{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":7,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":7,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"c2cb7ac1213e","filters":{"venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)"}},"results":[{"id":"W2346385517","doi":"10.4071/2016cicmt-tha22","title":"A comparative study on four different transmission lines in LTCC for 60 GHz applications","year":2016,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"Microwave Engineering and Waveguides","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Stripline; Microstrip; Bandwidth (computing); Wireless; Telecommunications; Transmission line; Electronic engineering; Electrical engineering; Coplanar waveguide; Fabrication; Ceramic; Insertion loss; Computer science; Engineering; Materials science; Microwave","authors":[{"name":"Aria Isapour","is_ca":true},{"name":"Dorra Bahloul","is_ca":true},{"name":"Ammar B. Kouki","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04486140176488416,"gpt":0.2793908088951091,"spread":0.234529407130225,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001475212,0.0003827969,0.0004414032,0.0003181963,0.0001324816,0.00006304569,0.0002827433,0.00009465602,0.00062428],"category_scores_gemma":[0.00003293808,0.0002821401,0.0001166755,0.0002503802,0.0000573314,0.0001320031,0.00002221605,0.0002008679,0.00009259115],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001173972,"about_ca_system_score_gemma":0.00004836921,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001112416,"about_ca_topic_score_gemma":0.00007660865,"domain_scores_codex":[0.9983423,0.0000515335,0.0004698974,0.0004526517,0.0002818332,0.0004017721],"domain_scores_gemma":[0.9985062,0.0008740362,0.00006663594,0.0002741881,0.0001377379,0.0001411708],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0009754386,0.007095715,0.01869866,0.002726886,0.00322816,0.0001824225,0.02417664,0.1022076,0.2280648,0.02522079,0.1374499,0.449973],"study_design_scores_gemma":[0.01144153,0.001952548,0.2288247,0.006005067,0.0003753842,0.00006673799,0.006295281,0.1269168,0.02020901,0.01170897,0.5812401,0.004963901],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6615314,0.0005359647,0.3201604,0.001631521,0.0004130811,0.003284735,0.005275263,0.001188284,0.00597938],"genre_scores_gemma":[0.9966992,0.00003019392,0.001031995,0.00005414825,0.000229923,0.001143437,0.000444484,0.00004609807,0.00032056],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4450091,"threshold_uncertainty_score":0.9999631,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2756368836","doi":"10.4071/2017dpc-tha1_presentation1","title":"Plasmon Rulers for 3D IC Alignment","year":2017,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"Nanofabrication and Lithography Techniques","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Simon Fraser University","funders":"","keywords":"Plasmon; Nanotechnology; Materials science; Optoelectronics","authors":[{"name":"Hao Jiang","is_ca":true},{"name":"Jasbir N. Patel","is_ca":true},{"name":"Bożena Kamińska","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02746928339931395,"gpt":0.2698458820778556,"spread":0.2423765986785417,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0002006175,0.0003080097,0.0002877843,0.000233752,0.0005877133,0.0003453752,0.0006184833,0.00013075,0.002488299],"category_scores_gemma":[0.00008308618,0.0003139257,0.0001795752,0.0001113768,0.0001773018,0.0003802137,0.00005531355,0.0001829488,0.0001087747],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00007726785,"about_ca_system_score_gemma":0.00006805566,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004781256,"about_ca_topic_score_gemma":0.00003832577,"domain_scores_codex":[0.9984676,0.00002499353,0.0003592687,0.0003827179,0.0003470078,0.0004184505],"domain_scores_gemma":[0.9986655,0.0002224485,0.000183619,0.0005839707,0.0001835109,0.0001610185],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001158422,0.0003453096,0.01293958,0.0008944516,0.001134177,0.00003720712,0.001376296,0.0004901151,0.008994845,0.1168439,0.5249743,0.3318539],"study_design_scores_gemma":[0.0006537072,0.00008797635,0.02420153,0.0003362892,0.00008144762,0.0000168763,0.0002206995,0.008799687,0.003919472,0.005286096,0.9555876,0.0008086102],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.09401241,0.002011488,0.256215,0.0102022,0.004024246,0.005239931,0.03300376,0.009679789,0.5856112],"genre_scores_gemma":[0.9763859,0.00009683771,0.02004994,0.0003017547,0.0002395749,0.0005686742,0.001776498,0.00005680581,0.000524014],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.8823735,"threshold_uncertainty_score":0.9999313,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2347065509","doi":"10.4071/2016cicmt-wa13","title":"MEMS Fabrication on LTCC Substrates for RF Applications: Challenges and Perspectives","year":2016,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"Electrical and Thermal Properties of Materials","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Microelectromechanical systems; Fabrication; Polishing; Chemical-mechanical planarization; Materials science; Ceramic; Surface roughness; Substrate (aquarium); Surface finish; Transceiver; Process (computing); Electronic engineering; Mechanical engineering; Nanotechnology; Optoelectronics; Computer science; Engineering; Composite material","authors":[{"name":"Dorra Bahloul","is_ca":true},{"name":"Achraf Ben Amar","is_ca":true},{"name":"Ammar B. Kouki","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04631850318735394,"gpt":0.2349285013945454,"spread":0.1886099982071915,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001314369,0.0002206217,0.0002162663,0.0001091779,0.0001450946,0.00007199722,0.0001811758,0.00008471841,0.0009026777],"category_scores_gemma":[0.00009151489,0.0001558693,0.00005327212,0.00007713425,0.0001180759,0.0002240664,0.00001980496,0.00007738989,0.0001336744],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00006235229,"about_ca_system_score_gemma":0.00002777675,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000006627869,"about_ca_topic_score_gemma":0.00001105672,"domain_scores_codex":[0.9989316,0.00002512251,0.0002369322,0.0003509972,0.0001799879,0.0002753024],"domain_scores_gemma":[0.998848,0.0006081918,0.0000672997,0.0001712798,0.0002134372,0.00009180285],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001209008,0.0001660796,0.0000728312,0.0004470749,0.0002907808,0.000001876279,0.0009944853,0.00006704571,0.05959965,0.1406449,0.004019374,0.793575],"study_design_scores_gemma":[0.0028156,0.00108704,0.03456154,0.001737632,0.0002018567,0.00005171802,0.003721403,0.001467118,0.0691326,0.1451156,0.7373213,0.002786621],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5698863,0.1381891,0.0341335,0.05770991,0.001281533,0.00817754,0.01650918,0.006241192,0.1678718],"genre_scores_gemma":[0.9954863,0.002545195,0.0003526849,0.00009155097,0.0003462834,0.0007330652,0.0001956744,0.00003222594,0.000216976],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7907884,"threshold_uncertainty_score":0.9883688,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2347054149","doi":"10.4071/2016cicmt-wa12","title":"Fabrication of LTCC Micro-fluidic Devices For Wireless Lab-On-A-Chip Applications","year":2016,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"Electrical and Thermal Properties of Materials","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"École de Technologie Supérieure","funders":"","keywords":"Fabrication; Materials science; Capacitive sensing; Microfluidics; Fluidics; Capacitance; Ceramic; Optoelectronics; Chip; Lamination; Microelectromechanical systems; Capacitance probe; Permittivity; Dielectric; Electrical engineering; Electronic engineering; Nanotechnology; Capacitor; Electrode; Engineering; Composite material; Voltage; Layer (electronics)","authors":[{"name":"Achraf Ben Amar","is_ca":true},{"name":"Houssem Eddine Amor","is_ca":true},{"name":"Hung Cao","is_ca":false},{"name":"Ammar B. Kouki","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02118912601856663,"gpt":0.2288600288582825,"spread":0.2076709028397159,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0001717841,0.0002608463,0.0003273319,0.0001612781,0.0001491755,0.00005396431,0.0003976322,0.0001105663,0.001760904],"category_scores_gemma":[0.00007341588,0.0001906328,0.0001130773,0.0002232595,0.0001288541,0.0002072417,0.00003392706,0.00009238995,0.0002814172],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00006487021,"about_ca_system_score_gemma":0.00007195261,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001748054,"about_ca_topic_score_gemma":0.00001259312,"domain_scores_codex":[0.9985243,0.00004734168,0.0004744965,0.0003318704,0.0002695457,0.0003524209],"domain_scores_gemma":[0.9983829,0.0007318144,0.0001534832,0.0002772944,0.0003481321,0.000106367],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001196518,0.0002328642,0.0008885633,0.0008237623,0.0003614109,0.000001387872,0.0001930527,0.0001414763,0.7359077,0.02836209,0.02063626,0.2123317],"study_design_scores_gemma":[0.001953981,0.0004965765,0.01763322,0.001617302,0.0001994777,0.00001746628,0.000174019,0.001369315,0.3665603,0.01711871,0.5912399,0.00161981],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9077799,0.00232992,0.04258129,0.00457721,0.0006691897,0.002596292,0.01702053,0.001441795,0.02100386],"genre_scores_gemma":[0.9970222,0.00009147871,0.0007144055,0.0002604634,0.0003123216,0.000591956,0.000680038,0.00004450367,0.0002826745],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5706036,"threshold_uncertainty_score":0.9991516,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2192582977","doi":"10.4071/hiten-session3b-paper3b_2","title":"“Turning ceramic on its head” – a polymer based packaging system for operation over 175°C","year":2015,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Head (geology); Ceramic; Polymer; Materials science; Electronic circuit; Electronic packaging; Printed circuit board; SIGNAL (programming language); Electrical engineering; Optoelectronics; Computer science; Engineering; Composite material","authors":[{"name":"P. Tremlett","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05793566208622742,"gpt":0.2785982126758502,"spread":0.2206625505896228,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003094279,0.0004729975,0.0004668247,0.0002852936,0.0003015572,0.0003166859,0.0002649578,0.0001594582,0.0007711001],"category_scores_gemma":[0.000200165,0.0004702833,0.0001265481,0.0002394585,0.00005606644,0.0004688768,0.0000308427,0.0002449421,0.0002065518],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003095693,"about_ca_system_score_gemma":0.0001743365,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00005684332,"about_ca_topic_score_gemma":0.00005363846,"domain_scores_codex":[0.9977173,0.0001059469,0.0005431719,0.0005276955,0.0005010072,0.0006048932],"domain_scores_gemma":[0.9984326,0.0005334007,0.0001530184,0.0003069309,0.0002964844,0.0002775068],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0003578837,0.0001544219,0.0005831693,0.001484186,0.0003945298,0.00008340472,0.001167471,0.8194398,0.1094058,0.03477501,0.02178918,0.01036514],"study_design_scores_gemma":[0.005415811,0.0005186588,0.003685836,0.004376404,0.0002485242,0.0001331804,0.001870734,0.7377957,0.1305253,0.0008338657,0.1114282,0.00316778],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7558839,0.002280188,0.1359906,0.001862659,0.007676599,0.002548525,0.01578907,0.007832521,0.07013597],"genre_scores_gemma":[0.9928417,0.000004779271,0.001874762,0.0004649189,0.0006935618,0.0002206721,0.003356486,0.0001123711,0.00043079],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2369578,"threshold_uncertainty_score":0.9997749,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2247983858","doi":"10.4071/2011dpc-tp14","title":"A Novel Approach to 3D Chip Stacking","year":2011,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"ON Semiconductor (Canada)","funders":"","keywords":"Application-specific integrated circuit; Flexibility (engineering); System in package; Die (integrated circuit); Miniaturization; Three-dimensional integrated circuit; Integrated circuit; Interposer; Chip; Embedded system; Computer science; Package on package; Integrated circuit packaging; Chip-scale package; Interconnection; System on a chip; Stacking; Electronic engineering; Engineering; Electrical engineering; Nanotechnology; Materials science; Telecommunications; Layer (electronics); Operating system","authors":[{"name":"Mark Vandermeulen","is_ca":true},{"name":"Andrew D. Smith","is_ca":false},{"name":"Ron Csermak","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05978361744578992,"gpt":0.224049136916589,"spread":0.1642655194707991,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000178571,0.0004017805,0.0003554549,0.0003787509,0.0001943961,0.0001103336,0.0006597866,0.0001871063,0.0024025],"category_scores_gemma":[0.0001591196,0.0003935644,0.0001056325,0.0005872354,0.0001532419,0.0003668663,0.0001518974,0.000433195,0.0005000043],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00009216506,"about_ca_system_score_gemma":0.00008454049,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001103618,"about_ca_topic_score_gemma":0.00003039472,"domain_scores_codex":[0.9980192,0.00002342893,0.0004013904,0.0005016424,0.0004338323,0.0006204788],"domain_scores_gemma":[0.9989293,0.0001650571,0.0000765038,0.0004411853,0.0002011351,0.0001867679],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001977688,0.001841279,0.005455885,0.001204615,0.002333169,0.00017874,0.02324719,0.009267188,0.01124475,0.4636571,0.1574329,0.3239395],"study_design_scores_gemma":[0.00265186,0.0005923802,0.07012326,0.001855459,0.0004291922,0.0007786297,0.01950525,0.04633685,0.006950049,0.01619321,0.8282848,0.006299086],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.02515669,0.0005934545,0.1677409,0.0004253079,0.0005629115,0.0006738929,0.002931426,0.004285653,0.7976298],"genre_scores_gemma":[0.9192817,0.00002331893,0.07892852,0.0005323081,0.0001564158,0.0001802194,0.0006394875,0.00006266116,0.0001953271],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.894125,"threshold_uncertainty_score":0.9998516,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2319926189","doi":"10.4071/2012dpc-wp21","title":"Laddered-UBM Structure: Bump Reliability Improvement through Distribution of Load Concentration Points","year":2012,"lang":"en","type":"article","venue":"Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Flip chip; Materials science; Soldering; Bending; Enhanced Data Rates for GSM Evolution; Stress (linguistics); Structural engineering; Die (integrated circuit); Substrate (aquarium); Composite material; Layer (electronics); Engineering","authors":[{"name":"Roden Topacio","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01385232920948679,"gpt":0.2326590516396746,"spread":0.2188067224301878,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0002909965,0.0003656174,0.0003849829,0.00005187112,0.0001768829,0.00006348885,0.00034501,0.0002180693,0.001013682],"category_scores_gemma":[0.0002587266,0.0003589175,0.0001185736,0.000340473,0.0002560688,0.0006003152,0.00007743018,0.0004683037,0.00003616282],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000462861,"about_ca_system_score_gemma":0.0001916401,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0000906542,"about_ca_topic_score_gemma":0.00003383811,"domain_scores_codex":[0.9977548,0.00005862671,0.0005095559,0.0003602013,0.0005784152,0.0007384536],"domain_scores_gemma":[0.9987079,0.0002233477,0.0001935724,0.0004663204,0.000298202,0.0001106779],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002928711,0.001518121,0.06903422,0.004012502,0.002582504,0.00002330977,0.010693,0.0122425,0.2499833,0.2556868,0.2735091,0.1204218],"study_design_scores_gemma":[0.004407528,0.0009352242,0.1472243,0.002112187,0.0006732095,0.0001682222,0.004402918,0.02529706,0.4272517,0.08178999,0.3008043,0.00493341],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9730823,0.001585758,0.01109249,0.001007094,0.0007149687,0.00050244,0.006359372,0.001478882,0.004176705],"genre_scores_gemma":[0.9947948,0.00012141,0.001389163,0.00007178464,0.0001683107,0.00005491345,0.003326384,0.00003158068,0.00004165402],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1772684,"threshold_uncertainty_score":0.9998995,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}