{"meta":{"query_hash":"a7bbb75a3168","filters":{"venue":"Microelectronics Reliability"},"cohort_total":45,"direct_labels_cover":0,"predictions_cover":45,"exported":45,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/a7bbb75a3168","api":"https://metacan.xera.ac/api/v1/cohort?venue=Microelectronics+Reliability"},"results":[{"id":"W1971829013","doi":"10.1016/j.microrel.2009.11.015","title":"A high level synthesis design flow with a novel approach for efficient design space exploration in case of multi-parametric optimization objective","year":2009,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Manufacturing Process and Optimization","field":"Engineering","cited_by":34,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Design space exploration; High-level synthesis; Parametric statistics; Parametric design; Design flow; Computer science; Space (punctuation); Mathematical optimization; Flow (mathematics); Mathematics; Embedded system; Geometry; Statistics","score_opus":0.029873579155619053,"score_gpt":0.22614239453540577,"score_spread":0.19626881537978672,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1971829013","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.026723163,0.00014758161,0.97133356,0.000025613863,0.000022094318,0.0016080097,0.000030674306,0.000102455626,0.0000068252325],"genre_scores_gemma":[0.51040745,0.000023876943,0.4893753,0.0000025771915,0.000004842968,0.00014889029,0.000014409489,0.000019493458,0.0000031833345],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99866444,0.00007580384,0.0003658572,0.00040345502,0.00012346444,0.00036701004],"domain_scores_gemma":[0.9990879,0.00027310496,0.000108788954,0.00027518318,0.00020861464,0.000046392204],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00069881935,0.0002485838,0.00033550258,0.00028304354,0.0000714619,0.000035473313,0.00011096224,0.00014659199,0.000002592765],"category_scores_gemma":[0.0002836567,0.00023214034,0.000051353305,0.0007589316,0.000029170647,0.00016471332,0.000008448373,0.00017374095,1.9366335e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002680487,0.00043990492,0.0000044628932,0.00015281816,0.000018083938,0.0000014746935,0.00049199007,0.9951957,0.0011049708,0.00003000269,0.0000056958265,0.0022868381],"study_design_scores_gemma":[0.00087329326,0.00027996948,0.00003938305,0.000025025427,0.000039103947,0.000016634951,0.00005222558,0.87258714,0.1258202,0.0000503229,0.0000012123467,0.00021550199],"about_ca_topic_score_codex":0.00006022757,"about_ca_topic_score_gemma":0.000012308886,"teacher_disagreement_score":0.48368427,"about_ca_system_score_codex":0.00052518176,"about_ca_system_score_gemma":0.000112775306,"threshold_uncertainty_score":0.94664085},"labels":[],"label_agreement":null},{"id":"W1976571931","doi":"10.1016/j.microrel.2013.03.014","title":"Efficient multi-level modeling technique for determining effective board drop reliability of PCB assembly","year":2013,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"","keywords":"Reliability (semiconductor); Reliability engineering; Drop (telecommunication); Computer science; Engineering; Telecommunications; Physics","score_opus":0.015410194309684058,"score_gpt":0.24647779949957513,"score_spread":0.23106760518989106,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1976571931","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.54738605,0.00036735475,0.44974586,0.00004002602,0.000079483885,0.0016267915,0.000016207105,0.0006959671,0.00004224298],"genre_scores_gemma":[0.9252414,0.000054385295,0.07296108,0.00000919771,0.000019700718,0.001598443,0.000008863364,0.000087231245,0.00001969744],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99706954,0.0000933495,0.0007454488,0.0007109549,0.00021434274,0.0011663715],"domain_scores_gemma":[0.9978869,0.00040754056,0.00011913166,0.0010963663,0.00039514547,0.00009489831],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0011915915,0.00046443735,0.00067822926,0.0001809738,0.00015902471,0.000043748245,0.0005538021,0.00042348844,0.000004780336],"category_scores_gemma":[0.00074108836,0.00045891057,0.00030129915,0.00036155537,0.00016340287,0.0001024654,0.00013802397,0.0008077013,0.0000089298255],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000021199767,0.00016148943,0.0004742738,0.00052672677,0.00004810567,3.6161507e-7,0.0001658904,0.37863103,0.61361,0.00008604051,0.000084068575,0.0061907573],"study_design_scores_gemma":[0.00040784583,0.00021454747,0.00030135334,0.00006736733,0.000026954274,0.0000039639594,0.00003245267,0.6520864,0.34465054,0.0018377178,0.000050445648,0.00032040232],"about_ca_topic_score_codex":0.00014510844,"about_ca_topic_score_gemma":0.000024807883,"teacher_disagreement_score":0.37785533,"about_ca_system_score_codex":0.0010816971,"about_ca_system_score_gemma":0.00014266437,"threshold_uncertainty_score":0.99978626},"labels":[],"label_agreement":null},{"id":"W1977396033","doi":"10.1016/j.microrel.2005.05.013","title":"Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element","year":2005,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Aerodynamics and Acoustics in Jet Flows","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Diffuser (optics); Tube (container); Series (stratigraphy); Inclusion (mineral); Materials science; Element (criminal law); Structural engineering; Engineering; Optics; Composite material; Physics; Geology; Thermodynamics; Political science","score_opus":0.0038812529026614594,"score_gpt":0.19398663876180663,"score_spread":0.1901053858591452,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1977396033","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99680823,0.00012992257,0.0023221595,0.00009042576,0.00007277901,0.00035633866,0.000095183954,0.000042041316,0.00008288859],"genre_scores_gemma":[0.99305725,0.00016196295,0.006626245,0.000019550052,0.000036154957,0.0000134099755,0.000045185796,0.00002724689,0.000012990411],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99849415,0.000042502186,0.00068790413,0.0002094175,0.00026671487,0.00029933345],"domain_scores_gemma":[0.99907607,0.000052845466,0.00012086965,0.00045270866,0.0002235298,0.00007399765],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005589543,0.00018261705,0.00036643422,0.00008726779,0.000062761384,0.000004705504,0.0002475301,0.000107124404,0.000026944645],"category_scores_gemma":[0.00007629929,0.0001854933,0.000075865646,0.00026788117,0.000108128195,0.00011454962,0.00023771079,0.00020411692,0.0000017110195],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012595931,0.00008347529,0.0044022813,0.0004902684,0.000026973616,1.7505023e-7,0.0009208795,0.07579176,0.9159623,0.0003759694,0.00008335431,0.0017366385],"study_design_scores_gemma":[0.00045497602,0.00042439712,0.0065797428,0.00006272371,0.000032311356,0.0000014735149,0.000024846597,0.16652603,0.82441646,0.00068236503,0.00060351874,0.00019116857],"about_ca_topic_score_codex":0.00007125854,"about_ca_topic_score_gemma":0.00020073335,"teacher_disagreement_score":0.09154583,"about_ca_system_score_codex":0.0003306642,"about_ca_system_score_gemma":0.000114484865,"threshold_uncertainty_score":0.7564198},"labels":[],"label_agreement":null},{"id":"W1982011965","doi":"10.1016/j.microrel.2009.11.003","title":"Strain estimation in III–V materials by analysis of the degree of polarization of luminescence","year":2009,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":5,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Luminescence; Degree of polarization; Polarization (electrochemistry); Reliability (semiconductor); Strain (injury); Degree (music); Optics; Optoelectronics; Chemistry; Physics; Acoustics","score_opus":0.009053698273581155,"score_gpt":0.23995284600945813,"score_spread":0.23089914773587697,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1982011965","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9976934,0.000044834178,0.0014512959,0.000055716562,0.00003466085,0.0002414681,0.00043224441,0.0000036786357,0.000042697433],"genre_scores_gemma":[0.999517,0.0000026505008,0.00024182575,0.000009945427,0.0000052954842,0.0000030337378,0.00020164673,0.0000044871804,0.000014086111],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9987763,0.000115229086,0.0006336295,0.00018125317,0.00012470943,0.00016883285],"domain_scores_gemma":[0.9989891,0.000038179554,0.00047552667,0.0003616068,0.00011923912,0.000016352393],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00047119532,0.00010924087,0.00041238667,0.000080691076,0.000019197747,0.000008460258,0.00020690216,0.000050588165,0.00013314564],"category_scores_gemma":[0.000023048926,0.000087300235,0.00011387113,0.00061573496,0.000061868464,0.00007362443,0.000019945286,0.00006216553,1.9812771e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002399143,0.00016745462,0.022604255,0.000030935124,0.000049132646,8.353285e-9,0.00011717785,0.0007811978,0.97431713,0.0010143752,0.000010804289,0.0008835463],"study_design_scores_gemma":[0.00024013816,0.00005310688,0.057651076,0.000020943795,0.00015942115,3.3639637e-8,0.000029007206,0.00085388793,0.9393889,0.0015270733,0.000008934558,0.000067531444],"about_ca_topic_score_codex":0.0014315286,"about_ca_topic_score_gemma":0.00004382244,"teacher_disagreement_score":0.035046823,"about_ca_system_score_codex":0.000043982345,"about_ca_system_score_gemma":0.0000952696,"threshold_uncertainty_score":0.35600004},"labels":[],"label_agreement":null},{"id":"W1992092752","doi":"10.1016/j.microrel.2014.01.007","title":"CEDAR: Modeling impact of component error derating and read frequency on system-level vulnerability in high-performance processors","year":2014,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Victoria","funders":"","keywords":"Derating; Component (thermodynamics); Computer science; Cache; Vulnerability (computing); Reliability engineering; Reliability (semiconductor); Soft error; Multi-core processor; Fault injection; Embedded system; Electronic engineering; Parallel computing; Engineering; Power (physics); Software; Operating system; Electrical engineering","score_opus":0.009888697849285385,"score_gpt":0.23960666288688612,"score_spread":0.22971796503760072,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1992092752","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98867446,0.00045361478,0.009564216,0.000021449467,0.00010042819,0.00058726966,0.000019497384,0.00021436377,0.00036471983],"genre_scores_gemma":[0.99827266,0.00004131191,0.0015063537,0.00000684156,0.0000332129,0.00006014686,0.000019712143,0.000057286685,0.0000024814397],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9974151,0.00023853118,0.00080351497,0.0005225567,0.00026556817,0.00075468025],"domain_scores_gemma":[0.9987558,0.0002783238,0.00012978121,0.0006006606,0.00013912847,0.00009631717],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0017527834,0.00037261646,0.00058471854,0.00016945261,0.0001126949,0.00003172055,0.00024356044,0.00020548856,0.000005283681],"category_scores_gemma":[0.00026979353,0.00035514956,0.00008953718,0.00037343276,0.00007204723,0.00020826608,0.000031868938,0.0007926634,0.0000036143424],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000044847948,0.00009531971,0.007249556,0.0009152683,0.0000269675,2.423123e-7,0.00015931908,0.9743512,0.0136112375,0.001027427,0.000003877591,0.0025147127],"study_design_scores_gemma":[0.0006141954,0.00056291564,0.009978982,0.00012983078,0.0000149628895,0.000006567282,0.000013770403,0.9772174,0.010449515,0.00070195,0.0000033025997,0.0003066511],"about_ca_topic_score_codex":0.0005397733,"about_ca_topic_score_gemma":0.0001469923,"teacher_disagreement_score":0.009598212,"about_ca_system_score_codex":0.00252412,"about_ca_system_score_gemma":0.00018788507,"threshold_uncertainty_score":0.99989},"labels":[],"label_agreement":null},{"id":"W1993952433","doi":"10.1016/j.microrel.2010.10.007","title":"Switch-level emulation of strength-base soft error detection","year":2010,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"CMC Microsystems","keywords":"Emulation; Base (topology); Computer science; Soft error; Reliability engineering; Embedded system; Engineering; Electronic engineering; Mathematics; Psychology","score_opus":0.0064825436348270446,"score_gpt":0.22085038912453098,"score_spread":0.21436784548970395,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1993952433","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96102923,0.00022019437,0.037095413,0.00004152912,0.000569432,0.00038504854,0.000027299791,0.00037590088,0.00025594223],"genre_scores_gemma":[0.9974671,0.000016813237,0.0022475056,0.0000130982535,0.00009710822,0.000033183685,0.000029268745,0.00006235188,0.000033546203],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99828136,0.00006163903,0.00050185755,0.00034698783,0.00024426985,0.0005638927],"domain_scores_gemma":[0.9986946,0.00020995694,0.000114113136,0.00071461836,0.00017522048,0.00009152183],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00061602,0.00026014692,0.00028598137,0.00014103227,0.00008848548,0.000023581324,0.00024599335,0.00028867854,0.000074244665],"category_scores_gemma":[0.00033188763,0.0002885279,0.0001388151,0.00041780318,0.00008490339,0.00019337784,0.000023620445,0.00094973313,0.00002735494],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00002528007,0.00008158792,0.0003728819,0.000102790786,0.000029021892,2.6941902e-7,0.00007833668,0.2793324,0.6897581,0.000350475,0.00008602869,0.029782806],"study_design_scores_gemma":[0.00031550342,0.0001065691,0.002125697,0.00000473115,0.000024094981,0.00000536991,0.000004601956,0.50705653,0.48605892,0.0013009603,0.0027904355,0.00020660242],"about_ca_topic_score_codex":0.000057643545,"about_ca_topic_score_gemma":0.00091024605,"teacher_disagreement_score":0.22772412,"about_ca_system_score_codex":0.0004486809,"about_ca_system_score_gemma":0.00015272047,"threshold_uncertainty_score":0.99995667},"labels":[],"label_agreement":null},{"id":"W1998665022","doi":"10.1016/j.microrel.2005.12.006","title":"A review of gate tunneling current in MOS devices","year":2006,"lang":"en","type":"review","venue":"Microelectronics Reliability","topic":"Semiconductor materials and devices","field":"Engineering","cited_by":195,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"","keywords":"Quantum tunnelling; Time-dependent gate oxide breakdown; Optoelectronics; Transistor; Materials science; Electronic circuit; Valence band; Gate oxide; Current (fluid); Semiconductor; Metal gate; MOSFET; Electrical engineering; Engineering; Voltage; Band gap","score_opus":0.023336269108309996,"score_gpt":0.30729710729723236,"score_spread":0.28396083818892237,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W1998665022","genre_codex":"review","genre_gemma":"review","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"review","genre_consensus":"review","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.0007195168,0.997281,0.000013489416,0.000003293209,0.00051442784,0.001045461,0.00010637412,0.00012968741,0.00018673962],"genre_scores_gemma":[0.00011016321,0.9992109,0.00009779709,0.000017165567,0.000099499484,0.0001309745,0.00023685658,0.00009173009,0.000004916477],"study_design_codex":"systematic_review","study_design_gemma":"not_applicable","domain_scores_codex":[0.996632,0.00019744915,0.0018423841,0.00053115486,0.00017889678,0.0006181349],"domain_scores_gemma":[0.99860466,0.00015015202,0.0003559868,0.00073535217,0.0000952015,0.000058645022],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0009839716,0.0006061741,0.0026756958,0.00017226239,0.00002060898,0.000029463283,0.00049882464,0.00027658275,0.000086194465],"category_scores_gemma":[0.000075546726,0.00052565994,0.00051143847,0.0005916748,0.0000449068,0.00009385008,0.00007970212,0.000694922,0.000040118513],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000012097802,0.000058468013,0.0000055337746,0.7325599,0.000036004934,0.0000010066988,0.000008595617,0.0001451273,0.000084481406,0.000013286594,0.0013919972,0.26569438],"study_design_scores_gemma":[0.0000712956,0.000014621449,0.0000014510168,0.1318319,0.00023610737,0.0000067032465,6.796064e-7,0.00009432103,0.00010227619,0.00006441942,0.8671865,0.00038975256],"about_ca_topic_score_codex":0.00009775302,"about_ca_topic_score_gemma":0.000079401274,"teacher_disagreement_score":0.8657945,"about_ca_system_score_codex":0.00060377625,"about_ca_system_score_gemma":0.0002992027,"threshold_uncertainty_score":0.9997195},"labels":[],"label_agreement":null},{"id":"W2001361816","doi":"10.1016/s0026-2714(02)00271-8","title":"Modeling facet heating in ridge lasers","year":2003,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Semiconductor Lasers and Optical Devices","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada); Carleton University","funders":"","keywords":"Facet (psychology); Joule heating; Ridge; Thermal conductivity; Laser; Materials science; Semiconductor laser theory; Thermal; Heat equation; Mechanics; Semiconductor; Joule effect; Optics; Thermodynamics; Optoelectronics; Physics; Composite material; Geology","score_opus":0.008599889440452734,"score_gpt":0.21336718110250155,"score_spread":0.20476729166204882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2001361816","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99362874,0.0014726229,0.0017421009,0.000030850228,0.00014707254,0.00016578085,0.000007220814,0.00017032961,0.0026352936],"genre_scores_gemma":[0.9982144,0.0001395993,0.0015060318,0.000054331143,0.000014647383,0.00001465892,0.00000876654,0.00003127795,0.00001624036],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99863124,0.000052125735,0.00032510902,0.0002912924,0.000106304455,0.00059391215],"domain_scores_gemma":[0.99952555,0.00004710068,0.00001173281,0.00029997248,0.000033045828,0.00008262578],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004403272,0.00018553392,0.00023012664,0.00006164505,0.000044606797,0.000035229714,0.00013280258,0.00011706829,0.000059543912],"category_scores_gemma":[0.00013058369,0.00019091694,0.000069359754,0.0002785056,0.000025367457,0.00012827438,0.000014623629,0.00044012067,0.000028336188],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000004982635,0.000050134026,0.0025681355,0.000096965545,0.000012867777,0.000002796548,0.00016303176,0.9357542,0.05927309,0.0015795315,0.00008938402,0.00040493006],"study_design_scores_gemma":[0.0003992075,0.000033143082,0.0001031327,0.00002528979,0.0000084616395,0.000004193581,0.00010434421,0.9418896,0.052179467,0.0023390201,0.0025980899,0.00031605747],"about_ca_topic_score_codex":0.00010848588,"about_ca_topic_score_gemma":0.00021013292,"teacher_disagreement_score":0.0070936247,"about_ca_system_score_codex":0.00040064054,"about_ca_system_score_gemma":0.000052364463,"threshold_uncertainty_score":0.7785366},"labels":[],"label_agreement":null},{"id":"W2010735430","doi":"10.1016/j.microrel.2003.09.009","title":"A relation model of gate oxide yield and reliability","year":2004,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Semiconductor materials and devices","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"National Science Foundation","keywords":"Reliability (semiconductor); Burn-in; Reliability engineering; Yield (engineering); Function (biology); Failure rate; Computer science; Engineering; Materials science; Thermodynamics; Physics","score_opus":0.009992094874209906,"score_gpt":0.2046338221035005,"score_spread":0.1946417272292906,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2010735430","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9950924,0.00079230464,0.0032217293,0.00007001264,0.00011452759,0.00021039268,0.000017387065,0.00016956803,0.0003116873],"genre_scores_gemma":[0.9964679,0.0003249832,0.0031118304,0.000024356781,0.000014107589,0.000010987623,0.0000071367062,0.000024631088,0.000014076976],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99888325,0.000016801694,0.00040397196,0.00028498523,0.00011432807,0.00029668974],"domain_scores_gemma":[0.9993346,0.00005887754,0.00005728397,0.00041176617,0.00007518892,0.0000623327],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00041616338,0.00017188479,0.00026914285,0.0000419965,0.000040629508,0.000020580594,0.0001115714,0.00014792272,0.000015090885],"category_scores_gemma":[0.00011390118,0.00016731443,0.000061128325,0.00011470337,0.00008386536,0.00017565775,0.000037602676,0.00019976003,0.000004914441],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000018514711,0.000027396853,0.00062054716,0.00017220761,0.0000072718726,1.3413124e-7,0.0001369051,0.3033703,0.6951034,0.00045757068,0.000025904073,0.000059839203],"study_design_scores_gemma":[0.0005763967,0.000098433906,0.004027406,0.00006484424,0.000041345833,0.000006745324,0.000025034915,0.06751459,0.8718606,0.055115152,0.00031264182,0.00035680324],"about_ca_topic_score_codex":0.00017774769,"about_ca_topic_score_gemma":0.00003786631,"teacher_disagreement_score":0.2358557,"about_ca_system_score_codex":0.00022885416,"about_ca_system_score_gemma":0.000072826544,"threshold_uncertainty_score":0.6822884},"labels":[],"label_agreement":null},{"id":"W2019688018","doi":"10.1016/j.microrel.2010.08.003","title":"Rapid design space exploration by hybrid fuzzy search approach for optimal architecture determination of multi objective computing systems","year":2010,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Embedded Systems Design Techniques","field":"Computer Science","cited_by":19,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Fuzzy logic; Architecture; Space (punctuation); Computer science; Computer architecture; Artificial intelligence; Operating system; Geography","score_opus":0.023846040390050206,"score_gpt":0.2704738115921323,"score_spread":0.2466277712020821,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2019688018","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.027307782,0.00038677535,0.9683174,0.00008605099,0.00019150016,0.0032703346,0.000025385785,0.00034835268,0.00006642543],"genre_scores_gemma":[0.5173635,0.000007524711,0.48237282,0.0000072437865,0.000036457543,0.00014299633,0.000023879264,0.00002267914,0.000022906117],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9963938,0.00080721267,0.00068711484,0.0009919854,0.0004251696,0.0006947148],"domain_scores_gemma":[0.9969242,0.0006599022,0.00040014434,0.0011114702,0.0007973284,0.00010690885],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0042971084,0.00033447114,0.0004954889,0.00020362815,0.00022896627,0.00019090399,0.0011279113,0.00023532733,5.824371e-7],"category_scores_gemma":[0.00032912387,0.00032888164,0.00016322003,0.0004275286,0.00014868689,0.0005151065,0.0001891661,0.0007674554,0.0000014405614],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000096463424,0.00045660778,0.000043260137,0.0004949949,0.00003130048,9.260568e-7,0.0027275414,0.019459508,0.94084185,0.0031421324,0.0006817293,0.032023657],"study_design_scores_gemma":[0.000311433,0.00039288684,0.000005244255,0.000015883956,0.000007942973,0.000025054156,0.000046362406,0.5766402,0.42148575,0.00069278793,0.00017254057,0.00020395484],"about_ca_topic_score_codex":0.00010178513,"about_ca_topic_score_gemma":0.0000049214023,"teacher_disagreement_score":0.55718064,"about_ca_system_score_codex":0.00039946608,"about_ca_system_score_gemma":0.00036888153,"threshold_uncertainty_score":0.9999163},"labels":[],"label_agreement":null},{"id":"W2022602619","doi":"10.1016/j.microrel.2008.06.025","title":"Simulation of migration effects in nanoscaled copper metallizations","year":2008,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Copper Interconnects and Reliability","field":"Materials Science","cited_by":9,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"Bundesministerium für Forschung und Technologie; Bundesministerium für Bildung, Wissenschaft, Forschung und Technologie; Bundesministerium für Bildung und Forschung","keywords":"Copper; Interconnection; Materials science; Electrical resistivity and conductivity; Aluminium; Void (composites); Copper interconnect; Electromigration; Metallurgy; Composite material; Electrical engineering; Computer science; Engineering","score_opus":0.010152594568213713,"score_gpt":0.25054092103797004,"score_spread":0.24038832646975633,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2022602619","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9921312,0.0003837243,0.0063388776,0.00016601525,0.00019368962,0.0005595374,0.000011107401,0.0000560013,0.00015990132],"genre_scores_gemma":[0.99874794,0.000055417124,0.0009973188,0.00004345616,0.000018398165,0.00003087773,0.000016852706,0.0000142173985,0.000075540265],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9981133,0.0002700932,0.0005839419,0.00045119843,0.00022963392,0.0003518403],"domain_scores_gemma":[0.9984824,0.0005729183,0.00013917127,0.00050138356,0.00024999233,0.000054116626],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000639114,0.00017082393,0.00035388724,0.00009778489,0.000111159265,0.000013624308,0.00020554345,0.00013796965,0.0001464912],"category_scores_gemma":[0.00084091834,0.00014777243,0.00012150464,0.00037991378,0.00021542514,0.00019627628,0.000058446392,0.00017251223,0.000038677223],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007958117,0.0004347538,0.016831292,0.00011295148,0.000005089073,0.0000017162637,0.0005291616,0.10928029,0.8722298,0.00025305245,0.00009089817,0.00015142986],"study_design_scores_gemma":[0.00097299414,0.00036899588,0.026268728,0.000052003375,0.000029767472,0.0000052912683,0.000023480332,0.08179488,0.88569754,0.0026423715,0.0018344241,0.00030953597],"about_ca_topic_score_codex":0.00039096596,"about_ca_topic_score_gemma":0.0006073188,"teacher_disagreement_score":0.027485408,"about_ca_system_score_codex":0.0003045828,"about_ca_system_score_gemma":0.00019428933,"threshold_uncertainty_score":0.6025985},"labels":[],"label_agreement":null},{"id":"W2025153625","doi":"10.1016/j.microrel.2014.12.013","title":"Development of a fast method for optimization of Au ball bond process","year":2015,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Ball (mathematics); Bond strength; Materials science; Factorial experiment; Ball mill; Response surface methodology; Bond energy; Composite material; Analytical Chemistry (journal); Chemistry; Molecule; Adhesive; Mathematics; Geometry; Chromatography","score_opus":0.016880999354531714,"score_gpt":0.27439304661013686,"score_spread":0.25751204725560517,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2025153625","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.33254611,0.00040507893,0.6662811,0.000028829434,0.00004095539,0.00023632163,0.000006292834,0.00022035302,0.00023495857],"genre_scores_gemma":[0.6204344,0.0000136778435,0.37945998,0.0000017697562,0.0000056121257,0.000042822598,0.000011508319,0.000019238643,0.000010994838],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9988566,0.000015679558,0.00040320956,0.00020287471,0.00012900414,0.00039264848],"domain_scores_gemma":[0.99928814,0.000055930876,0.00008470043,0.00030316762,0.00022552541,0.00004253889],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00079873455,0.00015389013,0.00030285737,0.00007957685,0.00003250636,0.000005882893,0.00023543641,0.0001277391,0.0000011084369],"category_scores_gemma":[0.00018369153,0.0001499625,0.000058639907,0.00023222591,0.000048298276,0.00005596004,0.000031822827,0.0001579746,4.208469e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006353499,0.00013354867,0.00034757066,0.0010048933,0.000099636905,1.04104174e-7,0.0034606887,0.92432624,0.05467228,0.00075380446,0.0002828643,0.014854854],"study_design_scores_gemma":[0.00046950893,0.00013272488,0.000021591686,0.000034487348,0.000021584941,0.0000021387443,0.00023047865,0.2890621,0.7058502,0.0024384945,0.0015579904,0.00017867435],"about_ca_topic_score_codex":0.000011116323,"about_ca_topic_score_gemma":0.00003733785,"teacher_disagreement_score":0.65117794,"about_ca_system_score_codex":0.0005545458,"about_ca_system_score_gemma":0.00061789464,"threshold_uncertainty_score":0.6115294},"labels":[],"label_agreement":null},{"id":"W2029133164","doi":"10.1016/j.microrel.2012.10.002","title":"Remote carrier trapping in FinFETs with ONO buried layer: Temperature effects","year":2012,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Semiconductor materials and devices","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Trapping; Materials science; Optoelectronics; Silicon on insulator; Coupling (piping); Threshold voltage; Biasing; Charge (physics); Insulator (electricity); Channel (broadcasting); Trap (plumbing); Silicon nitride; Voltage; Electrical engineering; Silicon; Physics; Transistor","score_opus":0.004780144605245655,"score_gpt":0.20183260674207779,"score_spread":0.19705246213683214,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2029133164","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99467236,0.0037283227,0.000055754583,0.000054257696,0.000360144,0.000356799,0.000010208777,0.00022397902,0.0005381731],"genre_scores_gemma":[0.999102,0.000103336046,0.00044481328,0.0000761787,0.00016450786,0.000015823913,0.000016884213,0.000051456005,0.000024997966],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984666,0.00007032682,0.00027133513,0.00027400942,0.00012815997,0.00078957394],"domain_scores_gemma":[0.99929756,0.000088041576,0.000033862598,0.0004243831,0.000037410668,0.00011873063],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00040553164,0.0002775493,0.00034770023,0.000070709444,0.00005078456,0.000052647163,0.00015186887,0.00020304539,0.000046184847],"category_scores_gemma":[0.000040118055,0.00023493674,0.00005505127,0.0002590618,0.000037465164,0.0002454512,0.000023732142,0.00042142996,0.000014416231],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0000413017,0.0000399407,0.003821671,0.00035204968,0.000029497636,0.0000031481216,0.000662717,0.0013132823,0.99277085,0.00004533331,0.00032308904,0.00059711403],"study_design_scores_gemma":[0.00083344284,0.00010230992,0.011812798,0.00011626343,0.000030161125,0.00002477195,0.00003358555,0.000991768,0.9676121,0.00019760875,0.01772592,0.0005193013],"about_ca_topic_score_codex":0.00012130651,"about_ca_topic_score_gemma":0.00011821324,"teacher_disagreement_score":0.025158785,"about_ca_system_score_codex":0.00032970824,"about_ca_system_score_gemma":0.00005962296,"threshold_uncertainty_score":0.95804423},"labels":[],"label_agreement":null},{"id":"W2032428945","doi":"10.1016/s0026-2714(01)00007-5","title":"Influence of the lightly doped drain resistance on the worst-case hot-carrier stress condition for NMOS devices","year":2001,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Semiconductor materials and devices","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"NMOS logic; Materials science; Doping; Stress (linguistics); Optoelectronics; Electrical engineering; Engineering; Transistor; Voltage","score_opus":0.0078684885619078,"score_gpt":0.22491908931562765,"score_spread":0.21705060075371985,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2032428945","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9975006,0.0007828565,0.00003628781,0.0002663493,0.00016289107,0.0007123755,0.00022607236,0.000078144476,0.00023444308],"genre_scores_gemma":[0.9994167,0.00008237512,0.00006016385,0.00016643137,0.000059259455,0.000102088656,0.000011226581,0.000028101753,0.000073630355],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99871576,0.00010416864,0.0003781652,0.00027377822,0.00015456008,0.00037355296],"domain_scores_gemma":[0.9986135,0.00038464877,0.00012176327,0.00069260556,0.00014756016,0.000039953607],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00052163546,0.00020567932,0.00022658164,0.000026430627,0.00019198588,0.00005949795,0.0003705988,0.00010805855,0.00004003352],"category_scores_gemma":[0.00017184763,0.00012789435,0.00010884737,0.00023184989,0.00012083266,0.00012562341,0.00003391001,0.00020422041,0.0000040297477],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00031675532,0.00011240863,0.0022341236,0.00065826694,0.0001035123,0.000008319501,0.0008569124,0.045464795,0.94389236,0.003751057,0.0024018504,0.000199618],"study_design_scores_gemma":[0.00044127193,0.000085996915,0.0035498166,0.00016946673,0.00005395057,0.000024238157,0.00014268277,0.0014237611,0.9498692,0.0029551685,0.040977146,0.00030728368],"about_ca_topic_score_codex":0.000064394655,"about_ca_topic_score_gemma":0.00093076343,"teacher_disagreement_score":0.044041034,"about_ca_system_score_codex":0.00016201306,"about_ca_system_score_gemma":0.00006199113,"threshold_uncertainty_score":0.521538},"labels":[],"label_agreement":null},{"id":"W2033697244","doi":"10.1016/j.microrel.2005.12.005","title":"Transistor-level to gate-level comprehensive fault synthesis for n-input primitive gates","year":2006,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"VLSI and Analog Circuit Testing","field":"Computer Science","cited_by":9,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"High-level synthesis; Transistor; Computer science; Gate equivalent; Electrical engineering; Electronic engineering; Engineering; Embedded system; Gate oxide; Field-programmable gate array; Voltage","score_opus":0.033360078591586205,"score_gpt":0.25196031784461126,"score_spread":0.21860023925302505,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2033697244","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.21693915,0.00037602283,0.77873826,0.0019252355,0.0001631643,0.0009089427,0.00015443264,0.0003172508,0.0004775355],"genre_scores_gemma":[0.9570512,0.000011555708,0.041759007,0.0005647816,0.00011015972,0.00020470377,0.000023644143,0.000037417103,0.00023754305],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99657655,0.00014657852,0.00060539396,0.0012068048,0.0003217015,0.0011429455],"domain_scores_gemma":[0.99690026,0.001153777,0.00015475998,0.00091741234,0.0006945442,0.00017926925],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005967556,0.00040843667,0.00053214096,0.00014754655,0.0004211815,0.00018127289,0.0011195636,0.00016562015,0.000007491663],"category_scores_gemma":[0.00043439868,0.0004114369,0.00031197065,0.00059700967,0.000106899555,0.00028301397,0.0001356025,0.0003084829,0.000045945028],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000048394333,0.001340276,0.0018363097,0.0005907431,0.0001814113,0.000024730853,0.0016318763,0.019770665,0.6737919,0.045601424,0.009350189,0.24583207],"study_design_scores_gemma":[0.0021874954,0.001155091,0.031399462,0.0002795389,0.00019344264,0.000103758306,0.0001430833,0.093817286,0.74722683,0.036025017,0.08448754,0.0029814218],"about_ca_topic_score_codex":0.0004460187,"about_ca_topic_score_gemma":0.00025380577,"teacher_disagreement_score":0.74011207,"about_ca_system_score_codex":0.0006182086,"about_ca_system_score_gemma":0.00041060479,"threshold_uncertainty_score":0.99983376},"labels":[],"label_agreement":null},{"id":"W2046192159","doi":"10.1016/j.microrel.2014.06.009","title":"Water absorption characterisation, electrical reliability and mechanical testing of a submerged laminated a-Si thin film photovoltaic (PV) cells","year":2014,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Vibration and Dynamic Analysis","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Laurentian University","funders":"","keywords":"Photovoltaic system; Materials science; Absorption (acoustics); Reliability (semiconductor); Stiffness; Dirt; Composite material; Environmental science; Electrical engineering; Engineering; Mechanical engineering; Power (physics); Physics","score_opus":0.004832221064200352,"score_gpt":0.18564706918244414,"score_spread":0.18081484811824378,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2046192159","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93914837,0.000046788708,0.059940584,0.00006951326,0.000081476814,0.00029177775,0.000011343319,0.00025800196,0.00015214515],"genre_scores_gemma":[0.9974644,0.00006055135,0.002179014,0.000047569058,0.000031776926,0.000027817794,0.00008468401,0.00003632539,0.00006783981],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99774325,0.00023494478,0.0007502513,0.00049843144,0.00024009428,0.00053302303],"domain_scores_gemma":[0.9988165,0.0001742488,0.00010137148,0.0005164112,0.0002736967,0.00011778354],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0014397632,0.00027521283,0.00047143947,0.00012360122,0.0001068745,0.000040675346,0.00017116971,0.0002517174,0.00009585498],"category_scores_gemma":[0.00043073317,0.0002366028,0.00012650472,0.00044707672,0.00008797625,0.00017454593,0.00005468845,0.0004655185,0.000022021411],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003791672,0.00009363482,0.0017577923,0.00012379314,0.00003037526,2.5784018e-7,0.00016464306,0.023888918,0.97240597,0.0000888349,0.000085506144,0.0013223327],"study_design_scores_gemma":[0.00026251364,0.000099619094,0.0025050584,0.000007417153,0.00004374571,0.0000025935233,0.0000064712062,0.66350687,0.33186036,0.0010343044,0.00049210555,0.00017893424],"about_ca_topic_score_codex":0.00009704205,"about_ca_topic_score_gemma":0.00004509337,"teacher_disagreement_score":0.6405456,"about_ca_system_score_codex":0.00028774142,"about_ca_system_score_gemma":0.0000465492,"threshold_uncertainty_score":0.96483827},"labels":[],"label_agreement":null},{"id":"W2052889152","doi":"10.1016/j.microrel.2007.04.012","title":"Thermal stress concentration factors for defects in plated-through-vias","year":2007,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto; University of New Brunswick","funders":"","keywords":"Stress (linguistics); Materials science; Thermal; Structural engineering; Composite material; Forensic engineering; Engineering; Physics; Thermodynamics","score_opus":0.010073988013134213,"score_gpt":0.23757453114847799,"score_spread":0.22750054313534376,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2052889152","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9691422,0.0014719038,0.027605046,0.00003611254,0.00014433621,0.00042318855,0.000013517768,0.0008530782,0.00031064084],"genre_scores_gemma":[0.998648,0.0001537959,0.0010555488,0.000014089068,0.000023478546,0.000015404052,0.000040153573,0.0000371642,0.000012356401],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9982871,0.000020361551,0.0003302761,0.0003077856,0.000104118764,0.0009503917],"domain_scores_gemma":[0.99927926,0.0002531556,0.000037880633,0.00035132203,0.000040523737,0.00003783644],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004590053,0.00022932244,0.000244297,0.00005716682,0.000072950425,0.000027252996,0.00021993683,0.00024757528,0.0000039494576],"category_scores_gemma":[0.00013566835,0.0002295172,0.00008884622,0.00025388878,0.00006836831,0.00012917911,0.000022326658,0.00047949044,0.000002776736],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017122817,0.00032448277,0.09207535,0.00052797445,0.00014266417,0.000010273381,0.004042824,0.18144885,0.7072948,0.0056083836,0.0007598645,0.007593303],"study_design_scores_gemma":[0.00067369075,0.00016145779,0.005618678,0.00003270719,0.000014611765,0.0000014980878,0.00014885342,0.0106700845,0.9771734,0.0029336086,0.0022112303,0.00036021948],"about_ca_topic_score_codex":0.000051748113,"about_ca_topic_score_gemma":0.000314667,"teacher_disagreement_score":0.26987857,"about_ca_system_score_codex":0.00081845827,"about_ca_system_score_gemma":0.00006708587,"threshold_uncertainty_score":0.93594396},"labels":[],"label_agreement":null},{"id":"W2058843548","doi":"10.1016/j.microrel.2007.01.081","title":"Dynamic behavior of resistive faults in nanometer technology","year":2007,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"VLSI and Analog Circuit Testing","field":"Computer Science","cited_by":7,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Resistive touchscreen; CMOS; Resistor; Electronic circuit; Transistor; Electronic engineering; Nanometre; Materials science; Fault (geology); Logic gate; Electrical engineering; Engineering; Optoelectronics; Voltage","score_opus":0.005357918778952152,"score_gpt":0.25094410407588724,"score_spread":0.2455861852969351,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2058843548","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.85415417,0.0004537947,0.14459917,0.00016133305,0.0000642576,0.00019902174,0.0000026504888,0.0000968194,0.0002687612],"genre_scores_gemma":[0.99322605,0.0000129714645,0.0066743107,0.000026525879,0.000004205216,0.000011339829,0.0000022817055,0.0000083256045,0.00003398783],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99808717,0.000048365706,0.00049394724,0.0005218251,0.00015883477,0.0006898751],"domain_scores_gemma":[0.9987912,0.00017592726,0.0001415928,0.00069582585,0.0001482574,0.00004718484],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013921123,0.000145561,0.00025816594,0.0003814028,0.00006106455,0.000012146714,0.0007860852,0.00015794815,0.0000036114116],"category_scores_gemma":[0.00029222268,0.00014668344,0.00007519947,0.0013682288,0.00013546999,0.00014382917,0.00020830982,0.00038111818,0.000007396609],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000008495494,0.00087427336,0.13610268,0.00009244717,0.00001572528,0.000069305504,0.0005099966,0.000098293815,0.47764325,0.012960886,0.000012942857,0.3716117],"study_design_scores_gemma":[0.0024906688,0.0015572151,0.49146384,0.00025958766,0.000053728763,0.0001797034,0.00023692548,0.026278477,0.43089622,0.043700453,0.0013773305,0.0015058537],"about_ca_topic_score_codex":0.000072438605,"about_ca_topic_score_gemma":0.00040901935,"teacher_disagreement_score":0.37010586,"about_ca_system_score_codex":0.00043321075,"about_ca_system_score_gemma":0.00016786713,"threshold_uncertainty_score":0.59815764},"labels":[],"label_agreement":null},{"id":"W2059355161","doi":"10.1016/j.microrel.2010.02.023","title":"Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding","year":2010,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Fluid Dynamics and Heat Transfer","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Laminar flow; Thermocouple; Volumetric flow rate; Scanning electron microscope; Electromagnetic shielding; Composite material; Materials science; Turbulence; Analytical Chemistry (journal); Chemistry; Metallurgy; Mechanics","score_opus":0.0022934574258680522,"score_gpt":0.19410994522293695,"score_spread":0.1918164877970689,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2059355161","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99821043,0.00022840843,0.00025759672,0.00011641481,0.00017568258,0.00029731114,0.000013281355,0.000063164196,0.0006377204],"genre_scores_gemma":[0.99960226,0.00016303887,0.00014137682,0.000013075219,0.000018244446,0.000010621345,0.000014127618,0.000025613395,0.0000116439805],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.999164,0.000052759653,0.00023465724,0.00017511846,0.00007612142,0.00029736967],"domain_scores_gemma":[0.99942523,0.00012882422,0.000013172236,0.00035177142,0.000040934345,0.000040038987],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006372543,0.0001596411,0.00021933476,0.00007416949,0.000035851528,0.000014712051,0.00013280277,0.00012510148,0.000016647427],"category_scores_gemma":[0.00006996475,0.00014451866,0.000043130047,0.0001609771,0.000045411034,0.000099053665,0.000018630384,0.00050691655,0.0000054857683],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020750146,0.00005917595,0.0010159309,0.0006217046,0.000018164343,0.000001627489,0.0004314861,0.010300547,0.9738554,0.0050000604,0.00017689477,0.008311551],"study_design_scores_gemma":[0.0013991396,0.0010187896,0.0023861923,0.00006792319,0.000025796751,0.0000066510293,0.0000054587586,0.7473297,0.24433404,0.00179979,0.0013381753,0.0002883202],"about_ca_topic_score_codex":0.000044403223,"about_ca_topic_score_gemma":0.0007816153,"teacher_disagreement_score":0.7370292,"about_ca_system_score_codex":0.00014116212,"about_ca_system_score_gemma":0.00002487754,"threshold_uncertainty_score":0.58933},"labels":[],"label_agreement":null},{"id":"W2061903336","doi":"10.1016/j.microrel.2011.11.022","title":"Study of the breakdown failure mechanisms for power AlGaN/GaN HEMTs implemented using a RF compatible process","year":2011,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Toronto","funders":"China Scholarship Council; CMC Microsystems","keywords":"Materials science; Process (computing); Optoelectronics; Power (physics); Electronic engineering; Electrical engineering; Computer science; Engineering; Physics; Operating system","score_opus":0.02452944365724568,"score_gpt":0.28006297632099025,"score_spread":0.25553353266374457,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2061903336","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99584496,0.000015245792,0.0016358295,0.00002608398,0.00015406293,0.0019714208,0.00019192757,0.000021549862,0.00013891034],"genre_scores_gemma":[0.99908185,1.9616932e-7,0.0006842842,0.000028457303,0.000026915033,0.00009726267,0.000027529835,0.000034716923,0.000018790432],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.998231,0.00009740968,0.0005353501,0.000442443,0.0001714954,0.00052228634],"domain_scores_gemma":[0.9985851,0.00004600432,0.00036387672,0.00065128185,0.00029303404,0.00006067332],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00043200215,0.00026090856,0.0004084863,0.000037439066,0.00021287508,0.0000331638,0.00045523475,0.000055599856,0.00048615612],"category_scores_gemma":[0.0000104047795,0.0001933183,0.00017461008,0.00021746334,0.00004944179,0.00010275285,0.00008542374,0.00015837309,0.0000019374368],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000158237,0.0022272412,0.03958909,0.00016081631,0.00024135274,1.8747392e-7,0.004987902,0.00009748654,0.94955194,0.0027282808,0.00013712837,0.00012034464],"study_design_scores_gemma":[0.0016992355,0.00069586124,0.0014950366,0.000029500305,0.00017331302,0.0000013995867,0.0041398024,0.00019783908,0.97774386,0.013099706,0.00042913694,0.00029531273],"about_ca_topic_score_codex":0.0015826462,"about_ca_topic_score_gemma":0.00028065286,"teacher_disagreement_score":0.03809405,"about_ca_system_score_codex":0.00008117002,"about_ca_system_score_gemma":0.00024252017,"threshold_uncertainty_score":0.7883291},"labels":[],"label_agreement":null},{"id":"W2063069455","doi":"10.1016/j.microrel.2003.08.013","title":"Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements","year":2003,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Soldering; Photoluminescence; Optoelectronics; Laser; Diode; Finite element method; Silicon; Polarization (electrochemistry); Semiconductor laser theory; Composite material; Optics; Structural engineering; Chemistry; Physics; Engineering","score_opus":0.029135757131637893,"score_gpt":0.2570071989924409,"score_spread":0.227871441860803,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2063069455","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9848298,0.00095698464,0.013190266,0.000027798267,0.0001145487,0.0002237579,0.00012476722,0.00018271586,0.00034936692],"genre_scores_gemma":[0.99567544,0.00008095108,0.0040511326,0.000005206733,0.000005449324,0.000007735728,0.00013902408,0.000018833787,0.000016193178],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99877554,0.000051901574,0.00035447758,0.00032501214,0.00016923796,0.00032381038],"domain_scores_gemma":[0.99900013,0.00006972291,0.00005797154,0.0008026175,0.000042023832,0.000027533764],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00051621697,0.00014786633,0.00020783792,0.00008417113,0.000032763193,0.000015784093,0.00036433048,0.00014359094,0.000031863834],"category_scores_gemma":[0.0004559039,0.0001643066,0.000030128322,0.00034900216,0.0000579128,0.0002378759,0.000042994372,0.00030950594,0.0000037933034],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000010281668,0.00008445074,0.063849516,0.000050674513,0.000024126652,8.7306563e-7,0.00006117912,0.0014856218,0.9329832,0.00018586915,0.00010752938,0.0011566824],"study_design_scores_gemma":[0.0007927025,0.000045798457,0.022221738,0.00007101983,0.000033962304,0.0000024495214,0.00019732854,0.0162988,0.95351475,0.0022884808,0.0041576778,0.0003752784],"about_ca_topic_score_codex":0.0003128504,"about_ca_topic_score_gemma":0.00046235518,"teacher_disagreement_score":0.04162778,"about_ca_system_score_codex":0.00031323577,"about_ca_system_score_gemma":0.00007804186,"threshold_uncertainty_score":0.6700229},"labels":[],"label_agreement":null},{"id":"W2073642904","doi":"10.1016/j.microrel.2007.10.005","title":"Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings","year":2007,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Soldering; Materials science; Thermal shock; Intermetallic; Microstructure; Metallurgy; Solder paste; Composite material; Joint (building); Coating; Printed circuit board; Temperature cycling; Alloy; Thermal; Structural engineering; Electrical engineering","score_opus":0.00453028076890844,"score_gpt":0.19679675898391544,"score_spread":0.192266478215007,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2073642904","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9844911,0.0025042067,0.01195279,0.00010406277,0.000032237844,0.00017296335,0.000008796112,0.00039200202,0.00034185627],"genre_scores_gemma":[0.9939277,0.0008954646,0.005005022,0.000017277214,0.000012521591,0.0000057535112,0.000004430556,0.00003695581,0.00009487988],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99855995,0.000017459737,0.00034947926,0.00033004055,0.00013395963,0.0006091268],"domain_scores_gemma":[0.9992379,0.0001381178,0.000085321415,0.00041293193,0.00006846824,0.000057276884],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005881027,0.00023300189,0.00035679172,0.00007702978,0.00008678628,0.000029659566,0.00013896063,0.00016208176,0.0000020907878],"category_scores_gemma":[0.000107273714,0.00021836597,0.000028088654,0.00018689466,0.00029424953,0.00007669104,0.000056136672,0.00050306047,8.637632e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005054896,0.00029098085,0.11943679,0.0032685807,0.00027352606,0.00004054417,0.0031956332,0.00021902774,0.8304287,0.004730564,0.0010996129,0.036510523],"study_design_scores_gemma":[0.0023835716,0.0010828716,0.2733812,0.0005117504,0.000188624,0.00017530071,0.00021538573,0.003615013,0.6962434,0.012021861,0.008481884,0.0016991161],"about_ca_topic_score_codex":0.0000332554,"about_ca_topic_score_gemma":0.00030095692,"teacher_disagreement_score":0.15394442,"about_ca_system_score_codex":0.00020772325,"about_ca_system_score_gemma":0.000046104644,"threshold_uncertainty_score":0.89047056},"labels":[],"label_agreement":null},{"id":"W2080305885","doi":"10.1016/j.microrel.2005.01.008","title":"Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints","year":2005,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":67,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of New Brunswick; University of Toronto","funders":"","keywords":"Temperature cycling; Soldering; Materials science; Microelectronics; Reliability (semiconductor); Cycling; Metallurgy; Resistor; Composite material; Thermal; Electrical engineering; Thermodynamics; Engineering; Voltage; Optoelectronics","score_opus":0.004874569280780098,"score_gpt":0.20723354211324688,"score_spread":0.2023589728324668,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2080305885","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9930597,0.0052351467,0.00016876949,0.00021974658,0.00005678469,0.00035520789,0.0000063691655,0.0005449345,0.0003533301],"genre_scores_gemma":[0.9954699,0.00042512946,0.003926033,0.000021134972,0.000028113984,0.000039407412,0.0000070305005,0.00004153776,0.000041703723],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9984152,0.00005555319,0.00036525718,0.00035415834,0.00012563728,0.000684225],"domain_scores_gemma":[0.99911934,0.00011050997,0.000046001536,0.00063144526,0.000047579997,0.000045136556],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004035407,0.00026595668,0.00038533588,0.00013254776,0.00005988436,0.00003158572,0.00033094946,0.00028951565,0.000009834786],"category_scores_gemma":[0.00017736794,0.00025566985,0.0000600784,0.0003329774,0.00010562534,0.00014327603,0.00011193816,0.0008744982,0.0000039864954],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000020578052,0.00008165419,0.002831521,0.0003263581,0.000031385403,0.0000023231344,0.000272522,0.0075233527,0.9802919,0.00019509952,0.0003721876,0.0080511095],"study_design_scores_gemma":[0.0009999743,0.00012571769,0.0072534624,0.00011328912,0.000015787351,0.00000946219,0.000022325117,0.020153731,0.96919954,0.0014035316,0.00036959958,0.0003335969],"about_ca_topic_score_codex":0.00002638529,"about_ca_topic_score_gemma":0.00010542541,"teacher_disagreement_score":0.012630378,"about_ca_system_score_codex":0.00032840122,"about_ca_system_score_gemma":0.00007514058,"threshold_uncertainty_score":0.99998957},"labels":[],"label_agreement":null},{"id":"W2083270183","doi":"10.1016/j.microrel.2004.05.023","title":"Impact of negative bias temperature instability on digital circuit reliability","year":2004,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Semiconductor materials and devices","field":"Engineering","cited_by":120,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Ansys (Canada)","funders":"","keywords":"Negative-bias temperature instability; Ring oscillator; PMOS logic; Materials science; Static random-access memory; Reliability (semiconductor); Transistor; Degradation (telecommunications); Circuit reliability; Electrical engineering; Digital electronics; Electronic circuit; Electronic engineering; Voltage; Threshold voltage; Optoelectronics; Engineering; CMOS; Physics; Power (physics)","score_opus":0.01280367382415954,"score_gpt":0.23553660008546784,"score_spread":0.2227329262613083,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2083270183","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9969569,0.00026711464,0.000036274094,0.000033637978,0.0002788704,0.0005392638,0.00039179862,0.00033013133,0.0011660457],"genre_scores_gemma":[0.9996215,0.000058361868,0.00009889729,0.000020074516,0.00006547116,0.000021499794,0.000052085903,0.000054217526,0.000007886651],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99762666,0.00007749716,0.0007202956,0.00062024256,0.00029439718,0.0006608899],"domain_scores_gemma":[0.99813396,0.0002295258,0.000121066456,0.0010968607,0.00026097707,0.0001576172],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000529706,0.00045804706,0.00063533627,0.0000903387,0.00007778979,0.00011433978,0.00036127318,0.00029603133,0.00012870222],"category_scores_gemma":[0.0006053899,0.00037682723,0.00040310324,0.00045569992,0.00022878074,0.0004152255,0.000057834786,0.0005825794,0.000038899358],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00032730063,0.000947146,0.028990582,0.0005063104,0.0001784949,0.0000032036219,0.0009981791,0.089150816,0.8771651,0.0005765557,0.00023012057,0.0009261852],"study_design_scores_gemma":[0.002138907,0.00166244,0.11009303,0.0001257577,0.00004874545,0.000017504553,0.00008873174,0.00026768108,0.84481996,0.039180767,0.0005389763,0.0010174996],"about_ca_topic_score_codex":0.0003246331,"about_ca_topic_score_gemma":0.000037691756,"teacher_disagreement_score":0.08888313,"about_ca_system_score_codex":0.0017679351,"about_ca_system_score_gemma":0.00036451835,"threshold_uncertainty_score":0.9998684},"labels":[],"label_agreement":null},{"id":"W2154071014","doi":"10.1016/j.microrel.2007.06.006","title":"Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging","year":2007,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":34,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"","keywords":"Flip chip; Soldering; Reliability (semiconductor); Capillary action; Electronic packaging; Newtonian fluid; Materials science; Chip; Flow (mathematics); Mechanical engineering; Process (computing); Electronic engineering; Mechanics; Computer science; Engineering; Composite material; Electrical engineering; Physics; Thermodynamics","score_opus":0.009666468221762826,"score_gpt":0.23333141715598246,"score_spread":0.22366494893421965,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2154071014","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9112471,0.0055063055,0.08200343,0.00006688467,0.000078408586,0.0004000873,0.00001877034,0.0003567744,0.00032224075],"genre_scores_gemma":[0.99360764,0.0002653106,0.0059309546,0.000010552842,0.0000135985065,0.00004948127,0.00006642113,0.000041620926,0.000014417254],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99834484,0.000020376248,0.0004464894,0.0003412691,0.00012990374,0.00071713334],"domain_scores_gemma":[0.99927497,0.00012475054,0.00006063382,0.00044969955,0.000047379104,0.00004254344],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006101902,0.000221407,0.0002999671,0.00013005706,0.00006115273,0.000015243789,0.00027752074,0.00019759781,0.0000027424376],"category_scores_gemma":[0.000045412136,0.000244607,0.00009724014,0.00024127057,0.00009405554,0.0001428883,0.000035136396,0.00033139743,8.0169616e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005067159,0.00011748121,0.00052707497,0.00014015571,0.000033432814,4.825408e-7,0.0009995387,0.100232415,0.8933007,0.0009847496,0.0006072435,0.0030060688],"study_design_scores_gemma":[0.00042529812,0.00011747876,0.00008504586,0.000024349947,0.000007031972,0.0000019955698,0.00017075069,0.23331064,0.7615168,0.0035275812,0.0006018768,0.00021113499],"about_ca_topic_score_codex":0.000044485994,"about_ca_topic_score_gemma":0.0000688995,"teacher_disagreement_score":0.13307823,"about_ca_system_score_codex":0.0008000989,"about_ca_system_score_gemma":0.000057493096,"threshold_uncertainty_score":0.9974784},"labels":[],"label_agreement":null},{"id":"W2520494064","doi":"10.1016/j.microrel.2016.07.028","title":"Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices","year":2016,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"","keywords":"Soldering; Materials science; Eutectic system; Alloy; Composite material; Die (integrated circuit); Temperature cycling; Metallurgy; Thermal; Nanotechnology","score_opus":0.008683188988046282,"score_gpt":0.238760725180432,"score_spread":0.23007753619238572,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2520494064","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.84293693,0.0026515843,0.15161711,0.0007104618,0.00012508803,0.0004688344,0.000034452463,0.0010827249,0.00037283415],"genre_scores_gemma":[0.99649227,0.0004911336,0.0025884765,0.000025719124,0.000026831121,0.00012611887,0.000009801303,0.00007967023,0.00015998808],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99739707,0.00006298705,0.0005807661,0.0005025919,0.00019618159,0.0012603811],"domain_scores_gemma":[0.9982582,0.0005671042,0.00011628662,0.0008492288,0.00014303565,0.00006619081],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00087051437,0.00034955263,0.0004625519,0.00014923279,0.000112352376,0.000033064916,0.0006036184,0.00028585503,0.000029406332],"category_scores_gemma":[0.00036646385,0.0002711031,0.0002596807,0.00031841814,0.00011962182,0.00019594448,0.00007991274,0.0004528619,0.000010871848],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005760322,0.00018041508,0.0011732625,0.000240757,0.00028609348,5.1748407e-7,0.00014937733,0.0008532889,0.94225687,0.030817384,0.0027400865,0.021244377],"study_design_scores_gemma":[0.0016214912,0.0008886627,0.00070477533,0.00019534271,0.00011740693,0.000019664358,0.00011324168,0.007160248,0.8905917,0.05167181,0.045884505,0.0010311892],"about_ca_topic_score_codex":0.000014810487,"about_ca_topic_score_gemma":0.00010545542,"teacher_disagreement_score":0.15355535,"about_ca_system_score_codex":0.00078576163,"about_ca_system_score_gemma":0.00023856283,"threshold_uncertainty_score":0.99997413},"labels":[],"label_agreement":null},{"id":"W2593116849","doi":"10.1016/j.microrel.2017.02.013","title":"Fault detection using thermal image based on soft computing methods: Comparative study","year":2017,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Industrial Vision Systems and Defect Detection","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Soft computing; Computer science; Principal component analysis; Fault detection and isolation; Histogram; Printed circuit board; Artificial intelligence; Adaptive neuro fuzzy inference system; Artificial neural network; Fuzzy logic; Finite element method; Support vector machine; Image processing; Engineering; Pattern recognition (psychology); Image (mathematics); Fuzzy control system","score_opus":0.04081144518267854,"score_gpt":0.35470485705526633,"score_spread":0.3138934118725878,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2593116849","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.78115547,0.00003100439,0.21645369,0.0000061232067,0.00067597,0.0007037492,0.000004275918,0.00023632467,0.0007334295],"genre_scores_gemma":[0.99650115,5.725521e-7,0.0032369066,0.000009463593,0.00018692491,0.000014233984,0.0000017834049,0.00003889666,0.000010047199],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99792045,0.00047710145,0.00045706634,0.00044810225,0.00022805369,0.00046922013],"domain_scores_gemma":[0.99840575,0.00022446694,0.00019272567,0.0009408675,0.00016273574,0.000073425916],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001952648,0.00029506514,0.00044229144,0.000105280174,0.000921412,0.00028523005,0.0002758289,0.00018428804,0.00001694033],"category_scores_gemma":[0.00020911686,0.00027807386,0.00015448144,0.00013833735,0.000067752684,0.00019666449,0.000054613396,0.000720336,0.000025243455],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00019738817,0.00024409982,0.000989047,0.0000477933,0.000067531284,0.0000034801808,0.000573237,0.3510203,0.6132501,0.0000030275935,0.000027295777,0.033576738],"study_design_scores_gemma":[0.0008539137,0.00041670233,0.0026358746,0.00002379612,0.000030606636,0.0000030168783,0.00016528611,0.7764388,0.21870518,0.000023436254,0.00045255982,0.00025085834],"about_ca_topic_score_codex":0.00033326732,"about_ca_topic_score_gemma":0.000070640075,"teacher_disagreement_score":0.4254185,"about_ca_system_score_codex":0.0006901452,"about_ca_system_score_gemma":0.000061203966,"threshold_uncertainty_score":0.99996716},"labels":[],"label_agreement":null},{"id":"W2894760885","doi":"10.1016/j.microrel.2018.07.019","title":"A single event upset tolerant latch design","year":2018,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Fundamental Research Funds for the Central Universities; China Institute of Atomic Energy; National Natural Science Foundation of China","keywords":"Single event upset; Upset; Event (particle physics); Reliability engineering; Computer science; Embedded system; Engineering; Physics; Computer hardware; Static random-access memory; Mechanical engineering","score_opus":0.007599514493057119,"score_gpt":0.2174444839226748,"score_spread":0.20984496942961767,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2894760885","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.72053075,0.0017617524,0.2727643,0.00028096998,0.00076714455,0.00084537436,0.000014851756,0.0010519793,0.001982863],"genre_scores_gemma":[0.9931728,0.000056669698,0.0061462168,0.00011608375,0.00023086346,0.00005617993,0.000014930774,0.00008443542,0.000121785975],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9976678,0.00016300684,0.0004406209,0.0004561464,0.00025372268,0.001018717],"domain_scores_gemma":[0.9986827,0.00019172406,0.000056198933,0.0007881679,0.00015334807,0.00012786704],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0008760781,0.00032123816,0.00030921848,0.00008966909,0.00014575031,0.00006219658,0.0003710304,0.00019983847,0.00016529877],"category_scores_gemma":[0.00013199303,0.0003373442,0.00012633005,0.00045984949,0.00013713572,0.00015385901,0.000039728227,0.00048071754,0.00030324276],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013442339,0.00042180688,0.00019755933,0.00014674391,0.00016484474,0.0000052070172,0.00075406267,0.68370837,0.25085256,0.0012009015,0.027465865,0.03494767],"study_design_scores_gemma":[0.00046683647,0.000793578,0.00017457436,0.000016140799,0.000032333723,0.00002263871,0.0000062872277,0.61092144,0.29800624,0.004998572,0.08409031,0.00047104928],"about_ca_topic_score_codex":0.000022512944,"about_ca_topic_score_gemma":0.0000912953,"teacher_disagreement_score":0.27264208,"about_ca_system_score_codex":0.0016081231,"about_ca_system_score_gemma":0.00019090096,"threshold_uncertainty_score":0.99990785},"labels":[],"label_agreement":null},{"id":"W2895269483","doi":"10.1016/j.microrel.2018.06.078","title":"Deriving lifetime predictions for wire bonds at high temperatures","year":2018,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wire bonding; Bond; Materials science; Arrhenius equation; Reliability (semiconductor); Composite material; Thermodynamics; Forensic engineering; Activation energy; Chemistry; Electrical engineering; Engineering; Physical chemistry; Physics","score_opus":0.00497197118214231,"score_gpt":0.21379748094004322,"score_spread":0.2088255097579009,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W2895269483","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97360253,0.0019129596,0.019533286,0.0005689228,0.00035551796,0.00041369407,0.000049066297,0.003059316,0.0005046975],"genre_scores_gemma":[0.99465847,0.00021604035,0.004016601,0.000045528264,0.00019801494,0.00013724867,0.00003591787,0.00006799584,0.0006241872],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9982105,0.000023690012,0.00029022348,0.00044018333,0.00012526562,0.00091012777],"domain_scores_gemma":[0.9989336,0.000117363335,0.00003610766,0.0007190075,0.00012153872,0.000072372284],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00031307503,0.00027824097,0.00027349414,0.00009171225,0.0004418957,0.00005545855,0.00034387643,0.00023367934,0.000028352804],"category_scores_gemma":[0.00017870893,0.00028140476,0.000105063795,0.00027236744,0.0002263203,0.000096749325,0.00009729351,0.00043333042,0.000028335595],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013953233,0.00020231931,0.0031976972,0.0005050793,0.00040082043,0.000003052515,0.0007072847,0.01573512,0.833352,0.006227242,0.13482577,0.004704049],"study_design_scores_gemma":[0.0010429512,0.0012216981,0.0018110706,0.00008844295,0.00010707742,0.00006263012,0.00004015199,0.09954739,0.70089984,0.014184222,0.17995615,0.0010383812],"about_ca_topic_score_codex":0.00001970429,"about_ca_topic_score_gemma":0.00012611126,"teacher_disagreement_score":0.1324522,"about_ca_system_score_codex":0.0009455544,"about_ca_system_score_gemma":0.00009655973,"threshold_uncertainty_score":0.9999638},"labels":[],"label_agreement":null},{"id":"W3097274808","doi":"10.1016/j.microrel.2020.113938","title":"Experimental results on diodes and BIMOS ESD devices in 28 nm FD-SOI under TLP & TID radiation","year":2020,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electrostatic Discharge in Electronics","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Robustness (evolution); Electrostatic discharge; Diode; Silicon on insulator; CMOS; Optoelectronics; Materials science; Radiation; Transmission line; Electrical engineering; Electronic engineering; Silicon; Engineering; Voltage; Physics; Optics; Chemistry","score_opus":0.012321850077406948,"score_gpt":0.24443079354381875,"score_spread":0.2321089434664118,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3097274808","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9898266,0.0058939615,0.00095299777,0.0014357778,0.00008117845,0.0005690636,0.000044357967,0.00032563022,0.00087040657],"genre_scores_gemma":[0.9976342,0.00057997415,0.0008934206,0.00052532845,0.00007140187,0.000056298297,0.00012477828,0.00007874831,0.000035883775],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99727714,0.00012548311,0.0006720043,0.0007081062,0.00028379506,0.0009334524],"domain_scores_gemma":[0.99903196,0.00023113431,0.00009098686,0.00043565838,0.00004320763,0.00016702394],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00048542512,0.00040629273,0.00040505963,0.00010517427,0.00009274965,0.00009520734,0.00026838816,0.00019328493,0.000026624213],"category_scores_gemma":[0.00015273732,0.00043255778,0.00008068896,0.00048789088,0.00008514154,0.0002338951,0.00005741819,0.00078674423,0.00006638254],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0010783643,0.00067466364,0.0036303797,0.00044989228,0.00019110627,0.000007893044,0.005682219,0.07071784,0.8921752,0.005318522,0.0071724923,0.012901445],"study_design_scores_gemma":[0.0039866813,0.0014670712,0.0031857605,0.000084018604,0.000051915802,0.000013847891,0.00024904413,0.09777442,0.8072918,0.0028430875,0.08166026,0.0013920723],"about_ca_topic_score_codex":0.00006595622,"about_ca_topic_score_gemma":0.00038839687,"teacher_disagreement_score":0.08488336,"about_ca_system_score_codex":0.0010449295,"about_ca_system_score_gemma":0.00014864797,"threshold_uncertainty_score":0.9998126},"labels":[],"label_agreement":null},{"id":"W3205037212","doi":"10.1016/j.microrel.2021.114253","title":"Repetitive short circuit capability of SiC MOSFET at specific low gate-source voltage bias for more robust extreme operation","year":2021,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"","keywords":"Materials science; MOSFET; Silicon carbide; Optoelectronics; Voltage; Robustness (evolution); Gate oxide; Threshold voltage; Depolarization; Electrical engineering; Transistor; Engineering; Composite material; Chemistry","score_opus":0.03957350329607008,"score_gpt":0.22714880173932891,"score_spread":0.18757529844325882,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3205037212","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9866044,0.0025986175,0.008409149,0.00009686545,0.00027455384,0.0008992067,0.00020818817,0.0006635012,0.00024549844],"genre_scores_gemma":[0.99818534,0.0003957815,0.0006581578,0.000028303393,0.000059900474,0.00012540485,0.00023027933,0.00009355557,0.00022330444],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9971038,0.00008212758,0.00081937754,0.00095975935,0.00028466654,0.0007502656],"domain_scores_gemma":[0.99729896,0.0003697357,0.000088585715,0.0016300675,0.0005240946,0.00008857228],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0007262149,0.0004189874,0.0006456011,0.000102229074,0.000117427146,0.000047732716,0.0004125656,0.00040227102,0.00018756765],"category_scores_gemma":[0.0008234549,0.00046735012,0.00031980927,0.00046639377,0.0003539296,0.00018956808,0.00016242366,0.0005439336,0.000012397021],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003203329,0.000104891595,0.003581066,0.00034881625,0.000058695507,0.000004241953,0.00030063998,0.04234668,0.9497643,0.00023959669,0.00081032765,0.002408693],"study_design_scores_gemma":[0.00038078552,0.000085932596,0.0013259373,0.000041181138,0.000039889415,0.000026034144,0.0003206259,0.032069378,0.9598166,0.0007158854,0.00474602,0.0004317411],"about_ca_topic_score_codex":0.000042042942,"about_ca_topic_score_gemma":0.00021804003,"teacher_disagreement_score":0.011580893,"about_ca_system_score_codex":0.0020131136,"about_ca_system_score_gemma":0.00019216855,"threshold_uncertainty_score":0.9997778},"labels":[],"label_agreement":null},{"id":"W4226175265","doi":"10.1016/j.microrel.2022.114533","title":"Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables","year":2022,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; IBM Canada; International Business Machines Corporation","keywords":"Flip chip; Delamination (geology); Wafer dicing; Materials science; Composite material; Chip; Structural engineering; Finite element method; Engineering; Adhesive; Electrical engineering; Layer (electronics)","score_opus":0.0049984485628284375,"score_gpt":0.18033057685198559,"score_spread":0.17533212828915715,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4226175265","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9819125,0.0006993181,0.01648179,0.000030730036,0.000044565473,0.00013948405,0.000020204994,0.00008785854,0.00058357086],"genre_scores_gemma":[0.9992011,0.00009116317,0.00053329446,0.000018454584,0.000014505473,0.000019834748,0.00004085269,0.000031498897,0.000049298847],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9988381,0.000062825355,0.00030049152,0.0002888219,0.0001912867,0.0003184436],"domain_scores_gemma":[0.99949855,0.00005541856,0.000051246163,0.00026450923,0.00009245614,0.00003782065],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00039318952,0.00017970327,0.00026088118,0.00013388912,0.00018435296,0.00002920539,0.00014830794,0.00006225811,0.000043734657],"category_scores_gemma":[0.00001743233,0.00016905174,0.000055192446,0.00023090182,0.000035264256,0.00013118933,0.000049475275,0.00049809844,4.989372e-7],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016702315,0.000022605385,0.00017744486,0.00006138479,0.00010564017,0.0000013046301,0.00088404707,0.9528432,0.044017605,0.000626384,0.000025012987,0.0012186965],"study_design_scores_gemma":[0.00028418773,0.00012540887,0.000052154206,0.000017348537,0.000106786865,0.000020154506,0.00081479683,0.9354683,0.059656028,0.0027476044,0.00044365606,0.00026356857],"about_ca_topic_score_codex":0.00034179082,"about_ca_topic_score_gemma":0.00017055232,"teacher_disagreement_score":0.017374866,"about_ca_system_score_codex":0.00043063686,"about_ca_system_score_gemma":0.00006709042,"threshold_uncertainty_score":0.689373},"labels":[],"label_agreement":null},{"id":"W4297181909","doi":"10.1016/j.microrel.2022.114695","title":"Study of short-circuit robustness of p-GaN and cascode transistors","year":2022,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Silicon Carbide Semiconductor Technologies","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"","keywords":"Cascode; Robustness (evolution); High-electron-mobility transistor; Microsecond; Transistor; Materials science; Nanosecond; Optoelectronics; Voltage; Millisecond; Electrical engineering; Electronic engineering; Computer science; Engineering; Physics; Chemistry","score_opus":0.01650529318706781,"score_gpt":0.2194562202419357,"score_spread":0.2029509270548679,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4297181909","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99713105,0.0018130066,0.00007571413,0.000010855643,0.00014050746,0.00046380365,0.000034111326,0.000229738,0.000101234604],"genre_scores_gemma":[0.99980813,0.000051712326,0.000032860757,0.0000020394732,0.0000055881587,0.000056384804,0.0000038827566,0.00003311523,0.000006307752],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9986821,0.00007424825,0.0004378327,0.00030400997,0.00020850096,0.0002933503],"domain_scores_gemma":[0.99917597,0.00007724253,0.00004765047,0.00061548775,0.00005382714,0.000029853563],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00038026524,0.00017411748,0.00039837463,0.00013936879,0.00005916655,0.000004790219,0.00033036375,0.000072342336,0.000030212992],"category_scores_gemma":[0.000043730906,0.0001996383,0.00006954343,0.00039583482,0.00012628459,0.000052076288,0.00008051134,0.00046756057,1.1809786e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000023985092,0.00037042843,0.015810922,0.00020170225,0.000105892745,0.000002884394,0.0021939655,0.17733677,0.8013173,0.000081881,0.00011173303,0.0024425462],"study_design_scores_gemma":[0.0016066858,0.0021328381,0.010691889,0.000016375443,0.00023303661,0.000078058736,0.014180865,0.02425902,0.9444115,0.0006834374,0.0008777611,0.0008285194],"about_ca_topic_score_codex":0.00010421747,"about_ca_topic_score_gemma":0.00017011916,"teacher_disagreement_score":0.15307775,"about_ca_system_score_codex":0.0003564986,"about_ca_system_score_gemma":0.000057188103,"threshold_uncertainty_score":0.8141014},"labels":[],"label_agreement":null},{"id":"W4362705188","doi":"10.1016/j.microrel.2023.114974","title":"Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs","year":2023,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Advanced Neural Network Applications","field":"Computer Science","cited_by":11,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; National Key Research and Development Program of China; TRIUMF","keywords":"Computer science; Convolutional neural network; Redundancy (engineering); Triple modular redundancy; Field-programmable gate array; Modular design; Error detection and correction; Algorithm; Parallel computing; Embedded system; Artificial intelligence","score_opus":0.019635262379650634,"score_gpt":0.31322943299036715,"score_spread":0.2935941706107165,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4362705188","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9489078,0.00014944212,0.048660196,0.001251254,0.00007948922,0.0007097351,0.000009213749,0.00012889001,0.00010401187],"genre_scores_gemma":[0.99882644,0.000024186613,0.00082702754,0.00017376908,0.00002472669,0.000079175734,0.000027131668,0.000010995094,0.0000065598842],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9977927,0.00033950678,0.00031663894,0.0005735051,0.0005254425,0.00045217772],"domain_scores_gemma":[0.99828017,0.00060834555,0.00011752039,0.0006981728,0.000224547,0.000071247756],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0019282851,0.00017390658,0.00020060004,0.00015045037,0.00008867869,0.000028879096,0.0003614795,0.00008844892,0.0000083171535],"category_scores_gemma":[0.00019821776,0.00015883263,0.000076271484,0.0011991796,0.000092838935,0.000138677,0.00009467611,0.00036993274,0.000007848373],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003886707,0.00011168656,0.0016268928,0.000004817176,0.0000039908196,4.1572946e-7,0.0000176495,0.9756805,0.00083746493,0.00190795,0.00019970456,0.019570118],"study_design_scores_gemma":[0.000537314,0.0003193591,0.053782236,0.000011161691,0.000007793433,0.0000016387914,0.0000011151188,0.9323454,0.00075829704,0.012063427,0.000055475215,0.000116799994],"about_ca_topic_score_codex":0.000024423744,"about_ca_topic_score_gemma":0.00003218674,"teacher_disagreement_score":0.052155342,"about_ca_system_score_codex":0.0006161147,"about_ca_system_score_gemma":0.00025592122,"threshold_uncertainty_score":0.6477006},"labels":[],"label_agreement":null},{"id":"W4379106637","doi":"10.1016/j.microrel.2023.115033","title":"SEU performance of Schmitt-trigger-based flip-flops at the 22-nm FD SOI technology node","year":2023,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems; Cisco Systems","keywords":"Silicon on insulator; Flip-flop; Node (physics); Heavy ion; Schmitt trigger; FLOPS; Soft error; Upset; Single event upset; Electronic engineering; Materials science; Electrical engineering; Computer science; Engineering; Ion; Physics; Silicon; Optoelectronics; Voltage; CMOS; Parallel computing; Mechanical engineering; Static random-access memory","score_opus":0.003430533642543005,"score_gpt":0.2022919191166685,"score_spread":0.1988613854741255,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4379106637","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9941402,0.0015808662,0.00070590456,0.00090529496,0.0003022841,0.0006131763,0.00003052306,0.0011550953,0.0005666581],"genre_scores_gemma":[0.99838036,0.0004939438,0.00034462457,0.000066223394,0.000052165706,0.0001279952,0.000052988435,0.00009260044,0.00038911507],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99730337,0.00010707345,0.0005810522,0.0004866334,0.000358874,0.0011630051],"domain_scores_gemma":[0.99791044,0.00040237125,0.00012437298,0.0013346542,0.00015917922,0.00006898407],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0011829605,0.0003598426,0.00042679821,0.00031170464,0.00025250498,0.000023681729,0.00072293193,0.00036361034,0.00011800326],"category_scores_gemma":[0.00020165402,0.00031377532,0.00017935659,0.0021942414,0.0003185492,0.00010526899,0.00012811682,0.00095221767,0.00040584625],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006112871,0.0000684476,0.003408763,0.0003119011,0.0000783466,0.0000016799199,0.00006854006,0.8932819,0.0856512,0.00034855906,0.0058835554,0.010836026],"study_design_scores_gemma":[0.000530932,0.00021909467,0.001462834,0.000024015751,0.000035266206,0.000007895352,0.0000095429905,0.56934786,0.35478392,0.0003995595,0.07286234,0.00031674805],"about_ca_topic_score_codex":0.000015990667,"about_ca_topic_score_gemma":0.000060585226,"teacher_disagreement_score":0.32393402,"about_ca_system_score_codex":0.0014527434,"about_ca_system_score_gemma":0.00034310456,"threshold_uncertainty_score":0.99993145},"labels":[],"label_agreement":null},{"id":"W4394981627","doi":"10.1016/j.microrel.2024.115392","title":"Comparative study: AutoDPR-SEM for enhancing CNN reliability in SRAM-based FPGAs through autonomous reconfiguration","year":2024,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; Cisco Systems","keywords":"Control reconfiguration; Field-programmable gate array; Static random-access memory; Reliability (semiconductor); Embedded system; Computer architecture; Computer science; Reliability engineering; Engineering; Computer hardware; Physics","score_opus":0.015802399351226185,"score_gpt":0.27290994294218207,"score_spread":0.2571075435909559,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4394981627","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95906967,0.0014751916,0.034771428,0.0002888629,0.00055548636,0.0017720364,0.00006342251,0.00075711636,0.0012467803],"genre_scores_gemma":[0.9981776,0.00002892427,0.00091835,0.000052284893,0.00008818259,0.00037279355,0.00014662789,0.00006560371,0.00014964417],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9968096,0.00019581398,0.0010182261,0.00095172075,0.00021846355,0.00080620125],"domain_scores_gemma":[0.9984778,0.00038759244,0.00006714682,0.00073179224,0.00026001374,0.00007562945],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0013881745,0.00047133834,0.00077646127,0.0002041113,0.00013988576,0.0002198203,0.00030606982,0.00027734612,0.00013898122],"category_scores_gemma":[0.00013809881,0.00045003908,0.0003259326,0.00090915576,0.00007689496,0.00040422584,0.000017231065,0.000941343,0.000047755522],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016870162,0.001139019,0.00085746794,0.0012375241,0.00043889243,0.000018281113,0.016278172,0.6610744,0.30685544,0.002024528,0.004740549,0.0051670466],"study_design_scores_gemma":[0.00081882626,0.0005937245,0.00023689444,0.00011756201,0.00022443847,0.0000034867808,0.0012286451,0.7769635,0.18292907,0.0049409387,0.03115797,0.000784995],"about_ca_topic_score_codex":0.00055097986,"about_ca_topic_score_gemma":0.0052756467,"teacher_disagreement_score":0.12392636,"about_ca_system_score_codex":0.0024812915,"about_ca_system_score_gemma":0.0005489233,"threshold_uncertainty_score":0.99979514},"labels":[],"label_agreement":null},{"id":"W4400576843","doi":"10.1016/j.microrel.2024.115442","title":"Analyzing false turn-on events with varying gate drive parameters in high voltage GaN devices","year":2024,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":2,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Université de Sherbrooke; Ballard Power Systems (Canada)","funders":"","keywords":"Turn (biochemistry); Materials science; Optoelectronics; Voltage; Electrical engineering; Physics; Engineering; Nuclear magnetic resonance","score_opus":0.007774838977672135,"score_gpt":0.24018786513776594,"score_spread":0.2324130261600938,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4400576843","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.99751246,0.0003414484,0.0009033802,0.00015335703,0.00024189912,0.00043918865,0.00008742672,0.00008644993,0.00023438614],"genre_scores_gemma":[0.99924386,0.000017075216,0.0002909659,0.000072947594,0.000085250926,0.000054406537,0.00011167506,0.000050903516,0.00007291958],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9977328,0.00012862636,0.0004539802,0.00078182097,0.0001805725,0.0007221545],"domain_scores_gemma":[0.9990572,0.00018383317,0.00012175355,0.00047341827,0.000059308528,0.000104505234],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00053133984,0.0003626427,0.00043331063,0.00015863337,0.000099661294,0.00018477527,0.00026624938,0.00007849064,0.00014203267],"category_scores_gemma":[0.000009680981,0.00029409092,0.00014014491,0.00043645033,0.000053588083,0.00024167274,0.000043781536,0.0004890713,0.00005758244],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006546698,0.0010414055,0.27297947,0.0011008626,0.0008587514,0.000067824854,0.0019102772,0.039339866,0.6602613,0.008209642,0.00033596106,0.013240022],"study_design_scores_gemma":[0.0028352279,0.0011793786,0.011026148,0.0015268597,0.00041658717,0.000008057635,0.00039181847,0.0073648067,0.929309,0.03587909,0.007944325,0.0021186604],"about_ca_topic_score_codex":0.0016634162,"about_ca_topic_score_gemma":0.00013772762,"teacher_disagreement_score":0.26904777,"about_ca_system_score_codex":0.00027689527,"about_ca_system_score_gemma":0.00020286224,"threshold_uncertainty_score":0.9999511},"labels":[],"label_agreement":null},{"id":"W4404666228","doi":"10.1016/j.microrel.2024.115554","title":"Effects of humidity, ionic contaminations and temperature on the degradation of silicone-based sealing materials used in microelectronics","year":2024,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Silicone and Siloxane Chemistry","field":"Materials Science","cited_by":3,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Alberta","funders":"Nederlandse Organisatie voor Wetenschappelijk Onderzoek; Technische Universiteit Delft; Stichting voor Fundamenteel Onderzoek der Materie","keywords":"Microelectronics; Degradation (telecommunications); Humidity; Silicone; Materials science; Ionic bonding; Composite material; Process engineering; Chemical engineering; Nanotechnology; Electrical engineering; Chemistry; Engineering; Organic chemistry; Thermodynamics; Ion","score_opus":0.006328577349669021,"score_gpt":0.23274607033524622,"score_spread":0.2264174929855772,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4404666228","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9959587,0.002588228,0.000024690004,0.0005690803,0.00015360635,0.000585036,0.000060497543,0.00004659518,0.000013607748],"genre_scores_gemma":[0.99955624,0.00013032029,0.00005771855,0.000060118455,0.000022210603,0.000056645113,0.000038306174,0.000022145616,0.000056283046],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99804795,0.00029294417,0.000553207,0.00048233024,0.00023270144,0.00039084],"domain_scores_gemma":[0.9979349,0.0013361141,0.00014356815,0.00042738917,0.00011911976,0.00003892128],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0013300088,0.0002246259,0.0003953287,0.00010266231,0.00008924975,0.00008665616,0.00025864833,0.00019347713,0.00006864566],"category_scores_gemma":[0.00038132523,0.00017254533,0.00008420927,0.00037271588,0.00023088783,0.00009821213,0.000052438398,0.00034558118,0.000004584212],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006591192,0.00014983113,0.00029851857,0.0009616408,0.0000108885,0.000001982061,0.00013266875,0.00010289001,0.99663293,0.001500946,0.00006786501,0.00007390434],"study_design_scores_gemma":[0.00042357447,0.00019412683,0.0010106204,0.00023982444,0.000039531067,0.000003256632,0.000034475834,0.00022101817,0.99694705,0.0006802061,0.000059853857,0.00014643413],"about_ca_topic_score_codex":0.0001380113,"about_ca_topic_score_gemma":0.00009849168,"teacher_disagreement_score":0.0035975934,"about_ca_system_score_codex":0.00030487514,"about_ca_system_score_gemma":0.0005052791,"threshold_uncertainty_score":0.7036195},"labels":[],"label_agreement":null},{"id":"W4408079678","doi":"10.1016/j.microrel.2025.115648","title":"Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electrodeposition and Electroless Coatings","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"Agence Nationale de la Recherche","keywords":"Die (integrated circuit); Materials science; Ageing; Porosity; Semiconductor; Power (physics); Semiconductor device; Thermal; Engineering physics; Metallurgy; Electrical engineering; Composite material; Optoelectronics; Engineering; Nanotechnology; Layer (electronics); Physics; Thermodynamics","score_opus":0.004436125196631784,"score_gpt":0.23869208819174542,"score_spread":0.23425596299511364,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4408079678","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98961437,0.0017796332,0.0037107756,0.00020481004,0.00009431122,0.0005126953,0.000008425675,0.00019118638,0.0038837676],"genre_scores_gemma":[0.99924666,0.00008210314,0.00023725769,0.00023566544,0.00001393508,0.000064447646,0.000051523268,0.00003129677,0.000037115013],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99811107,0.00018432364,0.0004194414,0.00040012147,0.00036459768,0.0005204448],"domain_scores_gemma":[0.99912196,0.00010765055,0.00008024058,0.00039150674,0.0002458706,0.000052765332],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0008934694,0.00026619819,0.00029287537,0.0001826972,0.00012146597,0.000039726707,0.00014314087,0.0001611635,0.000039469996],"category_scores_gemma":[0.00009156311,0.0002809598,0.000086133354,0.0002972586,0.000054287953,0.000119212185,0.000021474432,0.0004497048,0.0000029255864],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010225637,0.00012785997,0.0005784305,0.00011829143,0.00006406064,0.0000011071717,0.000078320605,0.026654841,0.9639188,0.00022518981,0.0002085113,0.007922326],"study_design_scores_gemma":[0.000905681,0.00037466676,0.004736873,0.00008319904,0.00010916497,0.000002543163,0.000008599146,0.26426044,0.7283817,0.00073439744,0.00016819211,0.00023453234],"about_ca_topic_score_codex":0.000028416629,"about_ca_topic_score_gemma":0.00002796746,"teacher_disagreement_score":0.23760562,"about_ca_system_score_codex":0.00076752633,"about_ca_system_score_gemma":0.0001932761,"threshold_uncertainty_score":0.99996424},"labels":[],"label_agreement":null},{"id":"W4409652475","doi":"10.1016/j.microrel.2025.115743","title":"Solder mask as a reliable insulation layer on printed circuit boards–different layouts and materials under humidity and high voltage","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Kellogg's (Canada)","funders":"","keywords":"Printed circuit board; Materials science; Layer (electronics); Soldering; Composite material; Voltage; Humidity; Optoelectronics; Electrical engineering; Engineering","score_opus":0.008501488866618714,"score_gpt":0.2235216358572344,"score_spread":0.21502014699061567,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4409652475","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.988948,0.0010729295,0.0074939155,0.00042767095,0.00021628938,0.00041604985,0.00001559775,0.0009953227,0.00041421977],"genre_scores_gemma":[0.9983556,0.0008752195,0.00013767958,0.00010744447,0.00001887495,0.000052734726,0.000021089156,0.000038648515,0.00039269947],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99819237,0.000063919346,0.00036383577,0.00057116454,0.00015063475,0.0006580668],"domain_scores_gemma":[0.9990716,0.00013140378,0.00005081925,0.00063047645,0.000056320903,0.000059400554],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004930719,0.00035463885,0.0004255581,0.00016388767,0.0001666147,0.00012128802,0.00018552448,0.0003495387,0.000021596603],"category_scores_gemma":[0.0001420319,0.00033738677,0.00004555136,0.00021390557,0.00012593852,0.000093233044,0.00013865998,0.00062493543,0.000008565483],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00014328385,0.00020050418,0.0028969985,0.00073590013,0.0002237289,0.0000038290773,0.00022567423,0.0034245565,0.924735,0.06289133,0.00073645974,0.0037827347],"study_design_scores_gemma":[0.0010590096,0.00026533374,0.034337647,0.00017653446,0.00007459255,0.000009744799,0.000045361052,0.0035931496,0.8239674,0.13292257,0.0029894728,0.0005591928],"about_ca_topic_score_codex":0.00013647345,"about_ca_topic_score_gemma":0.000036361624,"teacher_disagreement_score":0.100767605,"about_ca_system_score_codex":0.0006063063,"about_ca_system_score_gemma":0.00007749084,"threshold_uncertainty_score":0.9999078},"labels":[],"label_agreement":null},{"id":"W4410653122","doi":"10.1016/j.microrel.2025.115794","title":"Dependence between drain current saturation level and short-circuit robustness of p-GaN HEMTs","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":2,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"Liaoning Academy of Agricultural Sciences; International Centre for Advanced Materials; Centro de Ecológia Aplicada; Direction Générale de l’Armement; Centre National d’Etudes Spatiales; European Synchrotron Radiation Facility; Agence Nationale de la Recherche","keywords":"Robustness (evolution); Materials science; Saturation (graph theory); Saturation current; Optoelectronics; Short circuit; Electrical engineering; Electronic engineering; Mathematics; Engineering; Chemistry; Voltage","score_opus":0.025809192198488685,"score_gpt":0.28482744548961275,"score_spread":0.25901825329112405,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4410653122","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9835856,0.0005682994,0.014709838,0.0000742452,0.00022276049,0.0003626574,0.00016244105,0.000021128992,0.00029304845],"genre_scores_gemma":[0.9995177,0.000019147825,0.00014963742,0.000008153069,0.000091761045,0.000020281563,0.00011682069,0.000011173679,0.00006533272],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9985712,0.00009800573,0.0004449203,0.00042255278,0.00012552785,0.0003377717],"domain_scores_gemma":[0.9991897,0.00010516846,0.00011823236,0.00037742616,0.00015208019,0.000057431105],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00045506557,0.00019924382,0.00036055318,0.000060893493,0.00010000626,0.00005447116,0.00020234588,0.000072620416,0.000054426917],"category_scores_gemma":[0.0000159003,0.00019267827,0.000085873886,0.00018306733,0.000091281916,0.00012638218,0.00006477785,0.00024175759,0.0000015219671],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00004810231,0.00029043425,0.23401895,0.0005873583,0.00013805916,1.9023217e-7,0.0002645911,0.00046738048,0.6580902,0.011749257,0.00037972306,0.093965754],"study_design_scores_gemma":[0.0007935487,0.00011084788,0.05196166,0.0001732151,0.00020680507,6.931254e-7,0.00013011243,0.000727182,0.91910017,0.019972302,0.006304023,0.0005194299],"about_ca_topic_score_codex":0.0002372514,"about_ca_topic_score_gemma":0.00004007038,"teacher_disagreement_score":0.26101,"about_ca_system_score_codex":0.000092079295,"about_ca_system_score_gemma":0.00027381262,"threshold_uncertainty_score":0.78571916},"labels":[],"label_agreement":null},{"id":"W4412603908","doi":"10.1016/j.microrel.2025.115865","title":"RHBD current-mode bandgap with SET isolation using PVT-independent sensors","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan; Dalhousie University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Isolation (microbiology); Set (abstract data type); Optoelectronics; Current (fluid); Mode (computer interface); Electronic engineering; Electrical engineering; Materials science; Computer science; Engineering; Biology","score_opus":0.00554908047163868,"score_gpt":0.25767347390558465,"score_spread":0.252124393433946,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4412603908","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9005141,0.0024994046,0.09454672,0.0000801436,0.000494871,0.00062857434,0.00003156934,0.00048019626,0.0007244106],"genre_scores_gemma":[0.9981173,0.00018461214,0.0013809347,0.00003286715,0.000060578088,0.000031327687,0.0000652905,0.00006135769,0.000065678716],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99774307,0.0001368199,0.000443624,0.0005311945,0.0002845052,0.00086081016],"domain_scores_gemma":[0.9988181,0.00014916841,0.00007948558,0.0007144731,0.00015120214,0.00008756428],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004905449,0.00037435262,0.00035473582,0.0002066419,0.000181421,0.000083197294,0.0002738681,0.00019632521,0.00002691879],"category_scores_gemma":[0.00006409028,0.00037634638,0.000109560395,0.00071798044,0.00007147084,0.00023144812,0.000030886433,0.0008842122,0.00002014159],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006080953,0.00006471584,0.0017102589,0.00023089103,0.00008892061,0.0000011003253,0.00013525817,0.97044677,0.021645924,0.00075758074,0.00081232144,0.0040454515],"study_design_scores_gemma":[0.0007455086,0.000094993615,0.0006709254,0.00006451881,0.00009608694,0.000012280328,0.000015280051,0.94524354,0.03522469,0.0013495084,0.016061323,0.0004213206],"about_ca_topic_score_codex":0.00005372295,"about_ca_topic_score_gemma":0.00016788868,"teacher_disagreement_score":0.09760325,"about_ca_system_score_codex":0.0025159216,"about_ca_system_score_gemma":0.00043000025,"threshold_uncertainty_score":0.99986887},"labels":[],"label_agreement":null},{"id":"W4414945337","doi":"10.1016/j.microrel.2025.115929","title":"Improving transformer model reliability on NVIDIA Jetson AGX: Insights from single event effects with two-photon absorption laser analysis","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":true,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; University of Saskatchewan","keywords":"Triple modular redundancy; Redundancy (engineering); Modular design; Soft error; Robustness (evolution); Latency (audio); Transformer","score_opus":0.0024695520470327096,"score_gpt":0.20211322314116037,"score_spread":0.19964367109412767,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4414945337","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7680663,0.00081706094,0.22850122,0.00008790154,0.00019876767,0.0010831726,0.000034219353,0.00049890333,0.000712461],"genre_scores_gemma":[0.9969333,0.000091608,0.0021587082,0.00016540743,0.0000454358,0.00023039852,0.00018742759,0.000091003625,0.00009670436],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9962519,0.0002710197,0.00076183275,0.0011896851,0.0004967864,0.0010288156],"domain_scores_gemma":[0.99737185,0.00065628486,0.00014222975,0.0014770961,0.00018761148,0.0001649144],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005950874,0.0006859865,0.0008382804,0.00047453982,0.00022035875,0.00011085806,0.0004310505,0.00037842093,0.000023410128],"category_scores_gemma":[0.0001660069,0.00063638063,0.0004372381,0.0017728634,0.00011520586,0.00034455262,0.000028562914,0.0011407097,0.00002411373],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":true,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00025647826,0.00036133293,0.00033377044,0.00022872581,0.00049082644,0.0000016783804,0.00018854065,0.8667322,0.12384859,0.00022895045,0.00008461665,0.007244303],"study_design_scores_gemma":[0.0010682442,0.00034260555,0.00086003466,0.000049273232,0.00068267074,4.0946696e-7,0.0000060659545,0.69705933,0.29589182,0.0031705196,0.0004231639,0.00044583943],"about_ca_topic_score_codex":0.00047050943,"about_ca_topic_score_gemma":0.0016983888,"teacher_disagreement_score":0.22886701,"about_ca_system_score_codex":0.004278972,"about_ca_system_score_gemma":0.00033195133,"threshold_uncertainty_score":0.99960876},"labels":[],"label_agreement":null},{"id":"W7115189498","doi":"10.1016/j.microrel.2025.115983","title":"Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Ottawa","funders":"","keywords":"Interposer; Finite element method; Strain energy density function; Ball grid array; Pareto principle; Decoupling (probability); Die (integrated circuit); Energy (signal processing)","score_opus":0.006119501206106753,"score_gpt":0.20731367600679299,"score_spread":0.20119417480068624,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7115189498","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7246709,0.0016098234,0.27303866,0.00012977261,0.000012629577,0.00022626051,0.00000874618,0.00021037731,0.0000928622],"genre_scores_gemma":[0.9968865,0.0009001194,0.002109401,0.000016331307,0.0000028983693,0.000018637176,0.000013974628,0.000016796104,0.00003532637],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99886197,0.00008427082,0.0002971557,0.00033770915,0.000097690456,0.0003212],"domain_scores_gemma":[0.99917626,0.00027528108,0.000057729918,0.00041114903,0.0000430702,0.000036482757],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00045742778,0.00021885695,0.0004173383,0.00019302573,0.00006694826,0.000026802738,0.00019805519,0.00013503214,0.000015734897],"category_scores_gemma":[0.00011627658,0.00018089214,0.00006288751,0.00047157047,0.00015603032,0.000052224772,0.00012277145,0.00046042886,7.133243e-7],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00074657635,0.00031243646,0.1722841,0.000974512,0.0045617865,0.00001131323,0.000908098,0.13471778,0.5678556,0.0021129716,0.00016254044,0.11535228],"study_design_scores_gemma":[0.0009344087,0.0008461152,0.008608513,0.000059832215,0.00060950976,0.000004968416,0.00019702068,0.60229295,0.38228,0.003116908,0.0006573975,0.000392403],"about_ca_topic_score_codex":0.00006500715,"about_ca_topic_score_gemma":0.00010568882,"teacher_disagreement_score":0.46757516,"about_ca_system_score_codex":0.00012416455,"about_ca_system_score_gemma":0.000032325464,"threshold_uncertainty_score":0.7376568},"labels":[],"label_agreement":null},{"id":"W7116970989","doi":"10.1016/j.microrel.2025.115986","title":"On the activation energy in SP-GaN gate HEMT devices during gate lifetime test","year":2025,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":0,"is_retracted":false,"has_abstract":false,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Safran Electronics (Canada)","funders":"Liaoning Academy of Agricultural Sciences; Direction Générale de l’Armement; Centre National d’Etudes Spatiales; Commissariat à l'Énergie Atomique et aux Énergies Alternatives; European Synchrotron Radiation Facility; Agence Nationale de la Recherche; International Centre for Advanced Materials","keywords":"Activation energy; Impact ionization; High-electron-mobility transistor; Time-dependent gate oxide breakdown; Gate dielectric; Leakage (economics); Transistor; Dielectric","score_opus":0.004749961726133079,"score_gpt":0.22168674483023065,"score_spread":0.21693678310409759,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7116970989","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9954221,0.00006747141,0.00011709368,0.0011745483,0.00011501546,0.00027427042,0.000026193524,0.000039832277,0.002763426],"genre_scores_gemma":[0.9988872,0.000011853323,0.000020084091,0.0003756486,0.00007674451,0.0000688963,0.000044168104,0.00001979849,0.00049559557],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9983597,0.00014330537,0.00040633115,0.00046415394,0.00012030934,0.000506197],"domain_scores_gemma":[0.9987872,0.00040917462,0.00014992231,0.0005361753,0.00007463138,0.000042857788],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00042713652,0.00024949462,0.00027332327,0.0000861009,0.00018920908,0.00010806473,0.0003127579,0.00007330447,0.00032416396],"category_scores_gemma":[0.000054501157,0.00019353614,0.00010461704,0.0003427958,0.000055840454,0.00011347918,0.00006424559,0.00029352613,0.000022764081],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012871652,0.0005102654,0.028364392,0.000110950175,0.00006582409,7.431031e-7,0.00015264933,0.0019115449,0.9346537,0.03240794,0.0005277193,0.0011655821],"study_design_scores_gemma":[0.0005775504,0.00006373492,0.009813171,0.00012150479,0.000021466056,2.2684571e-7,0.00007725449,0.0006232426,0.95698375,0.023799203,0.007667209,0.0002516815],"about_ca_topic_score_codex":0.0014106848,"about_ca_topic_score_gemma":0.0001586295,"teacher_disagreement_score":0.02233008,"about_ca_system_score_codex":0.0002349945,"about_ca_system_score_gemma":0.00019694831,"threshold_uncertainty_score":0.7892175},"labels":[],"label_agreement":null}]}