{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":5,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":5,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"ea19d3792852","filters":{"venue":"Regional Events"}},"results":[{"id":"W4416879449","doi":"10.37665/rezqtqh29421","title":"Process Considerations in Reducing Voiding in High Reliability Lead Free Solder Joints","year":2015,"lang":"","type":"article","venue":"Regional Events","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Alpha Technologies (Canada)","funders":"","keywords":"Soldering; Solder paste; Reliability (semiconductor); Ball grid array; Surface-mount technology; Process (computing); Reflow soldering; Lead (geology)","authors":[{"name":"William W. Yu","is_ca":true},{"name":"Steve D. M. Brown","is_ca":true},{"name":"Mitch Hohzer","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04947112017125478,"gpt":0.280687446886717,"spread":0.2312163267154622,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001289494,0.0003925918,0.0003209494,0.0007363709,0.0004847003,0.001043379,0.0008187189,0.0004631337,0.001506458],"category_scores_gemma":[0.001695544,0.0002806623,0.0003164107,0.0004273219,0.0004488569,0.001354515,0.0004854806,0.0003681637,0.0003027921],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004198666,"about_ca_system_score_gemma":0.0004906415,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0006034353,"about_ca_topic_score_gemma":0.002329448,"domain_scores_codex":[0.9991955,0.0001899374,0.00005158679,0.00007808161,0.0004180611,0.00006681865],"domain_scores_gemma":[0.9989039,0.0004017671,0.0002395809,0.0001298434,0.0002810837,0.00004386226],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0005871313,0.0003194783,0.004313989,0.001148805,0.00003072041,0.0007726672,0.0004163418,0.007038705,0.8798622,0.002928481,0.0004932391,0.1020881],"study_design_scores_gemma":[0.00006408361,0.002398984,0.01348347,0.00005687958,0.0001110642,0.001031166,0.0004727304,0.0114218,0.957746,0.001859331,0.01131367,0.00004081206],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"methods","genre_scores_codex":[0.836337,0.0110213,0.139138,0.0007470853,0.0002300022,0.0003020329,0.0000916175,0.0006792782,0.01145359],"genre_scores_gemma":[0.9618367,0.001854539,0.03310082,0.0001169764,0.00003944351,0.00003609123,0.00006529895,0.00008229716,0.002867719],"genre_candidate":"methods","genre_consensus":null,"teacher_disagreement_score":0.001506458,"threshold_uncertainty_score":0.006819546,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879471","doi":"10.37665/reqfmnd70699","title":"DfX - Design for Excellence - How to Build a Consistent Design-to-Test Flow in Order to Deliver Defect-Free PCBAs","year":2015,"lang":"","type":"article","venue":"Regional Events","topic":"Quality and Supply Management","field":"Business, Management and Accounting","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"ASTER","funders":"","keywords":"Product (mathematics); Reliability (semiconductor); Testability; Excellence; Traceability; New product development; Product design; Order (exchange); Product lifecycle","authors":[{"name":"Christophe Lotz","is_ca":true},{"name":"Peter Collins","is_ca":false},{"name":"Rui Meng","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.1292642009545131,"gpt":0.282183487813325,"spread":0.1529192868588119,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.01713976,0.001146319,0.0006020616,0.001983,0.001509084,0.004622762,0.001717949,0.002211092,0.02210554],"category_scores_gemma":[0.02602359,0.0009514667,0.0007942216,0.0007163433,0.001613053,0.005211387,0.002819455,0.00203232,0.01083848],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002902135,"about_ca_system_score_gemma":0.005512975,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002549473,"about_ca_topic_score_gemma":0.002646443,"domain_scores_codex":[0.9888216,0.004235175,0.0008281716,0.0007394296,0.004692682,0.0006829137],"domain_scores_gemma":[0.9834013,0.003950837,0.001242993,0.003747493,0.006603102,0.001054171],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002532193,0.00033875,0.004464735,0.001058021,0.00005380158,0.000672277,0.002497195,0.01470053,0.02082786,0.07234612,0.0694707,0.8133169],"study_design_scores_gemma":[0.0001986471,0.001283804,0.005486558,0.001465165,0.00006383593,0.002457026,0.001614951,0.03186573,0.04005886,0.06271906,0.852542,0.0002443094],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.012899,0.001373454,0.878721,0.008767328,0.000677684,0.001687931,0.0006831184,0.01321804,0.08197249],"genre_scores_gemma":[0.1009623,0.0008750209,0.8584023,0.00135695,0.00008890781,0.0006618601,0.001109666,0.002846188,0.03369693],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.02210554,"threshold_uncertainty_score":0.09064484,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416879434","doi":"10.37665/rezevcd27787","title":"The Influence of Soldering Materials on Sustainability","year":2024,"lang":"","type":"article","venue":"Regional Events","topic":"Chemistry and Chemical Engineering","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Alpha Technologies (Canada)","funders":"","keywords":"Sustainability; Soldering; Production (economics); Component (thermodynamics)","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.006522593018718083,"gpt":0.2329280397288805,"spread":0.2264054467101625,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0009703411,0.0004139618,0.0003667785,0.000705128,0.0004598612,0.001859589,0.0002909329,0.0005499348,0.01118302],"category_scores_gemma":[0.002098222,0.0001605607,0.0003572398,0.0006541322,0.000720437,0.0009934802,0.0006534779,0.0003982765,0.001298072],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000951838,"about_ca_system_score_gemma":0.0004299489,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002039669,"about_ca_topic_score_gemma":0.002864784,"domain_scores_codex":[0.9995033,0.0001840121,0.00002158744,0.00007794099,0.0001315494,0.00008167756],"domain_scores_gemma":[0.9991481,0.0004899076,0.00009233384,0.00004184282,0.0001823504,0.00004539838],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00175277,0.0004156118,0.02801928,0.004227655,0.0004200997,0.001647874,0.0008214609,0.06830174,0.3250355,0.09400309,0.01407378,0.4612811],"study_design_scores_gemma":[0.0001043641,0.002406164,0.09002868,0.0008008137,0.0008527671,0.0008886452,0.003750424,0.01747144,0.5466628,0.0936208,0.2432647,0.0001483981],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"other","genre_scores_codex":[0.7121065,0.0533192,0.006645384,0.003930817,0.0008998757,0.00004153434,0.0004357328,0.0002614683,0.2223595],"genre_scores_gemma":[0.9805423,0.008425354,0.0007754394,0.0002004937,0.0001245663,0.000009538093,0.0000843832,0.00006854092,0.009769266],"genre_candidate":"other","genre_consensus":null,"teacher_disagreement_score":0.01118302,"threshold_uncertainty_score":0.03741091,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108217068","doi":"10.37665/reachdg18465","title":"Next-Generation High-Reliability Solder for Enabling Enhanced Thermo-Mechanical Performance in Automotive Applications","year":2024,"lang":"","type":"article","venue":"Regional Events","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Alpha Technologies (Canada)","funders":"","keywords":"Soldering; Reliability (semiconductor); Automotive industry; Electronics; Miniaturization; Temperature cycling; Intermetallic; Surface-mount technology; Automotive electronics","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.03994349362497563,"gpt":0.2715423417597382,"spread":0.2315988481347626,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002005346,0.0004128319,0.0002720353,0.0004196479,0.0001265488,0.0003760205,0.0003932551,0.0004115131,0.0009981162],"category_scores_gemma":[0.0001611174,0.0001576429,0.00022256,0.0002472293,0.0001021908,0.0003424346,0.0002674872,0.0002039607,0.0007610868],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002435076,"about_ca_system_score_gemma":0.0001732052,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002443998,"about_ca_topic_score_gemma":0.0006368406,"domain_scores_codex":[0.9998677,0.00001670962,0.00000915651,0.00001943121,0.00007034048,0.00001668866],"domain_scores_gemma":[0.9998829,0.000006348974,0.00002867935,0.00001230913,0.00005717478,0.00001239908],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002548992,0.00002788733,0.000313072,0.00009832437,0.000009593734,0.00007413983,0.00001651892,0.0006750395,0.9886826,0.0006027913,0.0002826959,0.009191904],"study_design_scores_gemma":[0.000009825217,0.0003955268,0.001310736,0.00001160582,0.00002175398,0.0002355544,0.00001570597,0.007968197,0.9728341,0.0001438328,0.01704177,0.00001141818],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8691183,0.01834605,0.09148423,0.0004016899,0.0004992565,0.0001221001,0.000278165,0.001888026,0.01786214],"genre_scores_gemma":[0.9462934,0.001972714,0.04550051,0.00008343286,0.00007062842,0.00002792613,0.0001583954,0.0001272926,0.005765797],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009981162,"threshold_uncertainty_score":0.003338993,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885692","doi":"10.37665/rehqomq45236","title":"Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2 - Warpage Acceptance Proposal","year":2014,"lang":"","type":"article","venue":"Regional Events","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Original equipment manufacturer; Component (thermodynamics); Process (computing); Work (physics); Root cause; Head (geology); Surface-mount technology","authors":[{"name":"Alex Chan","is_ca":false},{"name":"Paul Brown","is_ca":false},{"name":"Richard Coyle","is_ca":false},{"name":"Lars Bruno","is_ca":false},{"name":"Anne-Kathrlne Knoph","is_ca":false},{"name":"Thilo Sack","is_ca":true},{"name":"David Geiger","is_ca":false},{"name":"David Méndez","is_ca":false},{"name":"Ron Kulterman","is_ca":false},{"name":"Mulugeta Abtew","is_ca":false},{"name":"I. Muntele","is_ca":false},{"name":"Kirk VanDreel","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02193287589731737,"gpt":0.2727877190308229,"spread":0.2508548431335055,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0329647,0.0007188949,0.0003338359,0.001569985,0.002587519,0.003698659,0.002812283,0.00561689,0.01083126],"category_scores_gemma":[0.02768518,0.0005591915,0.0006489296,0.0004198286,0.001237581,0.003010501,0.005318036,0.002417642,0.002800384],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002530172,"about_ca_system_score_gemma":0.01252137,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002266766,"about_ca_topic_score_gemma":0.003161481,"domain_scores_codex":[0.9696339,0.01512673,0.00153153,0.001652076,0.007654906,0.004400813],"domain_scores_gemma":[0.9608415,0.01004515,0.002624216,0.002796805,0.01660158,0.007090734],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.001727664,0.007423942,0.07036047,0.002322321,0.0001941567,0.01175532,0.02885228,0.03689159,0.1045898,0.05970905,0.06597793,0.6101955],"study_design_scores_gemma":[0.001349935,0.01589502,0.07382512,0.002557732,0.0002078157,0.004559624,0.08560746,0.04700045,0.1054932,0.01768033,0.6453114,0.0005118163],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"other","genre_scores_codex":[0.4529342,0.001260737,0.289209,0.05195479,0.001409636,0.01823937,0.0002923379,0.001678559,0.1830215],"genre_scores_gemma":[0.8504432,0.0004554667,0.09322803,0.004673776,0.0003233026,0.00421138,0.000329596,0.0001063124,0.04622888],"genre_candidate":"other","genre_consensus":null,"teacher_disagreement_score":0.0329647,"threshold_uncertainty_score":0.174336,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}