{"meta":{"query_hash":"1c9da4a648c1","filters":{"venue":"2016 6th Electronic System-Integration Technology Conference (ESTC)"},"cohort_total":3,"direct_labels_cover":0,"predictions_cover":3,"exported":3,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/1c9da4a648c1","api":"https://metacan.xera.ac/api/v1/cohort?venue=2016+6th+Electronic+System-Integration+Technology+Conference+%28ESTC%29"},"results":[{"id":"W2561275360","doi":"10.1109/estc.2016.7764500","title":"Thin micro-cold plate for hot-spot aware chip cooling","year":2016,"lang":"en","type":"article","venue":"2016 6th Electronic System-Integration Technology Conference (ESTC)","topic":"Heat Transfer and Optimization","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Hot spot (computer programming); Chip; Materials science; Computer science; Telecommunications; Operating system","score_opus":0.009704015304325495,"score_gpt":0.2128841259958778,"score_spread":0.2031801106915523,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2561275360","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22145098,0.0070082056,0.73638177,0.00055544125,0.0016187972,0.00045922663,0.0005340908,0.004908202,0.027083265],"genre_scores_gemma":[0.62354547,0.0018993289,0.344302,0.00035926694,0.00027192803,0.00034968532,0.00037386327,0.00042086,0.028477546],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99958843,0.000033758966,0.000010711377,0.000095634765,0.00022933648,0.000042029907],"domain_scores_gemma":[0.9997012,0.000066901004,0.000042799824,0.00007197768,0.00009268941,0.000024330317],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017983036,0.00075528724,0.0006672003,0.00041723464,0.00040594063,0.00057623896,0.001865782,0.0008144699,0.0034183785],"category_scores_gemma":[0.00029386385,0.00052763376,0.00037207222,0.0002022129,0.000579541,0.0006911736,0.00066649367,0.0008580695,0.0021487693],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007045885,0.000028157008,0.00013291916,0.00023304846,0.000022591634,0.00016020668,0.000057531906,0.0030274307,0.97895986,0.0023076066,0.0011830425,0.013817109],"study_design_scores_gemma":[0.000018213363,0.00023830408,0.000704395,0.000027652444,0.00003612941,0.00029500414,0.000025635476,0.030659806,0.95080376,0.00032323974,0.016815595,0.000052167903],"about_ca_topic_score_codex":0.0007078204,"about_ca_topic_score_gemma":0.0013836491,"teacher_disagreement_score":0.0034183785,"about_ca_system_score_codex":0.00051756075,"about_ca_system_score_gemma":0.0005132743,"threshold_uncertainty_score":0.011435628},"labels":[],"label_agreement":null},{"id":"W2562344022","doi":"10.1109/estc.2016.7764473","title":"Design of a GaN HEMT based inverter leg power module for aeronautic applications","year":2016,"lang":"en","type":"preprint","venue":"2016 6th Electronic System-Integration Technology Conference (ESTC)","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"","keywords":"EMI; Decoupling (probability); High-electron-mobility transistor; Inverter; Capacitor; Component (thermodynamics); Electronic component; Power (physics); Transistor; Electrical engineering; Computer science; Thermal; Power module; Electronic engineering; Materials science; Engineering; Electromagnetic interference; Control engineering; Physics; Voltage","score_opus":0.01947452148402267,"score_gpt":0.23589141473783884,"score_spread":0.21641689325381616,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2562344022","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3248572,0.00077586656,0.6276037,0.00036793578,0.00020476962,0.0003886404,0.0006532708,0.0017989359,0.043349586],"genre_scores_gemma":[0.84372854,0.0003871509,0.14154136,0.00013622144,0.000057822876,0.00022372283,0.00034916968,0.00017272834,0.013403339],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999505,0.000004843735,0.000001819242,0.000011739644,0.000022178594,0.00000896586],"domain_scores_gemma":[0.9999721,0.0000032060773,0.0000053186186,0.0000032238968,0.00001172855,0.0000044312733],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000049203456,0.00022223045,0.00023435382,0.00014088712,0.00014577081,0.0003083375,0.00055662444,0.00034205124,0.0021875238],"category_scores_gemma":[0.00006296523,0.00013872367,0.00025195192,0.0001234772,0.00007452204,0.00017728763,0.00014077256,0.00018609175,0.00079104817],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000101254096,0.000082641185,0.0011714442,0.00040183114,0.00010125361,0.0005240107,0.00012298548,0.028018383,0.9014681,0.00435541,0.0029637269,0.060689013],"study_design_scores_gemma":[0.0001649373,0.0020468438,0.0118954675,0.00007004455,0.00020681578,0.0025971092,0.000100180725,0.2866945,0.5917331,0.0028352155,0.10159341,0.000062342064],"about_ca_topic_score_codex":0.00016371802,"about_ca_topic_score_gemma":0.00025397906,"teacher_disagreement_score":0.0021875238,"about_ca_system_score_codex":0.00018872727,"about_ca_system_score_gemma":0.0002038069,"threshold_uncertainty_score":0.0073179603},"labels":[],"label_agreement":null},{"id":"W2563205948","doi":"10.1109/estc.2016.7764520","title":"Ba<inf>1−x</inf>Sr<inf>x</inf>TiO<inf>3</inf> (x =0.4) nanoparticles dispersion for 3D integration of decoupling capacitors on glass interposer","year":2016,"lang":"en","type":"article","venue":"2016 6th Electronic System-Integration Technology Conference (ESTC)","topic":"Ferroelectric and Piezoelectric Materials","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Nanoparticle; Materials science; Capacitor; Analytical Chemistry (journal); Nanotechnology; Chemistry; Electrical engineering; Organic chemistry; Engineering","score_opus":0.0135169652334842,"score_gpt":0.2395712372417721,"score_spread":0.2260542720082879,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2563205948","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.24609537,0.0037166672,0.13869087,0.0034821087,0.002005657,0.00033036375,0.00560779,0.012941107,0.58713007],"genre_scores_gemma":[0.3377193,0.0018282952,0.08167577,0.0004460907,0.00014819227,0.00025287538,0.004675212,0.002373536,0.5708808],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983585,0.000009919842,0.0000040735813,0.00004785356,0.00007880379,0.00002349112],"domain_scores_gemma":[0.99984944,0.000013145546,0.000025008869,0.00003526311,0.000054904063,0.000022133672],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021488099,0.00047664513,0.00026558226,0.00042547696,0.0005283373,0.00077486475,0.00057987915,0.00065582385,0.056750767],"category_scores_gemma":[0.00019358844,0.0002884612,0.0001970529,0.0004206883,0.000278224,0.0004470486,0.00037224093,0.0006531965,0.034087572],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00018142606,0.000064916574,0.00030814676,0.00013739418,0.00000714227,0.00009926577,0.00007634131,0.00057501625,0.93123966,0.008867441,0.019128406,0.039314885],"study_design_scores_gemma":[0.000032513075,0.0001798179,0.0031569772,0.000023919056,0.0000107585265,0.00018341906,0.000046791018,0.004897588,0.68090606,0.001022446,0.30951333,0.000026311114],"about_ca_topic_score_codex":0.0033679425,"about_ca_topic_score_gemma":0.0042117625,"teacher_disagreement_score":0.056750767,"about_ca_system_score_codex":0.0013216888,"about_ca_system_score_gemma":0.00037514218,"threshold_uncertainty_score":0.18985027},"labels":[],"label_agreement":null}]}