{"meta":{"query_hash":"093c5916b2c1","filters":{"venue":"Specialized and Legacy Electronics Manufacturing Conferences"},"cohort_total":12,"direct_labels_cover":0,"predictions_cover":12,"exported":12,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/093c5916b2c1","api":"https://metacan.xera.ac/api/v1/cohort?venue=Specialized+and+Legacy+Electronics+Manufacturing+Conferences"},"results":[{"id":"W3023605403","doi":"10.37665/lebhxuy70716","title":"Fluid Flow and Heat Transfer from a Cylinder Between Parallel Planes","year":2004,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Hermeneutics and Narrative Identity","field":"Arts and Humanities","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Prandtl number; Boundary layer; Mechanics; Heat transfer; Cylinder; Film temperature; Reynolds number; Boundary layer thickness; Potential flow around a circular cylinder; Blasius boundary layer; Flow (mathematics); Isothermal flow; Isothermal process; Integral equation; Physics; Classical mechanics; Mathematics; Thermodynamics; Geometry; Mathematical analysis; Nusselt number; Open-channel flow; Turbulence","score_opus":0.02770141963332936,"score_gpt":0.24105772064155,"score_spread":0.21335630100822064,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3023605403","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.97827387,0.01057368,0.00025263446,0.0015792791,0.0007113372,0.00055381533,0.0003605487,0.00007755492,0.0076173106],"genre_scores_gemma":[0.9810438,0.0151265375,0.000050626397,0.0001666696,0.002852836,0.0000196779,0.00017364825,0.00005049368,0.0005156986],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","domain_scores_codex":[0.99641454,0.0001826666,0.00080637063,0.001026021,0.00048117508,0.0010892132],"domain_scores_gemma":[0.9989025,0.000266333,0.00007322758,0.00030527543,0.00009322792,0.0003594507],"candidate_categories":["metaepi_narrow","sts","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00029082672,0.00079931354,0.0010976149,0.0002110929,0.0015446558,0.003156373,0.00032902163,0.000320436,0.0028828774],"category_scores_gemma":[0.00001951667,0.0007144333,0.00019088779,0.000046681605,0.00084740215,0.0008370788,0.00010800261,0.00082342816,0.00003713658],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0015567284,0.00073685363,0.0033191598,0.0006687612,0.0038382162,0.00016331715,0.07818695,0.00036524606,0.0011310894,0.834375,0.00042286847,0.07523578],"study_design_scores_gemma":[0.013221878,0.0016593011,0.027112193,0.0007155772,0.0013417925,0.000019686899,0.006712431,0.00029582804,0.030620908,0.3315228,0.5835058,0.0032717823],"about_ca_topic_score_codex":0.006339321,"about_ca_topic_score_gemma":0.047743663,"teacher_disagreement_score":0.583083,"about_ca_system_score_codex":0.00012362128,"about_ca_system_score_gemma":0.00062632584,"threshold_uncertainty_score":0.9997552},"labels":[],"label_agreement":null},{"id":"W7124133016","doi":"10.37665/lefmvmh58851","title":"“Life-Tests of Small Sample Sizes = Trouble”… or “What Can You Learn, If You Test Only a Few?”","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Biosensors and Analytical Detection","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Sample size determination; Sample (material); Quality (philosophy); Test (biology); Statistical hypothesis testing; Test method","score_opus":0.025830533478420438,"score_gpt":0.2340475055127009,"score_spread":0.20821697203428047,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124133016","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9704505,0.016882831,0.0008828608,0.002738152,0.0015360494,0.0009594718,0.00015716786,0.00037282717,0.006020108],"genre_scores_gemma":[0.9498205,0.0461863,0.0003331739,0.000121786514,0.001044263,0.000013819412,0.00002564507,0.00009733907,0.0023571798],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.995457,0.00015374832,0.0012421892,0.001024298,0.00054054195,0.0015822316],"domain_scores_gemma":[0.99724627,0.00096869783,0.00041915145,0.0005510733,0.00015023795,0.00066457194],"candidate_categories":["metaepi_narrow","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00033599007,0.0009709119,0.0014187051,0.0003796995,0.000476497,0.0015952113,0.0005228189,0.0005457515,0.0036402205],"category_scores_gemma":[0.0008217385,0.00085236726,0.00035719256,0.0004022644,0.00040592923,0.00077735446,0.00013031994,0.0012705134,0.000029775787],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.001032382,0.0012125241,0.0015137837,0.0023937281,0.0017865965,0.00009750457,0.006137244,0.001871598,0.006337072,0.02061477,0.000606292,0.9563965],"study_design_scores_gemma":[0.018359372,0.0107648065,0.018995658,0.0037868272,0.003070173,0.00034867428,0.014896696,0.11540177,0.252466,0.020237418,0.53259546,0.00907716],"about_ca_topic_score_codex":0.0019031228,"about_ca_topic_score_gemma":0.0071294876,"teacher_disagreement_score":0.9473193,"about_ca_system_score_codex":0.00021508023,"about_ca_system_score_gemma":0.0005449342,"threshold_uncertainty_score":0.9994412},"labels":[],"label_agreement":null},{"id":"W7124137847","doi":"10.37665/lefknie90989","title":"Effects of Vision Parameters on Photonics Automation System Performance","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Astronomical Observations and Instrumentation","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"ATS Automation Tooling Systems (Canada)","funders":"","keywords":"Automation; Machine vision; Vision; Photonics; Calibration; Key (lock)","score_opus":0.010399270916423753,"score_gpt":0.2076470754695512,"score_spread":0.19724780455312743,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124137847","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9918077,0.0013587942,0.0010163306,0.000069290094,0.00073521875,0.0006535798,0.000007155338,0.0001306358,0.0042212834],"genre_scores_gemma":[0.9944417,0.004355815,0.000924393,0.000016361348,0.00010556141,0.00002998617,0.000018576891,0.00003553856,0.00007209472],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99784476,0.00009275726,0.000742657,0.00043154598,0.0003334285,0.00055486313],"domain_scores_gemma":[0.9990284,0.00021472633,0.0003502364,0.00024222025,0.00004569817,0.00011875027],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00016837216,0.0004350325,0.0005735494,0.00023419077,0.0002586015,0.00030980387,0.0002147643,0.000199654,0.00013156144],"category_scores_gemma":[0.000017520151,0.00042686498,0.00012199785,0.00013846833,0.000117170675,0.00076638773,0.000038926708,0.00041190797,0.000031830015],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0003760247,0.00047692523,0.0005345563,0.0064807953,0.000699493,0.0000058780947,0.0027065845,0.032901324,0.0072732074,0.06082171,0.000190497,0.887533],"study_design_scores_gemma":[0.0023094064,0.0015805596,0.016782403,0.0012135394,0.00019805762,0.0000038416033,0.00031068438,0.6001583,0.37258154,0.0001674707,0.0040647592,0.0006294387],"about_ca_topic_score_codex":0.000069885595,"about_ca_topic_score_gemma":0.000011904446,"teacher_disagreement_score":0.8869036,"about_ca_system_score_codex":0.00035999727,"about_ca_system_score_gemma":0.000060406674,"threshold_uncertainty_score":0.9998183},"labels":[],"label_agreement":null},{"id":"W7124142415","doi":"10.37665/levbmop59194","title":"Static & Dynamic Characteristics of Interposer Sockets","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hewlett-Packard (Canada)","funders":"","keywords":"Interposer; Reliability (semiconductor); Component (thermodynamics); Work (physics); New product development","score_opus":0.017256751775784323,"score_gpt":0.23466141281898045,"score_spread":0.21740466104319614,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124142415","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9793616,0.00855363,0.001452458,0.0006666369,0.0007619232,0.0004297668,0.000068670786,0.00039754092,0.008307793],"genre_scores_gemma":[0.9427011,0.05559305,0.00031307194,0.000031348434,0.00012801838,0.000016419835,0.000051141054,0.00005174635,0.0011141276],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9968568,0.000083700914,0.00097198965,0.00058119063,0.0003773651,0.0011289441],"domain_scores_gemma":[0.99868286,0.00019345741,0.00037794656,0.0005310327,0.00007405151,0.00014065989],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00022416885,0.0006739307,0.0010717923,0.00048337973,0.00018061073,0.00038106955,0.00057193916,0.00038932863,0.0024053045],"category_scores_gemma":[0.00008316973,0.0006637733,0.0001831502,0.00025061003,0.0004639135,0.00044200162,0.00020437092,0.0009132336,0.00009838925],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000119776385,0.00021676195,0.00050268834,0.0016822084,0.0009082279,0.0000335766,0.0058768303,0.00007419848,0.0020082716,0.021865312,0.0012810453,0.9654311],"study_design_scores_gemma":[0.0053801974,0.0015552411,0.022906262,0.0018668895,0.0010307793,0.00011326765,0.0036849573,0.051519856,0.074674,0.06373284,0.76895446,0.0045812605],"about_ca_topic_score_codex":0.000049961167,"about_ca_topic_score_gemma":0.00014131275,"teacher_disagreement_score":0.9608498,"about_ca_system_score_codex":0.00015023633,"about_ca_system_score_gemma":0.00012812715,"threshold_uncertainty_score":0.99958134},"labels":[],"label_agreement":null},{"id":"W7124143977","doi":"10.37665/lepwvba27912","title":"Critical Manufacturing Issues Associated with Moisture Sensitive Devices (MSD)","year":2001,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"ABB (Canada)","funders":"","keywords":"Reliability (semiconductor); Moisture; Surface-mount technology; Electronic equipment; Sensitivity (control systems)","score_opus":0.014751578739195777,"score_gpt":0.2560235867441065,"score_spread":0.24127200800491075,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124143977","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9529649,0.023091061,0.0018439433,0.0034868703,0.0007128694,0.00064141536,0.000032612836,0.0019884375,0.015237872],"genre_scores_gemma":[0.9777499,0.019680873,0.00041732192,0.00010881161,0.0007010621,0.00003965832,0.00005455641,0.0001640723,0.001083747],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99357617,0.00028546408,0.0008953279,0.0014852323,0.00083796633,0.0029198118],"domain_scores_gemma":[0.99757296,0.0008137982,0.00030618682,0.0007451628,0.00018851017,0.00037339795],"candidate_categories":["metaepi_narrow","scholarly_communication","research_integrity"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0006226926,0.0014944446,0.0015874703,0.0005150118,0.0011093923,0.002036172,0.00076462317,0.0008702955,0.00022677385],"category_scores_gemma":[0.00031217534,0.0013571528,0.0002318289,0.00033308382,0.00092272926,0.0012075829,0.00025168745,0.0027138805,0.000027337523],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0042118602,0.0024417627,0.013046579,0.004631959,0.019745354,0.0065968083,0.023928193,0.010660395,0.0067413296,0.33594513,0.004251895,0.56779873],"study_design_scores_gemma":[0.008055885,0.003940794,0.03650773,0.005739639,0.0023717803,0.0011202337,0.0125738485,0.007665338,0.63153696,0.06027943,0.22088332,0.009325054],"about_ca_topic_score_codex":0.00056718633,"about_ca_topic_score_gemma":0.0037978666,"teacher_disagreement_score":0.6247956,"about_ca_system_score_codex":0.00062925584,"about_ca_system_score_gemma":0.0005129693,"threshold_uncertainty_score":0.9997805},"labels":[],"label_agreement":null},{"id":"W7124146230","doi":"10.37665/lekixsm90450","title":"Issues and Solutions to Implementing Lead Free Soldering","year":2000,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Recycling and Waste Management Techniques","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Soldering; Electronics; Dip soldering; Solder paste; Electronic component; Printed circuit board; Electronic equipment","score_opus":0.02016367596025477,"score_gpt":0.2687136801336891,"score_spread":0.24855000417343437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124146230","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9261358,0.005158042,0.0009072212,0.005071435,0.00022540776,0.0010147523,0.000025611285,0.00028414684,0.061177623],"genre_scores_gemma":[0.9654108,0.024910355,0.0017979795,0.0002667692,0.00043164883,0.000037668666,0.000007846303,0.0000414594,0.0070954617],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9957762,0.00013218744,0.0006838398,0.0011585299,0.0005074581,0.001741796],"domain_scores_gemma":[0.99886,0.00008059512,0.0001698129,0.0005720095,0.000013518496,0.00030406486],"candidate_categories":["metaepi_narrow","sts","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00087146054,0.0006011061,0.0005940834,0.0001937389,0.001517098,0.0017081108,0.00068176864,0.00016477608,0.006016535],"category_scores_gemma":[0.000032039658,0.0006056459,0.00010841478,0.00018877083,0.00037006926,0.00082429085,0.0009138462,0.0005051897,0.00010695174],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00007208587,0.0000686168,0.00089988275,0.00008010201,0.00010530868,0.000008878619,0.001488324,0.00008717898,0.001116134,0.0065685827,0.0018177622,0.9876872],"study_design_scores_gemma":[0.0013753187,0.00076235755,0.016241489,0.00034584323,0.00021334169,0.000020442907,0.0016690926,0.0013817931,0.04152418,0.030322019,0.9046143,0.0015297829],"about_ca_topic_score_codex":0.0033542288,"about_ca_topic_score_gemma":0.002701292,"teacher_disagreement_score":0.98615736,"about_ca_system_score_codex":0.00015115044,"about_ca_system_score_gemma":0.000059550523,"threshold_uncertainty_score":0.9997828},"labels":[],"label_agreement":null},{"id":"W7124147859","doi":"10.37665/levswlz25021","title":"Development and Application of a Press-Pin/PTH Reliability Model","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hewlett-Packard (Canada)","funders":"","keywords":"Reliability (semiconductor); Parametric statistics; Finite element method; Soldering; Physics of failure; Parametric model; Development (topology); Interconnection; Cable gland","score_opus":0.022680753185900567,"score_gpt":0.23317021629085474,"score_spread":0.21048946310495417,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124147859","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9347596,0.03215256,0.024456337,0.0003490665,0.00013441447,0.0006333334,0.000011598043,0.0005038177,0.0069992593],"genre_scores_gemma":[0.9710923,0.02331763,0.005139486,0.000010332432,0.00007413539,0.000058387937,0.000007423871,0.000041112515,0.00025921504],"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9971307,0.000051321633,0.0007825256,0.0007707685,0.00033233198,0.0009323476],"domain_scores_gemma":[0.99889344,0.000110269786,0.00025977884,0.00054019765,0.0000615263,0.00013479171],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003753972,0.00056175166,0.0007591805,0.00018425324,0.00031447853,0.00026001452,0.00040051667,0.00035201033,0.000028165272],"category_scores_gemma":[0.000055124507,0.00056651357,0.000080003105,0.00011352435,0.00037821857,0.00035914066,0.00018638634,0.00078710297,0.0000032079026],"study_design_candidate":"design_other","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00010177035,0.00026997423,0.00026492192,0.0017835886,0.00049760623,0.000003741457,0.007767383,0.012008355,0.0033525296,0.110475875,0.00015577904,0.86331844],"study_design_scores_gemma":[0.0017007706,0.00027194014,0.00058325427,0.00029693026,0.00019203832,0.000018483312,0.0005180902,0.5911802,0.29586396,0.035449814,0.07256427,0.0013602567],"about_ca_topic_score_codex":0.00014714368,"about_ca_topic_score_gemma":0.00016990103,"teacher_disagreement_score":0.8619582,"about_ca_system_score_codex":0.00020389968,"about_ca_system_score_gemma":0.00018169257,"threshold_uncertainty_score":0.9996786},"labels":[],"label_agreement":null},{"id":"W7124151573","doi":"10.37665/lejxjmt64128","title":"Have High Cu Dissolution Rates of SAC305/405 Alloys Forced a Change in the Lead Free Alloy used During PTH Processes?","year":2007,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Alloy; Reliability (semiconductor); Dissolution; Soldering; Electronics; Lead (geology)","score_opus":0.029127026404439472,"score_gpt":0.27427367709678707,"score_spread":0.2451466506923476,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124151573","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9819644,0.013712405,0.00064889895,0.00097620155,0.00032048544,0.0011096532,0.000019907044,0.00036936818,0.00087869185],"genre_scores_gemma":[0.9849935,0.0139568355,0.00021859456,0.000027868567,0.00048643237,0.00009786154,0.000030886138,0.000082661085,0.000105322826],"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9948186,0.0001689598,0.0011789862,0.0008981139,0.0007025426,0.0022327905],"domain_scores_gemma":[0.9978256,0.00055682345,0.0004865421,0.00090276985,0.00010952821,0.00011872901],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001432377,0.000914738,0.0011334608,0.0006764499,0.0004718364,0.0005060812,0.0014251794,0.00055673945,0.000047685695],"category_scores_gemma":[0.00030051035,0.00077959284,0.00018271286,0.0005512009,0.0004576376,0.0008556338,0.00025700819,0.0016747612,0.000003182678],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":true,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0059441226,0.002966082,0.07217598,0.02514205,0.0052395687,0.0006820019,0.18214275,0.005374762,0.17375456,0.3510978,0.00043548114,0.17504486],"study_design_scores_gemma":[0.0071894047,0.0011928633,0.11201958,0.001852354,0.00034823266,0.00008211176,0.008698997,0.0026983898,0.83151996,0.029148115,0.002924302,0.0023256987],"about_ca_topic_score_codex":0.0028278923,"about_ca_topic_score_gemma":0.02297123,"teacher_disagreement_score":0.6577654,"about_ca_system_score_codex":0.0004116478,"about_ca_system_score_gemma":0.00042189652,"threshold_uncertainty_score":0.9994655},"labels":[],"label_agreement":null},{"id":"W7124156425","doi":"10.37665/lekeygs14724","title":"A Scale Analysis Approach to Thermal Contact Resistance","year":2004,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Adhesion, Friction, and Surface Interactions","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Thermal contact conductance; Asperity (geotechnical engineering); Surface roughness; Surface finish; Range (aeronautics); Contact resistance; Gaussian surface; Thermal; Superposition principle; Thermal conduction","score_opus":0.011174568213523207,"score_gpt":0.23358116541757015,"score_spread":0.22240659720404696,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124156425","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9098318,0.0043946444,0.029766256,0.0008213831,0.0010197177,0.0007966192,0.00007463365,0.00029073347,0.05300418],"genre_scores_gemma":[0.9932548,0.0015532863,0.0015468469,0.000093841554,0.0005535168,0.00008206551,0.00005043853,0.00006446041,0.00280076],"study_design_codex":"simulation_or_modeling","study_design_gemma":"not_applicable","domain_scores_codex":[0.99616873,0.00017226831,0.0008310256,0.0010173279,0.00059529697,0.0012153538],"domain_scores_gemma":[0.9985747,0.00011803956,0.00022217915,0.00054864585,0.000121727906,0.0004147041],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003862786,0.00072050485,0.0010615591,0.00074351707,0.001263126,0.00097408606,0.00051701395,0.0002254084,0.00031713318],"category_scores_gemma":[0.00002241334,0.00066602795,0.00043443294,0.00086825946,0.000102991384,0.000641824,0.00011746901,0.0010140669,0.000041062623],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0030888864,0.0023286804,0.0032381946,0.00093932904,0.01594818,0.00007084778,0.054665323,0.7459679,0.01277689,0.124067344,0.0016913358,0.035217088],"study_design_scores_gemma":[0.010240883,0.0016871076,0.07237532,0.00064410875,0.008011785,0.00008593795,0.020628333,0.00997271,0.18257058,0.023062432,0.66316503,0.007555776],"about_ca_topic_score_codex":0.0011721002,"about_ca_topic_score_gemma":0.0048321765,"teacher_disagreement_score":0.7359952,"about_ca_system_score_codex":0.00070984266,"about_ca_system_score_gemma":0.000580624,"threshold_uncertainty_score":0.9995791},"labels":[],"label_agreement":null},{"id":"W7124166108","doi":"10.37665/lepzpdv85770","title":"The Optoelectronic Assembly Workcell","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Flexible and Reconfigurable Manufacturing Systems","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Forming Technologies (Canada)","funders":"","keywords":"Workcell; Automation; Process (computing); Control reconfiguration; Changeover; Production (economics); Photonics; Quality (philosophy)","score_opus":0.0162316155737629,"score_gpt":0.21682530551587995,"score_spread":0.20059368994211704,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124166108","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.39484668,0.29723096,0.0005577342,0.0033333306,0.007454824,0.0019616254,0.000020503272,0.00092749833,0.29366684],"genre_scores_gemma":[0.8535582,0.12745261,0.000029744418,0.00007475672,0.0019357408,0.000070257855,0.000010608272,0.00013946422,0.016728632],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99304545,0.00037997664,0.0014028328,0.0012126712,0.0008057378,0.0031533614],"domain_scores_gemma":[0.99713546,0.00081965135,0.0004461345,0.0010355038,0.00009376031,0.00046947628],"candidate_categories":["metaepi_narrow","sts","scholarly_communication","insufficient_payload"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0009175631,0.0013209982,0.0012007519,0.00032387863,0.0023094425,0.004352659,0.0012923018,0.0006121486,0.001554916],"category_scores_gemma":[0.000056845092,0.0010081389,0.00041814192,0.0003149321,0.0005162271,0.00079043343,0.00017047116,0.0022465202,0.0004401904],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00025993132,0.00024686463,0.000072747855,0.0010858958,0.0024573659,0.0000835592,0.0028643399,0.0024973468,0.0014009225,0.09930369,0.013904656,0.87582266],"study_design_scores_gemma":[0.0017430045,0.00048663424,0.00024494898,0.00035396154,0.0002517035,0.000107548454,0.0007820327,0.012130798,0.08137428,0.005708419,0.8951565,0.0016601532],"about_ca_topic_score_codex":0.00032546397,"about_ca_topic_score_gemma":0.00086541526,"teacher_disagreement_score":0.8812519,"about_ca_system_score_codex":0.0004730176,"about_ca_system_score_gemma":0.00030109272,"threshold_uncertainty_score":0.99995416},"labels":[],"label_agreement":null},{"id":"W7124178004","doi":"10.37665/leifnko27953","title":"“Optoelectronic Fingerprint Sensor for Mobile Phones”","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Biometric Identification and Security","field":"Computer Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Vancouver Native Health Society","funders":"","keywords":"Fingerprint (computing); Microprocessor; Fingerprint recognition; Mobile phone; Biometrics; Mobile device; Chip; Cursor (databases)","score_opus":0.030640109716644232,"score_gpt":0.261544606042661,"score_spread":0.23090449632601676,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124178004","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.57606745,0.10745528,0.27607355,0.008653098,0.008416747,0.0069909156,0.0001532665,0.0009872287,0.015202444],"genre_scores_gemma":[0.97116613,0.020157862,0.0019486422,0.00027918926,0.00085252046,0.0002028907,0.000026670681,0.000045318804,0.005320772],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9943005,0.00026146983,0.0010611925,0.001761674,0.00069882296,0.001916376],"domain_scores_gemma":[0.9972907,0.00046522997,0.00060114893,0.0009646059,0.0002749992,0.00040333855],"candidate_categories":["metaepi_narrow","scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0008841059,0.00078553375,0.0009413419,0.0007610285,0.0011850789,0.0034308657,0.0014011596,0.00041745979,0.0017486525],"category_scores_gemma":[0.00012612695,0.0007906317,0.000389423,0.0007753223,0.00037129718,0.0010646046,0.00031612653,0.0008699657,0.00014380064],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00012362153,0.0005808426,0.000040678246,0.00032986343,0.00033952872,0.000010382318,0.004793877,0.000028257531,0.0009009944,0.12482118,0.0025142024,0.86551654],"study_design_scores_gemma":[0.002710639,0.0010648607,0.00032146357,0.000081981125,0.00014598726,0.000052183754,0.00044021712,0.050349727,0.057261914,0.012029906,0.8741292,0.0014119366],"about_ca_topic_score_codex":0.00017782286,"about_ca_topic_score_gemma":0.00018381761,"teacher_disagreement_score":0.871615,"about_ca_system_score_codex":0.00033170107,"about_ca_system_score_gemma":0.00058310275,"threshold_uncertainty_score":0.99945444},"labels":[],"label_agreement":null},{"id":"W7124187219","doi":"10.37665/lervull59598","title":"Reliable Serial Backplane Data Transmission at 10 Gb/s","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Advancements in PLL and VCO Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Forming Technologies (Canada)","funders":"","keywords":"Backplane; Channel (broadcasting); Equalization (audio); Data transmission; Transmission (telecommunications); Intersymbol interference","score_opus":0.037941004335341276,"score_gpt":0.25395274656378153,"score_spread":0.21601174222844025,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124187219","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.55372983,0.18487331,0.009346435,0.0047012283,0.0076276055,0.0032385676,0.000742238,0.0036287128,0.2321121],"genre_scores_gemma":[0.8277827,0.15008387,0.0024112866,0.000049612754,0.0011060889,0.000021267877,0.00034300104,0.00010251803,0.018099632],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.99571484,0.000067707784,0.0008548552,0.0012974499,0.00052296807,0.0015421902],"domain_scores_gemma":[0.9980999,0.00013107643,0.00023646717,0.0012488283,0.000042936066,0.00024077154],"candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0003039118,0.00086522114,0.0009067129,0.00022536571,0.00077577244,0.0006761034,0.0014640371,0.00052921876,0.019131465],"category_scores_gemma":[0.000038071397,0.0008120901,0.0001018207,0.0001836975,0.00034233645,0.0013051485,0.00070834253,0.00096447684,0.00026849197],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0007598486,0.0002974999,0.00009522897,0.0008899632,0.0007716496,0.00009492093,0.0010098763,0.0012464662,0.0033912486,0.010737704,0.034780312,0.9459253],"study_design_scores_gemma":[0.0020206857,0.00037486156,0.00005112456,0.00021613322,0.00017547411,0.000034439272,0.0001946582,0.013114605,0.052924413,0.004348278,0.9255301,0.0010152524],"about_ca_topic_score_codex":0.000093926545,"about_ca_topic_score_gemma":0.00016063063,"teacher_disagreement_score":0.94491005,"about_ca_system_score_codex":0.00026095964,"about_ca_system_score_gemma":0.00010264902,"threshold_uncertainty_score":0.999433},"labels":[],"label_agreement":null}]}