{"meta":{"query_hash":"c547e8b0c111","filters":{"venue":"I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems"},"cohort_total":4,"direct_labels_cover":0,"predictions_cover":4,"exported":4,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/c547e8b0c111","api":"https://metacan.xera.ac/api/v1/cohort?venue=I-THERM+%3A%2FI-THERM+-+Intersociety+Conference+on+Thermal+Phenomena+in+Electronic+Systems"},"results":[{"id":"W1992060174","doi":"10.1109/itherm.2008.4544376","title":"Hierarchical modeling of heat transfer in silicon-based electronic devices","year":2008,"lang":"en","type":"article","venue":"I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems","topic":"Thermal properties of materials","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Miniaturization; Electronics; Boltzmann equation; Reliability (semiconductor); Thermal conductivity; Heat transfer; Computer science; Phonon; Electronic engineering; Materials science; Statistical physics; Nanotechnology; Physics; Electrical engineering; Mechanics; Engineering; Condensed matter physics","score_opus":0.030698581878251117,"score_gpt":0.2383047023493335,"score_spread":0.2076061204710824,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1992060174","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99239427,0.0018175818,0.0004384889,0.00028244618,0.00038968786,0.0014368128,0.000050430495,0.00019379781,0.00299651],"genre_scores_gemma":[0.99849105,0.00016573144,0.000015737118,0.00042282074,0.00024613494,0.00036402748,0.000020383948,0.00016131208,0.0001127874],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99259484,0.001048156,0.0018046596,0.0012268202,0.0009045297,0.0024210059],"domain_scores_gemma":[0.99820566,0.0002580366,0.00020070365,0.00094691315,0.00018874832,0.0001999221],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0020324383,0.00088425266,0.001517974,0.00028330027,0.00017845196,0.00012678497,0.0016819047,0.0004413081,0.00182217],"category_scores_gemma":[0.000042596068,0.00077109045,0.00033644948,0.00038077953,0.0005425685,0.00046224814,0.000106218824,0.001077695,0.00023950519],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0015819088,0.00064606935,0.00044994525,0.00027103777,0.00008826738,0.000016346441,0.0050758035,0.10367799,0.88209456,0.0057434444,0.00001133883,0.00034330957],"study_design_scores_gemma":[0.015442895,0.005922954,0.0014795044,0.0037956275,0.00013325881,0.00010901246,0.007051794,0.6533418,0.3063699,0.0010973267,0.00060439634,0.004651516],"about_ca_topic_score_codex":0.0026409754,"about_ca_topic_score_gemma":0.0004067332,"teacher_disagreement_score":0.57572466,"about_ca_system_score_codex":0.0014866064,"about_ca_system_score_gemma":0.0011833375,"threshold_uncertainty_score":0.999474},"labels":[],"label_agreement":null},{"id":"W2003744067","doi":"10.1109/itherm.2008.4544274","title":"Development of a high-accuracy thermal interface material tester","year":2008,"lang":"en","type":"article","venue":"I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems","topic":"Thermal properties of materials","field":"Materials Science","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"University of Waterloo","keywords":"Thermistor; Thermal conductivity; Thermal resistance; Electrical impedance; Measurement uncertainty; Thermal; Materials science; Sensitivity (control systems); Thermal conductivity measurement; Measure (data warehouse); Thermal grease; Interface (matter); Electricity meter; Temperature measurement; Metre; Acoustics; Power (physics); Mechanical engineering; Electrical engineering; Electronic engineering; Computer science; Engineering; Physics; Composite material; Thermodynamics; Contact angle","score_opus":0.03170663742294606,"score_gpt":0.24493502342690646,"score_spread":0.21322838600396038,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2003744067","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99144787,0.00047091072,0.00014982841,0.00012742383,0.0017095634,0.0015436145,0.00011005161,0.00030407123,0.004136681],"genre_scores_gemma":[0.9973794,0.000054762506,0.00030846716,0.00019855647,0.00058180216,0.0004391594,0.000030987132,0.00021286009,0.0007939975],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99261105,0.00075527217,0.0022236023,0.0012931933,0.0010361834,0.0020806985],"domain_scores_gemma":[0.99678093,0.000219897,0.0012323147,0.0012303278,0.0002927606,0.00024379551],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0017291835,0.0010932366,0.0016006476,0.0001961085,0.00032986037,0.0002593175,0.002186752,0.000435345,0.006342454],"category_scores_gemma":[0.00007512166,0.0009088108,0.00025683054,0.00025871152,0.0006896879,0.0007313779,0.0004624186,0.00065675384,0.0011757007],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0015418879,0.0005235677,0.00008772769,0.00021281053,0.00017394814,0.000016676613,0.014429381,0.0011025113,0.97747153,0.0017871266,0.000092241295,0.002560612],"study_design_scores_gemma":[0.004036653,0.0013508883,0.0020052898,0.0012420393,0.00005581732,0.00008925094,0.004660966,0.00061911746,0.9811007,0.0001326999,0.0026323015,0.0020743213],"about_ca_topic_score_codex":0.00091531395,"about_ca_topic_score_gemma":0.000051452196,"teacher_disagreement_score":0.009768416,"about_ca_system_score_codex":0.0012431346,"about_ca_system_score_gemma":0.00091289304,"threshold_uncertainty_score":0.999602},"labels":[],"label_agreement":null},{"id":"W2036857315","doi":"10.1109/itherm.2008.4544304","title":"Transient thermal characterization with applications to optimized thermal packaging of multi-core microprocessors","year":2008,"lang":"en","type":"article","venue":"I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems","topic":"Thermal properties of materials","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Transient (computer programming); Thermal; Characterization (materials science); Transient analysis; Core (optical fiber); Computer science; Materials science; Reliability engineering; Engineering; Electrical engineering; Transient response; Operating system; Telecommunications; Nanotechnology","score_opus":0.036037713039494,"score_gpt":0.24723847995105475,"score_spread":0.21120076691156076,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2036857315","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99043316,0.00032452625,0.0035307894,0.0002607634,0.0003072943,0.0032017527,0.00016222692,0.0002808235,0.0014986777],"genre_scores_gemma":[0.99655914,0.00007203762,0.00040927753,0.00036932676,0.00031385393,0.0013488655,0.000065482745,0.00021741643,0.0006445891],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9943266,0.0005005356,0.0014291301,0.0012493398,0.00083496113,0.0016594323],"domain_scores_gemma":[0.99723387,0.00010688644,0.0008957884,0.0010717716,0.0004159033,0.0002757787],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0012012817,0.00092373637,0.0012928534,0.00022284244,0.0003284157,0.00017536679,0.0015073372,0.00029998945,0.0011793644],"category_scores_gemma":[0.000020665822,0.0007319118,0.00022902193,0.00046722445,0.00054179825,0.00056952547,0.00014941212,0.00055520417,0.00034990732],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0016545138,0.0006219884,0.0002447448,0.00020058846,0.00014145339,0.000009014467,0.012941779,0.012619552,0.9692008,0.00069845497,0.00000962114,0.0016574707],"study_design_scores_gemma":[0.016210755,0.0045753024,0.013153304,0.0029251145,0.000265536,0.00016104302,0.011553106,0.013676757,0.93046,0.000039791776,0.001972114,0.0050071822],"about_ca_topic_score_codex":0.00045458713,"about_ca_topic_score_gemma":0.000025467694,"teacher_disagreement_score":0.03874083,"about_ca_system_score_codex":0.0006941583,"about_ca_system_score_gemma":0.00049432786,"threshold_uncertainty_score":0.9997337},"labels":[],"label_agreement":null},{"id":"W2076295025","doi":"10.1109/itherm.2008.4544347","title":"Effect of integrated heat spreader on thermal performance and bump joint reliability for flip chip packages","year":2008,"lang":"en","type":"article","venue":"I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Heat spreader; Flip chip; Materials science; Soldering; Thermal grease; Composite material; Thermal; Joint (building); Reliability (semiconductor); Electronic packaging; Heat sink; Integrated circuit packaging; Mechanical engineering; Structural engineering; Layer (electronics); Thermal conductivity; Engineering; Integrated circuit; Optoelectronics; Thermodynamics","score_opus":0.01654936836482215,"score_gpt":0.2193801874118187,"score_spread":0.20283081904699654,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2076295025","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9927532,0.0015240285,0.00025722012,0.00011415605,0.0003038597,0.0014498405,0.000037719186,0.0007072377,0.0028527188],"genre_scores_gemma":[0.9981807,0.0007756331,0.000021500256,0.00004219726,0.00013097345,0.00049758476,0.000021257669,0.00013860666,0.00019158037],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99644554,0.00026742677,0.0007825215,0.00074323546,0.00036318263,0.0013981116],"domain_scores_gemma":[0.9984058,0.00038706718,0.00017312492,0.00082572125,0.00009949945,0.00010877236],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0012429684,0.00079365773,0.0011102088,0.00019770894,0.00017446588,0.00005748712,0.0006188834,0.00041191315,0.00003384447],"category_scores_gemma":[0.00007687003,0.0006361538,0.00025017906,0.00031201894,0.00044869204,0.00018678461,0.000064293556,0.0012032863,0.000014631428],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0036727071,0.0010355167,0.013144088,0.005350987,0.0021409614,0.000022195065,0.022017485,0.14800565,0.711934,0.009524532,0.0008058481,0.08234605],"study_design_scores_gemma":[0.01072997,0.021182777,0.011423991,0.004572099,0.00020020713,0.000106641826,0.0035136133,0.5954323,0.34759313,0.00051784865,0.0010767679,0.0036506846],"about_ca_topic_score_codex":0.00019817983,"about_ca_topic_score_gemma":0.0000130524095,"teacher_disagreement_score":0.44742662,"about_ca_system_score_codex":0.0010045388,"about_ca_system_score_gemma":0.0001583951,"threshold_uncertainty_score":0.999609},"labels":[],"label_agreement":null}]}