{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":238,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":238,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"eaa7cddf67d7","filters":{"topic":"3D IC and TSV technologies"}},"results":[{"id":"W2135369720","doi":"10.1109/ted.2005.850668","title":"On-chip antennas in silicon ICs and their application","year":2005,"lang":"en","type":"article","venue":"IEEE Transactions on Electron Devices","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":261,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"CMOS; Electronic circuit; Chip; Electronic engineering; Integrated circuit; Wireless; Radio frequency; System in package; Key (lock); System on a chip; Electrical engineering; Computer science; Engineering; Embedded system; Telecommunications","authors":[{"name":"O K.K.","is_ca":false},{"name":"Kyu Hyun Kim","is_ca":false},{"name":"Brian Floyd","is_ca":false},{"name":"Jawahar L. Mehta","is_ca":false},{"name":"Hyung‐Suk Yoon","is_ca":false},{"name":"Chih-Ming Hung","is_ca":false},{"name":"D. Bravo","is_ca":false},{"name":"Timothy O. Dickson","is_ca":true},{"name":"X. Guo","is_ca":false},{"name":"R. Li","is_ca":false},{"name":"N. Trichy","is_ca":false},{"name":"J. Caserta","is_ca":false},{"name":"W. Bomstad","is_ca":false},{"name":"John Branch","is_ca":false},{"name":"Dongjun Yang","is_ca":false},{"name":"Jose L. Bohorquez","is_ca":false},{"name":"Eunyoung Seok","is_ca":false},{"name":"Li Gao","is_ca":false},{"name":"A. Sugavanam","is_ca":false},{"name":"Jau-Jr Lin","is_ca":false},{"name":"Jianjun Chen","is_ca":false},{"name":"J.E. Brewer","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006284640946332033,"gpt":0.2083154310722896,"spread":0.2020307901259576,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001793268,0.0002681321,0.0002144217,0.0003160377,0.0001653514,0.001088378,0.0003903907,0.0009834138,0.003568674],"category_scores_gemma":[0.0005823552,0.0002143726,0.0002393121,0.0003856649,0.0004898275,0.00047613,0.0004024835,0.0004440857,0.001328345],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003558015,"about_ca_system_score_gemma":0.0002295067,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002660342,"about_ca_topic_score_gemma":0.0002838346,"domain_scores_codex":[0.9997839,0.00003982406,0.000006228693,0.00002827819,0.0001114418,0.000030328],"domain_scores_gemma":[0.9997759,0.00008072599,0.00001760253,0.00005197067,0.00006163876,0.00001213045],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001374413,0.00009553161,0.002555571,0.0006855683,0.00006513248,0.0007598267,0.0004307038,0.0333142,0.1630661,0.3692242,0.01730967,0.4123559],"study_design_scores_gemma":[0.00005576442,0.000572307,0.004420304,0.0003550129,0.00009671271,0.002971398,0.0003300065,0.1445827,0.160294,0.1374516,0.5487958,0.00007432885],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.1057736,0.04995529,0.4707756,0.002276022,0.002464296,0.00008919686,0.0001421709,0.00181304,0.3667108],"genre_scores_gemma":[0.827346,0.0222006,0.09136305,0.0008707891,0.0006843587,0.00005183138,0.0001627677,0.0001360816,0.05718449],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.003568674,"threshold_uncertainty_score":0.01193839,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3188178661","doi":"10.1109/isca52012.2021.00014","title":"Pioneering Chiplet Technology and Design for the AMD EPYC™ and Ryzen™ Processor Families : Industrial Product","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":168,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Product (mathematics); Product design; Computer science; Manufacturing engineering; Computer architecture; Engineering; Mathematics","authors":[{"name":"Samuel Naffziger","is_ca":true},{"name":"Noah Beck","is_ca":true},{"name":"Thomas D. Burd","is_ca":true},{"name":"Kevin M. Lepak","is_ca":true},{"name":"Gabriel H. Loh","is_ca":true},{"name":"Mahesh Subramony","is_ca":true},{"name":"Sean White","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03364821018964429,"gpt":0.2111666268012855,"spread":0.1775184166116412,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001466968,0.0006320667,0.0002680008,0.0007778776,0.00074805,0.002085596,0.001031688,0.00157703,0.006930613],"category_scores_gemma":[0.003415829,0.0004999602,0.0004807504,0.0007961516,0.000652782,0.002182662,0.00109822,0.002141942,0.00430104],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001218715,"about_ca_system_score_gemma":0.001711263,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009639871,"about_ca_topic_score_gemma":0.001444625,"domain_scores_codex":[0.9987142,0.0001083789,0.0000532934,0.0001679739,0.0008347676,0.0001213234],"domain_scores_gemma":[0.9980171,0.0002250437,0.0001539356,0.0002144549,0.00124368,0.0001458643],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002526658,0.0001832126,0.003059046,0.0004743343,0.00003617212,0.0007159831,0.001534621,0.006416951,0.142601,0.08924034,0.07119129,0.6842943],"study_design_scores_gemma":[0.00006188816,0.001108833,0.001940044,0.0001815497,0.00005050129,0.001736563,0.0002001878,0.01570489,0.09935329,0.009086276,0.8705004,0.00007559677],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"other","genre_scores_codex":[0.08838135,0.007000085,0.7612767,0.005561996,0.002440198,0.0007832037,0.000539019,0.004925052,0.1290925],"genre_scores_gemma":[0.2386225,0.005421523,0.6425307,0.001823969,0.0004794386,0.0004244363,0.0009204172,0.001157709,0.1086193],"genre_candidate":"other","genre_consensus":null,"teacher_disagreement_score":0.006930613,"threshold_uncertainty_score":0.02318525,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2159563595","doi":"10.1149/2.007312jss","title":"Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding","year":2013,"lang":"en","type":"article","venue":"ECS Journal of Solid State Science and Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":156,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"","keywords":"Materials science; X-ray photoelectron spectroscopy; Wafer; Silicon; Reactive-ion etching; Silicon dioxide; Oxygen; Anodic bonding; Chemical engineering; Relative humidity; Humidity; Etching (microfabrication); Analytical Chemistry (journal); Nanotechnology; Composite material; Layer (electronics); Chemistry; Optoelectronics; Organic chemistry","authors":[{"name":"Arif Ul Alam","is_ca":true},{"name":"Matiar M. R. Howlader","is_ca":true},{"name":"M. Jamal Deen","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01023634672878418,"gpt":0.2383324208805291,"spread":0.2280960741517449,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008585784,0.000218052,0.0001106578,0.0001412585,0.0001296275,0.0001410442,0.0001690896,0.0002117293,0.001332781],"category_scores_gemma":[0.0001112544,0.0001416504,0.0001530957,0.0001487338,0.0001467497,0.0001522207,0.0001534697,0.0001785954,0.0002094884],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000143377,"about_ca_system_score_gemma":0.0001077429,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008224541,"about_ca_topic_score_gemma":0.001878864,"domain_scores_codex":[0.9999145,0.000006197047,0.000003302766,0.00001919156,0.00004362915,0.00001311034],"domain_scores_gemma":[0.9999636,0.000008250595,0.000007876475,0.000005069494,0.00001222638,0.000002940331],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000013681,0.000002911558,0.0003466217,0.0000242726,0.000003465219,0.00002085341,0.00001212861,0.00005188248,0.9977044,0.00003535852,0.00002431855,0.001760085],"study_design_scores_gemma":[0.000002076098,0.0001126698,0.0097566,0.000002144584,0.00001196544,0.0001202389,0.00003899158,0.000672204,0.9878018,0.00004315394,0.001433129,0.000004823082],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9906974,0.001151104,0.005688765,0.00002965141,0.00002837591,0.00003242767,0.0002694464,0.00004198037,0.002060983],"genre_scores_gemma":[0.9898146,0.001002594,0.006354987,0.0000239142,0.00000980638,0.00003772717,0.0004581225,0.00002182858,0.002276342],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001332781,"threshold_uncertainty_score":0.004458606,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2805887040","doi":"10.3390/mi9060287","title":"3D Integrated Circuit Cooling with Microfluidics","year":2018,"lang":"en","type":"review","venue":"Micromachines","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":77,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"York University","funders":"","keywords":"Microfluidics; Thermal management of electronic devices and systems; Three-dimensional integrated circuit; Integrated circuit; Thermal; Electronics; Chip; Engineering; Mechanical engineering; Systems engineering; Nanotechnology; Materials science; Electrical engineering","authors":[{"name":"Shaoxi Wang","is_ca":true},{"name":"Yue Yin","is_ca":false},{"name":"Chenxia Hu","is_ca":false},{"name":"Pouya Rezai","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02648025340362146,"gpt":0.2496548920570798,"spread":0.2231746386534583,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002659537,0.0006264893,0.0005208558,0.001426289,0.000234764,0.00079155,0.0005284295,0.0006386745,0.002932723],"category_scores_gemma":[0.0004050089,0.0002917069,0.0005198506,0.001202746,0.0002464466,0.0009861196,0.0004954766,0.0005940127,0.00115222],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004361246,"about_ca_system_score_gemma":0.0007238794,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007145321,"about_ca_topic_score_gemma":0.0008059542,"domain_scores_codex":[0.9998235,0.00002380112,0.0000139284,0.00004017576,0.00008127071,0.00001734426],"domain_scores_gemma":[0.9998797,0.00005251757,0.00001921883,0.000007141834,0.00003543216,0.000006067361],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00004670803,0.0000574517,0.0002784686,0.0155697,0.00009110734,0.000251221,0.0001162739,0.001882671,0.02930531,0.01706333,0.0155215,0.9198162],"study_design_scores_gemma":[0.000006681474,0.00007983079,0.0005534794,0.001115861,0.0000739692,0.0009542379,0.00003417916,0.0009305543,0.0167745,0.00249903,0.9769534,0.00002429247],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"review","genre_gemma":"review","genre_scores_codex":[0.001627136,0.9862394,0.004050269,0.0002651432,0.0004083309,0.00001997157,0.00005033375,0.00005324909,0.007286233],"genre_scores_gemma":[0.01636635,0.9739178,0.003095152,0.0002956829,0.0004016558,0.00004500938,0.000100031,0.00001223078,0.005766049],"genre_candidate":"review","genre_consensus":"review","teacher_disagreement_score":0.002932723,"threshold_uncertainty_score":0.009810925,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2555318774","doi":"10.1145/1289816.1289846","title":"Three-dimensional multiprocessor system-on-chip thermal optimization","year":2007,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":65,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Queen's University","funders":"Northwestern University","keywords":"MPSoC; Multiprocessing; Three-dimensional integrated circuit; Computer science; Frequency scaling; Scheduling (production processes); System on a chip; Chip; Embedded system; Power density; Parallel computing; Voltage; Power (physics); Engineering; Electrical engineering","authors":[{"name":"Chong Sun","is_ca":true},{"name":"Li Shang","is_ca":true},{"name":"Robert P. Dick","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01008166410651781,"gpt":0.2012799681001117,"spread":0.1911983039935939,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002366953,0.0004346763,0.0003864442,0.0002514065,0.0003452624,0.0005292398,0.0004393755,0.0003249178,0.001381411],"category_scores_gemma":[0.0004882262,0.0002184998,0.000493378,0.0002736463,0.0002523474,0.0004364981,0.0004094767,0.0003383055,0.000207198],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005994638,"about_ca_system_score_gemma":0.000949497,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002327008,"about_ca_topic_score_gemma":0.004097171,"domain_scores_codex":[0.9998079,0.00005017879,0.000008114062,0.00002766908,0.00006903862,0.00003712283],"domain_scores_gemma":[0.9998484,0.00004324678,0.00002223266,0.00002217675,0.00005103472,0.00001290988],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00003094534,0.00002500622,0.0004311048,0.00003209326,0.00002021047,0.00002460654,0.00001741731,0.9668423,0.009416474,0.002140317,0.0007730216,0.02024656],"study_design_scores_gemma":[0.000005569992,0.00002131808,0.0002072255,0.000001309372,0.000005288218,0.00001069691,0.000006780028,0.99655,0.001508995,0.0009910987,0.00068794,0.000003771377],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.1615998,0.0007631393,0.8205485,0.0004102722,0.0001089778,0.00008268278,0.0001657272,0.001431151,0.01488991],"genre_scores_gemma":[0.8613479,0.0003221824,0.1348152,0.0001223229,0.00002416593,0.0001812782,0.0001557416,0.0001725997,0.002858683],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.002327008,"threshold_uncertainty_score":0.004626989,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2158969233","doi":"10.1109/stherm.1992.172851","title":"Analysis of thermal vias in high density interconnect technology","year":2003,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":54,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Interconnection; Materials science; Thermal; Optoelectronics; Computer science; Electronic engineering; Electrical engineering; Telecommunications; Engineering; Physics","authors":[{"name":"S. Lee","is_ca":true},{"name":"T.F. Lemczyk","is_ca":true},{"name":"M. M. Yovanovich","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.005842922069534908,"gpt":0.1899562530859673,"spread":0.1841133310164324,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001635307,0.0004391335,0.0001890055,0.0004322244,0.0002272684,0.0006236424,0.0002902757,0.0003433663,0.001053314],"category_scores_gemma":[0.0006295624,0.0002427484,0.0003206129,0.0002906803,0.0004093602,0.0005708084,0.0001986509,0.000172616,0.0003324829],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005637723,"about_ca_system_score_gemma":0.0003588148,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001171397,"about_ca_topic_score_gemma":0.001129298,"domain_scores_codex":[0.9998673,0.00002890047,0.000003760157,0.00001908618,0.00006343045,0.00001743863],"domain_scores_gemma":[0.9998691,0.00004440532,0.00002571785,0.00001986944,0.00003494626,0.000005894269],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003883157,0.0000319701,0.001526099,0.000131353,0.00003274165,0.000260974,0.0001157827,0.8289024,0.09821235,0.05502731,0.0006522544,0.01506798],"study_design_scores_gemma":[0.000004159306,0.00006988113,0.001121197,0.00001072567,0.00001847582,0.0001660917,0.00002577595,0.9729953,0.01441938,0.007493826,0.003663977,0.00001125297],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.4141784,0.002043992,0.5598971,0.0001385953,0.00006075938,0.00005593276,0.0001518878,0.0009202078,0.02255309],"genre_scores_gemma":[0.970732,0.0007057232,0.02270923,0.00001384638,0.00001632033,0.00003497505,0.00006303121,0.00006983882,0.005655076],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.001171397,"threshold_uncertainty_score":0.004090488,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3191072511","doi":"10.1109/ectc32696.2021.00034","title":"Direct Bonded Heterogeneous Integration (DBHi) Si Bridge","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":44,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interconnection; System in package; Integrated circuit packaging; Thermocompression bonding; Reliability (semiconductor); Chip; Three-dimensional integrated circuit; Computer science; Wire bonding; Materials science; Package on package; Electronic packaging; Joins; Quad Flat No-leads package; Mechanical engineering; Electronic engineering; Engineering; Adhesive; Layer (electronics); Power (physics); Composite material","authors":[{"name":"Kamal Sikka","is_ca":false},{"name":"Ravi Bonam","is_ca":false},{"name":"Yang Liu","is_ca":false},{"name":"Paul Andry","is_ca":false},{"name":"Dishit P. Parekh","is_ca":false},{"name":"Aakrati Jain","is_ca":false},{"name":"R. Divakaruni","is_ca":false},{"name":"Maryse Cournoyer","is_ca":true},{"name":"Pascale Gagnon","is_ca":true},{"name":"Catherine Dufort","is_ca":true},{"name":"Isabel Sousa","is_ca":true},{"name":"Hongqing Zhang","is_ca":false},{"name":"Ed Cropp","is_ca":false},{"name":"Thomas Wassick","is_ca":false},{"name":"Hiroyuki Mori","is_ca":false},{"name":"Sayuri Kohara","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01437083391184331,"gpt":0.2113010488287646,"spread":0.1969302149169213,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001480533,0.0003051603,0.000212794,0.0001483318,0.0001385505,0.000326363,0.000909975,0.0004203003,0.002996654],"category_scores_gemma":[0.0001745939,0.0002158255,0.0002526252,0.0001656153,0.0001910959,0.0005432788,0.000647967,0.0003609916,0.0008736569],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002330521,"about_ca_system_score_gemma":0.0001582568,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003785637,"about_ca_topic_score_gemma":0.0006064894,"domain_scores_codex":[0.9998477,0.00001150925,0.000005812981,0.00004292407,0.00006302472,0.00002903064],"domain_scores_gemma":[0.9999179,0.000008823682,0.00001545536,0.00002751993,0.00002182242,0.000008429001],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000160091,0.0001400444,0.002557689,0.0003541295,0.00008109295,0.0006378768,0.0001690791,0.01780606,0.8646209,0.01244587,0.004353283,0.09667392],"study_design_scores_gemma":[0.00006371192,0.002504872,0.007537164,0.0000478052,0.0001289599,0.001754417,0.0001134409,0.1149857,0.8035989,0.002348166,0.0668544,0.00006242887],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6660956,0.003050219,0.2768192,0.0002126142,0.0003951956,0.0002629466,0.0007972586,0.002531451,0.04983543],"genre_scores_gemma":[0.9100332,0.0005615157,0.07784171,0.0001652504,0.00004330482,0.0001268273,0.0006174395,0.00008656525,0.01052423],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002996654,"threshold_uncertainty_score":0.01002479,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2073553220","doi":"10.1016/j.talanta.2010.05.001","title":"Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C","year":2010,"lang":"en","type":"article","venue":"Talanta","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":42,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; McMaster University","keywords":"Anodic bonding; Void (composites); Silicon; Plasma activation; Chemistry; Anode; Amorphous silicon; Amorphous solid; Reactive-ion etching; Plasma; Chemical engineering; Etching (microfabrication); Composite material; Layer (electronics); Crystalline silicon; Materials science; Crystallography; Physical chemistry; Electrode; Organic chemistry","authors":[{"name":"M.M.R. Howlader","is_ca":true},{"name":"Md Golam Kibria","is_ca":true},{"name":"Fuzhong Zhang","is_ca":true},{"name":"M.J. Kim","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01051066360440148,"gpt":0.232595561959583,"spread":0.2220848983551815,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001521211,0.0003147622,0.0003019736,0.0002189695,0.0005103741,0.0003539378,0.0004821454,0.0004137369,0.003309699],"category_scores_gemma":[0.0001624694,0.0003130916,0.0002588046,0.0001937245,0.0002329277,0.0005113963,0.0005595019,0.0004495436,0.0006739438],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003611711,"about_ca_system_score_gemma":0.000289181,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009225009,"about_ca_topic_score_gemma":0.002548488,"domain_scores_codex":[0.9998592,0.000008704709,0.000004291341,0.00003484435,0.00005040348,0.00004245864],"domain_scores_gemma":[0.9999418,0.00001187591,0.000008191864,0.000009941011,0.00001853216,0.00000966094],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00008885736,0.00001579408,0.0002019947,0.00007739249,0.00001598959,0.00006229441,0.0001271532,0.0002615866,0.9958437,0.0004505931,0.0005372637,0.002317287],"study_design_scores_gemma":[0.00001502416,0.0001266714,0.001782703,0.000006009023,0.00001534307,0.00007534291,0.00006775519,0.002364522,0.993374,0.0001260366,0.002034998,0.00001155236],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9884135,0.0009066208,0.005475305,0.00013258,0.0001026602,0.00002359665,0.0001422083,0.0002574397,0.004546012],"genre_scores_gemma":[0.9943448,0.0001777381,0.002244027,0.00002889172,0.00001685805,0.00002604972,0.00009671659,0.00005061566,0.003014327],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003309699,"threshold_uncertainty_score":0.01107204,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2513352037","doi":"10.1109/jssc.2016.2596773","title":"A 0.3 pJ/bit 20 Gb/s/Wire Parallel Interface for Die-to-Die Communication","year":2016,"lang":"en","type":"article","venue":"IEEE Journal of Solid-State Circuits","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":41,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Die (integrated circuit); Transceiver; CMOS; Interposer; Transmitter; Electrical engineering; Electronic circuit; Silicon on insulator; Computer science; Materials science; Optoelectronics; Electronic engineering; Computer hardware; Channel (broadcasting); Silicon; Engineering; Nanotechnology; Layer (electronics)","authors":[{"name":"Behzad Dehlaghi","is_ca":true},{"name":"Anthony Chan Carusone","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02684802874997689,"gpt":0.273959809874317,"spread":0.2471117811243401,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002231062,0.0004447588,0.0003561908,0.0004518558,0.0003550595,0.0007534928,0.001550496,0.0006275857,0.009442031],"category_scores_gemma":[0.0004893895,0.0002577524,0.0001888185,0.0005444963,0.0001532327,0.0009192847,0.0004914838,0.000619262,0.003006373],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003725407,"about_ca_system_score_gemma":0.0004237425,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003032133,"about_ca_topic_score_gemma":0.0006276073,"domain_scores_codex":[0.9997608,0.00002556468,0.00001309071,0.00005338661,0.0001134824,0.00003373113],"domain_scores_gemma":[0.9996843,0.00004785808,0.00005342541,0.00006289423,0.0001184324,0.00003311193],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003797366,0.0003027726,0.002161914,0.000407206,0.00007607178,0.0007122914,0.0001414509,0.002342237,0.8234364,0.006845314,0.01551509,0.1476797],"study_design_scores_gemma":[0.0001825151,0.003411936,0.006298208,0.00007034196,0.0001755475,0.004700085,0.0001754784,0.05149601,0.8129574,0.001858041,0.1185629,0.0001117167],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.4028435,0.001416381,0.5367374,0.0009206124,0.0006243025,0.0005699789,0.001309963,0.01537684,0.04020111],"genre_scores_gemma":[0.6790625,0.0005626574,0.2910716,0.000449928,0.0001806436,0.0003096246,0.001375927,0.0005003875,0.02648675],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.009442031,"threshold_uncertainty_score":0.03158677,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2042079275","doi":"10.1063/1.4807905","title":"Fast atom beam-activated n-Si/n-GaAs wafer bonding with high interfacial transparency and electrical conductivity","year":2013,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":39,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Materials science; Argon; Annealing (glass); Wafer; Atom (system on chip); Wafer bonding; Electrical resistivity and conductivity; Helium; Atomic physics; Optoelectronics; Composite material","authors":[{"name":"Stephanie Essig","is_ca":false},{"name":"O. Moutanabbir","is_ca":true},{"name":"A. Wekkeli","is_ca":false},{"name":"H. Nähme","is_ca":false},{"name":"Eduard Oliva","is_ca":false},{"name":"Andreas W. Bett","is_ca":false},{"name":"Frank Dimroth","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009779548144638854,"gpt":0.1916496859880321,"spread":0.1818701378433932,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001368661,0.000502236,0.0002145862,0.0001790077,0.0002098761,0.000316817,0.0002934657,0.0002566306,0.001602407],"category_scores_gemma":[0.0001766188,0.0002691261,0.0001702139,0.0001954755,0.000213579,0.0002351988,0.00039507,0.0002541794,0.0003469799],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001995917,"about_ca_system_score_gemma":0.0002336027,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003810699,"about_ca_topic_score_gemma":0.001422064,"domain_scores_codex":[0.9998738,0.0000118968,0.00000593749,0.00002723552,0.00005637031,0.00002476133],"domain_scores_gemma":[0.9998916,0.00002480971,0.0000290861,0.00002280742,0.00002168433,0.00001000809],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001569164,0.000006181917,0.0001623713,0.00003520065,0.000005345888,0.0000309875,0.0000176986,0.0001190594,0.9980937,0.0001438024,0.00004082167,0.001329121],"study_design_scores_gemma":[0.000004449844,0.00006746528,0.002082575,0.000003340167,0.000005431776,0.00009325565,0.00002218877,0.0008481676,0.9958116,0.00007492903,0.0009817729,0.000004887911],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.990892,0.0004261397,0.005058169,0.00002277849,0.00001717587,0.00002553587,0.0001510088,0.00006758816,0.003339706],"genre_scores_gemma":[0.9902479,0.00032998,0.007514791,0.000009049832,0.000004480914,0.00002669428,0.0001179406,0.00003798526,0.001711126],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001602407,"threshold_uncertainty_score":0.005360603,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2303696326","doi":"10.1109/tcad.2015.2474411","title":"TSV Extracted Equivalent Circuit Model and an On-Chip Test Solution","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":37,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Windsor","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Parametric statistics; Through-silicon via; Equivalent circuit; Electronic engineering; Chip; Void (composites); Parametric model; Electronic circuit; Realization (probability); Integrated circuit; Testability; Computer science; Circuit extraction; Engineering; Materials science; Reliability engineering; Electrical engineering","authors":[{"name":"Zheng Gong","is_ca":true},{"name":"Rashid Rashidzadeh","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.08736034808519404,"gpt":0.2482283514382359,"spread":0.1608680033530418,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001144559,0.0007633952,0.0004084763,0.0004469992,0.000280661,0.0006914628,0.001131959,0.001200283,0.008868018],"category_scores_gemma":[0.0006160411,0.0002625831,0.000805604,0.0003508807,0.0002928729,0.0008717731,0.0002525334,0.0004933425,0.001341675],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009501387,"about_ca_system_score_gemma":0.001105098,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.005971589,"about_ca_topic_score_gemma":0.005960846,"domain_scores_codex":[0.9997879,0.00003174179,0.000007156641,0.00002862539,0.0001232274,0.00002140263],"domain_scores_gemma":[0.9998092,0.00005459027,0.0000222053,0.00004683482,0.00006308116,0.000004169483],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005500454,0.00006142987,0.0004412207,0.0001236081,0.0000398483,0.000215841,0.00006504599,0.9258719,0.03213894,0.01224049,0.002559789,0.02618682],"study_design_scores_gemma":[0.00001051041,0.00006950941,0.0002012724,0.00000701062,0.0000150859,0.00006087428,0.00001456659,0.986912,0.007380126,0.001797762,0.003523703,0.000007574348],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.08556463,0.0001755029,0.8574212,0.0002850514,0.0001102811,0.000360922,0.002852453,0.003951333,0.04927864],"genre_scores_gemma":[0.8731368,0.0002309491,0.1014726,0.0001664721,0.00002938946,0.0005122335,0.001801276,0.0003334073,0.02231693],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.008868018,"threshold_uncertainty_score":0.02966642,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2600443473","doi":"10.1063/1.4979173","title":"High performance 3D printed electronics using electroless plated copper","year":2017,"lang":"en","type":"article","venue":"AIP Advances","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":37,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Simon Fraser University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Inductor; Toroid; Materials science; Printed circuit board; Electromagnetic coil; Inductance; Copper; Plating (geology); 3d printed; Electronics; 3D printing; Core (optical fiber); Copper plating; Optoelectronics; Composite material; Electrical engineering; Layer (electronics); Metallurgy; Engineering; Biomedical engineering; Voltage; Plasma; Physics; Electroplating","authors":[{"name":"Jin Jian","is_ca":true},{"name":"Taeil Kim","is_ca":true},{"name":"Jae Sung Park","is_ca":true},{"name":"Jiacheng Wang","is_ca":true},{"name":"Woo Soo Kim","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0092826199899686,"gpt":0.2332239794015869,"spread":0.2239413594116183,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002061373,0.0003599648,0.0002003685,0.000366457,0.0001277677,0.000667401,0.0006891727,0.0004996089,0.001161155],"category_scores_gemma":[0.000514556,0.0002650996,0.0002921216,0.0002233851,0.0002819375,0.0004455126,0.0003003055,0.0002642905,0.0008470487],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004332724,"about_ca_system_score_gemma":0.000218469,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003531357,"about_ca_topic_score_gemma":0.0005018731,"domain_scores_codex":[0.9995276,0.00003042212,0.00001653273,0.00006886554,0.00032369,0.00003290812],"domain_scores_gemma":[0.9996312,0.00007231795,0.00006426605,0.0001230942,0.00009406942,0.00001519352],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005953769,0.00002678598,0.0006552917,0.000214781,0.00002167204,0.0005936072,0.0001569208,0.01042496,0.9383216,0.001879673,0.001203475,0.04644177],"study_design_scores_gemma":[0.00001703806,0.0002751002,0.001908034,0.00001451076,0.00001667076,0.0007590473,0.00002552537,0.02388414,0.9560444,0.000318799,0.0167105,0.00002634653],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5981008,0.00170458,0.3539062,0.0003376719,0.0004663851,0.0001625443,0.0004807948,0.007027952,0.03781315],"genre_scores_gemma":[0.8791766,0.0002890805,0.1135289,0.00006327326,0.00002957602,0.0000447631,0.0001620251,0.000126975,0.006578805],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001161155,"threshold_uncertainty_score":0.003884435,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2159359319","doi":"10.1109/mwsym.2006.249414","title":"Monolithic RF MEMS Switch Matrix Integration","year":2006,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":36,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Microelectromechanical systems; Materials science; Interconnection; Crossbar switch; Fabrication; Radio frequency; Clos network; Optoelectronics; Matrix (chemical analysis); Electronic engineering; Electrical engineering; Computer science; Engineering; Telecommunications","authors":[{"name":"Mojgan Daneshmand","is_ca":true},{"name":"Raafat R. Mansour","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006137921016087577,"gpt":0.2041444243341018,"spread":0.1980065033180142,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001567287,0.0003589012,0.0002165205,0.0002782564,0.000263071,0.0005948432,0.000588742,0.0004197241,0.002666258],"category_scores_gemma":[0.0002119733,0.0001939513,0.0003212478,0.0002682088,0.0001412972,0.0005479314,0.0004205307,0.000431855,0.0008402634],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000294159,"about_ca_system_score_gemma":0.0002124413,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005204749,"about_ca_topic_score_gemma":0.0009859063,"domain_scores_codex":[0.9997554,0.00001832014,0.000006638033,0.00004768399,0.0001362855,0.00003548845],"domain_scores_gemma":[0.999864,0.00002297286,0.00001944757,0.00002352837,0.00005262403,0.00001742687],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00006529898,0.00004765258,0.0004551951,0.00007204238,0.00003005846,0.000124949,0.00003756302,0.00120999,0.9718051,0.002251861,0.0006682842,0.02323206],"study_design_scores_gemma":[0.00003988039,0.0007717849,0.003758251,0.00001575922,0.00007742638,0.001202075,0.0000590392,0.03123037,0.9259305,0.00127017,0.03561791,0.00002691252],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6217031,0.003931973,0.3159955,0.0004357595,0.0007237881,0.0002548369,0.0004834763,0.003764222,0.05270728],"genre_scores_gemma":[0.8948436,0.0007409402,0.09440841,0.0001266948,0.0001208614,0.00009825458,0.0003640447,0.0001083625,0.009188929],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002666258,"threshold_uncertainty_score":0.008919537,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2029637008","doi":"10.1143/jjap.47.2526","title":"Void-Free Room-Temperature Silicon Wafer Direct Bonding Using Sequential Plasma Activation","year":2008,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":36,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wafer; Anodic bonding; Plasma activation; Materials science; Annealing (glass); Void (composites); Reactive-ion etching; Wafer bonding; Direct bonding; Microelectromechanical systems; Silicon; Composite material; Plasma; Plasma cleaning; Etching (microfabrication); Analytical Chemistry (journal); Optoelectronics; Chemistry; Layer (electronics)","authors":[{"name":"Chenxi Wang","is_ca":false},{"name":"Eiji Higurashi","is_ca":false},{"name":"Tadatomo Suga","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01840807697793023,"gpt":0.2159968058735313,"spread":0.197588728895601,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001124983,0.0003767546,0.0004047185,0.0002214521,0.0001574717,0.0002111823,0.0006272595,0.0002115208,0.001749619],"category_scores_gemma":[0.0001495197,0.0003827397,0.0002456789,0.0002367452,0.000200821,0.0003726542,0.000643233,0.0003610324,0.0005400131],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001569108,"about_ca_system_score_gemma":0.0002326347,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002622763,"about_ca_topic_score_gemma":0.0006076437,"domain_scores_codex":[0.9998388,0.000009146514,0.000007293378,0.00004849052,0.00007030585,0.00002590762],"domain_scores_gemma":[0.9999031,0.0000155298,0.00002614315,0.00002358127,0.00002260775,0.000009073202],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0000366274,0.00002215199,0.0001516501,0.0001232099,0.00001185592,0.00004727916,0.00003347875,0.0004921246,0.9887205,0.0003218624,0.0002416259,0.009797563],"study_design_scores_gemma":[0.00002884464,0.0002411841,0.002127361,0.000005627396,0.00002110218,0.000439602,0.00001938433,0.00501347,0.9877864,0.000263752,0.00403627,0.00001710257],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9159125,0.00161123,0.07425544,0.00007345833,0.00008524078,0.0001006699,0.0002312959,0.001030325,0.006699785],"genre_scores_gemma":[0.9647789,0.0004673289,0.03088473,0.00002319217,0.00001665919,0.00009077659,0.0002213258,0.0000906369,0.003426522],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001749619,"threshold_uncertainty_score":0.005852997,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2389379251","doi":"10.1016/j.jmatprotec.2016.05.017","title":"Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding","year":2016,"lang":"en","type":"article","venue":"Journal of Materials Processing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":35,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"European Commission","keywords":"Soldering; Materials science; Metallurgy; Alloy; Anode; Metal; Anodic bonding; Electrode; Silicon; Chemistry","authors":[{"name":"Wim J. Malfait","is_ca":false},{"name":"Robert Klemenčič","is_ca":false},{"name":"Britta Lang","is_ca":false},{"name":"Tobias Rist","is_ca":false},{"name":"Martin Klučka","is_ca":false},{"name":"Zoltán Zajacz","is_ca":true},{"name":"Matthias M. Koebel","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.008829217280582455,"gpt":0.2285162464141685,"spread":0.219687029133586,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001842401,0.0007939364,0.0005788294,0.0004356791,0.0003244006,0.0005641128,0.0006965376,0.0003934932,0.001423288],"category_scores_gemma":[0.0002944735,0.0004454224,0.0002780681,0.0004669691,0.000102914,0.0004508619,0.0002948374,0.0002578537,0.0008678627],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004697653,"about_ca_system_score_gemma":0.0007028563,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001050379,"about_ca_topic_score_gemma":0.005631707,"domain_scores_codex":[0.9998025,0.00002042815,0.00001596405,0.00004549688,0.000085229,0.0000303498],"domain_scores_gemma":[0.9998889,0.0000105655,0.00002090291,0.000014933,0.00005507137,0.000009646803],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007940335,0.0000596951,0.0003866704,0.0001847501,0.00002736747,0.00005823929,0.00003731646,0.00326605,0.9795362,0.0006562601,0.0006041919,0.01510394],"study_design_scores_gemma":[0.00002679069,0.0003462976,0.001219261,0.000007240876,0.00006732662,0.0001224493,0.00002855518,0.01524693,0.9771466,0.000173982,0.0055959,0.00001862853],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.843995,0.003717649,0.1348105,0.0001778889,0.0004743219,0.0002343735,0.0005871999,0.002063371,0.0139398],"genre_scores_gemma":[0.907204,0.0007088578,0.08564813,0.00003160104,0.00003180997,0.00006469202,0.0002876922,0.0003029564,0.005720326],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001423288,"threshold_uncertainty_score":0.004761398,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2119741953","doi":"10.1088/0957-4484/21/13/134011","title":"Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale","year":2010,"lang":"en","type":"article","venue":"Nanotechnology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":35,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; University of Texas at Dallas; McMaster University","keywords":"Materials science; Wafer; Nanostructure; Nanotechnology; Nanowire; Nanometre; Reactive-ion etching; Etching (microfabrication); Plasma etching; Plasma; Silicon; Contact angle; Wafer bonding; Optoelectronics; Composite material; Layer (electronics)","authors":[{"name":"Md Golam Kibria","is_ca":true},{"name":"F Zhang","is_ca":true},{"name":"T.-H. Lee","is_ca":false},{"name":"Moon J. Kim","is_ca":false},{"name":"M.M.R. Howlader","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02029274435062406,"gpt":0.2306394134790619,"spread":0.2103466691284379,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002073045,0.000409265,0.0002518744,0.0001521222,0.0001363951,0.0002424443,0.0002847385,0.0002954584,0.0009732373],"category_scores_gemma":[0.0002430502,0.0002284135,0.0002383896,0.0001490882,0.0001166965,0.0002642671,0.0001709906,0.0002863497,0.0001836094],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000160212,"about_ca_system_score_gemma":0.0001822444,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002807945,"about_ca_topic_score_gemma":0.0005906975,"domain_scores_codex":[0.9998605,0.00001123035,0.000006322964,0.00002222618,0.00007898435,0.00002069045],"domain_scores_gemma":[0.9998873,0.00003109457,0.00002449726,0.00001435408,0.00003542932,0.000007234639],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001447226,0.0000142634,0.00009278552,0.00007605061,0.000005121609,0.00002675017,0.00001090635,0.0001671507,0.9973459,0.00008419568,0.00002411888,0.002138203],"study_design_scores_gemma":[0.000004372708,0.00025987,0.001401978,0.000004557116,0.00001461169,0.0001200341,0.00001389684,0.001342602,0.9956322,0.00004664226,0.001155808,0.000003416728],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9856907,0.002355467,0.00907723,0.00003870049,0.00001681606,0.0000814572,0.0001672077,0.000088564,0.002483935],"genre_scores_gemma":[0.9778991,0.001817349,0.01841637,0.00002380572,0.000008092787,0.00008659095,0.0003172265,0.00003239632,0.001399261],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009732373,"threshold_uncertainty_score":0.003255785,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2120154505","doi":"10.1109/mwsym.2004.1339060","title":"A novel MEMS LTCC switch matrix","year":2004,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":33,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"COM DEV International","funders":"University of Waterloo","keywords":"Microelectromechanical systems; Materials science; Interconnection; Crossbar switch; Substrate (aquarium); Planar; Ceramic; Matrix (chemical analysis); Optoelectronics; Electronic engineering; Electrical engineering; Computer science; Engineering; Telecommunications; Composite material","authors":[{"name":"Bahram Yassini","is_ca":true},{"name":"Savio Choi","is_ca":true},{"name":"A. Zybura","is_ca":true},{"name":"Ming Yu","is_ca":true},{"name":"R.E. Mihailovich","is_ca":false},{"name":"J.F. DeNatale","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009674603285278579,"gpt":0.2132636487686038,"spread":0.2035890454833253,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008121439,0.0003616633,0.000198038,0.0002238368,0.0002697231,0.0004939787,0.0005752679,0.0004058157,0.003356062],"category_scores_gemma":[0.0001335917,0.0001529008,0.0002403276,0.0002244386,0.0001383231,0.0003862193,0.0002569119,0.0003410966,0.0008925203],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003020816,"about_ca_system_score_gemma":0.0003240658,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009020319,"about_ca_topic_score_gemma":0.001221601,"domain_scores_codex":[0.9998561,0.000009205294,0.000005160468,0.00002607606,0.00008040192,0.00002300522],"domain_scores_gemma":[0.9998884,0.00001188953,0.00002482236,0.00001517165,0.00003620519,0.00002342975],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0000362538,0.00001929927,0.0002249175,0.00005077184,0.00001043771,0.0001592492,0.00001670324,0.001115749,0.9871616,0.001282513,0.0008635087,0.009058983],"study_design_scores_gemma":[0.00004655374,0.0006280006,0.002738717,0.000009513782,0.00005360163,0.001051187,0.00003707116,0.0204859,0.9234685,0.0006038994,0.05084171,0.00003529429],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8213651,0.002294487,0.1219225,0.000652406,0.0009609792,0.0002720922,0.001050253,0.004008384,0.04747386],"genre_scores_gemma":[0.9058422,0.0005531862,0.07790031,0.0001148451,0.000126056,0.0001276677,0.0005355123,0.00007735969,0.01472289],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003356062,"threshold_uncertainty_score":0.01122719,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2117283955","doi":"10.1149/1.3223985","title":"Role of Heating on Plasma-Activated Silicon Wafers Bonding","year":2009,"lang":"en","type":"article","venue":"Journal of The Electrochemical Society","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":30,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"","keywords":"Silicon; Wafer; Materials science; Silicon oxide; Plasma activation; Etching (microfabrication); Surface roughness; Anodic bonding; Composite material; Wafer bonding; Oxide; Reactive-ion etching; Plasma; Layer (electronics); Nanotechnology; Optoelectronics; Metallurgy; Silicon nitride","authors":[{"name":"M.M.R. Howlader","is_ca":true},{"name":"Tadatomo Suga","is_ca":false},{"name":"H. Itoh","is_ca":false},{"name":"T. H. Lee","is_ca":false},{"name":"M. J. Kim","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.005075655904516735,"gpt":0.2016228554164125,"spread":0.1965471995118958,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002832318,0.0003679847,0.0003396631,0.0001994381,0.0002851955,0.0003607357,0.0002609225,0.0002738222,0.002585266],"category_scores_gemma":[0.0007283461,0.0003453717,0.0002171938,0.0001465777,0.0003797095,0.0004785052,0.0003322994,0.0002690366,0.0004106119],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002196638,"about_ca_system_score_gemma":0.0001558542,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002820927,"about_ca_topic_score_gemma":0.0002803417,"domain_scores_codex":[0.9997924,0.00003727871,0.000008730099,0.00004393185,0.00007574269,0.0000419199],"domain_scores_gemma":[0.9995866,0.0002407234,0.00005509537,0.00004794011,0.00005392292,0.00001561195],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001617046,0.00001478149,0.0006989095,0.0001246398,0.00001326411,0.00009546681,0.000108244,0.0004458498,0.992062,0.0001809031,0.00004356341,0.006050851],"study_design_scores_gemma":[0.000006478537,0.0002084331,0.004927223,0.000007328483,0.00002408111,0.0001759779,0.00006139821,0.001491538,0.991743,0.00007148516,0.001275178,0.000007802543],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9908056,0.002253362,0.004143184,0.00006635403,0.00003112699,0.00002810955,0.00004554804,0.0001072225,0.002519349],"genre_scores_gemma":[0.9957089,0.0006645516,0.002286362,0.00002155286,0.00001610455,0.00001490934,0.0000520531,0.00005302334,0.001182358],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002585266,"threshold_uncertainty_score":0.008648574,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2063787241","doi":"10.1149/1.3272957","title":"Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bonded Wafers at Room Temperature","year":2010,"lang":"en","type":"article","venue":"Electrochemical and Solid-State Letters","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"McMaster University","keywords":"Materials science; Annealing (glass); Amorphous solid; Wafer; Composite material; Optoelectronics; Crystallography; Chemistry","authors":[{"name":"M.M.R. Howlader","is_ca":true},{"name":"Tadatomo Suga","is_ca":false},{"name":"Fuzhong Zhang","is_ca":true},{"name":"T. H. Lee","is_ca":false},{"name":"M. J. Kim","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.004183097193783306,"gpt":0.2028024206934443,"spread":0.198619323499661,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001154863,0.0003189238,0.0003049067,0.000227282,0.0002905293,0.000349341,0.0003471906,0.0003860171,0.002286481],"category_scores_gemma":[0.0003558202,0.0002688591,0.0001895605,0.0002645055,0.0002134819,0.0002887815,0.000212726,0.0005029538,0.0003752719],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002448096,"about_ca_system_score_gemma":0.0001548109,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001342503,"about_ca_topic_score_gemma":0.001697839,"domain_scores_codex":[0.9998431,0.00001059705,0.000008876582,0.00004393018,0.00006068965,0.00003287763],"domain_scores_gemma":[0.9998302,0.00004566602,0.00002543715,0.00002000934,0.00005211634,0.00002659822],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000069936,0.00001061843,0.0002744369,0.00003723245,0.00001121803,0.0001029692,0.00006928086,0.0001153045,0.9985754,0.00004607905,0.00002920456,0.000658229],"study_design_scores_gemma":[0.00000992446,0.0001937394,0.007840008,0.000009543422,0.00003245591,0.0001134126,0.00018394,0.002184491,0.9888094,0.00004265537,0.000568504,0.0000120939],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9980131,0.0003694545,0.0006917735,0.0000211849,0.00001609303,0.000006957422,0.0001601847,0.00003789244,0.0006833569],"genre_scores_gemma":[0.9976971,0.0001923137,0.0008121814,0.00002022677,0.000006630315,0.00001383488,0.0002019326,0.00002730643,0.001028387],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002286481,"threshold_uncertainty_score":0.007649064,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2074317550","doi":"10.1088/0960-1317/20/6/065012","title":"Void nucleation at a sequentially plasma-activated silicon/silicon bonded interface","year":2010,"lang":"en","type":"article","venue":"Journal of Micromechanics and Microengineering","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; McMaster University","keywords":"Nucleation; Materials science; Void (composites); Silicon; Reactive-ion etching; Wafer; Scanning electron microscope; Plasma etching; Annealing (glass); Transmission electron microscopy; Composite material; Plasma; Plasma activation; Analytical Chemistry (journal); Etching (microfabrication); Chemistry; Nanotechnology; Metallurgy; Layer (electronics)","authors":[{"name":"M.M.R. Howlader","is_ca":true},{"name":"F Zhang","is_ca":true},{"name":"Md Golam Kibria","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.004634746040105577,"gpt":0.186123070192699,"spread":0.1814883241525934,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001121867,0.0002270739,0.0002864436,0.0002079715,0.0002061709,0.000232681,0.0003972508,0.0003112496,0.001395389],"category_scores_gemma":[0.0003025502,0.000361928,0.0002023431,0.0001143324,0.0002139071,0.0002327084,0.0002700553,0.0003575582,0.0001860155],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002903288,"about_ca_system_score_gemma":0.0002430099,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008626394,"about_ca_topic_score_gemma":0.001355444,"domain_scores_codex":[0.9998853,0.000006512631,0.000004804522,0.00003114425,0.00004616542,0.00002612145],"domain_scores_gemma":[0.999841,0.00005131712,0.00003191279,0.00002008151,0.00003557469,0.0000201955],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003455371,0.000009932344,0.0001410924,0.00002160797,0.000004275333,0.00006024435,0.00001825171,0.0001904286,0.9988195,0.00005368781,0.00001926953,0.0006271197],"study_design_scores_gemma":[0.000008567387,0.0001281606,0.002481857,0.000002651121,0.00001062118,0.00008642422,0.00002140813,0.002951047,0.9938626,0.00004900762,0.0003923867,0.000005355749],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9954972,0.0002640015,0.003079625,0.00001777914,0.00001464314,0.00001312255,0.00006468291,0.0000816176,0.0009672734],"genre_scores_gemma":[0.9942674,0.0001155588,0.004560902,0.00001212304,0.000004541811,0.0000189684,0.0001029686,0.00001910798,0.0008985524],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001395389,"threshold_uncertainty_score":0.004667997,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4379115896","doi":"10.23919/date56975.2023.10137172","title":"The Next Era for Chiplet Innovation","year":2023,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":26,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Computer science; Product (mathematics); Variety (cybernetics); Soar; Stacking; Data science; Artificial intelligence; Mathematics","authors":[{"name":"Gabriel H. Loh","is_ca":true},{"name":"T. Raja Swaminathan","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0416677909492878,"gpt":0.2448723962198773,"spread":0.2032046052705895,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002732397,0.0006183514,0.0005758914,0.0009305133,0.001187942,0.004685012,0.00203257,0.003793367,0.03421646],"category_scores_gemma":[0.00410573,0.0003263605,0.0006533618,0.001052717,0.002321881,0.00867578,0.003621804,0.004454704,0.01266101],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002046918,"about_ca_system_score_gemma":0.002104673,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008724577,"about_ca_topic_score_gemma":0.0009326853,"domain_scores_codex":[0.9982598,0.0002857719,0.00003922106,0.0002321696,0.0008919148,0.0002910718],"domain_scores_gemma":[0.9972704,0.0006624004,0.0001249704,0.0005108257,0.0008956347,0.0005357456],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00008276848,0.00007300323,0.0005330296,0.0003947048,0.00002574601,0.0001991417,0.0004175841,0.001255787,0.006970024,0.5895931,0.1775999,0.2228553],"study_design_scores_gemma":[0.00001164992,0.0000811592,0.0003497139,0.0001557185,0.000008143058,0.0002346496,0.0001689873,0.001634,0.002091296,0.08714021,0.908104,0.00002050142],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"review","genre_scores_codex":[0.03441008,0.08214825,0.246393,0.1476658,0.01476373,0.0002589726,0.001214002,0.005332636,0.4678136],"genre_scores_gemma":[0.2408068,0.09714203,0.2407334,0.06748021,0.008543054,0.0005199834,0.002026769,0.002031608,0.3407162],"genre_candidate":"review","genre_consensus":null,"teacher_disagreement_score":0.03421646,"threshold_uncertainty_score":0.1144655,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2332051722","doi":"10.1149/1.2357070","title":"Sequential Plasma Activated Process for Silicon Direct Bonding","year":2006,"lang":"en","type":"article","venue":"ECS Transactions","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":25,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"McMaster University","keywords":"Plasma activation; Silicon oxide; Silicon; Materials science; Anodic bonding; Ultimate tensile strength; Composite material; Surface roughness; Annealing (glass); High-resolution transmission electron microscopy; Chemistry; Wafer; Plasma; Chemical engineering; Nanotechnology; Transmission electron microscopy; Metallurgy; Silicon nitride","authors":[{"name":"Matiar R. Howlader","is_ca":true},{"name":"Hironori Itoh","is_ca":false},{"name":"Tadatomo Suga","is_ca":false},{"name":"Moon J. Kim","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01449991768443569,"gpt":0.2332446222743863,"spread":0.2187447045899506,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001165596,0.0003928433,0.0002942476,0.0002263994,0.0002194396,0.000213394,0.000514949,0.0002962606,0.003012893],"category_scores_gemma":[0.0001834273,0.0003385207,0.0002570738,0.0002515516,0.000177312,0.000295506,0.0004102435,0.0005479442,0.001133232],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000244615,"about_ca_system_score_gemma":0.0002972568,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004903892,"about_ca_topic_score_gemma":0.0007780938,"domain_scores_codex":[0.9998294,0.00001075863,0.000006359705,0.00004138645,0.0000927449,0.0000194024],"domain_scores_gemma":[0.9999083,0.00001467175,0.00001696452,0.00001834137,0.0000325302,0.000009204537],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003761832,0.00001677697,0.0001307857,0.000114838,0.000006442902,0.00004629047,0.0000252522,0.0002504333,0.9852735,0.0006574493,0.0005349841,0.01290571],"study_design_scores_gemma":[0.00002675472,0.0003461736,0.001157641,0.000007533357,0.0000177985,0.0007565106,0.00001390855,0.006466677,0.9712351,0.0002966347,0.01965971,0.00001547804],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.681609,0.004674031,0.2861851,0.0003328522,0.0004395283,0.0004413299,0.0007350397,0.00230247,0.02328067],"genre_scores_gemma":[0.8625065,0.001289297,0.1218649,0.000112132,0.0000503129,0.0002936309,0.0005854659,0.0001315728,0.01316616],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003012893,"threshold_uncertainty_score":0.01007915,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2102027329","doi":"10.1021/am4021236","title":"Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining","year":2013,"lang":"en","type":"article","venue":"ACS Applied Materials & Interfaces","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Alberta","funders":"","keywords":"Materials science; Eutectic system; Transfer printing; Electrical contacts; Eutectic bonding; Silicon; Nanometre; Substrate (aquarium); Thermal contact; Semiconductor; Nanotechnology; Thermal; Optoelectronics; Composite material; Alloy","authors":[{"name":"Hohyun Keum","is_ca":false},{"name":"Hyun‐Joong Chung","is_ca":true},{"name":"Seok Kim","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.008700372564203727,"gpt":0.2118643244691399,"spread":0.2031639519049362,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001532888,0.000198239,0.0002162205,0.0001995015,0.0001675252,0.0003947609,0.0003781736,0.0003917939,0.001124811],"category_scores_gemma":[0.0004454732,0.0001996853,0.0001958333,0.0001439499,0.0002566734,0.0004829927,0.0004824058,0.0003591789,0.0003847019],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001867777,"about_ca_system_score_gemma":0.00007007636,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00008507007,"about_ca_topic_score_gemma":0.0001716753,"domain_scores_codex":[0.999732,0.0000290249,0.00001771279,0.00006083756,0.0001282678,0.00003220728],"domain_scores_gemma":[0.9998276,0.00006487266,0.00003937251,0.00003326247,0.00002471682,0.00001025978],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002045396,0.000006715291,0.000147765,0.00003276651,0.000005061547,0.0001506064,0.0000567689,0.0001731526,0.9966657,0.0001586411,0.00003206562,0.002550307],"study_design_scores_gemma":[0.000002446799,0.000042345,0.0005661596,0.000001361139,0.000004078822,0.0001571496,0.00002045141,0.0008112414,0.997808,0.00004054759,0.0005438591,0.000002273649],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9799321,0.0008662335,0.01524533,0.00008936587,0.00005848601,0.00002268029,0.00005247639,0.000182009,0.003551249],"genre_scores_gemma":[0.991176,0.0002212269,0.006634505,0.00002739115,0.00001124345,0.00001052312,0.00003926603,0.00002982303,0.001849995],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001124811,"threshold_uncertainty_score":0.003762841,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1981141412","doi":"10.1145/2633606","title":"Statistical Peak Temperature Prediction and Thermal Yield Improvement for 3D Chip Multiprocessors","year":2014,"lang":"en","type":"article","venue":"ACM Transactions on Design Automation of Electronic Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"Division of Computer and Network Systems; Intel Corporation","keywords":"Computer science; Chip; Thermal; Fabrication; Yield (engineering); Leakage power; Process (computing); Three-dimensional integrated circuit; Integrated circuit; Matching (statistics); Electronic circuit; Power (physics); Materials science; Optoelectronics; Electrical engineering; Power consumption; Composite material; Telecommunications","authors":[{"name":"Da-Cheng Juan","is_ca":false},{"name":"Siddharth Garg","is_ca":true},{"name":"Diana Marculescu","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01092210371300435,"gpt":0.2083514887250244,"spread":0.1974293850120201,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004039524,0.0006193875,0.0003493077,0.0003467187,0.0002073219,0.0003543078,0.0005793907,0.0004122749,0.0005056978],"category_scores_gemma":[0.001692726,0.0003695579,0.0003863156,0.000345253,0.0003048806,0.0005959317,0.0003677045,0.0004588383,0.0001820789],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006973739,"about_ca_system_score_gemma":0.000585196,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.003636362,"about_ca_topic_score_gemma":0.005072102,"domain_scores_codex":[0.9997951,0.00004456885,0.000009064923,0.00004802781,0.00007960363,0.00002363531],"domain_scores_gemma":[0.9994562,0.0002497452,0.0001042199,0.0000915878,0.00008227026,0.00001582476],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00003972289,0.00002285006,0.001337321,0.00001248814,0.00001489652,0.00001397915,0.000009640159,0.9690937,0.007860116,0.0005064441,0.0001597896,0.02092894],"study_design_scores_gemma":[6.276226e-7,0.000007511304,0.0001976673,4.639465e-7,0.000001712089,0.000002721317,8.313522e-7,0.9976943,0.001836464,0.0002172242,0.00003897347,0.000001513199],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.1359846,0.0003805946,0.8612007,0.0001482069,0.00001869009,0.00001593907,0.0001072133,0.001387951,0.0007560327],"genre_scores_gemma":[0.936299,0.0001980548,0.0625601,0.00004600121,0.00001592892,0.00003342232,0.0001509496,0.00007969017,0.0006167702],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.003636362,"threshold_uncertainty_score":0.007230401,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2324919773","doi":"10.1149/1.3483522","title":"Surface and Interface Characterization of Sequentially Plasma Activated Silicon, Silicon dioxide and Germanium Wafers for Low Temperature Bonding Applications","year":2010,"lang":"en","type":"article","venue":"ECS Transactions","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"","keywords":"Germanium; Wafer; Materials science; Silicon; Reactivity (psychology); Surface roughness; Silicon dioxide; Plasma activation; Plasma; Characterization (materials science); Nanotechnology; Analytical Chemistry (journal); Composite material; Chemistry; Optoelectronics","authors":[{"name":"Fangfang Zhang","is_ca":true},{"name":"Md Golam Kibria","is_ca":true},{"name":"K. Cormier","is_ca":true},{"name":"M.M.R. Howlader","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.005851483857038826,"gpt":0.2101241962603762,"spread":0.2042727124033374,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001039687,0.000281954,0.0001754817,0.0002671464,0.0001840702,0.0002010649,0.0002014022,0.0003006384,0.0014371],"category_scores_gemma":[0.0002312708,0.0002015684,0.0002126196,0.0001779424,0.0001362589,0.0001903963,0.0001534422,0.0002312419,0.0002545466],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001339352,"about_ca_system_score_gemma":0.0001196782,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00072713,"about_ca_topic_score_gemma":0.001019992,"domain_scores_codex":[0.9999114,0.000006940236,0.000004010416,0.00001845805,0.000044564,0.00001451073],"domain_scores_gemma":[0.9999129,0.00002167381,0.00001451297,0.000009057988,0.00003118356,0.00001061783],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002081069,0.000003551824,0.0001639856,0.00001646217,0.000002541419,0.00001584261,0.00001199059,0.0000385336,0.9991295,0.00001363877,0.00002054898,0.0005627007],"study_design_scores_gemma":[0.000007190194,0.0003152754,0.01502822,0.000003366093,0.00002351764,0.0001762803,0.0000633352,0.001857073,0.9813517,0.0000293919,0.001136955,0.000007752944],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9954087,0.0005556104,0.002766178,0.00002763491,0.00001605779,0.00001705651,0.0002079792,0.00003466016,0.000966154],"genre_scores_gemma":[0.9940785,0.0003103286,0.003668794,0.00002171195,0.000008344551,0.00004511921,0.0003809326,0.0000243962,0.001461861],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0014371,"threshold_uncertainty_score":0.004807591,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1980699453","doi":"10.1109/isscc.2006.1696063","title":"A 2.6GHz Dual-Core 64bx86 Microprocessor with DDR2 Memory Support","year":2006,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Memory controller; Microprocessor; Embedded system; Chip; Computer science; Interconnection; Controller (irrigation); Dual (grammatical number); Computer hardware; Operating system; Semiconductor memory; Telecommunications","authors":[{"name":"Michael Golden","is_ca":true},{"name":"Srikanth Arekapudi","is_ca":true},{"name":"G. Dabney","is_ca":true},{"name":"Mike Haertel","is_ca":true},{"name":"Stephen Hale","is_ca":true},{"name":"Lowell Herlinger","is_ca":true},{"name":"Yongg Kim","is_ca":true},{"name":"Kevin McGrath","is_ca":true},{"name":"Vasant Palisetti","is_ca":true},{"name":"Monica Singh","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.005849187665998048,"gpt":0.1723883053757252,"spread":0.1665391177097272,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001434039,0.0003929553,0.0003617219,0.0004001618,0.0003158031,0.0003926497,0.0006238127,0.0003191309,0.01146287],"category_scores_gemma":[0.0002327132,0.000230331,0.0001438018,0.0004488957,0.00009580577,0.0003829144,0.0002793467,0.0002783864,0.003449797],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002693707,"about_ca_system_score_gemma":0.0005045035,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0006082153,"about_ca_topic_score_gemma":0.001258179,"domain_scores_codex":[0.9998362,0.00001644542,0.00000842354,0.0000413959,0.00004289632,0.00005457545],"domain_scores_gemma":[0.9998761,0.00001991215,0.000009430344,0.00002298037,0.00004024559,0.00003130213],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0009959862,0.0003587856,0.003666727,0.0003560573,0.00006766688,0.0007560772,0.0002895083,0.004489221,0.6895618,0.00939722,0.04731039,0.2427506],"study_design_scores_gemma":[0.0005678957,0.003715978,0.01738919,0.0001125227,0.0001436847,0.004681863,0.0002987171,0.1112437,0.6003339,0.003365702,0.2580048,0.0001420549],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"methods","genre_scores_codex":[0.6741973,0.001309515,0.1853349,0.0009158449,0.0003599581,0.0004490136,0.001792285,0.02866978,0.1069714],"genre_scores_gemma":[0.8916873,0.0002433274,0.07343506,0.0003726587,0.00006020679,0.0001661399,0.001554996,0.0003344335,0.03214595],"genre_candidate":"methods","genre_consensus":null,"teacher_disagreement_score":0.01146287,"threshold_uncertainty_score":0.03834713,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2514960441","doi":"10.1149/07509.0117ecst","title":"Combined Surface Activated Bonding Technique for Hydrophilic SiO<sub>2</sub>-SiO<sub>2</sub> and Cu-Cu Bonding","year":2016,"lang":"en","type":"article","venue":"ECS Transactions","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Optech (Canada)","funders":"","keywords":"Anodic bonding; Annealing (glass); Materials science; Direct bonding; Wafer bonding; Void (composites); Wafer; Bonding strength; Scanning electron microscope; Transmission electron microscopy; Composite material; Analytical Chemistry (journal); Nanotechnology; Chemistry","authors":[{"name":"Ran He","is_ca":false},{"name":"Masahisa Fujino","is_ca":false},{"name":"Akira Yamauchi","is_ca":true},{"name":"Tadatomo Suga","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01043603237648257,"gpt":0.2092559784798357,"spread":0.1988199461033531,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000149715,0.0004469259,0.0004154423,0.0003092584,0.0002618888,0.0002473272,0.0004355081,0.0004123531,0.002465391],"category_scores_gemma":[0.0001780542,0.0003636688,0.0002952553,0.0002723888,0.000341055,0.0003910463,0.0004484626,0.0006506752,0.0007502714],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001126479,"about_ca_system_score_gemma":0.0001932508,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001619033,"about_ca_topic_score_gemma":0.0005385153,"domain_scores_codex":[0.9998573,0.0000177728,0.000006293712,0.00002995075,0.00006715149,0.00002148554],"domain_scores_gemma":[0.9998749,0.00002775689,0.0000292231,0.00002506947,0.00003284339,0.00001015781],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002141974,0.00001591158,0.0001286053,0.00009975076,0.000008978758,0.00003260774,0.00002378682,0.00009301217,0.9940217,0.0001551912,0.0001268007,0.005272198],"study_design_scores_gemma":[0.00001123441,0.0003033804,0.001522051,0.000005047049,0.00002166026,0.0003684568,0.00003862169,0.001939537,0.9888579,0.0001471057,0.006774163,0.0000108968],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"methods","genre_scores_codex":[0.8637344,0.003155128,0.1223206,0.0002892161,0.000258543,0.0002293067,0.0002371977,0.001063075,0.008712478],"genre_scores_gemma":[0.9100523,0.001249657,0.07847677,0.00009903812,0.00007296368,0.0001814639,0.0001473789,0.00009795078,0.009622523],"genre_candidate":"methods","genre_consensus":null,"teacher_disagreement_score":0.002465391,"threshold_uncertainty_score":0.008247554,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2161130272","doi":"10.1109/tcpmt.2011.2177269","title":"Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"University of Waterloo; Nanyang Technological University","keywords":"Materials science; Plating (geology); Microstructure; Shear strength (soil); Metallurgy; Electroless plating; Copper; Contact resistance; Pillar; Copper plating; Composite material; Daisy chain; Flip chip; Layer (electronics); Electroplating; Adhesive; Structural engineering","authors":[{"name":"Jaesik Lee","is_ca":false},{"name":"Daniel Moses Fernandez","is_ca":false},{"name":"Myo Paing","is_ca":false},{"name":"Yen Chen Yeo","is_ca":false},{"name":"Shan Gao","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01469833692879095,"gpt":0.2261363404971476,"spread":0.2114380035683566,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002262501,0.0004020666,0.0002228657,0.0001903888,0.0001281017,0.0002737595,0.0006203886,0.0002926811,0.0002980835],"category_scores_gemma":[0.0004763034,0.0003154158,0.0001509213,0.0002030239,0.0001731527,0.0003147895,0.0002260405,0.0002565787,0.0001285002],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002959845,"about_ca_system_score_gemma":0.0001593722,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0006752396,"about_ca_topic_score_gemma":0.001524285,"domain_scores_codex":[0.999757,0.00002717301,0.00001466155,0.00005919794,0.0001117545,0.000030187],"domain_scores_gemma":[0.9997112,0.00005489752,0.00009666208,0.0000607888,0.00006294116,0.00001348692],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003275654,0.00001004792,0.0004081799,0.00003141013,0.00000429126,0.00006627119,0.00002239014,0.0005611737,0.9930315,0.00006109848,0.00006998051,0.005700947],"study_design_scores_gemma":[0.000008319859,0.0001469314,0.003879175,0.000003469454,0.00001432759,0.0002059107,0.00001536349,0.006291972,0.9883298,0.00003128219,0.001063887,0.000009556912],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9445356,0.000842489,0.052256,0.00007609682,0.00006961552,0.00004059941,0.0000850306,0.0005487238,0.001545878],"genre_scores_gemma":[0.9692971,0.0002306337,0.0290475,0.00003545417,0.000009574494,0.00002396274,0.0000446774,0.00004789251,0.00126322],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0006752396,"threshold_uncertainty_score":0.002147496,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1796445194","doi":"10.1109/cicc.1994.379764","title":"An overview of technology, architecture and CAD tools for programmable logic devices","year":2002,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Programmable Array Logic; Programmable logic device; Simple programmable logic device; Programmable logic array; Computer science; Erasable programmable logic device; Field-programmable gate array; Logic synthesis; Logic family; Macrocell array; Computer architecture; Complex programmable logic device; Logic gate; Digital electronics; Embedded system; Register-transfer level; Electronic circuit; Computer hardware; Electrical engineering; Engineering; Algorithm","authors":[{"name":"S. D. Brown","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.06103781827731848,"gpt":0.2753612934061263,"spread":0.2143234751288078,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006250273,0.001489195,0.0006562358,0.003413554,0.0005717019,0.003015807,0.00161974,0.001969502,0.01725914],"category_scores_gemma":[0.001315348,0.0009692129,0.0006496654,0.004474249,0.0005668193,0.004065943,0.0009051524,0.002429222,0.01221075],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009472421,"about_ca_system_score_gemma":0.001186578,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001257593,"about_ca_topic_score_gemma":0.001462152,"domain_scores_codex":[0.9991294,0.00008739886,0.0001082316,0.00009405179,0.0005394086,0.00004157379],"domain_scores_gemma":[0.9996355,0.0001552102,0.00003210625,0.00004051669,0.0001157001,0.00002102062],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00004318026,0.00009478251,0.0001998005,0.003388889,0.00003012493,0.0004744944,0.0002616197,0.005828594,0.01347082,0.1473507,0.1100217,0.7188354],"study_design_scores_gemma":[0.000007639396,0.00002751824,0.000128563,0.0003888578,0.000006643214,0.0005655481,0.00002251665,0.002127878,0.001340467,0.01188657,0.9834759,0.00002185157],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"review","genre_scores_codex":[0.002301167,0.3792285,0.4512079,0.00286838,0.003464296,0.0004042829,0.001450926,0.00533812,0.1537364],"genre_scores_gemma":[0.01290511,0.3620194,0.5159331,0.002418245,0.001804843,0.0008073444,0.003445548,0.001153095,0.09951328],"genre_candidate":"review","genre_consensus":null,"teacher_disagreement_score":0.01725914,"threshold_uncertainty_score":0.05773759,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4385066962","doi":"10.3390/electronics12143154","title":"Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology","year":2023,"lang":"en","type":"article","venue":"Electronics","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Université de Sherbrooke; Université du Québec en Outaouais","funders":"","keywords":"Multiphysics; Finite element method; System in package; Chip; Mechanical engineering; Reliability (semiconductor); Thermal; Electronic packaging; Electronic engineering; Materials science; Temperature control; Computer science; Engineering; Electrical engineering; Structural engineering","authors":[{"name":"Aziz Oukaira","is_ca":true},{"name":"Dhaou Said","is_ca":true},{"name":"Jamal Zbitou","is_ca":false},{"name":"Ahmed Lakhssassi","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00854233383199903,"gpt":0.245066928823636,"spread":0.2365245949916369,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003822361,0.0004448133,0.0002793974,0.0002348849,0.0002270981,0.0003975936,0.0004360963,0.0003824441,0.0007335823],"category_scores_gemma":[0.0004019354,0.0002281847,0.0003980829,0.0001878531,0.0003427954,0.0003099089,0.0003109296,0.0004014795,0.0002246934],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003480919,"about_ca_system_score_gemma":0.0005259399,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007259864,"about_ca_topic_score_gemma":0.001072837,"domain_scores_codex":[0.9997779,0.000046488,0.000008606937,0.00003040656,0.0001211352,0.00001553179],"domain_scores_gemma":[0.9998358,0.00005608966,0.00003012137,0.00002973824,0.00004237113,0.000005869471],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00007085616,0.00008340508,0.001397367,0.0005729749,0.00006600516,0.000157192,0.0002517845,0.4629275,0.4059626,0.01702952,0.002138624,0.1093421],"study_design_scores_gemma":[0.00001223798,0.0001229752,0.0005606635,0.00003647404,0.00002184207,0.0001105914,0.0000239482,0.9068556,0.07935512,0.0009597221,0.01191421,0.00002658348],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.02773937,0.0003512128,0.9666121,0.00006757673,0.00006003948,0.00005594683,0.00002916284,0.0005658575,0.004518642],"genre_scores_gemma":[0.4967152,0.0004517339,0.4998847,0.00005437582,0.00003012585,0.0002498149,0.0000782643,0.000143483,0.002392194],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.0007335823,"threshold_uncertainty_score":0.002525568,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2014715605","doi":"10.1007/s13391-013-3260-6","title":"Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test","year":2014,"lang":"en","type":"article","venue":"Electronic Materials Letters","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo; Western University","funders":"Small and Medium Business Administration","keywords":"Materials science; Thermal shock; Composite material; Shock (circulatory); Thermal; Structural engineering; Metallurgy; Nuclear engineering; Thermodynamics; Engineering","authors":[{"name":"Il Ho Jeong","is_ca":false},{"name":"Myong Hoon Roh","is_ca":false},{"name":"Flora Jung","is_ca":true},{"name":"Wan Ho Song","is_ca":true},{"name":"M. Mayer","is_ca":true},{"name":"Jae Pil Jung","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.001668548405669852,"gpt":0.154877426253279,"spread":0.1532088778476092,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001313288,0.0002296838,0.0002357392,0.0003751588,0.0003313513,0.0002328995,0.0004695701,0.0004996894,0.001642044],"category_scores_gemma":[0.0006067627,0.0001603183,0.0002487978,0.0005011,0.000345583,0.0004481318,0.000212931,0.0002037314,0.0001715658],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004305025,"about_ca_system_score_gemma":0.0001801589,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002156798,"about_ca_topic_score_gemma":0.001926367,"domain_scores_codex":[0.9998121,0.00001559575,0.000007891792,0.00003921179,0.00008951177,0.00003582785],"domain_scores_gemma":[0.9995745,0.00009600755,0.00005675265,0.00006366181,0.0001803919,0.0000286868],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006996987,0.00005025321,0.009583995,0.0001183955,0.00004426481,0.0007236752,0.0007315237,0.006832283,0.9662352,0.0004863843,0.0006894155,0.01380482],"study_design_scores_gemma":[0.00003140336,0.001445072,0.1050755,0.00002649899,0.0001133534,0.0007245178,0.001048663,0.06344781,0.8239498,0.0004152836,0.003657873,0.00006427773],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9958606,0.0001092486,0.002823889,0.00002959417,0.00001519163,0.000008146659,0.000118077,0.0001117901,0.0009234028],"genre_scores_gemma":[0.9991756,0.00001883424,0.0002780725,0.000005283612,0.000001771402,0.00000380491,0.00004952545,0.000007384019,0.0004598004],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002156798,"threshold_uncertainty_score":0.005493224,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4312576493","doi":"10.1109/tvlsi.2022.3214793","title":"A Robust Integrated Power Delivery Methodology for 3-D ICs","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Fonds de recherche du Québec","keywords":"Notation; Integrated circuit; Computer science; Power (physics); Dimension (graph theory); Power domains; Electronic engineering; Topology (electrical circuits); Voltage; Mathematics; Electrical engineering; Engineering; Physics; Arithmetic","authors":[{"name":"Yousef Safari","is_ca":true},{"name":"Boris Vaisband","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04747307557331044,"gpt":0.2454761839940282,"spread":0.1980031084207177,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000286359,0.0005207818,0.0002921138,0.000366589,0.0003085274,0.0007970952,0.0008945994,0.0005745399,0.001905319],"category_scores_gemma":[0.0005481014,0.000312804,0.0004533441,0.0002862427,0.0003782074,0.0007008507,0.0006888033,0.0007348928,0.0008135018],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005452551,"about_ca_system_score_gemma":0.0005228417,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003307869,"about_ca_topic_score_gemma":0.0003251304,"domain_scores_codex":[0.9995921,0.00004704631,0.00002047831,0.00007023141,0.0002452147,0.00002489137],"domain_scores_gemma":[0.9998298,0.00003290843,0.00003311562,0.00004582677,0.00005140913,0.000007005687],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005690703,0.00008695709,0.000269595,0.0004342434,0.00006293798,0.0002661268,0.0001859046,0.1191416,0.5505424,0.1079092,0.003450873,0.2175934],"study_design_scores_gemma":[0.00004225662,0.0004412518,0.0003526293,0.00005296656,0.00005867058,0.0007255408,0.00004047477,0.5848569,0.324199,0.02021142,0.06896585,0.00005299121],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.004798844,0.0002586672,0.9909363,0.0000757207,0.00004217166,0.00005326103,0.00003086857,0.0005188189,0.003285281],"genre_scores_gemma":[0.2180186,0.0006940888,0.7744853,0.0001587279,0.00004359658,0.0002073527,0.0001338416,0.0001902001,0.00606828],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.001905319,"threshold_uncertainty_score":0.006373942,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2040401447","doi":"10.1109/tim.2014.2321461","title":"Low-Contact Resistance Probe Card Using MEMS Technology","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Instrumentation and Measurement","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Windsor","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Microelectromechanical systems; Wafer; Contact resistance; Wafer testing; Return loss; Materials science; Die (integrated circuit); Integrated circuit; Electrical engineering; Insertion loss; Electronic circuit; Electronic engineering; Optoelectronics; Engineering; Nanotechnology; Layer (electronics)","authors":[{"name":"Nabeeh Kandalaft","is_ca":true},{"name":"Iftekhar Basith","is_ca":true},{"name":"Rashid Rashidzadeh","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02384830864490771,"gpt":0.2209793983538635,"spread":0.1971310897089557,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005317904,0.0004568662,0.0005299092,0.0005616511,0.0002387533,0.0005891515,0.001183059,0.0008856775,0.005830224],"category_scores_gemma":[0.001340127,0.0002821193,0.0002195528,0.000407395,0.00030885,0.001229293,0.0006728086,0.0006136835,0.002050051],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000306846,"about_ca_system_score_gemma":0.0003158841,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002448864,"about_ca_topic_score_gemma":0.0004964794,"domain_scores_codex":[0.9989065,0.0001650522,0.00006383903,0.0002499471,0.0005333817,0.0000813796],"domain_scores_gemma":[0.9987423,0.0004133807,0.0002386692,0.0003026656,0.000257205,0.00004579216],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002711793,0.0001231389,0.003444104,0.0001881249,0.00003298159,0.0001822502,0.00007901573,0.000673915,0.8798248,0.002851201,0.003881809,0.1084475],"study_design_scores_gemma":[0.000091877,0.001680497,0.01148993,0.00001744826,0.00004674109,0.001695695,0.00005113384,0.02402559,0.930498,0.0005022729,0.02982233,0.00007857315],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.3759611,0.001066197,0.5937361,0.000610815,0.0005576817,0.0008343061,0.001281144,0.01084636,0.01510626],"genre_scores_gemma":[0.71997,0.0002599657,0.268212,0.0003635887,0.0001255911,0.000406502,0.0006675873,0.000144281,0.009850568],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.005830224,"threshold_uncertainty_score":0.01950407,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2921917561","doi":"10.1109/jmems.2019.2902066","title":"Capabilities and Limits to Form High Aspect-Ratio Microstructures by Molding of Borosilicate Glass","year":2019,"lang":"en","type":"article","venue":"Journal of Microelectromechanical Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Borosilicate glass; Materials science; Aspect ratio (aeronautics); Molding (decorative); Etching (microfabrication); Anodic bonding; Potassium hydroxide; Fabrication; Silicon; Reactive-ion etching; Microelectromechanical systems; Microstructure; Composite material; Nanotechnology; Optoelectronics; Chemical engineering","authors":[{"name":"Amrid Amnache","is_ca":true},{"name":"John Neumann","is_ca":false},{"name":"Luc G. Fréchette","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.003559086015003398,"gpt":0.1831226490213544,"spread":0.179563563006351,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004387157,0.0002829711,0.0001419278,0.0001653742,0.0001494789,0.0003877019,0.0002427755,0.000198336,0.0005649049],"category_scores_gemma":[0.0007108814,0.0002710086,0.000162097,0.00009162942,0.0003457,0.000401345,0.0002950502,0.0002614704,0.0001862306],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001731792,"about_ca_system_score_gemma":0.0001475903,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002874682,"about_ca_topic_score_gemma":0.0006144749,"domain_scores_codex":[0.9997023,0.00002950191,0.00002480082,0.00005305622,0.0001398669,0.00005038461],"domain_scores_gemma":[0.9991705,0.0003423601,0.0001997658,0.0001780984,0.00006949603,0.00003980661],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001526291,0.000009936996,0.000262701,0.0000478792,0.000003885525,0.00004055314,0.00005603157,0.000563274,0.9958159,0.0003122628,0.00002501098,0.002847124],"study_design_scores_gemma":[0.000007072737,0.000218668,0.00153256,0.000007566724,0.000007851776,0.0001403763,0.00002039861,0.002099721,0.9940531,0.00008001245,0.001827547,0.000005263838],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9699929,0.001798885,0.02278804,0.00008308664,0.00003497983,0.00007593937,0.0000759653,0.000235756,0.004914456],"genre_scores_gemma":[0.9759225,0.0008296981,0.02218932,0.00002573994,0.00001188198,0.00003298385,0.00007839303,0.00006209756,0.0008474219],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0005649049,"threshold_uncertainty_score":0.00232023,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2887263428","doi":"10.1109/ectc.2018.00069","title":"Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process","year":2018,"lang":"en","type":"preprint","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Flip chip; Materials science; Substrate (aquarium); Chip; Soldering; Reflow soldering; Capacitively coupled plasma; Plasma; Optoelectronics; Nanotechnology; Metallurgy; Inductively coupled plasma; Electrical engineering; Layer (electronics); Adhesive; Engineering","authors":[{"name":"Maxime Godard","is_ca":true},{"name":"Dominique Drouin","is_ca":true},{"name":"Maxime Darnon","is_ca":true},{"name":"Serge Martel","is_ca":true},{"name":"Clement Fortin","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03828951399632404,"gpt":0.2723795526379459,"spread":0.2340900386416219,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001453358,0.0003385568,0.0002872186,0.0002029101,0.0003021306,0.0002500468,0.0004182947,0.0004322479,0.001805921],"category_scores_gemma":[0.0002187982,0.0001360117,0.0002212997,0.0002166213,0.0001274651,0.0002642275,0.0002327723,0.0003513679,0.0006520492],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002222446,"about_ca_system_score_gemma":0.0001036181,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002904703,"about_ca_topic_score_gemma":0.0003885186,"domain_scores_codex":[0.9997434,0.00002076533,0.00001091044,0.00007991937,0.0001055067,0.00003944801],"domain_scores_gemma":[0.9999195,0.00001543725,0.00002019383,0.00001174244,0.00002715703,0.000005937258],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002657881,0.00001083861,0.0001332531,0.00008564865,0.000003555581,0.00005939089,0.00004000593,0.0001739508,0.9955983,0.00009537255,0.0001847428,0.003588382],"study_design_scores_gemma":[0.000003863389,0.00009670621,0.001236525,0.000003477961,0.000006958406,0.0000931036,0.00001499273,0.0009232309,0.9942931,0.00004238219,0.003279959,0.000005662093],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9431029,0.002920983,0.04696893,0.0001875212,0.000192206,0.0001429902,0.0006378143,0.00090451,0.004942165],"genre_scores_gemma":[0.9706758,0.0008316088,0.02439166,0.00007154283,0.00002885336,0.00009745992,0.0005138075,0.0001263937,0.003262925],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001805921,"threshold_uncertainty_score":0.006041467,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1601853155","doi":"10.1109/aps.2005.1551373","title":"24 GHz differential integrated antennas in 10 Ω-cm bulk silicon","year":2005,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Carleton University","funders":"","keywords":"Lossy compression; Differential (mechanical device); Wireless; Electrical impedance; Electronic engineering; Omega; Electrical engineering; Very-large-scale integration; Silicon; Materials science; Computer science; Optoelectronics; Physics; Telecommunications; Engineering","authors":[{"name":"Atif Shamim","is_ca":true},{"name":"Langis Roy","is_ca":true},{"name":"G. Tarr","is_ca":true},{"name":"V. Levenets","is_ca":true},{"name":"N. Fong","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009863099367313772,"gpt":0.2000491515592982,"spread":0.1901860521919844,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001417843,0.0003812019,0.0003088129,0.0001196929,0.00008945957,0.0004485909,0.0006155804,0.0003854932,0.001493516],"category_scores_gemma":[0.0005546271,0.0002437166,0.0002001836,0.0002373,0.0001928232,0.0003840135,0.0003153271,0.00036386,0.000812312],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004878722,"about_ca_system_score_gemma":0.0001323357,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003766912,"about_ca_topic_score_gemma":0.0006336886,"domain_scores_codex":[0.9997829,0.00001525949,0.000008043955,0.00005687563,0.00008425793,0.00005279499],"domain_scores_gemma":[0.9996964,0.00008117247,0.0000790187,0.00004329124,0.00007047284,0.00002971768],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001311055,0.00003034616,0.000776238,0.0000746426,0.00002400743,0.0001816013,0.0000875493,0.001643939,0.9827039,0.0006868129,0.0004965543,0.0131633],"study_design_scores_gemma":[0.000042698,0.0006246853,0.002089491,0.000007831417,0.00004793336,0.0003600077,0.00003918346,0.008419017,0.9825278,0.0001305922,0.005692891,0.00001783755],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9606571,0.00061318,0.03250055,0.0001743544,0.000108578,0.00002395032,0.0001407641,0.0005019758,0.005279534],"genre_scores_gemma":[0.9734907,0.0002310846,0.02206758,0.00004093393,0.00002395938,0.00001545312,0.0001024828,0.0000414568,0.003986503],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001493516,"threshold_uncertainty_score":0.0049963,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2611406581","doi":"10.1109/jmems.2017.2675987","title":"Practical CMUT Fabrication With a Nitride-to-Oxide-Based Wafer Bonding Process","year":2017,"lang":"en","type":"article","venue":"Journal of Microelectromechanical Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; University of Waterloo; Université de Sherbrooke; CMC Microsystems","keywords":"Capacitive micromachined ultrasonic transducers; Materials science; Wafer bonding; Wafer; Fabrication; Silicon on insulator; Optoelectronics; LOCOS; Surface micromachining; Microelectromechanical systems; Silicon nitride; Electronic engineering; Silicon; Piezoelectricity; Composite material; Engineering","authors":[{"name":"Albert I. H. Chen","is_ca":true},{"name":"Lawrence L. P. Wong","is_ca":true},{"name":"Zhenhao Li","is_ca":true},{"name":"Shuai Na","is_ca":true},{"name":"John T. W. Yeow","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01922763668398653,"gpt":0.2751285167642341,"spread":0.2559008800802476,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003318878,0.0006245944,0.0003176414,0.0003857148,0.0006232389,0.0004714433,0.0007027712,0.0006421171,0.001947173],"category_scores_gemma":[0.0006231397,0.0003898628,0.0001734032,0.0003854065,0.0003223769,0.0005991465,0.0004930014,0.0005508468,0.0005547921],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004261467,"about_ca_system_score_gemma":0.0006642339,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005885109,"about_ca_topic_score_gemma":0.001691764,"domain_scores_codex":[0.9997262,0.000024044,0.0000166163,0.00007865671,0.0001134459,0.00004108153],"domain_scores_gemma":[0.9997712,0.00004952809,0.00004166417,0.00004031408,0.00007676593,0.0000205093],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001920019,0.00001082012,0.0001631058,0.0001372416,0.000004122071,0.00009781807,0.00009009344,0.0003043639,0.9913362,0.0008494919,0.0002741409,0.006713491],"study_design_scores_gemma":[0.000007136414,0.0001405754,0.001283543,0.00001534061,0.00001043058,0.0003926771,0.00006180922,0.0034338,0.9836385,0.0001323784,0.01086661,0.00001714044],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"methods","genre_scores_codex":[0.5099619,0.002006673,0.4674073,0.0003526391,0.0005472446,0.000852426,0.0009131478,0.002622324,0.01533633],"genre_scores_gemma":[0.631486,0.0007912548,0.362359,0.0000953358,0.00003907457,0.0004523385,0.0003730848,0.0001506962,0.004253298],"genre_candidate":"methods","genre_consensus":null,"teacher_disagreement_score":0.001947173,"threshold_uncertainty_score":0.006513894,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3158793502","doi":"10.1109/iscas51556.2021.9401673","title":"Power Delivery for Silicon Interconnect Fabric","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"","keywords":"Decoupling capacitor; Topology (electrical circuits); Capacitor; Ripple; Electronic engineering; Network topology; Electrical engineering; Decoupling (probability); Interconnection; Voltage; Engineering; Interposer; Computer science; Materials science; Telecommunications","authors":[{"name":"Yousef Safari","is_ca":true},{"name":"Boris Vaisband","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00909530246295118,"gpt":0.1992285984976841,"spread":0.1901332960347329,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000946073,0.0003424709,0.0001239115,0.0002665505,0.0002482012,0.0004299654,0.0003618221,0.0001885265,0.004373877],"category_scores_gemma":[0.0002445133,0.0001304159,0.0001757161,0.0002673495,0.0001408216,0.0004513244,0.0003026175,0.0002080695,0.001180067],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005781347,"about_ca_system_score_gemma":0.0002274906,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003136173,"about_ca_topic_score_gemma":0.000637426,"domain_scores_codex":[0.9998939,0.00001029736,0.000004375991,0.00002862209,0.00004637484,0.00001643009],"domain_scores_gemma":[0.9999166,0.0000160857,0.00002235294,0.00001623294,0.00002419756,0.000004559],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001113374,0.00007051229,0.0008465459,0.0003589693,0.00003090334,0.0002391507,0.0001598127,0.03770591,0.7289006,0.02822839,0.006554226,0.1967937],"study_design_scores_gemma":[0.00003737253,0.0006688823,0.002220083,0.00006579664,0.00005110695,0.0007602182,0.0001027911,0.2752592,0.6230993,0.007025879,0.09068388,0.00002549968],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.2422995,0.002671881,0.6628667,0.0005526636,0.0002655049,0.0001762868,0.0005591313,0.003819015,0.08678925],"genre_scores_gemma":[0.9135296,0.000977342,0.06378324,0.000142234,0.00004947192,0.00008162128,0.0004089811,0.0002326922,0.02079482],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.004373877,"threshold_uncertainty_score":0.01463211,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3173173979","doi":"10.1109/newcas50681.2021.9462767","title":"Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Polytechnique Montréal; Université du Québec en Outaouais","funders":"","keywords":"Transient (computer programming); Finite element method; Reliability (semiconductor); Thermal; Thermal analysis; Heat transfer; Coupling (piping); Computer science; Junction temperature; Thermal transfer; Materials science; System in package; Mechanical engineering; Temperature measurement; Layer (electronics); Electronic engineering; Structural engineering; Engineering; Mechanics; Composite material; Physics","authors":[{"name":"Touati Djallel eddine","is_ca":true},{"name":"Aziz Oukaira","is_ca":true},{"name":"Ahmad Hassan","is_ca":true},{"name":"Yvon Savaria","is_ca":true},{"name":"Ahmed Lakhssassi","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04558490358198759,"gpt":0.2765045196547829,"spread":0.2309196160727953,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002261763,0.0004272505,0.000294189,0.0003666551,0.0002558371,0.0004800279,0.0005406118,0.0005724276,0.002438756],"category_scores_gemma":[0.0004286224,0.0002436674,0.0006500946,0.0002941873,0.0004276498,0.0005812207,0.0004812029,0.0004123797,0.0006158615],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005943445,"about_ca_system_score_gemma":0.0004941944,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00132631,"about_ca_topic_score_gemma":0.001745726,"domain_scores_codex":[0.9999006,0.00002323935,0.000003050604,0.00001544374,0.00004149845,0.00001613522],"domain_scores_gemma":[0.999895,0.00004413399,0.00001555686,0.00001435666,0.00002541847,0.000005489408],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00005293757,0.00003725455,0.0006540288,0.0001368068,0.00003045416,0.0001166159,0.0001544762,0.8888743,0.06147217,0.0366831,0.000866269,0.0109216],"study_design_scores_gemma":[0.000001530186,0.0000176606,0.0001028342,0.000006145769,0.000004426352,0.0000156634,0.00001241456,0.9944817,0.002730451,0.001385573,0.001237501,0.000004069867],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.0658782,0.0006274754,0.9166017,0.0001086655,0.00005968104,0.00005741166,0.0001589462,0.0006316889,0.01587628],"genre_scores_gemma":[0.9394797,0.0007353185,0.04943456,0.00006297943,0.00003314541,0.0002022261,0.0001896263,0.0001777705,0.009684587],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.002438756,"threshold_uncertainty_score":0.008158445,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2196069668","doi":"10.1109/tim.2015.2477240","title":"Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing Capacitive Coupling","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Instrumentation and Measurement","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Windsor","funders":"CMC Microsystems","keywords":"Through-silicon via; Capacitive coupling; Capacitive sensing; Materials science; Electronic engineering; Three-dimensional integrated circuit; CMOS; Integrated circuit; Insertion loss; Coupling (piping); Wafer; Optoelectronics; Signal integrity; Electrical engineering; Engineering; Printed circuit board; Voltage","authors":[{"name":"Iftekhar Basith","is_ca":true},{"name":"Rashid Rashidzadeh","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.1195598470326332,"gpt":0.2842163010423921,"spread":0.1646564540097589,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002428037,0.000372189,0.0002551132,0.0005196366,0.0002591501,0.0006010228,0.001026794,0.0006344289,0.001194053],"category_scores_gemma":[0.001329763,0.0001878972,0.000216303,0.0003401079,0.0005041804,0.001121276,0.0009458097,0.0003093905,0.0002480266],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003424485,"about_ca_system_score_gemma":0.0002741769,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002720511,"about_ca_topic_score_gemma":0.0004584193,"domain_scores_codex":[0.9995093,0.00006663871,0.00002183798,0.00008286522,0.0002766798,0.00004262697],"domain_scores_gemma":[0.9988883,0.0003327361,0.0002602784,0.0002736633,0.0001865432,0.00005842677],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001427682,0.00005474767,0.002275354,0.0001654124,0.00003534189,0.0004424079,0.0002727588,0.002385772,0.9390485,0.004446618,0.0008808529,0.04984952],"study_design_scores_gemma":[0.00005384477,0.001099765,0.005370093,0.00002789743,0.00005544359,0.001814446,0.0001813416,0.06923693,0.9053737,0.003094013,0.01362483,0.00006756804],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5705841,0.001513334,0.4178314,0.0004401243,0.0002631134,0.0002255178,0.0002223999,0.002153987,0.006766215],"genre_scores_gemma":[0.9805853,0.0001286115,0.01814883,0.00008664409,0.00002997914,0.00004096209,0.00004419683,0.00001996931,0.000915529],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001194053,"threshold_uncertainty_score":0.003994524,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4290755476","doi":"10.3390/s22155904","title":"Towards Real-Time Monitoring of Thermal Peaks in Systems-on-Chip (SoC)","year":2022,"lang":"en","type":"article","venue":"Sensors","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Université du Québec en Outaouais; Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Chip; Field-programmable gate array; Thermal; Integrated circuit; System on a chip; Gate array; Computer science; Electronic circuit; Electronic engineering; Computer hardware; Materials science; Embedded system; Electrical engineering; Engineering; Optoelectronics; Physics; Telecommunications","authors":[{"name":"Aziz Oukaira","is_ca":true},{"name":"Ahmad Hassan","is_ca":true},{"name":"Mohamed Ali","is_ca":true},{"name":"Yvon Savaria","is_ca":true},{"name":"Ahmed Lakhssassi","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01368944135687246,"gpt":0.2168812680898269,"spread":0.2031918267329544,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003455003,0.0006020462,0.0002698344,0.0006963093,0.0001201607,0.0005311506,0.0004543267,0.0004239345,0.0009619091],"category_scores_gemma":[0.0007680422,0.0001841789,0.0001258287,0.0004514851,0.0002522856,0.000573381,0.0002854499,0.0004270937,0.0003639318],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002268759,"about_ca_system_score_gemma":0.0001967747,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003274042,"about_ca_topic_score_gemma":0.0006878853,"domain_scores_codex":[0.9995475,0.00006576581,0.00001376892,0.00008989464,0.0002534656,0.00002947024],"domain_scores_gemma":[0.9994988,0.0001225708,0.0001021427,0.00007189883,0.0001842888,0.00002023815],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002087835,0.00005986015,0.002859807,0.0003256376,0.00003656077,0.0001324969,0.0001868313,0.007152264,0.8014546,0.001634595,0.001445805,0.1845028],"study_design_scores_gemma":[0.00002011782,0.0005207527,0.006377496,0.00003693943,0.0000422103,0.0004739793,0.0001047436,0.1352176,0.8463315,0.0009556414,0.009866785,0.00005242307],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.1811076,0.002159852,0.806829,0.0001908434,0.0002148152,0.0000784575,0.0002686011,0.00479072,0.004360003],"genre_scores_gemma":[0.7669194,0.0005939802,0.2296416,0.0001036562,0.00004795772,0.00006174706,0.0001341147,0.0001808508,0.0023166],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.0009619091,"threshold_uncertainty_score":0.003217876,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2791036357","doi":"10.1088/1361-6439/aaa878","title":"Study on the mechanism of Si–glass–Si two step anodic bonding process","year":2018,"lang":"en","type":"article","venue":"Journal of Micromechanics and Microengineering","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"University of Waterloo; National Natural Science Foundation of China","keywords":"Anodic bonding; Anode; Mechanism (biology); Materials science; Process (computing); Silicon; Optoelectronics; Chemistry; Computer science; Physical chemistry; Physics; Electrode","authors":[{"name":"Lifang Hu","is_ca":false},{"name":"Hao Wang","is_ca":false},{"name":"Yongzhi Xue","is_ca":false},{"name":"Fangrong Shi","is_ca":false},{"name":"Shaoping Chen","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01224875648229883,"gpt":0.2265101055769904,"spread":0.2142613490946915,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002497613,0.0004621302,0.0003119183,0.0003012065,0.0002725672,0.0002439249,0.0007088829,0.0006020089,0.002323039],"category_scores_gemma":[0.0003167716,0.000414653,0.0004686371,0.0001533565,0.0002237427,0.0006016931,0.0003371819,0.0004961575,0.0004774152],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001838883,"about_ca_system_score_gemma":0.0002221993,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000528108,"about_ca_topic_score_gemma":0.000529176,"domain_scores_codex":[0.9997894,0.00001658441,0.000007679453,0.0000450875,0.00009614797,0.00004511839],"domain_scores_gemma":[0.9998555,0.00004793306,0.00002462232,0.00001525588,0.00004479244,0.00001175462],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00004062451,0.00004250832,0.0003815757,0.0003803457,0.00003883004,0.0002733148,0.00009908999,0.0007028375,0.9910645,0.001251216,0.000196585,0.005528593],"study_design_scores_gemma":[0.00002255962,0.0002651869,0.00252336,0.00001394124,0.00004370199,0.0002913792,0.00008178726,0.01396353,0.9800015,0.0004510423,0.002321407,0.00002061835],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9582003,0.003964222,0.03206493,0.0002525513,0.0001634237,0.0001991165,0.0001190129,0.0002490664,0.004787212],"genre_scores_gemma":[0.9824389,0.001480784,0.0122643,0.00007721184,0.00002134053,0.00008994651,0.00007042646,0.0000167857,0.003540299],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002323039,"threshold_uncertainty_score":0.007771313,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2063069455","doi":"10.1016/j.microrel.2003.08.013","title":"Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements","year":2003,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Soldering; Photoluminescence; Optoelectronics; Laser; Diode; Finite element method; Silicon; Polarization (electrochemistry); Semiconductor laser theory; Composite material; Optics; Structural engineering; Chemistry; Physics; Engineering","authors":[{"name":"Mark A. Fritz","is_ca":true},{"name":"Daniel T. Cassidy","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02913575713163789,"gpt":0.2570071989924409,"spread":0.227871441860803,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003350842,0.0004002364,0.0003469106,0.001072807,0.0003923745,0.0004988641,0.0006077147,0.0006470677,0.001252111],"category_scores_gemma":[0.001176597,0.0004472672,0.0002088227,0.0008928585,0.0003279868,0.0007653466,0.0002796097,0.0006937592,0.0006007679],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003227607,"about_ca_system_score_gemma":0.0003190572,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000967976,"about_ca_topic_score_gemma":0.002930862,"domain_scores_codex":[0.9997278,0.00003752284,0.00001518882,0.0000549658,0.0001286045,0.00003598275],"domain_scores_gemma":[0.9993155,0.0002719765,0.0001359354,0.0001004294,0.0001507897,0.00002540931],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001759735,0.00005945171,0.005815319,0.00008944528,0.00002069092,0.00008014688,0.00009035483,0.001384559,0.9717736,0.0003927531,0.0002058971,0.01991173],"study_design_scores_gemma":[0.00001130213,0.00009492876,0.02332657,0.00001604372,0.00003761535,0.0001559485,0.00006587511,0.01662306,0.9585615,0.000304141,0.0007788895,0.00002410481],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9519826,0.000624983,0.04347521,0.00009133986,0.00002668479,0.00004170934,0.0006731033,0.0004986666,0.002585613],"genre_scores_gemma":[0.9842969,0.0004372164,0.01387495,0.00003237834,0.00001097291,0.00006279381,0.000426913,0.00007478856,0.0007830094],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001252111,"threshold_uncertainty_score":0.004188716,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4212833482","doi":"10.1002/047134608x.w8433","title":"Wafer‐Scale Integration","year":2022,"lang":"en","type":"other","venue":"Wiley Encyclopedia of Electrical and Electronics Engineering","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"","keywords":"Wafer; Interconnection; Scalability; Wafer-scale integration; System integration; Scale (ratio); Chip; Computer science; Key (lock); Systems engineering; Scaling; Chip-scale package; Integration platform; Embedded system; Nanotechnology; Engineering; Materials science; Telecommunications; Physics; Database; Operating system","authors":[{"name":"Yousef Safari","is_ca":true},{"name":"Boris Vaisband","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.002490535453082054,"gpt":0.1669719437089376,"spread":0.1644814082558555,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002231045,0.0006432732,0.0004097239,0.0006397238,0.0003091366,0.001426958,0.0009273204,0.0007962883,0.01981718],"category_scores_gemma":[0.0003020899,0.0002851613,0.0005253822,0.0007020613,0.0001645403,0.001104237,0.001335582,0.0006900033,0.01561752],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006328495,"about_ca_system_score_gemma":0.0004677839,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001065705,"about_ca_topic_score_gemma":0.001357471,"domain_scores_codex":[0.9996263,0.00002179983,0.00001483557,0.00007605385,0.0002155512,0.00004549051],"domain_scores_gemma":[0.9998525,0.00001334287,0.00001641336,0.0000391401,0.00006657297,0.00001186359],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00007744849,0.0001268125,0.0009394163,0.001827514,0.0001046707,0.0008261291,0.0001462991,0.005132376,0.3045032,0.06400242,0.1125091,0.5098046],"study_design_scores_gemma":[0.00001889552,0.0001367304,0.001048204,0.0001604004,0.00003955695,0.0007249497,0.00007617962,0.006724117,0.07156589,0.006533514,0.9129394,0.00003233792],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.03435621,0.05340848,0.1412614,0.001900246,0.005256686,0.0005825871,0.00296743,0.004475176,0.7557917],"genre_scores_gemma":[0.4355903,0.07995469,0.139996,0.002873384,0.00125711,0.0008256359,0.008180182,0.0009515131,0.3303712],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.01981718,"threshold_uncertainty_score":0.06629503,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2040339639","doi":"10.1109/tdmr.2015.2401035","title":"Study of Near-Surface Stresses in Silicon Around Through-Silicon Vias at Elevated Temperatures by Raman Spectroscopy and Simulations","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Device and Materials Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Silicon; Stress (linguistics); Raman spectroscopy; Thermal expansion; Shrinkage; Composite material; Through-silicon via; Spectroscopy; Optoelectronics; Optics","authors":[{"name":"Ye Zhu","is_ca":true},{"name":"Jiye Zhang","is_ca":false},{"name":"Hong Yu Li","is_ca":false},{"name":"Chuan Seng Tan","is_ca":false},{"name":"Guangrui Xia","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01968514828641314,"gpt":0.2652793448116388,"spread":0.2455941965252256,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001253823,0.0002293991,0.0002531486,0.0002658077,0.0002139971,0.0003023709,0.000309149,0.0003386794,0.0007326126],"category_scores_gemma":[0.0004382801,0.0001948274,0.0003438327,0.0002016976,0.0004033473,0.000283177,0.0001370614,0.0001804141,0.00009343318],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004136287,"about_ca_system_score_gemma":0.0003923826,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.005268998,"about_ca_topic_score_gemma":0.004118231,"domain_scores_codex":[0.9999408,0.000007640704,0.0000023577,0.000009985468,0.00002278101,0.00001643193],"domain_scores_gemma":[0.9998577,0.00005825924,0.0000284704,0.00001363392,0.00003198786,0.000009965783],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00005193681,0.0000327394,0.002930067,0.0000379888,0.00001823237,0.0001341909,0.00008754242,0.9543664,0.03820101,0.001659973,0.00008569712,0.002394209],"study_design_scores_gemma":[0.000007169687,0.00004370144,0.002174272,0.000003938617,0.000005887042,0.00001754031,0.00002841462,0.9919722,0.005233273,0.0003093246,0.0001980512,0.00000626664],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9906039,0.00006433028,0.00652347,0.0000342363,0.000005560045,0.00001393903,0.00009185092,0.00006871842,0.002593976],"genre_scores_gemma":[0.9980209,0.00004841532,0.001459586,0.000004568014,0.000001839986,0.00001224149,0.00004002385,0.00001055995,0.0004019429],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.005268998,"threshold_uncertainty_score":0.01047665,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4283710572","doi":"10.1109/isqed54688.2022.9806286","title":"Integrated Power Delivery Methodology for 3D ICs","year":2022,"lang":"en","type":"article","venue":"2022 23rd International Symposium on Quality Electronic Design (ISQED)","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Nature","keywords":"Three-dimensional integrated circuit; Parasitic extraction; Power network design; Integrated circuit; Chip; Electronic engineering; Computer science; Power domains; Power management; Voltage; Power (physics); Electrical engineering; Engineering","authors":[{"name":"Yousef Safari","is_ca":true},{"name":"Boris Vaisband","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05610639359177479,"gpt":0.3040692019487737,"spread":0.247962808356999,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000300854,0.0005235206,0.0002979104,0.0006009773,0.000289017,0.0009877237,0.001035852,0.0006368334,0.003936011],"category_scores_gemma":[0.0004540503,0.0003367914,0.0005329786,0.0003626914,0.0003716782,0.0006847287,0.0009066309,0.0006812055,0.001286843],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005618554,"about_ca_system_score_gemma":0.0005884044,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000424479,"about_ca_topic_score_gemma":0.0005643938,"domain_scores_codex":[0.9995943,0.00004138078,0.00001658288,0.00005604616,0.0002586299,0.00003322475],"domain_scores_gemma":[0.9998474,0.00003121758,0.00002464973,0.00003579803,0.00005443307,0.000006365712],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00004988095,0.0001143809,0.0004007741,0.0008153822,0.00008460189,0.0004660147,0.0002819262,0.1188443,0.3607929,0.2100942,0.006224318,0.3018313],"study_design_scores_gemma":[0.00004104532,0.0004757058,0.0005565971,0.0001285483,0.00009086748,0.001211407,0.00009891766,0.5461513,0.2129506,0.04336093,0.1948709,0.00006317088],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.004905617,0.0009267375,0.9813842,0.0001114092,0.0001087925,0.00009938105,0.00006462848,0.000732428,0.01166681],"genre_scores_gemma":[0.2254193,0.002096095,0.7552171,0.000280086,0.00009657843,0.0003874695,0.0002886864,0.0002901939,0.01592445],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.003936011,"threshold_uncertainty_score":0.01316732,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2114029889","doi":"10.1109/impact.2012.6420220","title":"Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay","year":2012,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of British Columbia","funders":"","keywords":"Capacitance; Miniaturization; Scaling; Interconnection; Stress (linguistics); Materials science; Dimension (graph theory); Electronic engineering; Transmission (telecommunications); SIGNAL (programming language); Computer science; Engineering; Telecommunications; Nanotechnology; Electrode; Physics","authors":[{"name":"K. Ghosh","is_ca":false},{"name":"Jun Zhang","is_ca":false},{"name":"L. Zhang","is_ca":false},{"name":"Yan Dong","is_ca":true},{"name":"H.Y. Li","is_ca":false},{"name":"Chung-An Tan","is_ca":false},{"name":"Guangrui Xia","is_ca":true},{"name":"Chuan Seng Tan","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.027046138112824,"gpt":0.2409879020778878,"spread":0.2139417639650638,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004380598,0.0006982114,0.000498852,0.000651506,0.0006586695,0.000880373,0.0007748068,0.0005024998,0.002519166],"category_scores_gemma":[0.0009849914,0.000224738,0.0002771534,0.0004405901,0.0003511747,0.001081666,0.0007143799,0.0006493141,0.0009910733],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006189641,"about_ca_system_score_gemma":0.0007813768,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005863198,"about_ca_topic_score_gemma":0.001253903,"domain_scores_codex":[0.9996974,0.0000342442,0.00002037521,0.00006066345,0.0001433368,0.0000439643],"domain_scores_gemma":[0.9993006,0.00009546847,0.0001220953,0.0001070165,0.0003168555,0.00005791786],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001038027,0.0002011264,0.001238008,0.000228505,0.00001998285,0.0003556015,0.0002861817,0.009430706,0.8906532,0.02134308,0.002511065,0.07362875],"study_design_scores_gemma":[0.00008319072,0.00208049,0.004813979,0.0001164954,0.0000807243,0.001215897,0.0006141611,0.07807943,0.8089494,0.02005717,0.08380284,0.0001061232],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.4979484,0.005615928,0.4210602,0.0027722,0.0007378721,0.0009702015,0.0002463401,0.002263027,0.06838585],"genre_scores_gemma":[0.8705199,0.001374696,0.1196926,0.0002668479,0.0001535699,0.0003162421,0.0001076319,0.0002163964,0.007352096],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002519166,"threshold_uncertainty_score":0.008427441,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2319599348","doi":"10.1109/tcpmt.2014.2377375","title":"Capacitance and Conductance of Through Silicon Vias With Consideration of Multilayer Media and Different Shapes","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Capacitance; Conductance; Materials science; RADIUS; Silicon; Optoelectronics; Acoustics; Optics; Physics; Condensed matter physics; Computer science; Electrode","authors":[{"name":"Sheng Liu","is_ca":false},{"name":"Wanchun Tang","is_ca":false},{"name":"Wei Zhuang","is_ca":false},{"name":"Gui Wang","is_ca":false},{"name":"Y.L. Chow","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03071623851263045,"gpt":0.2196587963073834,"spread":0.188942557794753,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001780766,0.0005482425,0.0002939336,0.0006570688,0.0001807985,0.0004357866,0.0002452153,0.0005092873,0.0004954547],"category_scores_gemma":[0.001026268,0.0001912912,0.0005151665,0.0005451153,0.0003508996,0.0009886082,0.0002373706,0.0001397914,0.00008574459],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006865538,"about_ca_system_score_gemma":0.0005639005,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002370497,"about_ca_topic_score_gemma":0.003231799,"domain_scores_codex":[0.9998017,0.00002930664,0.000006910904,0.00004281507,0.000085216,0.00003411393],"domain_scores_gemma":[0.9997535,0.0001015541,0.0000420108,0.00003177035,0.00005814861,0.00001304503],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0002295841,0.00006084893,0.007025059,0.0002287678,0.0001539351,0.001167018,0.0003281297,0.3725726,0.574228,0.01491573,0.000594339,0.02849593],"study_design_scores_gemma":[0.00002684912,0.0003117681,0.007640027,0.0000287532,0.0001430543,0.0007429057,0.0001630686,0.8918194,0.09203867,0.003462252,0.003547696,0.00007556525],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9203303,0.0007370081,0.06994406,0.0001352963,0.00005782835,0.00003448135,0.0002065504,0.0003724917,0.008182105],"genre_scores_gemma":[0.9925248,0.000273617,0.006462859,0.00001125909,0.000008035651,0.00001025369,0.00004547915,0.00002102448,0.0006426697],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002370497,"threshold_uncertainty_score":0.004981339,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2053161408","doi":"10.2320/matertrans.m2009314","title":"A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging","year":2010,"lang":"en","type":"article","venue":"MATERIALS TRANSACTIONS","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"National Research Foundation of Korea; National Research Foundation","keywords":"Bumping; Materials science; Electroplating; Wafer; Etching (microfabrication); Polishing; Layer (electronics); Metallurgy; Deep reactive-ion etching; Soldering; Chemical-mechanical planarization; Reactive-ion etching; Silicon; Composite material; Optoelectronics","authors":[{"name":"Jiheon Jun","is_ca":false},{"name":"Inrak Kim","is_ca":false},{"name":"M. Mayer","is_ca":true},{"name":"Y. Zhou","is_ca":true},{"name":"Seung‐Boo Jung","is_ca":false},{"name":"Jae Pil Jung","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006401410241892618,"gpt":0.2173936218425649,"spread":0.2109922116006723,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000202879,0.0005394416,0.000325042,0.0003234457,0.0001399916,0.0003316613,0.0004864974,0.0004105457,0.0009770702],"category_scores_gemma":[0.0002695041,0.0002428484,0.0003931179,0.0002247498,0.0002321025,0.0004156352,0.0003223357,0.0005111794,0.0003773072],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001631601,"about_ca_system_score_gemma":0.0001932825,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001673016,"about_ca_topic_score_gemma":0.0003168861,"domain_scores_codex":[0.9996414,0.00002030371,0.00002158612,0.00006633705,0.0002185552,0.00003179373],"domain_scores_gemma":[0.9998133,0.00002720967,0.00004422256,0.00005384459,0.00004372144,0.00001777094],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001701427,0.00002627673,0.0001910655,0.0001040616,0.000008161076,0.00006679397,0.00002320083,0.0001574909,0.9899275,0.0001192874,0.0001299652,0.009229197],"study_design_scores_gemma":[0.00001838137,0.0006630056,0.003575812,0.000007465745,0.0000322164,0.0008881405,0.00001586684,0.00226575,0.9868352,0.00005810728,0.005623047,0.00001702699],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8725119,0.003443643,0.1153665,0.0001246927,0.0002982015,0.0003030666,0.0003910058,0.001137199,0.006423901],"genre_scores_gemma":[0.8671118,0.001048096,0.1265043,0.00008146459,0.00004477962,0.0001265356,0.0003508495,0.0001027992,0.004629361],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009770702,"threshold_uncertainty_score":0.0032686,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2344622367","doi":"10.1109/tvlsi.2015.2496312","title":"A Mismatch-Insensitive Skew Compensation Architecture for Clock Synchronization in 3-D ICs","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Dalhousie University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Jitter; Clock skew; Skew; Computer science; Electronic engineering; Network topology; Synchronization (alternating current); Clock domain crossing; Compensation (psychology); CMOS; Static timing analysis; Topology (electrical circuits); Clock signal; Detector; Synchronous circuit; Engineering; Electrical engineering; Telecommunications","authors":[{"name":"Tejinder Singh Sandhu","is_ca":true},{"name":"Kamal El‐Sankary","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01665280393413697,"gpt":0.2273678569011584,"spread":0.2107150529670214,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001093221,0.0002231243,0.0001382213,0.0002884884,0.0002948039,0.0002820717,0.0005514325,0.0002484041,0.0006483914],"category_scores_gemma":[0.0002362696,0.0001293936,0.0001494496,0.0002931251,0.0001383748,0.0003781664,0.000198961,0.0001995397,0.0002125099],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004016857,"about_ca_system_score_gemma":0.0003965707,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009288166,"about_ca_topic_score_gemma":0.002363299,"domain_scores_codex":[0.9998996,0.00001460343,0.000008502485,0.00002460376,0.00003908253,0.00001358095],"domain_scores_gemma":[0.9998866,0.00001338268,0.00003295958,0.00002448883,0.00003145037,0.0000109873],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002409534,0.00005563147,0.0016478,0.0001082098,0.00003337301,0.0001946594,0.0001175281,0.02583739,0.8395658,0.007082241,0.001558173,0.1235583],"study_design_scores_gemma":[0.0000683055,0.001407011,0.004669842,0.00003512168,0.00009058135,0.001041141,0.0000561046,0.4036432,0.5658748,0.002810054,0.02022366,0.00008012193],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.4015219,0.001074432,0.5884256,0.0002557099,0.0001704923,0.00009635532,0.0002023582,0.00232734,0.005925788],"genre_scores_gemma":[0.9020152,0.0001750058,0.09588534,0.0001045923,0.00003942972,0.00002676134,0.00009749463,0.00003040449,0.001625763],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.0009288166,"threshold_uncertainty_score":0.002914488,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}