{"meta":{"query_hash":"e4741a582e83","filters":{"venue":"IEEE Transactions on Components Packaging and Manufacturing Technology"},"cohort_total":106,"direct_labels_cover":0,"predictions_cover":106,"exported":106,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/e4741a582e83","api":"https://metacan.xera.ac/api/v1/cohort?venue=IEEE+Transactions+on+Components+Packaging+and+Manufacturing+Technology"},"results":[{"id":"W1965715476","doi":"10.1109/tcpmt.2014.2300842","title":"Reduction of Electromagnetic Radiation from Apertures and Enclosures Using Electromagnetic Bandgap Structures","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Antenna and Metasurface Technologies","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Sultan Qaboos University","keywords":"Electromagnetic radiation; Aperture (computer memory); Enclosure; Optics; Near and far field; Radiation; Electromagnetic field; Metamaterial; Reduction (mathematics); Electromagnetic spectrum; Parametric statistics; Radiation properties; Physics; Materials science; Acoustics; Computer science; Telecommunications","score_opus":0.009091333398006296,"score_gpt":0.210352672930902,"score_spread":0.2012613395328957,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1965715476","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.90555996,0.0011764928,0.09200304,0.00011916584,0.00025711392,0.00012984233,0.000008393245,0.0007305573,0.000015435795],"genre_scores_gemma":[0.9912416,0.0010962605,0.007578872,0.000010993643,0.00001887235,0.000010518101,0.0000032243668,0.00003169644,0.000007971511],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990438,0.000027621725,0.00023261968,0.00029704612,0.00010737351,0.0002915078],"domain_scores_gemma":[0.999557,0.00006711786,0.00006399845,0.00025423593,0.000014805083,0.000042828204],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005400676,0.00024074875,0.00030217695,0.0004777054,0.00015120665,0.000019968951,0.000117572126,0.00020421635,0.0000063538173],"category_scores_gemma":[0.0000075971775,0.00023644537,0.00003754558,0.000117985124,0.00019354292,0.000092724804,0.0000040540003,0.00035254177,6.570015e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019271925,0.000016666143,0.00002145729,0.00004051872,0.000056602865,8.4569865e-7,0.000059152033,0.012165438,0.86824375,0.00009331059,0.0000046353957,0.11927834],"study_design_scores_gemma":[0.00047524876,0.00020966484,0.0010973155,0.00005436755,0.00007817565,0.00005150595,0.000059830974,0.020907303,0.9655331,0.011065806,0.00023187332,0.00023581726],"about_ca_topic_score_codex":0.00005241994,"about_ca_topic_score_gemma":0.000005123861,"teacher_disagreement_score":0.11904252,"about_ca_system_score_codex":0.00003611226,"about_ca_system_score_gemma":0.000004548195,"threshold_uncertainty_score":0.96419626},"labels":[],"label_agreement":null},{"id":"W1986794465","doi":"10.1109/tcpmt.2015.2419981","title":"A Study on Measuring Contact Resistance of Ball Bonds on Thin Metallization","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Contact resistance; Composite material; Ball (mathematics); Sheet resistance; Voltage drop; Thin film; Drop (telecommunication); Current (fluid); Electrical engineering; Nanotechnology; Geometry; Layer (electronics)","score_opus":0.0388792300282667,"score_gpt":0.24106275617228565,"score_spread":0.20218352614401894,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1986794465","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93557864,0.00013444385,0.06034901,0.00028565037,0.000295598,0.00030465255,0.000008423526,0.0023874415,0.00065614516],"genre_scores_gemma":[0.9991508,0.00006970333,0.000494436,0.000019169822,0.00001004302,0.000056302524,0.0000017077205,0.0000554158,0.00014241422],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984651,0.00004924233,0.0003391011,0.00041357122,0.00031254624,0.00042040704],"domain_scores_gemma":[0.9991091,0.00008626153,0.000079716185,0.00061099685,0.000034374898,0.00007957704],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00027515893,0.00034202327,0.00042688908,0.0008849732,0.00015718362,0.00003154264,0.00030485584,0.00020570269,0.0000014431942],"category_scores_gemma":[0.000016484253,0.0003382798,0.0000551301,0.00023199356,0.000088334884,0.00008844114,0.00000726348,0.0007138387,0.00000986605],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0010272831,0.0033436543,0.0013150834,0.0005931494,0.0023052646,0.00024271215,0.004809568,0.8517849,0.087304674,0.00601814,0.00076483353,0.040490773],"study_design_scores_gemma":[0.0022549182,0.00124655,0.0010334454,0.00046156338,0.00009929945,0.000023505887,0.0011287181,0.004459278,0.9857655,0.0022933406,0.00064242166,0.0005914258],"about_ca_topic_score_codex":0.000017200313,"about_ca_topic_score_gemma":0.000034772827,"teacher_disagreement_score":0.89846087,"about_ca_system_score_codex":0.0001987814,"about_ca_system_score_gemma":0.000016377917,"threshold_uncertainty_score":0.9999069},"labels":[],"label_agreement":null},{"id":"W1988198042","doi":"10.1109/tcpmt.2012.2204393","title":"Multiorder Arnoldi Approach for Model Order Reduction of PEEC Models With Retardation","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Model order reduction; Reduction (mathematics); Arnoldi iteration; Order (exchange); Computer science; Generalized minimal residual method; Mathematics; Mathematical optimization; Economics; Algorithm; Iterative method; Finance","score_opus":0.019192933738268,"score_gpt":0.21772429001328825,"score_spread":0.19853135627502025,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1988198042","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.49383485,0.000050722614,0.5055186,0.000035325746,0.00006849233,0.00019843614,0.000007187108,0.00023020954,0.000056165565],"genre_scores_gemma":[0.93115216,0.000050372433,0.06860512,0.0000034341303,0.000012835094,0.000090114605,0.000012169587,0.000030609874,0.000043190485],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9991623,0.00001398523,0.0002001116,0.00021639786,0.000109436514,0.00029776627],"domain_scores_gemma":[0.99957484,0.000025093792,0.0000433072,0.00026575237,0.00003907203,0.00005193202],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000097260236,0.00018222071,0.0002121533,0.00032046053,0.00013652498,0.000008716399,0.00008462459,0.0001461365,0.0000033180722],"category_scores_gemma":[0.0000012100141,0.000168236,0.000035670608,0.00010988577,0.0000809591,0.00020619095,0.0000021146811,0.0002505106,4.6460403e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009980219,0.00019512937,0.000014386543,0.00017820926,0.000062645086,7.65365e-8,0.00032340587,0.8992931,0.07597357,0.00010628308,0.0000159006,0.023737455],"study_design_scores_gemma":[0.00047444535,0.0000796421,0.000037867518,0.000034476274,0.000042449905,0.000015688056,0.00006466852,0.56537074,0.43312556,0.0006031224,0.000017029259,0.00013430738],"about_ca_topic_score_codex":0.000012896008,"about_ca_topic_score_gemma":0.000002475648,"teacher_disagreement_score":0.4373173,"about_ca_system_score_codex":0.000039639282,"about_ca_system_score_gemma":0.000007054969,"threshold_uncertainty_score":0.68604654},"labels":[],"label_agreement":null},{"id":"W1989274186","doi":"10.1109/tcpmt.2013.2254173","title":"Thermal Resistance and Heat Spreading Characterization Platform for Concentrated Photovoltaic Cell Receivers","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"solar cell performance optimization","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Sherbrooke","funders":"","keywords":"Characterization (materials science); Thermal; Materials science; Thermal resistance; Photovoltaics; Heat flux; Solar cell; Photovoltaic system; Computer science; Mechanical engineering; Electronic engineering; Nuclear engineering; Environmental science; Optoelectronics; Nanotechnology; Heat transfer; Electrical engineering; Engineering; Meteorology; Mechanics; Physics","score_opus":0.00818652351418424,"score_gpt":0.18043111102152432,"score_spread":0.17224458750734006,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1989274186","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.787424,0.00003823561,0.21119082,0.00006189611,0.00026370928,0.00041065324,0.00001397167,0.00049735245,0.00009936125],"genre_scores_gemma":[0.9960462,0.00033570846,0.0032854173,0.000025371832,0.000013079016,0.0001069652,0.00002475674,0.000041055093,0.000121449855],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992052,0.0000067876454,0.00018057588,0.00023934804,0.00006678128,0.00030135456],"domain_scores_gemma":[0.9996887,0.000036276826,0.000031806325,0.00016051761,0.000023280993,0.00005943502],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004356573,0.0001976483,0.00017298739,0.000271841,0.00024651777,0.00006243342,0.00007618863,0.00015785101,0.000021888476],"category_scores_gemma":[0.0000010054691,0.00021240195,0.000024072393,0.00009147813,0.000071745635,0.00032710604,0.00000212941,0.00021826553,0.000009151135],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000033138214,0.000025758543,0.00012563857,0.00015471264,0.000039567887,9.958263e-7,0.00019212948,0.029504972,0.9584457,0.00000462683,0.0000253598,0.011447391],"study_design_scores_gemma":[0.000701707,0.000036616584,0.00079349143,0.000072105286,0.000020899271,0.0000041434237,0.000075133146,0.25131395,0.74639314,0.000041769592,0.0003378871,0.00020913735],"about_ca_topic_score_codex":0.0000143714515,"about_ca_topic_score_gemma":0.0000053730632,"teacher_disagreement_score":0.22180898,"about_ca_system_score_codex":0.00007139002,"about_ca_system_score_gemma":0.0000042944775,"threshold_uncertainty_score":0.86615},"labels":[],"label_agreement":null},{"id":"W1992059690","doi":"10.1109/tcpmt.2013.2259167","title":"Optimum Order Estimation of Reduced Macromodels Based on a Geometric Approach for Projection-Based MOR Methods","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Model Reduction and Neural Networks","field":"Physics and Astronomy","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Heuristics; Projection (relational algebra); Mathematical optimization; Computer science; Order (exchange); Task (project management); Algorithm; Transient (computer programming); Estimation; Mathematics; Engineering","score_opus":0.02537949123131428,"score_gpt":0.28758037914902873,"score_spread":0.26220088791771445,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1992059690","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2465136,0.000003917493,0.75200194,0.00038728493,0.00018007313,0.000648678,0.000015932506,0.00014849477,0.00010006363],"genre_scores_gemma":[0.80020005,0.0000012541898,0.1991745,0.000039255756,0.000018613666,0.0004432856,0.000020440415,0.000025843132,0.0000767503],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99881864,0.000058044418,0.00029123746,0.0004180964,0.00012366584,0.00029034648],"domain_scores_gemma":[0.9992588,0.00014892819,0.00014616824,0.0003117541,0.0000682318,0.00006609486],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014085704,0.00023732435,0.00029557076,0.0009700633,0.00025712283,0.00003585878,0.00013043656,0.00012565879,0.000058793674],"category_scores_gemma":[0.0000030951883,0.00022008951,0.000107447886,0.00037183127,0.00009305856,0.000091160044,0.0000025250406,0.00032382688,0.0000027669096],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000655042,0.00039215945,0.000010450036,0.00005030065,0.00005299861,8.3553175e-8,0.000014722647,0.729563,0.0061832573,0.00006431342,0.000043784137,0.26355943],"study_design_scores_gemma":[0.00069272687,0.000114866045,0.000029431316,0.000026204048,0.000030751824,0.0000011243601,0.000028965003,0.64186287,0.35644582,0.0006120058,0.000021876875,0.00013338141],"about_ca_topic_score_codex":0.00008916661,"about_ca_topic_score_gemma":1.3485577e-7,"teacher_disagreement_score":0.55368644,"about_ca_system_score_codex":0.000034322955,"about_ca_system_score_gemma":0.000026611484,"threshold_uncertainty_score":0.89749897},"labels":[],"label_agreement":null},{"id":"W1997337242","doi":"10.1109/tcpmt.2013.2286527","title":"Self-Consistent Steady-State Simulation of Microwave Photonic Systems Using Harmonic Balance","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Photonic and Optical Devices","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Harmonic balance; Chirp; Steady state (chemistry); Photonics; Harmonic; Microwave; Phase (matter); SIGNAL (programming language); Laser; Diode; State (computer science); Control theory (sociology); Physics; Computer science; Electronic engineering; Optics; Optoelectronics; Engineering; Acoustics; Telecommunications; Nonlinear system; Algorithm; Control (management); Quantum mechanics; Chemistry","score_opus":0.014889739309094123,"score_gpt":0.2171502440571007,"score_spread":0.20226050474800658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1997337242","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8083981,0.0003029291,0.18986686,0.00002970932,0.00038078806,0.00031693434,0.000010682481,0.00057730824,0.000116701405],"genre_scores_gemma":[0.99787796,0.00018968854,0.001819196,0.000011948643,0.000006561844,0.00003447759,0.0000014594456,0.000035059486,0.000023681074],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99890417,0.000021934915,0.0003405139,0.00025840427,0.00012459492,0.00035040735],"domain_scores_gemma":[0.9994513,0.00007959647,0.00007204264,0.0002888503,0.00003442459,0.000073811214],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000066182016,0.00023061759,0.0003224861,0.00034965636,0.00011767224,0.000040752646,0.00014115241,0.0001465423,0.000009769619],"category_scores_gemma":[0.0000011258784,0.00023061373,0.000060015707,0.000113573464,0.000092508424,0.00014269986,0.0000047660756,0.00032816245,0.000021648935],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012657097,0.00010016355,0.000049142218,0.0005070613,0.00025701817,0.000006073633,0.0001741419,0.824666,0.165917,0.00003149946,0.0000034187044,0.008275821],"study_design_scores_gemma":[0.0003148585,0.000027715801,0.00015371403,0.0001234128,0.000037695187,0.000021576692,0.00006830161,0.6445247,0.35429433,0.00014897011,0.00011723704,0.00016750461],"about_ca_topic_score_codex":0.00008052067,"about_ca_topic_score_gemma":0.0000043755585,"teacher_disagreement_score":0.18947983,"about_ca_system_score_codex":0.00011149757,"about_ca_system_score_gemma":0.000010150832,"threshold_uncertainty_score":0.9404155},"labels":[],"label_agreement":null},{"id":"W2004328225","doi":"10.1109/tcpmt.2012.2234503","title":"Efficient Reduced-Order Macromodels of Massively Coupled Interconnect Structures via Clustering","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Low-power high-performance VLSI design","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Massively parallel; Reduction (mathematics); Computer science; Interconnection; Cluster analysis; Block (permutation group theory); Parallel computing; Algorithm; Multithreading; Singular value decomposition; Model order reduction; Transient (computer programming); Degradation (telecommunications); Mathematics; Artificial intelligence; Thread (computing)","score_opus":0.008965490120112055,"score_gpt":0.20124975611942594,"score_spread":0.1922842659993139,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2004328225","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5741283,0.00004276693,0.4243802,0.000119604934,0.0005016913,0.00022954104,0.000008170867,0.0005572135,0.000032484273],"genre_scores_gemma":[0.99496895,0.000056086894,0.0047779717,0.000019881447,0.000015801152,0.00007283781,0.000003648661,0.000058305424,0.00002652743],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99856544,0.000021038124,0.00040019487,0.0003597537,0.00017703041,0.0004765255],"domain_scores_gemma":[0.99929637,0.000056044926,0.000076087475,0.00042934957,0.000052353487,0.00008981597],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00007609866,0.00035070817,0.0003898771,0.0007998555,0.00016760452,0.000040071343,0.00027853952,0.00022140876,0.0000674768],"category_scores_gemma":[0.0000024207527,0.0003402087,0.00006685057,0.00019881755,0.00016602308,0.00011170107,0.00001120287,0.00050966395,0.00003165051],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021646612,0.00005787101,0.000010277867,0.0001568024,0.00018322343,0.0000061389655,0.00026368696,0.6518126,0.3174283,0.000018453913,0.000025055244,0.030015914],"study_design_scores_gemma":[0.00050517125,0.000062240826,0.0002707931,0.0000972984,0.00003106684,0.000054119617,0.000071012895,0.46435133,0.53387463,0.00039025355,0.000033683435,0.0002584164],"about_ca_topic_score_codex":0.000100651836,"about_ca_topic_score_gemma":0.000009984436,"teacher_disagreement_score":0.42084062,"about_ca_system_score_codex":0.00009916616,"about_ca_system_score_gemma":0.000008754,"threshold_uncertainty_score":0.999905},"labels":[],"label_agreement":null},{"id":"W2006661506","doi":"10.1109/tcpmt.2013.2292549","title":"Monolithic Wafer-Level Rectangular Waveguide and Its Transition to Coplanar Waveguide Line Using a Simplified 3-D Fabrication Process","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Coplanar waveguide; Waveguide; Fabrication; Wafer; Materials science; Optoelectronics; Capacitive sensing; Insertion loss; Coupling (piping); Microelectromechanical systems; Capacitive coupling; Line (geometry); Computer science; Electrical engineering; Telecommunications; Microwave; Engineering; Voltage","score_opus":0.022980350971316545,"score_gpt":0.23907100977675855,"score_spread":0.216090658805442,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2006661506","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.51423603,0.00007455458,0.48435184,0.0002633927,0.00019239642,0.00018312209,0.000020057963,0.00064916606,0.000029415784],"genre_scores_gemma":[0.9954621,0.00009731376,0.0041207597,0.00009734209,0.000056814642,0.00004139085,0.000009927454,0.0000795896,0.00003474207],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984758,0.000032777934,0.00038407612,0.00048370557,0.00015580574,0.00046782175],"domain_scores_gemma":[0.9993388,0.00006284195,0.000045227924,0.00032543714,0.000056852725,0.00017084452],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00020735168,0.00037539823,0.00037139046,0.000787648,0.0002701019,0.000051400115,0.00015942332,0.00026198954,0.0000048792363],"category_scores_gemma":[0.000014577861,0.00040829103,0.000048618487,0.00022742321,0.000050208168,0.00012227827,0.0000048652164,0.00044921687,0.00001101366],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000049009515,0.000069308655,0.0000067062947,0.00045376108,0.00015570545,0.000009834623,0.0009131647,0.49636254,0.46305484,0.000095943986,0.000035491226,0.038793687],"study_design_scores_gemma":[0.00043899615,0.00007246376,0.00012306155,0.00020947891,0.000053060805,0.00010259404,0.00006596871,0.36880556,0.6289805,0.0004133288,0.0003711269,0.0003638465],"about_ca_topic_score_codex":0.000030217203,"about_ca_topic_score_gemma":0.000008782822,"teacher_disagreement_score":0.48122606,"about_ca_system_score_codex":0.000103314014,"about_ca_system_score_gemma":0.0000095409105,"threshold_uncertainty_score":0.9998369},"labels":[],"label_agreement":null},{"id":"W2007599487","doi":"10.1109/tcpmt.2012.2187897","title":"Self-Packaged Millimeter-Wave Substrate Integrated Waveguide Filter With Asymmetric Frequency Response","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":72,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Montréal; Polytechnique Montréal","funders":"","keywords":"Band-pass filter; Extremely high frequency; Diplexer; Center frequency; Materials science; Microwave; Optoelectronics; Insertion loss; Printed circuit board; Bandwidth (computing); Conductor; Microstrip; Coplanar waveguide; Waveguide; Electronic engineering; Electrical engineering; Telecommunications; Computer science; Engineering","score_opus":0.01390311091308472,"score_gpt":0.19923816412115977,"score_spread":0.18533505320807506,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007599487","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.72480994,0.00029126916,0.27181092,0.00010610113,0.0005057888,0.00018813764,0.000029611705,0.0020471308,0.00021109027],"genre_scores_gemma":[0.9823875,0.00016043341,0.01709787,0.000032495725,0.000039350045,0.000048290873,0.000009097241,0.0001109089,0.00011405656],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981604,0.00007188534,0.00036646685,0.00038305102,0.00018610568,0.00083206076],"domain_scores_gemma":[0.9990071,0.00016224869,0.000054246608,0.00052582,0.000035044628,0.00021554026],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00032072281,0.0005072142,0.00039770533,0.0013926163,0.00023655542,0.00006076317,0.00018810316,0.00028865619,0.000023563582],"category_scores_gemma":[0.0000073043975,0.0004530673,0.000079487625,0.00046894452,0.00011163086,0.00022182919,0.0000049904475,0.00086032593,0.00004606464],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0010829442,0.0014503605,0.0015582733,0.0012454629,0.0036256697,0.00047734694,0.003021628,0.04161637,0.82174516,0.00021611276,0.0009329276,0.12302774],"study_design_scores_gemma":[0.0009530944,0.00019227104,0.0025345488,0.0001705846,0.000111423906,0.0004509358,0.0001259365,0.007996738,0.9841389,0.000067184934,0.00255302,0.00070537155],"about_ca_topic_score_codex":0.00002432189,"about_ca_topic_score_gemma":0.0000064242945,"teacher_disagreement_score":0.25757754,"about_ca_system_score_codex":0.00017734244,"about_ca_system_score_gemma":0.0000143471025,"threshold_uncertainty_score":0.9997921},"labels":[],"label_agreement":null},{"id":"W2007712544","doi":"10.1109/tcpmt.2015.2409791","title":"Efficient Microwave Susceptor Design for Localized Heating on Substrate","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Susceptor; Microwave; Substrate (aquarium); Materials science; Optoelectronics; Microfluidics; Microwave heating; Microwave oven; Electronic engineering; Nanotechnology; Computer science; Layer (electronics); Telecommunications","score_opus":0.02795211182758798,"score_gpt":0.22874097419563916,"score_spread":0.20078886236805119,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007712544","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4375453,0.00007109891,0.56060386,0.000111427056,0.0005252128,0.00022866542,0.000011460528,0.00085689087,0.000046081368],"genre_scores_gemma":[0.98419064,0.000020905321,0.015484988,0.0000376705,0.000036761256,0.00008065626,0.000004297635,0.00007535353,0.0000687336],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987179,0.000023930917,0.00028035426,0.00035903117,0.00012756596,0.0004912027],"domain_scores_gemma":[0.9993554,0.00012957788,0.00003493289,0.000299831,0.000031476226,0.00014881631],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00022731477,0.00033056593,0.00030561403,0.00050820824,0.00017510919,0.000046107925,0.00015477139,0.00019542703,0.00000338032],"category_scores_gemma":[0.000007457898,0.0003366833,0.000073073,0.000113875256,0.00007915719,0.000026804411,0.00000281896,0.0003763352,0.000021338006],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007740742,0.000067420406,0.0000027290853,0.00007581878,0.000086372245,0.000007033034,0.00013965848,0.93736094,0.050443366,0.00005838116,0.00030486306,0.0113759795],"study_design_scores_gemma":[0.0010584213,0.0001697329,0.000008707633,0.000117295036,0.000026483256,0.00003016566,0.0000847957,0.27927786,0.7176255,0.0003282798,0.0009776783,0.0002950759],"about_ca_topic_score_codex":0.00001327206,"about_ca_topic_score_gemma":0.0000030104284,"teacher_disagreement_score":0.66718215,"about_ca_system_score_codex":0.00013819805,"about_ca_system_score_gemma":0.000013229122,"threshold_uncertainty_score":0.9999085},"labels":[],"label_agreement":null},{"id":"W2031219506","doi":"10.1109/tcpmt.2012.2206810","title":"Numerical and Experimental Study of a Hybrid Thermoelectric Cooler Thermal Management System for Electronic Cooling","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Thermoelectric Materials and Devices","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Thermoelectric cooling; TEC; Heat sink; Passive cooling; Thermal resistance; Electronics; Coefficient of performance; Thermal; Materials science; Electronic component; Thermoelectric effect; Mechanical engineering; Hybrid system; Water cooling; Nuclear engineering; Environmental science; Computer science; Engineering; Thermodynamics; Heat pump; Electrical engineering; Heat exchanger; Physics","score_opus":0.011819927929008538,"score_gpt":0.24505299915248008,"score_spread":0.23323307122347153,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2031219506","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8890137,0.00033440173,0.1095271,0.000015504995,0.00026981535,0.00058490626,0.000006430788,0.00022745327,0.000020663494],"genre_scores_gemma":[0.99921644,0.000020375115,0.00049039285,0.000012780053,0.000024140432,0.00019250053,8.4658217e-7,0.000029201532,0.000013349693],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998676,0.000054266082,0.00027691814,0.0003306107,0.00013521254,0.0005269671],"domain_scores_gemma":[0.9995054,0.00006119868,0.00013190258,0.00022268029,0.000014499263,0.00006431568],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020087614,0.00021753946,0.00032932224,0.00027362906,0.0002805844,0.000027590817,0.00014573075,0.000051506704,0.00001341899],"category_scores_gemma":[8.307867e-7,0.00019006532,0.00003292077,0.00008288414,0.00006296145,0.00011421371,0.00000878233,0.00012882781,0.0000034795119],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000767843,0.0014632583,0.000064039785,0.0002559283,0.00017121398,0.0000075107664,0.0005240569,0.0019270403,0.97396666,0.0003321181,0.0000020731673,0.020518273],"study_design_scores_gemma":[0.0012594552,0.0006225411,0.00017440812,0.000042436714,0.0000662907,0.000064224594,0.0007506564,0.00077655324,0.9959406,0.000056718654,0.000055362016,0.00019074319],"about_ca_topic_score_codex":0.000032930333,"about_ca_topic_score_gemma":6.7402124e-7,"teacher_disagreement_score":0.11020269,"about_ca_system_score_codex":0.000070659546,"about_ca_system_score_gemma":0.000005389852,"threshold_uncertainty_score":0.7750639},"labels":[],"label_agreement":null},{"id":"W2034374573","doi":"10.1109/tcpmt.2013.2245377","title":"Macromodeling of Multilayered Power Distribution Networks Based on Multiconductor Transmission Line Approach","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Spice; Discretization; Transmission line; Helmholtz equation; Electric power transmission; Coupling (piping); Partial differential equation; Finite difference; Computer science; Finite difference method; Electronic engineering; Power (physics); Topology (electrical circuits); Line (geometry); Helmholtz free energy; Mathematics; Mathematical analysis; Physics; Engineering; Electrical engineering; Geometry; Telecommunications; Boundary value problem","score_opus":0.009949276659019657,"score_gpt":0.2017492511577862,"score_spread":0.19179997449876654,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2034374573","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.55241877,0.000041598134,0.44674176,0.00008381322,0.00011521863,0.00021935898,0.000012301119,0.00033933893,0.000027871216],"genre_scores_gemma":[0.9951151,0.00004956349,0.0046929712,0.000015286772,0.000008721248,0.000052868632,0.000018256957,0.00003390107,0.000013300405],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9987927,0.000039124952,0.00033221304,0.00033798564,0.00015045844,0.0003474912],"domain_scores_gemma":[0.9993672,0.00008983262,0.00004657886,0.00037278704,0.00003054229,0.00009309304],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000084979416,0.0002693401,0.00030179316,0.00028727317,0.00016139765,0.000021024536,0.00015470512,0.0002467743,0.000061311395],"category_scores_gemma":[0.000002418044,0.00024983688,0.000078697834,0.00012351459,0.00009171434,0.00008278103,0.0000029060518,0.0005717514,0.0000049587816],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006388453,0.00030218487,0.000011560352,0.000103636085,0.000032502347,0.0000012225887,0.000065191,0.7849206,0.12829372,0.0000031136162,0.000021173975,0.08618125],"study_design_scores_gemma":[0.00058151456,0.00013471239,0.0002882072,0.00011422694,0.000016113103,0.00000393255,0.000021561431,0.6263563,0.37226588,0.000039223847,0.000028230123,0.00015010053],"about_ca_topic_score_codex":0.000040896408,"about_ca_topic_score_gemma":0.0000014305034,"teacher_disagreement_score":0.4426964,"about_ca_system_score_codex":0.000053528853,"about_ca_system_score_gemma":0.00000571289,"threshold_uncertainty_score":0.9999954},"labels":[],"label_agreement":null},{"id":"W2034496484","doi":"10.1109/tcpmt.2012.2209118","title":"Delay-Extraction-Based Waveform Relaxation Algorithm for Fast Transient Analysis of Power Distribution Networks","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Lightning and Electromagnetic Phenomena","field":"Physics and Astronomy","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Waveform; Algorithm; Parallelizable manifold; Computer science; Relaxation (psychology); Transient (computer programming); Scalability; Convergence (economics); Time domain; Iterative method; Electric power transmission; Transmission line; Engineering; Telecommunications","score_opus":0.007397515889341554,"score_gpt":0.22694293159550008,"score_spread":0.21954541570615851,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2034496484","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.41689932,0.000019120322,0.58246356,0.00010064519,0.00018872421,0.00012682192,0.000092346956,0.000071679664,0.000037790018],"genre_scores_gemma":[0.9971454,0.000004630817,0.0025029345,0.000013802618,0.000034519664,0.00007451016,0.0001663906,0.00001741592,0.00004038343],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989259,0.00002206875,0.00028599592,0.00024550315,0.000113105176,0.00040737665],"domain_scores_gemma":[0.9994096,0.000089387395,0.00015427363,0.0002257976,0.00003883591,0.00008207379],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014398414,0.00019334664,0.00029485382,0.00044602618,0.0002824948,0.00001768754,0.00008880936,0.000105844425,0.000032393044],"category_scores_gemma":[6.3074793e-7,0.00018616638,0.00016040017,0.00029776723,0.000075921685,0.00010915933,0.0000015899245,0.00025110572,0.0000014669607],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001842736,0.0019025373,0.0034074797,0.00004347533,0.0030841008,8.2106385e-7,0.000564404,0.09352434,0.008851652,0.0012784175,0.00008132195,0.88707715],"study_design_scores_gemma":[0.0028456182,0.0006711346,0.021954874,0.000094812625,0.002785697,0.000007635964,0.0005006778,0.5327349,0.4344758,0.0008721441,0.0022068042,0.0008499025],"about_ca_topic_score_codex":0.00006929823,"about_ca_topic_score_gemma":0.0000024631709,"teacher_disagreement_score":0.88622725,"about_ca_system_score_codex":0.000062452455,"about_ca_system_score_gemma":0.000010432223,"threshold_uncertainty_score":0.75916445},"labels":[],"label_agreement":null},{"id":"W2047070565","doi":"10.1109/tcpmt.2014.2331211","title":"Compact MEMS-Based Ultrawide-Band CPW Band-Pass Filters With Single/Double Tunable Notch-Bands","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Band-stop filter; Capacitor; Microelectromechanical systems; Band-pass filter; Passband; Filter (signal processing); Physics; Topology (electrical circuits); Electronic engineering; Optoelectronics; Low-pass filter; Computer science; Materials science; Electrical engineering; Engineering; Voltage","score_opus":0.011272005504279299,"score_gpt":0.19269361521589548,"score_spread":0.1814216097116162,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2047070565","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5703383,0.000050042574,0.42681712,0.00030771628,0.00037563845,0.00014856842,0.000014014944,0.0014347386,0.0005138366],"genre_scores_gemma":[0.99841744,0.000030615403,0.0011510557,0.000062885134,0.000037613856,0.000026205138,0.000012905483,0.0001052511,0.00015604458],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99832433,0.000021263515,0.00032054685,0.00046925232,0.00020050324,0.0006640768],"domain_scores_gemma":[0.99907804,0.00012106933,0.00005605721,0.0005508883,0.000028161692,0.00016578157],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00015194465,0.0004860736,0.000471037,0.0007144658,0.00030340315,0.000103749866,0.00025582834,0.00023787018,0.000027610262],"category_scores_gemma":[0.0000025921154,0.00045577224,0.00008672488,0.00020510769,0.00017845686,0.00012859046,0.0000018739213,0.0006356394,0.000020970461],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014123303,0.00016666918,0.00011761417,0.00026477344,0.00023603963,0.000019251853,0.0001114317,0.59799135,0.39272472,0.000023261247,0.00034779508,0.00785585],"study_design_scores_gemma":[0.0021119397,0.00023221648,0.00027227378,0.00027232524,0.00006883021,0.00007109431,0.00003443056,0.017794145,0.9742236,0.00007936304,0.0042881733,0.00055159634],"about_ca_topic_score_codex":0.000069945025,"about_ca_topic_score_gemma":0.000027426502,"teacher_disagreement_score":0.58149886,"about_ca_system_score_codex":0.000119576885,"about_ca_system_score_gemma":0.000011736742,"threshold_uncertainty_score":0.9997894},"labels":[],"label_agreement":null},{"id":"W2074130819","doi":"10.1109/tcpmt.2013.2262637","title":"Miniaturized, Lumped-Element Filters for Customized System-on-Package L-Band Receivers","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Center frequency; Miniaturization; Band-pass filter; Distributed element filter; Insertion loss; Bandwidth (computing); Inductor; Electronic engineering; Resonator; Capacitor; System in package; Passband; Electrical engineering; Prototype filter; Engineering; Low-pass filter; Telecommunications; Chip","score_opus":0.009175600826798556,"score_gpt":0.19800621568062948,"score_spread":0.18883061485383093,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2074130819","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.71601295,0.000059955913,0.27922085,0.0004381395,0.0014356435,0.0007074961,0.000062714265,0.0018469095,0.0002153355],"genre_scores_gemma":[0.9955034,0.00009608238,0.0036767735,0.000044120217,0.00004132721,0.00030997625,0.0000111088975,0.000083131876,0.00023405175],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99852407,0.000020338768,0.00034148805,0.00042155458,0.00013710074,0.0005554593],"domain_scores_gemma":[0.99923587,0.00013500912,0.000038807306,0.0004339974,0.000027078497,0.00012922483],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000116149895,0.00039529667,0.00040760398,0.00067417294,0.00025432365,0.0000717743,0.0002197904,0.0002290401,0.000027407727],"category_scores_gemma":[0.0000040464065,0.00039169993,0.00012130364,0.000103641665,0.00008337598,0.00009578837,0.0000032051275,0.00041357797,0.0000752184],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00041955474,0.00040589672,0.000021456128,0.0023190647,0.0017147779,0.000046220594,0.00077296625,0.14663929,0.70957637,0.00032499613,0.0144174285,0.123341955],"study_design_scores_gemma":[0.0029819726,0.00014760444,0.00007070625,0.00033311153,0.000077043835,0.000041781674,0.00031266783,0.029035814,0.96091974,0.00011136595,0.0054079667,0.0005602401],"about_ca_topic_score_codex":0.000025702317,"about_ca_topic_score_gemma":0.0000026507096,"teacher_disagreement_score":0.27949047,"about_ca_system_score_codex":0.0001731802,"about_ca_system_score_gemma":0.0000061519504,"threshold_uncertainty_score":0.9998535},"labels":[],"label_agreement":null},{"id":"W2074976246","doi":"10.1109/tcpmt.2013.2262109","title":"Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Materials science; Bond; Piezoresistive effect; Intermetallic; Composite material; Stress (linguistics); Wire bonding; Bond strength; Chip; Electrical engineering; Adhesive; Alloy","score_opus":0.020550741356212956,"score_gpt":0.2237971267878483,"score_spread":0.20324638543163534,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2074976246","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9732213,0.00017384814,0.022973523,0.00043310566,0.00042069308,0.00020802562,0.00017639727,0.002323248,0.00006987431],"genre_scores_gemma":[0.98708415,0.00008807897,0.01260769,0.000021698326,0.000028350298,0.000047850284,0.00003820445,0.00006670506,0.000017248367],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981825,0.000022489667,0.00037211797,0.0006092466,0.00019429927,0.0006193453],"domain_scores_gemma":[0.9984768,0.00021051313,0.00009599471,0.0010965739,0.000037871785,0.00008223862],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00009588339,0.0004034041,0.00046913832,0.00057028874,0.00030275199,0.000065162116,0.00069992396,0.0003473194,0.000012823418],"category_scores_gemma":[0.000016496486,0.00041215046,0.0000368815,0.00025718103,0.00027617422,0.00032939954,0.000040505434,0.0010927405,0.000011940013],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000038996328,0.00022951902,0.0027956816,0.00029352485,0.0008558045,0.000045960922,0.0006452192,0.032569993,0.8256637,0.00019011048,0.00075111084,0.13592036],"study_design_scores_gemma":[0.0007218605,0.00012218839,0.003279713,0.00048705924,0.000065297856,0.000053980915,0.00075224345,0.015744014,0.9754624,0.0027062364,0.00007622222,0.00052880216],"about_ca_topic_score_codex":0.0007054581,"about_ca_topic_score_gemma":0.00006326701,"teacher_disagreement_score":0.14979866,"about_ca_system_score_codex":0.00011927037,"about_ca_system_score_gemma":0.00002735969,"threshold_uncertainty_score":0.99983305},"labels":[],"label_agreement":null},{"id":"W2077090243","doi":"10.1109/tcpmt.2015.2484284","title":"Nonlinear Electronic/Photonic Component Modeling Using Adjoint State-Space Dynamic Neural Network Technique","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Photonic and Optical Devices","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Nonlinear system; Artificial neural network; Computer science; Transient (computer programming); Photonics; Component (thermodynamics); Computation; State space; Electronic component; Electronic engineering; Electronic circuit simulation; Algorithm; Electronic circuit; Artificial intelligence; Mathematics; Engineering; Physics","score_opus":0.016989385572532854,"score_gpt":0.23367614125744338,"score_spread":0.21668675568491053,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2077090243","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5603472,0.00029718754,0.43755946,0.0001138194,0.00036435478,0.0002582015,0.000009001552,0.0010064546,0.00004432874],"genre_scores_gemma":[0.98847187,0.00027423352,0.011021044,0.0000420355,0.000021249192,0.0000620133,0.0000063909542,0.00008641596,0.000014752752],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99795276,0.00003953372,0.00038464062,0.00046220073,0.00022013528,0.00094075315],"domain_scores_gemma":[0.9992191,0.000045936064,0.000055115568,0.00043117217,0.000035032142,0.00021365359],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00022113914,0.00042240572,0.00044296068,0.0004301981,0.00024951977,0.000058043894,0.00027330624,0.00024697545,0.000005867346],"category_scores_gemma":[0.000002375643,0.00043598787,0.000089270936,0.00021928585,0.00012257369,0.00015968761,0.000015086287,0.0011042237,0.000013018621],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004365057,0.00006195336,0.0000071761565,0.000048983755,0.00009003252,0.000018644587,0.000058431353,0.97796834,0.018596075,0.000035824567,0.000004215246,0.0030666844],"study_design_scores_gemma":[0.00052545895,0.000088900495,0.0000064170263,0.00012582049,0.000045710705,0.000139513,0.00006826577,0.8619571,0.1348057,0.001542221,0.00030527462,0.00038965722],"about_ca_topic_score_codex":0.0000991399,"about_ca_topic_score_gemma":0.000061453764,"teacher_disagreement_score":0.42812467,"about_ca_system_score_codex":0.0004011431,"about_ca_system_score_gemma":0.000039059298,"threshold_uncertainty_score":0.9998092},"labels":[],"label_agreement":null},{"id":"W2080004655","doi":"10.1109/tcpmt.2012.2196516","title":"Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":38,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Return loss; Planar; Integrated circuit; Bandwidth (computing); Insertion loss; Interconnection; Waveguide; Electronic circuit; Computer science; Wideband; Substrate (aquarium); Topology (electrical circuits); Materials science; Electrical engineering; Telecommunications; Optoelectronics; Engineering; Antenna (radio)","score_opus":0.017432254834396987,"score_gpt":0.22337600593706103,"score_spread":0.20594375110266405,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2080004655","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5373658,0.00013425577,0.4600798,0.00008676325,0.00087025895,0.00016489557,0.000024888206,0.0011835708,0.00008981567],"genre_scores_gemma":[0.9977059,0.000072117975,0.0018678744,0.00003715764,0.00005097695,0.00008052629,0.000018435143,0.00008531067,0.00008169983],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99849373,0.000019507006,0.0003414077,0.0003069013,0.00009989133,0.0007385715],"domain_scores_gemma":[0.99932104,0.00012063162,0.000021043914,0.0003170326,0.000035165198,0.0001850831],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001609238,0.00038398255,0.00035290502,0.0005860745,0.00017745885,0.000047603076,0.00018726684,0.0002889269,0.000021771806],"category_scores_gemma":[0.000011449269,0.0003730182,0.000094824274,0.0001672304,0.00010368738,0.0001540744,0.000003499163,0.0005784489,0.00002869444],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014404373,0.0006372859,0.00029768897,0.00081625575,0.0012159346,0.000032613032,0.0010351482,0.05358517,0.742068,0.0013725209,0.0016571347,0.19713819],"study_design_scores_gemma":[0.0007089934,0.000078382574,0.00026045434,0.00017509288,0.000061905426,0.00010516085,0.00016026068,0.03503924,0.9570649,0.00019215311,0.0057067475,0.00044666597],"about_ca_topic_score_codex":0.000020273434,"about_ca_topic_score_gemma":0.000008939155,"teacher_disagreement_score":0.4603401,"about_ca_system_score_codex":0.00013318348,"about_ca_system_score_gemma":0.000010256051,"threshold_uncertainty_score":0.99987215},"labels":[],"label_agreement":null},{"id":"W2097399447","doi":"10.1109/tcpmt.2011.2106127","title":"Ionomer Composite Thin Film Capacitors","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Dielectric materials and actuators","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Supercapacitor; Ionomer; Capacitance; Capacitor; Composite material; Thin film; Composite number; Electrode; Polymer; Ionic bonding; Substrate (aquarium); Electrical conductor; Planar; Voltage; Optoelectronics; Nanotechnology; Computer science; Electrical engineering; Ion","score_opus":0.013859652742378173,"score_gpt":0.18652924513445257,"score_spread":0.1726695923920744,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2097399447","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9247073,0.000049937942,0.071307704,0.000058834798,0.001166886,0.00011909768,0.000013863542,0.0013026085,0.0012737629],"genre_scores_gemma":[0.9982936,0.00011410441,0.0013872222,0.000036419675,0.000023099872,0.000027315964,0.0000020376383,0.000040519695,0.00007571609],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99907666,0.000014317265,0.00021718627,0.00024913182,0.00008782572,0.00035489778],"domain_scores_gemma":[0.9995934,0.000021728501,0.000032552733,0.0002613679,0.000009171772,0.000081812526],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000060901853,0.00024177087,0.00023892208,0.00047553118,0.00018237627,0.000030757066,0.00017036713,0.0001627948,0.00011494277],"category_scores_gemma":[7.1151266e-7,0.00023698219,0.0000494659,0.00010118292,0.00009028212,0.00009982383,0.00000320211,0.00032929858,0.00005383926],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00035556007,0.0013759019,0.0007554113,0.0009215774,0.0019887066,0.00025758514,0.006082481,0.055879753,0.41857842,0.0015606041,0.0022516393,0.50999236],"study_design_scores_gemma":[0.00034278422,0.000059763122,0.0005949639,0.000050776693,0.00003188996,0.00004093348,0.00006773247,0.0041140974,0.9917693,0.00095939194,0.0016520882,0.0003162555],"about_ca_topic_score_codex":0.0000589189,"about_ca_topic_score_gemma":0.0000050436865,"teacher_disagreement_score":0.5731909,"about_ca_system_score_codex":0.000040802275,"about_ca_system_score_gemma":0.0000035546639,"threshold_uncertainty_score":0.9663853},"labels":[],"label_agreement":null},{"id":"W2103568915","doi":"10.1109/tcpmt.2010.2100712","title":"Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Transient (computer programming); Materials science; Frequency domain; Electronic packaging; Thermal; Computer science; Physics; Thermodynamics; Composite material","score_opus":0.01667965212243944,"score_gpt":0.22026632175862698,"score_spread":0.20358666963618754,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2103568915","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5705571,0.00029634626,0.42566976,0.00045967384,0.00013129607,0.00034467873,0.000005913359,0.0022605364,0.00027469863],"genre_scores_gemma":[0.9904836,0.00009003441,0.008757231,0.00006181808,0.000033142816,0.00045293046,0.000003249274,0.00009149129,0.000026497832],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9976952,0.000029750994,0.00027450427,0.00043176665,0.00026323195,0.0013055332],"domain_scores_gemma":[0.9990949,0.00003785927,0.000041875453,0.0006144402,0.000023049774,0.00018787781],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00022658928,0.00043823762,0.00034058752,0.00079397304,0.00040503748,0.00004563275,0.00034945132,0.00020847519,0.000009328824],"category_scores_gemma":[0.0000014279716,0.00041558337,0.000062159175,0.00036499547,0.00014064038,0.00017689815,0.000006799451,0.00085226167,0.00003911959],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000150969,0.0009577277,0.0047164406,0.0004297518,0.0016625096,0.00002079507,0.0026947064,0.055760913,0.68034554,0.003314448,0.00017849568,0.24976769],"study_design_scores_gemma":[0.0012893636,0.0003394979,0.0019629921,0.00024347143,0.00013439385,0.00018735352,0.00055766996,0.000425473,0.98675764,0.0024244878,0.0044825743,0.0011950805],"about_ca_topic_score_codex":0.000015964257,"about_ca_topic_score_gemma":0.000027526396,"teacher_disagreement_score":0.41992652,"about_ca_system_score_codex":0.00032234486,"about_ca_system_score_gemma":0.000021283438,"threshold_uncertainty_score":0.9998296},"labels":[],"label_agreement":null},{"id":"W2132909871","doi":"10.1109/tcpmt.2013.2292584","title":"Application of the Kirchhoff Transform to Thermal Spreading Problems With Convection Boundary Conditions","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Thermal properties of materials","field":"Materials Science","cited_by":69,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Heat sink; Thermal resistance; Thermal conductivity; Thermal conduction; Junction temperature; Materials science; Microelectronics; Boundary value problem; Heat transfer; Mechanics; Thermal transmittance; Electronics; Thermal; Heat transfer coefficient; Electronic engineering; Mechanical engineering; Thermodynamics; Engineering; Mathematical analysis; Mathematics; Optoelectronics; Physics; Electrical engineering","score_opus":0.00911060732653541,"score_gpt":0.20922964624046614,"score_spread":0.20011903891393074,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2132909871","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8205934,0.000005767658,0.17689908,0.0013794911,0.000304305,0.0004956562,0.00003147598,0.00023321966,0.000057567748],"genre_scores_gemma":[0.9991146,0.0000014849866,0.00048530195,0.00010402219,0.000015508522,0.00020087895,0.0000016897014,0.000025824194,0.00005073075],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989259,0.00007974319,0.00024257082,0.00030949165,0.0001864958,0.00025579444],"domain_scores_gemma":[0.99938405,0.000040226743,0.0001157501,0.0003816356,0.000029631401,0.00004872395],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024064581,0.00016828408,0.00021576716,0.00019463993,0.00061310816,0.000040491188,0.00030016014,0.00007621686,0.000028706476],"category_scores_gemma":[0.000002121542,0.00012189613,0.00003664569,0.000089278794,0.0002809906,0.00010395447,0.000010542137,0.00020327757,0.00002579607],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000091261296,0.000071432376,0.000041445463,0.00004973954,0.000016874794,2.0909333e-7,0.00024550562,0.015622795,0.9755506,0.00007585667,0.000004559654,0.008229746],"study_design_scores_gemma":[0.00044492885,0.00019730035,0.0011008539,0.000095762385,0.000032196738,0.000039218303,0.000069640395,0.00039428312,0.9961367,0.00052887737,0.0008056503,0.00015459162],"about_ca_topic_score_codex":0.0001531461,"about_ca_topic_score_gemma":0.000023163562,"teacher_disagreement_score":0.17852111,"about_ca_system_score_codex":0.000057592657,"about_ca_system_score_gemma":0.000014408753,"threshold_uncertainty_score":0.497078},"labels":[],"label_agreement":null},{"id":"W2145991395","doi":"10.1109/tcpmt.2010.2099750","title":"Passivity Verification of Delayed Rational Function Based Macromodels of Tabulated Networks Characterized by Scattering Parameters","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Lightning and Electromagnetic Phenomena","field":"Physics and Astronomy","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Passivity; Mathematical proof; Eigenvalues and eigenvectors; Rational function; Applied mathematics; Function (biology); Scattering; Hamiltonian (control theory); Mathematics; Scattering parameters; Control theory (sociology); Mathematical analysis; Computer science; Mathematical optimization; Physics; Engineering; Geometry; Quantum mechanics; Optics","score_opus":0.01343277522000359,"score_gpt":0.1961039024803066,"score_spread":0.18267112726030302,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2145991395","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5367964,0.0000073843107,0.46289182,0.00003122298,0.00007776694,0.000097339194,0.000021810365,0.000052505242,0.00002377802],"genre_scores_gemma":[0.9983324,0.0000048839997,0.0015148261,0.000013615162,0.000008732401,0.000052406343,0.000040316263,0.000016656486,0.000016186234],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991082,0.000030316072,0.00029411446,0.00025740534,0.000094839954,0.00021511219],"domain_scores_gemma":[0.99945945,0.000034220186,0.00020156543,0.00023117264,0.000030222664,0.00004336206],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008523443,0.00016526874,0.0002448685,0.00022842815,0.00012622958,0.000008736334,0.000107558495,0.000082120256,0.000048568578],"category_scores_gemma":[3.1701936e-7,0.0001694422,0.000057505742,0.00010589824,0.00012281086,0.00007914571,0.0000029404434,0.00021188935,0.0000012791658],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006873895,0.0008653521,0.0014754246,0.000065422384,0.00046055153,5.9483665e-7,0.00019349286,0.007536812,0.9082209,0.0003171362,0.000018699686,0.08015826],"study_design_scores_gemma":[0.0009293227,0.00025670856,0.001995794,0.000051018982,0.00008512786,0.000001479775,0.000028621025,0.018351201,0.9768149,0.0012809212,0.000022864297,0.00018201757],"about_ca_topic_score_codex":0.00013591982,"about_ca_topic_score_gemma":7.381467e-7,"teacher_disagreement_score":0.461536,"about_ca_system_score_codex":0.000018065932,"about_ca_system_score_gemma":0.00001144436,"threshold_uncertainty_score":0.69096524},"labels":[],"label_agreement":null},{"id":"W2151674152","doi":"10.1109/tcpmt.2012.2232711","title":"High-Performance, Compact Quasi-Elliptic Band Pass Filters for V-Band High Data Rate Radios","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Communications Research Centre Canada","funders":"","keywords":"Insertion loss; Return loss; Center frequency; Band-pass filter; Distributed element filter; Prototype filter; Microstrip; Bandwidth (computing); m-derived filter; Microwave; Filter (signal processing); Planar; Materials science; Resonator; Waveguide filter; Optoelectronics; Electronic engineering; Low-pass filter; Electrical engineering; Computer science; Telecommunications; Engineering","score_opus":0.016512272893631694,"score_gpt":0.20773057265324782,"score_spread":0.19121829975961613,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2151674152","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6651563,0.00008409893,0.332137,0.00038564377,0.000870725,0.00033688764,0.00009666099,0.0009132663,0.000019424411],"genre_scores_gemma":[0.9968686,0.0003232431,0.002315921,0.000039652907,0.00006296552,0.000067967485,0.00006487498,0.00008906104,0.00016771346],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998417,0.00002162611,0.00035720738,0.00049402023,0.00011097122,0.0005991509],"domain_scores_gemma":[0.99884605,0.00012558547,0.000050905706,0.00082591275,0.000024867788,0.00012668423],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00016485021,0.00040825413,0.00043810724,0.00055754534,0.00027926246,0.00009964452,0.0004475879,0.00021267163,0.00003409988],"category_scores_gemma":[0.0000039409697,0.0004018602,0.00005188367,0.0001279549,0.00011550563,0.00028835336,0.000005670455,0.0004714195,0.000047045163],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000111375244,0.00035009687,0.00012727923,0.00131441,0.0011497439,0.000018300829,0.00022460517,0.50650454,0.38838404,0.00009640118,0.009834711,0.091884516],"study_design_scores_gemma":[0.0014430038,0.00016272985,0.001281268,0.00020273648,0.000089827496,0.000049970397,0.000042059284,0.114443064,0.8788329,0.00029680706,0.0025613687,0.0005943146],"about_ca_topic_score_codex":0.00010610024,"about_ca_topic_score_gemma":0.0000059190593,"teacher_disagreement_score":0.49044883,"about_ca_system_score_codex":0.00007535611,"about_ca_system_score_gemma":0.000008190121,"threshold_uncertainty_score":0.9998433},"labels":[],"label_agreement":null},{"id":"W2153606476","doi":"10.1109/tcpmt.2011.2170982","title":"Sensitivity Analysis of Microwave Circuits Using Parameterized Model Order Reduction Techniques","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Parameterized complexity; Sensitivity (control systems); Discretization; Parametric statistics; Reduction (mathematics); Model order reduction; Microwave; Finite element method; Algorithm; Applied mathematics; Mathematics; Computer science; Variable (mathematics); Mathematical optimization; Electronic engineering; Mathematical analysis; Physics; Engineering; Geometry; Telecommunications; Statistics","score_opus":0.029751072251944337,"score_gpt":0.23201840392296866,"score_spread":0.20226733167102431,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2153606476","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.57638437,0.000016258879,0.42298043,0.000009448406,0.000069618996,0.00009791831,0.0000095767555,0.00038835657,0.000044052882],"genre_scores_gemma":[0.9791974,0.000058590325,0.020688819,0.0000046095583,0.0000039670413,0.0000118680855,0.0000033942679,0.00002349861,0.000007848221],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99900943,0.00004423197,0.00028366596,0.00030462712,0.000101145415,0.00025690396],"domain_scores_gemma":[0.9994511,0.000032538006,0.000061815575,0.0003704979,0.00003585559,0.00004819324],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013197382,0.00020920356,0.0003896893,0.0011067139,0.00012753706,0.000009506174,0.00008579131,0.0001903068,0.000012560408],"category_scores_gemma":[0.0000022081342,0.00022288959,0.00009344333,0.00041540273,0.0001437703,0.00009094634,0.0000046224795,0.0003242873,6.548678e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028571681,0.00010416149,0.000030159472,0.000046727724,0.00034752276,0.0000032139749,0.0002656325,0.04793569,0.9136137,0.000008288765,0.0000012595298,0.03761511],"study_design_scores_gemma":[0.0001307732,0.000045339017,0.00026309627,0.000042282838,0.00030489796,0.000023652286,0.000026397043,0.2861422,0.71241945,0.00045313945,0.0000017884063,0.0001469948],"about_ca_topic_score_codex":0.00010887905,"about_ca_topic_score_gemma":0.000026928734,"teacher_disagreement_score":0.40281305,"about_ca_system_score_codex":0.00005414565,"about_ca_system_score_gemma":0.000008486755,"threshold_uncertainty_score":0.90891737},"labels":[],"label_agreement":null},{"id":"W2161130272","doi":"10.1109/tcpmt.2011.2177269","title":"Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"University of Waterloo; Nanyang Technological University","keywords":"Materials science; Plating (geology); Microstructure; Shear strength (soil); Metallurgy; Electroless plating; Copper; Contact resistance; Pillar; Copper plating; Composite material; Daisy chain; Flip chip; Layer (electronics); Electroplating; Adhesive; Structural engineering","score_opus":0.014698336928790953,"score_gpt":0.22613634049714756,"score_spread":0.21143800356835663,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2161130272","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6112799,0.00008191402,0.38614509,0.00046638036,0.00045925996,0.00029580624,0.000010680929,0.0011963168,0.00006465881],"genre_scores_gemma":[0.9926123,0.00006501679,0.006945311,0.000059818,0.000039062885,0.00017951605,0.000004553657,0.00006240971,0.000032014257],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983707,0.00001962463,0.00034181183,0.00034216896,0.00012360816,0.00080207817],"domain_scores_gemma":[0.999397,0.00010695841,0.000052605326,0.000333002,0.000017517486,0.00009293497],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00020959057,0.0003218194,0.0003601625,0.0010748042,0.00024944442,0.000041339415,0.00022233214,0.00027109327,0.000006169192],"category_scores_gemma":[0.0000076230103,0.0003440213,0.000054068452,0.00026180522,0.000056783836,0.00021296208,0.000009439748,0.00056892104,0.000018345221],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00027309253,0.00071895134,0.0077241277,0.0007837787,0.00063330523,0.00002596687,0.0035885875,0.10661437,0.50487506,0.0036965113,0.0003176953,0.37074852],"study_design_scores_gemma":[0.0020295756,0.00017688329,0.015623703,0.00036791523,0.00007880344,0.00008159592,0.0005225389,0.033027984,0.9418322,0.003323107,0.001886099,0.001049604],"about_ca_topic_score_codex":0.000049156293,"about_ca_topic_score_gemma":0.00004673467,"teacher_disagreement_score":0.43695712,"about_ca_system_score_codex":0.00016862142,"about_ca_system_score_gemma":0.000006522564,"threshold_uncertainty_score":0.9999012},"labels":[],"label_agreement":null},{"id":"W2167147386","doi":"10.1109/tcpmt.2011.2112655","title":"Analytical Modeling of Cyclic Thermal Stress and Strain in Plated-Through-Vias With Defects","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto; Hatch (Canada)","funders":"","keywords":"Waviness; von Mises yield criterion; Finite element method; Stress (linguistics); Materials science; Structural engineering; Composite material; Physics; Engineering; Philosophy","score_opus":0.023617027442483323,"score_gpt":0.21379624404171202,"score_spread":0.1901792165992287,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2167147386","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8896506,0.000169905,0.108935244,0.000047260855,0.000049737595,0.00011326542,0.000010014334,0.00086897623,0.00015503177],"genre_scores_gemma":[0.99740964,0.0002419419,0.0022782416,0.0000063136504,0.000003129871,0.000019002688,0.0000012668391,0.000036317248,0.000004147733],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99890643,0.000017283233,0.00024078246,0.00030742463,0.00010110846,0.00042695823],"domain_scores_gemma":[0.99958354,0.000036928788,0.000033547152,0.00029369825,0.0000098206465,0.000042472413],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007468107,0.00025372586,0.0003298488,0.0005584126,0.00008488009,0.000012762751,0.00016222255,0.0002204797,0.0000029841497],"category_scores_gemma":[0.0000020484583,0.00023520696,0.00003077886,0.00016684362,0.00021770227,0.00010403683,0.0000070950173,0.00063547434,9.202915e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003434278,0.0006868348,0.010345116,0.0009710971,0.0009632408,0.00025215943,0.004443785,0.863866,0.047255274,0.0018631858,0.000004657782,0.06900526],"study_design_scores_gemma":[0.0015311069,0.00034970572,0.0028818804,0.00067826756,0.00009172179,0.00010651658,0.00069927354,0.24227786,0.7476812,0.0030916084,0.000007362895,0.00060350436],"about_ca_topic_score_codex":0.000108668435,"about_ca_topic_score_gemma":0.0000836106,"teacher_disagreement_score":0.7004259,"about_ca_system_score_codex":0.000044880904,"about_ca_system_score_gemma":0.000008431239,"threshold_uncertainty_score":0.95914614},"labels":[],"label_agreement":null},{"id":"W2168258332","doi":"10.1109/tcpmt.2011.2117423","title":"Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Discretization; Transmission line; Partial element equivalent circuit; Electronic engineering; Electric power transmission; Computer science; Line (geometry); Power (physics); Emphasis (telecommunications); Transmission (telecommunications); Equivalent circuit; Topology (electrical circuits); Engineering; Electrical engineering; Voltage; Mathematics; Telecommunications; Geometry","score_opus":0.023403663512343995,"score_gpt":0.22794158238762763,"score_spread":0.20453791887528364,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2168258332","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.59818244,0.00012791186,0.40098903,0.00001844888,0.00018516034,0.000104671875,0.0000054120824,0.00034325954,0.000043678865],"genre_scores_gemma":[0.9922944,0.000036616424,0.0076068137,0.0000062141166,0.0000067877604,0.000009628292,0.0000020118327,0.000033272994,0.000004302694],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988912,0.000027789902,0.00034221713,0.00028967092,0.0001480436,0.00030111743],"domain_scores_gemma":[0.9995014,0.00006062544,0.000048425616,0.00028958495,0.00002601609,0.000073923235],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009586006,0.00024335089,0.00027332126,0.0005727419,0.00020250674,0.000011088345,0.00014074086,0.00019627938,0.00004462255],"category_scores_gemma":[0.0000013261864,0.00024010881,0.00007282013,0.00012974272,0.000088982764,0.00004675292,0.0000023493571,0.00039734063,0.0000020933571],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009573971,0.00019548417,0.000024617588,0.00012374074,0.000040956285,0.000007491737,0.00025067595,0.81694645,0.16759281,0.0000067148803,8.169739e-7,0.014714514],"study_design_scores_gemma":[0.0003098358,0.00008829083,0.000089522364,0.000146137,0.000032520707,0.0000265136,0.000047379082,0.57500225,0.4239453,0.00015589676,0.000011431003,0.00014493543],"about_ca_topic_score_codex":0.0001242232,"about_ca_topic_score_gemma":0.00000849251,"teacher_disagreement_score":0.39411193,"about_ca_system_score_codex":0.000045477085,"about_ca_system_score_gemma":0.000013051648,"threshold_uncertainty_score":0.9791353},"labels":[],"label_agreement":null},{"id":"W2208159239","doi":"10.1109/tcpmt.2015.2490240","title":"Fast Variability Analysis of General Nonlinear Circuits Using Decoupled Polynomial Chaos","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Probabilistic and Robust Engineering Design","field":"Decision Sciences","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Ottawa; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Jacobian matrix and determinant; Polynomial chaos; Nonlinear system; Diagonal; Hermite polynomials; Applied mathematics; Electronic circuit; Polynomial; Mathematics; CHAOS (operating system); Control theory (sociology); Algorithm; Computer science; Mathematical analysis; Monte Carlo method; Engineering; Geometry; Statistics","score_opus":0.08322118390759257,"score_gpt":0.315203127111291,"score_spread":0.23198194320369842,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2208159239","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5054235,0.000012971026,0.4938596,0.00009203045,0.00035210664,0.00009112048,0.000029671048,0.000109969566,0.000029044471],"genre_scores_gemma":[0.98708117,0.0000063311268,0.012752099,0.000020564175,0.000029720106,0.00000830076,0.0000031194643,0.000017096838,0.000081583305],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9977013,0.000118465694,0.00066058803,0.0006260016,0.0005345743,0.0003590598],"domain_scores_gemma":[0.99833643,0.00037815972,0.00020336792,0.0007599185,0.00014425129,0.00017785668],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013242323,0.0002460942,0.00066015875,0.0019520913,0.00019827338,0.000056088382,0.00047888444,0.00022726358,0.000029465742],"category_scores_gemma":[0.00013053247,0.00021084149,0.00016721335,0.0010191308,0.00027858958,0.0001239936,0.000015806168,0.0003374197,0.000007972036],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007849957,0.00033585363,0.0014683999,0.000019011162,0.0007175847,0.000012239902,0.00031712407,0.9377368,0.018099312,0.00009059935,0.0000414507,0.041083105],"study_design_scores_gemma":[0.0010452474,0.00012284232,0.0024998642,0.000033364424,0.0006139196,0.000037250982,0.00018199152,0.8867842,0.1060304,0.0020092302,0.00024980964,0.0003918654],"about_ca_topic_score_codex":0.00014213193,"about_ca_topic_score_gemma":0.000017705586,"teacher_disagreement_score":0.48165768,"about_ca_system_score_codex":0.00011549239,"about_ca_system_score_gemma":0.00006508684,"threshold_uncertainty_score":0.8597866},"labels":[],"label_agreement":null},{"id":"W2241854678","doi":"10.1109/tcpmt.2015.2505320","title":"Highly Compact VHF/UHF Dual-Band/Dual-Function LTCC Circuits: Application to Avionic Systems","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Ultra high frequency; Avionics; Capacitor; Inductor; Multi-band device; Electronic circuit; Band-pass filter; Hybrid coupler; Electronic engineering; Integrated circuit; Electrical engineering; Topology (electrical circuits); Dual (grammatical number); Computer science; Engineering; Power dividers and directional couplers; Aerospace engineering","score_opus":0.015263873806830303,"score_gpt":0.21436426712050838,"score_spread":0.19910039331367807,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2241854678","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.45510575,0.00020410286,0.54082525,0.00023293735,0.0012658044,0.00029121002,0.000021067422,0.0018460135,0.00020786251],"genre_scores_gemma":[0.9992186,0.000060180122,0.00022467053,0.000037888993,0.0000856345,0.000084896565,0.000016003021,0.00008201076,0.00019011793],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99841315,0.000029452698,0.00037968645,0.00045547073,0.00022278794,0.0004994501],"domain_scores_gemma":[0.99906707,0.000048979706,0.000051357114,0.0005291333,0.00004813845,0.00025531687],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00021070249,0.0003776392,0.00037389193,0.0010805677,0.00020380237,0.00008794155,0.00015502384,0.00025739486,0.000003866675],"category_scores_gemma":[0.0000045777056,0.00040285176,0.000061670995,0.00033645582,0.0000593221,0.00013282416,0.0000041392077,0.0005196272,0.00012947687],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000034901524,0.00012015218,0.000049867886,0.00018483521,0.00022367494,0.000017153969,0.00026718067,0.8454281,0.12965345,0.0002445854,0.0015506768,0.022225415],"study_design_scores_gemma":[0.0024303382,0.0005043373,0.0011046968,0.0005194327,0.00021831115,0.00052351545,0.00050705066,0.087296195,0.85324687,0.00077420735,0.051283382,0.001591677],"about_ca_topic_score_codex":0.000096073505,"about_ca_topic_score_gemma":0.000009232252,"teacher_disagreement_score":0.7581319,"about_ca_system_score_codex":0.0002593245,"about_ca_system_score_gemma":0.00001499989,"threshold_uncertainty_score":0.99984235},"labels":[],"label_agreement":null},{"id":"W2313193335","doi":"10.1109/tcpmt.2014.2349523","title":"Wideband Active Inductor and Negative Capacitance for Broadband RF and Microwave Applications","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wideband; Inductor; Capacitance; Parasitic capacitance; Amplifier; Materials science; CMOS; Electrical engineering; Parasitic extraction; Electronic engineering; Electrical impedance; Optoelectronics; Engineering; Physics; Voltage; Electrode","score_opus":0.01222247050780161,"score_gpt":0.20808502226240144,"score_spread":0.19586255175459982,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2313193335","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.50119567,0.00013433193,0.49731287,0.00018437201,0.0001365638,0.00039727398,0.0000401288,0.0003725121,0.0002262883],"genre_scores_gemma":[0.9975713,0.00021073,0.0017689073,0.00003866928,0.000024366165,0.00029985188,0.000003108126,0.000044503144,0.000038568265],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990225,0.000019298388,0.000191533,0.00039138563,0.00006658102,0.0003086917],"domain_scores_gemma":[0.9993909,0.00020418923,0.00004490319,0.00024047635,0.000028872644,0.00009067073],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00007486529,0.00026472338,0.0002749216,0.0003739796,0.00028386974,0.00004734873,0.00010561853,0.00020831262,0.0000021182293],"category_scores_gemma":[0.0000062712165,0.00027278738,0.000029225419,0.00010032475,0.00027520658,0.00013344729,5.5207903e-7,0.00041039515,0.0000022050103],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000329179,0.000040973475,0.000029570923,0.00014807384,0.00020704167,0.0000016150966,0.0005538742,0.00094633724,0.7840907,0.00055259874,0.000058355305,0.21333797],"study_design_scores_gemma":[0.0007387852,0.00008314128,0.00021675345,0.000077311626,0.00005418292,0.00007556983,0.00014318242,0.0014165851,0.9820886,0.013732207,0.0010826534,0.00029101208],"about_ca_topic_score_codex":0.000025572095,"about_ca_topic_score_gemma":0.000027819731,"teacher_disagreement_score":0.49637565,"about_ca_system_score_codex":0.00007210743,"about_ca_system_score_gemma":0.0000063837515,"threshold_uncertainty_score":0.9999724},"labels":[],"label_agreement":null},{"id":"W2314806106","doi":"10.1109/tcpmt.2015.2512985","title":"Effect of Bond Geometry on Shear Strength and HTS Reliability for Au Ball Bond on Al Pad","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Innovation, Science and Economic Development Canada","keywords":"Materials science; Bond strength; Bond; Piezoresistive effect; Composite material; Structural engineering; Adhesive; Engineering","score_opus":0.0070798529946751775,"score_gpt":0.21885552709643177,"score_spread":0.2117756741017566,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2314806106","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9758528,0.00003149645,0.022590606,0.0004735373,0.00031491314,0.0002411709,0.00008683914,0.00032204916,0.000086611675],"genre_scores_gemma":[0.99954844,0.00008647209,0.00019015254,0.000030265965,0.000016206022,0.00003745154,0.000003722978,0.000036235968,0.00005105203],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988061,0.000028290331,0.00026791604,0.00040900192,0.00013095033,0.00035771597],"domain_scores_gemma":[0.99904376,0.00041845464,0.000051018487,0.00038552392,0.000022852006,0.0000783985],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002130935,0.00029671143,0.0004202779,0.00067464955,0.0001563975,0.000016853448,0.00012939378,0.00023048486,0.000010517326],"category_scores_gemma":[0.000014089315,0.00020993143,0.00010651643,0.00011636912,0.00014860001,0.000069607406,0.0000027466135,0.00034878214,0.0000051762686],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006911659,0.0004411463,0.00073934474,0.0007203396,0.0010403757,0.000015194103,0.00026110755,0.0063416814,0.46245435,0.0005193406,0.00073530327,0.5260406],"study_design_scores_gemma":[0.0011547414,0.00081879454,0.0002928484,0.00022906599,0.00010562185,0.000009358615,0.000028904205,0.001058243,0.99443734,0.0003022819,0.0013187277,0.00024406472],"about_ca_topic_score_codex":0.000056494544,"about_ca_topic_score_gemma":0.000017191811,"teacher_disagreement_score":0.53198296,"about_ca_system_score_codex":0.00011601121,"about_ca_system_score_gemma":0.000007205892,"threshold_uncertainty_score":0.8560755},"labels":[],"label_agreement":null},{"id":"W2319599348","doi":"10.1109/tcpmt.2014.2377375","title":"Capacitance and Conductance of Through Silicon Vias With Consideration of Multilayer Media and Different Shapes","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Capacitance; Conductance; Materials science; RADIUS; Silicon; Optoelectronics; Acoustics; Optics; Physics; Condensed matter physics; Computer science; Electrode","score_opus":0.03071623851263045,"score_gpt":0.21965879630738344,"score_spread":0.188942557794753,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2319599348","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9408581,0.0005728122,0.057779446,0.00018436932,0.00009314127,0.0001252802,0.000015382651,0.00033476707,0.000036661677],"genre_scores_gemma":[0.99710715,0.00045985534,0.0023854482,0.000007743214,0.000003381427,0.0000146627535,8.257493e-7,0.000016526872,0.0000043857276],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993561,0.0000100953475,0.00018935527,0.0001961617,0.00009301821,0.0001552605],"domain_scores_gemma":[0.9996515,0.0000780034,0.000055580105,0.00015187646,0.00002651736,0.00003651765],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003737955,0.00017544621,0.00029532096,0.00019525937,0.00005418278,0.000009320333,0.00006166986,0.000137164,0.0000019522377],"category_scores_gemma":[0.000005498708,0.00014623586,0.000013358977,0.00005683224,0.0004242963,0.00011030566,0.000003401601,0.00022100631,2.9642598e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00044197278,0.00047496165,0.008015709,0.0014952464,0.00096164725,0.000045375727,0.009180402,0.01925009,0.8476061,0.0036704075,0.00013758762,0.10872047],"study_design_scores_gemma":[0.00088557764,0.00012520811,0.0020902362,0.00015133349,0.000034606273,0.000054718697,0.00078647275,0.002647375,0.98985606,0.003171382,0.000031889955,0.00016512454],"about_ca_topic_score_codex":0.000029727853,"about_ca_topic_score_gemma":0.0000552521,"teacher_disagreement_score":0.14224994,"about_ca_system_score_codex":0.000018323664,"about_ca_system_score_gemma":0.0000047523527,"threshold_uncertainty_score":0.59633255},"labels":[],"label_agreement":null},{"id":"W2324019639","doi":"10.1109/tcpmt.2014.2375635","title":"Thermomechanical Characteristics of Copper Through-Silicon via Structures","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Cisco Systems","keywords":"Materials science; Electron backscatter diffraction; Misorientation; Copper; Wafer; Finite element method; Through-silicon via; Residual stress; Composite material; Silicon; Metallurgy; Substrate (aquarium); Optoelectronics; Electronic engineering; Microstructure; Structural engineering","score_opus":0.022297799716071976,"score_gpt":0.2280479209746731,"score_spread":0.20575012125860112,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2324019639","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7430887,0.00009464367,0.25473204,0.00017331332,0.0004914721,0.00010536825,0.00001603596,0.0011515436,0.00014683709],"genre_scores_gemma":[0.9981608,0.00013949604,0.0015855854,0.00002332872,0.00001432551,0.000017420309,0.0000027697197,0.00003575605,0.000020559943],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990667,0.000013994474,0.00026496634,0.00023062142,0.00013580236,0.0002878985],"domain_scores_gemma":[0.9994679,0.000036160138,0.000051285653,0.00036343795,0.000023305616,0.000057876296],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006181098,0.00023298798,0.00033472755,0.00029743352,0.00007766257,0.000014196546,0.00022041303,0.00028510543,0.000011109265],"category_scores_gemma":[0.0000041443564,0.00021523927,0.000049059552,0.00010645606,0.00019664086,0.0000860008,0.000007995216,0.00045248546,0.000010722484],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00019492905,0.00036278917,0.0006717442,0.00041948337,0.00073313486,0.00006443693,0.0010097354,0.007413756,0.24930921,0.0031431026,0.00063622574,0.7360414],"study_design_scores_gemma":[0.000684716,0.00015539191,0.0008177644,0.00006211254,0.00004524993,0.00008349759,0.00022478997,0.0029376813,0.98061836,0.013038916,0.0010203065,0.00031118863],"about_ca_topic_score_codex":0.000030063904,"about_ca_topic_score_gemma":0.0000042621746,"teacher_disagreement_score":0.73573023,"about_ca_system_score_codex":0.000049024475,"about_ca_system_score_gemma":0.0000074270592,"threshold_uncertainty_score":0.87772024},"labels":[],"label_agreement":null},{"id":"W2340015982","doi":"10.1109/tcpmt.2016.2548498","title":"Systematic Design Technique for Dual-Band Branch-Line Coupler Using T- and Pi-Networks and Their Application in Novel Wideband-Ratio Crossover","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":46,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"","keywords":"Crossover; Multi-band device; Wideband; Network topology; Topology (electrical circuits); Power (physics); Computer science; Line (geometry); Electronic engineering; Physics; Electrical engineering; Telecommunications; Mathematics; Engineering; Computer network; Antenna (radio); Artificial intelligence","score_opus":0.016853711256498493,"score_gpt":0.2196839530747019,"score_spread":0.20283024181820342,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2340015982","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.28296176,0.0002842175,0.7156629,0.00006612374,0.000094046445,0.0006423256,0.000015184116,0.00027204692,0.0000014193264],"genre_scores_gemma":[0.99542576,0.00019867977,0.0040203566,0.000012305198,0.000017658265,0.00025509202,0.0000015368065,0.000050871087,0.000017739743],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990017,0.000014807529,0.00032019353,0.0003153636,0.00005178514,0.0002961414],"domain_scores_gemma":[0.999415,0.00023592457,0.000050750466,0.00022687875,0.000018016284,0.000053468986],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023704383,0.0002687752,0.0003529752,0.00039681018,0.00014220725,0.000040419556,0.000068097506,0.00021637707,7.4104935e-7],"category_scores_gemma":[0.00000634374,0.00021067669,0.000029362556,0.000088329056,0.00009897337,0.00010486388,0.0000037252682,0.00019650579,3.9334913e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029675299,0.00003193459,0.000020566224,0.0011070408,0.000073670555,0.0000010399515,0.00009135178,0.12183537,0.87417674,0.000037797112,0.000003838521,0.0025909806],"study_design_scores_gemma":[0.0010235138,0.000043223128,0.000072726376,0.0014798006,0.000031446958,0.000111914036,0.000019368192,0.2392195,0.75721925,0.0004822885,0.000024105828,0.0002728735],"about_ca_topic_score_codex":0.0000167536,"about_ca_topic_score_gemma":0.000011962435,"teacher_disagreement_score":0.712464,"about_ca_system_score_codex":0.00008220233,"about_ca_system_score_gemma":0.000006490115,"threshold_uncertainty_score":0.85911465},"labels":[],"label_agreement":null},{"id":"W2419917080","doi":"10.1109/tcpmt.2016.2564425","title":"Gap Waveguide PMC Packaging for Two-Layer PEC Surfaces","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"National Natural Science Foundation of China","keywords":"Stopband; Materials science; Microstrip; Chebyshev filter; Optoelectronics; Printed circuit board; Layer (electronics); Waveguide; Substrate (aquarium); Dielectric; Insertion loss; Band-pass filter; Conductor; Electronic circuit; Permittivity; Optics; Electronic engineering; Electrical engineering; Composite material; Engineering; Physics","score_opus":0.020349094367615225,"score_gpt":0.23405117595953406,"score_spread":0.21370208159191884,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2419917080","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.49078536,0.00014086791,0.5060027,0.0005577342,0.0007025439,0.00018650762,0.00003707518,0.0014492716,0.00013794519],"genre_scores_gemma":[0.9937685,0.00021889072,0.005275537,0.000027713488,0.00006234078,0.000080649996,0.0000026341543,0.000107461754,0.00045625583],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983285,0.000017710647,0.0003600397,0.00047837055,0.00013946016,0.000675893],"domain_scores_gemma":[0.99913377,0.00019486519,0.000046579353,0.00046421625,0.000032230448,0.00012834428],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00017630962,0.00041500563,0.00037451976,0.0006226934,0.00026529148,0.0000515869,0.0002448027,0.00019531138,0.000023234486],"category_scores_gemma":[0.000007505687,0.0003470932,0.00011428688,0.00011525926,0.00012715819,0.00014672168,0.0000064474757,0.0003075478,0.000036279504],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000042702723,0.00007219172,0.00011426173,0.00021774253,0.00030338572,0.000016500575,0.00014812159,0.03336186,0.8358697,0.00024404342,0.0004738333,0.12913562],"study_design_scores_gemma":[0.0013573578,0.00006348336,0.00019632437,0.00031282066,0.000050915434,0.00007106126,0.00005559263,0.010362294,0.9811337,0.0010229107,0.004861253,0.0005123078],"about_ca_topic_score_codex":0.000014213872,"about_ca_topic_score_gemma":0.000008734539,"teacher_disagreement_score":0.50298315,"about_ca_system_score_codex":0.000115993535,"about_ca_system_score_gemma":0.000009133772,"threshold_uncertainty_score":0.99989814},"labels":[],"label_agreement":null},{"id":"W2527810829","doi":"10.1109/tcpmt.2016.2610321","title":"Vacuum-Assisted Through Silicon via Filling Method With Ag-Based Epoxy","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Government of Alberta; CMC Microsystems","keywords":"Materials science; Epoxy; Microfabrication; Silicon; Electroplating; Composite material; Electrical resistivity and conductivity; Doping; Optoelectronics; Electrical engineering; Fabrication","score_opus":0.016333443622301384,"score_gpt":0.22957699428578565,"score_spread":0.21324355066348427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2527810829","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.33893576,0.00007050372,0.65674883,0.0008724574,0.00021404111,0.0001417622,0.00001264637,0.0029068822,0.000097090066],"genre_scores_gemma":[0.9699353,0.00009520112,0.029685603,0.00005174649,0.0000127588855,0.00007572303,0.0000018717227,0.00006718687,0.00007460079],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985746,0.00002661184,0.00026796502,0.0004578114,0.00015914234,0.00051385723],"domain_scores_gemma":[0.9991446,0.00017019115,0.0000588262,0.0005419345,0.000022272065,0.000062175495],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00008796718,0.00037633587,0.00036948384,0.0005285959,0.00025355065,0.000029011999,0.00026088333,0.0003217952,0.000031454732],"category_scores_gemma":[0.0000026535417,0.00027001766,0.00006986289,0.00020309484,0.00021634279,0.00015846002,0.000005552623,0.0004555551,0.000025225067],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011916796,0.00021974843,0.00025798476,0.00020804735,0.00051049824,0.00009733866,0.00012131762,0.022912653,0.30635297,0.00022080098,0.00011136839,0.6688681],"study_design_scores_gemma":[0.0012411159,0.00015066646,0.00046405397,0.00026727802,0.000063183834,0.00011513782,0.00006353463,0.005033294,0.98903567,0.0016859276,0.001444012,0.00043612308],"about_ca_topic_score_codex":0.000027191216,"about_ca_topic_score_gemma":0.000016877164,"teacher_disagreement_score":0.6826827,"about_ca_system_score_codex":0.00010392161,"about_ca_system_score_gemma":0.000010289271,"threshold_uncertainty_score":0.9999752},"labels":[],"label_agreement":null},{"id":"W2529531072","doi":"10.1109/tcpmt.2016.2609400","title":"Barium Strontium Titanate Capacitor Fabrication on Copper Printed Circuit Board","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Acoustic Wave Resonator Technologies","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Queen's University","funders":"","keywords":"Materials science; Capacitor; Printed circuit board; Microstrip; Optoelectronics; Fabrication; Resonator; Ceramic; Electrical engineering; Voltage; Composite material; Engineering","score_opus":0.014164418912809784,"score_gpt":0.206136461632576,"score_spread":0.19197204271976623,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2529531072","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4317448,0.000039721006,0.56348103,0.00084283366,0.0007458754,0.0001837108,0.000031552085,0.0027245614,0.00020589576],"genre_scores_gemma":[0.99855703,0.00016271179,0.0008920785,0.00002648461,0.000030174,0.00006853878,0.0000014873193,0.0000632216,0.00019830007],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986184,0.000018277597,0.00025917307,0.00042755823,0.00019388343,0.00048271025],"domain_scores_gemma":[0.9991778,0.00009198458,0.000051107352,0.00056641933,0.000033589662,0.00007910033],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000068858855,0.00032423172,0.00028086308,0.0007508047,0.0001745814,0.000028358028,0.00029124066,0.0003246512,0.000023817443],"category_scores_gemma":[0.000012202993,0.0002660946,0.00006244346,0.00013273273,0.00022297398,0.00010628666,0.000006985354,0.0004896163,0.00009558456],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008686309,0.00026281577,0.00022986312,0.00019011063,0.00051399355,0.000047314592,0.0001106399,0.009939866,0.4656309,0.0015293179,0.001588523,0.5198698],"study_design_scores_gemma":[0.0009080958,0.00014407732,0.0013320056,0.0002474687,0.000050514594,0.000034010915,0.00011228198,0.0036135705,0.98554116,0.0013810864,0.0061237686,0.0005119467],"about_ca_topic_score_codex":0.000009798562,"about_ca_topic_score_gemma":0.000005494358,"teacher_disagreement_score":0.5668122,"about_ca_system_score_codex":0.00028270477,"about_ca_system_score_gemma":0.00000770299,"threshold_uncertainty_score":0.99997914},"labels":[],"label_agreement":null},{"id":"W2550504490","doi":"10.1109/tcpmt.2016.2620424","title":"Completely Tuned Coupled Cavity Filters in Defected Bed of Nails Cavity","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Chebyshev filter; Band-pass filter; Filter (signal processing); Coupling (piping); Waveguide filter; Prototype filter; Materials science; m-derived filter; Coaxial; Waveguide; Electronic engineering; Filter design; Acoustics; Optoelectronics; Engineering; Physics; Electrical engineering","score_opus":0.012651562355130338,"score_gpt":0.20426673551034058,"score_spread":0.19161517315521023,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2550504490","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.78694135,0.00005010022,0.21172632,0.00014188659,0.00030339847,0.00013860967,0.000038750248,0.0006395437,0.000020052199],"genre_scores_gemma":[0.9988347,0.00009501838,0.00094978214,0.000009336177,0.000008551798,0.000032829685,0.0000026031594,0.000041142594,0.000025978568],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988037,0.000026741787,0.0003479004,0.00030159368,0.00011620877,0.00040387033],"domain_scores_gemma":[0.99936604,0.00013690664,0.000046731235,0.00035688365,0.000019856134,0.00007360459],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012784777,0.00027137002,0.00039469308,0.0007180959,0.00007583523,0.000011452269,0.0001793336,0.00019087721,0.000019551822],"category_scores_gemma":[0.0000070787664,0.0002397814,0.000068529844,0.00017529899,0.00014702794,0.00007815366,0.000005337665,0.00032396225,0.000009016798],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050042603,0.00010350889,0.00045163685,0.00016599856,0.00012328094,0.000020532014,0.00011086037,0.0136669455,0.9570176,0.000028276534,0.000040844923,0.0282205],"study_design_scores_gemma":[0.0012939839,0.000062407154,0.005067996,0.00030232346,0.000023824316,0.00003377557,0.00002280695,0.008478335,0.984003,0.00020251179,0.00019150153,0.00031751342],"about_ca_topic_score_codex":0.00013592983,"about_ca_topic_score_gemma":0.000080844984,"teacher_disagreement_score":0.21189342,"about_ca_system_score_codex":0.00010940626,"about_ca_system_score_gemma":0.000007417827,"threshold_uncertainty_score":0.9778002},"labels":[],"label_agreement":null},{"id":"W2561970944","doi":"10.1109/tcpmt.2016.2631545","title":"A Fully 3-D Printed Waveguide and Its Application as Microfluidically Controlled Waveguide Switch","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":45,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; CMC Microsystems","keywords":"Insertion loss; Materials science; Fused deposition modeling; Optoelectronics; Fabrication; Waveguide; Acrylonitrile butadiene styrene; Attenuation; 3D printing; Optics; Composite material","score_opus":0.007232318108705828,"score_gpt":0.20554900376031746,"score_spread":0.19831668565161162,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2561970944","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.59014577,0.00035670542,0.40660998,0.000901406,0.00022944003,0.00034400914,0.00001267383,0.0012081271,0.00019187634],"genre_scores_gemma":[0.99743253,0.0010160846,0.0008550269,0.000062357445,0.000033163797,0.00013272189,0.0000023553787,0.00007576682,0.00038998327],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99835026,0.000025891308,0.00045773998,0.00050518767,0.00015470157,0.0005061882],"domain_scores_gemma":[0.99920183,0.0001376531,0.000058753452,0.0003922346,0.000043538723,0.00016600944],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00018708293,0.00040050072,0.00047385076,0.00060554594,0.00020186507,0.00004056746,0.00020544787,0.00028015854,0.000020049356],"category_scores_gemma":[0.000016331798,0.00032436618,0.000082092214,0.00012035208,0.000110370696,0.00010682175,0.00001034174,0.0003622285,0.000067688976],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008425089,0.000046466026,0.000009962372,0.00007878227,0.00018510793,0.000012904214,0.000049055012,0.000621554,0.9374351,0.00026885135,0.0000611941,0.061146762],"study_design_scores_gemma":[0.0030220193,0.000081846505,0.0001498435,0.00022035281,0.00006227897,0.0002141628,0.00002404416,0.012340009,0.97765213,0.00065537414,0.0051445714,0.0004333809],"about_ca_topic_score_codex":0.000016336513,"about_ca_topic_score_gemma":0.000005101406,"teacher_disagreement_score":0.40728676,"about_ca_system_score_codex":0.000098734236,"about_ca_system_score_gemma":0.000013108321,"threshold_uncertainty_score":0.99992085},"labels":[],"label_agreement":null},{"id":"W2573372484","doi":"10.1109/tcpmt.2016.2635656","title":"Stable Model-Order Reduction of Active Circuits","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Model Reduction and Neural Networks","field":"Physics and Astronomy","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Passivity; Reduction (mathematics); Electronic circuit; Model order reduction; Stability (learning theory); Computer science; Equivalent circuit; Control theory (sociology); Class (philosophy); Electronic engineering; Algorithm; Mathematics; Engineering; Electrical engineering; Control (management); Voltage; Artificial intelligence","score_opus":0.02514894381153028,"score_gpt":0.25736191567334865,"score_spread":0.23221297186181838,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2573372484","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6567771,0.000005978258,0.34143874,0.0004511498,0.00034929003,0.00011289218,0.00001881145,0.00008449808,0.0007615721],"genre_scores_gemma":[0.99867475,0.000026978538,0.0005954394,0.000007644575,0.000039829672,0.000025162622,0.0000031060988,0.000019698451,0.0006073852],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99912506,0.000015257936,0.00018562368,0.00031731385,0.00010675546,0.000249987],"domain_scores_gemma":[0.99922276,0.000012187593,0.00018119453,0.0004845054,0.000039392125,0.000059956583],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000050967483,0.00017444917,0.00022779092,0.0002302889,0.0006579594,0.000041258532,0.00020187296,0.0000935904,0.00005170751],"category_scores_gemma":[7.3069407e-7,0.00017529518,0.000060765673,0.00004503057,0.00020508512,0.00020511948,0.000007597359,0.00037728046,0.0000049214805],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000102726684,0.00045117174,0.00016074732,0.000040869916,0.00028488037,0.000001912584,0.0002775451,0.096011356,0.07187778,0.0022197496,0.00010532187,0.82846594],"study_design_scores_gemma":[0.0007121316,0.000049014572,0.00027548376,0.00007058367,0.000047976275,0.000010750928,0.0001771837,0.028322173,0.9620369,0.007860694,0.00021001093,0.00022707005],"about_ca_topic_score_codex":0.00013428222,"about_ca_topic_score_gemma":0.0000021006856,"teacher_disagreement_score":0.89015913,"about_ca_system_score_codex":0.000020171889,"about_ca_system_score_gemma":0.000015695268,"threshold_uncertainty_score":0.714833},"labels":[],"label_agreement":null},{"id":"W2577379255","doi":"10.1109/tcpmt.2016.2642199","title":"Variability Analysis via Parameterized Model Order Reduction and Numerical Inversion of Laplace Transform","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Probabilistic and Robust Engineering Design","field":"Decision Sciences","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Laplace transform; Parameterized complexity; Model order reduction; Applied mathematics; Inversion (geology); Frequency domain; Algorithm; Subspace topology; Inverse Laplace transform; Numerical integration; Time domain; Mathematics; Frequency response; Dimensionality reduction; Representation (politics); Computer science; Numerical analysis; Mathematical optimization; Mathematical analysis","score_opus":0.045423512440772855,"score_gpt":0.2949294368384428,"score_spread":0.24950592439766994,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2577379255","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.42432624,0.000006109857,0.57461953,0.0007017903,0.00013022654,0.00010340364,0.000009316839,0.000076518125,0.000026828617],"genre_scores_gemma":[0.9807934,0.000030731448,0.01904255,0.000008583027,0.000005361942,0.0000135481605,0.0000011497491,0.000010491544,0.000094172974],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9983642,0.00006919378,0.00042977877,0.00056967797,0.00033021934,0.00023691352],"domain_scores_gemma":[0.99851674,0.0002412228,0.00020214441,0.0008693926,0.000075646756,0.000094861556],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00081607664,0.00019823159,0.0004974392,0.00075118436,0.0005492563,0.00008515612,0.0004037129,0.00020787267,0.000015564208],"category_scores_gemma":[0.000090522,0.00016242609,0.00010549193,0.00027041914,0.00042200048,0.00021508746,0.000013849779,0.00031714226,0.0000028066684],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00066151994,0.0006069772,0.0010293958,0.00010986759,0.00096092455,0.000009123182,0.0007278133,0.6232639,0.052864753,0.0005770812,0.00004005344,0.31914857],"study_design_scores_gemma":[0.00077694654,0.000102069826,0.0014795053,0.000027454953,0.00031896224,0.00002436042,0.000063102474,0.86991495,0.09486571,0.032132465,0.00004704935,0.00024739554],"about_ca_topic_score_codex":0.00008036173,"about_ca_topic_score_gemma":0.0000040303885,"teacher_disagreement_score":0.5564672,"about_ca_system_score_codex":0.000038926082,"about_ca_system_score_gemma":0.00001729685,"threshold_uncertainty_score":0.66235435},"labels":[],"label_agreement":null},{"id":"W2580149315","doi":"10.1109/tcpmt.2017.2650138","title":"Delay Extraction-Based Modeling Using Loewner Matrix Framework","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Attenuation; Matrix (chemical analysis); Computer science; Algorithm; Elmore delay; Mathematics; Mathematical optimization; Propagation delay; Delay calculation","score_opus":0.02217231772579142,"score_gpt":0.27601393778104594,"score_spread":0.2538416200552545,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2580149315","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5435567,0.00006762608,0.4551358,0.00017224065,0.0004318341,0.00009341672,0.000004875101,0.00050509017,0.00003245053],"genre_scores_gemma":[0.98632634,0.000058352405,0.013472588,0.000017153821,0.00003356506,0.000018592047,0.0000015573339,0.00004761567,0.00002422318],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9987841,0.000022208991,0.00025796032,0.00036990724,0.00015525488,0.00041054582],"domain_scores_gemma":[0.99894965,0.000080291604,0.00006207542,0.0007951725,0.0000211553,0.00009164066],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00010575904,0.00027633665,0.00026498464,0.00041234866,0.0010090967,0.00011999469,0.00030258205,0.00029624478,0.00003821531],"category_scores_gemma":[0.0000070151555,0.00028524097,0.0000763271,0.00005347013,0.00012204693,0.00017686877,0.000006387186,0.00080754916,0.000011269376],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050614617,0.000100305995,0.00013053109,0.00010282125,0.000066704124,0.00002287999,0.00005422242,0.901532,0.066771194,0.000038502076,0.0000075062526,0.03112273],"study_design_scores_gemma":[0.00034013114,0.000040813222,0.0001215781,0.00020712096,0.00004019947,0.000034013814,0.000018248713,0.7052349,0.29189438,0.0017432581,0.00007527272,0.00025012242],"about_ca_topic_score_codex":0.00009085754,"about_ca_topic_score_gemma":0.00002078594,"teacher_disagreement_score":0.44276968,"about_ca_system_score_codex":0.000087201486,"about_ca_system_score_gemma":0.000013146857,"threshold_uncertainty_score":0.99995995},"labels":[],"label_agreement":null},{"id":"W2597046580","doi":"10.1109/tcpmt.2017.2671518","title":"Determining the Stopband of a Periodic Bed of Nails From the Dispersion Relation Measurements Prediction","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Stopband; Solver; Dispersion relation; Dispersion (optics); Waveguide; Reflection (computer programming); Scattering; Optics; Acoustics; Scattering parameters; Propagation constant; Physics; Mathematical analysis; Mathematics; Computer science; Mathematical optimization; Resonator","score_opus":0.023734073880233998,"score_gpt":0.21728815419920885,"score_spread":0.19355408031897486,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2597046580","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9223283,0.000099256584,0.07660315,0.00016688606,0.00045091918,0.00013448637,0.000033018543,0.00014683019,0.000037179972],"genre_scores_gemma":[0.9995142,0.0001006237,0.00032127192,0.000004442474,0.000017488275,0.000010289015,0.0000033864965,0.000018973295,0.000009282123],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993096,0.000019275449,0.00022994925,0.00015310456,0.00014021422,0.00014784373],"domain_scores_gemma":[0.9992889,0.00007190178,0.000098362965,0.0004958189,0.000022785127,0.000022186292],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014533056,0.00014261364,0.00017190874,0.00012043958,0.0004470428,0.000032134867,0.00025966094,0.00010546251,0.000004295777],"category_scores_gemma":[0.0000109934845,0.000101307174,0.00005275632,0.00003357611,0.00018169766,0.00008960696,0.0000064419405,0.00027247198,0.0000012484405],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009733669,0.00017234037,0.026663527,0.00024485646,0.00075228146,0.0000028161162,0.0026812055,0.10037808,0.6842607,0.000032752847,0.00015885594,0.18455522],"study_design_scores_gemma":[0.00076198956,0.000056909153,0.117906295,0.00032831484,0.00009766676,0.0000053131967,0.00012013846,0.017938271,0.86228544,0.0001332809,0.00022454007,0.00014186035],"about_ca_topic_score_codex":0.00006424651,"about_ca_topic_score_gemma":0.000012718476,"teacher_disagreement_score":0.18441336,"about_ca_system_score_codex":0.00003084438,"about_ca_system_score_gemma":0.0000043322325,"threshold_uncertainty_score":0.41311866},"labels":[],"label_agreement":null},{"id":"W2600349189","doi":"10.1109/tcpmt.2017.2676719","title":"Optimal Thermal Conditions for Maximum Power Generation When Operating Thermoelectric Liquid-to-Liquid Generators","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Thermoelectric Materials and Devices","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Outaouais","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Thermoelectric generator; Heat exchanger; Materials science; Heat transfer; Thermoelectric effect; Electricity generation; Thermoelectric cooling; Heat flux; Heat generation; Generator (circuit theory); Power (physics); Nuclear engineering; Mechanical engineering; Thermodynamics; Mechanics; Engineering; Physics","score_opus":0.02140944619754025,"score_gpt":0.26797552807111136,"score_spread":0.2465660818735711,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2600349189","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7094953,0.000034150715,0.2881446,0.00083343027,0.0007077233,0.00040667833,0.000059397466,0.00027514872,0.00004353355],"genre_scores_gemma":[0.99033254,0.000019288998,0.00890149,0.00022700764,0.000115626724,0.0002738673,0.000008456657,0.000050782317,0.00007095052],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99828875,0.000057919868,0.00033604552,0.00060963235,0.00016007847,0.00054757146],"domain_scores_gemma":[0.9989438,0.00006056693,0.00019856071,0.00061521964,0.000063487874,0.00011835058],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":[],"category_scores_codex":[0.00028444038,0.00031104236,0.00033790316,0.00035387505,0.0021754387,0.00031149035,0.00044907632,0.0001860833,0.00014602109],"category_scores_gemma":[0.00001760689,0.00028544976,0.000069873655,0.000051070874,0.00014380222,0.0003041867,0.0000177241,0.00019793595,0.000035324563],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016331021,0.000067289024,0.0000020772684,0.00001240436,0.000030013834,0.0000047894705,0.00014402636,0.0059110397,0.9894504,0.00018996233,0.000026619104,0.003998075],"study_design_scores_gemma":[0.0006151112,0.0006581854,0.000046209618,0.000036095535,0.000034899775,0.00002552752,0.000037760747,0.0016039112,0.9957847,0.00031115356,0.00051150075,0.00033493424],"about_ca_topic_score_codex":0.000051276093,"about_ca_topic_score_gemma":0.00001460635,"teacher_disagreement_score":0.2808372,"about_ca_system_score_codex":0.00006627605,"about_ca_system_score_gemma":0.000028813924,"threshold_uncertainty_score":0.99995977},"labels":[],"label_agreement":null},{"id":"W2623763811","doi":"10.1109/tcpmt.2017.2702753","title":"Self-Packaged, Low-Loss, Planar Bandpass Filters for Millimeter-Wave Application Based on Printed Gap Waveguide Technology","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":57,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Band-pass filter; Printed circuit board; Insertion loss; Microstrip; Planar; Waveguide; Electronic circuit; Extremely high frequency; Materials science; Realization (probability); Waveguide filter; Electronic engineering; Filter (signal processing); Prototype filter; Computer science; Optoelectronics; Electrical engineering; Low-pass filter; Engineering; Telecommunications; Mathematics","score_opus":0.014655794463199423,"score_gpt":0.22087906631769785,"score_spread":0.20622327185449843,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2623763811","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3185647,0.000034840425,0.67709345,0.0009076301,0.0005606954,0.00052111695,0.00007478154,0.0020982472,0.0001445469],"genre_scores_gemma":[0.9851059,0.00009549688,0.014234984,0.00005387961,0.000044280503,0.00027211822,0.000021021906,0.00010814077,0.00006421661],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99820095,0.000019340101,0.00037969934,0.0006206244,0.00015455259,0.00062482216],"domain_scores_gemma":[0.9983905,0.00013366713,0.00011765896,0.0012004996,0.00004115381,0.00011652028],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00020437305,0.0004813855,0.00043772688,0.001098758,0.000714961,0.00009894387,0.00045883772,0.00044553788,0.000005364669],"category_scores_gemma":[0.000017477558,0.00050653017,0.00012411403,0.000107239975,0.00019519629,0.00010161823,0.000008335932,0.00064962934,0.000021669548],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006910429,0.0012020064,0.0003762726,0.0029586453,0.0017770521,0.0001865249,0.0003025561,0.23178098,0.54294485,0.0012520346,0.0011885022,0.21533954],"study_design_scores_gemma":[0.0013696087,0.00014831191,0.00022197567,0.00023802834,0.000066585686,0.000049755366,0.000021528387,0.2343844,0.7566289,0.00059364026,0.0057714926,0.00050579256],"about_ca_topic_score_codex":0.000012546939,"about_ca_topic_score_gemma":0.00000951477,"teacher_disagreement_score":0.66654116,"about_ca_system_score_codex":0.00016032973,"about_ca_system_score_gemma":0.00001311932,"threshold_uncertainty_score":0.99973863},"labels":[],"label_agreement":null},{"id":"W2732841385","doi":"10.1109/tcpmt.2017.2711480","title":"Efficient Modeling of Power Supply Induced Jitter in Voltage-Mode Drivers (EMPSIJ)","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":40,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Jitter; Electronic engineering; Voltage; Computer science; Power (physics); Noise (video); Mode (computer interface); SIGNAL (programming language); Electronic circuit; Electrical engineering; Engineering; Physics","score_opus":0.01253867020831403,"score_gpt":0.23373482158791606,"score_spread":0.22119615137960202,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2732841385","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96026504,0.000027762626,0.03861218,0.00019159063,0.0003465616,0.00017017519,0.00000870257,0.00025327833,0.0001247323],"genre_scores_gemma":[0.99950325,0.000030569914,0.00040101414,0.000008015846,0.000005166613,0.000015455063,0.0000010387248,0.000024497167,0.0000110165065],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989674,0.00001572755,0.00026481718,0.00029385267,0.00013200157,0.0003262194],"domain_scores_gemma":[0.9992618,0.000034757446,0.00005021627,0.0005853535,0.000014929832,0.000052973213],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000092049915,0.00020422762,0.00027918542,0.00052645465,0.00023255973,0.0000276952,0.0002797825,0.00018024644,0.000018498637],"category_scores_gemma":[0.000003923402,0.00021271982,0.000053615393,0.000053236534,0.00009967331,0.00006269702,0.000010457858,0.0005188646,0.0000041236376],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000063272746,0.0001978369,0.0007381212,0.000104758314,0.000055728186,0.000016599271,0.00069502124,0.6080984,0.3661048,0.00002441435,0.0000075753314,0.023893496],"study_design_scores_gemma":[0.0007782791,0.00008413722,0.0043526455,0.00020516777,0.000015516453,0.000008720598,0.00005911864,0.4453304,0.54853946,0.00040707347,0.000012553256,0.00020694213],"about_ca_topic_score_codex":0.00018344975,"about_ca_topic_score_gemma":0.00007976312,"teacher_disagreement_score":0.18243462,"about_ca_system_score_codex":0.000059658898,"about_ca_system_score_gemma":0.0000075546204,"threshold_uncertainty_score":0.8674463},"labels":[],"label_agreement":null},{"id":"W2746244107","doi":"10.1109/tcpmt.2017.2734639","title":"A Dual-Mode Wideband +17.7-dBm 60-GHz Power Amplifier in 65-nm CMOS","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Amplifier; RF power amplifier; Power bandwidth; Electrical engineering; dBm; Power-added efficiency; Cascode; Wideband; CMOS; Linear amplifier; Power gain; Direct-coupled amplifier; Electronic engineering; Impedance matching; Transformer; Bandwidth (computing); Materials science; Electrical impedance; Engineering; Voltage; Operational amplifier; Telecommunications","score_opus":0.016477537744574,"score_gpt":0.24002922951388123,"score_spread":0.22355169176930723,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2746244107","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8854822,0.00013123825,0.10727294,0.00068869145,0.0013962244,0.0003395509,0.000034766577,0.0012563075,0.003398103],"genre_scores_gemma":[0.9990059,0.00015778128,0.00030620705,0.00004666853,0.000021399706,0.00008731781,0.000002449869,0.00007828901,0.00029398978],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99825025,0.000030179635,0.00037786452,0.00051397935,0.00018255315,0.0006451607],"domain_scores_gemma":[0.99870336,0.00006390002,0.00007980286,0.0010141336,0.00002175982,0.00011701559],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00014160162,0.000414223,0.00043003878,0.00085325877,0.00046950573,0.00015336866,0.0004565609,0.00039062265,0.000062510735],"category_scores_gemma":[0.000009317406,0.00043185707,0.00008192783,0.00010684359,0.0002633834,0.00029860556,0.0000027347119,0.0010697271,0.00004898398],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015545856,0.00058190274,0.0013763272,0.0002879052,0.00089338777,0.0012165386,0.0015381442,0.20516181,0.60349935,0.000512061,0.0017896662,0.18298742],"study_design_scores_gemma":[0.0016495796,0.00010636863,0.0035120929,0.00038565238,0.000056218727,0.00029376498,0.00012831471,0.0073042354,0.9782055,0.0046119415,0.002906519,0.00083980267],"about_ca_topic_score_codex":0.00022281668,"about_ca_topic_score_gemma":0.0001611012,"teacher_disagreement_score":0.37470612,"about_ca_system_score_codex":0.00019240011,"about_ca_system_score_gemma":0.000016158392,"threshold_uncertainty_score":0.9998133},"labels":[],"label_agreement":null},{"id":"W2772960756","doi":"10.1109/tcpmt.2017.2774188","title":"Analysis, Modeling, and Mitigation of Parasitic Resonances in Integrated Metallic Seal Rings","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal; McGill University","funders":"","keywords":"Resonance (particle physics); Capacitor; Equivalent circuit; Integrated circuit; Optoelectronics; Materials science; Electrical element; Silicon; Electronic circuit; Electrical engineering; Electronic engineering; Acoustics; Physics; Engineering; Voltage; Atomic physics","score_opus":0.012751748989241092,"score_gpt":0.23098284460421376,"score_spread":0.21823109561497267,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2772960756","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8293449,0.00020889073,0.16993086,0.000111746005,0.00009876988,0.00006701455,0.000009816558,0.00019929567,0.000028691471],"genre_scores_gemma":[0.99847406,0.00039252883,0.0010720015,0.0000042022266,0.000004963424,0.00001255544,0.0000032290445,0.00001814132,0.000018288723],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9992312,0.000011723602,0.0002392991,0.00023159455,0.000075290605,0.00021085025],"domain_scores_gemma":[0.9995544,0.000024738758,0.000047401376,0.00030818617,0.000013944479,0.00005132588],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000113204755,0.00017429366,0.00030996083,0.00077752006,0.00014569565,0.00004085491,0.00014631537,0.00012407667,0.0000026494608],"category_scores_gemma":[0.0000060735993,0.00017894406,0.000046668672,0.0001077975,0.000116305346,0.00011044337,0.0000032706043,0.00029653375,8.6998193e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039840157,0.00011172365,0.005589805,0.00035579337,0.0009936546,0.000025259385,0.00046596472,0.84821296,0.09688598,0.0002447214,0.00000716523,0.047067147],"study_design_scores_gemma":[0.00044344546,0.000029791801,0.0061926907,0.00016913645,0.00014005679,0.000012909236,0.00006750267,0.56262016,0.42958242,0.000465081,0.000055394066,0.00022140314],"about_ca_topic_score_codex":0.00016234868,"about_ca_topic_score_gemma":0.00012567233,"teacher_disagreement_score":0.33269644,"about_ca_system_score_codex":0.000031135005,"about_ca_system_score_gemma":0.0000049274986,"threshold_uncertainty_score":0.7297127},"labels":[],"label_agreement":null},{"id":"W2789405386","doi":"10.1109/tcpmt.2018.2806562","title":"Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Antenna Design and Analysis","field":"Engineering","cited_by":96,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Antenna efficiency; Antenna measurement; Electronic engineering; MIMO; Electrical engineering; Reflection coefficient; Antenna tuner; Antenna factor; Computer science; Dipole antenna; Physics; Antenna (radio); Engineering; Beamforming","score_opus":0.014849842455606433,"score_gpt":0.2223071363205457,"score_spread":0.20745729386493925,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2789405386","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.43145376,0.000027415825,0.5676257,0.00008302294,0.00005147419,0.00034042532,0.000017985423,0.00039878968,0.0000014535192],"genre_scores_gemma":[0.9692451,0.00006904914,0.03037314,0.000017144524,0.000027269294,0.00016643957,0.000013403228,0.00005974802,0.000028732211],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99878997,0.000030082601,0.0002985353,0.00042501013,0.00010733679,0.0003490688],"domain_scores_gemma":[0.99923915,0.00015820914,0.00009146597,0.0003556024,0.00007354443,0.00008202129],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00012878595,0.0002927349,0.00036867225,0.0006413416,0.00036642063,0.000039843966,0.00016268989,0.00017162762,0.0000033837007],"category_scores_gemma":[0.0000025708257,0.000277057,0.000047747326,0.00020746318,0.0002777842,0.0001805519,0.0000042950032,0.00023307613,0.0000026462765],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00032865777,0.00023780724,0.0009156844,0.00028040353,0.0005017253,0.000004019102,0.000450638,0.0066271084,0.90381265,0.00004753914,0.000004386436,0.08678941],"study_design_scores_gemma":[0.0014197028,0.00026044692,0.0011052815,0.00013217102,0.00014709924,0.000021253414,0.00020108384,0.659448,0.33664787,0.00023679157,0.000050112892,0.00033016992],"about_ca_topic_score_codex":0.000037696205,"about_ca_topic_score_gemma":0.00002794723,"teacher_disagreement_score":0.6528209,"about_ca_system_score_codex":0.000036492424,"about_ca_system_score_gemma":0.000009544253,"threshold_uncertainty_score":0.9999682},"labels":[],"label_agreement":null},{"id":"W2789915583","doi":"10.1109/tcpmt.2018.2794202","title":"Development of Embedded Redistribution Layer-Based Silicon Interposer for 3-D Integration","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Government of Alberta; CMC Microsystems","keywords":"Materials science; Silicon; Fabrication; Electrical conductor; Redistribution (election); Optoelectronics; Interposer; Contact resistance; Composite material; Nanotechnology; Electronic engineering; Engineering physics; Layer (electronics); Engineering; Etching (microfabrication)","score_opus":0.022604601872157726,"score_gpt":0.24682673645428832,"score_spread":0.22422213458213058,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2789915583","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.48850134,0.000010324807,0.51038677,0.00007403399,0.00022549476,0.00012500818,0.000012371332,0.00063352264,0.000031133262],"genre_scores_gemma":[0.98044586,0.0000068284658,0.019404434,0.000010575417,0.000012329335,0.00007603366,0.000012284385,0.000021151274,0.0000104849205],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99921507,0.0000063983584,0.00026739133,0.00020768035,0.00007651671,0.00022691836],"domain_scores_gemma":[0.9996176,0.00003705329,0.000050395633,0.00022644001,0.000040650957,0.000027878485],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008260219,0.00017598814,0.00019736795,0.000445167,0.00016748933,0.000012993532,0.00013766171,0.00020031093,0.0000065459376],"category_scores_gemma":[0.0000049730743,0.00017185348,0.000042178155,0.0001040076,0.0001703879,0.00006100266,0.000003135625,0.00019926186,0.0000051028433],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001046797,0.00012295952,0.000015198481,0.00014842834,0.00012315955,0.0000010028974,0.0003427084,0.0011670395,0.55533206,0.00034195054,0.000099810066,0.44220102],"study_design_scores_gemma":[0.0004892047,0.00011658936,0.00010071608,0.000121039506,0.00001917876,0.000003873187,0.00019554624,0.02077127,0.9764261,0.0006854265,0.00091360824,0.00015742706],"about_ca_topic_score_codex":0.00000234393,"about_ca_topic_score_gemma":0.000016314989,"teacher_disagreement_score":0.49194455,"about_ca_system_score_codex":0.000078512756,"about_ca_system_score_gemma":0.000012341073,"threshold_uncertainty_score":0.70079815},"labels":[],"label_agreement":null},{"id":"W2792696860","doi":"10.1109/tcpmt.2018.2810064","title":"A Novel Multifunctional EBG-Based Coupled-Line-Defect Directional Coupler Based on Layered Dielectric Substrates","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ontario Tech University; Innovation, Science and Economic Development Canada; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Power dividers and directional couplers; Coupling (piping); Hybrid coupler; Realization (probability); Topology (electrical circuits); Dielectric; Materials science; Metamaterial; Optoelectronics; Line (geometry); Rat-race coupler; Electronic engineering; Antenna (radio); Physics; Optics; Computer science; Engineering; Telecommunications; Electrical engineering","score_opus":0.014952660739981749,"score_gpt":0.21490234978027387,"score_spread":0.19994968904029212,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2792696860","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.42310676,0.000038174916,0.57422084,0.00016456447,0.0007852395,0.00013463298,0.000039828756,0.0014172512,0.00009267956],"genre_scores_gemma":[0.9963483,0.000018137724,0.0031865607,0.0000997643,0.00010386984,0.00006735694,0.000020288908,0.00008274448,0.00007295158],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99845994,0.000015348622,0.0003013744,0.0004862498,0.00022999561,0.00050711],"domain_scores_gemma":[0.99922705,0.00019904009,0.000045860754,0.00035998845,0.00005551435,0.00011257328],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00013297949,0.0004176944,0.00030535748,0.0009996289,0.00037584602,0.000051665786,0.00016570529,0.00026072646,0.00006781669],"category_scores_gemma":[0.000008134407,0.0004274395,0.00012959498,0.0002925196,0.00017481759,0.0000627098,0.0000023827272,0.00061249494,0.00005058608],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012501697,0.00025178088,0.00006123803,0.000072775845,0.00015720236,0.0000075163193,0.000016186608,0.8006276,0.1938082,0.0000250035,0.00011035705,0.004737124],"study_design_scores_gemma":[0.00093756296,0.00018600198,0.00081592315,0.00008676895,0.000030105262,0.000023247463,0.0000054507645,0.5488395,0.44813073,0.000032717704,0.00061679736,0.00029521924],"about_ca_topic_score_codex":0.0000559402,"about_ca_topic_score_gemma":0.000036403006,"teacher_disagreement_score":0.57324153,"about_ca_system_score_codex":0.00014258025,"about_ca_system_score_gemma":0.000025779631,"threshold_uncertainty_score":0.9998177},"labels":[],"label_agreement":null},{"id":"W2796049108","doi":"10.1109/tcpmt.2018.2810738","title":"Packaging-Induced Range Tunability of Tactile Sensors for Physiological Signal Monitoring Applications","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta; CMC Microsystems","keywords":"Microelectromechanical systems; Emulation; Tactile sensor; Materials science; Polydimethylsiloxane; SIGNAL (programming language); Pressure sensor; Fabrication; Reusability; Sensitivity (control systems); Electronic engineering; Acoustics; Computer science; Optoelectronics; Mechanical engineering; Nanotechnology; Engineering","score_opus":0.028511548501926304,"score_gpt":0.2564460121458624,"score_spread":0.22793446364393607,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2796049108","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.74134564,0.000014092259,0.25722036,0.000042382206,0.00035900154,0.00024549483,0.000024332981,0.0007148535,0.000033809138],"genre_scores_gemma":[0.9948727,0.000026838703,0.0047393315,0.0000064927785,0.000114397495,0.00017489906,0.0000027981794,0.000041352636,0.000021211334],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988628,0.000023735047,0.00030704954,0.0003496244,0.00009511043,0.0003616903],"domain_scores_gemma":[0.99935424,0.00011967942,0.000067602596,0.0003340119,0.00005227203,0.00007218105],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000096170435,0.0002444754,0.00034293107,0.0002630235,0.0002708247,0.000018575383,0.00015712662,0.00018378964,0.000012045483],"category_scores_gemma":[0.0000054424236,0.00024229506,0.000072490206,0.000114539216,0.00020368517,0.00008661301,0.000004929032,0.00022712098,0.000006226419],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000054585096,0.00008917288,0.000082249695,0.00017988111,0.000078421595,0.000001133218,0.000081355916,0.01634668,0.96057254,0.00004108712,0.0000086103055,0.022464294],"study_design_scores_gemma":[0.00045202562,0.00013631531,0.000933032,0.00007172453,0.000032012456,0.000011069885,0.000073038034,0.00233896,0.99417293,0.0011935349,0.0003543107,0.00023104704],"about_ca_topic_score_codex":0.0000150648175,"about_ca_topic_score_gemma":0.0000023985228,"teacher_disagreement_score":0.25352702,"about_ca_system_score_codex":0.00005376652,"about_ca_system_score_gemma":0.0000051376237,"threshold_uncertainty_score":0.9880506},"labels":[],"label_agreement":null},{"id":"W2803611450","doi":"10.1109/tcpmt.2018.2834730","title":"Wideband and Ultrawideband Phase Shifter Designs Based on Low-Pass/Bandpass/High-Pass Networks","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Alberta Innovates - Technology Futures","keywords":"Band-pass filter; Phase shift module; Wideband; Microstrip; Passband; Inductor; Capacitor; Electronic engineering; Phase (matter); Insertion loss; Electrical engineering; Engineering; Physics; Computer science; Materials science; Voltage","score_opus":0.010942489982687214,"score_gpt":0.21671775863847267,"score_spread":0.20577526865578546,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2803611450","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.470504,0.00006178764,0.52768934,0.00019148515,0.000557902,0.00014211766,0.000016611137,0.0007800366,0.0000567374],"genre_scores_gemma":[0.9978257,0.00012441618,0.0016105174,0.00013726104,0.000099848105,0.00004237677,0.000007924656,0.000091065616,0.00006088108],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983837,0.000032072847,0.00032170356,0.0005160581,0.00015211261,0.0005943561],"domain_scores_gemma":[0.99914616,0.00015755025,0.00004280549,0.00046125238,0.000025376197,0.00016686985],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00014963369,0.00046277678,0.00039648922,0.000677743,0.0003514562,0.00009231332,0.00017954188,0.00031775696,0.000032245167],"category_scores_gemma":[0.0000046188047,0.0004559213,0.00006497768,0.00016277345,0.0002664917,0.000101259175,0.000004345767,0.00063437177,0.00001578143],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00069239025,0.0008090466,0.00017979727,0.000528639,0.00071180647,0.00015790226,0.00050238223,0.5989178,0.23383173,0.00013842425,0.0016434502,0.16188665],"study_design_scores_gemma":[0.0031266536,0.00047374298,0.0004940983,0.0003989976,0.00008463215,0.0000584866,0.00002551852,0.25094795,0.7420748,0.00026558488,0.0013622729,0.0006872639],"about_ca_topic_score_codex":0.000023205195,"about_ca_topic_score_gemma":0.000013083436,"teacher_disagreement_score":0.52732176,"about_ca_system_score_codex":0.00006867662,"about_ca_system_score_gemma":0.000008018836,"threshold_uncertainty_score":0.99978924},"labels":[],"label_agreement":null},{"id":"W2811169180","doi":"10.1109/tcpmt.2018.2845847","title":"Printing Green Nanomaterials for Organic Electronics","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Guelph","funders":"Ontario Ministry of Agriculture, Food and Rural Affairs","keywords":"Printed electronics; Materials science; Nanotechnology; Nanomaterials; Electronics; Context (archaeology); Nanocellulose; Inkwell; Electrical conductor; Organic electronics; Fabrication; Conductive ink; Substrate (aquarium); Electrical engineering; Sheet resistance; Engineering; Composite material; Transistor; Cellulose; Chemical engineering","score_opus":0.012450220967350802,"score_gpt":0.2180858767042127,"score_spread":0.2056356557368619,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2811169180","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.80167526,0.00006033223,0.1938572,0.0002352122,0.00089488644,0.0002520442,0.000013591082,0.0029751323,0.00003631849],"genre_scores_gemma":[0.99357873,0.00014470756,0.0059762364,0.000022992372,0.00007768338,0.00007627271,0.000002349468,0.00006578207,0.00005522949],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987627,0.000013272378,0.00028871757,0.0003368208,0.000074936186,0.00052349793],"domain_scores_gemma":[0.9994574,0.000051139024,0.000047803158,0.0003732522,0.000028491784,0.000041901476],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00016069312,0.00026708827,0.00030016634,0.00043316217,0.0003414086,0.00006489215,0.00027546202,0.00025569924,0.000028782464],"category_scores_gemma":[0.000005830527,0.00026980357,0.000050042996,0.00011329441,0.00016046665,0.00007999041,0.000010619879,0.00019955188,0.000025422303],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000030471669,0.000030421992,0.000017391105,0.00013332584,0.000105663166,0.0000023565365,0.0000616907,0.00018799036,0.9181478,0.00022179085,0.000030824755,0.08103028],"study_design_scores_gemma":[0.00042412902,0.00015574196,0.000067113055,0.000060803493,0.000029100682,0.00004555134,0.000025183926,0.001563548,0.9894454,0.003152345,0.004746047,0.00028503884],"about_ca_topic_score_codex":0.000009835337,"about_ca_topic_score_gemma":0.000016654127,"teacher_disagreement_score":0.19190346,"about_ca_system_score_codex":0.00006342719,"about_ca_system_score_gemma":0.000008715903,"threshold_uncertainty_score":0.99997544},"labels":[],"label_agreement":null},{"id":"W2865059223","doi":"10.1109/tcpmt.2018.2853595","title":"Monolithic IPD-MEMS Technology and Its Applications to High-&lt;inline-formula&gt; &lt;tex-math notation=\"LaTeX\"&gt;$Q$ &lt;/tex-math&gt; &lt;/inline-formula&gt; Switched Capacitor Banks and Variable True-Time-Delay Networks","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Varicap; Microelectromechanical systems; Variable capacitor; Capacitance; Capacitor; Insertion loss; Materials science; Resolution (logic); Electronic engineering; Optoelectronics; Electrical engineering; Computer science; Physics; Voltage; Engineering","score_opus":0.009933917521419438,"score_gpt":0.21235573053359827,"score_spread":0.20242181301217882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2865059223","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5984372,0.0007313167,0.3951677,0.0007088138,0.00078480947,0.0011943707,0.00013545134,0.0026131677,0.00022716857],"genre_scores_gemma":[0.9918557,0.0007166728,0.0056490074,0.00012693023,0.00022805984,0.00079079357,0.000056191668,0.00025793343,0.00031870778],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99532294,0.00007140645,0.0011873065,0.0014783866,0.0004334308,0.0015065225],"domain_scores_gemma":[0.99736977,0.00028112892,0.0002721514,0.0013581287,0.000276023,0.0004428112],"candidate_categories":["metaepi_narrow","research_integrity"],"consensus_categories":[],"category_scores_codex":[0.00046587162,0.0011570834,0.001178047,0.0025985164,0.0010796884,0.00022429816,0.00079610985,0.0015675183,0.000034386667],"category_scores_gemma":[0.00003925137,0.0011966131,0.00013140039,0.0014145965,0.0005437605,0.0005351531,0.000023982358,0.0017087788,0.000159904],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012261295,0.0003840528,0.000037634458,0.00035109636,0.0010463825,0.000057832247,0.0007414006,0.05854783,0.8339904,0.01870175,0.00027369865,0.085745305],"study_design_scores_gemma":[0.0028730026,0.00066587405,0.0003308039,0.00061531924,0.0005217829,0.0009631296,0.00010022144,0.39033663,0.57915705,0.008769228,0.013475455,0.0021915087],"about_ca_topic_score_codex":0.00006013907,"about_ca_topic_score_gemma":0.00007733755,"teacher_disagreement_score":0.39341852,"about_ca_system_score_codex":0.0004546736,"about_ca_system_score_gemma":0.000077885365,"threshold_uncertainty_score":0.9997287},"labels":[],"label_agreement":null},{"id":"W2886017228","doi":"10.1109/tcpmt.2018.2864595","title":"Performance and Diagnosis of Aluminum Connectors Tested Inside MV Cable Splices","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electrical Contact Performance and Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hydro-Québec","funders":"","keywords":"Cable gland; Cable harness; Shielded cable; Overheating (electricity); Engineering; Overhead (engineering); Electrical conductor; Electrical engineering; Reliability engineering; Structural engineering; Computer science","score_opus":0.010272252309606753,"score_gpt":0.20671210143258942,"score_spread":0.19643984912298268,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2886017228","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9938919,0.000113343114,0.0051067728,0.00009920557,0.00013187887,0.000087003995,0.0000059091262,0.00037340712,0.00019056017],"genre_scores_gemma":[0.99837303,0.0012229338,0.00027795177,0.000023279508,0.000018484947,0.000023242474,0.0000013086815,0.000021267797,0.000038511844],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991836,0.000009224651,0.00021533505,0.0002179493,0.000092004884,0.00028188684],"domain_scores_gemma":[0.99959403,0.00006926074,0.000042862433,0.0002093564,0.000025155718,0.000059345188],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006047969,0.00018378178,0.00027286293,0.00055283,0.00021733026,0.000018310086,0.00011141173,0.00012581176,0.000021802627],"category_scores_gemma":[0.0000019593615,0.00017669097,0.000035416702,0.0002330329,0.0001684037,0.00014432949,0.0000034053169,0.00025746858,0.000007816288],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017054958,0.00050128775,0.0967872,0.0012682115,0.0013923316,0.00002399927,0.0013838846,0.018287346,0.17945997,0.00007578422,0.00029595764,0.7003535],"study_design_scores_gemma":[0.00037551933,0.00023290666,0.0059339693,0.00012404146,0.00007412881,0.000017385188,0.000052391566,0.03431343,0.9577267,0.000042462572,0.0008859727,0.00022106316],"about_ca_topic_score_codex":0.00011113418,"about_ca_topic_score_gemma":0.00007667805,"teacher_disagreement_score":0.7782668,"about_ca_system_score_codex":0.000029904311,"about_ca_system_score_gemma":0.0000057716957,"threshold_uncertainty_score":0.72052485},"labels":[],"label_agreement":null},{"id":"W2886415527","doi":"10.1109/tcpmt.2018.2864171","title":"Optimization of Thermoelectric Generators in the Presence of Heat Losses and Fluid Flows","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Thermoelectric Materials and Devices","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Outaouais","funders":"Natural Sciences and Engineering Research Council of Canada; Agence Nationale de la Recherche","keywords":"Thermoelectric effect; Materials science; Thermoelectric generator; Mechanics; Nuclear engineering; Environmental science; Thermodynamics; Physics; Engineering","score_opus":0.011543083501261198,"score_gpt":0.23313539967335387,"score_spread":0.22159231617209266,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2886415527","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.86644024,0.00014758046,0.13294668,0.000115505536,0.00013253042,0.00014141532,0.000006691675,0.000046909234,0.000022447306],"genre_scores_gemma":[0.9972272,0.00022372395,0.0024840245,0.000023684708,0.000013547129,0.000014965495,5.018159e-7,0.000008947941,0.0000034059121],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99919015,0.00006670545,0.00023364407,0.00021876639,0.00011120898,0.00017951772],"domain_scores_gemma":[0.99956894,0.000092327,0.00007537916,0.00021777826,0.00002748287,0.000018110219],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001874399,0.000117948286,0.00020017358,0.0002822304,0.00012649078,0.000017639533,0.00017250731,0.00007491852,0.000027225291],"category_scores_gemma":[0.000005604907,0.000085748296,0.000015994925,0.00018260263,0.00023492884,0.0000851657,0.0000051586767,0.000085925225,0.0000010518157],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008140021,0.00007716761,0.000041375624,0.000048407604,0.000008703466,0.0000015925588,0.00028834888,0.012847683,0.97846705,0.00007821875,0.0000017663796,0.00805829],"study_design_scores_gemma":[0.00025639715,0.00020783467,0.00018461545,0.00004822374,0.0000119920505,0.000020465837,0.000072394505,0.008113661,0.9903547,0.0006293131,0.000019050634,0.000081338454],"about_ca_topic_score_codex":0.00010212002,"about_ca_topic_score_gemma":0.00002130255,"teacher_disagreement_score":0.13078697,"about_ca_system_score_codex":0.000010292835,"about_ca_system_score_gemma":0.000009165041,"threshold_uncertainty_score":0.3496714},"labels":[],"label_agreement":null},{"id":"W2895849029","doi":"10.1109/tcpmt.2018.2874241","title":"Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Heat Transfer and Optimization","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; Centre National de la Recherche Scientifique; Agence Nationale de la Recherche","keywords":"Microelectronics; Microchannel; Chip; Materials science; Heat flux; Volumetric flow rate; Mechanical engineering; Electrical engineering; Optoelectronics; Nanotechnology; Heat transfer; Mechanics; Physics; Engineering","score_opus":0.011601437105354847,"score_gpt":0.227324454912768,"score_spread":0.21572301780741315,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2895849029","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5235402,0.000041203068,0.47543928,0.00010742817,0.00009257591,0.00039003068,0.000021974323,0.00022191819,0.00014536275],"genre_scores_gemma":[0.9980421,0.00015003896,0.0015933388,0.000020862124,0.000017019565,0.00011460318,0.0000071128934,0.000033821136,0.000021101896],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99915475,0.000010784238,0.00022274708,0.00023428947,0.000063455926,0.00031399901],"domain_scores_gemma":[0.99967533,0.000032214142,0.000017739912,0.00022309652,0.000014783036,0.00003683469],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000068444126,0.0001787825,0.00020114292,0.0005172435,0.00012096823,0.000010786072,0.00013990019,0.000113942806,0.000009633547],"category_scores_gemma":[1.7936114e-7,0.00018975945,0.00004622506,0.00015489256,0.00009019663,0.000043265758,0.0000013067405,0.00021248973,0.0000065243426],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00046766005,0.0008326861,0.00009670252,0.0011000594,0.00063831854,0.000006553497,0.0007782994,0.30785343,0.41256526,0.0010641775,0.00009959166,0.27449727],"study_design_scores_gemma":[0.0010725682,0.00017377645,0.00067884586,0.00015028239,0.00003463052,0.0000065737413,0.000061889834,0.008677376,0.987967,0.0003813856,0.0005994445,0.00019619991],"about_ca_topic_score_codex":0.000008227429,"about_ca_topic_score_gemma":0.000015371703,"teacher_disagreement_score":0.5754018,"about_ca_system_score_codex":0.00006420152,"about_ca_system_score_gemma":0.0000043783184,"threshold_uncertainty_score":0.7738166},"labels":[],"label_agreement":null},{"id":"W2898179347","doi":"10.1109/tcpmt.2018.2878104","title":"Effective Method for Wire Bonds Rework Using Conductive Epoxy","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Metallurgy and Material Forming","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"MiQro Innovation Collaborative Centre","funders":"","keywords":"Rework; Epoxy; Electrical conductor; Bond; Materials science; Wire bonding; Composite material; Adhesive; Computer science; Electrical engineering; Engineering; Business; Embedded system","score_opus":0.019184495446056493,"score_gpt":0.2698595320670436,"score_spread":0.2506750366209871,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2898179347","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4644694,0.000025409503,0.5336423,0.000045895697,0.0009504098,0.0002598616,0.0000117133995,0.0005118831,0.00008312058],"genre_scores_gemma":[0.95222396,0.000014510773,0.04744247,0.00003233958,0.00007899302,0.00009135698,0.0000025104366,0.00005349248,0.000060389284],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989298,0.00003119508,0.00021835991,0.00034184038,0.000080574326,0.00039824398],"domain_scores_gemma":[0.99947643,0.00010968426,0.000047411962,0.0002651218,0.000033241995,0.00006808843],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00018376406,0.0002661929,0.00032292627,0.000438189,0.00043591356,0.00003383443,0.00013143619,0.00024203387,0.000020839538],"category_scores_gemma":[0.0000049457967,0.00026901215,0.000061423736,0.00011916928,0.000161735,0.0001400222,0.000005050276,0.00030010563,0.000011328778],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021351059,0.000091701026,0.0000099049485,0.00030595742,0.00062112324,0.000012458948,0.00063099345,0.01950748,0.8147975,0.00079434336,0.00006541499,0.16294958],"study_design_scores_gemma":[0.00060213415,0.0001740987,0.00004005916,0.00012717859,0.00008741082,0.00008460213,0.00009082557,0.030748617,0.96230894,0.0032140785,0.0022208653,0.00030121618],"about_ca_topic_score_codex":0.000027762837,"about_ca_topic_score_gemma":0.000008620172,"teacher_disagreement_score":0.48775452,"about_ca_system_score_codex":0.00008153319,"about_ca_system_score_gemma":0.000006589676,"threshold_uncertainty_score":0.9999762},"labels":[],"label_agreement":null},{"id":"W2900427238","doi":"10.1109/tcpmt.2018.2879447","title":"Conductive Polymer Metallized Vias: A New Approach for Substrate Integrated Waveguide Development","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Government of Alberta","keywords":"Materials science; Electrical conductor; Resonator; Optoelectronics; Microwave; Substrate (aquarium); Dielectric; Extremely high frequency; Electronic engineering; Composite material; Computer science; Telecommunications; Engineering","score_opus":0.024648807629364947,"score_gpt":0.22969094338865803,"score_spread":0.2050421357592931,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2900427238","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3341197,0.000119150696,0.6638876,0.000058853046,0.0003890009,0.00022734406,0.000012841631,0.0009865195,0.00019897879],"genre_scores_gemma":[0.9403848,0.00003768851,0.05859865,0.000027783566,0.000042455307,0.00007768215,0.000017269385,0.00007092869,0.0007427537],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986366,0.000014499734,0.000332162,0.00043257498,0.0001022335,0.00048193918],"domain_scores_gemma":[0.99943775,0.00004874092,0.00004068859,0.00030348173,0.0000403679,0.00012896761],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001282849,0.00036851605,0.0003552709,0.0005756793,0.0002496559,0.00004801116,0.00019913232,0.00021720723,0.000029123637],"category_scores_gemma":[0.0000038700014,0.00035826297,0.0000726785,0.00016414573,0.00014590674,0.0000912559,0.0000041498165,0.00035550658,0.00002414284],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002949793,0.00032453373,0.000011316316,0.00042126045,0.002214154,0.000014050243,0.0020730924,0.032021046,0.7876394,0.00044097652,0.0016419465,0.17290324],"study_design_scores_gemma":[0.0009254266,0.000058185175,0.000023733137,0.00006381064,0.000053816922,0.000046518784,0.00014337289,0.031000286,0.9614465,0.00018110899,0.0056715645,0.00038568125],"about_ca_topic_score_codex":0.000032373446,"about_ca_topic_score_gemma":0.000011361868,"teacher_disagreement_score":0.60626507,"about_ca_system_score_codex":0.00010072536,"about_ca_system_score_gemma":0.000030310543,"threshold_uncertainty_score":0.99988693},"labels":[],"label_agreement":null},{"id":"W2954420206","doi":"10.1109/tcpmt.2019.2926652","title":"Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications","year":2019,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":24,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec à Montréal; École de Technologie Supérieure","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; CMC Microsystems","keywords":"Monolithic microwave integrated circuit; Printed circuit board; Fabrication; Printed electronics; Materials science; Microstrip; Microwave; Transmission line; Electric power transmission; Electronic packaging; Integrated circuit packaging; Electronic circuit; Optoelectronics; Integrated circuit; Electronics; Electrical engineering; Amplifier; Engineering; Telecommunications; CMOS","score_opus":0.011260950484274966,"score_gpt":0.2191264273741032,"score_spread":0.20786547688982823,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2954420206","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.53100675,0.00008109502,0.4657355,0.0003480454,0.00032208062,0.00051041524,0.000018954714,0.0019421597,0.00003499226],"genre_scores_gemma":[0.9805073,0.0002604325,0.018729761,0.000026308568,0.000025166124,0.00028252442,0.000009981998,0.00006822225,0.00009028011],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987003,0.0000125204315,0.00032211977,0.00043145908,0.00009101095,0.00044254248],"domain_scores_gemma":[0.99931014,0.00008290139,0.000049335198,0.00047067902,0.00002691493,0.000060055292],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000111593836,0.00032437657,0.00035464758,0.0005097909,0.00022805028,0.000062034494,0.00028889967,0.00028951038,0.000014140236],"category_scores_gemma":[0.000001765712,0.00031186992,0.00009281462,0.00014089418,0.00008895651,0.00009288043,0.0000081522585,0.0003475689,0.000029131095],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031861633,0.000058834685,0.00009216511,0.0003266485,0.0000918056,0.0000014677942,0.000050119295,0.004194305,0.844831,0.00013970005,0.000033563196,0.15014857],"study_design_scores_gemma":[0.00068040926,0.000064493375,0.0001149896,0.00015450806,0.00003438475,0.000027780969,0.00005939237,0.0054290234,0.9835591,0.0014526746,0.008078226,0.0003450262],"about_ca_topic_score_codex":0.000008105743,"about_ca_topic_score_gemma":0.000004136375,"teacher_disagreement_score":0.44950056,"about_ca_system_score_codex":0.0000514728,"about_ca_system_score_gemma":0.000007259094,"threshold_uncertainty_score":0.99993336},"labels":[],"label_agreement":null},{"id":"W2968776414","doi":"10.1109/tcpmt.2019.2933799","title":"Efficient Time-Domain Sensitivity Analysis of Active Networks","year":2019,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Model Reduction and Neural Networks","field":"Physics and Astronomy","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Sensitivity (control systems); Passivity; Control theory (sociology); Electronic circuit; Stability (learning theory); Differential equation; Mathematics; Set (abstract data type); Computer science; Reduction (mathematics); Topology (electrical circuits); Electronic engineering; Engineering; Mathematical analysis; Geometry; Control (management)","score_opus":0.007074915077901801,"score_gpt":0.2152688092502481,"score_spread":0.2081938941723463,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2968776414","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.66139793,0.0000043528125,0.33792272,0.00011259648,0.00016666156,0.000118680175,0.000019285757,0.00007973065,0.00017803362],"genre_scores_gemma":[0.99952316,0.0000036776378,0.00024949113,0.0000181412,0.000018093695,0.000009077297,0.000007998313,0.000014668872,0.0001556784],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990077,0.00005743655,0.00020195878,0.00035586325,0.000114215814,0.00026279772],"domain_scores_gemma":[0.99940735,0.000084006344,0.00011496032,0.0003123902,0.000022052347,0.00005923254],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010029005,0.00018522269,0.00038560058,0.00061057706,0.00013510887,0.000013082766,0.00007843663,0.00009362136,0.0001836542],"category_scores_gemma":[2.2494086e-7,0.0001789215,0.00015701498,0.0003402531,0.00009930839,0.0000294448,0.00000611728,0.0003678188,0.000017256469],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007135213,0.00019878367,0.0004441073,0.0000062835707,0.00086417934,0.000001567039,0.000070163005,0.928597,0.01145012,0.00019594019,0.0000083402265,0.058092214],"study_design_scores_gemma":[0.00073581206,0.000072459145,0.003403323,0.000048785303,0.00042331073,0.0000056418535,0.00021121302,0.7947382,0.19958676,0.0003342409,0.0001228637,0.000317396],"about_ca_topic_score_codex":0.00006408142,"about_ca_topic_score_gemma":0.0000023765206,"teacher_disagreement_score":0.33812526,"about_ca_system_score_codex":0.000023539722,"about_ca_system_score_gemma":0.0000061464834,"threshold_uncertainty_score":0.7296207},"labels":[],"label_agreement":null},{"id":"W2981871387","doi":"10.1109/tcpmt.2019.2948802","title":"A Novel Framework for Parametric Loewner Matrix Interpolation","year":2019,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Acoustic Wave Phenomena Research","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Interpolation (computer graphics); Computer science; Singular value decomposition; Parametric statistics; Algorithm; Embedding; Mathematical optimization; Mathematics; Artificial intelligence","score_opus":0.018523861978180636,"score_gpt":0.2639955658914026,"score_spread":0.24547170391322198,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2981871387","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3887542,0.00003596186,0.60970384,0.00016792613,0.00045004307,0.0003109611,0.00001955658,0.0005135952,0.00004391486],"genre_scores_gemma":[0.9605134,0.00003435988,0.03912542,0.000020024261,0.000024756564,0.000082412225,0.0000037133038,0.000056886456,0.00013903384],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989006,0.000008525389,0.00021296038,0.00031350338,0.00014550904,0.00041891573],"domain_scores_gemma":[0.99925494,0.00026681952,0.000033437107,0.000351697,0.000022843324,0.00007025927],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010944665,0.00021291299,0.00023972569,0.0009833637,0.00011973184,0.000044211076,0.00019270234,0.00022793633,0.000037111702],"category_scores_gemma":[0.000008505277,0.00021562185,0.000059538022,0.0002294586,0.0000611728,0.00008898787,0.0000054684433,0.0005695743,0.00006197641],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003651111,0.00061197113,0.00046686418,0.0014130833,0.0009276006,0.000009789243,0.0005128312,0.47072002,0.34566003,0.0046939957,0.00021948265,0.17439921],"study_design_scores_gemma":[0.002108199,0.0003169125,0.00070707896,0.00031111945,0.00008138435,0.00007073812,0.0003007269,0.6986562,0.2786336,0.016599242,0.0014427601,0.00077201455],"about_ca_topic_score_codex":0.000010337497,"about_ca_topic_score_gemma":0.0000015205181,"teacher_disagreement_score":0.5717592,"about_ca_system_score_codex":0.00010658622,"about_ca_system_score_gemma":0.0000070011365,"threshold_uncertainty_score":0.87928045},"labels":[],"label_agreement":null},{"id":"W3010531757","doi":"10.1109/tcpmt.2020.2978432","title":"A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Bumping; Plating (geology); Materials science; Intermetallic; Electroplating; Flip chip; Metallurgy; Alloy; Layer (electronics); Composite material; Mechanical engineering; Engineering; Physics","score_opus":0.027156507840776646,"score_gpt":0.2559434605735102,"score_spread":0.22878695273273356,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3010531757","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9593991,0.0001579834,0.03772345,0.00021519567,0.00009993844,0.00045771775,0.0000062235918,0.001923843,0.000016540624],"genre_scores_gemma":[0.9994705,0.00011293285,0.00021948786,0.000014116515,0.000012626373,0.000118699,0.0000012706106,0.000046794798,0.0000036221963],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998609,0.000025071902,0.00032744135,0.00042097396,0.0001683378,0.0004491879],"domain_scores_gemma":[0.99957424,0.000041944346,0.00006478434,0.00020887921,0.000019688558,0.00009047115],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00006992886,0.0003008847,0.00041523104,0.00039386234,0.00021001526,0.00003334983,0.00021721667,0.00018738779,0.0000038657054],"category_scores_gemma":[0.0000070934598,0.00031184038,0.000043882876,0.00022704586,0.00009012707,0.00009954806,0.000012469807,0.00080364844,0.000002414517],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00029139975,0.001801971,0.0018817273,0.0021334523,0.0016768929,0.00045005532,0.0073219184,0.17852502,0.64637524,0.00031442402,0.000015789856,0.15921208],"study_design_scores_gemma":[0.0013619037,0.00042195994,0.00028955357,0.00013116642,0.0001269006,0.00012148579,0.0013587695,0.03958079,0.95605814,0.00010778609,0.000020695832,0.00042083542],"about_ca_topic_score_codex":0.0000083259365,"about_ca_topic_score_gemma":0.000007678087,"teacher_disagreement_score":0.30968288,"about_ca_system_score_codex":0.00004254942,"about_ca_system_score_gemma":0.000010055686,"threshold_uncertainty_score":0.99993336},"labels":[],"label_agreement":null},{"id":"W3037019054","doi":"10.1109/tcpmt.2020.3004414","title":"A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Low-power high-performance VLSI design","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Science and Engineering Research Board","keywords":"Interconnection; Reliability (semiconductor); Spice; Electronic engineering; Parametric statistics; Dielectric; Materials science; Signal integrity; Computer science; Optoelectronics; Mathematics; Engineering; Physics; Telecommunications","score_opus":0.01525755405643463,"score_gpt":0.2380177270313511,"score_spread":0.22276017297491646,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3037019054","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5199401,0.000044499713,0.47829965,0.0009520212,0.00012247643,0.00035000726,0.00003712989,0.00024841883,0.000005715666],"genre_scores_gemma":[0.99646413,0.00015962037,0.0030789662,0.00007189404,0.00001816138,0.00015757991,0.000010235396,0.0000328769,0.000006507305],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990057,0.000021415766,0.00027072683,0.0003202054,0.00014803643,0.00023391785],"domain_scores_gemma":[0.99942374,0.00017725307,0.00005676281,0.00025292364,0.000035015826,0.00005427937],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012795327,0.00023569845,0.0002647768,0.00026634458,0.00025025118,0.00003612285,0.00016381952,0.00012109318,0.0000023925904],"category_scores_gemma":[0.0000059331155,0.00019233627,0.00005916234,0.00015330131,0.00009714513,0.0001360012,0.0000051819193,0.00046893052,7.9513103e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012579972,0.00010526821,0.00007499613,0.00047257802,0.00018615909,0.0000016326667,0.00033248842,0.9373618,0.05272631,0.00045523388,0.00010456257,0.008053206],"study_design_scores_gemma":[0.0006162071,0.00013459196,0.00032392418,0.00005313475,0.000047546673,0.000009256688,0.000044577475,0.7500085,0.2480212,0.00056376314,0.000024875959,0.0001524115],"about_ca_topic_score_codex":0.000003964212,"about_ca_topic_score_gemma":0.0000023837006,"teacher_disagreement_score":0.47652408,"about_ca_system_score_codex":0.000058877828,"about_ca_system_score_gemma":0.000018498218,"threshold_uncertainty_score":0.7843245},"labels":[],"label_agreement":null},{"id":"W3037430656","doi":"10.1109/tcpmt.2020.3004569","title":"GVF: GPU-Based Vector Fitting for Modeling of Multiport Tabulated Data Networks","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Lightning and Electromagnetic Phenomena","field":"Physics and Astronomy","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Speedup; Computer science; Exploit; Parallel computing; Identification (biology); Massively parallel; Computational science; Computer engineering","score_opus":0.03319171933836478,"score_gpt":0.24279026743404253,"score_spread":0.20959854809567774,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3037430656","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.41471973,0.000023280192,0.5840988,0.000658668,0.00009542102,0.00017613177,0.0000510653,0.00015469508,0.000022169494],"genre_scores_gemma":[0.9943481,0.000003453638,0.0053784545,0.000065837005,0.00006452401,0.000033080923,0.000061504674,0.000032859734,0.000012183118],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.998762,0.00001788245,0.0003092769,0.00046480878,0.000092493254,0.0003535127],"domain_scores_gemma":[0.9992758,0.00008192828,0.00011387233,0.00041213754,0.00002806412,0.0000881685],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009973309,0.00020910552,0.00030903824,0.00014998994,0.00023562185,0.00002317941,0.0003197909,0.000084677624,0.000014814811],"category_scores_gemma":[0.000002647076,0.00021137201,0.000058458576,0.00011435131,0.00006130775,0.00007147561,0.00001135445,0.00033185503,0.000001488761],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00030381646,0.0004133985,0.0007932103,0.00017523213,0.0004816901,0.0000031735312,0.00029451845,0.8854037,0.032119073,0.00023534872,0.0001009797,0.07967588],"study_design_scores_gemma":[0.0010820413,0.00014885272,0.000034212637,0.00006510654,0.00007748267,9.950215e-7,0.00006964932,0.89303774,0.10482608,0.00027979378,0.0001793663,0.00019869747],"about_ca_topic_score_codex":0.00007901771,"about_ca_topic_score_gemma":0.0000012855395,"teacher_disagreement_score":0.57962835,"about_ca_system_score_codex":0.000012857195,"about_ca_system_score_gemma":0.000021119708,"threshold_uncertainty_score":0.86195004},"labels":[],"label_agreement":null},{"id":"W3087811192","doi":"10.1109/tcpmt.2020.3025186","title":"Aerosol Jet Printed, Microwave Microstrip Ring Resonators for System-In-Package Applications","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec à Montréal; École de Technologie Supérieure","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Resonator; Microstrip; Insertion loss; Materials science; Microwave; Fabrication; System in package; Bandwidth (computing); Optoelectronics; Split-ring resonator; Electronic engineering; Electrical engineering; Computer science; Telecommunications; Engineering","score_opus":0.012994298202696805,"score_gpt":0.21030539085690106,"score_spread":0.19731109265420427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3087811192","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.32197025,0.00019891774,0.6753344,0.00024853068,0.0002281507,0.00051729765,0.000060226437,0.0013677556,0.000074493924],"genre_scores_gemma":[0.9935482,0.000089017885,0.005874096,0.00004416794,0.00004645483,0.000278313,0.00000996413,0.00008622359,0.00002356134],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985476,0.000013466237,0.00038345094,0.00047299016,0.00009213938,0.0004903386],"domain_scores_gemma":[0.9993944,0.00007929363,0.00004444914,0.00032509994,0.000020262805,0.00013649365],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00009438675,0.00034563142,0.00037014007,0.00046878273,0.00017905355,0.0000486389,0.0002458068,0.00022459633,0.000002752328],"category_scores_gemma":[0.000004020195,0.0003816543,0.00009214867,0.00021769703,0.0000729098,0.00007120934,0.000007404426,0.00053649,0.00002142231],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010080492,0.0001291621,0.0001376006,0.0022211687,0.00029610135,0.00003812667,0.0005586487,0.07275228,0.874291,0.0006854506,0.00030419813,0.048485454],"study_design_scores_gemma":[0.0009587477,0.000052697163,0.000052090356,0.00021812852,0.000034192853,0.00005221851,0.00020831247,0.026942603,0.9660345,0.000078796525,0.0049632993,0.00040442104],"about_ca_topic_score_codex":0.000012159713,"about_ca_topic_score_gemma":0.000009612818,"teacher_disagreement_score":0.67157793,"about_ca_system_score_codex":0.00014147966,"about_ca_system_score_gemma":0.000008751741,"threshold_uncertainty_score":0.99986356},"labels":[],"label_agreement":null},{"id":"W3131909957","doi":"10.1109/tcpmt.2021.3060968","title":"Contact Resistance Behavior of Land Grid Array Sockets at Cryogenic Temperatures Required for Quantum Measurements","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microelectronics; Interconnection; Materials science; Contact resistance; Cryogenics; Elastomer; Optoelectronics; Composite material; Computer science; Physics; Telecommunications","score_opus":0.02696635579449528,"score_gpt":0.2409941907954504,"score_spread":0.21402783500095512,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3131909957","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9492375,0.0012737876,0.046663698,0.00034278742,0.00070993556,0.0002829393,0.000081087324,0.0013704551,0.000037768164],"genre_scores_gemma":[0.9971411,0.0004043921,0.0020256122,0.000015328746,0.000018291015,0.00015695447,0.000014290936,0.000057477584,0.00016655086],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99847823,0.000027392995,0.00035060878,0.0004331087,0.00018741787,0.000523238],"domain_scores_gemma":[0.9991771,0.000086962566,0.00007699301,0.0005399164,0.000058665184,0.00006037879],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00013231508,0.00031439282,0.00044243678,0.00036390004,0.00027477447,0.000029952505,0.00023147558,0.00025972875,0.0000060274283],"category_scores_gemma":[0.00001251433,0.00033188236,0.00012263752,0.00014905541,0.00012508451,0.00007557142,0.000007690346,0.0004204262,0.0000026413147],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008331024,0.00013561145,0.0006003547,0.00028536923,0.00030511312,0.000021097194,0.00010151049,0.001320117,0.9939723,0.000072649585,0.00023871212,0.0028638244],"study_design_scores_gemma":[0.001016833,0.00008164847,0.0007089787,0.00022174066,0.00010052242,0.00006041933,0.000055112807,0.00022608624,0.9953825,0.0006733485,0.00115508,0.00031773743],"about_ca_topic_score_codex":0.000008068591,"about_ca_topic_score_gemma":0.00009062315,"teacher_disagreement_score":0.04790356,"about_ca_system_score_codex":0.0001809284,"about_ca_system_score_gemma":0.00002528618,"threshold_uncertainty_score":0.99991333},"labels":[],"label_agreement":null},{"id":"W3138609293","doi":"10.1109/tcpmt.2021.3065579","title":"A Novel Chip-Join Assembly Using Heterogeneous Sn-Ag Bumps","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electromigration; Materials science; Soldering; Flip chip; Electroplating; Thermal copper pillar bump; Fabrication; Layer (electronics); Diffusion barrier; Chip; Optoelectronics; Composite material; Computer science; Adhesive","score_opus":0.022282950590582,"score_gpt":0.23177969769176784,"score_spread":0.20949674710118585,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3138609293","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6249058,0.00039745707,0.370056,0.00026338873,0.00045329105,0.000091210866,0.000016238084,0.0037429363,0.00007362641],"genre_scores_gemma":[0.9881,0.00033514743,0.011300714,0.000050451286,0.000025840514,0.000029805793,0.0000048084034,0.00008853245,0.000064680884],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998115,0.00002389091,0.00033231985,0.0005688082,0.0001869106,0.0007730656],"domain_scores_gemma":[0.9990693,0.00006257388,0.000053029722,0.00068670016,0.000029983043,0.00009842881],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00010025656,0.00042593072,0.00043255082,0.0006478746,0.0003873189,0.00008561426,0.00029085713,0.0003726607,0.000010118861],"category_scores_gemma":[0.0000070563083,0.0004777436,0.0001138613,0.0002861231,0.00015635244,0.0001088128,0.000017361495,0.0009460359,0.000014140866],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001752491,0.00022280418,0.000037345424,0.00016735081,0.0004143102,0.00016933815,0.00012677666,0.15809175,0.8038918,0.0002091778,0.000057211826,0.036594614],"study_design_scores_gemma":[0.0006569592,0.000054454566,0.00006187657,0.000173789,0.00006219277,0.00111456,0.00008729192,0.049790848,0.9456987,0.0010325166,0.00077381084,0.0004930416],"about_ca_topic_score_codex":0.00003335534,"about_ca_topic_score_gemma":0.00003282811,"teacher_disagreement_score":0.3631942,"about_ca_system_score_codex":0.00020633817,"about_ca_system_score_gemma":0.000032470653,"threshold_uncertainty_score":0.9997674},"labels":[],"label_agreement":null},{"id":"W3148216306","doi":"10.1109/tcpmt.2021.3071063","title":"Fast and Stable Time-Domain Simulation Based on Modified Numerical Inversion of the Laplace Transform","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Ottawa; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Laplace transform; Inversion (geology); Time domain; Laplace transform applied to differential equations; Post's inversion formula; Computer science; Algorithm; Laplace–Stieltjes transform; Mellin transform; Inverse Laplace transform; Two-sided Laplace transform; Computer simulation; Mathematical optimization; Applied mathematics; Simulation; Mathematics; Mathematical analysis; Geology; Fourier transform; Green's function for the three-variable Laplace equation; Fractional Fourier transform; Computer vision","score_opus":0.007740101266383095,"score_gpt":0.20063311302659537,"score_spread":0.19289301176021229,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3148216306","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.82280624,0.00003029982,0.1760257,0.00058721175,0.00010368907,0.00012766413,0.00001187587,0.00018045452,0.00012686139],"genre_scores_gemma":[0.9992509,0.000019538564,0.000618688,0.000027896698,0.000003976099,0.000007225608,0.000002960543,0.000015977581,0.000052833766],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992579,0.000043793025,0.00016469481,0.00021708777,0.00013198123,0.00018452255],"domain_scores_gemma":[0.999496,0.0001553337,0.000024875557,0.00026879038,0.000014289223,0.00004073876],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006395513,0.00014743608,0.0001847129,0.000160522,0.00017636044,0.000012795288,0.00008326059,0.00012231294,0.00002280871],"category_scores_gemma":[0.0000030969863,0.00012719465,0.000044480545,0.00013496407,0.00007506358,0.000046190664,0.0000037428335,0.00032361833,0.0000018388017],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000074925854,0.00010684375,0.000026484508,0.00009148284,0.000023057575,0.0000024958997,0.00010718067,0.8494567,0.1171244,0.0000129423615,0.000010819437,0.03296263],"study_design_scores_gemma":[0.0004379261,0.000058799695,0.0002009035,0.00008236096,0.000014246214,0.0000028440284,0.000020087666,0.48148113,0.51715225,0.00039690817,0.000073366864,0.00007917825],"about_ca_topic_score_codex":0.000010152802,"about_ca_topic_score_gemma":0.0000065227828,"teacher_disagreement_score":0.40002784,"about_ca_system_score_codex":0.00004128736,"about_ca_system_score_gemma":0.000010164355,"threshold_uncertainty_score":0.51868474},"labels":[],"label_agreement":null},{"id":"W3194095534","doi":"10.1109/tcpmt.2021.3105867","title":"A Fast Technique for Realization of Lumped-Element Values Into 3-D Physical Layout on LTCC","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Schematic; Realization (probability); Band-pass filter; HFSS; Electronic engineering; Ideal (ethics); Physical design; Filter (signal processing); Computer science; Engineering; Electrical engineering; Circuit design; Antenna (radio)","score_opus":0.010439810777667338,"score_gpt":0.23347954740426427,"score_spread":0.22303973662659693,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3194095534","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.34380305,0.000036177065,0.6551456,0.00009399368,0.0002275891,0.00018307887,0.00002409251,0.00043382033,0.000052603653],"genre_scores_gemma":[0.99469495,0.00008063548,0.004940486,0.000015242615,0.00002920773,0.00011660845,0.000014868416,0.00004752589,0.000060451508],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99912596,0.000015460406,0.0002296022,0.00027867727,0.00010588724,0.00024440995],"domain_scores_gemma":[0.9995235,0.000064191125,0.000027896638,0.0003018951,0.000036286146,0.000046224493],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007731616,0.0002164765,0.00027552515,0.00036732596,0.00011839305,0.000016723794,0.00010451938,0.00013378658,0.0000043718255],"category_scores_gemma":[0.000004904354,0.0002304918,0.00007902859,0.00012119975,0.00005929745,0.00004150975,0.000004177715,0.00024228137,0.0000024171457],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031137966,0.00023298913,0.000008222848,0.00051681563,0.0001910699,0.000007986873,0.00046802836,0.17540373,0.7829362,0.0005808793,0.00016249508,0.03946041],"study_design_scores_gemma":[0.00038929028,0.0001129532,0.000031796408,0.00020737642,0.0000367199,0.000017814706,0.000096771044,0.02500459,0.97138983,0.0018573474,0.0006540122,0.00020147713],"about_ca_topic_score_codex":0.000010239226,"about_ca_topic_score_gemma":0.0000045583233,"teacher_disagreement_score":0.6508919,"about_ca_system_score_codex":0.000067384295,"about_ca_system_score_gemma":0.000008775047,"threshold_uncertainty_score":0.93991834},"labels":[],"label_agreement":null},{"id":"W3195412051","doi":"10.1109/tcpmt.2021.3097944","title":"Error-Controlled Static Layered-Medium Green’s Function Computation via <i>hp</i>-Adaptive Spectral Differential Equation Approximation Method","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Scattering and Analysis","field":"Physics and Astronomy","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Manitoba","funders":"Natural Sciences and Engineering Research Council of Canada; Manitoba Hydro","keywords":"Computation; Function (biology); Differential equation; Mathematical analysis; Applied mathematics; Error analysis; Mathematics; Computer science; Physics; Algorithm","score_opus":0.0144576040270556,"score_gpt":0.2438571632902355,"score_spread":0.2293995592631799,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3195412051","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.38291714,0.000011147973,0.6157951,0.0006687214,0.00022954219,0.00015366136,0.0000111605295,0.00015837148,0.00005519934],"genre_scores_gemma":[0.99122053,0.0000048956267,0.008227416,0.000040647275,0.00008276945,0.00008775723,0.00008117688,0.000028455686,0.00022634951],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983686,0.00016080162,0.00037841738,0.00050970196,0.00022327842,0.0003591813],"domain_scores_gemma":[0.999312,0.00013212468,0.0001868706,0.00023225792,0.000061584324,0.00007520212],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001351711,0.00028698816,0.00044027081,0.00043955096,0.00038160195,0.000074491465,0.000094056384,0.000115127965,0.00012373351],"category_scores_gemma":[0.0000014921574,0.00028959254,0.00014318361,0.00020230647,0.00006150921,0.00012706875,0.0000061343803,0.0004570269,0.000017070068],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00077989994,0.0012542924,0.00024001575,0.000111680434,0.0019583814,0.00001741687,0.00064146734,0.07142036,0.4000081,0.0010491606,0.000051001767,0.5224682],"study_design_scores_gemma":[0.0050036237,0.0003400866,0.0011368732,0.00008174315,0.0006219757,0.000026290829,0.0005647108,0.4012263,0.5692388,0.021229504,0.000027323356,0.0005027977],"about_ca_topic_score_codex":0.0002536216,"about_ca_topic_score_gemma":0.000018724939,"teacher_disagreement_score":0.6083034,"about_ca_system_score_codex":0.00006188017,"about_ca_system_score_gemma":0.000026732014,"threshold_uncertainty_score":0.9999556},"labels":[],"label_agreement":null},{"id":"W3204880988","doi":"10.1109/tcpmt.2021.3116220","title":"3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":30,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Horizon 2020 Framework Programme; European Commission","keywords":"Diplexer; Band-pass filter; Stereolithography; Admittance; Filter (signal processing); Inverter; Electrical impedance; Extremely high frequency; Waveguide filter; Electronic engineering; Plane (geometry); Topology (electrical circuits); Optics; Engineering; Computer science; Acoustics; Physics; Prototype filter; Electrical engineering; Filter design; Mathematics; Voltage; Mechanical engineering; Geometry","score_opus":0.011598550569642272,"score_gpt":0.19720885676944686,"score_spread":0.1856103061998046,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3204880988","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.756098,0.0003049244,0.24284144,0.000107743814,0.00023392515,0.00006921783,0.00001178254,0.00029713174,0.000035875648],"genre_scores_gemma":[0.9929565,0.0004070253,0.006510827,0.000019802586,0.0000138666655,0.000010324596,0.000004225526,0.000038745613,0.00003868054],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9989384,0.000019405978,0.00027030613,0.00034463994,0.00013436892,0.00029291265],"domain_scores_gemma":[0.9994805,0.000082874925,0.000046268084,0.0002863252,0.00003292776,0.000071125876],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008154347,0.0002525573,0.00032880233,0.0003326995,0.00013957743,0.000035174027,0.00011324374,0.00013913448,0.000010675375],"category_scores_gemma":[0.0000032712544,0.00023755414,0.000034721976,0.00013352562,0.00012953504,0.0000979963,0.000006736049,0.0003720751,0.0000024984427],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000041450116,0.00007299066,0.0006728489,0.00043956016,0.00027281346,0.00006850439,0.0002844728,0.07886401,0.8727067,0.000046375277,0.000025515543,0.046504766],"study_design_scores_gemma":[0.00057605316,0.000056316123,0.0013749351,0.0005495374,0.00003654187,0.00015008304,0.00007965951,0.018029906,0.97839034,0.0002628107,0.00022376097,0.00027007636],"about_ca_topic_score_codex":0.000028324966,"about_ca_topic_score_gemma":0.000014087257,"teacher_disagreement_score":0.23685853,"about_ca_system_score_codex":0.000030096471,"about_ca_system_score_gemma":0.0000070862393,"threshold_uncertainty_score":0.9687177},"labels":[],"label_agreement":null},{"id":"W3211697685","doi":"10.1109/tcpmt.2021.3126284","title":"Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hamilton Health Sciences; Natural Resources Canada; McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Sintering; Silicon carbide; Molybdenum; Atmospheric temperature range; Electronic packaging; Power module; Die (integrated circuit); Composite material; Optoelectronics; Power (physics); Metallurgy; Nanotechnology","score_opus":0.00996854852550868,"score_gpt":0.21030490917158495,"score_spread":0.20033636064607627,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3211697685","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9514666,0.0008731691,0.046163436,0.00029735235,0.00012866619,0.00021581993,0.000086532724,0.00076231983,0.0000060806237],"genre_scores_gemma":[0.9972881,0.00029392925,0.0022659353,0.000023818815,0.0000066185194,0.000043243548,0.000009110716,0.000051736308,0.000017517908],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99880147,0.000016054091,0.00025663417,0.0004912055,0.00009934396,0.00033528928],"domain_scores_gemma":[0.9993203,0.00008883341,0.000049088183,0.00042102925,0.000057212448,0.00006353726],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00007434719,0.00031775443,0.0005610204,0.0009780511,0.00014390342,0.000056360976,0.00012717718,0.00027665377,0.0000040340183],"category_scores_gemma":[0.000008398777,0.000307042,0.000084607134,0.00032540155,0.0001823334,0.00012920758,0.00001032772,0.00042120143,2.0954052e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005433467,0.000040987958,0.00038758104,0.00016586274,0.0013655341,0.000011315284,0.00023431724,0.03545917,0.9528652,0.000024591503,0.000004928172,0.009386195],"study_design_scores_gemma":[0.00085331633,0.00007215691,0.0006047047,0.00012592177,0.0004766955,0.000054355867,0.00066709804,0.19668204,0.7999862,0.00016697105,0.0000108336235,0.0002997217],"about_ca_topic_score_codex":0.000019441104,"about_ca_topic_score_gemma":0.000037675414,"teacher_disagreement_score":0.16122288,"about_ca_system_score_codex":0.000041729552,"about_ca_system_score_gemma":0.000008540157,"threshold_uncertainty_score":0.9999382},"labels":[],"label_agreement":null},{"id":"W4226073136","doi":"10.1109/tcpmt.2022.3169592","title":"A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Millimeter-Wave Propagation and Modeling","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Peraso Technologies (Canada)","funders":"","keywords":"Antenna gain; Antenna (radio); Electrical engineering; Printed circuit board; Interposer; Materials science; Optoelectronics; Dipole antenna; Optics; Antenna efficiency; Computer science; Physics; Engineering","score_opus":0.013454467278490194,"score_gpt":0.18926132545756702,"score_spread":0.17580685817907682,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4226073136","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3909478,0.000060558068,0.6071014,0.00017063324,0.00029386356,0.00017726081,0.00001889675,0.0011078189,0.0001218159],"genre_scores_gemma":[0.99710786,0.000029704372,0.002507562,0.000045199402,0.00001846505,0.00015800378,0.000008016208,0.000056372395,0.00006882478],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987497,0.000045134024,0.00023608921,0.0003685629,0.00020741812,0.0003931444],"domain_scores_gemma":[0.9995129,0.000028686864,0.000051870873,0.00031501695,0.000016861817,0.00007463217],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000121144614,0.00026492513,0.00025184642,0.0006944524,0.0005968662,0.00003108315,0.00013804033,0.00009445932,0.000021511098],"category_scores_gemma":[7.0501403e-7,0.00026059995,0.000053830252,0.00017345877,0.00006936382,0.00006001119,0.0000072087396,0.0007720723,0.0000066860634],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000096266296,0.000075387914,0.0000033179626,0.00017272393,0.00016797005,0.00004115466,0.00049350783,0.50236994,0.4354218,0.000027866334,0.000018479312,0.061111562],"study_design_scores_gemma":[0.0007884506,0.00017425604,0.0000141485925,0.00012714056,0.000048312842,0.00041913337,0.0005668973,0.16781195,0.8291441,0.0001552836,0.00038000438,0.00037029453],"about_ca_topic_score_codex":0.000021555814,"about_ca_topic_score_gemma":0.0000125068855,"teacher_disagreement_score":0.60616004,"about_ca_system_score_codex":0.00020051021,"about_ca_system_score_gemma":0.000010225965,"threshold_uncertainty_score":0.9999846},"labels":[],"label_agreement":null},{"id":"W4242000462","doi":"10.1109/tcpmt.2018.2868793","title":"Author’s Reply","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"","keywords":"Type (biology); Biology","score_opus":0.018425495817780285,"score_gpt":0.22929049204494578,"score_spread":0.2108649962271655,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4242000462","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6304845,0.00008180932,0.36079717,0.0007630794,0.0015941617,0.00016879995,0.0000118308235,0.0032710584,0.002827551],"genre_scores_gemma":[0.9986773,0.0000401155,0.000728855,0.00011007205,0.000052266783,0.00003655031,0.0000012973469,0.0000577052,0.00029582478],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99882555,0.000021443077,0.00024560935,0.00035110384,0.00012842598,0.00042786356],"domain_scores_gemma":[0.9993252,0.000037532907,0.000029729004,0.00048684212,0.000026688896,0.000094020514],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00010206608,0.00026258884,0.00022611246,0.00066641916,0.00025963542,0.00004178405,0.00022990123,0.00019775915,0.00005599754],"category_scores_gemma":[0.0000031388456,0.00027066283,0.000048794445,0.00019242866,0.00026000632,0.00010860121,6.259189e-7,0.00055569405,0.00014656936],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000052376316,0.00017913402,0.00009644525,0.0001358966,0.00057434314,0.000116347896,0.00071903836,0.009737321,0.5597879,0.0008508579,0.005049369,0.42270094],"study_design_scores_gemma":[0.00028475485,0.000110811954,0.0001381601,0.00007557868,0.000028474105,0.00015744027,0.000057009544,0.0039037447,0.9840864,0.0021917957,0.008668361,0.00029749854],"about_ca_topic_score_codex":0.0000346187,"about_ca_topic_score_gemma":0.00001014132,"teacher_disagreement_score":0.42429844,"about_ca_system_score_codex":0.00011010323,"about_ca_system_score_gemma":0.00000837937,"threshold_uncertainty_score":0.99997455},"labels":[],"label_agreement":null},{"id":"W4285115020","doi":"10.1109/tcpmt.2022.3177663","title":"An On-Chip ESD Sensor for Use in Advanced Packaging","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electrostatic Discharge in Electronics","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Defense Advanced Research Projects Agency; Semiconductor Research Corporation","keywords":"Electrostatic discharge; Voltage; Electrical engineering; Weibull distribution; CMOS; Chip; Engineering; Electronic engineering","score_opus":0.013487551663890719,"score_gpt":0.23421521330423953,"score_spread":0.22072766164034882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285115020","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8505221,0.000041172843,0.14728369,0.00029120338,0.00042075402,0.00041402588,0.0000660272,0.00093946897,0.000021556498],"genre_scores_gemma":[0.99535686,0.000050577244,0.003932786,0.00011013537,0.000011470874,0.00037585848,0.000016894985,0.000092669536,0.000052727602],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983648,0.00004574523,0.000278359,0.00046187596,0.00016919698,0.000680014],"domain_scores_gemma":[0.9992448,0.00017579162,0.000044171353,0.0004491718,0.000011654084,0.000074428084],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001579999,0.0002939673,0.00029111118,0.0008861667,0.00039234004,0.000045906338,0.00024230288,0.00009537104,0.000014786414],"category_scores_gemma":[0.0000039172796,0.00034978573,0.00005716217,0.0002081538,0.000053370353,0.000172013,0.00000475495,0.0009270471,0.0000037324858],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022648986,0.00039766956,0.00021805144,0.00008941868,0.00011423073,0.000034317036,0.0003868279,0.8186284,0.09239247,0.0004258051,0.000051455496,0.08703487],"study_design_scores_gemma":[0.0029833997,0.0010378531,0.00054236164,0.00009809881,0.000048924325,0.000118472206,0.00057821255,0.17883319,0.8069701,0.0036543368,0.004228933,0.00090607634],"about_ca_topic_score_codex":0.000020488062,"about_ca_topic_score_gemma":0.00005556001,"teacher_disagreement_score":0.7145777,"about_ca_system_score_codex":0.0002856048,"about_ca_system_score_gemma":0.000014233359,"threshold_uncertainty_score":0.9998954},"labels":[],"label_agreement":null},{"id":"W4311633449","doi":"10.1109/tcpmt.2022.3226139","title":"Moisture Diffusion Inside the BEOL of an FC-PBGA Package","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; U.S. Bureau of Land Management","keywords":"Materials science; Ball grid array; Moisture; Flip chip; Saturation (graph theory); Relative humidity; Integrated circuit packaging; Composite material; Integrated circuit; Electronic engineering; Optoelectronics; Soldering; Thermodynamics; Mathematics; Engineering; Adhesive; Physics","score_opus":0.010094366073407407,"score_gpt":0.20692484002766187,"score_spread":0.19683047395425446,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4311633449","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96474344,0.0002981049,0.031227998,0.0008212548,0.00044400152,0.00021851022,0.000037718957,0.00211488,0.000094107265],"genre_scores_gemma":[0.9990044,0.00019262158,0.0005118602,0.00004779356,0.000012526627,0.00010799296,0.00000688293,0.000053297485,0.00006259099],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986208,0.000060413317,0.00027840244,0.00034389654,0.00024172952,0.00045472183],"domain_scores_gemma":[0.9990317,0.000077941986,0.0000682523,0.00075778697,0.000012756125,0.000051528572],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001843163,0.00028344346,0.00030420197,0.0005513542,0.0007276741,0.00002594148,0.00054439605,0.00015138094,0.000017215061],"category_scores_gemma":[0.0000035453236,0.00024759411,0.000076007454,0.00025747417,0.00023695409,0.000083057486,0.000029604515,0.0012648037,0.00000345107],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016529422,0.000726778,0.00029507017,0.00027350278,0.0005482615,0.000093383256,0.0020109375,0.32768285,0.3103467,0.00072009116,0.00046722408,0.3566699],"study_design_scores_gemma":[0.0009298098,0.00053140894,0.0009236687,0.00006855826,0.000076028424,0.00026480242,0.0014288417,0.0188081,0.9680801,0.004441193,0.0039140694,0.000533413],"about_ca_topic_score_codex":0.00006186647,"about_ca_topic_score_gemma":0.000036924022,"teacher_disagreement_score":0.65773344,"about_ca_system_score_codex":0.00012138999,"about_ca_system_score_gemma":0.00001263942,"threshold_uncertainty_score":0.9999976},"labels":[],"label_agreement":null},{"id":"W4377715328","doi":"10.1109/tcpmt.2023.3279098","title":"Deep Independent Recurrent Neural Network Technique for Modeling Transient Behavior of Nonlinear Circuits","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Analog and Mixed-Signal Circuit Design","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Nonlinear system; Artificial neural network; Transient (computer programming); Electronic circuit; Computer science; Transient analysis; Transient response; Control theory (sociology); Electronic engineering; Artificial intelligence; Engineering; Electrical engineering; Physics","score_opus":0.026667518383259817,"score_gpt":0.24088945866448194,"score_spread":0.21422194028122213,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4377715328","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.348288,0.00008345357,0.6498144,0.000018560891,0.0004590739,0.0005041029,0.000025861777,0.00079445826,0.000012045132],"genre_scores_gemma":[0.9985614,0.00017887459,0.0006565097,0.000010942596,0.000037804915,0.0004565935,0.000017018698,0.000067026216,0.000013870248],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9985028,0.000024327679,0.000402788,0.00036121847,0.00017071904,0.0005381318],"domain_scores_gemma":[0.99946976,0.00006756739,0.000050962673,0.00028466556,0.000035790043,0.00009124537],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00020717479,0.00028793103,0.0003735255,0.00067305454,0.00022014636,0.00001775743,0.00021255777,0.0002600016,0.000004381066],"category_scores_gemma":[0.0000019308904,0.00031068825,0.00013472844,0.0002661852,0.00007245158,0.00007019448,0.0000037618308,0.0004955008,0.000004858818],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020447813,0.00009962768,0.00001840502,0.00017595112,0.00009813631,0.00001537081,0.0001135006,0.86206967,0.056091674,0.00009957514,0.000023883023,0.081173785],"study_design_scores_gemma":[0.0009594228,0.00024286695,0.00012270712,0.00022013104,0.00018061096,0.00007754739,0.00014061923,0.60088325,0.3948629,0.0016190668,0.0001741382,0.0005167789],"about_ca_topic_score_codex":0.000011512545,"about_ca_topic_score_gemma":0.000013455803,"teacher_disagreement_score":0.6502733,"about_ca_system_score_codex":0.00006272117,"about_ca_system_score_gemma":0.0000099031295,"threshold_uncertainty_score":0.9999345},"labels":[],"label_agreement":null},{"id":"W4380607283","doi":"10.1109/tcpmt.2023.3285902","title":"Liquid-Crystal Reconfigurable Coupler for Millimeter-Wave Applications","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Antenna and Metasurface Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Reconfigurability; Materials science; Extremely high frequency; Permittivity; Millimeter; Relative permittivity; Waveguide; Coupling (piping); Slab; Optoelectronics; Dielectric; Frequency band; Substrate (aquarium); Liquid crystal; Optics; Physics; Telecommunications; Computer science; Antenna (radio); Composite material","score_opus":0.028566590063765062,"score_gpt":0.23947731652879448,"score_spread":0.21091072646502942,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4380607283","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4334597,0.00010846703,0.560724,0.00039283812,0.00032708526,0.00040025005,0.00006827522,0.004447354,0.00007201254],"genre_scores_gemma":[0.9944021,0.0007319146,0.003927959,0.00002384156,0.000015535492,0.0005578099,0.00001537047,0.000059099326,0.00026636798],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988648,0.0000061703126,0.0002259566,0.00034272624,0.000084317435,0.00047598765],"domain_scores_gemma":[0.9994125,0.0001010483,0.000035818444,0.00036946734,0.000022503453,0.00005867552],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0000866484,0.00024489374,0.00026789276,0.00068331347,0.0003071491,0.0000240966,0.0001622997,0.00020898167,0.000008217712],"category_scores_gemma":[0.0000033202791,0.0002531252,0.00007551228,0.0002661473,0.00013545871,0.00009108524,0.0000036917795,0.00032943423,0.000038768834],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007118294,0.00008451771,0.0000075959047,0.0002793909,0.0002718441,0.000012671935,0.000099913945,0.053902462,0.77247834,0.0002674921,0.00045678185,0.17206782],"study_design_scores_gemma":[0.0005447417,0.00012752814,0.0000348166,0.000060451817,0.00004219722,0.000027923954,0.0002670288,0.013658763,0.95701504,0.0030354955,0.024834478,0.00035153845],"about_ca_topic_score_codex":0.0000036937956,"about_ca_topic_score_gemma":0.000005343176,"teacher_disagreement_score":0.5609424,"about_ca_system_score_codex":0.000048557653,"about_ca_system_score_gemma":0.0000053408803,"threshold_uncertainty_score":0.9999921},"labels":[],"label_agreement":null},{"id":"W4381785378","doi":"10.1109/tcpmt.2023.3288612","title":"Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review","year":2023,"lang":"en","type":"review","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Heat Transfer Mechanisms","field":"Engineering","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Windsor","funders":"Natural Sciences and Engineering Research Council of Canada; Mitacs","keywords":"Heat sink; Electronics; Electronics cooling; Computer cooling; Active cooling; Power electronics; Mechanical engineering; Heat transfer; Jet (fluid); Reliability (semiconductor); Passive cooling; Water cooling; Computer science; Automotive industry; Automotive engineering; Materials science; Thermal management of electronic devices and systems; Power (physics); Aerospace engineering; Electrical engineering; Engineering; Mechanics; Physics","score_opus":0.02900197806166171,"score_gpt":0.2692932307040659,"score_spread":0.2402912526424042,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4381785378","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00011587053,0.62453514,0.37061584,0.00017486601,0.00031361895,0.0014201326,0.000051518142,0.0027413317,0.000031665924],"genre_scores_gemma":[0.012804497,0.98525846,0.00053339644,0.00006250632,0.00002242915,0.00096981815,0.00004933254,0.0002763061,0.00002323517],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9973395,0.000057278452,0.0007084081,0.0007907818,0.00029671038,0.00080734445],"domain_scores_gemma":[0.9988307,0.0000907656,0.000064290754,0.0008346452,0.000028643832,0.00015098785],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00023403202,0.00086447893,0.0016699833,0.0010031916,0.00020852704,0.00004991419,0.00044019445,0.00058276445,0.000014027803],"category_scores_gemma":[0.0000017864703,0.00075686874,0.00023743781,0.0005110244,0.000085694715,0.00007666664,0.000007939476,0.001648933,0.00012219063],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013328818,0.0000971422,1.01601266e-7,0.0511839,0.0009948233,0.00004450903,0.000050098475,0.0011939915,0.00014255715,0.00010616327,0.000107636944,0.9460657],"study_design_scores_gemma":[0.0006854148,0.00033986877,6.78658e-7,0.062013425,0.0020097697,0.00048322981,0.000024385517,0.0008737747,0.011977923,0.0002305003,0.91968644,0.001674587],"about_ca_topic_score_codex":0.000011066094,"about_ca_topic_score_gemma":0.00001660989,"teacher_disagreement_score":0.94439113,"about_ca_system_score_codex":0.00039458703,"about_ca_system_score_gemma":0.00005837436,"threshold_uncertainty_score":0.99948823},"labels":[],"label_agreement":null},{"id":"W4385267354","doi":"10.1109/tcpmt.2023.3298901","title":"Electro-Hydro-Dynamic-Force-Driven Filling Method for Through Polymer Substrates Via With Ag-Based Conductive Epoxy","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Fundamental Research Funds for the Central Universities; Natural Science Foundation of Jiangsu Province","keywords":"Electrical conductor; Materials science; Polymer; Substrate (aquarium); Conductive polymer; Epoxy; Electronics; Nanotechnology; Optoelectronics; Composite material; Electrical engineering; Engineering","score_opus":0.016857923060974125,"score_gpt":0.2525813535176965,"score_spread":0.2357234304567224,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4385267354","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.45764136,0.00003816978,0.54051864,0.0001249961,0.00021724714,0.0001296881,0.000025913181,0.0012872731,0.000016685379],"genre_scores_gemma":[0.9615057,0.0000570812,0.038019687,0.000035661273,0.00001687078,0.00012462257,0.0000393921,0.00009299285,0.00010796704],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99863034,0.00002955959,0.00024508117,0.0004270533,0.00010843923,0.0005595058],"domain_scores_gemma":[0.9993705,0.0001977953,0.000057476038,0.00028167854,0.00003109798,0.0000614549],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00007543164,0.0003300654,0.00037818504,0.0003778463,0.00032014688,0.00004354538,0.00013313587,0.00018862277,0.0000084120275],"category_scores_gemma":[0.0000030114034,0.0003161523,0.00006694071,0.00023514591,0.00010234498,0.00013568957,0.0000026991213,0.0003040272,0.000005824695],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000033837958,0.000018175255,0.00000386339,0.00006864534,0.00011231992,0.000012359287,0.00005760154,0.52964675,0.46733016,0.00004053867,0.0000038994067,0.002671864],"study_design_scores_gemma":[0.00068603415,0.00009566522,0.000028487266,0.000098802884,0.000053239946,0.000046955032,0.00009590307,0.14222771,0.8552231,0.00097509567,0.00015240801,0.00031655165],"about_ca_topic_score_codex":0.000042954613,"about_ca_topic_score_gemma":0.00002397243,"teacher_disagreement_score":0.50386435,"about_ca_system_score_codex":0.000079951475,"about_ca_system_score_gemma":0.000011310527,"threshold_uncertainty_score":0.9999291},"labels":[],"label_agreement":null},{"id":"W4385945601","doi":"10.1109/tcpmt.2023.3306007","title":"A Wideband Symmetrical Crossover Model With Analytic Analysis and Its Millimeter-Wave Application","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Crossover; Wideband; Extremely high frequency; Bandwidth (computing); Notation; Computer science; Electronic engineering; Beamforming; Algorithm; Mathematics; Telecommunications; Engineering; Artificial intelligence; Arithmetic","score_opus":0.01496157278123777,"score_gpt":0.21389275333760122,"score_spread":0.19893118055636344,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4385945601","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5125402,0.00006180219,0.48639965,0.00008230592,0.000034933637,0.000082634244,0.000015465223,0.00076431164,0.000018687762],"genre_scores_gemma":[0.99822706,0.000251859,0.001271874,0.0000143978905,0.000008314029,0.000042207408,0.000009298534,0.000042374377,0.00013262556],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9989215,0.000008522579,0.00020157776,0.0003841235,0.00013081299,0.000353476],"domain_scores_gemma":[0.9995124,0.000065279586,0.000028305585,0.00027937096,0.00001880171,0.00009584419],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008691934,0.00025238137,0.00031880147,0.0018683453,0.00017388814,0.000048675713,0.00008900209,0.00015391801,0.0000025284637],"category_scores_gemma":[0.0000023250466,0.00023650732,0.000059388556,0.0009913632,0.000065748776,0.000078322715,0.000005200789,0.00032176747,0.000011107885],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000294932,0.00003927498,0.00015992466,0.00012845744,0.0009811491,0.000020456442,0.00010848763,0.947543,0.03509588,0.000046429017,0.000033234355,0.015814193],"study_design_scores_gemma":[0.0003880929,0.00003375127,0.0010180495,0.000029246927,0.0002684731,0.00003059222,0.000018597593,0.8012153,0.1964989,0.00016908403,0.00008193919,0.00024795622],"about_ca_topic_score_codex":0.000014733247,"about_ca_topic_score_gemma":0.000012646745,"teacher_disagreement_score":0.48568684,"about_ca_system_score_codex":0.00004907203,"about_ca_system_score_gemma":0.000004337973,"threshold_uncertainty_score":0.9644488},"labels":[],"label_agreement":null},{"id":"W4389692456","doi":"10.1109/tcpmt.2023.3342134","title":"Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Communications Research Centre Canada; Université du Québec en Outaouais","funders":"","keywords":"Phase shift module; Transmission line; PIN diode; Electronic engineering; Modular design; Diode; Beamforming; Electronic circuit; Printed circuit board; Coplanar waveguide; Insertion loss; Computer science; Materials science; Optoelectronics; Engineering; Electrical engineering; Telecommunications; Microwave","score_opus":0.014847487220698563,"score_gpt":0.22209371937281808,"score_spread":0.20724623215211951,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4389692456","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6987299,0.000036753598,0.29764748,0.00034837864,0.00029434942,0.00017642413,0.000031545154,0.0025721295,0.00016302936],"genre_scores_gemma":[0.99796534,0.000101454985,0.0015321417,0.000047765217,0.00001744358,0.000046987436,0.000014600134,0.0000892043,0.00018506066],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985778,0.000021016605,0.0002446471,0.00042946104,0.00017212413,0.000555001],"domain_scores_gemma":[0.9992769,0.00010385923,0.000032325926,0.00046567942,0.000015460442,0.000105801526],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00012226762,0.000383107,0.0003334625,0.0006529209,0.0002229118,0.00006015792,0.0001871463,0.00018875701,0.000027148411],"category_scores_gemma":[0.0000018260075,0.00035431093,0.000061278326,0.0002712602,0.00009548144,0.00008264439,0.0000022731886,0.00057115516,0.00008291637],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000086526554,0.00010155479,0.000016782413,0.00008162266,0.0001106928,0.000049725637,0.00006917222,0.94656813,0.04427791,0.000020358899,0.00018399229,0.008433529],"study_design_scores_gemma":[0.0021851952,0.00026698614,0.00019919296,0.0002735121,0.000035749974,0.00002925293,0.000077384444,0.29963696,0.69384545,0.00012623279,0.0027951656,0.0005289168],"about_ca_topic_score_codex":0.000024658531,"about_ca_topic_score_gemma":0.000008306021,"teacher_disagreement_score":0.64956754,"about_ca_system_score_codex":0.00010705812,"about_ca_system_score_gemma":0.000009479945,"threshold_uncertainty_score":0.99989086},"labels":[],"label_agreement":null},{"id":"W4390691538","doi":"10.1109/tcpmt.2024.3352183","title":"Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Electronic engineering; Impedance matching; Engineering; Quad Flat No-leads package; Capacitive sensing; Band-pass filter; Electrical impedance; Microstrip; Printed circuit board; Monolithic microwave integrated circuit; Electrical engineering; CMOS; Materials science","score_opus":0.009816877131175896,"score_gpt":0.20279084235722433,"score_spread":0.19297396522604843,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4390691538","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5827307,0.00013700004,0.41634008,0.00009360087,0.00016477729,0.0002131555,0.000029121606,0.0002816337,0.000009897669],"genre_scores_gemma":[0.9984743,0.00054590317,0.00067710003,0.0000077773675,0.000016564043,0.00018790299,0.000012707008,0.00002989748,0.000047839916],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992867,0.0000038834214,0.00022628461,0.00023379667,0.000048619782,0.00020067755],"domain_scores_gemma":[0.9997327,0.000049529044,0.000019780391,0.0001544189,0.000010870823,0.000032719603],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007888829,0.00016725223,0.00018735077,0.00056391716,0.00006130504,0.000028534598,0.000058794165,0.00010799408,0.0000022342513],"category_scores_gemma":[0.0000010334904,0.00017307099,0.000029678557,0.000110490015,0.000050926476,0.0000927719,0.0000034421432,0.00021072756,0.0000011394964],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00001448949,0.000036014288,0.000032596876,0.0012492186,0.0000771913,0.000002335857,0.00022171655,0.0035305282,0.6269173,0.00014055156,0.000008931723,0.3677691],"study_design_scores_gemma":[0.0003132394,0.00009525086,0.0005965777,0.00038170864,0.00002409304,0.00002103597,0.00005125056,0.089583896,0.906719,0.00015842616,0.0018695401,0.00018597455],"about_ca_topic_score_codex":0.000004705748,"about_ca_topic_score_gemma":0.000004991734,"teacher_disagreement_score":0.4157436,"about_ca_system_score_codex":0.000044770062,"about_ca_system_score_gemma":0.0000047620556,"threshold_uncertainty_score":0.70576304},"labels":[],"label_agreement":null},{"id":"W4390970245","doi":"10.1109/tcpmt.2024.3355851","title":"On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Millimeter-Wave Propagation and Modeling","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Beamwidth; Chipset; Antenna (radio); Antenna gain; Lens (geology); Radar; Radiation pattern; Computer science; Optics; Electronic engineering; Materials science; Engineering; Antenna aperture; Telecommunications; Chip; Physics","score_opus":0.03907198588544596,"score_gpt":0.23822588312302984,"score_spread":0.19915389723758387,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4390970245","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.36746398,0.000057830493,0.63133323,0.0003192971,0.00010824763,0.00031341708,0.000028586735,0.00036685125,0.000008561593],"genre_scores_gemma":[0.99652356,0.00009387967,0.003034368,0.00007031083,0.000009154566,0.00020763831,0.0000072519347,0.000037900012,0.000015924947],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9992085,0.000019726374,0.0002190636,0.0002480484,0.0000819184,0.00022273004],"domain_scores_gemma":[0.9993806,0.00025381407,0.000021636986,0.0002988571,0.0000148098015,0.00003028085],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010072415,0.000162837,0.00016056155,0.00076425023,0.00012502432,0.000040482562,0.00011808141,0.000102118494,0.0000057477887],"category_scores_gemma":[0.0000033121937,0.00013629558,0.000056246707,0.00020603278,0.000057168254,0.000092988215,0.0000014678614,0.0003394007,0.0000037326433],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008649618,0.00028387053,0.000004906824,0.00048497462,0.00015813718,0.000008837761,0.0001956443,0.15381123,0.6702777,0.001442291,0.00004862415,0.1731973],"study_design_scores_gemma":[0.00021943249,0.00007301203,0.0000120698105,0.00010680314,0.000020752956,0.0000052587234,0.000015698672,0.4237847,0.573819,0.0010629679,0.00076014904,0.0001201659],"about_ca_topic_score_codex":0.00001239632,"about_ca_topic_score_gemma":0.000016626876,"teacher_disagreement_score":0.62905955,"about_ca_system_score_codex":0.000048253045,"about_ca_system_score_gemma":0.000009385682,"threshold_uncertainty_score":0.5557973},"labels":[],"label_agreement":null},{"id":"W4392902715","doi":"10.1109/tcpmt.2024.3376993","title":"Thermal Management of Nonuniform Heat Fluxes in an Electric-Vehicle Fast-Charger: Experimental and Numerical Analysis","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Refrigeration and Air Conditioning Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Thermal; Thermal management of electronic devices and systems; Environmental science; Mechanics; Materials science; Physics; Engineering; Thermodynamics; Mechanical engineering","score_opus":0.00925016608620334,"score_gpt":0.23265195279081954,"score_spread":0.2234017867046162,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392902715","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89225894,0.00034888502,0.10596695,0.00016142412,0.0001050183,0.000107130196,0.0000069255357,0.0009783321,0.00006641377],"genre_scores_gemma":[0.99880505,0.00014204018,0.00095477817,0.000008612996,0.0000043395717,0.000042144275,0.000004574667,0.000019988589,0.00001849931],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99919134,0.000012399751,0.00021103137,0.00027029729,0.00009453257,0.00022040558],"domain_scores_gemma":[0.9997282,0.000020436994,0.00001265032,0.00019658449,0.0000055589257,0.000036592675],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000053381707,0.00017053551,0.00022429884,0.0011730611,0.0000922746,0.00005204248,0.00010609303,0.00011631578,0.000018497922],"category_scores_gemma":[2.2552646e-7,0.00016662556,0.0000484146,0.0004043636,0.00006817929,0.00015368365,0.0000054151205,0.00027722702,0.000003271553],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000048437647,0.00035964706,0.0008695799,0.0002963151,0.0012011622,0.000116173214,0.0006943776,0.12697278,0.6954695,0.001421513,0.000014305422,0.17253624],"study_design_scores_gemma":[0.00025549528,0.00009221809,0.0023707026,0.00007335407,0.00007098827,0.000009201901,0.0003086302,0.21981771,0.7765866,0.00018952208,0.000048876187,0.00017669417],"about_ca_topic_score_codex":0.000016285803,"about_ca_topic_score_gemma":0.0000038110236,"teacher_disagreement_score":0.17235956,"about_ca_system_score_codex":0.00005274902,"about_ca_system_score_gemma":0.0000025630468,"threshold_uncertainty_score":0.6794793},"labels":[],"label_agreement":null},{"id":"W4393241316","doi":"10.1109/tcpmt.2024.3382628","title":"Sensitivity Enhancement of Microwave Split-Ring-Resonator Sensors","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Frequency and Time Standards","field":"Physics and Astronomy","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Microwave; Sensitivity (control systems); Resonator; Ring (chemistry); Materials science; Optoelectronics; Electronic engineering; Acoustics; Physics; Telecommunications; Computer science; Engineering; Chemistry","score_opus":0.00980190085108385,"score_gpt":0.24441142695788043,"score_spread":0.23460952610679658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4393241316","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.56262213,0.0000646767,0.4358932,0.00020450643,0.0003548362,0.00009829215,0.00006706833,0.00013557784,0.0005597105],"genre_scores_gemma":[0.9977304,0.000020732055,0.0018275349,0.000009024091,0.0000607731,0.00001573185,0.0000042682736,0.000022750326,0.00030879406],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99898726,0.000027481217,0.00021880506,0.0003648394,0.00012368005,0.00027793527],"domain_scores_gemma":[0.99956256,0.000076263495,0.00004963823,0.0002384518,0.000021278353,0.00005183617],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010974457,0.00020749499,0.00024243788,0.00031733903,0.00016356223,0.000024386594,0.000068583286,0.00007550203,0.00009806976],"category_scores_gemma":[6.156303e-7,0.00020237015,0.000088289635,0.00011069812,0.00017654047,0.000087918765,0.0000051970533,0.00039478656,0.000020130903],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008799921,0.00036909003,0.00019257303,0.00028003866,0.0006626445,0.00007447218,0.0004965064,0.0018883671,0.33404058,0.013001268,0.000083587285,0.6488229],"study_design_scores_gemma":[0.00027823297,0.000056849865,0.00004941044,0.00020741374,0.0000464001,0.000015151493,0.000115461975,0.0012473579,0.98730093,0.0075746733,0.002913442,0.00019468585],"about_ca_topic_score_codex":0.000059090806,"about_ca_topic_score_gemma":0.0000032578387,"teacher_disagreement_score":0.65326035,"about_ca_system_score_codex":0.000040915224,"about_ca_system_score_gemma":0.000019198587,"threshold_uncertainty_score":0.8252415},"labels":[],"label_agreement":null},{"id":"W4399527102","doi":"10.1109/tcpmt.2024.3410298","title":"TC-GVF: Tensor Core GPU-Based Vector Fitting via Accelerated Tall-Skinny QR Solvers","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Tensor decomposition and applications","field":"Mathematics","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Computational science; Tensor (intrinsic definition); Parallel computing; Computer science; Core (optical fiber); Computer graphics (images); CUDA; Mathematics; Geometry","score_opus":0.052529132840329756,"score_gpt":0.3024098454241697,"score_spread":0.24988071258383995,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399527102","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6335509,0.000049323644,0.36030596,0.0029251578,0.00042748576,0.00034298844,0.000053918357,0.0022435752,0.000100717974],"genre_scores_gemma":[0.99060565,0.000023302793,0.008578832,0.00019182471,0.000040358544,0.0001324395,0.000017791173,0.000079225094,0.00033056992],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9982236,0.000034812376,0.0004163471,0.00063632126,0.0002145259,0.00047440655],"domain_scores_gemma":[0.9988976,0.00032036612,0.00009784002,0.0005102302,0.00004736963,0.0001265602],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00013751083,0.00036520054,0.00035759434,0.00079246436,0.000573903,0.00014332792,0.0002710983,0.00027408838,0.00012863753],"category_scores_gemma":[0.0000074698855,0.00035652643,0.00014142825,0.0003389259,0.00019541969,0.00011889188,0.000008240623,0.0007762113,0.00009542813],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00037835786,0.0028044512,0.00024422212,0.0019604939,0.0017660211,0.0005035906,0.0014223002,0.0079021705,0.7400428,0.017176006,0.0068545314,0.21894506],"study_design_scores_gemma":[0.0017147686,0.00020383052,0.0005129364,0.0007487978,0.00032411458,0.00029398478,0.00025200626,0.061934955,0.8978954,0.025422446,0.009661173,0.0010356029],"about_ca_topic_score_codex":0.000029700132,"about_ca_topic_score_gemma":0.000012937178,"teacher_disagreement_score":0.3570548,"about_ca_system_score_codex":0.00012459695,"about_ca_system_score_gemma":0.00003198091,"threshold_uncertainty_score":0.99988866},"labels":[],"label_agreement":null},{"id":"W4399527193","doi":"10.1109/tcpmt.2024.3412794","title":"Analytical Solutions for Transient Thermal Spreading Resistance of a 3-D Flux Channel","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Transient (computer programming); Channel (broadcasting); Mechanics; Flux (metallurgy); Thermal resistance; Thermal; Transient analysis; Materials science; Physics; Transient response; Computer science; Thermodynamics; Engineering; Electrical engineering; Heat transfer","score_opus":0.026223679362500276,"score_gpt":0.2406381336712581,"score_spread":0.21441445430875783,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399527193","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.81744623,0.0007769361,0.17756528,0.00064927735,0.0006931213,0.00025847767,0.00007532644,0.0024156545,0.000119671495],"genre_scores_gemma":[0.9990867,0.000099822115,0.00052585854,0.000009282553,0.0000182525,0.000094678886,0.0000032727837,0.00005127463,0.00011089583],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988028,0.000009977699,0.00028235576,0.0003407188,0.000107266154,0.0004569222],"domain_scores_gemma":[0.99944997,0.00014355274,0.000021698492,0.0003180971,0.000018865105,0.000047815673],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011674107,0.00023399535,0.00029141354,0.00087260734,0.00014753352,0.000031650114,0.00019626656,0.00023188439,0.000009045469],"category_scores_gemma":[0.000005017476,0.00023840292,0.00011827883,0.00021773338,0.00024367485,0.0001022078,0.0000044196954,0.0004203937,0.000004927667],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005342967,0.000091271926,0.0000056874856,0.00093010545,0.000544748,0.000021136084,0.00048673278,0.04892129,0.9069474,0.0023725857,0.0005041877,0.039121468],"study_design_scores_gemma":[0.00033176685,0.000056387773,0.000053657375,0.00034301024,0.00009521117,0.000025367628,0.00021895401,0.096545674,0.8992124,0.0017561656,0.0011000496,0.0002613232],"about_ca_topic_score_codex":0.0000056732865,"about_ca_topic_score_gemma":0.000011141982,"teacher_disagreement_score":0.18164042,"about_ca_system_score_codex":0.000090544236,"about_ca_system_score_gemma":0.000010852137,"threshold_uncertainty_score":0.9721789},"labels":[],"label_agreement":null},{"id":"W4399939162","doi":"10.1109/tcpmt.2024.3418342","title":"High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Computational Physics and Python Applications","field":"Computer Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Decomposition; Tensor (intrinsic definition); Galerkin method; Tensor decomposition; Uncertainty quantification; Applied mathematics; Mathematics; Mathematical optimization; Computer science; Finite element method; Physics; Pure mathematics; Statistics","score_opus":0.02022201454345108,"score_gpt":0.26960996085831496,"score_spread":0.24938794631486388,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399939162","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4053965,0.0000625517,0.5922606,0.001518293,0.00027552198,0.00011056934,0.000010741467,0.00036253352,0.0000026768491],"genre_scores_gemma":[0.9794506,0.000013077263,0.020375734,0.00006448941,0.00002454928,0.000029329696,0.000008622864,0.000015309422,0.000018298064],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988703,0.000028621322,0.00020345698,0.0005358592,0.00015820895,0.00020351949],"domain_scores_gemma":[0.99940455,0.00015368912,0.00004812751,0.00028990686,0.000034885346,0.00006883671],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001032078,0.00017749035,0.00015408157,0.000524736,0.00041231784,0.00018155223,0.00017348443,0.000084546475,0.0000037405603],"category_scores_gemma":[0.000001183163,0.00017845398,0.000039361155,0.0002395679,0.00010663938,0.00019535968,0.000013456095,0.00027831018,0.000015909147],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026277025,0.00022374297,0.000006262491,0.00009087263,0.00014766703,0.000016833541,0.0001933095,0.5537409,0.086421154,0.06536812,0.000054500182,0.29371032],"study_design_scores_gemma":[0.00023547302,0.00004510486,0.00046567456,0.00013301207,0.00003223261,0.0001528745,0.000010331014,0.9270703,0.031504687,0.03997877,0.00013464104,0.00023687797],"about_ca_topic_score_codex":0.00007659507,"about_ca_topic_score_gemma":0.000004479172,"teacher_disagreement_score":0.5740541,"about_ca_system_score_codex":0.0000617941,"about_ca_system_score_gemma":0.000026379435,"threshold_uncertainty_score":0.72771424},"labels":[],"label_agreement":null},{"id":"W4400646360","doi":"10.1109/tcpmt.2024.3428404","title":"Nested Latin Hypercube-Based Sampling for Efficient Uncertainty Quantification Using Sensitivity-Assisted Least Squares SVM","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Fault Detection and Control Systems","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada","keywords":"Latin hypercube sampling; Sensitivity (control systems); Sampling (signal processing); Computer science; Hypercube; Support vector machine; Mathematics; Algorithm; Statistics; Artificial intelligence; Monte Carlo method; Engineering; Parallel computing; Electronic engineering","score_opus":0.036104893401316326,"score_gpt":0.2623124509950003,"score_spread":0.22620755759368394,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4400646360","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.49581063,0.000072921175,0.50148755,0.00017234714,0.0008148314,0.00024469668,0.000030625666,0.00136073,0.0000056787076],"genre_scores_gemma":[0.99832624,0.000006757265,0.0014356989,0.000018484108,0.00003860313,0.00008292371,0.000010802506,0.000061324725,0.000019153524],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99875414,0.000045451918,0.0003092457,0.0004114141,0.00013349595,0.00034625322],"domain_scores_gemma":[0.99935794,0.00023675071,0.000036501948,0.00027151473,0.000030926327,0.0000663634],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00020747767,0.0002695835,0.00028319066,0.00077001046,0.00035876976,0.00012696855,0.000075790886,0.00020498414,0.0000038218004],"category_scores_gemma":[0.0000055864925,0.00027640548,0.00010940822,0.00023130943,0.000072337185,0.0000563803,0.0000017616899,0.00035920012,0.000009851246],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032548884,0.000035463905,0.0000056377503,0.00022003605,0.000069058435,0.000005339529,0.000050695897,0.70522785,0.25232786,0.000027768821,0.00000408783,0.041993666],"study_design_scores_gemma":[0.00045924867,0.00003379703,0.00015786765,0.0002891651,0.000060298116,0.000056662648,0.00013218338,0.81198525,0.18578638,0.00003194999,0.0007711398,0.00023608631],"about_ca_topic_score_codex":0.00009896074,"about_ca_topic_score_gemma":0.00005567981,"teacher_disagreement_score":0.5025156,"about_ca_system_score_codex":0.00019437388,"about_ca_system_score_gemma":0.000019056703,"threshold_uncertainty_score":0.9999688},"labels":[],"label_agreement":null},{"id":"W4402666366","doi":"10.1109/tcpmt.2024.3464243","title":"A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Wideband; Materials science; Substrate (aquarium); Waveguide; Optoelectronics; Coaxial; Optics; Physics; Computer science; Telecommunications","score_opus":0.01123352734268309,"score_gpt":0.21399080436596973,"score_spread":0.20275727702328664,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4402666366","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5002106,0.00020979988,0.49610206,0.0004349996,0.0008034602,0.00011083074,0.000083485465,0.0019905982,0.000054173084],"genre_scores_gemma":[0.99716485,0.00015880603,0.002302995,0.00005604958,0.0000725377,0.00003728571,0.00002842314,0.00008011184,0.00009892002],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987251,0.000015218159,0.00030289992,0.00043720135,0.00012490312,0.00039464684],"domain_scores_gemma":[0.99948746,0.00007130168,0.000011361957,0.0002779231,0.00001689752,0.00013505238],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000083483166,0.00034404112,0.00029037293,0.0007666237,0.00012933635,0.00011203969,0.00014434953,0.00022609414,0.000040645627],"category_scores_gemma":[0.0000020024036,0.0003438405,0.000077416036,0.00024311614,0.000057625042,0.00010205035,0.0000023737794,0.0005972784,0.0000782223],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006953552,0.000076857614,0.000002915965,0.00022737643,0.00042937888,0.00017059794,0.0007732707,0.32088783,0.57036555,0.00007278804,0.0007129923,0.10621089],"study_design_scores_gemma":[0.00033501154,0.000078921774,0.000040166793,0.00043277832,0.000060302616,0.00006446629,0.00007960454,0.11710631,0.87493473,0.0004792688,0.0060028774,0.0003855529],"about_ca_topic_score_codex":0.00013300097,"about_ca_topic_score_gemma":0.00004546298,"teacher_disagreement_score":0.4969543,"about_ca_system_score_codex":0.00009916424,"about_ca_system_score_gemma":0.000011235308,"threshold_uncertainty_score":0.99990135},"labels":[],"label_agreement":null},{"id":"W4408520706","doi":"10.1109/tcpmt.2025.3552029","title":"A Novel 3-D-Printed Passive Microfluidic Temperature Sensor for Medical Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université Laval; Université de Moncton","funders":"Umm Al-Qura University","keywords":"Microfluidics; 3d printed; Materials science; Optoelectronics; Nanotechnology; Computer science; Electronic engineering; Biomedical engineering; Engineering","score_opus":0.008669363354741777,"score_gpt":0.23452464375767015,"score_spread":0.22585528040292838,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4408520706","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.27994132,0.00009643729,0.7173472,0.0007052625,0.00047769205,0.00026656414,0.000046371875,0.0010594414,0.00005966779],"genre_scores_gemma":[0.9937372,0.00026849925,0.0051904195,0.00012647794,0.00003271596,0.00033237168,0.000011125476,0.00003675386,0.00026444043],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9990186,0.0000099376675,0.00025307588,0.00031679444,0.00008865156,0.00031292773],"domain_scores_gemma":[0.9994644,0.00012354569,0.000027675704,0.0002801396,0.000029510125,0.00007472483],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005878079,0.00022837582,0.00026209396,0.0004349656,0.0002805649,0.00003498749,0.00017427592,0.00028435705,0.000009313246],"category_scores_gemma":[0.000008862727,0.0002302984,0.000055373668,0.00014315905,0.00011256809,0.00004652748,0.00000469312,0.00034586436,0.0000051427555],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000030494855,0.000082034596,0.0000036473925,0.00019586805,0.00014976253,0.000003830859,0.000025021805,0.009437375,0.95158476,0.00041417775,0.00018603413,0.037887026],"study_design_scores_gemma":[0.0008257287,0.000020171856,0.00005509387,0.00017260226,0.000039039118,0.000047266174,0.000054455995,0.0017631212,0.98163867,0.0007014365,0.014462544,0.00021986365],"about_ca_topic_score_codex":0.000009787874,"about_ca_topic_score_gemma":0.000005810529,"teacher_disagreement_score":0.71379584,"about_ca_system_score_codex":0.00005786669,"about_ca_system_score_gemma":0.000013995108,"threshold_uncertainty_score":0.93912965},"labels":[],"label_agreement":null},{"id":"W4409014793","doi":"10.1109/tcpmt.2025.3556594","title":"Unified Microwave Terahertz Waveguide Coupler for Multiband Wireless Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Terahertz radiation; Microwave; Optoelectronics; Materials science; Waveguide; Wireless; Terahertz metamaterials; Physics; Optics; Computer science; Telecommunications; Far-infrared laser","score_opus":0.00980170379380964,"score_gpt":0.2228124671870814,"score_spread":0.21301076339327174,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409014793","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22398089,0.00017529864,0.7732673,0.00028740373,0.00044513866,0.00043558076,0.000035864214,0.0011186844,0.00025379783],"genre_scores_gemma":[0.9932992,0.00017710237,0.005437371,0.00006290185,0.00002546023,0.00031549513,0.000012788815,0.00005279077,0.0006169099],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988439,0.000008761319,0.00030340848,0.0003727766,0.000068398745,0.00040273348],"domain_scores_gemma":[0.9993591,0.000113755625,0.000029619458,0.00039910513,0.000032810494,0.00006564121],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000087785105,0.00030139287,0.0002956694,0.0006632519,0.0002785262,0.000048851172,0.00020295414,0.00022827135,0.0000044094254],"category_scores_gemma":[0.0000019070668,0.00032440806,0.00007960578,0.00017200221,0.000101420264,0.00005530613,0.000004717603,0.0003583342,0.000008197639],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000053923064,0.0001688254,0.000031148924,0.0006797525,0.0005141229,0.00000562298,0.00013741135,0.043005977,0.599667,0.0011403827,0.0010005397,0.35359526],"study_design_scores_gemma":[0.0009352115,0.000026839174,0.00008733626,0.00015504815,0.00006392247,0.000017861537,0.000056540674,0.06262871,0.9039767,0.0011066654,0.030603465,0.00034172795],"about_ca_topic_score_codex":0.000013385952,"about_ca_topic_score_gemma":0.000013520766,"teacher_disagreement_score":0.7693183,"about_ca_system_score_codex":0.0000891025,"about_ca_system_score_gemma":0.000011191022,"threshold_uncertainty_score":0.9999208},"labels":[],"label_agreement":null},{"id":"W4409883267","doi":"10.1109/tcpmt.2025.3564969","title":"Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Band-pass filter; Mode (computer interface); Materials science; Line (geometry); Quarter (Canadian coin); Electronic engineering; Acoustics; Optoelectronics; Computer science; Physics; Engineering; Mathematics; Geometry","score_opus":0.00941839517516994,"score_gpt":0.22431637470165058,"score_spread":0.21489797952648065,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409883267","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.70948464,0.00013892732,0.2889343,0.00021488106,0.00036619697,0.00016503563,0.000024090421,0.0005556995,0.00011625023],"genre_scores_gemma":[0.99878603,0.00007093231,0.0008997661,0.00004356891,0.000013789735,0.000018029725,0.0000051109428,0.000042213007,0.0001205486],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986849,0.000024185527,0.00033407955,0.00034424048,0.00012547248,0.0004871099],"domain_scores_gemma":[0.9994515,0.00009295386,0.0000382119,0.00031831636,0.000019502198,0.00007948298],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00010144902,0.00035552727,0.0004551122,0.0011008644,0.00017811626,0.00006716319,0.00016356738,0.00020076272,0.000007857038],"category_scores_gemma":[0.0000026119135,0.0003418018,0.000050772564,0.00022472718,0.000109380846,0.00012032515,0.0000034710513,0.0005878077,0.0000022694167],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011527958,0.00012738068,0.0005751999,0.0002583762,0.00029314356,0.000046136865,0.0002478661,0.9301013,0.06471446,0.000025007865,0.00010497159,0.0033908961],"study_design_scores_gemma":[0.0037867257,0.00012385687,0.0008974431,0.000752118,0.00010487162,0.00007635585,0.0003978712,0.3055081,0.6871106,0.00017937654,0.00049343694,0.000569248],"about_ca_topic_score_codex":0.0002512383,"about_ca_topic_score_gemma":0.00016376768,"teacher_disagreement_score":0.62459314,"about_ca_system_score_codex":0.00016677385,"about_ca_system_score_gemma":0.000019715393,"threshold_uncertainty_score":0.9999034},"labels":[],"label_agreement":null},{"id":"W4410086780","doi":"10.1109/tcpmt.2025.3567023","title":"An Algorithmic Approach to Formulate Well-Conditioned Stable Reduced-Order Models of Active Circuits","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Real-time simulation and control systems","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Siemens (Canada); University of Ottawa; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electronic circuit; Computer science; Order (exchange); Electronic engineering; Mathematical optimization; Mathematics; Electrical engineering; Engineering","score_opus":0.011199955478163234,"score_gpt":0.2265505525252999,"score_spread":0.21535059704713666,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410086780","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3996809,0.000020005755,0.5972729,0.00006702703,0.00022306209,0.00033465988,0.000020953948,0.0005058188,0.0018746699],"genre_scores_gemma":[0.99817586,0.000022512872,0.0014487577,0.000030748215,0.000010746736,0.000101974074,0.000010912359,0.00003238427,0.00016609368],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99885005,0.000030308935,0.00032688084,0.0003436218,0.0001293956,0.00031977444],"domain_scores_gemma":[0.99937874,0.000034093082,0.00004813716,0.00040550763,0.00004937473,0.00008417543],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000088354194,0.00023704297,0.0003554016,0.0009524842,0.00018271962,0.000037701848,0.00019121387,0.00019051028,0.000008652814],"category_scores_gemma":[0.0000010547009,0.0002539032,0.00005308314,0.0002970523,0.00004869966,0.00026266626,0.0000033469819,0.0002849202,0.0000071790137],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002955818,0.00013118991,0.0000022922284,0.00009282389,0.00018071405,0.0000012857658,0.00022407198,0.88064694,0.060339034,0.00031264062,0.000019133364,0.05802029],"study_design_scores_gemma":[0.0010932985,0.00005567379,0.00019479598,0.00010813936,0.00005117872,0.000013208036,0.0002917658,0.56420445,0.43132794,0.0021907531,0.00020669667,0.00026211518],"about_ca_topic_score_codex":0.00007121204,"about_ca_topic_score_gemma":0.0000048712473,"teacher_disagreement_score":0.59849495,"about_ca_system_score_codex":0.00008857216,"about_ca_system_score_gemma":0.000014756314,"threshold_uncertainty_score":0.9999913},"labels":[],"label_agreement":null},{"id":"W4411143030","doi":"10.1109/tcpmt.2025.3577738","title":"An Improved Inductance and Self-Resonance Frequency Modeling and Estimation of Single-Turn On-Chip Inductors for Millimeter-Wave Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Royal Military College of Canada","funders":"Indian Institute of Space Science and Technology; Department of Science and Technology, Government of Rajasthan; Ministry of Science Research and Technology","keywords":"Inductance; Inductor; Extremely high frequency; Resonance (particle physics); Electronic engineering; Millimeter; Optoelectronics; Materials science; RLC circuit; Turn (biochemistry); Electrical engineering; Physics; Nuclear magnetic resonance; Capacitor; Engineering; Optics; Voltage","score_opus":0.014127652404844367,"score_gpt":0.22155604040182722,"score_spread":0.20742838799698285,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4411143030","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.51417255,0.00024436924,0.4849126,0.00004956973,0.000092111826,0.00020135373,0.000020051804,0.00029569794,0.000011714704],"genre_scores_gemma":[0.95806307,0.00018849553,0.041584954,0.00001379978,0.000010268138,0.0001013084,0.00000496943,0.000028373815,0.0000047772983],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99915457,0.000009805389,0.0002487445,0.00031928896,0.000050853985,0.00021675107],"domain_scores_gemma":[0.9995543,0.000069210604,0.000037319678,0.00026704726,0.000023311775,0.00004885425],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007760399,0.00021612672,0.0002338146,0.00050568854,0.0001668976,0.000028435294,0.0000849207,0.00017292345,4.0458556e-7],"category_scores_gemma":[0.000003631751,0.00023180601,0.000026530455,0.000117865784,0.000069728456,0.00009473787,0.000003109806,0.000255479,1.8687821e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003532004,0.00028647532,0.000039304046,0.0008468125,0.00023725854,0.0000013058676,0.0004421983,0.16100463,0.6402661,0.0010309783,0.0000056945405,0.19580388],"study_design_scores_gemma":[0.00048764268,0.00011637852,0.00012798709,0.00019417674,0.000052058906,0.000012459148,0.00005486916,0.53929305,0.45418817,0.0051988624,0.00004764685,0.00022673672],"about_ca_topic_score_codex":0.000014951646,"about_ca_topic_score_gemma":0.00000527779,"teacher_disagreement_score":0.4438905,"about_ca_system_score_codex":0.000046817997,"about_ca_system_score_gemma":0.0000070929323,"threshold_uncertainty_score":0.9452775},"labels":[],"label_agreement":null},{"id":"W4411600095","doi":"10.1109/tcpmt.2025.3582617","title":"VO <sub>2</sub> Switch-Based Tunable 3-D Cavity Filters","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Fiber Optic Sensors","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Materials science; Optoelectronics","score_opus":0.007813286987815497,"score_gpt":0.20674954574695648,"score_spread":0.19893625875914098,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4411600095","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5933022,0.00004718042,0.40410686,0.0003354997,0.00056711806,0.00014425667,0.000011035947,0.0013607729,0.00012510113],"genre_scores_gemma":[0.9965895,0.00007496345,0.0030302522,0.00011607209,0.000010134138,0.000054987813,0.0000037278035,0.000049149352,0.000071238945],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99868685,0.000018213168,0.00025987957,0.00041182037,0.0001237641,0.0004994666],"domain_scores_gemma":[0.999265,0.00010129468,0.00003479154,0.0004993616,0.00001959221,0.000079932506],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000066792316,0.0003259832,0.00031445335,0.0008786889,0.000272165,0.000034861296,0.00020515257,0.00024543348,0.000006804281],"category_scores_gemma":[0.0000031961806,0.00036641874,0.00007538359,0.0002638498,0.00015894466,0.00009904681,0.0000050392496,0.0006576226,0.000026338297],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050921724,0.00012028273,0.000054760465,0.0002093619,0.00020073508,0.000037302205,0.000058887326,0.39559972,0.48466673,0.000066467685,0.00018818768,0.118746646],"study_design_scores_gemma":[0.00072908873,0.000030077668,0.00021316599,0.00014225744,0.000047476326,0.000015421592,0.00005239385,0.027877357,0.9691699,0.0007241521,0.00069772586,0.00030097974],"about_ca_topic_score_codex":0.000016030075,"about_ca_topic_score_gemma":0.000016680817,"teacher_disagreement_score":0.48450318,"about_ca_system_score_codex":0.00016650363,"about_ca_system_score_gemma":0.0000146198545,"threshold_uncertainty_score":0.99987876},"labels":[],"label_agreement":null},{"id":"W4413212618","doi":"10.1109/tcpmt.2025.3597811","title":"Stable HIPPO-Based Circuit Macro-Modeling","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"VLSI and Analog Circuit Testing","field":"Computer Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Macro; Computer science; Electronic engineering; Computer architecture; Engineering; Programming language","score_opus":0.021946389548986395,"score_gpt":0.23679390555897387,"score_spread":0.21484751600998747,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4413212618","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22470428,0.00007294363,0.7716736,0.0014142711,0.0004638386,0.00012015472,0.0000032816868,0.0011600606,0.0003875359],"genre_scores_gemma":[0.99632114,0.000016583435,0.0030241876,0.00041210977,0.000010786467,0.000030928277,0.0000013451015,0.000016134278,0.00016677471],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99830735,0.000040579576,0.00029569966,0.0006521699,0.00017102939,0.0005331454],"domain_scores_gemma":[0.99903804,0.000112290494,0.000064337415,0.00066485984,0.00003913943,0.00008134885],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00019748182,0.00026272345,0.00028112138,0.0010539145,0.0006652855,0.00015721464,0.0006642374,0.00017129978,0.000006015514],"category_scores_gemma":[0.0000066188063,0.0002770476,0.000077468714,0.00041482327,0.00008969059,0.00020577841,0.000015945758,0.00055056304,0.000016690836],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000005278416,0.00035614808,0.00042084476,0.0001866233,0.00014893137,0.00007047442,0.00015674016,0.10561882,0.022412205,0.0054830224,0.00005641705,0.86508447],"study_design_scores_gemma":[0.0011180901,0.0000753616,0.00017628532,0.00042151008,0.0000443492,0.000047251357,0.0000617325,0.6731139,0.30602267,0.017643068,0.00076254783,0.00051325274],"about_ca_topic_score_codex":0.000080191996,"about_ca_topic_score_gemma":0.000010781017,"teacher_disagreement_score":0.8645712,"about_ca_system_score_codex":0.00009139882,"about_ca_system_score_gemma":0.0000585445,"threshold_uncertainty_score":0.9999682},"labels":[],"label_agreement":null},{"id":"W4413465490","doi":"10.1109/tcpmt.2025.3599098","title":"Cost-Effective 3-D-Printable Image Dielectric Guides Based 3-dB Coupler for Millimeter-Wave Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique; Université du Québec à Montréal","funders":"","keywords":"Extremely high frequency; Dielectric; Materials science; Optoelectronics; Optics; Millimeter; Computer science; Physics","score_opus":0.015052500722390817,"score_gpt":0.2406009282446244,"score_spread":0.22554842752223359,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4413465490","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.06191215,0.0002484175,0.9340305,0.00026467475,0.00036719316,0.0014925196,0.000056422305,0.001377382,0.00025078238],"genre_scores_gemma":[0.9824467,0.00011182167,0.014970915,0.00006605584,0.000020110976,0.002105523,0.000013547626,0.000054273518,0.0002111096],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987614,0.000013983584,0.00027769117,0.00040613918,0.00007745548,0.00046331144],"domain_scores_gemma":[0.99920726,0.00023629678,0.00003299964,0.00041163783,0.00004495318,0.000066846194],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00012335952,0.00031831375,0.00032087564,0.00094625633,0.00030729512,0.000055143348,0.0001706678,0.00019925574,0.000008824829],"category_scores_gemma":[0.0000059073886,0.00034377814,0.00010052276,0.0002878438,0.00009503288,0.0000691116,0.0000048600623,0.00038836655,0.0000098052515],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009570211,0.0003204627,0.00003651472,0.0010754189,0.0007642148,0.000009719899,0.000084003535,0.21328053,0.34942687,0.00050000474,0.001352153,0.43305442],"study_design_scores_gemma":[0.0007950552,0.00005195035,0.0001505175,0.00011167349,0.000081540005,0.000010799749,0.000022496926,0.15708606,0.82263553,0.0007045713,0.01805049,0.0002993073],"about_ca_topic_score_codex":0.000013763027,"about_ca_topic_score_gemma":0.000006702317,"teacher_disagreement_score":0.9205345,"about_ca_system_score_codex":0.00015584292,"about_ca_system_score_gemma":0.000013784742,"threshold_uncertainty_score":0.9999014},"labels":[],"label_agreement":null},{"id":"W4415368621","doi":"10.1109/tcpmt.2025.3623562","title":"Low-Cost Foldable Printed RGW Wideband MIMO Antenna With Additively Manufactured Dielectric Resonator","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Antenna Design and Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Abitibi-Témiscamingue; École de Technologie Supérieure","funders":"","keywords":"Wideband; Antenna efficiency; Bandwidth (computing); Resonator; Dielectric resonator antenna; Antenna (radio); Dielectric resonator; Dielectric; Electrical impedance","score_opus":0.008199716233820155,"score_gpt":0.20956935836236856,"score_spread":0.2013696421285484,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415368621","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.2644396,0.0007095184,0.7307076,0.0012823907,0.0006208531,0.0007484782,0.00011492676,0.001141473,0.00023514597],"genre_scores_gemma":[0.9940216,0.00180359,0.001048979,0.00020650066,0.00003446937,0.00017154634,0.000020170626,0.00013281345,0.002560363],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99588627,0.00010876089,0.00081095827,0.0013842115,0.00038598245,0.00142383],"domain_scores_gemma":[0.9981865,0.0002502255,0.00020886805,0.0009681975,0.00011318301,0.00027299114],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002142372,0.0011092763,0.0012027653,0.0033380995,0.0010045704,0.00022226699,0.00060778466,0.0007371441,0.00013984201],"category_scores_gemma":[0.000009540976,0.0010500577,0.0002854211,0.0012765274,0.0004936478,0.00027880212,0.000020367956,0.001977485,0.000052803367],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0039372323,0.0037264903,0.0008972262,0.0034688204,0.014951202,0.001366505,0.0011684339,0.017143147,0.4771317,0.0007813212,0.0011767853,0.47425115],"study_design_scores_gemma":[0.004236296,0.0003258956,0.0014618211,0.0028748002,0.0011831957,0.00014469962,0.00067906524,0.06683158,0.91533023,0.00056918187,0.004766062,0.0015971613],"about_ca_topic_score_codex":0.00015650081,"about_ca_topic_score_gemma":0.00010554538,"teacher_disagreement_score":0.7296586,"about_ca_system_score_codex":0.00037476333,"about_ca_system_score_gemma":0.000086261185,"threshold_uncertainty_score":0.999195},"labels":[],"label_agreement":null},{"id":"W4416676700","doi":"10.1109/tcpmt.2025.3614737","title":"Corrections to “Stable HIPPO-Based Circuit Macro-Modeling”","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"VLSI and FPGA Design Techniques","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Equivalent circuit; Integrated circuit; Network analysis; Electronic circuit; Circuit design; Transient analysis; Control theory (sociology)","score_opus":0.017829663256093684,"score_gpt":0.23713007161565666,"score_spread":0.219300408359563,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416676700","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.18535905,0.00028360405,0.805108,0.0015991887,0.0026127691,0.0007965323,0.000075173084,0.0032772052,0.00088844955],"genre_scores_gemma":[0.9935169,0.00027080972,0.0043614795,0.00042102902,0.000038093942,0.00030613822,0.0000070388137,0.00011986013,0.00095864886],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99666137,0.000074537355,0.0007657748,0.0010864878,0.00026866008,0.001143168],"domain_scores_gemma":[0.99831617,0.0001535468,0.000080712016,0.0010932619,0.000086258646,0.00027004743],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00027295685,0.0008090359,0.0007913082,0.003632731,0.0010673293,0.00020901306,0.0005832541,0.00077780435,0.00008829492],"category_scores_gemma":[0.000010285561,0.0009820206,0.00021920502,0.0009355646,0.00018929163,0.00016907703,0.000017614528,0.0016525644,0.00009134215],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001597394,0.00073369255,0.000103555096,0.00073322456,0.0006621111,0.00005445068,0.00030915128,0.6345924,0.05528736,0.0005807604,0.0008382026,0.30594534],"study_design_scores_gemma":[0.0011655526,0.0002576092,0.00006412855,0.0013076458,0.00030025575,0.00003010034,0.00018606562,0.2649079,0.7204607,0.0039253132,0.006375612,0.0010191221],"about_ca_topic_score_codex":0.00026735934,"about_ca_topic_score_gemma":0.0000570391,"teacher_disagreement_score":0.80815786,"about_ca_system_score_codex":0.0005034392,"about_ca_system_score_gemma":0.000088766225,"threshold_uncertainty_score":0.99926305},"labels":[],"label_agreement":null},{"id":"W7092212537","doi":"10.1109/tcpmt.2025.3622232","title":"SIW-Fed Inner CDRA Inserted Into Outer Frustum-Capped DRA to Reduce ECC for CF-mMIMO Application","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Antenna Design and Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"Science and Engineering Research Board","keywords":"Antenna (radio); Stacking; Trimming; Resonator; Dielectric resonator antenna; Envelope (radar); MIMO; Dielectric; Substrate (aquarium)","score_opus":0.011046049830412293,"score_gpt":0.24531680288453772,"score_spread":0.23427075305412542,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7092212537","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3085323,0.00015760148,0.68402857,0.0046379804,0.00075337547,0.0009364597,0.00003442681,0.00086298306,0.000056298046],"genre_scores_gemma":[0.9909058,0.00025999296,0.006323808,0.0003959527,0.000060708117,0.00060347567,0.000024271583,0.00010633183,0.0013196582],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9967886,0.00006114616,0.00085188635,0.001183852,0.00022240636,0.0008921044],"domain_scores_gemma":[0.9983496,0.0001658178,0.00014245926,0.0010056399,0.0001118449,0.00022463991],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00024121131,0.0007548169,0.0008834412,0.0027244475,0.0008639058,0.0001662627,0.00058580545,0.000692689,0.000025803203],"category_scores_gemma":[0.000013859352,0.0008383752,0.00028112842,0.0009385532,0.00020987548,0.00019419471,0.00002362413,0.00094411103,0.0000722969],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00063951116,0.0006323127,0.00006036638,0.0008535278,0.001910252,0.000017594699,0.0011225153,0.013216738,0.6620092,0.00044996882,0.00053221476,0.31855583],"study_design_scores_gemma":[0.0030075714,0.0003051784,0.0003312622,0.00083857164,0.0009246338,0.00002188898,0.00080499426,0.20736146,0.7694111,0.005255607,0.010410612,0.0013271053],"about_ca_topic_score_codex":0.00029080518,"about_ca_topic_score_gemma":0.00008151793,"teacher_disagreement_score":0.6823735,"about_ca_system_score_codex":0.00032149724,"about_ca_system_score_gemma":0.000046916673,"threshold_uncertainty_score":0.9994067},"labels":[],"label_agreement":null},{"id":"W7113903501","doi":"10.1109/tcpmt.2025.3642754","title":"Reliability Modelling of Optical Fiber Couplers Based on Accelerated Tensile Cyclic Tests","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Fiber Optic Sensors","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Reliability (semiconductor); Ultimate tensile strength; Adhesive; Optical fiber; Ribbon; Tensile testing; Delamination (geology); Stress (linguistics)","score_opus":0.023239424286207108,"score_gpt":0.24592710776013696,"score_spread":0.22268768347392986,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7113903501","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5574619,0.00006679677,0.4395566,0.0007312245,0.00068071747,0.0004412106,0.000037653244,0.00068595243,0.00033792603],"genre_scores_gemma":[0.982792,0.00016793708,0.016500099,0.000100234254,0.000015302392,0.00005309948,0.0000068613863,0.00010432546,0.0002601078],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9966262,0.0000628387,0.00096434244,0.0010923411,0.00035139176,0.0009029127],"domain_scores_gemma":[0.99750245,0.0007673026,0.00016078133,0.0012724211,0.00012172026,0.00017530585],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00022811872,0.0007702024,0.0009691517,0.0017395093,0.00040880853,0.000052519754,0.00040490294,0.00079616805,0.00006723184],"category_scores_gemma":[0.000028508945,0.00085542543,0.00020551284,0.0006665476,0.0006235757,0.00014670499,0.00001336879,0.0018226118,0.000033318596],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00024052768,0.00043014082,0.000025351428,0.00040519296,0.00019317999,0.000018102446,0.00004757185,0.9573071,0.022083197,0.000046631532,0.000020248723,0.01918276],"study_design_scores_gemma":[0.0012542409,0.00014909226,0.00027186575,0.0007274112,0.000154183,0.000009057657,0.000067680485,0.53565425,0.46057698,0.00043333933,0.00028733854,0.00041459207],"about_ca_topic_score_codex":0.000046868856,"about_ca_topic_score_gemma":0.0000035307162,"teacher_disagreement_score":0.4384938,"about_ca_system_score_codex":0.00036952813,"about_ca_system_score_gemma":0.000058570575,"threshold_uncertainty_score":0.99938965},"labels":[],"label_agreement":null},{"id":"W7113910473","doi":"10.1109/tcpmt.2025.3642792","title":"Battery-Less Icing Detection Using a Self-Calibrated SIW Wireless Sensor","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"RFID technology advancements","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wireless sensor network; Wireless; Antenna (radio); Ultra high frequency; Relative permittivity; Electro-optical sensor; Energy harvesting; Radio frequency; Noise (video); Frequency band","score_opus":0.012341286691001449,"score_gpt":0.22997481616783316,"score_spread":0.2176335294768317,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7113910473","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.54634607,0.00017271907,0.44760445,0.00043753424,0.0021415374,0.0004936519,0.000021703629,0.0027366637,0.000045682405],"genre_scores_gemma":[0.99415326,0.0005956687,0.0046669655,0.000119845434,0.000040110346,0.00009620677,0.0000038065762,0.0001669644,0.00015717823],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9957767,0.00013828033,0.001026154,0.0013746013,0.00030580355,0.0013784501],"domain_scores_gemma":[0.99812025,0.00023143578,0.0002492242,0.0011609771,0.00007574488,0.00016235991],"candidate_categories":["metaepi_narrow","research_integrity"],"consensus_categories":["research_integrity"],"category_scores_codex":[0.00023587215,0.0010649083,0.0010288248,0.003767682,0.0012862459,0.00016700047,0.0005854046,0.001340128,0.00002483744],"category_scores_gemma":[0.000008451139,0.0013122443,0.00018209706,0.0011686805,0.00044910528,0.00043567544,0.000041360203,0.0024823276,0.000032147876],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00025067487,0.00079695927,0.00092176214,0.0013772148,0.0025042896,0.0001783429,0.00031515202,0.14109792,0.591356,0.00012288544,0.000013115231,0.26106572],"study_design_scores_gemma":[0.0019744867,0.000109786604,0.00041582022,0.0011077322,0.00044310646,0.00016195426,0.0004445912,0.19108136,0.8024416,0.00055940694,0.00042000212,0.0008401296],"about_ca_topic_score_codex":0.00016637669,"about_ca_topic_score_gemma":0.00005606184,"teacher_disagreement_score":0.4478072,"about_ca_system_score_codex":0.00082521717,"about_ca_system_score_gemma":0.00005346331,"threshold_uncertainty_score":0.99995637},"labels":[],"label_agreement":null}]}