{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":42,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":42,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"360cd07c0f02","filters":{"venue":"Journal of Surface Mount Technology"}},"results":[{"id":"W2949529026","doi":"10.37665/smt.v36i3.6","title":"Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process","year":2023,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":11,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"Egg Farmers of Canada","keywords":"Eutectic system; Soldering; Materials science; Bismuth; Dissolution; Metallurgy; Melting point; Solder paste; Alloy; Ball grid array; Reflow soldering; Melting temperature; Composite material; Chemistry","authors":[{"name":"Tayler J. Swanson","is_ca":false},{"name":"Martin Anselm","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01320025924869265,"gpt":0.2300464754234767,"spread":0.2168462161747841,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004314458,0.000504846,0.0003648872,0.0004397279,0.0001593381,0.0003820157,0.0002938123,0.0004177849,0.001617601],"category_scores_gemma":[0.0009713896,0.0003553952,0.0003039826,0.0003305023,0.0001238759,0.0003709838,0.000159833,0.0002375354,0.0007108329],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00017864,"about_ca_system_score_gemma":0.0001198529,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003618438,"about_ca_topic_score_gemma":0.0006767442,"domain_scores_codex":[0.9994743,0.00009007719,0.00004959618,0.00009191532,0.0002431154,0.00005101403],"domain_scores_gemma":[0.9994592,0.00009806223,0.0001444595,0.00004776105,0.0001999967,0.00005047363],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0005300228,0.00003203185,0.0008989148,0.00009093735,0.00002124285,0.00006888897,0.00009024137,0.0002422178,0.994965,0.00003373884,0.0000435433,0.002983067],"study_design_scores_gemma":[0.00001415739,0.001702872,0.004443621,0.000007961459,0.00004621309,0.0000814088,0.00005100499,0.001134867,0.9916806,0.00001008298,0.0008192447,0.000007910509],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9982122,0.0005295524,0.0006815051,0.00001208435,0.00002770925,0.00001264959,0.00004478258,0.00004599688,0.0004335018],"genre_scores_gemma":[0.9969665,0.0001886129,0.001114401,0.00001417012,0.000007787469,0.00001203367,0.00009910378,0.00003059085,0.001566656],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001617601,"threshold_uncertainty_score":0.005411446,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3089628143","doi":"10.37665/smt.v33i2.8","title":"Impact of Conformal Coating Induced Stress on Wafer Level Chip Scale Package Thermal Cycling Performance","year":2020,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":3,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Zymeworks (Canada)","funders":"","keywords":"Conformal coating; Materials science; Temperature cycling; Coating; Composite material; Thermal expansion; Thermal","authors":[{"name":"Andy Hsiao","is_ca":false},{"name":"Mohamed Sheikh","is_ca":false},{"name":"Karl I. Loh","is_ca":true},{"name":"Edward S. Ibe","is_ca":true},{"name":"Tae-Kyu Lee","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03106445055355735,"gpt":0.2545269741207754,"spread":0.223462523567218,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001255027,0.0002592868,0.000212113,0.0001537554,0.0001003759,0.0002553748,0.0001538049,0.0002000751,0.001390774],"category_scores_gemma":[0.0005486907,0.0001471359,0.00018135,0.0001387635,0.0001434759,0.0001492869,0.0001706897,0.000182484,0.0001755476],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001848052,"about_ca_system_score_gemma":0.0001048925,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001001152,"about_ca_topic_score_gemma":0.001379327,"domain_scores_codex":[0.9998145,0.0000159344,0.00001240008,0.00003509337,0.0000848312,0.00003723928],"domain_scores_gemma":[0.9996026,0.0000661536,0.00008343918,0.00005426851,0.0001620301,0.00003155538],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007617952,0.00001205492,0.001396573,0.00003705276,0.00001002181,0.00006468436,0.0000278248,0.0004324727,0.9955158,0.0000116295,0.00003971278,0.002376105],"study_design_scores_gemma":[0.000005305432,0.001043397,0.02713953,0.000007628843,0.00002998506,0.0001395757,0.00006399917,0.002236072,0.9686685,0.00001093307,0.0006443624,0.00001069316],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9987362,0.000240279,0.000558618,0.00001033133,0.00001340805,0.000008522254,0.00006902884,0.00003342257,0.0003301077],"genre_scores_gemma":[0.9991912,0.00007769576,0.0002774779,0.00001008807,0.000002394309,0.0000045714,0.00005261893,0.00001029609,0.0003736247],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001390774,"threshold_uncertainty_score":0.004652619,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3091168940","doi":"10.37665/smt.v33i2.10","title":"Edgebond and Edgefill Induced Loading Effect on Large WLCSP Thermal Cycling Performance","year":2020,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Zymeworks (Canada)","funders":"Cisco Systems","keywords":"Temperature cycling; Materials science; Cycling; Reliability (semiconductor); Stress (linguistics); Degradation (telecommunications); Chip-scale package; Interconnection; Power cycling; Wafer; Thermal; Composite material; Structural engineering; Electronic engineering; Optoelectronics; Computer science; Engineering","authors":[{"name":"Andy Hsiao","is_ca":false},{"name":"Greg Baty","is_ca":false},{"name":"Edward S. Ibe","is_ca":true},{"name":"Karl I. Loh","is_ca":true},{"name":"Steve Perng","is_ca":false},{"name":"Weidong Xie","is_ca":false},{"name":"Tae-Kyu Lee","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01002640190069106,"gpt":0.2114118120279792,"spread":0.2013854101272882,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001332241,0.0003818397,0.0001772974,0.0002180326,0.0001668892,0.0001823289,0.0001935074,0.0002388993,0.002523161],"category_scores_gemma":[0.0003910441,0.0001670045,0.0001123202,0.0001806038,0.0002004682,0.0002448474,0.0002078298,0.0001778667,0.0003080833],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001204698,"about_ca_system_score_gemma":0.00009446873,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004047179,"about_ca_topic_score_gemma":0.001004556,"domain_scores_codex":[0.9998498,0.00001662765,0.000007805137,0.00003455183,0.00004750827,0.00004364709],"domain_scores_gemma":[0.9997075,0.00006178149,0.00005398976,0.00003856414,0.0001030869,0.00003502328],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001811632,0.00001852387,0.001047746,0.00004630722,0.000005449614,0.00007197521,0.00005952694,0.000435334,0.9948745,0.00002087792,0.00007301076,0.003165432],"study_design_scores_gemma":[0.000004924106,0.0008260806,0.01894316,0.000007309722,0.00001583224,0.0001131754,0.00007023074,0.002836169,0.9766247,0.00001413964,0.00053501,0.0000092983],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9988189,0.0001194714,0.0006635492,0.000007810308,0.000006182776,0.000004539851,0.00004571295,0.00005284398,0.000280872],"genre_scores_gemma":[0.9988762,0.00005231138,0.0003629548,0.000008653554,0.000002186793,0.000008315933,0.00007243846,0.0000196468,0.0005973672],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002523161,"threshold_uncertainty_score":0.008440793,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4400681988","doi":"10.37665/631d5y77","title":"Condition Monitoring System: A Flexible Hybrid Electronics Approach for Sealed Container Applications","year":2024,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Embedded Systems and FPGA Design","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Container (type theory); Electronics; Computer science; Engineering; Embedded system; Electrical engineering; Mechanical engineering","authors":[{"name":"Masoud Shariat Panahi","is_ca":false},{"name":"Anthony J. Hanson","is_ca":false},{"name":"Dinesh Maddipatla","is_ca":false},{"name":"S. Masihi","is_ca":false},{"name":"Binu B. Narakathu","is_ca":false},{"name":"Bradley J. Bazuin","is_ca":false},{"name":"Scott J. Miller","is_ca":false},{"name":"Massood Z. Atashbar","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01021126746742541,"gpt":0.2465199376850915,"spread":0.2363086702176661,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004406208,0.0005321993,0.0004438673,0.0005815221,0.0001807313,0.0007731565,0.001401361,0.0006815594,0.003424765],"category_scores_gemma":[0.0005189216,0.0002382373,0.0002698926,0.0004068837,0.0002392636,0.0008724062,0.0005498509,0.0002323671,0.0009335814],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002290673,"about_ca_system_score_gemma":0.000177197,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003338168,"about_ca_topic_score_gemma":0.0003405701,"domain_scores_codex":[0.9993782,0.00007026274,0.00003807527,0.0001870138,0.0002734943,0.00005277987],"domain_scores_gemma":[0.9996376,0.00006726768,0.00006834524,0.00009561084,0.0001068525,0.00002417683],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006861921,0.0001265001,0.001976583,0.0002357041,0.00004348339,0.0006126159,0.000117321,0.002420786,0.8476758,0.0009574844,0.001524655,0.1436229],"study_design_scores_gemma":[0.00008681663,0.002612614,0.01152121,0.00004071572,0.00009545506,0.002095131,0.00008786305,0.04340483,0.907813,0.0003219431,0.03178797,0.0001324843],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.4092505,0.001801544,0.5628168,0.0002454759,0.0003787357,0.0008100118,0.0008467303,0.01075868,0.0130915],"genre_scores_gemma":[0.8394278,0.0003725053,0.1487974,0.0001672011,0.00007069228,0.000191703,0.0003670867,0.0001688806,0.01043672],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.003424765,"threshold_uncertainty_score":0.01145697,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108222743","doi":"10.37665/jsmtfffzj66314","title":"Reliability Study and Solder Joint Microstructure of Various SnAgCu Ceramic Ball Grid Array (CBGA) Geometries and Alloys","year":2006,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Ball grid array; Soldering; Microstructure; Printed circuit board; Solder paste; Ceramic; Temperature cycling; Joint (building); Reliability (semiconductor)","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.006029201416307372,"gpt":0.2050314597766349,"spread":0.1990022583603275,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002046907,0.0002549877,0.000202238,0.0003727781,0.0001302717,0.0002179885,0.0002745347,0.0002316732,0.0006166468],"category_scores_gemma":[0.0003650245,0.0002475647,0.0001427816,0.000271113,0.0002003555,0.0001809555,0.0001307464,0.0001186026,0.0002645209],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000212325,"about_ca_system_score_gemma":0.0001058802,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002343252,"about_ca_topic_score_gemma":0.003253509,"domain_scores_codex":[0.9997845,0.0000390272,0.0000136811,0.00005026953,0.00008061405,0.0000319415],"domain_scores_gemma":[0.9997634,0.00002736424,0.00003770913,0.00002516288,0.000128871,0.00001757465],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001853876,0.00002002738,0.005534084,0.00005688194,0.00001356237,0.0001161483,0.0001275337,0.001192102,0.9892396,0.00005400595,0.00007284475,0.003387916],"study_design_scores_gemma":[0.00001771421,0.001718872,0.0850925,0.0000107184,0.00009182882,0.0004550556,0.0003226241,0.006613186,0.9038275,0.00003483993,0.001793959,0.0000212061],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9985967,0.0001517047,0.0008281755,0.000004217251,0.000003612745,0.000007431105,0.0000535783,0.00003188724,0.0003227046],"genre_scores_gemma":[0.9981122,0.00008546632,0.001186366,0.000005870662,0.000001870409,0.000006930642,0.0001046399,0.00001710251,0.0004795646],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002343252,"threshold_uncertainty_score":0.004659176,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880009","doi":"10.37665/jsmtjgqnh81477","title":"Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies","year":2000,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Reliability (semiconductor); Electronics; Printed circuit board; Electronic component; Reflow soldering; Electronic packaging; Electrical conductor","authors":[{"name":"Laura J. Turbini","is_ca":true},{"name":"Westin Bent","is_ca":false},{"name":"W. Jud Ready","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01505289001792776,"gpt":0.2647065130300061,"spread":0.2496536230120783,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004107992,0.0002722065,0.000319234,0.0004995039,0.0002873569,0.0005074024,0.0002208657,0.0003913422,0.001600454],"category_scores_gemma":[0.001478264,0.0001666441,0.0002782267,0.0002626417,0.0002635105,0.0004137606,0.0002930326,0.0002974847,0.0002408412],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002829903,"about_ca_system_score_gemma":0.00009668076,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007840893,"about_ca_topic_score_gemma":0.000834475,"domain_scores_codex":[0.9993708,0.0001357005,0.00005348215,0.00007710836,0.0002689399,0.0000940824],"domain_scores_gemma":[0.9984046,0.0006347403,0.0003441381,0.0001768498,0.0003583562,0.00008141056],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0007826226,0.00006694387,0.01177119,0.000135895,0.00005806924,0.0008261272,0.0002052961,0.001781073,0.9762784,0.00008022731,0.00009178364,0.007922214],"study_design_scores_gemma":[0.00001113415,0.001582909,0.03076542,0.000009403783,0.00006404611,0.0005972132,0.0001292053,0.001759579,0.9643371,0.00003970518,0.0006944034,0.000009919613],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9989032,0.0003338962,0.0004319364,0.00001002015,0.000007940821,0.000003709453,0.0000220559,0.00002379473,0.0002633981],"genre_scores_gemma":[0.9994743,0.00005374688,0.0002075207,0.000005917282,0.000003662893,0.000001990934,0.00003586958,0.000006938003,0.000209894],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001600454,"threshold_uncertainty_score":0.005354047,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108237924","doi":"10.37665/jsmtgptlh54189","title":"Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives","year":2015,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Conducting polymers and applications","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Waterloo","funders":"","keywords":"Nanofiber; Adhesive; Electrical conductor; Soldering; Nanocomposite; Polypyrrole; Electrically conductive","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.03713638209276124,"gpt":0.302111916359023,"spread":0.2649755342662617,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001464864,0.0005272392,0.0001375691,0.0002838135,0.0001277013,0.0002138374,0.000191382,0.0003557327,0.0004416231],"category_scores_gemma":[0.0001502085,0.0001589451,0.0001787547,0.0001312411,0.00010071,0.0002808714,0.0001611727,0.0002448479,0.0001782832],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001550048,"about_ca_system_score_gemma":0.00007039422,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002015415,"about_ca_topic_score_gemma":0.0004690545,"domain_scores_codex":[0.9999099,0.00001159605,0.000007521713,0.00003051082,0.00002543704,0.00001512671],"domain_scores_gemma":[0.9998791,0.00002635967,0.00003996239,0.000008651114,0.00002677284,0.00001914087],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000006459097,0.000005880026,0.00002425045,0.000028521,0.000002065182,0.0000345444,0.000004804211,0.00003762059,0.998899,0.00002915651,0.00001254602,0.000915202],"study_design_scores_gemma":[0.00000315469,0.00006426516,0.0004340968,0.000002442202,0.000005962078,0.00009116318,0.000006511092,0.000662546,0.9977575,0.000009687518,0.000959355,0.000003335453],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9829214,0.003295441,0.01145097,0.00008118746,0.00007356707,0.00004238775,0.0001009635,0.0001207796,0.001913322],"genre_scores_gemma":[0.9871431,0.0008050463,0.01061957,0.00002507278,0.00001429021,0.00002366266,0.00003662415,0.00001063937,0.001321949],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0005272392,"threshold_uncertainty_score":0.001477361,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108229979","doi":"10.37665/jsmttwigm23780","title":"A Nanocopper Based Alternative to High Temperature Solder","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Nanoporous metals and alloys","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Soldering; Solder paste; Creep; Microstructure; Reliability (semiconductor); Microelectronics; Grain size; Joint (building); Porosity","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.01338132701491411,"gpt":0.2758769596594592,"spread":0.2624956326445451,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001131186,0.0002865545,0.0003362265,0.0002215744,0.0001863162,0.0004024525,0.0006472913,0.0003960291,0.00447062],"category_scores_gemma":[0.0001440419,0.0001240308,0.0002199198,0.000171974,0.0001519442,0.0005329656,0.0003237308,0.0002542909,0.001975155],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003420015,"about_ca_system_score_gemma":0.0001330243,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000259117,"about_ca_topic_score_gemma":0.0007396343,"domain_scores_codex":[0.9998453,0.00001165686,0.000009131182,0.00004898926,0.00006629491,0.00001863763],"domain_scores_gemma":[0.9998788,0.00001151277,0.00003101964,0.00002781015,0.00003425825,0.0000166984],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002042164,0.0001082985,0.0002302052,0.0002214367,0.00002319036,0.0002385852,0.00002836639,0.0007294603,0.9529535,0.002189812,0.001776935,0.04129609],"study_design_scores_gemma":[0.00004296661,0.001009488,0.001007259,0.00001718828,0.000056946,0.0006138033,0.00002214775,0.008917416,0.9497427,0.0005154727,0.03803102,0.00002360433],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7693824,0.01104674,0.1373834,0.001226304,0.001608205,0.0003281279,0.0007725994,0.004860279,0.07339204],"genre_scores_gemma":[0.917582,0.001235698,0.04792206,0.0003388311,0.00007716187,0.00006796996,0.0001900597,0.0001600619,0.03242619],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00447062,"threshold_uncertainty_score":0.0149557,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108216163","doi":"10.37665/jsmtapvhh57901","title":"Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing","year":2015,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Temperature cycling; Soldering; Tin; Accelerated life testing; Monocrystalline whisker; Thermal shock; Aerospace","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.2058375857413413,"gpt":0.3265230360799823,"spread":0.120685450338641,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001325506,0.0004345263,0.0002471567,0.0005500847,0.000327348,0.0005947086,0.0006944107,0.0004277122,0.003225687],"category_scores_gemma":[0.0009828799,0.0002035156,0.0002487978,0.0006036527,0.0002476342,0.0004610098,0.0003405707,0.0003620856,0.0009012093],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0008559896,"about_ca_system_score_gemma":0.001612951,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.02008451,"about_ca_topic_score_gemma":0.01551547,"domain_scores_codex":[0.999431,0.0001331345,0.00001869687,0.00005280934,0.0003231051,0.0000412546],"domain_scores_gemma":[0.9992546,0.000151715,0.00004323363,0.0001047172,0.0004128123,0.00003273522],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0005795379,0.0005306125,0.01799242,0.0002215507,0.00004643437,0.0002281039,0.0001703378,0.7006829,0.07421037,0.00904229,0.01615029,0.1801451],"study_design_scores_gemma":[0.00005733364,0.001074106,0.006122962,0.00002962461,0.00002647186,0.00009347779,0.00008527881,0.8872002,0.07061456,0.00224411,0.03240567,0.00004605811],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.4136318,0.0008126429,0.4887539,0.0009771917,0.0002079718,0.0009551304,0.007623521,0.006136324,0.08090153],"genre_scores_gemma":[0.8661259,0.0005741497,0.1005635,0.000119494,0.00001437959,0.0004362323,0.003846325,0.0003316558,0.02798845],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.02008451,"threshold_uncertainty_score":0.03993517,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880471","doi":"10.37665/jsmtgecxy68329","title":"Component Temperature Study on Tin-Lead and Lead-Free Assemblies","year":2002,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Rework; Component (thermodynamics); Surface-mount technology; Eutectic system; Soldering; Reflow soldering; Solder paste; Upset","authors":[{"name":"Matthew Kelly","is_ca":true},{"name":"Duilio Colnago","is_ca":true},{"name":"V. Sirtori","is_ca":true},{"name":"Curtis Grosskopf","is_ca":false},{"name":"Ken Lyjak","is_ca":false},{"name":"C. Ravenelle","is_ca":false},{"name":"Eddie Kobeda","is_ca":false},{"name":"Suan Kee Tan","is_ca":false},{"name":"Lai Hook Teo","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01961017629730569,"gpt":0.2370576835932235,"spread":0.2174475072959178,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000252037,0.0003279493,0.0004193778,0.0006501253,0.0003528711,0.0003314843,0.0003862554,0.0002532549,0.001663554],"category_scores_gemma":[0.0006432625,0.0002301371,0.0002544796,0.0006018643,0.0002169983,0.0003920035,0.0002544204,0.0002553495,0.0003688758],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004079566,"about_ca_system_score_gemma":0.0001309956,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001597944,"about_ca_topic_score_gemma":0.00291991,"domain_scores_codex":[0.999543,0.00006866108,0.00002151638,0.00008860273,0.0002194077,0.00005892844],"domain_scores_gemma":[0.9993031,0.0001534096,0.0000885851,0.00009787744,0.0003211102,0.00003584159],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0009320137,0.0001575095,0.01020506,0.000188912,0.00003044169,0.0003009838,0.0007597384,0.006904332,0.9618235,0.0001952571,0.0002336267,0.01826863],"study_design_scores_gemma":[0.00001299666,0.002462862,0.04983142,0.000009044164,0.00004315606,0.0001688024,0.0002956388,0.01173264,0.93408,0.00003856958,0.001302622,0.00002214518],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.996093,0.0001357617,0.00240169,0.000007156433,0.000006113223,0.00001605242,0.0001181917,0.00009687795,0.001125171],"genre_scores_gemma":[0.9970763,0.00006046084,0.001454607,0.000006925114,0.000002259531,0.00001652255,0.0001347651,0.00005025724,0.001197885],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001663554,"threshold_uncertainty_score":0.005565166,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880616","doi":"10.37665/jsmtnbolj39597","title":"Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys","year":2018,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Creep; Intermetallic; Soldering; Microstructure; Solvus; Alloy; Ostwald ripening","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"Polina Snugovsky","is_ca":false},{"name":"Ivan Matijevic","is_ca":true},{"name":"Jeff Kennedy","is_ca":false},{"name":"Marianne Romansky","is_ca":false},{"name":"David Hillman","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Joseph Juarez","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"L. Snugovsky","is_ca":true},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.008766185548484816,"gpt":0.2250760229166996,"spread":0.2163098373682147,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001408283,0.0002227999,0.0002752306,0.0002106686,0.0001613943,0.0002645197,0.0002167694,0.0001659134,0.0009291547],"category_scores_gemma":[0.0001554068,0.0001529163,0.0001319896,0.0002151567,0.0001402764,0.0001596187,0.0002297158,0.0002265043,0.000241898],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00015354,"about_ca_system_score_gemma":0.0001743491,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007470407,"about_ca_topic_score_gemma":0.001652502,"domain_scores_codex":[0.9998771,0.00001605266,0.00001079251,0.00001988503,0.00004752733,0.00002854027],"domain_scores_gemma":[0.9999174,0.000006961549,0.00002758232,0.00001137163,0.00002131083,0.00001535744],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00006574271,0.0000170452,0.00007681543,0.00002053032,0.000001962729,0.00001633482,0.000009433113,0.00005895156,0.9986666,0.00002064275,0.000007684851,0.001038316],"study_design_scores_gemma":[0.000004987137,0.0003552859,0.002834349,0.00000326308,0.000009548799,0.00004691655,0.00001315785,0.0006876299,0.9953268,0.000008774879,0.000706179,0.000003292143],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9965531,0.0009516173,0.001496712,0.00001530469,0.00001669981,0.00001831965,0.00002702604,0.00005554958,0.0008657034],"genre_scores_gemma":[0.9958319,0.0002827361,0.002382611,0.00001571114,0.000004044091,0.00001089941,0.00004539561,0.00002521995,0.001401493],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009291547,"threshold_uncertainty_score":0.003108323,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880495","doi":"10.37665/jsmtlctbx38043","title":"Development and Application of a Press-PIN/PTH Reliability Model","year":2002,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hewlett-Packard (Canada)","funders":"","keywords":"Reliability (semiconductor); Parametric statistics; Finite element method; Soldering; Physics of failure; Parametric model; Development (topology); Interconnection; Cable gland","authors":[{"name":"Ajit R. Kulkarni","is_ca":true},{"name":"R. Iannuzzelli","is_ca":true},{"name":"J. Seyyedi","is_ca":true},{"name":"Hernán Mercado-Corujo","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01621269366846296,"gpt":0.2227548980992453,"spread":0.2065422044307823,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007337106,0.0008157725,0.0005852769,0.001052304,0.0004591796,0.0008431841,0.002196122,0.001270523,0.003856873],"category_scores_gemma":[0.001181797,0.0006358711,0.0008985543,0.0004267307,0.0003942536,0.0008315647,0.0006489229,0.0008939331,0.001015033],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009926542,"about_ca_system_score_gemma":0.001415511,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.009095556,"about_ca_topic_score_gemma":0.005124451,"domain_scores_codex":[0.9995561,0.00007031815,0.00002599569,0.0000759086,0.000229914,0.00004166562],"domain_scores_gemma":[0.9994417,0.0001895659,0.00008398566,0.0000547981,0.0002108614,0.00001908723],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00001137965,0.00002112248,0.0004253942,0.00004995514,0.000007878005,0.00007577392,0.00002926693,0.9859908,0.002861204,0.002495582,0.000402528,0.007629099],"study_design_scores_gemma":[0.000001517853,0.00001285953,0.0001114348,0.000006298766,0.000004012998,0.00001744358,0.000004252749,0.9983782,0.000506089,0.0003039173,0.0006513027,0.000002712938],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.03254177,0.0003908357,0.9446599,0.0002353895,0.00005128331,0.0003149085,0.000610455,0.001336921,0.01985856],"genre_scores_gemma":[0.8551098,0.0006385517,0.1290919,0.0000752879,0.0000410627,0.0007693584,0.0007866276,0.0002269787,0.01326051],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.009095556,"threshold_uncertainty_score":0.01808524,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880633","doi":"10.37665/jsmtcrtqi41511","title":"Via-in-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Reliability (semiconductor); Variety (cybernetics); Component (thermodynamics); Key (lock); Printed circuit board; Interconnection; Quality (philosophy); Electronic component","authors":[{"name":"Matt Kelly","is_ca":true},{"name":"Mark Jeanson","is_ca":false},{"name":"Timothy Younger","is_ca":false},{"name":"Jim Bielick","is_ca":false},{"name":"Theron Lewis","is_ca":false},{"name":"Mitch Ferrill","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02078567793168828,"gpt":0.2591655524786377,"spread":0.2383798745469494,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004202686,0.0002933625,0.000127858,0.000372534,0.0001977603,0.0006539954,0.0005771817,0.0003477384,0.002203588],"category_scores_gemma":[0.001114482,0.0001969695,0.0001395838,0.0002576227,0.0001745322,0.0004455012,0.0002694735,0.0002222092,0.0005576948],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004137464,"about_ca_system_score_gemma":0.0002639636,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005564433,"about_ca_topic_score_gemma":0.001748128,"domain_scores_codex":[0.9996666,0.00008502696,0.00002228796,0.00004687246,0.0001286708,0.00005052616],"domain_scores_gemma":[0.9991754,0.0001885772,0.00017802,0.0001153202,0.0003026712,0.00003999166],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0003191869,0.00008120685,0.0097534,0.0005772738,0.00003713866,0.001233437,0.0004137499,0.03579415,0.8733205,0.006065653,0.003250448,0.06915382],"study_design_scores_gemma":[0.00008261707,0.005837503,0.04237362,0.0001801345,0.0002013192,0.005080286,0.001091786,0.1306105,0.7404279,0.00222437,0.07181171,0.00007817717],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8805665,0.000694091,0.09399301,0.0004745606,0.0001271108,0.0001211099,0.0002603735,0.001045282,0.02271792],"genre_scores_gemma":[0.973079,0.0001738967,0.02208175,0.00003984928,0.00001259053,0.00002024105,0.00009015219,0.00007290165,0.004429434],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002203588,"threshold_uncertainty_score":0.007371724,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880353","doi":"10.37665/jsmtchfsg54823","title":"Issues and Solutions to Implementing Lead Free Soldering","year":2000,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Soldering; Electronics; Solder paste; Dip soldering; Electronic component; Printed circuit board","authors":[{"name":"Lee Whiteman","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01538077014821542,"gpt":0.2565367317331806,"spread":0.2411559615849652,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.03117057,0.001547143,0.0006195814,0.001928643,0.003741798,0.008361454,0.006715632,0.01020231,0.02287168],"category_scores_gemma":[0.05129483,0.0008561633,0.001034227,0.001847013,0.003349768,0.009346291,0.004612886,0.008365017,0.00535968],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.005140767,"about_ca_system_score_gemma":0.02027153,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.008696651,"about_ca_topic_score_gemma":0.00811058,"domain_scores_codex":[0.9653432,0.01350662,0.003118297,0.002447529,0.01219539,0.003389019],"domain_scores_gemma":[0.9230499,0.01737974,0.005502244,0.007160651,0.04140854,0.005498976],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001635146,0.001311601,0.006774624,0.002788143,0.0001019596,0.00209058,0.003071564,0.01320625,0.009316113,0.1950849,0.1716521,0.5944386],"study_design_scores_gemma":[0.0001207927,0.0008012012,0.003767212,0.003172537,0.0001050421,0.001927665,0.008602761,0.009837445,0.01281619,0.08499815,0.8736382,0.000212851],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"commentary","genre_gemma":"empirical","genre_scores_codex":[0.0366267,0.01949058,0.2324506,0.5318792,0.01262369,0.001564377,0.0002477039,0.004267681,0.1608495],"genre_scores_gemma":[0.4528431,0.01919607,0.3181949,0.1046117,0.003625122,0.001246866,0.0007096957,0.00082637,0.0987462],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.03117057,"threshold_uncertainty_score":0.1648477,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108227178","doi":"10.37665/jsmtbifmj56519","title":"The Effects of Aging on the Microstructure and Mechanical Properties of Bi-Containing Sn-Rich Alloys","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Carbide; Rockwell scale; Soldering; Recrystallization (geology); Precipitation hardening","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.01081066585295237,"gpt":0.221223903272483,"spread":0.2104132374195306,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002714549,0.0001877077,0.0002097891,0.0004267069,0.000157726,0.000207601,0.0001848138,0.0001795307,0.0006395067],"category_scores_gemma":[0.0003728186,0.0001519829,0.0001578824,0.0002574648,0.0001649864,0.0001765674,0.0001298758,0.0001231269,0.0001466747],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000253905,"about_ca_system_score_gemma":0.0001270549,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00184813,"about_ca_topic_score_gemma":0.002587628,"domain_scores_codex":[0.9998162,0.00003217561,0.00002469769,0.00003019276,0.00006703907,0.00002975221],"domain_scores_gemma":[0.9996295,0.00003625918,0.0001002389,0.00003300192,0.0001666981,0.00003432604],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004073329,0.00003584564,0.005230653,0.00004863341,0.00002205744,0.00009683466,0.00005430207,0.0004848451,0.9910675,0.00003248734,0.00003666211,0.002482855],"study_design_scores_gemma":[0.00001670102,0.001812855,0.1779987,0.00001280949,0.00008972702,0.0002549101,0.0001571611,0.003389437,0.8151661,0.00003164791,0.001053335,0.00001669139],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9991542,0.0003053128,0.0001694698,0.000004322097,0.000004759148,0.000004319608,0.00006394627,0.00001096293,0.0002826683],"genre_scores_gemma":[0.9991397,0.00008732518,0.0002522185,0.000006651981,0.000002122691,0.000004189914,0.00009692104,0.00000515152,0.0004057921],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00184813,"threshold_uncertainty_score":0.003674686,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879996","doi":"10.37665/jsmtyhirn77834","title":"Lead-Free Card Assembly and Rework for Column Grid Arrays","year":2004,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Interconnection; Design for manufacturability; Column (typography); Reliability (semiconductor); Grid; Printed circuit board; Microelectronics; Integrated circuit packaging","authors":[{"name":"Marie Cole","is_ca":false},{"name":"Mario Interrante","is_ca":false},{"name":"B. N. Chapman","is_ca":false},{"name":"Isabel Sousa","is_ca":true},{"name":"Janet L. Jozwiak","is_ca":false},{"name":"T. Lopez","is_ca":false},{"name":"W. F. Mader","is_ca":false},{"name":"Gregory Martin","is_ca":false},{"name":"Cheikhou Ndiaye","is_ca":false},{"name":"Steve Ostrander","is_ca":false},{"name":"Nandu Ranadive","is_ca":false},{"name":"William Sablinski","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01088462583357376,"gpt":0.2314414635269751,"spread":0.2205568376934013,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005730319,0.0005540438,0.00030814,0.0005451,0.0004970303,0.0007016316,0.0007996876,0.0003705779,0.002165009],"category_scores_gemma":[0.0009657937,0.0003143522,0.0002826526,0.0003625137,0.0003572885,0.0004986571,0.000504452,0.000503324,0.000985787],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000590796,"about_ca_system_score_gemma":0.0004373455,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001213799,"about_ca_topic_score_gemma":0.003255619,"domain_scores_codex":[0.999207,0.0001154852,0.00003419288,0.0001233253,0.0004207275,0.00009937008],"domain_scores_gemma":[0.9991346,0.00009270105,0.0001528946,0.0002720196,0.0002945361,0.0000532764],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002460682,0.0001621763,0.003123386,0.0002813453,0.00002343072,0.0005712683,0.0002634858,0.01526782,0.8867661,0.002555773,0.002858883,0.08788019],"study_design_scores_gemma":[0.0000191249,0.001107491,0.003682331,0.00001453148,0.00001613859,0.0003329198,0.00007183888,0.03436814,0.9493502,0.0001616298,0.01084996,0.00002563437],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7879019,0.0008284695,0.1919049,0.0001432109,0.00038157,0.0005029544,0.0002738391,0.005122061,0.01294112],"genre_scores_gemma":[0.8224549,0.0001781973,0.1660876,0.00005816724,0.0000231602,0.00009599106,0.0002971508,0.0003435329,0.0104613],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002165009,"threshold_uncertainty_score":0.007242739,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880111","doi":"10.37665/jsmtmozlf69774","title":"Microstructure and Hardness of Bi-Containing Solder Alloys After Solidification and Ageing","year":2014,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Rockwell scale; Soldering; Alloy; Precipitation hardening; Quenching (fluorescence); Indentation hardness; Hardening (computing)","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"L. Snugovsky","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Eva Kosiba","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006070056853342472,"gpt":0.2103146184216701,"spread":0.2042445615683276,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001694996,0.0001457476,0.0002462998,0.0005636085,0.0001774276,0.0002660215,0.0001651245,0.0002558573,0.001180027],"category_scores_gemma":[0.0003240736,0.0001874802,0.0001566854,0.0004198654,0.0001975848,0.0002246983,0.0001338474,0.000160886,0.0002992401],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002480118,"about_ca_system_score_gemma":0.00008326959,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001734046,"about_ca_topic_score_gemma":0.002128911,"domain_scores_codex":[0.9998147,0.00001762876,0.0000140774,0.0000270896,0.0001050554,0.00002159223],"domain_scores_gemma":[0.9997376,0.00002778912,0.00005923807,0.00002377135,0.0001248691,0.00002670866],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001564381,0.000009655228,0.002202584,0.00003429274,0.000008122488,0.0000936837,0.0000903308,0.0001583279,0.9956273,0.00002586758,0.00002343172,0.001570055],"study_design_scores_gemma":[0.00001642745,0.0009215355,0.3148069,0.000009418029,0.00005831762,0.0005299175,0.0002451259,0.002376033,0.6791395,0.00004928378,0.001822966,0.00002456004],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9984296,0.0003842434,0.0004441268,0.000005156272,0.000006422998,0.000005824784,0.0001249732,0.00001767439,0.0005820092],"genre_scores_gemma":[0.9976315,0.0001106314,0.0003899698,0.00000593432,0.000003756568,0.000006855315,0.0002331185,0.00001264172,0.001605545],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001734046,"threshold_uncertainty_score":0.003947556,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880073","doi":"10.37665/jsmtwqtne72522","title":"The Last Will and Testament of the Lead-Free BGA Void","year":2012,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Soldering; Ball grid array; Void (composites); Joint (building); Thermal","authors":[{"name":"David Hillman","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Tim Pearson","is_ca":false},{"name":"Ross Wilcoxon","is_ca":false},{"name":"Bev Christian","is_ca":true},{"name":"B. Smith","is_ca":true},{"name":"Mario Scalzo","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007346460471897368,"gpt":0.2085152498341961,"spread":0.2011687893622987,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001468594,0.00012367,0.0001657733,0.0005902723,0.0005676903,0.0009850492,0.0004281427,0.0003401142,0.001815922],"category_scores_gemma":[0.005318215,0.00009450189,0.0001418382,0.0002175258,0.000865913,0.000669442,0.0004438757,0.0003362314,0.0002650384],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004099561,"about_ca_system_score_gemma":0.0005706259,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00109455,"about_ca_topic_score_gemma":0.001481717,"domain_scores_codex":[0.9989225,0.000138458,0.00004793531,0.0001442696,0.0006107705,0.0001359842],"domain_scores_gemma":[0.9943105,0.00129911,0.00113246,0.0006499485,0.002110107,0.0004978958],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.002010213,0.0003223811,0.1534644,0.0002692146,0.00006035138,0.00163102,0.002532374,0.004097408,0.6772863,0.02115447,0.002232318,0.1349395],"study_design_scores_gemma":[0.00003349449,0.002758713,0.2513999,0.00007916876,0.00009657636,0.002694069,0.001376517,0.008321618,0.6893636,0.008746334,0.03504016,0.00008988465],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"commentary","genre_scores_codex":[0.975794,0.0004240228,0.01567022,0.0002030771,0.00005892183,0.00003644008,0.0001248136,0.0002609259,0.007427619],"genre_scores_gemma":[0.996484,0.00002996862,0.001241685,0.00004542361,0.000008251909,0.000006467671,0.00004102546,0.00002103815,0.002122242],"genre_candidate":"commentary","genre_consensus":null,"teacher_disagreement_score":0.001815922,"threshold_uncertainty_score":0.007766783,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880025","doi":"10.37665/jsmtkrtaa38745","title":"Qualification of a Lead-Free Card Assembly & Test Process for a Server Complexity PCBA","year":2008,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Original equipment manufacturer; Reliability (semiconductor); Directive; Process (computing); IBM; Electronics; Product (mathematics); Quality (philosophy)","authors":[{"name":"Marie Cole","is_ca":false},{"name":"Jim Wilcox","is_ca":false},{"name":"Jim Bielick","is_ca":false},{"name":"Timothy Younger","is_ca":false},{"name":"David Braun","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.08018237424099654,"gpt":0.3072174221265227,"spread":0.2270350478855261,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001968837,0.0005526798,0.0004280309,0.001047769,0.00101901,0.001274074,0.0007044436,0.0008561351,0.007435678],"category_scores_gemma":[0.003832049,0.0003354465,0.0004135402,0.0005310714,0.0007095971,0.0006190942,0.0006532429,0.001005522,0.004025276],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006995072,"about_ca_system_score_gemma":0.001097896,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001526213,"about_ca_topic_score_gemma":0.001958757,"domain_scores_codex":[0.997345,0.0004596803,0.0001904338,0.0002358479,0.001529799,0.0002392634],"domain_scores_gemma":[0.9965886,0.0006972076,0.0002996163,0.0005391376,0.001697672,0.0001777836],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0005413715,0.0003382907,0.004268023,0.0002882593,0.00001899747,0.001134338,0.000965337,0.00366381,0.9159899,0.002601253,0.002776219,0.06741424],"study_design_scores_gemma":[0.00004145315,0.002070673,0.00842321,0.00004267901,0.0000185126,0.0006102009,0.0003038508,0.006337148,0.9610742,0.000278523,0.02076107,0.00003845941],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7358289,0.0005020278,0.2237176,0.000492037,0.0005782279,0.00197391,0.001000628,0.003833052,0.0320736],"genre_scores_gemma":[0.833588,0.000135272,0.1376044,0.0002469945,0.00002575031,0.0002745529,0.0007649739,0.0004524352,0.02690762],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.007435678,"threshold_uncertainty_score":0.02487481,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108208076","doi":"10.37665/jsmtyrlcz79636","title":"In-Situ Resistance Characterization During Cure Progression For Electrically Conductive Adhesives","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Public Health Ontario; University of Waterloo","funders":"","keywords":"Thermosetting polymer; Adhesive; Electrical conductor; Conductivity; Epoxy; Electrical resistivity and conductivity; Sheet resistance; Conductive polymer","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.01223242481816366,"gpt":0.2735380754604533,"spread":0.2613056506422897,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002853615,0.0004138456,0.0003071498,0.0005223346,0.000203076,0.0003720548,0.0002971616,0.0003693128,0.001900737],"category_scores_gemma":[0.0005069613,0.0002156815,0.000169088,0.000332557,0.0002452086,0.0003836897,0.0001320036,0.0006320968,0.0004280107],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001694327,"about_ca_system_score_gemma":0.00009394958,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002865881,"about_ca_topic_score_gemma":0.0004788862,"domain_scores_codex":[0.9997756,0.00003429917,0.00001007251,0.00006725707,0.00007971399,0.00003299671],"domain_scores_gemma":[0.9995541,0.0001353368,0.0001143385,0.00005412653,0.0001174961,0.00002455589],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002765615,0.00001061227,0.000184634,0.00003837253,0.000002813332,0.00003187918,0.00007927539,0.00006258593,0.9983309,0.00003520234,0.00003473758,0.00116137],"study_design_scores_gemma":[0.000001861844,0.0000866808,0.001800576,0.00000396443,0.000007467611,0.00005320627,0.00004409828,0.0009124827,0.99613,0.00002244994,0.0009315359,0.000005584774],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9748053,0.001477809,0.02055181,0.00005387221,0.00004676515,0.00003776215,0.0005413787,0.0003423641,0.002142915],"genre_scores_gemma":[0.9891376,0.0006446862,0.006923053,0.00004216919,0.00001623632,0.000045627,0.0002418814,0.00008780739,0.002860856],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001900737,"threshold_uncertainty_score":0.006358564,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4383110208","doi":"10.37665/smt.v36i1.34","title":"Mechanical Characterization of SAC305 and SnPb36Ag2 BGA Assemblies Under Static Flexural Loading","year":2023,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Safran Electronics (Canada)","funders":"","keywords":"Ball grid array; Flexural strength; Structural engineering; Materials science; Finite element method; Soldering; Fixture; Printed circuit board; Composite material; Bending; Test fixture; Deflection (physics); Oriented strand board; Three point flexural test; Engineering; Mechanical engineering; Electrical engineering","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.01446614296742507,"gpt":0.2395034629494255,"spread":0.2250373199820004,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003363794,0.0003968199,0.0002677944,0.000897737,0.0003330869,0.0001915387,0.0002744515,0.0003932131,0.001619104],"category_scores_gemma":[0.0004188755,0.000188622,0.0001966587,0.0005218193,0.0002088088,0.0001864815,0.0001746685,0.0001899252,0.0004799656],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001491135,"about_ca_system_score_gemma":0.00009300215,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001265676,"about_ca_topic_score_gemma":0.002571358,"domain_scores_codex":[0.9996222,0.00003552554,0.00002936773,0.00006211863,0.0001986758,0.00005218123],"domain_scores_gemma":[0.9993766,0.00007105724,0.0001128066,0.00006701393,0.0002756137,0.00009699682],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001140534,0.00002225504,0.00239565,0.00006974908,0.000008089965,0.0001543804,0.0001282795,0.0006306962,0.9929458,0.00002084792,0.0001145435,0.003395607],"study_design_scores_gemma":[0.000008770168,0.002329116,0.1806722,0.00002242563,0.00006005292,0.0004851275,0.0005867166,0.005481913,0.8083379,0.00003163884,0.001943555,0.00004067229],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9980273,0.0002791827,0.0008858864,0.00001072314,0.00001626034,0.000008223059,0.0002263786,0.00006238047,0.0004835826],"genre_scores_gemma":[0.9976412,0.0000806774,0.0008278835,0.00001251536,0.000004028688,0.00001118942,0.000214284,0.00001545798,0.001192701],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001619104,"threshold_uncertainty_score":0.005416453,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880457","doi":"10.37665/jsmtsaclf86681","title":"New Generation of Pb-Free Solder Alloys: Possible Solution to Solve Current Issues with Main Stream Pb-Free Soldering","year":2012,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Ball grid array; Whisker; Solder paste; Printed circuit board; Reflow soldering; Bismuth; Alloy","authors":[{"name":"Polina Snugovsky","is_ca":false},{"name":"Simin Bagheri","is_ca":false},{"name":"Marianne Romansky","is_ca":false},{"name":"Doug D. Perovic","is_ca":true},{"name":"L. Snugovsky","is_ca":true},{"name":"J. W. Rutter","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02514254728652195,"gpt":0.2625714325175631,"spread":0.2374288852310411,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002662617,0.0005529638,0.0005065683,0.0008834339,0.0002068212,0.000552644,0.0008017211,0.0006299222,0.002462436],"category_scores_gemma":[0.0002059609,0.0002737686,0.0003597721,0.0004266062,0.0002099141,0.0007744779,0.0004286661,0.0004985136,0.001408746],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001731892,"about_ca_system_score_gemma":0.0003039461,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000195168,"about_ca_topic_score_gemma":0.0004228615,"domain_scores_codex":[0.9998357,0.00001779718,0.00001067804,0.00003511225,0.00008076385,0.00001980771],"domain_scores_gemma":[0.9999001,0.00001063744,0.00001770854,0.00001339742,0.00004613291,0.00001201069],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00021571,0.0004267237,0.001348825,0.001669135,0.00008362835,0.0007618748,0.0001788541,0.002838369,0.6242586,0.01534393,0.003094381,0.34978],"study_design_scores_gemma":[0.0001302808,0.003261503,0.004179392,0.0002568711,0.0002948245,0.004253937,0.0001877822,0.0239345,0.6692824,0.009407427,0.2847028,0.000108277],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.3945491,0.1312382,0.4140734,0.003468705,0.001260064,0.0004265813,0.0002570753,0.002255739,0.05247103],"genre_scores_gemma":[0.615967,0.05022752,0.2810206,0.0009147899,0.0005809999,0.0002302364,0.0005746973,0.0003344573,0.05014973],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.002462436,"threshold_uncertainty_score":0.00823772,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880004","doi":"10.37665/jsmtwtpss47010","title":"Process Optimization for 1.0 mm Pitch CBGA","year":2000,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interconnection; Ball grid array; Surface-mount technology; Printed circuit board; Soldering; Integrated circuit packaging; Ceramic; Integrated circuit; Chip-scale package; Ranging","authors":[{"name":"Marie Cole","is_ca":false},{"name":"Richard Duchesne","is_ca":true},{"name":"Mario Interrante","is_ca":false},{"name":"Lisa Jimarez","is_ca":false},{"name":"Grégory Martin","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00827445430016865,"gpt":0.2446063520763225,"spread":0.2363318977761538,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003718125,0.001018122,0.0007549303,0.0006274364,0.0004726052,0.001186473,0.000712986,0.000646678,0.003467606],"category_scores_gemma":[0.0007439637,0.000482951,0.0006232903,0.0008413366,0.0002286318,0.0005424535,0.0003895403,0.0007830749,0.001043422],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009033701,"about_ca_system_score_gemma":0.0009345787,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002721471,"about_ca_topic_score_gemma":0.004968561,"domain_scores_codex":[0.9997415,0.00001736793,0.00001330074,0.0000747466,0.00008426256,0.00006883104],"domain_scores_gemma":[0.9997322,0.00006103166,0.00007533847,0.00002662571,0.00008559949,0.00001929368],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0005247604,0.0004996439,0.002116837,0.00105821,0.00008828491,0.0006189903,0.0001856542,0.22003,0.7343339,0.001716283,0.0027583,0.03606903],"study_design_scores_gemma":[0.0003109171,0.004078686,0.01048202,0.00009784776,0.0003456762,0.0003091496,0.0002859785,0.2775392,0.6882718,0.0009474451,0.01720585,0.0001255234],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9255942,0.00369961,0.04585596,0.000524584,0.0003912187,0.0002700913,0.00107467,0.001517592,0.02107212],"genre_scores_gemma":[0.9658699,0.0007873886,0.02864989,0.00007078135,0.00001859602,0.0001399546,0.0005646974,0.0002271761,0.003671476],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003467606,"threshold_uncertainty_score":0.01160032,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880468","doi":"10.37665/jsmtjgwld83584","title":"Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation","year":2014,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Conformal coating; Tin; Nanoparticle; Microstructure; Ultimate tensile strength","authors":[{"name":"Junghyun Cho","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Suraj Maganty","is_ca":false},{"name":"Dale Starkey","is_ca":false},{"name":"Mario A. Goméz","is_ca":false},{"name":"David G. Edwards","is_ca":false},{"name":"Abdullah Ekin","is_ca":false},{"name":"Kevin Elsken","is_ca":false},{"name":"Jason Keeping","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Jeff Kennedy","is_ca":true},{"name":"Marianne Romansky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007442390161261796,"gpt":0.2112439848856254,"spread":0.2038015947243636,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001098815,0.0002518054,0.0001344722,0.0001616194,0.00009626769,0.00017828,0.0001694524,0.0001821612,0.0005923178],"category_scores_gemma":[0.0002276983,0.0001380592,0.0001513153,0.00009911359,0.0001303147,0.0001706518,0.0001543575,0.0002026679,0.0001600692],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001269043,"about_ca_system_score_gemma":0.00007442134,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003716025,"about_ca_topic_score_gemma":0.000907657,"domain_scores_codex":[0.9998997,0.00001072369,0.000006473454,0.00002418276,0.00004270691,0.00001624904],"domain_scores_gemma":[0.9998528,0.00003137187,0.00004768986,0.0000203239,0.00003046222,0.00001736587],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001376545,0.000008753857,0.00004559975,0.00002146055,0.00000193102,0.00001369824,0.000007435597,0.00009903007,0.9987135,0.00001861128,0.00001654324,0.001039675],"study_design_scores_gemma":[0.000002040361,0.00008380487,0.0003388749,0.000001223508,0.000003883546,0.00001717274,0.000004345225,0.0006114445,0.9986283,0.000004081081,0.0003031446,0.000001638616],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9938204,0.0006698023,0.0041847,0.0000213574,0.00003781946,0.00001842903,0.0000316392,0.00008628417,0.001129642],"genre_scores_gemma":[0.9952355,0.0002170993,0.003588886,0.00001445825,0.000006760497,0.000008115847,0.00002273158,0.00001915272,0.0008873012],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0005923178,"threshold_uncertainty_score":0.001981497,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108233748","doi":"10.37665/jsmtzqmwq13477","title":"SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development","year":2015,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Tin; Printed circuit board; Soldering; Surface-mount technology; Integrated circuit; Electronics","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.06458835714371991,"gpt":0.2569784389073318,"spread":0.1923900817636119,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001291542,0.0007872465,0.0007701769,0.001022555,0.0004123604,0.001005394,0.001816576,0.001040145,0.003511387],"category_scores_gemma":[0.002691536,0.0005741162,0.001252027,0.0006596725,0.0004377371,0.0008640235,0.0007250804,0.001045825,0.0007405342],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001241814,"about_ca_system_score_gemma":0.001426448,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.02506908,"about_ca_topic_score_gemma":0.01063888,"domain_scores_codex":[0.9994746,0.0001520558,0.00002258776,0.00006239484,0.0002312736,0.00005713574],"domain_scores_gemma":[0.9985464,0.0007928793,0.0001534862,0.0001088218,0.0003623486,0.00003619113],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.000006843722,0.000009400109,0.0002650214,0.000009809652,0.000005103041,0.00002048186,0.000009075291,0.9955428,0.0003320641,0.001477179,0.0001799589,0.00214219],"study_design_scores_gemma":[0.000001050335,0.000005660755,0.00005158476,0.000001309551,0.00000137904,0.000004992727,0.000002571082,0.9992276,0.0001025584,0.0004233621,0.0001762841,0.000001533845],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.05094713,0.0002072777,0.935194,0.0002177647,0.000026077,0.0001700301,0.0008533804,0.001111542,0.01127273],"genre_scores_gemma":[0.8163114,0.0004679907,0.1656725,0.0001219708,0.0000465981,0.0007528711,0.001346708,0.0004064973,0.01487333],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.02506908,"threshold_uncertainty_score":0.04984635,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879875","doi":"10.37665/jsmtyfjyr32353","title":"Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys","year":2019,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Microstructure; Creep; Bismuth; Intermetallic; Reliability (semiconductor); Temperature cycling","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"David Hillman","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Jeff Kennedy","is_ca":false},{"name":"Ross Wilcoxon","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Joseph Juarez","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01045491116737002,"gpt":0.2137589295267902,"spread":0.2033040183594202,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001660608,0.0002671367,0.0002113678,0.0002816971,0.0001481988,0.0002132384,0.0002146273,0.00021825,0.0008962102],"category_scores_gemma":[0.0002909889,0.0001902386,0.000190577,0.0002683674,0.0001489328,0.0001805795,0.00009771866,0.0002106385,0.000193882],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001911499,"about_ca_system_score_gemma":0.000103205,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001059652,"about_ca_topic_score_gemma":0.001956264,"domain_scores_codex":[0.9998026,0.00003093745,0.00001616425,0.00003375635,0.00007404401,0.00004245017],"domain_scores_gemma":[0.9998116,0.00002688698,0.00006844428,0.00002142714,0.00004958907,0.00002212072],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00009734795,0.00002121815,0.0003914228,0.00003488993,0.00000833801,0.00005120639,0.00003052944,0.0001371682,0.998245,0.00001769303,0.00001463036,0.0009505232],"study_design_scores_gemma":[0.000004280658,0.0004442047,0.009211075,0.000003629415,0.00001959042,0.00005354874,0.00004117362,0.0004790986,0.9893368,0.000004450493,0.0003961837,0.00000595041],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9989052,0.0004218864,0.0003083221,0.000007765704,0.00001089039,0.000007452722,0.0000411954,0.00001850393,0.0002788398],"genre_scores_gemma":[0.9985076,0.0002132647,0.0005483323,0.000009675212,0.000003162404,0.00000759666,0.00006336122,0.00001246652,0.0006344133],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001059652,"threshold_uncertainty_score":0.002998114,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880557","doi":"10.37665/jsmtkpxid94403","title":"Plasma Stencil Treatments: A Statistical Evaluation","year":2013,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Printed circuit board; Solder paste; Flip chip; Stencil; Soldering; Surface-mount technology; Circuit reliability; Chip; Electronic component; Reflow soldering","authors":[{"name":"William H. Green","is_ca":false},{"name":"Marie Cole","is_ca":false},{"name":"Ruediger Kellmann","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01625740060880267,"gpt":0.2505799338807415,"spread":0.2343225332719388,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.02179356,0.0008707531,0.002289583,0.002100816,0.0007376904,0.001356141,0.001771627,0.001382652,0.003920689],"category_scores_gemma":[0.03986898,0.0003169272,0.002546254,0.001870947,0.001357577,0.001177385,0.0008336973,0.002351798,0.0005716136],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006770355,"about_ca_system_score_gemma":0.0007916518,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001243354,"about_ca_topic_score_gemma":0.001056454,"domain_scores_codex":[0.9848419,0.005509383,0.00119434,0.002520651,0.005158773,0.0007748959],"domain_scores_gemma":[0.8911257,0.09308653,0.004865919,0.004394805,0.005930421,0.0005966959],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.03813419,0.01096238,0.2756374,0.00614899,0.01131929,0.002392085,0.002167001,0.1378613,0.151579,0.01156013,0.01178108,0.3404573],"study_design_scores_gemma":[0.000495898,0.05092947,0.1914757,0.0002948478,0.003999795,0.001224183,0.002928725,0.6053212,0.1196812,0.004283567,0.01900459,0.000360857],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8487435,0.001437134,0.1354351,0.0002202934,0.000418979,0.003133365,0.004651723,0.001901755,0.004058298],"genre_scores_gemma":[0.9402437,0.0002526389,0.05249965,0.000125224,0.00006919551,0.002275319,0.002303294,0.0002570067,0.001973922],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.02179356,"threshold_uncertainty_score":0.1152567,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880610","doi":"10.37665/jsmtirjgx23510","title":"Pb-Free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package","year":2011,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Ball grid array; Soldering; Temperature cycling; Dwell time; Microstructure; Reliability (semiconductor); Solder paste; Alloy","authors":[{"name":"Richard Coyle","is_ca":false},{"name":"Heather McCormick","is_ca":true},{"name":"John Osenbach","is_ca":false},{"name":"Peter Read","is_ca":false},{"name":"Richard Popowich","is_ca":false},{"name":"Debra Fleming","is_ca":false},{"name":"John Manock","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02929023501620828,"gpt":0.2272406420360263,"spread":0.197950407019818,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001188373,0.0001822924,0.0001410675,0.000222501,0.00008981473,0.0001361408,0.0001473372,0.0001845377,0.0006463422],"category_scores_gemma":[0.0002191253,0.0001113088,0.0001022361,0.0001268694,0.0001066189,0.0001857574,0.00007740062,0.0001136561,0.000205836],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001265903,"about_ca_system_score_gemma":0.00007268904,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00113063,"about_ca_topic_score_gemma":0.001898711,"domain_scores_codex":[0.999895,0.00001443764,0.000005515246,0.00002096945,0.00004417184,0.00001991963],"domain_scores_gemma":[0.9998323,0.00003144849,0.00003838434,0.00001730786,0.00006563003,0.00001494884],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000192013,0.00003870745,0.002347503,0.00002851973,0.000009986781,0.00008631888,0.00003551768,0.000758219,0.992975,0.00002037634,0.00002732512,0.003480664],"study_design_scores_gemma":[0.000008501084,0.002294284,0.05335838,0.000005154389,0.00005031433,0.0002931376,0.00004939974,0.004823986,0.9385777,0.00002516824,0.0005015157,0.00001239598],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9991818,0.0000987311,0.00054889,0.000002529353,0.000001605172,0.000001684659,0.00001834844,0.00002105836,0.0001254037],"genre_scores_gemma":[0.999157,0.00003792917,0.0003484919,0.000002728625,0.000001270769,0.000001978934,0.00003941554,0.000005426539,0.0004057438],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00113063,"threshold_uncertainty_score":0.002248108,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879901","doi":"10.37665/jsmtqgquw57724","title":"Strain Rate and Cyclic Dependencies of PCBA Pad Crater Susceptibility","year":2014,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Strain rate; Deformation (meteorology); Strain (injury); Failure mode and effects analysis; Printed circuit board; Soldering; Range (aeronautics); Surface-mount technology","authors":[{"name":"John McMahon","is_ca":false},{"name":"Brian Standing","is_ca":false},{"name":"M. Thomson","is_ca":false},{"name":"Jim Wilcox","is_ca":true},{"name":"Matt Kelly","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00824724130385835,"gpt":0.2185773647861803,"spread":0.2103301234823219,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004182011,0.0002546158,0.0001533295,0.0008187329,0.0001685973,0.0001667488,0.0001990381,0.0002458739,0.002638371],"category_scores_gemma":[0.002757802,0.0001634949,0.0001847876,0.0004301274,0.0002590357,0.0002237929,0.0002415884,0.0004131853,0.0004826935],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001433595,"about_ca_system_score_gemma":0.00009677409,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009504211,"about_ca_topic_score_gemma":0.001149668,"domain_scores_codex":[0.9996204,0.00004788666,0.00002912911,0.00007597113,0.0001690475,0.00005754993],"domain_scores_gemma":[0.9954543,0.002194081,0.0005723288,0.0005078837,0.001064447,0.0002069164],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001080884,0.0002596795,0.02840829,0.0001229735,0.00003120756,0.0002496963,0.0002887683,0.007718055,0.9330311,0.0001376127,0.0003115815,0.02835999],"study_design_scores_gemma":[0.00001297522,0.003784852,0.299435,0.00002007892,0.00003832292,0.00048355,0.0002020432,0.03043453,0.6644812,0.0001014496,0.000960316,0.0000456912],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9942434,0.0002325837,0.002967236,0.00002655368,0.00001432321,0.00003755394,0.0004183638,0.0001516279,0.001908241],"genre_scores_gemma":[0.9983382,0.00006011847,0.0005157137,0.00001125027,0.000005221846,0.00002118344,0.0002077844,0.00002333376,0.0008171661],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002638371,"threshold_uncertainty_score":0.008826256,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880454","doi":"10.37665/jsmteuguk46252","title":"The Influence of Alloy Composition and Temperature Cycling Dwell Time on the Reliability of a Quad Flat No Lead (QFN) Package","year":2012,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Temperature cycling; Eutectic system; Soldering; Dwell time; Reliability (semiconductor); Cycling; Alloy; Work (physics)","authors":[{"name":"Richard Coyle","is_ca":false},{"name":"Peter Read","is_ca":false},{"name":"Heather McCormick","is_ca":true},{"name":"Richard Popowich","is_ca":false},{"name":"Debra Fleming","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00587711501501991,"gpt":0.2161313284486766,"spread":0.2102542134336567,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003196915,0.0003131545,0.0002743665,0.0003500818,0.0001887341,0.0002706824,0.0002700578,0.0003723248,0.000756528],"category_scores_gemma":[0.001371536,0.0002513147,0.0001503293,0.0002262697,0.0001683249,0.0003196686,0.0001131233,0.0001362474,0.0002075207],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003026602,"about_ca_system_score_gemma":0.0001639835,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001877546,"about_ca_topic_score_gemma":0.00323223,"domain_scores_codex":[0.9997298,0.00005264589,0.00002309921,0.00006443485,0.00008554688,0.0000443618],"domain_scores_gemma":[0.9988681,0.0004822224,0.0001861119,0.00007483444,0.0003120166,0.0000767839],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001747889,0.00009272563,0.008135574,0.00008385184,0.00004032736,0.0002501306,0.0001212615,0.004914572,0.9708394,0.00004270501,0.00009704967,0.01363456],"study_design_scores_gemma":[0.00004716706,0.008674421,0.08825692,0.00002357138,0.0002486636,0.0008309127,0.000158272,0.02422909,0.876368,0.00006156992,0.0010479,0.00005353549],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9989035,0.0002881931,0.0005997205,0.000007471611,0.000006410078,0.000002804592,0.00002946345,0.00002893596,0.0001334946],"genre_scores_gemma":[0.9993848,0.00005393266,0.0003207144,0.000005902167,0.000003168713,0.000002218647,0.00003194627,0.0000121836,0.000185142],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001877546,"threshold_uncertainty_score":0.003733218,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880500","doi":"10.37665/jsmtpgcch16168","title":"Corrosion Study of Lead-Free Solders Exposed to Artificial Sweat","year":2013,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Blackberry (Canada); University of Waterloo","funders":"","keywords":"Corrosion; Soldering; Mobile phone; SWEAT; Headset","authors":[{"name":"Thomas P. Kennedy","is_ca":true},{"name":"Julie Liu","is_ca":true},{"name":"Deepchand Ramjattan","is_ca":true},{"name":"Laura J. Turbini","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01953884434409091,"gpt":0.2380754256725368,"spread":0.2185365813284459,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002402,0.0004240824,0.0004106146,0.0002507023,0.0001758453,0.0003005648,0.0002872473,0.0004840853,0.0007040352],"category_scores_gemma":[0.0004041161,0.0002198196,0.0003773283,0.0003416593,0.0001892695,0.0002505835,0.0002220748,0.0002935508,0.0002693851],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001950449,"about_ca_system_score_gemma":0.0001136095,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001372779,"about_ca_topic_score_gemma":0.00181651,"domain_scores_codex":[0.9997053,0.00006356293,0.00003190371,0.00005350188,0.0001172047,0.00002858778],"domain_scores_gemma":[0.9996381,0.00004313266,0.00006313012,0.00003050631,0.0002071286,0.00001798361],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001795995,0.00002259722,0.0009814721,0.0001029614,0.00001626253,0.0001241641,0.0001070685,0.0001949528,0.996442,0.0000263756,0.0000252317,0.001777293],"study_design_scores_gemma":[0.000006660703,0.001036011,0.005933301,0.00001343881,0.00004079533,0.0001636476,0.000216374,0.000990385,0.9902738,0.00002305666,0.001292784,0.000009777592],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9969342,0.001072936,0.001321664,0.00002346193,0.00002312729,0.00001304101,0.0001020524,0.00001991245,0.000489547],"genre_scores_gemma":[0.9950258,0.0008584555,0.001965066,0.00003040955,0.000007430805,0.00001731749,0.0001692583,0.00001752488,0.001908618],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001372779,"threshold_uncertainty_score":0.002729535,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879915","doi":"10.37665/jsmtlkwuw50812","title":"Stretchable Polyurethane-Based Conductive Ink for E-Textile Applications","year":2019,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Electrical conductor; Inkwell; Coating; Conductive ink; Textile; Conductive polymer; Porosity; Durability; Printed electronics","authors":[{"name":"Pengxiang Si","is_ca":true},{"name":"Li Chen","is_ca":true},{"name":"Boxin Zhao","is_ca":true},{"name":"Alex Chen","is_ca":false},{"name":"John Persic","is_ca":false},{"name":"Robert Lyn","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01104300264896922,"gpt":0.2441086962161711,"spread":0.2330656935672019,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001229873,0.0003310251,0.0001127974,0.0002765423,0.000114346,0.0003222199,0.0001492257,0.0003661521,0.001056467],"category_scores_gemma":[0.0002265674,0.0001065914,0.0001742306,0.0002304059,0.0001498707,0.0004128641,0.0001710358,0.000264117,0.0004046406],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00009370639,"about_ca_system_score_gemma":0.00007580067,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00009131645,"about_ca_topic_score_gemma":0.0001632275,"domain_scores_codex":[0.9998745,0.00001846899,0.00001195431,0.00002403631,0.00005310211,0.00001793924],"domain_scores_gemma":[0.9998533,0.00003528003,0.00004639835,0.00001374159,0.00003768621,0.00001370762],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002678597,0.00002009797,0.0001638694,0.00009595104,0.000002981061,0.0001034307,0.00001576094,0.000211903,0.9896723,0.0001486735,0.0000886267,0.009449635],"study_design_scores_gemma":[0.000002895348,0.0001071726,0.0006064284,0.000006756448,0.000005711364,0.0001771603,0.00001297434,0.001812492,0.9941567,0.00005351076,0.003051983,0.000006202194],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8635843,0.01305666,0.1101097,0.0003000305,0.0003262507,0.0001019239,0.0002043118,0.0006153465,0.01170153],"genre_scores_gemma":[0.9704376,0.001842246,0.02333585,0.00006552508,0.00002751813,0.00002450965,0.00006697803,0.00003934151,0.004160375],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001056467,"threshold_uncertainty_score":0.003534198,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879854","doi":"10.37665/jsmtpsuej25516","title":"The Study of Dissolution of Bi Precipitates in Sn Using a Novel in Situ Heating Technique in the SEM","year":2019,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Dissolution; Scanning electron microscope; Microstructure; Soldering; Kinetics; Alloy; In situ; Optical microscope","authors":[{"name":"Peter Banh","is_ca":true},{"name":"André M. Delhaise","is_ca":true},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01637854508169661,"gpt":0.2641619936112848,"spread":0.2477834485295882,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001719772,0.0002552645,0.0001540325,0.0003165163,0.0002251367,0.0001895773,0.0002060033,0.0002363505,0.0009720377],"category_scores_gemma":[0.0001401784,0.0002038895,0.0001435784,0.0001639592,0.000158904,0.0001955637,0.0001339328,0.0003881351,0.0002077337],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001719445,"about_ca_system_score_gemma":0.00009326787,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007620894,"about_ca_topic_score_gemma":0.00178775,"domain_scores_codex":[0.9998971,0.00001326281,0.000009195468,0.00002696504,0.00003873852,0.00001472693],"domain_scores_gemma":[0.9998403,0.00003814726,0.00003533817,0.00002328104,0.00005128259,0.00001178225],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001985849,0.000005937157,0.0001729402,0.00001691535,0.000002533651,0.00002578637,0.00002767877,0.00002658318,0.9986227,0.00004128867,0.00001156693,0.001026343],"study_design_scores_gemma":[0.000001565341,0.00004954302,0.003202969,0.00000207425,0.000007162386,0.000129173,0.00002895982,0.001007195,0.9948843,0.00001301611,0.0006711857,0.000002959693],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9638125,0.0008597996,0.03158639,0.00005449171,0.00005235816,0.00004336188,0.0001843109,0.0002400807,0.003166641],"genre_scores_gemma":[0.9624166,0.0004825874,0.03154004,0.00003535312,0.00001175406,0.00003697732,0.0001697379,0.00005371356,0.005253202],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009720377,"threshold_uncertainty_score":0.003251791,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3151243527","doi":"10.37665/smt.v34i1.23","title":"Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms","year":2021,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false},"ca_institutions":"","funders":"University of Toronto","keywords":"Whisker; Materials science; Tin; Soldering; Metallurgy; Alloy; Bismuth","authors":[{"name":"André M. Delhaise","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Jeff Kennedy","is_ca":false},{"name":"Zohreh Bagheri","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01665957658375086,"gpt":0.2195099258202323,"spread":0.2028503492364814,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001097269,0.0001775217,0.0001796007,0.0002574707,0.0001751178,0.0002380562,0.0002121358,0.0002094499,0.0007571569],"category_scores_gemma":[0.0001713338,0.0001434569,0.0001425917,0.0002042438,0.0001620673,0.000204646,0.000117811,0.0001307967,0.0001273994],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001768392,"about_ca_system_score_gemma":0.00007544702,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008495071,"about_ca_topic_score_gemma":0.001525096,"domain_scores_codex":[0.9999104,0.000007983067,0.000005602697,0.00002296552,0.00003438674,0.00001881363],"domain_scores_gemma":[0.9998423,0.00003327429,0.00004554271,0.00001885635,0.00003835073,0.00002166347],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007403299,0.000009051394,0.0006372893,0.00002449673,0.000005167338,0.0001005743,0.00007686505,0.00008640208,0.9982211,0.00001817552,0.00001481914,0.0007320322],"study_design_scores_gemma":[0.000005359362,0.000313168,0.009910591,0.000003669341,0.00001831024,0.00005976466,0.0001114942,0.001010843,0.9881722,0.000007892302,0.000382554,0.00000427772],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9993547,0.0001528443,0.0002284593,0.000003764736,0.000006739222,0.000003862053,0.00004231226,0.00001581265,0.0001914285],"genre_scores_gemma":[0.9983833,0.00009090875,0.000532648,0.000004529064,0.000002257278,0.00000604386,0.00005857929,0.000008924097,0.0009127844],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0008495071,"threshold_uncertainty_score":0.002532959,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879969","doi":"10.37665/jsmtnjsgz43207","title":"Failure Mechanism of SAC 305 and SAC 405 in Harsh Environments and Influence of Board Defects Including Black Pad","year":2007,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Soldering; Ball grid array; Printed circuit board; Temperature cycling; Scanning electron microscope; Failure mechanism","authors":[{"name":"Polina Snugovsky","is_ca":true},{"name":"Zohreh Bagheri","is_ca":true},{"name":"Heather McCormick","is_ca":true},{"name":"Simin Bagheri","is_ca":true},{"name":"Craig Hamilton","is_ca":true},{"name":"Marianne Romansky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007396897397177095,"gpt":0.2215443370557898,"spread":0.2141474396586127,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001685015,0.0002461247,0.0001629748,0.0002433713,0.0001542767,0.0001626539,0.0002231166,0.0002160866,0.001028207],"category_scores_gemma":[0.0002517963,0.0001131703,0.0001210403,0.00009823457,0.0002006338,0.0001952263,0.0001183555,0.00009432867,0.0002465345],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001501731,"about_ca_system_score_gemma":0.0000857562,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001377594,"about_ca_topic_score_gemma":0.00182876,"domain_scores_codex":[0.9998699,0.0000128561,0.000005765987,0.00002503031,0.00006029115,0.00002612297],"domain_scores_gemma":[0.99977,0.00002661156,0.00005261808,0.00003317742,0.00008869219,0.00002897885],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0002175819,0.00002068107,0.007076223,0.00004425279,0.00001349164,0.0002578726,0.00008730838,0.001127471,0.9865958,0.00007356564,0.00005718146,0.004428496],"study_design_scores_gemma":[0.000009340826,0.001291452,0.05512417,0.000006650323,0.00003346798,0.0004538973,0.00016772,0.008886894,0.9329535,0.00004879679,0.001011483,0.00001256144],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.999119,0.0000657091,0.0006291416,0.000002101576,0.000002867817,0.000002738741,0.00001288101,0.00002061901,0.0001450907],"genre_scores_gemma":[0.9992564,0.00001764354,0.0002542324,0.000001956477,5.822715e-7,0.000001504329,0.00002246099,0.000002974333,0.0004421893],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001377594,"threshold_uncertainty_score":0.003439724,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W3147875004","doi":"10.37665/smt.v34i1.12","title":"Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar","year":2021,"lang":"en","type":"article","venue":"Journal of Surface Mount Technology","topic":"Antenna Design and Optimization","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Infineon Technologies (Canada)","funders":"","keywords":"Ball grid array; Temperature cycling; Failure mode and effects analysis; Radar; Reliability (semiconductor); Automotive industry; Thermal; Wafer; Microwave; Materials science; Vibration fatigue; Ball (mathematics); Printed circuit board; Vibration; Electronic engineering; Mechanical engineering; Automotive engineering; Soldering; Acoustics; Engineering; Fatigue testing; Structural engineering; Electrical engineering; Optoelectronics; Composite material; Telecommunications; Power (physics)","authors":[{"name":"Walter Hartner","is_ca":true},{"name":"M. Nießner","is_ca":true},{"name":"F. Arcioni","is_ca":true},{"name":"Markus Fink","is_ca":true},{"name":"Christian Geißler","is_ca":true},{"name":"Birgit Hebler","is_ca":true},{"name":"G. Haubner","is_ca":true},{"name":"Maciej Wojnowski","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01587826481166186,"gpt":0.2224925001102935,"spread":0.2066142352986316,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003431316,0.0005154064,0.0003700709,0.0002574035,0.000152628,0.0003421505,0.0004995729,0.0003699298,0.00183708],"category_scores_gemma":[0.0008806092,0.0001970912,0.0003256255,0.0001837001,0.0001561891,0.0003414014,0.0001670735,0.0001828698,0.0005133376],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003484569,"about_ca_system_score_gemma":0.0001452468,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004764627,"about_ca_topic_score_gemma":0.0004741065,"domain_scores_codex":[0.9996972,0.00007243055,0.00000976993,0.00005503577,0.0001093452,0.0000561522],"domain_scores_gemma":[0.9993852,0.000162079,0.0001253502,0.0001083844,0.0001805412,0.0000383992],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001410168,0.00022796,0.0163407,0.0005228142,0.0002421651,0.001046287,0.0004132198,0.1287036,0.7999944,0.0005696535,0.002068948,0.04846003],"study_design_scores_gemma":[0.0001034075,0.01537618,0.04592508,0.00008525608,0.0004009846,0.0007961969,0.000206146,0.3082767,0.6236744,0.0002321977,0.004832166,0.0000913538],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9919945,0.0005244123,0.005903356,0.0000322928,0.00003235662,0.00001334171,0.0001549062,0.0004228613,0.0009218598],"genre_scores_gemma":[0.9983934,0.00007373353,0.0007434341,0.000007617917,0.000004147909,0.00000694864,0.0001147152,0.00003807063,0.0006179152],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00183708,"threshold_uncertainty_score":0.006145656,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880638","doi":"10.37665/jsmtmoxij89329","title":"Accelerated Life Testing Solder Reliability in Combined Environments: Isothermal Conditions with Harmonic Vibration","year":2018,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Reliability (semiconductor); Vibration; Temperature cycling; Protocol (science); Isothermal process; Accelerated life testing; Thermal","authors":[{"name":"Chee Kiang Ivan Tan","is_ca":false},{"name":"Joseph Juarez","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Jeffrey Kennedy","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"David Hillman","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Subramaniam Suthakaran","is_ca":false},{"name":"Russell Brush","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03072627449100186,"gpt":0.2549032275054243,"spread":0.2241769530144225,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008638321,0.0005096967,0.0006233586,0.0004848553,0.0003640771,0.0003781843,0.0007236766,0.0003570266,0.002837624],"category_scores_gemma":[0.0006018202,0.0003203303,0.0005245906,0.0003688394,0.0005349845,0.000588138,0.0009886271,0.000579464,0.000456163],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004133837,"about_ca_system_score_gemma":0.000288998,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001219186,"about_ca_topic_score_gemma":0.003161222,"domain_scores_codex":[0.9986839,0.0001857922,0.00004872071,0.0001929524,0.0007649682,0.000123782],"domain_scores_gemma":[0.9994546,0.0001389997,0.00008749679,0.0001020731,0.0001661836,0.00005065287],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006041993,0.0001531904,0.002991942,0.0001191861,0.00003204037,0.00009987265,0.0001857051,0.001802617,0.9819328,0.0001357852,0.00009525961,0.01184732],"study_design_scores_gemma":[0.00005743816,0.007121169,0.02651893,0.0000276109,0.00009550453,0.0002488572,0.0001992928,0.007944996,0.9547614,0.0001817074,0.002777472,0.00006552254],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9760342,0.0008424912,0.02043937,0.00003757879,0.00006282056,0.0001033099,0.0001286138,0.0001946266,0.002157106],"genre_scores_gemma":[0.9841584,0.0002710712,0.01154234,0.00003694156,0.00003285582,0.0001052783,0.0001921182,0.00007158299,0.00358943],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002837624,"threshold_uncertainty_score":0.009492815,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108217785","doi":"10.37665/jsmtlpvgx48695","title":"Design for Excellence: Inductor Form, Fit, Function Equivalence & New Design Rules","year":2017,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Analog and Mixed-Signal Circuit Design","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Inductor; Electronics; Electronic component; Power electronics; Reliability (semiconductor); Inductance; Electromagnetic coil; Component (thermodynamics); Automotive electronics","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.09781978512255075,"gpt":0.2918326674696679,"spread":0.1940128823471172,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.006141004,0.0004994891,0.0004783299,0.0009365978,0.0005016008,0.002780143,0.001273137,0.0008157705,0.004303932],"category_scores_gemma":[0.01094252,0.0003845328,0.0004054967,0.0005691241,0.002228773,0.002527055,0.001146745,0.001110442,0.0009917245],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001151034,"about_ca_system_score_gemma":0.0007423027,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000359802,"about_ca_topic_score_gemma":0.0005168085,"domain_scores_codex":[0.9940826,0.002076774,0.0006139347,0.0005935357,0.00240093,0.0002321951],"domain_scores_gemma":[0.9942164,0.002263944,0.0005022393,0.001329829,0.001575258,0.0001122369],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001680443,0.00008995365,0.001329933,0.0003175392,0.00003441414,0.000310131,0.00116464,0.02367616,0.01766759,0.6334381,0.007090778,0.3147128],"study_design_scores_gemma":[0.0002420592,0.0006933624,0.001133193,0.0002945529,0.0001364295,0.001957363,0.0005625493,0.1629435,0.07153466,0.4248649,0.3355183,0.0001191151],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.02219273,0.0005582337,0.934678,0.0006929247,0.0001471047,0.0001948051,0.00003709338,0.0009546223,0.04054451],"genre_scores_gemma":[0.3636652,0.0003467329,0.6236238,0.000378821,0.0001193369,0.0002397283,0.00006779501,0.0003894198,0.01116915],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.006141004,"threshold_uncertainty_score":0.03247714,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880008","doi":"10.37665/jsmtwltkf84359","title":"Evaluating the Effect of Solder Paste Residues on RF Signals Between 5 and 10 GHz","year":2004,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Printed circuit board; Solder paste; HFSS; Surface-mount technology; Microstrip; Electromagnetic compatibility; Integrated circuit packaging; Insertion loss; Radio frequency","authors":[{"name":"Dwayne R. Shirley","is_ca":true},{"name":"Gabor Bendzsak","is_ca":true},{"name":"Laura J. Turbini","is_ca":false},{"name":"Gregory Munie","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0248937754443685,"gpt":0.3089835680260126,"spread":0.2840897925816441,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002808569,0.0004448175,0.0002855275,0.0002226408,0.000118242,0.0002007607,0.0002431916,0.0002923035,0.0007132938],"category_scores_gemma":[0.0009948835,0.0001458249,0.0002412809,0.0001852499,0.0001964483,0.0002612396,0.0001436286,0.0001930449,0.0001954653],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001393978,"about_ca_system_score_gemma":0.00007527656,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003297375,"about_ca_topic_score_gemma":0.000597182,"domain_scores_codex":[0.9996729,0.00007690691,0.00002145934,0.00005328334,0.0001209726,0.00005449492],"domain_scores_gemma":[0.9990221,0.0004598326,0.0002389625,0.00007962042,0.0001622335,0.00003716771],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004249755,0.000040491,0.001375898,0.00007286052,0.00002346342,0.0001557795,0.00003038026,0.00114261,0.9922829,0.00001723481,0.00001684989,0.004416539],"study_design_scores_gemma":[0.00000677812,0.001408937,0.006954955,0.000005407896,0.00004860771,0.0001195065,0.00002709121,0.001782863,0.9893596,0.0000114648,0.0002708342,0.000003966831],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9959332,0.0002728998,0.003276776,0.00001030051,0.00001241093,0.00001061168,0.00003109413,0.00003291274,0.0004196435],"genre_scores_gemma":[0.9973948,0.0001943277,0.001863247,0.00001855888,0.000005581316,0.000006352338,0.00006254137,0.0000160834,0.0004384468],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0007132938,"threshold_uncertainty_score":0.002386212,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108209789","doi":"10.37665/jsmtejpyj76951","title":"Case Histories in Failure Analysis of Electronics Assemblies","year":2011,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Thornhill Medical (Canada)","funders":"","keywords":"Electronics; Root cause analysis; Root cause; Failure causes; Electronic systems","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.01797076466686285,"gpt":0.2183929258488412,"spread":0.2004221611819783,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002371841,0.0006508332,0.0003998307,0.003850718,0.002154207,0.0008013548,0.001174194,0.002639321,0.003685578],"category_scores_gemma":[0.01510592,0.0005457043,0.000816472,0.001550548,0.001607938,0.000886564,0.0008597251,0.001007846,0.000564073],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001141521,"about_ca_system_score_gemma":0.0003519843,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002619681,"about_ca_topic_score_gemma":0.003964262,"domain_scores_codex":[0.9971998,0.001045454,0.0002721645,0.0002673693,0.0009422555,0.0002731057],"domain_scores_gemma":[0.9857391,0.01030009,0.001299577,0.0008617818,0.001303847,0.0004956102],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"case_report","study_design_gemma":"case_report","study_design_scores_codex":[0.002403606,0.001789712,0.2694813,0.001423695,0.0004199428,0.466692,0.01258722,0.05681895,0.01728833,0.01358266,0.01674757,0.1407651],"study_design_scores_gemma":[0.0002036548,0.004841555,0.1435389,0.001157719,0.000637164,0.5882264,0.008124276,0.04968678,0.06948622,0.01518204,0.1184044,0.0005110299],"study_design_candidate":"case_report","study_design_consensus":"case_report","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9523068,0.002531236,0.03110765,0.0007505109,0.0001121293,0.0004074583,0.0006400494,0.0002544733,0.01188961],"genre_scores_gemma":[0.9899485,0.0006088937,0.006609229,0.0001559858,0.00003763003,0.00006335512,0.0002298698,0.00003845769,0.002308025],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003850718,"threshold_uncertainty_score":0.01254368,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879936","doi":"10.37665/jsmtyhyjs54922","title":"Optical Connector Contamination/Scratches and Its Influence on Optical Signal Performance","year":2003,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electrical Contact Performance and Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Cable gland; Optical fiber; Optical fiber cable; Cladding (metalworking); Insertion loss; SIGNAL (programming language); Fiber optic splitter; Optical power; Bit error rate","authors":[{"name":"Tatiana Berdinskikh","is_ca":true},{"name":"Nick Albeanu","is_ca":true},{"name":"David Silmser","is_ca":false},{"name":"Heather Tkalec","is_ca":false},{"name":"Jennifer Nguyen","is_ca":false},{"name":"Les Aseere","is_ca":false},{"name":"Yves G. Pradieu","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007239604039199722,"gpt":0.2121066285472663,"spread":0.2048670245080666,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0007983053,0.0004007262,0.0003391267,0.0004801258,0.0002511928,0.0005611914,0.0002310271,0.00048994,0.001697484],"category_scores_gemma":[0.003534316,0.0002837927,0.0003228696,0.000349919,0.0004489395,0.0004155659,0.0004029257,0.0003767501,0.0004611305],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002958166,"about_ca_system_score_gemma":0.0001144055,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0006637267,"about_ca_topic_score_gemma":0.0006170445,"domain_scores_codex":[0.9989451,0.0002207548,0.00006104564,0.0001486823,0.0005000653,0.0001244505],"domain_scores_gemma":[0.9932608,0.002995777,0.00127154,0.0005062902,0.00175037,0.0002152052],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0009416701,0.00008313142,0.02275246,0.0001730179,0.00007372569,0.0007355272,0.0001467225,0.006482783,0.9563972,0.00007097937,0.000154156,0.01198865],"study_design_scores_gemma":[0.00001736331,0.00324224,0.09431984,0.00003170264,0.0001208403,0.0009568374,0.000206726,0.01802264,0.8819695,0.00006622424,0.001007523,0.0000385559],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9949344,0.0003375491,0.003909009,0.0000249728,0.00001860093,0.00001348934,0.00005960454,0.0001161557,0.000586162],"genre_scores_gemma":[0.9987282,0.00007730175,0.0007693659,0.00001818285,0.000004777286,0.000003448694,0.00005833195,0.00002349219,0.000316874],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001697484,"threshold_uncertainty_score":0.005678654,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879825","doi":"10.37665/jsmtywpng58628","title":"iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry","year":2008,"lang":"","type":"article","venue":"Journal of Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Soldering; Reliability (semiconductor); Alloy; Supply chain; Ball grid array; Printed circuit board","authors":[{"name":"G.A. Henshall","is_ca":false},{"name":"Robert M. Healy","is_ca":false},{"name":"Ranjit Pandher","is_ca":false},{"name":"Keith Sweatman","is_ca":false},{"name":"Keith Howell","is_ca":false},{"name":"Richard Coyle","is_ca":false},{"name":"Thilo Sack","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Stephen Tisdale","is_ca":false},{"name":"Fay Hua","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01908028371262318,"gpt":0.2502368493376327,"spread":0.2311565656250096,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.005817753,0.0005918468,0.0004219293,0.003799831,0.0008187906,0.003248754,0.001418363,0.001819523,0.01744838],"category_scores_gemma":[0.003519961,0.0002764777,0.0003396848,0.003301985,0.0003949506,0.001599284,0.0007917642,0.0009346865,0.008161678],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002140083,"about_ca_system_score_gemma":0.003931861,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.006578463,"about_ca_topic_score_gemma":0.0096,"domain_scores_codex":[0.9957095,0.0004059781,0.0001395634,0.0002700825,0.003288393,0.0001864192],"domain_scores_gemma":[0.9951537,0.00047165,0.0004149551,0.0003520825,0.003268291,0.000339369],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.002561655,0.001755379,0.01724715,0.002238848,0.00007336692,0.0007718283,0.0005464311,0.006309012,0.06607234,0.02690225,0.1912257,0.684296],"study_design_scores_gemma":[0.0000542761,0.00133372,0.01260478,0.0002850517,0.00004083849,0.0003526787,0.0003283476,0.002996014,0.05002902,0.001522284,0.9304088,0.00004422917],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.1803959,0.04512567,0.03560014,0.009665157,0.001312132,0.001889462,0.04171381,0.003765206,0.6805326],"genre_scores_gemma":[0.4797146,0.03788748,0.07862237,0.002176237,0.0007035444,0.00126449,0.09557866,0.0006779878,0.3033747],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.01744838,"threshold_uncertainty_score":0.05837059,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}