{"meta":{"query_hash":"e4741a582e83","filters":{"venue":"IEEE Transactions on Components Packaging and Manufacturing Technology"},"cohort_total":106,"direct_labels_cover":0,"predictions_cover":106,"exported":106,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/e4741a582e83","api":"https://metacan.xera.ac/api/v1/cohort?venue=IEEE+Transactions+on+Components+Packaging+and+Manufacturing+Technology"},"results":[{"id":"W1965715476","doi":"10.1109/tcpmt.2014.2300842","title":"Reduction of Electromagnetic Radiation from Apertures and Enclosures Using Electromagnetic Bandgap Structures","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Antenna and Metasurface Technologies","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Sultan Qaboos University","keywords":"Electromagnetic radiation; Aperture (computer memory); Enclosure; Optics; Near and far field; Radiation; Electromagnetic field; Metamaterial; Reduction (mathematics); Electromagnetic spectrum; Parametric statistics; Radiation properties; Physics; Materials science; Acoustics; Computer science; Telecommunications","score_opus":0.009091333398006296,"score_gpt":0.210352672930902,"score_spread":0.2012613395328957,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1965715476","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.73262477,0.0021718722,0.25160983,0.00018341374,0.000064464875,0.0000376504,0.00006497395,0.00072721,0.012515849],"genre_scores_gemma":[0.9594845,0.0005211999,0.03812678,0.000032065407,0.000016877408,0.000016295053,0.000044145178,0.000064924556,0.0016931682],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998005,0.000031642394,0.0000075622015,0.000029179377,0.00011136445,0.000019813055],"domain_scores_gemma":[0.9995202,0.00016569154,0.00013204943,0.00009210697,0.000072331866,0.000017626968],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019165705,0.00047911817,0.0004298968,0.0002302809,0.00013996627,0.0004310612,0.0003275971,0.0004650023,0.00053618563],"category_scores_gemma":[0.0005060951,0.00015859552,0.0003242321,0.00019684556,0.00033692262,0.000384975,0.0004177713,0.00027017682,0.00025217133],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011224954,0.000041673695,0.0011334439,0.00025120427,0.000026666381,0.0004358206,0.00021166474,0.009776322,0.95380414,0.0027965712,0.00026010736,0.03115015],"study_design_scores_gemma":[0.000021201984,0.000506244,0.0060213306,0.000043498756,0.00005139439,0.0013280713,0.0001117271,0.048822213,0.93376076,0.0010862579,0.008219896,0.000027494561],"about_ca_topic_score_codex":0.000055871602,"about_ca_topic_score_gemma":0.00008185389,"teacher_disagreement_score":0.00053618563,"about_ca_system_score_codex":0.00022080648,"about_ca_system_score_gemma":0.00010165939,"threshold_uncertainty_score":0.0017936826},"labels":[],"label_agreement":null},{"id":"W1986794465","doi":"10.1109/tcpmt.2015.2419981","title":"A Study on Measuring Contact Resistance of Ball Bonds on Thin Metallization","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Contact resistance; Composite material; Ball (mathematics); Sheet resistance; Voltage drop; Thin film; Drop (telecommunication); Current (fluid); Electrical engineering; Nanotechnology; Geometry; Layer (electronics)","score_opus":0.0388792300282667,"score_gpt":0.24106275617228565,"score_spread":0.20218352614401894,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1986794465","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96835786,0.0005218453,0.029890677,0.000036027246,0.000025568592,0.00007278273,0.00008538199,0.00025084274,0.0007591468],"genre_scores_gemma":[0.9826287,0.00021741641,0.016672505,0.000012946937,0.000008072401,0.000027376533,0.000057722355,0.000034373414,0.00034084768],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99904746,0.0001244345,0.0000392052,0.00021574667,0.00051400217,0.000059141596],"domain_scores_gemma":[0.9969709,0.001232513,0.00045986343,0.0006361536,0.00063382974,0.00006680622],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006206742,0.0005683551,0.00055630784,0.00047980098,0.00026515292,0.00035895265,0.00086231105,0.0005019086,0.0007557231],"category_scores_gemma":[0.003295909,0.00035939933,0.00021512083,0.00056170195,0.0004147085,0.0005685057,0.0002877303,0.0003920571,0.00020803737],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006943263,0.000024085191,0.0012773136,0.0000884841,0.00001202549,0.00014705856,0.00011629629,0.00099821,0.98954153,0.000102763435,0.000047160833,0.0075755017],"study_design_scores_gemma":[0.00000947735,0.0014848821,0.012997599,0.000016875398,0.000041609015,0.00055751036,0.000103109196,0.0128856255,0.97049934,0.00007576268,0.0013076623,0.000020572397],"about_ca_topic_score_codex":0.000726973,"about_ca_topic_score_gemma":0.0011881392,"teacher_disagreement_score":0.00086231105,"about_ca_system_score_codex":0.00031017905,"about_ca_system_score_gemma":0.00017268976,"threshold_uncertainty_score":0.0032824874},"labels":[],"label_agreement":null},{"id":"W1988198042","doi":"10.1109/tcpmt.2012.2204393","title":"Multiorder Arnoldi Approach for Model Order Reduction of PEEC Models With Retardation","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Model order reduction; Reduction (mathematics); Arnoldi iteration; Order (exchange); Computer science; Generalized minimal residual method; Mathematics; Mathematical optimization; Economics; Algorithm; Iterative method; Finance","score_opus":0.019192933738268,"score_gpt":0.21772429001328825,"score_spread":0.19853135627502025,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1988198042","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.004949154,0.00007280001,0.99217576,0.00005255493,0.000016960965,0.00003133479,0.000027025264,0.00022304202,0.0024514135],"genre_scores_gemma":[0.30198753,0.0004025233,0.6847287,0.000073530246,0.000038215225,0.00038193187,0.00027662856,0.0003077804,0.011803208],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998647,0.000032575463,0.000006559601,0.000013802492,0.00007019625,0.00001219736],"domain_scores_gemma":[0.99981624,0.00008443989,0.00002181579,0.000037361177,0.000032340096,0.000007901276],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025212351,0.00067182316,0.00058988755,0.00038633455,0.0004224338,0.00048218283,0.00071888836,0.00050534384,0.0028984258],"category_scores_gemma":[0.0006163271,0.00039907784,0.0006848707,0.00021257742,0.00047006476,0.00071885996,0.0005585246,0.0012279564,0.0009974004],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000038348728,0.000043333792,0.00030300763,0.00010938369,0.000024631936,0.00011297242,0.00014974094,0.8723509,0.011534242,0.06862025,0.00092295324,0.045790188],"study_design_scores_gemma":[0.00000437986,0.00001785197,0.00002467795,0.0000043960927,0.0000028745637,0.000022057235,0.000009615639,0.990021,0.0016259721,0.006033162,0.0022286102,0.0000054318107],"about_ca_topic_score_codex":0.0020868122,"about_ca_topic_score_gemma":0.0026648804,"teacher_disagreement_score":0.0028984258,"about_ca_system_score_codex":0.0005186069,"about_ca_system_score_gemma":0.0006990493,"threshold_uncertainty_score":0.009696186},"labels":[],"label_agreement":null},{"id":"W1989274186","doi":"10.1109/tcpmt.2013.2254173","title":"Thermal Resistance and Heat Spreading Characterization Platform for Concentrated Photovoltaic Cell Receivers","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"solar cell performance optimization","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Sherbrooke","funders":"","keywords":"Characterization (materials science); Thermal; Materials science; Thermal resistance; Photovoltaics; Heat flux; Solar cell; Photovoltaic system; Computer science; Mechanical engineering; Electronic engineering; Nuclear engineering; Environmental science; Optoelectronics; Nanotechnology; Heat transfer; Electrical engineering; Engineering; Meteorology; Mechanics; Physics","score_opus":0.00818652351418424,"score_gpt":0.18043111102152432,"score_spread":0.17224458750734006,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1989274186","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7769775,0.00034879005,0.21676432,0.000078282486,0.00008228482,0.00037508694,0.00060040987,0.0016551577,0.0031182258],"genre_scores_gemma":[0.91015714,0.00017401713,0.087211855,0.000035591103,0.000026427177,0.00034538365,0.0002801145,0.00014241424,0.0016269571],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9991364,0.0001244362,0.00004087804,0.00018497212,0.00046517464,0.000048195965],"domain_scores_gemma":[0.9983883,0.00036868246,0.00028766313,0.00032226578,0.0005969889,0.000036143636],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00077941245,0.0006904211,0.0005168767,0.00076459395,0.00033553498,0.0004945455,0.0012885547,0.00066920824,0.0013703705],"category_scores_gemma":[0.0017115256,0.00029526325,0.00035444665,0.00046849417,0.0004369221,0.0006498574,0.00043763072,0.0005172163,0.000519649],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001014127,0.00007160326,0.0017189773,0.00009902163,0.000019181305,0.0000645391,0.00015205567,0.0040250993,0.98006344,0.0004117164,0.0002412295,0.013031811],"study_design_scores_gemma":[0.000012595739,0.0004759148,0.002993674,0.00000908957,0.000018146862,0.00009238377,0.000047004734,0.01731084,0.97793704,0.00007283492,0.0010099604,0.00002045957],"about_ca_topic_score_codex":0.0003877178,"about_ca_topic_score_gemma":0.00066992996,"teacher_disagreement_score":0.0013703705,"about_ca_system_score_codex":0.00051098363,"about_ca_system_score_gemma":0.00024477317,"threshold_uncertainty_score":0.004584372},"labels":[],"label_agreement":null},{"id":"W1992059690","doi":"10.1109/tcpmt.2013.2259167","title":"Optimum Order Estimation of Reduced Macromodels Based on a Geometric Approach for Projection-Based MOR Methods","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Model Reduction and Neural Networks","field":"Physics and Astronomy","cited_by":9,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Heuristics; Projection (relational algebra); Mathematical optimization; Computer science; Order (exchange); Task (project management); Algorithm; Transient (computer programming); Estimation; Mathematics; Engineering","score_opus":0.02537949123131428,"score_gpt":0.28758037914902873,"score_spread":0.26220088791771445,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1992059690","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00126164,0.000022004904,0.9982734,0.000014490758,0.0000028534541,0.000008204036,0.000006173579,0.00012488976,0.00028639476],"genre_scores_gemma":[0.11947504,0.00016114266,0.87860686,0.00003287462,0.000021233669,0.0001415071,0.00009992768,0.00026145362,0.0011999096],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99947995,0.00019430376,0.000019846295,0.000054805634,0.00022147057,0.000029524399],"domain_scores_gemma":[0.9990676,0.00051610457,0.000075032134,0.00015737259,0.00015989949,0.000023950237],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00082782627,0.00081955054,0.00096561416,0.0008039771,0.00037555207,0.00061186694,0.0007703893,0.0005985518,0.0025953676],"category_scores_gemma":[0.0027158246,0.0005919501,0.00076932664,0.00041624325,0.00064265885,0.0010654447,0.000863809,0.0015833548,0.0009968779],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007265733,0.000048029422,0.00030002135,0.00013056335,0.000032645854,0.00006381594,0.00013188651,0.8165237,0.013874022,0.03927775,0.0009876793,0.12855724],"study_design_scores_gemma":[0.0000026842838,0.000015879068,0.000040366584,0.000004949368,0.0000031443146,0.000015850064,0.000005228885,0.9921818,0.0015221592,0.0055642067,0.00063831767,0.000005467975],"about_ca_topic_score_codex":0.0008735367,"about_ca_topic_score_gemma":0.0015566095,"teacher_disagreement_score":0.0025953676,"about_ca_system_score_codex":0.0003923723,"about_ca_system_score_gemma":0.00078015256,"threshold_uncertainty_score":0.00868237},"labels":[],"label_agreement":null},{"id":"W1997337242","doi":"10.1109/tcpmt.2013.2286527","title":"Self-Consistent Steady-State Simulation of Microwave Photonic Systems Using Harmonic Balance","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Photonic and Optical Devices","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Harmonic balance; Chirp; Steady state (chemistry); Photonics; Harmonic; Microwave; Phase (matter); SIGNAL (programming language); Laser; Diode; State (computer science); Control theory (sociology); Physics; Computer science; Electronic engineering; Optics; Optoelectronics; Engineering; Acoustics; Telecommunications; Nonlinear system; Algorithm; Control (management); Quantum mechanics; Chemistry","score_opus":0.014889739309094123,"score_gpt":0.2171502440571007,"score_spread":0.20226050474800658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1997337242","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.27983773,0.00020493925,0.6842749,0.00064024277,0.00012474894,0.00017527744,0.0002576227,0.0006798893,0.033804644],"genre_scores_gemma":[0.9157921,0.00016296201,0.07704872,0.00014300628,0.000032081687,0.00043800185,0.00020922661,0.00014138859,0.0060324795],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99987304,0.000038590646,0.000004867095,0.000010627377,0.00004960135,0.0000233086],"domain_scores_gemma":[0.99958736,0.00026970275,0.000031067695,0.00003548963,0.000051633262,0.000024757283],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005291697,0.00026490857,0.00046434934,0.00039422576,0.0006214251,0.0007233977,0.0008590516,0.00085990416,0.0024275375],"category_scores_gemma":[0.0011303286,0.00038656575,0.00042601634,0.0003362813,0.000871318,0.0007783345,0.00070266303,0.00059555407,0.0002492848],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000290721,0.00003870722,0.0003752819,0.000023482895,0.000012655551,0.00005594535,0.000057103312,0.96939284,0.0022434276,0.025018664,0.0002905116,0.0024623491],"study_design_scores_gemma":[0.0000050566223,0.0000043398754,0.00002200474,0.0000010232476,7.006376e-7,0.0000019815166,0.000003953409,0.9983259,0.00019655733,0.0012947022,0.00014210289,0.000001724184],"about_ca_topic_score_codex":0.002587636,"about_ca_topic_score_gemma":0.0018899929,"teacher_disagreement_score":0.002587636,"about_ca_system_score_codex":0.00047460746,"about_ca_system_score_gemma":0.0008886547,"threshold_uncertainty_score":0.008120954},"labels":[],"label_agreement":null},{"id":"W2004328225","doi":"10.1109/tcpmt.2012.2234503","title":"Efficient Reduced-Order Macromodels of Massively Coupled Interconnect Structures via Clustering","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Low-power high-performance VLSI design","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Massively parallel; Reduction (mathematics); Computer science; Interconnection; Cluster analysis; Block (permutation group theory); Parallel computing; Algorithm; Multithreading; Singular value decomposition; Model order reduction; Transient (computer programming); Degradation (telecommunications); Mathematics; Artificial intelligence; Thread (computing)","score_opus":0.008965490120112055,"score_gpt":0.20124975611942594,"score_spread":0.1922842659993139,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2004328225","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.013116178,0.000044769902,0.9838599,0.000045783538,0.000012895956,0.000039284772,0.000058090365,0.0006866925,0.0021364475],"genre_scores_gemma":[0.40820736,0.00020609488,0.58255863,0.00006513081,0.000025165637,0.00034468464,0.00056095555,0.0006246369,0.007407379],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99983776,0.000036703826,0.000006123819,0.000021877575,0.00007939618,0.000018232253],"domain_scores_gemma":[0.99964964,0.0001455461,0.000041478575,0.0000682246,0.00007428098,0.000020899626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00032434246,0.0007119712,0.00079932914,0.00054237596,0.0005236007,0.0006159651,0.0012942712,0.0008788983,0.0025804758],"category_scores_gemma":[0.001134411,0.0006329366,0.0007455681,0.00050433906,0.00041836457,0.00092091225,0.0005465174,0.0007997432,0.00083706726],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000074485406,0.000008975646,0.00009494018,0.000021314667,0.000006988747,0.00003003397,0.000037576065,0.9859518,0.0026106078,0.004733994,0.00024254418,0.006253907],"study_design_scores_gemma":[0.000001745732,0.0000037202417,0.000017464658,0.0000015565648,0.0000013699821,0.000006117046,0.0000045697916,0.997311,0.0005685116,0.0016001433,0.00048159444,0.0000022704694],"about_ca_topic_score_codex":0.0047175675,"about_ca_topic_score_gemma":0.0064392397,"teacher_disagreement_score":0.0047175675,"about_ca_system_score_codex":0.00080157927,"about_ca_system_score_gemma":0.0012438134,"threshold_uncertainty_score":0.009380221},"labels":[],"label_agreement":null},{"id":"W2006661506","doi":"10.1109/tcpmt.2013.2292549","title":"Monolithic Wafer-Level Rectangular Waveguide and Its Transition to Coplanar Waveguide Line Using a Simplified 3-D Fabrication Process","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Coplanar waveguide; Waveguide; Fabrication; Wafer; Materials science; Optoelectronics; Capacitive sensing; Insertion loss; Coupling (piping); Microelectromechanical systems; Capacitive coupling; Line (geometry); Computer science; Electrical engineering; Telecommunications; Microwave; Engineering; Voltage","score_opus":0.022980350971316545,"score_gpt":0.23907100977675855,"score_spread":0.216090658805442,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2006661506","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.43928203,0.0020092807,0.5361139,0.0003398353,0.0003538591,0.00017761481,0.00054058223,0.003224389,0.017958423],"genre_scores_gemma":[0.65833426,0.0008115116,0.33322698,0.00014807291,0.000050614573,0.00017350237,0.00044969327,0.00013149748,0.006673833],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998374,0.000011900357,0.00000701866,0.00005976578,0.00006435322,0.00001947634],"domain_scores_gemma":[0.99984694,0.00003134041,0.000043075106,0.00004483351,0.000025162224,0.000008704943],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012243804,0.00031400597,0.0002332281,0.00015407927,0.00013736499,0.00040319603,0.0006785419,0.00043950195,0.001000168],"category_scores_gemma":[0.0001797426,0.00032580367,0.00046729526,0.00017862812,0.00023176064,0.00045224384,0.00027016576,0.0006803008,0.00073411135],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021766202,0.000019885221,0.0001714116,0.00008008022,0.000012999201,0.0001124564,0.000043827604,0.0009310538,0.98814535,0.0015980435,0.00031226274,0.008550926],"study_design_scores_gemma":[0.000022400232,0.00035254617,0.0020404342,0.000011519616,0.000035187488,0.0007263354,0.000038108043,0.01447309,0.96381974,0.0003112236,0.018140212,0.000029244626],"about_ca_topic_score_codex":0.00047350078,"about_ca_topic_score_gemma":0.000964765,"teacher_disagreement_score":0.001000168,"about_ca_system_score_codex":0.00031789587,"about_ca_system_score_gemma":0.0002952227,"threshold_uncertainty_score":0.0033459067},"labels":[],"label_agreement":null},{"id":"W2007599487","doi":"10.1109/tcpmt.2012.2187897","title":"Self-Packaged Millimeter-Wave Substrate Integrated Waveguide Filter With Asymmetric Frequency Response","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":72,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Montréal; Polytechnique Montréal","funders":"","keywords":"Band-pass filter; Extremely high frequency; Diplexer; Center frequency; Materials science; Microwave; Optoelectronics; Insertion loss; Printed circuit board; Bandwidth (computing); Conductor; Microstrip; Coplanar waveguide; Waveguide; Electronic engineering; Electrical engineering; Telecommunications; Computer science; Engineering","score_opus":0.01390311091308472,"score_gpt":0.19923816412115977,"score_spread":0.18533505320807506,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007599487","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8144612,0.0005664219,0.17801633,0.000081819315,0.00010632811,0.000032886463,0.00012708489,0.0008269257,0.0057810284],"genre_scores_gemma":[0.94404924,0.00028298213,0.05194145,0.00004426775,0.000033556877,0.000029951316,0.00020258856,0.00005453258,0.0033614177],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998802,0.000015704292,0.000008010158,0.000025361578,0.000050481507,0.000020154248],"domain_scores_gemma":[0.99976796,0.0000327003,0.00008099501,0.0000399328,0.00006443312,0.000013919153],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012890136,0.00034229248,0.0002980093,0.00022209594,0.00008655502,0.00025094047,0.0004081219,0.00034812768,0.0006553677],"category_scores_gemma":[0.0002085573,0.00016755174,0.0003005132,0.00018833824,0.00014747746,0.0003827306,0.00013597397,0.00023161397,0.0004968039],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000631531,0.000024336385,0.00079803204,0.000056978657,0.00002671723,0.00008600748,0.000031539366,0.0006458986,0.9852865,0.0007636729,0.00024343104,0.011973838],"study_design_scores_gemma":[0.000026274676,0.00046191175,0.0037266964,0.000005136926,0.000050742114,0.00056287245,0.000022990556,0.018904692,0.9705861,0.000114443385,0.005523538,0.000014462439],"about_ca_topic_score_codex":0.00015661903,"about_ca_topic_score_gemma":0.00042703748,"teacher_disagreement_score":0.0006553677,"about_ca_system_score_codex":0.00014670633,"about_ca_system_score_gemma":0.00014057524,"threshold_uncertainty_score":0.002192378},"labels":[],"label_agreement":null},{"id":"W2007712544","doi":"10.1109/tcpmt.2015.2409791","title":"Efficient Microwave Susceptor Design for Localized Heating on Substrate","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Susceptor; Microwave; Substrate (aquarium); Materials science; Optoelectronics; Microfluidics; Microwave heating; Microwave oven; Electronic engineering; Nanotechnology; Computer science; Layer (electronics); Telecommunications","score_opus":0.02795211182758798,"score_gpt":0.22874097419563916,"score_spread":0.20078886236805119,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2007712544","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8707426,0.0017750446,0.1206359,0.00017195626,0.00016244882,0.00010395713,0.000066289234,0.000596866,0.005744917],"genre_scores_gemma":[0.95805186,0.0003458256,0.040023994,0.000031792457,0.000027780115,0.000056450222,0.000040874336,0.000041708106,0.001379724],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99987304,0.000019350395,0.0000065494105,0.000030219026,0.000042797343,0.000028073955],"domain_scores_gemma":[0.9998791,0.000019694793,0.000040665163,0.000017907634,0.000031551408,0.000011037794],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022155407,0.00033099734,0.00026384462,0.00014955178,0.00013029159,0.0002955074,0.0006445524,0.00034255558,0.00075335393],"category_scores_gemma":[0.0002450756,0.00019845461,0.00018760466,0.00010213629,0.0001967026,0.0003690235,0.0002533128,0.00028204537,0.00041194702],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000045394616,0.000012034974,0.0001673965,0.000081477025,0.000005235515,0.000074209594,0.000036315276,0.0006707757,0.99299264,0.0023021959,0.00013595034,0.0034765636],"study_design_scores_gemma":[0.000026190502,0.00043542119,0.0006791165,0.000011418326,0.000019878735,0.00023555993,0.000024538114,0.019593775,0.9723051,0.00016479383,0.006491399,0.000012669612],"about_ca_topic_score_codex":0.00016436905,"about_ca_topic_score_gemma":0.00032930242,"teacher_disagreement_score":0.00075335393,"about_ca_system_score_codex":0.00019538181,"about_ca_system_score_gemma":0.00019273403,"threshold_uncertainty_score":0.0025202036},"labels":[],"label_agreement":null},{"id":"W2031219506","doi":"10.1109/tcpmt.2012.2206810","title":"Numerical and Experimental Study of a Hybrid Thermoelectric Cooler Thermal Management System for Electronic Cooling","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Thermoelectric Materials and Devices","field":"Materials Science","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Thermoelectric cooling; TEC; Heat sink; Passive cooling; Thermal resistance; Electronics; Coefficient of performance; Thermal; Materials science; Electronic component; Thermoelectric effect; Mechanical engineering; Hybrid system; Water cooling; Nuclear engineering; Environmental science; Computer science; Engineering; Thermodynamics; Heat pump; Electrical engineering; Heat exchanger; Physics","score_opus":0.011819927929008538,"score_gpt":0.24505299915248008,"score_spread":0.23323307122347153,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2031219506","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97838926,0.00017558009,0.014752652,0.00011652213,0.000045566278,0.000076347584,0.0001656374,0.0001178072,0.0061605126],"genre_scores_gemma":[0.9939507,0.000049199378,0.0052605914,0.0000064431797,0.000002770844,0.00004435994,0.000031667838,0.0000068555705,0.0006473767],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99983716,0.00002693677,0.0000065895474,0.000034243178,0.000060476672,0.000034681667],"domain_scores_gemma":[0.9995332,0.00024207913,0.000052844414,0.0000479895,0.00009332296,0.000030719133],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003861247,0.0003406454,0.0006074388,0.00024870082,0.000544324,0.0007403465,0.0005398703,0.00076344464,0.0020521737],"category_scores_gemma":[0.0008544925,0.00022157395,0.0002912445,0.00031196827,0.0007590877,0.0004632273,0.00031645954,0.0003851345,0.0001422261],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00036675372,0.0004281689,0.0035866725,0.00038798954,0.000022840995,0.00022044597,0.0001732883,0.8910545,0.09224696,0.00239862,0.0006759166,0.008437931],"study_design_scores_gemma":[0.00004666252,0.00047164393,0.0014720036,0.000009564284,0.000013161041,0.000025045869,0.000060890517,0.9800836,0.01715091,0.00017968152,0.00047064733,0.000016256428],"about_ca_topic_score_codex":0.0023055924,"about_ca_topic_score_gemma":0.0022203687,"teacher_disagreement_score":0.0023055924,"about_ca_system_score_codex":0.00062704436,"about_ca_system_score_gemma":0.0005175462,"threshold_uncertainty_score":0.006865263},"labels":[],"label_agreement":null},{"id":"W2034374573","doi":"10.1109/tcpmt.2013.2245377","title":"Macromodeling of Multilayered Power Distribution Networks Based on Multiconductor Transmission Line Approach","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Spice; Discretization; Transmission line; Helmholtz equation; Electric power transmission; Coupling (piping); Partial differential equation; Finite difference; Computer science; Finite difference method; Electronic engineering; Power (physics); Topology (electrical circuits); Line (geometry); Helmholtz free energy; Mathematics; Mathematical analysis; Physics; Engineering; Electrical engineering; Geometry; Telecommunications; Boundary value problem","score_opus":0.009949276659019657,"score_gpt":0.2017492511577862,"score_spread":0.19179997449876654,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2034374573","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.021377182,0.00011437149,0.9749111,0.000057026584,0.000016196409,0.000030855208,0.00009618736,0.0005572424,0.0028397932],"genre_scores_gemma":[0.7329495,0.0005179391,0.25806943,0.000054664353,0.000020854679,0.00020597831,0.00028271085,0.00017344716,0.007725422],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998704,0.00003241358,0.000007963382,0.000026661106,0.00004940044,0.000013111016],"domain_scores_gemma":[0.9998301,0.00006009673,0.000032881053,0.000029607276,0.00003868741,0.0000085137235],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022288658,0.0004942717,0.00039602173,0.00038080552,0.0002759534,0.00058481016,0.0006493225,0.00052078156,0.0019344491],"category_scores_gemma":[0.00057453645,0.00030430098,0.00046489076,0.00036792684,0.00027272088,0.0010911573,0.0002947668,0.00045162288,0.0003362789],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00000872276,0.000008221954,0.00020065045,0.000022509974,0.000010328704,0.000046418594,0.000035360954,0.9813819,0.0043498804,0.0055431095,0.00016812605,0.008224795],"study_design_scores_gemma":[0.0000018512281,0.000007662115,0.000039896764,0.0000025801512,0.0000029680202,0.000012494937,0.000005413444,0.9971431,0.0008817813,0.0010736708,0.0008262802,0.0000022774532],"about_ca_topic_score_codex":0.004877468,"about_ca_topic_score_gemma":0.0049211257,"teacher_disagreement_score":0.004877468,"about_ca_system_score_codex":0.0007226914,"about_ca_system_score_gemma":0.0006958327,"threshold_uncertainty_score":0.009698153},"labels":[],"label_agreement":null},{"id":"W2034496484","doi":"10.1109/tcpmt.2012.2209118","title":"Delay-Extraction-Based Waveform Relaxation Algorithm for Fast Transient Analysis of Power Distribution Networks","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Lightning and Electromagnetic Phenomena","field":"Physics and Astronomy","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Waveform; Algorithm; Parallelizable manifold; Computer science; Relaxation (psychology); Transient (computer programming); Scalability; Convergence (economics); Time domain; Iterative method; Electric power transmission; Transmission line; Engineering; Telecommunications","score_opus":0.007397515889341554,"score_gpt":0.22694293159550008,"score_spread":0.21954541570615851,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2034496484","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0013901762,0.00004524768,0.9980228,0.00002315698,0.000006600607,0.000011308511,0.000009651452,0.00009994627,0.00039120176],"genre_scores_gemma":[0.10689194,0.00031927763,0.8897175,0.00004345997,0.000031754844,0.00019382905,0.0001800325,0.00021821674,0.0024040372],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998161,0.00006662077,0.000009887743,0.000025108979,0.00006403827,0.000018255763],"domain_scores_gemma":[0.99939394,0.00038588268,0.00005185083,0.000050335217,0.000100013545,0.000018063809],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006802976,0.0006853447,0.00055493694,0.00038794958,0.0003537066,0.0005055698,0.000884426,0.00061041315,0.0025562963],"category_scores_gemma":[0.0019905497,0.00042184646,0.00049607945,0.00064486667,0.000350821,0.001023981,0.0006005484,0.0013539572,0.00074181403],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010264083,0.00003821854,0.0002486431,0.000118171214,0.00003118842,0.000059705024,0.000112519025,0.8415289,0.012954338,0.025634937,0.0015079249,0.11766282],"study_design_scores_gemma":[0.000008529503,0.000010593394,0.000019256613,0.000003874738,0.0000024458254,0.000011422141,0.000004679401,0.9958264,0.001002008,0.0020360288,0.0010716897,0.0000031444133],"about_ca_topic_score_codex":0.0019029776,"about_ca_topic_score_gemma":0.0015952757,"teacher_disagreement_score":0.0025562963,"about_ca_system_score_codex":0.0005137826,"about_ca_system_score_gemma":0.00086269004,"threshold_uncertainty_score":0.008551657},"labels":[],"label_agreement":null},{"id":"W2047070565","doi":"10.1109/tcpmt.2014.2331211","title":"Compact MEMS-Based Ultrawide-Band CPW Band-Pass Filters With Single/Double Tunable Notch-Bands","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Band-stop filter; Capacitor; Microelectromechanical systems; Band-pass filter; Passband; Filter (signal processing); Physics; Topology (electrical circuits); Electronic engineering; Optoelectronics; Low-pass filter; Computer science; Materials science; Electrical engineering; Engineering; Voltage","score_opus":0.011272005504279299,"score_gpt":0.19269361521589548,"score_spread":0.1814216097116162,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2047070565","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5658605,0.01077816,0.40826517,0.00044073604,0.00044902647,0.0001438414,0.00035136848,0.0010520491,0.012659058],"genre_scores_gemma":[0.7905357,0.0027930234,0.19720548,0.00026410635,0.00017782657,0.00018019386,0.0002622348,0.000075728305,0.008505792],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998204,0.000013207114,0.000011383637,0.000045962242,0.00008594127,0.0000230408],"domain_scores_gemma":[0.99985516,0.000029488874,0.00005327654,0.000017067046,0.000034964112,0.000010020786],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015050598,0.000399443,0.00038423785,0.0003187055,0.00019053137,0.00043303068,0.00069823704,0.000666702,0.0007620161],"category_scores_gemma":[0.00020167933,0.00025159473,0.00033744515,0.00031086884,0.00021950631,0.00086546707,0.00028788287,0.00037729624,0.00054838747],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009086282,0.000026119948,0.00016820799,0.00012319688,0.000025631432,0.00010253032,0.000033958495,0.00087310205,0.979779,0.0015950397,0.00027609576,0.016906345],"study_design_scores_gemma":[0.00003827613,0.00029653433,0.0013820871,0.000015454692,0.00006420005,0.000553098,0.000024269815,0.019471176,0.96180695,0.0003720204,0.01594404,0.000031914242],"about_ca_topic_score_codex":0.00027275988,"about_ca_topic_score_gemma":0.00073989935,"teacher_disagreement_score":0.0007620161,"about_ca_system_score_codex":0.00039719415,"about_ca_system_score_gemma":0.00021741007,"threshold_uncertainty_score":0.002881825},"labels":[],"label_agreement":null},{"id":"W2074130819","doi":"10.1109/tcpmt.2013.2262637","title":"Miniaturized, Lumped-Element Filters for Customized System-on-Package L-Band Receivers","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Center frequency; Miniaturization; Band-pass filter; Distributed element filter; Insertion loss; Bandwidth (computing); Inductor; Electronic engineering; Resonator; Capacitor; System in package; Passband; Electrical engineering; Prototype filter; Engineering; Low-pass filter; Telecommunications; Chip","score_opus":0.009175600826798556,"score_gpt":0.19800621568062948,"score_spread":0.18883061485383093,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2074130819","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.06923717,0.0006290687,0.9207137,0.00021101808,0.000113377646,0.00009433462,0.000124005,0.0025708126,0.006306524],"genre_scores_gemma":[0.40602633,0.00035071897,0.58516145,0.00019524063,0.00009556237,0.000138701,0.00015235155,0.00037968374,0.007500011],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99976915,0.00006257659,0.000010048201,0.000040019848,0.00008757367,0.000030624644],"domain_scores_gemma":[0.999684,0.00009381743,0.00007765731,0.00006403317,0.00006564263,0.00001481169],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00038542814,0.00072221906,0.00038397568,0.0003147745,0.00016373504,0.00053006725,0.000796111,0.00056323066,0.0020404903],"category_scores_gemma":[0.00070449663,0.00034592513,0.00041491215,0.00020383783,0.0002365714,0.0007751893,0.0002462089,0.00053190044,0.0016966889],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001755285,0.00007746945,0.00061300775,0.0001930729,0.00006159727,0.0001952307,0.00012581468,0.011273116,0.9199841,0.007585978,0.0020978532,0.05761721],"study_design_scores_gemma":[0.00006794802,0.00077400455,0.0018450252,0.000043666554,0.00011152708,0.00056046434,0.000056419867,0.11842811,0.82954717,0.0019014913,0.046602707,0.00006152219],"about_ca_topic_score_codex":0.00028979426,"about_ca_topic_score_gemma":0.0008272109,"teacher_disagreement_score":0.0020404903,"about_ca_system_score_codex":0.0005120436,"about_ca_system_score_gemma":0.0002566,"threshold_uncertainty_score":0.006826043},"labels":[],"label_agreement":null},{"id":"W2074976246","doi":"10.1109/tcpmt.2013.2262109","title":"Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Materials science; Bond; Piezoresistive effect; Intermetallic; Composite material; Stress (linguistics); Wire bonding; Bond strength; Chip; Electrical engineering; Adhesive; Alloy","score_opus":0.020550741356212956,"score_gpt":0.2237971267878483,"score_spread":0.20324638543163534,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2074976246","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96078223,0.0010509971,0.032754965,0.000093333256,0.00009390699,0.0000614353,0.0017102052,0.0010393272,0.0024135534],"genre_scores_gemma":[0.99109745,0.00028940456,0.0066919774,0.00003741416,0.000021652953,0.00004196166,0.0005004215,0.00005112344,0.0012687013],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996772,0.00003589079,0.000023192955,0.000067042536,0.00016774872,0.000028847808],"domain_scores_gemma":[0.9991603,0.00022139469,0.00014984114,0.00018706152,0.0002584067,0.000023082684],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002470307,0.0006294843,0.0002339805,0.0007554226,0.000140409,0.00023650895,0.0005086416,0.00058276503,0.0026316766],"category_scores_gemma":[0.0009182317,0.00018577705,0.00020851038,0.00057039317,0.00022681315,0.00039203634,0.00022333821,0.00040319338,0.00060641486],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00024054748,0.00006706655,0.0094144065,0.00021465798,0.000036316822,0.00040164974,0.00018062176,0.0024117401,0.95664495,0.00017226438,0.00041164836,0.02980422],"study_design_scores_gemma":[0.0000120931145,0.0005880503,0.07095742,0.000014568979,0.00004198602,0.0010737176,0.00011322006,0.018324623,0.9063198,0.00025254153,0.002267922,0.000034009554],"about_ca_topic_score_codex":0.00069684634,"about_ca_topic_score_gemma":0.0009887938,"teacher_disagreement_score":0.0026316766,"about_ca_system_score_codex":0.00023872031,"about_ca_system_score_gemma":0.000090929774,"threshold_uncertainty_score":0.008803785},"labels":[],"label_agreement":null},{"id":"W2077090243","doi":"10.1109/tcpmt.2015.2484284","title":"Nonlinear Electronic/Photonic Component Modeling Using Adjoint State-Space Dynamic Neural Network Technique","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Photonic and Optical Devices","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Nonlinear system; Artificial neural network; Computer science; Transient (computer programming); Photonics; Component (thermodynamics); Computation; State space; Electronic component; Electronic engineering; Electronic circuit simulation; Algorithm; Electronic circuit; Artificial intelligence; Mathematics; Engineering; Physics","score_opus":0.016989385572532854,"score_gpt":0.23367614125744338,"score_spread":0.21668675568491053,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2077090243","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.009193568,0.000101093574,0.9874206,0.00005616899,0.000016157765,0.000014867524,0.000026147425,0.0002133351,0.002958079],"genre_scores_gemma":[0.73576486,0.00049662153,0.25309482,0.00009141349,0.000027658805,0.00017967632,0.00017304701,0.000090111665,0.010081846],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9999058,0.000021946922,0.000004443175,0.000016414737,0.00004258163,0.000008878553],"domain_scores_gemma":[0.99990845,0.00003859614,0.000011241815,0.0000109443035,0.000026759659,0.0000041277635],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023817604,0.00032425064,0.00023754286,0.00026761496,0.00022815421,0.00037370675,0.0005428856,0.00050252397,0.001393799],"category_scores_gemma":[0.00041278786,0.0002265119,0.0003715926,0.00022789442,0.00030060316,0.000783848,0.00029367534,0.0006104061,0.00026003714],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020894926,0.000020695461,0.00031475103,0.000031256965,0.000014109337,0.00004124503,0.00003188561,0.9529906,0.008114606,0.013049938,0.0002712682,0.025098864],"study_design_scores_gemma":[4.963054e-7,0.0000023256675,0.000022894028,8.623496e-7,8.655547e-7,0.000004870786,0.0000010584566,0.99860376,0.00050753093,0.00063233275,0.00022192523,0.0000011398049],"about_ca_topic_score_codex":0.003533147,"about_ca_topic_score_gemma":0.0038914443,"teacher_disagreement_score":0.003533147,"about_ca_system_score_codex":0.0004407449,"about_ca_system_score_gemma":0.00052771904,"threshold_uncertainty_score":0.0070251822},"labels":[],"label_agreement":null},{"id":"W2080004655","doi":"10.1109/tcpmt.2012.2196516","title":"Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":38,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Return loss; Planar; Integrated circuit; Bandwidth (computing); Insertion loss; Interconnection; Waveguide; Electronic circuit; Computer science; Wideband; Substrate (aquarium); Topology (electrical circuits); Materials science; Electrical engineering; Telecommunications; Optoelectronics; Engineering; Antenna (radio)","score_opus":0.017432254834396987,"score_gpt":0.22337600593706103,"score_spread":0.20594375110266405,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2080004655","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.18914704,0.010468238,0.7459456,0.0005637803,0.00064554194,0.00013999555,0.00049451017,0.004187495,0.04840778],"genre_scores_gemma":[0.6213185,0.005745653,0.35354045,0.0002372781,0.00015405299,0.00017699697,0.0007059491,0.00021099385,0.01791015],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998524,0.00001987392,0.000007669888,0.000022611912,0.00007889075,0.000018539007],"domain_scores_gemma":[0.9999019,0.00002303881,0.000021255823,0.000019370635,0.000027369964,0.0000070855885],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016663055,0.0003965935,0.00017135721,0.00023511743,0.0001735228,0.0005529523,0.00040832892,0.00038904083,0.0020672234],"category_scores_gemma":[0.00022455528,0.00020176706,0.00028849256,0.00041631388,0.0001555629,0.00043144455,0.00032379807,0.00036243454,0.0010695935],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011476213,0.000049570666,0.001075374,0.00045844214,0.000056794524,0.0005357171,0.0002103183,0.008539124,0.77684844,0.05254454,0.005364628,0.15420236],"study_design_scores_gemma":[0.000059496495,0.0010476123,0.0027812861,0.000101294325,0.00007536318,0.0016905541,0.00017072915,0.10757133,0.62821716,0.009931476,0.24828027,0.00007350508],"about_ca_topic_score_codex":0.00037058262,"about_ca_topic_score_gemma":0.0011242641,"teacher_disagreement_score":0.0020672234,"about_ca_system_score_codex":0.00036121192,"about_ca_system_score_gemma":0.00022704576,"threshold_uncertainty_score":0.006915629},"labels":[],"label_agreement":null},{"id":"W2097399447","doi":"10.1109/tcpmt.2011.2106127","title":"Ionomer Composite Thin Film Capacitors","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Dielectric materials and actuators","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Materials science; Supercapacitor; Ionomer; Capacitance; Capacitor; Composite material; Thin film; Composite number; Electrode; Polymer; Ionic bonding; Substrate (aquarium); Electrical conductor; Planar; Voltage; Optoelectronics; Nanotechnology; Computer science; Electrical engineering; Ion","score_opus":0.013859652742378173,"score_gpt":0.18652924513445257,"score_spread":0.1726695923920744,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2097399447","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8550953,0.016103603,0.065646775,0.001041347,0.0008878386,0.00022528927,0.0014752115,0.0062780404,0.053246662],"genre_scores_gemma":[0.9156393,0.0053821104,0.050330594,0.0004174828,0.00013429072,0.000090324625,0.000637759,0.00015819844,0.027209992],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99975044,0.0000103705015,0.000008262661,0.00007901166,0.00011672368,0.00003523122],"domain_scores_gemma":[0.99983,0.00003306258,0.000033075474,0.000016094433,0.00006577148,0.000021920281],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000120091005,0.0007035258,0.0002852717,0.00034418906,0.00035178388,0.00053631165,0.0006800992,0.0006103334,0.0052772975],"category_scores_gemma":[0.00022646805,0.00019508916,0.00022819883,0.0002832564,0.0001729915,0.000587185,0.00030292978,0.00044633876,0.0016064759],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004576238,0.000019736022,0.00006463428,0.000102416445,0.000013297763,0.000104817685,0.000014920979,0.00016810164,0.9915285,0.00020362854,0.00043833558,0.0072957696],"study_design_scores_gemma":[0.000008606895,0.000087740445,0.00048654934,0.0000053354647,0.000026563592,0.00026348137,0.000015732629,0.00089170947,0.99144405,0.000037609654,0.006724577,0.000008085268],"about_ca_topic_score_codex":0.00045038087,"about_ca_topic_score_gemma":0.0009989319,"teacher_disagreement_score":0.0052772975,"about_ca_system_score_codex":0.00023804892,"about_ca_system_score_gemma":0.00015196679,"threshold_uncertainty_score":0.01765436},"labels":[],"label_agreement":null},{"id":"W2103568915","doi":"10.1109/tcpmt.2010.2100712","title":"Transient Frequency-Domain Thermal Measurements With Applications to Electronic Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Transient (computer programming); Materials science; Frequency domain; Electronic packaging; Thermal; Computer science; Physics; Thermodynamics; Composite material","score_opus":0.01667965212243944,"score_gpt":0.22026632175862698,"score_spread":0.20358666963618754,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2103568915","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.14201398,0.0012501768,0.8458843,0.00018051433,0.000102932165,0.000084968815,0.00025035822,0.0016920151,0.008540749],"genre_scores_gemma":[0.89582306,0.0010515901,0.10032268,0.000079914855,0.000048199352,0.00008851785,0.00018759686,0.00008288263,0.0023154994],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998374,0.000031542357,0.0000065854024,0.000031029744,0.00008185523,0.0000115660005],"domain_scores_gemma":[0.999617,0.00017941474,0.000051201612,0.00006930749,0.000074690055,0.000008328332],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002106608,0.00027755054,0.00019428074,0.0003737787,0.00016027785,0.00025390065,0.00031557467,0.0003746315,0.0017291493],"category_scores_gemma":[0.0008014602,0.0001456959,0.00013319793,0.00056407653,0.0002503094,0.0005509901,0.00020680072,0.0002725358,0.0003537209],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017560231,0.00009937715,0.0022805436,0.00033992346,0.00002802083,0.00019980801,0.00025269593,0.011949455,0.81995744,0.006037873,0.001345941,0.15733323],"study_design_scores_gemma":[0.00003081335,0.000716353,0.010684791,0.000058015656,0.00005609471,0.0015490277,0.00022738278,0.15591748,0.80690396,0.004401879,0.019392652,0.00006170948],"about_ca_topic_score_codex":0.00019042258,"about_ca_topic_score_gemma":0.00020924667,"teacher_disagreement_score":0.0017291493,"about_ca_system_score_codex":0.00018146411,"about_ca_system_score_gemma":0.000091701804,"threshold_uncertainty_score":0.005784631},"labels":[],"label_agreement":null},{"id":"W2132909871","doi":"10.1109/tcpmt.2013.2292584","title":"Application of the Kirchhoff Transform to Thermal Spreading Problems With Convection Boundary Conditions","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Thermal properties of materials","field":"Materials Science","cited_by":69,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Heat sink; Thermal resistance; Thermal conductivity; Thermal conduction; Junction temperature; Materials science; Microelectronics; Boundary value problem; Heat transfer; Mechanics; Thermal transmittance; Electronics; Thermal; Heat transfer coefficient; Electronic engineering; Mechanical engineering; Thermodynamics; Engineering; Mathematical analysis; Mathematics; Optoelectronics; Physics; Electrical engineering","score_opus":0.00911060732653541,"score_gpt":0.20922964624046614,"score_spread":0.20011903891393074,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2132909871","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.012696043,0.00043250644,0.9800685,0.0002480087,0.000084002546,0.000044294695,0.000020602876,0.00011000976,0.006296095],"genre_scores_gemma":[0.52984405,0.0014820977,0.45806175,0.00020411327,0.00016267509,0.00019908306,0.00007443832,0.0002016839,0.0097700795],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9996797,0.00012780244,0.000017879222,0.00002723693,0.000120304205,0.000027034921],"domain_scores_gemma":[0.99925655,0.0004778248,0.000047143316,0.00006836911,0.0001271985,0.00002285431],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00078696,0.0006257682,0.0005261048,0.0004851697,0.00048031713,0.0007585742,0.00067221,0.0010485158,0.0013556308],"category_scores_gemma":[0.0032399646,0.00027898955,0.0004634002,0.0004555286,0.0012222024,0.0015854383,0.00088557746,0.0011952935,0.00039155304],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003853731,0.000050830648,0.00040827863,0.0001523596,0.00001906993,0.00027621692,0.0002463723,0.66681707,0.0183052,0.2621172,0.0011417667,0.050427105],"study_design_scores_gemma":[0.0000036264187,0.0000058819437,0.000028496452,0.000004494124,0.0000011692628,0.000030030125,0.000011815072,0.98161894,0.0011547614,0.016421156,0.0007150646,0.000004649678],"about_ca_topic_score_codex":0.0030187545,"about_ca_topic_score_gemma":0.0017528613,"teacher_disagreement_score":0.0030187545,"about_ca_system_score_codex":0.00055814657,"about_ca_system_score_gemma":0.0011174877,"threshold_uncertainty_score":0.0060023665},"labels":[],"label_agreement":null},{"id":"W2145991395","doi":"10.1109/tcpmt.2010.2099750","title":"Passivity Verification of Delayed Rational Function Based Macromodels of Tabulated Networks Characterized by Scattering Parameters","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Lightning and Electromagnetic Phenomena","field":"Physics and Astronomy","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Passivity; Mathematical proof; Eigenvalues and eigenvectors; Rational function; Applied mathematics; Function (biology); Scattering; Hamiltonian (control theory); Mathematics; Scattering parameters; Control theory (sociology); Mathematical analysis; Computer science; Mathematical optimization; Physics; Engineering; Geometry; Quantum mechanics; Optics","score_opus":0.01343277522000359,"score_gpt":0.1961039024803066,"score_spread":0.18267112726030302,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2145991395","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.031716563,0.000046631703,0.9651449,0.00003948733,0.000016821807,0.000027242322,0.00002817407,0.00016389412,0.002816306],"genre_scores_gemma":[0.8595589,0.00015852098,0.13710432,0.000058818736,0.000016146763,0.0001163573,0.00010413305,0.00013035949,0.0027523485],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99964786,0.0001167057,0.00001633247,0.000047892405,0.00013643406,0.000034808094],"domain_scores_gemma":[0.998814,0.0007176743,0.00012282352,0.0001690259,0.00015743336,0.000019088637],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00095027394,0.000612851,0.00044710038,0.00042085332,0.00029252877,0.0007882178,0.00071152253,0.00073595985,0.002083393],"category_scores_gemma":[0.0031271207,0.0003067457,0.0004972604,0.00012740334,0.00070740934,0.0012931273,0.00042192085,0.00064324494,0.0002581624],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008885926,0.00003637305,0.0007541948,0.000116361356,0.000028135746,0.0002481114,0.00021905088,0.8065753,0.035634983,0.13303924,0.00047181954,0.022787515],"study_design_scores_gemma":[0.000004216706,0.000021717848,0.000049174305,0.000007755547,0.0000037740028,0.000033284963,0.000017236356,0.9835271,0.0044286833,0.011348289,0.00055361894,0.000005116867],"about_ca_topic_score_codex":0.0010186009,"about_ca_topic_score_gemma":0.00093986915,"teacher_disagreement_score":0.002083393,"about_ca_system_score_codex":0.00059075066,"about_ca_system_score_gemma":0.000650557,"threshold_uncertainty_score":0.0069696307},"labels":[],"label_agreement":null},{"id":"W2151674152","doi":"10.1109/tcpmt.2012.2232711","title":"High-Performance, Compact Quasi-Elliptic Band Pass Filters for V-Band High Data Rate Radios","year":2013,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Communications Research Centre Canada","funders":"","keywords":"Insertion loss; Return loss; Center frequency; Band-pass filter; Distributed element filter; Prototype filter; Microstrip; Bandwidth (computing); m-derived filter; Microwave; Filter (signal processing); Planar; Materials science; Resonator; Waveguide filter; Optoelectronics; Electronic engineering; Low-pass filter; Electrical engineering; Computer science; Telecommunications; Engineering","score_opus":0.016512272893631694,"score_gpt":0.20773057265324782,"score_spread":0.19121829975961613,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2151674152","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4088162,0.0029365153,0.57083166,0.00020156741,0.00019969148,0.0001115817,0.00016338985,0.0016436907,0.015095701],"genre_scores_gemma":[0.8109383,0.0010333093,0.17964262,0.00010915872,0.00012502547,0.00007356545,0.00022020805,0.00012122023,0.007736628],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997545,0.000041450185,0.000012133555,0.000035786343,0.000119145356,0.000036930174],"domain_scores_gemma":[0.99958843,0.0001243123,0.00009699601,0.00004392448,0.00012754933,0.000018895196],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00029409424,0.00030392694,0.00018350195,0.0002954305,0.00018412205,0.0006282347,0.00043377661,0.0004673726,0.0016093734],"category_scores_gemma":[0.00053470663,0.00016977686,0.000268669,0.0002104169,0.00015815608,0.00051353633,0.00013408487,0.00026920746,0.0009271469],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004422132,0.000044324952,0.0012538321,0.00017546566,0.000052965755,0.000115183975,0.0000848817,0.0021941962,0.91343033,0.0018868044,0.00066261424,0.07965733],"study_design_scores_gemma":[0.00007212984,0.0018094787,0.008647544,0.000031359228,0.000113516646,0.00081363355,0.0001040745,0.021436859,0.9283534,0.00051467185,0.03806436,0.000038804774],"about_ca_topic_score_codex":0.00032304204,"about_ca_topic_score_gemma":0.0007152195,"teacher_disagreement_score":0.0016093734,"about_ca_system_score_codex":0.00032441886,"about_ca_system_score_gemma":0.00015371079,"threshold_uncertainty_score":0.0053839087},"labels":[],"label_agreement":null},{"id":"W2153606476","doi":"10.1109/tcpmt.2011.2170982","title":"Sensitivity Analysis of Microwave Circuits Using Parameterized Model Order Reduction Techniques","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Parameterized complexity; Sensitivity (control systems); Discretization; Parametric statistics; Reduction (mathematics); Model order reduction; Microwave; Finite element method; Algorithm; Applied mathematics; Mathematics; Computer science; Variable (mathematics); Mathematical optimization; Electronic engineering; Mathematical analysis; Physics; Engineering; Geometry; Telecommunications; Statistics","score_opus":0.029751072251944337,"score_gpt":0.23201840392296866,"score_spread":0.20226733167102431,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2153606476","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.022839038,0.00009208908,0.9734342,0.000045267247,0.00001180887,0.000033954922,0.000047748446,0.0005206694,0.002975318],"genre_scores_gemma":[0.8149868,0.00042678084,0.17976399,0.00006260614,0.000025562138,0.0001477664,0.00020691051,0.00025869044,0.004120892],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9995722,0.00012069127,0.000011240285,0.000038796607,0.00023192853,0.000025248277],"domain_scores_gemma":[0.999503,0.00030970728,0.000040956736,0.000087060114,0.00005357121,0.000005622989],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00043033305,0.00069056643,0.0003782661,0.0005261412,0.0002001888,0.00053811795,0.00050167495,0.0004224966,0.0015380387],"category_scores_gemma":[0.0017925833,0.00040102587,0.00072264666,0.00025748348,0.0002810838,0.00073367945,0.0004126193,0.0006562709,0.00030518652],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026850892,0.000028185581,0.0002683767,0.000059280912,0.000040728766,0.000058629063,0.000049559738,0.92444134,0.03727859,0.012095428,0.0002611026,0.025391921],"study_design_scores_gemma":[0.0000020880098,0.000014827735,0.00010195867,0.0000025818617,0.000006782167,0.000018758676,0.0000031437662,0.9907342,0.006286262,0.002234427,0.0005900471,0.0000050066874],"about_ca_topic_score_codex":0.0012785925,"about_ca_topic_score_gemma":0.0012744203,"teacher_disagreement_score":0.0015380387,"about_ca_system_score_codex":0.0005891175,"about_ca_system_score_gemma":0.0003435385,"threshold_uncertainty_score":0.0051452518},"labels":[],"label_agreement":null},{"id":"W2161130272","doi":"10.1109/tcpmt.2011.2177269","title":"Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"University of Waterloo; Nanyang Technological University","keywords":"Materials science; Plating (geology); Microstructure; Shear strength (soil); Metallurgy; Electroless plating; Copper; Contact resistance; Pillar; Copper plating; Composite material; Daisy chain; Flip chip; Layer (electronics); Electroplating; Adhesive; Structural engineering","score_opus":0.014698336928790953,"score_gpt":0.22613634049714756,"score_spread":0.21143800356835663,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2161130272","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9445356,0.00084248895,0.052256,0.00007609682,0.00006961552,0.000040599407,0.0000850306,0.0005487238,0.0015458784],"genre_scores_gemma":[0.96929705,0.00023063374,0.029047504,0.000035454166,0.000009574494,0.000023962737,0.000044677403,0.00004789251,0.0012632197],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999757,0.000027173006,0.0000146615475,0.00005919794,0.00011175452,0.000030187002],"domain_scores_gemma":[0.9997112,0.000054897522,0.00009666208,0.000060788796,0.00006294116,0.000013486924],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022625006,0.00040206662,0.00022286574,0.0001903888,0.00012810172,0.0002737595,0.0006203886,0.00029268113,0.00029808347],"category_scores_gemma":[0.0004763034,0.00031541585,0.00015092129,0.00020302393,0.00017315273,0.0003147895,0.00022604049,0.0002565787,0.00012850019],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032756536,0.000010047918,0.00040817985,0.000031410127,0.0000042912598,0.00006627119,0.000022390142,0.0005611737,0.9930315,0.00006109848,0.00006998051,0.005700947],"study_design_scores_gemma":[0.000008319859,0.00014693144,0.0038791748,0.0000034694538,0.000014327592,0.00020591074,0.000015363494,0.0062919725,0.98832977,0.000031282194,0.0010638873,0.000009556912],"about_ca_topic_score_codex":0.0006752396,"about_ca_topic_score_gemma":0.0015242847,"teacher_disagreement_score":0.0006752396,"about_ca_system_score_codex":0.00029598447,"about_ca_system_score_gemma":0.00015937215,"threshold_uncertainty_score":0.0021474957},"labels":[],"label_agreement":null},{"id":"W2167147386","doi":"10.1109/tcpmt.2011.2112655","title":"Analytical Modeling of Cyclic Thermal Stress and Strain in Plated-Through-Vias With Defects","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto; Hatch (Canada)","funders":"","keywords":"Waviness; von Mises yield criterion; Finite element method; Stress (linguistics); Materials science; Structural engineering; Composite material; Physics; Engineering; Philosophy","score_opus":0.023617027442483323,"score_gpt":0.21379624404171202,"score_spread":0.1901792165992287,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2167147386","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.34425557,0.00078272005,0.62477404,0.00031238844,0.00012939727,0.00018035933,0.0006715447,0.0013382456,0.027555788],"genre_scores_gemma":[0.9632439,0.00055305654,0.025291784,0.00003770203,0.00002394586,0.00015475295,0.00013588073,0.00011811275,0.01044084],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99974793,0.000025796104,0.000010254271,0.000056147335,0.00011758783,0.000042287716],"domain_scores_gemma":[0.9997974,0.00004207993,0.00003807094,0.000032361113,0.00007606288,0.000014116642],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00030491082,0.0005968792,0.00040174558,0.0008082411,0.00030086897,0.0007136702,0.0014604372,0.0010858114,0.0014326934],"category_scores_gemma":[0.00092419615,0.00045090704,0.00068456726,0.00048583775,0.0008012067,0.0007157336,0.00031201556,0.00030665414,0.00044099012],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000015603937,0.00001936122,0.00053493306,0.000028171375,0.000010103312,0.00017305397,0.000081332386,0.971573,0.016777238,0.007955758,0.00018622122,0.0026452055],"study_design_scores_gemma":[0.0000011741183,0.0000074169066,0.00014239142,0.0000027854887,0.000002749854,0.000020151976,0.000005721593,0.99823254,0.00086118275,0.00047492425,0.00024513894,0.0000037030547],"about_ca_topic_score_codex":0.008607381,"about_ca_topic_score_gemma":0.006427475,"teacher_disagreement_score":0.008607381,"about_ca_system_score_codex":0.0014783259,"about_ca_system_score_gemma":0.0011635476,"threshold_uncertainty_score":0.01711458},"labels":[],"label_agreement":null},{"id":"W2168258332","doi":"10.1109/tcpmt.2011.2117423","title":"Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines","year":2011,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Discretization; Transmission line; Partial element equivalent circuit; Electronic engineering; Electric power transmission; Computer science; Line (geometry); Power (physics); Emphasis (telecommunications); Transmission (telecommunications); Equivalent circuit; Topology (electrical circuits); Engineering; Electrical engineering; Voltage; Mathematics; Telecommunications; Geometry","score_opus":0.023403663512343995,"score_gpt":0.22794158238762763,"score_spread":0.20453791887528364,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2168258332","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.020549778,0.00006388116,0.9757637,0.000026676526,0.00001042681,0.000024507015,0.000052656713,0.0003098927,0.0031985498],"genre_scores_gemma":[0.6379069,0.0004317763,0.3561571,0.000032796004,0.000013895936,0.000116734576,0.00022837239,0.00017558798,0.004936868],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99987686,0.00003219275,0.0000055244427,0.000017089827,0.00005880573,0.000009647598],"domain_scores_gemma":[0.99986315,0.000059925816,0.000025277504,0.000026994072,0.000020015976,0.0000046616206],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017471,0.00051764114,0.0002702459,0.00021554212,0.00021744944,0.0005960308,0.0006701774,0.0003903096,0.0013835351],"category_scores_gemma":[0.0004453676,0.00031022044,0.00044227348,0.00030605655,0.00032142305,0.0009974835,0.00026222007,0.00047259033,0.00037166578],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000131845845,0.000012664917,0.00025695248,0.000026912152,0.0000100656825,0.00005336733,0.000035259694,0.9754317,0.007907988,0.0060512405,0.00017224919,0.010028429],"study_design_scores_gemma":[0.0000041193434,0.00001106456,0.00004678388,0.0000028131617,0.0000037310836,0.000021510048,0.0000070588044,0.9951309,0.002656001,0.001010506,0.0011032744,0.0000022797217],"about_ca_topic_score_codex":0.0020331542,"about_ca_topic_score_gemma":0.0027355277,"teacher_disagreement_score":0.0020331542,"about_ca_system_score_codex":0.000446938,"about_ca_system_score_gemma":0.00046918934,"threshold_uncertainty_score":0.00462842},"labels":[],"label_agreement":null},{"id":"W2208159239","doi":"10.1109/tcpmt.2015.2490240","title":"Fast Variability Analysis of General Nonlinear Circuits Using Decoupled Polynomial Chaos","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Probabilistic and Robust Engineering Design","field":"Decision Sciences","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Ottawa; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Jacobian matrix and determinant; Polynomial chaos; Nonlinear system; Diagonal; Hermite polynomials; Applied mathematics; Electronic circuit; Polynomial; Mathematics; CHAOS (operating system); Control theory (sociology); Algorithm; Computer science; Mathematical analysis; Monte Carlo method; Engineering; Geometry; Statistics","score_opus":0.08322118390759257,"score_gpt":0.315203127111291,"score_spread":0.23198194320369842,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2208159239","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.014473495,0.00005365422,0.984677,0.000028844861,0.000005890305,0.000008856852,0.000015807005,0.000053399242,0.0006830079],"genre_scores_gemma":[0.85058796,0.0003117894,0.14625762,0.00003512123,0.000053372278,0.00007054621,0.000101214995,0.000071964634,0.0025104154],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99975973,0.000058605816,0.000008304806,0.000039710536,0.00011368696,0.000019921301],"domain_scores_gemma":[0.99943656,0.00037744982,0.00005828571,0.000057432662,0.000054154192,0.000016093467],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00045875763,0.0004579552,0.00044029244,0.0003830896,0.00020634652,0.00048008785,0.00055890915,0.0003361954,0.0006566325],"category_scores_gemma":[0.0016933744,0.00022989171,0.0005651628,0.00027154657,0.00054856914,0.0007774138,0.00060575746,0.0007700315,0.00012005825],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000080125326,0.000019641999,0.00054319925,0.00006582531,0.00004360986,0.000094989606,0.000071713825,0.87439644,0.020675909,0.07114794,0.00023448265,0.032626193],"study_design_scores_gemma":[0.0000018307514,0.000010646876,0.00007009524,0.0000010930291,0.000002038401,0.000011514873,0.0000015830105,0.99405634,0.00093205785,0.0047439984,0.0001657627,0.0000029402897],"about_ca_topic_score_codex":0.0009872401,"about_ca_topic_score_gemma":0.0007954502,"teacher_disagreement_score":0.0009872401,"about_ca_system_score_codex":0.00036098302,"about_ca_system_score_gemma":0.00041471046,"threshold_uncertainty_score":0.0026190877},"labels":[],"label_agreement":null},{"id":"W2241854678","doi":"10.1109/tcpmt.2015.2505320","title":"Highly Compact VHF/UHF Dual-Band/Dual-Function LTCC Circuits: Application to Avionic Systems","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Ultra high frequency; Avionics; Capacitor; Inductor; Multi-band device; Electronic circuit; Band-pass filter; Hybrid coupler; Electronic engineering; Integrated circuit; Electrical engineering; Topology (electrical circuits); Dual (grammatical number); Computer science; Engineering; Power dividers and directional couplers; Aerospace engineering","score_opus":0.015263873806830303,"score_gpt":0.21436426712050838,"score_spread":0.19910039331367807,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2241854678","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.15295048,0.0007694051,0.83024955,0.00026262857,0.00011484954,0.00013916902,0.00016339734,0.0023417189,0.013008787],"genre_scores_gemma":[0.83087766,0.0002060686,0.16352616,0.000115764786,0.000082636216,0.00010215251,0.00015104722,0.000065303575,0.0048732916],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998611,0.000020753816,0.000007701252,0.000025710164,0.000067479734,0.00001721571],"domain_scores_gemma":[0.99981207,0.000027249007,0.000055476652,0.000026359488,0.00006576566,0.000013194011],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016449305,0.0004384966,0.00019815813,0.00030722946,0.00021550656,0.0004959775,0.0006994825,0.00046106297,0.0016836942],"category_scores_gemma":[0.0002893848,0.0001248475,0.00019650352,0.00021521971,0.00020274421,0.00044439945,0.000153303,0.00023397316,0.0005503674],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020183515,0.00005405292,0.0007339789,0.00020986734,0.00004238659,0.0004511945,0.00012883346,0.00975758,0.90632194,0.01064585,0.0019186146,0.069533825],"study_design_scores_gemma":[0.00008993439,0.0019147515,0.003449907,0.000051446616,0.00014791418,0.0026857476,0.000062749124,0.22587284,0.71294546,0.0021193398,0.05059145,0.00006850145],"about_ca_topic_score_codex":0.0005047289,"about_ca_topic_score_gemma":0.0009919617,"teacher_disagreement_score":0.0016836942,"about_ca_system_score_codex":0.00042404438,"about_ca_system_score_gemma":0.00021515405,"threshold_uncertainty_score":0.00563246},"labels":[],"label_agreement":null},{"id":"W2313193335","doi":"10.1109/tcpmt.2014.2349523","title":"Wideband Active Inductor and Negative Capacitance for Broadband RF and Microwave Applications","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wideband; Inductor; Capacitance; Parasitic capacitance; Amplifier; Materials science; CMOS; Electrical engineering; Parasitic extraction; Electronic engineering; Electrical impedance; Optoelectronics; Engineering; Physics; Voltage; Electrode","score_opus":0.01222247050780161,"score_gpt":0.20808502226240144,"score_spread":0.19586255175459982,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2313193335","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.24567926,0.005599537,0.7014712,0.0010465239,0.0006802143,0.0001303309,0.00018908911,0.001808646,0.043395218],"genre_scores_gemma":[0.8915661,0.0011879307,0.0993533,0.00024673686,0.00020196177,0.000046671496,0.000092577866,0.000079369995,0.007225432],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998394,0.000014617213,0.000008332888,0.0000395976,0.00007717984,0.000020784999],"domain_scores_gemma":[0.9998338,0.000033831595,0.000038740058,0.000020489766,0.000054454133,0.000018643197],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001515684,0.00038404396,0.00019540268,0.00028734762,0.00019666679,0.00055908447,0.00086743484,0.00041934318,0.0012999214],"category_scores_gemma":[0.00037376338,0.00015085885,0.00017919447,0.00033223096,0.0002998584,0.0010018793,0.00030150844,0.00035760042,0.00048136266],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000057482892,0.00002247255,0.00021170352,0.00017557015,0.000011600068,0.00016728992,0.000063746076,0.0010301733,0.95048445,0.00964148,0.00078642514,0.03734764],"study_design_scores_gemma":[0.000056007782,0.00071812107,0.0010896723,0.000044530483,0.00010947224,0.0027104917,0.000074110496,0.036612075,0.84550625,0.004207494,0.10880786,0.00006394619],"about_ca_topic_score_codex":0.00020077355,"about_ca_topic_score_gemma":0.0005723395,"teacher_disagreement_score":0.0012999214,"about_ca_system_score_codex":0.00041946291,"about_ca_system_score_gemma":0.00023685848,"threshold_uncertainty_score":0.0043486357},"labels":[],"label_agreement":null},{"id":"W2314806106","doi":"10.1109/tcpmt.2015.2512985","title":"Effect of Bond Geometry on Shear Strength and HTS Reliability for Au Ball Bond on Al Pad","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; Innovation, Science and Economic Development Canada","keywords":"Materials science; Bond strength; Bond; Piezoresistive effect; Composite material; Structural engineering; Adhesive; Engineering","score_opus":0.0070798529946751775,"score_gpt":0.21885552709643177,"score_spread":0.2117756741017566,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2314806106","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.996784,0.00072263164,0.0011009962,0.00007415129,0.00004553531,0.000012860311,0.00020463699,0.00014501264,0.0009101789],"genre_scores_gemma":[0.9980869,0.00023088971,0.0009885592,0.000019473155,0.000012899306,0.000008072056,0.000100871606,0.000030801388,0.00052165944],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995976,0.00004294584,0.000032541677,0.00009515221,0.00015225986,0.00007947444],"domain_scores_gemma":[0.9987423,0.00030774248,0.00036596996,0.00013190538,0.0003702636,0.00008188817],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00034083886,0.00049579795,0.0003676286,0.00035265574,0.0002454432,0.00041885077,0.00043451533,0.00044412693,0.0019374883],"category_scores_gemma":[0.0013293049,0.00031774046,0.00021392631,0.00032736544,0.00023507755,0.0004121798,0.00026293407,0.00024882628,0.00054360024],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00044700017,0.00003832114,0.0046196776,0.00014998083,0.000047138055,0.00047176777,0.00016682973,0.004952928,0.9792818,0.0001296903,0.0005112873,0.009183625],"study_design_scores_gemma":[0.000023797038,0.0025657283,0.02406049,0.000014974633,0.0000997566,0.0004629304,0.00022170968,0.008098469,0.96275043,0.00005994442,0.0016095494,0.000032308886],"about_ca_topic_score_codex":0.00096431596,"about_ca_topic_score_gemma":0.0021794764,"teacher_disagreement_score":0.0019374883,"about_ca_system_score_codex":0.0003601898,"about_ca_system_score_gemma":0.0001924461,"threshold_uncertainty_score":0.0064815283},"labels":[],"label_agreement":null},{"id":"W2319599348","doi":"10.1109/tcpmt.2014.2377375","title":"Capacitance and Conductance of Through Silicon Vias With Consideration of Multilayer Media and Different Shapes","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Capacitance; Conductance; Materials science; RADIUS; Silicon; Optoelectronics; Acoustics; Optics; Physics; Condensed matter physics; Computer science; Electrode","score_opus":0.03071623851263045,"score_gpt":0.21965879630738344,"score_spread":0.188942557794753,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2319599348","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9203303,0.00073700806,0.06994406,0.00013529627,0.000057828347,0.000034481352,0.00020655042,0.00037249172,0.008182105],"genre_scores_gemma":[0.9925248,0.00027361704,0.0064628585,0.0000112590915,0.000008035651,0.00001025369,0.00004547915,0.000021024482,0.00064266974],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998017,0.000029306639,0.000006910904,0.000042815067,0.000085216,0.000034113928],"domain_scores_gemma":[0.99975353,0.00010155408,0.000042010797,0.000031770353,0.000058148606,0.000013045031],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017807662,0.0005482425,0.0002939336,0.0006570688,0.0001807985,0.00043578655,0.00024521534,0.0005092873,0.0004954547],"category_scores_gemma":[0.0010262678,0.00019129117,0.0005151665,0.00054511527,0.0003508996,0.0009886082,0.00023737056,0.00013979142,0.00008574459],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022958407,0.000060848928,0.007025059,0.00022876776,0.0001539351,0.0011670177,0.00032812968,0.37257263,0.57422805,0.014915726,0.000594339,0.028495934],"study_design_scores_gemma":[0.000026849122,0.00031176806,0.0076400265,0.000028753197,0.00014305426,0.00074290566,0.00016306862,0.8918194,0.09203867,0.003462252,0.0035476964,0.00007556525],"about_ca_topic_score_codex":0.0023704965,"about_ca_topic_score_gemma":0.0032317995,"teacher_disagreement_score":0.0023704965,"about_ca_system_score_codex":0.0006865538,"about_ca_system_score_gemma":0.0005639005,"threshold_uncertainty_score":0.004981339},"labels":[],"label_agreement":null},{"id":"W2324019639","doi":"10.1109/tcpmt.2014.2375635","title":"Thermomechanical Characteristics of Copper Through-Silicon via Structures","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Cisco Systems","keywords":"Materials science; Electron backscatter diffraction; Misorientation; Copper; Wafer; Finite element method; Through-silicon via; Residual stress; Composite material; Silicon; Metallurgy; Substrate (aquarium); Optoelectronics; Electronic engineering; Microstructure; Structural engineering","score_opus":0.022297799716071976,"score_gpt":0.2280479209746731,"score_spread":0.20575012125860112,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2324019639","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9981213,0.00016606005,0.0006271094,0.000018243338,0.0000071831073,0.0000056436047,0.00011561702,0.00004826304,0.00089064834],"genre_scores_gemma":[0.9990941,0.00005739984,0.00028242418,0.0000029407738,0.0000022482163,0.0000051900147,0.00006055403,0.0000045949246,0.0004904696],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99989843,0.000006342875,0.0000047299163,0.00002388135,0.000047095516,0.000019488267],"domain_scores_gemma":[0.9997162,0.000049671,0.00008640451,0.00003057598,0.000101144346,0.000015928368],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009107938,0.00025252043,0.00014007055,0.00041222264,0.00013145668,0.00020076589,0.00021956806,0.0002541622,0.0009822961],"category_scores_gemma":[0.00047147294,0.00013886264,0.00012822039,0.00033650626,0.0001960179,0.00025289512,0.000105119376,0.00008560587,0.0001251302],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009608647,0.000018487048,0.005442488,0.000054412478,0.000021162945,0.0002758249,0.00023181597,0.0039799376,0.98365676,0.00039513825,0.00027681733,0.0055511734],"study_design_scores_gemma":[0.000022483391,0.0013719582,0.11755731,0.000030544677,0.00007028792,0.00069375784,0.0004525101,0.058927815,0.8148544,0.00029086974,0.005674106,0.00005396078],"about_ca_topic_score_codex":0.0015819157,"about_ca_topic_score_gemma":0.0019417559,"teacher_disagreement_score":0.0015819157,"about_ca_system_score_codex":0.00039872684,"about_ca_system_score_gemma":0.00014216441,"threshold_uncertainty_score":0.0032860637},"labels":[],"label_agreement":null},{"id":"W2340015982","doi":"10.1109/tcpmt.2016.2548498","title":"Systematic Design Technique for Dual-Band Branch-Line Coupler Using T- and Pi-Networks and Their Application in Novel Wideband-Ratio Crossover","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":46,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"","keywords":"Crossover; Multi-band device; Wideband; Network topology; Topology (electrical circuits); Power (physics); Computer science; Line (geometry); Electronic engineering; Physics; Electrical engineering; Telecommunications; Mathematics; Engineering; Computer network; Antenna (radio); Artificial intelligence","score_opus":0.016853711256498493,"score_gpt":0.2196839530747019,"score_spread":0.20283024181820342,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2340015982","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.033066228,0.0005660471,0.95768523,0.00010732449,0.0000610399,0.0001749152,0.000027776558,0.00035693537,0.007954559],"genre_scores_gemma":[0.3574302,0.0010532871,0.63746494,0.000077540215,0.00006904151,0.00028207296,0.000060648446,0.000067060304,0.0034953086],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9996698,0.00008131659,0.00001776749,0.00008495015,0.00012530955,0.00002080023],"domain_scores_gemma":[0.9997695,0.00004682175,0.00007987612,0.000033573902,0.000059772952,0.000010439147],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00044800094,0.0005643893,0.00036283248,0.00052176684,0.0003126191,0.00067707937,0.00068643404,0.0005184861,0.001395416],"category_scores_gemma":[0.00048417592,0.0003252674,0.00059972587,0.0004209671,0.00030579028,0.00076649326,0.0003006711,0.00059084274,0.0005290807],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020569022,0.00013693511,0.0012432896,0.00072459737,0.0001447787,0.00042000983,0.00042801508,0.05508877,0.6674398,0.08980352,0.0012707866,0.18309383],"study_design_scores_gemma":[0.00018353919,0.002115942,0.0020751427,0.00016977468,0.0002474654,0.003525023,0.00017889931,0.5354623,0.38539052,0.012265747,0.058270168,0.00011556909],"about_ca_topic_score_codex":0.00020743089,"about_ca_topic_score_gemma":0.0003013076,"teacher_disagreement_score":0.001395416,"about_ca_system_score_codex":0.00040144907,"about_ca_system_score_gemma":0.00037108196,"threshold_uncertainty_score":0.0046681166},"labels":[],"label_agreement":null},{"id":"W2419917080","doi":"10.1109/tcpmt.2016.2564425","title":"Gap Waveguide PMC Packaging for Two-Layer PEC Surfaces","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":17,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"National Natural Science Foundation of China","keywords":"Stopband; Materials science; Microstrip; Chebyshev filter; Optoelectronics; Printed circuit board; Layer (electronics); Waveguide; Substrate (aquarium); Dielectric; Insertion loss; Band-pass filter; Conductor; Electronic circuit; Permittivity; Optics; Electronic engineering; Electrical engineering; Composite material; Engineering; Physics","score_opus":0.020349094367615225,"score_gpt":0.23405117595953406,"score_spread":0.21370208159191884,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2419917080","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9231223,0.0007670806,0.07009445,0.00006500118,0.00008021134,0.000025998179,0.000040933224,0.00024500725,0.0055590533],"genre_scores_gemma":[0.96692735,0.00024317749,0.031480763,0.000023992448,0.000015978334,0.00002055705,0.000053973235,0.00003761534,0.0011964526],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983895,0.000022884473,0.000008386593,0.00004361287,0.000058826274,0.000027293745],"domain_scores_gemma":[0.99977785,0.00005455358,0.000056454963,0.00007240455,0.000029803969,0.000008956356],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015985292,0.0003286773,0.00023524255,0.00015217153,0.000109502005,0.000496629,0.0002666713,0.00045241436,0.00040296474],"category_scores_gemma":[0.00025783526,0.00015288856,0.00021936925,0.00012515597,0.00029835216,0.0005117791,0.00035057694,0.00029152734,0.00021709998],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000060793565,0.00003383436,0.000820103,0.00016894222,0.000018239254,0.000544176,0.00013486255,0.0027277572,0.98035663,0.004388814,0.00018700949,0.010558739],"study_design_scores_gemma":[0.000017835304,0.0008586863,0.0027624678,0.000021707996,0.000027928352,0.0012658228,0.00010851007,0.026703853,0.96020544,0.000703944,0.0073111015,0.000012777024],"about_ca_topic_score_codex":0.00004078732,"about_ca_topic_score_gemma":0.000056680983,"teacher_disagreement_score":0.000496629,"about_ca_system_score_codex":0.00011985054,"about_ca_system_score_gemma":0.000088686975,"threshold_uncertainty_score":0.0013480186},"labels":[],"label_agreement":null},{"id":"W2527810829","doi":"10.1109/tcpmt.2016.2610321","title":"Vacuum-Assisted Through Silicon via Filling Method With Ag-Based Epoxy","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Government of Alberta; CMC Microsystems","keywords":"Materials science; Epoxy; Microfabrication; Silicon; Electroplating; Composite material; Electrical resistivity and conductivity; Doping; Optoelectronics; Electrical engineering; Fabrication","score_opus":0.016333443622301384,"score_gpt":0.22957699428578565,"score_spread":0.21324355066348427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2527810829","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89482284,0.0013372129,0.09765427,0.000104153754,0.00018874941,0.000111391906,0.00014518146,0.0013399516,0.004296249],"genre_scores_gemma":[0.9240786,0.0007639564,0.07130868,0.000044283886,0.000025940417,0.00006417529,0.00010221438,0.00010424847,0.0035080183],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998419,0.000012075348,0.000013391237,0.00004757401,0.00006430737,0.000020666299],"domain_scores_gemma":[0.9998692,0.000020071244,0.00004653882,0.000026147198,0.000029374376,0.0000087638455],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013828902,0.00045238787,0.0002502896,0.00026252976,0.00015128336,0.00020054453,0.0003036741,0.00027756958,0.00055535685],"category_scores_gemma":[0.00024434717,0.00023116017,0.00025407525,0.00015753356,0.00017169346,0.00038791777,0.00024992714,0.00029284105,0.00033913364],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000009839358,0.000010442914,0.00018848578,0.00006182747,0.0000038138403,0.00009492304,0.0000542499,0.00011579659,0.9940587,0.00018780876,0.00008594528,0.0051280935],"study_design_scores_gemma":[0.000004125355,0.00020493924,0.0013343093,0.000005616473,0.000014750292,0.000467343,0.000027648572,0.001614877,0.9922132,0.000043736487,0.004054548,0.000014783979],"about_ca_topic_score_codex":0.00024312992,"about_ca_topic_score_gemma":0.0004786024,"teacher_disagreement_score":0.00055535685,"about_ca_system_score_codex":0.00010238476,"about_ca_system_score_gemma":0.00016650966,"threshold_uncertainty_score":0.0018578768},"labels":[],"label_agreement":null},{"id":"W2529531072","doi":"10.1109/tcpmt.2016.2609400","title":"Barium Strontium Titanate Capacitor Fabrication on Copper Printed Circuit Board","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Acoustic Wave Resonator Technologies","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Queen's University","funders":"","keywords":"Materials science; Capacitor; Printed circuit board; Microstrip; Optoelectronics; Fabrication; Resonator; Ceramic; Electrical engineering; Voltage; Composite material; Engineering","score_opus":0.014164418912809784,"score_gpt":0.206136461632576,"score_spread":0.19197204271976623,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2529531072","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.55948395,0.0015708937,0.3802344,0.00055582094,0.000880989,0.0016634929,0.003133968,0.0110035455,0.04147289],"genre_scores_gemma":[0.527873,0.0017999838,0.43465024,0.0001460083,0.000072395385,0.0011578192,0.0020711473,0.0008822104,0.031347297],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99978286,0.00001675144,0.000014773652,0.000052121126,0.00010416748,0.000029305193],"domain_scores_gemma":[0.99961424,0.00006403475,0.000060724207,0.000120482444,0.000105873296,0.000034634308],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025687218,0.00060522195,0.00033090616,0.0005638314,0.0004024946,0.0004196149,0.0007981179,0.00029269728,0.008051565],"category_scores_gemma":[0.00044248352,0.00049326045,0.00020918743,0.0005737897,0.00019500047,0.00035324742,0.00025957418,0.00067388214,0.0045597376],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020486388,0.000022757757,0.00007511912,0.00009616664,0.000006231821,0.00017117547,0.00003438551,0.00027551875,0.9909695,0.00034014173,0.0007417937,0.0072467616],"study_design_scores_gemma":[0.000015428646,0.00013506095,0.0009496502,0.000008077092,0.000012813749,0.00034401217,0.000031205145,0.0019324775,0.98196477,0.00006689549,0.014527644,0.000011984495],"about_ca_topic_score_codex":0.000603178,"about_ca_topic_score_gemma":0.0017096814,"teacher_disagreement_score":0.008051565,"about_ca_system_score_codex":0.00025041396,"about_ca_system_score_gemma":0.00037190397,"threshold_uncertainty_score":0.02693522},"labels":[],"label_agreement":null},{"id":"W2550504490","doi":"10.1109/tcpmt.2016.2620424","title":"Completely Tuned Coupled Cavity Filters in Defected Bed of Nails Cavity","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Chebyshev filter; Band-pass filter; Filter (signal processing); Coupling (piping); Waveguide filter; Prototype filter; Materials science; m-derived filter; Coaxial; Waveguide; Electronic engineering; Filter design; Acoustics; Optoelectronics; Engineering; Physics; Electrical engineering","score_opus":0.012651562355130338,"score_gpt":0.20426673551034058,"score_spread":0.19161517315521023,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2550504490","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8833942,0.00041159932,0.113634825,0.000047257716,0.00003305589,0.000020684465,0.00007517938,0.00031699715,0.0020662032],"genre_scores_gemma":[0.958462,0.0001232779,0.040500645,0.000012298111,0.000007155994,0.000017515817,0.000033766097,0.000022886496,0.00082050136],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998023,0.000023515233,0.000008652033,0.000055412555,0.000073310504,0.000036768983],"domain_scores_gemma":[0.9996908,0.000059946637,0.0001239535,0.00004443815,0.00006184436,0.000019028801],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019248042,0.00036839326,0.00044427384,0.00016919718,0.00014185271,0.0002973676,0.00057349936,0.00052595243,0.0003332632],"category_scores_gemma":[0.0002773273,0.00030636223,0.00034879608,0.00018903775,0.00033413043,0.000405613,0.00022332798,0.00018201293,0.00012956916],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001706567,0.00003110306,0.0007590426,0.000097571305,0.00004247949,0.0002100956,0.000061539504,0.021171948,0.9665104,0.003781818,0.00016194925,0.0070013306],"study_design_scores_gemma":[0.00007288322,0.0011737138,0.0028444976,0.000025191297,0.00007843665,0.00064499094,0.000057245004,0.26693797,0.72352886,0.0010799641,0.0035012097,0.000055024317],"about_ca_topic_score_codex":0.0010613692,"about_ca_topic_score_gemma":0.001815827,"teacher_disagreement_score":0.0010613692,"about_ca_system_score_codex":0.0005211853,"about_ca_system_score_gemma":0.00033480898,"threshold_uncertainty_score":0.0037814379},"labels":[],"label_agreement":null},{"id":"W2561970944","doi":"10.1109/tcpmt.2016.2631545","title":"A Fully 3-D Printed Waveguide and Its Application as Microfluidically Controlled Waveguide Switch","year":2016,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":45,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; CMC Microsystems","keywords":"Insertion loss; Materials science; Fused deposition modeling; Optoelectronics; Fabrication; Waveguide; Acrylonitrile butadiene styrene; Attenuation; 3D printing; Optics; Composite material","score_opus":0.007232318108705828,"score_gpt":0.20554900376031746,"score_spread":0.19831668565161162,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2561970944","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6775792,0.0027856897,0.30605686,0.00037206232,0.00048804263,0.00013695282,0.00056493015,0.0026014596,0.009414807],"genre_scores_gemma":[0.863712,0.001121452,0.13062856,0.00015438822,0.000064756925,0.00010092095,0.00024058371,0.000075133394,0.0039021317],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997882,0.000019609548,0.00001276137,0.00005594494,0.00009428746,0.000029179297],"domain_scores_gemma":[0.9998068,0.000044941207,0.00005706644,0.000040079947,0.000029759276,0.000021276923],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000202205,0.00031044855,0.00024584486,0.00022319535,0.00016012158,0.00055157655,0.0004557343,0.0004231284,0.0005232921],"category_scores_gemma":[0.00021685625,0.00022717415,0.00047484477,0.00017476515,0.0002900986,0.00037268334,0.0003524934,0.00029346262,0.0002546801],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031856376,0.000014055471,0.0001441628,0.000051019633,0.000008876407,0.00012861672,0.000023507595,0.0020365636,0.9901619,0.00056678295,0.00013174303,0.006700939],"study_design_scores_gemma":[0.000013094829,0.0002778651,0.0016543105,0.000009294556,0.000018214456,0.00048422886,0.00001510841,0.016313877,0.9728011,0.0003454397,0.00803458,0.000032873715],"about_ca_topic_score_codex":0.00023926536,"about_ca_topic_score_gemma":0.00032549788,"teacher_disagreement_score":0.00055157655,"about_ca_system_score_codex":0.00025496096,"about_ca_system_score_gemma":0.00027627376,"threshold_uncertainty_score":0.0018498898},"labels":[],"label_agreement":null},{"id":"W2573372484","doi":"10.1109/tcpmt.2016.2635656","title":"Stable Model-Order Reduction of Active Circuits","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Model Reduction and Neural Networks","field":"Physics and Astronomy","cited_by":21,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Passivity; Reduction (mathematics); Electronic circuit; Model order reduction; Stability (learning theory); Computer science; Equivalent circuit; Control theory (sociology); Class (philosophy); Electronic engineering; Algorithm; Mathematics; Engineering; Electrical engineering; Control (management); Voltage; Artificial intelligence","score_opus":0.02514894381153028,"score_gpt":0.25736191567334865,"score_spread":0.23221297186181838,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2573372484","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.009263842,0.00006250842,0.9857178,0.000052277624,0.000015846455,0.000021707037,0.000033406282,0.0005803863,0.0042522755],"genre_scores_gemma":[0.71266556,0.0002863913,0.27558234,0.0000933736,0.000041652023,0.0001985122,0.00025190756,0.00039504646,0.010485219],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99977237,0.00005634579,0.0000091688225,0.000036841207,0.000102358455,0.000022864364],"domain_scores_gemma":[0.9997378,0.00012302425,0.000019580884,0.00006067591,0.000052314583,0.0000065750955],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028757725,0.0006485089,0.000566279,0.0003873801,0.00031932717,0.00068938715,0.0007658336,0.00047294438,0.003314002],"category_scores_gemma":[0.0010004615,0.00027911138,0.0007371496,0.00019628236,0.00047704944,0.00060950883,0.0005656524,0.00086521317,0.0008603237],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007998095,0.00004922345,0.00023730274,0.00013725205,0.000034241388,0.00014072077,0.00013803401,0.7404957,0.038773764,0.11893206,0.0017728929,0.09920896],"study_design_scores_gemma":[0.000007989212,0.000023105074,0.00003307182,0.0000046955493,0.0000072872167,0.000024792476,0.0000059873473,0.96506494,0.0051338,0.027923537,0.0017660984,0.000004738243],"about_ca_topic_score_codex":0.0010917094,"about_ca_topic_score_gemma":0.0014234261,"teacher_disagreement_score":0.003314002,"about_ca_system_score_codex":0.00048997503,"about_ca_system_score_gemma":0.00049676915,"threshold_uncertainty_score":0.011086404},"labels":[],"label_agreement":null},{"id":"W2577379255","doi":"10.1109/tcpmt.2016.2642199","title":"Variability Analysis via Parameterized Model Order Reduction and Numerical Inversion of Laplace Transform","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Probabilistic and Robust Engineering Design","field":"Decision Sciences","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Laplace transform; Parameterized complexity; Model order reduction; Applied mathematics; Inversion (geology); Frequency domain; Algorithm; Subspace topology; Inverse Laplace transform; Numerical integration; Time domain; Mathematics; Frequency response; Dimensionality reduction; Representation (politics); Computer science; Numerical analysis; Mathematical optimization; Mathematical analysis","score_opus":0.045423512440772855,"score_gpt":0.2949294368384428,"score_spread":0.24950592439766994,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2577379255","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0014950723,0.000020856833,0.99803954,0.000016583681,0.0000033570718,0.00000795923,0.000013287775,0.00014858892,0.00025483567],"genre_scores_gemma":[0.30192193,0.000264499,0.69461256,0.00006705477,0.000045787376,0.0002898135,0.00036023612,0.00030341418,0.002134702],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99973804,0.000065368054,0.000012340565,0.000037338952,0.00012502851,0.000021861213],"domain_scores_gemma":[0.9992324,0.00046738682,0.00009646314,0.00008519583,0.00009941687,0.000019061006],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00067875435,0.00072598265,0.00069818547,0.00066624756,0.00035514176,0.00077855884,0.0008185838,0.00050555536,0.0014141189],"category_scores_gemma":[0.0021149002,0.00037424773,0.0010435072,0.0005998485,0.0005008653,0.0007358592,0.0008384391,0.0011565665,0.0004697655],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000277301,0.00003086126,0.0006300577,0.000057236666,0.000039204402,0.0000910752,0.00006922414,0.8704708,0.010749396,0.034823578,0.0008008112,0.08221],"study_design_scores_gemma":[0.0000012090827,0.000005252787,0.000034940236,0.0000013397104,0.0000014923415,0.000012024117,0.0000021880176,0.9959912,0.00041788927,0.0032165535,0.00031287255,0.0000029970038],"about_ca_topic_score_codex":0.0025416478,"about_ca_topic_score_gemma":0.002258709,"teacher_disagreement_score":0.0025416478,"about_ca_system_score_codex":0.0005971154,"about_ca_system_score_gemma":0.0010863624,"threshold_uncertainty_score":0.0050537586},"labels":[],"label_agreement":null},{"id":"W2580149315","doi":"10.1109/tcpmt.2017.2650138","title":"Delay Extraction-Based Modeling Using Loewner Matrix Framework","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Western University","funders":"","keywords":"Attenuation; Matrix (chemical analysis); Computer science; Algorithm; Elmore delay; Mathematics; Mathematical optimization; Propagation delay; Delay calculation","score_opus":0.02217231772579142,"score_gpt":0.27601393778104594,"score_spread":0.2538416200552545,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2580149315","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0024968616,0.00007904989,0.99513334,0.000020445861,0.000010877797,0.000014122081,0.00003064166,0.0003527971,0.001861807],"genre_scores_gemma":[0.24092585,0.0009630475,0.7451503,0.00008549106,0.000045120534,0.00023565206,0.00041024125,0.0005207219,0.011663588],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99978954,0.00004182929,0.00001034925,0.00003830054,0.00010183132,0.000018220926],"domain_scores_gemma":[0.99980754,0.000076824086,0.000027569138,0.000036033074,0.000044062668,0.000008039099],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003510748,0.0009903183,0.0005862656,0.0007045839,0.00035460113,0.0007959339,0.0012330038,0.0008012162,0.0034794076],"category_scores_gemma":[0.00078879145,0.00044575075,0.0007688965,0.00055326545,0.00036367105,0.002066887,0.00044570485,0.0009675222,0.0016523533],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000049239883,0.000043448414,0.00024219646,0.00013738405,0.000040269184,0.000158566,0.00014674444,0.8203375,0.04574835,0.08462474,0.0007386255,0.04773295],"study_design_scores_gemma":[0.00000312654,0.000016463042,0.000024534702,0.000007756303,0.000005653706,0.000033616197,0.000008123747,0.9865861,0.005057603,0.0049580135,0.0032898039,0.00000917275],"about_ca_topic_score_codex":0.0025985292,"about_ca_topic_score_gemma":0.0032180105,"teacher_disagreement_score":0.0034794076,"about_ca_system_score_codex":0.00072697125,"about_ca_system_score_gemma":0.00068282237,"threshold_uncertainty_score":0.011639833},"labels":[],"label_agreement":null},{"id":"W2597046580","doi":"10.1109/tcpmt.2017.2671518","title":"Determining the Stopband of a Periodic Bed of Nails From the Dispersion Relation Measurements Prediction","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Stopband; Solver; Dispersion relation; Dispersion (optics); Waveguide; Reflection (computer programming); Scattering; Optics; Acoustics; Scattering parameters; Propagation constant; Physics; Mathematical analysis; Mathematics; Computer science; Mathematical optimization; Resonator","score_opus":0.023734073880233998,"score_gpt":0.21728815419920885,"score_spread":0.19355408031897486,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2597046580","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.658363,0.0005902486,0.3309825,0.000069190675,0.000049718445,0.00003886019,0.0002683245,0.0012159138,0.00842228],"genre_scores_gemma":[0.92081517,0.0002395164,0.07561312,0.000032762415,0.0000064599712,0.000036361103,0.00024315117,0.00013352216,0.0028798985],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998307,0.000015681679,0.000007924247,0.000041834046,0.00008240256,0.000021496648],"domain_scores_gemma":[0.99955326,0.00018115126,0.000085654465,0.000050380368,0.00011336784,0.000016165433],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028293548,0.00043653473,0.00026786563,0.00067560654,0.00019153647,0.0005529104,0.00032435884,0.00047693236,0.0016823122],"category_scores_gemma":[0.00083505485,0.00025062653,0.00018610418,0.00027444866,0.00032110605,0.0004812461,0.00020775292,0.00026703894,0.0011557725],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00026547935,0.000051486142,0.0034590268,0.00018483459,0.000018041512,0.0002663741,0.0002917275,0.009260128,0.93251073,0.0024162077,0.00051576423,0.050760366],"study_design_scores_gemma":[0.00002460767,0.0005915931,0.017534796,0.000110056986,0.00006645453,0.00059765484,0.00059825904,0.15916671,0.8101068,0.0021391711,0.008992236,0.00007161326],"about_ca_topic_score_codex":0.00056258333,"about_ca_topic_score_gemma":0.0013680578,"teacher_disagreement_score":0.0016823122,"about_ca_system_score_codex":0.0002484311,"about_ca_system_score_gemma":0.00023073716,"threshold_uncertainty_score":0.0056278706},"labels":[],"label_agreement":null},{"id":"W2600349189","doi":"10.1109/tcpmt.2017.2676719","title":"Optimal Thermal Conditions for Maximum Power Generation When Operating Thermoelectric Liquid-to-Liquid Generators","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Thermoelectric Materials and Devices","field":"Materials Science","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Outaouais","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Thermoelectric generator; Heat exchanger; Materials science; Heat transfer; Thermoelectric effect; Electricity generation; Thermoelectric cooling; Heat flux; Heat generation; Generator (circuit theory); Power (physics); Nuclear engineering; Mechanical engineering; Thermodynamics; Mechanics; Engineering; Physics","score_opus":0.02140944619754025,"score_gpt":0.26797552807111136,"score_spread":0.2465660818735711,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2600349189","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8589223,0.0012131622,0.12659508,0.0002955293,0.000047830385,0.00014546969,0.0002917756,0.00033115488,0.012157763],"genre_scores_gemma":[0.99276465,0.00022164597,0.0065624393,0.000011443459,0.000007581452,0.000046678557,0.000041188418,0.000023345412,0.00032106755],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996019,0.000076248296,0.000026796393,0.00006815144,0.00014246402,0.00008441253],"domain_scores_gemma":[0.9994429,0.00026932248,0.00015065193,0.000032286338,0.00008469849,0.000020182626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005677184,0.00040508193,0.00065529183,0.00048146406,0.00045654995,0.0011574687,0.00036823226,0.0005448514,0.0011719224],"category_scores_gemma":[0.001739279,0.00031180296,0.00021265121,0.000399396,0.00063732604,0.0009511381,0.00042162673,0.0003922932,0.00048746596],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.001134663,0.00024365824,0.0066301147,0.0008193788,0.000033189688,0.00068186625,0.00046675804,0.25790915,0.6895939,0.011822637,0.0011365289,0.029528081],"study_design_scores_gemma":[0.00010485758,0.0006760502,0.0038749627,0.00007276598,0.00005535559,0.00023846692,0.00045304955,0.32469553,0.65909344,0.006595036,0.0040726177,0.00006768875],"about_ca_topic_score_codex":0.00032841734,"about_ca_topic_score_gemma":0.0008921743,"teacher_disagreement_score":0.0011719224,"about_ca_system_score_codex":0.0004816465,"about_ca_system_score_gemma":0.0005616075,"threshold_uncertainty_score":0.003920436},"labels":[],"label_agreement":null},{"id":"W2623763811","doi":"10.1109/tcpmt.2017.2702753","title":"Self-Packaged, Low-Loss, Planar Bandpass Filters for Millimeter-Wave Application Based on Printed Gap Waveguide Technology","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":57,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"","keywords":"Band-pass filter; Printed circuit board; Insertion loss; Microstrip; Planar; Waveguide; Electronic circuit; Extremely high frequency; Materials science; Realization (probability); Waveguide filter; Electronic engineering; Filter (signal processing); Prototype filter; Computer science; Optoelectronics; Electrical engineering; Low-pass filter; Engineering; Telecommunications; Mathematics","score_opus":0.014655794463199423,"score_gpt":0.22087906631769785,"score_spread":0.20622327185449843,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2623763811","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.44505027,0.00195808,0.54353553,0.00016879849,0.00015752607,0.00005948122,0.00014824026,0.002448437,0.006473649],"genre_scores_gemma":[0.81485754,0.0008000769,0.17994736,0.00007267439,0.00008552999,0.00006603965,0.00015243719,0.000109473316,0.0039089904],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99984646,0.000020381314,0.000007255569,0.000028045111,0.00008196049,0.000015766096],"domain_scores_gemma":[0.9997396,0.00004687512,0.0001053276,0.000048432146,0.000049780432,0.00000990743],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00013417799,0.0004196935,0.00033059463,0.0003200312,0.00009969684,0.00038864475,0.00057700864,0.00037408475,0.00052199786],"category_scores_gemma":[0.0002595096,0.00024635848,0.000330856,0.00030565125,0.00019489581,0.0005698446,0.00015758781,0.00030020453,0.0004432098],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050539926,0.000022724951,0.00041507193,0.0001129466,0.000030145777,0.00010756544,0.000033373934,0.001080001,0.9765911,0.0015502481,0.00031823028,0.019688006],"study_design_scores_gemma":[0.00002204587,0.00060399954,0.0019634482,0.000010748879,0.000056454755,0.00076098554,0.000020672744,0.01630592,0.9720428,0.00032749734,0.007864027,0.000021493219],"about_ca_topic_score_codex":0.00008209567,"about_ca_topic_score_gemma":0.0001820893,"teacher_disagreement_score":0.00057700864,"about_ca_system_score_codex":0.00019579638,"about_ca_system_score_gemma":0.0001116829,"threshold_uncertainty_score":0.0017462373},"labels":[],"label_agreement":null},{"id":"W2732841385","doi":"10.1109/tcpmt.2017.2711480","title":"Efficient Modeling of Power Supply Induced Jitter in Voltage-Mode Drivers (EMPSIJ)","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":40,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Jitter; Electronic engineering; Voltage; Computer science; Power (physics); Noise (video); Mode (computer interface); SIGNAL (programming language); Electronic circuit; Electrical engineering; Engineering; Physics","score_opus":0.01253867020831403,"score_gpt":0.23373482158791606,"score_spread":0.22119615137960202,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2732841385","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.014083575,0.00014994311,0.9840097,0.000022213508,0.000012960608,0.000024246741,0.000033063894,0.00043552392,0.0012287967],"genre_scores_gemma":[0.83452547,0.0004897168,0.1609879,0.000037457852,0.000028949793,0.00012359387,0.00015401925,0.0001962477,0.0034567504],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9997002,0.000057110443,0.000011282882,0.000030912193,0.00017384188,0.000026666534],"domain_scores_gemma":[0.99970764,0.00012167245,0.00005073422,0.000051116964,0.000060679165,0.000008166002],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00046529778,0.0007070683,0.00035051224,0.00040359673,0.0002631357,0.0005387798,0.0009930653,0.00043695627,0.00088031887],"category_scores_gemma":[0.0011624375,0.00034877646,0.00040144025,0.00031381144,0.00028971056,0.0007435866,0.00037951733,0.00048529252,0.00026966882],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000032357064,0.000022667467,0.0006819828,0.00007570543,0.000019951158,0.0000958295,0.00005826733,0.9370369,0.02190455,0.013303303,0.00031831744,0.02645019],"study_design_scores_gemma":[0.000001174516,0.000013784577,0.000094598036,0.00000303906,0.000003192163,0.000019704617,0.0000024841206,0.9953381,0.0032570066,0.000885616,0.00037890763,0.00000246485],"about_ca_topic_score_codex":0.0014964865,"about_ca_topic_score_gemma":0.0016185534,"teacher_disagreement_score":0.0014964865,"about_ca_system_score_codex":0.0006172292,"about_ca_system_score_gemma":0.0005978149,"threshold_uncertainty_score":0.004478395},"labels":[],"label_agreement":null},{"id":"W2746244107","doi":"10.1109/tcpmt.2017.2734639","title":"A Dual-Mode Wideband +17.7-dBm 60-GHz Power Amplifier in 65-nm CMOS","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Amplifier; RF power amplifier; Power bandwidth; Electrical engineering; dBm; Power-added efficiency; Cascode; Wideband; CMOS; Linear amplifier; Power gain; Direct-coupled amplifier; Electronic engineering; Impedance matching; Transformer; Bandwidth (computing); Materials science; Electrical impedance; Engineering; Voltage; Operational amplifier; Telecommunications","score_opus":0.016477537744574,"score_gpt":0.24002922951388123,"score_spread":0.22355169176930723,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2746244107","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.53031164,0.0024297256,0.42392522,0.0011891245,0.00039214155,0.00017946034,0.00036225235,0.0031898313,0.038020592],"genre_scores_gemma":[0.89871246,0.0008808536,0.088117816,0.00021842656,0.00011337928,0.00005412354,0.00018096752,0.000078784135,0.011643331],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99974173,0.00001758324,0.000014088285,0.000078183315,0.00010668634,0.000041799256],"domain_scores_gemma":[0.99988925,0.000013863079,0.000028819357,0.000011466152,0.000036802074,0.000019740291],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012434873,0.000335167,0.00022997658,0.00020046002,0.00018805006,0.00047894786,0.00066967367,0.00040762383,0.0017726717],"category_scores_gemma":[0.0002170062,0.00023793861,0.00023365789,0.00030044818,0.00018976373,0.0007391178,0.00034808533,0.00039659732,0.0013255014],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000085296764,0.00003865818,0.0006677268,0.00007777751,0.000027768629,0.00022489061,0.00010921103,0.00064799475,0.9691226,0.0029467752,0.0009582937,0.025093095],"study_design_scores_gemma":[0.00008178832,0.0011085193,0.0029159426,0.000036448255,0.00013640366,0.0025441453,0.0001196609,0.030585624,0.9004168,0.0011773465,0.06083764,0.000039641855],"about_ca_topic_score_codex":0.0005085541,"about_ca_topic_score_gemma":0.0010760075,"teacher_disagreement_score":0.0017726717,"about_ca_system_score_codex":0.00026997214,"about_ca_system_score_gemma":0.00021911798,"threshold_uncertainty_score":0.0059301853},"labels":[],"label_agreement":null},{"id":"W2772960756","doi":"10.1109/tcpmt.2017.2774188","title":"Analysis, Modeling, and Mitigation of Parasitic Resonances in Integrated Metallic Seal Rings","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal; McGill University","funders":"","keywords":"Resonance (particle physics); Capacitor; Equivalent circuit; Integrated circuit; Optoelectronics; Materials science; Electrical element; Silicon; Electronic circuit; Electrical engineering; Electronic engineering; Acoustics; Physics; Engineering; Voltage; Atomic physics","score_opus":0.012751748989241092,"score_gpt":0.23098284460421376,"score_spread":0.21823109561497267,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2772960756","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.53570706,0.00037197632,0.4551345,0.00011813117,0.000020096924,0.000035889803,0.00007910563,0.0009515921,0.007581673],"genre_scores_gemma":[0.9774753,0.00012730055,0.021177782,0.000009778587,0.0000051309303,0.00001541948,0.000021400767,0.00002984672,0.0011379593],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99987304,0.000027105678,0.000004661746,0.000023997085,0.000054910754,0.000016257041],"domain_scores_gemma":[0.9998287,0.000066782675,0.00003804676,0.000032952456,0.00002759179,0.000006012287],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021166466,0.00033312695,0.00021213319,0.00016578584,0.00009749575,0.000252142,0.00052611163,0.00043695813,0.00044767396],"category_scores_gemma":[0.0003997072,0.00023458204,0.00031888604,0.00012999016,0.00025740764,0.00039674932,0.00016165012,0.00016419735,0.00016425812],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000097210264,0.00004287419,0.0015849943,0.000117512645,0.00002912917,0.00030811006,0.00014583794,0.74782133,0.22869657,0.004476353,0.00032667597,0.016353395],"study_design_scores_gemma":[0.0000037134134,0.00009578829,0.0005237447,0.0000037294697,0.000009767786,0.000056105833,0.000014965828,0.9803106,0.018172625,0.00021525251,0.00058831414,0.0000054266775],"about_ca_topic_score_codex":0.001063289,"about_ca_topic_score_gemma":0.0011957587,"teacher_disagreement_score":0.001063289,"about_ca_system_score_codex":0.00035110055,"about_ca_system_score_gemma":0.0002826885,"threshold_uncertainty_score":0.002547443},"labels":[],"label_agreement":null},{"id":"W2789405386","doi":"10.1109/tcpmt.2018.2806562","title":"Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Antenna Design and Analysis","field":"Engineering","cited_by":96,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Antenna efficiency; Antenna measurement; Electronic engineering; MIMO; Electrical engineering; Reflection coefficient; Antenna tuner; Antenna factor; Computer science; Dipole antenna; Physics; Antenna (radio); Engineering; Beamforming","score_opus":0.014849842455606433,"score_gpt":0.2223071363205457,"score_spread":0.20745729386493925,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2789405386","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.19467987,0.0007603241,0.79222316,0.000333947,0.00045562553,0.000089846515,0.0002028793,0.0020508324,0.00920349],"genre_scores_gemma":[0.64209825,0.0005896636,0.34786093,0.00023723661,0.000111153975,0.000114892675,0.00041028723,0.00024494663,0.008332606],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998167,0.000029049073,0.00001691429,0.000042330455,0.000070275666,0.0000246933],"domain_scores_gemma":[0.99956757,0.000051863502,0.00011806188,0.00010878383,0.00012587412,0.000027806316],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025282663,0.0005008672,0.00034831176,0.000277819,0.00012278144,0.0004990372,0.0007638737,0.00073052983,0.0007901972],"category_scores_gemma":[0.00044818353,0.00026043388,0.00051877054,0.00037987385,0.00012330906,0.00049502676,0.00036052422,0.00035955646,0.0009982436],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014009903,0.00005264522,0.0011011742,0.00019921147,0.00005053483,0.0005300267,0.00009674446,0.004229507,0.930663,0.0021502594,0.0014283003,0.059358492],"study_design_scores_gemma":[0.000045627585,0.0009146297,0.0037687793,0.00001941487,0.00011804078,0.0021494487,0.000053813732,0.03501584,0.9275862,0.00044878386,0.029827747,0.000051689418],"about_ca_topic_score_codex":0.000054458767,"about_ca_topic_score_gemma":0.000056631598,"teacher_disagreement_score":0.0007901972,"about_ca_system_score_codex":0.00016494462,"about_ca_system_score_gemma":0.00011903857,"threshold_uncertainty_score":0.0026435256},"labels":[],"label_agreement":null},{"id":"W2789915583","doi":"10.1109/tcpmt.2018.2794202","title":"Development of Embedded Redistribution Layer-Based Silicon Interposer for 3-D Integration","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Government of Alberta; CMC Microsystems","keywords":"Materials science; Silicon; Fabrication; Electrical conductor; Redistribution (election); Optoelectronics; Interposer; Contact resistance; Composite material; Nanotechnology; Electronic engineering; Engineering physics; Layer (electronics); Engineering; Etching (microfabrication)","score_opus":0.022604601872157726,"score_gpt":0.24682673645428832,"score_spread":0.22422213458213058,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2789915583","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8644011,0.0022023176,0.12692517,0.00009686603,0.00010668452,0.00012087718,0.0002567758,0.0012209618,0.0046693366],"genre_scores_gemma":[0.885424,0.0010515987,0.11130446,0.000034662226,0.000015987782,0.0000525215,0.00019446797,0.00004736386,0.0018749457],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99992883,0.0000047158005,0.000004322446,0.000017779295,0.000032555967,0.000011824334],"domain_scores_gemma":[0.99992,0.000009678397,0.00002383663,0.000015955062,0.000020845971,0.000009659144],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009370568,0.00023802962,0.00017953226,0.00023949725,0.00007909564,0.00021660727,0.0005029974,0.00030234407,0.00040640956],"category_scores_gemma":[0.00013631773,0.00016328073,0.00022933303,0.000151167,0.0000977813,0.00033182418,0.00019449317,0.0002610748,0.00025102927],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010406548,0.000018623525,0.00018057297,0.000055003413,0.000007999909,0.00008787844,0.000018713023,0.001154409,0.99037045,0.00038316558,0.00007173189,0.0076409844],"study_design_scores_gemma":[0.000009339373,0.00031627747,0.0018305435,0.0000076183373,0.000018831106,0.00028165063,0.00001338541,0.015362712,0.9781763,0.00008510042,0.003883744,0.000014612685],"about_ca_topic_score_codex":0.0003200379,"about_ca_topic_score_gemma":0.0005716395,"teacher_disagreement_score":0.0005029974,"about_ca_system_score_codex":0.0001744851,"about_ca_system_score_gemma":0.00018838386,"threshold_uncertainty_score":0.001359582},"labels":[],"label_agreement":null},{"id":"W2792696860","doi":"10.1109/tcpmt.2018.2810064","title":"A Novel Multifunctional EBG-Based Coupled-Line-Defect Directional Coupler Based on Layered Dielectric Substrates","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ontario Tech University; Innovation, Science and Economic Development Canada; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Power dividers and directional couplers; Coupling (piping); Hybrid coupler; Realization (probability); Topology (electrical circuits); Dielectric; Materials science; Metamaterial; Optoelectronics; Line (geometry); Rat-race coupler; Electronic engineering; Antenna (radio); Physics; Optics; Computer science; Engineering; Telecommunications; Electrical engineering","score_opus":0.014952660739981749,"score_gpt":0.21490234978027387,"score_spread":0.19994968904029212,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2792696860","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8059595,0.001739445,0.18253122,0.00017596604,0.00012486479,0.000093019335,0.00012830243,0.00067491963,0.00857276],"genre_scores_gemma":[0.9097989,0.00053361757,0.08700739,0.00007732917,0.000020927186,0.000043259493,0.000063153115,0.000036652178,0.002418742],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999864,0.000026031963,0.000007473533,0.00003254448,0.00005927574,0.000010623857],"domain_scores_gemma":[0.9998411,0.000021348427,0.000067252884,0.000027535747,0.000028504106,0.000014296178],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019836589,0.00041432757,0.00022176014,0.00021793119,0.00008629492,0.00036071485,0.0004416304,0.00035694905,0.00040926208],"category_scores_gemma":[0.00018961614,0.00017628062,0.00021392755,0.00017126983,0.00017243289,0.00051421864,0.0001783019,0.00021018028,0.000332557],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040397088,0.000029765164,0.00031073808,0.000090865025,0.000019049106,0.00021845772,0.00004094959,0.0021551,0.9876429,0.0022325707,0.00015863578,0.0070606065],"study_design_scores_gemma":[0.000025643487,0.00052885234,0.0012574013,0.00001586432,0.000045024695,0.0012124071,0.00004102478,0.048614934,0.9387141,0.00029527367,0.009215261,0.000034325934],"about_ca_topic_score_codex":0.000099243065,"about_ca_topic_score_gemma":0.0001774251,"teacher_disagreement_score":0.0004416304,"about_ca_system_score_codex":0.00014739057,"about_ca_system_score_gemma":0.00007052431,"threshold_uncertainty_score":0.0013691783},"labels":[],"label_agreement":null},{"id":"W2796049108","doi":"10.1109/tcpmt.2018.2810738","title":"Packaging-Induced Range Tunability of Tactile Sensors for Physiological Signal Monitoring Applications","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; University of Alberta; CMC Microsystems","keywords":"Microelectromechanical systems; Emulation; Tactile sensor; Materials science; Polydimethylsiloxane; SIGNAL (programming language); Pressure sensor; Fabrication; Reusability; Sensitivity (control systems); Electronic engineering; Acoustics; Computer science; Optoelectronics; Mechanical engineering; Nanotechnology; Engineering","score_opus":0.028511548501926304,"score_gpt":0.2564460121458624,"score_spread":0.22793446364393607,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2796049108","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.91448677,0.0031019787,0.078788996,0.000156359,0.00008725692,0.000051568706,0.00009670996,0.00038693318,0.0028435022],"genre_scores_gemma":[0.97286147,0.00063247996,0.025504803,0.00012913736,0.000030326335,0.00003999623,0.00005900724,0.000044251443,0.0006985136],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99982065,0.00003565976,0.000018050921,0.00004424638,0.0000616005,0.000019852265],"domain_scores_gemma":[0.999668,0.00013407174,0.00009502188,0.000046909237,0.000040917894,0.000015179812],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00030366308,0.00035800604,0.00015443345,0.00020196704,0.000090673995,0.00025197523,0.00026043464,0.00032700266,0.0006776778],"category_scores_gemma":[0.0006233515,0.00022290145,0.00019418499,0.00012883563,0.00020249576,0.00042570275,0.000254083,0.00033985768,0.00018804953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000012044292,0.0000074902696,0.00012821994,0.00003060091,0.0000023196737,0.00003352165,0.000020852569,0.00013811135,0.9952667,0.00007010927,0.00002101175,0.004268868],"study_design_scores_gemma":[0.000003065142,0.00017967424,0.0028930525,0.000004467528,0.000009187584,0.00021766807,0.000015936808,0.0015213937,0.9940978,0.000053211836,0.000997574,0.0000069236276],"about_ca_topic_score_codex":0.000026725867,"about_ca_topic_score_gemma":0.00006883215,"teacher_disagreement_score":0.0006776778,"about_ca_system_score_codex":0.00006908427,"about_ca_system_score_gemma":0.00005424967,"threshold_uncertainty_score":0.0022670627},"labels":[],"label_agreement":null},{"id":"W2803611450","doi":"10.1109/tcpmt.2018.2834730","title":"Wideband and Ultrawideband Phase Shifter Designs Based on Low-Pass/Bandpass/High-Pass Networks","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Alberta Innovates - Technology Futures","keywords":"Band-pass filter; Phase shift module; Wideband; Microstrip; Passband; Inductor; Capacitor; Electronic engineering; Phase (matter); Insertion loss; Electrical engineering; Engineering; Physics; Computer science; Materials science; Voltage","score_opus":0.010942489982687214,"score_gpt":0.21671775863847267,"score_spread":0.20577526865578546,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2803611450","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.16507922,0.0017302636,0.82237,0.00016048331,0.000111781184,0.00009103247,0.00006957976,0.0010032149,0.00938435],"genre_scores_gemma":[0.59839296,0.0011303073,0.39251906,0.0001623428,0.00011461755,0.000118195465,0.00012481037,0.00008537268,0.0073523074],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99980754,0.00003056513,0.000011309087,0.0000632475,0.00006733342,0.000020053934],"domain_scores_gemma":[0.9998147,0.00003830749,0.000063328705,0.000023525326,0.00004834243,0.000011801626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024400283,0.00035943446,0.00023032392,0.00028545642,0.00015885677,0.00040529147,0.00060132163,0.0004099712,0.0011530261],"category_scores_gemma":[0.00028568867,0.00024030628,0.00020746292,0.00016036483,0.0002099952,0.00062319817,0.00023187537,0.00034565467,0.00062684447],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000088554065,0.000030258549,0.00022557609,0.000095207266,0.000024016605,0.000058707094,0.00005621055,0.0021241477,0.94783574,0.007036341,0.00029737505,0.042127695],"study_design_scores_gemma":[0.000074183416,0.0007540062,0.0012814538,0.000029701408,0.00008464509,0.0008262609,0.00003912425,0.039979044,0.921581,0.0018316195,0.033480458,0.000038677365],"about_ca_topic_score_codex":0.000109020555,"about_ca_topic_score_gemma":0.00034467684,"teacher_disagreement_score":0.0011530261,"about_ca_system_score_codex":0.00026830143,"about_ca_system_score_gemma":0.00013704668,"threshold_uncertainty_score":0.003857255},"labels":[],"label_agreement":null},{"id":"W2811169180","doi":"10.1109/tcpmt.2018.2845847","title":"Printing Green Nanomaterials for Organic Electronics","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Guelph","funders":"Ontario Ministry of Agriculture, Food and Rural Affairs","keywords":"Printed electronics; Materials science; Nanotechnology; Nanomaterials; Electronics; Context (archaeology); Nanocellulose; Inkwell; Electrical conductor; Organic electronics; Fabrication; Conductive ink; Substrate (aquarium); Electrical engineering; Sheet resistance; Engineering; Composite material; Transistor; Cellulose; Chemical engineering","score_opus":0.012450220967350802,"score_gpt":0.2180858767042127,"score_spread":0.2056356557368619,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2811169180","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.35609585,0.10176431,0.3703774,0.0032584907,0.00459332,0.00026443775,0.0010067736,0.004324471,0.15831499],"genre_scores_gemma":[0.6750609,0.04667044,0.22580957,0.0014141869,0.0004772935,0.00017256885,0.00061524275,0.00052746723,0.049252275],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997836,0.000018421786,0.00000907402,0.00003816096,0.0001310572,0.00001968771],"domain_scores_gemma":[0.99988115,0.000043769716,0.000020151156,0.000019703511,0.000025260608,0.000009986454],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016661067,0.00039377448,0.00026766933,0.0004542187,0.00033395053,0.0006798591,0.00033851506,0.0006238186,0.0030222407],"category_scores_gemma":[0.00034540563,0.00017149746,0.00032962655,0.00042039464,0.00030297515,0.000771065,0.0005890881,0.00065038406,0.0019918196],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026769041,0.00003009004,0.00017927625,0.0004265148,0.000015622509,0.0002691748,0.00006260265,0.0010505175,0.89374506,0.010679318,0.0023685137,0.091146484],"study_design_scores_gemma":[0.000005611188,0.000070326154,0.00025301712,0.000028920706,0.000011409071,0.0002790141,0.000027827522,0.0019226553,0.93628424,0.0031080681,0.05799415,0.0000147527235],"about_ca_topic_score_codex":0.00010052125,"about_ca_topic_score_gemma":0.0003134589,"teacher_disagreement_score":0.0030222407,"about_ca_system_score_codex":0.00030109304,"about_ca_system_score_gemma":0.00015581053,"threshold_uncertainty_score":0.010110438},"labels":[],"label_agreement":null},{"id":"W2865059223","doi":"10.1109/tcpmt.2018.2853595","title":"Monolithic IPD-MEMS Technology and Its Applications to High-&lt;inline-formula&gt; &lt;tex-math notation=\"LaTeX\"&gt;$Q$ &lt;/tex-math&gt; &lt;/inline-formula&gt; Switched Capacitor Banks and Variable True-Time-Delay Networks","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Varicap; Microelectromechanical systems; Variable capacitor; Capacitance; Capacitor; Insertion loss; Materials science; Resolution (logic); Electronic engineering; Optoelectronics; Electrical engineering; Computer science; Physics; Voltage; Engineering","score_opus":0.009933917521419438,"score_gpt":0.21235573053359827,"score_spread":0.20242181301217882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2865059223","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3384463,0.011744544,0.615234,0.0011797956,0.0005488297,0.00013166749,0.00064634025,0.0017445597,0.030324014],"genre_scores_gemma":[0.7945542,0.003155714,0.19637047,0.00014369305,0.00014303622,0.00006776706,0.0002559271,0.00006511348,0.0052442118],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998549,0.0000132441855,0.000007226861,0.000034856897,0.00007168122,0.000018063422],"domain_scores_gemma":[0.9998659,0.000034998247,0.000029267683,0.000026467287,0.00003511921,0.000008084393],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00021410729,0.0003050568,0.00015919884,0.00021104499,0.00016536572,0.00067751284,0.0007212087,0.0004180745,0.0014526111],"category_scores_gemma":[0.00027222701,0.00024996145,0.00017461741,0.0004790483,0.0002992512,0.0006760793,0.00025456917,0.00038489705,0.0005000858],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004022035,0.000022829523,0.00045614698,0.00016901101,0.00001058389,0.00013671952,0.000036910096,0.0017051131,0.9620321,0.008107904,0.00057535525,0.026707206],"study_design_scores_gemma":[0.000034256616,0.00035563798,0.003526783,0.000025173707,0.000042396026,0.00094687444,0.0000440419,0.049810577,0.9158207,0.0023741284,0.026990565,0.00002887917],"about_ca_topic_score_codex":0.00033145712,"about_ca_topic_score_gemma":0.00061002286,"teacher_disagreement_score":0.0014526111,"about_ca_system_score_codex":0.0005373345,"about_ca_system_score_gemma":0.00030335638,"threshold_uncertainty_score":0.004859507},"labels":[],"label_agreement":null},{"id":"W2886017228","doi":"10.1109/tcpmt.2018.2864595","title":"Performance and Diagnosis of Aluminum Connectors Tested Inside MV Cable Splices","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electrical Contact Performance and Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hydro-Québec","funders":"","keywords":"Cable gland; Cable harness; Shielded cable; Overheating (electricity); Engineering; Overhead (engineering); Electrical conductor; Electrical engineering; Reliability engineering; Structural engineering; Computer science","score_opus":0.010272252309606753,"score_gpt":0.20671210143258942,"score_spread":0.19643984912298268,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2886017228","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9908285,0.0003738721,0.007923354,0.000018649846,0.00004046529,0.000025722235,0.000084078405,0.00020431647,0.00050092995],"genre_scores_gemma":[0.9964114,0.00014298463,0.0027739462,0.000012393698,0.000009642331,0.000009597607,0.0001018897,0.000025511346,0.0005126276],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987967,0.00022290956,0.00009535492,0.00021936579,0.0005231678,0.00014242354],"domain_scores_gemma":[0.9982514,0.00040977486,0.00033501096,0.00019418028,0.00069577136,0.0001138435],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008083616,0.000805004,0.0003983372,0.0017927071,0.00031789712,0.00039556352,0.0006388915,0.0008867786,0.0011925153],"category_scores_gemma":[0.0022106995,0.00022364143,0.00036832585,0.0006995015,0.00055873016,0.000528826,0.00042977574,0.00032424444,0.0004934629],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004859614,0.00007433721,0.016261812,0.00009499544,0.00001662875,0.000733621,0.0005277293,0.001058415,0.9691112,0.00013894615,0.00013224744,0.011364186],"study_design_scores_gemma":[0.00001545851,0.0026380413,0.045854874,0.000023509767,0.000069318914,0.0013041287,0.00060683885,0.007886218,0.9403291,0.0000859063,0.0011524481,0.000034264725],"about_ca_topic_score_codex":0.0005198878,"about_ca_topic_score_gemma":0.000929939,"teacher_disagreement_score":0.0017927071,"about_ca_system_score_codex":0.00023761173,"about_ca_system_score_gemma":0.00014417048,"threshold_uncertainty_score":0.0042750835},"labels":[],"label_agreement":null},{"id":"W2886415527","doi":"10.1109/tcpmt.2018.2864171","title":"Optimization of Thermoelectric Generators in the Presence of Heat Losses and Fluid Flows","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Thermoelectric Materials and Devices","field":"Materials Science","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Outaouais","funders":"Natural Sciences and Engineering Research Council of Canada; Agence Nationale de la Recherche","keywords":"Thermoelectric effect; Materials science; Thermoelectric generator; Mechanics; Nuclear engineering; Environmental science; Thermodynamics; Physics; Engineering","score_opus":0.011543083501261198,"score_gpt":0.23313539967335387,"score_spread":0.22159231617209266,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2886415527","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.22327194,0.0017722159,0.7513929,0.00040325522,0.0000825286,0.00015354074,0.0001163994,0.00027426102,0.022533003],"genre_scores_gemma":[0.9541117,0.0006178785,0.040345624,0.000029707533,0.000024050622,0.00013190757,0.000052535695,0.0001275637,0.004559132],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99968207,0.0001181333,0.000010444588,0.0000511142,0.00009258587,0.000045633355],"domain_scores_gemma":[0.99959224,0.0002770981,0.000048227612,0.00001985731,0.0000450931,0.000017529163],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00074752094,0.0011588958,0.0011444488,0.00043169878,0.0003057005,0.0012078874,0.0005599847,0.00087328703,0.0013872015],"category_scores_gemma":[0.0016312405,0.00058687356,0.00045979215,0.0004494842,0.00065491005,0.0010222392,0.00056342396,0.0006163348,0.00030968589],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007923132,0.000028631363,0.00020768656,0.00009049666,0.000018755323,0.00007578201,0.000028530783,0.9770552,0.007340909,0.0039807004,0.00017969421,0.010914482],"study_design_scores_gemma":[0.000015793408,0.00008678004,0.00021421786,0.0000078546245,0.000012377369,0.000025181273,0.000017709113,0.9933142,0.0031743925,0.0023770407,0.00074653985,0.000007921221],"about_ca_topic_score_codex":0.00049281516,"about_ca_topic_score_gemma":0.00077568326,"teacher_disagreement_score":0.0013872015,"about_ca_system_score_codex":0.000610448,"about_ca_system_score_gemma":0.0005630192,"threshold_uncertainty_score":0.0046406984},"labels":[],"label_agreement":null},{"id":"W2895849029","doi":"10.1109/tcpmt.2018.2874241","title":"Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Heat Transfer and Optimization","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; Centre National de la Recherche Scientifique; Agence Nationale de la Recherche","keywords":"Microelectronics; Microchannel; Chip; Materials science; Heat flux; Volumetric flow rate; Mechanical engineering; Electrical engineering; Optoelectronics; Nanotechnology; Heat transfer; Mechanics; Physics; Engineering","score_opus":0.011601437105354847,"score_gpt":0.227324454912768,"score_spread":0.21572301780741315,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2895849029","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8509504,0.0045408,0.13187434,0.00036584833,0.0006776969,0.00029533615,0.00036616178,0.002217919,0.008711499],"genre_scores_gemma":[0.8977506,0.00084760576,0.095407784,0.00012099381,0.00009811833,0.00017442543,0.00012513815,0.00017488013,0.005300437],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99976367,0.000024841265,0.000010408072,0.00006529777,0.00010095573,0.000034920857],"domain_scores_gemma":[0.9996635,0.000079866586,0.00008675275,0.00007662762,0.000066998335,0.000026345946],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019588639,0.00039887626,0.00032513254,0.0002137858,0.00022116657,0.0003505714,0.0006480665,0.00031651655,0.0016619365],"category_scores_gemma":[0.00041327334,0.00016882508,0.00018835584,0.00013572407,0.00031423898,0.00051131565,0.00037659195,0.00032543708,0.00038706025],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006627027,0.00004098644,0.00023942694,0.00012804045,0.000008535968,0.000053057796,0.00005963299,0.00058886077,0.9879699,0.0010085434,0.00034395835,0.009492762],"study_design_scores_gemma":[0.000011847934,0.00022519921,0.001175546,0.000008341455,0.000014455208,0.00013177235,0.000017596825,0.00448155,0.9843614,0.00009564834,0.009461244,0.000015456686],"about_ca_topic_score_codex":0.0002722579,"about_ca_topic_score_gemma":0.0007640903,"teacher_disagreement_score":0.0016619365,"about_ca_system_score_codex":0.00034548336,"about_ca_system_score_gemma":0.00022509848,"threshold_uncertainty_score":0.005559683},"labels":[],"label_agreement":null},{"id":"W2898179347","doi":"10.1109/tcpmt.2018.2878104","title":"Effective Method for Wire Bonds Rework Using Conductive Epoxy","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Metallurgy and Material Forming","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"MiQro Innovation Collaborative Centre","funders":"","keywords":"Rework; Epoxy; Electrical conductor; Bond; Materials science; Wire bonding; Composite material; Adhesive; Computer science; Electrical engineering; Engineering; Business; Embedded system","score_opus":0.019184495446056493,"score_gpt":0.2698595320670436,"score_spread":0.2506750366209871,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2898179347","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4947565,0.008127841,0.4837696,0.0002800466,0.0009387658,0.00065880007,0.0002958247,0.0030513576,0.008121332],"genre_scores_gemma":[0.6830662,0.0036732093,0.29990423,0.0002505966,0.00012533601,0.0005774112,0.00048390857,0.0007346026,0.0111845685],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99873453,0.00012488752,0.00011549602,0.00035646613,0.0005636317,0.00010500889],"domain_scores_gemma":[0.99889624,0.00022594133,0.00025614744,0.00034775917,0.0002211716,0.000052731477],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007522169,0.0010045312,0.00043903888,0.0010662931,0.000300803,0.00041073165,0.00060789974,0.0005906364,0.0015803598],"category_scores_gemma":[0.0011078507,0.00056132436,0.00039337736,0.00036818135,0.00037636168,0.00060676754,0.00059532956,0.0013701537,0.0013198641],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000022705506,0.0000347522,0.00025313825,0.00018196525,0.000014692794,0.00022645465,0.00009335332,0.00024156926,0.9824111,0.0003003403,0.0003344682,0.015885388],"study_design_scores_gemma":[0.000007611614,0.0002623391,0.0013877109,0.000022013239,0.00002355261,0.00077487156,0.000047325208,0.0009550614,0.98866546,0.00009552044,0.0077431863,0.000015319327],"about_ca_topic_score_codex":0.000119663826,"about_ca_topic_score_gemma":0.00036107766,"teacher_disagreement_score":0.0015803598,"about_ca_system_score_codex":0.0001460375,"about_ca_system_score_gemma":0.00016426016,"threshold_uncertainty_score":0.005286813},"labels":[],"label_agreement":null},{"id":"W2900427238","doi":"10.1109/tcpmt.2018.2879447","title":"Conductive Polymer Metallized Vias: A New Approach for Substrate Integrated Waveguide Development","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada; Government of Alberta","keywords":"Materials science; Electrical conductor; Resonator; Optoelectronics; Microwave; Substrate (aquarium); Dielectric; Extremely high frequency; Electronic engineering; Composite material; Computer science; Telecommunications; Engineering","score_opus":0.024648807629364947,"score_gpt":0.22969094338865803,"score_spread":0.2050421357592931,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2900427238","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.53908265,0.0054708724,0.4358502,0.00031511698,0.00030747624,0.0002472813,0.00020337847,0.0022358107,0.016287183],"genre_scores_gemma":[0.77162874,0.0032465048,0.2187884,0.000068247726,0.000055662556,0.00010959024,0.00016676701,0.00015177968,0.0057843705],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99984777,0.000014240919,0.000009172479,0.000037072165,0.000073121395,0.000018635796],"domain_scores_gemma":[0.99989855,0.000011345129,0.00003886639,0.000022622833,0.000016896505,0.000011735027],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012969351,0.00049900444,0.00018862166,0.00035487927,0.00010641507,0.0004395028,0.00034614236,0.00028716002,0.00047725544],"category_scores_gemma":[0.00021140873,0.0002345031,0.00020280143,0.00021108381,0.0002295089,0.00048108213,0.00031559783,0.00037545757,0.0003893796],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000110402525,0.000012001419,0.0001657848,0.000064173844,0.000004687957,0.00011155939,0.000036807087,0.00030727367,0.98549855,0.0012056265,0.00010730005,0.012475142],"study_design_scores_gemma":[0.0000064746023,0.00029653887,0.0006747157,0.000010287704,0.000013660223,0.00078387273,0.000018315084,0.0034793066,0.9792479,0.00025869513,0.015198524,0.000011786589],"about_ca_topic_score_codex":0.00009640034,"about_ca_topic_score_gemma":0.00018341624,"teacher_disagreement_score":0.00049900444,"about_ca_system_score_codex":0.00013594945,"about_ca_system_score_gemma":0.00018922404,"threshold_uncertainty_score":0.00159657},"labels":[],"label_agreement":null},{"id":"W2954420206","doi":"10.1109/tcpmt.2019.2926652","title":"Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications","year":2019,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":24,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec à Montréal; École de Technologie Supérieure","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; CMC Microsystems","keywords":"Monolithic microwave integrated circuit; Printed circuit board; Fabrication; Printed electronics; Materials science; Microstrip; Microwave; Transmission line; Electric power transmission; Electronic packaging; Integrated circuit packaging; Electronic circuit; Optoelectronics; Integrated circuit; Electronics; Electrical engineering; Amplifier; Engineering; Telecommunications; CMOS","score_opus":0.011260950484274966,"score_gpt":0.2191264273741032,"score_spread":0.20786547688982823,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2954420206","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6273413,0.009400597,0.32802054,0.00060641265,0.00080750254,0.00014456744,0.00049768697,0.004137734,0.029043581],"genre_scores_gemma":[0.87240124,0.0023748404,0.11330796,0.00021563696,0.00019107928,0.000082154664,0.0002444834,0.00025686523,0.010925792],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997453,0.00003056375,0.000013991424,0.000041591957,0.00015217057,0.000016359192],"domain_scores_gemma":[0.9997485,0.00007257187,0.000077637145,0.000043270713,0.000045255554,0.000012734129],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017452604,0.00041626944,0.00018989314,0.00026858348,0.0001334115,0.00045950778,0.0005450298,0.0004279251,0.0023476747],"category_scores_gemma":[0.00037422616,0.00018970149,0.00025346648,0.00024812954,0.0001519526,0.0004565241,0.0002923902,0.0005236454,0.0015701827],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020898518,0.000023264742,0.00016564719,0.00011370583,0.000006223679,0.00012273538,0.000022290766,0.00035635033,0.9763507,0.0003578928,0.0004213482,0.022038888],"study_design_scores_gemma":[0.000008313512,0.00019124598,0.0005222402,0.0000071228146,0.000011570657,0.00029815006,0.000009924033,0.0028702072,0.98708993,0.000108152024,0.008875937,0.0000072085836],"about_ca_topic_score_codex":0.0000619198,"about_ca_topic_score_gemma":0.0001871273,"teacher_disagreement_score":0.0023476747,"about_ca_system_score_codex":0.00017760164,"about_ca_system_score_gemma":0.000086967775,"threshold_uncertainty_score":0.007853746},"labels":[],"label_agreement":null},{"id":"W2968776414","doi":"10.1109/tcpmt.2019.2933799","title":"Efficient Time-Domain Sensitivity Analysis of Active Networks","year":2019,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Model Reduction and Neural Networks","field":"Physics and Astronomy","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Sensitivity (control systems); Passivity; Control theory (sociology); Electronic circuit; Stability (learning theory); Differential equation; Mathematics; Set (abstract data type); Computer science; Reduction (mathematics); Topology (electrical circuits); Electronic engineering; Engineering; Mathematical analysis; Geometry; Control (management)","score_opus":0.007074915077901801,"score_gpt":0.2152688092502481,"score_spread":0.2081938941723463,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2968776414","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.018639663,0.00012668238,0.9778546,0.000066957764,0.000010084998,0.00002320936,0.00004337986,0.00019883935,0.003036552],"genre_scores_gemma":[0.8863326,0.0002976848,0.10859267,0.00005809085,0.000027531973,0.00013068199,0.0001479796,0.00013437535,0.0042783725],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.999796,0.00007583049,0.000006524444,0.000030035892,0.00006967316,0.000021856913],"domain_scores_gemma":[0.9994943,0.00037616803,0.000029241466,0.00002886336,0.00006172403,0.000009761728],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00057793304,0.000697127,0.00049147796,0.0005064681,0.00024241653,0.0006248754,0.00053585845,0.0004606742,0.0021562788],"category_scores_gemma":[0.0014026887,0.0003502317,0.0005997399,0.00020581068,0.00047245863,0.00058826694,0.0005591164,0.0006728352,0.00023017226],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023857703,0.00001304736,0.00013708476,0.000045254972,0.000024190922,0.000044587956,0.000031794665,0.96015906,0.006683645,0.017891409,0.00021251084,0.014733539],"study_design_scores_gemma":[7.7591096e-7,0.0000029623848,0.000020779242,0.0000013776513,0.0000016760747,0.000003662588,0.0000015854749,0.99649966,0.0005922572,0.0027289586,0.00014514892,0.0000011985496],"about_ca_topic_score_codex":0.0016996098,"about_ca_topic_score_gemma":0.0015949946,"teacher_disagreement_score":0.0021562788,"about_ca_system_score_codex":0.0006253267,"about_ca_system_score_gemma":0.0004391979,"threshold_uncertainty_score":0.0072134733},"labels":[],"label_agreement":null},{"id":"W2981871387","doi":"10.1109/tcpmt.2019.2948802","title":"A Novel Framework for Parametric Loewner Matrix Interpolation","year":2019,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Acoustic Wave Phenomena Research","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Interpolation (computer graphics); Computer science; Singular value decomposition; Parametric statistics; Algorithm; Embedding; Mathematical optimization; Mathematics; Artificial intelligence","score_opus":0.018523861978180636,"score_gpt":0.2639955658914026,"score_spread":0.24547170391322198,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2981871387","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0006763473,0.000038795584,0.9976725,0.000021449243,0.000013294978,0.000008419959,0.000022745427,0.00012530046,0.0014211739],"genre_scores_gemma":[0.14393416,0.00047908083,0.84683377,0.00012531596,0.00012793332,0.00017389523,0.00035904738,0.000486381,0.0074804216],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.99915373,0.00023583352,0.000039351642,0.00014810478,0.00035404862,0.00006899379],"domain_scores_gemma":[0.9994449,0.00019737118,0.000056119185,0.00015502365,0.000117091666,0.000029509934],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0012667702,0.0009215166,0.0006917801,0.0009729596,0.0005479619,0.0011963026,0.0016477172,0.00095170515,0.0045739166],"category_scores_gemma":[0.0027384926,0.00040363715,0.0010839398,0.0010531448,0.0009877726,0.0017797542,0.001570674,0.0018540298,0.0016209132],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":"theoretical_or_conceptual","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000059356305,0.000049917187,0.00026379636,0.00011268382,0.0000293307,0.000121804005,0.00014740395,0.25404397,0.0138169,0.6302932,0.002002101,0.09905957],"study_design_scores_gemma":[0.000006947183,0.00004259405,0.00007119806,0.00001612801,0.0000083178375,0.00009269176,0.00001626244,0.86589277,0.0036445616,0.11424405,0.01594147,0.000022979168],"about_ca_topic_score_codex":0.0012860321,"about_ca_topic_score_gemma":0.0014422841,"teacher_disagreement_score":0.0045739166,"about_ca_system_score_codex":0.00057585904,"about_ca_system_score_gemma":0.0008759158,"threshold_uncertainty_score":0.015301287},"labels":[],"label_agreement":null},{"id":"W3010531757","doi":"10.1109/tcpmt.2020.2978432","title":"A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Bumping; Plating (geology); Materials science; Intermetallic; Electroplating; Flip chip; Metallurgy; Alloy; Layer (electronics); Composite material; Mechanical engineering; Engineering; Physics","score_opus":0.027156507840776646,"score_gpt":0.2559434605735102,"score_spread":0.22878695273273356,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3010531757","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98920023,0.0016789335,0.006885189,0.000054387925,0.000049078917,0.000065549204,0.00015985378,0.0001414269,0.0017653815],"genre_scores_gemma":[0.9832266,0.0011266497,0.013418372,0.000023128243,0.000018598303,0.000037043865,0.00016646602,0.000043246473,0.0019398062],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996482,0.000024479865,0.0000166801,0.00009661663,0.00017813397,0.000035824884],"domain_scores_gemma":[0.9995746,0.00010826112,0.00010041319,0.000060416463,0.0001371002,0.000019173844],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00018522415,0.00037087596,0.0003810125,0.00025114656,0.00018663141,0.00030409274,0.00039375047,0.0003748101,0.00096899923],"category_scores_gemma":[0.0008308704,0.00021584732,0.00020758717,0.000518575,0.00014764829,0.00035311832,0.00010268571,0.00028154807,0.00031271717],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000111441266,0.00006318152,0.0007610756,0.00020413887,0.000014174193,0.000105266845,0.000036494683,0.0007432405,0.9860015,0.000117630356,0.00010598587,0.01173583],"study_design_scores_gemma":[0.000010751018,0.0010965593,0.006814964,0.000008051187,0.000033531585,0.00020582785,0.00003555347,0.0069987243,0.9827139,0.000038275066,0.0020344404,0.000009443029],"about_ca_topic_score_codex":0.0010113564,"about_ca_topic_score_gemma":0.0016154189,"teacher_disagreement_score":0.0010113564,"about_ca_system_score_codex":0.00033938687,"about_ca_system_score_gemma":0.00021839402,"threshold_uncertainty_score":0.0032415986},"labels":[],"label_agreement":null},{"id":"W3037019054","doi":"10.1109/tcpmt.2020.3004414","title":"A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Low-power high-performance VLSI design","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Science and Engineering Research Board","keywords":"Interconnection; Reliability (semiconductor); Spice; Electronic engineering; Parametric statistics; Dielectric; Materials science; Signal integrity; Computer science; Optoelectronics; Mathematics; Engineering; Physics; Telecommunications","score_opus":0.01525755405643463,"score_gpt":0.2380177270313511,"score_spread":0.22276017297491646,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3037019054","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.039305575,0.00053535413,0.95078784,0.00021460134,0.000057872363,0.000046429428,0.000103299586,0.00046637942,0.00848274],"genre_scores_gemma":[0.9196088,0.00060639787,0.06951867,0.00010206006,0.00003732054,0.000111261186,0.000108724875,0.00011603698,0.009790803],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9997532,0.00007874649,0.000006909989,0.00003649995,0.00009448371,0.000030161362],"domain_scores_gemma":[0.9997267,0.00011197175,0.000039650873,0.000040683477,0.00006952669,0.00001149403],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037707423,0.00057597156,0.0005288924,0.00035081565,0.0002865351,0.0006486712,0.0011617518,0.0011668424,0.0011394868],"category_scores_gemma":[0.0009817516,0.0002878477,0.0006530916,0.00034319906,0.0005539123,0.0009657288,0.00033316948,0.00073282875,0.00042263273],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019764497,0.000013784795,0.00009947179,0.000025062438,0.000012524797,0.000069311885,0.000030521485,0.9780075,0.0064906604,0.012043953,0.0002351711,0.002952252],"study_design_scores_gemma":[8.283992e-7,0.0000055641053,0.000018652116,9.170628e-7,0.0000019094193,0.0000069693206,0.0000019616689,0.99906415,0.00022766308,0.00054739724,0.00012236247,0.000001725301],"about_ca_topic_score_codex":0.0046786196,"about_ca_topic_score_gemma":0.0034049868,"teacher_disagreement_score":0.0046786196,"about_ca_system_score_codex":0.0007644603,"about_ca_system_score_gemma":0.0005213808,"threshold_uncertainty_score":0.009302735},"labels":[],"label_agreement":null},{"id":"W3037430656","doi":"10.1109/tcpmt.2020.3004569","title":"GVF: GPU-Based Vector Fitting for Modeling of Multiport Tabulated Data Networks","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Lightning and Electromagnetic Phenomena","field":"Physics and Astronomy","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"","keywords":"Speedup; Computer science; Exploit; Parallel computing; Identification (biology); Massively parallel; Computational science; Computer engineering","score_opus":0.03319171933836478,"score_gpt":0.24279026743404253,"score_spread":0.20959854809567774,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3037430656","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.009606596,0.00014439732,0.9844311,0.000099975325,0.000053792664,0.00003058158,0.00012993212,0.0028752433,0.0026283355],"genre_scores_gemma":[0.4157016,0.00032586147,0.573045,0.00012960736,0.000049382834,0.00020554345,0.0006953803,0.0018721549,0.007975533],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998666,0.000033878263,0.000004916345,0.000017805576,0.000058960508,0.000017757215],"domain_scores_gemma":[0.99974245,0.00009450703,0.000025117619,0.00003907199,0.0000805949,0.00001822488],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003352948,0.0007148975,0.00044731627,0.0004709519,0.00035701777,0.00063486386,0.001201984,0.000820306,0.0054923235],"category_scores_gemma":[0.0013885987,0.0003020211,0.00047426982,0.0006198206,0.0003179359,0.00087147526,0.00044577112,0.0007790735,0.0010991932],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000059597554,0.00003815557,0.0010390624,0.00007827663,0.000031136828,0.00011003899,0.00010654945,0.9030077,0.0050504096,0.015666492,0.0054759625,0.0693367],"study_design_scores_gemma":[0.0000024286296,0.000003889112,0.000029309384,0.0000024920769,7.923577e-7,0.000008443509,0.0000046872697,0.99703014,0.00054754707,0.00095897424,0.0014091546,0.0000021510575],"about_ca_topic_score_codex":0.0071824086,"about_ca_topic_score_gemma":0.0068828943,"teacher_disagreement_score":0.0071824086,"about_ca_system_score_codex":0.00054201187,"about_ca_system_score_gemma":0.0009851486,"threshold_uncertainty_score":0.018373668},"labels":[],"label_agreement":null},{"id":"W3087811192","doi":"10.1109/tcpmt.2020.3025186","title":"Aerosol Jet Printed, Microwave Microstrip Ring Resonators for System-In-Package Applications","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec à Montréal; École de Technologie Supérieure","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Resonator; Microstrip; Insertion loss; Materials science; Microwave; Fabrication; System in package; Bandwidth (computing); Optoelectronics; Split-ring resonator; Electronic engineering; Electrical engineering; Computer science; Telecommunications; Engineering","score_opus":0.012994298202696805,"score_gpt":0.21030539085690106,"score_spread":0.19731109265420427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3087811192","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4844517,0.00071185455,0.49999636,0.00015299536,0.00018473761,0.00012529235,0.00029624067,0.0038439522,0.010236818],"genre_scores_gemma":[0.84674263,0.00042553528,0.1487678,0.000035468624,0.00003104913,0.00005586462,0.00013322031,0.0002802773,0.003528171],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99979526,0.000031091353,0.000007851115,0.0000271931,0.00012102622,0.000017618238],"domain_scores_gemma":[0.9997526,0.00010788663,0.000045565903,0.00004322659,0.000042417934,0.000008365509],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028146646,0.00039043374,0.00030476085,0.00009434019,0.00015303747,0.00044024922,0.00062431407,0.00033506955,0.002258595],"category_scores_gemma":[0.00054758735,0.0002671171,0.00046985532,0.00009790054,0.00016384547,0.00033787632,0.00016116793,0.00025927465,0.00069769024],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020875414,0.00013962021,0.002069974,0.00059830147,0.0001268643,0.00058889674,0.000175123,0.2326072,0.71392566,0.0016955107,0.0016293839,0.046234686],"study_design_scores_gemma":[0.00009531835,0.0009542945,0.001929396,0.000013452345,0.0001149478,0.00036822923,0.00003469778,0.49332663,0.49297673,0.000459739,0.009698777,0.000027788708],"about_ca_topic_score_codex":0.00036483744,"about_ca_topic_score_gemma":0.00077805563,"teacher_disagreement_score":0.002258595,"about_ca_system_score_codex":0.0002527987,"about_ca_system_score_gemma":0.00023076795,"threshold_uncertainty_score":0.007555783},"labels":[],"label_agreement":null},{"id":"W3131909957","doi":"10.1109/tcpmt.2021.3060968","title":"Contact Resistance Behavior of Land Grid Array Sockets at Cryogenic Temperatures Required for Quantum Measurements","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microelectronics; Interconnection; Materials science; Contact resistance; Cryogenics; Elastomer; Optoelectronics; Composite material; Computer science; Physics; Telecommunications","score_opus":0.02696635579449528,"score_gpt":0.2409941907954504,"score_spread":0.21402783500095512,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3131909957","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9942173,0.00017984086,0.004736145,0.000039729883,0.000025686988,0.000015157072,0.00017813784,0.00019327865,0.0004146599],"genre_scores_gemma":[0.99666923,0.000098935525,0.002483539,0.000012326712,0.000005568938,0.000017574226,0.000114888666,0.000046627127,0.0005513265],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99912614,0.00014587776,0.00005323551,0.00017012148,0.00038850555,0.0001161281],"domain_scores_gemma":[0.998659,0.00027311774,0.00034096476,0.00030250728,0.00033963838,0.0000847478],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006928167,0.00024642685,0.0004154494,0.00037963258,0.00035223825,0.0006066051,0.00035586685,0.00039769692,0.0012242711],"category_scores_gemma":[0.0018808731,0.00021299151,0.00021968721,0.0005166792,0.00063450506,0.0008298877,0.0005305773,0.00037077206,0.00043805892],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021108278,0.000027337497,0.0032032377,0.00009694647,0.00000955834,0.00029086284,0.0004570729,0.0006386707,0.9890894,0.00033637564,0.00022923354,0.005410237],"study_design_scores_gemma":[0.000020247926,0.00119642,0.017222721,0.0000149661355,0.00001956869,0.0004744248,0.00036561358,0.0052436623,0.97312486,0.00018685375,0.0021056398,0.000024908106],"about_ca_topic_score_codex":0.00034835143,"about_ca_topic_score_gemma":0.000595257,"teacher_disagreement_score":0.0012242711,"about_ca_system_score_codex":0.00033351398,"about_ca_system_score_gemma":0.00019954487,"threshold_uncertainty_score":0.004095614},"labels":[],"label_agreement":null},{"id":"W3138609293","doi":"10.1109/tcpmt.2021.3065579","title":"A Novel Chip-Join Assembly Using Heterogeneous Sn-Ag Bumps","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electromigration; Materials science; Soldering; Flip chip; Electroplating; Thermal copper pillar bump; Fabrication; Layer (electronics); Diffusion barrier; Chip; Optoelectronics; Composite material; Computer science; Adhesive","score_opus":0.022282950590582,"score_gpt":0.23177969769176784,"score_spread":0.20949674710118585,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3138609293","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.76933795,0.0011480993,0.21943234,0.00008692684,0.00021706369,0.0002782638,0.00025681793,0.0027246627,0.006517928],"genre_scores_gemma":[0.83736527,0.00022981044,0.15778133,0.000043667806,0.000046060813,0.00010436056,0.00022389994,0.00013714588,0.0040685683],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997296,0.00001565211,0.000012645062,0.00010006842,0.000098040684,0.00004402815],"domain_scores_gemma":[0.9998227,0.000022413078,0.000044289744,0.000043212145,0.00004002623,0.000027301892],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014263396,0.00054520566,0.00032450762,0.0003770379,0.0003478152,0.00039602476,0.0008133403,0.00047769767,0.00094983587],"category_scores_gemma":[0.00023189085,0.0003681963,0.00022169502,0.00023418562,0.00019155347,0.00051629025,0.00044150453,0.0003735794,0.00070534035],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000481436,0.00003888079,0.00036590148,0.00007744317,0.000013254486,0.00028289197,0.000052475876,0.0008359304,0.98766845,0.00047186692,0.0001867745,0.0099578975],"study_design_scores_gemma":[0.000017346236,0.0006589825,0.0027355815,0.0000070663446,0.0000332059,0.0005443888,0.000030484674,0.011842279,0.97367406,0.00016344532,0.010275871,0.000017368202],"about_ca_topic_score_codex":0.00021011475,"about_ca_topic_score_gemma":0.0006142679,"teacher_disagreement_score":0.00094983587,"about_ca_system_score_codex":0.00016542042,"about_ca_system_score_gemma":0.00017150301,"threshold_uncertainty_score":0.0031775236},"labels":[],"label_agreement":null},{"id":"W3148216306","doi":"10.1109/tcpmt.2021.3071063","title":"Fast and Stable Time-Domain Simulation Based on Modified Numerical Inversion of the Laplace Transform","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Ottawa; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Laplace transform; Inversion (geology); Time domain; Laplace transform applied to differential equations; Post's inversion formula; Computer science; Algorithm; Laplace–Stieltjes transform; Mellin transform; Inverse Laplace transform; Two-sided Laplace transform; Computer simulation; Mathematical optimization; Applied mathematics; Simulation; Mathematics; Mathematical analysis; Geology; Fourier transform; Green's function for the three-variable Laplace equation; Fractional Fourier transform; Computer vision","score_opus":0.007740101266383095,"score_gpt":0.20063311302659537,"score_spread":0.19289301176021229,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3148216306","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0064834417,0.000028910697,0.9907995,0.00003342113,0.000021550499,0.000019324045,0.000012147349,0.00031787017,0.002283728],"genre_scores_gemma":[0.3109533,0.00016908335,0.6849984,0.00006473643,0.000025488434,0.00017959598,0.00010336016,0.00015593514,0.0033501312],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99983525,0.000028781958,0.0000064713813,0.000013752354,0.00010366116,0.000012077767],"domain_scores_gemma":[0.9997681,0.00011924985,0.00001894878,0.000031280248,0.00005119065,0.000011236528],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00027662405,0.00026495455,0.0002945401,0.00024030745,0.0002075197,0.00040237766,0.000659018,0.00043615888,0.0015288957],"category_scores_gemma":[0.0008410669,0.00013595412,0.00029319472,0.00022962928,0.0003336151,0.00059571356,0.00043909517,0.0005163626,0.0004305852],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012368786,0.00008316436,0.00085065904,0.00011620197,0.0000344464,0.0001908805,0.00019918688,0.6896503,0.09721792,0.08030519,0.0019009265,0.12932746],"study_design_scores_gemma":[0.0000051920756,0.00001091588,0.000023835355,0.0000016216699,0.0000011679648,0.000024078101,0.0000030381268,0.9944214,0.0033272207,0.0010190154,0.0011594819,0.0000030356593],"about_ca_topic_score_codex":0.00087577093,"about_ca_topic_score_gemma":0.00084625644,"teacher_disagreement_score":0.0015288957,"about_ca_system_score_codex":0.00024726376,"about_ca_system_score_gemma":0.0005082168,"threshold_uncertainty_score":0.005114615},"labels":[],"label_agreement":null},{"id":"W3194095534","doi":"10.1109/tcpmt.2021.3105867","title":"A Fast Technique for Realization of Lumped-Element Values Into 3-D Physical Layout on LTCC","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":6,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Schematic; Realization (probability); Band-pass filter; HFSS; Electronic engineering; Ideal (ethics); Physical design; Filter (signal processing); Computer science; Engineering; Electrical engineering; Circuit design; Antenna (radio)","score_opus":0.010439810777667338,"score_gpt":0.23347954740426427,"score_spread":0.22303973662659693,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3194095534","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0022932112,0.000038673774,0.9928181,0.000030657146,0.000028683009,0.000028897277,0.000063624146,0.0024889295,0.002209192],"genre_scores_gemma":[0.08790255,0.00012003571,0.9083076,0.00005964579,0.000020186466,0.0001516709,0.00035173004,0.0006727863,0.002413772],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99966085,0.000070108625,0.000018651583,0.000043471406,0.00018423697,0.000022652772],"domain_scores_gemma":[0.99936825,0.0002083597,0.00007864106,0.00018080571,0.0001517524,0.000012140395],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041669066,0.0009438891,0.0003456746,0.0006809076,0.00034383225,0.00077770685,0.000861375,0.00038929793,0.006794709],"category_scores_gemma":[0.0014423968,0.00048515003,0.0006005467,0.00054228003,0.00033234403,0.0006747398,0.0004936612,0.00082016026,0.0025465884],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017079394,0.00008911774,0.00133562,0.0008285575,0.0001165448,0.00072248495,0.0009113993,0.23647906,0.28078204,0.10696402,0.014748477,0.35685182],"study_design_scores_gemma":[0.00006811917,0.00032422584,0.0010559408,0.00008814814,0.00006903192,0.0011685201,0.00016340955,0.58558047,0.23655446,0.017438266,0.15738615,0.00010318876],"about_ca_topic_score_codex":0.0012505852,"about_ca_topic_score_gemma":0.0023078432,"teacher_disagreement_score":0.006794709,"about_ca_system_score_codex":0.00058193743,"about_ca_system_score_gemma":0.00059513585,"threshold_uncertainty_score":0.022730589},"labels":[],"label_agreement":null},{"id":"W3195412051","doi":"10.1109/tcpmt.2021.3097944","title":"Error-Controlled Static Layered-Medium Green’s Function Computation via <i>hp</i>-Adaptive Spectral Differential Equation Approximation Method","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electromagnetic Scattering and Analysis","field":"Physics and Astronomy","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Manitoba","funders":"Natural Sciences and Engineering Research Council of Canada; Manitoba Hydro","keywords":"Computation; Function (biology); Differential equation; Mathematical analysis; Applied mathematics; Error analysis; Mathematics; Computer science; Physics; Algorithm","score_opus":0.0144576040270556,"score_gpt":0.2438571632902355,"score_spread":0.2293995592631799,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3195412051","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0062740566,0.000016922713,0.99168336,0.000020999449,0.000008588635,0.0000099767585,0.000019842668,0.00031817678,0.0016479953],"genre_scores_gemma":[0.2975284,0.000101114165,0.6987549,0.00003686585,0.000014452566,0.00009760549,0.00012241384,0.00021323736,0.003130976],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998209,0.00002778616,0.0000070124293,0.000016233387,0.000112456284,0.000015605365],"domain_scores_gemma":[0.99958414,0.00016793895,0.000030792864,0.000059119444,0.00014131308,0.00001670063],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003371062,0.00035754248,0.0003841183,0.00034473388,0.0002263163,0.0005851731,0.0010591702,0.000398974,0.0021474457],"category_scores_gemma":[0.0012059566,0.00018665829,0.00035129592,0.0003651332,0.00040942652,0.0006141034,0.00058446464,0.00049449597,0.0006311923],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008387548,0.00005473952,0.0011637568,0.00015155565,0.000038752405,0.0002207958,0.00017385818,0.7291776,0.05854637,0.08315572,0.0019942552,0.12523872],"study_design_scores_gemma":[0.0000023310809,0.0000055860887,0.00003994633,0.0000025528188,0.0000015095785,0.000017295251,0.0000054265356,0.99422777,0.0035030085,0.0016444926,0.000546918,0.0000031274244],"about_ca_topic_score_codex":0.001912086,"about_ca_topic_score_gemma":0.0016271578,"teacher_disagreement_score":0.0021474457,"about_ca_system_score_codex":0.00043765368,"about_ca_system_score_gemma":0.0007751528,"threshold_uncertainty_score":0.0071839094},"labels":[],"label_agreement":null},{"id":"W3204880988","doi":"10.1109/tcpmt.2021.3116220","title":"3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":30,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"Horizon 2020 Framework Programme; European Commission","keywords":"Diplexer; Band-pass filter; Stereolithography; Admittance; Filter (signal processing); Inverter; Electrical impedance; Extremely high frequency; Waveguide filter; Electronic engineering; Plane (geometry); Topology (electrical circuits); Optics; Engineering; Computer science; Acoustics; Physics; Prototype filter; Electrical engineering; Filter design; Mathematics; Voltage; Mechanical engineering; Geometry","score_opus":0.011598550569642272,"score_gpt":0.19720885676944686,"score_spread":0.1856103061998046,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3204880988","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.68636936,0.00029090836,0.2950553,0.00009073961,0.00009522234,0.000070187714,0.00015579803,0.0009218904,0.016950537],"genre_scores_gemma":[0.8470567,0.00014867651,0.14757848,0.000020917108,0.000009339681,0.00003690317,0.00008341858,0.00008503247,0.0049805455],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997688,0.000013714664,0.000012146117,0.000030568346,0.00015463616,0.000020171366],"domain_scores_gemma":[0.99978083,0.000038725557,0.00007379975,0.00005192094,0.000047695932,0.0000071111576],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015943522,0.00029371062,0.00014551819,0.00026078746,0.00014730277,0.00042396193,0.00032755933,0.00031366013,0.00086924277],"category_scores_gemma":[0.00032389964,0.00018022569,0.00027944607,0.000210142,0.00022009372,0.0002620956,0.00017193938,0.0002980343,0.0003725757],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000029102403,0.000021015918,0.00041119615,0.00006548646,0.0000062804893,0.00018216987,0.00009350163,0.005232716,0.9762623,0.0018585897,0.00013371205,0.015703846],"study_design_scores_gemma":[0.0000073214633,0.00016339355,0.0012364736,0.000005351922,0.000008071556,0.00021474296,0.000020912596,0.012788511,0.9805489,0.00014069333,0.004855494,0.000010023663],"about_ca_topic_score_codex":0.00050121587,"about_ca_topic_score_gemma":0.0012792563,"teacher_disagreement_score":0.00086924277,"about_ca_system_score_codex":0.00037746748,"about_ca_system_score_gemma":0.0002450819,"threshold_uncertainty_score":0.0029079318},"labels":[],"label_agreement":null},{"id":"W3211697685","doi":"10.1109/tcpmt.2021.3126284","title":"Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range","year":2021,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hamilton Health Sciences; Natural Resources Canada; McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Sintering; Silicon carbide; Molybdenum; Atmospheric temperature range; Electronic packaging; Power module; Die (integrated circuit); Composite material; Optoelectronics; Power (physics); Metallurgy; Nanotechnology","score_opus":0.00996854852550868,"score_gpt":0.21030490917158495,"score_spread":0.20033636064607627,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3211697685","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.34664106,0.003675244,0.59096056,0.00065248756,0.00017928878,0.00015556703,0.0005533612,0.0013178083,0.055864666],"genre_scores_gemma":[0.96163327,0.001141821,0.02606431,0.000061906416,0.000023896659,0.00012092632,0.00018308974,0.00013025072,0.010640487],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99990237,0.000016094215,0.000003160121,0.000015688533,0.000045089844,0.000017565262],"domain_scores_gemma":[0.9999335,0.000018585084,0.000014483704,0.000007759179,0.000021627446,0.000004107443],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020463817,0.0005004017,0.00042496968,0.00032341952,0.00028234322,0.00049636204,0.00074681034,0.0008719005,0.001231129],"category_scores_gemma":[0.000292458,0.00033660364,0.00081531313,0.00031119087,0.00025982576,0.0005178077,0.00021276783,0.00033915514,0.00038003523],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000048776546,0.000030834562,0.00078089675,0.00014107408,0.00003240751,0.00025203076,0.00008804153,0.9514696,0.033418488,0.0065142503,0.0007562989,0.0064672437],"study_design_scores_gemma":[0.0000026730493,0.000017071701,0.0002170597,0.0000040217024,0.0000068047016,0.000017447068,0.000006723257,0.9972154,0.0016650446,0.00023682244,0.0006074322,0.0000034787809],"about_ca_topic_score_codex":0.0059856274,"about_ca_topic_score_gemma":0.005655619,"teacher_disagreement_score":0.0059856274,"about_ca_system_score_codex":0.00063564786,"about_ca_system_score_gemma":0.000697934,"threshold_uncertainty_score":0.011901557},"labels":[],"label_agreement":null},{"id":"W4226073136","doi":"10.1109/tcpmt.2022.3169592","title":"A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Millimeter-Wave Propagation and Modeling","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Peraso Technologies (Canada)","funders":"","keywords":"Antenna gain; Antenna (radio); Electrical engineering; Printed circuit board; Interposer; Materials science; Optoelectronics; Dipole antenna; Optics; Antenna efficiency; Computer science; Physics; Engineering","score_opus":0.013454467278490194,"score_gpt":0.18926132545756702,"score_spread":0.17580685817907682,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4226073136","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.13011025,0.0010882491,0.82608294,0.0006363388,0.00025498532,0.00016742277,0.00020750018,0.0041916613,0.03726066],"genre_scores_gemma":[0.76493096,0.0004648914,0.21707052,0.00038971883,0.000092405375,0.00010417831,0.00028296304,0.00007276093,0.016591616],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997603,0.000051415853,0.00001263394,0.000039892373,0.00008947581,0.000046226873],"domain_scores_gemma":[0.99992037,0.0000061387445,0.000016961227,0.00001740865,0.000030137795,0.000009035572],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019445515,0.0005200645,0.00024919023,0.0003007528,0.00014421268,0.00057670986,0.0008555517,0.00055935176,0.0027116735],"category_scores_gemma":[0.00014106793,0.0001372474,0.0002915012,0.00027872555,0.00014241284,0.00052499404,0.0003793325,0.00034965272,0.001942779],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00031098534,0.0001718299,0.0026694126,0.0004053144,0.00019975337,0.00060310634,0.0002064938,0.028917475,0.6566809,0.06262149,0.012590082,0.23462315],"study_design_scores_gemma":[0.00012776125,0.0032256988,0.004720864,0.00008329558,0.00022733069,0.0029257673,0.00010525111,0.367013,0.46045318,0.0053852554,0.15563127,0.00010125549],"about_ca_topic_score_codex":0.0003615092,"about_ca_topic_score_gemma":0.0006717873,"teacher_disagreement_score":0.0027116735,"about_ca_system_score_codex":0.00044075664,"about_ca_system_score_gemma":0.00022906686,"threshold_uncertainty_score":0.009071469},"labels":[],"label_agreement":null},{"id":"W4242000462","doi":"10.1109/tcpmt.2018.2868793","title":"Author’s Reply","year":2018,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Radio Frequency Integrated Circuit Design","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Calgary","funders":"","keywords":"Type (biology); Biology","score_opus":0.018425495817780285,"score_gpt":0.22929049204494578,"score_spread":0.2108649962271655,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4242000462","genre_codex":"commentary","genre_gemma":"editorial","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"editorial","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.00026284473,0.0012282478,0.00015704174,0.89773995,0.0949003,0.000020243297,0.00024089047,0.000094766154,0.0053556007],"genre_scores_gemma":[0.0035452847,0.0009445576,0.00024559625,0.952169,0.02505568,0.00007299202,0.00012262943,0.000095313546,0.017748898],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.99218965,0.0018990033,0.0008639958,0.0013930899,0.002473274,0.0011810121],"domain_scores_gemma":[0.95914793,0.017825946,0.0015150419,0.0021934316,0.01621727,0.0031003316],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.008547648,0.0008473401,0.0012134371,0.0013141931,0.0040114913,0.005256041,0.0032137015,0.034506727,0.05148238],"category_scores_gemma":[0.09747872,0.00074053416,0.0016673672,0.0010142608,0.003881,0.0059146006,0.0036527782,0.030488744,0.026329048],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000018968092,0.0000043791006,0.00010333916,0.00003542118,0.0000051564425,0.00010602601,0.00009235555,0.000010175164,0.000023993538,0.0017496804,0.9953815,0.002469035],"study_design_scores_gemma":[0.000030311563,0.000013412568,0.0003196559,0.00025217675,0.000014091429,0.00039588648,0.00030721372,0.00003903263,0.00016452842,0.0025758392,0.9958592,0.000028624447],"about_ca_topic_score_codex":0.0049613784,"about_ca_topic_score_gemma":0.004873551,"teacher_disagreement_score":0.05148238,"about_ca_system_score_codex":0.005815696,"about_ca_system_score_gemma":0.009630417,"threshold_uncertainty_score":0.17222571},"labels":[],"label_agreement":null},{"id":"W4285115020","doi":"10.1109/tcpmt.2022.3177663","title":"An On-Chip ESD Sensor for Use in Advanced Packaging","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electrostatic Discharge in Electronics","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Defense Advanced Research Projects Agency; Semiconductor Research Corporation","keywords":"Electrostatic discharge; Voltage; Electrical engineering; Weibull distribution; CMOS; Chip; Engineering; Electronic engineering","score_opus":0.013487551663890719,"score_gpt":0.23421521330423953,"score_spread":0.22072766164034882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4285115020","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.47519985,0.003714891,0.4359482,0.00140602,0.0010300165,0.0008009324,0.0024224801,0.008622919,0.070854604],"genre_scores_gemma":[0.8527533,0.0007539891,0.12490693,0.0005473113,0.00007787424,0.00012222465,0.0006960071,0.00014441938,0.019997995],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99970275,0.00003102095,0.000009303064,0.000058008183,0.00017775879,0.00002113618],"domain_scores_gemma":[0.9997273,0.000039568207,0.00005077253,0.000060967377,0.00010122527,0.000020161067],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017168104,0.0003614737,0.00035505067,0.00024370966,0.00021731078,0.0004319732,0.0006627464,0.0006137576,0.0027668525],"category_scores_gemma":[0.0003992462,0.00017304742,0.00019431874,0.00020222159,0.00013680187,0.00052883994,0.00030707545,0.00027507317,0.0010678616],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000177701,0.00013735246,0.0036165267,0.0003603121,0.000043560714,0.00054096425,0.00010258949,0.0027675054,0.8628454,0.003145674,0.0130493175,0.113213114],"study_design_scores_gemma":[0.000059309237,0.0027411773,0.013603282,0.000071730654,0.0001313853,0.0033258682,0.00010769854,0.06284547,0.7850862,0.0013182389,0.13062547,0.00008408979],"about_ca_topic_score_codex":0.00018320563,"about_ca_topic_score_gemma":0.000508773,"teacher_disagreement_score":0.0027668525,"about_ca_system_score_codex":0.00031082646,"about_ca_system_score_gemma":0.00026789447,"threshold_uncertainty_score":0.009256005},"labels":[],"label_agreement":null},{"id":"W4311633449","doi":"10.1109/tcpmt.2022.3226139","title":"Moisture Diffusion Inside the BEOL of an FC-PBGA Package","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; U.S. Bureau of Land Management","keywords":"Materials science; Ball grid array; Moisture; Flip chip; Saturation (graph theory); Relative humidity; Integrated circuit packaging; Composite material; Integrated circuit; Electronic engineering; Optoelectronics; Soldering; Thermodynamics; Mathematics; Engineering; Adhesive; Physics","score_opus":0.010094366073407407,"score_gpt":0.20692484002766187,"score_spread":0.19683047395425446,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4311633449","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99390864,0.000096917036,0.004889565,0.00003064244,0.00002336077,0.000022116943,0.0003057471,0.00025791654,0.00046505782],"genre_scores_gemma":[0.99218655,0.00011686464,0.0056462274,0.00003155765,0.0000062260347,0.000038646664,0.00022802196,0.00007918876,0.0016666629],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99983895,0.000013085695,0.0000054647912,0.00006402636,0.0000472668,0.000031141524],"domain_scores_gemma":[0.99980897,0.00005399312,0.000039104638,0.00003896125,0.000044174398,0.000014732307],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017489835,0.0005021263,0.00040158245,0.00028560316,0.00021939121,0.00035912858,0.00042708352,0.0003460208,0.001822378],"category_scores_gemma":[0.00030870605,0.00019501142,0.00022987791,0.00023602752,0.00022501845,0.0004014047,0.00023939704,0.00032949052,0.0005242547],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012311584,0.00003627769,0.0012605115,0.00005327961,0.00000826498,0.00017678083,0.000114451876,0.0006978042,0.99369943,0.00005180423,0.00011232405,0.0036659457],"study_design_scores_gemma":[0.000007354036,0.0003953103,0.006877064,0.000006369646,0.000019167042,0.000103713035,0.00007472086,0.004653993,0.98634386,0.000022039472,0.0014830111,0.000013334612],"about_ca_topic_score_codex":0.0008183897,"about_ca_topic_score_gemma":0.0009294562,"teacher_disagreement_score":0.001822378,"about_ca_system_score_codex":0.00031101026,"about_ca_system_score_gemma":0.00014986756,"threshold_uncertainty_score":0.0060964823},"labels":[],"label_agreement":null},{"id":"W4377715328","doi":"10.1109/tcpmt.2023.3279098","title":"Deep Independent Recurrent Neural Network Technique for Modeling Transient Behavior of Nonlinear Circuits","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Analog and Mixed-Signal Circuit Design","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Nonlinear system; Artificial neural network; Transient (computer programming); Electronic circuit; Computer science; Transient analysis; Transient response; Control theory (sociology); Electronic engineering; Artificial intelligence; Engineering; Electrical engineering; Physics","score_opus":0.026667518383259817,"score_gpt":0.24088945866448194,"score_spread":0.21422194028122213,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4377715328","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0048362003,0.00020742355,0.99323624,0.000040264615,0.00002000098,0.000011099381,0.00003765098,0.00045250263,0.0011586122],"genre_scores_gemma":[0.65081894,0.0009338945,0.33870515,0.00009600846,0.00006406933,0.00016324705,0.00040901187,0.00023112689,0.008578495],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99987316,0.000031598374,0.000008786006,0.000027810784,0.000045592657,0.000012954992],"domain_scores_gemma":[0.99988866,0.000042689782,0.000019217989,0.000015189666,0.000029309691,0.0000048853863],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003393631,0.0007495285,0.0004210325,0.00028059594,0.00019763678,0.00032944215,0.0008385837,0.00057036435,0.0016372006],"category_scores_gemma":[0.0006048307,0.00031388865,0.00065673544,0.00026998165,0.00024937277,0.00081277813,0.00028036517,0.0009250679,0.0004342352],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000028804838,0.00001672241,0.00031400644,0.00007715333,0.000042536536,0.00007857525,0.00004153284,0.92564684,0.012750301,0.010254979,0.0007062448,0.05004216],"study_design_scores_gemma":[8.234545e-7,0.00000745487,0.000026960552,0.0000018208883,0.0000033203578,0.000009644063,0.0000012155103,0.99790657,0.0008629166,0.0007976649,0.00037975176,0.0000018191006],"about_ca_topic_score_codex":0.0042369496,"about_ca_topic_score_gemma":0.0062670684,"teacher_disagreement_score":0.0042369496,"about_ca_system_score_codex":0.00045605892,"about_ca_system_score_gemma":0.0004865498,"threshold_uncertainty_score":0.0084245205},"labels":[],"label_agreement":null},{"id":"W4380607283","doi":"10.1109/tcpmt.2023.3285902","title":"Liquid-Crystal Reconfigurable Coupler for Millimeter-Wave Applications","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Antenna and Metasurface Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Reconfigurability; Materials science; Extremely high frequency; Permittivity; Millimeter; Relative permittivity; Waveguide; Coupling (piping); Slab; Optoelectronics; Dielectric; Frequency band; Substrate (aquarium); Liquid crystal; Optics; Physics; Telecommunications; Computer science; Antenna (radio); Composite material","score_opus":0.028566590063765062,"score_gpt":0.23947731652879448,"score_spread":0.21091072646502942,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4380607283","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8328123,0.0035366036,0.1456686,0.0003750835,0.00015049592,0.000086537584,0.00022637146,0.0016123828,0.015531505],"genre_scores_gemma":[0.9576039,0.0007359402,0.038211603,0.000101834936,0.000030589345,0.0000450408,0.00009845061,0.0000531968,0.0031195313],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99987555,0.000018090446,0.000005979209,0.000026999762,0.00005940636,0.000014002725],"domain_scores_gemma":[0.9998963,0.000018672885,0.000050348182,0.000013544916,0.000014589465,0.000006676716],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015348085,0.00031613567,0.00020921257,0.00015985049,0.00011899282,0.00030157887,0.0004047411,0.00031004925,0.00070814835],"category_scores_gemma":[0.00013577184,0.00014851779,0.00021380538,0.00023328685,0.00016103673,0.0003558918,0.00019091308,0.0002998847,0.00047190973],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000040035196,0.00001997055,0.00015336512,0.00005517328,0.0000073643755,0.00010525683,0.000019124996,0.0010818761,0.99113137,0.0007771065,0.00015881882,0.0064505767],"study_design_scores_gemma":[0.000019419515,0.00031476244,0.00091116194,0.000008275749,0.000019611754,0.0003904245,0.000021357944,0.025912143,0.965505,0.00017140222,0.006710812,0.000015602947],"about_ca_topic_score_codex":0.0002271146,"about_ca_topic_score_gemma":0.0004913009,"teacher_disagreement_score":0.00070814835,"about_ca_system_score_codex":0.00021999324,"about_ca_system_score_gemma":0.00011602064,"threshold_uncertainty_score":0.0023690462},"labels":[],"label_agreement":null},{"id":"W4381785378","doi":"10.1109/tcpmt.2023.3288612","title":"Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review","year":2023,"lang":"en","type":"review","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Heat Transfer Mechanisms","field":"Engineering","cited_by":26,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Windsor","funders":"Natural Sciences and Engineering Research Council of Canada; Mitacs","keywords":"Heat sink; Electronics; Electronics cooling; Computer cooling; Active cooling; Power electronics; Mechanical engineering; Heat transfer; Jet (fluid); Reliability (semiconductor); Passive cooling; Water cooling; Computer science; Automotive industry; Automotive engineering; Materials science; Thermal management of electronic devices and systems; Power (physics); Aerospace engineering; Electrical engineering; Engineering; Mechanics; Physics","score_opus":0.02900197806166171,"score_gpt":0.2692932307040659,"score_spread":0.2402912526424042,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4381785378","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0005029481,0.9971347,0.0006597181,0.000091850176,0.00016378655,0.000011423065,0.000024131645,0.000017856899,0.0013935518],"genre_scores_gemma":[0.0016207505,0.9968363,0.00058563735,0.00007326001,0.00009996187,0.000012814243,0.0000336876,0.00000375372,0.00073380984],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99978966,0.000020041607,0.00002559296,0.000050298655,0.00009176482,0.000022622893],"domain_scores_gemma":[0.9996106,0.000183291,0.00007033593,0.000013630693,0.00010166271,0.000020504991],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00058167486,0.0011154006,0.0010867044,0.0026684592,0.0003061555,0.0009685719,0.00088024884,0.000929846,0.003200563],"category_scores_gemma":[0.00067375536,0.00055095705,0.0007503523,0.0025110824,0.00033279837,0.0014996192,0.00059021264,0.0011116359,0.0017936518],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006332947,0.0001643337,0.00028344456,0.03892401,0.00009729609,0.00024461423,0.00010150952,0.0014096003,0.012917376,0.0055974983,0.016187292,0.9240098],"study_design_scores_gemma":[0.00001215283,0.0003083061,0.0007700566,0.003932566,0.00021927344,0.0012173722,0.00006759281,0.0005839445,0.006723905,0.0013207735,0.98479974,0.000044288605],"about_ca_topic_score_codex":0.00063796295,"about_ca_topic_score_gemma":0.0010272812,"teacher_disagreement_score":0.003200563,"about_ca_system_score_codex":0.00027106467,"about_ca_system_score_gemma":0.0007939984,"threshold_uncertainty_score":0.010706961},"labels":[],"label_agreement":null},{"id":"W4385267354","doi":"10.1109/tcpmt.2023.3298901","title":"Electro-Hydro-Dynamic-Force-Driven Filling Method for Through Polymer Substrates Via With Ag-Based Conductive Epoxy","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Fundamental Research Funds for the Central Universities; Natural Science Foundation of Jiangsu Province","keywords":"Electrical conductor; Materials science; Polymer; Substrate (aquarium); Conductive polymer; Epoxy; Electronics; Nanotechnology; Optoelectronics; Composite material; Electrical engineering; Engineering","score_opus":0.016857923060974125,"score_gpt":0.2525813535176965,"score_spread":0.2357234304567224,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4385267354","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9260569,0.0008413324,0.06913863,0.00015141202,0.00010799723,0.00007123879,0.00015486302,0.00078813446,0.0026895357],"genre_scores_gemma":[0.96811813,0.0003249809,0.029413808,0.00004117429,0.000014188572,0.000047500187,0.00008678194,0.000057439993,0.0018959774],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998443,0.000014795853,0.000009174258,0.000040492083,0.000069763366,0.00002148071],"domain_scores_gemma":[0.999843,0.000038855633,0.000056641948,0.000026953912,0.000023088656,0.000011483358],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014128182,0.0003575684,0.00018008346,0.00016705372,0.000116001276,0.00019734414,0.00030616368,0.00024335347,0.0004916206],"category_scores_gemma":[0.0002976742,0.00015656826,0.00023816538,0.0001174909,0.00019462247,0.00036972263,0.00026343868,0.00029476485,0.0002410969],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013416616,0.000010891727,0.00017021384,0.000067050714,0.0000033221884,0.000085032734,0.000046092817,0.00031040565,0.992366,0.0003262415,0.00016214092,0.006439239],"study_design_scores_gemma":[0.000004012546,0.000081062106,0.0006554854,0.0000043653913,0.000004632528,0.0001642307,0.000015728447,0.0037699146,0.99266464,0.000057647987,0.0025685339,0.000009766293],"about_ca_topic_score_codex":0.00019711246,"about_ca_topic_score_gemma":0.00036418586,"teacher_disagreement_score":0.0004916206,"about_ca_system_score_codex":0.00017241828,"about_ca_system_score_gemma":0.00013244171,"threshold_uncertainty_score":0.0016446114},"labels":[],"label_agreement":null},{"id":"W4385945601","doi":"10.1109/tcpmt.2023.3306007","title":"A Wideband Symmetrical Crossover Model With Analytic Analysis and Its Millimeter-Wave Application","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique","funders":"","keywords":"Crossover; Wideband; Extremely high frequency; Bandwidth (computing); Notation; Computer science; Electronic engineering; Beamforming; Algorithm; Mathematics; Telecommunications; Engineering; Artificial intelligence; Arithmetic","score_opus":0.01496157278123777,"score_gpt":0.21389275333760122,"score_spread":0.19893118055636344,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4385945601","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.013825024,0.00057421514,0.9658044,0.0002145771,0.00005690094,0.000046745616,0.00007440799,0.00031526596,0.019088583],"genre_scores_gemma":[0.79948545,0.0025440482,0.17342603,0.00021477762,0.00010627449,0.00030050272,0.00032338512,0.00017921536,0.023420429],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998516,0.000029597351,0.000004955803,0.000031334697,0.00006524872,0.000017281181],"domain_scores_gemma":[0.9999076,0.000025339259,0.000022292661,0.000012433319,0.000027243088,0.0000049646483],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024996288,0.0005898963,0.0003620407,0.0004487044,0.0002891151,0.0007310988,0.0009941406,0.0009198034,0.002488102],"category_scores_gemma":[0.00043444347,0.0002915329,0.00065202184,0.00047055833,0.00033307646,0.00092676526,0.0003471217,0.0005501316,0.0010440502],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015760663,0.00009485559,0.0007335638,0.00026604772,0.0000463023,0.0005403052,0.0003567731,0.63376296,0.07649039,0.23584348,0.004208473,0.04749923],"study_design_scores_gemma":[0.000009686622,0.00005305587,0.000090868656,0.000013067784,0.00001327485,0.00012820646,0.00002744429,0.98468125,0.0034820167,0.007411436,0.0040786285,0.000011110757],"about_ca_topic_score_codex":0.0011901016,"about_ca_topic_score_gemma":0.00073324156,"teacher_disagreement_score":0.002488102,"about_ca_system_score_codex":0.0005244938,"about_ca_system_score_gemma":0.00032656154,"threshold_uncertainty_score":0.00832355},"labels":[],"label_agreement":null},{"id":"W4389692456","doi":"10.1109/tcpmt.2023.3342134","title":"Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes","year":2023,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Communications Research Centre Canada; Université du Québec en Outaouais","funders":"","keywords":"Phase shift module; Transmission line; PIN diode; Electronic engineering; Modular design; Diode; Beamforming; Electronic circuit; Printed circuit board; Coplanar waveguide; Insertion loss; Computer science; Materials science; Optoelectronics; Engineering; Electrical engineering; Telecommunications; Microwave","score_opus":0.014847487220698563,"score_gpt":0.22209371937281808,"score_spread":0.20724623215211951,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4389692456","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.75592923,0.0006849859,0.22872066,0.0002574141,0.0002676631,0.000098093165,0.00017681051,0.0013079875,0.012557201],"genre_scores_gemma":[0.89816886,0.0003167466,0.09570677,0.00006952288,0.000048551832,0.000046161374,0.00008714835,0.000053856802,0.005502412],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991286,0.000009265985,0.000003881803,0.00003198108,0.00003134439,0.0000105794625],"domain_scores_gemma":[0.9998919,0.000019870462,0.000043654545,0.00002093376,0.000016358908,0.000007410618],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000846425,0.00033214546,0.00019280867,0.00017702917,0.000116740535,0.00026138613,0.0007398059,0.00036663483,0.00078288687],"category_scores_gemma":[0.00013663266,0.00017753882,0.00018834542,0.00017342751,0.00022042175,0.00042864055,0.00018358648,0.0002590718,0.00049284217],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000044553566,0.000019939956,0.00015588674,0.000027523229,0.0000061797386,0.000059206264,0.000013761504,0.0008990614,0.9891017,0.0010902048,0.0001652763,0.0084167],"study_design_scores_gemma":[0.000037447116,0.0004020316,0.0010767253,0.000007236803,0.000017765078,0.0004115082,0.000013882059,0.031245666,0.9577307,0.00033430965,0.008704565,0.000018159935],"about_ca_topic_score_codex":0.00013897165,"about_ca_topic_score_gemma":0.0004482906,"teacher_disagreement_score":0.00078288687,"about_ca_system_score_codex":0.00026244292,"about_ca_system_score_gemma":0.000124113,"threshold_uncertainty_score":0.0026189685},"labels":[],"label_agreement":null},{"id":"W4390691538","doi":"10.1109/tcpmt.2024.3352183","title":"Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Electronic engineering; Impedance matching; Engineering; Quad Flat No-leads package; Capacitive sensing; Band-pass filter; Electrical impedance; Microstrip; Printed circuit board; Monolithic microwave integrated circuit; Electrical engineering; CMOS; Materials science","score_opus":0.009816877131175896,"score_gpt":0.20279084235722433,"score_spread":0.19297396522604843,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4390691538","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9545961,0.0005464259,0.042604774,0.00005543481,0.000030112149,0.000020358002,0.00008655167,0.00022612928,0.0018340132],"genre_scores_gemma":[0.9854857,0.00025674174,0.013240534,0.000017836797,0.000008239691,0.000011477532,0.00007609644,0.00003988501,0.0008636222],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99980193,0.00003116114,0.000006936419,0.000047418733,0.000092064685,0.000020601106],"domain_scores_gemma":[0.9997737,0.000043271928,0.00007793881,0.000035988105,0.000061787825,0.0000073484616],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024789662,0.00035547419,0.00013452773,0.00026680582,0.000101053294,0.0002780482,0.00032469176,0.00025259197,0.00031538878],"category_scores_gemma":[0.000538199,0.0001313677,0.000102904894,0.00028701988,0.00017353157,0.0004383583,0.0001287849,0.00012253651,0.000146715],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008112301,0.00002119767,0.0026413354,0.00007383953,0.0000117000045,0.00019521794,0.00018928843,0.002358068,0.9774598,0.0003046217,0.00019064137,0.016473213],"study_design_scores_gemma":[0.000009496549,0.0007826018,0.02235916,0.000016773305,0.00005067858,0.0005030418,0.00014219615,0.020795247,0.95029616,0.0001326347,0.0048930366,0.000019000934],"about_ca_topic_score_codex":0.00038844862,"about_ca_topic_score_gemma":0.0008276189,"teacher_disagreement_score":0.00038844862,"about_ca_system_score_codex":0.0002663773,"about_ca_system_score_gemma":0.00008865518,"threshold_uncertainty_score":0.0019326806},"labels":[],"label_agreement":null},{"id":"W4390970245","doi":"10.1109/tcpmt.2024.3355851","title":"On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Millimeter-Wave Propagation and Modeling","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Beamwidth; Chipset; Antenna (radio); Antenna gain; Lens (geology); Radar; Radiation pattern; Computer science; Optics; Electronic engineering; Materials science; Engineering; Antenna aperture; Telecommunications; Chip; Physics","score_opus":0.03907198588544596,"score_gpt":0.23822588312302984,"score_spread":0.19915389723758387,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4390970245","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.38701603,0.006562006,0.5446345,0.0006146861,0.0005468169,0.00013001486,0.00031712776,0.0034189308,0.056759924],"genre_scores_gemma":[0.83037525,0.0045289663,0.14782688,0.00038769608,0.0002062099,0.00004981502,0.00031296542,0.00023470404,0.016077543],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99967694,0.000050697305,0.00001581293,0.00006392844,0.00015399372,0.00003863835],"domain_scores_gemma":[0.99941385,0.000078937555,0.0002040708,0.00007830884,0.0001961179,0.000028784703],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00015717272,0.00080814905,0.0003940135,0.00039286952,0.00012103809,0.00076781464,0.0007675433,0.0004963178,0.0018091877],"category_scores_gemma":[0.00036486337,0.00023114981,0.0006029024,0.0005611575,0.0001630926,0.0005919737,0.00025344137,0.00030379425,0.0021702668],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022135548,0.000077391654,0.0019432665,0.00064810243,0.000119468365,0.00072134036,0.00010853057,0.004872945,0.8796589,0.0029381511,0.0022547338,0.10643588],"study_design_scores_gemma":[0.000026643504,0.0011006752,0.004712223,0.000050443257,0.00016951405,0.0021494478,0.00008116457,0.031315275,0.9233872,0.0003011546,0.036640964,0.00006523605],"about_ca_topic_score_codex":0.0004688898,"about_ca_topic_score_gemma":0.00049624144,"teacher_disagreement_score":0.0018091877,"about_ca_system_score_codex":0.00043593277,"about_ca_system_score_gemma":0.00024212523,"threshold_uncertainty_score":0.0060523152},"labels":[],"label_agreement":null},{"id":"W4392902715","doi":"10.1109/tcpmt.2024.3376993","title":"Thermal Management of Nonuniform Heat Fluxes in an Electric-Vehicle Fast-Charger: Experimental and Numerical Analysis","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Refrigeration and Air Conditioning Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Thermal; Thermal management of electronic devices and systems; Environmental science; Mechanics; Materials science; Physics; Engineering; Thermodynamics; Mechanical engineering","score_opus":0.00925016608620334,"score_gpt":0.23265195279081954,"score_spread":0.2234017867046162,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4392902715","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9838299,0.00023726549,0.01227716,0.000101693084,0.000023605968,0.000036027424,0.00013824627,0.00014572975,0.0032103257],"genre_scores_gemma":[0.99468887,0.00008382806,0.0045281067,0.000006795564,0.0000026252956,0.00002527436,0.00003829728,0.000012389712,0.0006138812],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99988806,0.000011359182,0.000004755295,0.000020721132,0.00005544432,0.000019700754],"domain_scores_gemma":[0.99981254,0.00007257617,0.000031496154,0.000026412019,0.00004754567,0.000009511627],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037137305,0.0002406596,0.00031444457,0.00022917565,0.00031229263,0.00035376474,0.00046423604,0.00039354595,0.0013118765],"category_scores_gemma":[0.00046795726,0.00013477643,0.00025782545,0.00024567076,0.00044121884,0.00036740178,0.00021263439,0.0003363374,0.00014463298],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004038083,0.00042234684,0.0045091766,0.000533387,0.000027700413,0.00032634442,0.0003426263,0.34418988,0.6243934,0.0045477743,0.00095428416,0.019349182],"study_design_scores_gemma":[0.000040364037,0.00043854106,0.0029066515,0.000013881187,0.000014073239,0.00005733244,0.00011406507,0.78259313,0.21223924,0.00032039586,0.001236683,0.000025547752],"about_ca_topic_score_codex":0.0013655137,"about_ca_topic_score_gemma":0.0015055018,"teacher_disagreement_score":0.0013655137,"about_ca_system_score_codex":0.00054459594,"about_ca_system_score_gemma":0.00027143268,"threshold_uncertainty_score":0.0043886304},"labels":[],"label_agreement":null},{"id":"W4393241316","doi":"10.1109/tcpmt.2024.3382628","title":"Sensitivity Enhancement of Microwave Split-Ring-Resonator Sensors","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Frequency and Time Standards","field":"Physics and Astronomy","cited_by":12,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Microwave; Sensitivity (control systems); Resonator; Ring (chemistry); Materials science; Optoelectronics; Electronic engineering; Acoustics; Physics; Telecommunications; Computer science; Engineering; Chemistry","score_opus":0.00980190085108385,"score_gpt":0.24441142695788043,"score_spread":0.23460952610679658,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4393241316","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9529949,0.0015703095,0.041444838,0.00013660174,0.000059361908,0.00003883663,0.000084353065,0.00025273635,0.0034180086],"genre_scores_gemma":[0.9729513,0.0004257785,0.025528304,0.00005390458,0.00001936324,0.000017934766,0.000052178937,0.000014844018,0.0009364394],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993698,0.00013080884,0.000023727422,0.00015821487,0.00026126427,0.00005620859],"domain_scores_gemma":[0.9994735,0.00015674454,0.00014984996,0.000040245122,0.00015445697,0.000025234109],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041861046,0.00041529798,0.00035479656,0.00019882774,0.000080386024,0.00026928063,0.0003887889,0.00041302384,0.00058063155],"category_scores_gemma":[0.0007271255,0.00023271677,0.00020134811,0.00013647939,0.00022766965,0.0004393206,0.00032478463,0.00024486607,0.00030105346],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026539925,0.000005564678,0.00012576839,0.000030774492,0.000003283342,0.000021719527,0.0000097544935,0.00022349786,0.9974343,0.00007499896,0.000025101295,0.0020186934],"study_design_scores_gemma":[0.0000026638586,0.000097469696,0.0007286799,0.0000020350706,0.0000072904263,0.00008478189,0.000008233513,0.0027117128,0.9959025,0.000017890792,0.00043202424,0.0000048341894],"about_ca_topic_score_codex":0.000111725945,"about_ca_topic_score_gemma":0.00024116151,"teacher_disagreement_score":0.00058063155,"about_ca_system_score_codex":0.00023546921,"about_ca_system_score_gemma":0.00009272781,"threshold_uncertainty_score":0.0022138357},"labels":[],"label_agreement":null},{"id":"W4399527102","doi":"10.1109/tcpmt.2024.3410298","title":"TC-GVF: Tensor Core GPU-Based Vector Fitting via Accelerated Tall-Skinny QR Solvers","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Tensor decomposition and applications","field":"Mathematics","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Computational science; Tensor (intrinsic definition); Parallel computing; Computer science; Core (optical fiber); Computer graphics (images); CUDA; Mathematics; Geometry","score_opus":0.052529132840329756,"score_gpt":0.3024098454241697,"score_spread":0.24988071258383995,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399527102","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0026041097,0.0001431033,0.9935628,0.0000871828,0.000052570464,0.00003590116,0.000074590964,0.0012590239,0.002180667],"genre_scores_gemma":[0.06706433,0.00027175745,0.92706203,0.00012546341,0.00004733632,0.00012865874,0.00046645346,0.000857453,0.003976471],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9996124,0.00009040395,0.000020706293,0.000052251184,0.00017928102,0.0000449287],"domain_scores_gemma":[0.99933976,0.00019831602,0.00006708129,0.000122045385,0.00021389584,0.000058973517],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006492643,0.0010298045,0.0007647066,0.0005788446,0.0004392647,0.0009678648,0.0013892627,0.0010462466,0.007843044],"category_scores_gemma":[0.0026766863,0.0003655703,0.0006574813,0.0008281742,0.0005506507,0.0012184741,0.0014043334,0.0014176273,0.0028661462],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022018104,0.00012304903,0.0016838654,0.00041065426,0.00012041189,0.0004281865,0.0003847753,0.4960322,0.03156399,0.10250333,0.030356834,0.3361725],"study_design_scores_gemma":[0.00001569483,0.000019560044,0.00005144655,0.0000106769385,0.000004272419,0.000061026505,0.000017972741,0.9866757,0.002720579,0.0049418323,0.0054709837,0.000010264846],"about_ca_topic_score_codex":0.0052834083,"about_ca_topic_score_gemma":0.008433999,"teacher_disagreement_score":0.007843044,"about_ca_system_score_codex":0.0005036374,"about_ca_system_score_gemma":0.0018029982,"threshold_uncertainty_score":0.026237607},"labels":[],"label_agreement":null},{"id":"W4399527193","doi":"10.1109/tcpmt.2024.3412794","title":"Analytical Solutions for Transient Thermal Spreading Resistance of a 3-D Flux Channel","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Memorial University of Newfoundland","funders":"","keywords":"Transient (computer programming); Channel (broadcasting); Mechanics; Flux (metallurgy); Thermal resistance; Thermal; Transient analysis; Materials science; Physics; Transient response; Computer science; Thermodynamics; Engineering; Electrical engineering; Heat transfer","score_opus":0.026223679362500276,"score_gpt":0.2406381336712581,"score_spread":0.21441445430875783,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399527193","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.14367679,0.0018033218,0.82714754,0.0006034694,0.00015582102,0.00013913384,0.00018848987,0.00055710674,0.02572825],"genre_scores_gemma":[0.9323175,0.0011743404,0.052377276,0.00013129713,0.00004416699,0.00018102473,0.00010277559,0.00012376405,0.013547897],"study_design_codex":"simulation_or_modeling","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.9998771,0.00002878805,0.000006324161,0.000027210372,0.000035839406,0.000024661373],"domain_scores_gemma":[0.9996922,0.00014870388,0.000044154836,0.000022244538,0.00008144353,0.000011267909],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041851235,0.000538987,0.0004080828,0.0005691411,0.00033876687,0.0007682348,0.00056898117,0.001407459,0.0021403173],"category_scores_gemma":[0.0015079955,0.000265113,0.0006991872,0.00037727307,0.00091733,0.0010074573,0.0004070307,0.00055019715,0.00035092552],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000050531333,0.000042780364,0.00058722706,0.00022344472,0.0000184731,0.0003212569,0.00041598617,0.8723251,0.038127407,0.075806655,0.0010737627,0.011007373],"study_design_scores_gemma":[0.0000037828024,0.00000780943,0.00006804607,0.000008500735,0.0000026233408,0.000038841245,0.000028203707,0.99494123,0.0016708376,0.0026589844,0.00056414306,0.0000069800417],"about_ca_topic_score_codex":0.0018166621,"about_ca_topic_score_gemma":0.0011328949,"teacher_disagreement_score":0.0021403173,"about_ca_system_score_codex":0.00078670395,"about_ca_system_score_gemma":0.00067595555,"threshold_uncertainty_score":0.0071600676},"labels":[],"label_agreement":null},{"id":"W4399939162","doi":"10.1109/tcpmt.2024.3418342","title":"High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Computational Physics and Python Applications","field":"Computer Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Decomposition; Tensor (intrinsic definition); Galerkin method; Tensor decomposition; Uncertainty quantification; Applied mathematics; Mathematics; Mathematical optimization; Computer science; Finite element method; Physics; Pure mathematics; Statistics","score_opus":0.02022201454345108,"score_gpt":0.26960996085831496,"score_spread":0.24938794631486388,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4399939162","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0064144093,0.000069254515,0.9929093,0.000040737326,0.000007378318,0.000009247849,0.00001885304,0.00006493239,0.00046593047],"genre_scores_gemma":[0.55341065,0.0005264733,0.4447269,0.000048924267,0.00004269909,0.00009369549,0.00013823045,0.0001066862,0.00090579165],"study_design_codex":"simulation_or_modeling","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.99880314,0.0004817753,0.000051056497,0.00011138924,0.0005114541,0.00004114561],"domain_scores_gemma":[0.9980566,0.001138126,0.0002908636,0.00025520945,0.00021364278,0.000045453395],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001809564,0.0010732195,0.0007708428,0.0008625642,0.00038956339,0.0013229526,0.0005286099,0.0006196024,0.0005530954],"category_scores_gemma":[0.0039014996,0.00033862027,0.00076717796,0.0007109573,0.0012672354,0.0018744254,0.0012863232,0.0010364925,0.00013425772],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000039140454,0.000031647007,0.000579741,0.000082624,0.000041357198,0.00005955505,0.00006976063,0.9044709,0.009439257,0.052458912,0.00027602812,0.032451034],"study_design_scores_gemma":[0.0000016632561,0.000015226513,0.000112179674,0.000005816944,0.000002787537,0.000024370796,0.000006119492,0.9866759,0.0020784587,0.010761071,0.0003059675,0.000010364773],"about_ca_topic_score_codex":0.0010141796,"about_ca_topic_score_gemma":0.0007883139,"teacher_disagreement_score":0.001809564,"about_ca_system_score_codex":0.0005554566,"about_ca_system_score_gemma":0.0007922809,"threshold_uncertainty_score":0.009570003},"labels":[],"label_agreement":null},{"id":"W4400646360","doi":"10.1109/tcpmt.2024.3428404","title":"Nested Latin Hypercube-Based Sampling for Efficient Uncertainty Quantification Using Sensitivity-Assisted Least Squares SVM","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Fault Detection and Control Systems","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada","keywords":"Latin hypercube sampling; Sensitivity (control systems); Sampling (signal processing); Computer science; Hypercube; Support vector machine; Mathematics; Algorithm; Statistics; Artificial intelligence; Monte Carlo method; Engineering; Parallel computing; Electronic engineering","score_opus":0.036104893401316326,"score_gpt":0.2623124509950003,"score_spread":0.22620755759368394,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4400646360","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.004334078,0.000056917535,0.99495137,0.000026331318,0.000006403394,0.000016152262,0.000018484905,0.00014903488,0.00044121942],"genre_scores_gemma":[0.36715484,0.0001842739,0.63064426,0.0000877908,0.00002668681,0.0002920171,0.00022183901,0.00015418098,0.0012341475],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9990809,0.00053742406,0.000036073357,0.00009507791,0.00021384697,0.00003660839],"domain_scores_gemma":[0.9981754,0.0013251908,0.00009114319,0.00012818535,0.00024826283,0.00003188723],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001689314,0.00071786455,0.00085962564,0.00049555226,0.00030463623,0.00055720494,0.00064472907,0.00062159775,0.0018132],"category_scores_gemma":[0.004475088,0.00047057585,0.0006326465,0.00052496773,0.0005842249,0.0009131508,0.00088110316,0.0010784217,0.00039605913],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00008721196,0.00003358959,0.00040014528,0.00008291167,0.00003313737,0.00004802327,0.000076084965,0.93735117,0.0057080765,0.013867551,0.00051376777,0.04179832],"study_design_scores_gemma":[0.0000020654031,0.000008928989,0.000021641452,0.0000017971455,0.0000010886744,0.000004822634,0.0000023227024,0.99747413,0.0007628795,0.0015354682,0.00018227207,0.0000024279368],"about_ca_topic_score_codex":0.0016867131,"about_ca_topic_score_gemma":0.0014688183,"teacher_disagreement_score":0.0018132,"about_ca_system_score_codex":0.00046192695,"about_ca_system_score_gemma":0.0006712759,"threshold_uncertainty_score":0.008934081},"labels":[],"label_agreement":null},{"id":"W4402666366","doi":"10.1109/tcpmt.2024.3464243","title":"A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide","year":2024,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"","keywords":"Wideband; Materials science; Substrate (aquarium); Waveguide; Optoelectronics; Coaxial; Optics; Physics; Computer science; Telecommunications","score_opus":0.01123352734268309,"score_gpt":0.21399080436596973,"score_spread":0.20275727702328664,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4402666366","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93766844,0.0007488555,0.05372776,0.000089919624,0.00014283873,0.00003087346,0.00012882995,0.0010627428,0.0063996864],"genre_scores_gemma":[0.9823728,0.00024369854,0.015200036,0.000042828364,0.000023339026,0.000018265298,0.000105263214,0.000043934,0.0019498942],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998497,0.000011232141,0.0000062170434,0.000051996663,0.0000490242,0.000031932308],"domain_scores_gemma":[0.99988914,0.000015189036,0.000031795425,0.000018229452,0.000027270453,0.000018362372],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007130869,0.0003627745,0.00018640715,0.00020105632,0.000109242945,0.0002993525,0.00036283486,0.00030030555,0.0006041474],"category_scores_gemma":[0.00015712013,0.00014843921,0.00017192004,0.00025385272,0.00018294046,0.00027427755,0.00030230428,0.00036112705,0.00045186785],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005844114,0.000019628309,0.00054021063,0.000039360286,0.000007310415,0.00015587856,0.00003547411,0.00024944768,0.99196774,0.00034526968,0.00016581276,0.006415536],"study_design_scores_gemma":[0.000021760905,0.00052188884,0.0038821083,0.000009942253,0.000025270792,0.0007736123,0.000047347643,0.008896345,0.9787,0.00010993265,0.006995293,0.000016362314],"about_ca_topic_score_codex":0.0002551808,"about_ca_topic_score_gemma":0.0005017885,"teacher_disagreement_score":0.0006041474,"about_ca_system_score_codex":0.00013834982,"about_ca_system_score_gemma":0.00011773111,"threshold_uncertainty_score":0.0020210743},"labels":[],"label_agreement":null},{"id":"W4408520706","doi":"10.1109/tcpmt.2025.3552029","title":"A Novel 3-D-Printed Passive Microfluidic Temperature Sensor for Medical Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université Laval; Université de Moncton","funders":"Umm Al-Qura University","keywords":"Microfluidics; 3d printed; Materials science; Optoelectronics; Nanotechnology; Computer science; Electronic engineering; Biomedical engineering; Engineering","score_opus":0.008669363354741777,"score_gpt":0.23452464375767015,"score_spread":0.22585528040292838,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4408520706","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.27081317,0.006804675,0.70512366,0.0013847672,0.0014010043,0.0002701385,0.0007006267,0.004760324,0.008741654],"genre_scores_gemma":[0.62335956,0.0023588366,0.36409,0.0007993307,0.0002509945,0.00019482295,0.00026011484,0.00010868659,0.008577682],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999762,0.000017293612,0.000012979446,0.00006426079,0.0001296316,0.000013736353],"domain_scores_gemma":[0.99982786,0.000051590254,0.00004399638,0.000020495487,0.000037528487,0.000018484547],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00019317263,0.00043404775,0.00038792964,0.0002539619,0.00015416964,0.00038177986,0.00084425375,0.0009903588,0.00088573655],"category_scores_gemma":[0.000346888,0.0003247927,0.00042546907,0.00018217282,0.00024801717,0.00052809116,0.00028542348,0.00034592647,0.0005851377],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000031103868,0.000021696404,0.00008695835,0.00011216604,0.000006040822,0.00011267014,0.000013083327,0.0010144144,0.98719597,0.0003176406,0.00032208842,0.0107662715],"study_design_scores_gemma":[0.000018658497,0.00026541145,0.0009306234,0.000010790731,0.000026485026,0.0010374455,0.0000067400565,0.019655587,0.9691685,0.00021580474,0.008626121,0.000037935733],"about_ca_topic_score_codex":0.00011668255,"about_ca_topic_score_gemma":0.00022983913,"teacher_disagreement_score":0.0009903588,"about_ca_system_score_codex":0.0002595571,"about_ca_system_score_gemma":0.00027415575,"threshold_uncertainty_score":0.002963066},"labels":[],"label_agreement":null},{"id":"W4409014793","doi":"10.1109/tcpmt.2025.3556594","title":"Unified Microwave Terahertz Waveguide Coupler for Multiband Wireless Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Terahertz radiation; Microwave; Optoelectronics; Materials science; Waveguide; Wireless; Terahertz metamaterials; Physics; Optics; Computer science; Telecommunications; Far-infrared laser","score_opus":0.00980170379380964,"score_gpt":0.2228124671870814,"score_spread":0.21301076339327174,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409014793","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.51175636,0.010360067,0.4430504,0.0008179429,0.00057386863,0.00023625577,0.00043072153,0.0026029844,0.03017138],"genre_scores_gemma":[0.83994347,0.0024518173,0.1378053,0.0003217574,0.00015934034,0.00013331755,0.00027879357,0.00012884922,0.018777428],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996656,0.00004504341,0.000019024983,0.00009959087,0.00014304028,0.000027626334],"domain_scores_gemma":[0.9997514,0.00003062883,0.00008251319,0.000040341016,0.00007293814,0.000022242206],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00038473876,0.00046834123,0.00042495952,0.00040813393,0.00022556793,0.0006440354,0.00059559604,0.0005219382,0.0014626886],"category_scores_gemma":[0.00023620404,0.00031034913,0.00043658985,0.0003580929,0.000212695,0.0008342313,0.00041673798,0.0005277037,0.0012020603],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012746757,0.000038846134,0.00028987243,0.00011238787,0.000033117147,0.00018848047,0.000065363674,0.00054972066,0.9782642,0.0046386006,0.00072409457,0.0149678895],"study_design_scores_gemma":[0.000044978235,0.0004861311,0.0016428531,0.00001951474,0.00009802756,0.0014831385,0.000046493842,0.02366176,0.94130075,0.00053980754,0.030630698,0.00004580381],"about_ca_topic_score_codex":0.0001541182,"about_ca_topic_score_gemma":0.00039503968,"teacher_disagreement_score":0.0014626886,"about_ca_system_score_codex":0.00027487392,"about_ca_system_score_gemma":0.00016452443,"threshold_uncertainty_score":0.0048931837},"labels":[],"label_agreement":null},{"id":"W4409883267","doi":"10.1109/tcpmt.2025.3564969","title":"Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Band-pass filter; Mode (computer interface); Materials science; Line (geometry); Quarter (Canadian coin); Electronic engineering; Acoustics; Optoelectronics; Computer science; Physics; Engineering; Mathematics; Geometry","score_opus":0.00941839517516994,"score_gpt":0.22431637470165058,"score_spread":0.21489797952648065,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409883267","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7552909,0.0017450218,0.23407423,0.00023256497,0.0001477826,0.000054764576,0.00016006624,0.001307346,0.006987317],"genre_scores_gemma":[0.872852,0.00056159694,0.122969195,0.000060956387,0.00005441874,0.000059193753,0.00014876823,0.00010421494,0.00318957],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998559,0.00001486184,0.000008172059,0.00004587751,0.000046218905,0.000028894296],"domain_scores_gemma":[0.99979025,0.000039625455,0.00007277145,0.000037225698,0.00004171077,0.000018378423],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022122775,0.00048741067,0.00040779272,0.00020750724,0.00019055644,0.00043923562,0.00064578245,0.0005412091,0.00077973306],"category_scores_gemma":[0.00021456303,0.0002977966,0.00038489903,0.0001709929,0.0002411553,0.0007868411,0.00027167526,0.00038316663,0.0004811154],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011959462,0.000025867577,0.00023645387,0.00006420385,0.000015755348,0.000058018784,0.000052993164,0.00058668526,0.98916143,0.0009355304,0.00015647007,0.008586949],"study_design_scores_gemma":[0.000038136044,0.0003701114,0.0011080772,0.000010049249,0.00003381645,0.0003111082,0.0000348887,0.021466928,0.9673976,0.00018437281,0.009019303,0.000025669537],"about_ca_topic_score_codex":0.00044314325,"about_ca_topic_score_gemma":0.0008192226,"teacher_disagreement_score":0.00077973306,"about_ca_system_score_codex":0.00038152953,"about_ca_system_score_gemma":0.00023232725,"threshold_uncertainty_score":0.0027682185},"labels":[],"label_agreement":null},{"id":"W4410086780","doi":"10.1109/tcpmt.2025.3567023","title":"An Algorithmic Approach to Formulate Well-Conditioned Stable Reduced-Order Models of Active Circuits","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Real-time simulation and control systems","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Siemens (Canada); University of Ottawa; Carleton University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Electronic circuit; Computer science; Order (exchange); Electronic engineering; Mathematical optimization; Mathematics; Electrical engineering; Engineering","score_opus":0.011199955478163234,"score_gpt":0.2265505525252999,"score_spread":0.21535059704713666,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410086780","genre_codex":"methods","genre_gemma":"methods","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"methods","genre_consensus":"methods","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0009279877,0.000015480524,0.99806875,0.000022676995,0.0000069667276,0.000018781342,0.00001203753,0.000063966174,0.0008633898],"genre_scores_gemma":[0.1924704,0.00025044518,0.80188155,0.00009035178,0.00006156146,0.00044232642,0.00017736341,0.00016956397,0.004456537],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99975187,0.00006875618,0.000014584994,0.000027465261,0.00011425691,0.000023068107],"domain_scores_gemma":[0.9995389,0.00019598873,0.00005795477,0.00008337476,0.0001080217,0.000015772433],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00068041915,0.0010334704,0.0006778848,0.0005915657,0.00040476344,0.000992886,0.001338444,0.00090425933,0.0033596905],"category_scores_gemma":[0.001399883,0.0005933738,0.0012348809,0.0003778358,0.0009068331,0.0010091749,0.001107979,0.0016979364,0.00084506464],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013657235,0.00003135927,0.00015515463,0.00007566373,0.000018854893,0.00008002703,0.00010002224,0.86239797,0.0056285807,0.11276369,0.00048775293,0.018247357],"study_design_scores_gemma":[0.0000050601097,0.000016778362,0.00001379832,0.0000055098535,0.0000031261218,0.000012021802,0.0000062013846,0.9844195,0.00071817095,0.013678146,0.0011169915,0.0000047384615],"about_ca_topic_score_codex":0.0021073641,"about_ca_topic_score_gemma":0.003724059,"teacher_disagreement_score":0.0033596905,"about_ca_system_score_codex":0.00060121017,"about_ca_system_score_gemma":0.0011780452,"threshold_uncertainty_score":0.01123935},"labels":[],"label_agreement":null},{"id":"W4411143030","doi":"10.1109/tcpmt.2025.3577738","title":"An Improved Inductance and Self-Resonance Frequency Modeling and Estimation of Single-Turn On-Chip Inductors for Millimeter-Wave Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Royal Military College of Canada","funders":"Indian Institute of Space Science and Technology; Department of Science and Technology, Government of Rajasthan; Ministry of Science Research and Technology","keywords":"Inductance; Inductor; Extremely high frequency; Resonance (particle physics); Electronic engineering; Millimeter; Optoelectronics; Materials science; RLC circuit; Turn (biochemistry); Electrical engineering; Physics; Nuclear magnetic resonance; Capacitor; Engineering; Optics; Voltage","score_opus":0.014127652404844367,"score_gpt":0.22155604040182722,"score_spread":0.20742838799698285,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4411143030","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.013971924,0.0004681298,0.9833398,0.00004606131,0.000017892511,0.000015673693,0.000044853256,0.0005975879,0.0014980995],"genre_scores_gemma":[0.74162126,0.0010926984,0.2523908,0.00008953323,0.00005883722,0.000097516524,0.00026214335,0.00019107471,0.004195986],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99944335,0.00013059832,0.000025193167,0.00010729569,0.0002532188,0.00004036552],"domain_scores_gemma":[0.9996031,0.00013425022,0.000065108085,0.000074691365,0.00011709244,0.0000057416078],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041741386,0.000927594,0.0005370114,0.00069804274,0.00019103673,0.00069504767,0.000888399,0.00066678145,0.0006899633],"category_scores_gemma":[0.0012915068,0.0003703751,0.0007330606,0.00033517627,0.00028148256,0.0015557314,0.0004044624,0.00042194242,0.0007198416],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000112588816,0.000064711385,0.0023814936,0.00041142688,0.00011687953,0.000317347,0.0002735992,0.5620369,0.23499024,0.01391922,0.0020157546,0.18335982],"study_design_scores_gemma":[0.000005250488,0.00007460801,0.0006012439,0.000019162237,0.00003441439,0.00025411963,0.000022476006,0.9502436,0.04295126,0.0016855061,0.004083954,0.00002446145],"about_ca_topic_score_codex":0.0011225326,"about_ca_topic_score_gemma":0.0014015858,"teacher_disagreement_score":0.0011225326,"about_ca_system_score_codex":0.00063983473,"about_ca_system_score_gemma":0.00032192847,"threshold_uncertainty_score":0.0046423674},"labels":[],"label_agreement":null},{"id":"W4411600095","doi":"10.1109/tcpmt.2025.3582617","title":"VO <sub>2</sub> Switch-Based Tunable 3-D Cavity Filters","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Fiber Optic Sensors","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Materials science; Optoelectronics","score_opus":0.007813286987815497,"score_gpt":0.20674954574695648,"score_spread":0.19893625875914098,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4411600095","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7807186,0.001156208,0.19830991,0.0002343763,0.00022353278,0.00009200743,0.00033097938,0.0013529912,0.017581254],"genre_scores_gemma":[0.93171555,0.0003003074,0.06239281,0.000096282616,0.00003256728,0.000051266026,0.00015035021,0.000046680027,0.0052141305],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998785,0.000009247411,0.0000053046115,0.000032970976,0.00005428794,0.0000195876],"domain_scores_gemma":[0.9998741,0.00002306941,0.00003487246,0.000014897246,0.000039782553,0.0000131401675],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012150736,0.00022559824,0.0001939833,0.00023013778,0.00017840887,0.00053639297,0.00071211543,0.00035410115,0.0008134979],"category_scores_gemma":[0.00018909598,0.00016046685,0.00024565062,0.00015818232,0.0001975957,0.0003490522,0.00023360891,0.0002073854,0.0002594742],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000097422424,0.00002719724,0.0007731099,0.000053912663,0.00002196574,0.00008399195,0.000053068627,0.002324282,0.97362536,0.0038165417,0.00042585106,0.018697405],"study_design_scores_gemma":[0.000036895126,0.0002872597,0.002655531,0.000012643718,0.000025756262,0.00037286044,0.00004309678,0.045483347,0.930872,0.00060911314,0.019550689,0.00005089707],"about_ca_topic_score_codex":0.0009554292,"about_ca_topic_score_gemma":0.0019007092,"teacher_disagreement_score":0.0009554292,"about_ca_system_score_codex":0.0005041636,"about_ca_system_score_gemma":0.0002754067,"threshold_uncertainty_score":0.0036579967},"labels":[],"label_agreement":null},{"id":"W4413212618","doi":"10.1109/tcpmt.2025.3597811","title":"Stable HIPPO-Based Circuit Macro-Modeling","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"VLSI and Analog Circuit Testing","field":"Computer Science","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Macro; Computer science; Electronic engineering; Computer architecture; Engineering; Programming language","score_opus":0.021946389548986395,"score_gpt":0.23679390555897387,"score_spread":0.21484751600998747,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4413212618","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.02308135,0.00017142948,0.9672974,0.00009463507,0.000037858666,0.00004926271,0.00029357497,0.00096593157,0.008008553],"genre_scores_gemma":[0.8900185,0.00036304386,0.09995959,0.00008451005,0.000030259409,0.00025284672,0.0004109179,0.0002220288,0.0086582955],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99982774,0.00003097061,0.000009198224,0.000044247205,0.00006407372,0.000023768242],"domain_scores_gemma":[0.9998173,0.00006869998,0.000026187889,0.000033846398,0.000044547567,0.000009371418],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024134805,0.0005811149,0.00039838033,0.00023412355,0.00023728391,0.0004404024,0.0010572094,0.00057993276,0.0028275375],"category_scores_gemma":[0.00048560367,0.00023861633,0.00059251394,0.00015111569,0.0005021613,0.0007882644,0.0005553714,0.0007568849,0.0004384688],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002481024,0.000010021836,0.00024819886,0.00003481165,0.000013484928,0.00006196279,0.000030010118,0.9710576,0.005903429,0.013711348,0.00043088009,0.008473479],"study_design_scores_gemma":[0.0000011149517,0.0000081478365,0.000038503786,0.0000012746391,0.0000023227353,0.000006552529,0.0000016126186,0.99785846,0.00060750864,0.0011299449,0.00034282546,0.0000017042444],"about_ca_topic_score_codex":0.0040084976,"about_ca_topic_score_gemma":0.005524497,"teacher_disagreement_score":0.0040084976,"about_ca_system_score_codex":0.0005772678,"about_ca_system_score_gemma":0.0006736304,"threshold_uncertainty_score":0.009459019},"labels":[],"label_agreement":null},{"id":"W4413465490","doi":"10.1109/tcpmt.2025.3599098","title":"Cost-Effective 3-D-Printable Image Dielectric Guides Based 3-dB Coupler for Millimeter-Wave Applications","year":2025,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut National de la Recherche Scientifique; Université du Québec à Montréal","funders":"","keywords":"Extremely high frequency; Dielectric; Materials science; Optoelectronics; Optics; Millimeter; Computer science; Physics","score_opus":0.015052500722390817,"score_gpt":0.2406009282446244,"score_spread":0.22554842752223359,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4413465490","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.58143586,0.003760112,0.4008405,0.00026684426,0.00017535801,0.0002087997,0.00038469996,0.003271551,0.009656191],"genre_scores_gemma":[0.63559955,0.0017626157,0.35396522,0.00021447001,0.00006607102,0.00011845176,0.00030206854,0.00016229144,0.0078091505],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998122,0.000017897184,0.00000902168,0.000033338147,0.000111035086,0.000016488066],"domain_scores_gemma":[0.9997687,0.000025808797,0.00011357289,0.000029290917,0.000046316796,0.000016284795],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00022430492,0.0005967197,0.00035370284,0.000370754,0.00011778075,0.00034204323,0.0007061979,0.00046878099,0.00060160994],"category_scores_gemma":[0.00017702968,0.00031779072,0.00040289198,0.00033474228,0.00018549757,0.00038362332,0.00023790392,0.0004052453,0.00073281233],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000037230984,0.000039709357,0.000349632,0.00010801104,0.000015073379,0.0002000666,0.000052197458,0.0006493357,0.9798252,0.0010376344,0.0004923476,0.017193547],"study_design_scores_gemma":[0.00002914264,0.00051069504,0.002054285,0.00001164926,0.00003284949,0.0014090063,0.00002961196,0.0074677053,0.9740571,0.00020036867,0.014160103,0.000037408186],"about_ca_topic_score_codex":0.00026113505,"about_ca_topic_score_gemma":0.0005843819,"teacher_disagreement_score":0.0007061979,"about_ca_system_score_codex":0.00028202412,"about_ca_system_score_gemma":0.00021429664,"threshold_uncertainty_score":0.0020462275},"labels":[],"label_agreement":null},{"id":"W4415368621","doi":"10.1109/tcpmt.2025.3623562","title":"Low-Cost Foldable Printed RGW Wideband MIMO Antenna With Additively Manufactured Dielectric Resonator","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Antenna Design and Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université du Québec en Abitibi-Témiscamingue; École de Technologie Supérieure","funders":"","keywords":"Wideband; Antenna efficiency; Bandwidth (computing); Resonator; Dielectric resonator antenna; Antenna (radio); Dielectric resonator; Dielectric; Electrical impedance","score_opus":0.008199716233820155,"score_gpt":0.20956935836236856,"score_spread":0.2013696421285484,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4415368621","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6730731,0.0012990207,0.31590766,0.00027220047,0.00026467576,0.000046352186,0.00014513939,0.0016140501,0.007377728],"genre_scores_gemma":[0.84081614,0.00045717836,0.15129602,0.00013859883,0.00006540043,0.000040782972,0.0001484381,0.00007754755,0.006959945],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997979,0.000023659995,0.000011167124,0.00005208146,0.000091031055,0.000024100636],"domain_scores_gemma":[0.99981374,0.000028551969,0.00007332204,0.00004361023,0.000024471314,0.000016406373],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000137327,0.0004628129,0.00033611513,0.0001334513,0.00007246991,0.00034128773,0.00052772637,0.00053326396,0.00047784022],"category_scores_gemma":[0.0002191347,0.0001994741,0.00045646686,0.00012863701,0.00015431276,0.00038426957,0.00030563408,0.00037702243,0.0009301286],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023471337,0.0000116681795,0.00010792028,0.000028553433,0.000006673636,0.000110203415,0.00001631142,0.00081268704,0.9922051,0.00023033336,0.00009505665,0.0063520824],"study_design_scores_gemma":[0.000010256738,0.0005044277,0.0008884606,0.0000043295236,0.000023919354,0.0008385721,0.000020830306,0.012244463,0.97907984,0.00008477237,0.006278926,0.000021120677],"about_ca_topic_score_codex":0.000063203755,"about_ca_topic_score_gemma":0.00012098316,"teacher_disagreement_score":0.00053326396,"about_ca_system_score_codex":0.00015867085,"about_ca_system_score_gemma":0.000059063277,"threshold_uncertainty_score":0.0015985966},"labels":[],"label_agreement":null},{"id":"W4416676700","doi":"10.1109/tcpmt.2025.3614737","title":"Corrections to “Stable HIPPO-Based Circuit Macro-Modeling”","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"VLSI and FPGA Design Techniques","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McGill University","funders":"","keywords":"Equivalent circuit; Integrated circuit; Network analysis; Electronic circuit; Circuit design; Transient analysis; Control theory (sociology)","score_opus":0.017829663256093684,"score_gpt":0.23713007161565666,"score_spread":0.219300408359563,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416676700","genre_codex":"methods","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.005890783,0.0013438959,0.7420528,0.0063641206,0.020142974,0.00017813857,0.009579547,0.046315793,0.16813189],"genre_scores_gemma":[0.14711753,0.0017713018,0.45953044,0.009902629,0.0029558772,0.0007414814,0.01220475,0.06953664,0.29623932],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9991548,0.0001353515,0.000035787707,0.00010966515,0.0004782979,0.000086156164],"domain_scores_gemma":[0.9990835,0.0001270619,0.000034973793,0.00039571154,0.00031934495,0.000039390517],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00057934166,0.0017158221,0.00070230995,0.0009649424,0.0010647238,0.0018506206,0.0029483512,0.0015089666,0.1109486],"category_scores_gemma":[0.003807781,0.00089960155,0.0012059088,0.0007924994,0.0007322036,0.0031662018,0.0015962434,0.004631037,0.055326253],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016849792,0.000044762022,0.00044498133,0.00024084811,0.00006534237,0.00032530687,0.00021057844,0.012572582,0.007434098,0.361216,0.5546652,0.062611684],"study_design_scores_gemma":[0.000051797215,0.000037356516,0.00045556147,0.000091043934,0.000029860854,0.00031710946,0.00005245043,0.059941065,0.012391325,0.11642832,0.81011546,0.00008859055],"about_ca_topic_score_codex":0.005896419,"about_ca_topic_score_gemma":0.012606173,"teacher_disagreement_score":0.1109486,"about_ca_system_score_codex":0.002242135,"about_ca_system_score_gemma":0.0011565121,"threshold_uncertainty_score":0.37116003},"labels":[],"label_agreement":null},{"id":"W7092212537","doi":"10.1109/tcpmt.2025.3622232","title":"SIW-Fed Inner CDRA Inserted Into Outer Frustum-Capped DRA to Reduce ECC for CF-mMIMO Application","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Antenna Design and Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Concordia University","funders":"Science and Engineering Research Board","keywords":"Antenna (radio); Stacking; Trimming; Resonator; Dielectric resonator antenna; Envelope (radar); MIMO; Dielectric; Substrate (aquarium)","score_opus":0.011046049830412293,"score_gpt":0.24531680288453772,"score_spread":0.23427075305412542,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7092212537","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.75809443,0.0009189998,0.22949806,0.00015482683,0.00020267273,0.00004277428,0.00015695725,0.0013364076,0.009594869],"genre_scores_gemma":[0.91218793,0.00018175741,0.084673904,0.00009353491,0.00004008548,0.000024741916,0.00011739717,0.00006453173,0.002615994],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99986684,0.000018502058,0.0000066009766,0.000034725028,0.00004534421,0.000028084734],"domain_scores_gemma":[0.99960274,0.000042254287,0.00017317483,0.00007231204,0.00008194082,0.000027650163],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011948014,0.0005597741,0.00021562207,0.00022584683,0.00012391256,0.0004094802,0.0005399028,0.00040343349,0.0005863374],"category_scores_gemma":[0.00024118174,0.00015712882,0.00038942616,0.0002096305,0.00017840446,0.00033787714,0.00024095536,0.00031644807,0.00086463254],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000053870714,0.000022333039,0.00036194225,0.0000517872,0.000017482022,0.00015085912,0.000025366862,0.0018151551,0.984591,0.00073612214,0.00027002048,0.011904134],"study_design_scores_gemma":[0.000011100924,0.0005319092,0.0016305465,0.000008524355,0.000038716666,0.00077857263,0.000032272103,0.019496057,0.9684049,0.00014031552,0.008903361,0.000023853352],"about_ca_topic_score_codex":0.00017096894,"about_ca_topic_score_gemma":0.00044270523,"teacher_disagreement_score":0.0005863374,"about_ca_system_score_codex":0.00021732136,"about_ca_system_score_gemma":0.00015566335,"threshold_uncertainty_score":0.0019614697},"labels":[],"label_agreement":null},{"id":"W7113903501","doi":"10.1109/tcpmt.2025.3642754","title":"Reliability Modelling of Optical Fiber Couplers Based on Accelerated Tensile Cyclic Tests","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Advanced Fiber Optic Sensors","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Reliability (semiconductor); Ultimate tensile strength; Adhesive; Optical fiber; Ribbon; Tensile testing; Delamination (geology); Stress (linguistics)","score_opus":0.023239424286207108,"score_gpt":0.24592710776013696,"score_spread":0.22268768347392986,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7113903501","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.5095767,0.0010748083,0.47940573,0.00013419462,0.000044378037,0.00018127981,0.0005060406,0.0008335779,0.008243278],"genre_scores_gemma":[0.980275,0.00036557746,0.01691045,0.000014852449,0.0000132716,0.00014407499,0.00012568936,0.000052920805,0.0020982216],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99969494,0.000055221026,0.00001715497,0.000055848832,0.00013963813,0.0000371839],"domain_scores_gemma":[0.9993673,0.000254494,0.0001511217,0.00008376456,0.00012821559,0.000015076478],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00052306824,0.00079465774,0.00028725475,0.00079878856,0.00016283155,0.0003297677,0.0009817319,0.0008038078,0.0010648551],"category_scores_gemma":[0.0016938469,0.00033967546,0.00076521974,0.00028914903,0.00035947643,0.00047099745,0.00022381953,0.0003905147,0.00033135727],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003665645,0.000033583678,0.0015290251,0.000053646094,0.00002188773,0.00012395809,0.000061913626,0.9584343,0.027692642,0.0016285527,0.0001641381,0.0102196755],"study_design_scores_gemma":[9.915904e-7,0.00003939019,0.00052090443,0.000003110618,0.00000387444,0.000023943066,0.0000028588224,0.99697745,0.0020682637,0.00020084753,0.0001544975,0.000003889218],"about_ca_topic_score_codex":0.003564988,"about_ca_topic_score_gemma":0.0018380905,"teacher_disagreement_score":0.003564988,"about_ca_system_score_codex":0.0004563892,"about_ca_system_score_gemma":0.00034059654,"threshold_uncertainty_score":0.0070884824},"labels":[],"label_agreement":null},{"id":"W7113910473","doi":"10.1109/tcpmt.2025.3642792","title":"Battery-Less Icing Detection Using a Self-Calibrated SIW Wireless Sensor","year":2025,"lang":"","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"RFID technology advancements","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wireless sensor network; Wireless; Antenna (radio); Ultra high frequency; Relative permittivity; Electro-optical sensor; Energy harvesting; Radio frequency; Noise (video); Frequency band","score_opus":0.012341286691001449,"score_gpt":0.22997481616783316,"score_spread":0.2176335294768317,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7113910473","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6925686,0.0013872798,0.3008405,0.00024016072,0.00018804571,0.00008671533,0.00018611566,0.0007934898,0.003709156],"genre_scores_gemma":[0.9140816,0.0007703399,0.08257081,0.00014571888,0.000047609563,0.000059939313,0.00015723966,0.000042074756,0.0021246758],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997992,0.000023006101,0.000012321456,0.000062651925,0.00008603794,0.000016882264],"domain_scores_gemma":[0.9997632,0.000039319435,0.00007992873,0.00003559842,0.00007062402,0.000011281851],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020369599,0.00038569077,0.00032587576,0.00023206271,0.0000856489,0.00028698402,0.0006519451,0.0003583849,0.0003110046],"category_scores_gemma":[0.00046126256,0.00019808237,0.00025943638,0.00022804613,0.00023497893,0.0008099079,0.00034609603,0.0002751002,0.00033404538],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000059107842,0.000018719275,0.0013050159,0.000117569376,0.000016664566,0.00009858032,0.000051636947,0.0010497118,0.97897446,0.00037929678,0.00021308054,0.017716125],"study_design_scores_gemma":[0.000012132641,0.00027151708,0.0022515568,0.000011060948,0.000035652916,0.00042449398,0.00005646086,0.036904044,0.9561037,0.00012784454,0.003776718,0.000024903802],"about_ca_topic_score_codex":0.0001465837,"about_ca_topic_score_gemma":0.00028873663,"teacher_disagreement_score":0.0006519451,"about_ca_system_score_codex":0.00017012755,"about_ca_system_score_gemma":0.00015678206,"threshold_uncertainty_score":0.0012343526},"labels":[],"label_agreement":null}]}