{"meta":{"query_hash":"b13991d8262c","filters":{"venue":"Harsh Environments Conference"},"cohort_total":2,"direct_labels_cover":0,"predictions_cover":2,"exported":2,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/b13991d8262c","api":"https://metacan.xera.ac/api/v1/cohort?venue=Harsh+Environments+Conference"},"results":[{"id":"W4416884148","doi":"10.37665/hazblcz89064","title":"The Remarkable Return of Post-Reflow Cleaning as a Mainstream Process to Improve Reliability","year":2023,"lang":"","type":"article","venue":"Harsh Environments Conference","topic":"Polymer Science and PVC","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Mainstream; Montreal Protocol; Process (computing); Reliability (semiconductor); Order (exchange); Work (physics); Subject (documents); Treaty","score_opus":0.014564743859305063,"score_gpt":0.26187711607125314,"score_spread":0.24731237221194807,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884148","genre_codex":"commentary","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.037476465,0.09992378,0.17199436,0.36286592,0.03827957,0.00042864733,0.0014917884,0.0053855428,0.28215393],"genre_scores_gemma":[0.37128294,0.09460998,0.14461067,0.15189923,0.015443654,0.0004360971,0.0016700879,0.0038440223,0.21620336],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9919944,0.0011046224,0.00025092126,0.00091925496,0.0050597205,0.000671038],"domain_scores_gemma":[0.9798157,0.003906815,0.00086231786,0.0032408964,0.010811573,0.0013626392],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.012641335,0.00080392003,0.0005002069,0.0011182225,0.001870562,0.004954173,0.0023604252,0.0046276487,0.01609498],"category_scores_gemma":[0.015734436,0.00037089348,0.0008892289,0.0010708281,0.0047311927,0.006799341,0.0027051277,0.00699756,0.007034631],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022492133,0.00028733193,0.0010703665,0.0011396077,0.00005926142,0.00030711776,0.00092558586,0.0017153185,0.01909943,0.28439018,0.25220385,0.4385771],"study_design_scores_gemma":[0.000020640411,0.00030855607,0.0009839821,0.00032883973,0.000014941338,0.00019446123,0.00025466282,0.0007612045,0.009983575,0.02446975,0.9626393,0.00004007408],"about_ca_topic_score_codex":0.0045013446,"about_ca_topic_score_gemma":0.0051972265,"teacher_disagreement_score":0.01609498,"about_ca_system_score_codex":0.0043230746,"about_ca_system_score_gemma":0.0053218366,"threshold_uncertainty_score":0.066854596},"labels":[],"label_agreement":null},{"id":"W7108215830","doi":"10.37665/hamigfs85311","title":"Latest Results on Pb-Free Solder Alloys for Harsh Environments","year":2018,"lang":"","type":"article","venue":"Harsh Environments Conference","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Computer Research Institute of Montréal","funders":"","keywords":"Soldering; Creep; Alloy; Recrystallization (geology); Reliability (semiconductor); Thermal fatigue; Electronics; Wetting","score_opus":0.030799409851805484,"score_gpt":0.23347441837772032,"score_spread":0.20267500852591483,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108215830","genre_codex":"review","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.13713337,0.7524018,0.02774852,0.001718523,0.0028772366,0.00018505736,0.0010577966,0.0003051049,0.07657249],"genre_scores_gemma":[0.3297483,0.57845455,0.024088666,0.0010694333,0.0020261093,0.00014815695,0.0036070338,0.00023764934,0.060620096],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99913293,0.00012393363,0.0001206089,0.00020292062,0.0003289583,0.000090591486],"domain_scores_gemma":[0.99851304,0.00028737224,0.00014194951,0.000101410944,0.00087734865,0.00007880316],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0023828174,0.0007409503,0.0006641643,0.0011042304,0.00026836206,0.0012748464,0.00071044115,0.00088272913,0.0041303947],"category_scores_gemma":[0.0013546648,0.00031943346,0.0006140718,0.0016581868,0.0003934642,0.0014019262,0.0004675466,0.0006397024,0.0025196222],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.002493941,0.00051095366,0.0034477815,0.010208374,0.0003865582,0.0005838344,0.00052007765,0.0054785525,0.23303902,0.0056416197,0.016539328,0.7211498],"study_design_scores_gemma":[0.000069016685,0.0040581194,0.0066655735,0.0007339767,0.000767437,0.0010932456,0.0003923385,0.0016834358,0.33196443,0.0011382167,0.65138,0.000054069154],"about_ca_topic_score_codex":0.0009472774,"about_ca_topic_score_gemma":0.0012582775,"teacher_disagreement_score":0.0041303947,"about_ca_system_score_codex":0.00047598497,"about_ca_system_score_gemma":0.000766689,"threshold_uncertainty_score":0.013817549},"labels":[],"label_agreement":null}]}