{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":9,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":9,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"c15ee3040bce","filters":{"venue":"IEEE Transactions on Electronics Packaging Manufacturing"}},"results":[{"id":"W2103214730","doi":"10.1109/tepm.2004.843083","title":"Modeling of Positive-Displacement Fluid Dispensing Processes","year":2004,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Additive Manufacturing and 3D Printing Technologies","field":"Engineering","cited_by":67,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Saskatchewan","funders":"","keywords":"Piston (optics); Displacement (psychology); Fluid motion; Fluid dynamics; Compressibility; Volume (thermodynamics); Positive displacement meter; Mechanics; Materials science; Work (physics); Volume of fluid method; Mechanical engineering; Flow (mathematics); Engineering; Thermodynamics; Physics","authors":[{"name":"Daniel Chen","is_ca":true},{"name":"J. Kai","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0099530633088824,"gpt":0.2139678051452885,"spread":0.2040147418364061,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004150154,0.001006823,0.001031483,0.0005351161,0.0005786477,0.001847962,0.00207434,0.002615353,0.003408259],"category_scores_gemma":[0.001104741,0.0005645641,0.0007853392,0.0005308054,0.000744772,0.001079129,0.0008528486,0.0008371897,0.0008924616],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009898193,"about_ca_system_score_gemma":0.001135253,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.01050802,"about_ca_topic_score_gemma":0.003839771,"domain_scores_codex":[0.9996758,0.00004461472,0.00002187739,0.00007803604,0.0001342655,0.00004540096],"domain_scores_gemma":[0.9996401,0.0001583359,0.00007570783,0.00002105105,0.00008532672,0.00001954725],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00003103102,0.00003021242,0.000252949,0.00007396239,0.000006135285,0.0001271392,0.00004517062,0.9849073,0.00433572,0.006739749,0.0001967429,0.003253955],"study_design_scores_gemma":[0.000004294654,0.00001174237,0.00005419586,0.000002927644,0.000002397074,0.00001488043,0.000004094292,0.9980693,0.000603231,0.0007298309,0.0004986937,0.000004316355],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.05910536,0.001156025,0.9077168,0.0005096431,0.0001637267,0.0002603348,0.0006823933,0.0007156903,0.0296901],"genre_scores_gemma":[0.9180642,0.001800679,0.04910434,0.0001006275,0.00005848886,0.0006287018,0.0005239776,0.00009952233,0.02961945],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.01050802,"threshold_uncertainty_score":0.02089375,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2165136139","doi":"10.1109/6104.895075","title":"Modeling of time-pressure fluid dispensing processes","year":2000,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Injection Molding Process and Properties","field":"Engineering","cited_by":62,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Saskatchewan","funders":"","keywords":"Fluid dynamics; Fluid pressure; Process (computing); Materials science; Volumetric flow rate; Flow (mathematics); Mechanical engineering; Process engineering; Computer science; Mechanics; Engineering; Physics","authors":[{"name":"Daniel Chen","is_ca":true},{"name":"G. Shoenau","is_ca":false},{"name":"Wenjun Zhang","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007564136803124713,"gpt":0.1922164563825065,"spread":0.1846523195793818,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004671815,0.001140338,0.001109658,0.0006226589,0.0006198062,0.00184697,0.002311767,0.003277679,0.003277414],"category_scores_gemma":[0.001373144,0.0005342183,0.001046927,0.0005957979,0.0007310249,0.001447527,0.0008166124,0.001092429,0.0009694928],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009286591,"about_ca_system_score_gemma":0.001263819,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.009049506,"about_ca_topic_score_gemma":0.00250125,"domain_scores_codex":[0.9995389,0.00006031207,0.0000307705,0.00009439213,0.0002127766,0.00006291392],"domain_scores_gemma":[0.9995549,0.0001857234,0.00008585326,0.00003433768,0.0001092561,0.00002978079],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00003503113,0.00003771948,0.0001917874,0.00007184653,0.000008209597,0.0001260452,0.00004984853,0.9791679,0.006387585,0.01008732,0.0002003804,0.003636352],"study_design_scores_gemma":[0.00000579732,0.00001163021,0.00003667907,0.000002703231,0.000002496328,0.00001647463,0.000003662745,0.9973983,0.0009221526,0.0008625844,0.0007330073,0.000004521218],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.04002736,0.0008923662,0.9343187,0.0003622739,0.0001686609,0.0002205032,0.0005284286,0.0008708594,0.02261082],"genre_scores_gemma":[0.8513712,0.002599306,0.101019,0.0001374272,0.00009805054,0.001098333,0.0008182918,0.0002151956,0.04264321],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.009049506,"threshold_uncertainty_score":0.01799369,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2069933678","doi":"10.1109/6104.924786","title":"Examining the environmental impact of lead-free soldering alternatives","year":2001,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Recycling and Waste Management Techniques","field":"Environmental Science","cited_by":62,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"STMicroelectronics (Canada)","funders":"","keywords":"European union; Electronics; Directive; Lead (geology); Environmentally friendly; Soldering; Environmental impact assessment; Electronic equipment; Engineering; Environmental science; Manufacturing engineering; Risk analysis (engineering); Environmental economics; Business; Environmental protection; Computer science; Ecology; Chemistry; Electrical engineering; International trade","authors":[{"name":"Laura J. Turbini","is_ca":true},{"name":"G.C. Munie","is_ca":false},{"name":"D. Bernier","is_ca":false},{"name":"J. Gamalski","is_ca":false},{"name":"D.W. Bergman","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01610869067598053,"gpt":0.2422410614608694,"spread":0.2261323707848888,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001200386,0.0005318451,0.0004166128,0.001167255,0.0005623716,0.001269539,0.000446313,0.0006399268,0.003389841],"category_scores_gemma":[0.002061547,0.0001866357,0.000553849,0.001053312,0.0003385502,0.0009581243,0.0005103087,0.0004412235,0.0002673082],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001174539,"about_ca_system_score_gemma":0.0004426685,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002114079,"about_ca_topic_score_gemma":0.004923877,"domain_scores_codex":[0.9982521,0.00062647,0.00007110086,0.0001094017,0.0007565544,0.0001843323],"domain_scores_gemma":[0.9984142,0.0008259995,0.0001762347,0.00005108175,0.0004957006,0.00003681292],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.01264692,0.007029189,0.06732834,0.004566351,0.001061017,0.004150811,0.0008605901,0.2593822,0.3973019,0.01626105,0.001976574,0.2274349],"study_design_scores_gemma":[0.0004517658,0.06058915,0.0861086,0.0002732853,0.001881103,0.001212558,0.005904881,0.09035734,0.6946711,0.02124363,0.03711086,0.0001957249],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9870299,0.001411762,0.0008428783,0.00007120198,0.00002093123,0.00007220326,0.0002217401,0.00000701345,0.01032233],"genre_scores_gemma":[0.9929363,0.001785968,0.001844371,0.00004629443,0.0000109668,0.00004427652,0.0002281632,0.00001125529,0.003092343],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003389841,"threshold_uncertainty_score":0.01134014,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2150862675","doi":"10.1109/tepm.2006.874964","title":"Effects of Fluid Properties on Dispensing Processes for Electronics Packaging","year":2006,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Injection Molding Process and Properties","field":"Engineering","cited_by":54,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Saskatchewan","funders":"","keywords":"Materials science; Electronics; Electronic packaging; Printed circuit board; Coating; Epoxy; Surface tension; Adhesive; Integrated circuit packaging; Process engineering; Composite material; Mechanical engineering; Integrated circuit; Engineering; Electrical engineering; Optoelectronics","authors":[{"name":"Daniel Chen","is_ca":true},{"name":"Hongqin Ke","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007399130290290004,"gpt":0.1909744074363162,"spread":0.1835752771460262,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008811975,0.0007076798,0.0004758198,0.0005583668,0.0004267394,0.0008554176,0.0004115781,0.0005909647,0.000978227],"category_scores_gemma":[0.0050341,0.0003302673,0.000328019,0.0004500476,0.0004041681,0.001160724,0.0005243949,0.0006459939,0.0003993035],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002959024,"about_ca_system_score_gemma":0.0002301762,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004840288,"about_ca_topic_score_gemma":0.0005348297,"domain_scores_codex":[0.9986163,0.0002583897,0.0001384743,0.0001705736,0.0007201909,0.00009601931],"domain_scores_gemma":[0.9964147,0.002256438,0.0006386836,0.0001555973,0.0004288217,0.0001057774],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002015641,0.00004228734,0.000214793,0.0001254062,0.000006650249,0.00009920221,0.00009169798,0.0002333075,0.9898705,0.00006746672,0.00003541197,0.009011858],"study_design_scores_gemma":[0.000004753582,0.000164654,0.0003907194,0.000004374389,0.000009703736,0.00004784074,0.00001908325,0.0009680256,0.9978374,0.00001906363,0.0005266046,0.000007782596],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9397632,0.007553413,0.04815988,0.0002412877,0.0002776688,0.0002518609,0.0002215773,0.0003840126,0.00314694],"genre_scores_gemma":[0.9735736,0.002840159,0.02169305,0.0001566602,0.00008354443,0.0000798835,0.0001412362,0.0001278104,0.00130408],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.000978227,"threshold_uncertainty_score":0.004660249,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2099097872","doi":"10.1109/tepm.2008.926118","title":"Automatic Microassembly Using Visual Servo Control","year":2008,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Advanced MEMS and NEMS Technologies","field":"Engineering","cited_by":50,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Micromanipulator; Cartesian coordinate system; GRASP; Servo; Microelectromechanical systems; Process (computing); Computer science; Position (finance); Servo control; Artificial intelligence; Computer vision; Position sensor; Control engineering; Engineering; Mechanical engineering","authors":[{"name":"Lidai Wang","is_ca":true},{"name":"James K. Mills","is_ca":true},{"name":"William L. Cleghorn","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0109565698510792,"gpt":0.2250604936179124,"spread":0.2141039237668332,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002202665,0.0004402718,0.0002879013,0.000342282,0.0002621598,0.0004645333,0.0008018723,0.0003855191,0.001239215],"category_scores_gemma":[0.0004218177,0.0002516489,0.0002605581,0.0002037447,0.0003660404,0.0004267439,0.0004689705,0.0003588791,0.0004074344],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002426406,"about_ca_system_score_gemma":0.0003739072,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009716552,"about_ca_topic_score_gemma":0.0008718328,"domain_scores_codex":[0.9994835,0.00003933274,0.00002369724,0.00009205266,0.0003259768,0.00003538324],"domain_scores_gemma":[0.9997433,0.00006745685,0.00005676191,0.00004102781,0.00007120823,0.00002035111],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001577289,0.00008505884,0.000389161,0.0001930608,0.00002170189,0.0001554136,0.0001426043,0.02013119,0.611702,0.006516537,0.001309326,0.3591962],"study_design_scores_gemma":[0.0001697294,0.0008334209,0.001853141,0.00003963875,0.00003827931,0.0006363703,0.0000344048,0.5576437,0.3992329,0.004021723,0.03538179,0.000115006],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.03226146,0.0006446005,0.9590409,0.0001093474,0.0001237939,0.00008820734,0.00002239673,0.002922584,0.00478671],"genre_scores_gemma":[0.5578611,0.000410351,0.4357862,0.0001153715,0.00009172651,0.0001745101,0.00007960162,0.0001152555,0.0053658],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.001239215,"threshold_uncertainty_score":0.004145563,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2186696467","doi":"10.1109/tepm.2003.820824","title":"Off-line control of time-pressure dispensing processes for electronics packaging","year":2003,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Injection Molding Process and Properties","field":"Engineering","cited_by":47,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Queen's University; University of Saskatchewan","funders":"","keywords":"Electronics; Pressure control; Electronic packaging; Process control; Process (computing); Computer science; Mechanical engineering; Materials science; Engineering; Electronic engineering; Electrical engineering","authors":[{"name":"Daniel Chen","is_ca":true},{"name":"Wenjun Zhang","is_ca":true},{"name":"Greg Schoenau","is_ca":true},{"name":"Brian Surgenor","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.008518147756332566,"gpt":0.2086201863122019,"spread":0.2001020385558694,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001965631,0.0006297904,0.0003399599,0.0001511553,0.0002087585,0.0006532382,0.0008014112,0.0004136417,0.001087916],"category_scores_gemma":[0.0005182576,0.000182491,0.0002746093,0.0001291298,0.0002497473,0.0004251662,0.0002156173,0.0003962984,0.0003297907],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000291219,"about_ca_system_score_gemma":0.0002454752,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001001932,"about_ca_topic_score_gemma":0.0009951954,"domain_scores_codex":[0.9997343,0.00003698981,0.00001414278,0.00004926083,0.0001475847,0.00001764104],"domain_scores_gemma":[0.9997295,0.000102997,0.00006937388,0.00002820075,0.0000595736,0.00001042424],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004063568,0.0004647411,0.0007960103,0.0005723638,0.00003574203,0.0003671731,0.0002923021,0.1646971,0.6095078,0.007694781,0.00177049,0.2133952],"study_design_scores_gemma":[0.00002251808,0.0002876268,0.0003189817,0.000008596487,0.00001388475,0.0001176418,0.00001090986,0.8911598,0.104146,0.0006169734,0.003281861,0.00001513033],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.09438698,0.0006952491,0.8964481,0.0001276433,0.0001582666,0.0001428213,0.00006008373,0.001280741,0.006700201],"genre_scores_gemma":[0.9473657,0.000395329,0.04912566,0.00004569201,0.00003264181,0.00007330537,0.00004696701,0.00005509249,0.002859607],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.001087916,"threshold_uncertainty_score":0.0036394,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2102464802","doi":"10.1109/tepm.2009.2019123","title":"Low-Stress Thermosonic Copper Ball Bonding","year":2009,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":45,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Ball (mathematics); Materials science; Copper; Ultrasonic sensor; Composite material; Shear stress; Shear (geology); Ultrasound; Electrical engineering; Metallurgy; Acoustics; Physics; Engineering; Mathematics; Geometry","authors":[{"name":"A. Shah","is_ca":true},{"name":"M. Mayer","is_ca":true},{"name":"Y. Zhou","is_ca":true},{"name":"S.J. Hong","is_ca":false},{"name":"J.T. Moon","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007038754233577107,"gpt":0.2076295932135606,"spread":0.2005908389799835,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004040231,0.0005520197,0.0005649218,0.0006078815,0.0005788305,0.0006167244,0.00124716,0.000571096,0.01522728],"category_scores_gemma":[0.0007373931,0.0004201116,0.0002401782,0.000636505,0.0003875121,0.0006258418,0.0005973058,0.0004203476,0.004525617],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007241612,"about_ca_system_score_gemma":0.0005492752,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001640923,"about_ca_topic_score_gemma":0.002165166,"domain_scores_codex":[0.9992067,0.00007124701,0.00005207133,0.00022651,0.0003394483,0.0001040158],"domain_scores_gemma":[0.9992132,0.00008076901,0.00008815299,0.0002190535,0.0003584006,0.00004036308],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001715752,0.00005355496,0.00120467,0.0003395034,0.00002233361,0.000142411,0.0001267526,0.0007775602,0.9621947,0.001679425,0.004826196,0.02846132],"study_design_scores_gemma":[0.00002509797,0.000336699,0.004330164,0.00001678179,0.00002418003,0.0002906995,0.00006449126,0.004759943,0.9708266,0.0002252736,0.01906956,0.00003048392],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8002468,0.001429756,0.1236162,0.0004202422,0.0006460256,0.0006161507,0.001508097,0.00877472,0.06274207],"genre_scores_gemma":[0.9104532,0.0004852868,0.04862128,0.0001130274,0.00007589598,0.0003138764,0.001057518,0.0005516658,0.03832835],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.01522728,"threshold_uncertainty_score":0.05094033,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2146393746","doi":"10.1109/tepm.2005.863266","title":"Characteristics of Sn–Cu Solder Bump Formed by Electroplating for Flip Chip","year":2006,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Electroplating; Flip chip; Plating (geology); Materials science; Soldering; Substrate (aquarium); Analytical Chemistry (journal); Metallurgy; Physics; Nanotechnology; Chemistry; Chromatography; Adhesive","authors":[{"name":"S.W. Jung","is_ca":false},{"name":"Jae Pil Jung","is_ca":false},{"name":"Y. Zhou","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006306673522306281,"gpt":0.2002486619927317,"spread":0.1939419884704254,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000269764,0.0005600343,0.0004601293,0.0005331311,0.0001909413,0.0003064049,0.0005454451,0.0007877906,0.001881833],"category_scores_gemma":[0.0007047249,0.0003264429,0.0002277219,0.0006912648,0.0001607916,0.0005043268,0.0001367633,0.0002694101,0.0005013979],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004324078,"about_ca_system_score_gemma":0.0001858077,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001044289,"about_ca_topic_score_gemma":0.001374571,"domain_scores_codex":[0.999537,0.00003088313,0.00002689042,0.0001256902,0.0002105469,0.00006898399],"domain_scores_gemma":[0.9992719,0.0001396082,0.0001463536,0.00005849973,0.0003418844,0.0000416294],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003430041,0.00003325818,0.001995701,0.0002585605,0.00003147722,0.0005791439,0.0002775129,0.0011602,0.9792629,0.0002114278,0.001318587,0.0145282],"study_design_scores_gemma":[0.00003018722,0.0009779203,0.01817331,0.00002479692,0.00005413986,0.0006587407,0.0001408863,0.01026804,0.9650096,0.0000823501,0.004545541,0.00003451173],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9866701,0.001211755,0.00721912,0.0001223487,0.000141947,0.00007195633,0.000641486,0.0006396472,0.003281673],"genre_scores_gemma":[0.9923873,0.0003490662,0.003844196,0.00004231774,0.00002243063,0.00004661518,0.0002878512,0.000056657,0.002963568],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001881833,"threshold_uncertainty_score":0.006295383,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2168065962","doi":"10.1109/tepm.2009.2020515","title":"Modeling of the Fluid Volume Transferred in Contact Dispensing Processes","year":2009,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":15,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Saskatchewan","funders":"U.S. Department of Energy","keywords":"Volume (thermodynamics); Surface tension; Mechanics; Volume of fluid method; Laplace's equation; Materials science; Fluid dynamics; Process (computing); Control volume; Mechanical engineering; Boundary value problem; Computer science; Engineering; Mathematics; Thermodynamics; Flow (mathematics); Physics; Mathematical analysis","authors":[{"name":"Daniel Chen","is_ca":true},{"name":"Mei-Lin Li","is_ca":true},{"name":"Tate Cao","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.008463022753606813,"gpt":0.1985592750310564,"spread":0.1900962522774496,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003427387,0.0005490052,0.0007553768,0.0004738945,0.0004696431,0.001164958,0.001495835,0.002352715,0.001177973],"category_scores_gemma":[0.001258052,0.0003283782,0.0005957985,0.0004328887,0.0007044587,0.001375533,0.0006328244,0.0006203304,0.0002952343],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000893209,"about_ca_system_score_gemma":0.0008861404,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.005193654,"about_ca_topic_score_gemma":0.001701477,"domain_scores_codex":[0.9996144,0.00004676085,0.00002194839,0.00008433415,0.0001798966,0.00005269676],"domain_scores_gemma":[0.9996196,0.0002073337,0.0000568053,0.00002441617,0.00006693402,0.00002485072],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00008953518,0.00009379529,0.0006920201,0.000090831,0.00001091442,0.0004018674,0.0001485552,0.944313,0.03864193,0.007303576,0.0002152297,0.007998752],"study_design_scores_gemma":[0.000005104282,0.00001686077,0.00006054937,0.000001614622,0.000002120493,0.00002204391,0.000005983204,0.9962846,0.002960999,0.0004014117,0.0002344912,0.000004148561],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.2127342,0.000693253,0.774348,0.0003108539,0.0001084902,0.0001984237,0.0002327482,0.000546073,0.01082801],"genre_scores_gemma":[0.9688186,0.0005490526,0.02214355,0.00005544927,0.00002091769,0.0001836185,0.0001153167,0.00004397066,0.008069453],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.005193654,"threshold_uncertainty_score":0.01032686,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}