{"meta":{"query_hash":"73542da774b7","filters":{"venue":"Pan Pacific Symposium"},"cohort_total":21,"direct_labels_cover":0,"predictions_cover":21,"exported":21,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/73542da774b7","api":"https://metacan.xera.ac/api/v1/cohort?venue=Pan+Pacific+Symposium"},"results":[{"id":"W4416882226","doi":"10.37665/ppmajms97441","title":"DOE for Process Validation Involving Numerous Assembly Materials and Test Methods","year":2009,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Rework; Printed circuit board; Soldering; Surface-mount technology; Process (computing); Solder paste; Process validation; Test method","score_opus":0.015183888929373893,"score_gpt":0.29619264929616895,"score_spread":0.28100876036679506,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882226","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.90448606,0.009570745,0.07056671,0.004303111,0.0021847233,0.0022765163,0.00010596489,0.0037459228,0.0027602515],"genre_scores_gemma":[0.98051596,0.0016723707,0.016983114,0.000023244002,0.00025146938,0.00015157653,0.000037232236,0.00009647509,0.0002685692],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99714714,0.0001182282,0.00070863526,0.0007554825,0.0002076804,0.0010628065],"domain_scores_gemma":[0.9982916,0.0006373358,0.00021716965,0.0006206197,0.000110880595,0.0001223945],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001278096,0.0005954007,0.0007159597,0.00027830733,0.0003679337,0.00051720213,0.00036765236,0.0004872071,0.000009160714],"category_scores_gemma":[0.0006530249,0.0006336377,0.00009573673,0.0003833083,0.00009403922,0.00038407758,0.00005325054,0.00033894248,0.000009409533],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000024684383,0.00009445785,0.0003192649,0.0006539509,0.00008986965,0.0000032727492,0.0025601266,0.0002794358,0.9684048,0.0019715359,0.00023751869,0.025361044],"study_design_scores_gemma":[0.0007283719,0.0006275616,0.00030808116,0.00041841643,0.00019609893,0.00005729491,0.0015515931,0.01098631,0.9728773,0.010817914,0.0005475948,0.00088342064],"about_ca_topic_score_codex":0.000007999952,"about_ca_topic_score_gemma":9.540144e-7,"teacher_disagreement_score":0.07602989,"about_ca_system_score_codex":0.00020836183,"about_ca_system_score_gemma":0.00007893919,"threshold_uncertainty_score":0.9996115},"labels":[],"label_agreement":null},{"id":"W4416882444","doi":"10.37665/ppmaxzl36133","title":"X-Ray Inspection … Avoid Radiation Damage","year":2002,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Radiation Effects in Electronics","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Ball grid array; Soldering; Reliability (semiconductor); Electronic equipment; Intellectualization; Component (thermodynamics)","score_opus":0.006290436446254146,"score_gpt":0.19164234788801923,"score_spread":0.18535191144176508,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882444","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.17446001,0.02584531,0.03419956,0.006357258,0.037299573,0.0049782177,0.00023905329,0.0075976243,0.7090234],"genre_scores_gemma":[0.98631316,0.0052664224,0.00024408325,0.000057773672,0.0017700822,0.0000970518,0.000061749146,0.0002274535,0.005962205],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.996089,0.000351132,0.00088081596,0.0008228208,0.00065101776,0.0012052067],"domain_scores_gemma":[0.9979131,0.00030280135,0.00027078934,0.0011024853,0.00010543405,0.00030534997],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0005735925,0.0007054569,0.0005390466,0.00056725414,0.00051778916,0.0003447215,0.00040268552,0.0005518111,0.001016],"category_scores_gemma":[0.00013012927,0.0007764623,0.0002632735,0.0012234006,0.00013248163,0.00081944803,0.00004138626,0.0009989762,0.0039004697],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003436657,0.000512264,0.0011410863,0.00055596605,0.00049657736,0.000033189215,0.010698323,0.8193445,0.05423618,0.002481629,0.05169433,0.05877156],"study_design_scores_gemma":[0.0010412235,0.00030078006,0.0021357366,0.00007299953,0.00015647497,0.000025731759,0.00030918096,0.8983525,0.005631729,0.000102913495,0.09094013,0.00093061064],"about_ca_topic_score_codex":0.000028293529,"about_ca_topic_score_gemma":0.000008011049,"teacher_disagreement_score":0.8118532,"about_ca_system_score_codex":0.0016548136,"about_ca_system_score_gemma":0.00004660727,"threshold_uncertainty_score":0.9998972},"labels":[],"label_agreement":null},{"id":"W4416882507","doi":"10.37665/ppvoblq72363","title":"Mil/Aero MEMS: Benefits and Barriers","year":2002,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Advanced MEMS and NEMS Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Software deployment; Reliability (semiconductor); Key (lock); Work (physics); Risk management","score_opus":0.012288290500920247,"score_gpt":0.1960985447643907,"score_spread":0.18381025426347045,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882507","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.68961734,0.17916405,0.00051159,0.003624263,0.005282324,0.001345007,0.00030191825,0.0032601375,0.116893366],"genre_scores_gemma":[0.9305972,0.06548579,0.0009560213,0.00003553218,0.00023896455,0.00006199937,0.000005043152,0.00013499675,0.0024844834],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99724007,0.000013143471,0.00057240395,0.0008056425,0.00030479828,0.0010639414],"domain_scores_gemma":[0.9983826,0.00013088461,0.00011134334,0.0008824488,0.00005999061,0.00043270134],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00014046693,0.00068407645,0.0006183821,0.00027541482,0.00036975052,0.00014973081,0.0003511486,0.0005609746,0.00048595289],"category_scores_gemma":[0.00010273789,0.00072914065,0.00014730057,0.00047997507,0.00038436602,0.00038768578,0.00018177074,0.00060981186,0.00027168402],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000046561054,0.0001520907,0.0015216164,0.00077047764,0.0006710784,0.00013859778,0.008287549,0.0028976626,0.6958612,0.0044045756,0.017994426,0.26725417],"study_design_scores_gemma":[0.0045480793,0.0011828801,0.0016119834,0.0015101609,0.000743879,0.00044504474,0.019623617,0.015072939,0.39633107,0.0024145101,0.5505625,0.0059533715],"about_ca_topic_score_codex":0.00001545061,"about_ca_topic_score_gemma":0.000008473775,"teacher_disagreement_score":0.53256804,"about_ca_system_score_codex":0.00013467579,"about_ca_system_score_gemma":0.00001191444,"threshold_uncertainty_score":0.99951595},"labels":[],"label_agreement":null},{"id":"W4416882623","doi":"10.37665/ppnbtnt17481","title":"Reliability Assessment of Alternative Lead-Free Alloys Used During Wave and Rework","year":2009,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada); Hain Celestial (Canada)","funders":"","keywords":"Rework; Reliability (semiconductor); Electronics; Alloy; Soldering; Procurement","score_opus":0.011811000485866288,"score_gpt":0.2403579959719319,"score_spread":0.2285469954860656,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882623","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9757718,0.0019328811,0.0026055581,0.0018492859,0.0006006258,0.00060115947,0.000044512442,0.0009409132,0.015653295],"genre_scores_gemma":[0.99175197,0.0033433072,0.0042683426,0.000007961402,0.00013031319,0.000024549296,0.0000063513785,0.00006356798,0.0004036301],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99655133,0.00014323572,0.0008733354,0.00088772044,0.00050927314,0.0010350785],"domain_scores_gemma":[0.99734294,0.0002512853,0.00026658917,0.0018819941,0.00011345482,0.00014373446],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006993707,0.0006298866,0.0008960338,0.0002823729,0.00021999408,0.000108270775,0.0005994522,0.00042289123,0.000015554699],"category_scores_gemma":[0.00019582342,0.000670213,0.00019785132,0.00043894042,0.0003491446,0.00024664943,0.000253045,0.0010552552,0.0000040749264],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00013045527,0.00069066876,0.016215239,0.0016596357,0.0007864855,0.00014894485,0.009866111,0.013885517,0.9364497,0.012108498,0.00059549295,0.007463235],"study_design_scores_gemma":[0.0066605895,0.0028785956,0.16416936,0.0031230284,0.0006149169,0.00024551482,0.0050476226,0.1609268,0.5970819,0.054923657,0.0006650824,0.003662943],"about_ca_topic_score_codex":0.000040857936,"about_ca_topic_score_gemma":0.0000057116213,"teacher_disagreement_score":0.33936784,"about_ca_system_score_codex":0.0005604248,"about_ca_system_score_gemma":0.000093047274,"threshold_uncertainty_score":0.9995749},"labels":[],"label_agreement":null},{"id":"W4416882731","doi":"10.37665/ppjiniv58944","title":"Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives","year":2015,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Conducting polymers and applications","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada); University of Waterloo","funders":"","keywords":"Nanofiber; Adhesive; Electrical conductor; Soldering; Nanocomposite; Polypyrrole; Electrically conductive","score_opus":0.03598824637494545,"score_gpt":0.28459545704460243,"score_spread":0.24860721066965696,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882731","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7207562,0.0038039603,0.2252352,0.0083835125,0.0046866764,0.009446874,0.0025402857,0.0004102089,0.02473711],"genre_scores_gemma":[0.9863343,0.000053836164,0.009459021,0.00005421624,0.00038349637,0.00084548286,0.00008785808,0.000074111944,0.0027076532],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9964365,0.00009971646,0.0010500611,0.0011071141,0.0005272522,0.0007793626],"domain_scores_gemma":[0.99628365,0.0004472085,0.000992021,0.001005718,0.0008652333,0.00040616037],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0008493324,0.00047034823,0.00071248465,0.00022161327,0.00030767874,0.00013173085,0.00068831764,0.00026560016,0.000033977863],"category_scores_gemma":[0.00018121254,0.00048087936,0.00025103716,0.00079554087,0.0005852865,0.00030873183,0.00012462377,0.00015250417,0.000087010674],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021692616,0.0006839208,0.00013148779,0.00010142192,0.000057159723,2.3881594e-7,0.002831774,0.000053186766,0.9886435,0.004418922,0.0011740881,0.001687357],"study_design_scores_gemma":[0.0019271249,0.0006184679,0.000048640373,0.00004767604,0.00023754263,0.000019084413,0.0067245867,0.0024798405,0.974109,0.00055123644,0.012663963,0.00057282986],"about_ca_topic_score_codex":0.00029509453,"about_ca_topic_score_gemma":0.000008544952,"teacher_disagreement_score":0.26557815,"about_ca_system_score_codex":0.0001964104,"about_ca_system_score_gemma":0.00062830886,"threshold_uncertainty_score":0.99976426},"labels":[],"label_agreement":null},{"id":"W4416882974","doi":"10.37665/ppflyqj65836","title":"A Nanocopper Based Alternative to High Temperature Solder","year":2015,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Nanoporous metals and alloys","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Soldering; Solder paste; Creep; Microstructure; Reliability (semiconductor); Microelectronics; Joint (building); Grain size; Isothermal process","score_opus":0.019945027304738256,"score_gpt":0.2481419129108982,"score_spread":0.22819688560615994,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882974","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9436659,0.0007835801,0.00039938325,0.012294912,0.019661661,0.0024904306,0.0006386844,0.0003026723,0.019762784],"genre_scores_gemma":[0.9736836,0.000052679756,0.002723857,0.0015044621,0.0016376694,0.00019430088,0.0000482061,0.00014599788,0.020009227],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9934655,0.0006517387,0.0010184889,0.0017890134,0.0014959764,0.0015793173],"domain_scores_gemma":[0.9957263,0.000159018,0.00038669276,0.0014701091,0.0007843974,0.0014735016],"candidate_categories":["metaepi_narrow","scholarly_communication","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0017207109,0.0009536473,0.0010782589,0.00033730397,0.0004146411,0.0010615201,0.0011301525,0.00043130093,0.0015053845],"category_scores_gemma":[0.00021149132,0.00082275766,0.00028676994,0.00089511607,0.000301941,0.00049762067,0.00036456695,0.00040014507,0.0062417104],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00032475177,0.0004947024,0.00024356136,0.000080873295,0.000061598636,0.00012429454,0.0042558615,0.0008829537,0.95639807,0.00059923565,0.03630495,0.00022916817],"study_design_scores_gemma":[0.0027472728,0.0012148258,0.00012720954,0.0003507651,0.00015727716,0.000039192142,0.0029581569,0.0003355257,0.9313685,0.00053913577,0.058685906,0.0014762008],"about_ca_topic_score_codex":0.00045019068,"about_ca_topic_score_gemma":0.000026353604,"teacher_disagreement_score":0.030017707,"about_ca_system_score_codex":0.0003832318,"about_ca_system_score_gemma":0.0008968104,"threshold_uncertainty_score":0.9999755},"labels":[],"label_agreement":null},{"id":"W4416883221","doi":"10.37665/ppxnchk78425","title":"Design Challenges in SMT Terminal Block Design","year":2002,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Canadian Anthropology Society","funders":"","keywords":"Surface-mount technology; Cable gland; Footprint; Soldering; Compatibility (geochemistry); Block (permutation group theory); Component (thermodynamics); Mount","score_opus":0.06457406865605836,"score_gpt":0.22504882571915175,"score_spread":0.1604747570630934,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883221","genre_codex":"review","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.04748004,0.57037115,0.15147026,0.023979384,0.007528155,0.006555982,0.000042583604,0.014982954,0.17758952],"genre_scores_gemma":[0.92666966,0.06691567,0.004598974,0.000009345584,0.00017397471,0.00016439184,0.0000013086101,0.00015687704,0.0013098066],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99541944,0.0003775446,0.00081747805,0.0010315878,0.00041436005,0.0019396148],"domain_scores_gemma":[0.9978333,0.000509013,0.00013595437,0.0012972067,0.00004560094,0.0001789395],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0009771726,0.00086436956,0.0008396172,0.0006887732,0.00020026085,0.00016529748,0.0008503274,0.0007294146,0.00008152693],"category_scores_gemma":[0.0000955319,0.00097546633,0.00016902272,0.00063979364,0.00022715077,0.00023577364,0.000130521,0.0012511921,0.0005071272],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00029234387,0.0027529777,0.0012150703,0.0029563233,0.0013844895,0.0032183619,0.06943888,0.3264462,0.21872076,0.0037524945,0.021790009,0.3480321],"study_design_scores_gemma":[0.00328709,0.002178485,0.000420772,0.0020207493,0.00029134186,0.001208897,0.006419307,0.8626973,0.10384646,0.003792917,0.009518959,0.004317735],"about_ca_topic_score_codex":0.000013005392,"about_ca_topic_score_gemma":0.000004852049,"teacher_disagreement_score":0.8791896,"about_ca_system_score_codex":0.00056029443,"about_ca_system_score_gemma":0.000055611577,"threshold_uncertainty_score":0.9992696},"labels":[],"label_agreement":null},{"id":"W4416883329","doi":"10.37665/ppnjbnv25063","title":"Polymer-Based Electronics: Economically Viable Renewable Energy System","year":2014,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Simon Fraser University","funders":"","keywords":"Renewable energy; Energy (signal processing); Architecture; Systems architecture; Energy system; Hybrid system; Key (lock)","score_opus":0.005339686363239521,"score_gpt":0.1776360595809346,"score_spread":0.17229637321769506,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883329","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.03391632,0.0059251804,0.27984685,0.00053701364,0.014191733,0.00064318493,0.00023495479,0.0042010807,0.6605037],"genre_scores_gemma":[0.9850554,0.000286138,0.001370981,0.000091046895,0.001522576,0.00009640459,0.00011664564,0.00034733466,0.011113457],"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99494386,0.00035544662,0.0013355946,0.0011359479,0.00031202624,0.0019171513],"domain_scores_gemma":[0.9972115,0.000364505,0.00035574785,0.0014310254,0.00010460086,0.0005325945],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00059562194,0.0009742607,0.0012310038,0.0002932328,0.00040841807,0.00043438963,0.0006085374,0.0005320182,0.00024868944],"category_scores_gemma":[0.0000481879,0.0011160262,0.00031698283,0.00033288344,0.00013726813,0.0003251213,0.00008213861,0.00027900908,0.00039753376],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00009113891,0.00006438676,0.000051946383,0.0005508164,0.00013222359,0.000007890261,0.00006430613,0.53070587,0.45754325,0.009010415,0.001072248,0.00070554594],"study_design_scores_gemma":[0.0011078053,0.00029561424,0.0000064791298,0.00038541248,0.00014903751,0.000034757704,0.0001522063,0.23686692,0.6222085,0.0002354002,0.13730855,0.0012493662],"about_ca_topic_score_codex":0.0011939047,"about_ca_topic_score_gemma":0.0000994783,"teacher_disagreement_score":0.9511391,"about_ca_system_score_codex":0.00084352924,"about_ca_system_score_gemma":0.00018577585,"threshold_uncertainty_score":0.999129},"labels":[],"label_agreement":null},{"id":"W4416883630","doi":"10.37665/ppjxvqa25605","title":"C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and Wlcsp","year":2006,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Bumping; Soldering; Flip chip; Chip-scale package; Wafer; Solder paste","score_opus":0.007130211700205046,"score_gpt":0.20505448679103824,"score_spread":0.19792427509083318,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883630","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8421058,0.056788277,0.046938535,0.02038176,0.002657544,0.0043431334,0.0003374571,0.00810265,0.018344853],"genre_scores_gemma":[0.9920198,0.003312417,0.002516867,0.000021639247,0.0003026224,0.00030303712,0.000024295417,0.00017389293,0.0013254719],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9963204,0.000036106845,0.0006700879,0.0010561851,0.00022193133,0.001695288],"domain_scores_gemma":[0.998125,0.0002768475,0.00015911047,0.0012404015,0.00008015994,0.00011849197],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00041022964,0.00078237895,0.0008285134,0.00067519123,0.00054634677,0.0002892483,0.0005817635,0.0009349127,0.000004205342],"category_scores_gemma":[0.00016469184,0.0008700828,0.00013110827,0.00054810196,0.0007369046,0.00018551236,0.0003687845,0.00083481125,0.000013477166],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00016376445,0.00042852413,0.022798538,0.0042550475,0.00085760915,0.00007937715,0.0020714912,0.001795689,0.7597973,0.06539031,0.01708058,0.1252818],"study_design_scores_gemma":[0.015545337,0.0019557169,0.0056373887,0.0039366153,0.0012100687,0.0013221639,0.008688411,0.23250723,0.53315675,0.11443084,0.07331164,0.008297852],"about_ca_topic_score_codex":0.000054821303,"about_ca_topic_score_gemma":0.000048568352,"teacher_disagreement_score":0.23071153,"about_ca_system_score_codex":0.0002240751,"about_ca_system_score_gemma":0.000072011244,"threshold_uncertainty_score":0.999375},"labels":[],"label_agreement":null},{"id":"W4416883635","doi":"10.37665/ppipdal65996","title":"A Simple Approach for a 3D Printed Single-Strand Based Compliant Deflection Sensor Input Device","year":2023,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Additive Manufacturing and 3D Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Electrical conductor; Cantilever; 3D printing; Deflection (physics); Electrically conductive; Fused deposition modeling; 3d printed; Printed circuit board; Electronic component","score_opus":0.04279766150524851,"score_gpt":0.25403180418844634,"score_spread":0.21123414268319785,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883635","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.14099796,0.000165888,0.8237487,0.00069348665,0.0014129492,0.0032945385,0.00074617536,0.009818995,0.019121287],"genre_scores_gemma":[0.9694,0.00005090717,0.028274849,0.000027756254,0.0002885467,0.00044297893,0.0005639136,0.00021230223,0.000738784],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9962247,0.0001276227,0.0007988254,0.0011251929,0.00036403706,0.0013596242],"domain_scores_gemma":[0.9977983,0.0006710154,0.00023173698,0.0009246101,0.00019464383,0.00017967394],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00059658836,0.00079145667,0.0007577308,0.000685892,0.00056480867,0.00029540987,0.0004604063,0.00055124046,0.00004843171],"category_scores_gemma":[0.00028482045,0.0008541669,0.0003663407,0.0011339992,0.0002294655,0.00013434408,0.00017586967,0.00065339654,0.00020797265],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0012265152,0.0016994168,0.004849736,0.013179064,0.002085863,0.000107615844,0.0052183787,0.2836145,0.5759006,0.00054422754,0.019994102,0.091579966],"study_design_scores_gemma":[0.0016930539,0.00039600796,0.0021473248,0.00024417182,0.00022839132,0.000026157888,0.0026134225,0.705932,0.24863504,0.00023769608,0.036650322,0.001196408],"about_ca_topic_score_codex":0.000042881846,"about_ca_topic_score_gemma":0.000006676559,"teacher_disagreement_score":0.828402,"about_ca_system_score_codex":0.00032980493,"about_ca_system_score_gemma":0.000066658205,"threshold_uncertainty_score":0.9993909},"labels":[],"label_agreement":null},{"id":"W4416883853","doi":"10.37665/pplivqe67389","title":"“Life-Testing …. Save Time and Money, Get Better Data”","year":2001,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Statistical Distribution Estimation and Applications","field":"Mathematics","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Test (biology); Key (lock); Quality (philosophy); Sample (material); Statistical hypothesis testing; Statistical analysis","score_opus":0.09531937168020718,"score_gpt":0.32827227572557743,"score_spread":0.23295290404537025,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883853","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.03360768,0.0009049375,0.6922946,0.046411548,0.00077727245,0.0033206043,0.018266242,0.0010166905,0.2034004],"genre_scores_gemma":[0.9491215,0.0002900046,0.03944401,0.0010577469,0.000689129,0.00011239526,0.0030508968,0.00013200169,0.0061023626],"study_design_codex":"not_applicable","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99649686,0.00019650611,0.0010578444,0.0010311719,0.00050710735,0.00071048574],"domain_scores_gemma":[0.99480176,0.0020714754,0.00040215102,0.0016565447,0.0002764293,0.0007916169],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0006263114,0.00049705774,0.00058375904,0.000111906804,0.0005847749,0.00041990026,0.0005577463,0.00024864243,0.0019506568],"category_scores_gemma":[0.002901806,0.0005222835,0.00006891656,0.000592126,0.0004316579,0.0003552603,0.0004564329,0.00037647312,0.0032978293],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00020622737,0.0034848198,0.011710898,0.0013270137,0.0009096809,0.00017201305,0.0034367424,0.000081888145,0.035805214,0.34103984,0.51906115,0.082764484],"study_design_scores_gemma":[0.00233302,0.000202338,0.009075914,0.00044810784,0.001172805,0.00041306484,0.0010770735,0.8254672,0.00035686666,0.05020521,0.1072206,0.002027775],"about_ca_topic_score_codex":0.000030458465,"about_ca_topic_score_gemma":0.0000018887141,"teacher_disagreement_score":0.91551375,"about_ca_system_score_codex":0.00008202309,"about_ca_system_score_gemma":0.00016747897,"threshold_uncertainty_score":0.9997229},"labels":[],"label_agreement":null},{"id":"W4416884016","doi":"10.37665/ppauazr67473","title":"Design and Assembly Factors for 0201 Components","year":2001,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Component (thermodynamics); Printed circuit board; Solder paste; Surface-mount technology; Stencil; Selection (genetic algorithm); Electronic component","score_opus":0.03146905896153589,"score_gpt":0.23584795299054107,"score_spread":0.20437889402900516,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884016","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.66451734,0.0049826438,0.32139274,0.0010073291,0.0019812041,0.0012908066,0.000031508574,0.0020714167,0.0027249763],"genre_scores_gemma":[0.9902843,0.0047745192,0.0036600828,0.000007907132,0.00011578507,0.00009862592,0.000024454688,0.00013039692,0.0009038991],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99728185,0.00007854709,0.00047470749,0.00066995586,0.00023126164,0.0012636721],"domain_scores_gemma":[0.9981757,0.0008215959,0.000109640765,0.00065037434,0.00005942336,0.00018326193],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00041918334,0.00061648444,0.0006069587,0.00026336868,0.00036545724,0.00022789557,0.0003907361,0.00044028985,0.000009408697],"category_scores_gemma":[0.000100861165,0.0006399679,0.00014355351,0.00028580555,0.00016340638,0.00020058436,0.00009737646,0.00043893393,0.000028749391],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002632436,0.0003972873,0.01613433,0.0009770393,0.001205947,0.00005340954,0.0078110215,0.011661069,0.9351316,0.0020972155,0.0077808816,0.016486967],"study_design_scores_gemma":[0.005887532,0.0024614143,0.00670168,0.0010735252,0.00085235504,0.00034313818,0.007348365,0.63358575,0.26753002,0.0056070546,0.06347082,0.0051383665],"about_ca_topic_score_codex":0.000027608907,"about_ca_topic_score_gemma":0.0000016773295,"teacher_disagreement_score":0.6676016,"about_ca_system_score_codex":0.00022868722,"about_ca_system_score_gemma":0.00004529508,"threshold_uncertainty_score":0.9996052},"labels":[],"label_agreement":null},{"id":"W4416884737","doi":"10.37665/ppuakob46324","title":"Problems with Rose Testing Using Today’s Fluxes","year":2018,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Printed circuit board; Rosin; Soldering; Solder paste; Wave soldering; Isopropyl alcohol; Test method; Surface-mount technology; Reflow soldering","score_opus":0.024130243577645143,"score_gpt":0.22414641065607724,"score_spread":0.2000161670784321,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884737","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.8855566,0.0049061845,0.025129681,0.00071293203,0.0022505715,0.0012488207,0.0000371263,0.006898447,0.073259644],"genre_scores_gemma":[0.9848153,0.00020095159,0.013089233,0.000014128331,0.00065351854,0.000043882308,0.0000058103124,0.00023052578,0.00094666536],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9960333,0.00007457417,0.0006437234,0.00094824756,0.00044604152,0.001854103],"domain_scores_gemma":[0.99788404,0.0001855568,0.00020963051,0.0012715973,0.0002587874,0.00019039758],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004624192,0.00081923633,0.00066800136,0.00035726922,0.00070401875,0.00038390947,0.00062787783,0.00043145593,0.000030715753],"category_scores_gemma":[0.00012959755,0.0007758446,0.00010845395,0.0012953997,0.0007315939,0.00034154128,0.00020419159,0.0008434392,0.00015165642],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00006156178,0.00024032923,0.019795457,0.0010775647,0.00066459883,0.000080049496,0.00758152,0.02224668,0.93302906,0.00094853475,0.0009846302,0.013290034],"study_design_scores_gemma":[0.0025950146,0.004373583,0.0012822822,0.005849203,0.0007546804,0.0011964934,0.004903593,0.6613041,0.30039614,0.0027344583,0.009803351,0.004807093],"about_ca_topic_score_codex":0.00017158191,"about_ca_topic_score_gemma":0.000032137035,"teacher_disagreement_score":0.63905746,"about_ca_system_score_codex":0.0005008292,"about_ca_system_score_gemma":0.00023985999,"threshold_uncertainty_score":0.9994693},"labels":[],"label_agreement":null},{"id":"W4416884804","doi":"10.37665/ppyzcwb14335","title":"Fabrication of 2d And 3d Inductors for Dc-Dc Converters Integrated On Glass Interposer","year":2018,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Inductor; Fabrication; Inductance; Microfabrication; Magnetic core; Silicon; Substrate (aquarium); Converters; Interposer","score_opus":0.012784964735673579,"score_gpt":0.2228485629380753,"score_spread":0.21006359820240172,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884804","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9083827,0.0006193568,0.06324184,0.0009364323,0.0055995327,0.0018004825,0.0002730813,0.0008223727,0.018324187],"genre_scores_gemma":[0.9976054,0.00035472863,0.0010497487,0.000028396438,0.00018436895,0.00007748143,0.000043288077,0.00007497567,0.0005816537],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9980471,0.000045654182,0.00067723985,0.0005485493,0.00018878882,0.00049266545],"domain_scores_gemma":[0.99855775,0.00019897462,0.00023675298,0.0006237508,0.00028310253,0.00009968204],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00024295467,0.0004518388,0.0005529293,0.0003834542,0.00011742137,0.00007060795,0.00033037696,0.00046025775,0.000056474695],"category_scores_gemma":[0.00016123617,0.00041999217,0.00011545663,0.00039984426,0.0006597693,0.00019179747,0.000087752225,0.00030664366,0.00006254974],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0011676141,0.0006807133,0.018467985,0.0019834975,0.0018010155,0.0000066814746,0.02390042,0.000095241536,0.6760513,0.013081064,0.019370615,0.24339382],"study_design_scores_gemma":[0.002921034,0.0043765963,0.003663772,0.0012789477,0.00045398867,0.000022684913,0.020167569,0.1021839,0.8243661,0.0014328284,0.03748028,0.0016522746],"about_ca_topic_score_codex":0.000054785352,"about_ca_topic_score_gemma":0.000007776536,"teacher_disagreement_score":0.24174155,"about_ca_system_score_codex":0.00017344553,"about_ca_system_score_gemma":0.000052554606,"threshold_uncertainty_score":0.9998252},"labels":[],"label_agreement":null},{"id":"W4416884832","doi":"10.37665/ppjeiwt59357","title":"Reliability Studies of Flip Chip Package with Reflowable Underfill","year":2001,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Optech (Canada)","funders":"","keywords":"Flip chip; Soldering; Bridging (networking); Temperature cycling; Adhesive; Curing (chemistry); Die (integrated circuit); Delamination (geology)","score_opus":0.02181932613487384,"score_gpt":0.2493835742177381,"score_spread":0.22756424808286427,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884832","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9096998,0.020884993,0.0024483104,0.0018219071,0.0011960514,0.0008586948,0.00005143233,0.0022900386,0.060748797],"genre_scores_gemma":[0.974671,0.021046722,0.0014291262,0.000011778377,0.00013041931,0.000068738096,0.000010238826,0.00013612292,0.00249584],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9959415,0.00014662051,0.0009539364,0.0009546505,0.0005467231,0.0014565367],"domain_scores_gemma":[0.99680066,0.00038503512,0.00027285685,0.0021139919,0.0002724542,0.00015498183],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00085259666,0.0008119207,0.0012607641,0.00031343114,0.00030345522,0.00007420278,0.00065290823,0.00043928262,0.000032034444],"category_scores_gemma":[0.00024704012,0.0007034126,0.00022848076,0.0011783513,0.00090977235,0.00028320734,0.00020270543,0.0009079622,0.000060235823],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0015611041,0.0025234618,0.110303,0.01115696,0.008676236,0.00057413086,0.042248588,0.08003685,0.68807733,0.011368005,0.023591075,0.019883284],"study_design_scores_gemma":[0.009342576,0.00858457,0.0157356,0.008160263,0.0024289542,0.00088328915,0.07648052,0.022168295,0.7844307,0.024664745,0.038426716,0.00869381],"about_ca_topic_score_codex":0.0000774298,"about_ca_topic_score_gemma":0.000038882714,"teacher_disagreement_score":0.09635335,"about_ca_system_score_codex":0.00061098614,"about_ca_system_score_gemma":0.00015409861,"threshold_uncertainty_score":0.9995417},"labels":[],"label_agreement":null},{"id":"W4416885169","doi":"10.37665/ppykpzo82456","title":"Evaluating the Manufacturability and Operational Costs for New Conformal Coating Processes","year":2008,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Material Selection and Properties","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Design for manufacturability; Conformal coating; Coating; Conformal map; Process (computing); Electronics","score_opus":0.07630489811716142,"score_gpt":0.3166529547050901,"score_spread":0.24034805658792868,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885169","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9849105,0.00069967244,0.00089881214,0.004166453,0.002225965,0.0021571694,0.00012783686,0.00009516219,0.004718447],"genre_scores_gemma":[0.9909717,0.00032561345,0.0011837728,0.00029160312,0.0008472738,0.00016919014,0.00003169653,0.000026705873,0.006152448],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9972105,0.000322188,0.0008185604,0.0006002004,0.0004956577,0.0005528822],"domain_scores_gemma":[0.99810666,0.00058233185,0.00032614297,0.00030386553,0.00049638905,0.00018460762],"candidate_categories":["sts","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0018025163,0.00034579905,0.00035877203,0.00004210312,0.002486887,0.00077388674,0.00028010565,0.00013695353,0.0010352631],"category_scores_gemma":[0.00084939064,0.0002336768,0.00006230145,0.00015824672,0.0005096419,0.0006403064,0.00011578337,0.000139941,0.00006439316],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0013042494,0.00008934666,0.0017679151,0.00090089976,0.000041700045,0.0000010359939,0.020956583,0.00021596416,0.9655564,0.00053018145,0.003170043,0.005465687],"study_design_scores_gemma":[0.0019925975,0.0017654588,0.00183212,0.00018451824,0.00010903084,0.00034132873,0.003947953,0.008481257,0.95727533,0.0003343661,0.022912696,0.0008233137],"about_ca_topic_score_codex":0.00046782737,"about_ca_topic_score_gemma":0.000040265153,"teacher_disagreement_score":0.019742653,"about_ca_system_score_codex":0.00010631025,"about_ca_system_score_gemma":0.0010047917,"threshold_uncertainty_score":0.9998779},"labels":[],"label_agreement":null},{"id":"W4416885191","doi":"10.37665/ppfawbh25693","title":"Life-Test Statistics for Small Sample Sizes","year":2008,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Sample size determination; Quality (philosophy); Test (biology); Statistical hypothesis testing; Sample (material); Interpretation (philosophy)","score_opus":0.022321947664105096,"score_gpt":0.21324105958582937,"score_spread":0.19091911192172428,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885191","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.038067117,0.0085393265,0.8212573,0.0019872421,0.011735428,0.004034231,0.034870356,0.0016913877,0.07781762],"genre_scores_gemma":[0.97899103,0.0032248318,0.009661642,0.00016741555,0.0013268555,0.00014178224,0.0009115366,0.00025488238,0.0053199986],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9962517,0.00007481713,0.0011654091,0.00085088453,0.00037282595,0.0012843662],"domain_scores_gemma":[0.99533635,0.0022459198,0.00023523642,0.00090448535,0.0005679755,0.00071001035],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00028363615,0.0008346799,0.0010717899,0.0003350892,0.0006327214,0.0002196411,0.00051512744,0.00048526423,0.0010305018],"category_scores_gemma":[0.0014272138,0.00086286524,0.00050525356,0.0006149424,0.00024385263,0.00019003953,0.000041546107,0.0005464992,0.0003289896],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00017981548,0.0015486949,0.012728319,0.0024047021,0.005878598,0.00022475216,0.031341143,0.011652011,0.45671552,0.02434682,0.44278637,0.010193263],"study_design_scores_gemma":[0.005874339,0.0021514683,0.0012103716,0.00052808045,0.0053135008,0.00029077032,0.01577047,0.29363942,0.07228483,0.0036165153,0.59175867,0.0075615374],"about_ca_topic_score_codex":0.00049424486,"about_ca_topic_score_gemma":0.000086434986,"teacher_disagreement_score":0.9409239,"about_ca_system_score_codex":0.00023901547,"about_ca_system_score_gemma":0.00043141353,"threshold_uncertainty_score":0.9998827},"labels":[],"label_agreement":null},{"id":"W4416885239","doi":"10.37665/ppxxkau97527","title":"Sustainable Microelectronics Packaging – Balancing Environmental, Cost and Reliability Issues","year":2025,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Diverse Musicological Studies","field":"Arts and Humanities","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microelectronics; Reliability (semiconductor); Enabling; Interfacing; Interconnection; Integrated circuit packaging; Sustainability; Packaging engineering; Energy consumption","score_opus":0.012545584240274101,"score_gpt":0.21510064482935956,"score_spread":0.20255506058908546,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885239","genre_codex":"other","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.36479354,0.03759604,0.000060648847,0.01842684,0.0025269666,0.0031791097,0.00027186575,0.0003081747,0.5728368],"genre_scores_gemma":[0.8253352,0.0062526166,0.000027798484,0.00041107656,0.0002470834,0.00008197829,0.000022290447,0.000028283082,0.1675937],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.99633193,0.00023932787,0.00062511873,0.0010635356,0.0002996199,0.0014404386],"domain_scores_gemma":[0.9986598,0.00034560353,0.00019066832,0.00055619085,0.00009714554,0.00015060708],"candidate_categories":["metaepi_narrow","sts","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00071290426,0.00060217653,0.0007486115,0.00016558115,0.00255767,0.0018342962,0.00030503707,0.00018686296,0.0012079637],"category_scores_gemma":[0.00009648543,0.0005635132,0.00017867827,0.00013858752,0.0016274136,0.00037660098,0.00089411717,0.00049073325,0.00013814947],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000533103,0.0024249854,0.09950415,0.0030436544,0.001216141,0.00021860485,0.10429185,0.000062741594,0.008604263,0.64419866,0.12567323,0.010228605],"study_design_scores_gemma":[0.00063912215,0.00023308618,0.0017120981,0.00012020264,0.00026871733,0.000002744351,0.12841251,0.000117913376,0.0005123612,0.0028839272,0.8645697,0.00052759703],"about_ca_topic_score_codex":0.0005187594,"about_ca_topic_score_gemma":0.00003083331,"teacher_disagreement_score":0.7388965,"about_ca_system_score_codex":0.0008966053,"about_ca_system_score_gemma":0.0000967477,"threshold_uncertainty_score":0.9997051},"labels":[],"label_agreement":null},{"id":"W4416885636","doi":"10.37665/ppcadjg70211","title":"Residual Stress Correlation to ATC Reliability Scale in the μPGA-Solder Joint-PCB Pad System*","year":2005,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Soldering; Deflection (physics); Failure mode and effects analysis; Residual stress; Interconnection; Ball grid array; Strain gauge; Residual; Stress (linguistics)","score_opus":0.009094532407398747,"score_gpt":0.21030123692526487,"score_spread":0.20120670451786613,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885636","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.94846886,0.0025444122,0.0070839263,0.013219254,0.001908138,0.002044321,0.000114838025,0.0022014086,0.022414856],"genre_scores_gemma":[0.99711716,0.0003276535,0.0009653741,0.000046252357,0.0004979136,0.00023761175,0.000027131899,0.00010195047,0.0006789718],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9951188,0.0004520223,0.0011932581,0.0010267813,0.0007253064,0.0014838284],"domain_scores_gemma":[0.997122,0.00034946087,0.0001781451,0.00207838,0.00011076333,0.00016126863],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0019825757,0.0006982395,0.00073012034,0.00041531972,0.00037356038,0.0003001246,0.00092738785,0.0006115037,0.000025574362],"category_scores_gemma":[0.00020517177,0.0006159319,0.0002017158,0.0010779138,0.0002009672,0.00033147045,0.00020375686,0.0014383927,0.00038946295],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00023382167,0.0011562557,0.096150115,0.003151205,0.00031602423,0.00007018559,0.07083464,0.736986,0.039359994,0.004630023,0.023303559,0.023808198],"study_design_scores_gemma":[0.00621786,0.002119338,0.1421745,0.009821396,0.0008800335,0.0005050123,0.12765254,0.55225945,0.11908593,0.0018327814,0.029690947,0.0077602174],"about_ca_topic_score_codex":0.00022880739,"about_ca_topic_score_gemma":0.0002519509,"teacher_disagreement_score":0.18472652,"about_ca_system_score_codex":0.0013628193,"about_ca_system_score_gemma":0.00011832368,"threshold_uncertainty_score":0.9996292},"labels":[],"label_agreement":null},{"id":"W4416885894","doi":"10.37665/ppymlfx56370","title":"Silver-Polyaniline-Epoxy Electrical Conductive Adhesives - A Percolation Threshold Analysis","year":2012,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Conducting polymers and applications","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Percolation threshold; Adhesive; Epoxy; Electrical conductor; Soldering; Polyaniline; Conductivity; Conductive polymer","score_opus":0.0238802164482994,"score_gpt":0.2779023640994681,"score_spread":0.2540221476511687,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416885894","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97373337,0.005602616,0.0012233871,0.0015741636,0.002085504,0.0010486068,0.00022987298,0.00022272526,0.014279782],"genre_scores_gemma":[0.9931674,0.00021986103,0.0005968205,0.00010013292,0.0012310166,0.0002022658,0.000107168154,0.000069257236,0.0043060975],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9948912,0.00035496804,0.0011149895,0.0012510744,0.00079282303,0.0015949404],"domain_scores_gemma":[0.9966686,0.00043669625,0.0006629158,0.001280379,0.00029186122,0.0006595758],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0010593361,0.0006870318,0.00095307623,0.0006374594,0.0009990805,0.0004474699,0.00059262547,0.00041368086,0.0023557195],"category_scores_gemma":[0.00012886104,0.0006800314,0.0006658127,0.0031146358,0.00049342983,0.0010238449,0.00019722786,0.00048172474,0.0009946009],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00005686498,0.00068620965,0.03484456,0.00002772909,0.00051809225,0.0000019488978,0.0091303885,0.000034018187,0.9511096,0.0023022096,0.00084871124,0.00043965684],"study_design_scores_gemma":[0.0009869534,0.00036455202,0.030077042,0.00005203256,0.0069143344,0.00006272449,0.015395767,0.0056110085,0.93292946,0.00035342778,0.0052295644,0.0020231523],"about_ca_topic_score_codex":0.0003212886,"about_ca_topic_score_gemma":0.000021672684,"teacher_disagreement_score":0.019434039,"about_ca_system_score_codex":0.00033505456,"about_ca_system_score_gemma":0.00024778896,"threshold_uncertainty_score":0.9997832},"labels":[],"label_agreement":null},{"id":"W7108211549","doi":"10.37665/ppmqibm57579","title":"Impedance and Propagation Delay Characterization for FR-4 Printed Circuit Boards","year":2001,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Printed circuit board; Transmission line; Electrical impedance; Characteristic impedance; Propagation delay; Electric power transmission; Transmission (telecommunications); Dielectric; Line (geometry); Impedance matching","score_opus":0.010401777679501725,"score_gpt":0.2166227693439596,"score_spread":0.20622099166445787,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7108211549","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.93638384,0.00066333474,0.055030577,0.0005385752,0.0010452037,0.002080763,0.00009703117,0.00027655493,0.0038841134],"genre_scores_gemma":[0.9954051,0.0018149783,0.00030245807,0.000021338124,0.00041687815,0.00025005243,0.00031665398,0.00008867107,0.0013839036],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9973988,0.00012309388,0.00072763226,0.0007655875,0.00029382555,0.0006910438],"domain_scores_gemma":[0.9986656,0.00016515037,0.00018798358,0.0005619902,0.0002130711,0.00020622197],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004341242,0.0004637014,0.0004591632,0.00017480447,0.00030905346,0.0001948942,0.00018579759,0.00030431635,0.00012703682],"category_scores_gemma":[0.00008288937,0.000506384,0.00012433772,0.0003814293,0.00009904324,0.0004024482,0.000057470334,0.00029314464,0.000025759413],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00021002413,0.00014091584,0.0026326103,0.00068242365,0.000060679908,0.000004663552,0.0026611648,0.00010945613,0.94014466,0.0005261108,0.0000785262,0.052748766],"study_design_scores_gemma":[0.003945235,0.0020781364,0.047379274,0.0011455014,0.00045250406,0.0002378854,0.0005128716,0.66603994,0.23660992,0.0013464524,0.038158037,0.0020942143],"about_ca_topic_score_codex":0.000015842921,"about_ca_topic_score_gemma":0.000010771097,"teacher_disagreement_score":0.7035347,"about_ca_system_score_codex":0.0001753911,"about_ca_system_score_gemma":0.0000744791,"threshold_uncertainty_score":0.99973875},"labels":[],"label_agreement":null}]}