{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":98,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":98,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"21a686c8a2d1","filters":{"venue":"SMTA International"}},"results":[{"id":"W2159963606","doi":"10.37665/smscwem73165","title":"Does Copper Dissolution Impact Through-Hole Solder Joint Reliability?","year":2009,"lang":"en","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada); Hain Celestial (Canada)","funders":"","keywords":"Copper; Dissolution; Materials science; Rework; Joint (building); Reliability (semiconductor); Soldering; Metallurgy; Interconnection; Plating (geology); Structural engineering; Engineering; Geology","authors":[{"name":"Craig Hamilton","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Mario Moreno","is_ca":false},{"name":"Teng Hoon Ng","is_ca":false},{"name":"Juthathip Fangkangwanwong","is_ca":false},{"name":"Matthew Kelly","is_ca":true},{"name":"Marie Cole","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01069823607993766,"gpt":0.259987358896289,"spread":0.2492891228163514,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009640555,0.0001366674,0.0001169938,0.00006514441,0.00004755694,0.00004834066,0.0002159604,0.00008805953,0.00009177138],"category_scores_gemma":[0.00007115001,0.00009142349,0.00009173987,0.00007630443,0.00003956498,0.0002365631,0.00002724266,0.000224758,0.00004884025],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002999733,"about_ca_system_score_gemma":0.00001645532,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002213399,"about_ca_topic_score_gemma":0.000005750475,"domain_scores_codex":[0.9992016,0.000007892952,0.0001728548,0.0001730937,0.0001783497,0.000266208],"domain_scores_gemma":[0.9996494,0.00001632299,0.00002340544,0.0002421283,0.00004167261,0.00002704264],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"theoretical_or_conceptual","study_design_scores_codex":[0.000110989,0.0007465102,0.02204754,0.0001140831,0.0009230461,0.00005462798,0.003216813,0.336745,0.2125072,0.08410767,0.2543429,0.08508369],"study_design_scores_gemma":[0.002216137,0.0006099223,0.2219462,0.0003803377,0.00006181577,0.00006479785,0.0003709486,0.2647953,0.1529817,0.2820116,0.07264315,0.001918151],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9546646,0.0002734819,0.01847616,0.00564525,0.001522711,0.0001377254,0.00002769812,0.002271889,0.01698047],"genre_scores_gemma":[0.997894,0.0001096437,0.001324697,0.00006853638,0.0001348165,0.000008413259,0.00002289363,0.00001385616,0.0004231539],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1998987,"threshold_uncertainty_score":0.3728142,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878272","doi":"10.37665/smtylhz49682","title":"Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys","year":2018,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Alpha Technologies (Canada); Hain Celestial (Canada)","funders":"","keywords":"Soldering; Ball grid array; Temperature cycling; Eutectic system; Alloy; Thermal shock; Reliability (semiconductor); Solder paste","authors":[{"name":"Richard Coyle","is_ca":false},{"name":"Dave Hillman","is_ca":false},{"name":"Charmaine Johnson","is_ca":false},{"name":"Richard D. Parker","is_ca":false},{"name":"Michael Osterman","is_ca":false},{"name":"Brook Sandy-Smith","is_ca":false},{"name":"Babak Arfaei","is_ca":false},{"name":"Hongwen Zhang","is_ca":false},{"name":"Jie Geng","is_ca":false},{"name":"Keith Howell","is_ca":false},{"name":"Joe Smetana","is_ca":false},{"name":"Stuart Longgood","is_ca":false},{"name":"Andre Kleyner","is_ca":false},{"name":"André M. Delhaise","is_ca":true},{"name":"Jasbir Bath","is_ca":false},{"name":"Julie Silk","is_ca":false},{"name":"Ranjit Pandher","is_ca":true},{"name":"Eric Lundeen","is_ca":false},{"name":"Raiyo Aspandiar","is_ca":false},{"name":"Jerome Noiray","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01345126953279814,"gpt":0.2434387221744259,"spread":0.2299874526416277,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003053854,0.0002581135,0.0002779937,0.0001584611,0.0000999599,0.00006090797,0.000683852,0.0002354299,0.0002511218],"category_scores_gemma":[0.0001625933,0.0002741854,0.0000823365,0.0001132088,0.0005481565,0.0002295551,0.0003578665,0.0003654184,0.00001460863],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001736302,"about_ca_system_score_gemma":0.00004368327,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002230788,"about_ca_topic_score_gemma":0.00003441408,"domain_scores_codex":[0.9984158,0.00004142143,0.0004533123,0.0003786579,0.000355791,0.0003550086],"domain_scores_gemma":[0.9988741,0.0001054263,0.0001277214,0.0006003539,0.0002377612,0.00005464826],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004221219,0.000865091,0.02070908,0.0006480126,0.002215686,0.00002437165,0.003944175,0.02398752,0.7069052,0.1884528,0.009555879,0.0422701],"study_design_scores_gemma":[0.004932948,0.001183482,0.1117865,0.001105242,0.0002138275,0.0000789519,0.000245241,0.2400465,0.5853454,0.04867737,0.00480362,0.001580798],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9780492,0.0003696616,0.01383295,0.002490215,0.001411212,0.0001651105,0.00007997151,0.0003345628,0.003267137],"genre_scores_gemma":[0.991919,0.0002302981,0.007249832,0.00003795153,0.0003134873,0.00001334843,0.00002858384,0.00003358742,0.0001739492],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.216059,"threshold_uncertainty_score":0.999971,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2529445137","doi":"10.37665/smljhgf72386","title":"Evaluation of Halogen-Free Laminates Used in Handheld Electronics","year":2009,"lang":"en","type":"dissertation","venue":"SMTA International","topic":"Material Properties and Applications","field":"Materials Science","cited_by":1,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Mobile device; Electronics; Halogen; Materials science; Engineering; Computer science; Electrical engineering; Chemistry; World Wide Web; Organic chemistry","authors":[{"name":"David Lau","is_ca":true},{"name":"Laura J. Turbini","is_ca":false},{"name":"Julie Liu","is_ca":false},{"name":"Y. Zhou","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02739568787323546,"gpt":0.311719479146195,"spread":0.2843237912729595,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.001068789,0.0001676446,0.0002269781,0.0001736058,0.00003986898,0.00007082265,0.0006855811,0.0001739706,0.002266226],"category_scores_gemma":[0.0002838148,0.0001592501,0.00006389883,0.0001000803,0.00002678088,0.0001244841,0.00003811577,0.0001238163,0.00006938041],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002153268,"about_ca_system_score_gemma":0.0002899373,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002955512,"about_ca_topic_score_gemma":0.00305997,"domain_scores_codex":[0.997916,0.00008822443,0.0004935461,0.0003098914,0.001008651,0.0001836328],"domain_scores_gemma":[0.9986595,0.00002864839,0.0003252033,0.0003247286,0.0006366352,0.00002528563],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001093415,0.0001929369,0.00007938787,0.0000511967,0.00002317934,8.351572e-7,0.0004083303,0.0002530426,0.9795768,0.007299176,0.001170801,0.01083498],"study_design_scores_gemma":[0.001369963,0.0001177686,0.01280086,0.0002221988,0.0001248607,0.000002608378,0.0002798369,0.003126883,0.9423758,0.03516473,0.004049616,0.00036486],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9805591,0.0005584757,0.00001762716,0.0002127679,0.001040637,0.0004054249,0.0001228639,0.00002617143,0.0170569],"genre_scores_gemma":[0.9960801,0.00007040967,0.0002238411,0.00002547259,0.0001629255,0.0001367889,0.001177356,0.00001921936,0.002103872],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.03720097,"threshold_uncertainty_score":0.9986458,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878144","doi":"10.37665/smmpfqc43223","title":"The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys","year":2018,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Soldering; Temperature cycling; Eutectic system; Ball grid array; Reliability (semiconductor); Microstructure; Alloy; Indium; Weibull distribution","authors":[{"name":"Richard Coyle","is_ca":false},{"name":"Dave Hillman","is_ca":false},{"name":"Richard D. Parker","is_ca":false},{"name":"Charmaine Johnson","is_ca":false},{"name":"Michael Osterman","is_ca":false},{"name":"Joe Smetana","is_ca":false},{"name":"Babak Arfaei","is_ca":false},{"name":"André M. Delhaise","is_ca":true},{"name":"Keith Howell","is_ca":false},{"name":"Stuart Longgood","is_ca":false},{"name":"Andre Kleyner","is_ca":false},{"name":"Hongwen Zhang","is_ca":false},{"name":"Jie Geng","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01330948840487666,"gpt":0.2545368319459015,"spread":0.2412273435410248,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001312878,0.0003372927,0.0003637978,0.0001285417,0.0002278531,0.00006375054,0.002243682,0.0002393245,0.0002359132],"category_scores_gemma":[0.002036284,0.0001799098,0.0001963607,0.0002596243,0.001076088,0.00009984671,0.000460262,0.0006548703,0.00002128524],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001543337,"about_ca_system_score_gemma":0.00008461142,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001953607,"about_ca_topic_score_gemma":0.00006445745,"domain_scores_codex":[0.9977538,0.0001770965,0.000611063,0.0003430655,0.000643233,0.0004717322],"domain_scores_gemma":[0.9963145,0.001810479,0.000277062,0.001358395,0.0002058301,0.00003373948],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.009291456,0.00157621,0.1128835,0.00190002,0.0132765,0.00005918427,0.01034595,0.0654844,0.1889349,0.305693,0.07688793,0.213667],"study_design_scores_gemma":[0.00196232,0.003186191,0.02751683,0.00064223,0.0001133525,0.00001075311,0.0001307577,0.02512254,0.9303151,0.007218,0.003309949,0.0004719145],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9869998,0.000208658,0.001556456,0.004947301,0.00221249,0.000404487,0.00006684227,0.0001823217,0.003421681],"genre_scores_gemma":[0.9986495,0.0001844659,0.0002939274,0.00002675312,0.0002816929,0.00004098265,0.000005560981,0.000041056,0.0004760041],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7413803,"threshold_uncertainty_score":0.7336507,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880441","doi":"10.37665/smhfoof81186","title":"Lead-Free Card Assembly Advances and Challenges for Server PCBAs","year":2008,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Original equipment manufacturer; Reliability (semiconductor); Process (computing); Product (mathematics); Electronics; Portfolio; Variety (cybernetics); Backplane","authors":[{"name":"Matthew Kelly","is_ca":true},{"name":"Marie Cole","is_ca":false},{"name":"Jim Wilcox","is_ca":false},{"name":"Simin Bagheri","is_ca":false},{"name":"Craig Hamilton","is_ca":false},{"name":"Heather McCormick","is_ca":false},{"name":"Irene Sterian","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04624667281097757,"gpt":0.2572731512190762,"spread":0.2110264784080987,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001649649,0.0002786191,0.0002717385,0.0001667473,0.0001594509,0.00004709735,0.000642835,0.0001978647,0.00001501449],"category_scores_gemma":[0.0002759803,0.0003062466,0.0001114997,0.000064456,0.0001546565,0.0003567814,0.0002026211,0.0002969523,0.00001255112],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000163274,"about_ca_system_score_gemma":0.00005012112,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001504613,"about_ca_topic_score_gemma":0.00007189902,"domain_scores_codex":[0.9985733,0.00001341407,0.0002765509,0.0004040647,0.0002837383,0.0004489285],"domain_scores_gemma":[0.9991986,0.0001578919,0.00006950221,0.0004034846,0.0001175319,0.00005297192],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.000367126,0.0005441149,0.01461597,0.004188059,0.004272306,0.0001974821,0.007124841,0.01415123,0.006021619,0.2790964,0.02676534,0.6426556],"study_design_scores_gemma":[0.005009121,0.0008168716,0.02107749,0.0007475291,0.0001341909,0.0004958481,0.001132317,0.05969445,0.02265938,0.05090299,0.8353837,0.001946119],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5910065,0.3515192,0.01232007,0.02121966,0.004953869,0.0005875388,0.0001885686,0.001572935,0.01663164],"genre_scores_gemma":[0.8683056,0.1260668,0.004205409,0.00003079676,0.0003601176,0.00006623462,0.00001058425,0.00004489119,0.0009095938],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.8086184,"threshold_uncertainty_score":0.999939,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880379","doi":"10.37665/smaffsu27301","title":"Selective Wave Soldering DOE to Develop DFM Guidelines for Lead and Lead-Free Assemblies","year":2008,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Design for manufacturability; Pallet; Printed circuit board; Soldering; Surface-mount technology; Lead frame; Wave soldering; Cable gland; Solder paste","authors":[{"name":"Craig Hamilton","is_ca":true},{"name":"Mario Moreno","is_ca":false},{"name":"Ramón Téllez Méndez","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.09394900731101583,"gpt":0.3142705772206114,"spread":0.2203215699095955,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002386248,0.0004587573,0.0004133724,0.0004286894,0.0003233725,0.0001135292,0.000781879,0.0002928735,0.00001460881],"category_scores_gemma":[0.004131098,0.0005103047,0.0001212685,0.0004969731,0.0001245783,0.0002989653,0.0006700295,0.0004406579,0.00001588538],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006733407,"about_ca_system_score_gemma":0.0002669352,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00006582048,"about_ca_topic_score_gemma":0.0001959968,"domain_scores_codex":[0.99755,0.00001694754,0.0006308053,0.0006387036,0.0004255848,0.0007379268],"domain_scores_gemma":[0.9979643,0.0001453278,0.000113081,0.0004636958,0.001216172,0.00009745174],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004178553,0.0004015606,0.02682834,0.001214507,0.004492443,0.0001157698,0.01494489,0.04169015,0.2245407,0.03133236,0.5055709,0.1484506],"study_design_scores_gemma":[0.005748973,0.0007104772,0.02928543,0.00235303,0.0001563682,0.0008695647,0.001443233,0.2791266,0.556027,0.02262554,0.09785297,0.003800834],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7549223,0.002543978,0.2123811,0.01652582,0.005016232,0.0009956355,0.000199023,0.001527479,0.005888413],"genre_scores_gemma":[0.910298,0.0006623825,0.08431792,0.0002374199,0.0005027073,0.000130232,0.00001456958,0.00008902463,0.00374769],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4077179,"threshold_uncertainty_score":0.9997349,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877043","doi":"10.37665/smkxcnw71032","title":"The New Millennium for CCGA - Beyond 2000 I/O","year":2001,"lang":"","type":"article","venue":"SMTA International","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interconnection; Printed circuit board; Microprocessor; Design for manufacturability; Microelectronics; Surface-mount technology; Integrated circuit packaging; Integrated circuit","authors":[{"name":"Marie Cole","is_ca":false},{"name":"Isabel DeSousa","is_ca":true},{"name":"Mario Interrante","is_ca":false},{"name":"Lisa Jimarez","is_ca":false},{"name":"Janet L. Jozwiak","is_ca":false},{"name":"Michael S. June","is_ca":false},{"name":"Gregory Martin","is_ca":false},{"name":"Megan J. Shannon","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01120911381251322,"gpt":0.2385920647246943,"spread":0.2273829509121811,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.000153554,0.0002373388,0.0001546885,0.0001112176,0.0002264673,0.0001923977,0.0009335877,0.0002045487,0.001015949],"category_scores_gemma":[0.0002017575,0.0001943066,0.000175722,0.0001439756,0.0001189782,0.0001892258,0.0001386606,0.0002725676,0.0002880479],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002262158,"about_ca_system_score_gemma":0.000123174,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004052198,"about_ca_topic_score_gemma":0.00007479749,"domain_scores_codex":[0.9986156,0.000007301235,0.0003737523,0.0002643111,0.0002905003,0.000448588],"domain_scores_gemma":[0.9991504,0.0002354786,0.000074694,0.0003447273,0.000116131,0.00007860264],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001173168,0.00005361438,0.0007372215,0.00001663654,0.0005366296,0.00001185919,0.0003061829,0.001592085,0.0002914099,0.1028249,0.541181,0.3523312],"study_design_scores_gemma":[0.0007503008,0.00006019155,0.0007151311,0.00003169972,0.00002508641,0.00002664267,0.0002301214,0.01765996,0.0008935352,0.01920895,0.9601687,0.0002296854],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.02719823,0.05613158,0.227235,0.1133043,0.04367161,0.001950376,0.0004322244,0.00166543,0.5284112],"genre_scores_gemma":[0.7631984,0.01731826,0.005146464,0.0003886078,0.003559143,0.0001374395,0.0000735514,0.0001066357,0.2100714],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.7360002,"threshold_uncertainty_score":0.9998972,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877820","doi":"10.37665/smamkdp15743","title":"Overcoming Head-In-Pillow Defects in Hybrid LGA Socket Assembly","year":2012,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Ball grid array; Soldering; Printed circuit board; Motherboard; Cable gland; Stencil; Fixture; Reflow soldering","authors":[{"name":"Marie Cole","is_ca":false},{"name":"Theron Lewis","is_ca":false},{"name":"Jim Bielick","is_ca":false},{"name":"PK Pu","is_ca":false},{"name":"Stephen Hugo","is_ca":false},{"name":"Phil Isaacs","is_ca":false},{"name":"Eddie Kobeda","is_ca":false},{"name":"Bing Su","is_ca":false},{"name":"Alex Chen","is_ca":false},{"name":"James Huang","is_ca":false},{"name":"John McMahon","is_ca":false},{"name":"Brian Standing","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0188158791467733,"gpt":0.2710521940697488,"spread":0.2522363149229755,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006036354,0.0003577867,0.0003542175,0.0006465212,0.00005403781,0.00009401133,0.000616181,0.0002059108,0.0001222576],"category_scores_gemma":[0.0003409625,0.000435699,0.000134961,0.0002855838,0.00005594057,0.0005722344,0.000226493,0.0009872699,0.0001602805],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001291719,"about_ca_system_score_gemma":0.00007481872,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001865305,"about_ca_topic_score_gemma":0.0002151719,"domain_scores_codex":[0.9975542,0.00005047898,0.0005279367,0.0003578715,0.000382423,0.001127075],"domain_scores_gemma":[0.9992492,0.0001883748,0.00008490451,0.0003507235,0.00003519611,0.00009163997],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"observational","study_design_scores_codex":[0.00008480517,0.0008566319,0.8779873,0.0002721191,0.0004272963,0.0002155085,0.002614951,0.02266395,0.02063822,0.02698235,0.004329127,0.04292769],"study_design_scores_gemma":[0.00792247,0.0003204352,0.4950192,0.003461499,0.00009023269,0.0004486004,0.001016036,0.3017907,0.1157371,0.01350339,0.05680953,0.00388082],"study_design_candidate":"observational","study_design_consensus":"observational","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9804537,0.003562735,0.002350929,0.000591436,0.003046676,0.0001681107,0.00002396812,0.0003789125,0.00942354],"genre_scores_gemma":[0.9979876,0.0005196536,0.0007250762,0.00006225555,0.0002968089,0.00004163053,0.0000254619,0.00004809798,0.0002934043],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3829682,"threshold_uncertainty_score":0.9998095,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880884","doi":"10.37665/smyfsfn12791","title":"Lead-Free Assembly and Qualification of a Storage Class PCBA","year":2009,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Reliability (semiconductor); Surface-mount technology; IBM; Ball grid array; Quality (philosophy); Pallet; Process (computing); Temperature cycling","authors":[{"name":"Matthew Kelly","is_ca":true},{"name":"Tom Truman","is_ca":true},{"name":"Adzahar Samat","is_ca":false},{"name":"Eric Goh","is_ca":false},{"name":"S.K. Tan","is_ca":false},{"name":"M. Tan","is_ca":false},{"name":"Seung Jin Lee","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0154108624832274,"gpt":0.2583403825938773,"spread":0.2429295201106499,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002719994,0.0002027599,0.0002301289,0.0002544604,0.00004955649,0.00006463213,0.0006104287,0.0001940766,0.00002641219],"category_scores_gemma":[0.0003173572,0.0002329201,0.00006973635,0.0001509041,0.0000930703,0.0001922557,0.00008998459,0.0003505762,0.00001098202],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001862796,"about_ca_system_score_gemma":0.00004479102,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002286411,"about_ca_topic_score_gemma":0.0000110779,"domain_scores_codex":[0.9986979,0.00002547772,0.0003986078,0.0002779209,0.0003230723,0.0002769726],"domain_scores_gemma":[0.9991637,0.00007591063,0.0001375165,0.0004759874,0.000106373,0.00004045435],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001023077,0.0004123265,0.002442586,0.0002387416,0.0006916435,0.00002221042,0.00239565,0.007804821,0.294056,0.5055164,0.0139841,0.1723332],"study_design_scores_gemma":[0.004463064,0.001276013,0.08674262,0.001156973,0.0001883373,0.0001340116,0.001283351,0.607894,0.1562466,0.1117765,0.02698546,0.001853076],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9329495,0.003434738,0.03804551,0.008605809,0.001056881,0.0001920878,0.00006980303,0.0005565579,0.01508907],"genre_scores_gemma":[0.9958782,0.0008149081,0.002488674,0.00004394943,0.0001268964,0.000005927871,0.00001765046,0.00001867169,0.0006051608],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6000892,"threshold_uncertainty_score":0.9498208,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877975","doi":"10.37665/smgvlzz35389","title":"Converting High Volume IC Manufacturing to CU Wire Packaging","year":2013,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Wire bonding; Original equipment manufacturer; Integrated circuit packaging; Lead frame; Reliability (semiconductor); Electronic packaging; Manufacturing cost; Die (integrated circuit); Integrated circuit; Wafer","authors":[{"name":"Larry Bright","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007042090314165701,"gpt":0.2097320657973602,"spread":0.2026899754831945,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0002218452,0.0004931687,0.0003786974,0.0004716137,0.0002165535,0.0004441935,0.001116425,0.0002501004,0.002096731],"category_scores_gemma":[0.0002017121,0.0005694527,0.0001541003,0.0001959448,0.00008454113,0.0005721101,0.0004974679,0.0008557686,0.003033852],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000780944,"about_ca_system_score_gemma":0.00005478555,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007667583,"about_ca_topic_score_gemma":0.00002724127,"domain_scores_codex":[0.9971151,0.00002826957,0.0006321633,0.0006363659,0.0005254242,0.001062677],"domain_scores_gemma":[0.9988756,0.00008439788,0.0001255118,0.0005790552,0.0001372623,0.0001982425],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005864802,0.0003743009,0.05238079,0.0007778353,0.003333016,0.0002015805,0.005579202,0.08488794,0.1164414,0.02171968,0.09631794,0.6179277],"study_design_scores_gemma":[0.0024934,0.0003991599,0.1021297,0.002390346,0.0001482295,0.0001906314,0.00194806,0.3808291,0.4218369,0.02120993,0.06239834,0.004026076],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9543414,0.0004375216,0.02344184,0.009872939,0.004067711,0.0004061092,0.00002295914,0.001542698,0.005866889],"genre_scores_gemma":[0.9904286,0.0001108759,0.00332106,0.0002932857,0.0005730737,0.0001071837,0.00002538313,0.0001062631,0.005034248],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6139016,"threshold_uncertainty_score":0.9996757,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876062","doi":"10.37665/smksazh82193","title":"Low Melting Temperature Solder Interconnect Behavior and Thermal Cycling Performance Enhancement Using Edgebond","year":2020,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Zymeworks (Canada)","funders":"","keywords":"Temperature cycling; Ball grid array; Soldering; Isothermal process; Shear (geology); Brittleness; Creep; Thermal; Shear strength (soil)","authors":[{"name":"Tae-Kyu Lee","is_ca":false},{"name":"Carly Rogan","is_ca":false},{"name":"Gihan Dodanduwa Waduge","is_ca":false},{"name":"Young‐Woo Lee","is_ca":false},{"name":"Edward S. Ibe","is_ca":true},{"name":"Karl I. Loh","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0198556926832693,"gpt":0.2461698708172683,"spread":0.2263141781339991,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001952672,0.0004292198,0.0003368614,0.0001446418,0.0002303413,0.0002831269,0.0005140934,0.0002573004,0.0001703776],"category_scores_gemma":[0.0001169305,0.000463547,0.0001055616,0.0001665046,0.0001203164,0.0004331289,0.0003705905,0.0009975981,0.00002120224],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002664407,"about_ca_system_score_gemma":0.00006705996,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001034223,"about_ca_topic_score_gemma":0.000001833088,"domain_scores_codex":[0.9979603,0.00002697153,0.0005123091,0.0005623238,0.0003426436,0.0005954278],"domain_scores_gemma":[0.9993689,0.00005551447,0.0001294789,0.0002306499,0.00009404389,0.0001214271],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00004491688,0.00008544922,0.005650298,0.0003224699,0.0003878598,0.00003845105,0.003070529,0.0104668,0.9203905,0.000338544,0.00008539522,0.05911873],"study_design_scores_gemma":[0.0007556644,0.0001671504,0.001307289,0.0006648223,0.00008823296,0.00004277367,0.0004372775,0.5067614,0.4888002,0.00002070538,0.0003500595,0.000604445],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9912423,0.001774766,0.003385205,0.0009957104,0.001414238,0.0002435877,0.00001542739,0.000375157,0.0005535732],"genre_scores_gemma":[0.9952873,0.0006347342,0.003072732,0.0001818871,0.0006056428,0.00003115867,0.0000190009,0.00007135939,0.00009616991],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4962946,"threshold_uncertainty_score":0.9997816,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880815","doi":"10.37665/smitwjh96163","title":"Design and Process Effects on the Reliability of 1.0 mm Pitch CBGA","year":2000,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Ball grid array; Interconnection; Printed circuit board; Surface-mount technology; Soldering; Ceramic; Package on package; Integrated circuit packaging; Ball (mathematics)","authors":[{"name":"Marie Cole","is_ca":false},{"name":"Richard Duchesne","is_ca":true},{"name":"Mario Interrante","is_ca":false},{"name":"Lisa Jimarez","is_ca":false},{"name":"Janet L. Jozwiak","is_ca":false},{"name":"Grégory Martin","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009506502191165505,"gpt":0.2351092112226918,"spread":0.2256027090315263,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004340546,0.0001951649,0.0001823191,0.00007361558,0.00007714955,0.00004468291,0.0004766292,0.0001306191,0.0002276474],"category_scores_gemma":[0.0003203072,0.0001512819,0.00004988584,0.0001341675,0.0001526611,0.00008693575,0.00003923557,0.0004230447,0.00002639878],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001039841,"about_ca_system_score_gemma":0.00004250419,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001370254,"about_ca_topic_score_gemma":7.999416e-7,"domain_scores_codex":[0.9988678,0.00006120704,0.0002518629,0.000271001,0.0002894467,0.0002586628],"domain_scores_gemma":[0.9988896,0.0006250912,0.00005228966,0.000337386,0.00006705718,0.00002857905],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0006963562,0.0007192677,0.008621676,0.001662449,0.001259134,0.00003475651,0.006165454,0.4426048,0.01306009,0.0341811,0.006944319,0.4840507],"study_design_scores_gemma":[0.00160552,0.001025134,0.01280142,0.001556684,0.0000986207,0.00003875174,0.0001784194,0.4900687,0.4026277,0.08475967,0.004396821,0.0008425103],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9861466,0.0005181709,0.004782395,0.003035076,0.0003342967,0.0003272744,0.000005747185,0.0002215964,0.004628832],"genre_scores_gemma":[0.9982435,0.0005304196,0.0006454585,0.00004796656,0.0000688178,0.00004611229,0.000001740584,0.000021367,0.0003946895],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4832081,"threshold_uncertainty_score":0.6169097,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876002","doi":"10.37665/smcarua40603","title":"Embedding Ceramic Thick-Film Resistors and Capacitors in Printed Circuit Boards","year":2003,"lang":"","type":"article","venue":"SMTA International","topic":"Electrical and Thermal Properties of Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Toronto East General Hospital","funders":"","keywords":"Resistor; Printed circuit board; Capacitor; Embedding; Ceramic capacitor; Electrical impedance; Ceramic; Electronic component","authors":[{"name":"Richard Snogren","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01532644002812905,"gpt":0.2257045709046172,"spread":0.2103781308764882,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005026055,0.0003223054,0.0003350289,0.00030227,0.0000860947,0.0001807905,0.0003185025,0.0002370236,0.001793557],"category_scores_gemma":[0.0004839954,0.0003271232,0.00008556888,0.0001723391,0.0001034831,0.0002977699,0.00007401549,0.0004767033,0.0001021166],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004745184,"about_ca_system_score_gemma":0.00005939322,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002109775,"about_ca_topic_score_gemma":0.00003053853,"domain_scores_codex":[0.9979479,0.0001385212,0.0006321255,0.0004144945,0.0003917491,0.0004752091],"domain_scores_gemma":[0.9993881,0.000102053,0.0000953143,0.000191173,0.0000930324,0.0001303136],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0009553941,0.001248238,0.03353442,0.001729312,0.002559006,0.0004664532,0.01161551,0.06975892,0.5895841,0.2536575,0.004568415,0.03032274],"study_design_scores_gemma":[0.01231306,0.001000886,0.07504854,0.003933644,0.0002759545,0.0004975076,0.001711842,0.2509747,0.3079042,0.05004811,0.2896352,0.006656451],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9459634,0.001278897,0.000339227,0.0002363637,0.004013781,0.000225279,0.00002682596,0.00008826985,0.047828],"genre_scores_gemma":[0.9970335,0.0003208666,0.0001472027,0.00009105426,0.0002949964,0.00002168595,0.000008963904,0.00005572094,0.002026025],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2850668,"threshold_uncertainty_score":0.9999181,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877024","doi":"10.37665/smhnlqa32276","title":"Board-Level Optronics Assembly and Packaging","year":2001,"lang":"","type":"article","venue":"SMTA International","topic":"Space Technology and Applications","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Optical fiber; Optical power; Fusion splicing; Optical engineering; Reliability (semiconductor); Soldering; Component (thermodynamics); Distortion (music); Optical cross-connect; Photonics","authors":[{"name":"Peter Arrowsmith","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02186687022191645,"gpt":0.2658874724361844,"spread":0.2440206022142679,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001278014,0.0002128833,0.0001557319,0.0001928533,0.0001369552,0.00009699736,0.000380126,0.0002270108,0.0006047761],"category_scores_gemma":[0.00005801605,0.0002563802,0.00006026999,0.0001868,0.000116865,0.0002212484,0.0001595621,0.0004318538,0.0002729351],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001462327,"about_ca_system_score_gemma":0.00003328051,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00003483842,"about_ca_topic_score_gemma":0.00007556604,"domain_scores_codex":[0.9988813,0.000009393991,0.0002623654,0.000320639,0.000203352,0.0003228929],"domain_scores_gemma":[0.9994214,0.00006602905,0.00006285931,0.0002833523,0.00008188024,0.00008451594],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00004912198,0.0003081725,0.1332974,0.00006148781,0.001123092,0.00008438748,0.0007345764,0.003716075,0.0115254,0.6218225,0.02192691,0.2053508],"study_design_scores_gemma":[0.002168836,0.00008207362,0.1567755,0.0002322761,0.0001514774,0.0004147417,0.0009254793,0.1569099,0.005361782,0.01886516,0.6568963,0.001216484],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8164445,0.002342702,0.0902627,0.02047279,0.002258326,0.0003255885,0.0001267976,0.000627325,0.06713925],"genre_scores_gemma":[0.9908714,0.001378478,0.003818974,0.0001513045,0.0003128248,0.00004400371,0.0000276894,0.0000366662,0.003358682],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6349694,"threshold_uncertainty_score":0.9999889,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880242","doi":"10.37665/smvgcju83670","title":"Implementation of Increased CU Levels (1%) in SAC Alloys for PBGA Applications","year":2008,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Soldering; Ball grid array; Reflow soldering; Alloy; Copper; Solder paste; Dissolution","authors":[{"name":"Isabel de Sousa","is_ca":true},{"name":"Donald W. Henderson","is_ca":false},{"name":"Luc Patry","is_ca":true},{"name":"Robert Martel","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03193112776686509,"gpt":0.3100791755879716,"spread":0.2781480478211065,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002123169,0.0001850798,0.0002293229,0.0003671832,0.00007166052,0.00001605163,0.0004482653,0.0001319352,0.0001353808],"category_scores_gemma":[0.00006237028,0.0002295202,0.0001048613,0.0002311481,0.00009187482,0.0001546722,0.00006705111,0.0002054359,0.00001028251],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003545298,"about_ca_system_score_gemma":0.0001568719,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004952531,"about_ca_topic_score_gemma":0.0002918032,"domain_scores_codex":[0.9985961,0.00001587917,0.000558819,0.0002676523,0.0002345068,0.0003270665],"domain_scores_gemma":[0.9993037,0.0001335228,0.0001378839,0.0002582089,0.0001318143,0.0000348653],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"observational","study_design_scores_codex":[0.0001691514,0.001147751,0.3562855,0.0009560591,0.002119674,0.00002351574,0.005899744,0.0249728,0.1810537,0.2518137,0.009454264,0.1661041],"study_design_scores_gemma":[0.01072386,0.0005427994,0.5017179,0.0004500192,0.0001399876,0.0001013743,0.002376411,0.09608677,0.3019686,0.03523768,0.04893613,0.001718487],"study_design_candidate":"observational","study_design_consensus":"observational","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8299496,0.000706065,0.1648718,0.0008585366,0.0004543452,0.0009599318,0.0004536582,0.0002719773,0.001474055],"genre_scores_gemma":[0.9917834,0.0003627014,0.006983244,0.00002289705,0.0001144704,0.0004558578,0.0001034562,0.00003119221,0.0001427468],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.216576,"threshold_uncertainty_score":0.9359561,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876742","doi":"10.37665/smuddnb87082","title":"Developing a Business Case for Implementing RFID in Manufacturing","year":2005,"lang":"","type":"article","venue":"SMTA International","topic":"RFID technology advancements","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Business case; Resource (disambiguation); Business rule; Business process; Competitive advantage; Business analysis; EMI; Business information","authors":[{"name":"William M. Scott","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02561274995106094,"gpt":0.3048722390091092,"spread":0.2792594890580483,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003394711,0.0003213967,0.0002513694,0.0006244756,0.0001452668,0.00009305966,0.0004716738,0.0001770795,0.0004651622],"category_scores_gemma":[0.0001404173,0.0004206576,0.00006987988,0.0002306514,0.00003912657,0.0006866298,0.0003082455,0.0003097303,0.00005735052],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001242617,"about_ca_system_score_gemma":0.00006636055,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00005793443,"about_ca_topic_score_gemma":0.001008985,"domain_scores_codex":[0.9977485,0.00001181417,0.0008121878,0.0004588961,0.0002288737,0.0007397618],"domain_scores_gemma":[0.9993074,0.00009730407,0.0001580239,0.0002358683,0.0001553289,0.00004606494],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001483284,0.0002673572,0.02001264,0.0007423077,0.001072997,0.001852416,0.00147486,0.1110529,0.004263862,0.04416284,0.0008327859,0.8141167],"study_design_scores_gemma":[0.009839154,0.0000507607,0.02056485,0.001198873,0.00008411517,0.002941528,0.001138041,0.22349,0.1544969,0.008047037,0.5759761,0.002172719],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8173022,0.0002770101,0.1741557,0.00336491,0.002290353,0.0006486575,0.0001072707,0.0001978192,0.001656087],"genre_scores_gemma":[0.9142776,0.00008694099,0.08436449,0.0001222821,0.0005379398,0.0001907396,0.00006243846,0.00006425284,0.0002933869],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.811944,"threshold_uncertainty_score":0.9998245,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878153","doi":"10.37665/smsswjw90183","title":"3D Aerosol Jet Printed Interconnects on Bare Die","year":2024,"lang":"","type":"article","venue":"SMTA International","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Die (integrated circuit); Electronics; Printed circuit board; Printed electronics; Flexible electronics; Electronic packaging; Process (computing); Line (geometry); Extremely high frequency","authors":[{"name":"Tom Rovere","is_ca":true},{"name":"Chris Torbitt","is_ca":true},{"name":"Joe Jendrisak","is_ca":true},{"name":"Steve Gonya","is_ca":false},{"name":"Emobosan Enka","is_ca":false},{"name":"Kurt K. Christenson","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01631224093889421,"gpt":0.2520411616324679,"spread":0.2357289206935737,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0002580056,0.000450264,0.0003143969,0.0004237843,0.00007195247,0.0007536864,0.000908417,0.0003134384,0.004090951],"category_scores_gemma":[0.0003776891,0.0004240027,0.0002014623,0.0001729637,0.00009749421,0.0002782604,0.0004983118,0.0005651854,0.002174095],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000334485,"about_ca_system_score_gemma":0.00004944352,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00003957833,"about_ca_topic_score_gemma":0.00002563543,"domain_scores_codex":[0.9979525,0.00003306721,0.0005785015,0.0006142285,0.0003775549,0.0004441377],"domain_scores_gemma":[0.999137,0.0001958242,0.00003368272,0.0004588112,0.00009912217,0.00007550748],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004021748,0.0005026404,0.001366869,0.002497264,0.004381582,0.001762641,0.002541485,0.009024181,0.3059388,0.2564714,0.03590232,0.3792087],"study_design_scores_gemma":[0.0007943992,0.0004176133,0.001125636,0.005297362,0.00009191954,0.00008725881,0.000198888,0.1359485,0.5564258,0.004390991,0.2938808,0.001340891],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9080617,0.001975779,0.004588953,0.004215113,0.03815881,0.0004395414,0.0004049225,0.00341789,0.03873731],"genre_scores_gemma":[0.9954441,0.000632172,0.001376112,0.00009870524,0.001016531,0.00005620314,0.00006692861,0.00009932267,0.001209877],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3778678,"threshold_uncertainty_score":0.9998212,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876459","doi":"10.37665/smvziyr60439","title":"Survey of Successful RFID Case Studies in Electronics Manufacturing","year":2005,"lang":"","type":"article","venue":"SMTA International","topic":"RFID technology advancements","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"ABB (Canada)","funders":"","keywords":"Barcode; Electronics; Set (abstract data type); Control (management); Radio-frequency identification; Manufacturing; Tracking (education)","authors":[{"name":"François Monette","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02905240966523186,"gpt":0.3239894278037403,"spread":0.2949370181385084,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005251807,0.0002864038,0.0003784043,0.0005288875,0.00004222829,0.00001766058,0.0005236056,0.0001805448,0.0003960883],"category_scores_gemma":[0.0003147788,0.00034587,0.00005916617,0.0002332269,0.0001653367,0.0004392251,0.0002502926,0.0005538361,0.00005255141],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009438226,"about_ca_system_score_gemma":0.0000476516,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002315739,"about_ca_topic_score_gemma":0.007918373,"domain_scores_codex":[0.9979926,0.00005855763,0.0008161825,0.0003556649,0.0003221491,0.0004548362],"domain_scores_gemma":[0.9990314,0.0002154469,0.0001907001,0.000318133,0.0002051988,0.00003911825],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002607251,0.0008515115,0.3968512,0.0004908007,0.003921706,0.002971106,0.001998427,0.3689333,0.002107044,0.004096027,0.0008916294,0.2166266],"study_design_scores_gemma":[0.009621974,0.0005648144,0.2886648,0.001199193,0.0001626219,0.003316344,0.001435407,0.1937452,0.4742586,0.003728165,0.02068019,0.002622707],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9889889,0.007184733,0.00065182,0.0002124016,0.001587307,0.0001942437,0.0001152865,0.00007280352,0.000992441],"genre_scores_gemma":[0.9962965,0.002066455,0.001117073,0.0000243557,0.0001135346,0.00002441272,0.00003201638,0.00003937239,0.0002862476],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4721516,"threshold_uncertainty_score":0.9998993,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876101","doi":"10.37665/smlrbbl70641","title":"Metallization Options for Optimum Chip-On-Board Assembly","year":2007,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Current Water Technologies (Canada)","funders":"","keywords":"Process (computing); Printed circuit board; Mainstream; Integrated circuit; Wire bonding; Integrated circuit packaging","authors":[{"name":"Mukul Luthra","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02107417549608722,"gpt":0.2884130587742194,"spread":0.2673388832781322,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006086838,0.0003249316,0.0002450754,0.0004909611,0.0001860973,0.00015665,0.000628886,0.0002867184,0.0001116768],"category_scores_gemma":[0.0003647501,0.0003698829,0.0002251002,0.0002490009,0.00007346919,0.0002204864,0.00008206045,0.0004223058,0.00009892257],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005214796,"about_ca_system_score_gemma":0.00005882955,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001190808,"about_ca_topic_score_gemma":0.00002819581,"domain_scores_codex":[0.9980295,0.00001333345,0.0004979135,0.000421686,0.0003934908,0.0006440391],"domain_scores_gemma":[0.9989594,0.0002739427,0.0001154088,0.0003718184,0.0001941623,0.0000853274],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.000158281,0.0003672456,0.0005216285,0.0001226117,0.001494619,0.00001562391,0.0004024165,0.191164,0.02160145,0.7338481,0.00902784,0.04127625],"study_design_scores_gemma":[0.003986428,0.001038017,0.006623491,0.0006313759,0.0003085156,0.00005234191,0.0005362906,0.5905575,0.1414999,0.03808655,0.2145355,0.002144078],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.0846254,0.0008948452,0.8819026,0.002582993,0.00521376,0.0005048774,0.00009790704,0.001166441,0.02301117],"genre_scores_gemma":[0.974274,0.0004503595,0.02169869,0.00009884993,0.0006572646,0.00006939458,0.00012844,0.00007691141,0.002546105],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.8896486,"threshold_uncertainty_score":0.9998753,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7128490249","doi":"10.37665/smwugfa65522","title":"Additive Copper Plating for Selective Metallization of Conformal Electronics","year":2025,"lang":"","type":"article","venue":"SMTA International","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Electrical conductor; Etching (microfabrication); Electronics; Plating (geology); Conformal map; Copper; Copper plating; Process (computing)","authors":[{"name":"Maya Chiesa","is_ca":true},{"name":"Tom Rovere","is_ca":true},{"name":"Paul Gaylo","is_ca":true},{"name":"Brent Cole","is_ca":true},{"name":"Steve Persons","is_ca":true},{"name":"Timothy Kolmel","is_ca":true},{"name":"Tom Derco","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.007892320110317678,"gpt":0.2547699280802135,"spread":0.2468776079698959,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000249043,0.0001930864,0.0002783656,0.0002713093,0.00007852763,0.00006694336,0.0003432179,0.000200248,0.0001350995],"category_scores_gemma":[0.000522148,0.0002153658,0.0001220615,0.0002119892,0.00006621097,0.0002171862,0.0001247568,0.0001527358,0.000005001145],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002175266,"about_ca_system_score_gemma":0.0001437664,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001777879,"about_ca_topic_score_gemma":0.00001706573,"domain_scores_codex":[0.9987987,0.00001556841,0.000547099,0.0002105905,0.0001560697,0.000271994],"domain_scores_gemma":[0.9989856,0.0002170364,0.0001738267,0.0001301148,0.0004779801,0.00001544076],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003999056,0.0001209888,0.001137322,0.0004711587,0.00287085,9.415116e-7,0.0006530386,0.0181148,0.1140496,0.7998313,0.006140606,0.0562095],"study_design_scores_gemma":[0.001110946,0.0001590889,0.001219032,0.0003055435,0.0001148529,0.00000230398,0.0002173724,0.09236496,0.8679725,0.01173034,0.0245339,0.0002691754],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5542377,0.002124615,0.3479232,0.00101386,0.01005766,0.002160949,0.002072218,0.0007669087,0.07964293],"genre_scores_gemma":[0.9917006,0.0003021285,0.007087353,0.00002831414,0.0001140527,0.00007879689,0.0001762652,0.00002098229,0.0004914628],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.788101,"threshold_uncertainty_score":0.8782362,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878108","doi":"10.37665/smwhphs59692","title":"Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth BTC Solder Joints","year":2024,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Alpha Technologies (Canada)","funders":"","keywords":"Electromigration; Soldering; Intermetallic; Eutectic system; Microstructure; Anode","authors":[{"name":"Prabjit Singh","is_ca":false},{"name":"Larry Palmer","is_ca":false},{"name":"Thomas Wassick","is_ca":false},{"name":"C. Ravenelle","is_ca":false},{"name":"Raiyo Aspandiar","is_ca":false},{"name":"Brunella Franco","is_ca":false},{"name":"Lavanya Ashok Swaminathan","is_ca":false},{"name":"Hao Fu","is_ca":false},{"name":"Vasu Vasudevan","is_ca":false},{"name":"Alina M. Allen","is_ca":false},{"name":"Kerry E. Howell","is_ca":false},{"name":"Kei Murayama","is_ca":false},{"name":"H. Zhang","is_ca":false},{"name":"Anna Lifton","is_ca":true},{"name":"Todd Munson","is_ca":false},{"name":"Stephen Middleton","is_ca":false},{"name":"Richard Coyle","is_ca":false},{"name":"S. Murali","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006119962495997549,"gpt":0.2277314638170746,"spread":0.2216115013210771,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002524394,0.0004057887,0.0002726273,0.0009264512,0.0001188171,0.0004085787,0.0004601536,0.0003225247,0.0001908711],"category_scores_gemma":[0.0001379897,0.0004590548,0.0001622766,0.0005755898,0.00008784418,0.0005601763,0.0001357431,0.001222733,0.0001743374],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002629508,"about_ca_system_score_gemma":0.0001603732,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001559222,"about_ca_topic_score_gemma":0.0002696824,"domain_scores_codex":[0.9975742,0.00004164402,0.0005955493,0.0006250988,0.0003913585,0.000772113],"domain_scores_gemma":[0.9994453,0.00006177108,0.00006565709,0.0003013991,0.0000702677,0.00005562471],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001323494,0.0001235034,0.01363671,0.0009913218,0.001083046,0.0003180674,0.003426515,0.02045023,0.8987825,0.04146444,0.002131904,0.01745939],"study_design_scores_gemma":[0.001967911,0.0002093961,0.09565781,0.002609141,0.0001158408,0.000845067,0.0004554304,0.6140628,0.2481191,0.03184875,0.002410083,0.001698643],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9815757,0.00554688,0.004204668,0.001514724,0.004448486,0.0002380438,0.00002982823,0.001215496,0.001226121],"genre_scores_gemma":[0.9968897,0.0004533828,0.000517852,0.00001301214,0.0004968402,0.0000410433,0.00004532502,0.00007841743,0.001464496],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6506634,"threshold_uncertainty_score":0.9997861,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877841","doi":"10.37665/smztbas18209","title":"Lead-Free SMT Connector Process Exposure, Reliability, Quality, and Yield Assessment for High Thermal Mass Assemblies","year":2012,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Ball grid array; Rework; Cable gland; Soldering; Reliability (semiconductor); Temperature cycling; Heat sink; Joint (building); Accelerated life testing","authors":[{"name":"Jimmy Chow","is_ca":false},{"name":"John McMahon","is_ca":false},{"name":"Heather McCormick","is_ca":false},{"name":"Russell Brush","is_ca":false},{"name":"Vejeyathaas Thambipillai","is_ca":false},{"name":"Kok Wei Khoo","is_ca":false},{"name":"Matt Kelly","is_ca":true},{"name":"Marie Cole","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04401237979671196,"gpt":0.3308317147699604,"spread":0.2868193349732484,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001395235,0.0004476545,0.0004643933,0.0002119585,0.0001865611,0.0002473927,0.001019874,0.0004099175,0.0001490793],"category_scores_gemma":[0.001586376,0.0004579872,0.0001369088,0.000134938,0.0001954375,0.0006494895,0.0003542533,0.0006978166,0.000008703417],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003257026,"about_ca_system_score_gemma":0.0001253659,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001003628,"about_ca_topic_score_gemma":0.00003943691,"domain_scores_codex":[0.9972067,0.00005259192,0.0007098639,0.0005292609,0.0006252621,0.0008763405],"domain_scores_gemma":[0.9976572,0.001023693,0.0001951614,0.0007104843,0.0002921621,0.0001212403],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"observational","study_design_scores_codex":[0.0002349571,0.0008782196,0.3854484,0.002430042,0.001942058,0.000005416501,0.002026172,0.004681255,0.05884058,0.5226579,0.005818601,0.01503644],"study_design_scores_gemma":[0.008231779,0.001747373,0.4449123,0.001540131,0.0004658052,0.00006493324,0.004299184,0.03309888,0.1782684,0.3176875,0.005404899,0.00427889],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.942851,0.00201745,0.03944615,0.006090187,0.003567485,0.0006016369,0.0002493554,0.0007288661,0.004447843],"genre_scores_gemma":[0.9865113,0.0002695813,0.01140414,0.00008540432,0.0007369868,0.0002718206,0.00004445377,0.00007476795,0.0006014947],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2049704,"threshold_uncertainty_score":0.9997872,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876714","doi":"10.37665/smbnrry91770","title":"Reliability of Mixed Solder Interconnects – Case Studies","year":2005,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Alpha Cancer Technologies; Hain Celestial (Canada)","funders":"","keywords":"Soldering; Ball grid array; Eutectic system; Intermetallic; Fillet (mechanics); Homogeneity (statistics); Solder paste; Reflow soldering","authors":[{"name":"Adam R. Zbrzezny","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Tanya Lindsay","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.023542240731812,"gpt":0.2918439763604231,"spread":0.2683017356286111,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004583489,0.000318638,0.0004274408,0.0002634471,0.0000777674,0.00003744731,0.0005294318,0.0002033465,0.0001803304],"category_scores_gemma":[0.001087427,0.0003252918,0.0001902577,0.0001740803,0.0003023937,0.0003116614,0.0003241833,0.0005142831,0.0000544387],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005830579,"about_ca_system_score_gemma":0.00005769772,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004056932,"about_ca_topic_score_gemma":0.0001419636,"domain_scores_codex":[0.998117,0.00004431703,0.0006935992,0.0004066347,0.0003004689,0.0004380383],"domain_scores_gemma":[0.9986075,0.0002923843,0.0001522449,0.0005434974,0.0003492029,0.00005516505],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003294214,0.002276504,0.01217547,0.003036608,0.01174301,0.002781424,0.0230071,0.2269184,0.04306913,0.1285724,0.06172707,0.4843634],"study_design_scores_gemma":[0.006227746,0.001070932,0.003816199,0.002890969,0.0006196679,0.007659085,0.01037949,0.3818253,0.4700371,0.03372294,0.07828248,0.003468079],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9849465,0.004296693,0.002782175,0.002122853,0.002774169,0.0001592973,0.00004546238,0.0004592281,0.002413656],"genre_scores_gemma":[0.9930426,0.001209253,0.004471896,0.00002812221,0.0003147323,0.00002454932,0.000006098101,0.00003719026,0.0008655632],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4808953,"threshold_uncertainty_score":0.9999199,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880172","doi":"10.37665/smpywte56368","title":"Recalling the Lead-Free Manhattan Project","year":2014,"lang":"","type":"article","venue":"SMTA International","topic":"Transportation Systems and Infrastructure","field":"Business, Management and Accounting","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Government (linguistics); Charter; Product (mathematics); Aerospace; Knowledge base; Task (project management); Resource (disambiguation); Best practice","authors":[{"name":"Anthony J. Rafanelli","is_ca":false},{"name":"Linda Woody","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01562096080357581,"gpt":0.2341324328968573,"spread":0.2185114720932815,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["scholarly_communication","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0007525022,0.0003222049,0.000247739,0.0002639447,0.0003988123,0.001164572,0.00152053,0.0001537224,0.002792416],"category_scores_gemma":[0.0002583032,0.0002359667,0.0002177327,0.0003609497,0.0001286537,0.001316625,0.0001763364,0.0003862793,0.0006277149],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00005244685,"about_ca_system_score_gemma":0.00004655803,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005724545,"about_ca_topic_score_gemma":0.0003408467,"domain_scores_codex":[0.9975693,0.00003268746,0.0007224302,0.0004796124,0.0008433546,0.0003525967],"domain_scores_gemma":[0.9982295,0.00008330943,0.0005590107,0.000587448,0.0005258778,0.00001483833],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002036458,0.0001498798,0.1001713,0.0004946309,0.0005862103,0.00001502946,0.001009639,0.0007993779,0.0004614309,0.5841356,0.2471342,0.06483901],"study_design_scores_gemma":[0.0008864158,0.00001640978,0.05369654,0.0002143764,0.00006542158,0.000005794695,0.0005109241,0.01518309,0.0000239943,0.005817546,0.9232588,0.0003206444],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.1680923,0.0006722825,0.03345617,0.04480771,0.03637747,0.00199447,0.0001603549,0.0004188507,0.7140204],"genre_scores_gemma":[0.9782988,0.00002333188,0.000424399,0.003413372,0.009481626,0.00003628027,0.0001407646,0.00005049481,0.008130954],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.8102065,"threshold_uncertainty_score":0.9998723,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878106","doi":"10.37665/smvofkw94111","title":"The Effect of Thermal Cycling Dwell Time on Reliability and Failure Mode of 3rd Generation High-Performance Pb-Free Solder Alloys","year":2024,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Safran Electronics (Canada); Alpha Technologies (Canada)","funders":"","keywords":"Temperature cycling; Dwell time; Reliability (semiconductor); Ball grid array; Soldering; Indium; Thermal shock; Failure mode and effects analysis","authors":[{"name":"Richard Coyle","is_ca":false},{"name":"Dave Hillman","is_ca":false},{"name":"Michael Osterman","is_ca":false},{"name":"Chloe Feng","is_ca":false},{"name":"T. J. Pearson","is_ca":false},{"name":"Isaac Becker","is_ca":false},{"name":"Joe Smetana","is_ca":false},{"name":"Keith Howell","is_ca":false},{"name":"Julie Silk","is_ca":false},{"name":"Hongwen Zhang","is_ca":false},{"name":"Jayse McLean","is_ca":false},{"name":"Jie Geng","is_ca":false},{"name":"Derek Daily","is_ca":false},{"name":"Anna Lifton","is_ca":false},{"name":"Morgana Ribas","is_ca":true},{"name":"Raiyo Aspandiar","is_ca":false},{"name":"Ranjit Pandher","is_ca":false},{"name":"James Wertin","is_ca":false},{"name":"Jean-Christophe Riou","is_ca":true},{"name":"Madan Jagernauth","is_ca":false},{"name":"Grace O’Malley","is_ca":false},{"name":"Martin Anselm","is_ca":false},{"name":"Dennis Fritz","is_ca":false},{"name":"Shantanu Joshi","is_ca":false},{"name":"Jasbir Bath","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.004402449535937545,"gpt":0.2184734085306611,"spread":0.2140709589947235,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005850364,0.0002443263,0.0002495399,0.0001295305,0.0001007211,0.00008974462,0.0005254393,0.0001829775,0.00002442495],"category_scores_gemma":[0.000241566,0.0001826352,0.00009280468,0.0001188646,0.0001942173,0.0001876225,0.0001700826,0.00049454,0.00001291179],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001490563,"about_ca_system_score_gemma":0.00003824455,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00003960726,"about_ca_topic_score_gemma":0.00001091038,"domain_scores_codex":[0.998549,0.00005985743,0.0004362171,0.0003199133,0.0003653759,0.0002696255],"domain_scores_gemma":[0.9988626,0.000464064,0.0000862024,0.000497064,0.00006513358,0.00002494294],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001394124,0.00004049531,0.00139506,0.0006477346,0.0006582073,0.00000369661,0.0004595627,0.506164,0.443145,0.007428301,0.002092791,0.03782578],"study_design_scores_gemma":[0.0002996297,0.0003074823,0.0006330063,0.0003120247,0.00003507233,0.000003399593,0.000005947193,0.6438466,0.3537155,0.0004232919,0.0002931461,0.0001248216],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9938385,0.001213141,0.001572167,0.001277001,0.0009966186,0.0001978843,0.00004203581,0.0002664327,0.0005962159],"genre_scores_gemma":[0.9982055,0.0006582209,0.0005507225,0.000004774233,0.0002270325,0.00002266454,0.00001686256,0.000034119,0.0002800558],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1376826,"threshold_uncertainty_score":0.7447647,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880818","doi":"10.37665/smiuufr82044","title":"Fluorinated Soldering Technology","year":2000,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Bell (Canada)","funders":"","keywords":"Soldering; Wave soldering; Wetting; Printed circuit board; Dip soldering; Solder paste; Flux (metallurgy)","authors":[{"name":"Stephen M. Bobbio","is_ca":false},{"name":"Robert F. Lipscomb","is_ca":false},{"name":"Bev Christian","is_ca":true},{"name":"Michael A. Pennington","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006177603079712613,"gpt":0.2201164201980192,"spread":0.2139388171183066,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0001425657,0.0003815677,0.0002963905,0.0005841328,0.0001491423,0.0001333586,0.001124672,0.0004672873,0.005001908],"category_scores_gemma":[0.00007788518,0.0004549022,0.0001234322,0.0005744194,0.0001951605,0.0002357404,0.0001481595,0.0009159553,0.001217003],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004193557,"about_ca_system_score_gemma":0.00005872937,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002652516,"about_ca_topic_score_gemma":0.000008405003,"domain_scores_codex":[0.9979237,0.00001416374,0.0004583231,0.0004911693,0.0003245886,0.0007880732],"domain_scores_gemma":[0.9992086,0.00003433317,0.00005305515,0.000550605,0.00008361918,0.00006981074],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00004150018,0.0001797406,0.002166927,0.00008370051,0.0009930209,0.0001574308,0.0003659101,0.02474205,0.01504305,0.03942375,0.00527656,0.9115264],"study_design_scores_gemma":[0.002309697,0.0003087348,0.002016645,0.0007523791,0.00009600438,0.0004669076,0.0003416897,0.2261246,0.08512389,0.03175757,0.6487648,0.00193708],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8289153,0.004671006,0.003530292,0.007968185,0.003591612,0.0002658223,0.00004365585,0.005766125,0.145248],"genre_scores_gemma":[0.9847011,0.002385803,0.002107735,0.0000396379,0.0002745013,0.0000395473,0.00001865667,0.00007406392,0.01035894],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.9095893,"threshold_uncertainty_score":0.9997903,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877437","doi":"10.37665/smdktiu51950","title":"Tin Pest Phenomena: A Real World Test Scenario","year":2006,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Tin; Whisker; Printed circuit board; Soldering; Surface-mount technology; Electronics; Process (computing)","authors":[{"name":"David Hillman","is_ca":false},{"name":"Mike Schmidt","is_ca":false},{"name":"Bev Christian","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00912117204197965,"gpt":0.2258877279999012,"spread":0.2167665559579216,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.000216822,0.0003852663,0.0002872884,0.0004870073,0.0001455473,0.0002369796,0.0008126283,0.0001711736,0.0005210756],"category_scores_gemma":[0.0001195655,0.0004417198,0.000140417,0.0003996248,0.0001534165,0.0002010572,0.0002053191,0.0007350277,0.0003948568],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009509068,"about_ca_system_score_gemma":0.0001111284,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001213592,"about_ca_topic_score_gemma":0.001760507,"domain_scores_codex":[0.9977809,0.00001564371,0.0005465903,0.0004715898,0.0004548431,0.0007304369],"domain_scores_gemma":[0.9991021,0.0001743917,0.0001216076,0.0004346168,0.0001035442,0.00006374725],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00007876936,0.001622599,0.3080623,0.0003011538,0.001106065,0.0003312622,0.0008390542,0.05680475,0.01791723,0.4234898,0.1339881,0.05545897],"study_design_scores_gemma":[0.003777117,0.0003863649,0.1405557,0.00107139,0.0001775258,0.0001241002,0.0002649126,0.2243287,0.0167037,0.03724528,0.5723652,0.002999976],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"empirical","genre_scores_codex":[0.2207983,0.002041918,0.004507933,0.006890906,0.005021225,0.0003936369,0.0001800139,0.003362239,0.7568039],"genre_scores_gemma":[0.9635347,0.0003214294,0.001615146,0.00003426676,0.001492057,0.00003356797,0.00007703221,0.0000709428,0.03282083],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.7427365,"threshold_uncertainty_score":0.9998035,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878298","doi":"10.37665/smihthd86872","title":"Low Melting Temperature Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning and Edgebond Adhesive","year":2018,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Zymeworks (Canada)","funders":"","keywords":"Soldering; Thixotropy; Interconnection; Adhesive; Bridging (networking); Melting temperature; Rheology; Temperature cycling","authors":[{"name":"Andy Hsiao","is_ca":false},{"name":"Tae-Kyu Lee","is_ca":false},{"name":"Imbok Lee","is_ca":false},{"name":"Young‐Woo Lee","is_ca":false},{"name":"Edward S. Ibe","is_ca":true},{"name":"Karl I. Loh","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01202676094972265,"gpt":0.2486094209317427,"spread":0.23658265998202,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004018126,0.00045033,0.0003184413,0.0002965324,0.0004461289,0.0002946423,0.0005291167,0.0002327366,0.0002734846],"category_scores_gemma":[0.0001224347,0.000488403,0.00009117441,0.0001784646,0.0002769725,0.000528286,0.0004433137,0.000783057,0.00003032336],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005809712,"about_ca_system_score_gemma":0.00007907239,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002521575,"about_ca_topic_score_gemma":0.00001170355,"domain_scores_codex":[0.9977328,0.00003629172,0.0005533685,0.0005690306,0.0003659737,0.0007425957],"domain_scores_gemma":[0.9991979,0.00007983631,0.0001772503,0.0002963858,0.0001667299,0.00008190284],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0000589501,0.00006199903,0.004956301,0.0002108378,0.0005807064,0.00001514811,0.003178879,0.001165275,0.9477504,0.0005331435,0.00008017426,0.04140822],"study_design_scores_gemma":[0.0006517075,0.000261429,0.0007117481,0.00156675,0.00004403327,0.00005904459,0.0009456791,0.370182,0.6246701,0.00007721834,0.0003141773,0.0005160624],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9900782,0.001262135,0.003403621,0.000206428,0.002476126,0.0002005788,0.00001222681,0.0002842468,0.002076414],"genre_scores_gemma":[0.9932936,0.0005012686,0.0047588,0.00007539873,0.001054822,0.00001373148,0.00001871112,0.00006767322,0.0002159917],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3690167,"threshold_uncertainty_score":0.9997568,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880174","doi":"10.37665/smprdow93244","title":"Interconnect Reliability of Large Lidded Flip Chip BGA Organic Assembly Under Flexural Loading","year":2008,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada); Hain Celestial (Canada); Toronto Metropolitan University","funders":"","keywords":"Ball grid array; Soldering; Flip chip; Interconnection; Fracture (geology); Substrate (aquarium); Reliability (semiconductor); Flexural strength","authors":[{"name":"Hua Lu","is_ca":true},{"name":"Xijia Gu","is_ca":true},{"name":"Jason G. Bragg","is_ca":true},{"name":"Heather McCormick","is_ca":true},{"name":"Isabel de Sousa","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01938866016711181,"gpt":0.2572251000553021,"spread":0.2378364398881903,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0005352504,0.0004521805,0.0005388215,0.0003819869,0.000183872,0.00005676877,0.00111114,0.0003769738,0.0007318141],"category_scores_gemma":[0.0006252481,0.0004940016,0.0002906487,0.0004034529,0.0002287033,0.0003924741,0.0004046371,0.0009932017,0.0001159906],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007903661,"about_ca_system_score_gemma":0.0001913205,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00007547598,"about_ca_topic_score_gemma":0.00006757924,"domain_scores_codex":[0.9971377,0.00007343778,0.0008471909,0.0005868691,0.0005540012,0.0008007633],"domain_scores_gemma":[0.9984958,0.0002441822,0.0002176233,0.0006905997,0.0002532684,0.00009856327],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004850181,0.002443837,0.2621332,0.001031688,0.004699162,0.0002526441,0.009113629,0.03067915,0.5839361,0.08540963,0.01105201,0.008763896],"study_design_scores_gemma":[0.005551228,0.0008551774,0.1582576,0.001524148,0.0002136606,0.0006194039,0.001515241,0.1636723,0.6449672,0.01086388,0.009285354,0.002674857],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9773843,0.0008259123,0.01337763,0.001023296,0.002203855,0.0001890675,0.00005410093,0.000749654,0.00419216],"genre_scores_gemma":[0.9967818,0.000609001,0.001322169,0.00007404247,0.0002761033,0.00001602055,0.00003743599,0.00007974734,0.0008036828],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1329932,"threshold_uncertainty_score":0.9997512,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880969","doi":"10.37665/smzppki40465","title":"Spherical Bend Test Failure Criteria Correlation in Compliant Systems","year":2014,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Toronto Metropolitan University","funders":"","keywords":"Ball grid array; Printed circuit board; Sample (material); Process (computing); Test data; Process capability; Grid; Characterization (materials science); New product development","authors":[{"name":"John McMahon","is_ca":false},{"name":"Brian Standing","is_ca":false},{"name":"Meisam Salahi","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01193971187018212,"gpt":0.2429588154993647,"spread":0.2310191036291825,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003315727,0.0002982677,0.000326344,0.0002226069,0.00006925146,0.0002260733,0.0005633698,0.0002922241,0.0002092772],"category_scores_gemma":[0.0005024286,0.0003366667,0.00007649146,0.0002378415,0.0000894375,0.0002169371,0.0001292846,0.0006958921,0.0001979247],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005364702,"about_ca_system_score_gemma":0.00003633857,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001525719,"about_ca_topic_score_gemma":0.00009472752,"domain_scores_codex":[0.9981456,0.00005166709,0.0005652233,0.000393373,0.0003532811,0.0004908172],"domain_scores_gemma":[0.9991223,0.0002775678,0.0001068632,0.0003442362,0.00008362735,0.0000654233],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00007916665,0.0008639584,0.191442,0.0007316758,0.0005689761,0.0001135146,0.001829807,0.5385728,0.02853627,0.1684245,0.0410872,0.02775008],"study_design_scores_gemma":[0.0006647392,0.000108646,0.01606619,0.000488053,0.00001360009,0.0000536646,0.0001836768,0.9531341,0.0003085689,0.001530888,0.02706851,0.0003794076],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.4287314,0.002990293,0.4861609,0.00842067,0.01900835,0.0009545189,0.0001915788,0.002526681,0.05101557],"genre_scores_gemma":[0.9964662,0.0000803174,0.002247363,0.00002477853,0.0004073097,0.00003279178,0.00005706176,0.00004546989,0.000638696],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.5677348,"threshold_uncertainty_score":0.9999085,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880337","doi":"10.37665/smevtqs48501","title":"The Relationship Between Reflow Profiles and Contamination","year":2021,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Treaty; Flux (metallurgy); Electronics; Miniaturization; Electronic component; Contamination; Solder paste","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.03200548297401454,"gpt":0.2781306640305077,"spread":0.2461251810564931,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003343722,0.0001582856,0.0001285502,0.00005969448,0.000344556,0.0002755221,0.0002723639,0.0001666869,0.00002357283],"category_scores_gemma":[0.001615435,0.000145478,0.00005067817,0.0001574857,0.0001387302,0.000168099,0.0001441405,0.0005101032,0.00002599775],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002070403,"about_ca_system_score_gemma":0.00008176774,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000006871543,"about_ca_topic_score_gemma":0.00002494395,"domain_scores_codex":[0.9988622,0.00005410458,0.0002978499,0.0002500749,0.0002631791,0.0002725683],"domain_scores_gemma":[0.9984114,0.001071856,0.0000698102,0.0002644175,0.000144993,0.0000375762],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"observational","study_design_scores_codex":[0.00000782563,0.00002141263,0.5458345,0.00006614673,0.0003538446,0.00001787678,0.0004889651,0.0001638492,0.000729249,0.382749,0.002537508,0.06702989],"study_design_scores_gemma":[0.0005448741,0.00004234866,0.8946374,0.0002452471,0.00005572475,0.00004386939,0.0005291428,0.008287726,0.009249765,0.05039657,0.03563694,0.0003303834],"study_design_candidate":"observational","study_design_consensus":"observational","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9503725,0.008634931,0.008523413,0.01808497,0.002138803,0.0001822817,0.0000566917,0.0004899557,0.01151649],"genre_scores_gemma":[0.9937878,0.000860851,0.0007549099,0.0000165654,0.0002997825,0.00002427136,0.0000635178,0.00002272226,0.004169644],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.348803,"threshold_uncertainty_score":0.5932421,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876721","doi":"10.37665/smdbnea28112","title":"Nasa-Dod Pb-Free Electronics Rework Project: Effect Of 1x And 2x Eutectic Solder Rework On Vibration Reliability","year":2011,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Rework; Reliability (semiconductor); Soldering; Electronics; Eutectic system; Temperature cycling; Surface-mount technology","authors":[{"name":"J.P. Tucker","is_ca":false},{"name":"Carol A. Handwerker","is_ca":false},{"name":"W. Russell","is_ca":false},{"name":"Aaron E. Pedigo","is_ca":false},{"name":"A. Ganster","is_ca":false},{"name":"Polina Snugovsky","is_ca":true},{"name":"Jason G. Bragg","is_ca":true},{"name":"Zohreh Bagheri","is_ca":true},{"name":"Marianne Romansky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01333591622013631,"gpt":0.2376682925886179,"spread":0.2243323763684816,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0009655876,0.0005155927,0.0005230463,0.0004019835,0.0001485303,0.0000802348,0.0009026664,0.0005097811,0.00008350987],"category_scores_gemma":[0.001489541,0.0005094117,0.0001825433,0.0004228871,0.0002492615,0.0003030942,0.000306411,0.001279958,0.00001723582],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005613794,"about_ca_system_score_gemma":0.0001477341,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00009588883,"about_ca_topic_score_gemma":0.00004659304,"domain_scores_codex":[0.9971759,0.0001569936,0.0007018846,0.0007206119,0.000550865,0.0006937943],"domain_scores_gemma":[0.9979932,0.0004228576,0.0002625656,0.001098781,0.0001552914,0.00006734564],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.01020457,0.004128538,0.132804,0.008511036,0.01074232,0.000201114,0.0212394,0.01503249,0.1068047,0.3604189,0.0292443,0.3006687],"study_design_scores_gemma":[0.007470736,0.01216097,0.03843914,0.003883812,0.0006616499,0.0001821176,0.000260487,0.0511104,0.7693766,0.1073387,0.006238924,0.002876473],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9725236,0.002934081,0.009312875,0.000777186,0.00207055,0.0009650966,0.00004190957,0.0008714144,0.01050334],"genre_scores_gemma":[0.9950228,0.001335431,0.002958619,0.00003062111,0.0001974321,0.00009801331,0.00001843967,0.00007782521,0.0002607982],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6625719,"threshold_uncertainty_score":0.9997358,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877540","doi":"10.37665/smuzfdc17807","title":"The IPC-B-52 Sir Test Vehicle: A Discussion of the Current Test Vehicle Design and Possible Modifications for the Future","year":2012,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); IBM (Canada)","funders":"","keywords":"Reliability (semiconductor); Soldering; Automotive industry; Flux (metallurgy); Electronics; Test (biology); Surface-mount technology; Aerospace","authors":[{"name":"Mitchell Ferrill","is_ca":false},{"name":"M.E. Kelly","is_ca":true},{"name":"W. F. Mader","is_ca":false},{"name":"Nandu Ranadive","is_ca":false},{"name":"Cheikhou Ndiaye","is_ca":false},{"name":"Jim Bielick","is_ca":false},{"name":"Simin Bagheri","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02150054734082796,"gpt":0.2677090467953706,"spread":0.2462084994545427,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005927254,0.0002230814,0.0001401866,0.00005511108,0.0007688987,0.0001495263,0.001000509,0.0001086761,0.000007423494],"category_scores_gemma":[0.0007770615,0.0001014576,0.0001239502,0.0002294087,0.0003011966,0.0001896564,0.0002382061,0.0005678529,0.000005012212],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000152289,"about_ca_system_score_gemma":0.00009077097,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000007491934,"about_ca_topic_score_gemma":0.00001223914,"domain_scores_codex":[0.998618,0.0000430368,0.0003521699,0.0002067515,0.0003184422,0.0004615924],"domain_scores_gemma":[0.997344,0.001721635,0.0001647555,0.0005815838,0.0001368716,0.00005111734],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00007934652,0.0009200738,0.04323083,0.0002197603,0.0006046917,3.11866e-7,0.003874271,0.01496638,0.03061974,0.07792662,0.02275747,0.8048005],"study_design_scores_gemma":[0.0011466,0.0001786903,0.1332673,0.0004311919,0.0002103562,0.00001801183,0.001305759,0.7145841,0.02096896,0.01277382,0.114607,0.0005082815],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"commentary","genre_gemma":"empirical","genre_scores_codex":[0.2679049,0.1730531,0.2483569,0.277095,0.02317233,0.006717999,0.001059356,0.001231331,0.001409094],"genre_scores_gemma":[0.9955407,0.002511003,0.0005877727,0.00001973653,0.0005809874,0.000201813,0.000004517037,0.00003178854,0.0005216495],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.8042922,"threshold_uncertainty_score":0.5913824,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877443","doi":"10.37665/smlbwqg40505","title":"Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware","year":2015,"lang":"","type":"article","venue":"SMTA International","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Variety (cybernetics); Printed circuit board; Flash (photography); Component (thermodynamics); Integrated circuit; Computer data storage; Class (philosophy); Flash memory; Reliability (semiconductor)","authors":[{"name":"Matt Kelly","is_ca":true},{"name":"Mark Jeanson","is_ca":false},{"name":"Timothy Younger","is_ca":false},{"name":"Jim Bielick","is_ca":false},{"name":"Theron Lewis","is_ca":false},{"name":"Mitch Ferrill","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04754714328552021,"gpt":0.2647121807875149,"spread":0.2171650375019947,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002865526,0.0002737478,0.0002564,0.0003015051,0.00006807948,0.0001644425,0.0002193328,0.0002473598,0.0005141149],"category_scores_gemma":[0.0005192345,0.0003018921,0.00007202444,0.0001090712,0.00009281755,0.0004784148,0.000142116,0.0002792634,0.00004160545],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003069637,"about_ca_system_score_gemma":0.0001095838,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00005878511,"about_ca_topic_score_gemma":0.00006894366,"domain_scores_codex":[0.9985945,0.00003382799,0.000437462,0.0003543923,0.0002691855,0.0003105846],"domain_scores_gemma":[0.9990655,0.000294691,0.00008562035,0.0002239645,0.0002205729,0.0001096195],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.001990908,0.001835245,0.0816768,0.000723428,0.00451407,0.001107884,0.02018617,0.4183748,0.008455046,0.1326133,0.3013582,0.0271642],"study_design_scores_gemma":[0.006986833,0.0003206271,0.0105191,0.0003157785,0.00008440343,0.0001148129,0.0007668013,0.9067896,0.004401345,0.05113636,0.01764309,0.0009212536],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.3996152,0.001934549,0.582976,0.003875347,0.005556563,0.001791555,0.0006237549,0.0006649368,0.002962032],"genre_scores_gemma":[0.9883505,0.0001013729,0.01034679,0.0001409539,0.0001340537,0.000104707,0.00004889999,0.00004257459,0.0007301424],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.5887353,"threshold_uncertainty_score":0.9999433,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877726","doi":"10.37665/smbdudv76173","title":"A Study of Copper Dissolution During Lead Free PTH Rework Using a Thermally Massive Test Vehicle","year":2006,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Dissolution; Alloy; Soldering; Copper; Process (computing); Process window","authors":[{"name":"Craig Hamilton","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Matthew Kelly","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01473640481050606,"gpt":0.2442061663536692,"spread":0.2294697615431631,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001698701,0.0003201596,0.0003199068,0.0002919202,0.0001738972,0.00008729244,0.0007910724,0.0001938413,0.00004453874],"category_scores_gemma":[0.0002369622,0.000356004,0.0001160566,0.0003079672,0.0001169784,0.0002440501,0.0003399255,0.0005287345,0.00001196409],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0006419744,"about_ca_system_score_gemma":0.00006456067,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005928224,"about_ca_topic_score_gemma":0.000217679,"domain_scores_codex":[0.9979081,0.00003745878,0.0006098619,0.0004029814,0.000522427,0.0005192329],"domain_scores_gemma":[0.9988871,0.0001160235,0.0002289197,0.0005767561,0.0001580098,0.00003322124],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0001172065,0.002134749,0.2685081,0.0001694868,0.0008687906,0.0001414818,0.002173063,0.3119023,0.4088786,0.003103838,0.0006663213,0.001336046],"study_design_scores_gemma":[0.007062497,0.0009507379,0.5365099,0.001590399,0.000299914,0.00009595419,0.003757467,0.3575967,0.08423594,0.006263954,0.0001495667,0.001487018],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9940459,0.0006317531,0.001270037,0.0003178959,0.0007096672,0.0003032713,0.00005226041,0.0003769415,0.002292265],"genre_scores_gemma":[0.9979056,0.00004251353,0.001217459,0.000004245775,0.000309902,0.00002343973,0.000009438256,0.00006028637,0.0004270766],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3246427,"threshold_uncertainty_score":0.9998892,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877907","doi":"10.37665/smdtjum93978","title":"Copper Corrosion Effects from Cleaning Agent Entrapment","year":2013,"lang":"","type":"article","venue":"SMTA International","topic":"Corrosion Behavior and Inhibition","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Electronics; Corrosion; Cleaning agent; Anode; Aqueous solution; Copper; Reliability (semiconductor)","authors":[{"name":"David Lober","is_ca":false},{"name":"Mike Bixenman","is_ca":false},{"name":"Linda Woody","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01283920597629837,"gpt":0.2500413655860442,"spread":0.2372021596097458,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0002367951,0.0003678081,0.0002947641,0.0001515821,0.0002799459,0.0007665246,0.0005859653,0.0001929985,0.07296963],"category_scores_gemma":[0.0001124226,0.0003574318,0.0002027224,0.0001097717,0.000129155,0.0008968537,0.0004352111,0.0002596912,0.01311394],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004746538,"about_ca_system_score_gemma":0.00007140043,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007541705,"about_ca_topic_score_gemma":0.00001943906,"domain_scores_codex":[0.9967033,0.0001509354,0.000714401,0.0007881123,0.001146274,0.0004969802],"domain_scores_gemma":[0.9985176,0.0001773485,0.0003138148,0.0003865715,0.0003271549,0.0002774587],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005763587,0.0003726178,0.00386449,0.00001527468,0.000004801997,0.0000154002,0.0006174201,0.00003811158,0.9524592,0.0003491395,0.03300802,0.009197962],"study_design_scores_gemma":[0.001933042,0.0003248258,0.04605053,0.000840574,0.00008622636,0.00001392247,0.000341752,0.005520729,0.9321528,0.0009648766,0.0111008,0.0006699112],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9674891,0.0001696071,0.005318044,0.001108152,0.02176815,0.0008223526,0.0001925686,0.00009717193,0.003034872],"genre_scores_gemma":[0.9945258,0.0001351801,0.0007874825,0.0009361291,0.0008903363,0.0001573542,0.0003145641,0.0000381642,0.002214915],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.05985569,"threshold_uncertainty_score":0.9998878,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878214","doi":"10.37665/smpmwev86175","title":"Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability Testing Using a Thermal Treatment","year":2018,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Microstructure; Soldering; Ball grid array; Temperature cycling; Alloy; Solder paste; Equiaxed crystals; Creep","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"Mikaella Brillantes","is_ca":true},{"name":"Chee Kiang Ivan Tan","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Jeff Kennedy","is_ca":false},{"name":"David Hillman","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.058320942994065,"gpt":0.2663049834731851,"spread":0.2079840404791201,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002550276,0.0002917363,0.0003788966,0.0001779246,0.0000927556,0.00006196445,0.0002985801,0.0002450178,0.0000294061],"category_scores_gemma":[0.0006278792,0.0002555257,0.00007120954,0.0001802483,0.0004208239,0.0002404982,0.0002269965,0.000250775,9.235876e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003714374,"about_ca_system_score_gemma":0.0001552867,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000378104,"about_ca_topic_score_gemma":0.00004976924,"domain_scores_codex":[0.9983784,0.00005750436,0.0006204805,0.0003657173,0.0002598212,0.0003180567],"domain_scores_gemma":[0.9987646,0.00006257245,0.0002442959,0.0004131611,0.0004807177,0.0000347054],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003250753,0.00007329107,0.007441329,0.0001276721,0.000259464,0.000003677235,0.001990997,0.001396611,0.9847066,0.0002145299,0.000006583579,0.003454114],"study_design_scores_gemma":[0.001203229,0.0007543889,0.007755309,0.0008382596,0.00008179454,0.00002881353,0.0003130895,0.2096886,0.7782721,0.0007711395,0.00002037414,0.0002729412],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9968516,0.0006635159,0.001320025,0.0001707219,0.0004629491,0.0002426383,0.00004656437,0.0001249677,0.000117077],"genre_scores_gemma":[0.9910799,0.00003392589,0.008634938,0.000008472953,0.0001530568,0.00001526151,0.000005042613,0.00003486445,0.00003452833],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2082919,"threshold_uncertainty_score":0.9999897,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7108207870","doi":"10.37665/smzxqvj96197","title":"Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies","year":2000,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Reliability (semiconductor); Electronics; Printed circuit board; Electronic component; Reflow soldering; Electronic packaging; Electrical conductor","authors":[],"retraction":null,"screen_n_in":null,"score":{"opus":0.01868976755401105,"gpt":0.2792796831133561,"spread":0.2605899155593451,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0005210613,0.0003148104,0.0003683114,0.0002032334,0.0000793646,0.00004550277,0.001321053,0.0001889873,0.001351397],"category_scores_gemma":[0.0007110992,0.0002430909,0.0003571311,0.0002802163,0.0002983095,0.0001656311,0.000183951,0.0006806482,0.00002117627],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004396055,"about_ca_system_score_gemma":0.00008668219,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002926869,"about_ca_topic_score_gemma":0.00001226943,"domain_scores_codex":[0.9979768,0.00006053253,0.0006658077,0.0003334267,0.0005224457,0.0004409971],"domain_scores_gemma":[0.9981487,0.0004689101,0.0002084139,0.000966787,0.0001723133,0.00003485518],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"observational","study_design_scores_codex":[0.0006626984,0.001174591,0.1046934,0.0005720697,0.004657059,0.0000145113,0.003557713,0.6337155,0.08836278,0.04170007,0.01142347,0.1094662],"study_design_scores_gemma":[0.003446005,0.001603833,0.4310212,0.003263401,0.0002113583,0.00002496834,0.000689614,0.2815817,0.2441501,0.02815656,0.004254827,0.001596425],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9736078,0.0002686229,0.0003500962,0.001526586,0.0004653448,0.0001752115,0.00004368447,0.0002488687,0.02331375],"genre_scores_gemma":[0.9978973,0.0002471522,0.0005005358,0.00001274368,0.0000907393,0.0000135857,0.000005514371,0.00003998203,0.001192415],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3521337,"threshold_uncertainty_score":0.9995615,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416875965","doi":"10.37665/smavddd31609","title":"Accelerated Thermal Cycling of Tin-Lead and Lead-Free Solder Joints","year":2003,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Soldering; Temperature cycling; Ball grid array; Reliability (semiconductor); Thermal; Scanning electron microscope; Atmospheric temperature range; Printed circuit board","authors":[{"name":"Yan Qi","is_ca":true},{"name":"Hamid Ghorbani","is_ca":true},{"name":"J.K. Spelt","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"P. Arrowsmith","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02702945798661655,"gpt":0.2553572064589395,"spread":0.228327748472323,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003101728,0.0003010558,0.0003182928,0.0002462968,0.00008672696,0.00009264423,0.000590134,0.0002472525,0.0002723127],"category_scores_gemma":[0.0005383349,0.0003263442,0.0000938439,0.0001764899,0.0001783968,0.0002136238,0.0001843252,0.0005622713,0.00002585906],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001539416,"about_ca_system_score_gemma":0.00007192509,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00003320121,"about_ca_topic_score_gemma":0.00001207839,"domain_scores_codex":[0.9982945,0.00004098768,0.000504264,0.0003550819,0.0003296102,0.0004755486],"domain_scores_gemma":[0.9991238,0.0001061528,0.0001398024,0.00044562,0.0001350412,0.00004963141],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001535188,0.0007154552,0.06252964,0.0007672469,0.003925687,0.0001077184,0.004438118,0.02253599,0.6916269,0.1156837,0.007213885,0.0903021],"study_design_scores_gemma":[0.004569368,0.0002870277,0.01556984,0.0009978286,0.0001413974,0.0001467832,0.0008137004,0.106843,0.847504,0.01563608,0.006057811,0.001433114],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9662401,0.002306084,0.004062108,0.0006178026,0.001377287,0.0001395687,0.00002754946,0.000339392,0.0248901],"genre_scores_gemma":[0.9949083,0.0005592091,0.003268768,0.00003078983,0.00009709258,0.00001035447,0.000008819566,0.00005114272,0.0010655],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1558772,"threshold_uncertainty_score":0.9999189,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416875919","doi":"10.37665/smdluzm31225","title":"Process Challenges and Solutions for Embedding Chip-On-Board into Mainstream Smt Assembly","year":2003,"lang":"","type":"article","venue":"SMTA International","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Current Water Technologies (Canada)","funders":"","keywords":"Rework; Surface-mount technology; Process (computing); Footprint; SMT placement equipment; Embedding; Key (lock); Mount","authors":[{"name":"Mukul Luthra","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03205729180685557,"gpt":0.2899041871989923,"spread":0.2578468953921367,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002866935,0.0003517019,0.0002743773,0.0003236579,0.0002647598,0.0001054797,0.0003820078,0.0002900929,0.00008432536],"category_scores_gemma":[0.0006164243,0.0003752206,0.000116933,0.0001051816,0.0001413727,0.0003031133,0.00009541478,0.0003327468,0.00003454362],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001956461,"about_ca_system_score_gemma":0.00006600115,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000005783477,"about_ca_topic_score_gemma":0.00003288291,"domain_scores_codex":[0.9982492,0.00002007158,0.0003739041,0.0004965562,0.0003058317,0.0005544615],"domain_scores_gemma":[0.9991817,0.0001980345,0.00009933743,0.000255544,0.0001696075,0.00009579246],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"theoretical_or_conceptual","study_design_scores_codex":[0.00005272092,0.0002816213,0.0004134581,0.0004831048,0.0007313637,0.00001066304,0.002492868,0.008045157,0.0006552843,0.8383661,0.001340418,0.1471273],"study_design_scores_gemma":[0.008056829,0.00159553,0.008378028,0.002375121,0.0003680791,0.0001941208,0.02451337,0.3372894,0.0344107,0.4160447,0.1629921,0.003781941],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":"theoretical_or_conceptual","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6650551,0.02884996,0.06649383,0.01375578,0.01009805,0.002059429,0.0003028735,0.001770502,0.2116145],"genre_scores_gemma":[0.9912886,0.003827507,0.003855312,0.00005143536,0.0002563691,0.0002191583,0.0000192787,0.00005705345,0.0004252963],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4223213,"threshold_uncertainty_score":0.99987,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W2186579313","doi":"10.37665/smjdsrr46574","title":"High Complexity Lead-Free Wave and Rework: The Effects of Material, Process and Board Design on Barrel Fill","year":2010,"lang":"en","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada); Hain Celestial (Canada)","funders":"","keywords":"Design for manufacturability; Engineering; Product design; Rework; Mechanical engineering; Manufacturing engineering; Computer science; Reliability engineering; Product (mathematics); Embedded system","authors":[{"name":"Craig Hamilton","is_ca":true},{"name":"John McMahon","is_ca":true},{"name":"Jose Traya","is_ca":true},{"name":"Wang Yong Kang","is_ca":false},{"name":"Khoo Kok Wei","is_ca":false},{"name":"Matthew Kelly","is_ca":true},{"name":"Marie Cole","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01354923990911709,"gpt":0.2243395902096489,"spread":0.2107903503005319,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000944684,0.00008549679,0.0000898428,0.00004180059,0.00003864225,0.00003095435,0.0002006696,0.00006265863,0.00001144039],"category_scores_gemma":[0.0001884826,0.00006395714,0.00001163494,0.00002875208,0.0001368848,0.00004083481,0.00005902793,0.0002060487,0.000001042395],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00001246792,"about_ca_system_score_gemma":0.000006451333,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002029258,"about_ca_topic_score_gemma":0.00001551021,"domain_scores_codex":[0.9995854,0.000009605418,0.00008634637,0.0001021581,0.0001033979,0.0001130278],"domain_scores_gemma":[0.9996318,0.000132691,0.00002359649,0.0001744182,0.00002333001,0.00001422064],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003683424,0.0002347248,0.007104956,0.001646351,0.001023119,0.00006292965,0.002801238,0.003443465,0.524174,0.3731503,0.03717232,0.04881824],"study_design_scores_gemma":[0.001251323,0.0003195019,0.0383285,0.0003121706,0.00003235587,0.00006272848,0.00006907097,0.03388662,0.7783875,0.1460757,0.0008646589,0.0004098555],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.996613,0.00006860385,0.001459639,0.0005698,0.0006738037,0.00009819851,0.0000125111,0.000187447,0.0003169513],"genre_scores_gemma":[0.9974036,0.00005412569,0.002393916,0.00002191669,0.000056729,0.00001665627,0.000003302838,0.00001102402,0.00003876835],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2542135,"threshold_uncertainty_score":0.2608097,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877755","doi":"10.37665/smmsjxl65955","title":"Effect of Warpage on SMT Process of PoP Package and its Solution","year":2013,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Reliability (semiconductor); Process (computing); Surface-mount technology; Stencil; Reflow soldering; Solder paste; Soldering; Circuit reliability","authors":[{"name":"Stephen Guo","is_ca":false},{"name":"Fubin Song","is_ca":false},{"name":"Jing Qi","is_ca":false},{"name":"James Huang","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.006405833574075162,"gpt":0.2480973123167142,"spread":0.241691478742639,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002545604,0.0002190571,0.0002927613,0.0001869258,0.00003543368,0.0000257466,0.0003325588,0.0001729159,0.0001143486],"category_scores_gemma":[0.0003377591,0.0002068493,0.00007327105,0.0001283586,0.00009001812,0.0001937391,0.00008397777,0.0003077892,0.00002990937],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00009380352,"about_ca_system_score_gemma":0.00002329327,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0000385771,"about_ca_topic_score_gemma":0.00000230006,"domain_scores_codex":[0.998798,0.00003642839,0.0003479315,0.0002337215,0.0003103367,0.000273629],"domain_scores_gemma":[0.9993156,0.0001673886,0.0001458621,0.0002017946,0.0001313173,0.00003809973],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004141263,0.0005880283,0.01723023,0.007364349,0.002115206,0.00001702688,0.003293753,0.01007819,0.719967,0.04463468,0.002795109,0.1915023],"study_design_scores_gemma":[0.0009743587,0.001157066,0.004947047,0.0007950588,0.00004420411,0.00001138474,0.00005764185,0.1001909,0.8896329,0.00184939,0.00007230177,0.0002677371],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.993774,0.001039039,0.0007589083,0.0003825371,0.0004714878,0.0002831935,0.0000285464,0.0001451399,0.00311718],"genre_scores_gemma":[0.9992188,0.0003221613,0.00007267486,0.000005983836,0.00005541804,0.00003785165,0.00001056413,0.00002537651,0.0002511644],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1912346,"threshold_uncertainty_score":0.8435072,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876876","doi":"10.37665/smbsfyu17170","title":"PWB Contamination & Reliability Doe","year":2001,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Reliability (semiconductor); Electronics; Contamination; Miniaturization; Printed circuit board; Surface-mount technology; Circuit reliability; Electronic equipment; Process (computing)","authors":[{"name":"Michael R. Weekes","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.014931109875714,"gpt":0.2573884233617606,"spread":0.2424573134860466,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0004407148,0.0002951986,0.0002384469,0.0002521499,0.0001187784,0.0001401138,0.0006852073,0.0003161792,0.0009345542],"category_scores_gemma":[0.0007403082,0.0003316478,0.000140392,0.0002613683,0.000139478,0.0003190819,0.0001532977,0.0006968215,0.0004944938],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0008166193,"about_ca_system_score_gemma":0.00006125567,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00009692542,"about_ca_topic_score_gemma":0.0001097753,"domain_scores_codex":[0.9980695,0.00003715436,0.0004714135,0.0004469976,0.0004648588,0.0005100935],"domain_scores_gemma":[0.9989039,0.0001606509,0.00009942079,0.0005592708,0.0002061743,0.00007060209],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0003334821,0.001367868,0.1684715,0.0004109838,0.001992289,0.0001748308,0.00377955,0.06525517,0.02004853,0.1800507,0.06786846,0.4902466],"study_design_scores_gemma":[0.001490519,0.0001251437,0.03927615,0.000284116,0.00006564729,0.0001507106,0.000189673,0.07359945,0.004066459,0.02692056,0.8528445,0.0009871024],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.843013,0.001217752,0.06937205,0.007042771,0.00554732,0.0002791124,0.0000409266,0.001663166,0.07182384],"genre_scores_gemma":[0.9869546,0.001746125,0.001943461,0.00006178191,0.00040711,0.00003291926,0.00007209093,0.00004108887,0.008740844],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.784976,"threshold_uncertainty_score":0.9999787,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416880778","doi":"10.37665/smrgeun24407","title":"Prediction of PCB Thickness for Selection of a Suitable PCB Manufacturing Technology","year":2000,"lang":"","type":"article","venue":"SMTA International","topic":"Electromagnetic Compatibility and Noise Suppression","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Printed circuit board; Fabrication; Interconnection; SIGNAL (programming language); Component (thermodynamics); Integrated circuit; Layer (electronics); Electronic component; Electronic circuit","authors":[{"name":"S. Pochareddy","is_ca":false},{"name":"L. Gopalakrishnan","is_ca":true},{"name":"K. Srihari","is_ca":false},{"name":"Manthos Economou","is_ca":true},{"name":"V. Sion","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01111965512488912,"gpt":0.2252660943520556,"spread":0.2141464392271664,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["insufficient_payload"],"consensus_categories":[],"category_scores_codex":[0.0002901333,0.000210535,0.0003246137,0.0004027761,0.00007819785,0.00001768065,0.0003408994,0.0003361058,0.005133544],"category_scores_gemma":[0.00008386026,0.0002395728,0.0001479866,0.000244433,0.00009573719,0.000237421,0.00004640715,0.000316513,0.000009313945],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001509537,"about_ca_system_score_gemma":0.00006547225,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00008395726,"about_ca_topic_score_gemma":0.00004251805,"domain_scores_codex":[0.9982599,0.00003298869,0.0007369461,0.0003333476,0.0003349168,0.0003019003],"domain_scores_gemma":[0.9991565,0.000143577,0.0001624884,0.000236961,0.0002575908,0.00004289693],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001376324,0.0009772156,0.01197369,0.001632117,0.0008177378,0.000001629371,0.001151791,0.06190744,0.6920702,0.004127677,0.00155575,0.2224084],"study_design_scores_gemma":[0.001359496,0.0007033577,0.01283036,0.000440652,0.00008769635,0.000029216,0.00006918322,0.1724999,0.8006912,0.004830837,0.006261982,0.0001961479],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9892343,0.0003113428,0.004376676,0.0002607376,0.0009369862,0.0004874022,0.00026035,0.0001034714,0.004028769],"genre_scores_gemma":[0.9954011,0.0001943629,0.002381691,0.000005368373,0.0002001806,0.00006066162,0.00007493844,0.00002924845,0.001652389],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2222123,"threshold_uncertainty_score":0.9957759,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877734","doi":"10.37665/smnxhbd90252","title":"Reliability Testing of PWB Plated Through Holes Using Interconnect Stress Testing Thermal Cycling before and after PB-Free Reflow Preconditioning","year":2013,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Intertek (Canada)","funders":"","keywords":"Temperature cycling; Reliability (semiconductor); Printed circuit board; Interconnection; Stress (linguistics); Materials testing; Test method; Material properties","authors":[{"name":"Bill Birch","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02340420687203824,"gpt":0.2515095894702273,"spread":0.2281053825981891,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0003776183,0.0004685166,0.000467855,0.0002442301,0.0002066744,0.0002598289,0.0007139635,0.000326011,0.0001376534],"category_scores_gemma":[0.003278593,0.0004936127,0.0001104153,0.0003423537,0.000433551,0.001155592,0.00062593,0.0008894804,0.000006748113],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003496644,"about_ca_system_score_gemma":0.00008028984,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008565963,"about_ca_topic_score_gemma":0.00006323749,"domain_scores_codex":[0.9973322,0.00006596049,0.0009443308,0.0006337878,0.0003616823,0.0006620978],"domain_scores_gemma":[0.9978291,0.000670263,0.0003596898,0.0006099748,0.000460496,0.00007046826],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"observational","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00007187681,0.0002579653,0.3766899,0.00138115,0.001122538,0.00003662783,0.005942544,0.3524481,0.1950528,0.0009737893,0.00005881993,0.06596391],"study_design_scores_gemma":[0.001100571,0.0002704706,0.1146845,0.005440644,0.0001182264,0.0001014921,0.0009564434,0.8074575,0.05105899,0.01799869,0.0000156136,0.0007968],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9894106,0.0006547637,0.00663123,0.000187489,0.0007392059,0.0003361709,0.0001245815,0.0005411562,0.00137478],"genre_scores_gemma":[0.9287447,0.00002873947,0.07079322,0.00001898934,0.0002302388,0.00005161279,0.00002230098,0.00007530886,0.00003484449],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4550094,"threshold_uncertainty_score":0.9997516,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416878082","doi":"10.37665/smcyuaa51863","title":"The North American Electronics Market: The Current Outlook and Positioning for the Future","year":2004,"lang":"","type":"article","venue":"SMTA International","topic":"Innovation Diffusion and Forecasting","field":"Decision Sciences","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Electronics; Production (economics); China; Order (exchange); Politics; Current (fluid)","authors":[{"name":"Eric Miscoll","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02589258467681051,"gpt":0.3367474309459043,"spread":0.3108548462690938,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["sts","scholarly_communication"],"consensus_categories":[],"category_scores_codex":[0.002539275,0.0002332882,0.0001636081,0.0001212698,0.003105042,0.001607583,0.001569925,0.00003626641,0.0002433993],"category_scores_gemma":[0.001175207,0.0001075673,0.0001815988,0.0008344735,0.0007493959,0.000242776,0.0003270752,0.0006227674,0.00003278534],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001701342,"about_ca_system_score_gemma":0.000343688,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001734829,"about_ca_topic_score_gemma":0.0009125526,"domain_scores_codex":[0.9968508,0.0001158515,0.0007839872,0.0004487857,0.001352936,0.0004476332],"domain_scores_gemma":[0.9954344,0.002283522,0.0007241871,0.0004409673,0.001050437,0.00006649081],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001549643,0.00004774039,0.003395783,0.000002109169,0.00008926127,5.629191e-7,0.0009007651,0.0002329068,0.000006021689,0.08542792,0.0101573,0.8995847],"study_design_scores_gemma":[0.0007429233,0.0001214356,0.0766383,0.00003226941,0.0000352312,0.00003117994,0.002542013,0.03057514,0.00001851904,0.0170798,0.8719835,0.0001997056],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"commentary","genre_gemma":"empirical","genre_scores_codex":[0.3083788,0.02107844,0.1155838,0.5039729,0.03103591,0.003150198,0.0004947598,0.00009257144,0.01621253],"genre_scores_gemma":[0.9887024,0.002639503,0.0004380497,0.002716528,0.002649502,0.0001105304,0.00002378129,0.00002370216,0.002696052],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.899385,"threshold_uncertainty_score":0.9994289,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W7128471603","doi":"10.37665/smduifk33287","title":"Investigation into Void Evaluation, Reliability Impact, and Establishment Criteria for Various Bottom Termination Component Packages","year":2025,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Lockheed Martin (Canada)","funders":"","keywords":"Soldering; Component (thermodynamics); Electronics; Joint (building); Reliability (semiconductor); Solder paste; Electronic packaging; Electronic component","authors":[{"name":"B. Gumpert","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01832732670566036,"gpt":0.3230622133993035,"spread":0.3047348866936432,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001769092,0.0003846841,0.0003349398,0.0005360184,0.0002686362,0.0004346116,0.0004289661,0.0002920276,0.00006673116],"category_scores_gemma":[0.001585398,0.0004148609,0.0001278545,0.0002847635,0.0002218878,0.0005206248,0.0002005402,0.0004175502,0.00000432411],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002038687,"about_ca_system_score_gemma":0.0003637225,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004651302,"about_ca_topic_score_gemma":0.0001093842,"domain_scores_codex":[0.9976168,0.0001232919,0.0006962566,0.0006394371,0.0005053217,0.0004188902],"domain_scores_gemma":[0.9981994,0.0003509507,0.0001764592,0.0004689395,0.0007196075,0.00008466382],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0005362235,0.0007662338,0.1022595,0.003274545,0.003291383,0.000009407069,0.01289404,0.03316335,0.1365965,0.03983669,0.06852882,0.5988433],"study_design_scores_gemma":[0.001970484,0.0002185838,0.08371978,0.0005517238,0.0002258354,0.000009316492,0.0004366965,0.7320369,0.0182205,0.1587526,0.003337912,0.0005196701],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.94133,0.002050955,0.04257912,0.00912043,0.002642678,0.001251797,0.0001125348,0.0004319738,0.0004805785],"genre_scores_gemma":[0.9891011,0.0003697533,0.009255128,0.00008547767,0.000151487,0.0003958514,0.0003668101,0.00003157343,0.0002428117],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6988735,"threshold_uncertainty_score":0.9998303,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877519","doi":"10.37665/smwidms67050","title":"CGA Trends and Capabilities","year":2015,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Ball grid array; Flip chip; Soldering; Reliability (semiconductor); Eutectic system; Ceramic; Wetting; Printed circuit board; Temperature cycling","authors":[{"name":"Marti McCurdy","is_ca":false},{"name":"Isabel Sousa","is_ca":true},{"name":"Robert Martel","is_ca":true},{"name":"Alain Lessard","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02268562936705583,"gpt":0.2520812211461858,"spread":0.2293955917791299,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002012209,0.000195011,0.0001665972,0.0002763589,0.00004250058,0.00011984,0.0003153128,0.0001416492,0.0001037659],"category_scores_gemma":[0.0001820642,0.0002108671,0.00004777858,0.0001264669,0.0001729138,0.0001852031,0.0001480502,0.0003121266,0.00003512892],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002921206,"about_ca_system_score_gemma":0.00005281432,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00007721086,"about_ca_topic_score_gemma":0.00003022833,"domain_scores_codex":[0.9989426,0.00001486353,0.000221037,0.0002458378,0.0002602747,0.0003153662],"domain_scores_gemma":[0.9995167,0.00004486495,0.00003494862,0.0002281547,0.00007864829,0.00009669849],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00008954707,0.0002176093,0.03264906,0.0001919984,0.001429159,0.00007300432,0.01183484,0.00995825,0.001470845,0.2948827,0.1137424,0.5334606],"study_design_scores_gemma":[0.004917585,0.0008574154,0.02373934,0.0005122463,0.0001566206,0.0004713594,0.006379622,0.227551,0.007608339,0.1886123,0.5367379,0.002456319],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7649789,0.01177233,0.002510395,0.01163523,0.005684095,0.00009277483,0.00008052817,0.001545105,0.2017007],"genre_scores_gemma":[0.9912003,0.0003358698,0.001034799,0.0000260266,0.0002289481,0.00001243932,0.00001311378,0.00002562684,0.007122837],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5310043,"threshold_uncertainty_score":0.8598909,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416876978","doi":"10.37665/smapyyb87005","title":"The Influence of Solder Void Location on BGA Thermal Fatigue Life","year":2010,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Ball grid array; Soldering; Void (composites); Temperature cycling; Printed circuit board; Reliability (semiconductor); Surface-mount technology; Thermal","authors":[{"name":"Richard Coyle","is_ca":false},{"name":"Heather McCormick","is_ca":true},{"name":"Peter Read","is_ca":false},{"name":"Richard Popowich","is_ca":false},{"name":"John Osenbach","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01089308512220567,"gpt":0.2472943423018057,"spread":0.2364012571796001,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003402845,0.000220714,0.0001544075,0.0001302055,0.0001676459,0.0000976904,0.0009976594,0.0002120566,0.00006249256],"category_scores_gemma":[0.0009805463,0.0001815285,0.0000796688,0.0001767711,0.0002884667,0.0001659695,0.0001159905,0.0009583462,0.00005597348],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00008301575,"about_ca_system_score_gemma":0.0001438873,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00007447279,"about_ca_topic_score_gemma":0.00007785152,"domain_scores_codex":[0.9985365,0.0000228934,0.0004169058,0.000240781,0.0004302521,0.0003526573],"domain_scores_gemma":[0.9987147,0.0002681777,0.0001580833,0.0005475559,0.0002582349,0.00005319699],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"observational","study_design_scores_codex":[0.00008789715,0.0001936353,0.007106669,0.0001000505,0.0006828943,0.000004074294,0.001094269,0.5793595,0.1770538,0.1773758,0.00195551,0.05498591],"study_design_scores_gemma":[0.002288784,0.0005911572,0.3823231,0.0010053,0.0001041139,0.00003149926,0.0007543936,0.3121628,0.2576644,0.01450908,0.02698491,0.001580407],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9891511,0.0002985286,0.001593517,0.003059508,0.001994298,0.0001418927,0.0000119424,0.0002291855,0.003519983],"genre_scores_gemma":[0.9988371,0.0002151933,0.000257313,0.00006575126,0.0002457814,0.00003035541,0.000006588143,0.00003061195,0.0003113202],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3752164,"threshold_uncertainty_score":0.7402518,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416877186","doi":"10.37665/smizngx75093","title":"Critical Manufacturing Issues and Solutions for Tracking Moisture Sensitive Devices (MSDs)","year":2001,"lang":"","type":"article","venue":"SMTA International","topic":"Experience-Based Knowledge Management","field":"Computer Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Centre Intégré de Santé et Services Sociaux de la Gaspésie","funders":"","keywords":"Reliability (semiconductor); Control (management); Tracking (education); Customer satisfaction; Product (mathematics); Material handling; Control system; Container (type theory)","authors":[{"name":"François Monette","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03990185873940716,"gpt":0.3295783693168803,"spread":0.2896765105774731,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","scholarly_communication"],"consensus_categories":[],"category_scores_codex":[0.0005452449,0.0003393995,0.0002588403,0.0002697647,0.0008514589,0.001243155,0.0008670504,0.0001283336,0.0001612804],"category_scores_gemma":[0.0004284469,0.00036769,0.0001439607,0.0001568193,0.0003489529,0.001465331,0.0009112326,0.0002603301,0.00005874681],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002418435,"about_ca_system_score_gemma":0.00006239826,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00009742356,"about_ca_topic_score_gemma":0.0003508597,"domain_scores_codex":[0.9971767,0.00009044771,0.0004773949,0.0009443769,0.0005867046,0.0007243413],"domain_scores_gemma":[0.9982072,0.0004996652,0.0001336589,0.0003573711,0.0006119392,0.0001901916],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0001487429,0.0006537387,0.002393418,0.0002190734,0.000449959,0.0003035694,0.01422823,0.0006888105,0.0005549585,0.6664087,0.003605094,0.3103457],"study_design_scores_gemma":[0.001978976,0.0004528647,0.04372022,0.0009204292,0.0001570965,0.0003361734,0.00450267,0.6235171,0.01273151,0.01963986,0.2905154,0.001527752],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.03182978,0.001940754,0.906862,0.03379017,0.006008649,0.0007079113,0.00007483591,0.0001646332,0.01862122],"genre_scores_gemma":[0.9793441,0.0001816428,0.01631682,0.0007797905,0.001298649,0.00007811888,0.00001729113,0.00002298583,0.001960586],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.9475144,"threshold_uncertainty_score":0.9998775,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}