{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":238,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":238,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12"},"query_hash":"eaa7cddf67d7","filters":{"topic":"3D IC and TSV technologies"}},"results":[{"id":"W2135369720","doi":"10.1109/ted.2005.850668","title":"On-chip antennas in silicon ICs and their application","year":2005,"lang":"en","type":"article","venue":"IEEE Transactions on Electron Devices","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":261,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"CMOS; Electronic circuit; Chip; Electronic engineering; Integrated circuit; Wireless; Radio frequency; System in package; Key (lock); System on a chip; Electrical engineering; Computer science; Engineering; Embedded system; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.006284640946332033,"gpt":0.2083154310722896,"spread":0.2020307901259576,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000479438,0.0001339987,0.0001140572,0.0001676565,0.0000489897,0.00001612292,0.0000822298,0.00009843273,0.000008383559],"category_scores_gemma":[8.494677e-7,0.0001181381,0.00002613507,0.0001948431,0.00002692921,0.000109021,3.34009e-7,0.0002749074,0.00003093085],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00006501927,"about_ca_system_score_gemma":0.000006389946,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001392251,"about_ca_topic_score_gemma":0.0007321698,"domain_scores_codex":[0.9994561,0.000008135972,0.0001232269,0.0001541097,0.00005318021,0.0002052453],"domain_scores_gemma":[0.9997568,0.00006022032,0.0000144331,0.0001372616,0.000007883062,0.00002342527],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005897166,0.000253917,0.0002379033,0.0000828444,0.00008359917,0.000001356046,0.0005462999,0.1212679,0.07953122,0.00159295,0.0001010231,0.796242],"study_design_scores_gemma":[0.0005731624,0.0002597082,0.001990009,0.00005441894,0.00001612378,0.00001205996,0.0002430877,0.1827475,0.8089356,0.001371627,0.003395127,0.0004015553],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8687816,0.0005923439,0.1288824,0.000313111,0.00004207017,0.000155361,0.000004648404,0.0005130096,0.0007154532],"genre_scores_gemma":[0.9992269,0.0004679703,0.00008421411,0.00008540462,0.00001643898,0.0000625864,0.000001132156,0.00001847015,0.00003690458],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7958404,"threshold_uncertainty_score":0.4817532,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3188178661","doi":"10.1109/isca52012.2021.00014","title":"Pioneering Chiplet Technology and Design for the AMD EPYC™ and Ryzen™ Processor Families : Industrial Product","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":168,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Product (mathematics); Product design; Computer science; Manufacturing engineering; Computer architecture; Engineering; Mathematics","retraction":null,"screen_n_in":null,"score":{"opus":0.03364821018964429,"gpt":0.2111666268012855,"spread":0.1775184166116412,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001021734,0.0001208575,0.0001421648,0.0001014192,0.0001011528,0.00004172687,0.00009952016,0.0001356107,0.000005560062],"category_scores_gemma":[0.00029666,0.00008381615,0.00001328075,0.0003066042,0.0001129965,0.00007158684,0.0000862506,0.0001730045,9.729832e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00000990685,"about_ca_system_score_gemma":0.00002089518,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00000214683,"about_ca_topic_score_gemma":0.000007037142,"domain_scores_codex":[0.9994521,0.000004707347,0.0001154197,0.0001845565,0.00004844882,0.0001947498],"domain_scores_gemma":[0.9996443,0.0001127763,0.00001299991,0.0001807256,0.00003261413,0.00001655359],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005539367,0.00005024519,0.005675996,0.0005610294,0.0004374153,0.00002078277,0.0008396889,0.004350237,0.05095736,0.03174257,0.01089076,0.8944185],"study_design_scores_gemma":[0.002344307,0.0002402199,0.002064635,0.0001222594,0.0001405887,0.00023382,0.008519026,0.03347231,0.8591931,0.01816617,0.07463372,0.0008697964],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7630498,0.01954726,0.2027746,0.007891214,0.0005636475,0.001644614,0.00001507322,0.003362358,0.001151508],"genre_scores_gemma":[0.9903413,0.0008753057,0.008259938,0.00001642442,0.00006604727,0.0001634377,0.000001425263,0.00002019781,0.0002559055],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.8935487,"threshold_uncertainty_score":0.3417923,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2159563595","doi":"10.1149/2.007312jss","title":"Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding","year":2013,"lang":"en","type":"article","venue":"ECS Journal of Solid State Science and Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":156,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"","keywords":"Materials science; X-ray photoelectron spectroscopy; Wafer; Silicon; Reactive-ion etching; Silicon dioxide; Oxygen; Anodic bonding; Chemical engineering; Relative humidity; Humidity; Etching (microfabrication); Analytical Chemistry (journal); Nanotechnology; Composite material; Layer (electronics); Chemistry; Optoelectronics; Organic chemistry","retraction":null,"screen_n_in":null,"score":{"opus":0.01023634672878418,"gpt":0.2383324208805291,"spread":0.2280960741517449,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005747857,0.0001349382,0.0004456107,0.0009036883,0.000121343,0.00004267952,0.0003163696,0.0001019529,0.000004335371],"category_scores_gemma":[0.0003183977,0.0001085555,0.00003775544,0.0009928023,0.0008226137,0.000395172,0.0001685709,0.0001866946,3.950216e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00004222503,"about_ca_system_score_gemma":0.0000348199,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001028287,"about_ca_topic_score_gemma":0.00002341999,"domain_scores_codex":[0.9989362,0.000007445695,0.000364788,0.0001924092,0.0001887391,0.0003104279],"domain_scores_gemma":[0.9992064,0.000104386,0.0001598443,0.0001887075,0.0002637531,0.00007688087],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001946771,0.00003557675,0.04920983,0.00009851981,0.0005858223,0.00001567152,0.0003970148,0.003190048,0.9171491,0.001260138,0.0002762825,0.02776256],"study_design_scores_gemma":[0.0007308597,0.0004049633,0.0222836,0.00005172792,0.0002803858,0.0001054481,0.001775767,0.04387796,0.9199704,0.009480516,0.0007394286,0.0002989169],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9975277,0.001184988,0.0003820685,0.0005406416,0.00006878709,0.0001247771,0.0000169785,0.0000734359,0.00008059543],"genre_scores_gemma":[0.9975401,0.001260817,0.001138344,0.000005554389,0.000005345006,0.000003647179,2.419839e-7,0.000007970859,0.00003793748],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.04068791,"threshold_uncertainty_score":0.4426767,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2805887040","doi":"10.3390/mi9060287","title":"3D Integrated Circuit Cooling with Microfluidics","year":2018,"lang":"en","type":"review","venue":"Micromachines","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":77,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"York University","funders":"","keywords":"Microfluidics; Thermal management of electronic devices and systems; Three-dimensional integrated circuit; Integrated circuit; Thermal; Electronics; Chip; Engineering; Mechanical engineering; Systems engineering; Nanotechnology; Materials science; Electrical engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.02648025340362146,"gpt":0.2496548920570798,"spread":0.2231746386534583,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00009638754,0.0006706584,0.001286336,0.0002865979,0.00008412005,0.00007685074,0.0005716428,0.0005078854,0.00005285672],"category_scores_gemma":[0.00002648726,0.0004505587,0.0001788274,0.0005038508,0.0001703805,0.00008046076,0.0000805574,0.0006271116,0.0003322104],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001131899,"about_ca_system_score_gemma":0.00007980965,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002488113,"about_ca_topic_score_gemma":0.00001204237,"domain_scores_codex":[0.9986625,0.00002760477,0.0004382824,0.0003648275,0.0001023257,0.0004044755],"domain_scores_gemma":[0.9991902,0.00005964856,0.00009787944,0.0005469246,0.000054779,0.00005061126],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.000001871165,0.00001333786,0.00000635481,0.00853505,0.0003902367,0.00004206189,0.00003886121,0.000002717797,0.0001121223,0.00004004384,0.006462552,0.9843548],"study_design_scores_gemma":[0.00009531291,0.00003676787,6.073196e-7,0.006677014,0.0003501595,0.0002397816,0.00001048993,0.00003301687,0.00018108,0.00001998823,0.9917876,0.0005682409],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"review","genre_gemma":"review","genre_scores_codex":[0.0001324105,0.9930779,0.002374706,0.000001812347,0.0003916149,0.0003363802,0.0001301796,0.001936473,0.001618557],"genre_scores_gemma":[0.00004630411,0.9976032,0.001357573,0.000008999978,0.0001879353,0.0000503027,0.0002107582,0.0001885324,0.0003463908],"genre_candidate":"review","genre_consensus":"review","teacher_disagreement_score":0.985325,"threshold_uncertainty_score":0.9997946,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2555318774","doi":"10.1145/1289816.1289846","title":"Three-dimensional multiprocessor system-on-chip thermal optimization","year":2007,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":65,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Queen's University","funders":"Northwestern University","keywords":"MPSoC; Multiprocessing; Three-dimensional integrated circuit; Computer science; Frequency scaling; Scheduling (production processes); System on a chip; Chip; Embedded system; Power density; Parallel computing; Voltage; Power (physics); Engineering; Electrical engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.01008166410651781,"gpt":0.2012799681001117,"spread":0.1911983039935939,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009193222,0.00009583646,0.00008030223,0.00007057705,0.00004073193,0.00001008702,0.00008737465,0.0000957911,0.00006482757],"category_scores_gemma":[0.00001295615,0.00007449744,0.00002306264,0.0001043682,0.00001914349,0.00005631932,0.00001598156,0.00008972159,0.0001019158],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00003561476,"about_ca_system_score_gemma":0.000003997352,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000007354114,"about_ca_topic_score_gemma":0.00001162573,"domain_scores_codex":[0.9994951,0.000001363164,0.0001222028,0.00009558834,0.0001098702,0.0001758323],"domain_scores_gemma":[0.9997712,0.00003957942,0.00001225584,0.0001279332,0.00002234146,0.00002666608],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00001039448,0.00001323859,0.0004531966,0.00004078122,0.00001823053,0.000009105616,0.00001429405,0.9868634,0.0008485371,0.00460061,0.0005303237,0.006597942],"study_design_scores_gemma":[0.0002952035,0.00003035827,0.002225026,0.00003786313,0.000005677939,0.000007661624,0.0001051905,0.9721707,0.02476427,0.00004292038,0.0001423143,0.0001728551],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.3010372,0.0001477425,0.6468977,0.00004167938,0.0003082294,0.0001445823,0.000002127202,0.003345208,0.04807558],"genre_scores_gemma":[0.9796903,0.000001289912,0.02013002,0.00002705592,0.00004612765,0.000005348023,0.000003677342,0.00001864346,0.00007759414],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.6786531,"threshold_uncertainty_score":0.3037917,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2158969233","doi":"10.1109/stherm.1992.172851","title":"Analysis of thermal vias in high density interconnect technology","year":2003,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":54,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Interconnection; Materials science; Thermal; Optoelectronics; Computer science; Electronic engineering; Electrical engineering; Telecommunications; Engineering; Physics","retraction":null,"screen_n_in":null,"score":{"opus":0.005842922069534908,"gpt":0.1899562530859673,"spread":0.1841133310164324,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006265014,0.00006426706,0.0002019627,0.0006202891,0.000005523538,0.00000203373,0.0000998395,0.0001172378,0.0001501243],"category_scores_gemma":[0.00004821605,0.00005524135,0.00004132215,0.001121164,0.00004544377,0.00002796009,0.00002089764,0.00009697525,0.00000824597],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002111114,"about_ca_system_score_gemma":0.00000289909,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00006075228,"about_ca_topic_score_gemma":0.0004180411,"domain_scores_codex":[0.9996328,0.000007100953,0.0001299273,0.00007942244,0.00003367571,0.0001170918],"domain_scores_gemma":[0.999752,0.00002128908,0.00001148155,0.0001956627,0.00001220717,0.00000739823],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000006417748,0.00008314398,0.7262577,0.00003408049,0.00143153,0.000032999,0.0002333388,0.0343025,0.0439807,0.1400821,0.0001107893,0.05344475],"study_design_scores_gemma":[0.0004492988,0.00006355289,0.2006895,0.00001451425,0.0002475858,0.000004593574,0.001453718,0.01770578,0.7732115,0.005518627,0.0003070206,0.0003342344],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9879525,0.0001441624,0.005297487,0.00002645235,0.00003429345,0.00003023963,7.185156e-7,0.000389123,0.006125003],"genre_scores_gemma":[0.9987898,0.0000260593,0.00113607,0.000006403777,9.449999e-7,0.000003339121,7.018307e-7,0.000005227436,0.00003142055],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7292309,"threshold_uncertainty_score":0.2252677,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3191072511","doi":"10.1109/ectc32696.2021.00034","title":"Direct Bonded Heterogeneous Integration (DBHi) Si Bridge","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":44,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interconnection; System in package; Integrated circuit packaging; Thermocompression bonding; Reliability (semiconductor); Chip; Three-dimensional integrated circuit; Computer science; Wire bonding; Materials science; Package on package; Electronic packaging; Joins; Quad Flat No-leads package; Mechanical engineering; Electronic engineering; Engineering; Adhesive; Layer (electronics); Power (physics); Composite material","retraction":null,"screen_n_in":null,"score":{"opus":0.01437083391184331,"gpt":0.2113010488287646,"spread":0.1969302149169213,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00001923802,0.00007546666,0.000087056,0.0000279802,0.00001923933,0.00002459657,0.0000578434,0.00006503403,0.0001681451],"category_scores_gemma":[0.00002941161,0.00006679902,0.00003751222,0.0001097965,0.00001213599,0.00004871947,0.00002426014,0.00006764434,0.00009859582],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002516471,"about_ca_system_score_gemma":0.000006399637,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000008003008,"about_ca_topic_score_gemma":0.00005551317,"domain_scores_codex":[0.9996449,0.000004691686,0.00008535058,0.00009503623,0.00005317397,0.0001168323],"domain_scores_gemma":[0.9997695,0.00001502216,0.000005419151,0.0001717356,0.0000203648,0.00001792948],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000009795717,0.0001207485,0.001676331,0.0001264627,0.0003085703,0.0005171393,0.0004743088,0.0101192,0.4499417,0.01670512,0.07252415,0.4474764],"study_design_scores_gemma":[0.00008632707,0.00001123778,0.0009178252,0.00000913807,0.00000616143,0.00003095559,0.00005175402,0.008998809,0.9792321,0.0004159999,0.01011239,0.0001273362],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.720719,0.001554559,0.03983653,0.0002599809,0.0004996702,0.00009198116,0.000007173688,0.004377299,0.2326537],"genre_scores_gemma":[0.9971255,0.0001194164,0.001287623,0.00005151991,0.00002341607,0.000007219648,0.00001151009,0.00001305916,0.001360756],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5292904,"threshold_uncertainty_score":0.2723985,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2073553220","doi":"10.1016/j.talanta.2010.05.001","title":"Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200°C","year":2010,"lang":"en","type":"article","venue":"Talanta","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":42,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; McMaster University","keywords":"Anodic bonding; Void (composites); Silicon; Plasma activation; Chemistry; Anode; Amorphous silicon; Amorphous solid; Reactive-ion etching; Plasma; Chemical engineering; Etching (microfabrication); Composite material; Layer (electronics); Crystalline silicon; Materials science; Crystallography; Physical chemistry; Electrode; Organic chemistry","retraction":null,"screen_n_in":null,"score":{"opus":0.01051066360440148,"gpt":0.232595561959583,"spread":0.2220848983551815,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007034334,0.0001454542,0.0002033269,0.00007893911,0.00004036641,0.00001292422,0.0003659074,0.00009880067,0.00006826794],"category_scores_gemma":[0.000086644,0.0001397629,0.00006373692,0.00005134375,0.00007297096,0.00008571341,0.0001674608,0.0002018362,0.00002890632],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00003470206,"about_ca_system_score_gemma":0.000007822905,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001272455,"about_ca_topic_score_gemma":0.000115962,"domain_scores_codex":[0.9992945,0.000002633421,0.0001932326,0.0001474796,0.00008636703,0.0002757635],"domain_scores_gemma":[0.999386,0.00007881655,0.00004335348,0.000435084,0.00001887692,0.0000379405],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00004462367,0.00002773229,0.002908288,0.0002065497,0.00009287442,0.00000686865,0.0001472486,0.0005400363,0.9320192,0.005437362,0.0546662,0.003903048],"study_design_scores_gemma":[0.0007169315,0.00005452635,0.0003639419,0.00002934227,0.00002024015,0.0000317778,0.0001646722,0.01592311,0.9652214,0.0007454574,0.01653238,0.0001962103],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9934761,0.00009834825,0.0008335038,0.00008095871,0.0004799773,0.0001823723,0.0001351726,0.0005300439,0.004183511],"genre_scores_gemma":[0.9979836,0.00001081071,0.0006546486,0.000003458082,0.00004731329,0.00002150884,0.00001406409,0.00003331696,0.00123129],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.03813382,"threshold_uncertainty_score":0.5699364,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2513352037","doi":"10.1109/jssc.2016.2596773","title":"A 0.3 pJ/bit 20 Gb/s/Wire Parallel Interface for Die-to-Die Communication","year":2016,"lang":"en","type":"article","venue":"IEEE Journal of Solid-State Circuits","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":41,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Die (integrated circuit); Transceiver; CMOS; Interposer; Transmitter; Electrical engineering; Electronic circuit; Silicon on insulator; Computer science; Materials science; Optoelectronics; Electronic engineering; Computer hardware; Channel (broadcasting); Silicon; Engineering; Nanotechnology; Layer (electronics)","retraction":null,"screen_n_in":null,"score":{"opus":0.02684802874997689,"gpt":0.273959809874317,"spread":0.2471117811243401,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003064861,0.0002036028,0.000367613,0.0002068618,0.00007683806,0.00003564537,0.00063954,0.0001176958,0.00001416367],"category_scores_gemma":[0.0001238944,0.0001503306,0.0001405965,0.00009606307,0.00007242873,0.00034441,0.00004597431,0.0002507262,0.00006896932],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001642142,"about_ca_system_score_gemma":0.00003673164,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000001990931,"about_ca_topic_score_gemma":0.00002208798,"domain_scores_codex":[0.9987167,0.0000247404,0.0005742343,0.0001244609,0.0001863972,0.0003734464],"domain_scores_gemma":[0.998871,0.0001792173,0.0002043703,0.0003831288,0.0002275207,0.0001348077],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001812686,0.0002056353,0.0007859065,0.0003666564,0.0009045421,0.0001011276,0.004179615,0.04581427,0.3151107,0.000386198,0.08818737,0.5437767],"study_design_scores_gemma":[0.01078221,0.002092574,0.004538278,0.00484056,0.0003276744,0.0005157034,0.002129905,0.006097696,0.6386253,0.04860136,0.278984,0.00246471],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5138699,0.003966285,0.4764435,0.002604139,0.001053257,0.0004562634,0.0001224099,0.0004110521,0.001073277],"genre_scores_gemma":[0.9951871,0.002680249,0.001307792,0.00006683333,0.0001081747,0.00002183353,9.953077e-7,0.00005291662,0.0005740823],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.541312,"threshold_uncertainty_score":0.6130304,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2042079275","doi":"10.1063/1.4807905","title":"Fast atom beam-activated n-Si/n-GaAs wafer bonding with high interfacial transparency and electrical conductivity","year":2013,"lang":"en","type":"article","venue":"Journal of Applied Physics","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":39,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Polytechnique Montréal","funders":"","keywords":"Materials science; Argon; Annealing (glass); Wafer; Atom (system on chip); Wafer bonding; Electrical resistivity and conductivity; Helium; Atomic physics; Optoelectronics; Composite material","retraction":null,"screen_n_in":null,"score":{"opus":0.009779548144638854,"gpt":0.1916496859880321,"spread":0.1818701378433932,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004136248,0.0001696721,0.0003055697,0.00006374492,0.00004588356,0.00004306135,0.0001233594,0.00009072034,0.00001713413],"category_scores_gemma":[0.000002172233,0.0001275694,0.00003718882,0.0002169528,0.00007596179,0.0002771238,0.00001598821,0.0004956552,0.000006449221],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00005544428,"about_ca_system_score_gemma":0.00001907639,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000005634551,"about_ca_topic_score_gemma":5.625197e-7,"domain_scores_codex":[0.9992958,0.000004257107,0.0002210974,0.0001010715,0.0001642674,0.0002135296],"domain_scores_gemma":[0.9996615,0.00003280651,0.00009417978,0.00009576706,0.00005250148,0.00006323458],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000121765,0.0001087385,0.0008985058,0.0000520989,0.0003151036,0.00001139454,0.000621788,0.006887094,0.9393929,0.01020898,0.000670419,0.04071119],"study_design_scores_gemma":[0.001466705,0.0003475824,0.005831079,0.00006515698,0.00009814718,0.00005624433,0.0004053724,0.002755458,0.9728894,0.01495872,0.0006751643,0.0004509364],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9843197,0.00004244793,0.01424274,0.00002744106,0.00007312414,0.0001086403,0.00000239248,0.000106672,0.001076848],"genre_scores_gemma":[0.9984646,0.0000295769,0.001325072,0.00001148405,0.0001259647,0.00000688115,0.000001191593,0.00002564909,0.000009535866],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.04026025,"threshold_uncertainty_score":0.520213,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2303696326","doi":"10.1109/tcad.2015.2474411","title":"TSV Extracted Equivalent Circuit Model and an On-Chip Test Solution","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":37,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Windsor","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Parametric statistics; Through-silicon via; Equivalent circuit; Electronic engineering; Chip; Void (composites); Parametric model; Electronic circuit; Realization (probability); Integrated circuit; Testability; Computer science; Circuit extraction; Engineering; Materials science; Reliability engineering; Electrical engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.08736034808519404,"gpt":0.2482283514382359,"spread":0.1608680033530418,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003375936,0.0003406945,0.0004485819,0.0003641662,0.0001098601,0.0001065397,0.0001862737,0.0002881088,0.000002801924],"category_scores_gemma":[0.00001206281,0.0002991549,0.00005302849,0.0002679047,0.0001074869,0.0002539194,0.000001666132,0.0003967596,0.000006850295],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001325573,"about_ca_system_score_gemma":0.00007234916,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00008980358,"about_ca_topic_score_gemma":0.000007930457,"domain_scores_codex":[0.9984673,0.0000881251,0.0005005167,0.0003650554,0.0002658537,0.0003131256],"domain_scores_gemma":[0.9989663,0.0001978578,0.00008762647,0.0003601756,0.0001856206,0.0002023776],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00002356502,0.0002442007,0.00001610828,0.0001182938,0.0001104846,0.00001075503,0.0005542132,0.9084819,0.02923814,0.0006463728,0.0003901357,0.06016585],"study_design_scores_gemma":[0.0007330776,0.001062798,0.00004220607,0.0003059597,0.00004442892,0.00007171151,0.0003500278,0.988736,0.007919132,0.0003885795,0.00002700793,0.0003191121],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.09786827,0.0003239419,0.8996861,0.00001271978,0.0006366679,0.0004396482,0.00007315122,0.0006969476,0.0002625714],"genre_scores_gemma":[0.9987003,0.0001408665,0.0009240924,0.00001549532,0.000045875,0.00005202696,0.000007059209,0.0000456434,0.00006869611],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.900832,"threshold_uncertainty_score":0.9999461,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2600443473","doi":"10.1063/1.4979173","title":"High performance 3D printed electronics using electroless plated copper","year":2017,"lang":"en","type":"article","venue":"AIP Advances","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":37,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Simon Fraser University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Inductor; Toroid; Materials science; Printed circuit board; Electromagnetic coil; Inductance; Copper; Plating (geology); 3d printed; Electronics; 3D printing; Core (optical fiber); Copper plating; Optoelectronics; Composite material; Electrical engineering; Layer (electronics); Metallurgy; Engineering; Biomedical engineering; Voltage; Plasma; Physics; Electroplating","retraction":null,"screen_n_in":null,"score":{"opus":0.0092826199899686,"gpt":0.2332239794015869,"spread":0.2239413594116183,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004711203,0.000153085,0.0001712561,0.0000495528,0.0002574784,0.00005583737,0.00037784,0.00009162044,0.0000141716],"category_scores_gemma":[0.00002595554,0.0001395911,0.00002363377,0.00006268811,0.00008586176,0.0004955492,0.00005174894,0.0002447859,0.00002578788],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00008246766,"about_ca_system_score_gemma":0.00001920308,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000007844177,"about_ca_topic_score_gemma":0.00002063995,"domain_scores_codex":[0.99923,0.00000381088,0.0001315863,0.0001536602,0.00009596383,0.0003850004],"domain_scores_gemma":[0.9994714,0.00001275057,0.00005780794,0.0004041141,0.00002900649,0.0000249679],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001418211,0.00009929235,0.06446926,0.0005054987,0.000415756,0.00004791139,0.0002061968,0.2157422,0.1980452,0.006640733,0.0007434028,0.5129427],"study_design_scores_gemma":[0.001063393,0.0002470039,0.01785968,0.0002148921,0.00005257907,0.00004530621,0.00007620318,0.3245938,0.6012396,0.001732676,0.05194455,0.0009302649],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9902413,0.003686619,0.003181996,0.00004611657,0.0002580524,0.00008437318,0.000002151686,0.0007192341,0.001780185],"genre_scores_gemma":[0.9934297,0.003723962,0.002677716,0.00001731368,0.0000448428,0.000009177344,0.000003023696,0.0000269985,0.00006723981],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5120124,"threshold_uncertainty_score":0.5692359,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2159359319","doi":"10.1109/mwsym.2006.249414","title":"Monolithic RF MEMS Switch Matrix Integration","year":2006,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":36,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Microelectromechanical systems; Materials science; Interconnection; Crossbar switch; Fabrication; Radio frequency; Clos network; Optoelectronics; Matrix (chemical analysis); Electronic engineering; Electrical engineering; Computer science; Engineering; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.006137921016087577,"gpt":0.2041444243341018,"spread":0.1980065033180142,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00002857484,0.00006635412,0.00006053444,0.00005156306,0.00001713723,0.00001867181,0.00006997567,0.00008151821,0.00006981331],"category_scores_gemma":[0.000005760865,0.00005283855,0.00002030712,0.00009745921,0.00001155554,0.00007132407,0.00001052285,0.00008648773,0.0001681092],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002541218,"about_ca_system_score_gemma":0.000002611674,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001397955,"about_ca_topic_score_gemma":0.00006828608,"domain_scores_codex":[0.999687,8.837829e-7,0.00009279414,0.00006099436,0.00004971246,0.0001086646],"domain_scores_gemma":[0.9998482,0.000008755117,0.000006234532,0.0001178365,0.00001053042,0.000008441059],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000006931347,0.00007154298,0.006625758,0.000117753,0.00006367239,0.00001886084,0.0001882063,0.0232868,0.2530085,0.4277564,0.1491402,0.1397153],"study_design_scores_gemma":[0.0003887679,0.00004322711,0.01109475,0.00003189545,0.00001630781,0.00001546675,0.0006153656,0.08954383,0.7910303,0.08255094,0.02414541,0.0005237279],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6313024,0.0006649938,0.1770072,0.0002958106,0.000261091,0.0001072119,0.000001635253,0.004382364,0.1859773],"genre_scores_gemma":[0.9956276,0.00002677188,0.001954541,0.000007346119,0.00004070841,0.000008607491,0.000004412118,0.00001033923,0.002319623],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5380217,"threshold_uncertainty_score":0.216076,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2029637008","doi":"10.1143/jjap.47.2526","title":"Void-Free Room-Temperature Silicon Wafer Direct Bonding Using Sequential Plasma Activation","year":2008,"lang":"en","type":"article","venue":"Japanese Journal of Applied Physics","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":36,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Wafer; Anodic bonding; Plasma activation; Materials science; Annealing (glass); Void (composites); Reactive-ion etching; Wafer bonding; Direct bonding; Microelectromechanical systems; Silicon; Composite material; Plasma; Plasma cleaning; Etching (microfabrication); Analytical Chemistry (journal); Optoelectronics; Chemistry; Layer (electronics)","retraction":null,"screen_n_in":null,"score":{"opus":0.01840807697793023,"gpt":0.2159968058735313,"spread":0.197588728895601,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009156554,0.0001841611,0.0002832051,0.0000977618,0.0001418305,0.00002937001,0.0002077899,0.0001271309,0.000007413655],"category_scores_gemma":[0.00002072939,0.0001588923,0.0001016579,0.0003145308,0.00004633813,0.0003599295,0.00004442504,0.0004178258,0.000005415552],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001264268,"about_ca_system_score_gemma":0.00003092291,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000004335936,"about_ca_topic_score_gemma":6.186195e-7,"domain_scores_codex":[0.9990897,0.000008124724,0.0002977719,0.0001055605,0.0002739734,0.000224905],"domain_scores_gemma":[0.9994774,0.00005110916,0.0001320336,0.0002145247,0.00006956416,0.00005537025],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005266637,0.000030408,0.0001338892,0.00002073678,0.00007690555,0.00002273146,0.001070558,0.1283302,0.8684402,0.0007241861,0.0003059817,0.0007915762],"study_design_scores_gemma":[0.0008548605,0.00003677313,0.0004293463,0.00003859352,0.00003237585,0.0001991584,0.0007789495,0.01100857,0.9844765,0.001689112,0.0002143861,0.0002413511],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.996992,0.00001932722,0.0004391926,0.00002466662,0.0001695437,0.00008235368,0.000001895314,0.0001766362,0.002094419],"genre_scores_gemma":[0.9983138,0.00001720303,0.001196879,0.00001791567,0.0003989075,0.000002894269,0.000002296543,0.00003417014,0.00001589982],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1173216,"threshold_uncertainty_score":0.647944,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2389379251","doi":"10.1016/j.jmatprotec.2016.05.017","title":"Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding","year":2016,"lang":"en","type":"article","venue":"Journal of Materials Processing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":35,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"European Commission","keywords":"Soldering; Materials science; Metallurgy; Alloy; Anode; Metal; Anodic bonding; Electrode; Silicon; Chemistry","retraction":null,"screen_n_in":null,"score":{"opus":0.008829217280582455,"gpt":0.2285162464141685,"spread":0.219687029133586,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003262148,0.0002272827,0.0005499466,0.0004757057,0.00009482603,0.00008436506,0.0003218556,0.0003306157,0.00001491744],"category_scores_gemma":[0.0005573896,0.0001597716,0.00004461711,0.0001687948,0.0001357713,0.0002608339,0.0001102672,0.0001283914,0.000004271712],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00007400048,"about_ca_system_score_gemma":0.00002837137,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":4.406437e-7,"about_ca_topic_score_gemma":2.71873e-7,"domain_scores_codex":[0.9986848,0.0000101909,0.0005855432,0.0001843503,0.0001256232,0.0004094644],"domain_scores_gemma":[0.9993191,0.0000986337,0.0002434675,0.0001483803,0.0001254153,0.00006503017],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00006017126,0.00001451704,0.00001623423,0.0001281382,0.00004885848,0.00002104864,0.00003604095,0.0001113645,0.9527707,0.0001095757,0.0008758479,0.04580751],"study_design_scores_gemma":[0.001396689,0.0002598302,0.000004827476,0.0004574859,0.00004766335,0.0004248548,0.0001324642,0.0004724906,0.9885458,0.00296386,0.005033769,0.000260285],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9126122,0.001103989,0.08316,0.001866007,0.0004191104,0.0001842786,0.00001881535,0.0006182367,0.00001736387],"genre_scores_gemma":[0.9508978,0.0001842617,0.0486546,0.00002805634,0.00007490045,0.00002069993,6.073083e-7,0.00005624703,0.00008279804],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.04554722,"threshold_uncertainty_score":0.6515296,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2119741953","doi":"10.1088/0957-4484/21/13/134011","title":"Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale","year":2010,"lang":"en","type":"article","venue":"Nanotechnology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":35,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; University of Texas at Dallas; McMaster University","keywords":"Materials science; Wafer; Nanostructure; Nanotechnology; Nanowire; Nanometre; Reactive-ion etching; Etching (microfabrication); Plasma etching; Plasma; Silicon; Contact angle; Wafer bonding; Optoelectronics; Composite material; Layer (electronics)","retraction":null,"screen_n_in":null,"score":{"opus":0.02029274435062406,"gpt":0.2306394134790619,"spread":0.2103466691284379,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006787419,0.0001639578,0.0002036511,0.0001908195,0.00007288263,0.00001262583,0.0003042353,0.0005995493,0.00002187745],"category_scores_gemma":[0.0001408883,0.0001191089,0.0000503324,0.0002357324,0.000376862,0.00007666268,0.00005038123,0.0004899852,0.00001539232],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00003298544,"about_ca_system_score_gemma":0.00001760703,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001288601,"about_ca_topic_score_gemma":0.00006438874,"domain_scores_codex":[0.9992873,0.0000136768,0.0002284435,0.0001774539,0.00009036518,0.0002027387],"domain_scores_gemma":[0.9993024,0.0001610554,0.00007858152,0.0003441011,0.00009866413,0.00001518234],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002657144,0.00000889387,0.00003210182,0.00001955087,0.00002931081,2.686491e-7,0.0001034435,0.0001142747,0.9763455,0.01255838,0.0004823482,0.0102794],"study_design_scores_gemma":[0.000312139,0.0001404411,0.00007144906,0.00002693735,0.00001262001,0.000005246687,0.000323196,0.006221348,0.9827242,0.007844168,0.002201298,0.0001168953],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9935199,0.00002046091,0.002766937,0.001657102,0.0005189724,0.0004126805,0.00001825346,0.0009328735,0.0001528218],"genre_scores_gemma":[0.9976549,0.00001445517,0.002083832,0.00004407372,0.00002261294,0.00009837822,0.0000167503,0.00002451373,0.00004044352],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0101625,"threshold_uncertainty_score":0.485712,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2120154505","doi":"10.1109/mwsym.2004.1339060","title":"A novel MEMS LTCC switch matrix","year":2004,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":33,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"COM DEV International","funders":"University of Waterloo","keywords":"Microelectromechanical systems; Materials science; Interconnection; Crossbar switch; Substrate (aquarium); Planar; Ceramic; Matrix (chemical analysis); Optoelectronics; Electronic engineering; Electrical engineering; Computer science; Engineering; Telecommunications; Composite material","retraction":null,"screen_n_in":null,"score":{"opus":0.009674603285278579,"gpt":0.2132636487686038,"spread":0.2035890454833253,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00001891328,0.00006560596,0.00006432749,0.0000390079,0.00001500679,0.00001122854,0.00009761708,0.00006411938,0.00007315935],"category_scores_gemma":[0.000007400673,0.00005427708,0.00002272007,0.000101349,0.00001333757,0.00005042885,0.00002099814,0.00007425689,0.0002677741],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00003053707,"about_ca_system_score_gemma":0.00000537952,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004154096,"about_ca_topic_score_gemma":0.0000174948,"domain_scores_codex":[0.9996821,2.179292e-7,0.00006794022,0.00006237125,0.00005224137,0.000135158],"domain_scores_gemma":[0.9998311,0.000005020879,0.00000398824,0.0001353095,0.000006380713,0.00001823193],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000006293551,0.0001535845,0.0007152645,0.0001501093,0.0001798911,0.00004187883,0.0004827645,0.1017767,0.436691,0.4081382,0.01423362,0.03743067],"study_design_scores_gemma":[0.003352723,0.0001383953,0.004123277,0.0000804787,0.00003866578,0.0001605657,0.00136554,0.008967672,0.8493996,0.05325652,0.07782067,0.001295892],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.348048,0.0005595023,0.5189906,0.0007388138,0.0003688478,0.0001320989,0.000003678758,0.006385162,0.1247732],"genre_scores_gemma":[0.9839638,0.00003162412,0.01526359,0.00002283034,0.00002237386,0.000006082902,7.317188e-7,0.00001275139,0.0006762212],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.6359158,"threshold_uncertainty_score":0.3441783,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2117283955","doi":"10.1149/1.3223985","title":"Role of Heating on Plasma-Activated Silicon Wafers Bonding","year":2009,"lang":"en","type":"article","venue":"Journal of The Electrochemical Society","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":30,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"","keywords":"Silicon; Wafer; Materials science; Silicon oxide; Plasma activation; Etching (microfabrication); Surface roughness; Anodic bonding; Composite material; Wafer bonding; Oxide; Reactive-ion etching; Plasma; Layer (electronics); Nanotechnology; Optoelectronics; Metallurgy; Silicon nitride","retraction":null,"screen_n_in":null,"score":{"opus":0.005075655904516735,"gpt":0.2016228554164125,"spread":0.1965471995118958,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009910778,0.00009626497,0.0001863227,0.00001831605,0.00004204358,0.000007722815,0.0002423953,0.0001205489,0.000004458986],"category_scores_gemma":[0.00008055849,0.00006424909,0.0002634386,0.0001922549,0.00003132592,0.00005540805,0.00001524095,0.000569062,4.958054e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001527024,"about_ca_system_score_gemma":0.00001480606,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":4.890105e-7,"about_ca_topic_score_gemma":4.51399e-8,"domain_scores_codex":[0.9993282,0.000007336982,0.0002416407,0.00005232087,0.0001773856,0.000193101],"domain_scores_gemma":[0.9996586,0.00006040352,0.0001170718,0.0001015698,0.00003276017,0.00002955543],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001455726,0.00001988358,0.00007369088,0.000006057852,0.00005551306,1.623477e-7,0.0001296789,0.0001937679,0.9965789,0.0002213581,0.0005673764,0.002139057],"study_design_scores_gemma":[0.0001972278,0.0001110553,0.0002671115,0.00005842972,0.00001610798,0.00001484185,0.0002058814,0.002307382,0.9940575,0.002470401,0.0002291385,0.00006496721],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.99806,0.0002438508,0.0002471688,0.0004654346,0.00004293085,0.00003464364,3.541349e-7,0.0000639905,0.0008416289],"genre_scores_gemma":[0.9984183,0.0000494386,0.001378551,0.00006463508,0.00006240877,3.470357e-7,2.040258e-7,0.000008685308,0.00001748108],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002521442,"threshold_uncertainty_score":0.2620002,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2063787241","doi":"10.1149/1.3272957","title":"Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bonded Wafers at Room Temperature","year":2010,"lang":"en","type":"article","venue":"Electrochemical and Solid-State Letters","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"McMaster University","keywords":"Materials science; Annealing (glass); Amorphous solid; Wafer; Composite material; Optoelectronics; Crystallography; Chemistry","retraction":null,"screen_n_in":null,"score":{"opus":0.004183097193783306,"gpt":0.2028024206934443,"spread":0.198619323499661,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004153017,0.0002407582,0.0002826639,0.00005460261,0.00005740296,0.00002370227,0.0001869581,0.000229373,0.00003990855],"category_scores_gemma":[0.00002132785,0.0002154624,0.00006694545,0.0001540553,0.0001540172,0.00009093509,0.00007306863,0.0007566799,0.000006891415],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00004729904,"about_ca_system_score_gemma":0.000007898538,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000008118182,"about_ca_topic_score_gemma":0.00001401302,"domain_scores_codex":[0.998966,0.000008632958,0.0002245624,0.0002378913,0.0001343146,0.0004286111],"domain_scores_gemma":[0.9996206,0.00003521693,0.0000371127,0.000199848,0.00002411736,0.0000831426],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00004372006,0.00001971489,0.0008447802,0.00002797671,0.00004111675,0.0000102272,0.000155216,0.00002127836,0.9962388,0.00002044167,0.002268145,0.0003086091],"study_design_scores_gemma":[0.0003452035,0.00003732902,0.0004906525,0.00001109422,0.0000204356,0.0000233039,0.00002137625,0.0001234622,0.9979564,0.00009178432,0.0006305971,0.0002483852],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9983725,0.00007137622,0.00007790237,0.0006659291,0.000142686,0.000137127,0.00001382501,0.0003986742,0.0001199905],"genre_scores_gemma":[0.9992232,0.00004931944,0.000351082,0.0001712616,0.00003592064,0.0000122391,0.00002610579,0.0000335885,0.00009728553],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001717602,"threshold_uncertainty_score":0.8786302,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2074317550","doi":"10.1088/0960-1317/20/6/065012","title":"Void nucleation at a sequentially plasma-activated silicon/silicon bonded interface","year":2010,"lang":"en","type":"article","venue":"Journal of Micromechanics and Microengineering","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":28,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada; McMaster University","keywords":"Nucleation; Materials science; Void (composites); Silicon; Reactive-ion etching; Wafer; Scanning electron microscope; Plasma etching; Annealing (glass); Transmission electron microscopy; Composite material; Plasma; Plasma activation; Analytical Chemistry (journal); Etching (microfabrication); Chemistry; Nanotechnology; Metallurgy; Layer (electronics)","retraction":null,"screen_n_in":null,"score":{"opus":0.004634746040105577,"gpt":0.186123070192699,"spread":0.1814883241525934,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001614805,0.0002219319,0.0002961409,0.0002483423,0.00005593582,0.00006018792,0.0002017881,0.0001984649,0.00004019772],"category_scores_gemma":[0.00004093196,0.0002148632,0.00009007601,0.0001357426,0.00002422787,0.0002123336,0.00009023312,0.0006001991,0.000008424298],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00009123037,"about_ca_system_score_gemma":0.00001674289,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000002546169,"about_ca_topic_score_gemma":0.00001197716,"domain_scores_codex":[0.9990863,0.000006008379,0.0004061741,0.0001289251,0.0001015453,0.0002710537],"domain_scores_gemma":[0.9995158,0.00002969102,0.0001219484,0.000160278,0.00007727414,0.00009502593],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001821325,0.00001246688,0.000007706796,0.00005721582,0.00008136634,0.00001679907,0.0001484758,0.001234787,0.9926478,0.0002040607,0.0003828032,0.005188304],"study_design_scores_gemma":[0.0005692685,0.00008295855,0.00004350418,0.00007577756,0.00003230188,0.0007997035,0.0001156952,0.01498221,0.9743319,0.0001081848,0.008649043,0.0002094455],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9916285,0.000712099,0.006261822,0.0000941015,0.0009544847,0.00008714241,0.000008277162,0.0002022532,0.00005135414],"genre_scores_gemma":[0.996315,0.0005027567,0.002985249,0.00001031273,0.00007138568,0.000001696195,0.000001926427,0.00005391614,0.00005775726],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0183159,"threshold_uncertainty_score":0.8761866,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4379115896","doi":"10.23919/date56975.2023.10137172","title":"The Next Era for Chiplet Innovation","year":2023,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":26,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Computer science; Product (mathematics); Variety (cybernetics); Soar; Stacking; Data science; Artificial intelligence; Mathematics","retraction":null,"screen_n_in":null,"score":{"opus":0.0416677909492878,"gpt":0.2448723962198773,"spread":0.2032046052705895,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005673096,0.0000267593,0.00002281662,0.00003775601,0.00004962272,0.00001986343,0.00006063389,0.00002457749,0.000006515994],"category_scores_gemma":[0.00004505914,0.00001674309,0.000008065928,0.0003445665,0.000009172162,0.00003371928,0.00001117476,0.00003351209,0.00007013181],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000005116892,"about_ca_system_score_gemma":0.000001998188,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":8.335464e-7,"about_ca_topic_score_gemma":0.000003145169,"domain_scores_codex":[0.9998115,5.398638e-7,0.00005241129,0.00002826422,0.00002325317,0.00008401777],"domain_scores_gemma":[0.9998583,0.00004692476,0.000003558433,0.00007744788,0.00001144651,0.000002377672],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.000001371233,0.000001234819,0.0001163459,0.00001613265,0.0000171195,2.487532e-7,0.00004000906,0.0009969241,0.003618779,0.4936832,0.2397321,0.2617765],"study_design_scores_gemma":[0.0002455435,0.00002908552,0.005809383,0.000005957394,0.000003371513,8.342673e-7,0.0007765265,0.1598037,0.02672926,0.08591809,0.7205198,0.0001584018],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8192887,0.0002221527,0.08670328,0.007671915,0.001188568,0.0005427525,0.000008168998,0.01292963,0.07144482],"genre_scores_gemma":[0.9974374,0.00005876023,0.0006533447,0.00003071691,0.00002917924,0.00004751663,0.000007231854,0.000007548045,0.001728287],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4807877,"threshold_uncertainty_score":0.09014259,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2332051722","doi":"10.1149/1.2357070","title":"Sequential Plasma Activated Process for Silicon Direct Bonding","year":2006,"lang":"en","type":"article","venue":"ECS Transactions","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":25,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"McMaster University","keywords":"Plasma activation; Silicon oxide; Silicon; Materials science; Anodic bonding; Ultimate tensile strength; Composite material; Surface roughness; Annealing (glass); High-resolution transmission electron microscopy; Chemistry; Wafer; Plasma; Chemical engineering; Nanotechnology; Transmission electron microscopy; Metallurgy; Silicon nitride","retraction":null,"screen_n_in":null,"score":{"opus":0.01449991768443569,"gpt":0.2332446222743863,"spread":0.2187447045899506,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00002452889,0.0001046249,0.0001041495,0.00009076306,0.0001214244,0.00002096901,0.00007243081,0.0001017487,0.00004360986],"category_scores_gemma":[0.000003969645,0.0001085023,0.00006291429,0.0001801922,0.0000260404,0.000145681,8.950271e-7,0.0001143526,0.00000923881],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00004566029,"about_ca_system_score_gemma":0.0000105139,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001685209,"about_ca_topic_score_gemma":0.0000426377,"domain_scores_codex":[0.9995135,0.000002699723,0.0001154111,0.0001137635,0.00005650126,0.0001981093],"domain_scores_gemma":[0.9998245,0.0000344438,0.00001223068,0.00009217308,0.00001813082,0.00001855619],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003428175,0.0001220648,0.0001002297,0.0002597704,0.0001785175,0.000004592378,0.0002407913,0.3968999,0.5860776,0.001507574,0.00207529,0.01249941],"study_design_scores_gemma":[0.0003408346,0.00001992357,0.00008225358,0.00001545509,0.0000346918,0.000005305797,0.0001051941,0.02194296,0.9638299,0.0006855644,0.0127722,0.0001657089],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8082443,0.00008818143,0.170612,0.0001513642,0.0004954331,0.0003361858,0.00007875628,0.003107114,0.01688666],"genre_scores_gemma":[0.9985784,0.000007237525,0.0004412881,0.000002168697,0.00005093004,0.0001242094,0.00001293377,0.00002832205,0.0007544526],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3777524,"threshold_uncertainty_score":0.4424596,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2102027329","doi":"10.1021/am4021236","title":"Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining","year":2013,"lang":"en","type":"article","venue":"ACS Applied Materials & Interfaces","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Alberta","funders":"","keywords":"Materials science; Eutectic system; Transfer printing; Electrical contacts; Eutectic bonding; Silicon; Nanometre; Substrate (aquarium); Thermal contact; Semiconductor; Nanotechnology; Thermal; Optoelectronics; Composite material; Alloy","retraction":null,"screen_n_in":null,"score":{"opus":0.008700372564203727,"gpt":0.2118643244691399,"spread":0.2031639519049362,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001556929,0.0003213456,0.0004221646,0.00005945284,0.00008685953,0.0002190311,0.0003667788,0.0002191982,0.0004826149],"category_scores_gemma":[0.00002327546,0.0002293567,0.00001604236,0.0001046152,0.0001186076,0.0001303424,0.0001781967,0.0002581352,0.0002831489],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00005844252,"about_ca_system_score_gemma":0.000004794404,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0000913144,"about_ca_topic_score_gemma":0.000009047858,"domain_scores_codex":[0.9987131,0.00002782658,0.0003966073,0.000309142,0.0001243033,0.0004290609],"domain_scores_gemma":[0.9994247,0.0001633751,0.00004020444,0.0003021332,0.00002017218,0.00004941997],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001831158,0.000006602773,0.00006726761,0.00004291602,0.00009997212,3.958572e-7,0.0002663895,0.00002228376,0.9891096,0.0002009461,0.005615737,0.004549535],"study_design_scores_gemma":[0.0003094806,0.00009038729,0.000492427,0.0000332064,0.00003765857,0.000006419987,0.0003758817,0.00002758229,0.9975322,0.0002849181,0.0005391991,0.000270649],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9959258,0.00079213,0.0003301177,0.0002756127,0.0001640406,0.0005275473,0.00004228517,0.0007584313,0.001184076],"genre_scores_gemma":[0.9992448,0.0001766566,0.00004792231,0.00005297374,0.00003355031,0.0001875232,0.00001295832,0.00005507801,0.0001885101],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.008422546,"threshold_uncertainty_score":0.9352894,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1981141412","doi":"10.1145/2633606","title":"Statistical Peak Temperature Prediction and Thermal Yield Improvement for 3D Chip Multiprocessors","year":2014,"lang":"en","type":"article","venue":"ACM Transactions on Design Automation of Electronic Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"Division of Computer and Network Systems; Intel Corporation","keywords":"Computer science; Chip; Thermal; Fabrication; Yield (engineering); Leakage power; Process (computing); Three-dimensional integrated circuit; Integrated circuit; Matching (statistics); Electronic circuit; Power (physics); Materials science; Optoelectronics; Electrical engineering; Power consumption; Composite material; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.01092210371300435,"gpt":0.2083514887250244,"spread":0.1974293850120201,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002887296,0.0001461175,0.0001821025,0.0001204171,0.00009151443,0.00002805619,0.000115743,0.0001608817,0.000008772087],"category_scores_gemma":[0.0001102312,0.0001328478,0.00003078732,0.0001057019,0.00003346031,0.0001301498,0.000001550884,0.000164521,0.000002800305],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00008759316,"about_ca_system_score_gemma":0.00002457607,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000008600015,"about_ca_topic_score_gemma":0.000002204304,"domain_scores_codex":[0.999134,0.00003192525,0.0002875363,0.0001656632,0.0001434675,0.0002373907],"domain_scores_gemma":[0.9992052,0.0004159809,0.00005340572,0.000231026,0.00006422502,0.00003018302],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001676906,0.0001742347,0.00001991144,0.001093133,0.0004465408,3.415259e-7,0.0006017569,0.5800781,0.172411,0.008360527,0.0006118538,0.2360349],"study_design_scores_gemma":[0.0007507049,0.001196747,0.0002997694,0.0001085961,0.00007647771,0.000009318198,0.0002487827,0.9471827,0.04888868,0.0005192403,0.0005350017,0.0001839864],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.03611911,0.0002655776,0.9620078,0.00006420587,0.0001758061,0.0006789541,0.00003850408,0.0005805708,0.00006943964],"genre_scores_gemma":[0.9888799,0.00006740604,0.01058976,0.00001050112,0.00003158692,0.0003362549,0.00001143591,0.00002424986,0.00004886111],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.9527608,"threshold_uncertainty_score":0.5417376,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2324919773","doi":"10.1149/1.3483522","title":"Surface and Interface Characterization of Sequentially Plasma Activated Silicon, Silicon dioxide and Germanium Wafers for Low Temperature Bonding Applications","year":2010,"lang":"en","type":"article","venue":"ECS Transactions","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":20,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"","keywords":"Germanium; Wafer; Materials science; Silicon; Reactivity (psychology); Surface roughness; Silicon dioxide; Plasma activation; Plasma; Characterization (materials science); Nanotechnology; Analytical Chemistry (journal); Composite material; Chemistry; Optoelectronics","retraction":null,"screen_n_in":null,"score":{"opus":0.005851483857038826,"gpt":0.2101241962603762,"spread":0.2042727124033374,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004373409,0.0001264349,0.000144036,0.00007470934,0.0001075164,0.00002979474,0.00006711981,0.0001784751,0.00001269163],"category_scores_gemma":[0.000004235466,0.0001325602,0.00003073751,0.0001360345,0.00008085012,0.0002180608,0.00000469276,0.0002429899,9.772618e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00001503475,"about_ca_system_score_gemma":0.00001229979,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000003801961,"about_ca_topic_score_gemma":0.00002491936,"domain_scores_codex":[0.9994956,0.000005202718,0.0001634356,0.0001551041,0.00004580296,0.0001349049],"domain_scores_gemma":[0.9996916,0.00005066317,0.00003438172,0.0001428042,0.00004006829,0.00004047187],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000008463017,0.00001563736,0.00003635887,0.0001062106,0.00004096435,9.251792e-8,0.0001856889,0.001014635,0.9965727,0.0003506361,0.000006845738,0.001661728],"study_design_scores_gemma":[0.0002662405,0.00001829815,0.000911906,0.00002003234,0.00003341927,0.000008977369,0.0001201921,0.003703258,0.9927247,0.00003794345,0.00202578,0.0001293159],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9401215,0.00002974009,0.05863935,0.0001692736,0.0001331771,0.0003936196,0.0001213411,0.0003164645,0.0000754793],"genre_scores_gemma":[0.9987701,0.00009425772,0.0008354111,0.000003996086,0.0000168301,0.00007008961,0.00002693608,0.00002637295,0.0001559916],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.05864856,"threshold_uncertainty_score":0.540565,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1980699453","doi":"10.1109/isscc.2006.1696063","title":"A 2.6GHz Dual-Core 64bx86 Microprocessor with DDR2 Memory Support","year":2006,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Memory controller; Microprocessor; Embedded system; Chip; Computer science; Interconnection; Controller (irrigation); Dual (grammatical number); Computer hardware; Operating system; Semiconductor memory; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.005849187665998048,"gpt":0.1723883053757252,"spread":0.1665391177097272,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003268935,0.000151728,0.0001412765,0.00007365303,0.00003449832,0.00002179369,0.000110655,0.00009739606,0.0003135092],"category_scores_gemma":[0.000003839328,0.0001116972,0.00002790435,0.0001725284,0.00006143824,0.00008869543,0.00002620606,0.0001243663,0.0001961385],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002494442,"about_ca_system_score_gemma":0.00001582144,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00006255758,"about_ca_topic_score_gemma":0.0001055651,"domain_scores_codex":[0.999349,0.000001242072,0.0001316109,0.0001472539,0.0001057336,0.0002651665],"domain_scores_gemma":[0.9997034,0.000009956224,0.00001492854,0.0002208384,0.00002555003,0.00002530734],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00008621434,0.0003690958,0.02795677,0.001219097,0.0004140715,0.001296045,0.0006791834,0.01706921,0.120223,0.033991,0.7555945,0.04110181],"study_design_scores_gemma":[0.002643885,0.0004663154,0.01545681,0.0001159663,0.0001097693,0.000758516,0.002059137,0.004635965,0.8516369,0.008899403,0.111125,0.002092319],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7611015,0.000441372,0.003320733,0.0001939894,0.000105664,0.0001609862,0.000007720466,0.003612023,0.231056],"genre_scores_gemma":[0.9859251,0.00002160512,0.00450189,0.00004948007,0.00005148693,0.00002138226,0.00001179398,0.00003499692,0.009382223],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7314138,"threshold_uncertainty_score":0.4554879,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2514960441","doi":"10.1149/07509.0117ecst","title":"Combined Surface Activated Bonding Technique for Hydrophilic SiO<sub>2</sub>-SiO<sub>2</sub> and Cu-Cu Bonding","year":2016,"lang":"en","type":"article","venue":"ECS Transactions","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Optech (Canada)","funders":"","keywords":"Anodic bonding; Annealing (glass); Materials science; Direct bonding; Wafer bonding; Void (composites); Wafer; Bonding strength; Scanning electron microscope; Transmission electron microscopy; Composite material; Analytical Chemistry (journal); Nanotechnology; Chemistry","retraction":null,"screen_n_in":null,"score":{"opus":0.01043603237648257,"gpt":0.2092559784798357,"spread":0.1988199461033531,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001995474,0.0004346053,0.0004318747,0.0003427844,0.0004349835,0.00006221973,0.0002358319,0.0004442094,0.00001650377],"category_scores_gemma":[0.00004984446,0.0003878711,0.0001764522,0.000563785,0.0001667288,0.0005087475,0.00002163493,0.0004331158,0.00002882506],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002247863,"about_ca_system_score_gemma":0.00003125116,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000007566854,"about_ca_topic_score_gemma":0.00002687844,"domain_scores_codex":[0.9982109,0.00002709824,0.0004160896,0.0004749107,0.0001901511,0.0006808472],"domain_scores_gemma":[0.9989299,0.0003301451,0.0000753077,0.0004505913,0.00006077332,0.0001533536],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003236492,0.00005092226,0.00007019856,0.0001023389,0.0001109054,0.000005616698,0.00008470828,0.0007831852,0.989529,0.0006098282,0.000476498,0.008144472],"study_design_scores_gemma":[0.001021802,0.0001259023,0.0002998685,0.0002188927,0.00008466297,0.00002876668,0.0001184008,0.001645856,0.9921097,0.002181191,0.001631663,0.0005332799],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7439715,0.0001337874,0.2518627,0.0006163464,0.0002964295,0.000744225,0.00009348194,0.00201651,0.0002650016],"genre_scores_gemma":[0.9971558,0.0005248613,0.001712721,0.00001632254,0.00004314764,0.0003052817,0.00001158595,0.0001374572,0.00009278418],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2531843,"threshold_uncertainty_score":0.9998573,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2161130272","doi":"10.1109/tcpmt.2011.2177269","title":"Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"University of Waterloo; Nanyang Technological University","keywords":"Materials science; Plating (geology); Microstructure; Shear strength (soil); Metallurgy; Electroless plating; Copper; Contact resistance; Pillar; Copper plating; Composite material; Daisy chain; Flip chip; Layer (electronics); Electroplating; Adhesive; Structural engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.01469833692879095,"gpt":0.2261363404971476,"spread":0.2114380035683566,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002095906,0.0003218194,0.0003601625,0.001074804,0.0002494444,0.00004133942,0.0002223321,0.0002710933,0.000006169192],"category_scores_gemma":[0.00000762301,0.0003440213,0.00005406845,0.0002618052,0.00005678384,0.0002129621,0.000009439748,0.000568921,0.00001834522],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001686214,"about_ca_system_score_gemma":0.000006522564,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004915629,"about_ca_topic_score_gemma":0.00004673467,"domain_scores_codex":[0.9983707,0.00001962463,0.0003418118,0.000342169,0.0001236082,0.0008020782],"domain_scores_gemma":[0.999397,0.0001069584,0.00005260533,0.000333002,0.00001751749,0.00009293497],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002730925,0.0007189513,0.007724128,0.0007837787,0.0006333052,0.00002596687,0.003588588,0.1066144,0.5048751,0.003696511,0.0003176953,0.3707485],"study_design_scores_gemma":[0.002029576,0.0001768833,0.0156237,0.0003679152,0.00007880344,0.00008159592,0.0005225389,0.03302798,0.9418322,0.003323107,0.001886099,0.001049604],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6112799,0.00008191402,0.3861451,0.0004663804,0.00045926,0.0002958062,0.00001068093,0.001196317,0.00006465881],"genre_scores_gemma":[0.9926123,0.00006501679,0.006945311,0.000059818,0.00003906288,0.000179516,0.000004553657,0.00006240971,0.00003201426],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4369571,"threshold_uncertainty_score":0.9999012,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1796445194","doi":"10.1109/cicc.1994.379764","title":"An overview of technology, architecture and CAD tools for programmable logic devices","year":2002,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Programmable Array Logic; Programmable logic device; Simple programmable logic device; Programmable logic array; Computer science; Erasable programmable logic device; Field-programmable gate array; Logic synthesis; Logic family; Macrocell array; Computer architecture; Complex programmable logic device; Logic gate; Digital electronics; Embedded system; Register-transfer level; Electronic circuit; Computer hardware; Electrical engineering; Engineering; Algorithm","retraction":null,"screen_n_in":null,"score":{"opus":0.06103781827731848,"gpt":0.2753612934061263,"spread":0.2143234751288078,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003538918,0.00009265887,0.0001480708,0.00009511374,0.00002342974,0.00002101045,0.0001366399,0.0001396177,0.00003282791],"category_scores_gemma":[0.00002644621,0.0000702536,0.00002272215,0.0001669683,0.00007643764,0.00009977974,0.00002314149,0.00007976136,0.000002344995],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000005561296,"about_ca_system_score_gemma":0.000001332404,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000004108706,"about_ca_topic_score_gemma":0.00003001376,"domain_scores_codex":[0.9995807,0.000002037837,0.0001077978,0.0001075421,0.00003540065,0.0001665618],"domain_scores_gemma":[0.9997396,0.00002528452,0.00001707738,0.0001826852,0.00001716606,0.00001811685],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.000001646304,0.00003121817,0.001122295,0.0004302732,0.00003291322,0.000001271383,0.00004755862,0.0003322044,0.002218334,0.05206175,0.0003740084,0.9433465],"study_design_scores_gemma":[0.002418733,0.002551899,0.004553719,0.0004274445,0.0001847884,0.0001479868,0.003172602,0.08569594,0.1854065,0.2685509,0.4450957,0.001793818],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8803706,0.07028955,0.03060554,0.00173386,0.00010366,0.001404767,0.0000399184,0.005625763,0.009826313],"genre_scores_gemma":[0.9566207,0.0008605235,0.0423488,0.00002361866,0.000007754382,0.00005968129,0.000002095634,0.00001161224,0.00006524727],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.9415527,"threshold_uncertainty_score":0.2864859,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4385066962","doi":"10.3390/electronics12143154","title":"Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology","year":2023,"lang":"en","type":"article","venue":"Electronics","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":18,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Université de Sherbrooke; Université du Québec en Outaouais","funders":"","keywords":"Multiphysics; Finite element method; System in package; Chip; Mechanical engineering; Reliability (semiconductor); Thermal; Electronic packaging; Electronic engineering; Materials science; Temperature control; Computer science; Engineering; Electrical engineering; Structural engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.00854233383199903,"gpt":0.245066928823636,"spread":0.2365245949916369,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003705743,0.000257887,0.0003870838,0.0003985541,0.000100537,0.00002202155,0.0002652801,0.0002024795,0.000002455198],"category_scores_gemma":[0.00005990967,0.0002331418,0.0000559505,0.0008258193,0.00003578116,0.00008326529,0.00003830455,0.0004108006,0.00001020447],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003091698,"about_ca_system_score_gemma":0.00005860268,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00000275421,"about_ca_topic_score_gemma":0.00004975827,"domain_scores_codex":[0.9983515,0.00002399839,0.000286811,0.0002846251,0.0001253681,0.0009277369],"domain_scores_gemma":[0.9993642,0.00016681,0.00006983894,0.0003307803,0.00003954065,0.00002883283],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0002001742,0.0000303806,0.0006513122,0.0005181992,0.0002883778,0.00006235204,0.0001655958,0.7735578,0.1300547,0.02393695,0.0000297905,0.07050428],"study_design_scores_gemma":[0.002562971,0.0003588637,0.0002269262,0.0001781251,0.00006675198,0.00002091449,0.0006380659,0.9083079,0.08261009,0.0009071985,0.003687374,0.0004348947],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.556087,0.004042043,0.4354994,0.0001226585,0.0001413311,0.0009242815,0.00002386301,0.002901078,0.0002583128],"genre_scores_gemma":[0.981922,0.0001961091,0.01743101,0.00001580035,0.00003528961,0.0002490696,0.00001377708,0.00008720051,0.00004976833],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.425835,"threshold_uncertainty_score":0.9507247,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2014715605","doi":"10.1007/s13391-013-3260-6","title":"Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test","year":2014,"lang":"en","type":"article","venue":"Electronic Materials Letters","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":16,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo; Western University","funders":"Small and Medium Business Administration","keywords":"Materials science; Thermal shock; Composite material; Shock (circulatory); Thermal; Structural engineering; Metallurgy; Nuclear engineering; Thermodynamics; Engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.001668548405669852,"gpt":0.154877426253279,"spread":0.1532088778476092,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00007066364,0.0001372874,0.0003729357,0.0001017031,0.00002559985,0.00001385214,0.0001858284,0.00007265899,0.00006640045],"category_scores_gemma":[0.00003891135,0.00008526613,0.00003941443,0.0003222984,0.00009113483,0.00002882024,0.00002906185,0.0001157172,3.544125e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002898575,"about_ca_system_score_gemma":0.00001173108,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001133559,"about_ca_topic_score_gemma":0.00001105073,"domain_scores_codex":[0.999256,0.0000301005,0.0002174643,0.0001175174,0.0001143781,0.0002645334],"domain_scores_gemma":[0.9995499,0.00006519235,0.00009431158,0.0002602737,0.0000160213,0.00001435629],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001521532,0.000005739561,0.01008406,0.00003361099,0.0002999798,2.522018e-7,0.00003732572,0.000300322,0.9883022,0.0004327084,0.00003603586,0.0004525169],"study_design_scores_gemma":[0.0002557656,0.0001107216,0.1529705,0.00001465832,0.0004324249,0.000004398727,0.000005730345,0.001735019,0.8441432,0.00004495132,0.000126606,0.0001559814],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.99911,0.00004990843,0.000414359,0.0001594912,0.00004153237,0.00009396541,0.00003082301,0.00007362066,0.0000262311],"genre_scores_gemma":[0.9997819,0.0000238624,0.00006003112,0.00007069668,0.00002852407,0.000003500477,0.000009448578,0.00001711248,0.000004896621],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.144159,"threshold_uncertainty_score":0.3477052,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4312576493","doi":"10.1109/tvlsi.2022.3214793","title":"A Robust Integrated Power Delivery Methodology for 3-D ICs","year":2022,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Fonds de recherche du Québec","keywords":"Notation; Integrated circuit; Computer science; Power (physics); Dimension (graph theory); Power domains; Electronic engineering; Topology (electrical circuits); Voltage; Mathematics; Electrical engineering; Engineering; Physics; Arithmetic","retraction":null,"screen_n_in":null,"score":{"opus":0.04747307557331044,"gpt":0.2454761839940282,"spread":0.1980031084207177,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006874317,0.0003446566,0.0004600204,0.0005028984,0.0005187779,0.00007686238,0.000320716,0.0002774206,0.0002846878],"category_scores_gemma":[0.00002054592,0.0003324478,0.0002695616,0.0006108717,0.00006138375,0.0002495285,0.000004292027,0.0007999326,0.0000465313],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000486727,"about_ca_system_score_gemma":0.00006472092,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00008830728,"about_ca_topic_score_gemma":0.000205039,"domain_scores_codex":[0.9979963,0.0002469525,0.0005829984,0.0004034771,0.0003000429,0.0004702735],"domain_scores_gemma":[0.9989086,0.0003494501,0.00008963048,0.0004040519,0.0001714827,0.0000767881],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0002740141,0.000400663,0.00001858745,0.0001441596,0.0003982215,0.0000143776,0.001612583,0.95127,0.01622548,0.002425487,0.01423074,0.01298564],"study_design_scores_gemma":[0.0020304,0.0009577241,0.00002339296,0.0001401133,0.0001844925,0.0001683318,0.03141094,0.8501602,0.05473032,0.0003844519,0.05874856,0.001061016],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.03415918,0.0003614844,0.9557947,0.00009450421,0.005566116,0.0008374035,0.0009035177,0.001472215,0.0008108856],"genre_scores_gemma":[0.9917268,0.00006271512,0.005005498,0.00007822594,0.0000535898,0.001435343,0.00008314409,0.00008209966,0.001472585],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.9575676,"threshold_uncertainty_score":0.9999127,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2040401447","doi":"10.1109/tim.2014.2321461","title":"Low-Contact Resistance Probe Card Using MEMS Technology","year":2014,"lang":"en","type":"article","venue":"IEEE Transactions on Instrumentation and Measurement","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Windsor","funders":"Natural Sciences and Engineering Research Council of Canada; CMC Microsystems","keywords":"Microelectromechanical systems; Wafer; Contact resistance; Wafer testing; Return loss; Materials science; Die (integrated circuit); Integrated circuit; Electrical engineering; Insertion loss; Electronic circuit; Electronic engineering; Optoelectronics; Engineering; Nanotechnology; Layer (electronics)","retraction":null,"screen_n_in":null,"score":{"opus":0.02384830864490771,"gpt":0.2209793983538635,"spread":0.1971310897089557,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000122674,0.0001386934,0.0001380909,0.0002102534,0.0001349945,0.00002577767,0.0000666233,0.00009958896,0.00001522685],"category_scores_gemma":[0.000003463289,0.0001391006,0.00003050309,0.0001878671,0.00004455022,0.0001090391,6.521316e-7,0.000153932,0.000008788779],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001939039,"about_ca_system_score_gemma":0.0000143685,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000008076516,"about_ca_topic_score_gemma":0.00009722428,"domain_scores_codex":[0.9992728,0.00001183041,0.000180541,0.0001640257,0.0001992744,0.0001715265],"domain_scores_gemma":[0.999715,0.00000630559,0.00002773584,0.0001613628,0.00005087337,0.00003874378],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007173925,0.0002023511,0.0002920488,0.0004324671,0.0003852567,0.000002413256,0.0006495539,0.0202856,0.6263182,0.003332149,0.0002341735,0.347794],"study_design_scores_gemma":[0.001058273,0.0001128071,0.0002777446,0.0001139306,0.00009921443,0.00000669185,0.0005921278,0.003635375,0.9908519,0.0007979982,0.002159319,0.0002945552],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.2124984,0.0000967092,0.7847441,0.0002020949,0.0004546238,0.000272272,0.000006132618,0.0006359672,0.001089755],"genre_scores_gemma":[0.9971457,0.00007832222,0.002597508,0.00004192386,0.00001069387,0.00006219339,6.458043e-7,0.00001817785,0.00004479686],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.7846473,"threshold_uncertainty_score":0.5672356,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2921917561","doi":"10.1109/jmems.2019.2902066","title":"Capabilities and Limits to Form High Aspect-Ratio Microstructures by Molding of Borosilicate Glass","year":2019,"lang":"en","type":"article","venue":"Journal of Microelectromechanical Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Borosilicate glass; Materials science; Aspect ratio (aeronautics); Molding (decorative); Etching (microfabrication); Anodic bonding; Potassium hydroxide; Fabrication; Silicon; Reactive-ion etching; Microelectromechanical systems; Microstructure; Composite material; Nanotechnology; Optoelectronics; Chemical engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.003559086015003398,"gpt":0.1831226490213544,"spread":0.179563563006351,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002500981,0.0001844061,0.0005576293,0.0001487881,0.0000282099,0.00005249715,0.0002752562,0.0001712885,0.00001475828],"category_scores_gemma":[0.00005828463,0.0001488582,0.00008546855,0.0001735247,0.00002751374,0.0001396716,0.00003846036,0.0002977033,0.000005238227],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001415372,"about_ca_system_score_gemma":0.00002192517,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004337822,"about_ca_topic_score_gemma":0.000005142973,"domain_scores_codex":[0.9986777,0.00002367391,0.000641834,0.0001428265,0.0002036123,0.0003103717],"domain_scores_gemma":[0.9993145,0.0001031549,0.0001927625,0.0001880574,0.0001079305,0.00009361521],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002656484,0.00001106222,0.0001507529,0.000172902,0.00008474321,0.000001949088,0.0001003482,0.000139354,0.9938802,0.002585641,0.001902381,0.0009441595],"study_design_scores_gemma":[0.0004957074,0.0009583479,0.0003454777,0.0001724049,0.00002940971,0.0002987036,0.0003440047,0.0005382834,0.9934651,0.001397184,0.001743795,0.0002116419],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.993018,0.003696766,0.00231102,0.0001286994,0.0004508778,0.0002423504,0.00002209245,0.00006786739,0.00006233528],"genre_scores_gemma":[0.9990675,0.0002373836,0.0005110794,0.00001804724,0.00006693953,0.000004495485,0.000001276222,0.0000281759,0.00006513557],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.006049475,"threshold_uncertainty_score":0.607026,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2887263428","doi":"10.1109/ectc.2018.00069","title":"Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process","year":2018,"lang":"en","type":"preprint","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Flip chip; Materials science; Substrate (aquarium); Chip; Soldering; Reflow soldering; Capacitively coupled plasma; Plasma; Optoelectronics; Nanotechnology; Metallurgy; Inductively coupled plasma; Electrical engineering; Layer (electronics); Adhesive; Engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.03828951399632404,"gpt":0.2723795526379459,"spread":0.2340900386416219,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00007175897,0.0004705513,0.0004848152,0.0001577171,0.00008128667,0.00007645566,0.0004132054,0.0005663757,0.00008814041],"category_scores_gemma":[0.00004020281,0.0003832687,0.0001707764,0.00007544176,0.0000645601,0.0000528011,0.0001823887,0.000268425,0.00007584859],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001615594,"about_ca_system_score_gemma":0.00006352144,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001527459,"about_ca_topic_score_gemma":0.00003694264,"domain_scores_codex":[0.9986777,0.000005180531,0.0003043943,0.0004531966,0.0001239665,0.0004355036],"domain_scores_gemma":[0.9991941,0.00006302968,0.00006069678,0.0005584685,0.00006382033,0.00005984773],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0002433063,0.0006105048,0.003478961,0.008732339,0.004572715,0.00005549373,0.007930739,0.1502593,0.001334563,0.0127225,0.04413117,0.7659284],"study_design_scores_gemma":[0.004286277,0.001081252,0.0008478878,0.001371232,0.0005254916,0.00003888246,0.002605835,0.4889231,0.4076777,0.04305161,0.04572862,0.003862137],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8949263,0.0005385958,0.03367276,0.0001992049,0.002008735,0.00162837,0.0001458472,0.007019582,0.05986059],"genre_scores_gemma":[0.9834285,0.0001516011,0.01315831,0.0000170595,0.0003842266,0.001011687,0.0001096935,0.0001097435,0.001629156],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7620663,"threshold_uncertainty_score":0.9998619,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W1601853155","doi":"10.1109/aps.2005.1551373","title":"24 GHz differential integrated antennas in 10 Ω-cm bulk silicon","year":2005,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Carleton University","funders":"","keywords":"Lossy compression; Differential (mechanical device); Wireless; Electrical impedance; Electronic engineering; Omega; Electrical engineering; Very-large-scale integration; Silicon; Materials science; Computer science; Optoelectronics; Physics; Telecommunications; Engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.009863099367313772,"gpt":0.2000491515592982,"spread":0.1901860521919844,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.00002315382,0.0001214818,0.0001357087,0.0001224254,0.00001228431,0.00001885487,0.0001437663,0.0001230994,0.001346408],"category_scores_gemma":[0.00002284876,0.00009664884,0.00003082091,0.000165924,0.00002912587,0.00008249724,0.00003412279,0.0001876584,0.0003123805],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00004863761,"about_ca_system_score_gemma":0.000004771532,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004169383,"about_ca_topic_score_gemma":0.000258116,"domain_scores_codex":[0.9994575,0.000004155784,0.0001516159,0.000112456,0.00005969936,0.0002145453],"domain_scores_gemma":[0.999777,0.00001501196,0.000007707075,0.0001655111,0.0000108242,0.00002391994],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0000850883,0.0004451606,0.01049726,0.0001488516,0.0002063713,0.00007982494,0.0008912444,0.01367234,0.2822484,0.01208388,0.08287489,0.5967667],"study_design_scores_gemma":[0.001892422,0.00012301,0.01534914,0.0001079298,0.00001989861,0.00001758261,0.0009185277,0.5401693,0.343529,0.001066565,0.09585556,0.0009510539],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9786267,0.000188206,0.002621263,0.0002598423,0.0001748902,0.00007476046,0.00000267657,0.00148465,0.01656699],"genre_scores_gemma":[0.995523,0.0000700216,0.0006959852,0.00002226903,0.00004014491,0.000009163855,0.000007141376,0.00001615772,0.00361612],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5958156,"threshold_uncertainty_score":0.9995665,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2611406581","doi":"10.1109/jmems.2017.2675987","title":"Practical CMUT Fabrication With a Nitride-to-Oxide-Based Wafer Bonding Process","year":2017,"lang":"en","type":"article","venue":"Journal of Microelectromechanical Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"Natural Sciences and Engineering Research Council of Canada; University of Waterloo; Université de Sherbrooke; CMC Microsystems","keywords":"Capacitive micromachined ultrasonic transducers; Materials science; Wafer bonding; Wafer; Fabrication; Silicon on insulator; Optoelectronics; LOCOS; Surface micromachining; Microelectromechanical systems; Silicon nitride; Electronic engineering; Silicon; Piezoelectricity; Composite material; Engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.01922763668398653,"gpt":0.2751285167642341,"spread":0.2559008800802476,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000505532,0.0001974524,0.0004381878,0.000210592,0.0001681763,0.0002415732,0.0005200357,0.0001673656,0.000006524972],"category_scores_gemma":[0.000500077,0.000145081,0.00008827294,0.0001710591,0.00003325285,0.0003298512,0.00002863552,0.0005606295,0.00002436925],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000231428,"about_ca_system_score_gemma":0.0001253866,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001082754,"about_ca_topic_score_gemma":0.000003757694,"domain_scores_codex":[0.99852,0.0000305289,0.000521739,0.0001622375,0.0003754914,0.0003899619],"domain_scores_gemma":[0.9986302,0.00009158549,0.0004123437,0.0003886188,0.0003137572,0.0001634904],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004819253,0.0002118919,0.001683592,0.0004921738,0.0004552118,0.0003505069,0.00008918851,0.003490792,0.9745722,0.00583406,0.009182779,0.003155666],"study_design_scores_gemma":[0.004083765,0.003692013,0.001919256,0.001955278,0.0003816203,0.003940372,0.0006525578,0.03632524,0.9297075,0.001898929,0.01408822,0.001355271],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.698122,0.0002190121,0.299393,0.001267869,0.000318798,0.0002862695,0.000002537686,0.0001717931,0.0002187748],"genre_scores_gemma":[0.9958403,0.00001602779,0.003816321,0.00002933425,0.0001818994,0.00001974396,6.984428e-7,0.00004149744,0.00005421487],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2977183,"threshold_uncertainty_score":0.5916233,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3158793502","doi":"10.1109/iscas51556.2021.9401673","title":"Power Delivery for Silicon Interconnect Fabric","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"","keywords":"Decoupling capacitor; Topology (electrical circuits); Capacitor; Ripple; Electronic engineering; Network topology; Electrical engineering; Decoupling (probability); Interconnection; Voltage; Engineering; Interposer; Computer science; Materials science; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.00909530246295118,"gpt":0.1992285984976841,"spread":0.1901332960347329,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000180649,0.00005598593,0.00007075953,0.00002739507,0.00001297664,0.00001285503,0.00005890056,0.00005246562,0.0003204523],"category_scores_gemma":[0.0000368992,0.00005072214,0.0000431251,0.00006479995,0.000009064986,0.00004842678,0.00002608775,0.00004438395,0.00005326759],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00001573807,"about_ca_system_score_gemma":0.00000545716,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000001582908,"about_ca_topic_score_gemma":0.000007410089,"domain_scores_codex":[0.9997196,0.000001610357,0.0000647861,0.00007671066,0.00002424976,0.0001130164],"domain_scores_gemma":[0.9997954,0.00004243748,0.000003321101,0.0001228443,0.00002316179,0.00001284175],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002265459,0.0001190734,0.002004137,0.000373064,0.0005194939,0.0001140411,0.0006509949,0.002938739,0.2456013,0.1144497,0.2306615,0.4025453],"study_design_scores_gemma":[0.0005443299,0.0000822645,0.0008874994,0.00003038372,0.00001615375,0.00002776249,0.001971342,0.01641423,0.8251272,0.005071866,0.1494344,0.000392559],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8573948,0.00157734,0.0663576,0.0002343172,0.0004377678,0.00009724704,0.000006222655,0.001701833,0.07219293],"genre_scores_gemma":[0.9967768,0.00005802934,0.001934883,0.00007512286,0.0000123021,0.00001329925,0.0000031899,0.00001124058,0.001115193],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5795259,"threshold_uncertainty_score":0.3508728,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3173173979","doi":"10.1109/newcas50681.2021.9462767","title":"Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies","year":2021,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":14,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Polytechnique Montréal; Université du Québec en Outaouais","funders":"","keywords":"Transient (computer programming); Finite element method; Reliability (semiconductor); Thermal; Thermal analysis; Heat transfer; Coupling (piping); Computer science; Junction temperature; Thermal transfer; Materials science; System in package; Mechanical engineering; Temperature measurement; Layer (electronics); Electronic engineering; Structural engineering; Engineering; Mechanics; Composite material; Physics","retraction":null,"screen_n_in":null,"score":{"opus":0.04558490358198759,"gpt":0.2765045196547829,"spread":0.2309196160727953,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005378741,0.00007312196,0.0002459272,0.00008289194,0.00001409425,0.000003808325,0.00006875292,0.0000514794,0.00007342669],"category_scores_gemma":[0.0000281523,0.00005555391,0.0001773479,0.0003365829,0.00002416741,0.00001749847,0.00001315275,0.0000351813,0.000001006872],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00001284815,"about_ca_system_score_gemma":0.000007588694,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000001004726,"about_ca_topic_score_gemma":0.00003004848,"domain_scores_codex":[0.9995825,0.000006178906,0.0001428098,0.0000930295,0.00006349328,0.0001120442],"domain_scores_gemma":[0.999634,0.0001195166,0.00001077844,0.000168785,0.00005495597,0.00001197129],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007261818,0.0003339492,0.001215212,0.0007357138,0.01979591,0.00002933933,0.00141223,0.2136119,0.6081379,0.01665225,0.002266615,0.1357364],"study_design_scores_gemma":[0.000602045,0.0001071966,0.001922514,0.0000197985,0.001205745,3.896898e-7,0.002088616,0.212568,0.7800971,0.0005242935,0.0006552436,0.0002091293],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7726325,0.001531931,0.2232417,0.0004052246,0.00009291291,0.0001117804,0.00002332171,0.0003994047,0.001561143],"genre_scores_gemma":[0.9961084,0.00003404933,0.00370966,0.00004301934,0.000005763467,0.00002526161,0.000006241102,0.000008670424,0.00005889945],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2234759,"threshold_uncertainty_score":0.2265423,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2196069668","doi":"10.1109/tim.2015.2477240","title":"Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing Capacitive Coupling","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Instrumentation and Measurement","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Windsor","funders":"CMC Microsystems","keywords":"Through-silicon via; Capacitive coupling; Capacitive sensing; Materials science; Electronic engineering; Three-dimensional integrated circuit; CMOS; Integrated circuit; Insertion loss; Coupling (piping); Wafer; Optoelectronics; Signal integrity; Electrical engineering; Engineering; Printed circuit board; Voltage","retraction":null,"screen_n_in":null,"score":{"opus":0.1195598470326332,"gpt":0.2842163010423921,"spread":0.1646564540097589,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001844959,0.0001528752,0.0001327446,0.0001332314,0.0001371564,0.00007245992,0.0000733858,0.00007989131,0.000009651688],"category_scores_gemma":[0.00001303764,0.000156308,0.00004088587,0.0001032137,0.00003465137,0.0001947536,6.513973e-7,0.0001181245,0.000003647342],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002720411,"about_ca_system_score_gemma":0.00005189983,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002271678,"about_ca_topic_score_gemma":0.00008288862,"domain_scores_codex":[0.9991856,0.000006052675,0.0001939705,0.0001600448,0.0002770949,0.0001772619],"domain_scores_gemma":[0.9995519,0.00004268702,0.00003563001,0.00009183196,0.0001927495,0.00008522458],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006183295,0.001206204,0.0007770855,0.001225615,0.0009467347,0.00001030201,0.004233191,0.370726,0.2261318,0.01230276,0.001276447,0.3805456],"study_design_scores_gemma":[0.002292718,0.0002172131,0.00004995168,0.00009653064,0.00006754521,0.000002069847,0.002864439,0.1637832,0.8295391,0.0006940976,0.0001606408,0.0002325383],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.1162252,0.00002659038,0.8817016,0.0001363566,0.0006625593,0.0004719554,0.00005028586,0.0003748808,0.0003505503],"genre_scores_gemma":[0.998011,0.00004274777,0.001527308,0.000116503,0.00001492583,0.0002487288,0.000005036435,0.00002350559,0.00001023848],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.8817858,"threshold_uncertainty_score":0.6374056,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4290755476","doi":"10.3390/s22155904","title":"Towards Real-Time Monitoring of Thermal Peaks in Systems-on-Chip (SoC)","year":2022,"lang":"en","type":"article","venue":"Sensors","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":13,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Université du Québec en Outaouais; Polytechnique Montréal","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Chip; Field-programmable gate array; Thermal; Integrated circuit; System on a chip; Gate array; Computer science; Electronic circuit; Electronic engineering; Computer hardware; Materials science; Embedded system; Electrical engineering; Engineering; Optoelectronics; Physics; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.01368944135687246,"gpt":0.2168812680898269,"spread":0.2031918267329544,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001162295,0.00009414919,0.0001642674,0.000130026,0.00003201588,0.000005640449,0.0001522973,0.00004869142,0.00004232169],"category_scores_gemma":[0.0000175856,0.0000946678,0.0000357096,0.0001775596,0.00001996892,0.00001983605,0.00005816038,0.0002090188,0.0000252148],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00009072717,"about_ca_system_score_gemma":0.000008169923,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001194724,"about_ca_topic_score_gemma":4.995289e-7,"domain_scores_codex":[0.9993683,0.00002831528,0.0001631528,0.00009944008,0.0001594144,0.0001814214],"domain_scores_gemma":[0.9997096,0.00003514708,0.00002425066,0.0002064846,0.00000795803,0.00001655603],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"observational","study_design_scores_codex":[0.00002191241,0.00003613768,0.01006833,0.0001201325,0.00005083823,0.00007491263,0.001188428,0.9448494,0.03757054,0.000982477,0.0004455627,0.004591324],"study_design_scores_gemma":[0.003674137,0.001237103,0.3372872,0.0007225938,0.00009184839,0.000110888,0.0477462,0.2765044,0.3180963,0.0009855358,0.01082639,0.002717412],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9752215,0.0001519577,0.000002365912,0.0000262388,0.0003634549,0.00009209141,0.00001031963,0.0004178535,0.02371429],"genre_scores_gemma":[0.9993612,0.00004014105,0.0001116716,0.000001003384,0.00004494245,0.00001904118,0.000001402504,0.00002383224,0.0003967766],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.668345,"threshold_uncertainty_score":0.3860441,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2791036357","doi":"10.1088/1361-6439/aaa878","title":"Study on the mechanism of Si–glass–Si two step anodic bonding process","year":2018,"lang":"en","type":"article","venue":"Journal of Micromechanics and Microengineering","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"University of Waterloo; National Natural Science Foundation of China","keywords":"Anodic bonding; Anode; Mechanism (biology); Materials science; Process (computing); Silicon; Optoelectronics; Chemistry; Computer science; Physical chemistry; Physics; Electrode","retraction":null,"screen_n_in":null,"score":{"opus":0.01224875648229883,"gpt":0.2265101055769904,"spread":0.2142613490946915,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004346234,0.0002244201,0.0003517575,0.000292272,0.00007814557,0.00004125235,0.0003447315,0.00007758885,0.000009306939],"category_scores_gemma":[0.00004322891,0.0001631681,0.00007984183,0.0002670544,0.00003962704,0.0001094194,0.00007126705,0.000386296,0.000003158436],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00004828242,"about_ca_system_score_gemma":0.00001755675,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000001875055,"about_ca_topic_score_gemma":0.000002374021,"domain_scores_codex":[0.9989346,0.00001323208,0.0004611315,0.0001266654,0.0001881411,0.0002762699],"domain_scores_gemma":[0.9993832,0.00005452855,0.0001651106,0.0002097524,0.0001317759,0.00005559202],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001768536,0.00007434857,0.00004002553,0.00008723581,0.0002048719,0.00003349768,0.001267217,0.0003039553,0.9853814,0.01025871,0.0002426265,0.002088417],"study_design_scores_gemma":[0.001372761,0.001438864,0.00009618433,0.000502125,0.0001297833,0.000418413,0.005725914,0.01418865,0.972106,0.002677194,0.0009575279,0.0003865856],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9760917,0.0006866491,0.02223622,0.00007978999,0.0005270734,0.0001876027,0.00000561007,0.00008666408,0.00009872727],"genre_scores_gemma":[0.9986992,0.0001484082,0.0009493274,0.00002076565,0.0001143123,0.000003742172,2.34623e-7,0.00004526944,0.00001873794],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.02260754,"threshold_uncertainty_score":0.6653802,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2063069455","doi":"10.1016/j.microrel.2003.08.013","title":"Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements","year":2003,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McMaster University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Soldering; Photoluminescence; Optoelectronics; Laser; Diode; Finite element method; Silicon; Polarization (electrochemistry); Semiconductor laser theory; Composite material; Optics; Structural engineering; Chemistry; Physics; Engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.02913575713163789,"gpt":0.2570071989924409,"spread":0.227871441860803,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000516217,0.0001478663,0.0002078379,0.00008417113,0.00003276319,0.00001578409,0.0003643305,0.0001435909,0.00003186383],"category_scores_gemma":[0.0004559039,0.0001643066,0.00003012832,0.0003490022,0.0000579128,0.0002378759,0.00004299437,0.0003095059,0.000003793303],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003132358,"about_ca_system_score_gemma":0.00007804186,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003128504,"about_ca_topic_score_gemma":0.0004623552,"domain_scores_codex":[0.9987755,0.00005190157,0.0003544776,0.0003250121,0.000169238,0.0003238104],"domain_scores_gemma":[0.9990001,0.00006972291,0.00005797154,0.0008026175,0.00004202383,0.00002753376],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001028167,0.00008445074,0.06384952,0.00005067451,0.00002412665,8.730656e-7,0.00006117912,0.001485622,0.9329832,0.0001858692,0.0001075294,0.001156682],"study_design_scores_gemma":[0.0007927025,0.00004579846,0.02222174,0.00007101983,0.0000339623,0.000002449521,0.0001973285,0.0162988,0.9535148,0.002288481,0.004157678,0.0003752784],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9848298,0.0009569846,0.01319027,0.00002779827,0.0001145487,0.0002237579,0.0001247672,0.0001827159,0.0003493669],"genre_scores_gemma":[0.9956754,0.00008095108,0.004051133,0.000005206733,0.000005449324,0.000007735728,0.0001390241,0.00001883379,0.00001619318],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.04162778,"threshold_uncertainty_score":0.6700229,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4212833482","doi":"10.1002/047134608x.w8433","title":"Wafer‐Scale Integration","year":2022,"lang":"en","type":"other","venue":"Wiley Encyclopedia of Electrical and Electronics Engineering","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"","keywords":"Wafer; Interconnection; Scalability; Wafer-scale integration; System integration; Scale (ratio); Chip; Computer science; Key (lock); Systems engineering; Scaling; Chip-scale package; Integration platform; Embedded system; Nanotechnology; Engineering; Materials science; Telecommunications; Physics; Database; Operating system","retraction":null,"screen_n_in":null,"score":{"opus":0.002490535453082054,"gpt":0.1669719437089376,"spread":0.1644814082558555,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005399329,0.0002363795,0.0002877098,0.0003299595,0.00002239202,0.000008503422,0.0001661063,0.0001871337,0.0003472682],"category_scores_gemma":[0.00002881469,0.0002386584,0.00005455095,0.0004221132,0.00002102725,0.00003941226,0.00004209093,0.0005040089,0.000004190212],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00008871416,"about_ca_system_score_gemma":0.00002143204,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001046848,"about_ca_topic_score_gemma":0.00001016588,"domain_scores_codex":[0.9990844,0.000006271097,0.0001967082,0.0001864884,0.0001428027,0.000383357],"domain_scores_gemma":[0.9996965,0.000032533,0.00003373627,0.0001754163,0.000007503153,0.0000543004],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00002578858,0.0001590761,0.0008364849,0.0006753264,0.0005321592,0.00002419217,0.0002882031,0.008208048,0.007303852,0.07843091,0.3366898,0.5668262],"study_design_scores_gemma":[0.0002223641,0.0001902817,0.00007962941,0.00005418939,0.00004578924,0.00001930862,0.00001261261,0.03043218,0.001086402,0.0004978708,0.966881,0.0004783368],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.004916295,0.1124304,0.02591137,0.00004994307,0.0004861294,0.0004367659,0.00002336979,0.003861626,0.8518841],"genre_scores_gemma":[0.4647643,0.3966559,0.01416247,0.00005677968,0.000908794,0.00043558,0.0001718267,0.002317326,0.1205271],"genre_candidate":"other","genre_consensus":null,"teacher_disagreement_score":0.731357,"threshold_uncertainty_score":0.9732207,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2040339639","doi":"10.1109/tdmr.2015.2401035","title":"Study of Near-Surface Stresses in Silicon Around Through-Silicon Vias at Elevated Temperatures by Raman Spectroscopy and Simulations","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Device and Materials Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"University of British Columbia","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Materials science; Silicon; Stress (linguistics); Raman spectroscopy; Thermal expansion; Shrinkage; Composite material; Through-silicon via; Spectroscopy; Optoelectronics; Optics","retraction":null,"screen_n_in":null,"score":{"opus":0.01968514828641314,"gpt":0.2652793448116388,"spread":0.2455941965252256,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001759761,0.0002022111,0.0003612602,0.00003238487,0.00009072843,0.00006240344,0.00007843727,0.0001405611,0.00002394772],"category_scores_gemma":[0.00001922285,0.0001832714,0.00001761299,0.0001834211,0.0001210587,0.0002184296,0.000004705784,0.0001400802,0.000002765029],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000107715,"about_ca_system_score_gemma":0.00001771701,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0006872707,"about_ca_topic_score_gemma":0.0006524246,"domain_scores_codex":[0.9989507,0.00007705115,0.0003613843,0.0002821234,0.00012348,0.0002052293],"domain_scores_gemma":[0.9994263,0.0001234508,0.00004262056,0.0003047029,0.00004799378,0.00005491036],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002484804,0.0007612823,0.007947112,0.000298838,0.0000807771,0.000003829577,0.003000208,0.09561645,0.8917242,0.00001123145,0.000179806,0.0001278234],"study_design_scores_gemma":[0.001143872,0.0004047139,0.002646291,0.00003947014,0.00004591831,0.000002896135,0.002119018,0.001720391,0.9913173,0.000239115,0.0001103394,0.0002107087],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9981611,0.0002330108,0.0004363288,0.00004790455,0.0002028387,0.000543209,0.0001378549,0.000216317,0.00002141806],"genre_scores_gemma":[0.9995047,0.0002114646,0.0002038968,0.00001077721,0.00000653496,0.00002205237,0.00000763756,0.00001950018,0.00001339027],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.09959311,"threshold_uncertainty_score":0.7473592,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4283710572","doi":"10.1109/isqed54688.2022.9806286","title":"Integrated Power Delivery Methodology for 3D ICs","year":2022,"lang":"en","type":"article","venue":"2022 23rd International Symposium on Quality Electronic Design (ISQED)","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"Natural Sciences and Engineering Research Council of Canada; Nature","keywords":"Three-dimensional integrated circuit; Parasitic extraction; Power network design; Integrated circuit; Chip; Electronic engineering; Computer science; Power domains; Power management; Voltage; Power (physics); Electrical engineering; Engineering","retraction":null,"screen_n_in":null,"score":{"opus":0.05610639359177479,"gpt":0.3040692019487737,"spread":0.247962808356999,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.001872791,0.0003161726,0.0003696339,0.0002480351,0.0002231083,0.00004706674,0.0008322492,0.0001540414,0.001199776],"category_scores_gemma":[0.0001884049,0.000337547,0.0002082368,0.0003428911,0.0000682996,0.0001325585,0.0001664845,0.0008631891,0.00004392686],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00139209,"about_ca_system_score_gemma":0.0001541289,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004520967,"about_ca_topic_score_gemma":0.00001227112,"domain_scores_codex":[0.997327,0.0004646441,0.0005499856,0.0004798568,0.0005146865,0.0006637933],"domain_scores_gemma":[0.9983711,0.0009630223,0.0001300485,0.0003430417,0.0001377918,0.00005505925],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.001971567,0.0006920566,0.0001847115,0.0000800484,0.002158326,0.00002864051,0.0008446794,0.1188557,0.215067,0.5264012,0.08765491,0.04606118],"study_design_scores_gemma":[0.002747996,0.003101079,0.0001622975,0.00002490028,0.0001110756,0.00009025011,0.001334131,0.1586257,0.06035851,0.04381568,0.7280825,0.001545908],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.0573119,0.001298838,0.9204165,0.002989622,0.003800347,0.00127442,0.0003999581,0.001999503,0.01050891],"genre_scores_gemma":[0.9822372,0.0003764143,0.01262197,0.0008830776,0.000125403,0.001083206,0.0003264169,0.0001007196,0.002245583],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.9249253,"threshold_uncertainty_score":0.9999077,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2114029889","doi":"10.1109/impact.2012.6420220","title":"Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay","year":2012,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of British Columbia","funders":"","keywords":"Capacitance; Miniaturization; Scaling; Interconnection; Stress (linguistics); Materials science; Dimension (graph theory); Electronic engineering; Transmission (telecommunications); SIGNAL (programming language); Computer science; Engineering; Telecommunications; Nanotechnology; Electrode; Physics","retraction":null,"screen_n_in":null,"score":{"opus":0.027046138112824,"gpt":0.2409879020778878,"spread":0.2139417639650638,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004784572,0.00007687999,0.00007647504,0.00002331658,0.00004343684,0.00003177139,0.00003024305,0.00007150908,0.00004981037],"category_scores_gemma":[0.000009744549,0.00005348475,0.000009601775,0.00002799971,0.00001654415,0.0001376103,0.000008936456,0.00006226189,0.000004032087],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00001051002,"about_ca_system_score_gemma":0.000004023978,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000005370975,"about_ca_topic_score_gemma":0.00001701608,"domain_scores_codex":[0.9996486,0.000003052118,0.00006658028,0.00006890117,0.00004272617,0.0001701578],"domain_scores_gemma":[0.9998162,0.00005338475,0.000008208673,0.00008049895,0.00001213099,0.00002958506],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001418542,0.0001985785,0.007607006,0.0003517492,0.0003118588,0.000005986453,0.0005018337,0.05624123,0.01359961,0.6821396,0.003454412,0.2354463],"study_design_scores_gemma":[0.002259034,0.0007340515,0.005654599,0.0001426303,0.00008702864,0.00004278048,0.004497143,0.1957493,0.7805561,0.007690669,0.001640352,0.0009462776],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8797892,0.0002258677,0.1116382,0.00004737169,0.00006699612,0.0002084868,0.000006346549,0.0005503582,0.00746727],"genre_scores_gemma":[0.995468,0.00001845727,0.004347183,0.00002339213,0.00003439929,0.00002414214,0.000003504628,0.00001389763,0.00006708768],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7669565,"threshold_uncertainty_score":0.2181045,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2319599348","doi":"10.1109/tcpmt.2014.2377375","title":"Capacitance and Conductance of Through Silicon Vias With Consideration of Multilayer Media and Different Shapes","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Capacitance; Conductance; Materials science; RADIUS; Silicon; Optoelectronics; Acoustics; Optics; Physics; Condensed matter physics; Computer science; Electrode","retraction":null,"screen_n_in":null,"score":{"opus":0.03071623851263045,"gpt":0.2196587963073834,"spread":0.188942557794753,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00003737955,0.0001754462,0.000295321,0.0001952594,0.00005418278,0.000009320333,0.00006166986,0.000137164,0.000001952238],"category_scores_gemma":[0.000005498708,0.0001462359,0.00001335898,0.00005683224,0.0004242963,0.0001103057,0.000003401601,0.0002210063,2.96426e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00001832366,"about_ca_system_score_gemma":0.000004752353,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002972785,"about_ca_topic_score_gemma":0.0000552521,"domain_scores_codex":[0.9993561,0.00001009535,0.0001893553,0.0001961617,0.00009301821,0.0001552605],"domain_scores_gemma":[0.9996515,0.0000780034,0.00005558011,0.0001518765,0.00002651736,0.00003651765],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004419728,0.0004749616,0.008015709,0.001495246,0.0009616473,0.00004537573,0.009180402,0.01925009,0.8476061,0.003670407,0.0001375876,0.1087205],"study_design_scores_gemma":[0.0008855776,0.0001252081,0.002090236,0.0001513335,0.00003460627,0.0000547187,0.0007864728,0.002647375,0.9898561,0.003171382,0.00003188995,0.0001651245],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9408581,0.0005728122,0.05777945,0.0001843693,0.00009314127,0.0001252802,0.00001538265,0.0003347671,0.00003666168],"genre_scores_gemma":[0.9971071,0.0004598553,0.002385448,0.000007743214,0.000003381427,0.00001466275,8.257493e-7,0.00001652687,0.000004385728],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1422499,"threshold_uncertainty_score":0.5963326,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2053161408","doi":"10.2320/matertrans.m2009314","title":"A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging","year":2010,"lang":"en","type":"article","venue":"MATERIALS TRANSACTIONS","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"National Research Foundation of Korea; National Research Foundation","keywords":"Bumping; Materials science; Electroplating; Wafer; Etching (microfabrication); Polishing; Layer (electronics); Metallurgy; Deep reactive-ion etching; Soldering; Chemical-mechanical planarization; Reactive-ion etching; Silicon; Composite material; Optoelectronics","retraction":null,"screen_n_in":null,"score":{"opus":0.006401410241892618,"gpt":0.2173936218425649,"spread":0.2109922116006723,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005948079,0.0001593526,0.000168702,0.00006691798,0.0001729997,0.00005959154,0.0001058177,0.0001228643,0.0001779251],"category_scores_gemma":[0.00001234061,0.0001518372,0.00004230689,0.00007266884,0.00001891308,0.0001118027,0.000002595883,0.0001821761,0.00001644396],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002025279,"about_ca_system_score_gemma":0.00002174043,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00003164113,"about_ca_topic_score_gemma":0.0001259623,"domain_scores_codex":[0.9992647,0.000002501451,0.0001877425,0.000166634,0.00008882731,0.0002896653],"domain_scores_gemma":[0.9997116,0.00004953531,0.00002709751,0.0001468451,0.00001917674,0.00004577538],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001622099,0.00001459812,0.00001002506,0.00008827814,0.00003359891,9.11997e-7,0.00005734284,0.002634885,0.9874411,0.0001169746,0.0003498337,0.009236193],"study_design_scores_gemma":[0.0003529004,0.00005107955,0.00009130892,0.000058908,0.00002588126,0.000006585653,0.00003166556,0.006191108,0.9904975,0.001653923,0.0008175373,0.0002216085],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5994211,0.00002105106,0.3985518,0.0001727013,0.0006861889,0.0002436499,0.00006077012,0.0006644578,0.0001783307],"genre_scores_gemma":[0.9952753,0.000005072045,0.004343803,0.00002062309,0.0001144459,0.0001119988,0.00002174471,0.00004624277,0.00006082345],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3958542,"threshold_uncertainty_score":0.619174,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2344622367","doi":"10.1109/tvlsi.2015.2496312","title":"A Mismatch-Insensitive Skew Compensation Architecture for Clock Synchronization in 3-D ICs","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"Dalhousie University","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Jitter; Clock skew; Skew; Computer science; Electronic engineering; Network topology; Synchronization (alternating current); Clock domain crossing; Compensation (psychology); CMOS; Static timing analysis; Topology (electrical circuits); Clock signal; Detector; Synchronous circuit; Engineering; Electrical engineering; Telecommunications","retraction":null,"screen_n_in":null,"score":{"opus":0.01665280393413697,"gpt":0.2273678569011584,"spread":0.2107150529670214,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003047352,0.0002813952,0.0003391795,0.0004094077,0.0001205678,0.00008809457,0.0001230217,0.0003336077,0.000006831835],"category_scores_gemma":[0.00002205937,0.0002706381,0.0001082577,0.0004660341,0.00004334991,0.0002612831,0.000001220989,0.0003842131,0.00004771277],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004876933,"about_ca_system_score_gemma":0.00006240642,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00009186401,"about_ca_topic_score_gemma":0.001265237,"domain_scores_codex":[0.9985299,0.00008460222,0.0004917585,0.0002948318,0.0002722991,0.0003266819],"domain_scores_gemma":[0.9992292,0.000122062,0.0000776212,0.0002590576,0.0002264133,0.00008562547],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001346394,0.0002259936,0.00005655234,0.0002419921,0.00009204118,0.000007242667,0.004109933,0.9714618,0.003107143,0.001208285,0.002031472,0.01732286],"study_design_scores_gemma":[0.001644781,0.0002227696,0.00006905185,0.0004050895,0.00004568157,0.00003926556,0.005616044,0.9587127,0.02948067,0.0005422339,0.002773388,0.0004483548],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.06217448,0.0001745431,0.9332147,0.000137439,0.00189165,0.0009823854,0.0001907604,0.0007677147,0.0004663041],"genre_scores_gemma":[0.9974864,0.00003694014,0.001648647,0.0000347299,0.0000988192,0.0003014538,0.00009112565,0.00005411237,0.0002478399],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.9353119,"threshold_uncertainty_score":0.9999746,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}