{"meta":{"query_hash":"952ec62d9b4e","filters":{"venue":"On-Demand Webinars"},"cohort_total":23,"direct_labels_cover":0,"predictions_cover":23,"exported":23,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/952ec62d9b4e","api":"https://metacan.xera.ac/api/v1/cohort?venue=On-Demand+Webinars"},"results":[{"id":"W4416879368","doi":"10.37665/weevrdu13701","title":"Non-Contact Additive Processes for Contemporary Electronics Production","year":2020,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Royal Ottawa Mental Health Centre","funders":"","keywords":"Presentation (obstetrics); Electronics; Production (economics); Jet (fluid); Emerging technologies; Electronic materials","score_opus":0.022020502491757923,"score_gpt":0.2313546385722342,"score_spread":0.2093341360804763,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879368","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9559874,0.010438487,0.0031727771,0.018296646,0.0025892532,0.0038621062,0.00045363096,0.0018381805,0.0033615367],"genre_scores_gemma":[0.9939268,0.0036081423,0.00072286517,0.00027642987,0.00080434873,0.00031900514,0.00007204842,0.000119421195,0.00015091263],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99785966,0.000028182561,0.00055051805,0.00074760814,0.00016838635,0.0006456192],"domain_scores_gemma":[0.99903256,0.000120697565,0.0001904825,0.00034882853,0.00017841559,0.0001290324],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00026226407,0.00052090693,0.00065577804,0.00010828057,0.00024023381,0.00015636811,0.00039237522,0.00034658535,0.000040598792],"category_scores_gemma":[0.0006753277,0.00051952386,0.00014737115,0.0004141649,0.00007001911,0.00031933378,0.00009413701,0.0003446284,0.00007624727],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.006502904,0.0010457549,0.0017324327,0.023730861,0.002424808,0.000113930575,0.0067624566,0.012712518,0.44477606,0.008701878,0.44432274,0.047173664],"study_design_scores_gemma":[0.0019439019,0.004607847,0.00045129017,0.0010696289,0.00014064786,0.0000119477945,0.0003699143,0.0035280394,0.7988426,0.002374587,0.185454,0.0012055782],"about_ca_topic_score_codex":0.0000048128354,"about_ca_topic_score_gemma":0.0000028956147,"teacher_disagreement_score":0.35406658,"about_ca_system_score_codex":0.00010835419,"about_ca_system_score_gemma":0.00033076445,"threshold_uncertainty_score":0.99972564},"labels":[],"label_agreement":null},{"id":"W4416879405","doi":"10.37665/wenntot18191","title":"Practical Guidelines in Handling Moisture Sensitive Packages and PWBs","year":2020,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"IBM; Automotive industry; Standardization; Surface-mount technology; Product (mathematics); Integrated circuit packaging; Process (computing); Packaging industry","score_opus":0.0403808911960884,"score_gpt":0.30148012553993486,"score_spread":0.26109923434384646,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879405","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8430299,0.011022931,0.009803343,0.1301621,0.0004904892,0.0006022991,0.000031756783,0.0012810293,0.0035761183],"genre_scores_gemma":[0.9841557,0.00923912,0.0049902997,0.0011402685,0.0002378734,0.000014876489,0.0000050037315,0.00007958885,0.00013726331],"study_design_codex":"not_applicable","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99745333,0.00010520618,0.0005776048,0.00074476,0.0002892614,0.0008298621],"domain_scores_gemma":[0.99888873,0.00035765787,0.00010047141,0.0003511916,0.000081040926,0.00022089444],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00042696582,0.00054863625,0.0006949738,0.00018280481,0.00016862791,0.00014958216,0.00017960304,0.00048745668,0.000009283633],"category_scores_gemma":[0.0015014842,0.0005453744,0.00009829561,0.00045223997,0.00019780225,0.00019803303,0.00018949142,0.0014376963,0.0000442833],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.002865312,0.0013618371,0.0395596,0.008011253,0.0039384016,0.018189609,0.04508199,0.22150213,0.105374485,0.07584683,0.31968582,0.15858273],"study_design_scores_gemma":[0.010544759,0.0050535128,0.012423553,0.00774588,0.00068810844,0.0007813639,0.0116442675,0.7941407,0.08003619,0.008288416,0.06261122,0.0060420423],"about_ca_topic_score_codex":0.000040839055,"about_ca_topic_score_gemma":0.00003140694,"teacher_disagreement_score":0.5726386,"about_ca_system_score_codex":0.00012925889,"about_ca_system_score_gemma":0.00010052586,"threshold_uncertainty_score":0.9996998},"labels":[],"label_agreement":null},{"id":"W4416879502","doi":"10.37665/weznfjc91929","title":"Design For Environment (DfE): 8 Proven Strategies for Developing Superior, Cost Efficient, & Environmentally Compliant Products","year":2012,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Sustainable Industrial Ecology","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Cerestech (Canada)","funders":"","keywords":"Design for the Environment; Electronics; Social responsibility; Environmentally friendly; Sustainable products; Product (mathematics)","score_opus":0.06195754527840272,"score_gpt":0.26451236387563026,"score_spread":0.20255481859722754,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879502","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.3627449,0.0035200075,0.59551436,0.003415935,0.0047368677,0.028700607,0.00036119582,0.00027609078,0.000730065],"genre_scores_gemma":[0.94850934,0.00037791082,0.042538133,0.0002480538,0.0012058693,0.0047839764,0.00019793262,0.0003820552,0.0017567511],"study_design_codex":"simulation_or_modeling","study_design_gemma":"not_applicable","domain_scores_codex":[0.994558,0.00022307523,0.0010859619,0.0010690104,0.0004244463,0.002639528],"domain_scores_gemma":[0.99752104,0.0009126184,0.00030463995,0.00080893555,0.0000659908,0.00038679186],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0017359207,0.0010199968,0.0010027959,0.00026905927,0.0007583895,0.00022557104,0.00055353384,0.0006442019,0.00020414508],"category_scores_gemma":[0.0002641219,0.0011007626,0.0002304551,0.00022029025,0.00033675658,0.00045552835,0.00020518865,0.0004609535,0.00032616474],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0013500289,0.0011127042,0.0001853721,0.001571545,0.0005530563,0.00001342116,0.00293413,0.9605087,0.014816455,0.005773183,0.0070522684,0.004129146],"study_design_scores_gemma":[0.015147565,0.0040083113,0.0015829608,0.0008237289,0.0009556169,0.00012439923,0.007992232,0.08242331,0.028534397,0.0015740946,0.852172,0.0046613943],"about_ca_topic_score_codex":0.000011855391,"about_ca_topic_score_gemma":0.0000022747781,"teacher_disagreement_score":0.8780854,"about_ca_system_score_codex":0.0029887867,"about_ca_system_score_gemma":0.0006706401,"threshold_uncertainty_score":0.99914426},"labels":[],"label_agreement":null},{"id":"W4416879555","doi":"10.37665/wegdnma10425","title":"How to Clean Really Complex Electronics Assemblies","year":2024,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Ultrasound and Cavitation Phenomena","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Troubleshooting; Electronics; Cleaning agent; Process (computing); New product development; Underpinning","score_opus":0.022008168310863947,"score_gpt":0.2743227953232981,"score_spread":0.2523146270124342,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879555","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.89715856,0.003457823,0.0033076387,0.048363212,0.004424048,0.0011453988,0.0003814044,0.00059214537,0.041169792],"genre_scores_gemma":[0.9635031,0.001087971,0.0009080192,0.0029499324,0.00068200775,0.000059308004,0.000056762812,0.00010309696,0.030649759],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99589574,0.00024545056,0.0005470614,0.0012289075,0.0008751797,0.0012076846],"domain_scores_gemma":[0.9981153,0.00041696994,0.00012825383,0.00068769825,0.00015185996,0.0004998949],"candidate_categories":["metaepi_narrow","scholarly_communication","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00095895334,0.0005822074,0.0005612529,0.0003643477,0.0005444241,0.0035015014,0.00070243,0.0001913945,0.0011352081],"category_scores_gemma":[0.00016389314,0.0005339645,0.00022701018,0.00091354846,0.00019524946,0.00061938894,0.0001497099,0.00039053097,0.0031132356],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00028081198,0.00038602954,0.000046020457,0.00054812344,0.00014919609,0.000105794534,0.0044395532,0.00044141852,0.60141355,0.21243764,0.161041,0.018710867],"study_design_scores_gemma":[0.0006370115,0.0032568534,0.0011201908,0.00065300445,0.00015677373,0.000051901403,0.00215613,0.0005417657,0.013843518,0.020195046,0.95618004,0.0012077395],"about_ca_topic_score_codex":0.000011889694,"about_ca_topic_score_gemma":0.00004541279,"teacher_disagreement_score":0.7951391,"about_ca_system_score_codex":0.00034531445,"about_ca_system_score_gemma":0.0004314711,"threshold_uncertainty_score":0.9997779},"labels":[],"label_agreement":null},{"id":"W4416879560","doi":"10.37665/wensyms76186","title":"Photonic Reflow Fundamentals and Best Use Cases","year":2024,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Metallurgical and Alloy Processes","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Photonics; Reflow soldering; Reliability (semiconductor); Flip chip; Soldering; Electronics; Printed circuit board; Process (computing)","score_opus":0.05658319445860938,"score_gpt":0.3053007730440561,"score_spread":0.24871757858544674,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879560","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9744581,0.017972406,0.000015239228,0.0014962063,0.0022523971,0.00044800385,0.00022719613,0.00014168992,0.002988778],"genre_scores_gemma":[0.95954067,0.014141142,0.00024892023,0.0007756137,0.0003072442,0.00005307875,0.000013436778,0.00006333466,0.024856556],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9963434,0.00019253051,0.0006608945,0.0013570025,0.00061950495,0.00082667416],"domain_scores_gemma":[0.99773884,0.0011173513,0.00012080228,0.00047791653,0.00006389102,0.00048121795],"candidate_categories":["metaepi_narrow","scholarly_communication","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.00067981967,0.0006002612,0.00066376064,0.00019288757,0.0004937086,0.0023706711,0.0003476839,0.00023243451,0.0067647863],"category_scores_gemma":[0.0002934138,0.0004606855,0.00018151596,0.00045602408,0.000606185,0.001011831,0.0003177476,0.00033230855,0.0034186158],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0017376665,0.0041647875,0.0009890066,0.0110167535,0.0006990838,0.018337453,0.002545506,0.00026506092,0.8720732,0.029164227,0.032417905,0.026589407],"study_design_scores_gemma":[0.0016550448,0.0057303356,0.00037699525,0.0067758667,0.00071128,0.0017413794,0.00063316355,0.0029983488,0.13742968,0.0035176806,0.83633924,0.0020909798],"about_ca_topic_score_codex":0.00010357857,"about_ca_topic_score_gemma":0.00002301177,"teacher_disagreement_score":0.80392134,"about_ca_system_score_codex":0.000081679944,"about_ca_system_score_gemma":0.00019379379,"threshold_uncertainty_score":0.99978447},"labels":[],"label_agreement":null},{"id":"W4416879590","doi":"10.37665/wergopj33851","title":"State of the Industry - Introduction to Harsh Environments (Coatings/ Potting)","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Diverse Musicological Studies","field":"Arts and Humanities","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Electronics; Excellence; Process (computing); State (computer science); Presentation (obstetrics); Design for manufacturability","score_opus":0.054867259415310385,"score_gpt":0.23282154496718435,"score_spread":0.17795428555187398,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879590","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.95771587,0.00006670063,0.0000011021581,0.018983925,0.0029547529,0.00066241145,0.00017392362,0.000058980226,0.019382354],"genre_scores_gemma":[0.889887,0.00015328715,0.000008725095,0.0017855566,0.0016287386,0.000046717778,0.000008046738,0.000036423622,0.10644556],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.997451,0.0001814808,0.0005370939,0.0005970444,0.0006297496,0.0006036319],"domain_scores_gemma":[0.9988726,0.00013519538,0.00034766598,0.00046896594,0.000047847476,0.0001277283],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0005481184,0.0003546369,0.00043441172,0.00014335921,0.0011992054,0.00026256885,0.00043509036,0.00015941591,0.0023181634],"category_scores_gemma":[0.0002710267,0.00024951485,0.00018975262,0.0003066082,0.0007051363,0.0001427476,0.0008525584,0.0006254914,0.0015829682],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003939094,0.0013075457,0.008235469,0.00024122478,0.0006075881,0.00005034492,0.047236174,0.007945764,0.0034235269,0.03543948,0.86724675,0.027872222],"study_design_scores_gemma":[0.00054233667,0.0008178849,0.029341824,0.00018599209,0.00010224101,9.706894e-7,0.004316861,0.00003486505,0.0008524947,0.0015686085,0.9618832,0.0003527502],"about_ca_topic_score_codex":0.00006408867,"about_ca_topic_score_gemma":0.00001786453,"teacher_disagreement_score":0.09463642,"about_ca_system_score_codex":0.00013132469,"about_ca_system_score_gemma":0.000027602797,"threshold_uncertainty_score":0.9999957},"labels":[],"label_agreement":null},{"id":"W4416879606","doi":"10.37665/wedtabu78029","title":"Selective Soldering Round Table Discussion","year":2020,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"PricewaterhouseCoopers (Canada)","funders":"","keywords":"Round table; Fusible alloy; Presentation (obstetrics); Soldering; Table (database)","score_opus":0.016555472583506498,"score_gpt":0.22412978277929016,"score_spread":0.20757431019578365,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879606","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7674215,0.014818852,0.059158433,0.0730858,0.0035556217,0.0024368898,0.00011445264,0.012268028,0.06714047],"genre_scores_gemma":[0.99510217,0.0019638678,0.00068841147,0.0003922348,0.00031511163,0.000048802023,0.000009797947,0.00016337336,0.0013162456],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99665684,0.00007470767,0.0005155351,0.00092670147,0.0004221934,0.0014040282],"domain_scores_gemma":[0.9987943,0.000098031815,0.00012275617,0.00059936463,0.000049272432,0.00033627092],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00023744778,0.000728047,0.0007352329,0.00017558648,0.00050655124,0.00024417628,0.00062696886,0.00046777778,0.00007866625],"category_scores_gemma":[0.00019646334,0.0005949578,0.00020266837,0.00094085,0.00014454896,0.00034692528,0.00026629926,0.0014853633,0.00033566967],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00084101077,0.0009793696,0.0042300676,0.004033433,0.0025307415,0.0006220126,0.020629076,0.50874394,0.14910547,0.018583775,0.21628533,0.07341578],"study_design_scores_gemma":[0.007417298,0.0077042254,0.0020659298,0.0045695007,0.00060859043,0.00010094193,0.004342967,0.5708507,0.21069379,0.012074721,0.17299841,0.006572967],"about_ca_topic_score_codex":0.000017498824,"about_ca_topic_score_gemma":0.000005505585,"teacher_disagreement_score":0.2276807,"about_ca_system_score_codex":0.00042188592,"about_ca_system_score_gemma":0.00014249721,"threshold_uncertainty_score":0.9996502},"labels":[],"label_agreement":null},{"id":"W4416879638","doi":"10.37665/wenzvur90162","title":"Achieving Enhanced Reliability with a Novel Lead-free, Bismuth-free, Low Temperature Solder","year":2025,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Reliability (semiconductor); Electronics; Soldering; Fusible alloy; Circuit reliability; Melting temperature; Presentation (obstetrics)","score_opus":0.004911731577698883,"score_gpt":0.21336996831521626,"score_spread":0.20845823673751737,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879638","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9523343,0.0048980443,0.015973084,0.009912837,0.001282299,0.0010309473,0.00011321211,0.0024743131,0.011981004],"genre_scores_gemma":[0.9877646,0.0015532522,0.003997908,0.0004255715,0.0001357796,0.00016205401,0.00001653755,0.00015973636,0.00578456],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9951097,0.00009713195,0.00080710364,0.001541985,0.00061366666,0.001830437],"domain_scores_gemma":[0.99486065,0.00037814342,0.00018421099,0.0042132577,0.00018134923,0.00018237396],"candidate_categories":["metaepi_narrow","research_integrity"],"consensus_categories":[],"category_scores_codex":[0.00070420513,0.0011983255,0.0011938591,0.0005846552,0.0006941553,0.00033498867,0.002128796,0.0010630876,0.000029507457],"category_scores_gemma":[0.0008656059,0.0010744353,0.0003111225,0.0016369233,0.0005511632,0.00034368568,0.00068511156,0.0027505893,0.00002879856],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0018702915,0.0035028232,0.0046433625,0.008717097,0.003343144,0.00024553097,0.0034956466,0.22906338,0.5807895,0.029558262,0.12090773,0.013863204],"study_design_scores_gemma":[0.03773579,0.0071607353,0.02166018,0.044612303,0.002007419,0.00017724237,0.0030966366,0.036448922,0.7879906,0.024148872,0.02396978,0.010991467],"about_ca_topic_score_codex":0.000038632625,"about_ca_topic_score_gemma":0.00007106775,"teacher_disagreement_score":0.20720112,"about_ca_system_score_codex":0.00066265004,"about_ca_system_score_gemma":0.0004257226,"threshold_uncertainty_score":0.9995501},"labels":[],"label_agreement":null},{"id":"W4416879640","doi":"10.37665/wexqsnw70661","title":"Practical Guidelines in Handling Moisture Sensitivity of SMT Packages","year":2016,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"IBM; Standardization; Automotive industry; Surface-mount technology; Product (mathematics); Integrated circuit packaging; Cleanroom; Process (computing)","score_opus":0.031669194035269944,"score_gpt":0.30480488894356017,"score_spread":0.2731356949082902,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879640","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9368889,0.003601875,0.03055914,0.025045013,0.00074015715,0.00037011888,0.000042428994,0.0006507524,0.0021016626],"genre_scores_gemma":[0.98887974,0.006050289,0.0042462163,0.00007415557,0.00013060842,0.000013997267,0.0000015682696,0.00006935316,0.00053409796],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9971228,0.00021548232,0.0007926515,0.00058811536,0.0003784744,0.00090243557],"domain_scores_gemma":[0.99768347,0.0011050547,0.00019032575,0.0007757663,0.00013939323,0.000106009065],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0016062973,0.00050212385,0.00079203077,0.00034837023,0.00009583908,0.000038813698,0.00021328985,0.00055327476,0.000020536845],"category_scores_gemma":[0.0027061289,0.00038068125,0.00017830475,0.00039216646,0.0002793469,0.00021896372,0.00015009605,0.000697964,0.00004334427],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00083413854,0.0014913612,0.062587485,0.0023305018,0.0013376173,0.002623599,0.0017903213,0.029110575,0.5915774,0.041654933,0.060264096,0.20439793],"study_design_scores_gemma":[0.012663899,0.0034056602,0.040484063,0.029717663,0.000579832,0.0007189229,0.0015197431,0.07682477,0.7693468,0.026819618,0.032334894,0.0055841897],"about_ca_topic_score_codex":0.00009695249,"about_ca_topic_score_gemma":0.00012043095,"teacher_disagreement_score":0.19881375,"about_ca_system_score_codex":0.0002517138,"about_ca_system_score_gemma":0.00015146303,"threshold_uncertainty_score":0.9998645},"labels":[],"label_agreement":null},{"id":"W4416879658","doi":"10.37665/weedujr48227","title":"The Role of Electrically Conductive Coatings in EMI Suppression","year":2024,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electromagnetic wave absorption materials","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"EMI; Electrical conductor; Electromagnetic interference; Coating; Key (lock); Electronics; Product (mathematics); Electromagnetic environment","score_opus":0.007016665542969296,"score_gpt":0.25259542550306074,"score_spread":0.24557875996009146,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879658","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98260045,0.007812534,0.000020982385,0.0017267772,0.0015788561,0.0007979912,0.00006970387,0.00006765824,0.0053250385],"genre_scores_gemma":[0.99581504,0.0016653689,0.00020918614,0.00011668602,0.00015638807,0.00007900593,0.000008035998,0.000057713045,0.001892605],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99544173,0.0008271669,0.0011875596,0.00086103665,0.00076523883,0.00091727136],"domain_scores_gemma":[0.9973903,0.0013418677,0.00034898045,0.00060815725,0.00016724688,0.0001434902],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0023759326,0.00042908432,0.0006221585,0.00026408807,0.00028755705,0.0004940448,0.0007058226,0.0002867427,0.0011058559],"category_scores_gemma":[0.0005897219,0.00030487162,0.00013461123,0.0008834226,0.00052364205,0.00029115443,0.00020486329,0.00043494732,0.00044268594],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00040892712,0.0001576908,0.000079009806,0.0001260084,0.00001954224,0.0000315031,0.0009502383,0.000052431984,0.97635496,0.017264064,0.0029800355,0.001575607],"study_design_scores_gemma":[0.0005707846,0.0019963766,0.0006394319,0.001019362,0.00005742181,0.000032474687,0.00035492145,0.0012402959,0.9483222,0.03647266,0.008930906,0.0003631718],"about_ca_topic_score_codex":0.00009417782,"about_ca_topic_score_gemma":0.000013464685,"teacher_disagreement_score":0.028032746,"about_ca_system_score_codex":0.00019588196,"about_ca_system_score_gemma":0.00045999198,"threshold_uncertainty_score":0.99994034},"labels":[],"label_agreement":null},{"id":"W4416879665","doi":"10.37665/weoiqlq94712","title":"LGA Void Reduction via Optimization of Solder Paste Deposition","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Soldering; Corporation; Electronics; Indium; Deposition (geology); Brazing; Reflow soldering","score_opus":0.007105790769368912,"score_gpt":0.20212903413443173,"score_spread":0.19502324336506283,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879665","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.70549095,0.005644709,0.27802283,0.002352191,0.0029268318,0.0008628278,0.000048884518,0.0014408381,0.003209912],"genre_scores_gemma":[0.99504304,0.0012256699,0.0030063393,0.000028307677,0.00009066139,0.00010558813,0.00005299431,0.00008334604,0.00036405926],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99787,0.00013897818,0.0005257158,0.0004623782,0.00044011787,0.000562785],"domain_scores_gemma":[0.99905133,0.000041543964,0.00022234848,0.00056662515,0.00005432171,0.00006380679],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003748458,0.0003480393,0.00039533695,0.00040163274,0.00053594855,0.000039060495,0.00031422637,0.00019857405,0.00016009796],"category_scores_gemma":[0.000024539191,0.00042452328,0.00015730821,0.0006257978,0.000107888736,0.0001765187,0.00016474677,0.0007522495,0.000012032974],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007446123,0.00019384979,0.000045047986,0.00016668107,0.00013364547,0.0000112133,0.0005524365,0.96817446,0.020726528,0.00055733835,0.0017825227,0.007581789],"study_design_scores_gemma":[0.0015454395,0.0022926016,0.0001464811,0.0003500109,0.00022809293,0.00027650062,0.0013305964,0.9121658,0.07750726,0.0022572596,0.0010047607,0.0008951682],"about_ca_topic_score_codex":0.000035685134,"about_ca_topic_score_gemma":0.0000015048523,"teacher_disagreement_score":0.28955206,"about_ca_system_score_codex":0.00049689575,"about_ca_system_score_gemma":0.00006504429,"threshold_uncertainty_score":0.99982065},"labels":[],"label_agreement":null},{"id":"W4416879667","doi":"10.37665/wexvevh47362","title":"Conformal Coatings - Understanding How Key Properties Translate to Fitness for Use","year":2025,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Key (lock); Presentation (obstetrics); Simple (philosophy); Conformal map","score_opus":0.05561481365500571,"score_gpt":0.2540135039170519,"score_spread":0.1983986902620462,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879667","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8887156,0.0005674955,0.09525438,0.008850026,0.0024367457,0.001959372,0.00013313358,0.00091714744,0.0011661032],"genre_scores_gemma":[0.99336207,0.00034153025,0.0038430144,0.0002850374,0.00006954744,0.00019472014,0.000009113164,0.0000753961,0.0018195963],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99782526,0.000039006656,0.0005391438,0.00051665615,0.00019774771,0.000882192],"domain_scores_gemma":[0.9990164,0.00020631531,0.00008947658,0.00050032843,0.000079953854,0.00010750368],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005044244,0.00055127084,0.00068560854,0.00041088142,0.000510105,0.0009145405,0.0004898196,0.00041116183,0.000022470671],"category_scores_gemma":[0.0002222031,0.0005099077,0.00019514638,0.00039544198,0.0001513813,0.00044177828,0.00015150597,0.0002547349,0.0000174069],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0048772516,0.0004757234,0.0020715187,0.018267713,0.0018206817,0.00008272942,0.014239802,0.07888885,0.4662733,0.33503017,0.04515739,0.032814864],"study_design_scores_gemma":[0.0077475677,0.0024895389,0.0006374463,0.011729636,0.0006055881,0.000017631917,0.005742454,0.06083684,0.7509352,0.013293095,0.14256331,0.0034017253],"about_ca_topic_score_codex":0.000028453784,"about_ca_topic_score_gemma":0.000018622719,"teacher_disagreement_score":0.32173705,"about_ca_system_score_codex":0.00023824412,"about_ca_system_score_gemma":0.00008435782,"threshold_uncertainty_score":0.99973524},"labels":[],"label_agreement":null},{"id":"W4416879675","doi":"10.37665/weuthrj43287","title":"What are the Consequences When Coatings Hit the Fan?","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Excellence; Electronics; Troubleshooting; Design for manufacturability; Work (physics); Process (computing); Subject matter; Value proposition","score_opus":0.025554662434865538,"score_gpt":0.24153683687086042,"score_spread":0.21598217443599488,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879675","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9144405,0.0036424352,0.000034991266,0.0737111,0.0048579522,0.00065306266,0.00003636124,0.0013849972,0.0012385852],"genre_scores_gemma":[0.9842509,0.012943276,0.00008150096,0.0006480768,0.0002528571,0.00012407222,0.000006087634,0.000069502865,0.0016237437],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9976308,0.00019094169,0.00053067895,0.0004670035,0.000400138,0.0007804449],"domain_scores_gemma":[0.99784446,0.0007947407,0.00021746915,0.0010237189,0.000058014404,0.00006161553],"candidate_categories":["metaepi_narrow","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0013944117,0.00046157875,0.00045648025,0.00013062825,0.0009026987,0.0012558213,0.0013473554,0.00030469344,0.00021737878],"category_scores_gemma":[0.0003626397,0.00026406828,0.0001770561,0.00054461695,0.00079347,0.00029516232,0.0004776861,0.0005096003,0.0008466416],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00032707775,0.0002534146,0.011856859,0.0023310375,0.0015539759,0.0010350116,0.03341099,0.031679496,0.15126713,0.08449013,0.60446876,0.077326104],"study_design_scores_gemma":[0.002154094,0.0010566607,0.014053529,0.007375714,0.00051626784,0.00017635715,0.082310036,0.009822873,0.22204606,0.20296954,0.45434707,0.00317179],"about_ca_topic_score_codex":0.00005434173,"about_ca_topic_score_gemma":0.00002801503,"teacher_disagreement_score":0.1501217,"about_ca_system_score_codex":0.000062952706,"about_ca_system_score_gemma":0.000050777286,"threshold_uncertainty_score":0.99998116},"labels":[],"label_agreement":null},{"id":"W4416879710","doi":"10.37665/wecpmku66744","title":"Moisture Sensitive Device Handling and Storage","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Standardization; Reliability (semiconductor); Process (computing); Automotive industry; Presentation (obstetrics); Variety (cybernetics)","score_opus":0.00953681391325106,"score_gpt":0.2159696326978152,"score_spread":0.20643281878456413,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879710","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9775523,0.012969142,0.0011301958,0.0022032505,0.0008051344,0.00032286966,0.000057093544,0.00091647654,0.0040435484],"genre_scores_gemma":[0.99623543,0.0017395958,0.0003470123,0.00030812615,0.00009583549,0.0000520079,0.000012031332,0.000090828675,0.0011191351],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99770534,0.00014387335,0.00030541196,0.0006415396,0.00037676794,0.0008270659],"domain_scores_gemma":[0.9990194,0.00020430298,0.000094430114,0.0005257857,0.000031362182,0.00012471282],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005299591,0.0004768184,0.0004992539,0.0002650651,0.0010863774,0.00011184317,0.00029852017,0.00019842993,0.00004021906],"category_scores_gemma":[0.000073924886,0.0005436328,0.000107560416,0.0004227571,0.00014363835,0.00010112884,0.00043120875,0.0016634826,0.000021288552],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0004394645,0.0005834766,0.002214597,0.0012752432,0.0016712636,0.0025315464,0.017398758,0.87036216,0.022806622,0.017187335,0.026984243,0.036545265],"study_design_scores_gemma":[0.010748112,0.0082685575,0.010304995,0.0025522262,0.0012571713,0.0023352082,0.029654384,0.5818436,0.029320244,0.013323247,0.30186006,0.008532153],"about_ca_topic_score_codex":0.000037845337,"about_ca_topic_score_gemma":0.000011554299,"teacher_disagreement_score":0.28851855,"about_ca_system_score_codex":0.0004614561,"about_ca_system_score_gemma":0.00008046882,"threshold_uncertainty_score":0.9997015},"labels":[],"label_agreement":null},{"id":"W4416879751","doi":"10.37665/webhxfg59444","title":"Moisture Sensitive Devices- Part II","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Standardization; Automotive industry; Task (project management); Test (biology); Reliability (semiconductor); Electronic component; Broadband","score_opus":0.013886049665012515,"score_gpt":0.23330687975767536,"score_spread":0.21942083009266283,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879751","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.96191967,0.0025516995,0.00017338504,0.0074251518,0.0019708492,0.00040413375,0.000062356485,0.0055337776,0.019958977],"genre_scores_gemma":[0.9869006,0.0044712266,0.00012030625,0.00029611372,0.00030680624,0.000044668366,0.000039382994,0.00013081357,0.007690056],"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","domain_scores_codex":[0.9968837,0.00007865903,0.00043302416,0.00074476696,0.00041562846,0.0014442415],"domain_scores_gemma":[0.99858254,0.00020339555,0.000097069584,0.00088939455,0.0000580159,0.00016958606],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00051238894,0.00064658414,0.00062536675,0.00041401462,0.0007020473,0.00010480658,0.00045190554,0.00057106046,0.000039022063],"category_scores_gemma":[0.00014116052,0.000661636,0.00023522032,0.0012005053,0.00018186074,0.00013644608,0.0003180233,0.0011801593,0.0013004041],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000178021,0.0004353114,0.0020673967,0.0013543371,0.0021678277,0.002399685,0.0076834164,0.20138074,0.005931375,0.025088495,0.7114197,0.03989372],"study_design_scores_gemma":[0.0041220435,0.003674363,0.015901316,0.0054460578,0.00062531966,0.00023501579,0.0041829594,0.13153993,0.035584345,0.0133450255,0.78012407,0.005219584],"about_ca_topic_score_codex":0.000020567984,"about_ca_topic_score_gemma":0.000027478862,"teacher_disagreement_score":0.06984081,"about_ca_system_score_codex":0.00027344187,"about_ca_system_score_gemma":0.00009103215,"threshold_uncertainty_score":0.9995835},"labels":[],"label_agreement":null},{"id":"W4416879753","doi":"10.37665/wemoiwc98236","title":"What's with Bismuth?","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Champion; Presentation (obstetrics); Electronics; Public interest","score_opus":0.012990973648133466,"score_gpt":0.23012473429236635,"score_spread":0.2171337606442329,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879753","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9662949,0.005746899,0.00052015664,0.008931899,0.0023207085,0.0004206011,0.00001079007,0.006707667,0.009046372],"genre_scores_gemma":[0.9736277,0.01929569,0.00018608087,0.00013277309,0.00013417962,0.00006515792,0.000014155981,0.00015012299,0.0063941614],"study_design_codex":"simulation_or_modeling","study_design_gemma":"not_applicable","domain_scores_codex":[0.997262,0.00004176073,0.0003183084,0.00063327723,0.00041812196,0.0013265428],"domain_scores_gemma":[0.9986313,0.00015372204,0.00006884339,0.00095839234,0.000036417136,0.00015135348],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0003586722,0.00055239024,0.000495973,0.00052470516,0.000302639,0.00040896112,0.00052778714,0.00036048636,0.000051611067],"category_scores_gemma":[0.000048501057,0.000493482,0.00012378412,0.0013826743,0.00021290284,0.0004349848,0.00013401842,0.0008531115,0.0014161073],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0005630635,0.00069539767,0.0037184793,0.0026364678,0.003228908,0.004067222,0.010380092,0.42758843,0.008700271,0.050078288,0.3205909,0.16775247],"study_design_scores_gemma":[0.014854936,0.015519759,0.015892379,0.023795338,0.0011369137,0.0006452554,0.02330459,0.28661248,0.07613208,0.053083632,0.47686374,0.012158897],"about_ca_topic_score_codex":0.0000075687913,"about_ca_topic_score_gemma":0.000010132816,"teacher_disagreement_score":0.15627283,"about_ca_system_score_codex":0.00017936737,"about_ca_system_score_gemma":0.000091415786,"threshold_uncertainty_score":0.9997517},"labels":[],"label_agreement":null},{"id":"W4416879756","doi":"10.37665/weghdnh49401","title":"Level 4 Traceability","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Food Supply Chain Traceability","field":"Agricultural and Biological Sciences","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Traceability; Rework; Work (physics); Bachelor; Process (computing); Product (mathematics); Work order","score_opus":0.08368913662752066,"score_gpt":0.2730407247085864,"score_spread":0.18935158808106578,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879756","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9522903,0.0002773989,0.000001368744,0.038098216,0.0014925567,0.0009881255,0.00071332324,0.0006903517,0.005448365],"genre_scores_gemma":[0.9883337,0.0003982212,0.00004471386,0.0007802113,0.0006446092,0.00007404446,0.00012902383,0.000009067853,0.009586395],"study_design_codex":"not_applicable","study_design_gemma":"observational","domain_scores_codex":[0.9942981,0.0006907269,0.0008692858,0.0017008926,0.0009767623,0.0014642227],"domain_scores_gemma":[0.9971024,0.0014094732,0.00021186646,0.0005439504,0.00015315623,0.0005791661],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.002523841,0.00069007237,0.0007573495,0.00007421914,0.00095203007,0.00022914151,0.0009869064,0.00058947166,0.0038622762],"category_scores_gemma":[0.000614399,0.00032393634,0.00059885916,0.002242547,0.000710708,0.00027353357,0.00032193464,0.00071172114,0.005811384],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0019250232,0.0071976925,0.2367449,0.0007225279,0.00043322874,0.00046922214,0.0036813372,0.0013158409,0.036098223,0.0044714543,0.41660133,0.29033923],"study_design_scores_gemma":[0.00076779985,0.0031333275,0.9175,0.0001374104,0.000058560527,0.00001228991,0.0013874654,0.001704238,0.00096902903,0.008144908,0.06512605,0.0010588883],"about_ca_topic_score_codex":0.0002598716,"about_ca_topic_score_gemma":0.00042198936,"teacher_disagreement_score":0.68075514,"about_ca_system_score_codex":0.00017928501,"about_ca_system_score_gemma":0.00007217281,"threshold_uncertainty_score":0.99992126},"labels":[],"label_agreement":null},{"id":"W4416879783","doi":"10.37665/weofahf24579","title":"Advantages, Benefits & Durability of Stencil Nano-Coatings","year":2025,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Stencil; Fusible alloy; Solder paste; Soldering; Abrasion (mechanical); Surface-mount technology","score_opus":0.013439739127724542,"score_gpt":0.2466497958780709,"score_spread":0.23321005675034637,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879783","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9675704,0.014528398,0.0011542116,0.0019812062,0.0008736859,0.00043649875,0.000059485,0.0008797797,0.012516302],"genre_scores_gemma":[0.99067765,0.005084787,0.0013506137,0.000092932205,0.000032205735,0.000041505424,0.000011336309,0.00005655014,0.0026523946],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9968429,0.000087945264,0.0009011382,0.0007584974,0.00041439416,0.0009951271],"domain_scores_gemma":[0.99772596,0.00039425172,0.00020466,0.0014337855,0.00014012601,0.000101197475],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00074136106,0.00061103643,0.00090360525,0.00040831254,0.00026977644,0.000056775254,0.0007623417,0.0005264129,0.000051892985],"category_scores_gemma":[0.00061867625,0.0006356895,0.00028732468,0.000869918,0.00033513643,0.00015060486,0.00027139627,0.0008719549,0.000056366953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0009120275,0.0032083108,0.083238505,0.017347915,0.0027113731,0.00007316684,0.005963712,0.1838629,0.23278666,0.20139652,0.05536739,0.21313153],"study_design_scores_gemma":[0.011900664,0.004006768,0.055883065,0.024774821,0.0015466803,0.00007714897,0.0028310474,0.0128950635,0.6479452,0.08255637,0.14875278,0.0068303794],"about_ca_topic_score_codex":0.000077688914,"about_ca_topic_score_gemma":0.00005460201,"teacher_disagreement_score":0.41515857,"about_ca_system_score_codex":0.00044343728,"about_ca_system_score_gemma":0.00023094557,"threshold_uncertainty_score":0.9996094},"labels":[],"label_agreement":null},{"id":"W4416879807","doi":"10.37665/wertjuv16319","title":"Practical Guidelines in Handling Moisture Sensitivity of SMT Packages","year":2019,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"IBM; Standardization; Automotive industry; Surface-mount technology; Cleanroom; Product (mathematics); Process (computing); Moisture; Integrated circuit packaging","score_opus":0.024371865109693355,"score_gpt":0.2982266898210501,"score_spread":0.27385482471135675,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879807","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9836794,0.0029154164,0.0029910482,0.005315196,0.0007420405,0.00041086416,0.000017220893,0.00039354846,0.0035352716],"genre_scores_gemma":[0.99216324,0.0028972216,0.00402,0.00009618045,0.000091830254,0.000009858896,0.000004914238,0.00007299865,0.00064373144],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9971485,0.00019304964,0.00077393686,0.0006113344,0.00040596558,0.0008672251],"domain_scores_gemma":[0.99801946,0.0007145794,0.00019246276,0.00085797865,0.0001266342,0.00008889073],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0015766514,0.00050973357,0.0009084339,0.00036050417,0.00007248682,0.000055611756,0.00021862629,0.0005901382,0.000031062373],"category_scores_gemma":[0.0011447439,0.0005025509,0.00018860814,0.00048657975,0.00014767327,0.00019937997,0.00015713522,0.0012534957,0.00009985895],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008409764,0.0017027932,0.16670886,0.005673931,0.0014864474,0.0017700327,0.0032462017,0.45423198,0.25138104,0.038195785,0.03566386,0.039098103],"study_design_scores_gemma":[0.009213881,0.0034938059,0.046886414,0.015447924,0.00046746674,0.0005292293,0.0033029388,0.62738395,0.25670207,0.010127075,0.021575393,0.004869876],"about_ca_topic_score_codex":0.00015624061,"about_ca_topic_score_gemma":0.00008585322,"teacher_disagreement_score":0.17315196,"about_ca_system_score_codex":0.00020574009,"about_ca_system_score_gemma":0.0001558062,"threshold_uncertainty_score":0.9997426},"labels":[],"label_agreement":null},{"id":"W4416879814","doi":"10.37665/weolwnm77920","title":"X-Ray Inspection Criteria and Common Defect Analysis","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Advanced X-ray and CT Imaging","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Presentation (obstetrics); Test (biology); Electronics; Software inspection; Visual inspection; Electronic equipment","score_opus":0.007567971386203748,"score_gpt":0.24697598735251808,"score_spread":0.23940801596631434,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879814","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97350866,0.0059463843,0.007918289,0.00074039603,0.0014853436,0.00039224952,0.00011703637,0.0004509118,0.009440734],"genre_scores_gemma":[0.99749357,0.0009190002,0.00038398395,0.0003978955,0.00015299645,0.00008068122,0.000052499363,0.00007858979,0.00044079358],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9976075,0.00025646447,0.00049191,0.00065175357,0.0004018365,0.00059051294],"domain_scores_gemma":[0.9989468,0.00015271119,0.00013305874,0.0005389784,0.000029743429,0.00019871652],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":[],"category_scores_codex":[0.00048736535,0.0004614306,0.00068285596,0.0006772966,0.0013014859,0.00014797671,0.00023411501,0.00009220978,0.0008929277],"category_scores_gemma":[0.00002401832,0.00054904196,0.00037455637,0.0015625044,0.00011100232,0.00032063614,0.00023925552,0.00079585396,0.00003661285],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00037204725,0.00044148572,0.024597209,0.00027931939,0.0027016674,0.0002540338,0.0037261164,0.9457721,0.0045581195,0.0017704997,0.0030018624,0.0125255305],"study_design_scores_gemma":[0.004484808,0.0024019745,0.09183647,0.0002368629,0.006654063,0.0001770544,0.005642591,0.76579386,0.001236136,0.0046044006,0.11376632,0.00316544],"about_ca_topic_score_codex":0.00005927011,"about_ca_topic_score_gemma":0.000027806935,"teacher_disagreement_score":0.17997822,"about_ca_system_score_codex":0.00030907372,"about_ca_system_score_gemma":0.000022067059,"threshold_uncertainty_score":0.9999987},"labels":[],"label_agreement":null},{"id":"W4416879830","doi":"10.37665/weixhkx17651","title":"3D Printing: What Is it and an Example of Its Use","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Additive Manufacturing and 3D Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"Centennial College","funders":"","keywords":"Aerospace; Automation; Technician; 3D printing; Centennial; Certificate; Rapid prototyping; Advanced manufacturing; Certification","score_opus":0.0499683553282207,"score_gpt":0.25929147698659977,"score_spread":0.20932312165837907,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879830","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9949919,0.0016049822,0.00019245004,0.00089581177,0.0006312657,0.00038109242,0.00007596684,0.00035989482,0.00086665165],"genre_scores_gemma":[0.99256176,0.004568686,0.0012044573,0.0002730711,0.00006660819,0.000054936787,0.000015796086,0.000090844675,0.0011638222],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99746996,0.00014467305,0.0005322171,0.00080116384,0.0004350074,0.00061698706],"domain_scores_gemma":[0.99833107,0.0003300786,0.00023334408,0.00090354914,0.00006608483,0.00013589133],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00058956305,0.0004743379,0.00055011426,0.00034990718,0.0005361608,0.00029410984,0.0005372924,0.0001893153,0.000926251],"category_scores_gemma":[0.00011514728,0.0005297375,0.00011929263,0.0002829823,0.0001964542,0.00078515545,0.0010586526,0.00084692874,0.000028691898],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008193259,0.00277842,0.011894484,0.004857886,0.002142784,0.00056379155,0.05103111,0.11830199,0.013164177,0.031538192,0.038859386,0.72404844],"study_design_scores_gemma":[0.0031160514,0.0041926284,0.0209549,0.0018541701,0.00035542058,0.00013327117,0.017114429,0.04162773,0.2063242,0.003063613,0.69822854,0.0030350364],"about_ca_topic_score_codex":0.00010928876,"about_ca_topic_score_gemma":0.000003953024,"teacher_disagreement_score":0.7210134,"about_ca_system_score_codex":0.000095990355,"about_ca_system_score_gemma":0.000034185097,"threshold_uncertainty_score":0.99998707},"labels":[],"label_agreement":null},{"id":"W4416879864","doi":"10.37665/wenleep41307","title":"Webtorial: Reflow - Understanding the Complete Process & Defect Prevention","year":2017,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Canadian Wood Council","funders":"","keywords":"Soldering; Reflow soldering; Surface-mount technology; Solder paste; Root cause; Process (computing); Session (web analytics)","score_opus":0.09406223789622012,"score_gpt":0.32437443442961533,"score_spread":0.2303121965333952,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879864","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8095166,0.009618716,0.059822723,0.013710173,0.014103078,0.0025869901,0.000081668026,0.0037789543,0.08678109],"genre_scores_gemma":[0.9966997,0.0010681092,0.0002070573,0.00003460225,0.0004997355,0.00006357348,0.000011764351,0.00010643441,0.0013090566],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.99719685,0.00013452112,0.00045348937,0.000622293,0.0005705863,0.0010222595],"domain_scores_gemma":[0.99726045,0.000176225,0.0003394822,0.0020225563,0.0000690762,0.00013220975],"candidate_categories":["metaepi_narrow","sts"],"consensus_categories":[],"category_scores_codex":[0.0013635828,0.0005598417,0.0005472538,0.00015712946,0.0023665112,0.00078547123,0.0014629926,0.00039211664,0.000027462982],"category_scores_gemma":[0.0005544821,0.00045729615,0.00030518355,0.00018634163,0.00045679577,0.00034625398,0.0002296464,0.001081958,0.00016477332],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":"theoretical_or_conceptual","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0019031181,0.0017283866,0.009149865,0.0062544,0.008121428,0.0003639093,0.024084447,0.25295988,0.011885194,0.39521024,0.25439012,0.033949018],"study_design_scores_gemma":[0.0074098893,0.0026397076,0.0017047473,0.006335301,0.0011778957,0.00015365625,0.003407343,0.04428342,0.002067118,0.8162593,0.110882014,0.0036795754],"about_ca_topic_score_codex":0.000021865273,"about_ca_topic_score_gemma":0.000093573086,"teacher_disagreement_score":0.4210491,"about_ca_system_score_codex":0.00085882883,"about_ca_system_score_gemma":0.00018131179,"threshold_uncertainty_score":0.99978787},"labels":[],"label_agreement":null},{"id":"W4416879878","doi":"10.37665/welyfup21439","title":"Shining a Light on LED Technology","year":2015,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Light-emitting diode; Reliability (semiconductor); LED lamp; Electronics; LED display; Focus (optics)","score_opus":0.019977593867182564,"score_gpt":0.2612269495768644,"score_spread":0.2412493557096818,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416879878","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9540371,0.0004763732,0.000042240754,0.0068902066,0.0029287792,0.00055326783,0.000090269394,0.00012557753,0.03485622],"genre_scores_gemma":[0.99462163,0.000033438646,0.00010817801,0.00079745735,0.0010053525,0.0000757048,0.000052525746,0.00009580694,0.00320991],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.9968866,0.00016594747,0.000683111,0.0009181596,0.0004121016,0.00093405397],"domain_scores_gemma":[0.9979565,0.00008782048,0.00043240385,0.0009106647,0.00015519894,0.00045737994],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005442328,0.0006845926,0.0008915038,0.00038395738,0.00028956347,0.00026829608,0.0005804052,0.0003825156,0.0007732567],"category_scores_gemma":[0.00003869843,0.000615095,0.00023747874,0.0004368834,0.00013973069,0.00019208122,0.0001763796,0.00055112195,0.002781936],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0035253672,0.0071042567,0.025469134,0.0005876787,0.0024206666,0.0005591234,0.010383021,0.0026263967,0.26664492,0.409257,0.23056775,0.0408547],"study_design_scores_gemma":[0.009875973,0.006639519,0.00026807238,0.0019472651,0.00043580565,0.000017834138,0.0059230067,0.00047222254,0.17739223,0.030658668,0.7639994,0.002369989],"about_ca_topic_score_codex":0.00004603817,"about_ca_topic_score_gemma":0.0000034970228,"teacher_disagreement_score":0.53343165,"about_ca_system_score_codex":0.00012195305,"about_ca_system_score_gemma":0.00032885757,"threshold_uncertainty_score":0.99963003},"labels":[],"label_agreement":null}]}