{"meta":{"query_hash":"66acb65a48a2","filters":{"venue":"Wafer-Level Packaging Symposium"},"cohort_total":8,"direct_labels_cover":0,"predictions_cover":8,"exported":8,"export_cap":100000,"truncated":false,"label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"permalink":"https://metacan.xera.ac/q/66acb65a48a2","api":"https://metacan.xera.ac/api/v1/cohort?venue=Wafer-Level+Packaging+Symposium"},"results":[{"id":"W4416882738","doi":"10.37665/wawmqfe92692","title":"Fabrication of 3D Microrobotic Parallel Actuator Architecture","year":2014,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Micro and Nano Robotics","field":"Physics and Astronomy","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":false,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"","funders":"","keywords":"Actuator; Wafer; Fabrication; Microelectromechanical systems; Microactuator; Etching (microfabrication); Process (computing); Silicon; Microelectronics","score_opus":0.014270075062905651,"score_gpt":0.23074487075996425,"score_spread":0.2164747956970586,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416882738","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.09955668,0.00056395656,0.8835115,0.0035538625,0.0023039954,0.0012490703,0.00038924592,0.00011784906,0.008753838],"genre_scores_gemma":[0.9655746,0.000057861696,0.028351154,0.00024696227,0.0014335626,0.000025693054,0.0002395158,0.00014985321,0.0039208047],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.995604,0.00037163,0.0012933682,0.0010421823,0.0005208481,0.0011680089],"domain_scores_gemma":[0.9964404,0.00034387838,0.00095808407,0.0014603351,0.0004208898,0.00037641366],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005588028,0.00088769995,0.0011271619,0.00032345022,0.0003837403,0.0001738762,0.00087553053,0.0003051543,0.00033435712],"category_scores_gemma":[0.000048203667,0.0008937901,0.0004975116,0.0005418662,0.00031983963,0.00021706273,0.00030351095,0.00074072345,0.00041532298],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00028874693,0.0018781108,0.026213974,0.0014447427,0.0012667481,0.0000042195998,0.008317448,0.050297413,0.8111075,0.025023667,0.0066687027,0.06748874],"study_design_scores_gemma":[0.026422387,0.0031096323,0.083775915,0.006345586,0.006832779,0.000097164324,0.0025850742,0.09673478,0.51247287,0.027194312,0.22014903,0.014280477],"about_ca_topic_score_codex":0.0001727647,"about_ca_topic_score_gemma":0.000007252605,"teacher_disagreement_score":0.86601794,"about_ca_system_score_codex":0.00013333838,"about_ca_system_score_gemma":0.0003579315,"threshold_uncertainty_score":0.99935126},"labels":[],"label_agreement":null},{"id":"W4416883457","doi":"10.37665/wamyfvf34391","title":"Development and Screening of Polymer Collar WLP1 Candidates for Lead-Free Solder Sphere Technology to Enhanced Reliability","year":2005,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Alpha Technologies (Canada)","funders":"","keywords":"Soldering; Thermosetting polymer; Polymer; Yield (engineering); Solder paste; Collar; Viscoelasticity; Reliability (semiconductor)","score_opus":0.01471591532382024,"score_gpt":0.24937037171329138,"score_spread":0.23465445638947113,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883457","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.7860941,0.0072924634,0.18616177,0.0154431565,0.00064634084,0.0017089278,0.00019525916,0.0016541355,0.00080382515],"genre_scores_gemma":[0.8380557,0.00030207497,0.15859924,0.0001064219,0.00014186015,0.00028346907,0.000018510653,0.00018858258,0.002304193],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99457943,0.000052532036,0.0014507108,0.0013764212,0.0004916217,0.0020492913],"domain_scores_gemma":[0.9969377,0.00029252455,0.00031129172,0.0018628277,0.00031631198,0.0002793532],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0008333425,0.0010342472,0.0013280921,0.00077813014,0.0005447597,0.00013971115,0.001254165,0.00084468175,0.00002092122],"category_scores_gemma":[0.00046522272,0.0011545869,0.00019079525,0.0011151369,0.00043631613,0.00031768865,0.00087790226,0.0008125212,0.000020722679],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002584573,0.0002762723,0.00294412,0.0020016436,0.00086936686,0.0000074244845,0.0063593583,0.013490784,0.85003877,0.0041538733,0.0035193444,0.11608058],"study_design_scores_gemma":[0.0020724062,0.00024936194,0.00030121772,0.0011179436,0.0001653305,0.00002242938,0.0013588404,0.0090181595,0.9652139,0.00059509656,0.018528536,0.0013567909],"about_ca_topic_score_codex":0.00006619287,"about_ca_topic_score_gemma":0.0003944979,"teacher_disagreement_score":0.11517511,"about_ca_system_score_codex":0.0006517138,"about_ca_system_score_gemma":0.00041256307,"threshold_uncertainty_score":0.99909043},"labels":[],"label_agreement":null},{"id":"W4416883543","doi":"10.37665/waderjq17268","title":"Pressure Indicating Film Characterization of Pressure Distribution in Eutectic Au/Sn Wafer-to-Wafer Bonding","year":2009,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Micralyne","funders":"","keywords":"Eutectic system; Soldering; Wafer; Eutectic bonding; Characterization (materials science); Compression (physics)","score_opus":0.012844276507189991,"score_gpt":0.23142711555760676,"score_spread":0.21858283905041676,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416883543","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9371703,0.002163051,0.046230804,0.0068103294,0.0014937379,0.001982022,0.00092890934,0.0018918418,0.0013289532],"genre_scores_gemma":[0.99618995,0.000296393,0.00086133124,0.00009602847,0.00033221146,0.00010382288,0.00043635356,0.00017737594,0.0015065457],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99310595,0.00027568062,0.0018700502,0.0014453713,0.00089872995,0.0024042123],"domain_scores_gemma":[0.99693054,0.00020590391,0.00068051263,0.0016131954,0.0002364097,0.0003334187],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0012876792,0.0012076442,0.0014559375,0.0011163432,0.0004904459,0.0002806818,0.0012683616,0.0010167961,0.000031876156],"category_scores_gemma":[0.0005277611,0.0014179688,0.00029791432,0.0023938792,0.00018435298,0.00084818096,0.0003626595,0.0019724213,0.000040108705],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0001433429,0.0004863536,0.022995526,0.0020542196,0.0005669494,0.000034692872,0.008857793,0.054663513,0.89085644,0.007127616,0.00038843442,0.01182511],"study_design_scores_gemma":[0.0033343225,0.0010780065,0.33977407,0.007858648,0.0011966077,0.00009963862,0.0007703653,0.22622453,0.40154472,0.0015675551,0.012577132,0.0039743856],"about_ca_topic_score_codex":0.00017040943,"about_ca_topic_score_gemma":0.000029430745,"teacher_disagreement_score":0.48931172,"about_ca_system_score_codex":0.0009485726,"about_ca_system_score_gemma":0.00036452588,"threshold_uncertainty_score":0.998827},"labels":[],"label_agreement":null},{"id":"W4416884140","doi":"10.37665/watgndh53502","title":"Lead Free Bumping Using C4Np Reliability and Cost Information-Extended Abstract-","year":2005,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Bumping; Soldering; Wafer; Chip-scale package; IBM; Solder paste","score_opus":0.024361463565565598,"score_gpt":0.24895944985714813,"score_spread":0.22459798629158254,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884140","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9100354,0.005554904,0.045352783,0.013340638,0.002444054,0.0020036283,0.00043175244,0.005018669,0.015818214],"genre_scores_gemma":[0.9795377,0.0013590746,0.017810216,0.00024488912,0.00043981892,0.000051434297,0.000042001167,0.00015654376,0.00035832298],"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.99434084,0.000083789724,0.001643785,0.00097624905,0.0007468804,0.002208455],"domain_scores_gemma":[0.99637884,0.00032882034,0.00042375564,0.0022591345,0.00025208833,0.00035738377],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0013236494,0.0011701315,0.0010306939,0.0007082569,0.00090437284,0.00079838175,0.0011766922,0.00081978383,0.000049691924],"category_scores_gemma":[0.0005831961,0.0013493751,0.00026338795,0.0007131476,0.00053745596,0.0025388256,0.0007380822,0.0020737306,0.00015244308],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.00022676634,0.0006908268,0.008748511,0.0056923795,0.0014160891,0.000070001486,0.018111872,0.5394843,0.15830204,0.012035207,0.009757086,0.2454649],"study_design_scores_gemma":[0.004870444,0.00021627928,0.016013531,0.0023442635,0.0005145648,0.00038572078,0.0020770922,0.85506415,0.059341222,0.0037240821,0.05111327,0.0043354006],"about_ca_topic_score_codex":0.00034662557,"about_ca_topic_score_gemma":0.00007364054,"teacher_disagreement_score":0.31557983,"about_ca_system_score_codex":0.0015849839,"about_ca_system_score_gemma":0.00033901725,"threshold_uncertainty_score":0.9988956},"labels":[],"label_agreement":null},{"id":"W4416884270","doi":"10.37665/wagvgjd10067","title":"C4NP - Data for Fine Pitch to CSP Flip Chip Solder Bumping","year":2006,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Bumping; Soldering; Flip chip; Chip-scale package; Solder paste; Wafer; Microelectronics; Wafer-level packaging; Integrated circuit packaging","score_opus":0.05048092656623807,"score_gpt":0.272186284909809,"score_spread":0.22170535834357094,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884270","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.28818,0.012132479,0.6007443,0.0518432,0.010621774,0.006241796,0.0045860442,0.012342956,0.013307453],"genre_scores_gemma":[0.9647594,0.00025252407,0.024867581,0.00032182998,0.0021640423,0.00029434598,0.0008830763,0.00058648095,0.0058707395],"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","domain_scores_codex":[0.990995,0.00010666877,0.0016658792,0.0025763721,0.00082310033,0.0038330036],"domain_scores_gemma":[0.99317944,0.0005551125,0.00030323412,0.005316716,0.00023400721,0.0004115127],"candidate_categories":["metaepi_narrow"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.0015445637,0.0016419023,0.0015166566,0.00092865847,0.0010029558,0.000793831,0.0037623898,0.00082999887,0.000048055535],"category_scores_gemma":[0.0004448345,0.001885549,0.00038877636,0.0013113326,0.000234547,0.0007229055,0.0017407209,0.0014596215,0.00026561195],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.0002573604,0.00092223013,0.005529094,0.0037938405,0.0016481597,0.00013183098,0.0022520872,0.14452915,0.4989554,0.027418558,0.27957693,0.034985345],"study_design_scores_gemma":[0.0073449872,0.0010025648,0.007184886,0.0046330667,0.001344999,0.00024847625,0.0007074737,0.42422602,0.21119112,0.010686546,0.32210985,0.009320023],"about_ca_topic_score_codex":0.0005863221,"about_ca_topic_score_gemma":0.0003482638,"teacher_disagreement_score":0.6765794,"about_ca_system_score_codex":0.0008630161,"about_ca_system_score_gemma":0.0003718801,"threshold_uncertainty_score":0.99963284},"labels":[],"label_agreement":null},{"id":"W4416884517","doi":"10.37665/waybdhc11612","title":"High-Speed Removal of Thick Negative Photoresist in Advanced Packaging Applications","year":2013,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Nanofabrication and Lithography Techniques","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Nexen (Canada)","funders":"","keywords":"Photoresist; Resist; Lithography; Polymer; Dissolution; Integrated circuit packaging; Photolithography; Transparency (behavior)","score_opus":0.01107437930505269,"score_gpt":0.23162736895460592,"score_spread":0.22055298964955322,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884517","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.6859535,0.006805128,0.17491233,0.010260374,0.0029621825,0.018895457,0.0012788968,0.0043430566,0.09458907],"genre_scores_gemma":[0.94347155,0.0007872438,0.052979313,0.00019398474,0.00019992539,0.000764884,0.000080464524,0.0002114269,0.0013112248],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99479085,0.00026187566,0.0019096095,0.0011241161,0.0007175086,0.0011960226],"domain_scores_gemma":[0.99633086,0.00045304437,0.0006325952,0.0016182848,0.00059464475,0.00037054578],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006422172,0.00093916047,0.0011899933,0.0013603114,0.0002595914,0.00021388388,0.0009811341,0.0004602956,0.00034241233],"category_scores_gemma":[0.00009299411,0.001066962,0.00040599666,0.0027824338,0.00041056648,0.00093434076,0.0002183548,0.0009876125,0.00017022557],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000094089686,0.0007570001,0.0090889605,0.0015196329,0.0004203893,0.000034013112,0.006016111,0.004429467,0.9167582,0.03027798,0.00182557,0.028778577],"study_design_scores_gemma":[0.0069997706,0.00038562066,0.1743727,0.0037288908,0.00045452578,0.0001365215,0.0042848117,0.027104676,0.72384906,0.019499201,0.03390294,0.00528126],"about_ca_topic_score_codex":0.0016111237,"about_ca_topic_score_gemma":0.00006020202,"teacher_disagreement_score":0.25751802,"about_ca_system_score_codex":0.0004628173,"about_ca_system_score_gemma":0.0001704286,"threshold_uncertainty_score":0.99917805},"labels":[],"label_agreement":null},{"id":"W4416884559","doi":"10.37665/waxnspb15247","title":"Examination of Key Packaging Metrics of a Hermetically Sealed MEMS Accelerometer","year":2013,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Advanced MEMS and NEMS Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"Micralyne","funders":"","keywords":"Microelectromechanical systems; Interconnection; Wafer; Eutectic bonding; Wire bonding; Metrology; Chip; Leakage (economics); Electronic component; Accelerometer","score_opus":0.026516819199073744,"score_gpt":0.2354395145749479,"score_spread":0.20892269537587416,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884559","genre_codex":"empirical","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"empirical","genre_consensus":"empirical","domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.9544459,0.0014976276,0.030274592,0.00090306817,0.0012389086,0.0013928949,0.0001255476,0.0006096155,0.009511843],"genre_scores_gemma":[0.9697526,0.0014948612,0.027238496,0.00004901019,0.00013060964,0.00011419007,0.000025675408,0.0002219486,0.00097262696],"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","domain_scores_codex":[0.99459374,0.000083017854,0.0019971735,0.0009179961,0.001056818,0.001351232],"domain_scores_gemma":[0.995815,0.0007327031,0.00077063794,0.0014830772,0.00091463287,0.00028398223],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0008913383,0.000947612,0.0015619324,0.0017951424,0.0001604801,0.00014252485,0.0010492627,0.00070192845,0.00032598732],"category_scores_gemma":[0.000660682,0.0009745681,0.00042799223,0.0027058898,0.0005250183,0.0011336085,0.00054391526,0.00091986917,0.000094100105],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000016246553,0.00024951337,0.00091822236,0.0015147087,0.0003808232,0.000009538798,0.0014922717,0.0014733177,0.9403173,0.0015515926,0.00022227608,0.051854227],"study_design_scores_gemma":[0.001656869,0.0004203473,0.05076797,0.0010759893,0.0003346328,0.000021120231,0.0014460724,0.009789561,0.9306445,0.0019705677,0.0005758325,0.0012965543],"about_ca_topic_score_codex":0.00013659886,"about_ca_topic_score_gemma":0.000009628719,"teacher_disagreement_score":0.050557673,"about_ca_system_score_codex":0.00035087165,"about_ca_system_score_gemma":0.0001009833,"threshold_uncertainty_score":0.9992705},"labels":[],"label_agreement":null},{"id":"W4416884624","doi":"10.37665/waknyjh62538","title":"Vacuum-Assisted Wet Processing for Advanced 3D Devices","year":2013,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Nanofabrication and Lithography Techniques","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"route_ca_aff":true,"route_ca_fund":false,"route_ca_venue":false,"route_about_ca":false,"ca_institutions":"MiQro Innovation Collaborative Centre; Dalsa Corporation","funders":"","keywords":"Fabrication; Oxide; Trench; Penetration (warfare); Immersion (mathematics); Priming (agriculture); Etching (microfabrication)","score_opus":0.020350578065679678,"score_gpt":0.256711544592633,"score_spread":0.23636096652695332,"validation_status":"score_only:v0-immature-baseline","prediction":{"id":"W4416884624","genre_codex":"methods","genre_gemma":"empirical","domain_codex":null,"domain_gemma":null,"model_version":"codex-gemma-dda1882f352a","genre_candidate":"methods","genre_consensus":null,"domain_candidate":null,"domain_consensus":null,"prediction_status":"machine_predicted_unvalidated","genre_scores_codex":[0.076893,0.013752949,0.82860327,0.012793972,0.004414226,0.012034958,0.00069833425,0.008730853,0.042078435],"genre_scores_gemma":[0.8669572,0.00031408045,0.12715064,0.00059263036,0.00040993726,0.0015860202,0.00012348981,0.0003092572,0.002556746],"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","domain_scores_codex":[0.99522406,0.000112033485,0.0013872284,0.0011736951,0.0005554303,0.0015475568],"domain_scores_gemma":[0.99695504,0.00024089447,0.00048056457,0.001049996,0.0007856986,0.00048782784],"candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005079298,0.0010569186,0.00094428053,0.0007700357,0.00067054876,0.0008749074,0.00088210014,0.00049149594,0.00027354504],"category_scores_gemma":[0.000055241162,0.0011183217,0.00047667723,0.0013534763,0.00016964556,0.0015750255,0.00014340146,0.0005521506,0.00017458176],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_system_candidate":false,"about_ca_system_consensus":false,"study_design_scores_codex":[0.000103104634,0.00063175237,0.005873614,0.0062451703,0.00061541784,0.000008376527,0.0036363497,0.0008092657,0.52825564,0.0027490065,0.016181136,0.43489113],"study_design_scores_gemma":[0.007556029,0.00084450684,0.10054911,0.0059299907,0.0012750083,0.00012707703,0.0022582177,0.19362219,0.18771905,0.002931519,0.48888135,0.008305964],"about_ca_topic_score_codex":0.00008338374,"about_ca_topic_score_gemma":0.000014009651,"teacher_disagreement_score":0.7900642,"about_ca_system_score_codex":0.000299251,"about_ca_system_score_gemma":0.00018730524,"threshold_uncertainty_score":0.9991267},"labels":[],"label_agreement":null}]}