{"meta":{"query_hash":"45c3e2e610a5","filters":{"venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)"},"cohort_total":7,"direct_labels_cover":0,"predictions_cover":7,"exported":7,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/45c3e2e610a5","api":"https://metacan.xera.ac/api/v1/cohort?venue=2022+IEEE+72nd+Electronic+Components+and+Technology+Conference+%28ECTC%29"},"results":[{"id":"W4285102970","doi":"10.1109/ectc51906.2022.00111","title":"Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Physical Unclonable Functions (PUFs) and Hardware Security","field":"Computer Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Hardware security module; Obfuscation; Overhead (engineering); Scalability; Benchmark (surveying); Computer science; Embedded system; Integrated circuit; Interconnection; Electronic circuit; Computer hardware; Engineering; Cryptography; Computer network; Electrical engineering; Computer security; Operating system","score_opus":0.04726548351358646,"score_gpt":0.26437981793209486,"score_spread":0.21711433441850841,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285102970","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.53396684,0.0012556802,0.44802287,0.00029757415,0.00011502299,0.0001786397,0.00024200765,0.0042443075,0.011677168],"genre_scores_gemma":[0.93765116,0.00025006005,0.0598455,0.00004714594,0.000012183891,0.000039364302,0.00011318765,0.00006529935,0.0019761475],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99973804,0.00003244132,0.000013657988,0.000043182456,0.00011131279,0.00006136932],"domain_scores_gemma":[0.9993968,0.00009368267,0.0002052556,0.00022836983,0.00005512585,0.000020646581],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002686472,0.000430338,0.0002032703,0.00051818887,0.00024785878,0.00038040878,0.0007029568,0.00029456508,0.0014413986],"category_scores_gemma":[0.00047666172,0.0001592453,0.00030672085,0.00026553925,0.00041855083,0.0007958092,0.000608215,0.00034986378,0.0003221179],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004622214,0.00018764571,0.0054330677,0.0005285685,0.0001486366,0.0009005584,0.000280038,0.0683275,0.691508,0.020002441,0.0027724197,0.20944895],"study_design_scores_gemma":[0.000052584008,0.0017177004,0.0031261146,0.00005273598,0.0000920138,0.0012892253,0.00010324041,0.17937756,0.7921111,0.0045415694,0.017492913,0.000043262597],"about_ca_topic_score_codex":0.00027355365,"about_ca_topic_score_gemma":0.00042255037,"teacher_disagreement_score":0.0014413986,"about_ca_system_score_codex":0.0003005083,"about_ca_system_score_gemma":0.0003909872,"threshold_uncertainty_score":0.004821956},"labels":[],"label_agreement":null},{"id":"W4285102986","doi":"10.1109/ectc51906.2022.00105","title":"Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Materials science; Soldering; Direct bonding; Bridge (graph theory); Silicon; Electrical conductor; Characterization (materials science); Thermocompression bonding; Composite material; Through-silicon via; Integrated circuit packaging; Stress (linguistics); Joint (building); Nanotechnology; Structural engineering; Optoelectronics; Integrated circuit; Layer (electronics); Engineering","score_opus":0.015213909154068617,"score_gpt":0.22614572190750018,"score_spread":0.21093181275343156,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285102986","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9942304,0.0002917566,0.004581745,0.000015932112,0.0000129015025,0.000040957082,0.00008488285,0.000036707563,0.00070472335],"genre_scores_gemma":[0.9916841,0.00020375801,0.0070358017,0.000019058949,0.000005172286,0.000060788192,0.00008017257,0.000026683429,0.0008844398],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997944,0.000023082186,0.000011323444,0.000050192568,0.00010298807,0.00001797075],"domain_scores_gemma":[0.9997086,0.00007702982,0.000062186235,0.000031731044,0.00009601402,0.000024343146],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023021502,0.000278276,0.00017698259,0.00022783618,0.00012410317,0.00020835438,0.00023193726,0.00029674455,0.0005402415],"category_scores_gemma":[0.0004532127,0.00019958749,0.00011892896,0.0001640235,0.00019880536,0.00021876645,0.000122685,0.00020225628,0.00015544814],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000075431285,0.0000065446957,0.00013132756,0.000016528413,0.0000016308757,0.000025063631,0.000018478684,0.00006797173,0.9990761,0.000012517095,0.000008716934,0.000627522],"study_design_scores_gemma":[0.0000025458703,0.00016643779,0.003569404,0.0000026947102,0.000010729509,0.00006005336,0.000024973779,0.00082711305,0.9950635,0.0000057552647,0.00026412014,0.0000027602657],"about_ca_topic_score_codex":0.00025334832,"about_ca_topic_score_gemma":0.00084423245,"teacher_disagreement_score":0.0005402415,"about_ca_system_score_codex":0.00012339505,"about_ca_system_score_gemma":0.0001394563,"threshold_uncertainty_score":0.0018072128},"labels":[],"label_agreement":null},{"id":"W4285103126","doi":"10.1109/ectc51906.2022.00188","title":"Low Temperature Formation of SAC-SnBi BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; IBM (Canada); Université de Sherbrooke","funders":"","keywords":"Eutectic system; Materials science; Soldering; Ball grid array; Homogeneous; Brittleness; Metallurgy; Composite material; Solder paste; Microstructure; Thermodynamics","score_opus":0.012777996482991718,"score_gpt":0.2256502112872095,"score_spread":0.21287221480421778,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285103126","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94841194,0.00061468605,0.04755876,0.00006647693,0.000031000203,0.00007513159,0.000104866835,0.00061447825,0.0025227338],"genre_scores_gemma":[0.95873696,0.00023240973,0.03925094,0.000018785884,0.000007448929,0.000041851206,0.00013512299,0.00006601736,0.001510448],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998549,0.000013463109,0.000010316028,0.000042098003,0.000058758527,0.000020310259],"domain_scores_gemma":[0.9998964,0.000010079032,0.000037964157,0.000019168752,0.000021304373,0.000015116286],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015783458,0.0003878906,0.00028130846,0.00031298262,0.0001692538,0.0003396118,0.00035437924,0.00022651104,0.00057742896],"category_scores_gemma":[0.0001701694,0.00025223722,0.00021380192,0.00015457105,0.00021990557,0.0004436957,0.0005514254,0.00033289485,0.00057970284],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008482389,0.000006843212,0.00015861864,0.000018931167,0.0000016768811,0.000019951163,0.000017001536,0.00012649666,0.9975193,0.00013909859,0.000018583072,0.0019650962],"study_design_scores_gemma":[0.0000031662817,0.00007635594,0.00046107898,0.0000010662446,0.0000030014455,0.00005968265,0.0000063354055,0.0013640007,0.9969252,0.000019295609,0.0010783395,0.0000024566707],"about_ca_topic_score_codex":0.00035922055,"about_ca_topic_score_gemma":0.0009936577,"teacher_disagreement_score":0.00057742896,"about_ca_system_score_codex":0.00025606452,"about_ca_system_score_gemma":0.0001992196,"threshold_uncertainty_score":0.0019316673},"labels":[],"label_agreement":null},{"id":"W4285103141","doi":"10.1109/ectc51906.2022.00224","title":"Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Université de Sherbrooke","funders":"","keywords":"Curing (chemistry); Materials science; Flip chip; Electrical conductor; Composite material; Adhesive; Electrical resistivity and conductivity; Optoelectronics; Polymerization; Radiation; Thermal conductivity; Thermal; Wavelength; Polymer; Electrical engineering; Optics","score_opus":0.012989569062185612,"score_gpt":0.20724456119720058,"score_spread":0.19425499213501496,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285103141","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9217444,0.0022820143,0.07036531,0.00008223275,0.00009671041,0.00007277716,0.00011206212,0.00034694176,0.004897556],"genre_scores_gemma":[0.9517738,0.00086621224,0.044241797,0.000046734927,0.00002410025,0.00004810565,0.00007108917,0.00006828257,0.0028598707],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997712,0.000033410746,0.000013853461,0.000052523294,0.000100881036,0.00002822195],"domain_scores_gemma":[0.99962616,0.00010327906,0.00013034459,0.000049606977,0.00007105641,0.000019561452],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022523072,0.00039060312,0.00020297342,0.00028905808,0.00017986826,0.00033769006,0.00030588824,0.0002211415,0.00095640233],"category_scores_gemma":[0.000522813,0.00017942359,0.00017667876,0.00021753593,0.00022310644,0.0002819795,0.00025805118,0.00051826716,0.0003127917],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010239685,0.000004820597,0.00009022244,0.000034923323,0.0000018382922,0.00004131145,0.000016291313,0.00014385764,0.99661654,0.00009803964,0.000024734863,0.0029172057],"study_design_scores_gemma":[0.0000025772808,0.00013856754,0.00125356,0.000004782151,0.0000064935357,0.00017023647,0.000009720714,0.0007653039,0.9961648,0.000024330297,0.0014549701,0.0000046629866],"about_ca_topic_score_codex":0.00015543983,"about_ca_topic_score_gemma":0.0003753341,"teacher_disagreement_score":0.00095640233,"about_ca_system_score_codex":0.00013220047,"about_ca_system_score_gemma":0.00017768363,"threshold_uncertainty_score":0.0031995177},"labels":[],"label_agreement":null},{"id":"W4285103217","doi":"10.1109/ectc51906.2022.00112","title":"A Self-Aligned Structure based on V-groove for Accurate Silicon Bridge Placement","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Modular Robots and Swarm Intelligence","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Silicon; Bridge (graph theory); Materials science; Substrate (aquarium); Groove (engineering); Optoelectronics; Interposer; Diode; Die (integrated circuit); Layer (electronics); Composite material; Etching (microfabrication); Nanotechnology; Metallurgy","score_opus":0.01350813181329197,"score_gpt":0.22479035439136744,"score_spread":0.21128222257807547,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285103217","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7759024,0.00078417774,0.21261923,0.00016578789,0.00024658028,0.00010830578,0.00018568161,0.0015186568,0.008469229],"genre_scores_gemma":[0.9079727,0.00015877179,0.08928072,0.000054796274,0.000024746054,0.00004913246,0.00011007107,0.00004039684,0.0023085917],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998785,0.0000086982145,0.0000066314033,0.000037280006,0.000051026967,0.000017769979],"domain_scores_gemma":[0.9998128,0.000011708667,0.00006052222,0.000045085544,0.000049871986,0.000020059186],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010189086,0.00026457792,0.00022416232,0.00024951427,0.00014138425,0.00026188503,0.0008915875,0.00050937495,0.0006000798],"category_scores_gemma":[0.0002088811,0.00022052685,0.00018171623,0.00019606594,0.00019634096,0.0003193062,0.00040150667,0.00025615413,0.0006080904],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003193408,0.000033344328,0.00092246284,0.000053981326,0.000011109355,0.00016104401,0.0000793571,0.0015010108,0.97488767,0.002203129,0.00050271547,0.019612242],"study_design_scores_gemma":[0.00008374429,0.0014629277,0.0054409695,0.00002274493,0.00003600396,0.0010021862,0.00013180546,0.08125791,0.89282167,0.0009245533,0.016763033,0.00005236757],"about_ca_topic_score_codex":0.0004039728,"about_ca_topic_score_gemma":0.0008892633,"teacher_disagreement_score":0.0008915875,"about_ca_system_score_codex":0.00018494831,"about_ca_system_score_gemma":0.00025619566,"threshold_uncertainty_score":0.0020074248},"labels":[],"label_agreement":null},{"id":"W4285103247","doi":"10.1109/ectc51906.2022.00104","title":"Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Semiconductor Lasers and Optical Devices","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nexen (Canada)","funders":"National Research Foundation of Korea; Korea Evaluation Institute of Industrial Technology; Electronics and Telecommunications Research Institute","keywords":"Materials science; Composite material; Soldering; Adhesive; Substrate (aquarium); Polyimide; Thermosetting polymer; Polyethylene terephthalate; Bending; Light-emitting diode; Wire bonding; Transfer molding; Optoelectronics; Mold; Chip; Layer (electronics)","score_opus":0.013661202666932538,"score_gpt":0.22460448957688722,"score_spread":0.21094328690995467,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285103247","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95855016,0.00023192476,0.037049968,0.00006618314,0.00009273553,0.00006533452,0.00014146227,0.0007329331,0.0030692723],"genre_scores_gemma":[0.924075,0.00018087607,0.06934386,0.00005889539,0.00002656031,0.00012737805,0.00016569842,0.000120972334,0.005900746],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99980265,0.000011263395,0.000010309077,0.00006954828,0.00006610308,0.000040159284],"domain_scores_gemma":[0.99984944,0.00002160635,0.000028381248,0.000048851878,0.000033006138,0.00001870987],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015142755,0.0005142596,0.00032424196,0.0003217011,0.00023809499,0.0002979312,0.0004896534,0.00028988213,0.002650075],"category_scores_gemma":[0.00023324435,0.00039499128,0.00036323705,0.00020885342,0.00018916721,0.00043378136,0.0005756151,0.00039927187,0.00067026686],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000022449145,0.000018564764,0.0001968721,0.000023751827,0.000004972115,0.000107012806,0.0000460677,0.00022974247,0.9931258,0.00012077782,0.00011058374,0.0059933676],"study_design_scores_gemma":[0.000007789041,0.00028922874,0.0027856336,0.0000034839966,0.0000132763835,0.000292462,0.000043557582,0.003324548,0.99085146,0.00008533733,0.0022888868,0.000014411061],"about_ca_topic_score_codex":0.0003858818,"about_ca_topic_score_gemma":0.0007671239,"teacher_disagreement_score":0.002650075,"about_ca_system_score_codex":0.00016561818,"about_ca_system_score_gemma":0.0001960211,"threshold_uncertainty_score":0.008865416},"labels":[],"label_agreement":null},{"id":"W4285103331","doi":"10.1109/ectc51906.2022.00004","title":"Table of Contents","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Diverse Scientific and Economic Studies","field":"Economics, Econometrics and Finance","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Hanbat National University; Indian Institute of Technology Kanpur; Indian Institute of Science; Université de Sherbrooke; National Chiao Tung University; University of Chicago; Shanghai Educational Development Foundation; Auburn University; Electronics and Telecommunications Research Institute; Portland State University","keywords":"Table (database); Computer science; Table of contents; Database; World Wide Web","score_opus":0.03224608955815365,"score_gpt":0.19703677144062492,"score_spread":0.16479068188247128,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285103331","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00046377524,0.0031874415,0.0022210237,0.0034010252,0.0094813695,0.000685254,0.066226795,0.0024070158,0.9119263],"genre_scores_gemma":[0.002074156,0.0028698435,0.0016392284,0.002679183,0.0021974319,0.00055066403,0.04582021,0.0010458825,0.94112337],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99931836,0.00008298951,0.0000329976,0.00011167566,0.00039045006,0.000063477775],"domain_scores_gemma":[0.99673235,0.00060910743,0.00012644511,0.0002969844,0.001771942,0.00046318877],"candidate_categories":["insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0006410729,0.0010595743,0.0009035247,0.0045433114,0.0016738893,0.004210109,0.001424964,0.0010180436,0.88117576],"category_scores_gemma":[0.007449924,0.00032680322,0.0005997662,0.0033009094,0.00034149503,0.001895054,0.0017696096,0.0011602527,0.83440065],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001606385,0.000023141321,0.00012305035,0.00013512735,0.0000029159157,0.000015458947,0.000009713196,0.000067128065,0.000080030084,0.0008790352,0.95747685,0.0411715],"study_design_scores_gemma":[0.000007615899,0.000013220705,0.00033162837,0.00018198097,0.0000041229528,0.0000291429,0.000030199903,0.000042239168,0.000086779975,0.0009767832,0.9982907,0.000005526093],"about_ca_topic_score_codex":0.0059630633,"about_ca_topic_score_gemma":0.0077588395,"teacher_disagreement_score":0.11882424,"about_ca_system_score_codex":0.0017888084,"about_ca_system_score_gemma":0.003166134,"threshold_uncertainty_score":0.16948831},"labels":[],"label_agreement":null}]}