{"meta":{"query_hash":"360cd07c0f02","filters":{"venue":"Journal of Surface Mount Technology"},"cohort_total":42,"direct_labels_cover":0,"predictions_cover":42,"exported":42,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/360cd07c0f02","api":"https://metacan.xera.ac/api/v1/cohort?venue=Journal+of+Surface+Mount+Technology"},"results":[{"id":"W2949529026","doi":"10.37665/smt.v36i3.6","title":"Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process","year":2023,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"Egg Farmers of Canada","keywords":"Eutectic system; Soldering; Materials science; Bismuth; Dissolution; Metallurgy; Melting point; Solder paste; Alloy; Ball grid array; Reflow soldering; Melting temperature; Composite material; Chemistry","score_opus":0.013200259248692645,"score_gpt":0.2300464754234767,"score_spread":0.21684621617478406,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2949529026","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9982122,0.0005295524,0.00068150513,0.000012084351,0.00002770925,0.000012649589,0.00004478258,0.000045996883,0.00043350182],"genre_scores_gemma":[0.99696654,0.00018861287,0.0011144009,0.000014170119,0.000007787469,0.000012033665,0.00009910378,0.000030590854,0.0015666558],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99947435,0.00009007719,0.00004959618,0.00009191532,0.00024311543,0.000051014027],"domain_scores_gemma":[0.9994592,0.00009806223,0.0001444595,0.00004776105,0.00019999675,0.00005047363],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00043144578,0.00050484604,0.00036488718,0.00043972785,0.00015933812,0.00038201574,0.00029381228,0.00041778488,0.0016176015],"category_scores_gemma":[0.00097138964,0.00035539523,0.00030398258,0.00033050228,0.00012387593,0.00037098382,0.00015983297,0.0002375354,0.00071083294],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005300228,0.000032031854,0.0008989148,0.00009093735,0.000021242855,0.00006888897,0.000090241374,0.00024221782,0.994965,0.000033738845,0.000043543303,0.0029830674],"study_design_scores_gemma":[0.00001415739,0.0017028723,0.0044436213,0.000007961459,0.000046213092,0.0000814088,0.000051004994,0.0011348672,0.99168056,0.00001008298,0.00081924465,0.000007910509],"about_ca_topic_score_codex":0.00036184385,"about_ca_topic_score_gemma":0.0006767442,"teacher_disagreement_score":0.0016176015,"about_ca_system_score_codex":0.00017864004,"about_ca_system_score_gemma":0.000119852935,"threshold_uncertainty_score":0.005411446},"labels":[],"label_agreement":null},{"id":"W3089628143","doi":"10.37665/smt.v33i2.8","title":"Impact of Conformal Coating Induced Stress on Wafer Level Chip Scale Package Thermal Cycling Performance","year":2020,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Zymeworks (Canada)","funders":"","keywords":"Conformal coating; Materials science; Temperature cycling; Coating; Composite material; Thermal expansion; Thermal","score_opus":0.03106445055355735,"score_gpt":0.25452697412077535,"score_spread":0.223462523567218,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3089628143","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9987362,0.000240279,0.000558618,0.000010331329,0.000013408052,0.000008522254,0.00006902884,0.000033422566,0.00033010772],"genre_scores_gemma":[0.9991912,0.00007769576,0.0002774779,0.000010088074,0.0000023943094,0.0000045714,0.000052618932,0.000010296093,0.00037362473],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99981445,0.000015934402,0.000012400083,0.00003509337,0.000084831205,0.000037239275],"domain_scores_gemma":[0.9996026,0.0000661536,0.000083439176,0.00005426851,0.00016203006,0.000031555377],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00012550267,0.00025928675,0.00021211298,0.00015375536,0.00010037594,0.0002553748,0.00015380493,0.00020007507,0.0013907738],"category_scores_gemma":[0.00054869073,0.00014713587,0.00018134997,0.00013876348,0.00014347586,0.00014928692,0.00017068975,0.00018248403,0.00017554763],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007617952,0.000012054916,0.0013965729,0.00003705276,0.000010021811,0.00006468436,0.0000278248,0.00043247268,0.99551576,0.000011629497,0.000039712784,0.0023761047],"study_design_scores_gemma":[0.0000053054323,0.0010433969,0.027139531,0.000007628843,0.000029985056,0.00013957566,0.00006399917,0.0022360715,0.96866846,0.000010933067,0.00064436236,0.000010693164],"about_ca_topic_score_codex":0.0010011523,"about_ca_topic_score_gemma":0.001379327,"teacher_disagreement_score":0.0013907738,"about_ca_system_score_codex":0.00018480519,"about_ca_system_score_gemma":0.000104892475,"threshold_uncertainty_score":0.0046526194},"labels":[],"label_agreement":null},{"id":"W3091168940","doi":"10.37665/smt.v33i2.10","title":"Edgebond and Edgefill Induced Loading Effect on Large WLCSP Thermal Cycling Performance","year":2020,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Zymeworks (Canada)","funders":"Cisco Systems","keywords":"Temperature cycling; Materials science; Cycling; Reliability (semiconductor); Stress (linguistics); Degradation (telecommunications); Chip-scale package; Interconnection; Power cycling; Wafer; Thermal; Composite material; Structural engineering; Electronic engineering; Optoelectronics; Computer science; Engineering","score_opus":0.010026401900691059,"score_gpt":0.21141181202797923,"score_spread":0.20138541012728817,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3091168940","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99881893,0.00011947138,0.0006635492,0.000007810308,0.0000061827764,0.000004539851,0.000045712946,0.00005284398,0.000280872],"genre_scores_gemma":[0.99887615,0.00005231138,0.00036295477,0.000008653554,0.0000021867927,0.000008315933,0.00007243846,0.000019646799,0.0005973672],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998498,0.000016627648,0.000007805137,0.00003455183,0.000047508274,0.00004364709],"domain_scores_gemma":[0.9997075,0.000061781495,0.000053989756,0.000038564136,0.00010308691,0.000035023284],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001332241,0.00038183972,0.0001772974,0.00021803261,0.00016688924,0.00018232888,0.00019350741,0.00023889929,0.0025231612],"category_scores_gemma":[0.00039104407,0.00016700449,0.00011232017,0.0001806038,0.00020046825,0.0002448474,0.00020782978,0.00017786669,0.00030808328],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00018116324,0.00001852387,0.0010477458,0.000046307225,0.0000054496136,0.00007197521,0.000059526945,0.00043533405,0.99487454,0.000020877917,0.000073010764,0.0031654318],"study_design_scores_gemma":[0.000004924106,0.0008260806,0.018943155,0.000007309722,0.000015832244,0.00011317541,0.000070230744,0.0028361692,0.97662467,0.000014139636,0.00053501,0.0000092983],"about_ca_topic_score_codex":0.0004047179,"about_ca_topic_score_gemma":0.0010045556,"teacher_disagreement_score":0.0025231612,"about_ca_system_score_codex":0.000120469835,"about_ca_system_score_gemma":0.000094468734,"threshold_uncertainty_score":0.008440793},"labels":[],"label_agreement":null},{"id":"W3147875004","doi":"10.37665/smt.v34i1.12","title":"Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar","year":2021,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Antenna Design and Optimization","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Ball grid array; Temperature cycling; Failure mode and effects analysis; Radar; Reliability (semiconductor); Automotive industry; Thermal; Wafer; Microwave; Materials science; Vibration fatigue; Ball (mathematics); Printed circuit board; Vibration; Electronic engineering; Mechanical engineering; Automotive engineering; Soldering; Acoustics; Engineering; Fatigue testing; Structural engineering; Electrical engineering; Optoelectronics; Composite material; Telecommunications; Power (physics)","score_opus":0.015878264811661855,"score_gpt":0.22249250011029348,"score_spread":0.20661423529863163,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3147875004","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9919945,0.00052441226,0.005903356,0.000032292803,0.000032356624,0.000013341711,0.00015490616,0.00042286134,0.0009218598],"genre_scores_gemma":[0.99839336,0.00007373353,0.00074343407,0.0000076179167,0.000004147909,0.0000069486396,0.00011471517,0.00003807063,0.0006179152],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996972,0.00007243055,0.00000976993,0.00005503577,0.00010934517,0.0000561522],"domain_scores_gemma":[0.99938524,0.00016207904,0.00012535024,0.000108384396,0.00018054119,0.000038399205],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00034313163,0.0005154064,0.0003700709,0.00025740347,0.00015262797,0.00034215054,0.0004995729,0.0003699298,0.0018370802],"category_scores_gemma":[0.0008806092,0.00019709123,0.00032562547,0.00018370013,0.00015618908,0.00034140144,0.00016707346,0.00018286983,0.0005133376],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0014101675,0.00022795996,0.016340705,0.0005228142,0.00024216509,0.0010462874,0.00041321976,0.12870356,0.7999944,0.00056965346,0.002068948,0.048460025],"study_design_scores_gemma":[0.00010340749,0.015376183,0.045925077,0.000085256084,0.0004009846,0.0007961969,0.00020614598,0.30827668,0.6236744,0.00023219771,0.0048321662,0.000091353795],"about_ca_topic_score_codex":0.00047646274,"about_ca_topic_score_gemma":0.00047410646,"teacher_disagreement_score":0.0018370802,"about_ca_system_score_codex":0.0003484569,"about_ca_system_score_gemma":0.00014524677,"threshold_uncertainty_score":0.006145656},"labels":[],"label_agreement":null},{"id":"W3151243527","doi":"10.37665/smt.v34i1.23","title":"Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms","year":2021,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"","funders":"University of Toronto","keywords":"Whisker; Materials science; Tin; Soldering; Metallurgy; Alloy; Bismuth","score_opus":0.016659576583750862,"score_gpt":0.2195099258202323,"score_spread":0.20285034923648143,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3151243527","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99935466,0.0001528443,0.0002284593,0.0000037647358,0.0000067392216,0.0000038620533,0.000042312262,0.000015812655,0.00019142852],"genre_scores_gemma":[0.9983833,0.00009090875,0.000532648,0.0000045290635,0.0000022572776,0.0000060438597,0.00005857929,0.000008924097,0.0009127844],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99991035,0.000007983067,0.0000056026975,0.000022965516,0.000034386736,0.00001881363],"domain_scores_gemma":[0.9998423,0.000033274286,0.000045542707,0.000018856354,0.000038350732,0.000021663474],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010972695,0.00017752174,0.00017960074,0.00025747073,0.00017511779,0.00023805616,0.0002121358,0.00020944988,0.0007571569],"category_scores_gemma":[0.00017133384,0.00014345685,0.00014259166,0.00020424384,0.00016206728,0.00020464598,0.000117810974,0.00013079673,0.00012739944],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000074032985,0.000009051394,0.00063728925,0.000024496725,0.000005167338,0.00010057431,0.00007686505,0.000086402084,0.9982211,0.00001817552,0.000014819142,0.0007320322],"study_design_scores_gemma":[0.0000053593617,0.00031316798,0.009910591,0.000003669341,0.000018310244,0.000059764658,0.0001114942,0.0010108431,0.98817223,0.000007892302,0.00038255402,0.00000427772],"about_ca_topic_score_codex":0.0008495071,"about_ca_topic_score_gemma":0.0015250964,"teacher_disagreement_score":0.0008495071,"about_ca_system_score_codex":0.0001768392,"about_ca_system_score_gemma":0.00007544702,"threshold_uncertainty_score":0.002532959},"labels":[],"label_agreement":null},{"id":"W4383110208","doi":"10.37665/smt.v36i1.34","title":"Mechanical Characterization of SAC305 and SnPb36Ag2 BGA Assemblies Under Static Flexural Loading","year":2023,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"","keywords":"Ball grid array; Flexural strength; Structural engineering; Materials science; Finite element method; Soldering; Fixture; Printed circuit board; Composite material; Bending; Test fixture; Deflection (physics); Oriented strand board; Three point flexural test; Engineering; Mechanical engineering; Electrical engineering","score_opus":0.014466142967425074,"score_gpt":0.2395034629494255,"score_spread":0.22503731998200044,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4383110208","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99802727,0.00027918274,0.00088588643,0.000010723142,0.000016260337,0.000008223059,0.0002263786,0.000062380466,0.00048358255],"genre_scores_gemma":[0.9976412,0.0000806774,0.00082788354,0.000012515363,0.0000040286877,0.000011189422,0.00021428401,0.000015457976,0.0011927009],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996222,0.000035525543,0.000029367735,0.000062118634,0.00019867576,0.000052181233],"domain_scores_gemma":[0.9993766,0.00007105724,0.000112806556,0.000067013934,0.0002756137,0.000096996824],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003363794,0.00039681987,0.00026779438,0.000897737,0.0003330869,0.00019153867,0.00027445154,0.00039321312,0.0016191038],"category_scores_gemma":[0.00041887554,0.00018862203,0.00019665872,0.0005218193,0.00020880882,0.00018648145,0.00017466854,0.0001899252,0.00047996565],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00011405336,0.000022255035,0.0023956501,0.00006974908,0.000008089965,0.00015438041,0.00012827951,0.0006306962,0.99294585,0.000020847916,0.00011454354,0.0033956068],"study_design_scores_gemma":[0.000008770168,0.0023291162,0.18067223,0.00002242563,0.000060052917,0.00048512753,0.00058671663,0.0054819128,0.80833787,0.00003163884,0.0019435551,0.000040672294],"about_ca_topic_score_codex":0.0012656756,"about_ca_topic_score_gemma":0.0025713583,"teacher_disagreement_score":0.0016191038,"about_ca_system_score_codex":0.00014911349,"about_ca_system_score_gemma":0.00009300215,"threshold_uncertainty_score":0.005416453},"labels":[],"label_agreement":null},{"id":"W4400681988","doi":"10.37665/631d5y77","title":"Condition Monitoring System: A Flexible Hybrid Electronics Approach for Sealed Container Applications","year":2024,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Embedded Systems and FPGA Design","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Container (type theory); Electronics; Computer science; Engineering; Embedded system; Electrical engineering; Mechanical engineering","score_opus":0.01021126746742541,"score_gpt":0.2465199376850915,"score_spread":0.2363086702176661,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4400681988","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4092505,0.0018015442,0.5628168,0.00024547588,0.00037873574,0.00081001176,0.00084673025,0.010758685,0.013091501],"genre_scores_gemma":[0.8394278,0.0003725053,0.14879738,0.00016720111,0.00007069228,0.00019170305,0.0003670867,0.00016888058,0.010436718],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993782,0.000070262744,0.000038075268,0.00018701382,0.00027349434,0.000052779866],"domain_scores_gemma":[0.9996376,0.000067267676,0.00006834524,0.00009561084,0.000106852494,0.000024176834],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00044062076,0.00053219934,0.00044386726,0.0005815221,0.00018073128,0.00077315647,0.001401361,0.00068155944,0.0034247653],"category_scores_gemma":[0.00051892165,0.00023823735,0.0002698926,0.0004068837,0.00023926355,0.00087240624,0.0005498509,0.00023236714,0.00093358144],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006861921,0.00012650015,0.001976583,0.00023570405,0.000043483393,0.0006126159,0.000117321004,0.0024207858,0.8476758,0.00095748436,0.0015246547,0.14362289],"study_design_scores_gemma":[0.00008681663,0.0026126143,0.011521213,0.00004071572,0.000095455056,0.0020951312,0.000087863045,0.043404825,0.907813,0.00032194305,0.031787965,0.00013248426],"about_ca_topic_score_codex":0.0003338168,"about_ca_topic_score_gemma":0.00034057006,"teacher_disagreement_score":0.0034247653,"about_ca_system_score_codex":0.0002290673,"about_ca_system_score_gemma":0.00017719703,"threshold_uncertainty_score":0.011456966},"labels":[],"label_agreement":null},{"id":"W4416879825","doi":"10.37665/jsmtywpng58628","title":"iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry","year":2008,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Soldering; Reliability (semiconductor); Alloy; Supply chain; Ball grid array; Printed circuit board","score_opus":0.01908028371262318,"score_gpt":0.25023684933763274,"score_spread":0.23115656562500955,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879825","genre_codex":"other","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":"other","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.1803959,0.045125674,0.035600144,0.009665157,0.0013121316,0.0018894623,0.041713808,0.003765206,0.6805326],"genre_scores_gemma":[0.4797146,0.037887476,0.07862237,0.0021762368,0.00070354436,0.00126449,0.095578656,0.0006779878,0.30337468],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99570954,0.0004059781,0.00013956336,0.00027008247,0.0032883927,0.0001864192],"domain_scores_gemma":[0.99515367,0.00047165,0.00041495505,0.00035208248,0.003268291,0.00033936897],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0058177533,0.0005918468,0.00042192932,0.0037998308,0.0008187906,0.0032487542,0.0014183633,0.0018195229,0.017448379],"category_scores_gemma":[0.0035199614,0.00027647772,0.00033968483,0.0033019846,0.00039495065,0.0015992838,0.00079176424,0.0009346865,0.008161678],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0025616547,0.0017553788,0.017247148,0.0022388475,0.00007336692,0.00077182835,0.00054643105,0.0063090124,0.06607234,0.026902251,0.19122572,0.684296],"study_design_scores_gemma":[0.000054276104,0.0013337203,0.012604784,0.00028505168,0.000040838488,0.00035267867,0.0003283476,0.002996014,0.050029017,0.0015222844,0.93040884,0.00004422917],"about_ca_topic_score_codex":0.0065784627,"about_ca_topic_score_gemma":0.0095999995,"teacher_disagreement_score":0.017448379,"about_ca_system_score_codex":0.0021400831,"about_ca_system_score_gemma":0.0039318614,"threshold_uncertainty_score":0.05837059},"labels":[],"label_agreement":null},{"id":"W4416879854","doi":"10.37665/jsmtpsuej25516","title":"The Study of Dissolution of Bi Precipitates in Sn Using a Novel in Situ Heating Technique in the SEM","year":2019,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Dissolution; Scanning electron microscope; Microstructure; Soldering; Kinetics; Alloy; In situ; Optical microscope","score_opus":0.016378545081696613,"score_gpt":0.26416199361128484,"score_spread":0.24778344852958822,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879854","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96381253,0.00085979956,0.03158639,0.00005449171,0.00005235816,0.000043361877,0.0001843109,0.00024008066,0.0031666406],"genre_scores_gemma":[0.9624166,0.00048258738,0.031540044,0.000035353125,0.000011754063,0.000036977322,0.00016973789,0.00005371356,0.0052532023],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998971,0.000013262807,0.000009195468,0.00002696504,0.000038738515,0.000014726934],"domain_scores_gemma":[0.99984026,0.00003814726,0.000035338166,0.000023281043,0.000051282594,0.000011782247],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00017197724,0.00025526452,0.00015403255,0.00031651626,0.00022513668,0.00018957727,0.00020600329,0.00023635048,0.00097203767],"category_scores_gemma":[0.00014017838,0.00020388952,0.00014357836,0.00016395924,0.00015890402,0.0001955637,0.00013393282,0.00038813511,0.0002077337],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000019858491,0.000005937157,0.00017294023,0.000016915354,0.0000025336506,0.000025786367,0.000027678774,0.000026583179,0.99862266,0.00004128867,0.00001156693,0.0010263425],"study_design_scores_gemma":[0.0000015653409,0.000049543018,0.0032029685,0.0000020742502,0.0000071623863,0.00012917297,0.00002895982,0.0010071949,0.9948843,0.000013016107,0.00067118567,0.0000029596931],"about_ca_topic_score_codex":0.00076208945,"about_ca_topic_score_gemma":0.0017877503,"teacher_disagreement_score":0.00097203767,"about_ca_system_score_codex":0.00017194446,"about_ca_system_score_gemma":0.000093267874,"threshold_uncertainty_score":0.003251791},"labels":[],"label_agreement":null},{"id":"W4416879875","doi":"10.37665/jsmtyfjyr32353","title":"Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys","year":2019,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Microstructure; Creep; Bismuth; Intermetallic; Reliability (semiconductor); Temperature cycling","score_opus":0.010454911167370016,"score_gpt":0.21375892952679024,"score_spread":0.20330401835942022,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879875","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9989052,0.00042188636,0.00030832208,0.000007765704,0.000010890386,0.000007452722,0.000041195402,0.00001850393,0.00027883975],"genre_scores_gemma":[0.99850756,0.0002132647,0.00054833235,0.000009675212,0.000003162404,0.0000075966595,0.00006336122,0.000012466525,0.0006344133],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99980265,0.000030937448,0.000016164255,0.00003375635,0.00007404401,0.000042450167],"domain_scores_gemma":[0.9998116,0.000026886984,0.00006844428,0.000021427139,0.000049589074,0.000022120721],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016606081,0.00026713673,0.00021136779,0.00028169708,0.0001481988,0.0002132384,0.00021462729,0.00021824999,0.0008962102],"category_scores_gemma":[0.0002909889,0.00019023857,0.00019057698,0.00026836744,0.00014893276,0.00018057952,0.00009771866,0.00021063849,0.00019388196],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000097347955,0.000021218153,0.00039142283,0.000034889927,0.00000833801,0.000051206385,0.000030529438,0.00013716824,0.998245,0.000017693028,0.000014630357,0.00095052324],"study_design_scores_gemma":[0.0000042806582,0.00044420466,0.0092110755,0.0000036294155,0.000019590425,0.00005354874,0.000041173622,0.0004790986,0.98933685,0.000004450493,0.00039618366,0.00000595041],"about_ca_topic_score_codex":0.0010596521,"about_ca_topic_score_gemma":0.0019562636,"teacher_disagreement_score":0.0010596521,"about_ca_system_score_codex":0.00019114987,"about_ca_system_score_gemma":0.000103205006,"threshold_uncertainty_score":0.0029981136},"labels":[],"label_agreement":null},{"id":"W4416879901","doi":"10.37665/jsmtqgquw57724","title":"Strain Rate and Cyclic Dependencies of PCBA Pad Crater Susceptibility","year":2014,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Strain rate; Deformation (meteorology); Strain (injury); Failure mode and effects analysis; Printed circuit board; Soldering; Range (aeronautics); Surface-mount technology","score_opus":0.00824724130385835,"score_gpt":0.21857736478618028,"score_spread":0.21033012348232194,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879901","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99424344,0.00023258373,0.0029672363,0.000026553676,0.000014323214,0.00003755394,0.00041836375,0.00015162786,0.0019082407],"genre_scores_gemma":[0.9983382,0.00006011847,0.0005157137,0.000011250267,0.0000052218456,0.000021183436,0.00020778437,0.000023333758,0.00081716606],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99962044,0.00004788666,0.00002912911,0.000075971126,0.00016904755,0.000057549933],"domain_scores_gemma":[0.9954543,0.0021940807,0.0005723288,0.0005078837,0.0010644468,0.00020691639],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041820106,0.00025461576,0.00015332946,0.0008187329,0.00016859728,0.00016674878,0.00019903808,0.0002458739,0.002638371],"category_scores_gemma":[0.0027578021,0.00016349494,0.00018478757,0.0004301274,0.00025903573,0.00022379287,0.00024158841,0.0004131853,0.00048269352],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0010808836,0.0002596795,0.028408287,0.00012297348,0.00003120756,0.0002496963,0.00028876826,0.007718055,0.93303114,0.00013761269,0.0003115815,0.028359987],"study_design_scores_gemma":[0.000012975219,0.0037848516,0.29943505,0.00002007892,0.00003832292,0.00048355001,0.00020204324,0.03043453,0.66448116,0.000101449565,0.00096031604,0.000045691202],"about_ca_topic_score_codex":0.00095042115,"about_ca_topic_score_gemma":0.0011496685,"teacher_disagreement_score":0.002638371,"about_ca_system_score_codex":0.00014335949,"about_ca_system_score_gemma":0.00009677409,"threshold_uncertainty_score":0.008826256},"labels":[],"label_agreement":null},{"id":"W4416879915","doi":"10.37665/jsmtlkwuw50812","title":"Stretchable Polyurethane-Based Conductive Ink for E-Textile Applications","year":2019,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Electrical conductor; Inkwell; Coating; Conductive ink; Textile; Conductive polymer; Porosity; Durability; Printed electronics","score_opus":0.011043002648969217,"score_gpt":0.2441086962161711,"score_spread":0.2330656935672019,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879915","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.86358434,0.013056662,0.110109694,0.00030003054,0.00032625068,0.00010192388,0.00020431184,0.00061534654,0.011701528],"genre_scores_gemma":[0.9704376,0.0018422456,0.023335848,0.00006552508,0.000027518126,0.00002450965,0.00006697803,0.00003934151,0.0041603753],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998745,0.000018468987,0.0000119543065,0.000024036306,0.000053102107,0.000017939243],"domain_scores_gemma":[0.99985325,0.00003528003,0.00004639835,0.000013741589,0.00003768621,0.000013707624],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001229873,0.00033102513,0.00011279738,0.0002765423,0.00011434601,0.00032221986,0.00014922573,0.0003661521,0.0010564674],"category_scores_gemma":[0.0002265674,0.000106591375,0.00017423056,0.00023040586,0.0001498707,0.00041286406,0.00017103579,0.00026411697,0.00040464057],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000026785965,0.000020097974,0.00016386938,0.000095951036,0.0000029810615,0.00010343069,0.000015760943,0.00021190301,0.9896723,0.00014867354,0.0000886267,0.009449635],"study_design_scores_gemma":[0.0000028953477,0.00010717264,0.0006064284,0.000006756448,0.0000057113643,0.00017716031,0.000012974341,0.0018124924,0.9941567,0.00005351076,0.003051983,0.0000062021936],"about_ca_topic_score_codex":0.00009131645,"about_ca_topic_score_gemma":0.0001632275,"teacher_disagreement_score":0.0010564674,"about_ca_system_score_codex":0.00009370639,"about_ca_system_score_gemma":0.00007580067,"threshold_uncertainty_score":0.0035341978},"labels":[],"label_agreement":null},{"id":"W4416879936","doi":"10.37665/jsmtyhyjs54922","title":"Optical Connector Contamination/Scratches and Its Influence on Optical Signal Performance","year":2003,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electrical Contact Performance and Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Cable gland; Optical fiber; Optical fiber cable; Cladding (metalworking); Insertion loss; SIGNAL (programming language); Fiber optic splitter; Optical power; Bit error rate","score_opus":0.007239604039199722,"score_gpt":0.21210662854726633,"score_spread":0.20486702450806663,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879936","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9949344,0.00033754914,0.0039090086,0.000024972802,0.00001860093,0.000013489339,0.000059604543,0.000116155745,0.00058616203],"genre_scores_gemma":[0.9987282,0.00007730175,0.0007693659,0.000018182845,0.000004777286,0.0000034486936,0.000058331952,0.00002349219,0.000316874],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99894506,0.00022075482,0.00006104564,0.00014868232,0.00050006533,0.00012445047],"domain_scores_gemma":[0.9932608,0.002995777,0.0012715396,0.00050629023,0.00175037,0.00021520516],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007983053,0.00040072625,0.00033912668,0.00048012577,0.00025119277,0.0005611914,0.0002310271,0.00048994,0.0016974839],"category_scores_gemma":[0.0035343159,0.0002837927,0.00032286963,0.00034991896,0.00044893954,0.00041556585,0.00040292574,0.0003767501,0.00046113046],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0009416701,0.00008313142,0.022752462,0.00017301786,0.000073725685,0.0007355272,0.00014672246,0.0064827832,0.95639724,0.000070979375,0.00015415599,0.01198865],"study_design_scores_gemma":[0.000017363313,0.0032422396,0.09431984,0.000031702635,0.000120840275,0.00095683744,0.00020672596,0.018022636,0.8819695,0.00006622424,0.0010075226,0.000038555896],"about_ca_topic_score_codex":0.0006637267,"about_ca_topic_score_gemma":0.00061704445,"teacher_disagreement_score":0.0016974839,"about_ca_system_score_codex":0.00029581663,"about_ca_system_score_gemma":0.000114405455,"threshold_uncertainty_score":0.0056786537},"labels":[],"label_agreement":null},{"id":"W4416879969","doi":"10.37665/jsmtnjsgz43207","title":"Failure Mechanism of SAC 305 and SAC 405 in Harsh Environments and Influence of Board Defects Including Black Pad","year":2007,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Soldering; Ball grid array; Printed circuit board; Temperature cycling; Scanning electron microscope; Failure mechanism","score_opus":0.007396897397177095,"score_gpt":0.22154433705578977,"score_spread":0.2141474396586127,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879969","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.999119,0.0000657091,0.00062914164,0.0000021015762,0.000002867817,0.000002738741,0.00001288101,0.000020619005,0.00014509073],"genre_scores_gemma":[0.99925643,0.000017643539,0.0002542324,0.0000019564766,5.822715e-7,0.000001504329,0.000022460987,0.0000029743333,0.00044218925],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99986994,0.000012856095,0.000005765987,0.000025030306,0.000060291146,0.000026122965],"domain_scores_gemma":[0.99977,0.000026611562,0.000052618085,0.000033177424,0.00008869219,0.000028978848],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001685015,0.00024612466,0.00016297477,0.00024337134,0.00015427671,0.00016265387,0.00022311663,0.0002160866,0.0010282075],"category_scores_gemma":[0.0002517963,0.00011317025,0.00012104028,0.00009823457,0.00020063383,0.00019522631,0.00011835549,0.00009432867,0.00024653447],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021758191,0.000020681075,0.0070762234,0.000044252785,0.000013491639,0.00025787263,0.00008730838,0.0011274713,0.9865958,0.00007356564,0.00005718146,0.0044284957],"study_design_scores_gemma":[0.000009340826,0.0012914519,0.055124167,0.000006650323,0.000033467983,0.0004538973,0.00016772,0.008886894,0.93295354,0.000048796788,0.001011483,0.000012561439],"about_ca_topic_score_codex":0.0013775936,"about_ca_topic_score_gemma":0.0018287603,"teacher_disagreement_score":0.0013775936,"about_ca_system_score_codex":0.0001501731,"about_ca_system_score_gemma":0.000085756204,"threshold_uncertainty_score":0.0034397244},"labels":[],"label_agreement":null},{"id":"W4416879996","doi":"10.37665/jsmtyhirn77834","title":"Lead-Free Card Assembly and Rework for Column Grid Arrays","year":2004,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Interconnection; Design for manufacturability; Column (typography); Reliability (semiconductor); Grid; Printed circuit board; Microelectronics; Integrated circuit packaging","score_opus":0.010884625833573762,"score_gpt":0.2314414635269751,"score_spread":0.22055683769340131,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879996","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7879019,0.00082846946,0.19190495,0.00014321094,0.00038157,0.00050295435,0.00027383908,0.005122061,0.012941123],"genre_scores_gemma":[0.82245487,0.00017819727,0.16608757,0.00005816724,0.000023160203,0.00009599106,0.00029715084,0.00034353285,0.010461302],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99920696,0.00011548521,0.00003419288,0.00012332533,0.0004207275,0.00009937008],"domain_scores_gemma":[0.9991346,0.00009270105,0.0001528946,0.00027201956,0.00029453615,0.000053276395],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005730319,0.0005540438,0.00030814,0.00054509996,0.0004970303,0.0007016316,0.00079968764,0.00037057785,0.0021650088],"category_scores_gemma":[0.0009657937,0.00031435225,0.00028265265,0.00036251367,0.00035728846,0.00049865706,0.00050445204,0.00050332403,0.000985787],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002460682,0.00016217634,0.003123386,0.00028134533,0.000023430723,0.0005712683,0.00026348582,0.01526782,0.88676614,0.002555773,0.002858883,0.08788019],"study_design_scores_gemma":[0.000019124898,0.0011074913,0.0036823307,0.0000145314825,0.000016138589,0.00033291982,0.00007183888,0.034368142,0.94935024,0.00016162978,0.0108499555,0.00002563437],"about_ca_topic_score_codex":0.0012137995,"about_ca_topic_score_gemma":0.0032556185,"teacher_disagreement_score":0.0021650088,"about_ca_system_score_codex":0.000590796,"about_ca_system_score_gemma":0.00043734547,"threshold_uncertainty_score":0.007242739},"labels":[],"label_agreement":null},{"id":"W4416880004","doi":"10.37665/jsmtwtpss47010","title":"Process Optimization for 1.0 mm Pitch CBGA","year":2000,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interconnection; Ball grid array; Surface-mount technology; Printed circuit board; Soldering; Integrated circuit packaging; Ceramic; Integrated circuit; Chip-scale package; Ranging","score_opus":0.00827445430016865,"score_gpt":0.24460635207632248,"score_spread":0.23633189777615382,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880004","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.92559415,0.0036996105,0.04585596,0.00052458403,0.00039121872,0.0002700913,0.0010746696,0.0015175918,0.021072118],"genre_scores_gemma":[0.9658699,0.0007873886,0.02864989,0.00007078135,0.00001859602,0.00013995462,0.00056469743,0.00022717615,0.0036714757],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997415,0.000017367927,0.000013300741,0.0000747466,0.00008426256,0.00006883104],"domain_scores_gemma":[0.9997322,0.000061031664,0.00007533847,0.000026625712,0.00008559949,0.000019293682],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00037181252,0.0010181216,0.0007549303,0.00062743644,0.00047260523,0.0011864732,0.000712986,0.000646678,0.0034676064],"category_scores_gemma":[0.0007439637,0.00048295097,0.00062329025,0.00084133656,0.00022863178,0.0005424535,0.00038954034,0.00078307494,0.0010434218],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005247604,0.0004996439,0.0021168366,0.0010582098,0.00008828491,0.0006189903,0.00018565421,0.22003002,0.7343339,0.0017162827,0.0027583,0.03606903],"study_design_scores_gemma":[0.00031091712,0.004078686,0.010482017,0.00009784776,0.0003456762,0.00030914962,0.00028597855,0.27753916,0.6882718,0.0009474451,0.017205853,0.00012552344],"about_ca_topic_score_codex":0.0027214705,"about_ca_topic_score_gemma":0.004968561,"teacher_disagreement_score":0.0034676064,"about_ca_system_score_codex":0.00090337015,"about_ca_system_score_gemma":0.0009345787,"threshold_uncertainty_score":0.011600316},"labels":[],"label_agreement":null},{"id":"W4416880008","doi":"10.37665/jsmtwltkf84359","title":"Evaluating the Effect of Solder Paste Residues on RF Signals Between 5 and 10 GHz","year":2004,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Printed circuit board; Solder paste; HFSS; Surface-mount technology; Microstrip; Electromagnetic compatibility; Integrated circuit packaging; Insertion loss; Radio frequency","score_opus":0.024893775444368497,"score_gpt":0.3089835680260126,"score_spread":0.28408979258164413,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880008","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99593323,0.00027289984,0.0032767756,0.000010300507,0.0000124109265,0.000010611681,0.00003109413,0.000032912743,0.00041964353],"genre_scores_gemma":[0.9973948,0.0001943277,0.0018632469,0.000018558881,0.000005581316,0.000006352338,0.000062541374,0.000016083399,0.0004384468],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9996729,0.00007690691,0.000021459338,0.00005328334,0.00012097264,0.00005449492],"domain_scores_gemma":[0.9990221,0.00045983263,0.00023896253,0.00007962042,0.00016223351,0.000037167705],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028085688,0.00044481753,0.00028552747,0.00022264084,0.000118242,0.00020076071,0.0002431916,0.00029230354,0.00071329385],"category_scores_gemma":[0.0009948835,0.00014582489,0.00024128087,0.00018524994,0.00019644825,0.00026123962,0.00014362863,0.00019304486,0.00019546528],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00042497547,0.000040490995,0.001375898,0.000072860516,0.00002346342,0.00015577947,0.000030380257,0.0011426099,0.9922829,0.000017234806,0.000016849888,0.004416539],"study_design_scores_gemma":[0.00000677812,0.0014089373,0.006954955,0.0000054078964,0.000048607708,0.00011950649,0.00002709121,0.0017828632,0.9893596,0.0000114647955,0.0002708342,0.000003966831],"about_ca_topic_score_codex":0.00032973752,"about_ca_topic_score_gemma":0.00059718196,"teacher_disagreement_score":0.00071329385,"about_ca_system_score_codex":0.00013939782,"about_ca_system_score_gemma":0.000075276555,"threshold_uncertainty_score":0.0023862123},"labels":[],"label_agreement":null},{"id":"W4416880009","doi":"10.37665/jsmtjgqnh81477","title":"Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies","year":2000,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Reliability (semiconductor); Electronics; Printed circuit board; Electronic component; Reflow soldering; Electronic packaging; Electrical conductor","score_opus":0.015052890017927761,"score_gpt":0.2647065130300061,"score_spread":0.24965362301207833,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880009","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99890316,0.00033389617,0.00043193635,0.000010020147,0.000007940821,0.000003709453,0.000022055901,0.000023794728,0.00026339808],"genre_scores_gemma":[0.99947435,0.000053746884,0.00020752073,0.0000059172817,0.0000036628933,0.000001990934,0.000035869583,0.000006938003,0.00020989403],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99937075,0.00013570054,0.00005348215,0.00007710836,0.00026893988,0.0000940824],"domain_scores_gemma":[0.99840456,0.00063474034,0.00034413807,0.00017684985,0.00035835616,0.00008141056],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004107992,0.00027220653,0.000319234,0.00049950386,0.0002873569,0.0005074024,0.00022086565,0.0003913422,0.0016004537],"category_scores_gemma":[0.001478264,0.00016664405,0.00027822665,0.00026264167,0.00026351053,0.00041376057,0.00029303264,0.00029748472,0.00024084118],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0007826226,0.000066943874,0.01177119,0.00013589498,0.000058069236,0.00082612725,0.00020529612,0.0017810727,0.9762784,0.000080227306,0.00009178364,0.007922214],"study_design_scores_gemma":[0.000011134154,0.0015829095,0.030765416,0.000009403783,0.000064046115,0.0005972132,0.00012920532,0.0017595794,0.96433705,0.000039705177,0.00069440337,0.000009919613],"about_ca_topic_score_codex":0.00078408926,"about_ca_topic_score_gemma":0.000834475,"teacher_disagreement_score":0.0016004537,"about_ca_system_score_codex":0.00028299025,"about_ca_system_score_gemma":0.00009668076,"threshold_uncertainty_score":0.005354047},"labels":[],"label_agreement":null},{"id":"W4416880025","doi":"10.37665/jsmtkrtaa38745","title":"Qualification of a Lead-Free Card Assembly & Test Process for a Server Complexity PCBA","year":2008,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Original equipment manufacturer; Reliability (semiconductor); Directive; Process (computing); IBM; Electronics; Product (mathematics); Quality (philosophy)","score_opus":0.08018237424099654,"score_gpt":0.3072174221265227,"score_spread":0.22703504788552614,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880025","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7358289,0.0005020278,0.22371763,0.000492037,0.0005782279,0.0019739096,0.0010006282,0.003833052,0.0320736],"genre_scores_gemma":[0.833588,0.00013527201,0.13760436,0.00024699452,0.000025750305,0.00027455288,0.00076497387,0.00045243523,0.026907623],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99734503,0.00045968033,0.00019043384,0.00023584794,0.0015297988,0.00023926338],"domain_scores_gemma":[0.9965886,0.00069720764,0.0002996163,0.0005391376,0.0016976718,0.00017778363],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0019688369,0.0005526798,0.00042803094,0.0010477693,0.0010190101,0.0012740744,0.0007044436,0.0008561351,0.007435678],"category_scores_gemma":[0.0038320485,0.00033544653,0.00041354017,0.0005310714,0.0007095971,0.0006190942,0.00065324287,0.0010055217,0.004025276],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005413715,0.00033829073,0.0042680227,0.0002882593,0.000018997465,0.0011343382,0.000965337,0.0036638104,0.9159899,0.0026012533,0.0027762188,0.06741424],"study_design_scores_gemma":[0.000041453153,0.0020706733,0.00842321,0.000042679014,0.000018512601,0.00061020086,0.0003038508,0.006337148,0.9610742,0.00027852305,0.020761065,0.000038459406],"about_ca_topic_score_codex":0.0015262128,"about_ca_topic_score_gemma":0.0019587567,"teacher_disagreement_score":0.007435678,"about_ca_system_score_codex":0.0006995072,"about_ca_system_score_gemma":0.0010978956,"threshold_uncertainty_score":0.024874806},"labels":[],"label_agreement":null},{"id":"W4416880073","doi":"10.37665/jsmtwqtne72522","title":"The Last Will and Testament of the Lead-Free BGA Void","year":2012,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Soldering; Ball grid array; Void (composites); Joint (building); Thermal","score_opus":0.007346460471897368,"score_gpt":0.2085152498341961,"score_spread":0.2011687893622987,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880073","genre_codex":"empirical","genre_gemma":"commentary","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"commentary","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97579396,0.00042402276,0.01567022,0.00020307711,0.000058921825,0.000036440084,0.00012481355,0.00026092585,0.007427619],"genre_scores_gemma":[0.99648404,0.000029968618,0.0012416849,0.000045423607,0.000008251909,0.000006467671,0.00004102546,0.000021038151,0.0021222425],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9989225,0.000138458,0.000047935308,0.0001442696,0.0006107705,0.00013598421],"domain_scores_gemma":[0.9943105,0.0012991095,0.0011324596,0.0006499485,0.0021101073,0.0004978958],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014685938,0.00012366998,0.00016577334,0.0005902723,0.0005676903,0.0009850492,0.00042814272,0.0003401142,0.0018159222],"category_scores_gemma":[0.005318215,0.00009450189,0.00014183823,0.00021752575,0.000865913,0.000669442,0.00044387573,0.00033623143,0.00026503843],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0020102132,0.0003223811,0.15346442,0.00026921462,0.000060351384,0.0016310196,0.0025323739,0.0040974077,0.6772863,0.021154465,0.0022323178,0.13493952],"study_design_scores_gemma":[0.000033494485,0.0027587125,0.25139987,0.000079168756,0.00009657636,0.0026940694,0.0013765171,0.008321618,0.6893636,0.008746334,0.035040155,0.00008988465],"about_ca_topic_score_codex":0.0010945497,"about_ca_topic_score_gemma":0.0014817169,"teacher_disagreement_score":0.0018159222,"about_ca_system_score_codex":0.00040995612,"about_ca_system_score_gemma":0.0005706259,"threshold_uncertainty_score":0.0077667832},"labels":[],"label_agreement":null},{"id":"W4416880111","doi":"10.37665/jsmtmozlf69774","title":"Microstructure and Hardness of Bi-Containing Solder Alloys After Solidification and Ageing","year":2014,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Rockwell scale; Soldering; Alloy; Precipitation hardening; Quenching (fluorescence); Indentation hardness; Hardening (computing)","score_opus":0.006070056853342472,"score_gpt":0.21031461842167007,"score_spread":0.2042445615683276,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880111","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9984296,0.00038424335,0.0004441268,0.0000051562715,0.000006422998,0.000005824784,0.00012497316,0.00001767439,0.0005820092],"genre_scores_gemma":[0.99763155,0.00011063137,0.00038996985,0.0000059343197,0.0000037565676,0.000006855315,0.0002331185,0.000012641724,0.0016055453],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998147,0.000017628765,0.0000140774,0.0000270896,0.00010505541,0.000021592234],"domain_scores_gemma":[0.99973756,0.00002778912,0.000059238075,0.000023771354,0.00012486913,0.000026708662],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00016949962,0.00014574759,0.00024629975,0.0005636085,0.00017742765,0.00026602147,0.00016512447,0.00025585733,0.0011800268],"category_scores_gemma":[0.00032407357,0.00018748021,0.00015668536,0.00041986536,0.00019758476,0.00022469833,0.0001338474,0.00016088603,0.0002992401],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015643811,0.000009655228,0.0022025844,0.000034292738,0.000008122488,0.0000936837,0.0000903308,0.00015832791,0.9956273,0.000025867575,0.000023431716,0.0015700548],"study_design_scores_gemma":[0.000016427446,0.0009215355,0.3148069,0.000009418029,0.000058317615,0.0005299175,0.0002451259,0.0023760332,0.6791395,0.000049283775,0.0018229662,0.000024560044],"about_ca_topic_score_codex":0.0017340461,"about_ca_topic_score_gemma":0.0021289112,"teacher_disagreement_score":0.0017340461,"about_ca_system_score_codex":0.00024801175,"about_ca_system_score_gemma":0.00008326959,"threshold_uncertainty_score":0.003947556},"labels":[],"label_agreement":null},{"id":"W4416880353","doi":"10.37665/jsmtchfsg54823","title":"Issues and Solutions to Implementing Lead Free Soldering","year":2000,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Soldering; Electronics; Solder paste; Dip soldering; Electronic component; Printed circuit board","score_opus":0.015380770148215418,"score_gpt":0.2565367317331806,"score_spread":0.24115596158496516,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880353","genre_codex":"commentary","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.036626704,0.019490577,0.23245063,0.5318792,0.012623692,0.0015643772,0.0002477039,0.0042676814,0.16084953],"genre_scores_gemma":[0.4528431,0.019196067,0.31819487,0.10461168,0.003625122,0.0012468661,0.0007096957,0.00082637003,0.098746195],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9653432,0.013506625,0.0031182969,0.002447529,0.01219539,0.0033890186],"domain_scores_gemma":[0.92304987,0.017379737,0.0055022445,0.0071606515,0.04140854,0.0054989764],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.031170575,0.0015471425,0.00061958143,0.0019286429,0.0037417982,0.008361454,0.0067156316,0.010202305,0.022871684],"category_scores_gemma":[0.05129483,0.00085616333,0.0010342269,0.0018470127,0.0033497678,0.009346291,0.004612886,0.008365017,0.00535968],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016351465,0.0013116006,0.0067746243,0.0027881425,0.00010195956,0.0020905796,0.003071564,0.013206249,0.009316113,0.19508487,0.17165208,0.5944386],"study_design_scores_gemma":[0.00012079267,0.00080120115,0.0037672122,0.0031725373,0.00010504211,0.0019276649,0.008602761,0.009837445,0.012816187,0.08499815,0.87363815,0.00021285102],"about_ca_topic_score_codex":0.008696651,"about_ca_topic_score_gemma":0.00811058,"teacher_disagreement_score":0.031170575,"about_ca_system_score_codex":0.005140767,"about_ca_system_score_gemma":0.020271527,"threshold_uncertainty_score":0.16484773},"labels":[],"label_agreement":null},{"id":"W4416880454","doi":"10.37665/jsmteuguk46252","title":"The Influence of Alloy Composition and Temperature Cycling Dwell Time on the Reliability of a Quad Flat No Lead (QFN) Package","year":2012,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Temperature cycling; Eutectic system; Soldering; Dwell time; Reliability (semiconductor); Cycling; Alloy; Work (physics)","score_opus":0.00587711501501991,"score_gpt":0.2161313284486766,"score_spread":0.2102542134336567,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880454","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9989035,0.0002881931,0.0005997205,0.000007471611,0.0000064100777,0.0000028045915,0.000029463446,0.000028935956,0.00013349464],"genre_scores_gemma":[0.99938476,0.000053932657,0.00032071443,0.000005902167,0.0000031687127,0.0000022186466,0.00003194627,0.000012183602,0.00018514201],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997298,0.000052645886,0.000023099212,0.00006443485,0.00008554688,0.0000443618],"domain_scores_gemma":[0.9988681,0.00048222241,0.0001861119,0.00007483444,0.0003120166,0.0000767839],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00031969146,0.00031315454,0.0002743665,0.0003500818,0.0001887341,0.00027068245,0.00027005785,0.00037232484,0.000756528],"category_scores_gemma":[0.0013715357,0.00025131472,0.00015032927,0.0002262697,0.00016832486,0.00031966862,0.00011312332,0.00013624741,0.00020752067],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0017478891,0.000092725626,0.008135574,0.00008385184,0.000040327355,0.00025013057,0.00012126154,0.004914572,0.97083944,0.00004270501,0.00009704967,0.013634563],"study_design_scores_gemma":[0.000047167065,0.008674421,0.08825692,0.00002357138,0.0002486636,0.0008309127,0.00015827196,0.02422909,0.87636805,0.000061569925,0.0010478997,0.00005353549],"about_ca_topic_score_codex":0.0018775458,"about_ca_topic_score_gemma":0.0032322295,"teacher_disagreement_score":0.0018775458,"about_ca_system_score_codex":0.00030266016,"about_ca_system_score_gemma":0.00016398347,"threshold_uncertainty_score":0.0037332177},"labels":[],"label_agreement":null},{"id":"W4416880457","doi":"10.37665/jsmtsaclf86681","title":"New Generation of Pb-Free Solder Alloys: Possible Solution to Solve Current Issues with Main Stream Pb-Free Soldering","year":2012,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Ball grid array; Whisker; Solder paste; Printed circuit board; Reflow soldering; Bismuth; Alloy","score_opus":0.02514254728652195,"score_gpt":0.2625714325175631,"score_spread":0.23742888523104114,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880457","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.39454913,0.13123824,0.4140734,0.003468705,0.0012600637,0.00042658127,0.0002570753,0.0022557392,0.05247103],"genre_scores_gemma":[0.61596704,0.050227523,0.28102058,0.00091478985,0.00058099994,0.00023023643,0.00057469733,0.00033445735,0.05014973],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9998357,0.000017797181,0.00001067804,0.000035112254,0.00008076385,0.000019807705],"domain_scores_gemma":[0.9999001,0.00001063744,0.000017708542,0.00001339742,0.000046132915,0.000012010688],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00026626175,0.0005529638,0.0005065683,0.00088343385,0.00020682122,0.000552644,0.00080172106,0.0006299222,0.0024624355],"category_scores_gemma":[0.00020596085,0.00027376864,0.00035977212,0.00042660622,0.00020991411,0.0007744779,0.00042866607,0.0004985136,0.0014087458],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021570998,0.00042672368,0.0013488246,0.0016691348,0.00008362835,0.00076187484,0.00017885413,0.0028383695,0.6242586,0.015343926,0.0030943807,0.34977996],"study_design_scores_gemma":[0.00013028075,0.0032615026,0.004179392,0.0002568711,0.00029482454,0.0042539374,0.0001877822,0.023934498,0.66928244,0.009407427,0.28470284,0.00010827705],"about_ca_topic_score_codex":0.00019516805,"about_ca_topic_score_gemma":0.00042286146,"teacher_disagreement_score":0.0024624355,"about_ca_system_score_codex":0.00017318923,"about_ca_system_score_gemma":0.00030394606,"threshold_uncertainty_score":0.00823772},"labels":[],"label_agreement":null},{"id":"W4416880468","doi":"10.37665/jsmtjgwld83584","title":"Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation","year":2014,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Conformal coating; Tin; Nanoparticle; Microstructure; Ultimate tensile strength","score_opus":0.007442390161261796,"score_gpt":0.21124398488562537,"score_spread":0.20380159472436357,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880468","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99382037,0.0006698023,0.0041847,0.0000213574,0.00003781946,0.000018429026,0.000031639203,0.00008628417,0.0011296417],"genre_scores_gemma":[0.9952355,0.00021709927,0.0035888865,0.000014458254,0.0000067604974,0.000008115847,0.000022731583,0.000019152722,0.0008873012],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99989974,0.000010723689,0.0000064734536,0.00002418276,0.00004270691,0.000016249043],"domain_scores_gemma":[0.9998528,0.00003137187,0.00004768986,0.000020323896,0.000030462215,0.000017365868],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00010988149,0.00025180544,0.0001344722,0.00016161945,0.00009626769,0.00017827998,0.00016945243,0.0001821612,0.0005923178],"category_scores_gemma":[0.00022769827,0.00013805924,0.00015131525,0.00009911359,0.0001303147,0.00017065184,0.00015435749,0.00020266786,0.00016006922],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000013765449,0.000008753857,0.00004559975,0.000021460548,0.0000019310203,0.000013698241,0.0000074355967,0.00009903007,0.9987135,0.000018611281,0.000016543241,0.0010396752],"study_design_scores_gemma":[0.0000020403606,0.000083804865,0.0003388749,0.0000012235084,0.0000038835465,0.000017172739,0.0000043452246,0.0006114445,0.99862826,0.0000040810814,0.0003031446,0.0000016386159],"about_ca_topic_score_codex":0.00037160254,"about_ca_topic_score_gemma":0.00090765697,"teacher_disagreement_score":0.0005923178,"about_ca_system_score_codex":0.00012690428,"about_ca_system_score_gemma":0.00007442134,"threshold_uncertainty_score":0.0019814968},"labels":[],"label_agreement":null},{"id":"W4416880471","doi":"10.37665/jsmtgecxy68329","title":"Component Temperature Study on Tin-Lead and Lead-Free Assemblies","year":2002,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Rework; Component (thermodynamics); Surface-mount technology; Eutectic system; Soldering; Reflow soldering; Solder paste; Upset","score_opus":0.019610176297305687,"score_gpt":0.23705768359322346,"score_spread":0.21744750729591777,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880471","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.996093,0.00013576169,0.0024016895,0.000007156433,0.000006113223,0.000016052423,0.00011819174,0.00009687795,0.0011251711],"genre_scores_gemma":[0.9970763,0.000060460843,0.0014546071,0.0000069251137,0.0000022595311,0.000016522548,0.00013476513,0.000050257244,0.0011978853],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99954295,0.00006866108,0.000021516382,0.000088602734,0.00021940767,0.00005892844],"domain_scores_gemma":[0.9993031,0.00015340958,0.0000885851,0.00009787744,0.00032111024,0.000035841585],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00025203696,0.0003279493,0.0004193778,0.0006501253,0.00035287114,0.0003314843,0.00038625541,0.00025325487,0.0016635545],"category_scores_gemma":[0.00064326247,0.00023013713,0.00025447962,0.0006018643,0.00021699835,0.00039200348,0.00025442042,0.00025534947,0.00036887577],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00093201373,0.00015750952,0.010205061,0.00018891196,0.00003044169,0.00030098384,0.00075973844,0.0069043324,0.96182346,0.00019525713,0.00023362666,0.018268626],"study_design_scores_gemma":[0.00001299666,0.0024628616,0.04983142,0.0000090441645,0.000043156062,0.00016880242,0.00029563878,0.01173264,0.93408,0.00003856958,0.001302622,0.000022145183],"about_ca_topic_score_codex":0.0015979444,"about_ca_topic_score_gemma":0.0029199105,"teacher_disagreement_score":0.0016635545,"about_ca_system_score_codex":0.0004079566,"about_ca_system_score_gemma":0.00013099557,"threshold_uncertainty_score":0.0055651665},"labels":[],"label_agreement":null},{"id":"W4416880495","doi":"10.37665/jsmtlctbx38043","title":"Development and Application of a Press-PIN/PTH Reliability Model","year":2002,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hewlett-Packard (Canada)","funders":"","keywords":"Reliability (semiconductor); Parametric statistics; Finite element method; Soldering; Physics of failure; Parametric model; Development (topology); Interconnection; Cable gland","score_opus":0.016212693668462962,"score_gpt":0.22275489809924526,"score_spread":0.2065422044307823,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880495","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.032541767,0.00039083575,0.9446599,0.00023538951,0.000051283314,0.00031490848,0.000610455,0.0013369215,0.01985856],"genre_scores_gemma":[0.85510975,0.0006385517,0.12909186,0.0000752879,0.0000410627,0.00076935836,0.00078662764,0.00022697866,0.013260507],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9995561,0.00007031815,0.000025995694,0.000075908596,0.00022991397,0.000041665622],"domain_scores_gemma":[0.9994417,0.00018956591,0.00008398566,0.0000547981,0.00021086143,0.00001908723],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007337106,0.00081577245,0.00058527687,0.0010523038,0.0004591796,0.0008431841,0.0021961222,0.0012705226,0.003856873],"category_scores_gemma":[0.0011817974,0.00063587114,0.0008985543,0.00042673066,0.0003942536,0.0008315647,0.00064892287,0.00089393306,0.0010150331],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000113796505,0.000021122481,0.00042539422,0.00004995514,0.000007878005,0.00007577392,0.000029266932,0.9859908,0.002861204,0.0024955817,0.00040252804,0.0076290993],"study_design_scores_gemma":[0.0000015178533,0.000012859534,0.0001114348,0.0000062987656,0.0000040129976,0.000017443575,0.0000042527495,0.99837816,0.00050608895,0.00030391727,0.0006513027,0.0000027129383],"about_ca_topic_score_codex":0.009095556,"about_ca_topic_score_gemma":0.005124451,"teacher_disagreement_score":0.009095556,"about_ca_system_score_codex":0.0009926542,"about_ca_system_score_gemma":0.0014155115,"threshold_uncertainty_score":0.018085241},"labels":[],"label_agreement":null},{"id":"W4416880500","doi":"10.37665/jsmtpgcch16168","title":"Corrosion Study of Lead-Free Solders Exposed to Artificial Sweat","year":2013,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Blackberry (Canada); University of Waterloo","funders":"","keywords":"Corrosion; Soldering; Mobile phone; SWEAT; Headset","score_opus":0.019538844344090908,"score_gpt":0.2380754256725368,"score_spread":0.2185365813284459,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880500","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9969342,0.0010729356,0.0013216643,0.000023461935,0.000023127286,0.000013041011,0.0001020524,0.000019912453,0.00048954703],"genre_scores_gemma":[0.9950258,0.00085845555,0.001965066,0.00003040955,0.000007430805,0.000017317489,0.00016925826,0.000017524879,0.001908618],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99970526,0.00006356293,0.00003190371,0.000053501884,0.00011720474,0.000028587778],"domain_scores_gemma":[0.9996381,0.000043132655,0.00006313012,0.000030506311,0.0002071286,0.00001798361],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00024020001,0.00042408236,0.0004106146,0.0002507023,0.00017584531,0.00030056477,0.00028724733,0.0004840853,0.00070403516],"category_scores_gemma":[0.00040411612,0.00021981962,0.00037732825,0.00034165932,0.00018926951,0.00025058351,0.00022207477,0.00029355078,0.00026938514],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001795995,0.000022597216,0.0009814721,0.00010296137,0.000016262526,0.00012416409,0.0001070685,0.00019495284,0.996442,0.0000263756,0.000025231697,0.0017772927],"study_design_scores_gemma":[0.000006660703,0.0010360115,0.005933301,0.000013438807,0.00004079533,0.00016364762,0.00021637403,0.000990385,0.9902738,0.000023056664,0.0012927839,0.000009777592],"about_ca_topic_score_codex":0.0013727791,"about_ca_topic_score_gemma":0.0018165099,"teacher_disagreement_score":0.0013727791,"about_ca_system_score_codex":0.00019504491,"about_ca_system_score_gemma":0.00011360946,"threshold_uncertainty_score":0.002729535},"labels":[],"label_agreement":null},{"id":"W4416880557","doi":"10.37665/jsmtkpxid94403","title":"Plasma Stencil Treatments: A Statistical Evaluation","year":2013,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Printed circuit board; Solder paste; Flip chip; Stencil; Soldering; Surface-mount technology; Circuit reliability; Chip; Electronic component; Reflow soldering","score_opus":0.01625740060880267,"score_gpt":0.25057993388074146,"score_spread":0.23432253327193878,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880557","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8487435,0.0014371335,0.13543506,0.00022029343,0.00041897903,0.0031333654,0.0046517234,0.001901755,0.0040582977],"genre_scores_gemma":[0.9402437,0.00025263886,0.05249965,0.00012522403,0.000069195514,0.0022753188,0.0023032937,0.00025700673,0.0019739217],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.98484194,0.005509383,0.0011943402,0.0025206513,0.0051587727,0.0007748959],"domain_scores_gemma":[0.8911257,0.093086526,0.004865919,0.0043948046,0.0059304214,0.00059669587],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.021793561,0.00087075314,0.0022895825,0.0021008165,0.00073769037,0.0013561408,0.0017716275,0.0013826519,0.0039206888],"category_scores_gemma":[0.03986898,0.0003169272,0.002546254,0.0018709467,0.0013575772,0.0011773849,0.0008336973,0.0023517981,0.0005716136],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.038134195,0.01096238,0.27563736,0.00614899,0.011319285,0.0023920853,0.0021670011,0.13786131,0.151579,0.011560128,0.011781077,0.3404573],"study_design_scores_gemma":[0.00049589796,0.05092947,0.19147573,0.0002948478,0.0039997953,0.001224183,0.0029287247,0.6053212,0.11968118,0.0042835674,0.019004589,0.00036085703],"about_ca_topic_score_codex":0.0012433544,"about_ca_topic_score_gemma":0.0010564538,"teacher_disagreement_score":0.021793561,"about_ca_system_score_codex":0.0006770355,"about_ca_system_score_gemma":0.0007916518,"threshold_uncertainty_score":0.11525673},"labels":[],"label_agreement":null},{"id":"W4416880610","doi":"10.37665/jsmtirjgx23510","title":"Pb-Free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package","year":2011,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Ball grid array; Soldering; Temperature cycling; Dwell time; Microstructure; Reliability (semiconductor); Solder paste; Alloy","score_opus":0.02929023501620828,"score_gpt":0.22724064203602629,"score_spread":0.197950407019818,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880610","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9991818,0.0000987311,0.00054889,0.0000025293534,0.0000016051717,0.0000016846587,0.000018348437,0.000021058364,0.00012540375],"genre_scores_gemma":[0.99915695,0.000037929174,0.00034849194,0.000002728625,0.0000012707693,0.000001978934,0.000039415543,0.0000054265392,0.0004057438],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.999895,0.000014437637,0.000005515246,0.00002096945,0.000044171837,0.000019919626],"domain_scores_gemma":[0.9998323,0.000031448486,0.00003838434,0.000017307862,0.000065630025,0.000014948838],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011883726,0.00018229238,0.00014106752,0.000222501,0.00008981473,0.0001361408,0.00014733718,0.00018453771,0.0006463422],"category_scores_gemma":[0.0002191253,0.000111308764,0.000102236074,0.00012686943,0.00010661892,0.0001857574,0.00007740062,0.00011365605,0.00020583601],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000192013,0.000038707447,0.0023475029,0.000028519726,0.000009986781,0.00008631888,0.00003551768,0.00075821904,0.992975,0.000020376336,0.000027325123,0.0034806635],"study_design_scores_gemma":[0.000008501084,0.0022942843,0.05335838,0.000005154389,0.000050314335,0.00029313756,0.00004939974,0.0048239864,0.9385777,0.000025168243,0.0005015157,0.000012395978],"about_ca_topic_score_codex":0.0011306297,"about_ca_topic_score_gemma":0.0018987112,"teacher_disagreement_score":0.0011306297,"about_ca_system_score_codex":0.00012659028,"about_ca_system_score_gemma":0.000072689036,"threshold_uncertainty_score":0.0022481084},"labels":[],"label_agreement":null},{"id":"W4416880616","doi":"10.37665/jsmtnbolj39597","title":"Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys","year":2018,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Creep; Intermetallic; Soldering; Microstructure; Solvus; Alloy; Ostwald ripening","score_opus":0.008766185548484816,"score_gpt":0.22507602291669956,"score_spread":0.21630983736821474,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880616","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99655306,0.0009516173,0.0014967115,0.000015304686,0.00001669981,0.000018319652,0.000027026035,0.000055549575,0.0008657034],"genre_scores_gemma":[0.9958319,0.00028273615,0.0023826114,0.000015711135,0.000004044091,0.0000108994145,0.00004539561,0.000025219952,0.0014014926],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9998771,0.000016052663,0.0000107925125,0.00001988503,0.000047527334,0.000028540275],"domain_scores_gemma":[0.9999174,0.0000069615494,0.00002758232,0.000011371633,0.000021310834,0.000015357436],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014082828,0.00022279989,0.00027523056,0.00021066862,0.0001613943,0.00026451965,0.00021676945,0.00016591344,0.0009291547],"category_scores_gemma":[0.00015540679,0.00015291625,0.00013198961,0.00021515672,0.00014027639,0.00015961868,0.00022971578,0.00022650433,0.00024189796],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006574271,0.000017045197,0.00007681543,0.000020530317,0.0000019627294,0.000016334825,0.000009433113,0.000058951562,0.99866664,0.000020642754,0.000007684851,0.0010383156],"study_design_scores_gemma":[0.0000049871373,0.00035528588,0.0028343494,0.00000326308,0.0000095487985,0.000046916553,0.000013157853,0.0006876299,0.99532676,0.0000087748795,0.000706179,0.0000032921432],"about_ca_topic_score_codex":0.00074704067,"about_ca_topic_score_gemma":0.001652502,"teacher_disagreement_score":0.0009291547,"about_ca_system_score_codex":0.00015354,"about_ca_system_score_gemma":0.00017434906,"threshold_uncertainty_score":0.0031083226},"labels":[],"label_agreement":null},{"id":"W4416880633","doi":"10.37665/jsmtcrtqi41511","title":"Via-in-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Reliability (semiconductor); Variety (cybernetics); Component (thermodynamics); Key (lock); Printed circuit board; Interconnection; Quality (philosophy); Electronic component","score_opus":0.020785677931688278,"score_gpt":0.25916555247863765,"score_spread":0.23837987454694937,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880633","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8805665,0.00069409097,0.09399301,0.00047456057,0.00012711078,0.000121109864,0.0002603735,0.0010452821,0.022717925],"genre_scores_gemma":[0.973079,0.00017389674,0.022081751,0.000039849285,0.000012590528,0.000020241047,0.00009015219,0.00007290165,0.0044294344],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9996666,0.000085026964,0.000022287964,0.00004687246,0.00012867077,0.000050526156],"domain_scores_gemma":[0.99917537,0.00018857719,0.00017802,0.00011532022,0.00030267122,0.000039991657],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004202686,0.0002933625,0.00012785802,0.00037253398,0.00019776025,0.0006539954,0.0005771817,0.00034773842,0.0022035881],"category_scores_gemma":[0.0011144823,0.00019696947,0.00013958376,0.0002576227,0.00017453218,0.00044550115,0.0002694735,0.00022220924,0.0005576948],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00031918692,0.00008120685,0.0097533995,0.0005772738,0.000037138663,0.0012334367,0.0004137499,0.035794146,0.87332046,0.006065653,0.0032504478,0.069153816],"study_design_scores_gemma":[0.00008261707,0.005837503,0.042373616,0.00018013454,0.00020131923,0.005080286,0.0010917863,0.13061054,0.7404279,0.00222437,0.07181171,0.00007817717],"about_ca_topic_score_codex":0.0005564433,"about_ca_topic_score_gemma":0.0017481277,"teacher_disagreement_score":0.0022035881,"about_ca_system_score_codex":0.0004137464,"about_ca_system_score_gemma":0.00026396362,"threshold_uncertainty_score":0.0073717237},"labels":[],"label_agreement":null},{"id":"W4416880638","doi":"10.37665/jsmtmoxij89329","title":"Accelerated Life Testing Solder Reliability in Combined Environments: Isothermal Conditions with Harmonic Vibration","year":2018,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Reliability (semiconductor); Vibration; Temperature cycling; Protocol (science); Isothermal process; Accelerated life testing; Thermal","score_opus":0.030726274491001855,"score_gpt":0.2549032275054243,"score_spread":0.22417695301442248,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416880638","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9760342,0.00084249116,0.020439373,0.000037578793,0.00006282056,0.000103309896,0.00012861381,0.00019462655,0.0021571063],"genre_scores_gemma":[0.9841584,0.00027107116,0.011542343,0.000036941565,0.00003285582,0.0001052783,0.00019211817,0.00007158299,0.00358943],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99868387,0.00018579225,0.000048720714,0.00019295236,0.00076496816,0.00012378203],"domain_scores_gemma":[0.99945456,0.00013899968,0.00008749679,0.00010207309,0.00016618357,0.000050652874],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00086383213,0.0005096967,0.0006233586,0.00048485532,0.00036407707,0.00037818428,0.00072367664,0.00035702664,0.002837624],"category_scores_gemma":[0.0006018202,0.00032033035,0.0005245906,0.00036883942,0.00053498446,0.000588138,0.0009886271,0.00057946396,0.00045616302],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006041993,0.00015319041,0.0029919422,0.00011918609,0.000032040374,0.000099872654,0.0001857051,0.0018026169,0.9819328,0.00013578522,0.00009525961,0.011847323],"study_design_scores_gemma":[0.000057438156,0.0071211695,0.026518932,0.000027610902,0.00009550453,0.0002488572,0.0001992928,0.0079449965,0.9547614,0.00018170736,0.0027774724,0.00006552254],"about_ca_topic_score_codex":0.0012191863,"about_ca_topic_score_gemma":0.0031612224,"teacher_disagreement_score":0.002837624,"about_ca_system_score_codex":0.0004133837,"about_ca_system_score_gemma":0.00028899798,"threshold_uncertainty_score":0.009492815},"labels":[],"label_agreement":null},{"id":"W7108208076","doi":"10.37665/jsmtyrlcz79636","title":"In-Situ Resistance Characterization During Cure Progression For Electrically Conductive Adhesives","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Public Health Ontario; University of Waterloo","funders":"","keywords":"Thermosetting polymer; Adhesive; Electrical conductor; Conductivity; Epoxy; Electrical resistivity and conductivity; Sheet resistance; Conductive polymer","score_opus":0.012232424818163659,"score_gpt":0.27353807546045333,"score_spread":0.26130565064228967,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108208076","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9748053,0.0014778087,0.020551808,0.000053872212,0.000046765148,0.00003776215,0.0005413787,0.00034236407,0.0021429153],"genre_scores_gemma":[0.9891376,0.00064468617,0.006923053,0.000042169195,0.000016236321,0.000045627003,0.0002418814,0.00008780739,0.0028608555],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997756,0.000034299173,0.000010072511,0.00006725707,0.00007971399,0.00003299671],"domain_scores_gemma":[0.9995541,0.00013533678,0.00011433851,0.00005412653,0.0001174961,0.000024555888],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00028536146,0.0004138456,0.0003071498,0.0005223346,0.00020307601,0.00037205484,0.00029716158,0.00036931277,0.0019007373],"category_scores_gemma":[0.00050696125,0.0002156815,0.00016908799,0.000332557,0.0002452086,0.00038368974,0.00013200358,0.00063209684,0.0004280107],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002765615,0.000010612272,0.00018463396,0.000038372527,0.0000028133318,0.000031879183,0.00007927539,0.00006258593,0.9983309,0.000035202338,0.00003473758,0.0011613698],"study_design_scores_gemma":[0.0000018618443,0.0000866808,0.001800576,0.00000396443,0.000007467611,0.00005320627,0.000044098277,0.0009124827,0.99613,0.00002244994,0.0009315359,0.0000055847745],"about_ca_topic_score_codex":0.0002865881,"about_ca_topic_score_gemma":0.0004788862,"teacher_disagreement_score":0.0019007373,"about_ca_system_score_codex":0.00016943274,"about_ca_system_score_gemma":0.00009394958,"threshold_uncertainty_score":0.006358564},"labels":[],"label_agreement":null},{"id":"W7108209789","doi":"10.37665/jsmtejpyj76951","title":"Case Histories in Failure Analysis of Electronics Assemblies","year":2011,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Thornhill Medical (Canada)","funders":"","keywords":"Electronics; Root cause analysis; Root cause; Failure causes; Electronic systems","score_opus":0.01797076466686285,"score_gpt":0.21839292584884115,"score_spread":0.2004221611819783,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108209789","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9523068,0.0025312358,0.031107647,0.0007505109,0.00011212934,0.0004074583,0.0006400494,0.0002544733,0.011889612],"genre_scores_gemma":[0.9899485,0.0006088937,0.0066092294,0.00015598584,0.00003763003,0.00006335512,0.0002298698,0.00003845769,0.002308025],"study_design_codex":"case_report","study_design_gemma":"case_report","domain_scores_codex":[0.9971998,0.0010454544,0.00027216447,0.00026736932,0.0009422555,0.0002731057],"domain_scores_gemma":[0.98573905,0.0103000915,0.0012995768,0.0008617818,0.0013038466,0.00049561023],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0023718409,0.00065083324,0.00039983066,0.0038507185,0.0021542073,0.00080135476,0.001174194,0.002639321,0.0036855778],"category_scores_gemma":[0.01510592,0.0005457043,0.000816472,0.001550548,0.0016079381,0.00088656397,0.0008597251,0.0010078461,0.00056407304],"study_design_candidate":"case_report","study_design_consensus":"case_report","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0024036064,0.0017897119,0.26948127,0.0014236945,0.00041994284,0.46669203,0.01258722,0.056818947,0.017288333,0.013582664,0.016747572,0.14076512],"study_design_scores_gemma":[0.00020365484,0.0048415554,0.1435389,0.0011577193,0.00063716405,0.5882264,0.008124276,0.049686782,0.06948622,0.015182041,0.1184044,0.00051102985],"about_ca_topic_score_codex":0.0026196812,"about_ca_topic_score_gemma":0.0039642616,"teacher_disagreement_score":0.0038507185,"about_ca_system_score_codex":0.0011415206,"about_ca_system_score_gemma":0.0003519843,"threshold_uncertainty_score":0.012543678},"labels":[],"label_agreement":null},{"id":"W7108216163","doi":"10.37665/jsmtapvhh57901","title":"Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing","year":2015,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Temperature cycling; Soldering; Tin; Accelerated life testing; Monocrystalline whisker; Thermal shock; Aerospace","score_opus":0.2058375857413413,"score_gpt":0.3265230360799823,"score_spread":0.12068545033864098,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108216163","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.4136318,0.00081264286,0.48875389,0.0009771917,0.0002079718,0.00095513044,0.0076235207,0.0061363243,0.080901526],"genre_scores_gemma":[0.86612594,0.0005741497,0.100563474,0.000119494,0.000014379589,0.00043623225,0.003846325,0.00033165584,0.02798845],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99943095,0.00013313453,0.000018696868,0.000052809337,0.00032310514,0.0000412546],"domain_scores_gemma":[0.99925464,0.00015171502,0.00004323363,0.00010471717,0.00041281228,0.000032735225],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013255059,0.0004345263,0.00024715674,0.0005500847,0.00032734795,0.0005947086,0.0006944107,0.00042771216,0.0032256867],"category_scores_gemma":[0.0009828799,0.00020351564,0.0002487978,0.0006036527,0.00024763416,0.0004610098,0.00034057072,0.0003620856,0.0009012093],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00057953794,0.0005306125,0.017992424,0.00022155068,0.00004643437,0.00022810395,0.0001703378,0.70068294,0.07421037,0.00904229,0.016150288,0.1801451],"study_design_scores_gemma":[0.00005733364,0.0010741056,0.006122962,0.000029624609,0.000026471862,0.00009347779,0.000085278814,0.88720024,0.07061456,0.0022441098,0.032405674,0.000046058114],"about_ca_topic_score_codex":0.020084506,"about_ca_topic_score_gemma":0.015515471,"teacher_disagreement_score":0.020084506,"about_ca_system_score_codex":0.0008559896,"about_ca_system_score_gemma":0.0016129513,"threshold_uncertainty_score":0.03993517},"labels":[],"label_agreement":null},{"id":"W7108217785","doi":"10.37665/jsmtlpvgx48695","title":"Design for Excellence: Inductor Form, Fit, Function Equivalence & New Design Rules","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Analog and Mixed-Signal Circuit Design","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Inductor; Electronics; Electronic component; Power electronics; Reliability (semiconductor); Inductance; Electromagnetic coil; Component (thermodynamics); Automotive electronics","score_opus":0.09781978512255075,"score_gpt":0.2918326674696679,"score_spread":0.19401288234711717,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108217785","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.022192728,0.0005582337,0.934678,0.00069292466,0.00014710466,0.00019480508,0.000037093385,0.00095462234,0.04054451],"genre_scores_gemma":[0.3636652,0.00034673294,0.6236238,0.00037882105,0.00011933691,0.00023972831,0.00006779501,0.0003894198,0.011169154],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9940826,0.0020767744,0.00061393465,0.0005935357,0.0024009296,0.00023219509],"domain_scores_gemma":[0.99421644,0.002263944,0.00050223933,0.0013298292,0.0015752583,0.000112236936],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.006141004,0.00049948914,0.0004783299,0.00093659776,0.0005016008,0.0027801434,0.0012731374,0.0008157705,0.004303932],"category_scores_gemma":[0.010942523,0.00038453285,0.00040549666,0.00056912407,0.0022287725,0.002527055,0.0011467453,0.0011104424,0.0009917245],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016804432,0.000089953646,0.0013299328,0.0003175392,0.000034414144,0.00031013103,0.0011646403,0.023676155,0.017667593,0.6334381,0.0070907776,0.3147128],"study_design_scores_gemma":[0.00024205918,0.00069336244,0.0011331927,0.00029455285,0.00013642952,0.0019573632,0.00056254934,0.1629435,0.071534656,0.42486486,0.33551833,0.00011911513],"about_ca_topic_score_codex":0.00035980195,"about_ca_topic_score_gemma":0.0005168085,"teacher_disagreement_score":0.006141004,"about_ca_system_score_codex":0.0011510344,"about_ca_system_score_gemma":0.0007423027,"threshold_uncertainty_score":0.03247714},"labels":[],"label_agreement":null},{"id":"W7108222743","doi":"10.37665/jsmtfffzj66314","title":"Reliability Study and Solder Joint Microstructure of Various SnAgCu Ceramic Ball Grid Array (CBGA) Geometries and Alloys","year":2006,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Ball grid array; Soldering; Microstructure; Printed circuit board; Solder paste; Ceramic; Temperature cycling; Joint (building); Reliability (semiconductor)","score_opus":0.006029201416307372,"score_gpt":0.2050314597766349,"score_spread":0.19900225836032753,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108222743","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9985967,0.00015170466,0.0008281755,0.000004217251,0.0000036127453,0.000007431105,0.000053578304,0.000031887244,0.00032270464],"genre_scores_gemma":[0.9981122,0.000085466316,0.0011863656,0.000005870662,0.000001870409,0.000006930642,0.00010463995,0.00001710251,0.0004795646],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9997845,0.000039027196,0.000013681098,0.000050269533,0.00008061405,0.000031941498],"domain_scores_gemma":[0.9997634,0.000027364242,0.000037709135,0.000025162884,0.000128871,0.000017574652],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00020469067,0.0002549877,0.00020223796,0.00037277807,0.00013027171,0.00021798855,0.00027453474,0.00023167316,0.0006166468],"category_scores_gemma":[0.00036502446,0.00024756475,0.0001427816,0.00027111298,0.00020035551,0.00018095545,0.00013074635,0.000118602584,0.0002645209],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001853876,0.000020027379,0.005534084,0.000056881938,0.000013562373,0.000116148316,0.00012753368,0.0011921016,0.9892396,0.00005400595,0.00007284475,0.0033879157],"study_design_scores_gemma":[0.000017714206,0.0017188719,0.0850925,0.000010718399,0.00009182882,0.00045505565,0.0003226241,0.0066131856,0.90382755,0.000034839934,0.0017939588,0.000021206102],"about_ca_topic_score_codex":0.0023432516,"about_ca_topic_score_gemma":0.0032535088,"teacher_disagreement_score":0.0023432516,"about_ca_system_score_codex":0.00021232502,"about_ca_system_score_gemma":0.00010588022,"threshold_uncertainty_score":0.004659176},"labels":[],"label_agreement":null},{"id":"W7108227178","doi":"10.37665/jsmtbifmj56519","title":"The Effects of Aging on the Microstructure and Mechanical Properties of Bi-Containing Sn-Rich Alloys","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Carbide; Rockwell scale; Soldering; Recrystallization (geology); Precipitation hardening","score_opus":0.010810665852952369,"score_gpt":0.221223903272483,"score_spread":0.21041323741953064,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108227178","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9991542,0.0003053128,0.00016946979,0.000004322097,0.000004759148,0.0000043196083,0.000063946274,0.000010962926,0.0002826683],"genre_scores_gemma":[0.99913967,0.000087325185,0.00025221845,0.0000066519815,0.000002122691,0.0000041899143,0.00009692104,0.0000051515203,0.00040579212],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99981624,0.000032175605,0.000024697692,0.000030192765,0.000067039065,0.000029752207],"domain_scores_gemma":[0.9996295,0.00003625918,0.00010023891,0.000033001925,0.0001666981,0.000034326036],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00027145492,0.00018770774,0.00020978905,0.0004267069,0.00015772597,0.00020760104,0.0001848138,0.00017953072,0.00063950673],"category_scores_gemma":[0.00037281855,0.00015198287,0.00015788244,0.00025746482,0.00016498644,0.00017656744,0.00012987581,0.00012312694,0.00014667472],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040733293,0.00003584564,0.0052306526,0.000048633414,0.000022057442,0.00009683466,0.00005430207,0.00048484514,0.99106747,0.000032487336,0.000036662113,0.0024828555],"study_design_scores_gemma":[0.00001670102,0.0018128547,0.17799866,0.000012809489,0.00008972702,0.0002549101,0.00015716106,0.0033894365,0.81516606,0.000031647905,0.0010533354,0.000016691387],"about_ca_topic_score_codex":0.0018481305,"about_ca_topic_score_gemma":0.0025876283,"teacher_disagreement_score":0.0018481305,"about_ca_system_score_codex":0.000253905,"about_ca_system_score_gemma":0.00012705491,"threshold_uncertainty_score":0.003674686},"labels":[],"label_agreement":null},{"id":"W7108229979","doi":"10.37665/jsmttwigm23780","title":"A Nanocopper Based Alternative to High Temperature Solder","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Nanoporous metals and alloys","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Soldering; Solder paste; Creep; Microstructure; Reliability (semiconductor); Microelectronics; Grain size; Joint (building); Porosity","score_opus":0.013381327014914107,"score_gpt":0.2758769596594592,"score_spread":0.26249563264454506,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108229979","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.76938236,0.011046741,0.13738339,0.0012263041,0.001608205,0.00032812794,0.0007725994,0.0048602787,0.07339204],"genre_scores_gemma":[0.917582,0.0012356979,0.04792206,0.00033883107,0.00007716187,0.00006796996,0.00019005974,0.00016006193,0.032426186],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99984527,0.00001165686,0.000009131182,0.00004898926,0.00006629491,0.000018637631],"domain_scores_gemma":[0.99987876,0.000011512774,0.000031019637,0.000027810145,0.000034258253,0.0000166984],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00011311857,0.0002865545,0.00033622648,0.00022157436,0.00018631617,0.00040245245,0.00064729125,0.00039602912,0.0044706203],"category_scores_gemma":[0.00014404186,0.00012403076,0.00021991982,0.00017197397,0.00015194419,0.00053296564,0.00032373078,0.00025429094,0.0019751545],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020421638,0.00010829851,0.00023020522,0.00022143665,0.000023190358,0.00023858517,0.000028366389,0.00072946027,0.95295346,0.0021898118,0.0017769348,0.041296087],"study_design_scores_gemma":[0.000042966614,0.0010094879,0.0010072592,0.000017188277,0.000056946003,0.00061380333,0.000022147753,0.008917416,0.9497427,0.0005154727,0.038031016,0.000023604329],"about_ca_topic_score_codex":0.000259117,"about_ca_topic_score_gemma":0.00073963427,"teacher_disagreement_score":0.0044706203,"about_ca_system_score_codex":0.00034200153,"about_ca_system_score_gemma":0.0001330243,"threshold_uncertainty_score":0.014955699},"labels":[],"label_agreement":null},{"id":"W7108233748","doi":"10.37665/jsmtzqmwq13477","title":"SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development","year":2015,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Tin; Printed circuit board; Soldering; Surface-mount technology; Integrated circuit; Electronics","score_opus":0.06458835714371991,"score_gpt":0.2569784389073318,"score_spread":0.1923900817636119,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108233748","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.05094713,0.00020727771,0.935194,0.00021776467,0.000026077005,0.00017003012,0.0008533804,0.0011115423,0.011272729],"genre_scores_gemma":[0.8163114,0.00046799067,0.16567251,0.00012197083,0.0000465981,0.0007528711,0.0013467076,0.00040649733,0.0148733305],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9994746,0.00015205583,0.000022587765,0.00006239484,0.00023127356,0.000057135738],"domain_scores_gemma":[0.99854636,0.00079287926,0.0001534862,0.00010882182,0.00036234857,0.000036191133],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0012915418,0.0007872465,0.0007701769,0.0010225553,0.0004123604,0.0010053943,0.0018165758,0.0010401446,0.0035113867],"category_scores_gemma":[0.0026915362,0.00057411625,0.0012520266,0.0006596725,0.00043773712,0.00086402346,0.0007250804,0.0010458246,0.00074053416],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000006843722,0.000009400109,0.00026502143,0.000009809652,0.000005103041,0.000020481855,0.000009075291,0.9955428,0.00033206408,0.0014771794,0.00017995892,0.0021421898],"study_design_scores_gemma":[0.0000010503348,0.0000056607546,0.000051584764,0.000001309551,0.0000013790403,0.0000049927266,0.0000025710824,0.99922764,0.00010255843,0.0004233621,0.00017628407,0.0000015338451],"about_ca_topic_score_codex":0.025069082,"about_ca_topic_score_gemma":0.010638876,"teacher_disagreement_score":0.025069082,"about_ca_system_score_codex":0.0012418145,"about_ca_system_score_gemma":0.0014264482,"threshold_uncertainty_score":0.04984635},"labels":[],"label_agreement":null},{"id":"W7108237924","doi":"10.37665/jsmtgptlh54189","title":"Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives","year":2015,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Conducting polymers and applications","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada); University of Waterloo","funders":"","keywords":"Nanofiber; Adhesive; Electrical conductor; Soldering; Nanocomposite; Polypyrrole; Electrically conductive","score_opus":0.03713638209276124,"score_gpt":0.30211191635902296,"score_spread":0.26497553426626175,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108237924","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9829214,0.0032954414,0.011450971,0.00008118746,0.00007356707,0.00004238775,0.000100963516,0.000120779565,0.0019133217],"genre_scores_gemma":[0.9871431,0.0008050463,0.010619574,0.000025072775,0.000014290205,0.000023662662,0.00003662415,0.000010639366,0.0013219488],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9999099,0.000011596052,0.0000075217126,0.000030510822,0.000025437037,0.000015126714],"domain_scores_gemma":[0.9998791,0.000026359672,0.000039962386,0.000008651114,0.000026772836,0.000019140874],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00014648645,0.0005272392,0.00013756908,0.00028381354,0.00012770132,0.00021383738,0.00019138202,0.0003557327,0.00044162307],"category_scores_gemma":[0.00015020848,0.00015894508,0.00017875471,0.00013124112,0.00010070996,0.00028087138,0.00016117269,0.00024484788,0.00017828321],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000006459097,0.0000058800265,0.000024250448,0.000028521004,0.0000020651821,0.000034544402,0.000004804211,0.000037620594,0.998899,0.000029156512,0.000012546017,0.00091520196],"study_design_scores_gemma":[0.0000031546897,0.000064265165,0.00043409682,0.0000024422018,0.000005962078,0.00009116318,0.0000065110917,0.000662546,0.9977575,0.000009687518,0.000959355,0.0000033354531],"about_ca_topic_score_codex":0.00020154152,"about_ca_topic_score_gemma":0.00046905447,"teacher_disagreement_score":0.0005272392,"about_ca_system_score_codex":0.00015500483,"about_ca_system_score_gemma":0.00007039422,"threshold_uncertainty_score":0.0014773607},"labels":[],"label_agreement":null}]}