,0.000232279,0.0027349996,0.000118324926,0.00017014948,0.0000029709574,0.009854614,0.67289144,0.30100396,0.0023007991,0.008222752,0.00031979042],"about_ca_topic_score_codex":0.00018621371,"about_ca_topic_score_gemma":0.000059585247,"teacher_disagreement_score":0.6635848,"about_ca_system_score_codex":0.000029022916,"about_ca_system_score_gemma":0.000037322912,"threshold_uncertainty_score":0.21893491},"labels":[],"label_agreement":null},{"id":"W2337755335","doi":"10.31399/asm.cp.istfa2015p0378","title":"Analysis Approach on DMOS Transistor Vth Mismatch Due to Trapped Charges","year":2015,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Transistor; Threshold voltage; Voltage; Sense (electronics); Static induction transistor; Electrical engineering; Materials science; Multiple-emitter transistor; Optoelectronics; Electronic engineering; Engineering","score_opus":0.024177131240257665,"score_gpt":0.2287427077559361,"score_spread":0.20456557651567844,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2337755335","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.90413976,0.00022124765,0.062039543,0.0034674243,0.0003710054,0.00084725575,0.0004709639,0.0011032716,0.027339524],"genre_scores_gemma":[0.9890205,0.000009665817,0.009489558,0.00020222925,0.00030812522,0.00018999528,0.000287063,0.00005639605,0.00043643184],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9976525,0.0000114202585,0.0005921117,0.0007239677,0.0005602657,0.00045978752],"domain_scores_gemma":[0.9981799,0.00012974325,0.00013648186,0.00017832188,0.0009790318,0.00039649772],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005138754,0.00044700506,0.00084274064,0.0014934249,0.0001680818,0.00036803537,0.00043926283,0.00018929092,0.00002865649],"category_scores_gemma":[0.00024188719,0.0004075013,0.0005982557,0.0038693054,0.000041673957,0.00027469118,0.000021939757,0.00025443465,0.000008647665],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040294326,0.0008100465,0.11718305,0.00057231914,0.13178982,0.00002668258,0.025538884,0.5470757,0.13176428,0.007638313,0.028991744,0.008206226],"study_design_scores_gemma":[0.0009792445,0.00027265702,0.0010816248,0.000053903397,0.018515216,0.000025378633,0.0026179887,0.95663697,0.0045308587,0.00031547088,0.01370363,0.0012670726],"about_ca_topic_score_codex":0.00022837175,"about_ca_topic_score_gemma":0.00008260459,"teacher_disagreement_score":0.40956125,"about_ca_system_score_codex":0.00019689003,"about_ca_system_score_gemma":0.000021750697,"threshold_uncertainty_score":0.9998377},"labels":[],"label_agreement":null},{"id":"W2342102170","doi":"10.31399/asm.cp.istfa2015p0065","title":"How Xe and Ga FIB Differ in Inducing Lateral Damage on TEM Samples","year":2015,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Oxford Instruments (Canada)","funders":"","keywords":"Focused ion beam; Materials science; Ion beam; Beam (structure); Polishing; Lamella (surface anatomy); Amorphous solid; Ion; Ion beam deposition; Beam energy; Optics; Composite material; Chemistry; Crystallography; Physics","score_opus":0.029491289190048318,"score_gpt":0.22524775634876473,"score_spread":0.19575646715871642,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2342102170","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9962739,0.0000789155,0.00037942952,0.0014096281,0.0000858308,0.00012556855,0.00004591187,0.0001370959,0.0014637155],"genre_scores_gemma":[0.99753886,0.000019653173,0.0017231789,0.00007406179,0.00019656602,0.0000432299,0.000071643255,0.000032334185,0.00030045642],"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99873126,0.0000071215964,0.00030306107,0.00041278853,0.00025238952,0.00029335654],"domain_scores_gemma":[0.9991885,0.00014328053,0.00009207003,0.00008051599,0.00035518344,0.00014048556],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028300352,0.0002725427,0.00038992276,0.0006110437,0.000088494184,0.000546172,0.00017739717,0.0001331013,0.0000056774784],"category_scores_gemma":[0.00032268968,0.00023903348,0.00011181559,0.00074475,0.00004228532,0.00041291252,0.000036006528,0.00024404154,9.973571e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005755565,0.00010234584,0.83080596,0.00019712039,0.0035787227,0.00001289141,0.00465749,0.009746899,0.13980377,0.0051489105,0.0024767483,0.0034115873],"study_design_scores_gemma":[0.002545361,0.00037482663,0.03443094,0.00044164094,0.002549855,0.000051146653,0.004198251,0.927484,0.012517021,0.003077585,0.010621888,0.0017075363],"about_ca_topic_score_codex":0.00021778392,"about_ca_topic_score_gemma":0.0001352692,"teacher_disagreement_score":0.91773707,"about_ca_system_score_codex":0.00011805114,"about_ca_system_score_gemma":0.000009622023,"threshold_uncertainty_score":0.9747502},"labels":[],"label_agreement":null},{"id":"W2344203009","doi":"10.5539/apr.v8n3p66","title":"Predictive Reliability Model of 10G/25G Mesa-Type Avalanche Photodiode Degradation","year":2016,"lang":"en","type":"article","venue":"Applied Physics Research","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Avalanche photodiode; APDS; Reliability (semiconductor); Degradation (telecommunications); Mesa; Optoelectronics; Dark current; Computer science; Materials science; Physics; Telecommunications; Photodetector; Detector","score_opus":0.058770833125325536,"score_gpt":0.29121137990367457,"score_spread":0.23244054677834902,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2344203009","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8895863,0.000062041705,0.05754036,0.000049779654,0.00007911794,0.0004738523,0.00010836249,0.00017883739,0.0519213],"genre_scores_gemma":[0.9989402,0.000117122334,0.0002906125,0.0000061766086,0.00008297922,0.000058345217,0.00003329422,0.00003743319,0.00043378465],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998379,0.000053029216,0.00026547702,0.0002989341,0.00060568104,0.00039788682],"domain_scores_gemma":[0.9985542,0.00021171515,0.000034924145,0.00055089936,0.0005634238,0.00008483337],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00059566,0.00015638157,0.00026351886,0.00011850155,0.00007429755,0.00001963907,0.00029385235,0.00013002985,0.000085706],"category_scores_gemma":[0.00005286995,0.000110998524,0.00008000069,0.0006951809,0.00016384464,0.00014310416,0.00004292061,0.00036698589,0.00009543749],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004003845,0.000053724776,0.00012058654,0.000045689892,0.00012267353,3.3700059e-7,0.00035464924,0.03367771,0.9429947,0.013298123,0.0027698711,0.006521855],"study_design_scores_gemma":[0.00030451722,0.00003935015,0.000044447537,0.000029077974,0.00003177939,2.0670483e-7,0.00013159153,0.20218146,0.77139264,0.02531256,0.0003572619,0.0001751156],"about_ca_topic_score_codex":0.000054058506,"about_ca_topic_score_gemma":0.000008228231,"teacher_disagreement_score":0.17160212,"about_ca_system_score_codex":0.00018788478,"about_ca_system_score_gemma":0.00010458153,"threshold_uncertainty_score":0.45263883},"labels":[],"label_agreement":null},{"id":"W2356696037","doi":"10.31399/asm.cp.istfa2015p0035","title":"Combinational Logic Analysis Using Laser Voltage Probing","year":2015,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Waveform; Combinational logic; Debugging; Truth table; Logic gate; Laser; Computer science; Electronic engineering; Voltage; State (computer science); Electrical engineering; Engineering; Algorithm; Physics; Optics","score_opus":0.03240336515866919,"score_gpt":0.24797194382771995,"score_spread":0.21556857866905077,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2356696037","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8875792,0.000274857,0.094143264,0.00083926966,0.00046591935,0.00056606915,0.00026809826,0.0009717125,0.014891622],"genre_scores_gemma":[0.9907175,0.000008823867,0.008173941,0.00008997499,0.00023283575,0.00005543624,0.00024880547,0.000040452083,0.0004322834],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99802065,0.000008857532,0.00056980207,0.0005260943,0.0004841728,0.00039042078],"domain_scores_gemma":[0.9977525,0.00014666248,0.00020437701,0.00012083682,0.0015561825,0.00021943045],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005459935,0.00035065468,0.0005889769,0.0010652608,0.00024279847,0.0005436002,0.000327309,0.00016880898,0.00004620645],"category_scores_gemma":[0.0003196197,0.00033162138,0.000448368,0.0034351333,0.00006828397,0.00053370354,0.000050913426,0.00022744293,0.000003846546],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000037396774,0.00023731982,0.20837374,0.00018085644,0.054775447,0.000012131364,0.0026620883,0.62297904,0.09637489,0.009176657,0.0039483593,0.0012420774],"study_design_scores_gemma":[0.0004720428,0.00004685975,0.0003673196,0.000021543194,0.011109029,0.0000145674285,0.00080024457,0.9819873,0.001323407,0.0019142032,0.0014586205,0.00048484228],"about_ca_topic_score_codex":0.00028515793,"about_ca_topic_score_gemma":0.000087623885,"teacher_disagreement_score":0.35900828,"about_ca_system_score_codex":0.00024706032,"about_ca_system_score_gemma":0.00003046462,"threshold_uncertainty_score":0.9999136},"labels":[],"label_agreement":null},{"id":"W2411345932","doi":"10.1385/1-59745-214-9:91","title":"Optimization of Cardiac Troponin I Pull-Down by IDM Affinity Beads and SELDI","year":2006,"lang":"en","type":"article","venue":"Humana Press eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Queen's University","funders":"National Heart, Lung, and Blood Institute; Johns Hopkins University","keywords":"Troponin I; Cardiac muscle; Medicine; Cardiac myocyte; Chemistry; Myocyte; Cardiology; Internal medicine; Myocardial infarction","score_opus":0.009303427460315726,"score_gpt":0.18595033182871018,"score_spread":0.17664690436839445,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2411345932","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.56770456,0.02901309,0.01024628,0.0000150636015,0.00044793173,0.0006064566,0.0003235343,0.00068841776,0.39095467],"genre_scores_gemma":[0.9978039,0.00023183359,0.00028170133,0.000007813781,0.000075606345,0.000014622945,0.00008685567,0.000030081403,0.0014675689],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99929166,0.00003301488,0.0002419825,0.00015341288,0.00010587167,0.00017407979],"domain_scores_gemma":[0.9996423,0.000022191825,0.00004699632,0.00018531193,0.000066497596,0.000036709724],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000078333665,0.00014923878,0.00026502516,0.000069218346,0.0000559131,0.000044532702,0.0000923127,0.00010113115,0.00003546072],"category_scores_gemma":[0.0000052728,0.00014278441,0.00007689001,0.00002854848,0.00005029793,0.000064644286,0.000013360601,0.0001248302,9.327232e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029464278,0.00013543415,0.00030077188,0.00040945073,0.0015947255,0.000008075308,0.0023236207,0.4489702,0.32395938,0.04939102,0.119748846,0.053128995],"study_design_scores_gemma":[0.0010656827,0.0001412934,0.00028724765,0.00014984868,0.0011678431,0.0000054202364,0.000406227,0.18438005,0.6536489,0.00039763947,0.15686151,0.001488322],"about_ca_topic_score_codex":0.0014644545,"about_ca_topic_score_gemma":0.00006750288,"teacher_disagreement_score":0.43009934,"about_ca_system_score_codex":0.00003370994,"about_ca_system_score_gemma":0.000005901264,"threshold_uncertainty_score":0.5822579},"labels":[],"label_agreement":null},{"id":"W2467562523","doi":"10.31399/asm.cp.istfa2015p0344","title":"Tester Assisted Multiple Emission Microscopy","year":2015,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Iddq testing; Microscopy; Materials science; Atomic force microscopy; Current (fluid); Computer science; Nanotechnology; Optoelectronics; Optics; Engineering; Electrical engineering; Physics; CMOS","score_opus":0.02614856157457974,"score_gpt":0.2472140759193491,"score_spread":0.22106551434476937,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2467562523","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9771619,0.00028766354,0.008222741,0.0012946146,0.0004564975,0.00034186925,0.0001221488,0.0008171892,0.011295371],"genre_scores_gemma":[0.9882986,0.000012430484,0.0103990575,0.00008771144,0.00026789206,0.00005976631,0.00012979117,0.00004241382,0.00070236396],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9985581,0.0000053828,0.0004243804,0.00040608944,0.00029419494,0.0003118392],"domain_scores_gemma":[0.9983943,0.00015307928,0.00012336315,0.00010226497,0.0010038862,0.00022307648],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00029424188,0.00028312748,0.00037767738,0.0004101857,0.0001343968,0.00036041494,0.00026276754,0.00015535693,0.000017716537],"category_scores_gemma":[0.00051247014,0.00025133078,0.00021705443,0.0010130901,0.000045453617,0.0003667759,0.000036975835,0.00018796859,0.000006579545],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032499007,0.00007275323,0.24269629,0.00008318471,0.0034851711,0.0000030774895,0.000947353,0.0030477925,0.7335973,0.0002189666,0.013774263,0.0020414009],"study_design_scores_gemma":[0.0016452393,0.00016551842,0.0026875108,0.00014366435,0.0038849767,0.00006566967,0.0015150872,0.89801544,0.043202873,0.00068593526,0.04688779,0.0011002865],"about_ca_topic_score_codex":0.00012975841,"about_ca_topic_score_gemma":0.000038113016,"teacher_disagreement_score":0.8949677,"about_ca_system_score_codex":0.00013401038,"about_ca_system_score_gemma":0.000019075533,"threshold_uncertainty_score":0.9999939},"labels":[],"label_agreement":null},{"id":"W2468337332","doi":"10.7567/ssdm.2012.e-8-4","title":"Low frequency noise assessment of accumulation Si p-MOSFETs","year":2012,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hatch (Canada)","funders":"","keywords":"Materials science; Infrasound; MOSFET; Optoelectronics; Noise (video); Electronic engineering; Engineering physics; Electrical engineering; Acoustics; Transistor; Computer science; Engineering; Physics; Artificial intelligence; Voltage","score_opus":0.02181414451700267,"score_gpt":0.2777039832780138,"score_spread":0.2558898387610111,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2468337332","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8912239,0.00012749729,0.018380078,0.000015303662,0.00025693313,0.0000673269,0.0000054116776,0.00012826386,0.089795284],"genre_scores_gemma":[0.9983033,0.000017018525,0.0013677926,0.0000208895,0.00007812914,0.0000043065675,0.000023501565,0.00001463898,0.00017040898],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99941385,0.00001187586,0.0002049354,0.000064488966,0.00012328329,0.00018156003],"domain_scores_gemma":[0.99966943,0.000019614123,0.00002607186,0.00016721908,0.00006163161,0.00005600522],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000104634615,0.000094624695,0.00014253121,0.00008469606,0.00001728435,0.000010663468,0.000070664,0.00006721967,0.0012103433],"category_scores_gemma":[0.000007877567,0.00007765774,0.000069214446,0.00017956719,0.00000928478,0.00027068675,0.0000049007167,0.000089033114,0.000032954915],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[5.3502106e-7,0.0000911911,0.050694518,0.00006548934,0.0002173771,7.3124124e-7,0.00038027883,0.014899216,0.9062109,0.022107845,0.0013899405,0.0039419653],"study_design_scores_gemma":[0.0007009838,0.00006923987,0.13080785,0.00008975826,0.0003518991,0.000007493653,0.0006568184,0.37662148,0.48554257,0.00074936176,0.003422157,0.0009803872],"about_ca_topic_score_codex":0.00008496131,"about_ca_topic_score_gemma":0.000019601168,"teacher_disagreement_score":0.42066833,"about_ca_system_score_codex":0.000055262713,"about_ca_system_score_gemma":0.000011318144,"threshold_uncertainty_score":0.9997027},"labels":[],"label_agreement":null},{"id":"W2469528592","doi":"10.31399/asm.cp.istfa2015p0092","title":"Circuit Tracing on Integrated Circuit Using FIB Passive Voltage Contrast Effect","year":2015,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Tracing; Integrated circuit; Computer science; Voltage; Layer (electronics); Circuit extraction; Electronic circuit; Electronic engineering; Materials science; Electrical engineering; Optoelectronics; Equivalent circuit; Engineering; Nanotechnology","score_opus":0.02634199767551785,"score_gpt":0.2373215922635275,"score_spread":0.21097959458800966,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2469528592","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9551191,0.00015175325,0.0319036,0.00021939714,0.0005021937,0.0005443287,0.00020726098,0.000702375,0.0106500145],"genre_scores_gemma":[0.9983412,0.000010311967,0.00066187995,0.00008673162,0.00041038042,0.000081392645,0.00015466969,0.000075520176,0.00017788561],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9976941,0.000016514878,0.00062687043,0.0006424811,0.00049939065,0.00052064366],"domain_scores_gemma":[0.99773747,0.00038008133,0.00023782671,0.00014554859,0.0012103481,0.00028872426],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00054073735,0.00051863305,0.0007454739,0.0007927832,0.00022869368,0.0005166042,0.00035655702,0.00024309425,0.000031524945],"category_scores_gemma":[0.0008105453,0.00046001349,0.00038791634,0.001577376,0.00007604645,0.00054640434,0.000028156881,0.00043036384,0.000008648756],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017871373,0.00023644001,0.11977146,0.00045723427,0.022500787,0.00004707902,0.004585623,0.09636665,0.726308,0.009043712,0.0039128424,0.016591467],"study_design_scores_gemma":[0.0018474215,0.00047405754,0.00036064925,0.00035610748,0.0059285206,0.00008399835,0.0016933477,0.95970213,0.023727516,0.001210426,0.0033639674,0.0012518796],"about_ca_topic_score_codex":0.00033630483,"about_ca_topic_score_gemma":0.000038893762,"teacher_disagreement_score":0.86333543,"about_ca_system_score_codex":0.00041757323,"about_ca_system_score_gemma":0.00003979112,"threshold_uncertainty_score":0.9997852},"labels":[],"label_agreement":null},{"id":"W2471460436","doi":"10.31399/asm.cp.istfa2013p0118","title":"Implications of Helium and Neon Ion Beam Chemistry for Advanced Circuit Editing","year":2013,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Neon; Sputtering; Etching (microfabrication); Ion beam; Helium; Focused ion beam; Optoelectronics; Deposition (geology); Materials science; Ion source; Ion; Dielectric; Nanotechnology; Engineering physics; Chemistry; Atomic physics; Thin film; Argon; Physics","score_opus":0.010046327814964243,"score_gpt":0.211632194153473,"score_spread":0.20158586633850878,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2471460436","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9797799,0.00024663162,0.012714902,0.0014786067,0.00011049185,0.0005475237,0.00018596023,0.00023723676,0.0046987436],"genre_scores_gemma":[0.9955185,0.000034398392,0.0034888692,0.000030924377,0.00026473086,0.00030853754,0.00013550471,0.000029617426,0.00018893287],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988633,0.0000015081998,0.00042865082,0.00033526678,0.00013331721,0.00023796553],"domain_scores_gemma":[0.99838,0.00018674378,0.0001900183,0.000081069426,0.0010722476,0.00008988615],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014871723,0.00020429149,0.00033407458,0.00019381955,0.00014366761,0.00015889613,0.00017245294,0.000113791255,0.000028977365],"category_scores_gemma":[0.00026394913,0.00020051558,0.00017404403,0.00051499926,0.000049437458,0.00034131086,0.000023299255,0.00011049549,6.175276e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000033747742,0.000019394409,0.014692515,0.00025996412,0.0011934354,4.349912e-8,0.00027733267,0.0014724671,0.9767048,0.0006334349,0.000695931,0.0040473435],"study_design_scores_gemma":[0.001883672,0.00022653742,0.00480967,0.00037409607,0.006185739,0.000046885685,0.0041945092,0.62504596,0.3363524,0.012011909,0.0073892456,0.0014793498],"about_ca_topic_score_codex":0.000084686595,"about_ca_topic_score_gemma":0.000008568477,"teacher_disagreement_score":0.64035237,"about_ca_system_score_codex":0.000052146028,"about_ca_system_score_gemma":0.000008218266,"threshold_uncertainty_score":0.8176788},"labels":[],"label_agreement":null},{"id":"W2501623948","doi":"","title":"High-performance wet cleaning technology","year":2016,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hatch (Canada)","funders":"","keywords":"Environmental science; Computer science; Process engineering; Engineering","score_opus":0.0049386452108319615,"score_gpt":0.16900574857785847,"score_spread":0.1640671033670265,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2501623948","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9759539,0.000048684935,0.00525099,0.0002856746,0.00017556098,0.00002324018,0.0000017815399,0.0007360541,0.01752413],"genre_scores_gemma":[0.9975469,0.00008945878,0.00039742215,0.0000306824,0.00004904053,0.000004739735,0.0000010141503,0.000017593722,0.0018631169],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99952704,0.0000025486468,0.000119919845,0.000099923134,0.000055324374,0.00019523357],"domain_scores_gemma":[0.99974704,0.000010113956,0.000009493184,0.00017568798,0.00003196194,0.0000256939],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003720189,0.00008973914,0.00011245917,0.00016385791,0.000028444385,0.000009613175,0.00012212295,0.00008992039,0.0008994704],"category_scores_gemma":[0.00000723798,0.000052101557,0.000024047113,0.00025886574,0.000024370547,0.00012013422,0.000008632853,0.00007685733,0.00051497313],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000014837409,0.0000066192415,0.0019885662,0.000011367848,0.00013371746,0.0000049047817,0.000046857098,0.00074480294,0.7813934,0.035982344,0.007947996,0.17173791],"study_design_scores_gemma":[0.00031014567,0.000043874654,0.00027399458,0.000054956123,0.000031230247,0.000013388282,0.00016744535,0.004352808,0.9575015,0.0009336299,0.035976164,0.00034086689],"about_ca_topic_score_codex":0.000010878418,"about_ca_topic_score_gemma":0.000013859192,"teacher_disagreement_score":0.17610806,"about_ca_system_score_codex":0.000041285697,"about_ca_system_score_gemma":0.0000049308537,"threshold_uncertainty_score":0.984857},"labels":[],"label_agreement":null},{"id":"W2501772948","doi":"10.1109/iemt.2003.1225870","title":"Unique fiducial designs for CSP singulation process","year":2004,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Fiducial marker; Computer science; Chip-scale package; Chip; Integrated circuit; Ball (mathematics); Physical design; Process (computing); Computer hardware; Embedded system; Circuit design; Artificial intelligence; Mathematics; Programming language","score_opus":0.021197864314747298,"score_gpt":0.248635219714301,"score_spread":0.2274373553995537,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2501772948","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2686676,0.00004430295,0.71387744,0.00011546634,0.0001851321,0.0002526868,0.0000068568274,0.00044963998,0.016400838],"genre_scores_gemma":[0.9976206,0.0000025598752,0.0019249122,0.00005686731,0.00011864478,0.000022627504,0.00002966558,0.000019991396,0.00020416183],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99957407,0.000003171004,0.00012302407,0.00009720791,0.000058618378,0.00014388833],"domain_scores_gemma":[0.99977636,0.0000117581885,0.000011621566,0.000079478734,0.00009030253,0.000030467249],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000054674936,0.000087601955,0.00009677625,0.000069629365,0.000047323647,0.00003052269,0.000060850973,0.00007368987,0.00008468417],"category_scores_gemma":[0.000015882151,0.00007558846,0.000055909284,0.00016064731,0.000008117051,0.00011568292,0.0000012589751,0.00005710488,0.000011205693],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011250271,0.000051153627,0.00009040346,0.00012450335,0.00021250623,0.0000029733958,0.0020904029,0.62764096,0.28439084,0.07635552,0.0018999898,0.0071294857],"study_design_scores_gemma":[0.00086514396,0.000091718226,0.000084029205,0.000047875525,0.00013714634,0.000007097007,0.0004711388,0.05672222,0.8809707,0.05525384,0.004777226,0.00057185383],"about_ca_topic_score_codex":0.000037091362,"about_ca_topic_score_gemma":0.0001178445,"teacher_disagreement_score":0.72895294,"about_ca_system_score_codex":0.00006523568,"about_ca_system_score_gemma":0.000031298307,"threshold_uncertainty_score":0.3082408},"labels":[],"label_agreement":null},{"id":"W2523301604","doi":"10.31399/asm.cp.istfa2014p0210","title":"Feature Based Nondestructive Fault Isolation in Advanced IC Packages","year":2014,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Reflectometry; Fault (geology); Feature (linguistics); Computer science; Isolation (microbiology); Fault detection and isolation; Electronic engineering; Time domain; Feature extraction; Device under test; Engineering; Artificial intelligence; Scattering parameters; Computer vision","score_opus":0.00625808691992033,"score_gpt":0.2104052998299475,"score_spread":0.20414721291002716,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2523301604","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9331239,0.00010954662,0.056558598,0.0022802283,0.00023464364,0.0003691967,0.000074572636,0.00044689604,0.006802458],"genre_scores_gemma":[0.98517716,0.000010079446,0.014220648,0.000081140715,0.00015574509,0.000074108626,0.00012035951,0.000032754022,0.00012799702],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99877524,0.000008456263,0.00029725596,0.00041330166,0.00022727388,0.00027846827],"domain_scores_gemma":[0.99895847,0.00021338052,0.00012817998,0.00008816048,0.0005341856,0.00007762164],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00025977052,0.00026528913,0.0003727419,0.00062290486,0.00011032543,0.00019899919,0.00019979427,0.00016026912,0.000014951639],"category_scores_gemma":[0.00034819936,0.00025057292,0.00018219583,0.0012576814,0.000035907953,0.00038826631,0.000015067443,0.000248304,0.000002010995],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000062757405,0.00008342584,0.3298986,0.00024107209,0.0028322758,0.0000023500347,0.0010589468,0.14478873,0.50331074,0.004706343,0.0013796074,0.011635185],"study_design_scores_gemma":[0.00060064206,0.00006638033,0.0040087444,0.00007516826,0.0007172614,0.0000046653267,0.00030650772,0.9852071,0.005344767,0.0009352863,0.0023498856,0.0003836281],"about_ca_topic_score_codex":0.000061602535,"about_ca_topic_score_gemma":0.00013502636,"teacher_disagreement_score":0.84041834,"about_ca_system_score_codex":0.00011814759,"about_ca_system_score_gemma":0.0000099146355,"threshold_uncertainty_score":0.99999464},"labels":[],"label_agreement":null},{"id":"W2525018093","doi":"10.31399/asm.cp.istfa2013p0243","title":"Physical and Electrical Performance Comparison of Identical 28 nm Qualcomm Telecommunication Die Produced by Samsung and TSMC","year":2013,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Chipworks (Canada)","funders":"","keywords":"Die (integrated circuit); Static random-access memory; Characterization (materials science); Computer science; Competition (biology); Product (mathematics); Manufacturing engineering; Telecommunications; Electrical engineering; Materials science; Engineering; Mechanical engineering; Nanotechnology","score_opus":0.012048445238123958,"score_gpt":0.24543400592034822,"score_spread":0.23338556068222427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2525018093","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99795616,0.00044867708,0.00055921223,0.00044119958,0.000020432806,0.00017703458,0.000012318656,0.000082229075,0.00030274253],"genre_scores_gemma":[0.99792844,0.00013736711,0.001655117,0.000015605254,0.0000801053,0.00006835087,0.000050787843,0.00002175401,0.000042494685],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99876624,0.000009492308,0.00045656486,0.00031890042,0.0002200297,0.00022876868],"domain_scores_gemma":[0.9989214,0.00023467699,0.00015724036,0.00009670381,0.00049379247,0.000096210504],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020528235,0.00021485145,0.00045503682,0.00024107259,0.00014587627,0.00020657186,0.0001952162,0.000094315445,0.0000079098545],"category_scores_gemma":[0.00022073716,0.00019256632,0.00009642632,0.00051250943,0.000092738,0.00041121794,0.000049357237,0.00023244564,0.0000010970069],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000135740165,0.00013550735,0.30368525,0.00018136947,0.0019558072,9.707652e-8,0.0012673333,0.0004847706,0.674677,0.00095363526,0.001111689,0.015533965],"study_design_scores_gemma":[0.00029607984,0.00013049433,0.0066453293,0.000045759454,0.0011252286,0.0000050299905,0.00028609158,0.9619422,0.028659083,0.00021076828,0.00035984168,0.00029411927],"about_ca_topic_score_codex":0.00019220839,"about_ca_topic_score_gemma":0.000014690418,"teacher_disagreement_score":0.96145743,"about_ca_system_score_codex":0.00004302766,"about_ca_system_score_gemma":0.000005730367,"threshold_uncertainty_score":0.78526264},"labels":[],"label_agreement":null},{"id":"W2525739004","doi":"10.1017/s1431927616011612","title":"Characterization of Amorphous Oxide Nano-Thick Layers on 316L Stainless Steel by Electron Channeling Contrast Imaging and Electron Backscatter Diffraction","year":2016,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University; Hôtel-Dieu de Québec; Université Laval","funders":"Centre Hospitalier Universitaire de Québec","keywords":"Materials science; Amorphous solid; Electron backscatter diffraction; X-ray photoelectron spectroscopy; Microstructure; Layer (electronics); Crystallite; Electron; Characterization (materials science); Oxide; Substrate (aquarium); Electron diffraction; Diffraction; Analytical Chemistry (journal); Composite material; Optics; Nanotechnology; Crystallography; Metallurgy; Nuclear magnetic resonance; Chemistry; Physics","score_opus":0.003401369953277212,"score_gpt":0.20328673056972438,"score_spread":0.19988536061644716,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2525739004","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9901648,0.0010817178,0.008151828,0.00022379924,0.00005596675,0.00012160982,0.00009862077,0.000066144865,0.000035473637],"genre_scores_gemma":[0.99726784,0.0019346628,0.000034083572,0.00017101016,0.000042146257,0.000011553631,0.00012995291,0.000050708386,0.00035801838],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99852943,0.00005976167,0.00042195583,0.00041042297,0.00013356203,0.0004448359],"domain_scores_gemma":[0.999376,0.000053646727,0.00015564096,0.00021693941,0.00011028308,0.00008750172],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00018759658,0.00032146944,0.0004889096,0.00033739116,0.00012825067,0.00008979802,0.00010311213,0.00013329936,0.000045694655],"category_scores_gemma":[0.000010891844,0.0002503872,0.0001211712,0.00030491615,0.0000818238,0.00028491902,0.0000140342845,0.00019756153,0.000007007343],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040006253,0.00002797381,0.001333343,0.00004032097,0.0003798615,0.0000013858628,0.00018083473,0.000020911022,0.99573696,0.000015373073,0.00025306814,0.0019699712],"study_design_scores_gemma":[0.00047600377,0.000042167434,0.000698014,0.00009771721,0.00039545924,0.000008805481,0.00015770468,0.0007535234,0.99579287,0.00001509766,0.0012506896,0.0003119519],"about_ca_topic_score_codex":0.00017665619,"about_ca_topic_score_gemma":0.00007192822,"teacher_disagreement_score":0.008117745,"about_ca_system_score_codex":0.00014185061,"about_ca_system_score_gemma":0.00001620749,"threshold_uncertainty_score":0.9999948},"labels":[],"label_agreement":null},{"id":"W2560789330","doi":"10.1017/s143192761600564x","title":"Taking Advantage of Scattering Delocalization To Reduce Radiation Damage In Vibrational or Valence-Loss EELS and Energy-Filtered TEM Images","year":2016,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Valence (chemistry); Delocalized electron; Materials science; Scattering; Radiation; Molecular physics; Atomic physics; Optics; Chemistry; Physics; Quantum mechanics","score_opus":0.00905545461885847,"score_gpt":0.24389336784192292,"score_spread":0.23483791322306444,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2560789330","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.87314385,0.000832114,0.12557277,0.00012026225,0.00004740837,0.00005760285,0.00010249812,0.000034868186,0.00008864745],"genre_scores_gemma":[0.9968332,0.0010076426,0.0017625325,0.000063415435,0.000032780066,0.000011874254,0.00004618654,0.000023107097,0.00021924186],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989242,0.0000441232,0.00042041234,0.0002993449,0.00009715301,0.00021474222],"domain_scores_gemma":[0.99953276,0.00005807939,0.00009997934,0.00017150081,0.00006814217,0.00006953286],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015333208,0.00018944629,0.00032960117,0.00050127186,0.000063577594,0.000063160536,0.00010281591,0.00008403816,0.0001606858],"category_scores_gemma":[0.000034657955,0.0001426158,0.00005888329,0.00058069883,0.000062264124,0.00033290318,0.000028763996,0.000055761444,0.0000019112153],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021396241,0.000011484608,0.0057633407,0.000044093733,0.00011428336,0.000004311586,0.000344173,0.00074812584,0.9692461,0.00008035788,0.00012686144,0.023495486],"study_design_scores_gemma":[0.00036256292,0.000023759887,0.0028068984,0.00018543919,0.00013748654,0.000008627502,0.00024218002,0.0038938194,0.9915531,0.000042720552,0.00050386216,0.00023952556],"about_ca_topic_score_codex":0.00017463714,"about_ca_topic_score_gemma":0.000318034,"teacher_disagreement_score":0.12381023,"about_ca_system_score_codex":0.000070949674,"about_ca_system_score_gemma":0.000019908135,"threshold_uncertainty_score":0.5815703},"labels":[],"label_agreement":null},{"id":"W2563824095","doi":"10.1109/cicc.1998.695038","title":"On-chip analog signal generator for mixed-signal built-in self-test","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Built-in self-test; Signal generator; Computer science; Emphasis (telecommunications); Implementation; Mixed-signal integrated circuit; Generator (circuit theory); Simplicity; Electronic engineering; SIGNAL (programming language); Chip; Process (computing); System on a chip; Analog signal; Analogue electronics; Embedded system; Computer architecture; Computer hardware; Integrated circuit; Electrical engineering; Electronic circuit; Engineering; Digital signal processing; Telecommunications; Power (physics)","score_opus":0.014223748222846565,"score_gpt":0.20269810392581722,"score_spread":0.18847435570297066,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2563824095","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9168839,0.00096080714,0.026397176,0.0002654211,0.0005404593,0.0006247269,0.0001404983,0.0011267926,0.053060215],"genre_scores_gemma":[0.9975449,0.000030848234,0.00088548014,0.00024250848,0.00022394506,0.00005010134,0.000025858812,0.000049545928,0.00094682106],"study_design_codex":"not_applicable","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.998792,0.00001769403,0.00032249693,0.0002760027,0.00015793623,0.00043386137],"domain_scores_gemma":[0.9993857,0.0001892663,0.000024437857,0.00022353005,0.00006580784,0.000111251604],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00011957137,0.00025130677,0.0002941855,0.0002645943,0.00006126456,0.000065531174,0.0002043797,0.0001517651,0.0031513767],"category_scores_gemma":[0.000022422284,0.00021474482,0.00017745329,0.00037075317,0.000014068116,0.00010339218,0.0000070694,0.00022046482,0.00020767197],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017337275,0.0008563472,0.0039144517,0.00017094119,0.0010630446,0.00010806573,0.0009765764,0.08032639,0.3555,0.034339216,0.5045094,0.018218203],"study_design_scores_gemma":[0.00091970124,0.0002093337,0.00012217695,0.000028771128,0.00011312392,0.000009355399,0.00012737617,0.8932302,0.08563561,0.0010081818,0.017913852,0.0006823204],"about_ca_topic_score_codex":0.00004482036,"about_ca_topic_score_gemma":0.0003407113,"teacher_disagreement_score":0.8129038,"about_ca_system_score_codex":0.00010586305,"about_ca_system_score_gemma":0.000011584116,"threshold_uncertainty_score":0.9977599},"labels":[],"label_agreement":null},{"id":"W2576001108","doi":"10.1557/jmr.2016.518","title":"Aberration-corrected self-interference of split higher order Laue zone line for measuring the <i>z</i>-dependent strain profile","year":2017,"lang":"en","type":"article","venue":"Journal of materials research/Pratt's guide to venture capital sources","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Natural Sciences and Engineering Research Council of Canada; University of Victoria","keywords":"Materials science; Optics; Interference (communication); Strain (injury); Line (geometry); Order (exchange); Geometry; Physics; Telecommunications; Mathematics","score_opus":0.0356985176001287,"score_gpt":0.30436725505377527,"score_spread":0.26866873745364656,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2576001108","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99402165,0.0008031909,0.0011542827,0.0012418854,0.0013272013,0.0005518977,0.0002320849,0.000040881932,0.00062691176],"genre_scores_gemma":[0.99619573,0.00011256649,0.0009596933,0.0000347638,0.0011037359,0.000043759464,0.000018671042,0.00005696897,0.0014740939],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9971765,0.00022502492,0.0010287532,0.00023067456,0.000833538,0.0005054543],"domain_scores_gemma":[0.9965935,0.00019225659,0.0004975638,0.00055532716,0.0019788884,0.00018251258],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0028308956,0.00027003413,0.0006119465,0.00027045986,0.0003845785,0.0006988707,0.0011882061,0.000183828,0.0008778737],"category_scores_gemma":[0.0007226382,0.00017565096,0.00018364955,0.00018678252,0.00012044521,0.00040219203,0.00011485663,0.00050433085,0.000026028232],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001672738,0.00009375813,0.000046284666,0.00021602798,0.00066849065,0.000023183573,0.002493137,0.0030657891,0.9763885,0.00044183404,0.015363078,0.0010326441],"study_design_scores_gemma":[0.0011795036,0.0008397032,0.0010300955,0.0006137884,0.00023800637,0.000065009735,0.003115343,0.0007377515,0.956677,0.00041371072,0.034622956,0.00046713764],"about_ca_topic_score_codex":0.00023993597,"about_ca_topic_score_gemma":0.0002033176,"teacher_disagreement_score":0.019711507,"about_ca_system_score_codex":0.00014880238,"about_ca_system_score_gemma":0.00014257761,"threshold_uncertainty_score":0.96121013},"labels":[],"label_agreement":null},{"id":"W2583649081","doi":"10.31399/asm.cp.istfa2016p0382","title":"Patterning in an Imperfect World—Limitations of Focused Ion Beam Systems and Their Effects on Advanced Applications at the 14 nm Process Node","year":2016,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Limiting; Process (computing); Node (physics); Computer science; Imperfect; Dimension (graph theory); Nanotechnology; Process control; Materials science; Computer engineering; Engineering; Mechanical engineering; Mathematics","score_opus":0.0152255067206852,"score_gpt":0.22920511845661737,"score_spread":0.21397961173593216,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2583649081","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99305576,0.00016521897,0.0052218675,0.00046670422,0.00005480075,0.0004384297,0.000065347434,0.00009786667,0.00043399373],"genre_scores_gemma":[0.99890554,0.00004633746,0.000235579,0.000028874794,0.00010306468,0.00051959103,0.00004148947,0.000029201683,0.0000903084],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988574,0.00001209904,0.000382725,0.00036162746,0.00017369408,0.00021246492],"domain_scores_gemma":[0.9982669,0.00092157314,0.00018137725,0.00011490659,0.00045069496,0.00006457261],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002682318,0.00022691934,0.00032971712,0.0004888454,0.00016817069,0.00011437314,0.00020406203,0.00007096825,0.0000030536314],"category_scores_gemma":[0.00019344894,0.00013862157,0.000105956526,0.0008987388,0.00005362534,0.00029529858,0.000022064216,0.00012072722,8.6215283e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040333383,0.00006629078,0.14267659,0.00028925808,0.0014517442,4.6197027e-7,0.0017868044,0.026175423,0.7994754,0.001086331,0.00006813,0.026883265],"study_design_scores_gemma":[0.0046114433,0.00080710184,0.018597953,0.0022466665,0.004115241,0.00003475572,0.004689423,0.6437372,0.31188607,0.0024027657,0.004732733,0.00213861],"about_ca_topic_score_codex":0.00005192641,"about_ca_topic_score_gemma":0.00030041492,"teacher_disagreement_score":0.6175618,"about_ca_system_score_codex":0.00010488878,"about_ca_system_score_gemma":0.000008051092,"threshold_uncertainty_score":0.5652824},"labels":[],"label_agreement":null},{"id":"W2583987622","doi":"10.1016/j.bpj.2016.11.886","title":"RyR2 Tetramer Distributions in Ventricular Myocytes from Phosphomutant Mice","year":2017,"lang":"en","type":"article","venue":"Biophysical Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Ryanodine receptor 2; Ryanodine receptor; Myocyte; Receptor; Chemistry; Phosphorylation; Internal medicine; Cell biology; Biophysics; Endocrinology; Biology; Medicine","score_opus":0.009360563447888912,"score_gpt":0.21898054455880028,"score_spread":0.20961998111091137,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2583987622","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99708855,0.00025044035,0.0013775331,0.00017792526,0.0004009614,0.000033957305,0.000082384126,0.00003601273,0.0005522239],"genre_scores_gemma":[0.9992445,0.00010730811,0.00011572987,0.000017068698,0.00045002106,0.0000024984338,0.000022099593,0.000015564643,0.000025212305],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99916327,0.000017387996,0.00023691676,0.00013193373,0.00017256857,0.00027792007],"domain_scores_gemma":[0.9994649,0.000029319908,0.000070231836,0.0002528609,0.0000566447,0.00012602066],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005802865,0.00014876189,0.00023609347,0.000060601385,0.00023990597,0.0003116863,0.00035686878,0.00008556435,0.00017414076],"category_scores_gemma":[0.000053588,0.00011939536,0.00018630779,0.000114548995,0.000058377896,0.00023733349,0.000019335695,0.00051618554,0.00010274023],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007182995,0.00011686068,0.001876693,0.000004112544,0.0002552878,0.00050737057,0.00009968894,0.00042459954,0.9887332,0.00093031145,0.0016379534,0.0054067383],"study_design_scores_gemma":[0.0014082565,0.000072231,0.05011499,0.0002156828,0.00035072197,0.00011865523,0.00030058672,0.037411787,0.88628966,0.0033742166,0.01941818,0.00092503097],"about_ca_topic_score_codex":0.000256684,"about_ca_topic_score_gemma":0.00002610715,"teacher_disagreement_score":0.10244354,"about_ca_system_score_codex":0.0001268687,"about_ca_system_score_gemma":0.000020495683,"threshold_uncertainty_score":0.48688015},"labels":[],"label_agreement":null},{"id":"W2591188832","doi":"10.31399/asm.cp.istfa2012p0455","title":"Fabrication and Characterization of Helium and Neon Ion Deposited Platinum Wires for Circuit Edit Applications","year":2012,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Materials science; Nanolithography; Ion beam; Focused ion beam; Neon; Platinum; Fabrication; Ion beam-assisted deposition; Deposition (geology); Nanotechnology; Ion; Dielectric; Ion beam deposition; Electrical resistivity and conductivity; Optoelectronics; Ion source; Conductivity; Electrical engineering; Atomic physics; Chemistry; Argon; Physics","score_opus":0.012470268223038133,"score_gpt":0.21561895722000296,"score_spread":0.20314868899696484,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2591188832","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.913786,0.00025100482,0.08416737,0.00035564782,0.000111489746,0.0005593874,0.00018605536,0.0001472635,0.00043577145],"genre_scores_gemma":[0.996217,0.00008153975,0.0024754712,0.000024305042,0.00044326604,0.00026329758,0.000399713,0.000025310546,0.000070110924],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990279,0.0000038258972,0.00037225417,0.00025227093,0.0001414446,0.000202318],"domain_scores_gemma":[0.99884635,0.00014454796,0.00020284737,0.000061572675,0.0006555355,0.000089150744],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020546257,0.00018034385,0.0002781756,0.00034898616,0.00015023562,0.00012376641,0.0000920347,0.00011336646,0.0000040164036],"category_scores_gemma":[0.00010637079,0.00017744632,0.000086203574,0.0005504485,0.000044470336,0.00044941553,0.000018742016,0.00007773841,2.7365422e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009473906,0.000030778774,0.10303768,0.00021012395,0.0009602914,2.204434e-8,0.00073422183,0.00007548765,0.8879292,0.0023900575,0.00008903838,0.004533627],"study_design_scores_gemma":[0.0015514682,0.00025788142,0.052148264,0.0002509741,0.009077209,0.00004681603,0.0014862621,0.7585729,0.15908983,0.0016082407,0.014526627,0.0013835416],"about_ca_topic_score_codex":0.00004719571,"about_ca_topic_score_gemma":0.000009099332,"teacher_disagreement_score":0.7584974,"about_ca_system_score_codex":0.000038498416,"about_ca_system_score_gemma":0.0000051575175,"threshold_uncertainty_score":0.7236051},"labels":[],"label_agreement":null},{"id":"W2594041875","doi":"","title":"Internal probing of mm-wave integrated circuits","year":2002,"lang":"en","type":"article","venue":"International Symposium on Antenna Technology and Applied Electromagnetics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Manitoba","funders":"","keywords":"Amplitude; Electronic circuit; Voltage; Bandwidth (computing); Calibration; Integrated circuit; Materials science; Phase (matter); Electronic engineering; Optics; Optoelectronics; Electrical engineering; Physics; Engineering; Telecommunications","score_opus":0.008121234831297662,"score_gpt":0.18243251027300647,"score_spread":0.1743112754417088,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2594041875","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9219561,0.00058393506,0.0025421402,0.0011514596,0.00034194163,0.00022055965,0.000029374913,0.00054867903,0.072625786],"genre_scores_gemma":[0.998314,0.00065450306,0.00019763874,0.000111852234,0.000051390198,0.0000266626,0.000018968149,0.000034990037,0.00058997236],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99878705,0.000009071122,0.00040146892,0.0002927418,0.00019224119,0.0003174488],"domain_scores_gemma":[0.9994888,0.00003414088,0.000085901636,0.00020893241,0.00013004949,0.000052213407],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000660534,0.00026091991,0.0003041383,0.0006076567,0.000052673433,0.000035859644,0.000308926,0.00028497592,0.0002373422],"category_scores_gemma":[0.000016675707,0.00024216424,0.000070938346,0.000575526,0.00017950636,0.000054310152,0.000031846885,0.00055181363,0.000032091422],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009756084,0.00007733316,0.00011795881,0.000014945039,0.00023676622,0.000011556114,0.00015428339,0.00010296525,0.9341918,0.050993387,0.00044704607,0.013642185],"study_design_scores_gemma":[0.0014907757,0.0009887451,0.00016273695,0.00022282022,0.0001718201,0.00033926134,0.00052816514,0.12978107,0.8486918,0.005636679,0.0110634025,0.00092269096],"about_ca_topic_score_codex":0.0000064690767,"about_ca_topic_score_gemma":0.000007957924,"teacher_disagreement_score":0.1296781,"about_ca_system_score_codex":0.00007488294,"about_ca_system_score_gemma":0.0000060882053,"threshold_uncertainty_score":0.9875171},"labels":[],"label_agreement":null},{"id":"W2604442971","doi":"10.1016/j.micron.2017.03.015","title":"Computer simulations analysis for determining the polarity of charge generated by high energy electron irradiation of a thin film","year":2017,"lang":"en","type":"article","venue":"Micron","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Institute for Nanotechnology; University of Alberta","funders":"National Research Council Canada; University of Alberta; National Institute for Nanotechnology","keywords":"Polarity (international relations); Irradiation; Thin film; Materials science; Charge (physics); Electron; Beam (structure); Phase (matter); Optics; Cathode ray; Optoelectronics; Nanotechnology; Physics; Chemistry; Nuclear physics","score_opus":0.010210325992650444,"score_gpt":0.21894163143918205,"score_spread":0.2087313054465316,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2604442971","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9480538,0.00014211281,0.051321212,0.000034874185,0.000063720334,0.00006505666,0.00025282512,0.000019737161,0.000046705463],"genre_scores_gemma":[0.9991242,0.0000125126435,0.00019868527,0.000023346985,0.000049767612,0.0000042121574,0.00047966334,0.00001297805,0.00009458588],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99941343,0.00002163974,0.00024352562,0.000113283204,0.00006842854,0.00013970427],"domain_scores_gemma":[0.9993583,0.00004196357,0.00015616373,0.00030162957,0.00012409035,0.00001783888],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000090133115,0.00010104574,0.00024234186,0.00011084638,0.00014833137,0.00004272985,0.00019745114,0.000081467966,0.000043701],"category_scores_gemma":[0.000013983904,0.000079269565,0.00014431628,0.00015312963,0.000024221143,0.0000960108,0.0000093568015,0.000067488065,5.9936957e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000051387988,0.00002994945,0.0042821057,0.0000168615,0.0010805642,8.987075e-8,0.00024308123,0.12681456,0.8642787,0.00047054442,0.0017807548,0.0009976601],"study_design_scores_gemma":[0.00018908399,0.000025502284,0.005318402,0.000004368843,0.00041099387,9.296363e-8,0.000004642737,0.7083094,0.28479466,0.000027983733,0.0008287295,0.00008614771],"about_ca_topic_score_codex":0.0009605246,"about_ca_topic_score_gemma":0.0005065797,"teacher_disagreement_score":0.5814948,"about_ca_system_score_codex":0.000034694374,"about_ca_system_score_gemma":0.0000112658,"threshold_uncertainty_score":0.3232519},"labels":[],"label_agreement":null},{"id":"W2605354471","doi":"10.1109/nsrec.2016.7891751","title":"Two Photon Absorption Laser Facility for Single Event Effect Testing","year":2016,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"University of Saskatchewan","funders":"","keywords":"Field-programmable gate array; Absorption (acoustics); Laser; Event (particle physics); Virtex; Two-photon absorption; Event data; Computer science; Photon; Optics; Nuclear engineering; Physics; Engineering; Computer hardware; Real-time computing","score_opus":0.018981471037756766,"score_gpt":0.22850741508472192,"score_spread":0.20952594404696515,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2605354471","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9473011,0.000027052458,0.044665035,0.00002529858,0.0001747467,0.000209253,0.00003819072,0.00034027663,0.0072190706],"genre_scores_gemma":[0.9988006,0.0000015065068,0.00027060532,0.000018842558,0.000059207712,0.000039800096,0.00001372715,0.000013585018,0.0007821651],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99936783,0.000016207707,0.00016973741,0.00015700172,0.00007832648,0.00021089925],"domain_scores_gemma":[0.99949974,0.0002094084,0.000018632856,0.00015376204,0.000072716495,0.00004576626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018850499,0.00012847455,0.00015294297,0.000053526914,0.000037426264,0.000022712375,0.00006347046,0.000052971784,0.00029482678],"category_scores_gemma":[0.00011191384,0.00007615857,0.00010423077,0.0001138703,0.0000114036175,0.000112591464,0.000004972411,0.000046543468,0.00010735868],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000041311373,0.000010284738,0.0005141468,0.000024635812,0.000047364323,5.2740836e-7,0.000017330065,0.0005223484,0.96270865,0.000048423895,0.0004865433,0.035615623],"study_design_scores_gemma":[0.0005111366,0.00010285364,0.000060497754,0.000036287696,0.000052450803,0.000002736819,0.000017029679,0.009749577,0.98559225,0.00020016119,0.0034898757,0.0001851311],"about_ca_topic_score_codex":0.000071030656,"about_ca_topic_score_gemma":0.000076502525,"teacher_disagreement_score":0.051499482,"about_ca_system_score_codex":0.00010879431,"about_ca_system_score_gemma":0.000005555807,"threshold_uncertainty_score":0.32281467},"labels":[],"label_agreement":null},{"id":"W2624449764","doi":"10.1109/vlsi-dat.2017.7939657","title":"Detailed routing violation prediction during placement using machine learning","year":2017,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo; University of Calgary","funders":"","keywords":"Router; Routing (electronic design automation); Computer science; Process (computing); Component (thermodynamics); Placement; Static routing; Reliability engineering; Network routing; Engineering; Physical design; Routing protocol; Computer network; Embedded system; Circuit design","score_opus":0.016053313182333266,"score_gpt":0.22185533239828947,"score_spread":0.2058020192159562,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2624449764","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98131514,0.000048467795,0.0132833235,0.000007921611,0.0002029441,0.00006678265,0.000002803311,0.00029901575,0.0047735907],"genre_scores_gemma":[0.99907345,0.000021416074,0.00031145228,0.000003453353,0.000133382,0.0000031028608,0.00002044763,0.000026098487,0.00040722126],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9992878,0.000015609443,0.00021719211,0.00014715653,0.00012464556,0.00020762472],"domain_scores_gemma":[0.999604,0.000008179465,0.00007371567,0.00022522008,0.000045149805,0.000043763142],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013909076,0.00013173348,0.00013886094,0.000091904294,0.00063554256,0.00019171016,0.00011249856,0.00007180307,0.00026929626],"category_scores_gemma":[0.0000408289,0.00012031857,0.00006380108,0.000051118695,0.000011469984,0.00037623977,0.000022218084,0.00022253362,0.000017341945],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000043416194,0.0000057521347,0.12973471,0.00001995502,0.00013800358,0.000003372383,0.0002863779,0.28340012,0.58588547,0.00010278236,0.000007712256,0.00041138643],"study_design_scores_gemma":[0.0002566971,0.00000803186,0.007059652,0.00003441092,0.00006127962,0.0000051880875,0.00023908322,0.9405754,0.051541504,0.000008361977,0.00007632761,0.00013404455],"about_ca_topic_score_codex":0.00026179038,"about_ca_topic_score_gemma":0.00021764605,"teacher_disagreement_score":0.6571753,"about_ca_system_score_codex":0.00013915004,"about_ca_system_score_gemma":0.0000065145764,"threshold_uncertainty_score":0.49064487},"labels":[],"label_agreement":null},{"id":"W2626541645","doi":"10.1088/1361-6528/aa79ea","title":"Investigating the impact of SEM chamber conditions and imaging parameters on contact resistance of<i>in situ</i>nanoprobing","year":2017,"lang":"en","type":"article","venue":"Nanotechnology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Canada Foundation for Innovation","keywords":"Materials science; Scanning electron microscope; Contact resistance; Vacuum chamber; Nanoprobe; Composite material; Ohm; Optics; Nanotechnology; Optoelectronics; Electrical engineering","score_opus":0.01239390774009053,"score_gpt":0.2505277461302729,"score_spread":0.23813383839018237,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2626541645","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9981756,0.00022282406,0.0000420907,0.00025153506,0.0000419889,0.00009188423,0.000015644408,0.00004722864,0.0011111995],"genre_scores_gemma":[0.9997893,0.000040503863,0.000107062144,0.000016691994,0.0000053982467,0.00000899169,0.0000030486085,0.000014140265,0.000014883763],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99934757,0.000019804018,0.00024241004,0.00013834045,0.0000624755,0.00018943222],"domain_scores_gemma":[0.9992564,0.00009145351,0.00014999394,0.00044277776,0.000040075178,0.000019335586],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014642149,0.0001237263,0.00027519607,0.00017664225,0.00010942288,0.000022425751,0.00018783388,0.00012188533,0.000006126013],"category_scores_gemma":[0.00017136063,0.000088940076,0.00007490744,0.00013435,0.00026433877,0.00009710723,0.000023538558,0.00029735448,0.0000011287484],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000025988275,0.000007906305,0.009042255,0.0000214304,0.00008634639,0.0000062234517,0.0003168285,0.0014413138,0.98381937,0.004255364,0.00010864669,0.0008917256],"study_design_scores_gemma":[0.0005943085,0.00006692073,0.0158876,0.00043684788,0.00006134917,0.000018968689,0.00064578897,0.007932353,0.9686246,0.0053979736,0.00007045731,0.00026284353],"about_ca_topic_score_codex":0.0004387464,"about_ca_topic_score_gemma":0.00044337718,"teacher_disagreement_score":0.015194772,"about_ca_system_score_codex":0.000050949184,"about_ca_system_score_gemma":0.000019342264,"threshold_uncertainty_score":0.3626871},"labels":[],"label_agreement":null},{"id":"W265012073","doi":"10.5006/c2008-08175","title":"Pharmaceutical Surface Defects: Correlation between Microstructural Artifacts and Electropolishing Results","year":2008,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nickel Institute","funders":"","keywords":"Electropolishing; Materials science; Surface (topology); Metallurgy; Corrosion; Chemistry; Electrode; Geometry","score_opus":0.020433240504178243,"score_gpt":0.23563819488667248,"score_spread":0.21520495438249423,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W265012073","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99275655,0.00029358407,0.0011499894,0.000053511838,0.00009318116,0.000063201616,0.000017842478,0.00023389945,0.005338231],"genre_scores_gemma":[0.9990835,0.00012481985,0.0002925585,0.000049451868,0.00009289196,5.3971013e-7,0.000054625896,0.000020263651,0.0002813231],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991502,0.000025198298,0.000241302,0.00017790138,0.000115387076,0.0002900078],"domain_scores_gemma":[0.99962604,0.00008397113,0.000022418597,0.00010968795,0.000046913592,0.00011097526],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000087053304,0.00015265368,0.0001830877,0.000060027494,0.00011983889,0.000051590672,0.000053551095,0.00010797986,0.00006726074],"category_scores_gemma":[0.000037003283,0.00013028648,0.000047860616,0.0002026502,0.00005163313,0.00025953,0.000009677748,0.00030575853,0.000032733195],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039412473,0.00001217798,0.040774047,0.000043032163,0.00044132458,0.000053713364,0.0020867814,0.015319644,0.92324907,0.0008925911,0.011292721,0.00579548],"study_design_scores_gemma":[0.0017983295,0.00009425554,0.035445463,0.000035875146,0.00032134974,0.00031288574,0.00032993572,0.13839602,0.8090765,0.00038715012,0.01273115,0.0010710785],"about_ca_topic_score_codex":0.00010021983,"about_ca_topic_score_gemma":0.000025285086,"teacher_disagreement_score":0.12307638,"about_ca_system_score_codex":0.00006102336,"about_ca_system_score_gemma":0.000012463882,"threshold_uncertainty_score":0.53129286},"labels":[],"label_agreement":null},{"id":"W2742449484","doi":"10.1109/transducers.2017.7994157","title":"A MEMS device for fracture toughness measurement of 2D nano films under TEM imaging","year":2017,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hitachi (Canada); University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Materials science; Microelectromechanical systems; Fracture toughness; Nano-; Composite material; Toughness; Transmission electron microscopy; Thin film; Ultimate tensile strength; Fracture (geology); Scanning electron microscope; Optoelectronics; Nanotechnology","score_opus":0.028296685664148377,"score_gpt":0.24828063478057497,"score_spread":0.2199839491164266,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2742449484","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.46564946,0.004088079,0.399241,0.0030339204,0.0028380447,0.0016693285,0.00012315526,0.0009733791,0.12238363],"genre_scores_gemma":[0.9986991,0.000010981099,0.00065008923,0.0001524281,0.000067969224,0.000021424119,0.000008295461,0.000030748713,0.00035891123],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99913496,0.0000060097846,0.00023713193,0.0001658723,0.0002263196,0.00022970603],"domain_scores_gemma":[0.99904543,0.000022156077,0.00007883969,0.00048363523,0.0003197838,0.00005014934],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021579994,0.00016657423,0.00026109462,0.00006808671,0.00014852856,0.0001008318,0.00031625616,0.00007582337,0.0002806159],"category_scores_gemma":[0.000044615113,0.00012811608,0.0001498335,0.000053239644,0.000026463824,0.00021640063,0.000014479799,0.00010076692,0.000008514295],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000005419776,0.000025799656,0.0005068909,0.00014112215,0.00046575937,0.0000015898455,0.00028007562,0.0061566527,0.970054,0.0010294775,0.018415159,0.0029180937],"study_design_scores_gemma":[0.0007535152,0.000022323342,0.0011488218,0.0001614549,0.00035279486,0.0000054719694,0.0018839671,0.037502628,0.91627604,0.00052830036,0.040808316,0.0005563796],"about_ca_topic_score_codex":0.0003866033,"about_ca_topic_score_gemma":0.00036186347,"teacher_disagreement_score":0.5330497,"about_ca_system_score_codex":0.000059592217,"about_ca_system_score_gemma":0.000028538985,"threshold_uncertainty_score":0.5224422},"labels":[],"label_agreement":null},{"id":"W2743089688","doi":"10.1007/s11082-017-1125-1","title":"A new guard ring for radiation induced noise reduction in photodiodes implemented in 0.18 μm CMOS technology","year":2017,"lang":"en","type":"article","venue":"Optical and Quantum Electronics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"CMOS; Photodiode; Optoelectronics; Noise reduction; Radiation; Materials science; Avalanche photodiode; Reduction (mathematics); Noise (video); Optics; Computer science; Physics; Detector; Artificial intelligence","score_opus":0.016395762861893193,"score_gpt":0.2663964521002865,"score_spread":0.2500006892383933,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2743089688","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9964081,0.00066045526,0.0018664317,0.00039128994,0.00008369714,0.00021174466,0.000002816581,0.000056560653,0.00031892533],"genre_scores_gemma":[0.9990769,0.00044234685,0.00031767762,0.0000071273994,0.000055496224,0.00004011202,0.000014428121,0.000018191804,0.0000277282],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99906087,0.000007729984,0.00025448395,0.0002069559,0.0000640103,0.00040594206],"domain_scores_gemma":[0.999666,0.00001843252,0.00004197501,0.00019503933,0.000029250124,0.000049343078],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015111975,0.0001370563,0.00023169452,0.00024753492,0.00009213057,0.000073259274,0.00012563435,0.00018226271,0.000019219344],"category_scores_gemma":[0.00007660547,0.00013254378,0.000040899227,0.00018044417,0.000021368003,0.00016950573,0.000014429266,0.00031842146,0.0000018898702],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050922445,0.00003888997,0.00090192223,0.00004310992,0.000087072236,0.0000046910345,0.00022710308,0.00048397313,0.8358808,0.07091682,0.0002200638,0.091144614],"study_design_scores_gemma":[0.00386551,0.00056369766,0.002045637,0.00013041425,0.000136406,0.000034401168,0.0006066188,0.4571749,0.501413,0.02649349,0.006761835,0.00077411125],"about_ca_topic_score_codex":0.00019902126,"about_ca_topic_score_gemma":0.0007524044,"teacher_disagreement_score":0.45669094,"about_ca_system_score_codex":0.00015849661,"about_ca_system_score_gemma":0.000056056346,"threshold_uncertainty_score":0.54049784},"labels":[],"label_agreement":null},{"id":"W2745098861","doi":"10.1109/marss.2017.8001945","title":"Experimental investigation of the impact of SEM chamber conditions on the contact resistance of in-situ nanoprobing","year":2017,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Scanning electron microscope; Materials science; Vacuum chamber; Contact resistance; Chamber pressure; Nanoprobe; Electrical contacts; In situ; Silicon; Silicon nanowires; Composite material; Optoelectronics; Nanotechnology; Metallurgy; Chemistry","score_opus":0.020012211712180462,"score_gpt":0.2551444582932371,"score_spread":0.23513224658105666,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2745098861","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97614247,0.000039837036,0.0000042922316,0.000051852272,0.000040119998,0.00009999614,0.000015502079,0.0000070665783,0.023598844],"genre_scores_gemma":[0.99979025,0.000003267668,0.00000639673,0.000009816766,0.000007723215,0.0000058971523,0.0000033429326,0.000007642146,0.00016567102],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995093,0.000025612238,0.00021925845,0.00006442027,0.00009971152,0.000081718856],"domain_scores_gemma":[0.99937,0.000043663622,0.00013577295,0.0003839547,0.000052350944,0.000014253965],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010669459,0.00008103109,0.00016209298,0.000047108126,0.00006369609,0.000012118941,0.00016338384,0.00004191973,0.0001092867],"category_scores_gemma":[0.000028840954,0.000042187563,0.00012317022,0.00008973028,0.00009256446,0.00009802779,0.000011189871,0.00009205964,0.0000011174142],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000003183453,0.000010756304,0.003044595,0.000008635898,0.000074176,2.1067714e-7,0.0009126785,0.00087582256,0.9863325,0.0082912175,0.0004428308,0.000003414128],"study_design_scores_gemma":[0.00012322536,0.000018876508,0.042399917,0.000119553886,0.00001136215,3.540714e-7,0.00056663307,0.00042580251,0.95608187,0.00020131892,0.0000046456116,0.000046438374],"about_ca_topic_score_codex":0.000604898,"about_ca_topic_score_gemma":0.00049687683,"teacher_disagreement_score":0.039355323,"about_ca_system_score_codex":0.000055516644,"about_ca_system_score_gemma":0.000024568046,"threshold_uncertainty_score":0.17203589},"labels":[],"label_agreement":null},{"id":"W2747147820","doi":"10.31399/asm.cp.istfa2017p0095","title":"Acoustic and Photoacoustic Inspection of Through-Silicon Vias in the GHz-Frequency Band","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto; Toronto Metropolitan University","funders":"","keywords":"Interconnection; Through-silicon via; Materials science; Reliability (semiconductor); Silicon; Frequency band; Delamination (geology); Chip; Electronic engineering; Computer science; Optoelectronics; Engineering; Bandwidth (computing); Telecommunications","score_opus":0.017359580806176868,"score_gpt":0.2440274551315761,"score_spread":0.22666787432539923,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2747147820","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99064493,0.0001871965,0.0016322543,0.0005039401,0.00010443957,0.00019971697,0.000040179206,0.00007812075,0.006609208],"genre_scores_gemma":[0.9987781,0.00011421558,0.0008229973,0.000035853824,0.00012517197,0.00005123973,0.000017226748,0.000017689503,0.000037504084],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99891764,0.0000059487343,0.00037313616,0.0002911566,0.00021474065,0.00019738491],"domain_scores_gemma":[0.9990856,0.00018157359,0.00021055601,0.00014552016,0.00034102134,0.00003573955],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000334971,0.0001958892,0.00032814432,0.00025627724,0.0002954109,0.00034068344,0.00033899458,0.00010261538,0.000009492662],"category_scores_gemma":[0.0004557657,0.00015232709,0.00012145574,0.00039489084,0.0001247185,0.00044975244,0.000021874168,0.00019026353,4.4562356e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002226381,0.000086040694,0.28729475,0.00032755843,0.0025913666,0.0000047559874,0.0049643237,0.0072706155,0.69326997,0.0026814537,0.00059564057,0.0008912826],"study_design_scores_gemma":[0.0015308306,0.00025834097,0.04581539,0.00033922694,0.006332377,0.00009318662,0.0052972594,0.91198766,0.018631076,0.008138501,0.0006373638,0.00093881367],"about_ca_topic_score_codex":0.000892277,"about_ca_topic_score_gemma":0.00047840326,"teacher_disagreement_score":0.904717,"about_ca_system_score_codex":0.000049696926,"about_ca_system_score_gemma":0.000008679324,"threshold_uncertainty_score":0.62117183},"labels":[],"label_agreement":null},{"id":"W2750334494","doi":"10.31399/asm.cp.istfa2017p0285","title":"Steps Toward Automated Deprocessing of Integrated Circuits","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":25,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Object Research Systems (Canada)","funders":"","keywords":"Workflow; Automation; Computer science; Bridging (networking); Suite; Embedded system; Node (physics); Computer hardware; Integrated circuit; Instrument control; Operating system; Engineering; Database; Mechanical engineering","score_opus":0.02191401069574563,"score_gpt":0.25438354129949464,"score_spread":0.232469530603749,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2750334494","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9779049,0.00023124828,0.008437966,0.0007038445,0.0003224675,0.0002895442,0.00021749618,0.0011250494,0.010767443],"genre_scores_gemma":[0.9959589,0.000033235992,0.003529838,0.000023476327,0.00013493154,0.000041761617,0.00008810876,0.000042221192,0.0001475235],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99837255,0.0000046006694,0.00057781365,0.00042591072,0.00030106728,0.00031806808],"domain_scores_gemma":[0.997849,0.00010143012,0.00041027073,0.00019109756,0.0013367361,0.000111468915],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003220671,0.00030821547,0.00055970706,0.000485282,0.00036006604,0.00061680214,0.0006081588,0.00017287311,0.00002538879],"category_scores_gemma":[0.0006488907,0.0002811019,0.0002743885,0.0006288514,0.00012490757,0.0006176922,0.000053239102,0.0002063131,0.0000019194583],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002747929,0.00011134279,0.34920284,0.0006503323,0.012571803,0.000006145206,0.0018511304,0.007266819,0.6072879,0.0019100581,0.0018411675,0.017273018],"study_design_scores_gemma":[0.00059794774,0.00006642597,0.0053737573,0.00021531737,0.0030344676,0.000020086733,0.0008191143,0.9620931,0.02480983,0.0004604856,0.001937576,0.00057190115],"about_ca_topic_score_codex":0.0003482277,"about_ca_topic_score_gemma":0.000053692027,"teacher_disagreement_score":0.9548263,"about_ca_system_score_codex":0.00009041198,"about_ca_system_score_gemma":0.000027826438,"threshold_uncertainty_score":0.9999641},"labels":[],"label_agreement":null},{"id":"W2751758248","doi":"10.31399/asm.cp.istfa2017p0446","title":"High Resolution Localization Using Lock-in Based Electron Beam Methods","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Cathode ray; Materials science; Beam (structure); Lock (firearm); Resolution (logic); Electron; Electron beam-induced current; Transistor; Root cause; Optics; Optoelectronics; Image resolution; Computer science; Physics; Electrical engineering; Engineering; Silicon; Voltage","score_opus":0.02120122472125914,"score_gpt":0.2870937120421192,"score_spread":0.26589248732086007,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2751758248","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5966484,0.00017054203,0.39970753,0.0007372797,0.00033187692,0.0003538016,0.000048637696,0.0003189782,0.0016829612],"genre_scores_gemma":[0.95543134,0.000016184282,0.044112798,0.000041332234,0.00019293548,0.000038287366,0.00007945794,0.000034674464,0.00005299822],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99859375,0.000010502312,0.00043829434,0.00041067446,0.00021900311,0.00032776064],"domain_scores_gemma":[0.99885374,0.0001159536,0.0002422772,0.00015757803,0.0005562098,0.000074264964],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005803894,0.000247969,0.00038511294,0.0005952068,0.0004092314,0.0005081957,0.0003311266,0.00016267918,0.00001557032],"category_scores_gemma":[0.0004998868,0.0002484699,0.00018055938,0.0006289333,0.000057683574,0.00049913104,0.000029168452,0.00019580513,8.4737985e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003254708,0.000058773996,0.1072543,0.000121510486,0.0018701187,0.000002221154,0.00022515442,0.52158284,0.36426422,0.0020311186,0.00028268082,0.0022745044],"study_design_scores_gemma":[0.00035419434,0.000032406737,0.0011486296,0.00006471156,0.001026357,0.00000386843,0.00006405188,0.9714716,0.024203742,0.0006878707,0.0006585657,0.00028398246],"about_ca_topic_score_codex":0.0010152169,"about_ca_topic_score_gemma":0.00019793618,"teacher_disagreement_score":0.44988877,"about_ca_system_score_codex":0.00022928,"about_ca_system_score_gemma":0.000019548088,"threshold_uncertainty_score":0.9999968},"labels":[],"label_agreement":null},{"id":"W2752800829","doi":"10.1117/12.2283867","title":"Novel three dimensional masking techniques for integrated photonic devices fabrication using low energy ion implantation induced quantum well intermixing","year":2017,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Sherbrooke","funders":"","keywords":"Ion implantation; Masking (illustration); Heterojunction; Optoelectronics; Materials science; Fabrication; Blueshift; Band gap; Quantum well; Photonics; Ion; Laser; Optics; Photoluminescence; Chemistry; Physics","score_opus":0.02820946859672909,"score_gpt":0.26182764051807494,"score_spread":0.23361817192134585,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2752800829","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5735861,0.000031352483,0.42497987,0.000019071333,0.00034794703,0.00015503907,0.00001406406,0.0002562673,0.000610269],"genre_scores_gemma":[0.99448216,0.000009955727,0.005026835,0.00006482715,0.00014828051,0.000043064018,0.00013594532,0.00005278402,0.000036130736],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99879533,0.000012200474,0.00039627647,0.0003059247,0.00015668542,0.0003335816],"domain_scores_gemma":[0.998994,0.000057174948,0.0002098274,0.00037599803,0.0003065339,0.000056482662],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020477588,0.0002667572,0.00028788525,0.00027160547,0.0004202908,0.00028468238,0.000317332,0.00020083968,0.00005464418],"category_scores_gemma":[0.000044144617,0.00022915495,0.0001343187,0.00013312267,0.000028317574,0.0006220435,0.000035328194,0.0001764421,0.0000042087554],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012244841,0.000020820418,0.0003573797,0.000036825633,0.00012272205,0.000001186815,0.000057010115,0.0013756983,0.98586375,0.0015721775,0.0000643103,0.010515901],"study_design_scores_gemma":[0.00014897902,0.00001864012,0.00025424134,0.00014368232,0.00006370312,0.000011670958,0.00008473988,0.5483253,0.45021474,0.00022140452,0.00029054616,0.0002223354],"about_ca_topic_score_codex":0.0029309955,"about_ca_topic_score_gemma":0.0022751777,"teacher_disagreement_score":0.5469496,"about_ca_system_score_codex":0.00020685355,"about_ca_system_score_gemma":0.00004833933,"threshold_uncertainty_score":0.9344668},"labels":[],"label_agreement":null},{"id":"W2754714077","doi":"10.31399/asm.cp.istfa2017p0390","title":"Practical Dynamic Laser Stimulation Techniques for Complex Analog and Mixed Signal IC Failure Analysis","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Semtech (Canada)","funders":"","keywords":"SIGNAL (programming language); Electronic engineering; Computer science; Fault detection and isolation; Mixed-signal integrated circuit; Integrated circuit; Isolation (microbiology); Reliability engineering; Engineering; Electrical engineering","score_opus":0.02730313060650525,"score_gpt":0.2904327430809753,"score_spread":0.26312961247447003,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2754714077","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.63928086,0.00011160438,0.34700316,0.0077592875,0.0002072465,0.0013756317,0.00085025124,0.0009980776,0.0024138703],"genre_scores_gemma":[0.9464349,0.000028798053,0.0524212,0.00005399055,0.00019981815,0.00016726594,0.0004879121,0.000047206326,0.00015889257],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9979598,0.000010992236,0.00060226006,0.0006829214,0.00033348272,0.0004105596],"domain_scores_gemma":[0.99765635,0.0003926318,0.0004125554,0.00022303448,0.0011467035,0.00016871988],"candidate_categories":["metaepi_narrow","scholarly_communication"],"consensus_categories":[],"category_scores_codex":[0.0005165055,0.00041228966,0.0007374455,0.00091305573,0.0007435298,0.0011152456,0.00036357404,0.00025031058,0.000043680364],"category_scores_gemma":[0.0005486667,0.0003881621,0.0004903655,0.00080946105,0.0001464382,0.0007941642,0.00006971496,0.00025165072,0.0000012035702],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022101468,0.00030599334,0.4294807,0.0006961446,0.0725198,0.000012849428,0.0010498791,0.019470582,0.4428783,0.0061098062,0.010131998,0.017122947],"study_design_scores_gemma":[0.00048473274,0.000109832705,0.008398955,0.00003984323,0.013440621,0.000014688455,0.0002858799,0.96892715,0.0039874935,0.0009807714,0.0027688018,0.00056125486],"about_ca_topic_score_codex":0.00018110334,"about_ca_topic_score_gemma":0.00063643605,"teacher_disagreement_score":0.9494566,"about_ca_system_score_codex":0.000122021214,"about_ca_system_score_gemma":0.00001924652,"threshold_uncertainty_score":0.9999217},"labels":[],"label_agreement":null},{"id":"W2755307068","doi":"10.31399/asm.cp.istfa2017p0574","title":"Precision Xe Plasma FIB Delayering for Physical Failure Analysis of Sub-20 nm Microprocessor Devices","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Polishing; Materials science; Chemical-mechanical planarization; Plasma; Planar; Dielectric; Microprocessor; Optoelectronics; Porosity; Nanotechnology; Computer science; Composite material; Embedded system; Physics","score_opus":0.015034927702998548,"score_gpt":0.25240671998419745,"score_spread":0.2373717922811989,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2755307068","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99062926,0.000087907036,0.006882761,0.00053078274,0.00011607682,0.0003238142,0.00042910423,0.00016690881,0.0008333826],"genre_scores_gemma":[0.9917093,0.000027859971,0.0073082196,0.000021320664,0.00032193985,0.00014774229,0.00026734237,0.000057343714,0.00013892187],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99769586,0.0000060438983,0.0007213533,0.00070519745,0.0004221851,0.0004493623],"domain_scores_gemma":[0.99691445,0.00040812884,0.00062465377,0.00028213044,0.001622573,0.00014808065],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003913455,0.00044969658,0.0010344986,0.0010352382,0.000554953,0.00069270533,0.00080508523,0.00021380946,0.0000147956725],"category_scores_gemma":[0.0006000844,0.0004099614,0.00092432904,0.0012762921,0.00011038178,0.0007329933,0.000089089845,0.00022527657,0.0000014955175],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001257438,0.00015692318,0.11254868,0.0005695389,0.0431601,0.0000019698916,0.0015330218,0.046861805,0.7866785,0.0012878797,0.0009997012,0.006076118],"study_design_scores_gemma":[0.00059545366,0.0001271406,0.0020840815,0.00012376836,0.01934893,0.000005200869,0.00044897594,0.91571414,0.05788129,0.00034617612,0.0027412798,0.0005835763],"about_ca_topic_score_codex":0.00015132323,"about_ca_topic_score_gemma":0.0007743778,"teacher_disagreement_score":0.8688523,"about_ca_system_score_codex":0.000097837474,"about_ca_system_score_gemma":0.0000221519,"threshold_uncertainty_score":0.99983525},"labels":[],"label_agreement":null},{"id":"W2758510945","doi":"10.31399/asm.cp.istfa2017p0265","title":"Practicality of Single Microscope Failure Analysis for Fault Isolation, Analysis, and Advanced TEM Sample Preparation by the Integration EBAC and EDS on FIBSEM","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Oxford Instruments (Canada)","funders":"","keywords":"Fault detection and isolation; Detector; Computer science; Lamella (surface anatomy); Materials science; Workflow; Actuator; Artificial intelligence; Composite material","score_opus":0.018233476307363237,"score_gpt":0.27525783537813964,"score_spread":0.2570243590707764,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2758510945","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.84154093,0.00023643325,0.15373173,0.0025062968,0.00007405821,0.00062972563,0.00075379753,0.00011142797,0.0004155707],"genre_scores_gemma":[0.986457,0.000073210475,0.012484739,0.000046801728,0.00009073129,0.00012241522,0.0005719273,0.000024906476,0.00012825531],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9981337,0.000018381734,0.0006722423,0.0006106722,0.00030113882,0.00026384208],"domain_scores_gemma":[0.9969941,0.00078017823,0.0006546327,0.00027125524,0.0012008225,0.00009901438],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006070188,0.00033646976,0.0006865431,0.0006063583,0.0006687585,0.0008341096,0.0003018739,0.00018027835,0.000011536139],"category_scores_gemma":[0.0015092952,0.00026513962,0.00038603676,0.0012298796,0.00015537975,0.00072534196,0.000045677825,0.0001854457,2.309531e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022971063,0.00018869732,0.23114902,0.0002069136,0.04063053,2.7493715e-7,0.0021761223,0.018744893,0.69527715,0.0025869708,0.0014437966,0.0073659257],"study_design_scores_gemma":[0.0008259717,0.00035601156,0.008744652,0.00007264369,0.033733044,0.0000041634457,0.0013336494,0.90390193,0.045545064,0.00094809383,0.0038876745,0.00064707955],"about_ca_topic_score_codex":0.00057945104,"about_ca_topic_score_gemma":0.0012001826,"teacher_disagreement_score":0.88515705,"about_ca_system_score_codex":0.00008067189,"about_ca_system_score_gemma":0.000013180115,"threshold_uncertainty_score":0.9999801},"labels":[],"label_agreement":null},{"id":"W2760444852","doi":"10.1116/1.4991898","title":"Camera for transmission He+ ion microscopy","year":2017,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Foundation for Innovation","keywords":"Ion beam; Beam (structure); Optics; Materials science; Ion; Intensity (physics); Focused ion beam; Atomic physics; Chemistry; Physics","score_opus":0.013226198089197169,"score_gpt":0.2424340335986136,"score_spread":0.22920783550941642,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2760444852","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9727553,0.014095934,0.011029646,0.001497177,0.00030323752,0.00017935745,0.000004484982,0.00009902344,0.000035829926],"genre_scores_gemma":[0.9950026,0.0031915533,0.0016700778,0.00002552259,0.000061122744,0.000010831321,8.3046046e-7,0.000021600266,0.000015848693],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99844617,0.000010980528,0.0004939929,0.0002906412,0.00020713208,0.0005510824],"domain_scores_gemma":[0.99873793,0.000007359966,0.00041656493,0.00026092757,0.0005074175,0.000069808084],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001444172,0.00024321933,0.00048447703,0.00090556766,0.0010983617,0.00030317658,0.00068394165,0.0003455319,0.0000057585394],"category_scores_gemma":[0.00006481326,0.00019517292,0.000045113848,0.00030614663,0.00094554236,0.00056493597,0.000050621853,0.00037045748,4.4212047e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000036118843,0.000017449598,0.000038185663,0.000100883335,0.000058610556,0.0000018457043,0.00011957771,0.0000030813087,0.94651383,0.0011963816,0.000026741598,0.05188728],"study_design_scores_gemma":[0.00066644483,0.00036813112,0.000022469058,0.00019675684,0.00013772503,0.00013382347,0.00015411804,0.0001624593,0.98438793,0.007657538,0.005898018,0.00021457551],"about_ca_topic_score_codex":0.0000032673468,"about_ca_topic_score_gemma":0.0000057484585,"teacher_disagreement_score":0.05167271,"about_ca_system_score_codex":0.00015884601,"about_ca_system_score_gemma":0.0002706792,"threshold_uncertainty_score":0.8447821},"labels":[],"label_agreement":null},{"id":"W2767337205","doi":"10.1116/1.4998561","title":"Oxidation sharpening of silicon tips in the atmospheric environment","year":2017,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Thermal oxidation; Silicon; Wafer; Materials science; Microelectronics; Nanotechnology; Sharpening; Oxide; Glovebox; Optoelectronics; Chemistry; Metallurgy; Computer science","score_opus":0.011783921683661089,"score_gpt":0.20927179985570424,"score_spread":0.19748787817204316,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2767337205","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.992987,0.005559429,0.0005687644,0.00064184907,0.00007897521,0.00010053954,8.7136914e-7,0.00002242483,0.00004017201],"genre_scores_gemma":[0.997993,0.0016515008,0.00030389754,0.000014592041,0.000018972934,0.000005829959,3.849399e-7,0.00000914619,0.0000026930813],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987324,0.000021562906,0.0004769981,0.00018764714,0.00024668837,0.00033470368],"domain_scores_gemma":[0.99909216,0.000007801694,0.0004724437,0.00026454043,0.0001400901,0.000022947363],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001975331,0.00016043193,0.00034793932,0.00032191735,0.0003928271,0.00013288554,0.0007315903,0.00019447874,0.000006329],"category_scores_gemma":[0.00006407548,0.00011381625,0.00002385219,0.00034186002,0.0008118098,0.00038000548,0.00006448666,0.00034662848,4.379601e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011377081,0.000022600778,0.00047430515,0.00004250497,0.000024785058,0.0000024701208,0.00024749225,0.00001847657,0.97502863,0.0011484806,0.000003442095,0.022975458],"study_design_scores_gemma":[0.00040923705,0.00023624262,0.0005598539,0.0001446022,0.000071758186,0.0001389617,0.00048034146,0.0003086173,0.99174535,0.0052571637,0.0005039223,0.00014394544],"about_ca_topic_score_codex":0.000005387133,"about_ca_topic_score_gemma":0.000007886235,"teacher_disagreement_score":0.022831513,"about_ca_system_score_codex":0.00012725734,"about_ca_system_score_gemma":0.00011717257,"threshold_uncertainty_score":0.46412918},"labels":[],"label_agreement":null},{"id":"W2771307248","doi":"10.1063/1.5009137","title":"Electrode erosion properties of gas spark switches for fast linear transformer drivers","year":2017,"lang":"en","type":"article","venue":"Physics of Plasmas","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"National Natural Science Foundation of China; Heart and Stroke Foundation of Canada","keywords":"Electrode; Physics; Surface roughness; Voltage; High voltage; Surface finish; Materials science; Optics; Optoelectronics; Composite material","score_opus":0.0262473094766618,"score_gpt":0.21935177583546012,"score_spread":0.19310446635879833,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2771307248","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9928176,0.000063166735,0.0057007694,0.000039061928,0.00009424332,0.00013162546,0.000036430716,0.00003067408,0.0010864614],"genre_scores_gemma":[0.99939746,0.00006331334,0.0003218407,0.0000030136384,0.00008339363,0.000010321727,0.000013007129,0.000024990666,0.00008267139],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993933,0.000003407725,0.00019346435,0.00011187602,0.00011690014,0.00018105916],"domain_scores_gemma":[0.9994916,0.000012802311,0.00008633948,0.0002538523,0.00012595192,0.000029507413],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000052037292,0.00013396789,0.00027972623,0.000036478647,0.00008723349,0.000017951206,0.00021971602,0.00005901773,0.000006210173],"category_scores_gemma":[0.000015070332,0.000109727436,0.00017110932,0.00004519861,0.00006859412,0.00021584133,0.0000049650225,0.00009766654,0.0000036610709],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017546507,0.000025463101,0.0002793801,0.00015079335,0.0001657351,9.437398e-8,0.00058922684,0.0042132214,0.9918296,0.0008218445,0.00014943858,0.0017576799],"study_design_scores_gemma":[0.00025429952,0.000056967954,0.000032005086,0.000072551775,0.0001130116,2.1664775e-7,0.00013498143,0.019966722,0.97841513,0.00049921783,0.00033130814,0.00012361174],"about_ca_topic_score_codex":0.000096189,"about_ca_topic_score_gemma":0.000067570276,"teacher_disagreement_score":0.0157535,"about_ca_system_score_codex":0.000018482922,"about_ca_system_score_gemma":0.00002185738,"threshold_uncertainty_score":0.4474555},"labels":[],"label_agreement":null},{"id":"W2773808098","doi":"10.1109/tns.2017.2780827","title":"Application of a Focused, Pulsed X-ray Beam for Total Ionizing Dose Testing of Bipolar Linear Integrated Circuits","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Nuclear Science","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Argonne National Laboratory; Office of Science; Canadian Light Source; U.S. Department of Energy","keywords":"Comparator; Absorbed dose; Ionizing radiation; Electronic circuit; Materials science; Bipolar junction transistor; Voltage; Transistor; Offset (computer science); Input offset voltage; Integrated circuit; Optoelectronics; Irradiation; Radiation; Electrical engineering; Physics; Operational amplifier; Optics; Computer science; Engineering; Nuclear physics","score_opus":0.0246751118563719,"score_gpt":0.24328836936701706,"score_spread":0.21861325751064517,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2773808098","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.73669547,0.000023102959,0.26231873,0.000020769543,0.0002675543,0.0002657596,0.00006366221,0.000116395444,0.00022853207],"genre_scores_gemma":[0.99641484,0.000008539893,0.0034786158,0.000007352364,0.000022341104,0.000015636559,6.5692495e-7,0.000029505227,0.000022512562],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989058,0.000008295178,0.00032379315,0.00026473904,0.00025021136,0.00024719277],"domain_scores_gemma":[0.99876904,0.00006693828,0.00014773641,0.00053625606,0.00040344123,0.000076585646],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00032392895,0.00014508693,0.00023454035,0.000311074,0.00051219383,0.00007544372,0.00051611895,0.00008470395,0.000017722921],"category_scores_gemma":[0.0000737164,0.00013547731,0.00011937499,0.0006407602,0.00030994852,0.00043840194,0.0000017151949,0.00019966425,0.000008863686],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000069047564,0.000045663946,0.000015219653,0.000031952826,0.0000306273,2.2353429e-7,0.0002497953,0.13480432,0.78832227,0.000038367245,0.0000036838048,0.07645096],"study_design_scores_gemma":[0.00026944024,0.00012956413,0.00020258114,0.00006694163,0.000060508457,0.000002691431,0.00015056535,0.7324016,0.26634243,0.000013166244,0.00021404677,0.00014645336],"about_ca_topic_score_codex":0.00028735385,"about_ca_topic_score_gemma":0.000025345458,"teacher_disagreement_score":0.5975973,"about_ca_system_score_codex":0.00007650153,"about_ca_system_score_gemma":0.00007134069,"threshold_uncertainty_score":0.55246043},"labels":[],"label_agreement":null},{"id":"W2782337064","doi":"10.1063/1.5003260","title":"Surface recombination velocity imaging of wet-cleaned silicon wafers using quantitative heterodyne lock-in carrierography","year":2018,"lang":"en","type":"article","venue":"Applied Physics Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; National Natural Science Foundation of China; Canada Research Chairs; Canada Foundation for Innovation","keywords":"Wafer; Passivation; Materials science; Etching (microfabrication); Heterodyne (poetry); Hydrofluoric acid; SIGNAL (programming language); Optics; Amplitude; Optoelectronics; Analytical Chemistry (journal); Chemistry; Physics; Acoustics; Nanotechnology; Computer science","score_opus":0.015328104957025796,"score_gpt":0.23148168999216792,"score_spread":0.21615358503514212,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2782337064","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98953575,0.000027982373,0.009244531,0.000045191384,0.00017135195,0.00014300196,0.000011114715,0.00008035893,0.00074070785],"genre_scores_gemma":[0.9987202,0.00000486839,0.0009988839,0.00014078876,0.000055114077,0.000004404105,0.000031240903,0.000043183947,0.0000013169362],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989014,0.00003209969,0.0003162301,0.00026476677,0.00017934776,0.00030613897],"domain_scores_gemma":[0.9994878,0.000051526953,0.00009515859,0.00023786284,0.00008459241,0.00004305468],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014323689,0.00022222644,0.0003231523,0.00014442031,0.000062637795,0.000029594428,0.00015579918,0.000053916345,0.000014722466],"category_scores_gemma":[0.0000043008795,0.0002436207,0.00011332436,0.0007763989,0.00015863807,0.00017317898,0.000014325355,0.0002088963,0.00000904722],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010441147,0.000020573514,0.0010479467,0.000027760085,0.00012250963,0.0000012952956,0.0014229503,0.044494893,0.95007133,0.0013738192,0.00014356806,0.0012629045],"study_design_scores_gemma":[0.0007021513,0.000025284984,0.00087827566,0.00006436718,0.00011196221,8.892236e-7,0.0012721121,0.1402433,0.8555713,0.00051257206,0.000069556125,0.0005481899],"about_ca_topic_score_codex":0.00034737834,"about_ca_topic_score_gemma":0.000044252647,"teacher_disagreement_score":0.09574842,"about_ca_system_score_codex":0.00012380265,"about_ca_system_score_gemma":0.000011964291,"threshold_uncertainty_score":0.99345636},"labels":[],"label_agreement":null},{"id":"W2783840413","doi":"10.1115/imece2017-70218","title":"An Empirical Prediction Law for Quasi-Static Nail-Particle Board Penetration Resistance","year":2017,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec à Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Penetration (warfare); Dimensionless quantity; Computer science; Materials science; Structural engineering; Mechanical engineering; Engineering; Mechanics; Physics","score_opus":0.028440504470806517,"score_gpt":0.2922468415889078,"score_spread":0.26380633711810125,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2783840413","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8860072,0.00007590323,0.086428635,0.0006150031,0.00040896382,0.00030901542,0.000065351946,0.0004604638,0.025629476],"genre_scores_gemma":[0.9973683,0.0000062164086,0.0012864404,0.00011879219,0.00012442074,0.000038019763,0.000045174966,0.000021375772,0.0009912938],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993029,0.000014697271,0.0002013603,0.00017291924,0.000113877206,0.00019424492],"domain_scores_gemma":[0.99934167,0.000024249517,0.00003648668,0.00043128766,0.00008965978,0.00007663835],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013579671,0.000106626474,0.00013485255,0.000024406672,0.000304737,0.0002504671,0.00016641198,0.000077419754,0.000114188646],"category_scores_gemma":[0.000029685834,0.000093637864,0.000063347135,0.00004165264,0.00003970911,0.00057591725,0.0000034109898,0.00007780983,0.000021408407],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013277821,0.00040481496,0.011926157,0.0003055534,0.0006240973,0.000011637357,0.0031153983,0.012320005,0.66219854,0.20692188,0.093376316,0.0086627975],"study_design_scores_gemma":[0.000826239,0.0002492851,0.004847954,0.000033269705,0.0001881812,0.0000016732658,0.0005649208,0.8103042,0.1394375,0.0045998297,0.038512,0.00043491952],"about_ca_topic_score_codex":0.00014368423,"about_ca_topic_score_gemma":0.0046243086,"teacher_disagreement_score":0.79798424,"about_ca_system_score_codex":0.000050852905,"about_ca_system_score_gemma":0.000011694178,"threshold_uncertainty_score":0.3818441},"labels":[],"label_agreement":null},{"id":"W2789298142","doi":"10.1007/978-3-319-72484-3_1","title":"On FIB Milling Parameters","year":2018,"lang":"en","type":"book-chapter","venue":"˜The œminerals, metals & materials series","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Natural Resources Canada","funders":"","keywords":"Focused ion beam; Materials science; Dwell time; Ion milling machine; Consumables; Ion beam; Metallurgy; Field ion microscope; Beam (structure); Microscope; Deposition (geology); Nanotechnology; Ion; Optics; Engineering; Structural engineering; Chemistry","score_opus":0.01874880954609663,"score_gpt":0.20365106279564976,"score_spread":0.18490225324955312,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2789298142","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.43041506,0.0067407475,0.00032802855,0.0004390544,0.015745202,0.0020481378,0.0027826226,0.0023078981,0.5391933],"genre_scores_gemma":[0.25212488,0.001568315,0.0004218721,0.0006677307,0.0020392945,0.00011403302,0.0008660933,0.00061207236,0.74158573],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9972068,0.00008484613,0.0010225344,0.00060451933,0.00046089897,0.00062041817],"domain_scores_gemma":[0.9981482,0.00013040654,0.00030570244,0.0011093414,0.00018793193,0.00011838756],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00051079923,0.0010559377,0.0014615757,0.00030774003,0.00021748498,0.0004846045,0.00064484717,0.0006209235,0.008980281],"category_scores_gemma":[0.000027984926,0.0007334473,0.00045420032,0.00008731816,0.000290256,0.0002577583,0.0000641759,0.00041879067,0.0016299575],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008197652,0.000014834998,1.5207623e-7,0.00028025787,0.002698139,0.0000589372,0.00061370136,0.0016170462,0.87355524,0.037051573,0.08373598,0.00029214955],"study_design_scores_gemma":[0.00028113255,0.00030636572,7.014437e-7,0.0005389133,0.0014556819,0.000066116685,0.00013008351,0.0001193905,0.29555792,0.037707582,0.66199917,0.0018369661],"about_ca_topic_score_codex":0.00011725839,"about_ca_topic_score_gemma":0.00018706282,"teacher_disagreement_score":0.57826316,"about_ca_system_score_codex":0.00010834579,"about_ca_system_score_gemma":0.000034979865,"threshold_uncertainty_score":0.99951166},"labels":[],"label_agreement":null},{"id":"W2791028749","doi":"10.1109/tns.2018.2797543","title":"Single-Event Effects in the Peripheral Circuitry of a Commercial Ferroelectric Random Access Memory","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Nuclear Science","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Argonne National Laboratory; U.S. Naval Research Laboratory; Jyväskylän Yliopisto; Office of Naval Research; Academy of Finland; Office of Science; European Space Agency; Canadian Light Source; U.S. Department of Energy","keywords":"Ferroelectricity; Random access memory; Random access; Event (particle physics); Non-volatile memory; Heavy ion; Materials science; Computer science; Optoelectronics; Physics; Ion; Computer hardware; Operating system; Dielectric","score_opus":0.01584857971042142,"score_gpt":0.2454381983724573,"score_spread":0.2295896186620359,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2791028749","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9773932,0.00002261916,0.019822724,0.00008198464,0.0005621576,0.0001776071,0.000002836751,0.000064238666,0.0018726231],"genre_scores_gemma":[0.99967945,0.000009147735,0.000034627876,0.00019349264,0.00004420987,0.0000090366,8.570486e-8,0.00001610546,0.000013872769],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.998911,0.000062859195,0.00020630813,0.00019610004,0.000337199,0.000286483],"domain_scores_gemma":[0.99947965,0.00007927141,0.000030149118,0.00028510677,0.00007826661,0.000047533056],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037065303,0.0001285927,0.00018645974,0.00035104196,0.00021546963,0.000104905834,0.00068073266,0.00005720957,0.00013451742],"category_scores_gemma":[0.000011114627,0.00009597565,0.000103288236,0.001851569,0.00035856606,0.00032990155,0.0000011616073,0.0002873127,0.000018541887],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012327645,0.000498665,0.000026463093,0.00007355608,0.00009203645,0.000014943618,0.013341814,0.105630405,0.76315004,0.00013879937,0.00034945618,0.11656054],"study_design_scores_gemma":[0.002556516,0.0011186515,0.0019328347,0.00018333351,0.0001936998,0.000054312783,0.0014917433,0.5910536,0.39998367,0.00011226193,0.00062822027,0.00069117994],"about_ca_topic_score_codex":0.000101800295,"about_ca_topic_score_gemma":0.00021073318,"teacher_disagreement_score":0.48542318,"about_ca_system_score_codex":0.0001280231,"about_ca_system_score_gemma":0.00004284016,"threshold_uncertainty_score":0.39137733},"labels":[],"label_agreement":null},{"id":"W2795632034","doi":"10.1109/tvlsi.2018.2817177","title":"On the Analysis and the Mitigation of Power Supply Noise and Power Distribution Network Impedance Variation for Scan-Based Delay Testing Techniques","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Electronic engineering; Noise (video); Static timing analysis; Noise margin; Voltage droop; Power (physics); Electrical impedance; Intermodulation; Computer science; Engineering; Transistor; Electrical engineering; Voltage; CMOS; Voltage regulator; Physics","score_opus":0.006050575191187877,"score_gpt":0.20434739059831325,"score_spread":0.19829681540712538,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2795632034","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22468077,0.00007608194,0.7735865,0.00011539453,0.00032372872,0.0006085541,0.0003542412,0.000103306826,0.00015141917],"genre_scores_gemma":[0.9990909,0.0000159668,0.0003220078,0.000070794595,0.000081899925,0.00026415914,0.0000805968,0.000025016872,0.00004866253],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99852026,0.00019227281,0.0005298488,0.0002747184,0.0002458705,0.0002370623],"domain_scores_gemma":[0.9981325,0.0007855447,0.00018341499,0.00032048248,0.00053016696,0.000047842037],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009712672,0.00023894741,0.00035487307,0.00016575246,0.0004486711,0.00014788317,0.00011416236,0.0001726605,0.000029874836],"category_scores_gemma":[0.00006259883,0.0001506038,0.00019185309,0.0009982126,0.00015596337,0.000196895,8.3415057e-7,0.00023852474,0.000002606091],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0018413259,0.00070539257,0.0019945933,0.00046165375,0.00726506,0.0000029663229,0.012315399,0.6518144,0.24956217,0.04210445,0.0077087474,0.02422383],"study_design_scores_gemma":[0.00059677433,0.00021936609,0.00075706653,0.0002455846,0.00081973796,0.0000039912616,0.00060703146,0.9329584,0.06303603,0.00027650583,0.00023339642,0.00024607164],"about_ca_topic_score_codex":0.00020433032,"about_ca_topic_score_gemma":0.0005467739,"teacher_disagreement_score":0.7744101,"about_ca_system_score_codex":0.00012452775,"about_ca_system_score_gemma":0.00003114647,"threshold_uncertainty_score":0.61414444},"labels":[],"label_agreement":null},{"id":"W2883549466","doi":"10.7939/r3k931b08","title":"On-line current monitoring of low-voltage VLSI circuits","year":2000,"lang":"en","type":"article","venue":"Library and Archives Canada (Government of Canada)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Very-large-scale integration; Current (fluid); Electronic circuit; Line (geometry); Electrical engineering; Computer science; Electronic engineering; Engineering; Mathematics","score_opus":0.005050774936941584,"score_gpt":0.1542630780443308,"score_spread":0.1492123031073892,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2883549466","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8630697,0.0009237636,0.00009543022,0.000106445164,0.00032334632,0.000085527674,0.00018183491,0.000024067567,0.13518988],"genre_scores_gemma":[0.9975422,0.000537429,0.00002871998,0.00006282853,0.00007425443,0.0000032622356,0.000006826,0.000022600801,0.0017218498],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984555,0.000015398095,0.00029843792,0.00015728148,0.00083269767,0.0002406332],"domain_scores_gemma":[0.9995137,0.000095104806,0.000050623417,0.0001837746,7.3601717e-7,0.00015609269],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000006679415,0.00017898635,0.00026098962,0.000032623648,0.000056123787,0.000011416559,0.0001725349,0.00002391159,0.00019920013],"category_scores_gemma":[0.0000015227511,0.00016806462,0.000041631894,0.00011300614,0.00003239071,0.00017351915,0.000013831469,0.00017340726,1.00099165e-8],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016228887,0.00013778772,0.015350046,0.0011645018,0.0008591103,0.00012420738,0.00046010813,0.055728126,0.40038007,0.047863454,0.0024801434,0.47529015],"study_design_scores_gemma":[0.0005146067,0.00010250159,0.007129585,0.0005995909,0.00008064716,0.000004110393,0.0010455062,0.017939795,0.9539108,0.00086078007,0.017265614,0.0005464122],"about_ca_topic_score_codex":0.0007010666,"about_ca_topic_score_gemma":0.001519165,"teacher_disagreement_score":0.5535308,"about_ca_system_score_codex":0.000008381985,"about_ca_system_score_gemma":0.00024731687,"threshold_uncertainty_score":0.6853476},"labels":[],"label_agreement":null},{"id":"W2886775678","doi":"10.1017/s1431927618006311","title":"Root Cause Failure Analysis of Polyethylene Tubing Utilizing Microscopy","year":2018,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Dow Chemical (Canada)","funders":"","keywords":"Materials science; Polyethylene; Root cause analysis; Composite material; Forensic engineering; Engineering","score_opus":0.010842402261726457,"score_gpt":0.2507253769721813,"score_spread":0.23988297471045483,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2886775678","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9881664,0.0037309548,0.006670893,0.000056717447,0.00015667306,0.0001075204,0.00011595355,0.00016690373,0.00082801335],"genre_scores_gemma":[0.99659365,0.000367324,0.0022584733,0.000092898874,0.000103175546,0.000008170496,0.000149451,0.00006575801,0.00036107708],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.997491,0.00007676725,0.00088246295,0.00064830953,0.0002356646,0.0006657903],"domain_scores_gemma":[0.9984669,0.00007643099,0.00018887589,0.00073753996,0.0003338618,0.00019636359],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003535507,0.0005165191,0.0012706656,0.0017914004,0.0002781176,0.00016611736,0.0003792979,0.00030016562,0.00063172274],"category_scores_gemma":[0.00003103372,0.000488564,0.0006785043,0.0042057824,0.000375127,0.0002609705,0.00007066613,0.00033107313,0.000028904116],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000140589045,0.000035106998,0.011399143,0.000051026283,0.010411159,0.0000060786374,0.0012609324,0.0002720152,0.97443,0.000111567926,0.00091045926,0.0010983988],"study_design_scores_gemma":[0.00031459052,0.000058556972,0.0013041636,0.000059972095,0.013363132,0.000009170503,0.001079656,0.008358032,0.9698507,0.000028692564,0.0049866894,0.0005865996],"about_ca_topic_score_codex":0.0006400246,"about_ca_topic_score_gemma":0.0033811359,"teacher_disagreement_score":0.01009498,"about_ca_system_score_codex":0.000103004844,"about_ca_system_score_gemma":0.000039572886,"threshold_uncertainty_score":0.9997566},"labels":[],"label_agreement":null},{"id":"W2887357661","doi":"10.11159/eee18.121","title":"A PVT Insensitive CMOS Negative Resistance Circuit for Q-factorEnhancement of FBAR","year":2018,"lang":"en","type":"article","venue":"Proceedings of the World Congress on Electrical Engineering and Computer Systems and Science","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"National Research Foundation of Korea; National Research Foundation","keywords":"CMOS; Negative resistance; Materials science; Optoelectronics; Q factor; Electrical engineering; Engineering; Resonator; Voltage","score_opus":0.008658040780018564,"score_gpt":0.19883376572683287,"score_spread":0.1901757249468143,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2887357661","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9896907,0.00051549386,0.0069091483,0.0000533812,0.0011769995,0.00046116344,0.000013082256,0.00007813488,0.001101877],"genre_scores_gemma":[0.99937934,0.000015376187,0.00023507174,0.000013256104,0.000119090306,0.000015639074,1.3514244e-7,0.000009755727,0.00021233044],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990537,0.0000027120147,0.0002459489,0.00023383771,0.0002235138,0.0002402601],"domain_scores_gemma":[0.99927837,0.000082003426,0.000087895074,0.000080615886,0.00040491746,0.00006618956],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022270164,0.00014511695,0.00027880925,0.00021649324,0.00010514759,0.000074673204,0.00022228208,0.0000327895,5.2823907e-7],"category_scores_gemma":[0.000043044263,0.000102002785,0.0000441957,0.00080835127,0.0002523216,0.00011184444,0.000029255429,0.000112526046,1.4441524e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010382706,0.000077629535,0.00073049834,0.001222814,0.0004405327,9.0981405e-7,0.0023515357,0.005148263,0.57555574,0.4035926,0.0030237774,0.0077518877],"study_design_scores_gemma":[0.00030018992,0.00028263757,0.00064869865,0.0006410988,0.00004057934,0.000004473036,0.00005017483,0.7815849,0.2146428,0.00016656742,0.0013942027,0.00024367525],"about_ca_topic_score_codex":0.0000100654315,"about_ca_topic_score_gemma":0.000003431271,"teacher_disagreement_score":0.7764366,"about_ca_system_score_codex":0.0000444701,"about_ca_system_score_gemma":0.000017559874,"threshold_uncertainty_score":0.41595528},"labels":[],"label_agreement":null},{"id":"W2888444930","doi":"10.29363/nanoge.fallmeeting.2018.028","title":"Insights by Material-Sensitive and Conductive AFM: From Properties of Membranes and Fuel Cell Electrodes before and after Operation to Ionomer Nanothin Films","year":2018,"lang":"en","type":"article","venue":"Proceedings of the nanoGe Fall Meeting 2018","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"","keywords":"Ionomer; Materials science; Electrode; Membrane; Fuel cells; Electrical conductor; Composite material; Chemical engineering; Chemistry; Polymer; Engineering","score_opus":0.0048314941100741325,"score_gpt":0.16623966775998686,"score_spread":0.16140817364991272,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2888444930","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9980982,0.0009598274,0.0000012139625,0.00007343253,0.000093645715,0.00021673724,0.0000425476,0.000026770866,0.00048761012],"genre_scores_gemma":[0.9993106,0.00011466516,0.0002754699,0.00005710194,0.000064532825,0.000016205255,0.0000033530976,0.000026498525,0.00013158686],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992084,0.000008442369,0.0002572127,0.00024952192,0.000118511925,0.0001579138],"domain_scores_gemma":[0.9994944,0.000012418516,0.0000948613,0.00006633674,0.00028453357,0.00004750344],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010215804,0.00019261142,0.00029202577,0.000083849285,0.000082130384,0.00008128092,0.00009354628,0.00010515248,0.000008055702],"category_scores_gemma":[0.000040637286,0.00012701676,0.000028744449,0.00011547081,0.00020000598,0.00026723617,0.0000610884,0.00007517513,0.0000011584413],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000046486974,0.000008871221,0.00067208277,0.00020178054,0.00008119515,7.0056174e-8,0.014061119,0.0000014303222,0.9845585,0.000022828901,0.00030586074,0.00003972203],"study_design_scores_gemma":[0.00015362386,0.000112255875,0.00034070257,0.0002322955,0.00009408742,0.0000021168544,0.0018074089,0.00049578096,0.9962568,0.00012027297,0.00023054336,0.00015409896],"about_ca_topic_score_codex":0.00059619633,"about_ca_topic_score_gemma":0.0002034695,"teacher_disagreement_score":0.01225371,"about_ca_system_score_codex":0.000017949831,"about_ca_system_score_gemma":0.00000852825,"threshold_uncertainty_score":0.5179593},"labels":[],"label_agreement":null},{"id":"W2891748079","doi":"10.1109/ipfa.2018.8452180","title":"Analysis Methods and Strategies of Analog and Mix Signal Circuits in Power IC","year":2018,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Computer science; Fault detection and isolation; Integrated circuit; Electronic engineering; Electronic circuit; SIGNAL (programming language); Fault (geology); Transistor; Isolation (microbiology); Power (physics); Failure mode and effects analysis; Mixed-signal integrated circuit; Electrical engineering; Engineering; Reliability engineering; Voltage","score_opus":0.011169184943866201,"score_gpt":0.27517043454576884,"score_spread":0.26400124960190263,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2891748079","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93558156,0.00077245565,0.038164258,0.0000120453315,0.00003036132,0.00004252465,0.000006060022,0.000044269687,0.02534644],"genre_scores_gemma":[0.9985018,0.00006248256,0.0013154291,0.000016130802,0.000015700574,0.0000020048938,0.000004296096,0.000010446281,0.000071718605],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992172,0.000053706946,0.00027594191,0.00019086855,0.00008267438,0.00017956656],"domain_scores_gemma":[0.99962145,0.000064471795,0.00002936022,0.00014770158,0.00008165164,0.00005535102],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029421944,0.00013894006,0.00037768084,0.00058163557,0.000022766395,0.00004822824,0.00007289075,0.00009681536,0.0006880233],"category_scores_gemma":[0.000011361901,0.0001142403,0.000068931826,0.0010463522,0.00011312761,0.0001713364,0.0000123248965,0.00010900698,0.0000018895425],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000070291885,0.0000533546,0.05928884,0.00009979054,0.004311633,0.000014420582,0.0047465945,0.002385045,0.8761395,0.018646775,0.00030925163,0.033997748],"study_design_scores_gemma":[0.0017224319,0.0006927313,0.20011586,0.000117260905,0.0047344556,0.00003595263,0.029773356,0.3424166,0.4068135,0.009604233,0.0019637938,0.002009789],"about_ca_topic_score_codex":0.00038188402,"about_ca_topic_score_gemma":0.0010037614,"teacher_disagreement_score":0.46932602,"about_ca_system_score_codex":0.00001474328,"about_ca_system_score_gemma":0.000014576978,"threshold_uncertainty_score":0.7533372},"labels":[],"label_agreement":null},{"id":"W2895927807","doi":"10.1088/1361-6641/aae810","title":"Contactless non-destructive imaging of doping density and electrical resistivity of semiconductor Si wafers using lock-in carrierography","year":2018,"lang":"en","type":"article","venue":"Semiconductor Science and Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; National Natural Science Foundation of China; Canada Research Chairs","keywords":"Wafer; Electrical resistivity and conductivity; Dopant; Materials science; Doping; Semiconductor; Optoelectronics; Silicon; Optics; Electrical engineering; Physics","score_opus":0.007095965585328293,"score_gpt":0.22717313299733416,"score_spread":0.22007716741200586,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2895927807","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99870896,0.0006405367,0.000100511,0.000025975272,0.00016067819,0.00014619651,0.000012822725,0.00006722415,0.00013711175],"genre_scores_gemma":[0.9993745,0.00008172367,0.0004793937,0.000013926454,0.000027279186,0.0000031079057,0.00000132664,0.000017018396,0.0000017411016],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983122,0.000023673856,0.00041542455,0.00050437776,0.00024333848,0.00050102524],"domain_scores_gemma":[0.998802,0.000054473483,0.00013582452,0.0003331814,0.0005804854,0.00009402314],"candidate_categories":["sts"],"consensus_categories":[],"category_scores_codex":[0.00044097425,0.00023534066,0.0005498669,0.0015756353,0.00014116406,0.000029548048,0.00032322554,0.00019482113,0.000006825194],"category_scores_gemma":[0.00019253706,0.00022301442,0.00004572173,0.0031062549,0.0028083548,0.00042238645,0.000096597774,0.00035671645,3.2359566e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000060654343,0.00001034531,0.08966388,0.00003130593,0.000033138618,0.0000045247425,0.00034608098,0.0000033767492,0.90678334,0.0011990044,0.0000071126883,0.0019118028],"study_design_scores_gemma":[0.00032400477,0.00007711164,0.0051135933,0.000110969966,0.000059120684,0.000067240566,0.0016937429,0.009841243,0.98106986,0.0013498564,0.0000186046,0.0002746532],"about_ca_topic_score_codex":0.00046902898,"about_ca_topic_score_gemma":0.00016000497,"teacher_disagreement_score":0.084550284,"about_ca_system_score_codex":0.00014032984,"about_ca_system_score_gemma":0.00018956201,"threshold_uncertainty_score":0.9999054},"labels":[],"label_agreement":null},{"id":"W2896180276","doi":"10.2351/1.5056828","title":"Laser spike anneal – Hazard prevention and remote process analysis","year":2015,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Optech (Canada)","funders":"","keywords":"Materials science; Wafer; Optoelectronics; Rapid thermal processing; Silicon; Laser; Ion implantation; Semiconductor; Fabrication; Semiconductor laser theory; Dopant; Doping; Optics","score_opus":0.017173635494707802,"score_gpt":0.24798813355313745,"score_spread":0.23081449805842966,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2896180276","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94645274,0.0003037502,0.024852285,0.00005228535,0.000080425416,0.000071162554,0.0000044706744,0.0002518617,0.027931023],"genre_scores_gemma":[0.9968177,0.000026213484,0.0005951962,0.00003122456,0.0000494075,0.0000019305703,0.00003376329,0.000013909346,0.0024306725],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993611,0.000014609523,0.00016548896,0.00016100034,0.00013890241,0.00015892269],"domain_scores_gemma":[0.9995888,0.0000060813168,0.000019822966,0.00014895259,0.00011685879,0.00011949922],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013696642,0.0001192248,0.00020853421,0.00021729492,0.000024973868,0.000057357847,0.00006921643,0.00007686411,0.00015799902],"category_scores_gemma":[0.000012479048,0.00009710491,0.000088844274,0.00070008513,0.000017196733,0.00017580915,0.0000067157043,0.000094460884,0.000028275426],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006765574,0.0002923086,0.041499186,0.00043791634,0.02392965,0.0001386049,0.009458944,0.37170732,0.012825355,0.0026016321,0.061966486,0.47507495],"study_design_scores_gemma":[0.0004698348,0.000069375594,0.000752041,0.000017432485,0.0018553159,0.000009187269,0.0014087103,0.9755808,0.012638768,0.0016136557,0.005131536,0.0004533488],"about_ca_topic_score_codex":0.00008715074,"about_ca_topic_score_gemma":0.0006157619,"teacher_disagreement_score":0.6038735,"about_ca_system_score_codex":0.000029608489,"about_ca_system_score_gemma":0.000016886073,"threshold_uncertainty_score":0.39598233},"labels":[],"label_agreement":null},{"id":"W2896952889","doi":"10.1109/jphotov.2018.2874973","title":"Quasi-Steady-State Free Carrier Absorption Measurements of Effective Carrier Lifetime in Silicon","year":2018,"lang":"en","type":"article","venue":"IEEE Journal of Photovoltaics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Carrier lifetime; Free carrier absorption; Photoconductivity; Steady state (chemistry); Materials science; Optoelectronics; Wafer; Semiconductor; Silicon; Steady State theory; SIGNAL (programming language); Absorption (acoustics); Microwave; Chemistry; Physics; Computer science; Telecommunications","score_opus":0.015106097273135001,"score_gpt":0.23779587327826462,"score_spread":0.22268977600512962,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2896952889","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99686986,0.00036184804,0.0006688462,0.00000947276,0.00096243236,0.0001758582,0.00006290333,0.000020002204,0.0008687902],"genre_scores_gemma":[0.99936515,0.000052723637,0.00006817369,0.000033876884,0.00036106445,0.0000049779187,0.0000022580443,0.000041405012,0.000070393544],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99811023,0.00010576807,0.0008257058,0.00014511822,0.00051308447,0.0003000798],"domain_scores_gemma":[0.9983576,0.00006460338,0.0003174552,0.00029564305,0.00083003525,0.00013469056],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00077731896,0.00023714482,0.0005614956,0.00048787883,0.00003517214,0.000027443179,0.00032244928,0.00016090494,0.00010395801],"category_scores_gemma":[0.00015073652,0.00020687959,0.000233708,0.00047489355,0.00009267002,0.000285342,0.000011613273,0.0004697425,0.000007669671],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006426977,0.000063885076,0.005485479,0.000052302643,0.00039801435,0.000017078222,0.0023284107,0.0027047894,0.98617625,0.0000039139163,0.0017824578,0.0009231673],"study_design_scores_gemma":[0.0011224336,0.0005203267,0.0013181271,0.00022916592,0.00016473785,0.000025825013,0.0003233641,0.0037903676,0.9910833,0.0002912568,0.0008915411,0.0002395076],"about_ca_topic_score_codex":0.0003952915,"about_ca_topic_score_gemma":0.0009005438,"teacher_disagreement_score":0.004907115,"about_ca_system_score_codex":0.00029264906,"about_ca_system_score_gemma":0.000083439096,"threshold_uncertainty_score":0.8436305},"labels":[],"label_agreement":null},{"id":"W2897456263","doi":"10.2351/1.5056782","title":"Control of X-ray hazard in femtosecond electron diffractometer","year":2013,"lang":"en","type":"article","venue":"International Laser Safety Conference","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"University of Toronto","funders":"","keywords":"Electron; Diffractometer; Materials science; Optics; Femtosecond; Photocathode; Collimated light; Anode; Electromagnetic shielding; Optoelectronics; Laser; Physics; Nuclear physics; Scanning electron microscope; Composite material; Electrode","score_opus":0.006230709015384931,"score_gpt":0.2000569191625343,"score_spread":0.19382621014714935,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2897456263","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96619195,0.000060156133,0.011451382,0.00037648014,0.0003262128,0.00015849991,0.000057264795,0.00005760104,0.021320479],"genre_scores_gemma":[0.99912554,0.00004292571,0.00007973825,0.000118394455,0.000044606037,0.000025926083,0.000045857716,0.00001511715,0.00050187093],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990199,0.000023498176,0.00039499256,0.000159179,0.00019652919,0.00020588712],"domain_scores_gemma":[0.999415,0.000080300306,0.000057199853,0.00015661598,0.00024350958,0.000047422538],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0000839511,0.00014739003,0.00024652673,0.00022984661,0.000011628494,0.000044231772,0.00029899768,0.00008309471,0.004043117],"category_scores_gemma":[0.00003343528,0.00013225606,0.00008363963,0.00014363977,0.000029683328,0.00029817916,0.000012136305,0.00022599947,0.00015877953],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010792638,0.00025408575,0.030352037,0.00007342259,0.0014440208,0.000024286546,0.0010032877,0.0334158,0.8873196,0.023602271,0.0030534544,0.019349806],"study_design_scores_gemma":[0.004848509,0.00019440214,0.18221152,0.00029472067,0.00012585829,0.000015063244,0.00044761674,0.5496566,0.22681154,0.004981118,0.029009648,0.001403359],"about_ca_topic_score_codex":0.0002726146,"about_ca_topic_score_gemma":0.00037395637,"teacher_disagreement_score":0.66050804,"about_ca_system_score_codex":0.00008906934,"about_ca_system_score_gemma":0.00003035839,"threshold_uncertainty_score":0.9968673},"labels":[],"label_agreement":null},{"id":"W2900472110","doi":"10.1016/j.micron.2018.11.003","title":"Single-shot real-time sub-nanosecond electron imaging aided by compressed sensing: Analytical modeling and simulation","year":2018,"lang":"en","type":"article","venue":"Micron","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":29,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Nanosecond; Temporal resolution; Ultrashort pulse; Image resolution; Optics; Computer science; Compressed sensing; Single shot; Materials science; Laser; Physics; Artificial intelligence","score_opus":0.013116596787013825,"score_gpt":0.22694201026535937,"score_spread":0.21382541347834555,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2900472110","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.987889,0.0002947738,0.008328465,0.000035025536,0.00005668627,0.00007440335,0.000010422474,0.00019238328,0.0031188733],"genre_scores_gemma":[0.9993303,0.000022513395,0.00019998453,0.00005427541,0.00012012592,5.011509e-7,0.00009266006,0.00004602733,0.00013363482],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989629,0.000028984205,0.00026847652,0.00027844595,0.000102448124,0.0003587824],"domain_scores_gemma":[0.9995478,0.000040606727,0.000031714688,0.00018567988,0.00011586983,0.00007835959],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009907438,0.00020820895,0.00025584825,0.00012803823,0.0001013174,0.00011864393,0.00007008646,0.0000970231,0.00008379514],"category_scores_gemma":[0.000012749251,0.00021127237,0.00005678061,0.00016332226,0.00005521407,0.00014472308,0.000013325001,0.00016165386,0.000032724296],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008629218,0.000010184366,0.000030898016,0.000010030055,0.00005718092,0.0000024141711,0.00016890305,0.028387314,0.9681779,0.000007433852,0.0017765681,0.0013625418],"study_design_scores_gemma":[0.00015890319,0.000021144951,0.000004033256,0.000016859787,0.00006061754,0.000004730499,0.000028328008,0.68834704,0.3102561,0.000030800467,0.0008968832,0.00017454903],"about_ca_topic_score_codex":0.00014516422,"about_ca_topic_score_gemma":0.00004057384,"teacher_disagreement_score":0.65995973,"about_ca_system_score_codex":0.00010931686,"about_ca_system_score_gemma":0.000010022722,"threshold_uncertainty_score":0.8615437},"labels":[],"label_agreement":null},{"id":"W2906907888","doi":"10.1109/iecon.2018.8591626","title":"Software-based Monitoring for Calibration of Measurement Units in Real-time Systems","year":2018,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ontario Tech University","funders":"","keywords":"Correctness; NIST; Computer science; Calibration; Measurement uncertainty; Task (project management); Software; System of measurement; Set (abstract data type); Real-time computing; Process (computing); Reliability engineering; Function (biology); Metrology; Units of measurement; Engineering; Algorithm; Systems engineering","score_opus":0.0423480228607432,"score_gpt":0.23241697179807896,"score_spread":0.19006894893733578,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2906907888","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.72171694,0.00021235173,0.27231517,0.000019460591,0.0008395274,0.00061070157,0.000026474034,0.0004685116,0.003790854],"genre_scores_gemma":[0.9989675,0.0000042391425,0.00075218594,0.0000024967594,0.00011927223,0.000027380396,0.000011067224,0.000018718707,0.00009711045],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993312,0.00001643491,0.0002575432,0.00009484042,0.0001593268,0.00014065146],"domain_scores_gemma":[0.99939775,0.000031051855,0.000029033792,0.00013240005,0.00038171327,0.000028023029],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024154768,0.00008972845,0.00016906201,0.00014968822,0.00002015619,0.00001956897,0.00006966374,0.00006638854,0.000029651206],"category_scores_gemma":[0.000050222294,0.00007855267,0.000031998785,0.00032175044,0.000012226995,0.000081855454,0.0000021850233,0.000038641607,0.000003883726],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012112111,0.00002155991,0.0023734414,0.00018791472,0.000112294656,5.7575176e-7,0.0002785708,0.05532627,0.9388267,0.00050627126,0.0015112096,0.00084307516],"study_design_scores_gemma":[0.00032539124,0.0000687468,0.00012947638,0.000158564,0.000037774193,2.140284e-7,0.00019200696,0.46375123,0.5348115,0.000022340291,0.000352994,0.00014979187],"about_ca_topic_score_codex":0.00060954865,"about_ca_topic_score_gemma":0.000098262404,"teacher_disagreement_score":0.40842494,"about_ca_system_score_codex":0.000112614645,"about_ca_system_score_gemma":0.000042119438,"threshold_uncertainty_score":0.3203285},"labels":[],"label_agreement":null},{"id":"W2909323267","doi":"","title":"Double-gate CMOS evaluation for 45nm technology node","year":2003,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"CMOS; Node (physics); Computer science; Electrical engineering; Engineering","score_opus":0.02369253077353993,"score_gpt":0.25270784243875294,"score_spread":0.229015311665213,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2909323267","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4078193,0.0014522887,0.21989894,0.0007159499,0.0012184827,0.0015024344,0.00001762925,0.001772197,0.36560276],"genre_scores_gemma":[0.9971122,0.000014003036,0.0016028966,0.00005419971,0.000026371616,0.00012258129,0.00002055036,0.000023158156,0.0010240321],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99938244,0.00000856473,0.00016145558,0.0001389347,0.000102157544,0.00020647234],"domain_scores_gemma":[0.9995721,0.000014083772,0.000015660538,0.00019425413,0.00017630865,0.00002760077],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002173679,0.000108778666,0.00013496229,0.00018495976,0.000044774777,0.00002310485,0.00008281004,0.00013644877,0.0007231165],"category_scores_gemma":[0.000031678217,0.00009203099,0.00006530544,0.0003317863,0.000013641556,0.00007462805,0.00000232262,0.00009193914,0.00007258218],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016062715,0.00006581993,0.00045187076,0.00008516148,0.00086211157,0.0000026040007,0.00038003168,0.12966791,0.4125879,0.399886,0.025529861,0.030464653],"study_design_scores_gemma":[0.0019117189,0.000041017396,0.00000767478,0.000014314705,0.00031553349,0.000011029476,0.00058841764,0.30075696,0.5294866,0.011238144,0.15517986,0.00044875994],"about_ca_topic_score_codex":0.000013860736,"about_ca_topic_score_gemma":0.000055735683,"teacher_disagreement_score":0.5892929,"about_ca_system_score_codex":0.00006889477,"about_ca_system_score_gemma":0.000023446455,"threshold_uncertainty_score":0.7917619},"labels":[],"label_agreement":null},{"id":"W2912325502","doi":"10.1016/j.micron.2019.01.005","title":"Radiation damage to organic and inorganic specimens in the TEM","year":2019,"lang":"en","type":"review","venue":"Micron","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":443,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Radiation damage; Materials science; Ionization; Radiation; Resolution (logic); Displacement (psychology); Radiolysis; Damage control; Irradiation; Optics; Composite material; Ion; Chemistry; Physics; Nuclear physics","score_opus":0.02220516967458926,"score_gpt":0.25037448704029175,"score_spread":0.22816931736570248,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2912325502","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0019531609,0.99670374,0.000018146484,0.000018491755,0.00014962762,0.00038404265,0.000019792515,0.000035225767,0.0007177504],"genre_scores_gemma":[0.0016124973,0.997671,0.000009529817,0.00006083862,0.00012301576,0.000011920999,0.000104514984,0.00005540681,0.000351268],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99917066,0.00006218611,0.00028537007,0.00020920798,0.00007647156,0.00019613285],"domain_scores_gemma":[0.99954236,0.0000495671,0.000039680614,0.00032698465,0.0000124504,0.000028965998],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016139315,0.0002482637,0.0006210048,0.00023987865,0.000022090697,0.00007479107,0.00024582393,0.00018818979,0.00018304326],"category_scores_gemma":[0.000010625313,0.00016727159,0.00009488839,0.0005630448,0.000006928404,0.000048207792,0.000018549961,0.0003827925,0.00050037284],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[6.3782693e-7,0.000022589371,0.000019177603,0.006078624,0.00034781944,0.000020604628,0.0023555963,0.000031008687,0.012608819,0.00018837601,0.016516872,0.9618099],"study_design_scores_gemma":[0.00004727377,0.000011201903,0.000017503213,0.000652008,0.00030124793,0.00001306169,0.000088514396,0.000018394196,0.00007620349,0.000002565206,0.9985575,0.00021452908],"about_ca_topic_score_codex":0.00003397149,"about_ca_topic_score_gemma":0.00012799338,"teacher_disagreement_score":0.98204064,"about_ca_system_score_codex":0.00018160361,"about_ca_system_score_gemma":0.000034986933,"threshold_uncertainty_score":0.68211377},"labels":[],"label_agreement":null},{"id":"W2914611278","doi":"10.1016/j.micron.2019.02.003","title":"Electron beam damage of epoxy resin films studied by scanning transmission X-ray spectromicroscopy","year":2019,"lang":"en","type":"article","venue":"Micron","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; Ontario Centres of Excellence","keywords":"Materials science; Focused ion beam; Acceleration voltage; Electron beam-induced deposition; Scanning electron microscope; Ion beam; Transmission electron microscopy; Radiation damage; Scanning transmission electron microscopy; Energy filtered transmission electron microscopy; Beam (structure); Analytical Chemistry (journal); Ion; Optics; Optoelectronics; Electron; Composite material; Cathode ray; Nanotechnology; Chemistry; Radiation; Physics","score_opus":0.0031110661562046165,"score_gpt":0.19364041211266161,"score_spread":0.19052934595645699,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2914611278","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9926721,0.0027902296,0.00070529315,0.000039697137,0.00011469229,0.00016413661,0.00002246005,0.000104832514,0.003386586],"genre_scores_gemma":[0.99736077,0.00019556805,0.000492841,0.000029403938,0.000026407097,0.0000036614754,0.0000848523,0.000052596948,0.0017538929],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99887764,0.000023661354,0.00032390386,0.0002559042,0.00013725879,0.00038164956],"domain_scores_gemma":[0.999541,0.00002117974,0.000056921584,0.00028084352,0.000044690492,0.00005538463],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001381071,0.00022474639,0.00038144342,0.00013292926,0.000045682547,0.00002851467,0.00020292222,0.0001284352,0.0005018344],"category_scores_gemma":[0.000003397449,0.0002047219,0.00012678464,0.0002694503,0.000025849135,0.000107489774,0.000009968154,0.00029139197,0.00006537034],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012562116,0.000025930573,0.00027300394,0.000057488283,0.00012250351,0.0000015159233,0.00040975361,0.0013138885,0.97509557,0.000015702832,0.022366837,0.00030526932],"study_design_scores_gemma":[0.00038756168,0.00010367683,0.00019443608,0.00007964553,0.000064654785,0.0000013296327,0.00020921376,0.0010438155,0.9828222,0.00001286902,0.014848557,0.00023208506],"about_ca_topic_score_codex":0.00014221977,"about_ca_topic_score_gemma":0.000010957241,"teacher_disagreement_score":0.0077266106,"about_ca_system_score_codex":0.00009567295,"about_ca_system_score_gemma":0.000021966693,"threshold_uncertainty_score":0.83483166},"labels":[],"label_agreement":null},{"id":"W2941005825","doi":"10.1109/radecs.2017.8696180","title":"Move the Laser Spot, Not the DUT: Investigating the New Micro-mirror Capability and Challenges for Localizing SEE Sites on Large Modern ICs","year":2017,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Laser; Optics; Laser scanning; Laser beams; Field of view; Micrometer; Computer science; Field (mathematics); Beam (structure); Physics; Electrical engineering; Engineering; Mathematics","score_opus":0.05499836587546301,"score_gpt":0.2532369439237617,"score_spread":0.19823857804829872,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2941005825","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9703871,0.0019500192,0.0020003256,0.020702567,0.00017465948,0.00054235413,0.000051187348,0.00013371783,0.0040580616],"genre_scores_gemma":[0.99766755,0.00022964303,0.00020994831,0.001059836,0.00014831815,0.000025302978,0.000005533221,0.00003483313,0.0006190272],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989888,0.000046716377,0.0002198146,0.00025539644,0.00014893059,0.00034032238],"domain_scores_gemma":[0.9985608,0.00044628035,0.00007661174,0.00077195995,0.00007443122,0.00006993562],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006584884,0.00022935939,0.0002131683,0.000023513707,0.00090952014,0.00030831076,0.000482088,0.00010960378,0.000036845264],"category_scores_gemma":[0.00024389193,0.00010154206,0.00012595419,0.000044653698,0.00015524804,0.00014435773,0.000059784623,0.00033626013,0.000009515453],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010211534,0.00022246821,0.009053771,0.0011512924,0.0032215936,0.000013090869,0.09751106,0.017498547,0.5845261,0.13408755,0.0384155,0.11419691],"study_design_scores_gemma":[0.0008641481,0.000068177615,0.0043685883,0.000118811186,0.0003961466,0.000012016118,0.010862345,0.7297423,0.19767395,0.014948756,0.04021016,0.0007346215],"about_ca_topic_score_codex":0.00062183244,"about_ca_topic_score_gemma":0.0043018092,"teacher_disagreement_score":0.71224374,"about_ca_system_score_codex":0.00003420767,"about_ca_system_score_gemma":0.000026016882,"threshold_uncertainty_score":0.6995386},"labels":[],"label_agreement":null},{"id":"W2948497441","doi":"10.11159/tann19.4","title":"Failure Mechanics of 2D Materials","year":2019,"lang":"en","type":"article","venue":"Proceedings of the International Conference of Theoretical and Applied Nanoscience and Nanotechnology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Computer science; Materials science; Mechanics; Physics","score_opus":0.005991150869983623,"score_gpt":0.1860151500813086,"score_spread":0.18002399921132498,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2948497441","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99661636,0.000022261858,0.00009138464,0.00047533488,0.00009429221,0.00008938077,0.000020433341,0.000017030257,0.0025734908],"genre_scores_gemma":[0.99963665,0.000106859465,0.0002000794,0.000019793162,0.0000055116616,0.0000038188923,6.040195e-7,0.0000046569953,0.00002199666],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993327,0.0000014654239,0.00024244515,0.00014627405,0.00016861396,0.00010847284],"domain_scores_gemma":[0.99961674,0.000022077274,0.000107909764,0.00006718871,0.00016798628,0.000018099445],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015475175,0.000092573806,0.00023679422,0.00011185234,0.000020221316,0.000016939652,0.00046772195,0.00012966005,0.00013733501],"category_scores_gemma":[0.000044261382,0.000060045215,0.00003093867,0.00017556248,0.0005134587,0.00006498682,0.00013083329,0.00010178339,6.6923747e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000057143807,0.0000044126787,0.000044501692,0.000025052661,0.000011716813,1.05598135e-8,0.000034264638,0.0000016309492,0.5046649,0.49490985,0.000007403048,0.0002905409],"study_design_scores_gemma":[0.000097392614,0.000035303434,0.00001596835,0.000049803213,0.000016331081,0.000004285513,0.0003931659,0.0011744002,0.84796727,0.15013106,0.000057838053,0.000057207202],"about_ca_topic_score_codex":0.0000038500657,"about_ca_topic_score_gemma":6.2859493e-7,"teacher_disagreement_score":0.3447788,"about_ca_system_score_codex":0.0000063494313,"about_ca_system_score_gemma":0.000011514453,"threshold_uncertainty_score":0.24485728},"labels":[],"label_agreement":null},{"id":"W2954108375","doi":"10.31399/asm.cp.istfa2018p0232","title":"Integration of Probing Capability into Plasma FIB for In-Situ Delayering, Defect Inspection, and EBAC on BEOL Defects of Sub-20nm FinFET Devices","year":2018,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Chemical-mechanical planarization; Polishing; Plasma; Integrated circuit; Controllability; Optoelectronics; Nanotechnology; Focused ion beam; Process (computing); Computer science; Ion; Chemistry; Physics; Composite material","score_opus":0.011911651916631126,"score_gpt":0.23267237095299775,"score_spread":0.22076071903636663,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2954108375","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9950616,0.0000622288,0.0036017518,0.00009723163,0.000070875394,0.00031598608,0.000028961804,0.00008288229,0.0006785061],"genre_scores_gemma":[0.995092,0.000023993947,0.0045759915,0.000013931686,0.000113313945,0.000100110956,0.000046397505,0.000024531939,0.000009736074],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986107,0.000008149137,0.0005938414,0.00039435862,0.00018682971,0.0002061189],"domain_scores_gemma":[0.9982512,0.00027624107,0.00026344918,0.00008719386,0.0010652752,0.000056642504],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00042893822,0.00024100729,0.0004709266,0.00065108953,0.00012291753,0.00007993791,0.00014945038,0.00013836706,0.0000033212914],"category_scores_gemma":[0.00053635,0.00022192203,0.00021473564,0.0008613203,0.00014386282,0.00029628736,0.000024351526,0.00013847383,3.192419e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006402052,0.00006691634,0.09284573,0.00045687336,0.001441629,1.908232e-7,0.0026145722,0.0022823235,0.8951687,0.002559626,0.000094107505,0.002405276],"study_design_scores_gemma":[0.0010084511,0.0007622495,0.009722132,0.0005063774,0.0019583527,0.00000895343,0.00139884,0.36919123,0.61286056,0.0017594195,0.00028129795,0.00054211746],"about_ca_topic_score_codex":0.00038858375,"about_ca_topic_score_gemma":0.0033178122,"teacher_disagreement_score":0.3669089,"about_ca_system_score_codex":0.00011239952,"about_ca_system_score_gemma":0.000017091541,"threshold_uncertainty_score":0.9049718},"labels":[],"label_agreement":null},{"id":"W2956965484","doi":"10.1109/vts.2019.8758629","title":"Innovative Practices on IEEE 1687.xyz","year":2019,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Standardization; Computer science; Session (web analytics); Port (circuit theory); Test (biology); IEEE floating point; Analogue electronics; Embedded system; Electronic circuit; Engineering; Electrical engineering; Operating system; World Wide Web","score_opus":0.015820420127029625,"score_gpt":0.23712024189396602,"score_spread":0.2212998217669364,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2956965484","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5631334,0.00001929441,0.00016201625,0.000070594884,0.00032286186,0.00005846931,0.0000029879716,0.00016397271,0.43606642],"genre_scores_gemma":[0.993155,0.000024217565,0.00009227944,0.00034294982,0.000071731316,0.000004219316,0.000010088751,0.000018589324,0.0062809447],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99945277,0.000010915313,0.00013445951,0.00013316848,0.000115181065,0.00015352928],"domain_scores_gemma":[0.9995696,0.00005502651,0.00005135007,0.00019677085,0.00010099924,0.000026236507],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.000075381504,0.00011403058,0.00013689848,0.00012275067,0.000017448974,0.0000401603,0.0001002248,0.00006755917,0.0022470965],"category_scores_gemma":[0.000026136557,0.00008568828,0.000036687932,0.0004779216,0.000007379014,0.00019556563,0.000003346177,0.00021081044,0.0022192092],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000025913738,0.0001232324,0.004765768,0.00009809985,0.0014311367,0.00002361153,0.0015731533,0.021807307,0.7406705,0.09109005,0.11500489,0.023386315],"study_design_scores_gemma":[0.00072446774,0.00028641967,0.0007780055,0.00007353226,0.000086669,0.000011070825,0.0026573665,0.044207033,0.44225875,0.00052742945,0.50736153,0.0010277042],"about_ca_topic_score_codex":0.000060043763,"about_ca_topic_score_gemma":0.000024701498,"teacher_disagreement_score":0.43002158,"about_ca_system_score_codex":0.00003847687,"about_ca_system_score_gemma":0.000012290546,"threshold_uncertainty_score":0.998665},"labels":[],"label_agreement":null},{"id":"W2957034537","doi":"10.18280/i2m.180110","title":"Microstructure Size Measurement Based on C-scan Image of Scanning Acoustic Microscopy","year":2019,"lang":"en","type":"article","venue":"Instrumentation Mesure Métrologie","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"National Natural Science Foundation of China","keywords":"Scanning acoustic microscope; Materials science; Acoustic microscopy; Resolution (logic); Microscopy; Wafer; Scanning electron microscope; Scanning probe microscopy; Scanning ion-conductance microscopy; Transducer; Optics; Scanning confocal electron microscopy; Acoustics; Optoelectronics; Physics; Computer science; Artificial intelligence; Composite material","score_opus":0.010964298635441962,"score_gpt":0.23704955474963393,"score_spread":0.22608525611419197,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2957034537","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9939467,0.00009240474,0.0024767437,0.000113075075,0.00064407365,0.000286096,0.00005987038,0.00017040373,0.0022106457],"genre_scores_gemma":[0.9974967,0.000009749712,0.0020495106,0.00027469383,0.000039653143,0.0000137712495,0.00004214888,0.000038351536,0.00003540283],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99847466,0.000068119465,0.00041333324,0.00028077376,0.00044260052,0.00032054354],"domain_scores_gemma":[0.9991785,0.00008252033,0.00012215122,0.00034594667,0.00021151776,0.000059359172],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003244382,0.00027016565,0.0003544093,0.00018237483,0.000048831032,0.00005082482,0.00022174139,0.00016008869,0.00064055214],"category_scores_gemma":[0.0000826583,0.00023889696,0.00015034874,0.0003106111,0.00005340685,0.00013885765,0.000010017084,0.0002772094,0.000050124498],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003809096,0.000018482873,0.0067893583,0.00007732793,0.000118134194,0.000002216227,0.00013580933,0.06761135,0.923236,0.000019860006,0.0009000207,0.0010533445],"study_design_scores_gemma":[0.0019523005,0.00032914893,0.018079106,0.00014518287,0.00022064759,0.000004036186,0.00082083803,0.03282982,0.94453764,0.00014646714,0.00044046825,0.0004943451],"about_ca_topic_score_codex":0.000039934734,"about_ca_topic_score_gemma":0.000023559478,"teacher_disagreement_score":0.03478153,"about_ca_system_score_codex":0.00025535174,"about_ca_system_score_gemma":0.00007986138,"threshold_uncertainty_score":0.9741935},"labels":[],"label_agreement":null},{"id":"W2992503855","doi":"10.5539/apr.v11n6p1","title":"Reliability Scaling of Nanoscale Avalanche Photodiodes in High-Speed Optical Communication","year":2019,"lang":"en","type":"article","venue":"Applied Physics Research","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Avalanche photodiode; APDS; Miniaturization; Microelectronics; Reliability (semiconductor); Photonics; Avalanche diode; Photodiode; Optoelectronics; Scaling; Avalanche breakdown; Computer science; Materials science; Breakdown voltage; Electrical engineering; Nanotechnology; Telecommunications; Physics; Detector; Engineering; Voltage; Power (physics)","score_opus":0.025990453000372515,"score_gpt":0.28139224282874736,"score_spread":0.25540178982837486,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2992503855","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96934175,0.000064936045,0.00013258765,0.000014648938,0.000026105812,0.00026766065,0.0000070993806,0.000040639366,0.030104551],"genre_scores_gemma":[0.99939686,0.00006539355,0.00035378523,0.0000053381596,0.000027263784,0.000022411996,0.000047927977,0.000025623332,0.000055389926],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986582,0.00007649199,0.0002926817,0.00021320462,0.00042451898,0.00033490104],"domain_scores_gemma":[0.99872077,0.000307618,0.000023009281,0.0007086642,0.00019050609,0.000049409406],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008858283,0.000113330716,0.00029890137,0.00012580503,0.000039786002,0.000029993864,0.00037023888,0.00012137428,0.00010492736],"category_scores_gemma":[0.00002340117,0.00010585466,0.000059159916,0.00081808586,0.0001237173,0.00008499803,0.00006504364,0.000710721,0.00013064024],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017563596,0.000090991045,0.0011815336,0.00010564586,0.000039234747,3.3986552e-7,0.0005967869,0.03150555,0.93709373,0.027237974,0.00015079914,0.0019798365],"study_design_scores_gemma":[0.0006465145,0.000027129641,0.0025710287,0.00008177236,0.00001538435,2.5864603e-7,0.0011766518,0.0676633,0.9143124,0.012935176,0.00030989377,0.0002604967],"about_ca_topic_score_codex":0.0003302739,"about_ca_topic_score_gemma":0.000020623616,"teacher_disagreement_score":0.036157746,"about_ca_system_score_codex":0.00012558023,"about_ca_system_score_gemma":0.000035226672,"threshold_uncertainty_score":0.4316628},"labels":[],"label_agreement":null},{"id":"W2998578337","doi":"10.1364/josaa.375703","title":"Generalized Talbot self-healing and noise mitigation of faulty periodic images","year":2020,"lang":"en","type":"article","venue":"Journal of the Optical Society of America A","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"Fonds de recherche du Québec – Nature et technologies; Natural Sciences and Engineering Research Council of Canada; Agence Nationale de la Recherche","keywords":"Jitter; Noise (video); Computer science; Image quality; Optics; Talbot effect; Energy (signal processing); Image noise; Process (computing); Computer vision; Physics; Image (mathematics); Diffraction; Telecommunications","score_opus":0.007737508052833629,"score_gpt":0.20799589313457653,"score_spread":0.2002583850817429,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2998578337","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98969394,0.0016075425,0.0057278518,0.0026693451,0.00007345297,0.000050820763,0.000008623012,0.000015940059,0.00015245452],"genre_scores_gemma":[0.978967,0.0010271654,0.019642591,0.00024630732,0.00009979435,3.978744e-7,7.5516334e-7,0.000011423267,0.0000045651473],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9991824,0.000026667733,0.00040028262,0.0000630835,0.00021971128,0.0001078661],"domain_scores_gemma":[0.99942404,0.000045738834,0.00020658883,0.000074951146,0.00015800558,0.000090682865],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010626778,0.000093765026,0.00034266437,0.000015146258,0.000038537488,0.000017565468,0.00014252309,0.00005148979,0.000027447242],"category_scores_gemma":[0.000055460685,0.000061354534,0.00039574702,0.00023269093,0.00014162574,0.00008756471,0.000019353616,0.0002731967,5.3351994e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015023683,0.000040178267,0.00043590297,0.00020306859,0.0006223728,9.097314e-7,0.005230484,0.010666279,0.9722949,0.000047984297,0.0056444993,0.00479837],"study_design_scores_gemma":[0.002213857,0.0005629828,0.0033048396,0.0003799256,0.0018016924,0.00006752999,0.009487858,0.55849314,0.4096702,0.00035406178,0.013080314,0.00058359385],"about_ca_topic_score_codex":0.00001304442,"about_ca_topic_score_gemma":1.1092579e-7,"teacher_disagreement_score":0.5626247,"about_ca_system_score_codex":0.000028467313,"about_ca_system_score_gemma":0.000031409192,"threshold_uncertainty_score":0.25019655},"labels":[],"label_agreement":null},{"id":"W3004567644","doi":"10.1016/j.bpj.2019.11.2373","title":"The Role of Electrostatics in the Desensitization of Cardiac Muscle Contraction","year":2020,"lang":"en","type":"article","venue":"Biophysical Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Government of Alberta; Ministry of Health; University of Alberta","funders":"","keywords":"Troponin I; Chemistry; Biophysics; Calmodulin; Troponin; Stereochemistry; Crystallography; Calcium; Internal medicine; Biology; Medicine; Organic chemistry","score_opus":0.006375680181967778,"score_gpt":0.19525218209281647,"score_spread":0.1888765019108487,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3004567644","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99801683,0.0001830271,0.0010615841,0.00029237114,0.00005538602,0.00004318603,0.000004767015,0.0000067894953,0.000336036],"genre_scores_gemma":[0.99964714,0.0001666718,0.000019986684,0.000025582252,0.00013216645,6.072775e-7,0.0000019420709,0.0000051440065,7.611222e-7],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995203,0.00005153081,0.0001785384,0.000030935298,0.00013428804,0.000084382475],"domain_scores_gemma":[0.9997192,0.00008084535,0.000052919277,0.000050161503,0.00007606062,0.000020838203],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009990966,0.000045931105,0.00010931203,0.000017512106,0.000034671226,0.000021285421,0.00007950428,0.000024049634,0.000002595915],"category_scores_gemma":[0.000033696007,0.000025486372,0.000081683625,0.00021853542,0.00002904695,0.00004929769,0.000002034256,0.00019881394,0.0000013932196],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000036355552,0.0000087031685,0.00005644454,0.0000027953258,0.000040040286,5.770559e-7,0.00061912806,0.0014839601,0.98714674,0.0015722035,0.00010424221,0.008961527],"study_design_scores_gemma":[0.00014683312,0.00009654783,0.0025522828,0.000015174285,0.00010752603,0.0000048896304,0.0036359217,0.13425379,0.85244435,0.001071931,0.005573872,0.00009689403],"about_ca_topic_score_codex":0.000010655678,"about_ca_topic_score_gemma":0.0000026366936,"teacher_disagreement_score":0.1347024,"about_ca_system_score_codex":0.000014370791,"about_ca_system_score_gemma":0.000011972696,"threshold_uncertainty_score":0.10393041},"labels":[],"label_agreement":null},{"id":"W3005743163","doi":"10.1088/1748-0221/15/02/c02013","title":"Effects of p doping on GaAs/AlGaAs SAM-APDs for X-rays detection","year":2020,"lang":"en","type":"article","venue":"Journal of Instrumentation","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Ministero dell’Istruzione, dell’Università e della Ricerca","keywords":"APDS; Avalanche photodiode; Optoelectronics; Doping; Materials science; Capacitance; Absorption (acoustics); Layer (electronics); Reverse bias; Multiplication (music); Drop (telecommunication); Photodiode; Optics; Physics; Nanotechnology; Detector; Diode; Telecommunications; Electrode; Computer science","score_opus":0.009542211769734016,"score_gpt":0.20813671327826955,"score_spread":0.19859450150853553,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3005743163","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9360728,0.000077689416,0.06306297,0.000093271214,0.00039260133,0.00011613781,0.0000023907535,0.000017743841,0.00016437266],"genre_scores_gemma":[0.9989218,0.00005547207,0.0006957504,0.00010437306,0.00019883993,0.0000033387555,0.000003213505,0.000013985024,0.0000032446758],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993372,0.000017661056,0.0003528873,0.00005669181,0.0001510014,0.000084544874],"domain_scores_gemma":[0.99955624,0.00006224742,0.00018272904,0.000035443463,0.00011572555,0.00004760011],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000083745384,0.000084612366,0.00018845449,0.00013665149,0.000027535889,0.000019567266,0.00006313158,0.000050613085,0.000012775117],"category_scores_gemma":[0.00006419377,0.00007305063,0.00013525315,0.00017492514,0.000007477636,0.00019335395,0.0000020814275,0.0001284691,0.0000022353665],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005517159,0.000014000382,0.000066389155,0.00019327064,0.000188191,0.000001947299,0.00069302646,0.010939599,0.9470438,0.00012755755,0.00019720836,0.040479835],"study_design_scores_gemma":[0.0008128924,0.0005403421,0.000316547,0.00010183209,0.00013871281,0.000005471658,0.00037108213,0.014544498,0.9825766,0.00011403309,0.0004011942,0.00007679045],"about_ca_topic_score_codex":0.0000044532035,"about_ca_topic_score_gemma":0.0000027599738,"teacher_disagreement_score":0.06284896,"about_ca_system_score_codex":0.000076763914,"about_ca_system_score_gemma":0.00001288922,"threshold_uncertainty_score":0.29789183},"labels":[],"label_agreement":null},{"id":"W3012508368","doi":"10.1109/tcad.2020.2982145","title":"Monitoring Aging Defects in STT-MRAMs","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Canada First Research Excellence Fund","keywords":"Testability; Tunnel magnetoresistance; Reliability (semiconductor); Computer science; CMOS; Scheme (mathematics); Electronic engineering; Process (computing); Spin-transfer torque; Materials science; Engineering; Reliability engineering; Power (physics); Nanotechnology; Magnetic field; Magnetization; Physics","score_opus":0.03653444929072989,"score_gpt":0.21830528285699174,"score_spread":0.18177083356626186,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3012508368","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.18589643,0.0007782016,0.811606,0.00001775739,0.0009492452,0.0003364853,0.00002384994,0.0002636267,0.0001284056],"genre_scores_gemma":[0.9991258,0.00027831394,0.00030236394,0.00003668525,0.00013282051,0.000038024846,0.0000036078018,0.00006175556,0.000020669522],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99793035,0.00018387022,0.0007738348,0.00043197902,0.0002799919,0.000399949],"domain_scores_gemma":[0.9990795,0.00020278273,0.00009750907,0.00024642813,0.00016553621,0.00020822996],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00026806645,0.0004069365,0.00072252343,0.00044559766,0.00008748951,0.000142653,0.00024190026,0.00022383692,0.000017655739],"category_scores_gemma":[0.00000660567,0.00036984275,0.00014668479,0.0009688259,0.000046484227,0.00023391897,0.0000011792843,0.0006367713,0.000013972257],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012302769,0.000055667715,0.00013359645,0.00021175282,0.0002780324,0.000040406514,0.0015160778,0.82637364,0.13512157,0.000060230115,0.0000925534,0.036104184],"study_design_scores_gemma":[0.00074432977,0.00033611892,0.00005167198,0.00089663535,0.00010021175,0.00003074024,0.0011759534,0.88593245,0.11009719,0.000015410216,0.00012508566,0.0004941987],"about_ca_topic_score_codex":0.00031331557,"about_ca_topic_score_gemma":0.000010542619,"teacher_disagreement_score":0.8132293,"about_ca_system_score_codex":0.0001378643,"about_ca_system_score_gemma":0.000055640186,"threshold_uncertainty_score":0.99987537},"labels":[],"label_agreement":null},{"id":"W3102317729","doi":"10.1063/5.0022852","title":"Lock-in carrierography non-destructive imaging of silicon wafers and silicon solar cells","year":2020,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"China Postdoctoral Science Foundation; Natural Sciences and Engineering Research Council of Canada; National Natural Science Foundation of China","keywords":"Lock (firearm); Silicon; Wafer; Photovoltaic system; Optoelectronics; Materials science; Heterodyne (poetry); Semiconductor; Photoluminescence; Computer science; SIGNAL (programming language); Engineering physics; Nanotechnology; Electrical engineering; Physics; Engineering; Acoustics; Mechanical engineering","score_opus":0.005650190318082488,"score_gpt":0.18349117714663477,"score_spread":0.1778409868285523,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3102317729","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9976267,0.00014931048,0.0007264004,0.000016952232,0.000074759795,0.000069395355,0.000010912575,0.000012064867,0.0013134608],"genre_scores_gemma":[0.99950624,0.0001020506,0.00014644254,0.00006388027,0.0001516725,0.000001086225,0.0000021778453,0.000026022946,4.330365e-7],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991149,0.000009191303,0.0004106164,0.00011884103,0.00017110707,0.00017539688],"domain_scores_gemma":[0.999498,0.00003219043,0.000171722,0.00009244717,0.00009299288,0.00011263359],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008025547,0.00017005774,0.0004423482,0.00012313353,0.00002031923,0.000025031773,0.00013255201,0.000054448014,0.000008260059],"category_scores_gemma":[0.0000030003644,0.00015618224,0.00014944319,0.00045218357,0.000057844736,0.00015025254,0.000012299544,0.00038810974,0.0000011768059],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029378536,0.000017051547,0.0009267352,0.000073883326,0.00021151596,0.000009896095,0.003073441,0.055107553,0.9356641,0.00021236608,0.00017753783,0.0044965534],"study_design_scores_gemma":[0.0007836523,0.00006734492,0.00037671108,0.00005551058,0.00019651078,0.0000050272247,0.003548042,0.040793926,0.9523845,0.0013084711,0.0002215847,0.0002587777],"about_ca_topic_score_codex":0.000016992399,"about_ca_topic_score_gemma":0.000002247826,"teacher_disagreement_score":0.016720356,"about_ca_system_score_codex":0.000032549167,"about_ca_system_score_gemma":0.00002865144,"threshold_uncertainty_score":0.6368927},"labels":[],"label_agreement":null},{"id":"W3105627035","doi":"10.1109/ipc47351.2020.9252272","title":"Low Leakage Current Mesa-type Avalanche Photodiodes with Zn-diffused Sidewall","year":2020,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Avalanche photodiode; Mesa; Optoelectronics; Photodiode; Materials science; Wafer; Gallium arsenide; Indium gallium arsenide; Leakage (economics); Single-photon avalanche diode; Optics; Physics; Detector","score_opus":0.01681296660747866,"score_gpt":0.19938108314491312,"score_spread":0.18256811653743446,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3105627035","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9471919,0.0019737468,0.0073959553,0.0005354816,0.00036800047,0.00029094281,0.000020383226,0.0015254912,0.040698085],"genre_scores_gemma":[0.9987705,0.00013671431,0.00016663455,0.00032755753,0.0001452353,0.00000774467,0.000037939513,0.00005100417,0.0003566833],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99898154,0.000018216346,0.00022198321,0.0002622274,0.00020759617,0.00030845302],"domain_scores_gemma":[0.99944645,0.000024524063,0.000026367628,0.00023019133,0.00009391429,0.00017855762],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00004673064,0.00025519394,0.00031438263,0.00006623532,0.000042448486,0.000075207034,0.00020499407,0.00007673265,0.0015955097],"category_scores_gemma":[0.000015717278,0.0001804866,0.000095395786,0.00045128982,0.000027902439,0.00013044158,0.000013399788,0.00033204185,0.00034390858],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010832969,0.00023647376,0.005793056,0.0007054493,0.0018181019,0.00014908426,0.007906228,0.01634052,0.73089236,0.002476165,0.20803931,0.025534945],"study_design_scores_gemma":[0.0019434383,0.00041598003,0.00038014274,0.00017128787,0.00051357533,0.000016534825,0.001924311,0.20761955,0.641797,0.000094767565,0.14332476,0.0017986638],"about_ca_topic_score_codex":0.000026400883,"about_ca_topic_score_gemma":0.00007639453,"teacher_disagreement_score":0.19127902,"about_ca_system_score_codex":0.000039422783,"about_ca_system_score_gemma":0.00003175053,"threshold_uncertainty_score":0.99931717},"labels":[],"label_agreement":null},{"id":"W3110244539","doi":"10.1093/jmicro/dfaa066","title":"Phase imaging dislocations using diffracted beam interferometry","year":2020,"lang":"en","type":"article","venue":"Microscopy","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Optics; Diffraction; Dislocation; Interference (communication); Interferometry; Phase (matter); Core (optical fiber); Beam (structure); Physics; Materials science; Condensed matter physics; Computer science; Telecommunications; Channel (broadcasting)","score_opus":0.0195063573680838,"score_gpt":0.27071447694166423,"score_spread":0.2512081195735804,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3110244539","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94134337,0.0004339946,0.05704845,0.00012659012,0.00019229713,0.00006492458,0.000044166074,0.00029369487,0.0004525175],"genre_scores_gemma":[0.9985768,0.000011427509,0.0008193176,0.00031952653,0.00012973302,0.0000035069577,0.000070178285,0.00004323356,0.00002625379],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992623,0.000010415173,0.00022717312,0.0001874858,0.0000757333,0.000236917],"domain_scores_gemma":[0.9996255,0.000014878773,0.0000270186,0.0001657202,0.000053471376,0.00011340889],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000030021978,0.0001650105,0.00019405452,0.000114612405,0.00007928024,0.00010226908,0.00016592859,0.000046780064,0.00032239297],"category_scores_gemma":[0.000023191289,0.00016251057,0.00008549239,0.00056841515,0.000031681357,0.00019049202,0.000017802831,0.00023107634,0.00008876977],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000029445735,0.00003567573,0.0002868459,0.00001825724,0.00006478976,0.000005991463,0.00054715975,0.0006870606,0.99605125,0.000013465955,0.0016298455,0.00065670675],"study_design_scores_gemma":[0.0006451969,0.000033327407,0.000033689987,0.000038938204,0.00012864644,0.000007527362,0.00066082465,0.17667805,0.8160984,0.000015911908,0.00532369,0.00033582686],"about_ca_topic_score_codex":0.000031754465,"about_ca_topic_score_gemma":0.0000022336524,"teacher_disagreement_score":0.17995289,"about_ca_system_score_codex":0.0000732666,"about_ca_system_score_gemma":0.00001706402,"threshold_uncertainty_score":0.66269886},"labels":[],"label_agreement":null},{"id":"W3111651134","doi":"10.31399/asm.cp.istfa2017p0171","title":"Debugging Signal Corruption in Scan Chain Using Phase Laser Voltage Imaging","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Amplifier; SIGNAL (programming language); Computer science; Debugging; Fault (geology); Phase (matter); Laser; Electronic engineering; Engineering; Optics; Physics; Telecommunications; Geology; Bandwidth (computing)","score_opus":0.0200572446178853,"score_gpt":0.27009019312995614,"score_spread":0.2500329485120708,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3111651134","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9771746,0.00010104475,0.01911469,0.00043297626,0.00019194925,0.0002162646,0.00006741636,0.00023130962,0.0024697573],"genre_scores_gemma":[0.9968416,0.000015274562,0.002558924,0.000043677162,0.00029736248,0.000038611823,0.000060584374,0.00004269759,0.00010128582],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9984196,0.00000505522,0.00047243785,0.00045246005,0.00026014604,0.0003903255],"domain_scores_gemma":[0.99895394,0.00008706047,0.0002577414,0.00014407218,0.00044929405,0.00010788947],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00045477814,0.00029376545,0.0004079108,0.00069540116,0.00046949086,0.0008240047,0.0003855235,0.000099894976,0.000037202848],"category_scores_gemma":[0.00024584652,0.00029798865,0.00021413395,0.00048976764,0.0000756532,0.0008405883,0.000053024498,0.0002458073,0.0000016289764],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000036302252,0.00010111402,0.38531825,0.00011431303,0.0020939838,0.000016342345,0.00083102385,0.026493188,0.5698482,0.0005603142,0.0002731201,0.014313906],"study_design_scores_gemma":[0.0007908068,0.000021598365,0.0011430341,0.00011652804,0.0010208916,0.000017519706,0.00034601495,0.99042034,0.004964726,0.00031397806,0.00047588706,0.00036866948],"about_ca_topic_score_codex":0.0007882916,"about_ca_topic_score_gemma":0.00025589226,"teacher_disagreement_score":0.96392715,"about_ca_system_score_codex":0.00022208955,"about_ca_system_score_gemma":0.00001798206,"threshold_uncertainty_score":0.99994725},"labels":[],"label_agreement":null},{"id":"W3111786897","doi":"10.31399/asm.cp.istfa2001p0043","title":"Resistive Interconnection Localization","year":2001,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":35,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Interconnection; Resistive touchscreen; Electrical conductor; Optoelectronics; Materials science; Laser; SIGNAL (programming language); Microscope; Electrical engineering; Electronic engineering; Optics; Computer science; Engineering; Physics; Telecommunications","score_opus":0.012028093136992213,"score_gpt":0.21831143049891438,"score_spread":0.20628333736192217,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3111786897","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.712328,0.00035341879,0.24156733,0.002185606,0.00072442257,0.0005659667,0.00009846016,0.0015065257,0.04067026],"genre_scores_gemma":[0.99723,0.00008831666,0.0017478851,0.000084339874,0.00028892,0.00006262432,0.00010818089,0.000031123363,0.00035858736],"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99885267,0.0000047381477,0.00035880355,0.00035201028,0.000196348,0.00023542998],"domain_scores_gemma":[0.99890053,0.00011078675,0.000074036856,0.000070490125,0.00076001964,0.00008415644],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020315727,0.00021839135,0.0002792424,0.00049254886,0.00018734254,0.0002550719,0.00016869396,0.000119207114,0.000054504057],"category_scores_gemma":[0.00024409308,0.00020967617,0.00018367222,0.0013235771,0.00004015622,0.00038591953,0.000019610829,0.00013851126,0.000005162097],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016490294,0.00021536347,0.48066124,0.00031540607,0.021086903,0.000013879304,0.003784397,0.1100967,0.33029833,0.016047176,0.018069774,0.019245941],"study_design_scores_gemma":[0.0003754615,0.00007576342,0.0009315091,0.00006369461,0.002200994,0.00003689163,0.00089046045,0.9620438,0.004352661,0.0011633256,0.027397096,0.0004683485],"about_ca_topic_score_codex":0.00014690573,"about_ca_topic_score_gemma":0.00012179241,"teacher_disagreement_score":0.85194707,"about_ca_system_score_codex":0.00011908072,"about_ca_system_score_gemma":0.0000062324175,"threshold_uncertainty_score":0.85503465},"labels":[],"label_agreement":null},{"id":"W3113127598","doi":"10.31399/asm.cp.istfa2017p0221","title":"Laser Voltage Tracing for Electrical Fault Isolation of Circuits Propagating Aperiodic Signals","year":2017,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Aperiodic graph; Tracing; Debugging; Voltage; Laser; Fault (geology); Computer science; Electronic engineering; Electrical engineering; Engineering; Optics; Physics; Mathematics","score_opus":0.017014250693945625,"score_gpt":0.24475298382482996,"score_spread":0.22773873313088433,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3113127598","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.85211074,0.00011897428,0.1423243,0.0005594646,0.00018992274,0.00069480244,0.00017022058,0.00026864198,0.0035629252],"genre_scores_gemma":[0.9933805,0.000014085959,0.005898614,0.000024219667,0.0002771558,0.00013134035,0.00007101982,0.000040140018,0.00016293833],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9983929,0.0000040982777,0.0005934535,0.00040973737,0.00027311116,0.0003267244],"domain_scores_gemma":[0.9979324,0.00025308825,0.00044227383,0.0001567923,0.0011264994,0.00008895406],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004312045,0.00026498496,0.0005022145,0.0003907157,0.00050782843,0.0004944519,0.00045056024,0.0001580196,0.000014602717],"category_scores_gemma":[0.0012789466,0.00025005135,0.00034221885,0.00042337627,0.00006673121,0.00056114566,0.000036200978,0.00017672473,8.231279e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001582161,0.000049591723,0.04233606,0.00023258316,0.0031312546,7.8613255e-7,0.0005996591,0.006121387,0.9336741,0.0006571094,0.00042423388,0.012757439],"study_design_scores_gemma":[0.0004984645,0.00010462333,0.00084315764,0.000103605315,0.0018814568,0.00000685246,0.00020236518,0.9437871,0.051182937,0.00065668556,0.00037821167,0.00035452362],"about_ca_topic_score_codex":0.00009288499,"about_ca_topic_score_gemma":0.00003435715,"teacher_disagreement_score":0.9376657,"about_ca_system_score_codex":0.00007665133,"about_ca_system_score_gemma":0.000018976556,"threshold_uncertainty_score":0.9999952},"labels":[],"label_agreement":null},{"id":"W3114038705","doi":"10.31399/asm.cp.istfa2002p0553","title":"Advanced sub 0.13µm Cu Devices – Failure Analysis and Circuit Edit With Improved FIB Chemical Processes and Beam Characteristics","year":2002,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Etching (microfabrication); Materials science; Focused ion beam; Dielectric; Ion beam; Optoelectronics; Isotropic etching; Beam (structure); Nanotechnology; Ion; Optics; Chemistry; Layer (electronics)","score_opus":0.008604323796260489,"score_gpt":0.19166153963333424,"score_spread":0.18305721583707374,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3114038705","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9948721,0.0004802189,0.0026804325,0.0006506728,0.00005230863,0.00027382938,0.00017640227,0.00029881616,0.00051522703],"genre_scores_gemma":[0.9956993,0.00019216712,0.0032556257,0.000076651995,0.00028120173,0.000116308904,0.00019479496,0.00005565083,0.00012829335],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9978351,0.0000053968524,0.0005751742,0.0007839662,0.00034476977,0.00045558254],"domain_scores_gemma":[0.99794817,0.00025562334,0.00028876326,0.00013580613,0.0011418705,0.00022976715],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001864731,0.00050446816,0.00081417937,0.00074638426,0.00024890222,0.00062744966,0.0002621655,0.000214162,0.000037880614],"category_scores_gemma":[0.00032141025,0.00043539994,0.00018857936,0.002456388,0.0001409925,0.00065791997,0.000051845276,0.00030808625,0.0000012561075],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006109401,0.000161748,0.40155128,0.0012014807,0.028779684,0.000009722566,0.0023157066,0.0007509084,0.55319417,0.00030797502,0.0005098523,0.011156393],"study_design_scores_gemma":[0.0027740893,0.0005547082,0.010586932,0.00050623866,0.052988004,0.00021346442,0.002758594,0.86646473,0.051422145,0.00039639484,0.007813991,0.0035206801],"about_ca_topic_score_codex":0.000082794,"about_ca_topic_score_gemma":0.0002497915,"teacher_disagreement_score":0.86571383,"about_ca_system_score_codex":0.00007384443,"about_ca_system_score_gemma":0.000013754033,"threshold_uncertainty_score":0.9998098},"labels":[],"label_agreement":null},{"id":"W3114386684","doi":"10.31399/asm.cp.istfa2004p0151","title":"A Novel Approach for Enhancing Critical FIB Imaging for Failure Analysis and Circuit Edit Applications","year":2004,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Focused ion beam; Materials science; Secondary electrons; Optoelectronics; Electrical conductor; Electrode; Nanotechnology; Ion; Electron; Composite material; Chemistry","score_opus":0.012624735943661243,"score_gpt":0.23736497725987032,"score_spread":0.2247402413162091,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3114386684","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.006873314,0.00018166805,0.9897025,0.0011586655,0.00006914961,0.00073668186,0.0004691806,0.000276093,0.0005327512],"genre_scores_gemma":[0.8563402,0.000015076276,0.14087696,0.00009810104,0.0005962288,0.0014327072,0.0005125196,0.000061826155,0.000066357454],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99763024,0.0000034153861,0.0006804677,0.0008518804,0.00029086557,0.00054313766],"domain_scores_gemma":[0.99752355,0.0005340973,0.00017879749,0.00015476976,0.0014055992,0.00020316176],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00047159294,0.0004255663,0.00070972595,0.0010212361,0.0004997799,0.00060839736,0.00032602742,0.00016247515,0.00000792658],"category_scores_gemma":[0.00054277375,0.00042552664,0.0006234501,0.0019501855,0.00011376361,0.0004983857,0.000040111372,0.00021746462,5.281795e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006405408,0.00044881392,0.029285543,0.0018684666,0.036840767,0.0000014467562,0.0024946628,0.07903605,0.7746469,0.06901235,0.0011765745,0.005124376],"study_design_scores_gemma":[0.0017405333,0.00010614322,0.00027840747,0.00009301191,0.028091,0.000054838518,0.0023151333,0.94481534,0.009079806,0.0064450796,0.0057416186,0.0012390871],"about_ca_topic_score_codex":0.00014935673,"about_ca_topic_score_gemma":0.00019491579,"teacher_disagreement_score":0.8657793,"about_ca_system_score_codex":0.00017712056,"about_ca_system_score_gemma":0.000030917265,"threshold_uncertainty_score":0.99981964},"labels":[],"label_agreement":null},{"id":"W3114744922","doi":"10.31399/asm.cp.istfa2005p0245","title":"Dynamic Electroluminescence Imaging (DEI) as an “Optical Oscilloscope” Probe","year":2005,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Canada","funders":"","keywords":"Oscilloscope; Waveform; Bandwidth (computing); Computer science; Electroluminescence; Electronic engineering; Transmission (telecommunications); SIGNAL (programming language); Radio frequency; Electronic circuit; Electrical engineering; Optoelectronics; Materials science; Voltage; Engineering; Telecommunications; Detector","score_opus":0.005898569836075854,"score_gpt":0.22829172257331498,"score_spread":0.22239315273723914,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3114744922","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9628535,0.00033419553,0.019197665,0.004065432,0.00019145447,0.0004375617,0.000050883875,0.0010107532,0.01185854],"genre_scores_gemma":[0.9798746,0.000037620124,0.019015793,0.00018314742,0.00026909704,0.00008005542,0.00010185649,0.000053119802,0.0003847138],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99808985,0.0000052573705,0.00048429443,0.0005900576,0.00034673652,0.00048383226],"domain_scores_gemma":[0.9987336,0.00008877598,0.00011710666,0.00013110344,0.00073357497,0.00019584516],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00029617723,0.00034641262,0.00040394405,0.0005035102,0.00022134854,0.000489642,0.00039418146,0.000114299415,0.00005623015],"category_scores_gemma":[0.00022275951,0.00033089673,0.00022653835,0.0010759609,0.000075549,0.00085622555,0.000033075215,0.00027097107,0.000013057252],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000035503876,0.00016435508,0.054315895,0.00011092828,0.0035123776,0.0000061063706,0.0008857236,0.0072830436,0.9115044,0.0061801206,0.00086807035,0.0151334815],"study_design_scores_gemma":[0.00032937535,0.00008040523,0.00050615,0.00004395843,0.0016777168,0.0000613325,0.00032336876,0.9827716,0.008475831,0.0006054379,0.0045918445,0.0005330221],"about_ca_topic_score_codex":0.00011945719,"about_ca_topic_score_gemma":0.00018378685,"teacher_disagreement_score":0.9754885,"about_ca_system_score_codex":0.00019243988,"about_ca_system_score_gemma":0.000022504168,"threshold_uncertainty_score":0.9999143},"labels":[],"label_agreement":null},{"id":"W3115183948","doi":"10.31399/asm.cp.istfa2013p0001","title":"Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry","year":2013,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Reflectometry; Fault detection and isolation; Chip; Squid; Electronic engineering; Fault (geology); Device under test; Time domain; Computer science; Materials science; Electrical engineering; Engineering; Scattering parameters; Computer vision; Geology","score_opus":0.010764844939909184,"score_gpt":0.23546076494994633,"score_spread":0.22469592001003716,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3115183948","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9847085,0.000035895664,0.0027136556,0.00079966045,0.000053146145,0.00047633515,0.000019884332,0.000117265634,0.01107566],"genre_scores_gemma":[0.9808504,0.000009935627,0.018423704,0.000066920766,0.0001244792,0.00023953248,0.00007261139,0.000041910764,0.00017050443],"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99846596,0.000006533082,0.0004320663,0.0004905395,0.00026452055,0.00034036045],"domain_scores_gemma":[0.99872315,0.00013581711,0.00018053249,0.00010190928,0.0007524123,0.00010620431],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00026522262,0.0003085181,0.0004608965,0.00082480896,0.00014748622,0.0007831764,0.0004281283,0.00013850648,0.00005905231],"category_scores_gemma":[0.000097288634,0.00025947555,0.00011512223,0.0022133158,0.000049318838,0.0011421305,0.000056072317,0.0002548423,0.0000067397837],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000055414042,0.00008616299,0.73323375,0.00013795591,0.005105798,0.0000035926337,0.0025911012,0.0120002935,0.24137191,0.002504152,0.0008946594,0.0020152368],"study_design_scores_gemma":[0.002434089,0.0003826899,0.061958652,0.00043243336,0.0024403755,0.000055564662,0.00739939,0.9067266,0.00849981,0.005988197,0.0019802758,0.0017018944],"about_ca_topic_score_codex":0.0014926903,"about_ca_topic_score_gemma":0.0007616155,"teacher_disagreement_score":0.89472634,"about_ca_system_score_codex":0.00016359886,"about_ca_system_score_gemma":0.000018981425,"threshold_uncertainty_score":0.99998575},"labels":[],"label_agreement":null},{"id":"W3115278549","doi":"10.31399/asm.cp.istfa2000p0017","title":"Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis","year":2000,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"NMOS logic; Materials science; Optoelectronics; Substrate (aquarium); CMOS; Layer (electronics); Die (integrated circuit); Beam (structure); Power (physics); Electronic engineering; Electrical engineering; Optics; Engineering; Nanotechnology; Transistor; Voltage; Physics","score_opus":0.01386571004556713,"score_gpt":0.23426177464191342,"score_spread":0.22039606459634628,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3115278549","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9653959,0.000089512556,0.030767554,0.00051131,0.000099513374,0.0005601489,0.0002917037,0.00026739112,0.002016962],"genre_scores_gemma":[0.99197376,0.0000183127,0.0068667186,0.000032251955,0.00022339191,0.00022244852,0.0005003682,0.00004620407,0.0001165744],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.997798,0.0000061326928,0.000818936,0.0006097502,0.00036465438,0.00040247524],"domain_scores_gemma":[0.9981368,0.00035077642,0.0002506631,0.00017523773,0.0009311803,0.00015532572],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00031361202,0.00037784464,0.0008004631,0.0008303048,0.00016170008,0.00022054138,0.00038221234,0.00023202051,0.00008880602],"category_scores_gemma":[0.00022051673,0.00036325373,0.0007083922,0.0024259596,0.00005180826,0.00038910477,0.000022175056,0.00019938397,0.000003944502],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008503744,0.00028337684,0.063944936,0.0002631588,0.025633559,6.860426e-7,0.0007474212,0.029553981,0.86355907,0.002534198,0.0007686497,0.012625944],"study_design_scores_gemma":[0.0013710484,0.00036414177,0.0023714565,0.000102266466,0.026961558,0.0000113829465,0.0006441941,0.88590974,0.07258474,0.0007539805,0.007826405,0.001099059],"about_ca_topic_score_codex":0.00017659072,"about_ca_topic_score_gemma":0.00013345605,"teacher_disagreement_score":0.8563558,"about_ca_system_score_codex":0.00013029856,"about_ca_system_score_gemma":0.000016006043,"threshold_uncertainty_score":0.9998819},"labels":[],"label_agreement":null},{"id":"W3116435867","doi":"10.31399/asm.cp.istfa2004p0613","title":"DEI Analysis of an OTP EPROM: Dynamic Electroluminescence Imaging (DEI) Applied to an OTP EPROM Memory Device","year":2004,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institute for Microstructural Sciences","funders":"","keywords":"EPROM; Electroluminescence; CMOS; Photomultiplier; Non-volatile memory; Computer science; Computer hardware; Electrical engineering; Materials science; Engineering; Layer (electronics)","score_opus":0.007820609583901898,"score_gpt":0.23443826939758072,"score_spread":0.22661765981367882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3116435867","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98052233,0.000099433266,0.016607998,0.00045105303,0.00007623592,0.00035069592,0.00010715346,0.00036366694,0.0014214532],"genre_scores_gemma":[0.98381245,0.000014200371,0.015210815,0.00015034304,0.00014300754,0.00013123368,0.00040798238,0.00007098044,0.000059007078],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9969923,0.0000109354205,0.00088167924,0.000984358,0.0005445394,0.00058621046],"domain_scores_gemma":[0.99772227,0.00010924469,0.0003152719,0.00030656927,0.0012387428,0.00030787534],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00056564267,0.0005081598,0.00094926526,0.0019384876,0.0002450141,0.0003737459,0.0007028089,0.00016051481,0.0000356026],"category_scores_gemma":[0.00017229696,0.0005097238,0.0004475156,0.005026428,0.00008045788,0.0007374265,0.00005600118,0.000296297,0.0000036250026],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004421067,0.00017109004,0.020576071,0.000104526516,0.010308418,0.0000042987012,0.0019078205,0.13639112,0.8258245,0.0010122104,0.000031548476,0.0036242066],"study_design_scores_gemma":[0.0007399282,0.00018278293,0.0045243595,0.000084572544,0.01797456,0.000022116823,0.0019492497,0.93548584,0.03712922,0.00066323084,0.00018931864,0.0010548317],"about_ca_topic_score_codex":0.00097579125,"about_ca_topic_score_gemma":0.0010824994,"teacher_disagreement_score":0.79909474,"about_ca_system_score_codex":0.00029305532,"about_ca_system_score_gemma":0.00004256757,"threshold_uncertainty_score":0.9997354},"labels":[],"label_agreement":null},{"id":"W3116952266","doi":"10.31399/asm.cp.istfa2006p0311","title":"Applications of Soft Defect Localization (SDL) on AMD Advanced SOI Microprocessors","year":2006,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Node (physics); Silicon on insulator; Computer science; Root cause; Voltage; Process (computing); Logic gate; Embedded system; Electronic engineering; Silicon; Electrical engineering; Materials science; Engineering; Reliability engineering; Optoelectronics; Operating system","score_opus":0.005002173297937989,"score_gpt":0.20601673673769322,"score_spread":0.20101456343975524,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3116952266","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6277001,0.00068127585,0.3502937,0.0007097608,0.00020067027,0.0010396022,0.00032827543,0.000932646,0.018113965],"genre_scores_gemma":[0.9958385,0.000017026616,0.0033268565,0.000039851766,0.00016503654,0.00015529463,0.00020689933,0.00003611536,0.00021436844],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9986687,0.0000035804155,0.0004830915,0.00036795836,0.0002504762,0.00022619734],"domain_scores_gemma":[0.99864155,0.00013521577,0.00020793287,0.00009522299,0.00086607534,0.000054026026],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015437747,0.0002399756,0.00034903316,0.000517509,0.00018032502,0.00014969823,0.00021871107,0.00011622617,0.000016756692],"category_scores_gemma":[0.00009327607,0.00022809011,0.00027007764,0.0014050864,0.000067774905,0.00020329333,0.000015655653,0.00012682697,0.0000029065884],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000057907586,0.0002662395,0.08729865,0.0005648618,0.0052923374,0.0000010730364,0.0006049563,0.4633181,0.41007218,0.015100396,0.0023944525,0.015028828],"study_design_scores_gemma":[0.0009917362,0.00018396358,0.0007547463,0.00017750655,0.004425198,0.000013051794,0.00062347465,0.8926318,0.06462442,0.004662005,0.029967604,0.0009444489],"about_ca_topic_score_codex":0.00018302222,"about_ca_topic_score_gemma":0.000084308194,"teacher_disagreement_score":0.42931372,"about_ca_system_score_codex":0.00007740912,"about_ca_system_score_gemma":0.000012892187,"threshold_uncertainty_score":0.93012446},"labels":[],"label_agreement":null},{"id":"W3117171627","doi":"10.31399/asm.cp.istfa2007p0337","title":"Latch-Up Root Cause Analysis for New ASIC Design","year":2007,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Interconnection; Application-specific integrated circuit; Root cause; Transistor; Wafer; Stress (linguistics); Guard (computer science); Computer science; Electronic engineering; Materials science; Electrical engineering; Optoelectronics; Engineering; Voltage; Reliability engineering; Telecommunications","score_opus":0.030246424752174848,"score_gpt":0.25349310922784024,"score_spread":0.2232466844756654,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3117171627","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.11082882,0.00021404898,0.8851875,0.00075072306,0.00030160326,0.0005113276,0.0000905963,0.00051826594,0.0015971021],"genre_scores_gemma":[0.9659342,0.000021252215,0.031588346,0.0000773737,0.0005542526,0.00007764832,0.00022061726,0.000063471394,0.0014628068],"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99768835,0.0000059011218,0.0007312361,0.0006285529,0.00036259758,0.00058336207],"domain_scores_gemma":[0.99769944,0.00061167375,0.00022900391,0.00015467171,0.0010356787,0.0002695592],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00088446605,0.00041736203,0.00070309796,0.001394871,0.00025413017,0.0004088592,0.0003877971,0.00022515413,0.000056445817],"category_scores_gemma":[0.0004450852,0.00039696222,0.00072928466,0.00331833,0.000045872403,0.00039858668,0.00002911899,0.00021587698,0.000003718193],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003166473,0.00020432842,0.39452824,0.0003495008,0.16095805,0.00001235352,0.0042364723,0.17708333,0.20775115,0.010241704,0.028472034,0.015846185],"study_design_scores_gemma":[0.0013367748,0.0002052765,0.0038638175,0.000058819005,0.043169577,0.000020638603,0.0007895536,0.91371155,0.016445482,0.0023302354,0.016757376,0.0013108954],"about_ca_topic_score_codex":0.00033103686,"about_ca_topic_score_gemma":0.0006073425,"teacher_disagreement_score":0.8551054,"about_ca_system_score_codex":0.00017302227,"about_ca_system_score_gemma":0.00003074296,"threshold_uncertainty_score":0.99984825},"labels":[],"label_agreement":null},{"id":"W3117325263","doi":"10.31399/asm.cp.istfa2002p0747","title":"The Influence of Optical Beams on Semiconductor Devices During Failure Analysis","year":2002,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Optoelectronics; CMOS; Semiconductor; Transistor; Laser; Wavelength; Semiconductor laser theory; Laser beams; Optics; Electrical engineering; Engineering; Physics","score_opus":0.010392182031802722,"score_gpt":0.20973852224270767,"score_spread":0.19934634021090494,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3117325263","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9969098,0.00016042194,0.00017369234,0.0008248207,0.000057418085,0.00015710227,0.00006001022,0.00016672224,0.0014900024],"genre_scores_gemma":[0.9979777,0.000094614166,0.0012988782,0.000044984776,0.00016287058,0.0000654499,0.000032599943,0.000035059464,0.00028787297],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9978391,0.000009418012,0.0007215549,0.000511743,0.0004903935,0.00042778446],"domain_scores_gemma":[0.99796546,0.00048122733,0.00027111193,0.00020556242,0.0009366715,0.00013997784],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000305385,0.00036649487,0.0006009472,0.0007467106,0.0003760271,0.00035823902,0.00054192333,0.00016971037,0.00004772899],"category_scores_gemma":[0.00042158816,0.00027807787,0.00053951045,0.0028179637,0.00014049868,0.00038352047,0.0000472683,0.00031704185,0.0000054474826],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000042750973,0.00014806788,0.21562167,0.00025825136,0.0421063,0.0000049176124,0.0017294039,0.2741258,0.45929414,0.004362121,0.0010489895,0.0012575834],"study_design_scores_gemma":[0.0012530755,0.0002976499,0.03131121,0.00027278118,0.029602468,0.00004342058,0.0026064282,0.8753536,0.050185908,0.00048439548,0.006799432,0.0017896711],"about_ca_topic_score_codex":0.00008949691,"about_ca_topic_score_gemma":0.00014919486,"teacher_disagreement_score":0.60122776,"about_ca_system_score_codex":0.00010171961,"about_ca_system_score_gemma":0.000006548059,"threshold_uncertainty_score":0.99996716},"labels":[],"label_agreement":null},{"id":"W3120081796","doi":"10.31399/asm.cp.istfa2008p0402","title":"Combining Refractive Solid Immersion Lens and Pulsed Laser Induced Techniques for Effective Defect Localization on Microprocessors","year":2008,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Lock-in amplifier; Laser; Amplifier; Immersion (mathematics); Optics; Lens (geology); Sensitivity (control systems); Image resolution; Optoelectronics; Microprocessor; Computer science; Electronic engineering; Computer hardware; Engineering; Physics; CMOS","score_opus":0.014935626970779709,"score_gpt":0.24124777126484898,"score_spread":0.22631214429406926,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3120081796","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9838598,0.00005891291,0.013136498,0.00030984476,0.00008767708,0.0006860221,0.00007636885,0.00032888947,0.0014560388],"genre_scores_gemma":[0.99744356,0.0000660925,0.0017117821,0.00011763745,0.00013711133,0.00026822256,0.00015037763,0.000048039907,0.000057151698],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99868816,0.000008694932,0.00035209022,0.00047909957,0.00019978374,0.00027219616],"domain_scores_gemma":[0.9984573,0.00035894688,0.0001780385,0.00006765174,0.00086310756,0.000074919684],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00025785633,0.0003017018,0.0004267812,0.0005465795,0.000395244,0.00013492048,0.00012971219,0.00018489783,0.0000042603565],"category_scores_gemma":[0.00031559324,0.00027833474,0.00022382835,0.0007379117,0.000056674962,0.0003894623,0.000021679572,0.00020690654,9.150332e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022371935,0.00014587266,0.037208173,0.0003160446,0.007188155,0.000003844143,0.002964909,0.0060885446,0.9362323,0.00059771637,0.0013065927,0.007724119],"study_design_scores_gemma":[0.0012262883,0.0007525357,0.00065651524,0.0002709289,0.0032139202,0.000046053072,0.0010724346,0.5713951,0.41789025,0.0004731392,0.0021184797,0.00088434597],"about_ca_topic_score_codex":0.000095759424,"about_ca_topic_score_gemma":0.00001659346,"teacher_disagreement_score":0.56530654,"about_ca_system_score_codex":0.000132019,"about_ca_system_score_gemma":0.000011264341,"threshold_uncertainty_score":0.99996686},"labels":[],"label_agreement":null},{"id":"W3121313763","doi":"10.1109/itc44778.2020.9325280","title":"Memory repair logic sharing techniques and their impact on yield","year":2020,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Siemens (Canada)","funders":"","keywords":"Cluster analysis; Yield (engineering); Logic gate; Computer science; Silicon; Reliability engineering; Materials science; Engineering; Optoelectronics; Artificial intelligence; Algorithm","score_opus":0.025738715385303135,"score_gpt":0.22775760175915252,"score_spread":0.20201888637384938,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3121313763","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.78865254,0.00073070865,0.0016851501,0.00053322804,0.00005959229,0.00018072443,0.0000127524745,0.003781371,0.20436396],"genre_scores_gemma":[0.9989681,0.00006902908,0.00012786739,0.0005232158,0.00010118214,0.000004430432,0.0000036601941,0.000019934983,0.00018257686],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995015,0.000004766618,0.00012234795,0.00017544568,0.000047620422,0.00014826859],"domain_scores_gemma":[0.9997107,0.000029153458,0.000010584005,0.00014708992,0.00001774768,0.0000847242],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000054141325,0.00015988195,0.00018307535,0.000057067547,0.000028253251,0.00003554137,0.000092148424,0.000076913944,0.00048468052],"category_scores_gemma":[0.00001590679,0.000093257695,0.00012356805,0.00014518472,0.000011859626,0.00007823818,0.000016469421,0.00019116647,0.000020482463],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000059032285,0.00006858219,0.0026432904,0.00028885744,0.0021172345,0.00018824007,0.0064814766,0.0087143285,0.78918433,0.009472913,0.09639922,0.08438248],"study_design_scores_gemma":[0.00016928944,0.00045954666,0.00016780112,0.00008940277,0.00007623067,0.000033117274,0.0015296885,0.13430491,0.85383505,0.0010342421,0.0075590243,0.00074167724],"about_ca_topic_score_codex":0.0000758363,"about_ca_topic_score_gemma":0.000009165478,"teacher_disagreement_score":0.21031559,"about_ca_system_score_codex":0.000028699147,"about_ca_system_score_gemma":0.0000041913822,"threshold_uncertainty_score":0.5306912},"labels":[],"label_agreement":null},{"id":"W3121786052","doi":"10.1007/s12095-020-00469-5","title":"Quiescent photonics side channel analysis: Low cost SRAM readout attack","year":2021,"lang":"en","type":"article","venue":"Cryptography and Communications","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Photonics; Static random-access memory; Channel (broadcasting); Computer science; Substrate (aquarium); Flash (photography); Optoelectronics; Photon; Computer hardware; Embedded system; Materials science; Optics; Telecommunications; Physics","score_opus":0.025129568954345673,"score_gpt":0.2511682808218927,"score_spread":0.226038711867547,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3121786052","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6616343,0.109712355,0.068712115,0.0037857848,0.0007524954,0.0011394109,0.00068336364,0.0020770733,0.15150307],"genre_scores_gemma":[0.9888615,0.009215411,0.0011607785,0.00020796995,0.000015960743,0.00006333602,0.00040097334,0.000021483218,0.000052570766],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990543,0.00007317357,0.00029988345,0.0002088211,0.000115436575,0.00024838868],"domain_scores_gemma":[0.99803394,0.00007915225,0.000045311488,0.0015287243,0.00019231465,0.00012055449],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000104271145,0.00018592688,0.00031220354,0.00032904814,0.00028916486,0.00013799938,0.0004172999,0.00011660413,0.00008118841],"category_scores_gemma":[0.000015765421,0.00018909188,0.0003271921,0.0021822217,0.00014293431,0.00011823317,0.00008433464,0.00034984798,0.00001450045],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007035889,0.0046470147,0.049419567,0.0012054493,0.097026154,0.00015709532,0.045640733,0.20424774,0.10667926,0.29273394,0.046815056,0.15135762],"study_design_scores_gemma":[0.0017036862,0.00007535356,0.015374189,0.0004157491,0.011666154,0.000059060654,0.024374634,0.54991597,0.027963312,0.005394322,0.3600535,0.0030040543],"about_ca_topic_score_codex":0.00005556898,"about_ca_topic_score_gemma":0.001101971,"teacher_disagreement_score":0.34566823,"about_ca_system_score_codex":0.00002581059,"about_ca_system_score_gemma":0.000028969815,"threshold_uncertainty_score":0.7710943},"labels":[],"label_agreement":null},{"id":"W3158881598","doi":"10.1109/iscas51556.2021.9401697","title":"A Scalable Many-Stage CMOS OTA for Closed-Loop Applications","year":2021,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Scalability; CMOS; Stage (stratigraphy); Electronic engineering; Computer science; Loop gain; Loop (graph theory); Compensation (psychology); Stability (learning theory); Frequency compensation; Single stage; Engineering; Electrical engineering; Voltage; Mathematics","score_opus":0.013894420368620057,"score_gpt":0.22894381541973008,"score_spread":0.21504939505111,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3158881598","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.041199744,0.001465055,0.7398338,0.0005902264,0.00029200318,0.00074790034,0.00018006354,0.0010163639,0.21467486],"genre_scores_gemma":[0.84292716,0.0001451381,0.00576555,0.0004898175,0.00026355978,0.00057403994,0.00034120385,0.0000830813,0.14941044],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99932593,0.0000061431483,0.00017855573,0.00018768696,0.000076833894,0.00022482763],"domain_scores_gemma":[0.9994372,0.000034799545,0.000013467613,0.00031061884,0.00014075747,0.00006314476],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000053519743,0.000115683506,0.0001617282,0.00005486763,0.00007166984,0.000066253146,0.00011232116,0.00008118878,0.0016263806],"category_scores_gemma":[0.000010575411,0.000106767,0.0001245232,0.00033235163,0.000011278251,0.00008124652,0.000009880091,0.00009770969,0.00015541715],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000003841393,0.00013777133,0.00031596646,0.0003100541,0.00084979174,0.000015468167,0.00022115254,0.0074196616,0.5872721,0.2544969,0.11680461,0.03215266],"study_design_scores_gemma":[0.00026234848,0.000009303116,0.00002285606,0.000009500976,0.000106809115,0.0000052759833,0.0005580032,0.084127374,0.15607512,0.00072324456,0.75782096,0.00027921135],"about_ca_topic_score_codex":0.000031246305,"about_ca_topic_score_gemma":0.00010605639,"teacher_disagreement_score":0.8017274,"about_ca_system_score_codex":0.000040581876,"about_ca_system_score_gemma":0.000029876732,"threshold_uncertainty_score":0.9992863},"labels":[],"label_agreement":null},{"id":"W3165038958","doi":"10.1017/s1551929521000663","title":"Radiation Damage and Nanofabrication in TEM and STEM","year":2021,"lang":"en","type":"article","venue":"Microscopy Today","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":46,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Nanolithography; Radiation damage; Materials science; Nanotechnology; Radiation; Physics; Medicine; Optics; Pathology","score_opus":0.005664570728895367,"score_gpt":0.2079124983330607,"score_spread":0.20224792760416532,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3165038958","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9956916,0.0029484376,0.00040773582,0.00010194904,0.0000929784,0.00003995841,0.000006622328,0.00003860047,0.0006721199],"genre_scores_gemma":[0.99861205,0.0005298147,0.00021123915,0.000067283516,0.000019291225,0.0000045266524,0.000025092806,0.000012105332,0.00051858986],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99957275,0.000020495525,0.00012521104,0.00013573145,0.000038657392,0.00010713181],"domain_scores_gemma":[0.99981606,0.000016903936,0.000013459752,0.00010069155,0.000023617567,0.000029294759],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006680934,0.000077299825,0.000112675836,0.0000740474,0.000027699441,0.000056777113,0.000027252889,0.000060991933,0.000029285293],"category_scores_gemma":[0.0000052261857,0.00007804795,0.0000134701,0.00020391167,0.000013252773,0.00010822994,0.000007963639,0.000082753046,0.000006192857],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[7.825529e-7,0.0000066656303,0.007957747,0.000027268958,0.000017561828,0.000006534713,0.00062517094,0.00010512343,0.9829175,0.00019686409,0.0007839175,0.007354903],"study_design_scores_gemma":[0.00041161466,0.000016726255,0.015110248,0.00005963992,0.00003811885,0.000016925726,0.00076098705,0.012080371,0.9484416,0.000095480646,0.022701433,0.00026684155],"about_ca_topic_score_codex":0.000040271927,"about_ca_topic_score_gemma":0.0000863956,"teacher_disagreement_score":0.034475844,"about_ca_system_score_codex":0.000041091178,"about_ca_system_score_gemma":0.000011240804,"threshold_uncertainty_score":0.31827033},"labels":[],"label_agreement":null},{"id":"W3189660383","doi":"10.1017/s1431927621006358","title":"RAFA Lens for Enhanced Far Focused Probes, Imaging and Analytical Resolutions","year":2021,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Lens (geology); Action (physics); Content (measure theory); Optics; Computer science; Materials science; Physics; Mathematics","score_opus":0.010771084495222441,"score_gpt":0.2376124481815799,"score_spread":0.22684136368635746,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3189660383","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7856495,0.031247508,0.17910832,0.0008993216,0.0001983353,0.00033065607,0.0002852225,0.0002737279,0.0020074144],"genre_scores_gemma":[0.9913682,0.0018484107,0.005007047,0.00024618214,0.0000783234,0.000032480595,0.00016967503,0.00004612462,0.0012035954],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99867314,0.000033373468,0.00035382618,0.0004507581,0.00008062493,0.00040830387],"domain_scores_gemma":[0.9993114,0.00006603983,0.0000394437,0.0002824707,0.0001940806,0.00010659429],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001466927,0.0002529876,0.00047120196,0.00022591339,0.0002491851,0.00018660334,0.00009069764,0.00010810026,0.00009365373],"category_scores_gemma":[0.000045316174,0.0002450077,0.0002307636,0.00054971944,0.00010395152,0.00016938317,0.000032498654,0.00018476223,0.0000059353683],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007050425,0.000024221148,0.00032562035,0.00006173061,0.00066675944,0.000007022331,0.00030181915,0.00013256645,0.9907469,0.00054926396,0.002451178,0.004725855],"study_design_scores_gemma":[0.0008340771,0.000021362954,0.00016422625,0.000058256195,0.002159538,0.000035110188,0.0008364959,0.036967352,0.8965895,0.00028632407,0.061474174,0.00057354907],"about_ca_topic_score_codex":0.00006307929,"about_ca_topic_score_gemma":0.00031020938,"teacher_disagreement_score":0.20571867,"about_ca_system_score_codex":0.00005934733,"about_ca_system_score_gemma":0.000041572654,"threshold_uncertainty_score":0.9991123},"labels":[],"label_agreement":null},{"id":"W4226175265","doi":"10.1016/j.microrel.2022.114533","title":"Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables","year":2022,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; IBM Canada; International Business Machines Corporation","keywords":"Flip chip; Delamination (geology); Wafer dicing; Materials science; Composite material; Chip; Structural engineering; Finite element method; Engineering; Adhesive; Electrical engineering; Layer (electronics)","score_opus":0.0049984485628284375,"score_gpt":0.18033057685198559,"score_spread":0.17533212828915715,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4226175265","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9819125,0.0006993181,0.01648179,0.000030730036,0.000044565473,0.00013948405,0.000020204994,0.00008785854,0.00058357086],"genre_scores_gemma":[0.9992011,0.00009116317,0.00053329446,0.000018454584,0.000014505473,0.000019834748,0.00004085269,0.000031498897,0.000049298847],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988381,0.000062825355,0.00030049152,0.0002888219,0.0001912867,0.0003184436],"domain_scores_gemma":[0.99949855,0.00005541856,0.000051246163,0.00026450923,0.00009245614,0.00003782065],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00039318952,0.00017970327,0.00026088118,0.00013388912,0.00018435296,0.00002920539,0.00014830794,0.00006225811,0.000043734657],"category_scores_gemma":[0.00001743233,0.00016905174,0.000055192446,0.00023090182,0.000035264256,0.00013118933,0.000049475275,0.00049809844,4.989372e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016702315,0.000022605385,0.00017744486,0.00006138479,0.00010564017,0.0000013046301,0.00088404707,0.9528432,0.044017605,0.000626384,0.000025012987,0.0012186965],"study_design_scores_gemma":[0.00028418773,0.00012540887,0.000052154206,0.000017348537,0.000106786865,0.000020154506,0.00081479683,0.9354683,0.059656028,0.0027476044,0.00044365606,0.00026356857],"about_ca_topic_score_codex":0.00034179082,"about_ca_topic_score_gemma":0.00017055232,"teacher_disagreement_score":0.017374866,"about_ca_system_score_codex":0.00043063686,"about_ca_system_score_gemma":0.00006709042,"threshold_uncertainty_score":0.689373},"labels":[],"label_agreement":null},{"id":"W4230325966","doi":"10.32920/ryerson.14654631","title":"Simulation models of current density imaging in studying cardiac states","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University; Toronto Metropolitan University","funders":"Canadian Institutes of Health Research","keywords":"Diffusion MRI; Current (fluid); Intracardiac injection; Cardiac electrophysiology; Cardiac imaging; Electrophysiology; Correlation; Computational model; Magnetic resonance imaging; Computer science; Physics; Neuroscience; Algorithm; Mathematics; Cardiology; Medicine","score_opus":0.033736920164787985,"score_gpt":0.26547059946515306,"score_spread":0.23173367930036506,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4230325966","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89428383,0.004615964,0.099500984,0.0000047931853,0.0005972207,0.00016344941,0.000020215779,0.000105397376,0.0007081233],"genre_scores_gemma":[0.9990626,0.0004518897,0.00019368215,0.0000040397995,0.000040207287,0.000009394284,0.00020045125,0.0000285387,0.000009182783],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988044,0.00005233243,0.00046371785,0.0002851554,0.00019894137,0.00019548512],"domain_scores_gemma":[0.99925447,0.00007245835,0.00006386912,0.00032903117,0.0002452186,0.000034964713],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001960955,0.00023256031,0.00054770906,0.00026707468,0.000015944875,0.00006439879,0.0001250116,0.000100185636,0.00003762041],"category_scores_gemma":[0.000019015883,0.000231047,0.00021449341,0.00020328305,0.000012501261,0.00014404838,0.00010782178,0.0005274934,0.0000011514828],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[6.503679e-7,0.000017957283,0.003911941,0.00017301636,0.00011824071,0.000003004324,0.0015277466,0.9868295,0.0018625741,0.0000801539,0.000023905994,0.005451281],"study_design_scores_gemma":[0.000059485945,0.0000010941695,0.00025414152,0.00021469887,0.000097276345,7.65159e-8,0.0013274072,0.9935136,0.0034746418,0.0008102927,0.000020075224,0.00022722648],"about_ca_topic_score_codex":0.00082494156,"about_ca_topic_score_gemma":0.00021386262,"teacher_disagreement_score":0.10477877,"about_ca_system_score_codex":0.0001682123,"about_ca_system_score_gemma":0.00004901203,"threshold_uncertainty_score":0.9421823},"labels":[],"label_agreement":null},{"id":"W4230348932","doi":"10.1109/iscas.1993.692969","title":"Towards built-in-self-test for SNR testing of a mixed-signal IC","year":2005,"lang":"en","type":"article","venue":"1993 IEEE International Symposium on Circuits and Systems","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Computer science; Built-in self-test; Mixed-signal integrated circuit; Test (biology); Reliability engineering; Integrated circuit; Embedded system; Engineering; Operating system","score_opus":0.025462753042655325,"score_gpt":0.24569666260798395,"score_spread":0.22023390956532862,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4230348932","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9704758,0.00066237303,0.0035835234,0.00025975818,0.0021624076,0.00057287497,0.0002791396,0.00021723611,0.02178692],"genre_scores_gemma":[0.9987342,0.000062975196,0.000084223626,0.000035745856,0.0006937918,0.00008172288,0.00002715511,0.000042223448,0.00023800884],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99836373,0.000024671743,0.0006660507,0.00030351515,0.0003471873,0.00029484087],"domain_scores_gemma":[0.9990442,0.00031172656,0.00013012502,0.00017168804,0.0002572605,0.000085021195],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00035695656,0.0002462593,0.00040074365,0.000269558,0.00004913545,0.000098503,0.00028184624,0.00014070784,0.000021862392],"category_scores_gemma":[0.00005094188,0.00022509658,0.00012138321,0.00021821837,0.000024788496,0.00017720774,0.00000961091,0.00017251972,0.000011809216],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019703299,0.0004884409,0.017370826,0.00062670675,0.00095944153,0.000023094235,0.0015602339,0.10418607,0.8256669,0.012335147,0.003994442,0.032769002],"study_design_scores_gemma":[0.002521488,0.0005032316,0.0027076073,0.0010451853,0.0001912885,0.00014375518,0.0004766293,0.86061615,0.083872244,0.00021467733,0.046598565,0.0011091538],"about_ca_topic_score_codex":0.00033801148,"about_ca_topic_score_gemma":0.00012859768,"teacher_disagreement_score":0.7564301,"about_ca_system_score_codex":0.00021352805,"about_ca_system_score_gemma":0.000034348803,"threshold_uncertainty_score":0.9179172},"labels":[],"label_agreement":null},{"id":"W4230764948","doi":"10.32920/ryerson.14662776.v1","title":"3.3V Transmitter Using 1.8V Transistors In A Cascode Configuration","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Electrical engineering; Cascode; Transmitter; Transistor; Materials science; Voltage; Optoelectronics; Electronic engineering; Engineering; Channel (broadcasting)","score_opus":0.022982613643350032,"score_gpt":0.22617138609393822,"score_spread":0.2031887724505882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4230764948","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89759374,0.00092953653,0.08963775,0.000077731085,0.0006684777,0.00020828546,0.00001937427,0.00020753636,0.010657545],"genre_scores_gemma":[0.9984746,0.00012325666,0.0007689719,0.00009267475,0.000089654146,0.000019537838,0.00018431332,0.000059518316,0.00018745825],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99859273,0.000051730287,0.0005117017,0.00038121254,0.00017705059,0.0002855559],"domain_scores_gemma":[0.9994677,0.00001721581,0.00003385369,0.0003355271,0.00008523337,0.00006047224],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00011192513,0.0003481808,0.0005398517,0.0003403322,0.000025536367,0.00013929763,0.00016077151,0.00049701676,0.0012633962],"category_scores_gemma":[0.0000048858633,0.00034497198,0.0002930513,0.00027755668,0.000020339623,0.00012532115,0.000009681518,0.0008565222,0.000008009756],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000053430153,0.000054507676,0.00029172935,0.0005918423,0.0006298958,0.00019673628,0.0075820116,0.7004334,0.28654432,0.00020737085,0.00041713717,0.0030457394],"study_design_scores_gemma":[0.00062299654,0.000013251119,0.00028519705,0.0007015883,0.0006468252,0.000033668497,0.0031238147,0.8611474,0.12948988,0.00018790118,0.002103014,0.0016444349],"about_ca_topic_score_codex":0.0024267414,"about_ca_topic_score_gemma":0.0049167913,"teacher_disagreement_score":0.16071406,"about_ca_system_score_codex":0.00028898232,"about_ca_system_score_gemma":0.00010321616,"threshold_uncertainty_score":0.9999002},"labels":[],"label_agreement":null},{"id":"W4231665712","doi":"10.1109/ectc.1990.122225","title":"A new power cycling technique for accelerated reliability evaluation of plated-through-holes and interconnects in PCBs","year":2002,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Reliability (semiconductor); Converse; Reliability engineering; Power (physics); Computer science; Shock (circulatory); Power cycling; Materials science; Engineering; Mathematics; Physics; Thermodynamics","score_opus":0.0472524536533161,"score_gpt":0.27297424909980167,"score_spread":0.22572179544648557,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4231665712","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94713694,0.0004461294,0.046185248,0.000071980656,0.00006697432,0.0005881239,0.0000057302705,0.00010941428,0.0053894394],"genre_scores_gemma":[0.9970075,0.000044832585,0.002781441,0.000023817793,0.0000117461905,0.000045052035,0.000008742063,0.000017895105,0.00005899629],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991439,0.000032696906,0.00035534505,0.00018791894,0.00012494542,0.00015519273],"domain_scores_gemma":[0.99951535,0.00007040385,0.00003592543,0.00016359898,0.00018219369,0.000032494267],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00043400007,0.00012964636,0.00023755743,0.00014371029,0.000017190194,0.00002190684,0.000072902854,0.00014457354,0.0005763154],"category_scores_gemma":[0.00014522337,0.00011263933,0.000054177428,0.0003100892,0.00001937105,0.00021974575,0.000008014356,0.00013203415,0.000002440056],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001835355,0.0000753266,0.00092309987,0.00012306523,0.00018243663,0.0000012829083,0.003816335,0.023198884,0.95432687,0.0014455351,0.0040639737,0.011824861],"study_design_scores_gemma":[0.0010347557,0.00008410467,0.000210237,0.00013960809,0.00012611535,0.0000040632763,0.00069892977,0.39331937,0.5994902,0.004202349,0.00039167312,0.0002985905],"about_ca_topic_score_codex":0.00024558042,"about_ca_topic_score_gemma":0.00021679752,"teacher_disagreement_score":0.3701205,"about_ca_system_score_codex":0.00008236385,"about_ca_system_score_gemma":0.000014581462,"threshold_uncertainty_score":0.6310249},"labels":[],"label_agreement":null},{"id":"W4232600830","doi":"10.1007/978-1-4419-9796-8_26","title":"Surface Decoration for Improving the Accuracy of Displacement Measurements by Digital Image Correlation in SEM","year":2012,"lang":"en","type":"book-chapter","venue":"Conference proceedings of the Society for Experimental Mechanics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Materials science; Digital image correlation; Focused ion beam; Nanoscopic scale; Displacement (psychology); Scanning electron microscope; Optics; Composite material; Nanotechnology; Ion; Chemistry","score_opus":0.02698254125946219,"score_gpt":0.23715851039830013,"score_spread":0.21017596913883793,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4232600830","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5546156,0.041151483,0.2923074,0.0010941948,0.008906236,0.043505654,0.008902566,0.00082111027,0.048695724],"genre_scores_gemma":[0.9975815,0.00006635857,0.0005035269,0.000013482092,0.00003941935,0.00008790486,0.00011378185,0.00006423704,0.0015297929],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987221,0.0000015392174,0.0005140892,0.00021858742,0.0003066418,0.00023709216],"domain_scores_gemma":[0.99882305,0.0000551262,0.00048635804,0.00013172229,0.00046973908,0.000034010598],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028464437,0.0003089447,0.00035282157,0.0000242707,0.00009727466,0.00008978477,0.00038507557,0.00026142987,0.000026128875],"category_scores_gemma":[0.000052235704,0.00022483217,0.00063526264,0.000055796037,0.000047487523,0.00046422225,0.00006682863,0.0002216871,7.7909846e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000022165812,0.00003665964,0.000010767446,0.00031342625,0.00031004872,3.2817045e-9,0.0025960307,0.00005825054,0.9724323,0.0213087,0.0022497852,0.0006618329],"study_design_scores_gemma":[0.00064011366,0.00012338783,4.1629048e-7,0.00030848736,0.00036354852,6.5168825e-7,0.0064602965,0.08752621,0.8995572,0.003573732,0.0010537179,0.00039225104],"about_ca_topic_score_codex":0.000008511964,"about_ca_topic_score_gemma":0.0000020437662,"teacher_disagreement_score":0.4429659,"about_ca_system_score_codex":0.00030851277,"about_ca_system_score_gemma":0.000047157588,"threshold_uncertainty_score":0.916839},"labels":[],"label_agreement":null},{"id":"W4233900819","doi":"10.22215/etd/2012-06826","title":"Exploiting incoherent sampling to provide electronic protection against digital radio frequency memory jammers","year":2012,"lang":"en","type":"dissertation","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University; Canadian Heritage; Library and Archives Canada","funders":"","keywords":"Computer science; Telecommunications","score_opus":0.01598741335242303,"score_gpt":0.22121551338276046,"score_spread":0.20522810003033742,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4233900819","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8953204,0.0013103033,0.008010166,0.000029019946,0.0011864883,0.0014007611,0.000025554022,0.0010324651,0.09168483],"genre_scores_gemma":[0.9927911,0.00005456428,0.00012739986,0.000035567176,0.000544763,0.0003983167,0.001503607,0.00018546109,0.004359199],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.997795,0.000019884212,0.0005898249,0.00043021215,0.00032295118,0.00084214786],"domain_scores_gemma":[0.99918604,0.000021788675,0.000120682365,0.0003138058,0.00016259027,0.00019510687],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00014717432,0.00054792326,0.00048669425,0.00050253165,0.00013047822,0.00024094558,0.0002434907,0.00040601223,0.00024364398],"category_scores_gemma":[0.00006266188,0.0005209146,0.0002647388,0.0004923065,0.0000074439517,0.00059298874,0.000008822371,0.00092861615,0.00020130946],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000025165888,0.00006419125,0.000084178806,0.00066651084,0.0012088788,0.0000053227104,0.0036475973,0.006406075,0.65097433,0.00071179576,0.0012308159,0.33497515],"study_design_scores_gemma":[0.0021456406,0.0006744367,0.0005365085,0.003937317,0.0025859547,0.00006746765,0.08085588,0.018026354,0.7727312,0.0019709365,0.10313287,0.013335448],"about_ca_topic_score_codex":0.0002633115,"about_ca_topic_score_gemma":0.0017134132,"teacher_disagreement_score":0.3216397,"about_ca_system_score_codex":0.0009160382,"about_ca_system_score_gemma":0.00013521746,"threshold_uncertainty_score":0.99972427},"labels":[],"label_agreement":null},{"id":"W4235101943","doi":"10.1088/978-1-6817-4954-9ch4","title":"Experimental probes and techniques (overview)","year":2018,"lang":"en","type":"book-chapter","venue":"Morgan & Claypool Publishers eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Computer science; Materials science","score_opus":0.016863343748296476,"score_gpt":0.20820290636391228,"score_spread":0.1913395626156158,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4235101943","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0032667082,0.0036903608,0.000037642367,0.00003245079,0.00038436882,0.00046355603,0.00003995833,0.0010734866,0.99101144],"genre_scores_gemma":[0.08154979,0.000101788835,0.0005356155,0.00053883845,0.001239836,0.000104106046,0.00019627654,0.0006122499,0.9151215],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99803865,0.0000150523665,0.0005311617,0.00060639606,0.00035791006,0.00045080966],"domain_scores_gemma":[0.99881727,0.000019471701,0.00012179368,0.00064076926,0.00018506772,0.00021562196],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00016034531,0.00074631965,0.00070948387,0.00043539045,0.00011827885,0.0007352529,0.00044414253,0.00080842065,0.0028959992],"category_scores_gemma":[0.000010158883,0.00070076674,0.00023551342,0.000040181494,0.00027179992,0.0004372152,0.000103776896,0.0007494985,0.00010511301],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013418164,0.000025181715,0.0000108610975,0.0003039061,0.0016114977,0.00008523948,0.002274703,0.000001957062,0.070918575,0.023600552,0.87996525,0.021188848],"study_design_scores_gemma":[0.00018237632,0.00012534315,0.0000015409217,0.00023386024,0.00025141725,0.000041832558,0.00032333125,0.00006218394,0.12068103,0.0036486085,0.87336266,0.0010858146],"about_ca_topic_score_codex":0.000045483564,"about_ca_topic_score_gemma":0.00004600876,"teacher_disagreement_score":0.07828309,"about_ca_system_score_codex":0.00022497725,"about_ca_system_score_gemma":0.00006770009,"threshold_uncertainty_score":0.9995443},"labels":[],"label_agreement":null},{"id":"W4235432822","doi":"10.1049/pbcs018e_ch24","title":"High-resolution flash time-to-digital conversion and calibration for system-on-chip testing","year":2006,"lang":"en","type":"book-chapter","venue":"Institution of Engineering and Technology eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Jitter; Chip; Electronic engineering; Interconnection; Calibration; Computer science; Flash (photography); System on a chip; High resolution; Embedded system; Computer hardware; Electrical engineering; Engineering; Telecommunications; Physics; Optics","score_opus":0.007052171522238566,"score_gpt":0.16019570195276575,"score_spread":0.1531435304305272,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4235432822","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2742749,0.0022426543,0.15549281,0.00022060297,0.0023247416,0.0040829023,0.0018057777,0.009729313,0.5498263],"genre_scores_gemma":[0.99155325,0.0000042210613,0.00080869894,0.0000047119966,0.0000969152,0.000026353116,0.00010161519,0.000056948767,0.007347292],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99917847,0.0000014280523,0.00031684522,0.00024667394,0.00008969356,0.00016688096],"domain_scores_gemma":[0.9995638,0.00004604298,0.00007188265,0.00015961177,0.00011211403,0.000046512327],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00005453738,0.0002811789,0.00037136546,0.0007457443,0.00007192715,0.00003349911,0.00007365113,0.0005512519,0.0000020752425],"category_scores_gemma":[0.000037598227,0.00029066243,0.00004773483,0.000056664507,0.00008763676,0.000058357287,0.000020812719,0.00024310379,0.000009320705],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020018284,0.000009231441,0.000010622878,0.0012460595,0.0004175169,0.000016236474,0.000027510043,0.23196448,0.05823757,0.69022024,0.0015876022,0.01624288],"study_design_scores_gemma":[0.0011376666,0.00060433947,0.0000071616473,0.0032468697,0.00047412227,0.000114849994,0.000023088638,0.84416896,0.033366293,0.0015162373,0.11400517,0.001335243],"about_ca_topic_score_codex":0.000009065417,"about_ca_topic_score_gemma":0.0000013441199,"teacher_disagreement_score":0.71727836,"about_ca_system_score_codex":0.00012324353,"about_ca_system_score_gemma":0.00002146767,"threshold_uncertainty_score":0.9999546},"labels":[],"label_agreement":null},{"id":"W4236116545","doi":"10.1097/der.0000000000000457","title":"Positive Occluded Patch Test in the Face of Negative Repeat Open Application Test","year":2019,"lang":"en","type":"article","venue":"Dermatitis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Medicine; Patch test; Test (biology); Face (sociological concept); Dermatology; Internal medicine; Immunology; Paleontology; Geology","score_opus":0.007075114571218992,"score_gpt":0.21849821346930345,"score_spread":0.21142309889808447,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4236116545","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.91236204,0.000119518656,0.0014597237,0.0011228323,0.00007041547,0.0011638546,0.00024552125,0.00006449268,0.08339159],"genre_scores_gemma":[0.99920523,0.000029584084,0.00007880227,0.0004169814,0.00001296226,0.00004607881,0.00007366798,0.000013039783,0.0001236345],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993519,0.00003317953,0.00024218681,0.00012625867,0.00011896744,0.00012749726],"domain_scores_gemma":[0.99922556,0.00033400793,0.000057499972,0.00029377453,0.00007145181,0.000017709852],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011533552,0.00010701916,0.00019684543,0.00006482104,0.000025110166,0.000056833116,0.00037311658,0.00005942722,0.000088477755],"category_scores_gemma":[0.00006020503,0.00008047596,0.000041703355,0.0003948197,0.00001956797,0.00021846592,0.000023309687,0.00014960386,0.00011448301],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000075749376,0.0006731311,0.3774634,0.0004723912,0.00061917806,0.00006423317,0.09727549,0.014545181,0.39598873,0.009571209,0.07680006,0.02651941],"study_design_scores_gemma":[0.0022371307,0.00027054033,0.36927503,0.0004818249,0.00020440544,0.00008813013,0.02598723,0.17654146,0.40831658,0.0028974148,0.012514686,0.0011855549],"about_ca_topic_score_codex":0.0017554208,"about_ca_topic_score_gemma":0.00059246423,"teacher_disagreement_score":0.16199628,"about_ca_system_score_codex":0.00004683288,"about_ca_system_score_gemma":0.000012816524,"threshold_uncertainty_score":0.32817146},"labels":[],"label_agreement":null},{"id":"W4237998367","doi":"10.1002/1522-2586(200007)12:1<46::aid-jmri6>3.3.co;2-4","title":"Sensitivity and Power Deposition in a High-Field Imaging Experiment","year":2000,"lang":"en","type":"article","venue":"Journal of Magnetic Resonance Imaging","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"National Research Council Institute for Biodiagnostics","funders":"","keywords":"Physics; Field (mathematics); Sensitivity (control systems); Dielectric; Computational physics; Noise (video); SIGNAL (programming language); Power (physics); Optics; Excitation; Electromagnetic field; Homogeneous; Dissipation; Boundary value problem; Nuclear magnetic resonance; Statistical physics; Image (mathematics); Computer science; Optoelectronics; Mathematics; Quantum mechanics; Electronic engineering","score_opus":0.0031974211219680856,"score_gpt":0.19756807563590867,"score_spread":0.1943706545139406,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4237998367","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97193974,0.025256963,0.0004753705,0.00038886568,0.00011562003,0.000042534164,0.0000011098614,0.000018405615,0.0017613807],"genre_scores_gemma":[0.9982738,0.00067164795,0.00073932845,0.00019928996,0.0000637256,0.0000014704503,4.2039406e-7,0.000016512784,0.000033806446],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990802,0.000047852922,0.00036906748,0.00011310499,0.00017341872,0.00021635646],"domain_scores_gemma":[0.99967384,0.000056337696,0.000048522317,0.00010181857,0.000058681697,0.000060812883],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025794224,0.00013280402,0.0002345384,0.00017913122,0.000031650678,0.00007596633,0.00006051406,0.00002766385,0.00031399372],"category_scores_gemma":[0.000017873364,0.000121270765,0.000059945647,0.00016219469,0.00002602403,0.0003049179,0.0000067391493,0.00027819775,0.000004006634],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000035296936,0.000041858246,0.01699872,0.000015242671,0.000014106208,0.00090668583,0.0011490548,0.0012922144,0.2305231,0.000049060145,0.0012794688,0.7476952],"study_design_scores_gemma":[0.007342121,0.00059563824,0.27323478,0.00292027,0.0003526354,0.007494173,0.0051651304,0.35650232,0.3082686,0.0011515118,0.034605917,0.0023668623],"about_ca_topic_score_codex":0.00015610259,"about_ca_topic_score_gemma":0.00002870207,"teacher_disagreement_score":0.7453283,"about_ca_system_score_codex":0.00007026982,"about_ca_system_score_gemma":0.000014231906,"threshold_uncertainty_score":0.49452782},"labels":[],"label_agreement":null},{"id":"W4238447347","doi":"10.1109/dac.2018.8465835","title":"A Machine Learning Framework to Identify Detailed Routing Short Violations from a Placed Netlist","year":2018,"lang":"en","type":"article","venue":"2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":36,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo; Microsemi (Canada); University of Calgary","funders":"","keywords":"Netlist; Computer science; Routing (electronic design automation); Router; Network routing; Metrics; Routing domain; Static routing; Machine learning; Distance-vector routing protocol; Artificial neural network; Routing protocol; Distributed computing; Artificial intelligence; Computer network; Embedded system","score_opus":0.05266024591243023,"score_gpt":0.29483534799917,"score_spread":0.24217510208673976,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4238447347","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.27646154,0.000065762724,0.7192387,0.00015674895,0.0008391432,0.00046814344,0.000057597215,0.0012077963,0.0015045701],"genre_scores_gemma":[0.97364,0.000026970556,0.024683489,0.00024467168,0.00058533414,0.00010793345,0.0002527648,0.000105996776,0.0003528137],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99682486,0.0002901394,0.0009287754,0.0006889671,0.00052759936,0.00073965517],"domain_scores_gemma":[0.99748534,0.0005330545,0.00018713255,0.0008871214,0.00058363355,0.00032373625],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0006557847,0.00055904966,0.0006319854,0.00052565354,0.00053580053,0.0006796609,0.000796452,0.00045288526,0.002677925],"category_scores_gemma":[0.0010816847,0.00056161574,0.00018405757,0.0011420177,0.00009267716,0.0006503261,0.000069512265,0.00078220805,0.001482455],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000115590316,0.00015086996,0.018174043,0.00008748569,0.0015850455,0.000035553814,0.021703415,0.06101755,0.85039645,0.0035887999,0.017152619,0.025992593],"study_design_scores_gemma":[0.00032705223,0.000119018005,0.006506983,0.0003218995,0.00018628452,0.0000063879083,0.0005190736,0.96674335,0.020008992,0.0020764936,0.0023552398,0.00082920387],"about_ca_topic_score_codex":0.000535973,"about_ca_topic_score_gemma":0.00051456084,"teacher_disagreement_score":0.90572584,"about_ca_system_score_codex":0.00027500925,"about_ca_system_score_gemma":0.00015184579,"threshold_uncertainty_score":0.99968356},"labels":[],"label_agreement":null},{"id":"W4240096237","doi":"10.32920/ryerson.14662776","title":"3.3V Transmitter Using 1.8V Transistors In A Cascode Configuration","year":2021,"lang":"en","type":"preprint","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Electrical engineering; Cascode; Transmitter; Transistor; Voltage; Materials science; Electronic engineering; Engineering; Channel (broadcasting)","score_opus":0.022982613643350032,"score_gpt":0.22617138609393822,"score_spread":0.2031887724505882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4240096237","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89759374,0.00092953653,0.08963775,0.000077731085,0.0006684777,0.00020828546,0.00001937427,0.00020753636,0.010657545],"genre_scores_gemma":[0.9984746,0.00012325666,0.0007689719,0.00009267475,0.000089654146,0.000019537838,0.00018431332,0.000059518316,0.00018745825],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99859273,0.000051730287,0.0005117017,0.00038121254,0.00017705059,0.0002855559],"domain_scores_gemma":[0.9994677,0.00001721581,0.00003385369,0.0003355271,0.00008523337,0.00006047224],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00011192513,0.0003481808,0.0005398517,0.0003403322,0.000025536367,0.00013929763,0.00016077151,0.00049701676,0.0012633962],"category_scores_gemma":[0.0000048858633,0.00034497198,0.0002930513,0.00027755668,0.000020339623,0.00012532115,0.000009681518,0.0008565222,0.000008009756],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000053430153,0.000054507676,0.00029172935,0.0005918423,0.0006298958,0.00019673628,0.0075820116,0.7004334,0.28654432,0.00020737085,0.00041713717,0.0030457394],"study_design_scores_gemma":[0.00062299654,0.000013251119,0.00028519705,0.0007015883,0.0006468252,0.000033668497,0.0031238147,0.8611474,0.12948988,0.00018790118,0.002103014,0.0016444349],"about_ca_topic_score_codex":0.0024267414,"about_ca_topic_score_gemma":0.0049167913,"teacher_disagreement_score":0.16071406,"about_ca_system_score_codex":0.00028898232,"about_ca_system_score_gemma":0.00010321616,"threshold_uncertainty_score":0.9999002},"labels":[],"label_agreement":null},{"id":"W4244308444","doi":"10.1002/9781118359259.ch224","title":"New Method for Representative Measurement of Anode Electrical Resistance","year":2012,"lang":"en","type":"other","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Rio Tinto (Canada)","funders":"","keywords":"Anode; Resistance (ecology); Materials science; Environmental science; Computer science; Electrical engineering; Engineering; Chemistry; Biology; Ecology; Electrode","score_opus":0.026438715052057707,"score_gpt":0.28274086117325925,"score_spread":0.25630214612120156,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4244308444","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[1.416495e-7,0.0041407454,0.49213925,0.000011938841,0.00010970432,0.00016820658,0.000021453643,0.00012029626,0.50328827],"genre_scores_gemma":[0.00033794646,0.00010299408,0.1352205,0.000018481305,0.00036301216,0.000029997233,0.000025866882,0.000343891,0.8635573],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9989503,0.000030781743,0.00030162255,0.00019791286,0.00026657552,0.00025280245],"domain_scores_gemma":[0.99938965,0.00004124462,0.00009275033,0.00029091167,0.00010485047,0.00008061156],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00022777621,0.00022223356,0.0004845581,0.00022249008,0.000009590271,0.000008968415,0.00015652223,0.00023606571,0.0033217485],"category_scores_gemma":[0.000044681125,0.00018155618,0.00019712196,0.00023685255,0.000008313061,0.000025079036,0.0000052316705,0.00014886932,0.000016113296],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000049615223,0.000008259666,0.0000067322453,0.00008857114,0.00064278673,2.6298628e-7,0.000046343226,0.000021974087,0.0112010045,0.0043837954,0.9807541,0.0028412535],"study_design_scores_gemma":[0.00019817038,0.000012319483,0.0000018120173,0.000063030326,0.00035843623,4.274422e-7,0.00003188357,0.0005404314,0.03994595,0.00023234054,0.9583547,0.0002604936],"about_ca_topic_score_codex":0.0004997258,"about_ca_topic_score_gemma":0.00091299403,"teacher_disagreement_score":0.36026904,"about_ca_system_score_codex":0.000095961346,"about_ca_system_score_gemma":0.00004245179,"threshold_uncertainty_score":0.99758935},"labels":[],"label_agreement":null},{"id":"W4250332012","doi":"10.1016/j.ress.2014.12.014","title":"EM algorithm for one-shot device testing with competing risks under exponential distribution","year":2015,"lang":"en","type":"article","venue":"Reliability Engineering & System Safety","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":42,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Exponential function; Algorithm; Exponential distribution; Shot (pellet); Distribution (mathematics); Mathematics; Computer science; Applied mathematics; Statistics; Reliability engineering; Engineering; Mathematical analysis; Materials science","score_opus":0.0601813470976526,"score_gpt":0.2456531552913967,"score_spread":0.1854718081937441,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4250332012","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.1719997,0.0001837759,0.82511455,0.000018682282,0.0005023606,0.00051830045,0.00021035176,0.0011500341,0.00030224214],"genre_scores_gemma":[0.97920644,0.0000030105316,0.019947954,0.0000052316877,0.00033079225,0.000085099215,0.00032249046,0.000087621345,0.00001137955],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99789214,0.00005219266,0.00068175973,0.00043861454,0.00036784683,0.0005674196],"domain_scores_gemma":[0.9983267,0.0002952652,0.0000960627,0.0004717142,0.0005659872,0.00024422252],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0010437676,0.0003892448,0.0005750676,0.00008930574,0.0001302456,0.000105933155,0.00021908607,0.00019994493,0.000004787342],"category_scores_gemma":[0.00019776745,0.00035822694,0.00014358335,0.0005772357,0.00002323633,0.00022294463,0.00002029123,0.00034594012,0.000013290936],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000018052562,0.000033297136,0.00039153732,0.0005747375,0.00023701551,0.0000039470274,0.0002712638,0.9896779,0.0040406105,0.00046826096,0.000060612783,0.0042227423],"study_design_scores_gemma":[0.00072382845,0.00008496757,0.00074867456,0.00046214584,0.0002249702,0.00003244217,0.0015652422,0.99142367,0.002507293,0.000009700104,0.0016797322,0.000537312],"about_ca_topic_score_codex":0.0002426734,"about_ca_topic_score_gemma":0.000025692189,"teacher_disagreement_score":0.80720675,"about_ca_system_score_codex":0.0010860519,"about_ca_system_score_gemma":0.000075889926,"threshold_uncertainty_score":0.999887},"labels":[],"label_agreement":null},{"id":"W4250848503","doi":"10.1149/ma2017-01/31/1483","title":"Improving FIB-SEM Reconstructions By Using Epoxy Resin Embedding","year":2017,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Automotive Fuel Cell Cooperation (Canada); University of Alberta","funders":"","keywords":"Focused ion beam; Materials science; Scanning electron microscope; Sample preparation; Nanotechnology; Composite material; Ion; Chemistry","score_opus":0.017634552873318922,"score_gpt":0.24676468359054304,"score_spread":0.22913013071722413,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4250848503","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.91698086,0.0003058278,0.0001352947,0.000048843198,0.00092934625,0.000073447256,0.000022633296,0.0002878378,0.081215896],"genre_scores_gemma":[0.9963817,0.000018456061,0.002802993,0.000013920306,0.00032918138,0.000003754511,0.000013834956,0.000063538246,0.00037264195],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99853563,0.000021899887,0.00046582677,0.00031005993,0.00018411955,0.00048243187],"domain_scores_gemma":[0.99884593,0.000069722984,0.000269815,0.00058366905,0.00009504106,0.00013580472],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00039070073,0.00025369835,0.00028201906,0.00013326718,0.00093499396,0.000557363,0.00034883118,0.000192483,0.00006396952],"category_scores_gemma":[0.00042207245,0.00026598154,0.00012669216,0.00009183176,0.00007044289,0.00049659587,0.000035062843,0.0004680014,0.00004353735],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000013909187,0.000011745856,0.0006289521,0.000041458297,0.000108019085,0.000019919336,0.00018586962,0.088082254,0.9047427,0.000007334597,0.0024926313,0.0036776965],"study_design_scores_gemma":[0.0005258884,0.000019840742,0.0007117831,0.0005353768,0.00026227257,0.00012970703,0.0010980255,0.25441998,0.7341983,0.00018462636,0.0068629044,0.0010512844],"about_ca_topic_score_codex":0.0016336826,"about_ca_topic_score_gemma":0.00009982781,"teacher_disagreement_score":0.17054443,"about_ca_system_score_codex":0.00014711976,"about_ca_system_score_gemma":0.0000400357,"threshold_uncertainty_score":0.99997926},"labels":[],"label_agreement":null},{"id":"W4251682289","doi":"10.1039/d0nh90031a","title":"Correction: Recent progress in controlled nano/micro cracking as an alternative nano-patterning method for functional applications","year":2020,"lang":"en","type":"erratum","venue":"Nanoscale Horizons","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Novelis (Canada)","funders":"","keywords":"Nano-; Nanotechnology; Cracking; Nanoscopic scale; Materials science; Composite material","score_opus":0.017101879263443455,"score_gpt":0.2760353992088463,"score_spread":0.2589335199454028,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4251682289","genre_codex":"methods","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0012410913,0.016578076,0.73158914,0.0022171342,0.17073591,0.0110232895,0.0015132992,0.0025120187,0.06259003],"genre_scores_gemma":[0.18510091,0.014468564,0.040875323,0.0041129203,0.08962298,0.07609594,0.06616626,0.004513291,0.5190438],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99671715,0.00019293658,0.0009553321,0.0009949857,0.00047141913,0.0006681684],"domain_scores_gemma":[0.9980854,0.00029503147,0.00033444236,0.00047591556,0.0005701823,0.00023901976],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00037038303,0.0007251726,0.0013384583,0.0005757693,0.00029865946,0.00024171095,0.00049426116,0.00091753155,0.00034904366],"category_scores_gemma":[0.00012872636,0.0007206565,0.0004963867,0.00093581335,0.000066365144,0.0002573682,0.000043596265,0.0017041845,0.0000719128],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00026056851,0.0002678389,0.00017245393,0.00026449937,0.0017905569,0.000023355862,0.00091999304,0.0024578825,0.020881442,0.0007088315,0.895251,0.07700159],"study_design_scores_gemma":[0.0022721824,0.00027787013,0.000023666875,0.00029095498,0.00062456256,0.000027860598,0.0004629565,0.056453045,0.007234091,0.00031317837,0.9310836,0.0009359818],"about_ca_topic_score_codex":0.00010427901,"about_ca_topic_score_gemma":0.0005863095,"teacher_disagreement_score":0.6907138,"about_ca_system_score_codex":0.000609311,"about_ca_system_score_gemma":0.00035054726,"threshold_uncertainty_score":0.9995245},"labels":[],"label_agreement":null},{"id":"W4286749310","doi":"","title":"High Aspect Ratio and Low Damage III-V/Ge Heterostructure Via Etching","year":2019,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Etching (microfabrication); Heterojunction; Materials science; Optoelectronics; Aspect ratio (aeronautics); Germanium; Nanotechnology; Silicon","score_opus":0.005955458515825381,"score_gpt":0.1874544334979719,"score_spread":0.1814989749821465,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4286749310","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.84291047,0.0013883576,0.13700895,0.000992078,0.0007124274,0.0004461108,0.00012212043,0.0005281859,0.015891308],"genre_scores_gemma":[0.99237186,0.00045810343,0.0037291632,0.00007000191,0.00005229476,0.000022134422,0.0008489879,0.000082772014,0.0023646986],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.997046,0.0010812223,0.0005155909,0.0006776514,0.00030916833,0.0003703545],"domain_scores_gemma":[0.9967563,0.00035612838,0.00022808455,0.0017419113,0.000766167,0.00015139229],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0013417824,0.00047783458,0.00058293674,0.00025376157,0.00021188018,0.0006090889,0.0007792165,0.0004678376,0.00024395285],"category_scores_gemma":[0.00016946919,0.0004783259,0.00020936954,0.00028725766,0.000107244196,0.00019844911,0.0004303409,0.0012545284,0.00003564328],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029561497,0.00044090988,0.0045920587,0.002565812,0.0028973706,0.00006431578,0.056113865,0.06493388,0.6824747,0.10517666,0.010548199,0.07016267],"study_design_scores_gemma":[0.0013701116,0.0000010528184,0.0037499813,0.0031006217,0.00042391932,0.000039339364,0.00041063083,0.6086037,0.36694765,0.007896987,0.005305454,0.0021505528],"about_ca_topic_score_codex":0.0014948923,"about_ca_topic_score_gemma":0.001516391,"teacher_disagreement_score":0.5436698,"about_ca_system_score_codex":0.0001425049,"about_ca_system_score_gemma":0.00008333985,"threshold_uncertainty_score":0.9997668},"labels":[],"label_agreement":null},{"id":"W4289886486","doi":"10.31399/asm.edfa.2007-1.p006","title":"Interconnect Layout Sensitivity and Yield Prediction","year":2007,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Abbott (Canada)","funders":"","keywords":"Sensitivity (control systems); Interconnection; Very-large-scale integration; Measure (data warehouse); Computer science; Process (computing); Reliability engineering; Vulnerability (computing); Yield (engineering); Integrated circuit layout; Simple (philosophy); Physical design; Channel (broadcasting); Electronic engineering; Integrated circuit; Circuit design; Engineering; Data mining; Embedded system; Materials science; Telecommunications; Programming language","score_opus":0.012199579858139856,"score_gpt":0.2014852087334344,"score_spread":0.18928562887529454,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4289886486","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98021096,0.000124417,0.016259804,0.00010405031,0.00009200419,0.000052138745,0.0000052602795,0.0005285833,0.0026227778],"genre_scores_gemma":[0.9994871,0.00001762887,0.00028834952,0.00007131892,0.00009400458,0.000002151105,0.0000023512548,0.000012758261,0.000024316294],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99937946,0.000011270521,0.00018258361,0.00013318645,0.000088534915,0.0002049566],"domain_scores_gemma":[0.9996131,0.00013477735,0.000011633912,0.00013287023,0.000028023222,0.000079559686],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00036747725,0.000094928306,0.000121319776,0.00007540207,0.00004231104,0.000028274315,0.000038388633,0.0000949194,0.000052419826],"category_scores_gemma":[0.000096194504,0.00008092194,0.000045813205,0.00017269498,0.000049421455,0.0001123548,0.000017247652,0.0001929553,0.000023241635],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000039091783,0.000019858933,0.0034591942,0.000007967445,0.000030486595,0.000020086418,0.00012606305,0.0001241354,0.95906323,0.0010532767,0.0010315806,0.035060223],"study_design_scores_gemma":[0.0002495864,0.00011592692,0.045857172,0.00008820045,0.00011043343,0.00012320334,0.0006144249,0.03134542,0.91616386,0.0013738642,0.0035577137,0.0004001856],"about_ca_topic_score_codex":0.00004530278,"about_ca_topic_score_gemma":0.0005155432,"teacher_disagreement_score":0.042899348,"about_ca_system_score_codex":0.00003128677,"about_ca_system_score_gemma":0.0000024776746,"threshold_uncertainty_score":0.32999012},"labels":[],"label_agreement":null},{"id":"W4290647010","doi":"10.31399/asm.edfa.2010-3.p020","title":"Combining Refractive Solid Immersion Lens and Pulsed Laser-Induced Technique for Integrated Circuit Failure Analysis","year":2010,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Immersion (mathematics); Materials science; Laser; Optics; Lens (geology); Oil immersion; Optical power; Optoelectronics; Physics","score_opus":0.015413459504231156,"score_gpt":0.24171894390628265,"score_spread":0.2263054844020515,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4290647010","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9743216,0.000023082921,0.023451349,0.00031647613,0.00010473508,0.00046540156,0.00004705479,0.0005740329,0.00069629273],"genre_scores_gemma":[0.99753714,0.000015607207,0.00199065,0.000072939336,0.000063801155,0.0001698623,0.00007320991,0.00005011687,0.000026695343],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99844635,0.000036959194,0.00045044333,0.00042308564,0.00018470547,0.0004584447],"domain_scores_gemma":[0.9989293,0.00021166494,0.00007867091,0.0004223614,0.00020134928,0.0001566282],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003931583,0.0002993078,0.0005211169,0.000436688,0.0001811156,0.00010246575,0.00023412795,0.00039000154,0.00015101222],"category_scores_gemma":[0.00017849299,0.00025643854,0.00026737823,0.001237224,0.000097090626,0.00035394682,0.000036581176,0.00082559336,0.000014186449],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000094457555,0.000051281022,0.0005810787,0.000013186932,0.0004091976,0.000004462053,0.00010513631,0.00011543503,0.99419886,0.00096906465,0.0003869772,0.0031558753],"study_design_scores_gemma":[0.00040946575,0.00012709621,0.0006909398,0.000028605105,0.00081965746,0.00001579125,0.0005539313,0.020154653,0.97376376,0.0013714043,0.0016078077,0.00045686323],"about_ca_topic_score_codex":0.00009795753,"about_ca_topic_score_gemma":0.00060939894,"teacher_disagreement_score":0.023215543,"about_ca_system_score_codex":0.00006719826,"about_ca_system_score_gemma":0.000025903646,"threshold_uncertainty_score":0.9999888},"labels":[],"label_agreement":null},{"id":"W4290647031","doi":"10.31399/asm.edfa.2015-3.p004","title":"Emerging Techniques in Atomic Force Microscopy: Diamond Milling and Electrostatic Force Microscopy","year":2015,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Mediprobe Research (Canada)","funders":"","keywords":"Conductive atomic force microscopy; Electrostatic force microscope; Microscopy; Scanning capacitance microscopy; Diamond; Photoconductive atomic force microscopy; Materials science; Force spectroscopy; Kelvin probe force microscope; Atomic force microscopy; Scanning probe microscopy; Nanotechnology; Scanning ion-conductance microscopy; Non-contact atomic force microscopy; Magnetic force microscope; Capacitance; Optoelectronics; Analytical Chemistry (journal); Scanning confocal electron microscopy; Chemistry; Optics; Composite material; Physics; Electrode","score_opus":0.010408243604960761,"score_gpt":0.24912190812657792,"score_spread":0.23871366452161716,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4290647031","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9897572,0.0017935493,0.006992769,0.00017988292,0.000058874775,0.00021191618,0.000005770996,0.00054479926,0.00045525414],"genre_scores_gemma":[0.9929331,0.00019855407,0.0065071983,0.00012903036,0.000050815266,0.000044122004,0.000008222631,0.00005407471,0.000074916905],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99847996,0.000035109315,0.00045831,0.0003139658,0.00016382012,0.0005488138],"domain_scores_gemma":[0.9993873,0.00007440313,0.000043407585,0.00026516663,0.000058570477,0.00017113119],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003445987,0.00025360426,0.0003533173,0.00024312294,0.00006392215,0.00009655429,0.00019667672,0.0001583538,0.000013839643],"category_scores_gemma":[0.00008707716,0.00023459704,0.00007343555,0.00054479076,0.00009949513,0.00024422773,0.00004512701,0.00038211473,0.000017791768],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008120368,0.000022740052,0.002812449,0.000025161493,0.000021724063,0.000010013358,0.00039619015,0.00012735049,0.9924236,0.00032135542,0.0009128693,0.0029184376],"study_design_scores_gemma":[0.0003220692,0.00009602198,0.00035028037,0.000104160186,0.00004436314,0.000021752527,0.00028707442,0.013231023,0.9761233,0.00763936,0.0014081151,0.0003724818],"about_ca_topic_score_codex":0.00011111614,"about_ca_topic_score_gemma":0.00025104033,"teacher_disagreement_score":0.01630029,"about_ca_system_score_codex":0.0001744105,"about_ca_system_score_gemma":0.00003027528,"threshold_uncertainty_score":0.95665896},"labels":[],"label_agreement":null},{"id":"W4291929344","doi":"10.31399/asm.edfa.2022-1.p003","title":"Determination of Indenter Crack Probability on Multilayer Stacks using an Acoustic Emission Test Method","year":2022,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Acoustic emission; Wafer; Materials science; Semiconductor; SIGNAL (programming language); Brittle fracture; Brittleness; Optoelectronics; Layer (electronics); Energy (signal processing); CMOS; Acoustics; Fracture (geology); Electronic engineering; Computer science; Composite material; Engineering; Physics","score_opus":0.03695661589918284,"score_gpt":0.2919720976147182,"score_spread":0.25501548171553534,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4291929344","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9571192,0.000014317889,0.042277433,0.000030878793,0.000058063782,0.00015300818,0.000019701127,0.00018108066,0.00014631297],"genre_scores_gemma":[0.99018085,9.604884e-7,0.009679746,0.000036597175,0.000027868522,0.00002279139,0.0000066850353,0.000022516135,0.000021963322],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988738,0.00009627515,0.0003401405,0.00021953708,0.00027922797,0.00019105706],"domain_scores_gemma":[0.99934095,0.00016079597,0.000055458564,0.00030163964,0.00007100976,0.000070171875],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041203707,0.00012661568,0.00019049282,0.000119151606,0.00010657509,0.0000203238,0.00017688968,0.00006881322,0.00031372005],"category_scores_gemma":[0.00018547344,0.000110389876,0.00008150742,0.0003286877,0.00003297448,0.00013299446,0.00005052738,0.00031184472,0.0000029069267],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000072720513,0.00028709605,0.0012878419,0.000019290434,0.000008986926,0.0000034529023,0.00016440423,0.043582022,0.94456685,0.000027986347,0.00006491208,0.009979906],"study_design_scores_gemma":[0.00017415817,0.00021344058,0.0011879208,0.000019922752,0.000060785613,0.000009577501,0.00021866901,0.5880807,0.40861383,0.0011086293,0.00014695393,0.00016537501],"about_ca_topic_score_codex":0.000030915722,"about_ca_topic_score_gemma":0.000022804008,"teacher_disagreement_score":0.5444987,"about_ca_system_score_codex":0.00018671177,"about_ca_system_score_gemma":0.000017038008,"threshold_uncertainty_score":0.45015684},"labels":[],"label_agreement":null},{"id":"W4299553075","doi":"10.31399/asm.edfa.2001-1.p035","title":"Backside Analysis: Focused-Ion-Beam Applications for Flip Chip Packaged ICs","year":2001,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Flip chip; Integrated circuit; Focused ion beam; Chip; Materials science; Electronic circuit; Debugging; Waveform; Electronic engineering; Optoelectronics; Computer science; Electrical engineering; Engineering; Nanotechnology; Ion; Voltage; Chemistry","score_opus":0.015531490332129947,"score_gpt":0.23082048142832784,"score_spread":0.2152889910961979,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4299553075","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6015202,0.0005438023,0.39092216,0.0007155161,0.00009467285,0.0007069204,0.000051507817,0.0016341127,0.003811115],"genre_scores_gemma":[0.9969746,0.00007093749,0.0019980352,0.00012644233,0.0002159586,0.0003484681,0.000053019325,0.000038444323,0.00017409342],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99867517,0.000018128103,0.00041969778,0.00029675162,0.00017960183,0.000410666],"domain_scores_gemma":[0.9990846,0.00016100788,0.00004315331,0.00045538624,0.00010729788,0.00014854473],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022435379,0.00020114344,0.00033827184,0.000247364,0.00014691305,0.00007775107,0.00026118918,0.00015374477,0.00021957124],"category_scores_gemma":[0.000054454234,0.00017607669,0.00036568343,0.0016091941,0.000060048536,0.0001293207,0.000019796316,0.0002290454,0.00011523755],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023359024,0.00037009522,0.007994308,0.000048961687,0.0022722434,0.000010748471,0.00021702715,0.01765828,0.87928617,0.011978761,0.015043801,0.06509622],"study_design_scores_gemma":[0.0020784396,0.00027765118,0.017159078,0.000067980356,0.0065349634,0.000037275375,0.00086537516,0.18826744,0.51085013,0.031132672,0.24017474,0.0025542427],"about_ca_topic_score_codex":0.000025158382,"about_ca_topic_score_gemma":0.00024754624,"teacher_disagreement_score":0.3954544,"about_ca_system_score_codex":0.0000721399,"about_ca_system_score_gemma":0.000014248119,"threshold_uncertainty_score":0.7180199},"labels":[],"label_agreement":null},{"id":"W4299565230","doi":"10.31399/asm.edfa.2003-4.p013","title":"Failure Analysis Turned Upside Down: A Review of Backside Analysis Techniques","year":2003,"lang":"en","type":"review","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Polishing; Materials science; Laser; Waveform; Optoelectronics; Microscopy; Laser ablation; Etching (microfabrication); Voltage; Optics; Nanotechnology; Electrical engineering; Engineering; Composite material","score_opus":0.021201763378683815,"score_gpt":0.28420444353823887,"score_spread":0.2630026801595551,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4299565230","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.000012018,0.99404526,0.0025389683,0.000047042577,0.000035180372,0.0005504124,0.00010929716,0.0006346209,0.0020272008],"genre_scores_gemma":[0.0007714973,0.99483806,0.003523977,0.00010787714,0.00006103153,0.0002004969,0.0002890713,0.00008925525,0.00011875009],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.995543,0.00029749385,0.0022920258,0.00070956285,0.0005639967,0.0005939351],"domain_scores_gemma":[0.99717957,0.00025762006,0.0004929264,0.0015749637,0.00027174057,0.00022321004],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0008743108,0.0008210977,0.005637288,0.001976829,0.000060462404,0.00006543712,0.00080550427,0.0006836756,0.0017965507],"category_scores_gemma":[0.00022523274,0.00061207806,0.005208262,0.0143670775,0.00014201947,0.00014473408,0.00007077576,0.00091156946,0.00007682672],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000001764971,0.00023156077,0.00007227157,0.07460388,0.062001668,0.000063575535,0.000035247096,0.00017043772,0.00071839703,0.0011118046,0.025935702,0.8350537],"study_design_scores_gemma":[0.000039403167,0.000028131843,0.0000040931855,0.0138005465,0.11489918,0.00001599022,0.000013176889,0.00010909218,0.0006636668,0.00010983828,0.8695397,0.00077721424],"about_ca_topic_score_codex":0.000056178756,"about_ca_topic_score_gemma":0.00025781995,"teacher_disagreement_score":0.84360397,"about_ca_system_score_codex":0.00022530938,"about_ca_system_score_gemma":0.00009063597,"threshold_uncertainty_score":0.9996331},"labels":[],"label_agreement":null},{"id":"W4299738164","doi":"10.31399/asm.edfa.2003-3.p013","title":"ABCs of Photon Emission Microscopy","year":2003,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":25,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Photon; Microscopy; Photon flux; Two-photon excitation microscopy; Materials science; Nanotechnology; Optoelectronics; Computer science; Optics; Physics","score_opus":0.009186161088774092,"score_gpt":0.22113835225939849,"score_spread":0.2119521911706244,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4299738164","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9896765,0.00034218075,0.0015163455,0.000028257136,0.00007297141,0.000056552275,0.0000029536654,0.0002157501,0.00808851],"genre_scores_gemma":[0.99821824,0.00003991894,0.0015781013,0.00002833719,0.000014274594,0.0000052670516,0.000001763668,0.000016644673,0.00009744408],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99931794,0.000017868904,0.0002489365,0.000115325565,0.00011310524,0.00018679014],"domain_scores_gemma":[0.99962246,0.000032462867,0.000022664386,0.00021575781,0.000039725815,0.000066947374],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011980234,0.00010118362,0.00016933691,0.00006299116,0.000028532746,0.000012724783,0.000105289524,0.00009158408,0.00034838208],"category_scores_gemma":[0.000068475936,0.00008209097,0.00008660602,0.00029742782,0.000047296453,0.000059412538,0.000007404993,0.00013827924,0.000032796994],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000012144992,0.000030682826,0.0006647153,0.000011995227,0.000016660159,0.0000016553505,0.000041110736,0.00008785827,0.9940675,0.0016096304,0.0025355625,0.0009314282],"study_design_scores_gemma":[0.00010302878,0.000024125175,0.00018887516,0.000023166785,0.000023336004,0.000004960003,0.00005945582,0.00071123126,0.9873227,0.0015979096,0.009835496,0.00010570292],"about_ca_topic_score_codex":0.000012720021,"about_ca_topic_score_gemma":0.0000062301665,"teacher_disagreement_score":0.008541768,"about_ca_system_score_codex":0.000027825785,"about_ca_system_score_gemma":0.000010185608,"threshold_uncertainty_score":0.38145393},"labels":[],"label_agreement":null},{"id":"W4299866212","doi":"10.31399/asm.edfa.2004-4.p012","title":"Thermal Solutions for Device Analysis of Integrated Circuits","year":2004,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Materials science; Mechanical engineering; Thermal analysis; Electronic circuit; Jet (fluid); Integrated circuit; Thermal; Nuclear engineering; Engineering physics; Process engineering; Electrical engineering; Engineering; Thermodynamics; Optoelectronics; Aerospace engineering; Physics","score_opus":0.026631452265788978,"score_gpt":0.23957379979511592,"score_spread":0.21294234752932695,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4299866212","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9269071,0.00027223106,0.07120951,0.00016386143,0.000053429427,0.00014465128,0.000074544274,0.00036997724,0.0008046636],"genre_scores_gemma":[0.9988198,0.000011919174,0.0009744917,0.000049776423,0.000027916327,0.000037505208,0.000044409593,0.000019751375,0.000014380019],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99897027,0.000013028811,0.00037611823,0.00016914004,0.00013227951,0.00033915066],"domain_scores_gemma":[0.999395,0.00007472509,0.00004011307,0.0002636273,0.00015250745,0.00007399407],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019780111,0.00013837124,0.00033133785,0.00031132431,0.00007432233,0.000021712005,0.00019440395,0.000113081165,0.00012567684],"category_scores_gemma":[0.000088850145,0.00011515191,0.00031902408,0.0017307856,0.0000748693,0.00010396818,0.000015993815,0.00014032981,0.00001284414],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000002420527,0.00008435283,0.00032786225,0.0000133478625,0.0009821451,0.0000012199949,0.00013361877,0.13717364,0.84486145,0.010033588,0.00018351784,0.00620283],"study_design_scores_gemma":[0.0014573551,0.00025241476,0.018657217,0.00010663789,0.0073985257,0.000005529961,0.0009810784,0.17828147,0.78003395,0.0070400466,0.0047453907,0.0010403778],"about_ca_topic_score_codex":0.00012572808,"about_ca_topic_score_gemma":0.0004055975,"teacher_disagreement_score":0.07191272,"about_ca_system_score_codex":0.000099289755,"about_ca_system_score_gemma":0.00003182803,"threshold_uncertainty_score":0.46957585},"labels":[],"label_agreement":null},{"id":"W4300165558","doi":"10.31399/asm.edfa.2004-1.p025","title":"Incorporating Comparative TDR into the Device Analysis Flow","year":2004,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Reflectometry; Computer science; Measure (data warehouse); Electronic engineering; Chip; Time domain; Electrical conductor; Flip chip; Electrical engineering; Engineering; Telecommunications; Materials science; Data mining","score_opus":0.02105799754932386,"score_gpt":0.24649876783007618,"score_spread":0.22544077028075232,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4300165558","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9712967,0.00034698058,0.024485983,0.0007898391,0.000053210115,0.00011073393,0.0000033297622,0.0005016249,0.0024115688],"genre_scores_gemma":[0.9936436,0.000008906715,0.006042173,0.00016656886,0.00007350646,0.00002480261,0.00001057414,0.000014273159,0.000015618893],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99897385,0.000035334324,0.0003401296,0.00019924706,0.00020907742,0.0002423381],"domain_scores_gemma":[0.9993513,0.000091017755,0.000042294807,0.0003503618,0.00008361778,0.000081368],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022535956,0.0001697437,0.00029523962,0.00014147823,0.00017982698,0.00008811321,0.0002907538,0.00008279667,0.00009076181],"category_scores_gemma":[0.00004207684,0.00011079173,0.00020057402,0.001882075,0.00012117906,0.00014967816,0.000034912304,0.00031237406,0.00012759921],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000005562463,0.00010623743,0.002087274,0.000014310138,0.0015426602,0.00001801595,0.0045247935,0.64950854,0.31717423,0.014349474,0.00093194033,0.009737006],"study_design_scores_gemma":[0.0009476439,0.00017593897,0.010458194,0.00008518273,0.0032029718,0.000020577436,0.006154764,0.4684047,0.45240384,0.05033017,0.0064035435,0.0014124607],"about_ca_topic_score_codex":0.00026360404,"about_ca_topic_score_gemma":0.0025566025,"teacher_disagreement_score":0.18110381,"about_ca_system_score_codex":0.00011208088,"about_ca_system_score_gemma":0.000019416493,"threshold_uncertainty_score":0.45179555},"labels":[],"label_agreement":null},{"id":"W4300823242","doi":"10.31399/asm.edfa.2003-1.p011","title":"Chip-Scale Packages and Their Failure Analysis Challenges","year":2003,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Chip-scale package; Computer science; Chip; Scale (ratio); Ball grid array; Reliability engineering; Embedded system; Engineering; Materials science; Soldering; Telecommunications","score_opus":0.011124831144295869,"score_gpt":0.1906325454034149,"score_spread":0.17950771425911904,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4300823242","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98600465,0.004144688,0.002479864,0.00053791347,0.00004019142,0.0000825488,0.000009371509,0.00057155266,0.0061292294],"genre_scores_gemma":[0.99852806,0.00059853954,0.000706683,0.00004606113,0.000033921406,0.000015510599,0.0000039000406,0.00002309517,0.000044242915],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99904865,0.0000464306,0.00023436436,0.00025725566,0.00010941159,0.00030389664],"domain_scores_gemma":[0.99940777,0.00007656572,0.000022023916,0.0003293708,0.000038032125,0.0001262507],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019301203,0.00020066423,0.00033200724,0.00019140591,0.00007439502,0.00005527427,0.0001239931,0.00013487769,0.00020279527],"category_scores_gemma":[0.000045633693,0.00014601713,0.00017216899,0.0006608513,0.00008181123,0.00011644917,0.000016309714,0.00022177893,0.000027125772],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000004394398,0.00021166247,0.01306342,0.00008164808,0.0025631408,0.000018252696,0.002409625,0.0019419568,0.9001469,0.03076558,0.0033032538,0.04549014],"study_design_scores_gemma":[0.00087695377,0.00020856134,0.04355656,0.00007314945,0.0021760028,0.00008413052,0.008172526,0.013650176,0.8247159,0.023979593,0.08048248,0.0020239449],"about_ca_topic_score_codex":0.000009171963,"about_ca_topic_score_gemma":0.0004620992,"teacher_disagreement_score":0.07717923,"about_ca_system_score_codex":0.000023639333,"about_ca_system_score_gemma":0.0000054145844,"threshold_uncertainty_score":0.59544057},"labels":[],"label_agreement":null},{"id":"W4300859152","doi":"10.31399/asm.edfa.2001-1.p020","title":"Emission Microscopy: A Historical Review","year":2001,"lang":"en","type":"review","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hyperion Technologies (Canada)","funders":"","keywords":"Optoelectronics; Luminescence; Materials science; Microscopy; Light emission; Oxide; Avalanche diode; Nanotechnology; Avalanche breakdown; Breakdown voltage; Transistor; Engineering physics; Voltage; Electrical engineering; Optics; Engineering; Physics","score_opus":0.03905045904956955,"score_gpt":0.2972402627426202,"score_spread":0.25818980369305067,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4300859152","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0000017263204,0.99644107,0.00022635715,0.00009148417,0.00020163601,0.00029770593,0.0000072846747,0.0006772468,0.0020555023],"genre_scores_gemma":[0.000011661618,0.99843955,0.00025584645,0.00009373801,0.00020126744,0.00008864739,0.00003508752,0.00008346537,0.0007907319],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99811685,0.00006449574,0.0008538816,0.0003518354,0.0002221394,0.00039078546],"domain_scores_gemma":[0.9990266,0.00008453164,0.00009286915,0.00056747923,0.00004475507,0.00018379663],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00021262864,0.00043065302,0.001696348,0.00014729536,0.000054200704,0.000035198875,0.00041431788,0.00040944986,0.0005685122],"category_scores_gemma":[0.00011534642,0.00030556336,0.00076087157,0.0010240858,0.000030862182,0.000064319334,0.000044104207,0.0007598221,0.00041191274],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[1.3914197e-7,0.000025981253,3.3500189e-7,0.009371552,0.00006183634,0.000022834662,0.0000021339881,3.9130447e-7,0.00032295592,0.000029729565,0.19411705,0.79604506],"study_design_scores_gemma":[0.00002571494,0.000015315374,7.997852e-8,0.026299793,0.0009872186,0.00007695647,8.779745e-7,0.000016512908,0.00005008709,0.000055233675,0.97211224,0.00035994273],"about_ca_topic_score_codex":0.00001837975,"about_ca_topic_score_gemma":0.000004772926,"teacher_disagreement_score":0.7956851,"about_ca_system_score_codex":0.00072661566,"about_ca_system_score_gemma":0.000047169444,"threshold_uncertainty_score":0.9999396},"labels":[],"label_agreement":null},{"id":"W4301193134","doi":"10.31399/asm.edfa.2002-4.p011","title":"Rapid Resistive Interconnection Localization","year":2002,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Interconnection; Resistive touchscreen; Flip chip; Electrical conductor; Computer science; Electronic engineering; Chip; Electrical engineering; Materials science; Engineering; Nanotechnology; Telecommunications","score_opus":0.01924133854147251,"score_gpt":0.19268798439994558,"score_spread":0.17344664585847308,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4301193134","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7550137,0.0027782917,0.16667292,0.0012596643,0.0007035025,0.0003692358,0.000012972885,0.0042913267,0.06889841],"genre_scores_gemma":[0.9993208,0.00011454278,0.0002107239,0.00009721141,0.00008237912,0.000012426217,0.0000040997356,0.000017682733,0.00014011831],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9993692,0.000020517695,0.00019935009,0.00013627623,0.000103595936,0.00017103415],"domain_scores_gemma":[0.9996838,0.00003496114,0.00001588609,0.00016344785,0.000047039906,0.00005487428],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000073540636,0.0000989365,0.00011645847,0.00009246546,0.000059836235,0.000035405774,0.00008880633,0.00008419608,0.0013974161],"category_scores_gemma":[0.000068385336,0.00008629848,0.00006609829,0.0003708704,0.000040983592,0.00013759475,0.000010276365,0.00014128281,0.00029680927],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008946914,0.00021492598,0.00088725786,0.000042935295,0.00020184273,0.000022923876,0.00089442084,0.007819247,0.6035521,0.010323096,0.13741583,0.2386165],"study_design_scores_gemma":[0.0004457678,0.00016679672,0.0012130518,0.00008141722,0.00013775923,0.00003061253,0.0004899514,0.57781893,0.32383955,0.0042426437,0.090890035,0.0006435175],"about_ca_topic_score_codex":0.000013975334,"about_ca_topic_score_gemma":0.00004200433,"teacher_disagreement_score":0.56999964,"about_ca_system_score_codex":0.00006396391,"about_ca_system_score_gemma":0.0000013362892,"threshold_uncertainty_score":0.9995154},"labels":[],"label_agreement":null},{"id":"W4301486599","doi":"10.31399/asm.edfa.2001-4.p029","title":"Recent Development: Single Contact Optical Beam Induced Currents (SCOBIC) – Technique and Applications","year":2001,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Beam (structure); CMOS; Materials science; Point (geometry); Optics; Optoelectronics; Computer science; Electronic engineering; Engineering; Physics; Mathematics","score_opus":0.02489163330588585,"score_gpt":0.23449581308922957,"score_spread":0.20960417978334372,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4301486599","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.967945,0.000607394,0.025444262,0.00019055691,0.0000712924,0.0004739127,0.0000033880037,0.00088917237,0.004375012],"genre_scores_gemma":[0.99737805,0.00022132711,0.0019850736,0.000047390306,0.00006817287,0.00024139583,0.0000126574005,0.000027016024,0.000018891415],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99892586,0.000012671356,0.00034214047,0.0002439391,0.00015859566,0.00031678143],"domain_scores_gemma":[0.99945,0.000061433355,0.000026184864,0.00023332227,0.00007017141,0.00015884262],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013656857,0.00017668262,0.00020696997,0.00011452548,0.00010043761,0.00006207853,0.00016012513,0.00015172969,0.000116424395],"category_scores_gemma":[0.00004926838,0.00015654467,0.00004355724,0.0004647405,0.000046477664,0.00012635069,0.00004046995,0.00028425688,0.000062874904],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000026533949,0.00012585118,0.00051832903,0.000008827024,0.00003454963,0.0000044042945,0.00003890764,0.000017515998,0.8307819,0.0010514442,0.0002570954,0.16715854],"study_design_scores_gemma":[0.00025612288,0.0000715897,0.0021809079,0.000054802906,0.00005539296,0.000060287384,0.00008120602,0.00036938474,0.8224832,0.0007986561,0.17317028,0.00041817527],"about_ca_topic_score_codex":0.0000052258556,"about_ca_topic_score_gemma":0.000028764429,"teacher_disagreement_score":0.17291318,"about_ca_system_score_codex":0.0001089472,"about_ca_system_score_gemma":0.000019321908,"threshold_uncertainty_score":0.6383707},"labels":[],"label_agreement":null},{"id":"W4307557603","doi":"10.31399/asm.cp.istfa2022p0043","title":"Machine Learning Methods for FEOL/MEOL Defects Measurement through SRAM Bitmap","year":2022,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Bitmap; Backpropagation; Static random-access memory; Computer science; Perceptron; Artificial neural network; Test data; Artificial intelligence; Computer hardware","score_opus":0.030835004573532887,"score_gpt":0.27412402107428585,"score_spread":0.24328901650075296,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4307557603","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.12567914,0.0065833274,0.83443946,0.0047985264,0.0018726434,0.0030897716,0.00068013015,0.0029149198,0.0199421],"genre_scores_gemma":[0.93405646,0.000045815123,0.06401152,0.0001436479,0.00024360107,0.0007939245,0.000216553,0.00007560203,0.0004128684],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9979952,0.000027971244,0.0005295119,0.0005554072,0.0004694085,0.00042250985],"domain_scores_gemma":[0.9982838,0.0003227512,0.0002192316,0.00010278284,0.0009773242,0.0000941269],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0012707904,0.00034548336,0.00052306306,0.00043809577,0.0007161121,0.00026240465,0.0003682056,0.000089856025,0.000077002405],"category_scores_gemma":[0.0006553311,0.00034075268,0.00042998345,0.0012918944,0.000035435074,0.00028497167,0.000084904364,0.00040198423,0.0000011772678],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010967995,0.0002294758,0.03794232,0.0005681934,0.020712983,0.0000031536533,0.0040148124,0.26334485,0.63774276,0.011042183,0.0049476232,0.019341959],"study_design_scores_gemma":[0.00058976066,0.00022565783,0.000050197486,0.000028681596,0.003387135,0.000019579054,0.0007629969,0.85685056,0.0057859663,0.0019439026,0.1298241,0.0005314593],"about_ca_topic_score_codex":0.00020270668,"about_ca_topic_score_gemma":0.000035733097,"teacher_disagreement_score":0.8083773,"about_ca_system_score_codex":0.00032580737,"about_ca_system_score_gemma":0.000022844832,"threshold_uncertainty_score":0.99990445},"labels":[],"label_agreement":null},{"id":"W4307557622","doi":"10.31399/asm.cp.istfa2022p0319","title":"A Correlative Microscopic Workflow For Nanoscale Failure Analysis and Characterization of Advanced Electronics Packages","year":2022,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Characterization (materials science); Workflow; Materials science; Focused ion beam; Sample (material); Computer science; Sample preparation; Nanotechnology; Nanoscopic scale; Chemistry","score_opus":0.005977493600999457,"score_gpt":0.20815140851296213,"score_spread":0.20217391491196268,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4307557622","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9768801,0.0002317989,0.021002103,0.0005158082,0.000100465,0.0004174396,0.0005876104,0.00012807443,0.00013660567],"genre_scores_gemma":[0.9916671,0.00007395348,0.006764809,0.000039431234,0.000070374415,0.00031501762,0.0007525377,0.000036982,0.00027979942],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.998438,0.0000111571635,0.00051141426,0.00047615243,0.00025574755,0.00030755633],"domain_scores_gemma":[0.99867177,0.00020729638,0.00031147327,0.000098682794,0.00063550647,0.00007526484],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00027422854,0.0002741816,0.0005985592,0.0008196989,0.00033073756,0.00013975463,0.00022139463,0.000096475414,0.000033294527],"category_scores_gemma":[0.00012229432,0.00028103794,0.00034587647,0.0023764318,0.000055316814,0.00028789262,0.00005141791,0.00021448151,1.7825813e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004504551,0.00005252679,0.06516106,0.00011798923,0.010029094,3.8296199e-7,0.0011401592,0.00983599,0.91041327,0.00086511247,0.00012205197,0.002217356],"study_design_scores_gemma":[0.0018758914,0.0006397187,0.0075080236,0.00009382948,0.026600812,0.00001956524,0.0027754086,0.8727815,0.07177761,0.0012726396,0.013380209,0.0012747513],"about_ca_topic_score_codex":0.000037417387,"about_ca_topic_score_gemma":0.000084449595,"teacher_disagreement_score":0.86294556,"about_ca_system_score_codex":0.00013615712,"about_ca_system_score_gemma":0.000020261605,"threshold_uncertainty_score":0.9999642},"labels":[],"label_agreement":null},{"id":"W4312300771","doi":"10.23919/eusipco55093.2022.9909919","title":"Boundary Enhanced Semantic Segmentation for High Resolution Electron Microscope Images","year":2022,"lang":"en","type":"article","venue":"2022 30th European Signal Processing Conference (EUSIPCO)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Computer science; Segmentation; Leverage (statistics); Artificial intelligence; Encoder; Image segmentation; Computer vision; Artificial neural network; Boundary (topology); Domain (mathematical analysis); Pattern recognition (psychology)","score_opus":0.012096134452989913,"score_gpt":0.22902294536890716,"score_spread":0.21692681091591726,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4312300771","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.62282413,0.0034520226,0.35851738,0.00024238547,0.0006700644,0.0009365325,0.000246757,0.0010221472,0.012088573],"genre_scores_gemma":[0.99636596,0.00006189432,0.0007203662,0.00017288628,0.00018648505,0.00010275651,0.00055946107,0.00010962833,0.0017205821],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9978932,0.00021374763,0.00047386173,0.0005023505,0.00037031554,0.000546517],"domain_scores_gemma":[0.99924767,0.000038825565,0.0001676955,0.00021973117,0.00024523423,0.00008085345],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005397986,0.00032610996,0.00031631143,0.00024117624,0.00088523905,0.00038258464,0.00041476378,0.000043396612,0.0009069728],"category_scores_gemma":[0.000018949935,0.00034794633,0.00011111097,0.0005457727,0.000074122254,0.00039656318,0.00007546411,0.0005215513,0.000039063947],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039329927,0.000038476308,0.000009279921,0.00013355516,0.00007570079,0.000009783727,0.0008522513,0.0057384744,0.9617216,0.0001529808,0.0034355677,0.027792979],"study_design_scores_gemma":[0.0016768217,0.00072299107,0.0003251232,0.00019584,0.00047265698,0.000040641615,0.002898769,0.08670275,0.88734764,0.001239857,0.016846469,0.0015304394],"about_ca_topic_score_codex":0.000037545586,"about_ca_topic_score_gemma":0.000013461215,"teacher_disagreement_score":0.3735418,"about_ca_system_score_codex":0.00029199992,"about_ca_system_score_gemma":0.0002033713,"threshold_uncertainty_score":0.99989724},"labels":[],"label_agreement":null},{"id":"W4323244232","doi":"10.5220/0011728100003417","title":"DeepCaps+: A Light Variant of DeepCaps","year":2023,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Computer science","score_opus":0.007612514872993387,"score_gpt":0.1864018145232784,"score_spread":0.178789299650285,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4323244232","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6355735,0.00054448855,0.008782724,0.00037336483,0.00083326304,0.00019303644,0.000025734491,0.0021941047,0.3514798],"genre_scores_gemma":[0.99794227,0.0000707509,0.00016286416,0.000031976306,0.00004925224,0.000006438981,0.000017672946,0.000024193929,0.0016945676],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99932814,0.000009375099,0.00021769016,0.00011122984,0.00012113464,0.00021242168],"domain_scores_gemma":[0.99964833,0.000023828694,0.000016535201,0.00021371353,0.00004658587,0.00005097507],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00010052513,0.00010811236,0.00018976146,0.00020465143,0.000021845657,0.00001537408,0.00013484285,0.00007650395,0.0010584682],"category_scores_gemma":[0.000014063624,0.00008623648,0.00010258109,0.00068433385,0.000011062443,0.00006920081,0.000011717909,0.00009470419,0.00047594873],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000003675405,0.000037391786,0.00033856835,0.00012739818,0.0008397775,0.00011077617,0.0017422236,0.017043537,0.79060817,0.05875596,0.1235867,0.0068058446],"study_design_scores_gemma":[0.0007374011,0.00009325994,0.0008224978,0.000089263805,0.0003721581,0.00004579803,0.0024880047,0.25549152,0.58003736,0.0045509036,0.15423194,0.0010398792],"about_ca_topic_score_codex":0.000062746214,"about_ca_topic_score_gemma":0.000058315574,"teacher_disagreement_score":0.3623688,"about_ca_system_score_codex":0.000017838942,"about_ca_system_score_gemma":0.000011055226,"threshold_uncertainty_score":0.9998547},"labels":[],"label_agreement":null},{"id":"W4367043601","doi":"10.1016/j.addma.2023.103579","title":"In situ correlative observation of humping-induced cracking in directed energy deposition of nickel-based superalloys","year":2023,"lang":"en","type":"article","venue":"Additive manufacturing","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Queen's University","funders":"Engineering and Physical Sciences Research Council; Natural Sciences and Engineering Research Council of Canada; Royal Academy of Engineering; Diamond Light Source; Canada Foundation for Innovation; Ontario Centres of Excellence","keywords":"Materials science; Superalloy; Waviness; Cracking; Synchrotron; Surface roughness; Laser; Optics; Composite material; Alloy","score_opus":0.017040166134575225,"score_gpt":0.22189256487415304,"score_spread":0.2048523987395778,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4367043601","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978595,0.000021451537,0.0008501444,0.000016618109,0.00012713336,0.00008874079,0.000027197402,0.00011923573,0.0008900281],"genre_scores_gemma":[0.99946475,0.00002206244,0.00007299965,0.00002446189,0.000025391448,0.000024626794,0.00030430846,0.000029203056,0.000032168246],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988687,0.00006941295,0.00045661032,0.00019904342,0.00016370723,0.0002425109],"domain_scores_gemma":[0.9994433,0.00022235455,0.0000937667,0.00013684767,0.00007694714,0.000026810078],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012487982,0.00017405867,0.00034102576,0.00070390676,0.000024110861,0.000009872954,0.00010116923,0.00012547335,0.00006248665],"category_scores_gemma":[0.000052015836,0.00018534271,0.000088925575,0.0007168508,0.000022631379,0.00028007643,0.000014282162,0.00020850648,0.0000049639984],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000017462366,0.00003570551,0.0014395585,0.0000707384,0.00009061031,0.00003463815,0.001408001,0.06325101,0.9281526,0.00026702235,0.000083258405,0.0051493743],"study_design_scores_gemma":[0.0003544288,0.000025878018,0.039436497,0.00027618487,0.000019800455,4.6088275e-7,0.0003644804,0.048117284,0.9110484,0.00016850168,0.0000251296,0.00016296744],"about_ca_topic_score_codex":0.0011096216,"about_ca_topic_score_gemma":0.0020227362,"teacher_disagreement_score":0.037996937,"about_ca_system_score_codex":0.0001596091,"about_ca_system_score_gemma":0.000020272106,"threshold_uncertainty_score":0.7558056},"labels":[],"label_agreement":null},{"id":"W4372263884","doi":"10.1109/icassp49357.2023.10095703","title":"Automatic Error Detection in Integrated Circuits Image Segmentation: A Data-Driven Approach","year":2023,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Tetra Tech (Canada)","funders":"","keywords":"Computer science; Correctness; Artificial intelligence; Image segmentation; Segmentation; Computer vision; Image processing; Image (mathematics); Error detection and correction; Integrated circuit; Pattern recognition (psychology); Algorithm","score_opus":0.03394619714830221,"score_gpt":0.2588143038926775,"score_spread":0.2248681067443753,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4372263884","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9326398,0.000046109348,0.049528833,0.000048866033,0.00033404934,0.00039906515,0.00006666245,0.0025487633,0.014387858],"genre_scores_gemma":[0.9973897,0.000018425688,0.0010665635,0.00002575778,0.000039775576,0.000051971423,0.00093116635,0.000038367292,0.00043827944],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99887323,0.000042647254,0.00033480083,0.00029468443,0.00017076812,0.00028385042],"domain_scores_gemma":[0.9994021,0.000030251764,0.000027600952,0.00043788116,0.0000488275,0.000053329142],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000213541,0.00017960809,0.00022899917,0.00049307756,0.000044293607,0.00008736731,0.0002997813,0.000100799756,0.00042451915],"category_scores_gemma":[0.000032857613,0.00015638999,0.000047133522,0.0019280772,0.000020976115,0.00047549454,0.00003102017,0.0002405376,0.00037721577],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000033061754,0.00011723277,0.00050898106,0.0003699805,0.00062143616,0.00008338173,0.0035643324,0.07235714,0.7093928,0.00031515578,0.018014027,0.19465223],"study_design_scores_gemma":[0.00022346896,0.000009483962,0.00045055483,0.00001710417,0.000039057544,0.000007845356,0.002769395,0.98788476,0.008025465,0.00003412895,0.0003440718,0.00019466523],"about_ca_topic_score_codex":0.00023211392,"about_ca_topic_score_gemma":0.0006125048,"teacher_disagreement_score":0.91552764,"about_ca_system_score_codex":0.0001342149,"about_ca_system_score_gemma":0.000023449351,"threshold_uncertainty_score":0.63773984},"labels":[],"label_agreement":null},{"id":"W4376271464","doi":"10.1109/asmc57536.2023.10121103","title":"Microcircuit Defect and Counterfeit Detection via Silicon Geometry","year":2023,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo; Palette (Canada)","funders":"","keywords":"Counterfeit; Sophistication; Reliability (semiconductor); Computer science; Face (sociological concept); Domain (mathematical analysis); Reliability engineering; Engineering; Mathematics; Physics; Geography","score_opus":0.00671964805224098,"score_gpt":0.18691951538716295,"score_spread":0.18019986733492196,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4376271464","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99135053,0.0002787989,0.0033474755,0.000013421434,0.00018764973,0.000056421075,0.0000046038135,0.00074175897,0.0040193615],"genre_scores_gemma":[0.99918014,0.00010911474,0.000005581053,0.00005052394,0.00005983399,0.0000078098465,0.000013704948,0.00002681996,0.00054645346],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993799,0.00000946491,0.00014048863,0.00016270309,0.00008520919,0.00022224072],"domain_scores_gemma":[0.999734,0.000034621295,0.000011754091,0.00013206745,0.00003382182,0.000053749685],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010815465,0.00012828824,0.00014622569,0.00029454398,0.000059151596,0.000054503493,0.00006111549,0.000101086036,0.00021465476],"category_scores_gemma":[0.000009870083,0.000115063835,0.00008097038,0.00065565587,0.000017808743,0.00010946597,0.00000967871,0.00013974243,0.0003532281],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[9.5197015e-7,0.0000029662071,0.00069239317,0.000031508243,0.00015585012,0.0000051906627,0.0001290462,0.00061332865,0.97425926,0.00005093862,0.0010542513,0.02300431],"study_design_scores_gemma":[0.00044413633,0.00007730539,0.0049979077,0.000027004486,0.00022659272,0.00007456952,0.0008283333,0.15064523,0.8240372,0.00047513365,0.01744314,0.00072343845],"about_ca_topic_score_codex":0.00013741513,"about_ca_topic_score_gemma":0.00021787567,"teacher_disagreement_score":0.15022206,"about_ca_system_score_codex":0.00004423063,"about_ca_system_score_gemma":0.0000035933049,"threshold_uncertainty_score":0.46921667},"labels":[],"label_agreement":null},{"id":"W4377082989","doi":"10.1364/ofc.2023.w4c.2","title":"Direct Electrostriction Measurement using SPM for Fiber Type Identification","year":2023,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ciena (Canada)","funders":"","keywords":"Electrostriction; Materials science; Fiber; Modulation (music); Identification (biology); Optics; Acoustics; Physics; Composite material","score_opus":0.052208119442952894,"score_gpt":0.2522314531281231,"score_spread":0.20002333368517022,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4377082989","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8817637,0.00062417466,0.07864551,0.00014537585,0.002381061,0.00094076083,0.000029825456,0.0034776963,0.0319919],"genre_scores_gemma":[0.99753547,0.000035780973,0.00021821802,0.000009440952,0.00009711728,0.0000151532895,0.000053581618,0.000023935969,0.0020113108],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994435,0.000007042892,0.0001444072,0.00011029756,0.00013457677,0.00016023222],"domain_scores_gemma":[0.9996519,0.000010616177,0.000016106818,0.0001077466,0.00019194523,0.000021681417],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020881246,0.00007408729,0.00008574495,0.00015103993,0.000058025325,0.000041052797,0.000045310444,0.0000471024,0.00012911588],"category_scores_gemma":[0.000030638104,0.00006717544,0.00005653982,0.00064667204,0.0000032756423,0.00008202659,0.0000022617912,0.00004124729,0.00016535955],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000018669883,0.0000038063533,0.000012772662,0.00001523142,0.00010257004,2.1449901e-7,0.00004001994,0.013633306,0.96663314,0.00016710903,0.016536448,0.0028534927],"study_design_scores_gemma":[0.000117276366,0.000020555564,0.00016849765,0.000010873094,0.00013575493,0.000001126277,0.00009420418,0.3599276,0.60408086,0.00011959796,0.035130445,0.00019323143],"about_ca_topic_score_codex":0.000037204194,"about_ca_topic_score_gemma":0.000026048692,"teacher_disagreement_score":0.36255231,"about_ca_system_score_codex":0.00014395284,"about_ca_system_score_gemma":0.000013908339,"threshold_uncertainty_score":0.27393347},"labels":[],"label_agreement":null},{"id":"W4386213232","doi":"10.1088/2058-9565/acf47b","title":"Quantum-referenced spontaneous emission tomography","year":2023,"lang":"en","type":"article","venue":"Quantum Science and Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada; Engineering and Physical Sciences Research Council; University of Toronto","keywords":"Photon; Physics; Phase (matter); Quantum; Tomography; Interference (communication); Optics; Quantum optics; Quantum mechanics; Computer science; Telecommunications","score_opus":0.010630583442079925,"score_gpt":0.2218866186078286,"score_spread":0.21125603516574867,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4386213232","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9960433,0.00025979528,0.000077931545,0.0004268133,0.0002362429,0.00006464444,0.000004303128,0.0013920321,0.0014949074],"genre_scores_gemma":[0.9995167,0.0003057696,0.000025322617,0.000026614836,0.000016144695,0.000011173785,0.0000044868702,0.000012968977,0.000080784106],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99874747,0.0000063495686,0.00017857116,0.00032671486,0.00025916114,0.000481719],"domain_scores_gemma":[0.99940693,0.000026209415,0.000022997632,0.00029758734,0.00015438888,0.000091912334],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00031789235,0.00014844185,0.0001941442,0.0016471676,0.0002447978,0.00006046008,0.00039677543,0.00016798067,0.00003451088],"category_scores_gemma":[0.0001082163,0.00011985039,0.00003224036,0.0062322617,0.00051116815,0.00015881973,0.000053441985,0.00024358575,0.00008575854],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000019837858,0.000009237938,0.0006980246,0.000015924592,0.000022581644,0.0001866876,0.00016484503,0.00004124568,0.9040422,0.07008418,0.001995148,0.02273797],"study_design_scores_gemma":[0.00057480467,0.00048672402,0.0014543035,0.00015360671,0.00010198421,0.0011253188,0.005861858,0.56240726,0.27979234,0.103058815,0.04356561,0.0014173652],"about_ca_topic_score_codex":0.000023913477,"about_ca_topic_score_gemma":0.000015567402,"teacher_disagreement_score":0.6242498,"about_ca_system_score_codex":0.000035206594,"about_ca_system_score_gemma":0.000055116743,"threshold_uncertainty_score":0.4887357},"labels":[],"label_agreement":null},{"id":"W4386825297","doi":"10.1109/mdat.2023.3314672","title":"VioNet: A Hierarchical Detailed Routing Wire-Short Violation Predictor Based on a Convolutional Neural Network","year":2023,"lang":"en","type":"article","venue":"IEEE Design and Test","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada; Huawei Technologies","keywords":"Netlist; Speedup; Computer science; Routing (electronic design automation); Convolutional neural network; Static routing; Hierarchical routing; Multipath routing; Distance-vector routing protocol; Artificial intelligence; Machine learning; Routing protocol; Computer network; Parallel computing; Embedded system","score_opus":0.021412589107313362,"score_gpt":0.21688183300766362,"score_spread":0.19546924390035025,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4386825297","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9421341,0.0000843,0.05523839,0.00011459337,0.0005108471,0.0003215005,0.000035058387,0.0009265598,0.00063465175],"genre_scores_gemma":[0.99910563,0.000011805262,0.00021302316,0.00010390725,0.0003615856,0.000030327295,0.00008699382,0.000030245476,0.000056508645],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99895334,0.000058553873,0.0002197481,0.00021698108,0.00018441428,0.00036697768],"domain_scores_gemma":[0.99910724,0.0005851287,0.000019688337,0.00012663114,0.000043149947,0.00011818687],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028799844,0.0001732911,0.00019334498,0.00013589938,0.00014500339,0.000058875034,0.00007294199,0.00011232725,0.000041231564],"category_scores_gemma":[0.000082357634,0.00015454585,0.00006922543,0.00048424932,0.000037114354,0.000078858844,0.000004653774,0.00024668913,0.000030417159],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003087522,0.000033816475,0.031405643,0.000018149907,0.00008634952,0.00003856932,0.00010942339,0.9210535,0.038804464,0.00040931688,0.005713291,0.0022965686],"study_design_scores_gemma":[0.0002276131,0.00008818051,0.015664743,0.00004386506,0.000044666158,0.00000463058,0.000010382368,0.98280895,0.00060289906,0.00018407026,0.00014949641,0.0001704778],"about_ca_topic_score_codex":0.0000074202794,"about_ca_topic_score_gemma":0.000008835343,"teacher_disagreement_score":0.06175544,"about_ca_system_score_codex":0.000049111866,"about_ca_system_score_gemma":0.000029393963,"threshold_uncertainty_score":0.6302197},"labels":[],"label_agreement":null},{"id":"W4388506965","doi":"10.31399/asm.cp.istfa2023p0387","title":"FIB-SEM Tomography Acquisition and Data Processing Optimization for Logic and Memory Structures","year":2023,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Fibics (Canada)","funders":"","keywords":"Distortion (music); Data acquisition; Computer science; Focused ion beam; Metrology; Resolution (logic); Image resolution; Electronic engineering; Computer engineering; Artificial intelligence; Computer hardware; Computer vision; Optics; Engineering","score_opus":0.025649270155984588,"score_gpt":0.26090557559516125,"score_spread":0.23525630543917667,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4388506965","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8687871,0.0021141565,0.11957798,0.0035489886,0.00035722347,0.0013127933,0.001193946,0.0017860895,0.0013217296],"genre_scores_gemma":[0.97569126,0.00016843462,0.022677192,0.00006703857,0.00022650525,0.000074569114,0.0010045865,0.000035178113,0.00005522717],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9987434,0.000004023032,0.0003141993,0.0005212058,0.000174671,0.00024248456],"domain_scores_gemma":[0.9990753,0.00015301282,0.0001216927,0.000099176694,0.00047074418,0.000080076265],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00032187853,0.00022610681,0.00029575275,0.0006020652,0.00027960647,0.0004815689,0.00021314439,0.00012183769,0.000009153245],"category_scores_gemma":[0.00018071581,0.00020724199,0.00008128221,0.0010987744,0.000059975377,0.00058172486,0.00006911942,0.00010090471,2.3506466e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021134257,0.00012943047,0.12866431,0.0045489683,0.01910075,0.00000944156,0.006683047,0.44772324,0.2659815,0.009087261,0.017362433,0.10049829],"study_design_scores_gemma":[0.0002958647,0.000040280313,0.0007047062,0.000050080478,0.001429376,0.000011782978,0.0005475648,0.99409074,0.0005347859,0.0015135799,0.00051530986,0.0002659264],"about_ca_topic_score_codex":0.000034691693,"about_ca_topic_score_gemma":0.00001606404,"teacher_disagreement_score":0.5463675,"about_ca_system_score_codex":0.00002479207,"about_ca_system_score_gemma":0.000007986071,"threshold_uncertainty_score":0.8451083},"labels":[],"label_agreement":null},{"id":"W4388523666","doi":"10.31399/asm.tb.edfatr.t56090083","title":"Systems-Level: Development and Challenges of Solid Immersion Lens","year":2023,"lang":"en","type":"book-chapter","venue":"ASM International eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Immersion (mathematics); Lens (geology); Optics; Laser; Computer science; Materials science; Physics; Mathematics","score_opus":0.06708449010438701,"score_gpt":0.2288227062878658,"score_spread":0.16173821618347878,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4388523666","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0008598244,0.0021591191,0.00009685614,0.000059610193,0.0013201705,0.00012971341,0.00017284669,0.00015140092,0.99505043],"genre_scores_gemma":[0.3188816,0.0036510627,0.00011576322,0.000021433001,0.00031376042,0.000022069087,0.00016707636,0.00017715323,0.6766501],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.99886394,0.0000050169465,0.00043458535,0.00022844612,0.00032902593,0.00013898418],"domain_scores_gemma":[0.9994587,0.000044479155,0.00011560176,0.00015259215,0.0001858213,0.000042831245],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000110834604,0.00026268273,0.00035866673,0.00036310934,0.000028321676,0.000019820274,0.00019497192,0.000258264,0.00006206069],"category_scores_gemma":[0.0000055451974,0.00025124743,0.00010017107,0.000008767117,0.00003788788,0.00004069525,0.00004781277,0.00023627658,0.00010438634],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008530011,0.000007282346,0.0000031122872,0.00055339583,0.0036563352,0.00005486055,0.0015960542,0.0004829212,0.004172803,0.9410331,0.0031519455,0.045279626],"study_design_scores_gemma":[0.00045065087,0.000053231874,0.000051524657,0.0022032189,0.00028603032,0.0000508877,0.00084311824,0.002915,0.011479172,0.0034402292,0.97710013,0.0011267749],"about_ca_topic_score_codex":0.0000208682,"about_ca_topic_score_gemma":0.00004404238,"teacher_disagreement_score":0.97394824,"about_ca_system_score_codex":0.000098643715,"about_ca_system_score_gemma":0.000039666,"threshold_uncertainty_score":0.999994},"labels":[],"label_agreement":null},{"id":"W4388523758","doi":"10.31399/asm.tb.edfatr.t56090131","title":"Package Innovation Roadmap","year":2023,"lang":"en","type":"book-chapter","venue":"ASM International eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Reliability engineering; Reliability (semiconductor); Engineering; Artificial neural network; Computer science; Fault (geology); Service (business); Throughput; Stacking; Wafer; Artificial intelligence; Systems engineering; Electrical engineering; Telecommunications","score_opus":0.023295262716687696,"score_gpt":0.2191218917463964,"score_spread":0.1958266290297087,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4388523758","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0002167701,0.000032306405,0.00035666017,0.00006727311,0.0020382437,0.00009802112,0.00013863848,0.00055938377,0.9964927],"genre_scores_gemma":[0.0565457,0.000040880794,0.000040890576,0.00013899597,0.0006895408,0.000016764696,0.00076232094,0.00016089338,0.941604],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.9986683,0.0000038270414,0.0004822966,0.0002638203,0.00040155416,0.0001802049],"domain_scores_gemma":[0.99921197,0.000034769873,0.00010887711,0.000272878,0.00033315783,0.000038338687],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00010436067,0.00032190836,0.00027348188,0.00075042655,0.000039226798,0.000089667396,0.0003474607,0.0003567662,0.0011491452],"category_scores_gemma":[0.000022054788,0.0003269814,0.00017240332,0.000050658946,0.000036759673,0.00006593331,0.000036531244,0.0005273498,0.0018423526],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000023098498,0.0000020813227,0.0000020499883,0.000019363688,0.0009198527,0.00004573971,0.00010823664,0.00015728983,0.0045685098,0.9424791,0.03763313,0.01406234],"study_design_scores_gemma":[0.00017930454,0.00001650853,0.000008805681,0.0001920612,0.00010735082,0.000013201573,0.000024846413,0.0015449065,0.0032833326,0.07828444,0.91574204,0.0006031977],"about_ca_topic_score_codex":0.000018775738,"about_ca_topic_score_gemma":0.000045825567,"teacher_disagreement_score":0.8781089,"about_ca_system_score_codex":0.00017636728,"about_ca_system_score_gemma":0.000038157476,"threshold_uncertainty_score":0.9999182},"labels":[],"label_agreement":null},{"id":"W4388526553","doi":"10.31399/asm.tb.edfastr.t56090083","title":"System-Level: Challenges of Solid Immersion Lens Technology","year":2023,"lang":"en","type":"book-chapter","venue":"ASM International eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Immersion (mathematics); Lens (geology); Computer science; Laser; Optics; Materials science; Engineering; Physics; Mathematics","score_opus":0.036323386590194996,"score_gpt":0.230179031099407,"score_spread":0.193855644509212,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4388526553","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00018656287,0.0006266255,0.00013028321,0.00014191073,0.00152461,0.00011251183,0.00033385068,0.0004931176,0.99645054],"genre_scores_gemma":[0.5591132,0.0008947792,0.000060138915,0.000014875761,0.00032101927,0.000020167825,0.00011756997,0.00018628182,0.43927196],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.9986565,0.0000051151837,0.00050383306,0.0002873409,0.00035437036,0.00019280144],"domain_scores_gemma":[0.9991309,0.000040098097,0.00016429211,0.00032452293,0.00030547875,0.000034692843],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00009732973,0.00031985814,0.0004837059,0.00096230203,0.000028218756,0.000011227235,0.0004596152,0.00059024605,0.00017955582],"category_scores_gemma":[0.000009535476,0.00031308355,0.0002573044,0.0000266201,0.00007550842,0.000040575283,0.00006518425,0.00045907105,0.00041936347],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000037464715,0.0000034342372,8.441502e-7,0.00016836294,0.0015320008,0.00004676691,0.00012689731,0.00017326753,0.008035488,0.97451556,0.0017883029,0.013605354],"study_design_scores_gemma":[0.0015707719,0.0003502016,0.000025575542,0.008629281,0.0016294249,0.00033749835,0.004006804,0.011579083,0.09916529,0.061941024,0.8070186,0.0037464688],"about_ca_topic_score_codex":0.000019446792,"about_ca_topic_score_gemma":0.000040458915,"teacher_disagreement_score":0.9125745,"about_ca_system_score_codex":0.0001793252,"about_ca_system_score_gemma":0.000034570912,"threshold_uncertainty_score":0.9999321},"labels":[],"label_agreement":null},{"id":"W4388540230","doi":"10.31399/asm.tb.edfastr.t56090131","title":"Package Innovation Roadmap","year":2023,"lang":"en","type":"book-chapter","venue":"ASM International eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Reliability engineering; Reliability (semiconductor); Engineering; Computer science; Service (business); Artificial neural network; Fault (geology); Throughput; Stacking; Artificial intelligence; Systems engineering; Embedded system; Telecommunications","score_opus":0.023295262716687696,"score_gpt":0.2191218917463964,"score_spread":0.1958266290297087,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4388540230","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0002167701,0.000032306405,0.00035666017,0.00006727311,0.0020382437,0.00009802112,0.00013863848,0.00055938377,0.9964927],"genre_scores_gemma":[0.0565457,0.000040880794,0.000040890576,0.00013899597,0.0006895408,0.000016764696,0.00076232094,0.00016089338,0.941604],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.9986683,0.0000038270414,0.0004822966,0.0002638203,0.00040155416,0.0001802049],"domain_scores_gemma":[0.99921197,0.000034769873,0.00010887711,0.000272878,0.00033315783,0.000038338687],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00010436067,0.00032190836,0.00027348188,0.00075042655,0.000039226798,0.000089667396,0.0003474607,0.0003567662,0.0011491452],"category_scores_gemma":[0.000022054788,0.0003269814,0.00017240332,0.000050658946,0.000036759673,0.00006593331,0.000036531244,0.0005273498,0.0018423526],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000023098498,0.0000020813227,0.0000020499883,0.000019363688,0.0009198527,0.00004573971,0.00010823664,0.00015728983,0.0045685098,0.9424791,0.03763313,0.01406234],"study_design_scores_gemma":[0.00017930454,0.00001650853,0.000008805681,0.0001920612,0.00010735082,0.000013201573,0.000024846413,0.0015449065,0.0032833326,0.07828444,0.91574204,0.0006031977],"about_ca_topic_score_codex":0.000018775738,"about_ca_topic_score_gemma":0.000045825567,"teacher_disagreement_score":0.8781089,"about_ca_system_score_codex":0.00017636728,"about_ca_system_score_gemma":0.000038157476,"threshold_uncertainty_score":0.9999182},"labels":[],"label_agreement":null},{"id":"W4388820911","doi":"10.1109/paine58317.2023.10317997","title":"Exploring Security of Embedded SRAM in PIC and RISC-V Chips: Insights from Image Processing of Low-Cost Photon Emission Microscopy","year":2023,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Static random-access memory; Microcontroller; Computer science; Embedded system; Block (permutation group theory); Computer hardware; Photon; Image processing; Chip; Image (mathematics); Physics; Optics; Artificial intelligence; Telecommunications","score_opus":0.026783289411176348,"score_gpt":0.24573425266436896,"score_spread":0.2189509632531926,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4388820911","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9978283,0.0003212321,0.00015894538,0.000005021861,0.00006715758,0.000115195486,0.00001556923,0.00013035798,0.0013581938],"genre_scores_gemma":[0.99945474,0.00019404931,0.00020879299,0.0000050785625,0.000021998332,0.000014830532,0.000042150077,0.000025413627,0.000032948774],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990397,0.00002105551,0.00040272553,0.00021252269,0.0001354734,0.00018851251],"domain_scores_gemma":[0.99960387,0.00003914812,0.000061107625,0.00017483954,0.000065099324,0.00005596608],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000820676,0.00016572779,0.00035941094,0.00032132716,0.000029426905,0.000028093604,0.00010756154,0.00008856651,0.00006580864],"category_scores_gemma":[0.000028450499,0.00013854058,0.000055205077,0.00072393334,0.00003777825,0.00037980574,0.000026474423,0.0002024135,0.000006305546],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007314769,0.000022799068,0.00084176875,0.0002449959,0.000030709238,0.0000067716487,0.0055268384,0.00023360565,0.9919385,0.00001044508,0.00009414175,0.0010421635],"study_design_scores_gemma":[0.0003035825,0.00000983988,0.0010884724,0.00040277047,0.000024301555,4.836624e-7,0.00309427,0.06946374,0.92505544,0.00034657842,0.000054575827,0.00015597176],"about_ca_topic_score_codex":0.0004850476,"about_ca_topic_score_gemma":0.00014510629,"teacher_disagreement_score":0.06923013,"about_ca_system_score_codex":0.000030481637,"about_ca_system_score_gemma":0.000019741885,"threshold_uncertainty_score":0.5649521},"labels":[],"label_agreement":null},{"id":"W4389736819","doi":"10.1016/j.micron.2023.103576","title":"Voxel dose-limited resolution for thick beam-sensitive specimens imaged in a TEM or STEM","year":2023,"lang":"en","type":"article","venue":"Micron","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta","keywords":"Materials science; Optics; Resolution (logic); Fluence; Voxel; Radiation; Image resolution; Beam (structure); Aperture (computer memory); Physics","score_opus":0.028298723722907405,"score_gpt":0.23664013477677157,"score_spread":0.20834141105386417,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4389736819","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99625593,0.00012941285,0.0012750293,0.00019766868,0.00024730866,0.00037662813,0.000105172876,0.00043532305,0.0009775023],"genre_scores_gemma":[0.99695426,0.0000358398,0.00018480346,0.00006513635,0.00011290189,0.000035124845,0.00017572482,0.000051435418,0.0023847544],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99896324,0.000031389514,0.00027435453,0.00024379215,0.00009535115,0.0003918578],"domain_scores_gemma":[0.9995485,0.00009807716,0.000031369298,0.00019717007,0.00008120439,0.000043655145],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024312775,0.00017825357,0.00025581417,0.00034672627,0.00007022849,0.000041545143,0.00009792218,0.00014384578,0.000035465535],"category_scores_gemma":[0.00002576887,0.00015421363,0.0001042447,0.0007981111,0.000024446728,0.00010192811,0.000014553972,0.00023198203,0.00016320882],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000051754534,0.0000149872085,0.00007343931,0.000049643517,0.00009973953,0.00003871676,0.0014401672,0.003307372,0.97734976,0.00009574911,0.016300563,0.0011781194],"study_design_scores_gemma":[0.0026150113,0.00018580635,0.00557055,0.0002781862,0.00020481698,0.000028363771,0.008005887,0.14069699,0.80602854,0.00018241054,0.035213348,0.0009901009],"about_ca_topic_score_codex":0.0001221744,"about_ca_topic_score_gemma":0.0007707739,"teacher_disagreement_score":0.17132121,"about_ca_system_score_codex":0.00022393223,"about_ca_system_score_gemma":0.000024205905,"threshold_uncertainty_score":0.62886494},"labels":[],"label_agreement":null},{"id":"W4391087972","doi":"10.23919/ofc49934.2023.10116447","title":"Direct Electrostriction Measurement using SPM for Fiber Type Identification","year":2023,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ciena (Canada)","funders":"","keywords":"Electrostriction; Fiber; Modulation (music); Materials science; Identification (biology); Optics; Acoustics; Physics; Composite material","score_opus":0.052208119442952894,"score_gpt":0.2522314531281231,"score_spread":0.20002333368517022,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4391087972","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8817637,0.00062417466,0.07864551,0.00014537585,0.002381061,0.00094076083,0.000029825456,0.0034776963,0.0319919],"genre_scores_gemma":[0.99753547,0.000035780973,0.00021821802,0.000009440952,0.00009711728,0.0000151532895,0.000053581618,0.000023935969,0.0020113108],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994435,0.000007042892,0.0001444072,0.00011029756,0.00013457677,0.00016023222],"domain_scores_gemma":[0.9996519,0.000010616177,0.000016106818,0.0001077466,0.00019194523,0.000021681417],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020881246,0.00007408729,0.00008574495,0.00015103993,0.000058025325,0.000041052797,0.000045310444,0.0000471024,0.00012911588],"category_scores_gemma":[0.000030638104,0.00006717544,0.00005653982,0.00064667204,0.0000032756423,0.00008202659,0.0000022617912,0.00004124729,0.00016535955],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000018669883,0.0000038063533,0.000012772662,0.00001523142,0.00010257004,2.1449901e-7,0.00004001994,0.013633306,0.96663314,0.00016710903,0.016536448,0.0028534927],"study_design_scores_gemma":[0.000117276366,0.000020555564,0.00016849765,0.000010873094,0.00013575493,0.000001126277,0.00009420418,0.3599276,0.60408086,0.00011959796,0.035130445,0.00019323143],"about_ca_topic_score_codex":0.000037204194,"about_ca_topic_score_gemma":0.000026048692,"teacher_disagreement_score":0.36255231,"about_ca_system_score_codex":0.00014395284,"about_ca_system_score_gemma":0.000013908339,"threshold_uncertainty_score":0.27393347},"labels":[],"label_agreement":null},{"id":"W4391134549","doi":"10.21203/rs.3.rs-3876312/v1","title":"Correlative, ML based and non destructive 3D analysis of intergranular fatigue cracking in SAC305 Bi solder balls","year":2024,"lang":"en","type":"preprint","venue":"Research Square","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"Österreichische Forschungsförderungsgesellschaft","keywords":"Intergranular corrosion; Correlative; Cracking; Soldering; Materials science; Metallurgy; Composite material; Corrosion","score_opus":0.036258663940305885,"score_gpt":0.3359424966095009,"score_spread":0.29968383266919496,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4391134549","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98688424,0.002850733,0.006004184,0.00006220689,0.00021915785,0.0006176602,0.0003395662,0.00010008197,0.0029221885],"genre_scores_gemma":[0.9988102,0.00028505674,0.0002973261,0.000005010436,0.00004734958,0.00009079051,0.00029997082,0.000075379736,0.000088944485],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99692357,0.0003140504,0.00067471043,0.0007372245,0.0007646596,0.0005858114],"domain_scores_gemma":[0.99810195,0.00044055347,0.00008326749,0.0006317538,0.0006007409,0.00014173437],"candidate_categories":["metaepi_narrow","research_integrity"],"consensus_categories":[],"category_scores_codex":[0.0010887755,0.00041535575,0.0010511386,0.0049377517,0.00006159184,0.00020215687,0.0003910968,0.0005545962,0.00032312414],"category_scores_gemma":[0.00019552537,0.0003814369,0.0004190137,0.0036303918,0.00019463376,0.00010409012,0.00033995786,0.0029308472,0.000011777555],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007674704,0.00017242022,0.07434199,0.0067727244,0.01352306,0.00028327806,0.01283388,0.84540087,0.0315505,0.0011099261,0.00077538076,0.013159235],"study_design_scores_gemma":[0.00025941472,0.00006197403,0.011956738,0.0026236163,0.0010767971,8.3719283e-7,0.0017813905,0.9759409,0.004419543,0.0013281454,0.00008667357,0.00046398406],"about_ca_topic_score_codex":0.0023115922,"about_ca_topic_score_gemma":0.0025323338,"teacher_disagreement_score":0.13054003,"about_ca_system_score_codex":0.00048233912,"about_ca_system_score_gemma":0.0002032147,"threshold_uncertainty_score":0.99986374},"labels":[],"label_agreement":null},{"id":"W4392024252","doi":"10.1109/lawp.2024.3368475","title":"Knowledge-Based Conditional Generative Adversarial Network for Conformal Antenna Array Diagnosis","year":2024,"lang":"en","type":"article","venue":"IEEE Antennas and Wireless Propagation Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Science Foundation of Sichuan Province; National Natural Science Foundation of China","keywords":"Discriminator; Generator (circuit theory); Computer science; Conformal map; Generative grammar; Antenna (radio); Generative adversarial network; Artificial intelligence; Adversarial system; Pattern recognition (psychology); Conformal antenna; Machine learning; Deep learning; Mathematics; Radiation pattern; Telecommunications; Physics; Power (physics)","score_opus":0.013274698226725251,"score_gpt":0.2279184257083946,"score_spread":0.21464372748166935,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392024252","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.23740508,0.0012304955,0.755236,0.0021398258,0.0024452507,0.00047574608,0.00035226851,0.0004156869,0.00029962035],"genre_scores_gemma":[0.9963361,0.00016650638,0.0004284051,0.0010286355,0.0012278303,0.00022644563,0.00046073843,0.000045169098,0.000080181366],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99890643,0.000032530144,0.00030993522,0.00029311024,0.00012886318,0.00032911295],"domain_scores_gemma":[0.99946654,0.00014765972,0.00003593427,0.00010542092,0.00016312751,0.00008130296],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014711134,0.0002418109,0.00025708388,0.00014112444,0.0001827618,0.00020889885,0.00007534594,0.00011251206,0.00006157425],"category_scores_gemma":[0.000009124013,0.00021136976,0.00015738727,0.00028576158,0.00009893048,0.0003185,0.0000036692836,0.00020045377,0.000023036879],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005052471,0.00004184244,0.0002589992,0.0004504389,0.0007739367,0.0000431505,0.0008014224,0.024489926,0.89324975,0.008484186,0.063678734,0.0076770643],"study_design_scores_gemma":[0.00080514647,0.00007191325,0.000091534166,0.00027074787,0.00024165794,0.000015630678,0.00013182715,0.85716575,0.11607014,0.0004343778,0.024149688,0.00055157626],"about_ca_topic_score_codex":0.000010388793,"about_ca_topic_score_gemma":0.00003509809,"teacher_disagreement_score":0.8326758,"about_ca_system_score_codex":0.000067513465,"about_ca_system_score_gemma":0.000072200564,"threshold_uncertainty_score":0.86194086},"labels":[],"label_agreement":null},{"id":"W4392052965","doi":"10.20944/preprints202402.1211.v1","title":"Test-Retest Reproducibility of Reduced Field of View Density-Weighted CRT MRSI at 3T","year":2024,"lang":"en","type":"preprint","venue":"Preprints.org","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"National Institutes of Health; Wellcome Trust; National Center for Advancing Translational Sciences; Purdue University","keywords":"Reproducibility; Field (mathematics); Test (biology); Mathematics; Statistics; Geology","score_opus":0.05822777236073436,"score_gpt":0.3029472553101729,"score_spread":0.24471948294943854,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392052965","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9815567,0.0017344317,0.000036218167,0.00021917692,0.0010482267,0.00053841673,0.00010275149,0.0003973704,0.014366709],"genre_scores_gemma":[0.9974888,0.00050334976,0.0001354718,0.00003579765,0.00017563358,0.000055516695,0.0000939474,0.00009591339,0.0014155762],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9954364,0.00011918395,0.0014945754,0.0020679233,0.0004583802,0.00042355567],"domain_scores_gemma":[0.9933646,0.00031030853,0.00035288814,0.0052560903,0.0005712585,0.00014490217],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0015246378,0.0006038718,0.0013957291,0.0003681746,0.00004872837,0.000019225483,0.0008344735,0.0007381793,0.0019245187],"category_scores_gemma":[0.0016546757,0.0005807634,0.0007591482,0.00059098203,0.0001283442,0.000061885185,0.00146387,0.0016562509,0.00043226607],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024477671,0.00015656717,0.0917873,0.0036667911,0.0012874921,0.00002480049,0.0012657006,0.0010974266,0.8984386,0.00033936944,0.0009863492,0.0009251599],"study_design_scores_gemma":[0.00011897984,0.00003134899,0.010855668,0.00094259693,0.0006925943,0.00001095855,0.000054533364,0.0016788499,0.9793941,0.0047845053,0.00090771023,0.0005281762],"about_ca_topic_score_codex":0.00071712676,"about_ca_topic_score_gemma":0.00012435489,"teacher_disagreement_score":0.08095551,"about_ca_system_score_codex":0.00031398883,"about_ca_system_score_gemma":0.0001699845,"threshold_uncertainty_score":0.99966437},"labels":[],"label_agreement":null},{"id":"W4392341228","doi":"10.48550/arxiv.2402.18421","title":"High-speed CMOS compatible plasmonic modulator for non-contact wafer-level testing","year":2024,"lang":"en","type":"preprint","venue":"arXiv (Cornell University)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"CMOS; Wafer; Materials science; Electronic engineering; Optoelectronics; Engineering","score_opus":0.09009213534746788,"score_gpt":0.18406937017548713,"score_spread":0.09397723482801926,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392341228","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9772954,0.000101626145,0.016964993,0.0000186223,0.0013885832,0.00053651276,0.00048690595,0.0006716117,0.0025357627],"genre_scores_gemma":[0.996796,0.000039016068,0.00062256196,0.000023092345,0.00023072925,0.000004148428,0.0002242285,0.000133305,0.0019268903],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99802196,0.000025865798,0.0003755053,0.00091216946,0.00009509376,0.0005694054],"domain_scores_gemma":[0.9985292,0.00017717254,0.00011996069,0.0007190156,0.00027236104,0.00018229244],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00015039521,0.00059992995,0.0007600156,0.0005042627,0.00013696111,0.00015691188,0.000658844,0.00052916905,0.00009399691],"category_scores_gemma":[0.00003945266,0.00065594394,0.00047052262,0.00073372124,0.000039801198,0.00014087796,0.00026777302,0.0011041262,0.00018255274],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016217904,0.000034906665,0.00044719368,0.0006511286,0.0012484014,0.00013644081,0.00020730452,0.9721934,0.010528596,0.011967526,0.0023482756,0.0002206071],"study_design_scores_gemma":[0.00048605748,0.00004412539,0.00023280006,0.0003198704,0.0008283818,0.0000034536781,0.00015399003,0.97805357,0.006680455,0.012135883,0.00027962856,0.0007817973],"about_ca_topic_score_codex":0.0008213342,"about_ca_topic_score_gemma":0.00022102967,"teacher_disagreement_score":0.019500645,"about_ca_system_score_codex":0.0005882975,"about_ca_system_score_gemma":0.00017373092,"threshold_uncertainty_score":0.9995892},"labels":[],"label_agreement":null},{"id":"W4392348398","doi":"10.18280/ts.410149","title":"A Novel Hybrid Optical Imaging Sensor for Early Stage Short-Circuit Fault Diagnosis in Printed Circuit Boards","year":2024,"lang":"en","type":"article","venue":"Traitement du signal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Printed circuit board; Stage (stratigraphy); Fault (geology); Computer science; Electronic engineering; Artificial intelligence; Engineering; Electrical engineering; Geology; Seismology; Paleontology","score_opus":0.02491169876321519,"score_gpt":0.24171077441313485,"score_spread":0.21679907564991965,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392348398","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7846007,0.00050074275,0.21020457,0.00016756504,0.00041714392,0.00075887307,0.0004482629,0.000615871,0.002286313],"genre_scores_gemma":[0.99841195,0.000037182,0.00032204908,0.00009769388,0.00027813794,0.00040598703,0.00010969208,0.00011023903,0.00022705599],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99764097,0.000022538974,0.00066917186,0.00056097587,0.00039213177,0.00071421085],"domain_scores_gemma":[0.9992685,0.00019396805,0.000023872735,0.00023721137,0.000109271576,0.00016718892],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00039543348,0.0004074085,0.00044606012,0.00048610877,0.000066884284,0.00034835903,0.00026598465,0.000095249954,0.0007355149],"category_scores_gemma":[0.00003213556,0.00039288372,0.00033326758,0.00045582972,0.000053950203,0.00032942256,0.000021176867,0.00045520725,0.000041977124],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050784416,0.00056799693,0.009228143,0.0011110666,0.0019984709,0.00075060374,0.0039834417,0.04448334,0.8141242,0.018968064,0.004992075,0.09974177],"study_design_scores_gemma":[0.0018890075,0.00020984374,0.0036173968,0.0007327573,0.0006661893,0.00007383455,0.0011622988,0.83419496,0.11251174,0.00051055587,0.042633504,0.0017979381],"about_ca_topic_score_codex":0.00014773844,"about_ca_topic_score_gemma":0.000080253674,"teacher_disagreement_score":0.7897116,"about_ca_system_score_codex":0.00034798193,"about_ca_system_score_gemma":0.00006010989,"threshold_uncertainty_score":0.9998523},"labels":[],"label_agreement":null},{"id":"W4392717286","doi":"10.1117/12.3001015","title":"250 kHz repetition rate OPA and 6 EV line for TR-ARPES measurement","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Repetition (rhetorical device); Angle-resolved photoemission spectroscopy; Line (geometry); Physics; Materials science; Optics; Electrical engineering; Spectral line; Quantum mechanics; Engineering","score_opus":0.022852384145121685,"score_gpt":0.21780164087453716,"score_spread":0.19494925672941546,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392717286","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.36454228,0.03399622,0.51060265,0.0046729418,0.0038594871,0.0016412989,0.00019026361,0.004369905,0.076124966],"genre_scores_gemma":[0.99767876,0.00027070948,0.00030694285,0.00006974235,0.00017274683,0.000022055892,0.00002578121,0.000025397268,0.0014278928],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99941516,0.000009502423,0.00016645098,0.00016700082,0.00009979093,0.00014211962],"domain_scores_gemma":[0.99973077,0.000025373074,0.0000071261256,0.00010166508,0.00009327847,0.00004180613],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029518167,0.00011353189,0.0001295795,0.000100970654,0.000034903915,0.000112378046,0.000039847066,0.00005467374,0.00022276131],"category_scores_gemma":[0.00002505648,0.00008689949,0.00007145185,0.00013306594,0.000009714828,0.000118237025,0.0000029206863,0.000083473875,0.000023363888],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008713209,0.000018583301,0.000011561785,0.00046360877,0.00065104035,0.000011355323,0.00047428097,0.002950216,0.9085938,0.022426631,0.03331349,0.031076752],"study_design_scores_gemma":[0.0004071358,0.000129634,0.00004213844,0.00027240117,0.00042905993,0.000014094906,0.0004876713,0.36783928,0.37083054,0.0037554244,0.25527173,0.00052088447],"about_ca_topic_score_codex":0.000036372665,"about_ca_topic_score_gemma":0.00013633621,"teacher_disagreement_score":0.63313645,"about_ca_system_score_codex":0.000057201236,"about_ca_system_score_gemma":0.000014064161,"threshold_uncertainty_score":0.35436586},"labels":[],"label_agreement":null},{"id":"W4392980053","doi":"10.1109/tia.2024.3350007","title":"Arc Rating Variability and Repeatability: Why Does Fabric Arc Rating Vary and Which Value is Correct?","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Industry Applications","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Kinectrics (Canada)","funders":"","keywords":"Repeatability; Arc (geometry); Engineering; Mathematics; Statistics; Mechanical engineering","score_opus":0.010315765811375641,"score_gpt":0.22955582854651535,"score_spread":0.2192400627351397,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392980053","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.19525063,0.00025747274,0.79851395,0.001052585,0.00039808,0.0006485274,0.0003102863,0.00076101546,0.0028074612],"genre_scores_gemma":[0.9979899,0.000100921265,0.00079890515,0.00013997007,0.00012955791,0.0004710856,0.000017626324,0.000045884088,0.00030615882],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99839205,0.000082660525,0.00044856116,0.0006187036,0.0001784602,0.00027953947],"domain_scores_gemma":[0.9987197,0.00045166185,0.000035559733,0.0005250472,0.000115639166,0.00015240413],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00041082734,0.00028421517,0.00027068547,0.00020868899,0.00041070447,0.00024148561,0.00012749578,0.00041214257,0.0003131897],"category_scores_gemma":[0.00001977185,0.00024828635,0.00008492854,0.001062976,0.00009988023,0.0002960285,0.0000026347982,0.0015223694,0.000013300027],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031389,0.0006789422,0.0020187984,0.0022935164,0.0026608002,0.000017547774,0.011124327,0.147148,0.371695,0.008386177,0.0059542693,0.44799122],"study_design_scores_gemma":[0.0005806078,0.00011454432,0.0003826227,0.00055644725,0.0015420683,0.00019276707,0.004621787,0.80216384,0.1541194,0.0077515664,0.026173625,0.0018007465],"about_ca_topic_score_codex":0.00019715421,"about_ca_topic_score_gemma":0.00007474665,"teacher_disagreement_score":0.80273926,"about_ca_system_score_codex":0.00012229533,"about_ca_system_score_gemma":0.00006897347,"threshold_uncertainty_score":0.99999696},"labels":[],"label_agreement":null},{"id":"W4393658718","doi":"10.5281/zenodo.6382502","title":"Supplementary material for 'In-situ full-field measurements for 3D printed polymers during mode I interface failure'","year":2022,"lang":"en","type":"dataset","venue":"Zenodo (CERN European Organization for Nuclear Research)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada); Polytechnique Montréal","funders":"","keywords":"In situ; Interface (matter); Mode (computer interface); Materials science; Polymer; Field (mathematics); Failure mode and effects analysis; Composite material; Computer science; Chemistry; Human–computer interaction; Mathematics","score_opus":0.023979360956157422,"score_gpt":0.2414779322779999,"score_spread":0.21749857132184247,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4393658718","genre_codex":"dataset","genre_gemma":"dataset","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"dataset","genre_consensus":"dataset","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0026419568,0.000042442425,0.0019594629,0.0001557571,0.0005219985,0.001264737,0.99255,0.0003152303,0.0005483808],"genre_scores_gemma":[0.010622633,0.000066606415,0.00019739583,0.000049332622,0.00021145758,0.0000027181075,0.98742366,0.0012950496,0.00013115363],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9976603,0.00014127039,0.0005542501,0.0005836049,0.00041341627,0.00064717396],"domain_scores_gemma":[0.9988736,0.000029899895,0.00012720999,0.00056600565,0.00027276497,0.00013049954],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00044276303,0.0003738097,0.00040660016,0.0006407894,0.00090245804,0.0005218494,0.0012669987,0.00017888335,0.1447606],"category_scores_gemma":[0.00017730548,0.00042569157,0.0001622174,0.00039553797,0.000036551497,0.0001674502,0.0005168161,0.00052811886,0.00012340694],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020861889,0.000066976565,1.4237595e-7,0.00043616563,0.00036149757,0.0000055550577,0.00021476096,0.0007963284,0.08268584,0.000012085138,0.9136064,0.0016056044],"study_design_scores_gemma":[0.0009413154,0.00021237832,8.5254646e-7,0.00006040218,0.00013435478,0.00002284318,0.00041583815,0.00043157523,0.019516757,0.00000804902,0.97784144,0.00041417137],"about_ca_topic_score_codex":0.00019726742,"about_ca_topic_score_gemma":0.00009654295,"teacher_disagreement_score":0.1446372,"about_ca_system_score_codex":0.0006334766,"about_ca_system_score_gemma":0.000008238124,"threshold_uncertainty_score":0.9998195},"labels":[],"label_agreement":null},{"id":"W4393754526","doi":"10.5281/zenodo.5163174","title":"Artifact for paper: \"SoK: Demystifying Binary Lifters Through the Lens of Downstream Applications\"","year":2021,"lang":"en","type":"dataset","venue":"Zenodo (CERN European Organization for Nuclear Research)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Artifact (error); Downstream (manufacturing); Binary number; Lens (geology); Computer science; Geology; Artificial intelligence; Mathematics; Engineering; Petroleum engineering; Operations management; Arithmetic","score_opus":0.0326537309864887,"score_gpt":0.23698633152610268,"score_spread":0.204332600539614,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4393754526","genre_codex":"dataset","genre_gemma":"dataset","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"dataset","genre_consensus":"dataset","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00013140772,0.0011139233,0.0043765656,0.000345782,0.00017962942,0.0009564256,0.986103,0.00048237725,0.006310899],"genre_scores_gemma":[0.004127607,0.0013403423,0.00013133683,0.00013792697,0.00022955677,0.0000010548647,0.9929714,0.0009200211,0.00014071324],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9983697,0.00014445769,0.00044725506,0.0003891955,0.0002969945,0.00035241386],"domain_scores_gemma":[0.9982825,0.00007376076,0.00014753429,0.0008764233,0.0005515159,0.00006827808],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0003059454,0.00026125702,0.00033352658,0.00017823654,0.0010119374,0.00039627627,0.0011085924,0.00018885738,0.005342909],"category_scores_gemma":[0.00019967051,0.00022084451,0.00019295739,0.00068258384,0.00014055507,0.00021487578,0.0002780871,0.0004958958,0.00083416555],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007668321,0.000048314734,4.095046e-8,0.00032290985,0.00030301188,0.0000027719911,0.00020536683,0.00095170265,0.005257682,0.000306572,0.9845456,0.008048369],"study_design_scores_gemma":[0.00015297491,0.00005404865,0.0000018929351,0.00007770889,0.00017962565,0.00002224078,0.00049712457,0.0002854062,0.0006729663,0.000049818562,0.99777913,0.00022705393],"about_ca_topic_score_codex":0.00004969162,"about_ca_topic_score_gemma":0.0000031121715,"teacher_disagreement_score":0.013233549,"about_ca_system_score_codex":0.0001333483,"about_ca_system_score_gemma":0.000009038374,"threshold_uncertainty_score":0.9999438},"labels":[],"label_agreement":null},{"id":"W4394964142","doi":"10.1088/1361-6560/ad40f7","title":"The effect of electron backscatter and charge build up in media on beam current transformer signal for ultra-high dose rate (FLASH) electron beam monitoring","year":2024,"lang":"en","type":"article","venue":"Physics in Medicine and Biology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Montréal; Polytechnique Montréal; Centre Hospitalier de l’Université de Montréal","funders":"","keywords":"Electron; Cathode ray; Flash (photography); Backscatter (email); Transformer; SIGNAL (programming language); Beam (structure); Materials science; Physics; Optoelectronics; Optics; Electrical engineering; Voltage; Computer science; Telecommunications; Engineering; Nuclear physics","score_opus":0.03290142312546419,"score_gpt":0.3121812043627808,"score_spread":0.2792797812373166,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4394964142","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99107826,0.007641827,0.0001839966,0.00019458818,0.00058408297,0.00022170426,0.000010940662,0.000019412426,0.00006518439],"genre_scores_gemma":[0.995016,0.004244426,0.0000015123759,0.000017058432,0.0005906901,0.000057361347,0.00004674741,0.000017563145,0.000008669445],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99912107,0.000046884572,0.00025103535,0.00021004664,0.00005388148,0.000317064],"domain_scores_gemma":[0.99913317,0.0007152662,0.00002135377,0.00007939165,0.000018521925,0.00003230715],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00042445207,0.00018908939,0.00036744465,0.00012564486,0.000030485795,0.000009656394,0.00007611894,0.00008391195,0.000004207177],"category_scores_gemma":[0.000020174906,0.000106995,0.000048042057,0.00022824193,0.00009113757,0.000044379256,0.0000025850527,0.00041025778,0.0000011833037],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000091453665,0.000012555783,0.0012374036,0.00023415445,0.00013144895,8.5980037e-7,0.0008218759,0.00012350269,0.94727695,0.0016996057,0.00034512155,0.048025046],"study_design_scores_gemma":[0.0012070928,0.0011766133,0.000331999,0.00037928496,0.00013653365,0.0000018340303,0.00006620986,0.0013523421,0.989317,0.002454555,0.003381791,0.00019475924],"about_ca_topic_score_codex":0.000045273326,"about_ca_topic_score_gemma":0.00003327898,"teacher_disagreement_score":0.047830287,"about_ca_system_score_codex":0.000037187718,"about_ca_system_score_gemma":0.000011237572,"threshold_uncertainty_score":0.43631297},"labels":[],"label_agreement":null},{"id":"W4394981627","doi":"10.1016/j.microrel.2024.115392","title":"Comparative study: AutoDPR-SEM for enhancing CNN reliability in SRAM-based FPGAs through autonomous reconfiguration","year":2024,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; Cisco Systems","keywords":"Control reconfiguration; Field-programmable gate array; Static random-access memory; Reliability (semiconductor); Embedded system; Computer architecture; Computer science; Reliability engineering; Engineering; Computer hardware; Physics","score_opus":0.015802399351226185,"score_gpt":0.27290994294218207,"score_spread":0.2571075435909559,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4394981627","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95906967,0.0014751916,0.034771428,0.0002888629,0.00055548636,0.0017720364,0.00006342251,0.00075711636,0.0012467803],"genre_scores_gemma":[0.9981776,0.00002892427,0.00091835,0.000052284893,0.00008818259,0.00037279355,0.00014662789,0.00006560371,0.00014964417],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9968096,0.00019581398,0.0010182261,0.00095172075,0.00021846355,0.00080620125],"domain_scores_gemma":[0.9984778,0.00038759244,0.00006714682,0.00073179224,0.00026001374,0.00007562945],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0013881745,0.00047133834,0.00077646127,0.0002041113,0.00013988576,0.0002198203,0.00030606982,0.00027734612,0.00013898122],"category_scores_gemma":[0.00013809881,0.00045003908,0.0003259326,0.00090915576,0.00007689496,0.00040422584,0.000017231065,0.000941343,0.000047755522],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016870162,0.001139019,0.00085746794,0.0012375241,0.00043889243,0.000018281113,0.016278172,0.6610744,0.30685544,0.002024528,0.004740549,0.0051670466],"study_design_scores_gemma":[0.00081882626,0.0005937245,0.00023689444,0.00011756201,0.00022443847,0.0000034867808,0.0012286451,0.7769635,0.18292907,0.0049409387,0.03115797,0.000784995],"about_ca_topic_score_codex":0.00055097986,"about_ca_topic_score_gemma":0.0052756467,"teacher_disagreement_score":0.12392636,"about_ca_system_score_codex":0.0024812915,"about_ca_system_score_gemma":0.0005489233,"threshold_uncertainty_score":0.99979514},"labels":[],"label_agreement":null},{"id":"W4395484833","doi":"10.1117/12.3002748","title":"Efficient collection of zero-phonon line emission from a single silicon T center","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Photon Etc (Canada); Simon Fraser University","funders":"","keywords":"Silicon; Phonon; Zero (linguistics); Center (category theory); Line (geometry); Optoelectronics; Materials science; Zero emission; Physics; Condensed matter physics; Electrical engineering; Chemistry; Engineering; Crystallography; Mathematics; Geometry","score_opus":0.011027204903809325,"score_gpt":0.20930497416261415,"score_spread":0.19827776925880483,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4395484833","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9760115,0.0007131364,0.010978879,0.000038464135,0.00057846983,0.00006371119,0.00002486714,0.00030632707,0.011284646],"genre_scores_gemma":[0.9984612,0.00002133931,0.00009649807,0.000014524427,0.00006852153,0.0000029838818,0.00004653326,0.000021977768,0.0012664206],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993798,0.000010689858,0.0002208786,0.00015573531,0.00010921653,0.00012367086],"domain_scores_gemma":[0.9997421,0.000032011067,0.0000125297665,0.0001272552,0.00004381269,0.00004231103],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000046482906,0.00011247878,0.00015559033,0.00015759315,0.000021002712,0.000035612764,0.000055077977,0.00008799417,0.0007377537],"category_scores_gemma":[0.000008567883,0.00008667314,0.00010431377,0.00039120548,0.000010594601,0.000031262705,0.0000075419675,0.000117826276,0.00004243784],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000041657,0.00004633386,0.000055615128,0.000033434862,0.00011577377,0.0000031870172,0.00037281192,0.01617311,0.9721992,0.00005280778,0.0074406397,0.0035028984],"study_design_scores_gemma":[0.00008985943,0.00002997074,0.0000137605775,0.00008982819,0.000040837193,0.000001469368,0.000071113034,0.49720702,0.49824697,0.000047658486,0.0040762867,0.00008525591],"about_ca_topic_score_codex":0.00029556217,"about_ca_topic_score_gemma":0.000036635465,"teacher_disagreement_score":0.4810339,"about_ca_system_score_codex":0.00009253254,"about_ca_system_score_gemma":0.000012619491,"threshold_uncertainty_score":0.8077886},"labels":[],"label_agreement":null},{"id":"W4396608006","doi":"10.1016/j.nima.2024.169415","title":"Hot spot visual evaluation of breakdown locations in ATLAS18 ITk strip sensors and test structures","year":2024,"lang":"en","type":"article","venue":"Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University; Carleton University; TRIUMF","funders":"Agencia Estatal de Investigación; Natural Sciences and Engineering Research Council of Canada; CERN; European Regional Development Fund; Canada Foundation for Innovation; U.S. Department of Energy","keywords":"Leakage (economics); Materials science; Detector; Microscope; Optoelectronics; Computer science; Optics; Electrical engineering; Engineering; Physics","score_opus":0.04927934281475628,"score_gpt":0.3806131086980951,"score_spread":0.33133376588333885,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4396608006","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9986233,0.0003010451,0.000057085264,0.000019923747,0.00021831448,0.00035367094,0.000023016328,0.000055101384,0.0003485277],"genre_scores_gemma":[0.99843067,0.0007409012,0.0006667842,0.0000067642904,0.000060073176,0.000026706024,0.00001475349,0.00004161721,0.000011735829],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99770266,0.00044990433,0.00043335292,0.00041307832,0.00057751435,0.00042349668],"domain_scores_gemma":[0.9992412,0.00032519246,0.000056771565,0.0001196604,0.00014501193,0.00011216791],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0021005156,0.00023562921,0.00035874252,0.0009038466,0.00013694893,0.0002764145,0.00008191471,0.00018042576,0.000057086396],"category_scores_gemma":[0.00022218286,0.00021897646,0.00005641892,0.0014771336,0.000127137,0.0003043395,0.000057756202,0.0007178539,6.691303e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000271955,0.00016958732,0.008225056,0.0001924741,0.00040869723,0.0000048959123,0.0025847044,0.00041950823,0.7582903,0.00065591186,0.00006034209,0.22896136],"study_design_scores_gemma":[0.0033307124,0.0012865419,0.104939006,0.00081651285,0.00036216617,0.000020097215,0.007602453,0.53593177,0.33403048,0.009798075,0.0006941947,0.0011879918],"about_ca_topic_score_codex":0.0004814856,"about_ca_topic_score_gemma":0.00015725644,"teacher_disagreement_score":0.53551227,"about_ca_system_score_codex":0.0007155703,"about_ca_system_score_gemma":0.00006087373,"threshold_uncertainty_score":0.89296013},"labels":[],"label_agreement":null},{"id":"W4396825993","doi":"10.1016/j.jmir.2024.03.025","title":"Comfortable Precision: Preliminary results of the Prototype Head Cushion for Gamma Knife ICON Immobilization","year":2024,"lang":"en","type":"article","venue":"Journal of medical imaging and radiation sciences","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto; Health Sciences Centre; Sunnybrook Health Science Centre","funders":"","keywords":"Icon; Cushion; Head (geology); Computer science; Engineering; Geology; Mechanical engineering","score_opus":0.017176679022120608,"score_gpt":0.2982468714345447,"score_spread":0.2810701924124241,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4396825993","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89270437,0.035495803,0.045450967,0.018685637,0.005274493,0.0007387442,0.00002866176,0.00008136044,0.0015399485],"genre_scores_gemma":[0.9987603,0.00080423476,0.00013168891,0.00003831732,0.00021145758,0.000003377643,0.0000015704493,0.0000043315486,0.00004476275],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99885607,0.00003399325,0.0004091687,0.0000853138,0.00052456337,0.000090909765],"domain_scores_gemma":[0.9994421,0.00024327925,0.00010178121,0.000053055777,0.00010422175,0.000055587774],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0016654575,0.000057148234,0.0001237193,0.00014200696,0.00008480862,0.000089501606,0.00017035019,0.00004484951,0.000015848938],"category_scores_gemma":[0.00044032885,0.00003040415,0.000070533184,0.00037220516,0.00011340933,0.00030805604,0.000007955958,0.00014365421,3.3340226e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002204475,0.000103482394,0.003243051,0.0007506123,0.0002023841,0.000015221213,0.0053594094,0.03051941,0.017231638,0.0043603443,0.06202025,0.87597376],"study_design_scores_gemma":[0.00044038685,0.0002567068,0.0007871412,0.0009034978,0.00007400589,0.000092719056,0.0009954465,0.95911473,0.0057579763,0.00072324544,0.0307708,0.00008332445],"about_ca_topic_score_codex":0.000011572191,"about_ca_topic_score_gemma":0.0000039803904,"teacher_disagreement_score":0.92859536,"about_ca_system_score_codex":0.000020959913,"about_ca_system_score_gemma":0.0001366972,"threshold_uncertainty_score":0.12398452},"labels":[],"label_agreement":null},{"id":"W4399529208","doi":"10.1109/csnt60213.2024.10546023","title":"Deep Learning Applications in Microscopy and Holography for near-field Signal Processing","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Horizon College and Seminary","funders":"","keywords":"Holography; Microscopy; Digital holographic microscopy; Signal processing; Field (mathematics); Computer science; Artificial intelligence; Optics; Digital signal processing; Physics; Computer hardware","score_opus":0.006453949637176921,"score_gpt":0.23856357231939476,"score_spread":0.23210962268221785,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399529208","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.18158518,0.009229471,0.8035799,0.0001049465,0.00004333292,0.00026877955,0.0000023308319,0.00048241165,0.004703614],"genre_scores_gemma":[0.9973174,0.000058090776,0.0023468398,0.000037116006,0.000029048872,0.00007412725,0.000012331348,0.000017493569,0.00010756703],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99957645,0.0000042363363,0.00011192041,0.00013930489,0.000030413248,0.00013768925],"domain_scores_gemma":[0.9998491,0.00006136848,0.0000054548686,0.00003982433,0.000019296425,0.000024984562],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005977852,0.000081121485,0.00009390977,0.00013891724,0.000061702674,0.00016398194,0.000042125368,0.00006753155,0.000047427333],"category_scores_gemma":[0.0000031284458,0.00006834535,0.00004281297,0.0003603022,0.000016595628,0.00009042341,0.0000038346247,0.00017219596,0.0000030220067],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007047061,0.000031737763,0.0097342115,0.0009185741,0.00023305591,0.00000727527,0.003493158,0.020507751,0.40867952,0.0062580225,0.001497952,0.5486317],"study_design_scores_gemma":[0.00010471783,0.000039184262,0.00012552198,0.000064121996,0.000060160924,0.0000040914438,0.0010450915,0.93864304,0.019817948,0.0008071773,0.03906456,0.00022435744],"about_ca_topic_score_codex":0.000024479681,"about_ca_topic_score_gemma":0.00006015518,"teacher_disagreement_score":0.91813534,"about_ca_system_score_codex":0.000010735905,"about_ca_system_score_gemma":0.0000086860455,"threshold_uncertainty_score":0.27870423},"labels":[],"label_agreement":null},{"id":"W4399741749","doi":"10.1039/d4na90068e","title":"Correction: Physical probing of quantum energy levels in a single indium arsenide (InAs) quantum dot","year":2024,"lang":"en","type":"erratum","venue":"Nanoscale Advances","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Quantum dot; Indium arsenide; Indium; Gallium arsenide; Nanoscopic scale; Quantum; Physics; Quantum point contact; Energy (signal processing); Optoelectronics; Materials science; Nanotechnology; Quantum well; Quantum mechanics","score_opus":0.013157319457600257,"score_gpt":0.2330536294806419,"score_spread":0.21989631002304164,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399741749","genre_codex":"editorial","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.091543905,0.19877385,0.006310945,0.0004387204,0.44499204,0.0015674084,0.0012614103,0.003414161,0.25169757],"genre_scores_gemma":[0.9501117,0.0016040318,0.00003480304,0.000031605203,0.0020787888,0.000088492336,0.00025791663,0.00020459844,0.045588072],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9974183,0.00006429726,0.0007850349,0.0006575723,0.00048207742,0.0005927423],"domain_scores_gemma":[0.9990094,0.00012438893,0.00020204004,0.00042945758,0.00014361228,0.00009112257],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001152623,0.00063885003,0.001194137,0.00073017576,0.000056124176,0.000082830324,0.0004010566,0.00060528575,0.00006223837],"category_scores_gemma":[0.000059195223,0.00058241317,0.00041284034,0.0013166051,0.00012084743,0.00036905473,0.00004903249,0.0014921837,0.000033173594],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031420263,0.00048961316,0.000048631995,0.0023807087,0.0008302109,0.00023860426,0.0029404683,0.020004159,0.1919124,0.006217195,0.7538321,0.02107447],"study_design_scores_gemma":[0.00026471843,0.00023758739,0.000019497662,0.0025619855,0.00033596758,0.00003210699,0.0007874939,0.09942126,0.07016138,0.003939376,0.8210819,0.0011567386],"about_ca_topic_score_codex":0.00030041568,"about_ca_topic_score_gemma":0.0013537323,"teacher_disagreement_score":0.8585678,"about_ca_system_score_codex":0.0003295845,"about_ca_system_score_gemma":0.00016138905,"threshold_uncertainty_score":0.99966276},"labels":[],"label_agreement":null},{"id":"W4400903501","doi":"10.1109/tcsi.2024.3425642","title":"Advancing Circuit Transient Response Macromodeling: From Conventional Neural Networks to Siamese-LSTM","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Circuits and Systems I Regular Papers","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Transient (computer programming); Transient response; Transient analysis; Computer science; Artificial neural network; Electronic engineering; Frequency response; Equivalent circuit; Control theory (sociology); Artificial intelligence; Voltage; Electrical engineering; Engineering","score_opus":0.011638688590316151,"score_gpt":0.2118775098804074,"score_spread":0.20023882129009124,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4400903501","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.24858816,0.0041414476,0.7411824,0.00024319139,0.0036256032,0.00048261814,0.00026272333,0.00066618895,0.00080767716],"genre_scores_gemma":[0.99846166,0.00016107188,0.000019729192,0.00015231036,0.00021241122,0.00009492158,0.000025752957,0.00010903689,0.00076307723],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99764055,0.0001668194,0.00058862474,0.0006443152,0.00040956854,0.00055014744],"domain_scores_gemma":[0.9988562,0.000225278,0.000028990598,0.0003765924,0.00007976013,0.00043319885],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00045008882,0.00042445553,0.00048975996,0.00043338482,0.00023894047,0.0003582796,0.0001809238,0.0002552914,0.00021371592],"category_scores_gemma":[0.000007764622,0.00039925092,0.00032662478,0.00057420466,0.000053266318,0.00021464692,9.042578e-7,0.0005371088,0.00003473149],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000027709277,0.00002324185,0.0000019825004,0.00008139843,0.00051021733,0.00007377241,0.0009831046,0.8256717,0.15178256,0.00019824543,0.00054753124,0.020098561],"study_design_scores_gemma":[0.00038125517,0.00012606764,0.00002459797,0.0004963791,0.0003023652,0.00010898414,0.0012595627,0.97699463,0.0024540075,0.000025472058,0.017191146,0.00063552306],"about_ca_topic_score_codex":0.00014813541,"about_ca_topic_score_gemma":0.000080718615,"teacher_disagreement_score":0.7498735,"about_ca_system_score_codex":0.00023949046,"about_ca_system_score_gemma":0.0000591968,"threshold_uncertainty_score":0.9998459},"labels":[],"label_agreement":null},{"id":"W4400979412","doi":"10.1109/fleps61194.2024.10603759","title":"Improving Zero-Voltage Photo Detection in Flexible OPDs with a PFN-Br Electron Transport Layer","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Voltage; Layer (electronics); Zero (linguistics); Optoelectronics; Electron; Materials science; Computer science; Electrical engineering; Nanotechnology; Physics; Engineering; Nuclear physics","score_opus":0.006450584479012012,"score_gpt":0.19891423778867107,"score_spread":0.19246365330965906,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4400979412","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.86290497,0.0005935459,0.119326144,0.000014284895,0.0001641058,0.00016105532,0.0000045780007,0.0009226796,0.015908621],"genre_scores_gemma":[0.99741375,0.000033547065,0.0000850758,0.000033349894,0.000050866434,0.000035173438,0.000012813446,0.00005516239,0.0022802777],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990434,0.000006947244,0.0002117845,0.00026008423,0.00013673429,0.00034106773],"domain_scores_gemma":[0.99974704,0.000012805665,0.000009559563,0.00015363407,0.00002653364,0.000050430703],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011802148,0.00019503526,0.00019377575,0.00032964896,0.000029932202,0.0000697804,0.00008396843,0.00011533388,0.00030887974],"category_scores_gemma":[0.000002055573,0.00014950047,0.000080918304,0.00077908905,0.000011087593,0.00027255676,0.0000025020352,0.00037727706,0.00003908895],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009866139,0.000010288795,0.00016461563,0.00008822406,0.00010920503,0.0000426514,0.00030659686,0.0045689265,0.9867796,0.0003717175,0.00011313027,0.00743523],"study_design_scores_gemma":[0.00018694582,0.00008632777,0.00010595385,0.000062679945,0.00008785363,0.000020449837,0.0001827589,0.11135584,0.881924,0.0000829535,0.0055990424,0.00030523833],"about_ca_topic_score_codex":0.0019645484,"about_ca_topic_score_gemma":0.0047321473,"teacher_disagreement_score":0.13450874,"about_ca_system_score_codex":0.00016395384,"about_ca_system_score_gemma":0.00003776722,"threshold_uncertainty_score":0.6096452},"labels":[],"label_agreement":null},{"id":"W4401000350","doi":"10.1093/mam/ozae044.1029","title":"Optical Distortion Correction of Convergent Beam Electron Diffraction Disks Using Deep Learning","year":2024,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Distortion (music); Electron diffraction; Optics; Materials science; Diffraction; Cathode ray; Electron; Physics; Optoelectronics; Nuclear physics","score_opus":0.006877098832796187,"score_gpt":0.238341310936162,"score_spread":0.23146421210336582,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401000350","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9286496,0.0058562956,0.06459878,0.000007751113,0.0005157404,0.000051971703,0.0000045148195,0.0001278107,0.0001875365],"genre_scores_gemma":[0.9982846,0.0010351752,0.00014542807,0.0000052733326,0.00007293609,0.000003924702,0.00007836159,0.000030831554,0.00034350614],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99903405,0.000027952468,0.00033982142,0.00026297188,0.00010726519,0.00022796766],"domain_scores_gemma":[0.999685,0.00003533396,0.00004658313,0.00011414605,0.000059865994,0.000059069393],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001356923,0.00018731353,0.0003075758,0.00032554215,0.00010954572,0.00009105904,0.000051903873,0.0001312358,0.00012003968],"category_scores_gemma":[0.000014006649,0.00017536194,0.00020308989,0.0005551086,0.000051665902,0.00018763653,0.000010464595,0.00033379794,0.00000983396],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008338402,0.000015802769,0.00055596523,0.000074932264,0.0005294132,0.0000025966021,0.00032106825,0.014170721,0.9745634,0.00002109751,0.00009615905,0.0096404925],"study_design_scores_gemma":[0.000069637696,0.000032763608,0.00019546303,0.000059169066,0.0010847686,0.000015900949,0.00030436853,0.25655603,0.7389572,0.000012241547,0.002524981,0.00018747168],"about_ca_topic_score_codex":0.00027026245,"about_ca_topic_score_gemma":0.00009773553,"teacher_disagreement_score":0.2423853,"about_ca_system_score_codex":0.00020569084,"about_ca_system_score_gemma":0.000015692822,"threshold_uncertainty_score":0.71510524},"labels":[],"label_agreement":null},{"id":"W4401005221","doi":"10.1093/mam/ozae044.259","title":"Evolution of Electron Channelling Contrast Imaging of Plastic Deformation Induced by Berkovich Nanoindentation in Ferrite Steel","year":2024,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Nanoindentation; Channelling; Materials science; Ferrite (magnet); Composite material; Chemistry; Ion","score_opus":0.004432909416261862,"score_gpt":0.21765615964629076,"score_spread":0.2132232502300289,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401005221","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9751563,0.009383217,0.015132359,0.000008427759,0.0000971644,0.00007901287,0.0000466401,0.000037271722,0.000059583137],"genre_scores_gemma":[0.99947315,0.00026787855,0.000056552326,0.0000045818724,0.000016269036,0.000006038858,0.00013429295,0.000019089279,0.000022122706],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99895686,0.000031789798,0.0005044603,0.00018985088,0.00010702108,0.00021002407],"domain_scores_gemma":[0.9996785,0.000049348135,0.00007249148,0.00009595598,0.000073711715,0.000029976016],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020075313,0.00016230221,0.00032885835,0.0006707995,0.000034027646,0.00004966273,0.000070762835,0.00008743236,0.000015627156],"category_scores_gemma":[0.000010422774,0.00015902499,0.00012207458,0.00084412534,0.000029311366,0.000293487,0.000007328576,0.00017563262,0.0000026243954],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008437399,0.000015096557,0.001997202,0.00019337333,0.00023306595,6.83236e-7,0.00085542205,0.0028283424,0.99303764,0.0000819354,0.000055781446,0.0006930391],"study_design_scores_gemma":[0.0002176861,0.000020868487,0.000704901,0.00019729062,0.00040894657,0.0000030986225,0.0008456124,0.12664755,0.87069815,0.00006299963,0.00003590755,0.00015697125],"about_ca_topic_score_codex":0.00070691464,"about_ca_topic_score_gemma":0.00031044293,"teacher_disagreement_score":0.1238192,"about_ca_system_score_codex":0.00017744744,"about_ca_system_score_gemma":0.00002838785,"threshold_uncertainty_score":0.6484851},"labels":[],"label_agreement":null},{"id":"W4401006421","doi":"10.1093/mam/ozae044.714","title":"Dynamics of Beam Interaction and Damage within a Thin TEM Specimen","year":2024,"lang":"en","type":"article","venue":"Microscopy and Microanalysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Materials science; Beam (structure); Dynamics (music); Composite material; Optics; Physics; Acoustics","score_opus":0.006357873328039188,"score_gpt":0.22898281952570565,"score_spread":0.22262494619766646,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401006421","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9907157,0.0046251873,0.0027766633,0.00009212645,0.00017419575,0.000063525025,0.00008075251,0.000113734815,0.0013581157],"genre_scores_gemma":[0.99793583,0.0006333006,0.00048504278,0.000022797041,0.000040395862,0.0000033695303,0.00008429055,0.000029920502,0.00076507946],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99910706,0.000019987194,0.00035480637,0.00027228764,0.00007904067,0.00016682893],"domain_scores_gemma":[0.99963117,0.0000409212,0.000041320436,0.00018285711,0.000044330645,0.00005943148],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017454999,0.00020101888,0.0003509938,0.0003937258,0.000057021523,0.00016746244,0.00008612177,0.00011048866,0.0001211429],"category_scores_gemma":[0.000006894005,0.00017468396,0.00012324571,0.00050673157,0.000078642435,0.00021419793,0.000025509797,0.00025572357,0.000009739755],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000007054231,0.000014393616,0.00043734157,0.0002177162,0.0011224082,0.000011544573,0.0019714048,0.0008501176,0.9907841,0.0010115119,0.0007032304,0.0028691401],"study_design_scores_gemma":[0.00022346384,0.000055151264,0.00014166012,0.00029276975,0.0018216511,0.00005505415,0.005606255,0.27370733,0.71399176,0.00055995886,0.0030471932,0.00049776764],"about_ca_topic_score_codex":0.00031330495,"about_ca_topic_score_gemma":0.0006007739,"teacher_disagreement_score":0.27679238,"about_ca_system_score_codex":0.00008284142,"about_ca_system_score_gemma":0.00001585587,"threshold_uncertainty_score":0.7123405},"labels":[],"label_agreement":null},{"id":"W4401305524","doi":"10.2139/ssrn.4914589","title":"Generating Stacking Faults in 4h-Sic Junction Transistor by Indentation","year":2024,"lang":"en","type":"preprint","venue":"SSRN Electronic Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Stacking; Indentation; Materials science; Transistor; Optoelectronics; Electrical engineering; Composite material; Engineering; Physics; Nuclear magnetic resonance","score_opus":0.00633230592002085,"score_gpt":0.21629585626654096,"score_spread":0.20996355034652012,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401305524","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.940231,0.026646988,0.029672755,0.00014706832,0.0021731067,0.00019189295,0.000020461563,0.00020875523,0.0007079527],"genre_scores_gemma":[0.99379313,0.0046450295,0.000055228338,0.000028266559,0.00061679777,0.000020433257,0.00014765587,0.00009694176,0.000596525],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9971346,0.000081871716,0.00065195124,0.0003545116,0.00033581565,0.0014411988],"domain_scores_gemma":[0.99954337,0.000017021903,0.00011987992,0.00017002292,0.00008805163,0.00006163944],"candidate_categories":["metaepi_narrow","research_integrity"],"consensus_categories":[],"category_scores_codex":[0.0009425048,0.0003736072,0.00039189405,0.00056193495,0.00009264015,0.00021293065,0.00023395476,0.00040224273,0.00004293551],"category_scores_gemma":[0.000015882704,0.00036671563,0.00026221614,0.0003584017,0.000014105409,0.00014858413,0.000027675096,0.00804461,0.00002540481],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":true,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003167023,0.00008189013,0.0003493616,0.000494706,0.0031877966,0.00005236025,0.0049863523,0.60345685,0.2320853,0.006319188,0.003159065,0.14579542],"study_design_scores_gemma":[0.0023273642,0.00034336356,0.000078948506,0.0020112619,0.002130438,0.0007020422,0.013223775,0.6880394,0.014714507,0.2672617,0.005581021,0.0035861477],"about_ca_topic_score_codex":0.00039522068,"about_ca_topic_score_gemma":0.0062625245,"teacher_disagreement_score":0.26094252,"about_ca_system_score_codex":0.0040438147,"about_ca_system_score_gemma":0.00090776436,"threshold_uncertainty_score":0.99987847},"labels":[],"label_agreement":null},{"id":"W4401568418","doi":"10.1109/pn62551.2024.10621772","title":"A SPRINT-Based Single Photon Subtractor for PNS Attacks on QKD","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Photon; Computer science; Sprint; Optoelectronics; Electronic engineering; Physics; Optics; Engineering","score_opus":0.021740966069280197,"score_gpt":0.23510559042801482,"score_spread":0.21336462435873463,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401568418","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.791363,0.0007253477,0.074886374,0.00065708905,0.0022746306,0.00065146596,0.00016009771,0.0030400327,0.12624197],"genre_scores_gemma":[0.99720997,0.000005381512,0.00036113427,0.00019022323,0.00014965603,0.000038582657,0.0000447549,0.00005615598,0.001944124],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992312,0.0000061554224,0.00017792406,0.0002215467,0.00010979342,0.00025333976],"domain_scores_gemma":[0.9995732,0.00011038559,0.000008343264,0.00020062436,0.000042819804,0.000064630774],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00007735611,0.00017402713,0.00016823881,0.00017966755,0.00003183764,0.0001361679,0.000103092876,0.00010737139,0.0010258185],"category_scores_gemma":[0.000017007897,0.00013780077,0.00021178766,0.00022476149,0.000011982817,0.00007984,0.000002848932,0.00016982583,0.00022554601],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015694577,0.000104935156,0.000032278815,0.00029389284,0.00041420516,0.000026122632,0.00018946364,0.009152572,0.91318995,0.01436283,0.045327246,0.016890809],"study_design_scores_gemma":[0.0001567748,0.00010943093,0.000011595984,0.00007503754,0.00008176018,0.0000014323754,0.000070100796,0.2218174,0.48697752,0.00013494628,0.29030153,0.0002624694],"about_ca_topic_score_codex":0.00005845972,"about_ca_topic_score_gemma":0.00011116234,"teacher_disagreement_score":0.42621243,"about_ca_system_score_codex":0.00012494547,"about_ca_system_score_gemma":0.0000322678,"threshold_uncertainty_score":0.9998874},"labels":[],"label_agreement":null},{"id":"W4401916192","doi":"10.18280/jesa.570417","title":"Advancing Predictive Maintenance: Median-Based Particle Filtering in MOSFET Prognostics","year":2024,"lang":"en","type":"article","venue":"Journal Européen des Systèmes Automatisés","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Prognostics; Particle filter; Reliability engineering; Predictive maintenance; Computer science; Medicine; Engineering; Artificial intelligence; Kalman filter","score_opus":0.009630784620965931,"score_gpt":0.226369789627153,"score_spread":0.2167390050061871,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4401916192","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.85423344,0.007218493,0.12988971,0.00030245405,0.0021247733,0.0003876327,0.00006996041,0.0016629492,0.0041105663],"genre_scores_gemma":[0.9970015,0.00026891663,0.002132812,0.00004590522,0.00024924002,0.000021715428,0.0000074598374,0.0000891588,0.0001832449],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9980328,0.000102337755,0.0006668516,0.00023094697,0.00034181756,0.0006252257],"domain_scores_gemma":[0.9992433,0.00018975342,0.000061579005,0.00018226508,0.00012693781,0.00019612355],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005189802,0.00027514706,0.00035988635,0.00033847845,0.00010580313,0.0003972496,0.00022787333,0.00009844469,0.00019805157],"category_scores_gemma":[0.00025009006,0.0002271392,0.00015857618,0.00082186464,0.00006436824,0.00049734826,0.000018732919,0.0006760031,0.00008280714],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023684579,0.000089262576,0.004945472,0.0013230749,0.000649719,0.003980071,0.0040334333,0.6458694,0.07108997,0.0010091821,0.0088497605,0.25813696],"study_design_scores_gemma":[0.0002646472,0.00009096613,0.0068942187,0.0017747426,0.0000883581,0.00031230427,0.00037792948,0.98222166,0.004916661,0.0008697216,0.0019099709,0.0002788364],"about_ca_topic_score_codex":0.000018037505,"about_ca_topic_score_gemma":0.00006941691,"teacher_disagreement_score":0.33635226,"about_ca_system_score_codex":0.0005469343,"about_ca_system_score_gemma":0.00012465172,"threshold_uncertainty_score":0.92624676},"labels":[],"label_agreement":null},{"id":"W4402473899","doi":"10.1109/tsp.2024.3459422","title":"DoA Estimation for Hybrid Receivers: Full Spatial Coverage and Successive Refinement","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Signal Processing","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ericsson (Canada); Carleton University; Ciena (Canada)","funders":"Mitacs","keywords":"Computer science; Algorithm; Signal processing; Estimation; Speech recognition; Mathematics; Telecommunications; Radar; Engineering","score_opus":0.011668130953759091,"score_gpt":0.23383780816096775,"score_spread":0.22216967720720865,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4402473899","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.017433058,0.00050499727,0.9808609,0.00008967014,0.00026234178,0.00016281675,0.000070589325,0.00027534252,0.00034032072],"genre_scores_gemma":[0.9987697,0.00006327084,0.0007985693,0.00003768433,0.00007876152,0.000058540372,0.000020980335,0.000036030826,0.0001364575],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9991997,0.000011134371,0.00021728732,0.00024373193,0.00014244593,0.00018568564],"domain_scores_gemma":[0.9997003,0.0000784758,0.000023257304,0.00006940267,0.00007260848,0.000055936038],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000089357934,0.00017612154,0.00015960982,0.00021585911,0.00018751931,0.00026437547,0.00005725621,0.00006348089,0.00014789702],"category_scores_gemma":[0.0000020154205,0.00016177565,0.00008319497,0.00019950143,0.000026777883,0.00038303976,3.0814834e-7,0.00021949517,0.000012276718],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003329169,0.000019869154,2.2145474e-7,0.0003828255,0.00013563456,0.00000952518,0.00039756426,0.29727435,0.040604156,0.000026230293,0.0002440078,0.66087234],"study_design_scores_gemma":[0.00022000026,0.00008554478,5.330838e-7,0.0002726051,0.00018859736,0.000012371542,0.000090039524,0.90417266,0.0932963,0.0002975236,0.0011657572,0.00019807383],"about_ca_topic_score_codex":0.000032137836,"about_ca_topic_score_gemma":0.000036248854,"teacher_disagreement_score":0.98133665,"about_ca_system_score_codex":0.00010722788,"about_ca_system_score_gemma":0.00004397908,"threshold_uncertainty_score":0.65970194},"labels":[],"label_agreement":null},{"id":"W4402716245","doi":"10.1109/mwscas60917.2024.10658786","title":"An FPGA-Accelerated Platform for Post-FEC BER Analysis of 200 Gb/s Wireline Systems","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Huawei Technologies (Canada); University of Toronto","funders":"","keywords":"Wireline; Field-programmable gate array; Computer science; Embedded system; Operating system","score_opus":0.020329197757096216,"score_gpt":0.2572802229659068,"score_spread":0.2369510252088106,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4402716245","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9513736,0.0020903018,0.037821386,0.000050021063,0.0007347973,0.0003722631,0.00062823936,0.00089386397,0.006035553],"genre_scores_gemma":[0.9968207,0.00005171269,0.0001740706,0.000034591187,0.00012062694,0.0000323788,0.00094157056,0.000052200576,0.001772184],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9987133,0.000010847337,0.0005378582,0.00027739408,0.00017295964,0.00028763004],"domain_scores_gemma":[0.99911857,0.00006513804,0.00003212786,0.00034742986,0.00033915634,0.000097610166],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020590438,0.00023096491,0.000559132,0.000816451,0.00003953426,0.00016416791,0.0001869608,0.0001691729,0.000887015],"category_scores_gemma":[0.000012224281,0.00017666901,0.00036332489,0.0018381857,0.000018786226,0.00033158564,0.000005830062,0.00014259698,0.000026206782],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002510686,0.000081337836,0.00024822273,0.0005246481,0.019178947,0.000017816008,0.00093511166,0.44348404,0.50405633,0.011351592,0.014453464,0.005643369],"study_design_scores_gemma":[0.00011206444,0.000075589574,0.00006101719,0.00003336607,0.0026427647,0.0000025687189,0.00058389566,0.9742512,0.014743338,0.000018631032,0.007219813,0.00025574415],"about_ca_topic_score_codex":0.0011469394,"about_ca_topic_score_gemma":0.00051786774,"teacher_disagreement_score":0.53076714,"about_ca_system_score_codex":0.00007756705,"about_ca_system_score_gemma":0.000036565332,"threshold_uncertainty_score":0.97121924},"labels":[],"label_agreement":null},{"id":"W4402978697","doi":"10.1109/tim.2024.3470973","title":"Wide-Focus Imaging for Industrial Metal Workpieces Using Tower-Type Transmitting Coils","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Instrumentation and Measurement","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia, Okanagan Campus; University of British Columbia","funders":"Science and Technology Program of Hubei Province; National Natural Science Foundation of China","keywords":"Focus (optics); Tower; Engineering; Electrical engineering; Mechanical engineering; Materials science; Optics; Structural engineering; Physics","score_opus":0.062089417913123335,"score_gpt":0.2590208381168755,"score_spread":0.19693142020375215,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4402978697","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22233321,0.0010887216,0.77191883,0.00022185825,0.0031581405,0.00047028254,0.00004184334,0.00032706402,0.0004400788],"genre_scores_gemma":[0.99910724,0.00010949235,0.0005228541,0.0000543777,0.00008912243,0.000038730726,0.0000056901476,0.000033344288,0.000039141047],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989239,0.000024027268,0.0003145344,0.0002329788,0.000286887,0.00021765994],"domain_scores_gemma":[0.99967843,0.000042074833,0.000022870612,0.00008303383,0.00009946661,0.000074146694],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029501153,0.00018902717,0.00017590131,0.00026223186,0.00017660968,0.00018357532,0.000050584746,0.00007107011,0.000119366094],"category_scores_gemma":[0.000004592135,0.00018168401,0.00012372367,0.00032159238,0.000026804484,0.00030386788,2.3277008e-7,0.0002155701,0.000003860518],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000053057283,0.000050327144,0.000032800715,0.00011027462,0.0009289119,0.0000040427403,0.001441197,0.027073467,0.311587,0.00012880175,0.00041652346,0.65817356],"study_design_scores_gemma":[0.0015798836,0.00014120022,0.000007806972,0.00053879875,0.0011930235,0.000021531447,0.0024655496,0.22405115,0.7603315,0.00022135793,0.00886212,0.0005860738],"about_ca_topic_score_codex":0.00007244833,"about_ca_topic_score_gemma":0.00006731909,"teacher_disagreement_score":0.77677405,"about_ca_system_score_codex":0.00023332561,"about_ca_system_score_gemma":0.000060005972,"threshold_uncertainty_score":0.74088585},"labels":[],"label_agreement":null},{"id":"W4403024529","doi":"10.1109/ipfa61654.2024.10690939","title":"Improved Defect Detection of Advanced Semiconductor Packaging in Acoustic Imaging","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Optoacoustic imaging; Semiconductor; Materials science; Optoelectronics; Integrated circuit packaging; Computer science; Acoustics; Integrated circuit; Physics","score_opus":0.004421127825033769,"score_gpt":0.20362183172925916,"score_spread":0.1992007039042254,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4403024529","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9711423,0.0028752417,0.022067958,0.000017397966,0.0006008378,0.00011286557,0.0000062375007,0.0004884716,0.0026887055],"genre_scores_gemma":[0.9995625,0.000055726654,0.00010482811,0.000012951149,0.000043710985,0.000011654484,0.0000053146473,0.00003752575,0.00016580819],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992126,0.000013598578,0.0002749834,0.00019502886,0.00007668244,0.00022711177],"domain_scores_gemma":[0.9997099,0.00005421486,0.000014777977,0.00015036322,0.000036998146,0.00003376315],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011839436,0.00014975271,0.00019844218,0.00038094906,0.000015079943,0.00004219516,0.00007807039,0.00005178966,0.000111720896],"category_scores_gemma":[0.000024707808,0.0001311841,0.00013027855,0.0005975613,0.000016450198,0.0002743414,0.000008257202,0.00024158676,0.00001148819],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000013675493,0.0000037063883,0.00007782933,0.000109647655,0.00005773427,0.0000074969585,0.00022018045,0.008011948,0.9672344,0.000048584978,0.00003639327,0.024190763],"study_design_scores_gemma":[0.000103633385,0.000008772842,0.000040037496,0.000095572,0.00005452416,0.000008586861,0.00064300105,0.49039337,0.5081046,0.00008508165,0.00030764274,0.00015517852],"about_ca_topic_score_codex":0.00011391121,"about_ca_topic_score_gemma":0.00040550987,"teacher_disagreement_score":0.48238143,"about_ca_system_score_codex":0.00012340059,"about_ca_system_score_gemma":0.0000182962,"threshold_uncertainty_score":0.53495324},"labels":[],"label_agreement":null},{"id":"W4403278366","doi":"10.1109/icem60801.2024.10700419","title":"Data-Driven Inter Turn Short Circuit Fault Detection of a Segmented SRM Based on Multi-Path Convolutional Neural Network and fCWT","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Convolutional neural network; Computer science; Path (computing); Turn (biochemistry); Fault detection and isolation; Fault (geology); Artificial neural network; Artificial intelligence; Pattern recognition (psychology); Physics; Actuator; Computer network","score_opus":0.028734254543021975,"score_gpt":0.24125003171173182,"score_spread":0.21251577716870984,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4403278366","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4666402,0.0012036932,0.5248482,0.00010538381,0.001628663,0.0004674873,0.00070083875,0.0010133768,0.003392104],"genre_scores_gemma":[0.99907535,0.00001688085,0.000293171,0.00007775055,0.00013779507,0.000009047553,0.00023743193,0.000029241302,0.00012333888],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990207,0.00002787396,0.0002765574,0.00030449554,0.00015764147,0.00021275916],"domain_scores_gemma":[0.9995004,0.00007160696,0.00001571158,0.00029098944,0.000059149887,0.000062149586],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012418997,0.00018360124,0.00021418488,0.00015847941,0.000039211845,0.00006327405,0.00014864936,0.00010358458,0.00020329907],"category_scores_gemma":[0.000016023474,0.00014944833,0.00007890454,0.0003020727,0.000038402137,0.00017676495,0.000026132466,0.00028165482,0.000012215087],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000046415524,0.00012541957,0.002481295,0.00037456368,0.0015522373,0.00006280526,0.0004079567,0.591006,0.3513371,0.00079085055,0.01022185,0.041593503],"study_design_scores_gemma":[0.0001544102,0.000047815647,0.00036767888,0.00008924736,0.000117056865,0.000008164113,0.00006966023,0.9947614,0.0026943327,0.00001495678,0.0015133552,0.00016189882],"about_ca_topic_score_codex":0.000102803795,"about_ca_topic_score_gemma":0.0004472088,"teacher_disagreement_score":0.5324351,"about_ca_system_score_codex":0.00007052974,"about_ca_system_score_gemma":0.000018724442,"threshold_uncertainty_score":0.6094326},"labels":[],"label_agreement":null},{"id":"W4403685661","doi":"10.31399/asm.cp.istfa2024p0074","title":"Addressing the Cost and Execution Challenges of Scan Chain Testing and Failure Analysis of Complex IC’s","year":2024,"lang":"en","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Semtech (Canada)","funders":"","keywords":"Computer science; Reliability engineering; Engineering","score_opus":0.06873226527710924,"score_gpt":0.27975185278837644,"score_spread":0.2110195875112672,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4403685661","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9810679,0.005597089,0.0048905984,0.003512869,0.00013114398,0.0005310752,0.0003965842,0.00035165044,0.003521097],"genre_scores_gemma":[0.9964389,0.00028708566,0.00295902,0.000019725956,0.00011791628,0.000045544504,0.00006489615,0.000030977735,0.000035887435],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99832344,0.0000149841035,0.0006084488,0.0004724933,0.00031640718,0.00026420574],"domain_scores_gemma":[0.99812555,0.0007231026,0.00022681615,0.00011301379,0.0007234425,0.00008804421],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00061909173,0.00029533645,0.00064866705,0.0010756474,0.00019079371,0.00030375455,0.00021052053,0.00013238876,0.000013907886],"category_scores_gemma":[0.00040786192,0.00023112763,0.00025143343,0.0024529512,0.00018746381,0.0003009358,0.00005941706,0.00022350771,1.9076558e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000036952053,0.00009260596,0.12778977,0.0021725453,0.052081916,0.000005632358,0.008714311,0.019959869,0.71267694,0.020348791,0.0008231733,0.05529747],"study_design_scores_gemma":[0.00020282844,0.00006744293,0.007883005,0.00034672517,0.012831053,0.000021580305,0.0027650206,0.97186035,0.0024045215,0.00049488683,0.0007873193,0.0003352651],"about_ca_topic_score_codex":0.0003951287,"about_ca_topic_score_gemma":0.00031711947,"teacher_disagreement_score":0.9519005,"about_ca_system_score_codex":0.00006002597,"about_ca_system_score_gemma":0.00001678189,"threshold_uncertainty_score":0.94251114},"labels":[],"label_agreement":null},{"id":"W4403761418","doi":"10.1038/s41598-024-76120-7","title":"Publisher Correction: A robust deep learning attack immune MRAM-based physical unclonable function","year":2024,"lang":"en","type":"erratum","venue":"Scientific Reports","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Physical unclonable function; Magnetoresistive random-access memory; Function (biology); Computer science; Deep learning; Computational biology; Artificial intelligence; Computer security; Biology; Cell biology; Computer hardware; Cryptography; Random access memory","score_opus":0.01148418060644593,"score_gpt":0.2096446684791392,"score_spread":0.19816048787269328,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4403761418","genre_codex":"editorial","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.001443666,0.00466433,0.0026857082,0.000076107295,0.8009179,0.00032735756,0.000003071908,0.0017797442,0.18810211],"genre_scores_gemma":[0.075404644,0.000020420961,0.000030185833,0.00001587258,0.0027293402,0.00008104464,0.0037552454,0.0002176293,0.9177456],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99596316,0.00006471787,0.00084149546,0.001398104,0.0010294782,0.0007030434],"domain_scores_gemma":[0.9977649,0.000034772733,0.00028409206,0.0011616108,0.00057827646,0.0001763488],"candidate_categories":["metaepi_narrow","scholarly_communication","research_integrity","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0009041648,0.0006182552,0.0007494433,0.0008758567,0.00047305718,0.0027715652,0.00026003612,0.0006664378,0.0011259603],"category_scores_gemma":[0.00015944456,0.00055914663,0.000714006,0.002417614,0.00016219007,0.00052009476,0.000051949097,0.0029174446,0.00043612477],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000020447033,0.000039514605,0.000009047525,0.00018954366,0.00027989197,0.0002782034,0.00014062843,0.16749173,0.00093596656,0.000007409035,0.82895476,0.0016712665],"study_design_scores_gemma":[0.00004126873,0.00003248193,0.0000047792064,0.00024055922,0.00045175085,0.00007585536,0.00016299928,0.23643042,0.00020651957,0.00041313018,0.7614518,0.0004884468],"about_ca_topic_score_codex":0.00012503151,"about_ca_topic_score_gemma":0.0001758531,"teacher_disagreement_score":0.79818857,"about_ca_system_score_codex":0.00049990835,"about_ca_system_score_gemma":0.00040481216,"threshold_uncertainty_score":0.99978715},"labels":[],"label_agreement":null},{"id":"W4404133854","doi":"10.1145/3649329.3658459","title":"NOFIS: Normalizing Flow for Rare Circuit Failure Analysis","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Montréal; Mila - Quebec Artificial Intelligence Institute","funders":"","keywords":"Computer science; Flow (mathematics); Mechanics; Physics","score_opus":0.012044102243023998,"score_gpt":0.2133418400172145,"score_spread":0.20129773777419052,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404133854","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.023104021,0.008853821,0.9151269,0.00046289296,0.0012061406,0.00047296687,0.00036507813,0.0038486181,0.046559565],"genre_scores_gemma":[0.99561137,0.000063680556,0.001944822,0.00009240362,0.00025089303,0.000056664874,0.00025435086,0.00005866161,0.0016671548],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988567,0.000010399278,0.00030112854,0.00030763357,0.00015543385,0.0003686748],"domain_scores_gemma":[0.999448,0.00007389265,0.000011709229,0.0002818405,0.000093039096,0.000091527516],"candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00014074457,0.0002345312,0.00034864005,0.00063839223,0.00007577361,0.00026645703,0.00018310537,0.00014824362,0.0016175846],"category_scores_gemma":[0.000013636724,0.00019407066,0.00060964824,0.0017100644,0.00001602475,0.00028737026,0.000009282719,0.00018937435,0.00013057524],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008025816,0.000050901832,0.0017865532,0.0013639164,0.04057473,0.00013826168,0.004157724,0.38163584,0.111379065,0.08958199,0.31678957,0.05253343],"study_design_scores_gemma":[0.00009406799,0.000014092326,0.000024894265,0.000033556,0.0023025346,0.0000064458904,0.00043516993,0.89318466,0.005556247,0.0005344402,0.09742715,0.00038674605],"about_ca_topic_score_codex":0.000055870358,"about_ca_topic_score_gemma":0.0004613401,"teacher_disagreement_score":0.97250736,"about_ca_system_score_codex":0.000087031956,"about_ca_system_score_gemma":0.000023366149,"threshold_uncertainty_score":0.99929506},"labels":[],"label_agreement":null},{"id":"W4404186048","doi":"10.1116/6.0003933","title":"Epitaxial SiGeSn grown on Si by ion implantation","year":2024,"lang":"en","type":"article","venue":"Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University; Okanagan University College; University of British Columbia, Okanagan Campus; University of British Columbia; Western University","funders":"Natural Sciences and Engineering Research Council of Canada; Tertiary Education Trust Fund; Western University","keywords":"Materials science; Epitaxy; Ion implantation; Optoelectronics; Ion; Nanotechnology; Chemistry; Layer (electronics)","score_opus":0.007322853888870506,"score_gpt":0.20733625983284482,"score_spread":0.20001340594397432,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404186048","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.971276,0.024395356,0.0024570771,0.0010219914,0.00044924612,0.00009914728,0.00000775302,0.0002335351,0.00005988103],"genre_scores_gemma":[0.9968996,0.002822038,0.00012224235,0.000041889503,0.000070024085,0.000006623445,0.0000025655938,0.000021644368,0.000013378238],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99841523,0.000019499714,0.00047980572,0.0003095338,0.00029070937,0.00048524773],"domain_scores_gemma":[0.99941283,0.0000133925105,0.00015143854,0.00012442678,0.00024191622,0.00005596659],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0012422706,0.00024355401,0.00036897368,0.0015033461,0.00028684575,0.0002441426,0.00032207044,0.000324334,0.000009888039],"category_scores_gemma":[0.00003606246,0.00019152046,0.000033122582,0.0010727199,0.00048612093,0.00040187288,0.000032561147,0.00054286775,0.000002798105],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019257017,0.000019324916,0.0000073078845,0.00009336571,0.00006250103,0.000007464359,0.00012856268,0.000007439625,0.93461275,0.0038917733,0.00011169847,0.06103855],"study_design_scores_gemma":[0.00025440042,0.00048329763,0.0000051821194,0.0002511416,0.00010298496,0.00031156518,0.00017037398,0.00023255702,0.98471814,0.008609011,0.0046490487,0.00021231275],"about_ca_topic_score_codex":0.0000021821272,"about_ca_topic_score_gemma":0.0000034921495,"teacher_disagreement_score":0.06082624,"about_ca_system_score_codex":0.00026845373,"about_ca_system_score_gemma":0.0002265,"threshold_uncertainty_score":0.78099775},"labels":[],"label_agreement":null},{"id":"W4404600777","doi":"10.52601/bpr.2024.240009","title":"Non-invasive micro-test technology and applications","year":2024,"lang":"en","type":"article","venue":"Biophysics Reports","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Beijing Forestry University; Institute of Genetics and Developmental Biology, Chinese Academy of Sciences; Purdue University; Chinese Academy of Sciences; Shanxi Medical University; Institute of Genetics; Jiangsu Normal University; Chinese Academy of Forestry; Institute of Biophysics, Chinese Academy of Sciences; Capital Medical University; Institute of Botany, Chinese Academy of Sciences; Capital Normal University; Jinan University; Peking University; China Agricultural University; University of Chicago","keywords":"Biochemical engineering; Test (biology); Computer science; Management science; Engineering; Biology; Ecology","score_opus":0.004025823932626012,"score_gpt":0.19643500105211434,"score_spread":0.19240917711948832,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404600777","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96335393,0.005974776,0.010010123,0.00021945506,0.00065127364,0.00044588238,0.000040296472,0.0016287128,0.017675577],"genre_scores_gemma":[0.999052,0.00017367837,0.00013482657,0.000013395954,0.0001533992,0.00006333019,0.000023791341,0.00002681811,0.00035876507],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994184,0.0000010703899,0.00017187302,0.00021676224,0.000056946916,0.00013499013],"domain_scores_gemma":[0.99963105,0.000020578711,0.000017770042,0.00024187074,0.000052424148,0.000036313897],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000028056093,0.00011640459,0.00012880166,0.0002063857,0.00004096407,0.00006518601,0.000045679895,0.00009495232,0.000012394292],"category_scores_gemma":[0.0000061618057,0.00010588555,0.000050150313,0.00069214986,0.000047200476,0.000070347225,0.000013594931,0.00014148152,0.000043326916],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[7.218277e-8,0.000010722338,0.00064179406,0.00008339129,0.000104943225,0.00019661157,0.000064300366,0.00006007188,0.9862166,0.003075088,0.0013959293,0.008150494],"study_design_scores_gemma":[0.000043367123,0.000026633614,0.0001430533,0.000113623355,0.00020409029,0.0005062641,0.00019872599,0.002582095,0.8608588,0.015711486,0.11913813,0.00047375256],"about_ca_topic_score_codex":0.00001008743,"about_ca_topic_score_gemma":0.000004682379,"teacher_disagreement_score":0.1253578,"about_ca_system_score_codex":0.000030778177,"about_ca_system_score_gemma":0.00003075435,"threshold_uncertainty_score":0.43178874},"labels":[],"label_agreement":null},{"id":"W4404848983","doi":"10.1109/itc51657.2024.00055","title":"Digital Scan and ATPG for Analog Circuits","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Siemens (Canada)","funders":"","keywords":"Automatic test pattern generation; Computer science; Electronic circuit; Digital electronics; Analogue electronics; Electronic engineering; Electrical engineering; Engineering","score_opus":0.008178518875195332,"score_gpt":0.20312797756164866,"score_spread":0.19494945868645333,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404848983","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.35190398,0.008202845,0.08114168,0.0003593796,0.0011041822,0.000383664,0.0002773333,0.002370513,0.55425644],"genre_scores_gemma":[0.99556506,0.00003761194,0.000033411838,0.000029564084,0.00009449311,0.000009094779,0.00003171231,0.000023199098,0.004175861],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9995742,0.0000013068769,0.00009984691,0.00013210662,0.000047326932,0.00014520981],"domain_scores_gemma":[0.99981475,0.00003528417,0.0000028407135,0.000075321026,0.00002240954,0.0000494091],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003414738,0.00009220646,0.00010307525,0.00010225155,0.000023649456,0.00025474853,0.000045365476,0.000048483555,0.000117126656],"category_scores_gemma":[0.00000769976,0.00007267165,0.00006457108,0.00016099586,0.000014329591,0.00019640301,0.0000041899907,0.00006470571,0.000029113327],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000014562902,0.00001396974,0.0005192657,0.0003958684,0.0010766231,0.000027557326,0.0006046154,0.00077642786,0.053541884,0.07531425,0.090026766,0.7777013],"study_design_scores_gemma":[0.00026408414,0.000081774,0.00017424682,0.00010019319,0.0002393123,0.000051351533,0.0005751137,0.31469393,0.012471863,0.0043485444,0.66628605,0.000713542],"about_ca_topic_score_codex":0.000007947336,"about_ca_topic_score_gemma":0.000025130625,"teacher_disagreement_score":0.7769878,"about_ca_system_score_codex":0.000023439059,"about_ca_system_score_gemma":0.000009344362,"threshold_uncertainty_score":0.2963464},"labels":[],"label_agreement":null},{"id":"W4405231872","doi":"10.1109/tsp.2024.3499772","title":"Corrections to “DoA Estimation for Hybrid Receivers: Full Spatial Coverage and Successive Refinement”","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Signal Processing","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ericsson (Canada); Carleton University; Ciena (Canada)","funders":"","keywords":"Computer science; Algorithm; Estimation; Speech recognition; Statistics; Mathematics; Engineering","score_opus":0.011520757265449011,"score_gpt":0.23887903568928645,"score_spread":0.22735827842383743,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4405231872","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.020343151,0.00019949388,0.977717,0.00012828135,0.0005170891,0.00023176665,0.00010353625,0.0003494317,0.00041025758],"genre_scores_gemma":[0.99829435,0.000030131216,0.0010511125,0.0000669592,0.000093078794,0.00010481175,0.000020447862,0.000040763145,0.00029831353],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99913913,0.000012205175,0.00022643546,0.00027802467,0.00013847854,0.00020574126],"domain_scores_gemma":[0.99961793,0.00009672946,0.000020847196,0.00007821599,0.00009893667,0.00008730822],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008455272,0.00018519974,0.00016663612,0.00033718513,0.00027463285,0.000291928,0.000062384024,0.0000636637,0.00016496162],"category_scores_gemma":[0.0000043221953,0.00017959284,0.00008486318,0.0003701095,0.000021473268,0.00037137748,4.402254e-7,0.00023075727,0.000025264779],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032838565,0.000020045672,4.0574986e-7,0.00018415829,0.000107474094,0.000005104429,0.00048391233,0.41648847,0.03736131,0.000015553946,0.0005080513,0.54479265],"study_design_scores_gemma":[0.00019020021,0.00013474528,0.0000012767804,0.00030001035,0.0002098103,0.000012650373,0.0001700859,0.92006886,0.076223314,0.00016962754,0.0022747454,0.00024469747],"about_ca_topic_score_codex":0.00005900563,"about_ca_topic_score_gemma":0.00011276128,"teacher_disagreement_score":0.9779512,"about_ca_system_score_codex":0.00013554427,"about_ca_system_score_gemma":0.000049066963,"threshold_uncertainty_score":0.73235834},"labels":[],"label_agreement":null},{"id":"W4406671380","doi":"10.1016/b978-0-08-052042-1.50025-0","title":"10.1016/b978-0-08-052042-1.50025-0","year":2000,"lang":"en","type":"book-chapter","venue":"Time to knit","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Amplifier; Detector; Electrical engineering; Materials science; Optoelectronics; Engineering; CMOS","score_opus":0.006499701050176169,"score_gpt":0.15221376126835534,"score_spread":0.14571406021817918,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4406671380","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0000015736739,0.0007091561,0.0000028704965,0.000028294482,0.000009918412,0.00019987146,0.00017087387,0.00057774567,0.9982997],"genre_scores_gemma":[0.000011172735,0.000004502386,0.000025830584,0.000032047836,0.0004752553,0.000013499613,0.00030024524,0.00024670103,0.99889076],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99827814,0.000009929092,0.00047496584,0.00045267574,0.00032213665,0.00046213894],"domain_scores_gemma":[0.998883,0.000035318513,0.000056845558,0.0006790498,0.00010714731,0.00023861411],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0000852419,0.0006524634,0.0007280586,0.00046447443,0.00006762843,0.00009742528,0.00044760475,0.0005922391,0.9981808],"category_scores_gemma":[0.000008246108,0.00065104646,0.00038072435,0.000108209446,0.00003920136,0.000094370254,0.000030551182,0.0006897069,0.9959136],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010486931,0.000008076989,1.5773007e-9,0.000031800315,0.00061849336,0.00004160645,0.000022831882,0.0010668489,0.00024906866,0.00018747804,0.54350656,0.45425674],"study_design_scores_gemma":[0.00010439683,0.000051371022,6.6829486e-8,0.00012736583,0.00029833117,0.000014057397,6.5392703e-7,0.0004415159,0.00009569332,0.00016280192,0.9979388,0.0007649059],"about_ca_topic_score_codex":0.000021599215,"about_ca_topic_score_gemma":0.0000017019239,"teacher_disagreement_score":0.45443228,"about_ca_system_score_codex":0.00017182583,"about_ca_system_score_gemma":0.00004069384,"threshold_uncertainty_score":0.9995941},"labels":[],"label_agreement":null},{"id":"W4406671730","doi":"10.1016/b978-0-08-051430-7.50022-x","title":"10.1016/b978-0-08-051430-7.50022-x","year":2000,"lang":"en","type":"book-chapter","venue":"Time to knit","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Computer science","score_opus":0.006538533688588171,"score_gpt":0.15163926911691675,"score_spread":0.14510073542832858,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4406671730","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0000013762582,0.000740334,0.0000032619052,0.000029046085,0.000010373703,0.00019978736,0.0001754534,0.0005782748,0.9982621],"genre_scores_gemma":[0.000010503876,0.000004625565,0.000025827403,0.000031829302,0.00048442653,0.000015304682,0.00031633125,0.00025266036,0.9988585],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99826896,0.000010119034,0.00047475152,0.0004539288,0.00032851938,0.0004637217],"domain_scores_gemma":[0.99887997,0.000034442895,0.000057640813,0.00068067585,0.000105973864,0.0002413079],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00008698959,0.000651962,0.0007263383,0.00046324433,0.0000689784,0.000097041324,0.0004509563,0.0005810705,0.99832225],"category_scores_gemma":[0.000008185607,0.00065209816,0.0003850229,0.000108898814,0.00003920474,0.0000948728,0.000031271586,0.00069889333,0.99568516],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010443097,0.000008189193,1.6429706e-9,0.00003082806,0.0006111957,0.0000414885,0.000023094326,0.0013167958,0.00018864471,0.00017854189,0.5569873,0.44060346],"study_design_scores_gemma":[0.000105822306,0.000052867268,4.892467e-8,0.00011971211,0.00029575248,0.000014916852,6.743129e-7,0.00054535136,0.00010675091,0.00016770052,0.997824,0.00076636206],"about_ca_topic_score_codex":0.000022329998,"about_ca_topic_score_gemma":0.0000016793534,"teacher_disagreement_score":0.44083673,"about_ca_system_score_codex":0.00017558974,"about_ca_system_score_gemma":0.00003986206,"threshold_uncertainty_score":0.999593},"labels":[],"label_agreement":null},{"id":"W4407097988","doi":"10.1109/tns.2025.3537609","title":"Analysis of Guard Gates on FF SEU Rates at a 12-nm FinFET Node","year":2025,"lang":"pt","type":"article","venue":"IEEE Transactions on Nuclear Science","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems; Cisco Systems","keywords":"Node (physics); Logic gate; Guard (computer science); Electrical engineering; Optoelectronics; Physics; Random access memory; Materials science; Electronic engineering; Computer science; Engineering; Computer hardware; Quantum mechanics","score_opus":0.01323003328825479,"score_gpt":0.24931496462401478,"score_spread":0.23608493133576,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4407097988","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97998166,0.00011346001,0.010951861,0.0006620641,0.0012340087,0.000224256,0.00027463294,0.00019143894,0.0063666333],"genre_scores_gemma":[0.9952558,0.00025954837,0.00010731628,0.00031578075,0.000013827809,0.000007745017,0.0000021820151,0.00003426144,0.0040034843],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9973071,0.00006412606,0.00062316144,0.000762339,0.00063812116,0.0006051426],"domain_scores_gemma":[0.9983406,0.00016114803,0.00012697018,0.00092571415,0.00027819577,0.00016737696],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000430044,0.00040461583,0.0007157149,0.0027972856,0.00068389386,0.00018995561,0.0007848893,0.00021549943,0.0021177616],"category_scores_gemma":[0.000028737804,0.00038208548,0.00066622766,0.007587213,0.0005235846,0.0003258728,0.00000540645,0.00054448005,0.00029515516],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000060784867,0.00026621154,0.00013971451,0.00006623693,0.002316796,0.000008351102,0.0017097138,0.8647781,0.12574309,0.00038416756,0.00065661466,0.003870231],"study_design_scores_gemma":[0.00038464804,0.00021053405,0.0019373803,0.00025868713,0.0036311762,0.0000025086795,0.0009521439,0.89403737,0.09619845,0.00001254891,0.001852974,0.0005215877],"about_ca_topic_score_codex":0.00041248894,"about_ca_topic_score_gemma":0.0005919946,"teacher_disagreement_score":0.02954465,"about_ca_system_score_codex":0.0005065522,"about_ca_system_score_gemma":0.00015400679,"threshold_uncertainty_score":0.9998631},"labels":[],"label_agreement":null},{"id":"W4407462090","doi":"10.1109/tns.2025.3540345","title":"Real-Time SER Measurements of CMOS Bulk 40- and 65-nm SRAMs Combined With Neutron Spectrometry at the JET Tokamak During Its Final D-T Plasma Operation","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Nuclear Science","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Cargill (Canada)","funders":"Euratom Research and Training Programme; European Commission; EUROfusion","keywords":"Tokamak; Dense plasma focus; Nuclear physics; Plasma; Jet (fluid); Physics; CMOS; Neutron; Atomic physics; Plasma diagnostics; Materials science; Nuclear engineering; Optoelectronics; Engineering","score_opus":0.012839789466513303,"score_gpt":0.20901252571932463,"score_spread":0.19617273625281134,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4407462090","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9975678,0.000010315859,0.00036030717,0.00013182669,0.0001315098,0.00015077667,0.000008419786,0.00007652811,0.0015625418],"genre_scores_gemma":[0.9989943,0.000037571812,0.00016755657,0.000021025447,0.0000072213807,0.000006159612,4.250482e-7,0.000015197724,0.0007505282],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989708,0.000022661161,0.00018483361,0.0002545487,0.00033964787,0.00022753139],"domain_scores_gemma":[0.9995342,0.00002370687,0.00003145949,0.00025028404,0.00010725777,0.000053086344],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019962141,0.00014926725,0.00017021358,0.00025703275,0.00044754532,0.00009615991,0.00022102465,0.00005049877,0.00021368377],"category_scores_gemma":[0.000003735243,0.000105003484,0.000046300753,0.0009365066,0.00017148507,0.0002888497,0.0000026190414,0.00019020266,0.000029338844],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000074434014,0.000032116142,0.000025187672,0.000020460353,0.00006701205,9.467963e-7,0.00024714737,0.13849822,0.86069715,0.000026551426,0.000028981092,0.0002817899],"study_design_scores_gemma":[0.0007639025,0.00027630143,0.0023209811,0.0001042416,0.00013503624,0.0000141871815,0.00021470826,0.16678943,0.82910347,0.0000033687077,0.000056299144,0.00021808564],"about_ca_topic_score_codex":0.00006469813,"about_ca_topic_score_gemma":0.00013754163,"teacher_disagreement_score":0.031593703,"about_ca_system_score_codex":0.00019175411,"about_ca_system_score_gemma":0.00004307988,"threshold_uncertainty_score":0.42819178},"labels":[],"label_agreement":null},{"id":"W4407575193","doi":"10.1109/iemt61324.2024.10875212","title":"An Innovative Approach to Scanning Acoustic Microscopy (SAM) for Layered Structures in Wafer Level Chip Scale Package (WLCSP)","year":2024,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nexen (Canada)","funders":"","keywords":"Chip-scale package; Wafer; Wafer-scale integration; Materials science; Chip; Wafer-level packaging; Acoustic microscopy; Scale (ratio); Optoelectronics; Scanning acoustic microscope; Microscopy; Electronic engineering; Computer science; Engineering; Optics; Physics; Telecommunications","score_opus":0.027888363543473647,"score_gpt":0.27935240141178685,"score_spread":0.25146403786831323,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4407575193","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.62044656,0.00022801019,0.37185946,0.000043646975,0.0003137014,0.00040556295,0.00018603822,0.00035674407,0.0061602755],"genre_scores_gemma":[0.98653734,0.000003150832,0.012204459,0.00018007116,0.00015273517,0.00008016579,0.00015076666,0.00007864588,0.00061269535],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986618,0.000019649942,0.00033305696,0.00041546908,0.00013291668,0.0004370897],"domain_scores_gemma":[0.9994633,0.00004347902,0.000014144021,0.00026214198,0.00012027966,0.00009664485],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017919678,0.000280288,0.0003245875,0.00053076854,0.0000590783,0.00023469479,0.00023232483,0.00015945274,0.000098458455],"category_scores_gemma":[0.000024452413,0.00022871632,0.000075990225,0.0013767461,0.000024081377,0.00024507855,0.000014981758,0.0003126341,0.00001560586],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000097478205,0.00002397759,0.0001475535,0.00015719105,0.00014834866,0.0000035485255,0.0038663854,0.065056816,0.9215906,0.0024983909,0.003951698,0.0025456941],"study_design_scores_gemma":[0.00056304596,0.00012874947,0.0018159696,0.00018062838,0.0000998792,0.000012154033,0.0060579604,0.4786531,0.5071537,0.0012343595,0.003003419,0.0010970037],"about_ca_topic_score_codex":0.00020989151,"about_ca_topic_score_gemma":0.0003142955,"teacher_disagreement_score":0.41443694,"about_ca_system_score_codex":0.00014560005,"about_ca_system_score_gemma":0.000050827584,"threshold_uncertainty_score":0.93267804},"labels":[],"label_agreement":null},{"id":"W4407736358","doi":"10.1109/jsen.2025.3539571","title":"AI-Driven Device Fingerprinting Using On-Chip Monitoring Sensors: A Novel Time Series-Based Approach","year":2025,"lang":"en","type":"article","venue":"IEEE Sensors Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Instituto Nacional de Ciberseguridad; Ontario Ministry of Research, Innovation and Science","keywords":"Series (stratigraphy); Computer science; Chip; Fingerprint recognition; Embedded system; Electronic engineering; Engineering; Fingerprint (computing); Artificial intelligence; Telecommunications","score_opus":0.0226080271695826,"score_gpt":0.252442035703049,"score_spread":0.22983400853346642,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4407736358","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9667564,0.00010167531,0.026837807,0.00013359147,0.0012169492,0.00012826397,0.000011613493,0.00026250866,0.004551167],"genre_scores_gemma":[0.98809725,0.000014714453,0.010220696,0.00017014531,0.0008671745,0.0000031425552,0.000003770308,0.000083378654,0.0005397276],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9979506,0.00008740245,0.0006164119,0.00033257905,0.00037440972,0.00063855795],"domain_scores_gemma":[0.9989828,0.000115463445,0.00013815437,0.00033895866,0.00025708365,0.00016753431],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00036475767,0.00042163976,0.00051216636,0.00068845256,0.0004020249,0.00035496883,0.000306013,0.00023064551,0.000061458166],"category_scores_gemma":[0.00007930994,0.00039803935,0.00032782956,0.00081567105,0.00004609709,0.00028658702,0.000014411742,0.0013234257,0.000044633827],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000014093092,0.000033414773,0.0004283181,0.000041183655,0.000299208,0.000031759988,0.00016760515,0.66846925,0.3297841,0.00002658905,0.00036056925,0.00034391767],"study_design_scores_gemma":[0.00061216915,0.000033251516,0.00012399702,0.0005926964,0.0002614605,0.0002261747,0.0003837727,0.82050127,0.1749778,0.000034470933,0.001714663,0.00053828454],"about_ca_topic_score_codex":0.00003543981,"about_ca_topic_score_gemma":0.0000020574103,"teacher_disagreement_score":0.1548063,"about_ca_system_score_codex":0.00038293912,"about_ca_system_score_gemma":0.00011206549,"threshold_uncertainty_score":0.9998472},"labels":[],"label_agreement":null},{"id":"W4407801179","doi":"","title":"Band Bending and Surface Composition Analysis by p-ARXPS and Their Impact on Minority Carrier Lifetime After Germanium Wet Etching","year":2023,"lang":"en","type":"article","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Germanium; Etching (microfabrication); Materials science; Composition (language); Bending; Band bending; Carrier lifetime; Optoelectronics; Silicon-germanium; Surface (topology); Silicon; Composite material; Mathematics","score_opus":0.00514339370130722,"score_gpt":0.1994339558171883,"score_spread":0.19429056211588108,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4407801179","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99152184,0.00071513356,0.002756485,0.00046341436,0.00003435575,0.00008693126,0.00019875895,0.00019144642,0.0040316386],"genre_scores_gemma":[0.99845135,0.00035048975,0.00013815793,0.000026692596,0.000009905715,0.0000065562176,0.00040569334,0.000021247066,0.0005898966],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99843824,0.000625465,0.00022338885,0.00031271274,0.00014438535,0.0002557957],"domain_scores_gemma":[0.99869025,0.00044339895,0.000061812985,0.00044937548,0.00021647546,0.00013870103],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0011508194,0.00022314077,0.00029035786,0.00023596027,0.00021321992,0.00025050173,0.00015637955,0.00010584123,0.00008652879],"category_scores_gemma":[0.00003260994,0.00018664704,0.00013743254,0.0008073761,0.00006398715,0.00017331754,0.00004904014,0.00024425169,0.000009724266],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004145838,0.00023976118,0.076548785,0.00017974789,0.003509072,0.000018342784,0.036462035,0.008622873,0.85294294,0.003577662,0.007210048,0.010647259],"study_design_scores_gemma":[0.00074269786,0.0000027130259,0.056522455,0.00042005276,0.00079675927,0.000014602455,0.0009033122,0.51017845,0.42572638,0.00026512664,0.0033662107,0.0010612303],"about_ca_topic_score_codex":0.00073152885,"about_ca_topic_score_gemma":0.00045855393,"teacher_disagreement_score":0.50155556,"about_ca_system_score_codex":0.00006452309,"about_ca_system_score_gemma":0.000011912255,"threshold_uncertainty_score":0.76112455},"labels":[],"label_agreement":null},{"id":"W4408144745","doi":"10.1109/tcsii.2025.3547997","title":"An FPGA-Accelerated Platform for Post-FEC BER Analysis of 200 Gb/s Wireline Systems","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Circuits & Systems II Express Briefs","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Huawei Technologies (Canada); University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wireline; Field-programmable gate array; Computer science; Telecommunications; Embedded system","score_opus":0.018842817193285843,"score_gpt":0.25098360304221234,"score_spread":0.2321407858489265,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4408144745","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2744733,0.0010850407,0.7157124,0.000023088016,0.0028360977,0.0013037487,0.0024451488,0.00065493333,0.0014662215],"genre_scores_gemma":[0.99632835,0.00008286273,0.000028699427,0.000060560564,0.00012338281,0.0005016797,0.00031175854,0.00010254001,0.0024601475],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9965624,0.0001038169,0.0014911763,0.0007106368,0.0004727487,0.00065922795],"domain_scores_gemma":[0.99720085,0.0002136977,0.00022863239,0.0011445397,0.0009972113,0.00021507857],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00041999682,0.0006065538,0.0015159444,0.0018896667,0.00041765414,0.00022804893,0.0005835921,0.00050758064,0.000119632336],"category_scores_gemma":[0.000012055046,0.00058987533,0.0007216237,0.0027710118,0.00007508807,0.0005712237,0.0000018592274,0.00044656196,0.000010461884],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003285329,0.00022899608,0.00001957732,0.0004371335,0.00640377,0.00000404128,0.00077995413,0.76179034,0.22654322,0.00048196714,0.0011640077,0.0021141348],"study_design_scores_gemma":[0.00195587,0.00044865813,0.00011098521,0.0008231455,0.0091206655,0.00001746013,0.0028979464,0.84882957,0.1182593,0.000012358727,0.016144048,0.0013800162],"about_ca_topic_score_codex":0.0033196583,"about_ca_topic_score_gemma":0.00041871623,"teacher_disagreement_score":0.72185504,"about_ca_system_score_codex":0.00029889506,"about_ca_system_score_gemma":0.00014975069,"threshold_uncertainty_score":0.99965525},"labels":[],"label_agreement":null},{"id":"W4408291382","doi":"10.3390/electronics14061091","title":"Investigation of Source/Drain Height Variation and Its Impacts on FinFET and GAA Nanosheet FET","year":2025,"lang":"en","type":"article","venue":"Electronics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"National Key Research and Development Program of China","keywords":"Nanosheet; Variation (astronomy); Materials science; Electronic engineering; Optoelectronics; Engineering; Physics; Nanotechnology","score_opus":0.0056604917290724545,"score_gpt":0.19242390481427507,"score_spread":0.1867634130852026,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4408291382","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9925817,0.005423074,0.0005340397,0.00019475594,0.000045469296,0.000080923,0.0000060710177,0.000047242924,0.0010866704],"genre_scores_gemma":[0.9983862,0.0011668052,0.000025187082,0.00010699555,0.000018401177,0.000003560437,0.000024277673,0.000010244254,0.00025834003],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9994568,0.000023603341,0.00015809067,0.000119119126,0.00007379761,0.00016857989],"domain_scores_gemma":[0.999755,0.000036750796,0.000033447104,0.000092662674,0.000046128756,0.000035978228],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001220243,0.000108290835,0.00014902816,0.0001495676,0.00004125659,0.000025985724,0.000042296826,0.000097732234,0.00001698836],"category_scores_gemma":[0.000043860367,0.00010026899,0.000023409382,0.00024806682,0.0000132177665,0.00008436566,0.0000065574022,0.00015851417,0.0000021506721],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009838144,0.000010226227,0.00062383484,0.00014503428,0.00029994143,7.4922946e-7,0.0018667005,0.002679018,0.9507704,0.0356797,0.002553865,0.005360741],"study_design_scores_gemma":[0.0010744189,0.0003565587,0.011626824,0.00024730412,0.00032382697,0.000007438747,0.00012523762,0.15410104,0.8020851,0.011360481,0.018156374,0.0005353905],"about_ca_topic_score_codex":0.000009756295,"about_ca_topic_score_gemma":0.00005982961,"teacher_disagreement_score":0.15142202,"about_ca_system_score_codex":0.00006856135,"about_ca_system_score_gemma":0.00004315363,"threshold_uncertainty_score":0.40888506},"labels":[],"label_agreement":null},{"id":"W4408963294","doi":"10.1007/s11837-025-07315-0","title":"Baked Carbon Anode Defect Detection Using a Two-Level Non-destructive Evaluation Scheme","year":2025,"lang":"en","type":"article","venue":"JOM","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Centre de Recherche en Sciences Animales de Deschambault; Université Laval","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Anode; Materials science; Carbon fibers; Scheme (mathematics); Metallurgy; Forensic engineering; Composite material; Nuclear engineering; Engineering; Mathematics; Physics; Electrode; Mathematical analysis","score_opus":0.024636885266984206,"score_gpt":0.27210957691481985,"score_spread":0.24747269164783564,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4408963294","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9820286,0.00014726627,0.009517472,0.000006950357,0.00046628618,0.00016445381,0.0000041651024,0.00010518668,0.0075596003],"genre_scores_gemma":[0.99912304,0.0000042283245,0.00064063753,0.00002093653,0.00009068087,0.000019666231,0.00001056259,0.00001967545,0.0000705819],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9992283,0.000039732913,0.00018814846,0.00018810347,0.00017302803,0.00018267373],"domain_scores_gemma":[0.9995467,0.000023024691,0.00003257795,0.0001915061,0.00017744815,0.000028726838],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020605257,0.00014603614,0.00017667981,0.0002556222,0.00006941982,0.000043571225,0.00007039462,0.0001074341,0.00003696679],"category_scores_gemma":[0.00004712344,0.00014459115,0.00011256705,0.0005811975,0.000015771146,0.00011204882,0.000008976663,0.00019663207,0.000006073396],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000004242926,0.000007856235,0.00069040956,0.000019679328,0.00027372493,0.000001184004,0.00020288498,0.024446096,0.9680033,0.00009555923,0.000016236798,0.0062388503],"study_design_scores_gemma":[0.00036811348,0.000009020409,0.0012154294,0.00004155181,0.0002885955,0.0000028057402,0.00019352768,0.83681566,0.16026734,0.0005882794,0.00006102967,0.00014864733],"about_ca_topic_score_codex":0.00080471626,"about_ca_topic_score_gemma":0.00056619075,"teacher_disagreement_score":0.8123696,"about_ca_system_score_codex":0.000429175,"about_ca_system_score_gemma":0.0000652021,"threshold_uncertainty_score":0.5896256},"labels":[],"label_agreement":null},{"id":"W4409023648","doi":"10.1016/b978-0-44-314153-9.00011-8","title":"Inference for one-shot devices with a single failure mode","year":2025,"lang":"en","type":"book-chapter","venue":"Elsevier eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Inference; Shot (pellet); Mode (computer interface); Computer science; Failure mode and effects analysis; Materials science; Artificial intelligence; Reliability engineering; Engineering; Human–computer interaction","score_opus":0.02717415772623105,"score_gpt":0.24101228829885782,"score_spread":0.21383813057262677,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409023648","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00008210214,0.00078630116,0.00088012597,0.00003637729,0.00013431902,0.0005217211,0.00019556789,0.0002660794,0.99709743],"genre_scores_gemma":[0.030930523,0.00004421666,0.0015564589,0.00020884738,0.00022612499,0.00012228018,0.00020429978,0.00014757142,0.9665597],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99853754,0.000007406598,0.00040962783,0.00044410347,0.0002316586,0.0003696511],"domain_scores_gemma":[0.998907,0.00009301884,0.00010924096,0.0005232588,0.00027032435,0.0000971089],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000065174696,0.0005774944,0.0007610054,0.00030256622,0.00009048476,0.00012694551,0.00034677776,0.00046768307,0.00016320501],"category_scores_gemma":[0.000011170402,0.0004933046,0.0002693436,0.000037401573,0.000064229804,0.00007746498,0.000026439706,0.00052354817,0.000025838728],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002231402,0.000016569888,0.0000053170506,0.0010554311,0.002355476,0.000016067079,0.0004806077,0.00068927015,0.0029842798,0.030575208,0.0016384083,0.96016103],"study_design_scores_gemma":[0.00023335556,0.0000893455,4.1613822e-7,0.0013483024,0.0008381807,0.0000035361384,0.000031054802,0.0010688311,0.0014055577,0.0033716888,0.99089026,0.0007194713],"about_ca_topic_score_codex":0.0000033732367,"about_ca_topic_score_gemma":0.0016831625,"teacher_disagreement_score":0.98925185,"about_ca_system_score_codex":0.00014430837,"about_ca_system_score_gemma":0.00012859219,"threshold_uncertainty_score":0.99975187},"labels":[],"label_agreement":null},{"id":"W4409030841","doi":"10.1016/b978-0-44-314153-9.00022-2","title":"Summary and future directions","year":2025,"lang":"en","type":"book-chapter","venue":"Elsevier eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Computer science","score_opus":0.006191864994215564,"score_gpt":0.19321398879703275,"score_spread":0.1870221238028172,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409030841","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.000008440929,0.019886462,0.0000025248119,0.000046667174,0.00077659835,0.00012951539,0.00006752037,0.0002439859,0.97883826],"genre_scores_gemma":[0.00007038117,0.006514563,0.0000483875,0.00011529319,0.00073448877,0.000014559562,0.00005623171,0.00006183511,0.99238425],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9992013,0.00000676471,0.0002471482,0.00025600818,0.00010986208,0.00017889247],"domain_scores_gemma":[0.9994955,0.000021024467,0.00003386468,0.00031399925,0.00006244991,0.00007314283],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00005161993,0.0003467397,0.00043463695,0.00026095865,0.00008660321,0.000052354942,0.00011643235,0.00041401893,0.00028900531],"category_scores_gemma":[0.0000015644476,0.0003191235,0.00018785335,0.000022755092,0.00004450968,0.000030610187,0.000024002686,0.00058984157,0.000033171975],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[6.4252174e-7,8.487396e-7,6.905989e-7,0.00008006295,0.00038947494,0.000009775417,0.00008885717,0.0000011115475,0.00006145953,0.01020734,0.00432059,0.98483914],"study_design_scores_gemma":[0.000053462205,0.0000062266395,0.0000014525693,0.00017058142,0.00033902796,0.000007296264,0.000015568992,0.00005011293,0.00003816095,0.001831532,0.99717796,0.0003086472],"about_ca_topic_score_codex":9.0183477e-7,"about_ca_topic_score_gemma":0.00006008562,"teacher_disagreement_score":0.99285734,"about_ca_system_score_codex":0.000067920424,"about_ca_system_score_gemma":0.000034670305,"threshold_uncertainty_score":0.9999261},"labels":[],"label_agreement":null},{"id":"W4409061151","doi":"10.1016/b978-0-44-314153-9.00012-x","title":"Divergence measures and their application to one-shot devices with a single failure mode","year":2025,"lang":"en","type":"book-chapter","venue":"Elsevier eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Single shot; Divergence (linguistics); Mode (computer interface); Computer science; Psychology; Physics; Optics; Human–computer interaction; Philosophy; Linguistics","score_opus":0.018723911737830144,"score_gpt":0.2112045731678267,"score_spread":0.19248066142999656,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409061151","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0004345884,0.0018224833,0.003260089,0.00005574094,0.0000629683,0.00051913515,0.00009739575,0.00021387124,0.99353373],"genre_scores_gemma":[0.4278872,0.00015555248,0.0007453961,0.00038524682,0.00021147348,0.00015635988,0.00009694831,0.00014873884,0.5702131],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9988356,0.000009775894,0.00027808358,0.00043978894,0.00020005087,0.00023670378],"domain_scores_gemma":[0.99916756,0.000027623719,0.00006706397,0.00044591102,0.00017425235,0.00011761408],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0000679907,0.00045633974,0.00051486376,0.00024355152,0.00009136198,0.000086634136,0.00025022982,0.00026541358,0.00003919557],"category_scores_gemma":[0.000004287541,0.00035525826,0.000100906254,0.000049512175,0.00004854347,0.00005543433,0.000040995954,0.00034810117,0.000022310716],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008398745,0.00000605645,0.000012479807,0.00018443869,0.0006899102,0.000002946957,0.00076610973,0.00045246902,0.012930453,0.003687865,0.000292728,0.98096615],"study_design_scores_gemma":[0.00010128359,0.000054232863,0.0000043525815,0.0007212286,0.000370445,0.000005438499,0.00007970255,0.00071384007,0.0041903877,0.0018104616,0.99129134,0.00065726734],"about_ca_topic_score_codex":0.000009467568,"about_ca_topic_score_gemma":0.0022106501,"teacher_disagreement_score":0.9909986,"about_ca_system_score_codex":0.000095443094,"about_ca_system_score_gemma":0.000041073712,"threshold_uncertainty_score":0.99988997},"labels":[],"label_agreement":null},{"id":"W4409073234","doi":"10.1016/b978-0-44-314153-9.00018-0","title":"Inference for one-shot devices with multiple failure modes","year":2025,"lang":"en","type":"book-chapter","venue":"Elsevier eBooks","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Inference; Shot (pellet); Computer science; One shot; Artificial intelligence; Engineering; Materials science; Mechanical engineering","score_opus":0.02520201314678415,"score_gpt":0.23495058201048669,"score_spread":0.20974856886370252,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409073234","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00013893441,0.00081706274,0.0009526772,0.000023861643,0.00011017169,0.00061387743,0.00024313721,0.00028633987,0.99681395],"genre_scores_gemma":[0.11312365,0.000075160235,0.0018207455,0.00015025066,0.00020468618,0.00015573697,0.00022242403,0.00014095561,0.8841064],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99854285,0.000007692503,0.00040886734,0.0004504457,0.0002256679,0.00036450854],"domain_scores_gemma":[0.9988416,0.0001544585,0.0001040244,0.00052481185,0.0002791669,0.000095941214],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00008109794,0.0005920415,0.00076451444,0.0002933841,0.00010577463,0.00011147748,0.00036447,0.00047157562,0.00015880166],"category_scores_gemma":[0.000016815566,0.00049598154,0.00027524875,0.000033321663,0.00006882157,0.00008199733,0.000028331018,0.00054320856,0.000026440903],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029362198,0.000012298051,0.000043415122,0.0014493461,0.0028574446,0.000017435936,0.00038663356,0.0013553939,0.0021820841,0.028644726,0.0012163371,0.9618055],"study_design_scores_gemma":[0.0003374852,0.00005940056,0.0000016366591,0.0011804587,0.0008027625,0.0000031546535,0.000043694996,0.0038183974,0.0021136366,0.0022074445,0.9886193,0.0008125873],"about_ca_topic_score_codex":0.0000029899786,"about_ca_topic_score_gemma":0.0014317967,"teacher_disagreement_score":0.987403,"about_ca_system_score_codex":0.00010227743,"about_ca_system_score_gemma":0.00011996057,"threshold_uncertainty_score":0.9997492},"labels":[],"label_agreement":null},{"id":"W4409098686","doi":"10.1051/0004-6361/202452198","title":"ZTF-observed late-time signals of pre-ZTF transients","year":2025,"lang":"en","type":"article","venue":"Astronomy and Astrophysics","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Planetary Science Division; Science Mission Directorate; Science and Technology Facilities Council; Horizon 2020 Framework Programme; University System of Taiwan; Smithsonian Astrophysical Observatory; Max-Planck-Institut für Astronomie; Stockholms Universitet; Queen's University; University of Warwick; Weizmann Institute of Science; Gordon and Betty Moore Foundation; Queen's University Belfast; Los Alamos National Laboratory; European Space Agency; Alfred P. Sloan Foundation; Johns Hopkins University; Durham University; Northwestern University; National Central University; Space Telescope Science Institute; Smithsonian Institution; Drexel University; National Science Foundation; Eötvös Loránd Tudományegyetem; European Commission; California Institute of Technology; National Aeronautics and Space Administration","keywords":"Physics; Astrophysics; Astronomy","score_opus":0.005858658248220792,"score_gpt":0.1801804684617398,"score_spread":0.174321810213519,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409098686","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9164049,0.000119305194,0.08158163,0.000017033026,0.000067627756,0.000089866466,0.000038337268,0.000056806784,0.0016244821],"genre_scores_gemma":[0.9969897,0.000009690171,0.0024183576,0.000012674504,0.000036033292,0.000007046937,0.000041577856,0.000014981072,0.00046992913],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992826,0.00001745621,0.00024875216,0.00016230324,0.00007542737,0.00021349186],"domain_scores_gemma":[0.99966604,0.000022576829,0.0000367933,0.00017321765,0.000052975454,0.000048413916],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000039524508,0.0001730764,0.00030539292,0.0000788521,0.000044927754,0.000028310671,0.00012413849,0.000060072776,0.000081218466],"category_scores_gemma":[0.0000015079089,0.00016607132,0.00011789961,0.00023216213,0.00004370327,0.0001436042,0.000013639072,0.00014763937,0.000010841782],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039097577,0.00013019731,0.0015040019,0.00014204394,0.0013469824,0.000002225444,0.00073623273,0.070620894,0.6677536,0.0019908738,0.0008286422,0.25490522],"study_design_scores_gemma":[0.0031282797,0.00045295115,0.01652094,0.00061218615,0.0014769351,0.0000012380411,0.0010785501,0.054750953,0.85571396,0.0019394325,0.06288504,0.001439542],"about_ca_topic_score_codex":0.000034326997,"about_ca_topic_score_gemma":0.0000018604512,"teacher_disagreement_score":0.25346568,"about_ca_system_score_codex":0.00001666294,"about_ca_system_score_gemma":0.000024351475,"threshold_uncertainty_score":0.67721915},"labels":[],"label_agreement":null},{"id":"W4409329969","doi":"10.1109/tcsi.2025.3556802","title":"A Multi-Stage RC Compensation Technique for Decoupling the Transimpedance and BW: Creating High Speed and Low Noise TIA Designs","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Circuits and Systems I Regular Papers","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Decoupling (probability); Transimpedance amplifier; Electronic engineering; Noise (video); Compensation (psychology); Computer science; Stage (stratigraphy); RC circuit; Operational amplifier; Electrical engineering; Engineering; Capacitor; Voltage; Amplifier; CMOS; Control engineering; Artificial intelligence; Psychology","score_opus":0.024829064994201833,"score_gpt":0.24438845665438086,"score_spread":0.21955939166017902,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409329969","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.19951096,0.000839102,0.79764855,0.00006263226,0.0002734361,0.0011087824,0.00007454246,0.00013178166,0.00035022],"genre_scores_gemma":[0.9986559,0.0003121865,0.00022406365,0.00004753209,0.000026621188,0.00014899112,0.0000062635463,0.00003550008,0.0005429457],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989038,0.000058835696,0.00035087252,0.00032821903,0.00011480998,0.00024346687],"domain_scores_gemma":[0.9993353,0.0002262138,0.000052314525,0.00022031735,0.00008076348,0.00008509113],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037608252,0.0002558368,0.00035408713,0.00018052598,0.00047693317,0.00017423299,0.00008448857,0.00017603196,0.000007802817],"category_scores_gemma":[0.000009054447,0.00020226496,0.00008564711,0.00023530904,0.00009037316,0.00011802521,6.196248e-7,0.00022499681,4.070217e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009648352,0.000023285476,0.00003085898,0.00051160564,0.0003805264,0.0000023804507,0.0010137592,0.071313225,0.9183788,0.00062619976,0.000013021974,0.0076967147],"study_design_scores_gemma":[0.002029446,0.00013116733,0.00029258316,0.001005467,0.0008445745,0.000053687287,0.0049732057,0.8348906,0.15391074,0.000053311258,0.0010592287,0.00075599237],"about_ca_topic_score_codex":0.00019569535,"about_ca_topic_score_gemma":0.00018855793,"teacher_disagreement_score":0.7991449,"about_ca_system_score_codex":0.00006334013,"about_ca_system_score_gemma":0.00003228171,"threshold_uncertainty_score":0.8248126},"labels":[],"label_agreement":null},{"id":"W4409804932","doi":"10.11159/icnnfc25.141","title":"Case Study on Ion Beam Characteristics Following Application of Dual Condenser Lens in Xenon Plasma FIB","year":2025,"lang":"en","type":"article","venue":"Proceedings of the World Congress on Recent Advances in Nanotechnology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":true,"route_about_ca":false,"ca_institutions":"","funders":"","keywords":"Xenon; Materials science; Focused ion beam; Dual (grammatical number); Plasma; Condenser (optics); Lens (geology); Ion; Beam (structure); Ion beam; Optics; Optoelectronics; Atomic physics; Physics; Nuclear physics; Light source","score_opus":0.00878308615727211,"score_gpt":0.2508220547061586,"score_spread":0.24203896854888649,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409804932","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.997385,0.00024771068,0.000006984367,0.0002382464,0.00068889884,0.0005203288,0.0000076039887,0.000071137656,0.00083404663],"genre_scores_gemma":[0.9993655,0.0003492378,0.000022408361,0.000027115517,0.000011163561,0.00008529184,0.0000022572185,0.000017188122,0.00011984362],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99874467,0.000009567125,0.00056858483,0.00028710722,0.00015955212,0.00023053815],"domain_scores_gemma":[0.99935836,0.0000931821,0.00020771955,0.00020588508,0.00012290823,0.000011938532],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019569998,0.000203804,0.0004668178,0.000917667,0.000040210725,0.000010219482,0.00032513955,0.00015854836,0.000004562663],"category_scores_gemma":[0.00012623762,0.00016848315,0.00007264407,0.001516341,0.00008226628,0.00013486069,0.000056766454,0.0005038554,0.0000010491593],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004544178,0.0016403741,0.20537226,0.0006676082,0.0005905242,0.00019827484,0.001214776,0.009661016,0.5447206,0.03902744,0.00028227406,0.19617045],"study_design_scores_gemma":[0.0017019417,0.00024984675,0.000520215,0.00084431196,0.00012786704,0.000026224308,0.0035810415,0.005640614,0.97473836,0.0010417782,0.01116102,0.00036677372],"about_ca_topic_score_codex":0.000024485902,"about_ca_topic_score_gemma":0.00059799035,"teacher_disagreement_score":0.4300178,"about_ca_system_score_codex":0.00015618643,"about_ca_system_score_gemma":0.000012853732,"threshold_uncertainty_score":0.6870544},"labels":[],"label_agreement":null},{"id":"W4410121591","doi":"10.1016/j.solener.2025.113546","title":"A novel few-shot detector for rare defect localization in photovoltaic cells using electroluminescence images","year":2025,"lang":"en","type":"article","venue":"Solar Energy","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Windsor","funders":"National Natural Science Foundation of China","keywords":"Electroluminescence; Photovoltaic system; Shot (pellet); Detector; Materials science; One shot; Optoelectronics; Single shot; Optics; Physics; Nanotechnology; Electrical engineering","score_opus":0.010612562861942445,"score_gpt":0.2199669074517289,"score_spread":0.20935434458978644,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410121591","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.11182068,0.0010817171,0.88599163,0.000006467984,0.0002811552,0.00013888924,0.000025442725,0.00014275828,0.00051125453],"genre_scores_gemma":[0.9987094,0.000047221154,0.0007905005,0.000118130614,0.0000413967,0.00003713642,0.000034954683,0.000034219876,0.00018707712],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991063,0.000018338304,0.00023940903,0.00023254106,0.00007941527,0.00032398078],"domain_scores_gemma":[0.9996196,0.000043319833,0.000029229377,0.00017916328,0.0000958684,0.00003284261],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008566968,0.00018283933,0.0002375594,0.00030841967,0.00006762433,0.00005464722,0.00013556793,0.0001332344,0.000023756853],"category_scores_gemma":[0.000033044937,0.00018579078,0.00014369725,0.00073752814,0.000017545208,0.00012158076,0.000010421803,0.0001127086,0.0000013242912],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000056787885,0.00001576144,0.00010329653,0.000049237904,0.0000694973,0.0000017098216,0.00003429655,0.05334933,0.94534636,0.00017697577,0.00027703983,0.00057080365],"study_design_scores_gemma":[0.00022039117,0.000010888669,0.000008333732,0.000044351727,0.00005001875,0.0000010663094,0.000034410725,0.36806124,0.62857133,0.00007012721,0.002793438,0.00013436776],"about_ca_topic_score_codex":0.000995472,"about_ca_topic_score_gemma":0.001541524,"teacher_disagreement_score":0.8868887,"about_ca_system_score_codex":0.0001716269,"about_ca_system_score_gemma":0.00005624403,"threshold_uncertainty_score":0.7576328},"labels":[],"label_agreement":null},{"id":"W4410490354","doi":"10.1103/bj8d-kclm","title":"Pulsed electroluminescence in a dopant-free gateable semiconductor","year":2025,"lang":"en","type":"article","venue":"Physical Review Applied","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Canada First Research Excellence Fund; University of Waterloo; Defence Research and Development Canada","keywords":"Electroluminescence; Dopant; Materials science; Optoelectronics; Semiconductor; Doping; Nanotechnology","score_opus":0.004324345586604056,"score_gpt":0.2328209584080571,"score_spread":0.22849661282145306,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410490354","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6087828,0.064990334,0.00073975965,0.001139638,0.00036442044,0.002106417,0.000031423602,0.0009716602,0.3208735],"genre_scores_gemma":[0.99407005,0.004709946,0.000030285639,0.0006677188,0.0000661496,0.00018302999,0.000021034366,0.00002471286,0.00022705765],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987725,0.000022101329,0.00034585994,0.0003025194,0.00014985612,0.0004071416],"domain_scores_gemma":[0.9992486,0.00005863038,0.000032250035,0.0005595419,0.00004074873,0.00006017655],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001317634,0.0002509129,0.00065471843,0.000116350704,0.000029625979,0.00002807117,0.00044129015,0.00004959024,0.000099240475],"category_scores_gemma":[0.000057805748,0.00021489308,0.0001468213,0.0011935894,0.000031029445,0.00007916673,0.000026565505,0.00037587626,0.00010998812],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000005717684,0.000092076174,0.000057656645,0.0013917041,0.000110273846,0.0000046797836,0.000048337122,0.00018945104,0.9520458,0.022835704,0.016458878,0.006759702],"study_design_scores_gemma":[0.0028778634,0.000068429355,0.00038557054,0.0066664238,0.0011792671,0.000005415254,0.00015892358,0.039719798,0.77464014,0.05058115,0.12134684,0.002370209],"about_ca_topic_score_codex":0.00003721975,"about_ca_topic_score_gemma":0.00004542275,"teacher_disagreement_score":0.38528723,"about_ca_system_score_codex":0.000115079216,"about_ca_system_score_gemma":0.000041507974,"threshold_uncertainty_score":0.87630856},"labels":[],"label_agreement":null},{"id":"W4410610019","doi":"10.4271/2025-01-8251","title":"Testing Complex Circuits with Radio-Frequency Reflectometry","year":2025,"lang":"en","type":"article","venue":"SAE technical papers on CD-ROM/SAE technical paper series","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Reflectometry; Radio frequency; Electronic circuit; Computer science; Electronic engineering; High frequency; Electrical engineering; Telecommunications; Engineering; Physics; Geophysics; Time domain","score_opus":0.019857530609466226,"score_gpt":0.24812527814307908,"score_spread":0.22826774753361284,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410610019","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.44214654,0.0013251102,0.000018288281,0.0016253075,0.00038807173,0.0010436513,0.00009075105,0.008566347,0.54479593],"genre_scores_gemma":[0.9937441,0.00014065488,0.0034986434,0.0014070615,0.00014328265,0.0002156842,0.00008590701,0.00017814945,0.00058655115],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99537504,0.00011827647,0.0012015454,0.0012136744,0.00082221575,0.0012692459],"domain_scores_gemma":[0.9969543,0.00060105213,0.00015296016,0.00165262,0.00028610355,0.0003529467],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00048132523,0.0010366333,0.0013236119,0.00075780286,0.0004621001,0.00021659442,0.0013108199,0.00089462,0.00067853136],"category_scores_gemma":[0.00075276184,0.00084377005,0.0004306076,0.004225955,0.00075249886,0.00048840017,0.00014308785,0.00202152,0.00011007133],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003436799,0.00013702785,0.0006302488,0.00011355535,0.00027938944,0.00008782598,0.00002005654,0.00016794378,0.9722984,0.014268758,0.005411272,0.0065511875],"study_design_scores_gemma":[0.00083398976,0.0007633625,0.9652775,0.0006185014,0.00036554204,0.0001598075,0.00015036532,0.0000014130046,0.00086518086,0.002557877,0.027185643,0.0012208442],"about_ca_topic_score_codex":0.00010029761,"about_ca_topic_score_gemma":0.03603312,"teacher_disagreement_score":0.97143316,"about_ca_system_score_codex":0.000667784,"about_ca_system_score_gemma":0.00016628446,"threshold_uncertainty_score":0.99940133},"labels":[],"label_agreement":null},{"id":"W4410754917","doi":"10.31399/asm.edfa.2025-2.p042","title":"Meeting the Metrology Needs of the Electronic Device Failure Analysis Technology Roadmap","year":2025,"lang":"en","type":"article","venue":"EDFA Technical Articles","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Technology roadmap; Metrology; Engineering; Systems engineering; Engineering management; Computer science; Business; Physics","score_opus":0.004015017406900987,"score_gpt":0.2032917321152572,"score_spread":0.1992767147083562,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410754917","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.982129,0.0016340046,0.0051743663,0.0074971966,0.00007173927,0.00015188534,0.000003006163,0.0003605098,0.002978324],"genre_scores_gemma":[0.9994797,0.000029212662,0.000115400704,0.00020832938,0.000021129823,0.000030509047,0.0000013852014,0.000012055612,0.00010227851],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99880636,0.000073847965,0.00041625247,0.00015019644,0.00014385945,0.00040950047],"domain_scores_gemma":[0.99899036,0.000168507,0.00006535457,0.00064975425,0.000102236314,0.000023772289],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000360973,0.0001597848,0.0003507835,0.00056040054,0.00013766348,0.000023623725,0.00071835954,0.00020925823,0.000068219735],"category_scores_gemma":[0.0001891791,0.000089370384,0.0003128445,0.0073353057,0.00021851511,0.000046639914,0.00010002694,0.0005507837,0.000008500941],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00000557265,0.00008047253,0.028162094,0.000027092437,0.0031914576,0.0000011115187,0.00022402855,0.016869044,0.7775582,0.16516016,0.0027776414,0.0059431368],"study_design_scores_gemma":[0.0004990007,0.000102535385,0.010832333,0.000082940256,0.0063695023,0.000014449583,0.004864558,0.03470973,0.866191,0.035583623,0.040177267,0.00057302986],"about_ca_topic_score_codex":0.00007529785,"about_ca_topic_score_gemma":0.0013505878,"teacher_disagreement_score":0.12957653,"about_ca_system_score_codex":0.000083437626,"about_ca_system_score_gemma":0.000038210535,"threshold_uncertainty_score":0.36444184},"labels":[],"label_agreement":null},{"id":"W4412407931","doi":"10.1007/978-3-031-94005-7_8","title":"Direct Conversion for Non-Destructive Testing (NDT)","year":2025,"lang":"en","type":"book-chapter","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Redlen Technologies (Canada)","funders":"","keywords":"Nondestructive testing; Materials science; Medicine; Radiology","score_opus":0.014330732770632404,"score_gpt":0.20204633133737507,"score_spread":0.18771559856674266,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4412407931","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00005573224,0.00015326531,0.0025657932,0.000009968385,0.00048136583,0.0002729969,0.00009961444,0.00030457557,0.9960567],"genre_scores_gemma":[0.015218892,0.00007394997,0.0015946946,0.00008639374,0.00027187378,0.000023488232,0.000196889,0.000104652696,0.98242915],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.999091,0.0000023989528,0.00027307804,0.0003027503,0.00010964996,0.00022107948],"domain_scores_gemma":[0.9991839,0.00021523277,0.000053642736,0.00024338113,0.00025026372,0.000053560656],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00006193247,0.00035886886,0.00048728572,0.0002608231,0.00007214963,0.00004128671,0.00016074227,0.00038475374,0.0004774562],"category_scores_gemma":[0.000036187128,0.00032333637,0.00025835785,0.00006567621,0.000027336815,0.00006695629,0.00001810031,0.0002857968,0.00005449045],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040868577,0.000023044286,0.000055169345,0.002625355,0.007828623,0.00006151143,0.00046887065,0.0025873936,0.04218485,0.33174983,0.53440803,0.07796645],"study_design_scores_gemma":[0.0008702082,0.00016504432,0.0000057348916,0.0015631949,0.0021750145,0.000011466687,0.00017959424,0.05922773,0.037442815,0.013908866,0.8821629,0.0022873958],"about_ca_topic_score_codex":0.000048554488,"about_ca_topic_score_gemma":0.000023474615,"teacher_disagreement_score":0.34775493,"about_ca_system_score_codex":0.00017240123,"about_ca_system_score_gemma":0.000061751074,"threshold_uncertainty_score":0.99992186},"labels":[],"label_agreement":null},{"id":"W4412871331","doi":"10.1101/2025.07.17.661952","title":"Enhancing STED Microscopy via Fluorescence Lifetime Unmixing and Filtering in Two-Species SPLIT-STED","year":2025,"lang":"en","type":"preprint","venue":"bioRxiv (Cold Spring Harbor Laboratory)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université Laval","funders":"","keywords":"STED microscopy; Microscopy; Fluorescence microscope; Stimulated emission; Fluorescence; Materials science; Optics; Physics; Laser","score_opus":0.007578302838086712,"score_gpt":0.2129961019835602,"score_spread":0.20541779914547348,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4412871331","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9816841,0.0034661435,0.011457842,0.000048149697,0.0014237761,0.00063746027,0.00024292276,0.00094828295,0.00009132332],"genre_scores_gemma":[0.99024177,0.00064233254,0.008461817,0.000086282664,0.00029038475,0.00010708777,0.0000018491132,0.00014111804,0.000027374126],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9965341,0.000118873526,0.0010072953,0.0011225683,0.00032067762,0.00089649844],"domain_scores_gemma":[0.99802613,0.00012401948,0.00020796336,0.001092176,0.0003147054,0.00023502269],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00052458234,0.00090388436,0.001100527,0.0009797808,0.00016916046,0.00044068438,0.00063773285,0.00054720516,0.00007814457],"category_scores_gemma":[0.00013141989,0.0010286954,0.00018332712,0.0012831959,0.000115376766,0.000270524,0.00037892346,0.0015492681,0.000023226368],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009476966,0.000028139739,0.0020260592,0.00079259527,0.00025818372,0.000058940263,0.00007181968,0.0016277601,0.99489087,0.00017955281,0.000047802365,0.000008797972],"study_design_scores_gemma":[0.0005047184,0.000014670288,0.009389935,0.0025022689,0.00018784101,5.3461314e-8,0.000023582987,0.030798085,0.954502,0.0000023552202,0.00086560816,0.0012088928],"about_ca_topic_score_codex":0.0004051874,"about_ca_topic_score_gemma":0.00011974999,"teacher_disagreement_score":0.040388882,"about_ca_system_score_codex":0.00060850015,"about_ca_system_score_gemma":0.00024677283,"threshold_uncertainty_score":0.9992163},"labels":[],"label_agreement":null},{"id":"W4413022268","doi":"10.21203/rs.3.rs-7236642/v1","title":"Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling","year":2025,"lang":"en","type":"preprint","venue":"Research Square","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Sample (material); Argon; Materials science; Ion; Ion milling machine; Analytical Chemistry (journal); Metallurgy; Composite material; Chemistry; Chromatography","score_opus":0.04948976067045417,"score_gpt":0.33957692488218916,"score_spread":0.29008716421173497,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4413022268","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9902861,0.0021075995,0.005009211,0.00010783738,0.000311659,0.0008233866,0.0002737471,0.00019118414,0.00088929053],"genre_scores_gemma":[0.99733526,0.00088845514,0.00017672987,0.000015134245,0.0001558001,0.000101617305,0.0011876483,0.00003942749,0.00009992695],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.997363,0.0002838147,0.00046244627,0.0007002202,0.00058583147,0.000604734],"domain_scores_gemma":[0.9982737,0.00058130006,0.00005627013,0.0005892377,0.00035278487,0.00014675276],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0008024343,0.00034693468,0.0005737964,0.00081116817,0.00014546972,0.00029189992,0.00030613402,0.0007079787,0.00015667232],"category_scores_gemma":[0.00044299776,0.00035977218,0.00012767746,0.00057695317,0.0000486657,0.00013904326,0.00018683616,0.0020920883,0.000028213857],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00026708705,0.0002805141,0.008103749,0.004077372,0.0020856927,0.00010278907,0.026479114,0.6269687,0.2772849,0.00044585127,0.008785975,0.045118302],"study_design_scores_gemma":[0.0014468034,0.0001719245,0.003050313,0.004720051,0.00017578607,0.0000010149062,0.004962383,0.9167971,0.05431182,0.010334346,0.0027957084,0.0012327202],"about_ca_topic_score_codex":0.014085998,"about_ca_topic_score_gemma":0.0106078135,"teacher_disagreement_score":0.28982848,"about_ca_system_score_codex":0.00042217856,"about_ca_system_score_gemma":0.00028655303,"threshold_uncertainty_score":0.99988544},"labels":[],"label_agreement":null},{"id":"W4413926131","doi":"10.1109/tcad.2025.3605537","title":"<i>QuickCell</i> : Fast Automatic Design of Standard Cells for Silicon Dangling Bond Logic","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of British Columbia","funders":"","keywords":"Dangling bond; Silicon; Computer science; Materials science; Optoelectronics","score_opus":0.02293307596942311,"score_gpt":0.22546608158682724,"score_spread":0.20253300561740412,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4413926131","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.010289502,0.00088818657,0.9853813,0.000010883121,0.0014873595,0.0012776743,0.00024098449,0.0002554829,0.00016862855],"genre_scores_gemma":[0.9952808,0.00019398733,0.004091816,0.000039970462,0.000040457257,0.00012486035,0.0000125449615,0.000058091842,0.00015745743],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99735063,0.00021646677,0.0012655723,0.00045968176,0.00028367573,0.0004239751],"domain_scores_gemma":[0.9978185,0.0007924589,0.00023771707,0.0004444581,0.00059340394,0.000113420865],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00069628126,0.00049654953,0.0011734202,0.0007551513,0.00015852462,0.00012285482,0.0003192773,0.00033165995,0.000018695293],"category_scores_gemma":[0.000010400277,0.00042418975,0.0002688815,0.00084335654,0.00010912617,0.00015891236,0.0000015082863,0.0003675801,0.0000028832292],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000036279995,0.0000854402,0.000001285562,0.00072864024,0.0006757668,0.0000035338082,0.00036007655,0.68657875,0.28309554,0.00041458153,0.0010517134,0.026968371],"study_design_scores_gemma":[0.00074419944,0.00051465083,6.3418935e-7,0.00092234893,0.00030165142,0.000008626405,0.00049996923,0.7067609,0.28970227,0.00012644957,0.0001329346,0.00028540837],"about_ca_topic_score_codex":0.00011243128,"about_ca_topic_score_gemma":0.0000065692525,"teacher_disagreement_score":0.9849913,"about_ca_system_score_codex":0.00017686358,"about_ca_system_score_gemma":0.0001866259,"threshold_uncertainty_score":0.999821},"labels":[],"label_agreement":null},{"id":"W4414310143","doi":"10.1109/icept67137.2025.11157520","title":"Research on the Failure Mechanism of TSV Interconnection Structure in RF Microsystem under Temperature Stress","year":2025,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"123 Certification (Canada)","funders":"","keywords":"Interconnection; Stress (linguistics); Through-silicon via; Thermal shock; Microsystem; Reliability (semiconductor); Failure mechanism; Layer (electronics); Silicon","score_opus":0.016099007636754096,"score_gpt":0.2646073121694292,"score_spread":0.24850830453267508,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4414310143","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9886993,0.00014260634,0.00023478712,0.00095961895,0.0003650283,0.00022071152,0.000037007358,0.0000686611,0.009272249],"genre_scores_gemma":[0.99813974,0.000015526686,0.000012974155,0.00010380867,0.000039413164,0.00001174331,0.000013835111,0.000015772386,0.001647209],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99897736,0.00010178859,0.00026477082,0.00020560635,0.00021461806,0.00023583426],"domain_scores_gemma":[0.9992276,0.00018838172,0.000019063591,0.00035219415,0.00019130035,0.00002149484],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003252218,0.00015107212,0.00021607711,0.00050071516,0.00007236757,0.00007378823,0.00028258213,0.0002842604,0.00041425682],"category_scores_gemma":[0.000021011514,0.0000920914,0.0000738798,0.0011394955,0.00002988543,0.0000672911,0.000024478299,0.00093960523,0.0000066432426],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00000465549,0.000011438898,0.00003320104,0.00008457276,0.000118116295,0.0000015015835,0.00024733835,0.004923006,0.61024386,0.3806308,0.0036364861,0.00006502925],"study_design_scores_gemma":[0.00020011979,0.00003214192,0.0001306162,0.00047240563,0.00002211867,0.0000016916741,0.01944836,0.002338857,0.9663917,0.010109417,0.00070577284,0.000146838],"about_ca_topic_score_codex":0.0003282294,"about_ca_topic_score_gemma":0.006719087,"teacher_disagreement_score":0.37052137,"about_ca_system_score_codex":0.00015604013,"about_ca_system_score_gemma":0.00003375703,"threshold_uncertainty_score":0.45358217},"labels":[],"label_agreement":null},{"id":"W4415128494","doi":"10.1364/ol.575290","title":"Optical waveguide facet preparation using programmable focused ion beam sculpting","year":2025,"lang":"en","type":"article","venue":"Optics Letters","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Facet (psychology); Focused ion beam; Waveguide; Fabrication; Coupling loss; Coupling (piping); Photonics; Beam (structure); Ion beam","score_opus":0.0124183859495482,"score_gpt":0.24120723462452034,"score_spread":0.22878884867497215,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415128494","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89205897,0.00007546812,0.0996113,0.00036099684,0.00036631495,0.00020692578,0.0000025983763,0.00027341448,0.00704399],"genre_scores_gemma":[0.9822615,0.000010368332,0.016988724,0.0003326679,0.00011928987,0.00001594744,0.00003481602,0.000033063785,0.0002036601],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99893427,0.000016190697,0.00031380012,0.00022043732,0.00015937931,0.0003559421],"domain_scores_gemma":[0.9995702,0.000023192175,0.00003316756,0.00025079568,0.000070071415,0.000052594976],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016104382,0.0001866853,0.00021575451,0.00018349598,0.000115994306,0.0001845139,0.00013329877,0.000113489776,0.000017901717],"category_scores_gemma":[0.000036921247,0.00018416451,0.00010973045,0.00042066813,0.000044999695,0.00018557352,0.000019432371,0.00022871542,0.000016032529],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000027778872,0.000012791369,0.00006278339,0.00004034324,0.00017252163,0.000005892674,0.00013741323,0.21288438,0.7825922,0.0014690342,0.0010869098,0.0015329845],"study_design_scores_gemma":[0.00027983816,0.000017964552,0.000018891269,0.00009535448,0.0002078079,0.0000040981486,0.00011724084,0.76054144,0.23519713,0.000058657755,0.0031688113,0.00029275374],"about_ca_topic_score_codex":0.000028203138,"about_ca_topic_score_gemma":0.000010889875,"teacher_disagreement_score":0.5476571,"about_ca_system_score_codex":0.00017855642,"about_ca_system_score_gemma":0.000025834284,"threshold_uncertainty_score":0.75100106},"labels":[],"label_agreement":null},{"id":"W4415338314","doi":"10.12783/shm2025/37536","title":"Advanced NeRF (ABM-Nerfacto) for High-Definition Digital Twin and Damage Mapping","year":2025,"lang":"","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Manitoba","funders":"","keywords":"Deep learning; Bridge (graph theory); Structural health monitoring; Mechanism (biology); Key (lock)","score_opus":0.012771942917432265,"score_gpt":0.21360662655404838,"score_spread":0.2008346836366161,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415338314","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.73539203,0.001969884,0.17085685,0.0010765529,0.0013129237,0.0008370336,0.0003941596,0.00041346357,0.08774709],"genre_scores_gemma":[0.99056154,0.00030947186,0.0019491375,0.0002091076,0.000152411,0.000047897334,0.00026092326,0.000055404842,0.006454076],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9979314,0.000020806649,0.0006871989,0.0006015213,0.00015255187,0.0006064949],"domain_scores_gemma":[0.9989298,0.00024739397,0.00008687532,0.000390889,0.00022079574,0.00012427485],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00013779872,0.0005040145,0.00063416123,0.00050152943,0.00023391088,0.0006340509,0.00019981829,0.00031643375,0.00041693446],"category_scores_gemma":[0.000132233,0.00048483736,0.00022255107,0.00072724663,0.000077439756,0.0009192336,0.00005614728,0.00036522857,0.000032724758],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001028422,0.00015053833,0.0006468744,0.0014725472,0.0029812348,0.000018888597,0.0015002999,0.008708979,0.30702126,0.3546797,0.00673232,0.31598455],"study_design_scores_gemma":[0.013812992,0.00086493563,0.003162855,0.0033736883,0.0034189497,0.00002459606,0.026752982,0.38799164,0.19834392,0.11037274,0.24526972,0.0066109933],"about_ca_topic_score_codex":0.00012555916,"about_ca_topic_score_gemma":0.000039060422,"teacher_disagreement_score":0.37928265,"about_ca_system_score_codex":0.00015431062,"about_ca_system_score_gemma":0.00006619339,"threshold_uncertainty_score":0.9997603},"labels":[],"label_agreement":null},{"id":"W4415828303","doi":"10.2139/ssrn.5603050","title":"Quantum Time Reversal Interferometry: Achieving 99.1% Logical Fidelity via Error Correction on IBM Torino","year":2025,"lang":"en","type":"preprint","venue":"SSRN Electronic Journal","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Canadian Quantum Research Center","funders":"","keywords":"Fidelity; Quantum error correction; Error detection and correction; Quantum; Qubit; Quantum computer; Quantum algorithm; State (computer science)","score_opus":0.011657918941877843,"score_gpt":0.24024092204244163,"score_spread":0.2285830031005638,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415828303","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7168634,0.009827419,0.22864278,0.0008255249,0.02246411,0.00089743,0.00012072107,0.001531778,0.018826852],"genre_scores_gemma":[0.9921534,0.0023796984,0.000055986402,0.00008653216,0.0010049831,0.0000140524935,0.0000974607,0.00006405044,0.004143848],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9955723,0.00028188294,0.0008599445,0.0006028068,0.00047223788,0.0022108152],"domain_scores_gemma":[0.99865425,0.00014267219,0.000258587,0.0005473194,0.00024032082,0.00015685036],"candidate_categories":["metaepi_narrow","research_integrity"],"consensus_categories":[],"category_scores_codex":[0.0018454168,0.0006655217,0.0008872994,0.0007402303,0.00025862447,0.00021079187,0.0007543716,0.0007736393,0.0003715183],"category_scores_gemma":[0.00021383974,0.00059215457,0.00068602024,0.0005259277,0.0000414727,0.00016146411,0.00014881576,0.014244422,0.00015718162],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":true,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0013712532,0.0014626905,0.0021458927,0.0010949911,0.030475132,0.00023318303,0.0026919243,0.40641245,0.06733633,0.056192677,0.07427636,0.35630712],"study_design_scores_gemma":[0.003364697,0.004080831,0.001155268,0.0051145037,0.0053324187,0.0017614156,0.0044790064,0.6964556,0.008068716,0.23683994,0.025287341,0.008060251],"about_ca_topic_score_codex":0.00027498486,"about_ca_topic_score_gemma":0.0003531927,"teacher_disagreement_score":0.34824687,"about_ca_system_score_codex":0.005000728,"about_ca_system_score_gemma":0.0009984805,"threshold_uncertainty_score":0.999653},"labels":[],"label_agreement":null},{"id":"W4415990515","doi":"10.31399/asm.cp.istfa2025p0400","title":"EOTPR Fine Pitch Probing for Die-to-Die Interconnect Failure Analysis","year":2025,"lang":"","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Advanced Micro Devices","keywords":"Interconnection; Root cause; Granularity; Fault detection and isolation; Isolation (microbiology); TRACE (psycholinguistics); Integrated circuit packaging; Catastrophic failure; Fault (geology)","score_opus":0.012912524940103648,"score_gpt":0.2484271748980187,"score_spread":0.23551464995791505,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415990515","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4245161,0.0040763095,0.49894854,0.045768213,0.0026910256,0.0069403755,0.0032871685,0.0019755757,0.011796675],"genre_scores_gemma":[0.97113204,0.00014778224,0.021787189,0.00043179624,0.00084055006,0.0010807575,0.0006936399,0.0001541266,0.0037321402],"study_design_codex":"meta_analysis","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99305993,0.000034261793,0.002314025,0.0023852892,0.00073250715,0.001473986],"domain_scores_gemma":[0.9924026,0.0013479562,0.00077333907,0.0005069838,0.0044769114,0.0004921925],"candidate_categories":["metaepi_narrow","scholarly_communication"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0014448713,0.0014107893,0.0025603827,0.0055956566,0.0010038033,0.0020613596,0.0014057759,0.00070587127,0.00013275059],"category_scores_gemma":[0.0024160356,0.0014239913,0.002664397,0.009039228,0.00015810793,0.00087891123,0.00031229446,0.00081396144,0.000011383998],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000684731,0.00088545197,0.10683896,0.003691781,0.36653197,0.000022449047,0.010200136,0.16009687,0.2841534,0.019795014,0.016803846,0.030295392],"study_design_scores_gemma":[0.0019928964,0.00046274334,0.00067174993,0.0009595399,0.102150336,0.000010972071,0.0032787465,0.8222353,0.010330811,0.0021415178,0.053441726,0.0023236768],"about_ca_topic_score_codex":0.0009317863,"about_ca_topic_score_gemma":0.002828474,"teacher_disagreement_score":0.6621384,"about_ca_system_score_codex":0.0007265966,"about_ca_system_score_gemma":0.00012976296,"threshold_uncertainty_score":0.9998642},"labels":[],"label_agreement":null},{"id":"W4415990632","doi":"10.31399/asm.cp.istfa2025p0199","title":"3.5D Package Failure Analysis – The Challenges and Innovative Solutions to Successful Root Cause Analysis","year":2025,"lang":"","type":"article","venue":"Proceedings - International Symposium for Testing and Failure Analysis","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Root cause; Root cause analysis; Root (linguistics); Sample (material); Power (physics); Integrated circuit packaging","score_opus":0.024632886429478393,"score_gpt":0.2563948779941797,"score_spread":0.23176199156470131,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415990632","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.73731714,0.016556565,0.11690638,0.10348585,0.0010066418,0.0033817503,0.0024301147,0.001124619,0.017790942],"genre_scores_gemma":[0.9937791,0.0008875336,0.002674423,0.00035235795,0.00036294514,0.0004117945,0.00033401334,0.000076808195,0.0011209738],"study_design_codex":"meta_analysis","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.993768,0.00008378884,0.0018714985,0.0021017245,0.00090248906,0.0012725363],"domain_scores_gemma":[0.9918659,0.0012971037,0.00075874827,0.00064025226,0.005023046,0.00041500322],"candidate_categories":["metaepi_narrow","bibliometrics","sts","scholarly_communication"],"consensus_categories":[],"category_scores_codex":[0.0017144695,0.0012308346,0.0023112984,0.007503752,0.001499082,0.0019085113,0.0012573163,0.00060039124,0.00012271848],"category_scores_gemma":[0.0015536441,0.0010416041,0.0016059154,0.033690874,0.00036892277,0.00088304793,0.00046635474,0.00097559707,0.000009053592],"study_design_candidate":"meta_analysis","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000103897764,0.00032555388,0.28629908,0.00049772114,0.57351166,0.0000116946,0.010539304,0.04236702,0.015307054,0.061037775,0.0036729479,0.006326313],"study_design_scores_gemma":[0.0011557117,0.0002154722,0.046749827,0.00033747888,0.4032613,0.000016569857,0.014955535,0.51560795,0.001361778,0.0022315474,0.011719731,0.0023871192],"about_ca_topic_score_codex":0.0016175199,"about_ca_topic_score_gemma":0.010464353,"teacher_disagreement_score":0.4732409,"about_ca_system_score_codex":0.00041739503,"about_ca_system_score_gemma":0.00011077658,"threshold_uncertainty_score":0.9998008},"labels":[],"label_agreement":null},{"id":"W4416873908","doi":"10.1109/ipfa65338.2025.11256509","title":"Systematic Laser Voltage Probing Approach for Marginal Scan Failures","year":2025,"lang":"","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Voltage; Identification (biology); Laser; Integrated circuit; Fault detection and isolation; Root cause; Isolation (microbiology)","score_opus":0.008980628410587308,"score_gpt":0.2177009801681363,"score_spread":0.208720351757549,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416873908","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0028436296,0.0037460818,0.87016374,0.00025120738,0.00088993233,0.0037492726,0.0000728413,0.00043922247,0.11784408],"genre_scores_gemma":[0.94001037,0.00004880583,0.004405188,0.0001830131,0.00019531928,0.00070094544,0.00010578735,0.000093948656,0.054256614],"study_design_codex":"systematic_review","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99656725,0.00009210612,0.0013112457,0.00076539145,0.00031197644,0.0009520411],"domain_scores_gemma":[0.9982489,0.00023880428,0.00016760631,0.0007969898,0.00038894193,0.00015879622],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00078061654,0.0007222743,0.0013964399,0.0007796244,0.00034578878,0.00059231976,0.00062537007,0.0004440457,0.00046733278],"category_scores_gemma":[0.00016749468,0.0006022699,0.0007447958,0.0012322688,0.00007499714,0.00033699308,0.000056569712,0.0005084152,0.00004478298],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009103064,0.0005892902,0.00020053452,0.42458928,0.017145218,0.000020828613,0.0030415577,0.091308475,0.06379179,0.33119258,0.06630135,0.0017280764],"study_design_scores_gemma":[0.0013713802,0.0000966558,0.0000073116016,0.008839168,0.005205258,0.000013435687,0.010910338,0.93988407,0.026140405,0.00078766723,0.005402079,0.0013422248],"about_ca_topic_score_codex":0.00032057945,"about_ca_topic_score_gemma":0.00011435045,"teacher_disagreement_score":0.93716675,"about_ca_system_score_codex":0.0004107533,"about_ca_system_score_gemma":0.00019285508,"threshold_uncertainty_score":0.99964285},"labels":[],"label_agreement":null},{"id":"W4416874095","doi":"10.1109/ipfa65338.2025.11251498","title":"Super Resolution of Acoustic Microscopy Image Using Real-ESRGAN for Semiconductor Packages","year":2025,"lang":"","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Acoustic microscopy; Resolution (logic); Superresolution; Process (computing); High resolution; Image resolution; Semiconductor; Semiconductor industry","score_opus":0.016122272006498593,"score_gpt":0.2871649477241871,"score_spread":0.27104267571768853,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416874095","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.79717666,0.00248424,0.18848604,0.00021597251,0.0018010132,0.0009648021,0.0006305705,0.0002009679,0.0080397595],"genre_scores_gemma":[0.98330396,0.00086937286,0.01026644,0.000101680555,0.00018645085,0.000022264541,0.00013132145,0.00010828027,0.0050101974],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9968292,0.00008636709,0.0012881549,0.0006941468,0.00023267712,0.00086944364],"domain_scores_gemma":[0.9977246,0.0002972688,0.0001896454,0.00080508937,0.0008514599,0.00013196809],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00043317824,0.0006266214,0.0010705875,0.0007662163,0.00025197744,0.00016796889,0.00042056933,0.000585918,0.00074155733],"category_scores_gemma":[0.00025729855,0.00061301765,0.0006002286,0.0011918129,0.0002293859,0.0004725943,0.00006365041,0.0004275076,0.000014346662],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000041585958,0.000086002154,0.0001767244,0.00095232844,0.001012061,0.0000026487073,0.00060743635,0.005057063,0.9809421,0.0024019834,0.008410423,0.00030965664],"study_design_scores_gemma":[0.0007676358,0.00008069522,0.000044167024,0.0004713972,0.0017165305,0.0000040199707,0.0030838219,0.16516247,0.8263129,0.00036079873,0.0014508833,0.00054466963],"about_ca_topic_score_codex":0.0020955603,"about_ca_topic_score_gemma":0.00025993556,"teacher_disagreement_score":0.18612736,"about_ca_system_score_codex":0.00052940275,"about_ca_system_score_gemma":0.00038263964,"threshold_uncertainty_score":0.9996321},"labels":[],"label_agreement":null},{"id":"W4416884981","doi":"10.37665/srsewdf89359","title":"Virtual Imaging of Interconnect Stress Test Coupon Failures","year":2011,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Interconnection; Internal stress; Stress (linguistics); Reliability (semiconductor); Temperature cycling; Voltage","score_opus":0.016634318768205668,"score_gpt":0.21031211556633425,"score_spread":0.19367779679812858,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884981","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9845608,0.002920871,0.0026368299,0.00014156767,0.000854544,0.00024160513,0.00013958022,0.00015561451,0.008348585],"genre_scores_gemma":[0.9978741,0.0015949288,0.00023620464,0.000012833333,0.00009808975,0.000010515006,0.0000138293035,0.00003903001,0.00012051334],"study_design_codex":"observational","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99729633,0.000110602334,0.0010033932,0.0007143258,0.00028555357,0.0005897642],"domain_scores_gemma":[0.9981792,0.00041953608,0.00022763455,0.00056857534,0.00039435818,0.00021068178],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005481845,0.0005563054,0.0008929705,0.0002708362,0.00017865314,0.00015332815,0.00044034075,0.0002722734,0.00093830074],"category_scores_gemma":[0.00038436425,0.00047506858,0.00025698243,0.00034067436,0.0007387745,0.00038687504,0.00012116612,0.0006168,0.000010273381],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017645657,0.0016386664,0.5713768,0.0049497467,0.0021555559,0.00008248632,0.11178348,0.003504705,0.106617846,0.02866759,0.0003068212,0.16873987],"study_design_scores_gemma":[0.0025318183,0.0024748559,0.039533447,0.007143106,0.0026890088,0.00007518195,0.19082727,0.27885798,0.4592132,0.008850281,0.0029881047,0.004815739],"about_ca_topic_score_codex":0.005904984,"about_ca_topic_score_gemma":0.0006312762,"teacher_disagreement_score":0.5318433,"about_ca_system_score_codex":0.000051243605,"about_ca_system_score_gemma":0.00016145031,"threshold_uncertainty_score":0.99997497},"labels":[],"label_agreement":null},{"id":"W4416885191","doi":"10.37665/ppfawbh25693","title":"Life-Test Statistics for Small Sample Sizes","year":2008,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Sample size determination; Quality (philosophy); Test (biology); Statistical hypothesis testing; Sample (material); Interpretation (philosophy)","score_opus":0.022321947664105096,"score_gpt":0.21324105958582937,"score_spread":0.19091911192172428,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885191","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.038067117,0.0085393265,0.8212573,0.0019872421,0.011735428,0.004034231,0.034870356,0.0016913877,0.07781762],"genre_scores_gemma":[0.97899103,0.0032248318,0.009661642,0.00016741555,0.0013268555,0.00014178224,0.0009115366,0.00025488238,0.0053199986],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9962517,0.00007481713,0.0011654091,0.00085088453,0.00037282595,0.0012843662],"domain_scores_gemma":[0.99533635,0.0022459198,0.00023523642,0.00090448535,0.0005679755,0.00071001035],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00028363615,0.0008346799,0.0010717899,0.0003350892,0.0006327214,0.0002196411,0.00051512744,0.00048526423,0.0010305018],"category_scores_gemma":[0.0014272138,0.00086286524,0.00050525356,0.0006149424,0.00024385263,0.00019003953,0.000041546107,0.0005464992,0.0003289896],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017981548,0.0015486949,0.012728319,0.0024047021,0.005878598,0.00022475216,0.031341143,0.011652011,0.45671552,0.02434682,0.44278637,0.010193263],"study_design_scores_gemma":[0.005874339,0.0021514683,0.0012103716,0.00052808045,0.0053135008,0.00029077032,0.01577047,0.29363942,0.07228483,0.0036165153,0.59175867,0.0075615374],"about_ca_topic_score_codex":0.00049424486,"about_ca_topic_score_gemma":0.000086434986,"teacher_disagreement_score":0.9409239,"about_ca_system_score_codex":0.00023901547,"about_ca_system_score_gemma":0.00043141353,"threshold_uncertainty_score":0.9998827},"labels":[],"label_agreement":null},{"id":"W4416885437","doi":"10.37665/srcnjdr30254","title":"Pb-Free Failure Analysis Case Studies – An EMS Perspective","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Centre for Social Innovation","funders":"","keywords":"Perspective (graphical); Government (linguistics); Context (archaeology); Term (time)","score_opus":0.03898376291309791,"score_gpt":0.2745081038955361,"score_spread":0.23552434098243819,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885437","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98502797,0.010044449,0.0013671187,0.0006852642,0.00052921416,0.00030230035,0.00012496246,0.0002924421,0.0016262807],"genre_scores_gemma":[0.9908691,0.0075227264,0.0007917898,0.000030954812,0.00028090406,0.000029210041,0.000021211503,0.00004441724,0.00040968286],"study_design_codex":"qualitative","study_design_gemma":"qualitative","domain_scores_codex":[0.9959287,0.00032208604,0.00097586605,0.0014552091,0.00046591047,0.00085222983],"domain_scores_gemma":[0.9962352,0.00032882032,0.00020094347,0.0014379831,0.0013463806,0.00045067247],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0007034872,0.00086006115,0.0017383603,0.0006908617,0.0012358663,0.00030099662,0.00052093616,0.00051416137,0.00036180462],"category_scores_gemma":[0.0005481622,0.0007146069,0.0006258908,0.0017192768,0.0013619697,0.00069940824,0.0001793029,0.0009762717,0.000011429822],"study_design_candidate":"qualitative","study_design_consensus":"qualitative","about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00018501614,0.0017591993,0.10553026,0.0027312296,0.08448655,0.0127215525,0.6009485,0.13702224,0.0100876875,0.030971356,0.0029724597,0.010583921],"study_design_scores_gemma":[0.0021289561,0.0013226832,0.0033646498,0.00039371985,0.0198731,0.0041375854,0.7860937,0.157862,0.0037428641,0.014172374,0.0024016963,0.0045066765],"about_ca_topic_score_codex":0.008851899,"about_ca_topic_score_gemma":0.008725113,"teacher_disagreement_score":0.18514517,"about_ca_system_score_codex":0.00027409405,"about_ca_system_score_gemma":0.0002740556,"threshold_uncertainty_score":0.9995305},"labels":[],"label_agreement":null},{"id":"W587612923","doi":"10.7567/ssdm.2001.c-8-2","title":"Novel Capacitor Technology for Sub-Quarter Micron 1T1C FRAM","year":2001,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Materials science; Capacitor; Quarter (Canadian coin); Optoelectronics; Engineering physics; Electrical engineering; Nanotechnology; Voltage; Engineering","score_opus":0.00894708522002817,"score_gpt":0.19784295578379335,"score_spread":0.18889587056376517,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W587612923","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6245437,0.00030406972,0.3610803,0.00065135537,0.00062008237,0.00024944116,0.000031960837,0.0009037092,0.011615367],"genre_scores_gemma":[0.99666977,0.000029715982,0.0017004706,0.00011910635,0.00018342372,0.000041102554,0.00002000612,0.000034460638,0.0012019582],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992785,0.000002103981,0.00018246449,0.00016894247,0.000059097893,0.0003089256],"domain_scores_gemma":[0.9996213,0.000018530462,0.000015757043,0.00021964296,0.00008222913,0.000042595326],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004375245,0.0001526447,0.00018753026,0.00021905082,0.00004537939,0.000029661916,0.00014661187,0.00022492491,0.00024688776],"category_scores_gemma":[0.000010342274,0.00012902623,0.00010220897,0.00029592775,0.000027730915,0.000081400685,0.000004889209,0.00015631848,0.00009668277],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000002400153,0.000021310923,0.0001766785,0.000011118347,0.00011865152,0.0000020185944,0.00006785299,0.00020148828,0.9749359,0.0021150315,0.018830076,0.0035174668],"study_design_scores_gemma":[0.0008487188,0.00011628293,0.00008224575,0.000024537805,0.00014182532,0.00008294554,0.0011596853,0.042147532,0.60273385,0.0010317733,0.35094076,0.0006898253],"about_ca_topic_score_codex":0.00004206503,"about_ca_topic_score_gemma":0.00013783367,"teacher_disagreement_score":0.37220204,"about_ca_system_score_codex":0.000052102256,"about_ca_system_score_gemma":0.00000778296,"threshold_uncertainty_score":0.52615374},"labels":[],"label_agreement":null},{"id":"W6893233625","doi":"10.5281/zenodo.15123058","title":"Supplementary Material for \"Nuclear Winter Could Sever Urban Water Access Across the Northern Hemisphere\"","year":2025,"lang":"en","type":"preprint","venue":"Zenodo (CERN European Organization for Nuclear Research)","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Future Earth","funders":"","keywords":"Northern italy; Hydrology (agriculture); Precipitation; Work (physics); Water resources","score_opus":0.02279963648457318,"score_gpt":0.25149327405133654,"score_spread":0.22869363756676336,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W6893233625","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.74994993,0.00032412613,0.008866938,0.007041537,0.005743407,0.0067124786,0.10532664,0.0059372783,0.11009769],"genre_scores_gemma":[0.94711363,0.00012498579,0.000068146146,0.0006644871,0.00093702215,0.0000011785372,0.044673245,0.0028822313,0.003535066],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9976948,0.00015207425,0.0004940964,0.00061172375,0.00034091534,0.00070641725],"domain_scores_gemma":[0.99823296,0.000020626947,0.000085739564,0.00089523796,0.0006449255,0.00012049417],"candidate_categories":["metaepi_narrow","sts","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000508248,0.0004079584,0.00037473132,0.00013182017,0.0016115983,0.0027175893,0.0026169517,0.00027186563,0.051012956],"category_scores_gemma":[0.0000550439,0.0003062387,0.00024798897,0.00021616275,0.00013807091,0.0002028282,0.002677488,0.0007985758,0.00066890696],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013203072,0.000075976706,0.0000085649035,0.0006270714,0.0011398934,0.000010793227,0.005692069,0.004262642,0.012452758,0.00025675455,0.9625418,0.012799631],"study_design_scores_gemma":[0.00037735642,0.000043307955,0.000012448467,0.00007841423,0.00014254203,0.000014478661,0.00072881,0.0024939524,0.008842759,0.0001552984,0.9867189,0.00039174713],"about_ca_topic_score_codex":0.00017693311,"about_ca_topic_score_gemma":0.000024412668,"teacher_disagreement_score":0.19716373,"about_ca_system_score_codex":0.00034460123,"about_ca_system_score_gemma":0.0000060436937,"threshold_uncertainty_score":0.99993896},"labels":[],"label_agreement":null},{"id":"W7108209789","doi":"10.37665/jsmtejpyj76951","title":"Case Histories in Failure Analysis of Electronics Assemblies","year":2011,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Thornhill Medical (Canada)","funders":"","keywords":"Electronics; Root cause analysis; Root cause; Failure causes; Electronic systems","score_opus":0.01797076466686285,"score_gpt":0.21839292584884115,"score_spread":0.2004221611819783,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108209789","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97995186,0.017454127,0.0013230268,0.0003078442,0.0003903684,0.00009669112,0.000026733684,0.000047708814,0.00040162724],"genre_scores_gemma":[0.9953652,0.0020105932,0.0024541586,0.0000091387765,0.000028127675,0.0000014504776,0.0000028959973,0.000050704464,0.000077706005],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9961484,0.000101699705,0.0023001106,0.00032357738,0.00040039266,0.00072579057],"domain_scores_gemma":[0.99669874,0.00010110843,0.0013369516,0.0006407233,0.0011126245,0.0001098817],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00088011404,0.0005028286,0.002214105,0.0061112996,0.00007098437,0.00003110759,0.00073551864,0.0010731816,0.00052618823],"category_scores_gemma":[0.00019664607,0.00047046228,0.0007836647,0.008535373,0.00030907412,0.00045283113,0.00006382388,0.0020052711,0.0000044306735],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00029443062,0.0014487191,0.13893616,0.00045156784,0.05786923,0.021546774,0.024338152,0.1407195,0.5398441,0.067650795,0.0011693289,0.0057312544],"study_design_scores_gemma":[0.0058286656,0.0060557635,0.0029304968,0.00097608916,0.07895839,0.02516258,0.14061138,0.05968262,0.6172234,0.009901599,0.04754821,0.0051208306],"about_ca_topic_score_codex":0.0007111495,"about_ca_topic_score_gemma":0.00552345,"teacher_disagreement_score":0.13600567,"about_ca_system_score_codex":0.0014639914,"about_ca_system_score_gemma":0.00031250363,"threshold_uncertainty_score":0.9997747},"labels":[],"label_agreement":null},{"id":"W7131225332","doi":"10.1109/eptc67330.2025.11392596","title":"Defect Z-Depth Determination in 2.5D ICs Using Magnetic Field Imaging","year":2025,"lang":"","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"National Research Foundation Singapore","keywords":"Nondestructive testing; Reliability (semiconductor); Magnetic field; Integrated circuit; Penetration depth; Field (mathematics); Image resolution; Fast Fourier transform","score_opus":0.011941264783897032,"score_gpt":0.24879079682570718,"score_spread":0.23684953204181014,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7131225332","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5960859,0.009873462,0.23159654,0.0011205439,0.0020709524,0.00054710434,0.0000065566765,0.00025367216,0.15844525],"genre_scores_gemma":[0.9960751,0.0002552934,0.0010255135,0.0010258753,0.000050255654,0.0000075797925,0.0000064889173,0.00003643793,0.0015174645],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9979831,0.00008399045,0.00070927944,0.00046041628,0.00018791374,0.00057530927],"domain_scores_gemma":[0.99920106,0.0001995999,0.000057016798,0.00034210802,0.00013384243,0.0000663539],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00029511764,0.0003812546,0.00044881372,0.0010714324,0.0001050065,0.00023200912,0.00023524444,0.0002161514,0.0011806745],"category_scores_gemma":[0.00010406245,0.0004036085,0.0003034689,0.0015221832,0.000032687134,0.00033516085,0.00004616762,0.00060583925,0.000029312607],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000022782013,0.00016717958,0.049926687,0.0005490216,0.000337185,0.00019036264,0.0013122602,0.021625265,0.27597147,0.00476865,0.0030489548,0.6420802],"study_design_scores_gemma":[0.00044987767,0.00003744142,0.00062629307,0.00042281265,0.000380711,0.00000995673,0.00080465834,0.9701712,0.024488699,0.0004841784,0.0016592225,0.00046495],"about_ca_topic_score_codex":0.0018408493,"about_ca_topic_score_gemma":0.001733891,"teacher_disagreement_score":0.94854593,"about_ca_system_score_codex":0.0003984624,"about_ca_system_score_gemma":0.00011738055,"threshold_uncertainty_score":0.9998416},"labels":[],"label_agreement":null}]}