{"meta":{"query_hash":"093c5916b2c1","filters":{"venue":"Specialized and Legacy Electronics Manufacturing Conferences"},"cohort_total":12,"direct_labels_cover":0,"predictions_cover":12,"exported":12,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/093c5916b2c1","api":"https://metacan.xera.ac/api/v1/cohort?venue=Specialized+and+Legacy+Electronics+Manufacturing+Conferences"},"results":[{"id":"W3023605403","doi":"10.37665/lebhxuy70716","title":"Fluid Flow and Heat Transfer from a Cylinder Between Parallel Planes","year":2004,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Hermeneutics and Narrative Identity","field":"Arts and Humanities","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Prandtl number; Boundary layer; Mechanics; Heat transfer; Cylinder; Film temperature; Reynolds number; Boundary layer thickness; Potential flow around a circular cylinder; Blasius boundary layer; Flow (mathematics); Isothermal flow; Isothermal process; Integral equation; Physics; Classical mechanics; Mathematics; Thermodynamics; Geometry; Mathematical analysis; Nusselt number; Open-channel flow; Turbulence","score_opus":0.02770141963332936,"score_gpt":0.24105772064155,"score_spread":0.21335630100822064,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W3023605403","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98113716,0.0002607348,0.017229838,0.000047323756,0.000017257194,0.000016331305,0.00001880995,0.000048751757,0.0012237532],"genre_scores_gemma":[0.99466187,0.00010184504,0.0038001514,0.000010419428,0.000006699329,0.000014811958,0.00003404787,0.000006666952,0.0013635887],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.9998016,0.000018420184,0.000009124689,0.000043458123,0.00007814513,0.00004924892],"domain_scores_gemma":[0.99956447,0.00020343601,0.00009247112,0.000036289,0.000076313525,0.000027050424],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002620846,0.00039243756,0.0005890493,0.00052677875,0.0007048526,0.000680844,0.00035130695,0.00046524475,0.0008204979],"category_scores_gemma":[0.0010595395,0.00021648954,0.00028692,0.00028642284,0.0008917486,0.0007342681,0.0008235552,0.00029340165,0.00016414038],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0006768143,0.00016501056,0.0042720963,0.0001212937,0.000031019976,0.000518605,0.0005321344,0.10772228,0.8627779,0.0043187295,0.00020754618,0.01865661],"study_design_scores_gemma":[0.0000751365,0.0006638432,0.005638953,0.00001613252,0.000035819045,0.00029778466,0.000264863,0.40423724,0.5849361,0.001561969,0.0022135281,0.000058639147],"about_ca_topic_score_codex":0.003934964,"about_ca_topic_score_gemma":0.0009715035,"teacher_disagreement_score":0.003934964,"about_ca_system_score_codex":0.0005563311,"about_ca_system_score_gemma":0.00089929224,"threshold_uncertainty_score":0.007824063},"labels":[],"label_agreement":null},{"id":"W7124133016","doi":"10.37665/lefmvmh58851","title":"“Life-Tests of Small Sample Sizes = Trouble”… or “What Can You Learn, If You Test Only a Few?”","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Biosensors and Analytical Detection","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Sample size determination; Sample (material); Quality (philosophy); Test (biology); Statistical hypothesis testing; Test method","score_opus":0.025830533478420438,"score_gpt":0.2340475055127009,"score_spread":0.20821697203428047,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124133016","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.015455869,0.027418092,0.7538127,0.15812649,0.015395938,0.00044307363,0.00092724815,0.003240438,0.02518016],"genre_scores_gemma":[0.3442201,0.014960393,0.45310685,0.1507328,0.011860132,0.0009310736,0.00079635455,0.0018795418,0.021512823],"study_design_codex":"design_other","study_design_gemma":"theoretical_or_conceptual","domain_scores_codex":[0.92950976,0.049315747,0.0033512805,0.0031376216,0.014220336,0.0004651865],"domain_scores_gemma":[0.5895337,0.3402949,0.01972529,0.02398642,0.02404173,0.0024179707],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.057091262,0.0012304297,0.0019646622,0.0015123967,0.0011719754,0.0031319342,0.001984331,0.0028435993,0.011461124],"category_scores_gemma":[0.32532728,0.0004656869,0.0011465297,0.0014433484,0.009305871,0.0069935853,0.00186336,0.0059409114,0.00376524],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008447419,0.00019813082,0.0131005,0.0037444625,0.00075021567,0.0008509979,0.0015764497,0.0048514744,0.004285639,0.26072735,0.31243566,0.39663446],"study_design_scores_gemma":[0.00014552343,0.00089209946,0.008192887,0.0030649754,0.00025427778,0.0022410979,0.0017639318,0.012471625,0.01075333,0.75956386,0.20024516,0.0004112892],"about_ca_topic_score_codex":0.00093687355,"about_ca_topic_score_gemma":0.0010070058,"teacher_disagreement_score":0.057091262,"about_ca_system_score_codex":0.0015630025,"about_ca_system_score_gemma":0.0015921065,"threshold_uncertainty_score":0.30193108},"labels":[],"label_agreement":null},{"id":"W7124137847","doi":"10.37665/lefknie90989","title":"Effects of Vision Parameters on Photonics Automation System Performance","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Astronomical Observations and Instrumentation","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"ATS Automation Tooling Systems (Canada)","funders":"","keywords":"Automation; Machine vision; Vision; Photonics; Calibration; Key (lock)","score_opus":0.010399270916423753,"score_gpt":0.2076470754695512,"score_spread":0.19724780455312743,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124137847","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.98908854,0.00042493836,0.00826423,0.00008983895,0.000032991644,0.0000410323,0.00008940262,0.0002787138,0.0016903533],"genre_scores_gemma":[0.9985708,0.00003591095,0.0010653255,0.000015409723,0.000005036151,0.000007770836,0.0000430308,0.00002495441,0.00023174877],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99795914,0.000452044,0.00021864382,0.00036914714,0.0006456482,0.0003554315],"domain_scores_gemma":[0.9829898,0.0101657575,0.0018623007,0.0010082021,0.0036076156,0.00036633387],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0017261222,0.00054218085,0.00047065772,0.00078124175,0.0006863729,0.0011674528,0.0005912748,0.0011995552,0.00259565],"category_scores_gemma":[0.013717823,0.00034076412,0.00030818407,0.00058084883,0.0005593352,0.001448961,0.00061908114,0.0005770285,0.0006656398],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0053211576,0.00061475596,0.022469454,0.00060121826,0.00016887757,0.0007949974,0.0005677901,0.086402304,0.81500256,0.0008115344,0.0009210643,0.06632423],"study_design_scores_gemma":[0.00006003883,0.004088976,0.0250556,0.000036862464,0.00010685821,0.00068566034,0.00027449205,0.0467434,0.92139876,0.000413071,0.0010362393,0.000099968616],"about_ca_topic_score_codex":0.0010865332,"about_ca_topic_score_gemma":0.0005208046,"teacher_disagreement_score":0.00259565,"about_ca_system_score_codex":0.0007043281,"about_ca_system_score_gemma":0.00028225518,"threshold_uncertainty_score":0.00912869},"labels":[],"label_agreement":null},{"id":"W7124142415","doi":"10.37665/levbmop59194","title":"Static & Dynamic Characteristics of Interposer Sockets","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hewlett-Packard (Canada)","funders":"","keywords":"Interposer; Reliability (semiconductor); Component (thermodynamics); Work (physics); New product development","score_opus":0.017256751775784323,"score_gpt":0.23466141281898045,"score_spread":0.21740466104319614,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124142415","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9832429,0.00034586454,0.010740046,0.000058423782,0.000042214037,0.000014788449,0.00029328908,0.00048271156,0.0047796764],"genre_scores_gemma":[0.9982418,0.00003074119,0.00023085969,0.000010069688,0.0000053815947,0.0000040071263,0.00012532462,0.000027049638,0.0013248568],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9993494,0.00006689175,0.00002706109,0.000114807066,0.00032537433,0.00011653341],"domain_scores_gemma":[0.9982198,0.00052682706,0.0003039334,0.00021313046,0.0005793591,0.0001569273],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00034213605,0.0003313405,0.00033482272,0.0007322322,0.0002185394,0.0004624301,0.00038251356,0.00039953744,0.0045732],"category_scores_gemma":[0.0014432693,0.00016318749,0.00020915712,0.0007335543,0.0003829649,0.0006454586,0.0003116469,0.00024072778,0.00080650585],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.002885121,0.00031509454,0.033386398,0.0002644591,0.00011823734,0.0020276078,0.0011996668,0.054740686,0.81371063,0.0051226,0.0049315738,0.08129787],"study_design_scores_gemma":[0.00012635715,0.005895747,0.07357482,0.00008376481,0.00017743515,0.0059524095,0.0010660109,0.23568149,0.64909625,0.0028789106,0.025297757,0.00016907616],"about_ca_topic_score_codex":0.00033130485,"about_ca_topic_score_gemma":0.00030682233,"teacher_disagreement_score":0.0045732,"about_ca_system_score_codex":0.00029844264,"about_ca_system_score_gemma":0.0001283989,"threshold_uncertainty_score":0.015298843},"labels":[],"label_agreement":null},{"id":"W7124143977","doi":"10.37665/lepwvba27912","title":"Critical Manufacturing Issues Associated with Moisture Sensitive Devices (MSD)","year":2001,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"ABB (Canada)","funders":"","keywords":"Reliability (semiconductor); Moisture; Surface-mount technology; Electronic equipment; Sensitivity (control systems)","score_opus":0.014751578739195777,"score_gpt":0.2560235867441065,"score_spread":0.24127200800491075,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124143977","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.43524012,0.1907048,0.16994467,0.033462968,0.008782184,0.0010946249,0.00039447026,0.0025578013,0.1578184],"genre_scores_gemma":[0.9385308,0.017775541,0.025431959,0.0030270999,0.0014711447,0.00007759987,0.0000745878,0.00013993938,0.01347129],"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.996637,0.0007012433,0.00024145872,0.00025384175,0.0019321027,0.0002343843],"domain_scores_gemma":[0.9903476,0.0042981557,0.0021511868,0.00061460386,0.002305502,0.0002830513],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0027195532,0.00055699865,0.00038005333,0.0013810536,0.001452979,0.0022318857,0.0008906857,0.0022284354,0.0063569318],"category_scores_gemma":[0.0066841105,0.00043231962,0.00032300878,0.00070236286,0.001319384,0.0020587123,0.0016387594,0.0009933695,0.0017295115],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0012862072,0.00021409837,0.019566104,0.005426767,0.00018157216,0.04665962,0.0044492804,0.012976292,0.2504066,0.06899262,0.05548887,0.534352],"study_design_scores_gemma":[0.00008000107,0.0022054303,0.01535496,0.0015160968,0.00030040252,0.08888055,0.005353781,0.016435646,0.27314484,0.040576242,0.55590224,0.00024976645],"about_ca_topic_score_codex":0.0006738918,"about_ca_topic_score_gemma":0.00090589345,"teacher_disagreement_score":0.0063569318,"about_ca_system_score_codex":0.00090905774,"about_ca_system_score_gemma":0.00050240854,"threshold_uncertainty_score":0.021266043},"labels":[],"label_agreement":null},{"id":"W7124146230","doi":"10.37665/lekixsm90450","title":"Issues and Solutions to Implementing Lead Free Soldering","year":2000,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Recycling and Waste Management Techniques","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Soldering; Electronics; Dip soldering; Solder paste; Electronic component; Printed circuit board; Electronic equipment","score_opus":0.02016367596025477,"score_gpt":0.2687136801336891,"score_spread":0.24855000417343437,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124146230","genre_codex":"commentary","genre_gemma":"other","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"other","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.03302248,0.02284186,0.22053692,0.5506196,0.013015334,0.0015533647,0.0002602045,0.004085702,0.15406463],"genre_scores_gemma":[0.43937734,0.023269862,0.32324257,0.11015621,0.0036731726,0.0013356208,0.00080656965,0.0008536209,0.097285025],"study_design_codex":"design_other","study_design_gemma":"not_applicable","domain_scores_codex":[0.9672208,0.012493999,0.0029049402,0.0024335538,0.011756675,0.0031901712],"domain_scores_gemma":[0.9222012,0.017315635,0.005318323,0.007003623,0.042619288,0.005541965],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.030728323,0.0015820354,0.0006396719,0.0019795087,0.0037432348,0.008326312,0.0068856785,0.010414961,0.023719022],"category_scores_gemma":[0.053072367,0.0008476946,0.0010645797,0.0019253917,0.003382629,0.009415226,0.004644396,0.00853498,0.0059293658],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00015789346,0.0012401884,0.006504568,0.0031666013,0.00009817488,0.0021614197,0.003256738,0.012758723,0.008837881,0.20235449,0.17799369,0.5814696],"study_design_scores_gemma":[0.000099720026,0.00066979893,0.0031807153,0.0033941707,0.00009474206,0.0017944676,0.008335839,0.008456364,0.010955424,0.0822105,0.8806182,0.00019000843],"about_ca_topic_score_codex":0.008701261,"about_ca_topic_score_gemma":0.008186369,"teacher_disagreement_score":0.030728323,"about_ca_system_score_codex":0.0052341446,"about_ca_system_score_gemma":0.02035167,"threshold_uncertainty_score":0.16250885},"labels":[],"label_agreement":null},{"id":"W7124147859","doi":"10.37665/levswlz25021","title":"Development and Application of a Press-Pin/PTH Reliability Model","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Hewlett-Packard (Canada)","funders":"","keywords":"Reliability (semiconductor); Parametric statistics; Finite element method; Soldering; Physics of failure; Parametric model; Development (topology); Interconnection; Cable gland","score_opus":0.022680753185900567,"score_gpt":0.23317021629085474,"score_spread":0.21048946310495417,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124147859","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.03339439,0.00041853683,0.94313395,0.00025030327,0.00005356837,0.00032045713,0.00062200276,0.0013360546,0.020470686],"genre_scores_gemma":[0.85989934,0.0006633208,0.12422906,0.000076150296,0.000042181677,0.0007685094,0.0007793497,0.00022430708,0.013317846],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99954623,0.00007231954,0.000026396823,0.000076982724,0.00023511935,0.000042917716],"domain_scores_gemma":[0.9994374,0.00019135128,0.00008543896,0.000054945856,0.00021144046,0.000019391982],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007473294,0.00081887026,0.0005940237,0.0010600544,0.00046460616,0.0008561119,0.0022258973,0.0012999579,0.0038622261],"category_scores_gemma":[0.0011908098,0.00064160407,0.0009115162,0.00043228953,0.00040418102,0.00084117503,0.0006614701,0.00091268413,0.001004433],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000011478147,0.00002113223,0.00042667767,0.00005129946,0.000007905624,0.00007799217,0.000029722316,0.98598504,0.0028664232,0.0025334444,0.00040684274,0.007582166],"study_design_scores_gemma":[0.0000015216743,0.000012971674,0.00011382173,0.0000064272153,0.000004047282,0.000017969634,0.00000433114,0.9983708,0.0005027487,0.0003107305,0.0006519209,0.0000027475583],"about_ca_topic_score_codex":0.0091983685,"about_ca_topic_score_gemma":0.0052018613,"teacher_disagreement_score":0.0091983685,"about_ca_system_score_codex":0.0010095518,"about_ca_system_score_gemma":0.0014351043,"threshold_uncertainty_score":0.018289626},"labels":[],"label_agreement":null},{"id":"W7124151573","doi":"10.37665/lejxjmt64128","title":"Have High Cu Dissolution Rates of SAC305/405 Alloys Forced a Change in the Lead Free Alloy used During PTH Processes?","year":2007,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Alloy; Reliability (semiconductor); Dissolution; Soldering; Electronics; Lead (geology)","score_opus":0.029127026404439472,"score_gpt":0.27427367709678707,"score_spread":0.2451466506923476,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124151573","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9893317,0.002587477,0.0030052755,0.00035694975,0.0002160159,0.00005059588,0.0003374856,0.0001382871,0.0039760955],"genre_scores_gemma":[0.9959479,0.00044885615,0.0010791617,0.00009954178,0.000025899802,0.000013879967,0.00023547758,0.00006514024,0.0020841449],"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","domain_scores_codex":[0.99818903,0.00016959179,0.00017071243,0.00033515078,0.00091558264,0.00021990531],"domain_scores_gemma":[0.99813616,0.0003210483,0.00046218745,0.00015529992,0.0008423443,0.00008303739],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0019661365,0.0003738373,0.0007216563,0.00082678924,0.0007032734,0.0013554553,0.00074035465,0.0012159182,0.0022739484],"category_scores_gemma":[0.004025276,0.0004251802,0.00047511552,0.00054315245,0.0006489708,0.0011570008,0.00044346676,0.00078692695,0.0012952584],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.004350012,0.0002586602,0.07948467,0.0018655346,0.0002673328,0.0029056848,0.0019487613,0.0037346042,0.82296854,0.0025112624,0.0038158332,0.075889155],"study_design_scores_gemma":[0.000045016775,0.0019663102,0.052100793,0.000117626354,0.00021317709,0.0019216805,0.002010323,0.005064289,0.9157711,0.000910462,0.019792784,0.000086497974],"about_ca_topic_score_codex":0.0050772782,"about_ca_topic_score_gemma":0.0080438,"teacher_disagreement_score":0.0050772782,"about_ca_system_score_codex":0.0010607485,"about_ca_system_score_gemma":0.00062670733,"threshold_uncertainty_score":0.01039803},"labels":[],"label_agreement":null},{"id":"W7124156425","doi":"10.37665/lekeygs14724","title":"A Scale Analysis Approach to Thermal Contact Resistance","year":2004,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Adhesion, Friction, and Surface Interactions","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"University of Waterloo","funders":"","keywords":"Thermal contact conductance; Asperity (geotechnical engineering); Surface roughness; Surface finish; Range (aeronautics); Contact resistance; Gaussian surface; Thermal; Superposition principle; Thermal conduction","score_opus":0.011174568213523207,"score_gpt":0.23358116541757015,"score_spread":0.22240659720404696,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124156425","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.008840219,0.0004176666,0.9834235,0.00011563989,0.000052709183,0.000040731586,0.00004480248,0.00038698196,0.0066777794],"genre_scores_gemma":[0.7862562,0.0011951273,0.1957832,0.0001679576,0.00024422354,0.0004428576,0.00015232307,0.00044022125,0.015317966],"study_design_codex":"simulation_or_modeling","study_design_gemma":"observational","domain_scores_codex":[0.99932396,0.00015557566,0.000021641035,0.00011311237,0.00033840135,0.000047291855],"domain_scores_gemma":[0.9993556,0.00031372168,0.000069185575,0.00011726167,0.00012737972,0.00001680424],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00055865775,0.00080235535,0.0007919996,0.0012133977,0.00038274826,0.0009511903,0.0011021937,0.0006440185,0.0028886222],"category_scores_gemma":[0.0018622898,0.00038323444,0.0011096066,0.0005960183,0.000838813,0.0014689462,0.00055311515,0.00087880617,0.0011397288],"study_design_candidate":"observational","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00003606807,0.000062541345,0.0007836849,0.00014838624,0.00008136426,0.00025602608,0.00019941975,0.69221956,0.030634439,0.2048874,0.0035888539,0.06710229],"study_design_scores_gemma":[0.0000021837582,0.000014834481,0.00014684959,0.000004826157,0.000006003008,0.00003527087,0.000007800228,0.97923285,0.0011147166,0.017207438,0.002218375,0.000008851958],"about_ca_topic_score_codex":0.0019144991,"about_ca_topic_score_gemma":0.0010524888,"teacher_disagreement_score":0.0028886222,"about_ca_system_score_codex":0.0010666532,"about_ca_system_score_gemma":0.0003231372,"threshold_uncertainty_score":0.009663403},"labels":[],"label_agreement":null},{"id":"W7124166108","doi":"10.37665/lepzpdv85770","title":"The Optoelectronic Assembly Workcell","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Flexible and Reconfigurable Manufacturing Systems","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Forming Technologies (Canada)","funders":"","keywords":"Workcell; Automation; Process (computing); Control reconfiguration; Changeover; Production (economics); Photonics; Quality (philosophy)","score_opus":0.0162316155737629,"score_gpt":0.21682530551587995,"score_spread":0.20059368994211704,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124166108","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.15150526,0.0033816546,0.54347605,0.0021291494,0.0033071518,0.0007715979,0.0044582365,0.0089297695,0.2820411],"genre_scores_gemma":[0.44374496,0.002052014,0.36063892,0.0009729652,0.00037692333,0.0007011505,0.003579414,0.00060509966,0.18732855],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.9994466,0.000028674187,0.000026684824,0.00011475889,0.00029838982,0.00008498303],"domain_scores_gemma":[0.9997477,0.000029534109,0.000032018273,0.00008327083,0.000077208315,0.000030201638],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00023223643,0.0005953886,0.00040708657,0.00067638606,0.0015066356,0.0023239562,0.0013184224,0.00068149186,0.015641682],"category_scores_gemma":[0.00030861716,0.00031187307,0.0003267328,0.0006332129,0.0004566068,0.00087717356,0.0012870602,0.0006543086,0.008060394],"study_design_candidate":"not_applicable","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00026675174,0.00018001888,0.0016804386,0.00028751974,0.000021454944,0.0012812358,0.00038905218,0.00854993,0.5725047,0.086001456,0.03484463,0.29399282],"study_design_scores_gemma":[0.000023139288,0.00018615411,0.0017313957,0.00005092545,0.000018483364,0.0007469992,0.00017585598,0.014422163,0.5632721,0.004581129,0.4147328,0.000058845642],"about_ca_topic_score_codex":0.0013081036,"about_ca_topic_score_gemma":0.0014571215,"teacher_disagreement_score":0.015641682,"about_ca_system_score_codex":0.0008053837,"about_ca_system_score_gemma":0.0008219034,"threshold_uncertainty_score":0.05232668},"labels":[],"label_agreement":null},{"id":"W7124178004","doi":"10.37665/leifnko27953","title":"“Optoelectronic Fingerprint Sensor for Mobile Phones”","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Biometric Identification and Security","field":"Computer Science","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Vancouver Native Health Society","funders":"","keywords":"Fingerprint (computing); Microprocessor; Fingerprint recognition; Mobile phone; Biometrics; Mobile device; Chip; Cursor (databases)","score_opus":0.030640109716644232,"score_gpt":0.261544606042661,"score_spread":0.23090449632601676,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124178004","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.33005333,0.03242405,0.5383281,0.00492373,0.0036128624,0.0006001581,0.0017479936,0.005398935,0.08291086],"genre_scores_gemma":[0.76960105,0.0038283323,0.17500654,0.0013949175,0.00023078771,0.00016665141,0.0005057516,0.00006395189,0.049202],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995888,0.00004901636,0.000018244982,0.00006955166,0.00024295668,0.000031439926],"domain_scores_gemma":[0.9997998,0.000025470597,0.000030116922,0.000019658892,0.0001084882,0.000016477205],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00026850615,0.00027733442,0.00027224908,0.00036844824,0.00023502331,0.00053187046,0.00047197047,0.00082787365,0.0041348375],"category_scores_gemma":[0.00049376616,0.00017707374,0.00015032526,0.00028267584,0.00020091335,0.0006373798,0.00028447562,0.0003258885,0.0015996934],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000324192,0.000055291814,0.00127367,0.00032670973,0.00002121221,0.00031585444,0.00006112966,0.0005817045,0.8119818,0.0042597107,0.011745751,0.16905296],"study_design_scores_gemma":[0.00005626054,0.00063729077,0.0038547015,0.000087364686,0.00006188588,0.0026471699,0.000060396338,0.014709571,0.9001254,0.001039747,0.076663606,0.000056613826],"about_ca_topic_score_codex":0.0002612202,"about_ca_topic_score_gemma":0.0005534002,"teacher_disagreement_score":0.0041348375,"about_ca_system_score_codex":0.00031335972,"about_ca_system_score_gemma":0.00025781215,"threshold_uncertainty_score":0.01383239},"labels":[],"label_agreement":null},{"id":"W7124187219","doi":"10.37665/lervull59598","title":"Reliable Serial Backplane Data Transmission at 10 Gb/s","year":2002,"lang":"","type":"article","venue":"Specialized and Legacy Electronics Manufacturing Conferences","topic":"Advancements in PLL and VCO Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Forming Technologies (Canada)","funders":"","keywords":"Backplane; Channel (broadcasting); Equalization (audio); Data transmission; Transmission (telecommunications); Intersymbol interference","score_opus":0.037941004335341276,"score_gpt":0.25395274656378153,"score_spread":0.21601174222844025,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W7124187219","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"metacan-v3-hybrid-931329e0061c","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.81217164,0.00034923048,0.16351186,0.00038143498,0.00018059928,0.00007242662,0.000403587,0.005761526,0.01716777],"genre_scores_gemma":[0.96458447,0.00015086168,0.025862891,0.00007216036,0.00004480744,0.000016662207,0.00038581403,0.00020136686,0.008680829],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.9995771,0.000063513224,0.000024033629,0.00006117737,0.00018505371,0.00008905178],"domain_scores_gemma":[0.99942064,0.00013642607,0.00008300118,0.00010895233,0.00022528303,0.00002565701],"candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00036059055,0.00039947443,0.0002733704,0.00031405987,0.00021164691,0.0005398307,0.00028090295,0.000284042,0.0047364],"category_scores_gemma":[0.00087576924,0.00016517975,0.00009034602,0.00023413649,0.0003095829,0.0005444571,0.00038091408,0.00030944182,0.0018491254],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0008095492,0.00007870998,0.0033850225,0.00017541388,0.00002782134,0.0004414796,0.0003301074,0.008363621,0.89629924,0.0030266675,0.003668427,0.083393954],"study_design_scores_gemma":[0.00009439191,0.00064119685,0.0021793728,0.000031410855,0.000034731136,0.0004914249,0.00014509115,0.046398584,0.93135417,0.0012886479,0.01731742,0.000023605855],"about_ca_topic_score_codex":0.0008062772,"about_ca_topic_score_gemma":0.00090757565,"teacher_disagreement_score":0.0047364,"about_ca_system_score_codex":0.00026932478,"about_ca_system_score_gemma":0.00024771728,"threshold_uncertainty_score":0.015844822},"labels":[],"label_agreement":null}]}