{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":23,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":23,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"952ec62d9b4e","filters":{"venue":"On-Demand Webinars"}},"results":[{"id":"W4416879590","doi":"10.37665/wergopj33851","title":"State of the Industry - Introduction to Harsh Environments (Coatings/ Potting)","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Diverse Musicological Studies","field":"Arts and Humanities","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Electronics; Excellence; Process (computing); State (computer science); Presentation (obstetrics); Design for manufacturability","authors":[{"name":"Jason Keeping","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05486725941531038,"gpt":0.2328215449671844,"spread":0.177954285551874,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001505383,0.0008199228,0.0003151646,0.001723684,0.0009058305,0.005318692,0.001201352,0.00247864,0.06907862],"category_scores_gemma":[0.00129166,0.0004646206,0.0003690399,0.002129718,0.0008698169,0.003912528,0.001936253,0.002998041,0.04173473],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001733577,"about_ca_system_score_gemma":0.001680315,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002012788,"about_ca_topic_score_gemma":0.002277666,"domain_scores_codex":[0.998941,0.00007366879,0.00007069985,0.0001993623,0.0005685931,0.0001465853],"domain_scores_gemma":[0.9989335,0.000131977,0.00007327167,0.00007434232,0.0005774393,0.0002094852],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0000644474,0.0001060626,0.000421677,0.001133182,0.000005544552,0.0001093032,0.0002564664,0.0002345702,0.006374549,0.01983611,0.4516245,0.5198337],"study_design_scores_gemma":[0.000001124491,0.00002796856,0.000236069,0.0001499088,0.000001225658,0.00006623406,0.0000480184,0.00003436859,0.0006375349,0.0006255078,0.9981665,0.000005454844],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.004590017,0.4032832,0.01292312,0.04673907,0.06562555,0.0002053678,0.001042426,0.001472948,0.4641184],"genre_scores_gemma":[0.03335308,0.266131,0.006076954,0.01262993,0.02192068,0.0001360835,0.001666197,0.0006322857,0.6574538],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.06907862,"threshold_uncertainty_score":0.231091,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879814","doi":"10.37665/weolwnm77920","title":"X-Ray Inspection Criteria and Common Defect Analysis","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Advanced X-ray and CT Imaging","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Presentation (obstetrics); Test (biology); Electronics; Software inspection; Visual inspection; Electronic equipment","authors":[{"name":"John Travis","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007567971386203748,"gpt":0.2469759873525181,"spread":0.2394080159663143,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00130511,0.0007334802,0.0005521607,0.01262803,0.0004960378,0.002264753,0.0008383692,0.0008995042,0.009302737],"category_scores_gemma":[0.007772441,0.0002447428,0.0004027452,0.002443237,0.001275163,0.001301707,0.001180083,0.0003591224,0.001882888],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001141013,"about_ca_system_score_gemma":0.0006282188,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.007885368,"about_ca_topic_score_gemma":0.006576995,"domain_scores_codex":[0.9975839,0.0002818319,0.000287679,0.0002995325,0.001344692,0.0002024625],"domain_scores_gemma":[0.9903215,0.002650894,0.001143429,0.0003361556,0.005004679,0.0005432501],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001946509,0.000308468,0.4457669,0.0008043573,0.0001654057,0.003765399,0.0011123,0.03473205,0.07468528,0.02593829,0.01659526,0.3941796],"study_design_scores_gemma":[0.000110845,0.001385843,0.531092,0.0006762607,0.0001966208,0.01337846,0.002950202,0.3445094,0.06234273,0.01397785,0.02911958,0.0002602142],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7627074,0.002591175,0.1536893,0.0004084358,0.0001436294,0.0004520393,0.001631792,0.001588476,0.07678775],"genre_scores_gemma":[0.9681791,0.0002273118,0.02381162,0.00002572759,0.00001957853,0.00004828042,0.0006999737,0.00009288164,0.006895506],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.01262803,"threshold_uncertainty_score":0.03112078,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879751","doi":"10.37665/webhxfg59444","title":"Moisture Sensitive Devices- Part II","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Standardization; Automotive industry; Task (project management); Test (biology); Reliability (semiconductor); Electronic component; Broadband","authors":[{"name":"Steven R. Martell","is_ca":false},{"name":"Neil Poole","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01388604966501251,"gpt":0.2333068797576754,"spread":0.2194208300926628,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000304939,0.001246594,0.0005927026,0.001577099,0.0006218218,0.002515668,0.001252356,0.001676883,0.1862631],"category_scores_gemma":[0.0004742321,0.0004993137,0.0007307847,0.001399425,0.0003451547,0.001462473,0.001111713,0.00120356,0.1248151],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007345063,"about_ca_system_score_gemma":0.0006564216,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001199175,"about_ca_topic_score_gemma":0.001267563,"domain_scores_codex":[0.9995416,0.00002820218,0.00001880728,0.00008360789,0.000269966,0.00005780154],"domain_scores_gemma":[0.9996853,0.00004009434,0.00002352358,0.00005118763,0.0001620391,0.00003785676],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001415736,0.0002162467,0.0004732936,0.001582905,0.00002423181,0.000293448,0.0001118691,0.00106763,0.02831967,0.0105291,0.5287781,0.4284621],"study_design_scores_gemma":[0.000009006762,0.0001319077,0.00105404,0.0002047886,0.00001020916,0.0003719776,0.00004428179,0.0002907905,0.00485843,0.00125224,0.9917589,0.00001339321],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.006103963,0.07284401,0.01553323,0.002211367,0.01324092,0.0007904748,0.004177474,0.003198204,0.8819004],"genre_scores_gemma":[0.0157212,0.02464125,0.002642546,0.001302179,0.002031654,0.0002351133,0.003831125,0.0004553645,0.9491395],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.1862631,"threshold_uncertainty_score":0.6231121,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879807","doi":"10.37665/wertjuv16319","title":"Practical Guidelines in Handling Moisture Sensitivity of SMT Packages","year":2019,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"IBM; Standardization; Automotive industry; Surface-mount technology; Cleanroom; Product (mathematics); Process (computing); Moisture; Integrated circuit packaging","authors":[{"name":"Mumtaz Y. Bora","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02437186510969335,"gpt":0.2982266898210501,"spread":0.2738548247113567,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.005045223,0.00153447,0.0007690463,0.002770479,0.001079251,0.001843243,0.002561064,0.003137394,0.01864878],"category_scores_gemma":[0.01180226,0.0008977383,0.0005269658,0.001006408,0.0007627233,0.001908032,0.001495235,0.001949118,0.02770522],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004974939,"about_ca_system_score_gemma":0.001002508,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001083932,"about_ca_topic_score_gemma":0.002028744,"domain_scores_codex":[0.9931646,0.001960475,0.0005847526,0.0001991276,0.003866112,0.0002248339],"domain_scores_gemma":[0.9896729,0.00238323,0.0006776673,0.001135162,0.005868054,0.0002630691],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002615209,0.0003722147,0.00220479,0.002290694,0.00002247145,0.002728462,0.001613072,0.005670798,0.1955747,0.007146077,0.2311341,0.5509812],"study_design_scores_gemma":[0.00004733088,0.0006337834,0.003405102,0.001147171,0.00001783946,0.003275083,0.0009928389,0.003653903,0.08891689,0.006621454,0.8911884,0.0001002474],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"other","genre_scores_codex":[0.04294828,0.018714,0.6606423,0.02592915,0.006800122,0.00909422,0.002733776,0.03114118,0.2019968],"genre_scores_gemma":[0.1293069,0.01700057,0.6719709,0.008640578,0.002481941,0.004128903,0.003371871,0.004935913,0.1581625],"genre_candidate":"other","genre_consensus":null,"teacher_disagreement_score":0.01864878,"threshold_uncertainty_score":0.06238633,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879753","doi":"10.37665/wemoiwc98236","title":"What's with Bismuth?","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Champion; Presentation (obstetrics); Electronics; Public interest","authors":[{"name":"Bev Christian","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01299097364813347,"gpt":0.2301247342923664,"spread":0.2171337606442329,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00090851,0.0004900467,0.0004394724,0.0008410977,0.001181775,0.003585156,0.000623618,0.002129207,0.1129745],"category_scores_gemma":[0.003498215,0.0001773663,0.0003792775,0.0009391271,0.0006321776,0.00346393,0.001341464,0.001928731,0.04128284],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001002112,"about_ca_system_score_gemma":0.0008757639,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002320628,"about_ca_topic_score_gemma":0.004350465,"domain_scores_codex":[0.9991195,0.0001891532,0.00003903275,0.00009954718,0.0004503643,0.0001024533],"domain_scores_gemma":[0.9989682,0.0002324345,0.00008219638,0.00004416647,0.0004157725,0.0002572445],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00006720135,0.0001086988,0.0007819451,0.0007468449,0.000007916159,0.0002478549,0.0005670377,0.00003011858,0.001184357,0.002829079,0.7708703,0.2225586],"study_design_scores_gemma":[0.000004364414,0.00003847076,0.0006233725,0.0002921563,0.000004933056,0.0004648465,0.0008070591,0.00002192171,0.0005408749,0.001271444,0.9959239,0.000006646501],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.0169802,0.1221246,0.005577455,0.3115173,0.06163419,0.000241358,0.001177517,0.002410444,0.478337],"genre_scores_gemma":[0.07038788,0.09385678,0.003915603,0.08892749,0.02633023,0.0001271484,0.001462209,0.001408988,0.7135837],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.1129745,"threshold_uncertainty_score":0.3779374,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879756","doi":"10.37665/weghdnh49401","title":"Level 4 Traceability","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Food Supply Chain Traceability","field":"Agricultural and Biological Sciences","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Traceability; Rework; Work (physics); Bachelor; Process (computing); Product (mathematics); Work order","authors":[{"name":"Michael Kou","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.08368913662752066,"gpt":0.2730407247085864,"spread":0.1893515880810658,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.006371535,0.001628943,0.0009449761,0.004808486,0.001912767,0.008722035,0.003411405,0.002529385,0.1556493],"category_scores_gemma":[0.01741683,0.0007959484,0.001376536,0.002301574,0.0009351759,0.005743539,0.00665721,0.002592827,0.07508902],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.003649949,"about_ca_system_score_gemma":0.006894018,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.01791485,"about_ca_topic_score_gemma":0.007320103,"domain_scores_codex":[0.9880787,0.001491664,0.0009339762,0.001560544,0.006600934,0.001334241],"domain_scores_gemma":[0.9710604,0.003333609,0.001263979,0.00926677,0.01420164,0.0008737017],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0005061745,0.0004096594,0.008194228,0.0009855003,0.00007246077,0.0007224821,0.001439392,0.004404545,0.0193878,0.05286887,0.2489795,0.6620294],"study_design_scores_gemma":[0.00003430822,0.0002247817,0.003085361,0.0005488385,0.000041566,0.0004178211,0.0004239386,0.006870387,0.0261506,0.01374185,0.9483762,0.00008430446],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.0164899,0.0006826051,0.3819175,0.003333152,0.001084759,0.004066903,0.01500341,0.0444627,0.532959],"genre_scores_gemma":[0.2224814,0.001402066,0.2150858,0.004067993,0.0006944658,0.002974355,0.04570071,0.007653479,0.4999397],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.1556493,"threshold_uncertainty_score":0.5206989,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879638","doi":"10.37665/wenzvur90162","title":"Achieving Enhanced Reliability with a Novel Lead-free, Bismuth-free, Low Temperature Solder","year":2025,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Reliability (semiconductor); Electronics; Soldering; Fusible alloy; Circuit reliability; Melting temperature; Presentation (obstetrics)","authors":[{"name":"Emily Belfield","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.004911731577698883,"gpt":0.2133699683152163,"spread":0.2084582367375174,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000149712,0.0002909606,0.000195557,0.0004171698,0.0002618893,0.0007521549,0.0004537744,0.0004547297,0.01710201],"category_scores_gemma":[0.0001896481,0.0001795413,0.0001652245,0.0002312907,0.0001557468,0.0007489495,0.0003280118,0.0005034805,0.006219138],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002465483,"about_ca_system_score_gemma":0.000194378,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002657439,"about_ca_topic_score_gemma":0.0008204506,"domain_scores_codex":[0.9998776,0.000008038973,0.000004593627,0.00001820704,0.00008191865,0.000009602543],"domain_scores_gemma":[0.9999222,0.000008904365,0.000009518677,0.000008138923,0.00003685323,0.00001441651],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001222729,0.0001634562,0.0002639168,0.0004498089,0.0000143987,0.000577863,0.0001277368,0.001067596,0.8017829,0.006630586,0.05104639,0.1377531],"study_design_scores_gemma":[0.00006642035,0.0005932902,0.00173733,0.00005940067,0.00003361891,0.001316161,0.0001159605,0.009012148,0.6454343,0.001494898,0.3400863,0.00005027274],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.2855068,0.01579497,0.2405129,0.007124022,0.008523037,0.0003965257,0.001234212,0.01395066,0.4269567],"genre_scores_gemma":[0.4182138,0.006726677,0.09700473,0.001232908,0.001012493,0.0001213479,0.0008228506,0.001117891,0.4737473],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.01710201,"threshold_uncertainty_score":0.05721188,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879667","doi":"10.37665/wexvevh47362","title":"Conformal Coatings - Understanding How Key Properties Translate to Fitness for Use","year":2025,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Key (lock); Presentation (obstetrics); Simple (philosophy); Conformal map","authors":[{"name":"Michael A. Strong","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05561481365500571,"gpt":0.2540135039170519,"spread":0.1983986902620462,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002141183,0.0003030532,0.0002915924,0.0009135394,0.0005218685,0.005286775,0.0003745476,0.0007130645,0.01659143],"category_scores_gemma":[0.01238083,0.0001954274,0.0002748042,0.0008856573,0.001003199,0.002753369,0.0009570349,0.0009974901,0.003574644],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001300539,"about_ca_system_score_gemma":0.0006771203,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.003674675,"about_ca_topic_score_gemma":0.00486163,"domain_scores_codex":[0.998935,0.0002059834,0.00005658032,0.0001859994,0.0005175155,0.00009883237],"domain_scores_gemma":[0.9961269,0.001751081,0.000517281,0.0003270977,0.001105188,0.0001724169],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003479139,0.0002973707,0.1061687,0.002019171,0.00009688913,0.0005951386,0.004140196,0.003403082,0.07734041,0.08545266,0.03857191,0.6815664],"study_design_scores_gemma":[0.00003251704,0.0008918053,0.4512781,0.001339496,0.0001666471,0.00121811,0.01406631,0.01456394,0.07288498,0.139093,0.3041969,0.0002682182],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.523893,0.01334139,0.05899793,0.02129899,0.001145646,0.0004295323,0.004331064,0.001490265,0.3750722],"genre_scores_gemma":[0.9542516,0.006179222,0.01637624,0.001065532,0.0001123909,0.00009335626,0.0007195608,0.000374218,0.02082793],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.01659143,"threshold_uncertainty_score":0.05550385,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879555","doi":"10.37665/wegdnma10425","title":"How to Clean Really Complex Electronics Assemblies","year":2024,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Ultrasound and Cavitation Phenomena","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Troubleshooting; Electronics; Cleaning agent; Process (computing); New product development; Underpinning","authors":[{"name":"Barbara Kanegsberg","is_ca":false},{"name":"Ed Kanegsberg","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02200816831086395,"gpt":0.2743227953232981,"spread":0.2523146270124342,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001209749,0.001256384,0.000729004,0.001079889,0.001837414,0.003003579,0.001254474,0.002428174,0.08773187],"category_scores_gemma":[0.003179268,0.001215225,0.001006659,0.0004437027,0.0007018308,0.00369045,0.002023603,0.002307044,0.06984866],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007424559,"about_ca_system_score_gemma":0.0007769924,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001510007,"about_ca_topic_score_gemma":0.003295722,"domain_scores_codex":[0.9986578,0.0001099861,0.00006772746,0.0001092356,0.0009433808,0.0001118552],"domain_scores_gemma":[0.9981657,0.0003551741,0.00007964446,0.0003497729,0.0008963841,0.000153448],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0000931007,0.0001551179,0.0009996305,0.001394384,0.00005443178,0.0006526976,0.0007244915,0.002556834,0.1529765,0.00824394,0.389597,0.4425518],"study_design_scores_gemma":[0.00002070557,0.0001564189,0.001174474,0.0002274419,0.00002676609,0.0007602642,0.0005059291,0.002099194,0.03977697,0.004968545,0.950219,0.00006434648],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.0312485,0.01489596,0.5526712,0.0292158,0.01183514,0.001565558,0.001784891,0.04581608,0.3109668],"genre_scores_gemma":[0.08580986,0.01465949,0.5180954,0.01128238,0.002273393,0.0007969047,0.003464499,0.01232902,0.351289],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.08773187,"threshold_uncertainty_score":0.2934923,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879405","doi":"10.37665/wenntot18191","title":"Practical Guidelines in Handling Moisture Sensitive Packages and PWBs","year":2020,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"IBM; Automotive industry; Standardization; Surface-mount technology; Product (mathematics); Integrated circuit packaging; Process (computing); Packaging industry","authors":[{"name":"Mumtaz Y. Bora","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0403808911960884,"gpt":0.3014801255399349,"spread":0.2610992343438465,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.005372859,0.002056365,0.001032911,0.003492899,0.001676775,0.002630618,0.003541541,0.003892411,0.04326043],"category_scores_gemma":[0.01069693,0.001364624,0.0006582098,0.00137106,0.001194773,0.002924516,0.002295072,0.003460878,0.06764124],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006984773,"about_ca_system_score_gemma":0.00168268,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001904489,"about_ca_topic_score_gemma":0.004014402,"domain_scores_codex":[0.9924544,0.001901758,0.0007519808,0.0002871096,0.004344586,0.00026011],"domain_scores_gemma":[0.9903977,0.001982606,0.000580995,0.001248827,0.00548853,0.0003012764],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001566081,0.0002787388,0.001085753,0.00170724,0.00001405096,0.002011428,0.001765916,0.002849441,0.05039661,0.009775363,0.4361965,0.4937623],"study_design_scores_gemma":[0.00001485554,0.0001367923,0.0006468126,0.0005860738,0.000005454739,0.00135463,0.0005325775,0.0004898974,0.008415758,0.003162198,0.9846219,0.00003305652],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.01398078,0.03420612,0.5234855,0.03336348,0.01102384,0.00935875,0.002991752,0.03487378,0.336716],"genre_scores_gemma":[0.03789817,0.02613338,0.5445102,0.01252652,0.002553085,0.004743757,0.004229099,0.006857383,0.3605482],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.04326043,"threshold_uncertainty_score":0.1447206,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879878","doi":"10.37665/welyfup21439","title":"Shining a Light on LED Technology","year":2015,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"GaN-based semiconductor devices and materials","field":"Physics and Astronomy","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Light-emitting diode; Reliability (semiconductor); LED lamp; Electronics; LED display; Focus (optics)","authors":[{"name":"M. Simard‐Normandin","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01997759386718256,"gpt":0.2612269495768644,"spread":0.2412493557096818,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006606373,0.0004496104,0.0003030901,0.0007650057,0.0007420335,0.003054959,0.0005093854,0.001781818,0.0383624],"category_scores_gemma":[0.0008111004,0.0002205858,0.0003601645,0.0005924278,0.0004049375,0.002371734,0.001277204,0.001718824,0.01624726],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001122466,"about_ca_system_score_gemma":0.0007033515,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001029529,"about_ca_topic_score_gemma":0.001714452,"domain_scores_codex":[0.9993559,0.000100959,0.00002062908,0.0000812847,0.0003541465,0.00008711108],"domain_scores_gemma":[0.9994044,0.000134073,0.00002921069,0.00003890476,0.0003125714,0.00008080249],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00006332169,0.00008176513,0.0006809925,0.0006995399,0.00001248619,0.0003361484,0.0004316254,0.0004324484,0.02147707,0.03356026,0.3245693,0.617655],"study_design_scores_gemma":[0.000003176012,0.00006094484,0.0002925787,0.0001624729,0.00000439893,0.0002329011,0.0001421734,0.000193753,0.002914057,0.002996935,0.9929878,0.000008796179],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.01490103,0.1727297,0.02609625,0.03517882,0.01438647,0.0001674063,0.0002914704,0.002461836,0.733787],"genre_scores_gemma":[0.06954009,0.1368099,0.02231624,0.01489838,0.007230111,0.00008015193,0.000452749,0.0004930999,0.7481793],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.0383624,"threshold_uncertainty_score":0.1283351,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879560","doi":"10.37665/wensyms76186","title":"Photonic Reflow Fundamentals and Best Use Cases","year":2024,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Metallurgical and Alloy Processes","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Photonics; Reflow soldering; Reliability (semiconductor); Flip chip; Soldering; Electronics; Printed circuit board; Process (computing)","authors":[{"name":"Ara Parsekian","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05658319445860938,"gpt":0.3053007730440561,"spread":0.2487175785854467,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008798225,0.000636834,0.0003164954,0.00221761,0.001291462,0.003039163,0.001606593,0.001723203,0.02024926],"category_scores_gemma":[0.001238967,0.0004395412,0.0003760282,0.001902356,0.0009130991,0.002821028,0.001603749,0.001233669,0.008960492],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002486914,"about_ca_system_score_gemma":0.0016116,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00483059,"about_ca_topic_score_gemma":0.007224896,"domain_scores_codex":[0.9990034,0.0001050526,0.00005767622,0.0001228374,0.0005131153,0.0001979589],"domain_scores_gemma":[0.9994142,0.0001476149,0.00006041276,0.00005939549,0.0002405804,0.00007784201],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001224648,0.0001086382,0.0009741653,0.001109728,0.000009025716,0.002265927,0.0006950317,0.001134697,0.008330378,0.07290604,0.09431454,0.8180293],"study_design_scores_gemma":[0.000005720335,0.00006401789,0.0005566442,0.0005878853,0.000005413193,0.002847642,0.0003670611,0.0007372144,0.006624993,0.00831754,0.9798613,0.00002470462],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"methods","genre_scores_codex":[0.01701204,0.1721162,0.06505687,0.01251104,0.001591286,0.0002716036,0.0004999189,0.002252459,0.7286885],"genre_scores_gemma":[0.2140919,0.2659846,0.09111706,0.007744506,0.001851795,0.0005970942,0.001711644,0.001482347,0.4154191],"genre_candidate":"methods","genre_consensus":null,"teacher_disagreement_score":0.02024926,"threshold_uncertainty_score":0.0677405,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879606","doi":"10.37665/wedtabu78029","title":"Selective Soldering Round Table Discussion","year":2020,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"PricewaterhouseCoopers (Canada)","funders":"","keywords":"Round table; Fusible alloy; Presentation (obstetrics); Soldering; Table (database)","authors":[{"name":"Karl Pfluke","is_ca":false},{"name":"Adrian De'ath","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0165554725835065,"gpt":0.2241297827792902,"spread":0.2075743101957837,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.002138932,0.001099971,0.0005608291,0.001244895,0.003553255,0.003595186,0.001652248,0.006016651,0.668155],"category_scores_gemma":[0.004435513,0.000536087,0.001444685,0.0008035937,0.0005419623,0.002622743,0.002650191,0.00479448,0.3674372],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001713324,"about_ca_system_score_gemma":0.002844405,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.003176292,"about_ca_topic_score_gemma":0.00762134,"domain_scores_codex":[0.9984089,0.000163507,0.00006434283,0.0001917622,0.0009023601,0.0002691105],"domain_scores_gemma":[0.998158,0.0003092059,0.00004835336,0.0001889001,0.001036239,0.0002593042],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0000226114,0.00003669416,0.00003305712,0.0000510201,0.00000108226,0.00004816172,0.00002382907,0.00002649113,0.000279232,0.001386723,0.9765058,0.02158521],"study_design_scores_gemma":[0.000003854638,0.00001172613,0.0001458533,0.00003366202,9.419198e-7,0.00002334873,0.00004952,0.00001433657,0.0001683027,0.0003650058,0.9991799,0.000003469648],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"commentary","genre_scores_codex":[0.0009885754,0.002114999,0.002511363,0.02368869,0.04099003,0.0005938066,0.001559287,0.001797018,0.9257562],"genre_scores_gemma":[0.001994124,0.0008075004,0.000565434,0.005827512,0.002896249,0.0001891147,0.0006187088,0.0002955445,0.9868058],"genre_candidate":"commentary","genre_consensus":null,"teacher_disagreement_score":0.668155,"threshold_uncertainty_score":0.4733366,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879783","doi":"10.37665/weofahf24579","title":"Advantages, Benefits & Durability of Stencil Nano-Coatings","year":2025,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Stencil; Fusible alloy; Solder paste; Soldering; Abrasion (mechanical); Surface-mount technology","authors":[{"name":"Tony Lentz","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01343973912772454,"gpt":0.2466497958780709,"spread":0.2332100567503464,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003869481,0.0002772416,0.0001956357,0.0004907516,0.000479207,0.001859531,0.0003463545,0.0006549775,0.04480834],"category_scores_gemma":[0.0004997822,0.0002067378,0.0002039704,0.0003708489,0.0001787252,0.0009854082,0.000450217,0.0006431214,0.008455804],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006960837,"about_ca_system_score_gemma":0.0003011556,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001670291,"about_ca_topic_score_gemma":0.005343586,"domain_scores_codex":[0.9994148,0.00002603392,0.00001674507,0.00003603129,0.000470074,0.00003624289],"domain_scores_gemma":[0.9996383,0.0000506691,0.00002542455,0.00002947208,0.000227289,0.0000289497],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003705074,0.0002010211,0.001707174,0.00164691,0.00001839663,0.0005598491,0.0003149395,0.0006111331,0.4383093,0.0051465,0.08185461,0.4692597],"study_design_scores_gemma":[0.00002772908,0.0005369646,0.009940878,0.0002351508,0.00004687672,0.001262184,0.0005756412,0.001382219,0.3675601,0.002089346,0.616276,0.00006695604],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.1314861,0.03900459,0.01536567,0.005573915,0.003614273,0.0002416416,0.00185006,0.002626749,0.8002371],"genre_scores_gemma":[0.4664702,0.01781441,0.01448011,0.001232779,0.0003563508,0.00008184984,0.0009401711,0.000783795,0.4978403],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.04480834,"threshold_uncertainty_score":0.1498988,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879665","doi":"10.37665/weoiqlq94712","title":"LGA Void Reduction via Optimization of Solder Paste Deposition","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Soldering; Corporation; Electronics; Indium; Deposition (geology); Brazing; Reflow soldering","authors":[{"name":"Emily Belfield","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007105790769368912,"gpt":0.2021290341344317,"spread":0.1950232433650628,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001146269,0.0003230254,0.0002676815,0.0003324717,0.0001524183,0.0005221954,0.0004647909,0.0003347853,0.003447337],"category_scores_gemma":[0.000406043,0.0001393324,0.0001654638,0.0003236314,0.0001083726,0.0003297488,0.000296619,0.0002698489,0.001365758],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000485385,"about_ca_system_score_gemma":0.0001680633,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001026609,"about_ca_topic_score_gemma":0.002964858,"domain_scores_codex":[0.9998751,0.00001153625,0.000005540292,0.00002299133,0.00006559453,0.00001939082],"domain_scores_gemma":[0.9998291,0.0000323831,0.00003931906,0.00002451411,0.00005922474,0.00001539464],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000158114,0.0001775369,0.001507697,0.0001685832,0.00001784798,0.0002156236,0.00007604945,0.01461952,0.9004987,0.0007405788,0.004214529,0.07760517],"study_design_scores_gemma":[0.00003365547,0.0006801902,0.005149758,0.00001311647,0.00003785448,0.00025939,0.0000577999,0.08169917,0.8889915,0.0004255316,0.02262718,0.000024901],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8398214,0.001884542,0.07798773,0.0006635381,0.0002814177,0.0001082793,0.0004996628,0.008525065,0.07022841],"genre_scores_gemma":[0.9650497,0.0002381224,0.02311012,0.00008618813,0.00001812659,0.00002098672,0.0001669929,0.0003556388,0.01095404],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003447337,"threshold_uncertainty_score":0.01153243,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879830","doi":"10.37665/weixhkx17651","title":"3D Printing: What Is it and an Example of Its Use","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Additive Manufacturing and 3D Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"Centennial College","funders":"","keywords":"Aerospace; Automation; Technician; 3D printing; Centennial; Certificate; Rapid prototyping; Advanced manufacturing; Certification","authors":[{"name":"Tim Repetski","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0499683553282207,"gpt":0.2592914769865998,"spread":0.2093231216583791,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.003137245,0.0007468908,0.0003884731,0.002219043,0.00226398,0.009382745,0.001507818,0.00318776,0.01438014],"category_scores_gemma":[0.005951012,0.000329758,0.0007730154,0.003874009,0.003046986,0.004421719,0.002791754,0.00199453,0.00626548],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001444682,"about_ca_system_score_gemma":0.0009001674,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.003069513,"about_ca_topic_score_gemma":0.003984442,"domain_scores_codex":[0.9958251,0.001058468,0.0001544804,0.0002723866,0.002471145,0.0002185105],"domain_scores_gemma":[0.9958833,0.002107699,0.0001572696,0.0006530461,0.0009510468,0.0002475237],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.000231046,0.0001716716,0.002793827,0.001831724,0.00002779706,0.003835373,0.008632055,0.001275426,0.007714411,0.0734298,0.10623,0.7938269],"study_design_scores_gemma":[0.00001006348,0.0001088328,0.001908807,0.001224879,0.0000193419,0.005766444,0.003124836,0.001405745,0.005491978,0.007836596,0.9730362,0.00006637263],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.04523444,0.06622589,0.1308531,0.03239195,0.005299851,0.0002832953,0.0005507826,0.002603738,0.7165569],"genre_scores_gemma":[0.4671471,0.1160727,0.1598248,0.01340404,0.003767936,0.0004276597,0.0008323116,0.00364163,0.2348818],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.01438014,"threshold_uncertainty_score":0.04810631,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879675","doi":"10.37665/weuthrj43287","title":"What are the Consequences When Coatings Hit the Fan?","year":2023,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Excellence; Electronics; Troubleshooting; Design for manufacturability; Work (physics); Process (computing); Subject matter; Value proposition","authors":[{"name":"Jason Keeping","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02555466243486554,"gpt":0.2415368368708604,"spread":0.2159821744359949,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002298739,0.0005054455,0.0004600508,0.0007803552,0.003652835,0.006086962,0.0008948987,0.00256076,0.03689098],"category_scores_gemma":[0.01009578,0.0002951518,0.0004568537,0.0005760819,0.002909199,0.003002511,0.00139359,0.002364495,0.006641569],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.004154644,"about_ca_system_score_gemma":0.001976121,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.02713851,"about_ca_topic_score_gemma":0.03353709,"domain_scores_codex":[0.9977155,0.000366433,0.00006621252,0.000313433,0.00107725,0.0004612601],"domain_scores_gemma":[0.9962696,0.0006675518,0.0004625659,0.0001983702,0.001837263,0.0005646259],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006206685,0.0002531491,0.1179321,0.0007795477,0.0001727271,0.009722398,0.01055033,0.001481986,0.007689341,0.03571343,0.4496302,0.3654541],"study_design_scores_gemma":[0.00008352591,0.0005410758,0.1034979,0.001799113,0.0001794088,0.006483072,0.06983842,0.002813485,0.008182119,0.03934299,0.7670072,0.000231696],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.2947633,0.01564369,0.007430492,0.1698185,0.0148865,0.0002190267,0.001127636,0.0008925714,0.4952183],"genre_scores_gemma":[0.8678248,0.005186039,0.001435218,0.01746647,0.00101188,0.00004927078,0.0003706628,0.0002659662,0.1063897],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.03689098,"threshold_uncertainty_score":0.1234126,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879864","doi":"10.37665/wenleep41307","title":"Webtorial: Reflow - Understanding the Complete Process & Defect Prevention","year":2017,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Canadian Wood Council","funders":"","keywords":"Soldering; Reflow soldering; Surface-mount technology; Solder paste; Root cause; Process (computing); Session (web analytics)","authors":[{"name":"Bob Willis","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.09406223789622012,"gpt":0.3243744344296153,"spread":0.2303121965333952,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005321449,0.001013014,0.0004530945,0.0006235805,0.000758188,0.002163925,0.001268765,0.001573768,0.3153214],"category_scores_gemma":[0.001595465,0.0003322341,0.0004524038,0.0003303291,0.0003106843,0.002395639,0.002307499,0.001545132,0.1908567],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000490597,"about_ca_system_score_gemma":0.0006752432,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008676048,"about_ca_topic_score_gemma":0.001647705,"domain_scores_codex":[0.9996661,0.00005601257,0.000008847799,0.0000489448,0.0001581739,0.0000620047],"domain_scores_gemma":[0.9990754,0.0001849347,0.00003757023,0.0001261598,0.000385612,0.0001902535],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001344841,0.0001569734,0.0003061607,0.0003317048,0.000003901251,0.0001686445,0.0002974572,0.0004665313,0.007864664,0.001994711,0.8031753,0.1850994],"study_design_scores_gemma":[0.0000161175,0.00007864236,0.001064357,0.0001606144,0.000004525749,0.0002333038,0.0001624367,0.001236896,0.004039013,0.001522609,0.9914647,0.0000169308],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.0168962,0.007349818,0.1128635,0.02038791,0.01513111,0.001093831,0.0049815,0.03480926,0.7864868],"genre_scores_gemma":[0.03049354,0.003089346,0.02181117,0.003084851,0.001867541,0.0003500312,0.003015315,0.00503247,0.9312557],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.3153214,"threshold_uncertainty_score":0.9766109,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879640","doi":"10.37665/wexqsnw70661","title":"Practical Guidelines in Handling Moisture Sensitivity of SMT Packages","year":2016,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"IBM; Standardization; Automotive industry; Surface-mount technology; Product (mathematics); Integrated circuit packaging; Cleanroom; Process (computing)","authors":[{"name":"Mumtaz Y. Bora","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03166919403526994,"gpt":0.3048048889435602,"spread":0.2731356949082902,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.008008425,0.001529133,0.0007664038,0.003287324,0.001309047,0.002094639,0.003045314,0.003485461,0.01998549],"category_scores_gemma":[0.02029761,0.0009591796,0.0005143809,0.001211309,0.0009166888,0.002193304,0.001730229,0.001973859,0.02980301],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006121986,"about_ca_system_score_gemma":0.001335999,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001431258,"about_ca_topic_score_gemma":0.002513833,"domain_scores_codex":[0.9888726,0.003644413,0.0009888974,0.0002802835,0.005879375,0.0003344275],"domain_scores_gemma":[0.9802915,0.004616714,0.001300484,0.00226392,0.01110523,0.0004221362],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002893259,0.0004544973,0.003161519,0.002194368,0.00002278924,0.0032088,0.002375291,0.005899683,0.1507814,0.006288567,0.276706,0.5486179],"study_design_scores_gemma":[0.0000563821,0.0007600841,0.005015551,0.001501582,0.00002027376,0.003743728,0.001524983,0.003920726,0.07723392,0.006289779,0.8998115,0.0001214675],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.05551495,0.015103,0.608346,0.02978023,0.006574658,0.01310043,0.003186113,0.03842589,0.2299687],"genre_scores_gemma":[0.1405763,0.01338374,0.6609088,0.008913631,0.002225207,0.005001646,0.003601791,0.005869146,0.1595198],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.01998549,"threshold_uncertainty_score":0.06685817,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879658","doi":"10.37665/weedujr48227","title":"The Role of Electrically Conductive Coatings in EMI Suppression","year":2024,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electromagnetic wave absorption materials","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"EMI; Electrical conductor; Electromagnetic interference; Coating; Key (lock); Electronics; Product (mathematics); Electromagnetic environment","authors":[{"name":"Michael Strong","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007016665542969296,"gpt":0.2525954255030607,"spread":0.2455787599600915,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006185177,0.0004606935,0.0002258912,0.0004307776,0.0004230201,0.001909161,0.0005961734,0.0009326685,0.005064939],"category_scores_gemma":[0.001375524,0.0003007935,0.0002106606,0.0002682863,0.0004533017,0.001034848,0.0006653994,0.0009292437,0.002314097],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005104379,"about_ca_system_score_gemma":0.0002394829,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004752507,"about_ca_topic_score_gemma":0.0005542591,"domain_scores_codex":[0.9994197,0.00007751198,0.00001930097,0.00006743348,0.000355072,0.00006102528],"domain_scores_gemma":[0.9993457,0.0002452302,0.00007756354,0.0000344149,0.0002633834,0.00003364633],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001412861,0.0000858357,0.0006299828,0.000973081,0.00001332955,0.000508853,0.0002829313,0.001415421,0.7732117,0.01060908,0.009623609,0.2025048],"study_design_scores_gemma":[0.00002309857,0.0004613859,0.001842607,0.0002199626,0.000042007,0.00109511,0.0003074759,0.007600115,0.7844313,0.0018782,0.2020603,0.00003839117],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.2431455,0.09865066,0.203835,0.00716774,0.004324102,0.0004514618,0.0002180794,0.003118413,0.4390891],"genre_scores_gemma":[0.7839167,0.04020062,0.06685687,0.002577265,0.0005576745,0.00009174349,0.0002016238,0.0005919692,0.1050055],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.005064939,"threshold_uncertainty_score":0.01694387,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879502","doi":"10.37665/weznfjc91929","title":"Design For Environment (DfE): 8 Proven Strategies for Developing Superior, Cost Efficient, & Environmentally Compliant Products","year":2012,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Sustainable Industrial Ecology","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Cerestech (Canada)","funders":"","keywords":"Design for the Environment; Electronics; Social responsibility; Environmentally friendly; Sustainable products; Product (mathematics)","authors":[{"name":"Graham Adams","is_ca":true},{"name":"Howard A. Stone","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.06195754527840272,"gpt":0.2645123638756303,"spread":0.2025548185972275,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.005136226,0.001126912,0.0003163929,0.001213109,0.0007269889,0.003772455,0.001050317,0.002007777,0.03977643],"category_scores_gemma":[0.006749198,0.0004680308,0.0003859914,0.0004098629,0.001177864,0.004060581,0.003457936,0.001525194,0.01274822],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009299221,"about_ca_system_score_gemma":0.001315063,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003067416,"about_ca_topic_score_gemma":0.0007735228,"domain_scores_codex":[0.9971102,0.001328698,0.0001310724,0.0002150361,0.001042065,0.0001729674],"domain_scores_gemma":[0.9967346,0.001099599,0.0002355818,0.0005333535,0.0009391664,0.0004576974],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001621582,0.0007667225,0.001537508,0.0008169892,0.00001887947,0.0004045248,0.00184939,0.002983675,0.01480882,0.0675568,0.1199177,0.7891769],"study_design_scores_gemma":[0.00009251832,0.0007131608,0.001868482,0.0005109145,0.00002004462,0.001299142,0.001426658,0.00643552,0.01366244,0.03516453,0.9387354,0.00007121437],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.03056955,0.002428908,0.5499356,0.009336947,0.0008293739,0.0008128461,0.0003906565,0.008655311,0.3970409],"genre_scores_gemma":[0.1780364,0.003050637,0.5591068,0.003049562,0.0002683201,0.0006664891,0.0008168082,0.002729316,0.2522756],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.03977643,"threshold_uncertainty_score":0.1330653,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879710","doi":"10.37665/wecpmku66744","title":"Moisture Sensitive Device Handling and Storage","year":2022,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Standardization; Reliability (semiconductor); Process (computing); Automotive industry; Presentation (obstetrics); Variety (cybernetics)","authors":[{"name":"Steven R. Martell","is_ca":false},{"name":"Mumtaz Y. Bora","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00953681391325106,"gpt":0.2159696326978152,"spread":0.2064328187845641,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003253527,0.0009314096,0.0006351277,0.001180759,0.001012091,0.002567548,0.00160551,0.001347802,0.2875963],"category_scores_gemma":[0.0007751191,0.0004895654,0.0005985204,0.0008895937,0.0001920701,0.001648092,0.001669516,0.001144843,0.174286],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006181747,"about_ca_system_score_gemma":0.000635042,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001492211,"about_ca_topic_score_gemma":0.00196831,"domain_scores_codex":[0.9994796,0.00002998309,0.00002417168,0.00008385391,0.0003151031,0.00006730073],"domain_scores_gemma":[0.999595,0.0000447753,0.00002886844,0.0000705805,0.0002246893,0.00003608917],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001632052,0.00009227436,0.0005962395,0.0007380066,0.00001136378,0.0004214123,0.0002366715,0.0004090126,0.08094222,0.002628332,0.5485951,0.3651662],"study_design_scores_gemma":[0.00001658762,0.00008775904,0.0009291288,0.0001068588,0.000008955315,0.0004916917,0.0001079175,0.0005244549,0.02563939,0.0005449691,0.9715182,0.0000239648],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.01861917,0.01339232,0.03628752,0.004423321,0.006722485,0.001035407,0.008570935,0.02321853,0.8877304],"genre_scores_gemma":[0.04340831,0.005959757,0.01257035,0.002359516,0.0007064386,0.000265484,0.006054753,0.002691205,0.9259843],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.2875963,"threshold_uncertainty_score":0.9621054,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879368","doi":"10.37665/weevrdu13701","title":"Non-Contact Additive Processes for Contemporary Electronics Production","year":2020,"lang":"","type":"article","venue":"On-Demand Webinars","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Royal Ottawa Mental Health Centre","funders":"","keywords":"Presentation (obstetrics); Electronics; Production (economics); Jet (fluid); Emerging technologies; Electronic materials","authors":[{"name":"Gustaf Mårtensson","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02202050249175792,"gpt":0.2313546385722342,"spread":0.2093341360804763,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000826384,0.0008778467,0.0005572553,0.001431111,0.0007748097,0.00289347,0.000847066,0.00109137,0.2320215],"category_scores_gemma":[0.001159682,0.0004098637,0.0005333483,0.001251079,0.0002882954,0.00257914,0.001847305,0.001940713,0.09984313],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004426227,"about_ca_system_score_gemma":0.0004041036,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001032679,"about_ca_topic_score_gemma":0.0003773812,"domain_scores_codex":[0.9992496,0.00006111704,0.00003285796,0.00008004493,0.0005280593,0.00004821513],"domain_scores_gemma":[0.9993269,0.0001680744,0.00004329613,0.0001264131,0.0002493712,0.00008602642],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001570158,0.0002225398,0.0001939824,0.001513549,0.00001690262,0.0004648331,0.0002784654,0.0005915427,0.08954857,0.01180299,0.2838912,0.6113185],"study_design_scores_gemma":[0.00001087072,0.0001244985,0.0005822905,0.0001429152,0.000007704232,0.0006894688,0.00008192081,0.000568828,0.02904014,0.003360941,0.9653718,0.00001861089],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.01608742,0.04818754,0.1372121,0.004841888,0.01682159,0.000677629,0.002421677,0.01085166,0.7628986],"genre_scores_gemma":[0.05114635,0.02186828,0.04931611,0.0009885991,0.003347001,0.0002499003,0.002882446,0.003114419,0.867087],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.2320215,"threshold_uncertainty_score":0.7761893,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}