{"meta":{"page":1,"per_page":50,"max_per_page":100,"total":83,"total_is_capped":false,"direct_labels_cover":0,"predictions_cover":83,"direct_label_status":"direct model label, unvalidated","prediction_status":"machine_predicted_unvalidated (Codex and Gemma teacher distillation)","score_status":"score_only:v0-immature-baseline (scores rank; they never assert a category)","snapshot":{"source":"OpenAlex, pinned release, all 482 partitions","release":"2026-06-24","frame_built":"2026-07-12","author_layer_release":"2026-06-26"},"query_hash":"1454ff251e9c","filters":{"venue":"Soldering and Reliability Conferences"}},"results":[{"id":"W4416885437","doi":"10.37665/srcnjdr30254","title":"Pb-Free Failure Analysis Case Studies – An EMS Perspective","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Centre for Social Innovation","funders":"","keywords":"Perspective (graphical); Government (linguistics); Context (archaeology); Term (time)","authors":[{"name":"Jason Bragg","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03898376291309791,"gpt":0.2745081038955361,"spread":0.2355243409824382,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001436896,0.000894325,0.0005959418,0.001781156,0.00114897,0.001217188,0.001600333,0.002620116,0.008686721],"category_scores_gemma":[0.002823272,0.0004313666,0.0007395596,0.0009008818,0.0008850089,0.001516723,0.0007812179,0.0007507037,0.001049722],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0009453128,"about_ca_system_score_gemma":0.0006829961,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.007983828,"about_ca_topic_score_gemma":0.0121165,"domain_scores_codex":[0.9990119,0.0004363038,0.00003441762,0.00007374826,0.0003045609,0.0001390731],"domain_scores_gemma":[0.9979721,0.001367399,0.0001091887,0.0001695979,0.0003343634,0.00004727952],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"case_report","study_design_scores_codex":[0.0009654188,0.001247244,0.01129902,0.0005679018,0.0001863946,0.0168488,0.002273868,0.7376184,0.03212682,0.08768465,0.006608041,0.1025734],"study_design_scores_gemma":[0.0003102692,0.002940508,0.01331139,0.0002315782,0.0003455903,0.009387164,0.007782091,0.7625514,0.0837082,0.07536034,0.04389207,0.0001793805],"study_design_candidate":"case_report","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6056786,0.0007622728,0.2425918,0.001366961,0.00005775661,0.0004396551,0.0007133823,0.0008426321,0.1475469],"genre_scores_gemma":[0.9309536,0.000464865,0.04095843,0.0001324091,0.00002428572,0.0001366227,0.0001933266,0.00009152677,0.02704484],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.008686721,"threshold_uncertainty_score":0.02906001,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884986","doi":"10.37665/srrrukz80653","title":"Characterization and Prediction of Pad-Crater Fracture In Lead-Free Compatible PCBs","year":2011,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Fracture (geology); Brittleness; Strain energy release rate; Bending; Liquidus; Surface finish; Brittle fracture; Intermetallic; Fracture toughness","authors":[{"name":"Siva Nadimpalli","is_ca":false},{"name":"J.K. Spelt","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02362937882670117,"gpt":0.2074641993871603,"spread":0.1838348205604592,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003957138,0.0005454609,0.0002512083,0.0008743518,0.0001126225,0.0001939835,0.0004276329,0.0002849523,0.0007252555],"category_scores_gemma":[0.001253062,0.0002940342,0.000250834,0.0002646591,0.0002220904,0.000233635,0.0001328438,0.0002131384,0.0002351165],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001937751,"about_ca_system_score_gemma":0.0001214249,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0009014471,"about_ca_topic_score_gemma":0.001556887,"domain_scores_codex":[0.9996836,0.00003770023,0.00001815758,0.00004970919,0.000182462,0.00002847769],"domain_scores_gemma":[0.9991691,0.0003064612,0.0001678585,0.0001047114,0.0002117842,0.00004009597],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0002055232,0.00005614718,0.02293034,0.00009084691,0.00001581208,0.0002524731,0.00009300793,0.01822473,0.9444946,0.00005769588,0.00004742536,0.01353156],"study_design_scores_gemma":[0.000008722419,0.00080847,0.08571079,0.000008343407,0.00001791073,0.0002847701,0.00007441988,0.08420926,0.8286059,0.00004373647,0.0002109355,0.00001687835],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9857407,0.00008416863,0.01379532,0.000003430844,0.00000323841,0.00001548109,0.00006075995,0.0001119075,0.0001848281],"genre_scores_gemma":[0.9960791,0.00003883982,0.003580553,0.000001923447,7.339128e-7,0.000007656333,0.00007063917,0.00001693479,0.0002036253],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009014471,"threshold_uncertainty_score":0.002426267,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884873","doi":"10.37665/srjyovr63054","title":"Improving Product Reliability Using Accelerated Stress Testing","year":2012,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Reliability and Maintenance Optimization","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Sciex (Canada); Spinal Cord Injury BC; North Toronto Eye Care","funders":"","keywords":"Reliability (semiconductor); Accelerated life testing; Failure rate; Field (mathematics); Component (thermodynamics); Stress (linguistics); Stress testing (software); Failure mode and effects analysis","authors":[{"name":"P. Arrowsmith","is_ca":true},{"name":"Bojan Randjelovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04721270029100482,"gpt":0.2555830456657017,"spread":0.2083703453746968,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001067531,0.0005627632,0.0003848643,0.001077165,0.0001861931,0.0004458047,0.0005744233,0.0002660169,0.001211141],"category_scores_gemma":[0.002130462,0.0002133563,0.0002786222,0.0004994284,0.0002280574,0.0005783802,0.0004576683,0.0002826397,0.0002900491],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002284768,"about_ca_system_score_gemma":0.000286109,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007631308,"about_ca_topic_score_gemma":0.0009096933,"domain_scores_codex":[0.9990622,0.0003041606,0.0000489262,0.00008618533,0.0004390006,0.00005947443],"domain_scores_gemma":[0.9979297,0.0004567615,0.0002365175,0.0003464475,0.000981214,0.00004940316],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002858513,0.0002964876,0.01321252,0.0001504117,0.00005136081,0.0001620024,0.0002296707,0.03364766,0.7692207,0.0008581832,0.0006078113,0.1812774],"study_design_scores_gemma":[0.0001434588,0.007938982,0.03808255,0.00005160644,0.0001413606,0.0007262154,0.0001734351,0.3186102,0.6229736,0.001742632,0.009306587,0.0001094024],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8702959,0.0005911946,0.12472,0.0001452284,0.00004157577,0.0001219474,0.00008865209,0.001368591,0.002626869],"genre_scores_gemma":[0.9542849,0.0001481399,0.04461281,0.00001818164,0.00001074262,0.00003248983,0.00006840027,0.00003965475,0.0007847078],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001211141,"threshold_uncertainty_score":0.005645752,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884858","doi":"10.37665/srybmzx48396","title":"Case Study - Head in Pillow Defect on a Plastic Ball Grid Array","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Experience-Based Knowledge Management","field":"Computer Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Schneider Electric (Canada)","funders":"","keywords":"Head (geology); Ball (mathematics); Grid; Field (mathematics); Product (mathematics)","authors":[{"name":"Henry Rekers","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0737687549705868,"gpt":0.3005829730579413,"spread":0.2268142180873545,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005827656,0.0006833965,0.0004565576,0.001375312,0.003024046,0.001190638,0.001467865,0.003573279,0.004472085],"category_scores_gemma":[0.003881559,0.0003528062,0.0004593287,0.000932991,0.001400388,0.0009426388,0.001338536,0.001842662,0.0008841652],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001336439,"about_ca_system_score_gemma":0.0008711074,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.007966471,"about_ca_topic_score_gemma":0.0133471,"domain_scores_codex":[0.9988821,0.0002879452,0.00008687595,0.0001144938,0.0003807076,0.0002478144],"domain_scores_gemma":[0.997542,0.001159544,0.0003041105,0.0001874305,0.000326878,0.0004800789],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"case_report","study_design_gemma":"case_report","study_design_scores_codex":[0.0001723373,0.001115495,0.0209381,0.0003617826,0.00003309991,0.8995585,0.03160093,0.002118728,0.004280717,0.002347365,0.00750251,0.02997043],"study_design_scores_gemma":[0.00004013074,0.0009073205,0.01749707,0.0003045764,0.00006375161,0.8494547,0.06876423,0.005193067,0.01881634,0.002356898,0.03648757,0.0001143158],"study_design_candidate":"case_report","study_design_consensus":"case_report","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9695497,0.0005997975,0.009411636,0.004699214,0.0002315475,0.0003216872,0.0002428614,0.0002008779,0.01474269],"genre_scores_gemma":[0.98375,0.0004844039,0.004939395,0.0008322604,0.0001156549,0.00003832116,0.0000782252,0.00005405052,0.00970768],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.007966471,"threshold_uncertainty_score":0.01584017,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884882","doi":"10.37665/srapppj97513","title":"Characterization of Solvus in Ternary and Quaternary Bismuth Containing Solder Alloys","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Solvus; Microstructure; Soldering; Differential scanning calorimetry; Precipitation; Ternary operation; Bismuth; Precipitation hardening","authors":[{"name":"Ivan Matijevic","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"Polina Snugovsky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01370989250854188,"gpt":0.2225805599305012,"spread":0.2088706674219594,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001826067,0.0001382582,0.0001701978,0.000652021,0.0001928703,0.0003188635,0.0002061764,0.0002193444,0.0006467504],"category_scores_gemma":[0.0003953319,0.0001150678,0.000093626,0.0003606141,0.0002301657,0.0001827928,0.0001515706,0.0001364911,0.000146675],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001812915,"about_ca_system_score_gemma":0.0001167424,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008538691,"about_ca_topic_score_gemma":0.001549125,"domain_scores_codex":[0.9998578,0.00001768766,0.00001454696,0.00002675562,0.00006688915,0.0000163042],"domain_scores_gemma":[0.9997385,0.00002757733,0.0000634481,0.00001829836,0.000128212,0.0000239311],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00006518669,0.00000837681,0.001248942,0.00002774795,0.000003288349,0.00003846166,0.00007133521,0.0001548501,0.996397,0.00009366505,0.00001844116,0.001872702],"study_design_scores_gemma":[0.000002528024,0.0001705302,0.009972033,0.000003731064,0.000008794225,0.0001039963,0.00005948606,0.002446763,0.98667,0.00003340986,0.0005241626,0.000004597141],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9969789,0.0002591956,0.001924196,0.000009638772,0.000006572853,0.000007075515,0.00007837019,0.00003248256,0.0007036158],"genre_scores_gemma":[0.9979743,0.00008409781,0.001227718,0.000005619509,0.00000210007,0.000005903293,0.00006378524,0.000009434317,0.0006270104],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0008538691,"threshold_uncertainty_score":0.002163589,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884906","doi":"10.37665/srexdqs79549","title":"Assembly Feasibility and Property Evaluation of Low Ag, Bi-Containing Solder Alloys","year":2012,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Ball grid array; Soldering; Alloy; Solder paste; Melting temperature; Fusible alloy; Melting point","authors":[{"name":"Eva Kosiba","is_ca":false},{"name":"Simin Bagheri","is_ca":false},{"name":"Zohreh Bagheri","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05841630123061495,"gpt":0.2888631866068093,"spread":0.2304468853761943,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003751681,0.0003483865,0.0001728634,0.0003963777,0.0002319539,0.0003089192,0.0002733876,0.0003142842,0.0008776924],"category_scores_gemma":[0.0005166831,0.0001818738,0.0002018257,0.0002573473,0.00009462128,0.0002247778,0.0001371532,0.0001359476,0.0005386791],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001851924,"about_ca_system_score_gemma":0.0001160201,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005623102,"about_ca_topic_score_gemma":0.001004084,"domain_scores_codex":[0.9996774,0.00005498778,0.0000395246,0.00005452959,0.0001321324,0.00004140934],"domain_scores_gemma":[0.9996212,0.00004585677,0.00006543032,0.00004816397,0.00018619,0.0000332854],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000103225,0.00002247278,0.0007334155,0.00004425831,0.000005118368,0.00005827013,0.0000361754,0.0002079139,0.9969145,0.00002935485,0.00002963913,0.001815589],"study_design_scores_gemma":[0.000004928348,0.0007099293,0.003896959,0.000002750208,0.00002268424,0.00006029658,0.00002461572,0.001245338,0.9933106,0.000007616116,0.000710259,0.00000394603],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9962479,0.0003672259,0.002223348,0.00001105964,0.00001559921,0.00001720424,0.00005707869,0.00006864417,0.0009918878],"genre_scores_gemma":[0.9947173,0.0001123192,0.003439131,0.000005994028,0.000003755573,0.00001191167,0.0001350723,0.00002851097,0.001545921],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0008776924,"threshold_uncertainty_score":0.002936125,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885086","doi":"10.37665/sraacij89955","title":"Electroplate Bumping without Photoresist and Si Dice Stacking with TSV for 3D Packaging","year":2009,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Bumping; Electroplating; Wafer; Soldering; Plating (geology); Deep reactive-ion etching; Flip chip; Stacking; Silicon; Etching (microfabrication)","authors":[{"name":"Jiheon Jun","is_ca":false},{"name":"Inrak Kim","is_ca":false},{"name":"Younggon Lee","is_ca":false},{"name":"Jae Pil Jung","is_ca":false},{"name":"Sung Jun Hong","is_ca":false},{"name":"Y. Zhou","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01055276565661303,"gpt":0.2264232840041697,"spread":0.2158705183475567,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001360461,0.0004993884,0.0003193628,0.0002301007,0.0001269356,0.0002805572,0.0004389707,0.0003089174,0.0008325486],"category_scores_gemma":[0.000179064,0.0003562499,0.0003347442,0.0002010617,0.0001761791,0.0002481627,0.0002317507,0.0003579374,0.0003995851],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002280466,"about_ca_system_score_gemma":0.0001491345,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003069379,"about_ca_topic_score_gemma":0.0007228939,"domain_scores_codex":[0.9997639,0.00001590509,0.00001170959,0.00004726605,0.0001254133,0.00003584218],"domain_scores_gemma":[0.9998881,0.00001555349,0.00002840049,0.00003159885,0.00002740568,0.000009002785],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000008243658,0.000006268855,0.00006102233,0.00005520369,0.000005440827,0.00005484874,0.0000142322,0.0001914493,0.9962646,0.00006767498,0.00007719988,0.003193826],"study_design_scores_gemma":[0.000004391708,0.0001474921,0.001302194,0.000003897611,0.00001087215,0.0002065045,0.00001401584,0.001354031,0.9942377,0.00003012526,0.002682004,0.000006758261],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9378929,0.003247068,0.0509895,0.0001048226,0.0002439458,0.0001339468,0.0002923499,0.0007984041,0.006296993],"genre_scores_gemma":[0.9438511,0.001066559,0.05036938,0.00004807996,0.00002791216,0.00005898092,0.0002747582,0.00008606647,0.004217089],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0008325486,"threshold_uncertainty_score":0.002785206,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885281","doi":"10.37665/srcpfab74512","title":"Environmental Legislation that Export Oriented Canadian Electronics Manufacturers Should Take into Consideration","year":2010,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Recycling and Waste Management Techniques","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Legislation; Electronics; Face (sociological concept); Electronic equipment; Chemical industry","authors":[{"name":"Bev Christian","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0158801806601344,"gpt":0.2346161062125185,"spread":0.2187359255523841,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001234509,0.0003707142,0.0001699408,0.0008559977,0.006246436,0.002763732,0.0008895463,0.001911296,0.01700901],"category_scores_gemma":[0.002695121,0.0001797376,0.0004008668,0.0009232017,0.001484007,0.001058338,0.000716257,0.001936612,0.001357601],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.01186331,"about_ca_system_score_gemma":0.03907527,"about_ca_topic_candidate":true,"about_ca_topic_consensus":true,"about_ca_topic_score_codex":0.8742636,"about_ca_topic_score_gemma":0.9555097,"domain_scores_codex":[0.9977118,0.0001310644,0.00005857223,0.0001015603,0.001406523,0.0005905924],"domain_scores_gemma":[0.9948301,0.0004469353,0.0001745207,0.0001446768,0.004093202,0.0003104827],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001006095,0.0001588053,0.01519137,0.0008849761,0.00003261492,0.001655199,0.003569125,0.001623799,0.02297543,0.1146777,0.6204538,0.2186765],"study_design_scores_gemma":[0.000005655392,0.00002772443,0.01222432,0.000179318,0.00001761534,0.0001858819,0.002418943,0.00008383903,0.003863156,0.001567284,0.9793844,0.00004179602],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"other","genre_scores_codex":[0.0508647,0.005638626,0.003750235,0.1203527,0.002182611,0.0001867425,0.001043893,0.0005502487,0.8154302],"genre_scores_gemma":[0.3631999,0.01191382,0.01470309,0.07252728,0.0006122718,0.00009044973,0.00117253,0.0003312316,0.5354495],"genre_candidate":"other","genre_consensus":"other","teacher_disagreement_score":0.1257364,"threshold_uncertainty_score":0.2529536,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885114","doi":"10.37665/srzncwo16137","title":"Improved Dehydration for Moisture Sensitive Devices","year":2022,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Gas Sensing Nanomaterials and Sensors","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Moisture; Dehydration; Water content; Presentation (obstetrics)","authors":[{"name":"Mircea Capanu","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01273371495541906,"gpt":0.2190855739007208,"spread":0.2063518589453017,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001608288,0.000391155,0.0003707623,0.0001640362,0.0002766541,0.0004128367,0.0004309895,0.0002981477,0.005135948],"category_scores_gemma":[0.0003155422,0.0002190152,0.0002719904,0.0001390165,0.0001387824,0.0008126833,0.0005081929,0.0007207965,0.001373513],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002456307,"about_ca_system_score_gemma":0.0001538532,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004537775,"about_ca_topic_score_gemma":0.001395342,"domain_scores_codex":[0.9998809,0.000008527491,0.000006697799,0.00003327995,0.00004869304,0.0000218914],"domain_scores_gemma":[0.9999044,0.00001545755,0.00001384445,0.00001604016,0.00003905284,0.00001116113],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003605639,0.000025909,0.00007739706,0.0001296435,0.000005864221,0.0000387183,0.00002860443,0.0001935272,0.9888621,0.0003402875,0.001206761,0.009055099],"study_design_scores_gemma":[0.000007616853,0.000119278,0.0004325068,0.00001234019,0.00001196547,0.00009121784,0.00003148126,0.001427995,0.9832405,0.00007846301,0.0145363,0.00001031299],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8244598,0.01635355,0.1125605,0.001683815,0.002610751,0.0004670369,0.001433768,0.00326939,0.03716144],"genre_scores_gemma":[0.8960591,0.006326452,0.05133779,0.0008897511,0.000237843,0.0001435178,0.0009904276,0.0006184316,0.04339663],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.005135948,"threshold_uncertainty_score":0.01718146,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884838","doi":"10.37665/srhbzza99967","title":"Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys","year":2017,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Creep; Intermetallic; Microstructure; Soldering; Solvus; Alloy; Ostwald ripening","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"Polina Snugovsky","is_ca":false},{"name":"Ivan Matijevic","is_ca":true},{"name":"Jeff Kennedy","is_ca":false},{"name":"Marianne Romansky","is_ca":false},{"name":"David Hillman","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Joseph Juarez","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"L. Snugovsky","is_ca":true},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01559925427467096,"gpt":0.2395310476031419,"spread":0.223931793328471,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001467118,0.0002213144,0.000285735,0.0002220305,0.0001651964,0.000274372,0.000221481,0.0001704549,0.0009824656],"category_scores_gemma":[0.0001626033,0.0001594553,0.0001330639,0.0002275757,0.0001461435,0.0001644891,0.0002363859,0.0002248962,0.0002464031],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001572415,"about_ca_system_score_gemma":0.0001793439,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007129004,"about_ca_topic_score_gemma":0.001641139,"domain_scores_codex":[0.9998699,0.00001671585,0.00001168181,0.00002027909,0.00005148675,0.00002989365],"domain_scores_gemma":[0.9999119,0.000007352849,0.00003102448,0.00001172979,0.00002219483,0.00001578527],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007372853,0.00001833521,0.00008918362,0.00002297958,0.000002076841,0.00001876789,0.00001008828,0.00006348684,0.9985542,0.00002216914,0.000008266717,0.001116889],"study_design_scores_gemma":[0.000005145283,0.0003711225,0.002966431,0.000003435744,0.000009884478,0.00005059364,0.0000139585,0.000693319,0.9951717,0.000008851959,0.0007023609,0.000003234948],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9965149,0.0009784645,0.001452411,0.00001577227,0.00001703526,0.0000186332,0.00002686909,0.00005623879,0.0009196987],"genre_scores_gemma":[0.9960084,0.0002836414,0.002251746,0.0000155235,0.000004025271,0.00001070872,0.00004295584,0.00002364991,0.00135921],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009824656,"threshold_uncertainty_score":0.00328666,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884546","doi":"10.37665/sryfxiq90242","title":"Dielectric Material Damage Vs. Conductive Anodic Filament Formation","year":2013,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Intertek (Canada)","funders":"","keywords":"Soldering; Printed circuit board; Electrical conductor; Anode; Dielectric; Degradation (telecommunications); Capacitance; Material properties","authors":[{"name":"P. Reid","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01198775066906338,"gpt":0.2127350480690404,"spread":0.200747297399977,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002626008,0.0001768021,0.0002309945,0.0005434005,0.0001822609,0.0004591243,0.00020119,0.0003985424,0.002170995],"category_scores_gemma":[0.0008560601,0.0001240891,0.0001892937,0.0003895775,0.0001722244,0.0005003859,0.0002781256,0.0003078857,0.0003238135],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002782497,"about_ca_system_score_gemma":0.00006004787,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004890313,"about_ca_topic_score_gemma":0.0005886775,"domain_scores_codex":[0.9996958,0.00003453123,0.00001940136,0.00005237868,0.0001357323,0.00006222768],"domain_scores_gemma":[0.9986151,0.0005334606,0.0003722326,0.0000851454,0.0003033836,0.00009071273],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001120784,0.0001354812,0.0409595,0.0007339403,0.0001277906,0.001538058,0.0002478406,0.002120011,0.9100236,0.0003286195,0.0008887622,0.04177572],"study_design_scores_gemma":[0.00001758342,0.002757384,0.1812001,0.00007604326,0.0001922269,0.002939776,0.0004327681,0.007244576,0.7983248,0.0003768608,0.006411334,0.00002634994],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9854453,0.006186211,0.003127124,0.0000856671,0.00007504997,0.00005125095,0.0002280729,0.0001166561,0.004684696],"genre_scores_gemma":[0.9972498,0.0008211096,0.0005130293,0.00003764756,0.00001530044,0.000009215117,0.00009272916,0.000009448286,0.001251674],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002170995,"threshold_uncertainty_score":0.007262766,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885151","doi":"10.37665/srahixg72986","title":"Microstructures Resulting from the Use of Solder Balls of One Composition with Paste of a Different Composition on a Copper Substrate","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Eutectic system; Microstructure; Soldering; Copper; Solder paste; Substrate (aquarium); Melting point; Dissolution","authors":[{"name":"L. Snugovsky","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"J. W. Rutter","is_ca":true},{"name":"Polina Snugovsky","is_ca":false},{"name":"Simin Bagheri","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03674950154234356,"gpt":0.2165554260465185,"spread":0.179805924504175,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002335247,0.0002724966,0.0003246435,0.0005295898,0.0001542045,0.0002526849,0.0002982501,0.000361785,0.0008519373],"category_scores_gemma":[0.0005493943,0.0004844345,0.0002594344,0.0003420384,0.0003201322,0.0001928377,0.0001906197,0.0002409763,0.0001881426],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002693774,"about_ca_system_score_gemma":0.00009582112,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007847594,"about_ca_topic_score_gemma":0.001462487,"domain_scores_codex":[0.9996551,0.00003621449,0.00003127326,0.000088312,0.0001404948,0.0000486061],"domain_scores_gemma":[0.9995651,0.00007204005,0.00009274302,0.0000783543,0.0001423588,0.00004938903],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00004064017,0.000005112002,0.0002505016,0.00002114034,0.000005556349,0.00006809064,0.00002260364,0.00005627062,0.9990759,0.00001222467,0.000007430744,0.0004345324],"study_design_scores_gemma":[0.00000946046,0.0003222129,0.01871813,0.000004950013,0.00003103306,0.0002277392,0.00005207498,0.0006208575,0.9794988,0.00001190195,0.0004965664,0.000006283643],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9972484,0.0002833909,0.001781355,0.00001143794,0.00001769633,0.00001809187,0.00008791967,0.00006338302,0.0004883085],"genre_scores_gemma":[0.994499,0.0001403846,0.004157716,0.00001680201,0.000004708635,0.00002078217,0.0001575785,0.00004695879,0.0009560231],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0008519373,"threshold_uncertainty_score":0.002849996,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884455","doi":"10.37665/srbsvxm70659","title":"Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Conducting polymers and applications","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Waterloo","funders":"","keywords":"Nanofiber; Adhesive; Electrical conductor; Soldering; Nanocomposite; Polypyrrole; Electrically conductive","authors":[{"name":"Wei Zhang","is_ca":true},{"name":"Behnam Meschi Amoli","is_ca":true},{"name":"Jeffrey d’Eon","is_ca":true},{"name":"Boxin Zhao","is_ca":true},{"name":"Alex Chen","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0513788350279509,"gpt":0.3003666635653641,"spread":0.2489878285374132,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001459101,0.0005080861,0.0001313371,0.0002737702,0.0001251566,0.0002110546,0.0001825886,0.0003404584,0.0004230794],"category_scores_gemma":[0.0001461739,0.0001567275,0.0001714713,0.0001240526,0.0001013284,0.0002667191,0.0001538605,0.0002283969,0.0001685949],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001577628,"about_ca_system_score_gemma":0.00007013157,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002114164,"about_ca_topic_score_gemma":0.0004784263,"domain_scores_codex":[0.9999113,0.00001170797,0.000007534682,0.00003008807,0.00002491973,0.00001443651],"domain_scores_gemma":[0.9998839,0.00002392491,0.00003828232,0.000008533032,0.0000266924,0.00001871066],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000006488102,0.000005908499,0.00002572396,0.00002595498,0.000002015154,0.00003281574,0.000004687738,0.0000395058,0.9988972,0.00002883322,0.00001170408,0.0009191794],"study_design_scores_gemma":[0.000003135558,0.00006731359,0.0004249482,0.00000225248,0.000005866699,0.00008752563,0.000006295923,0.0006905535,0.9977618,0.000009212034,0.0009379447,0.000003263323],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9844611,0.002998468,0.01034419,0.00007648484,0.00006722204,0.00003874954,0.00008663529,0.000109476,0.001817621],"genre_scores_gemma":[0.9879737,0.0007402707,0.009940054,0.00002317336,0.00001275523,0.00002086956,0.00003275606,0.000009798957,0.001246612],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0005080861,"threshold_uncertainty_score":0.001415312,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884863","doi":"10.37665/srwvmae67974","title":"The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-Rich Alloys","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Alloy; Rockwell scale; Carbide; Scanning electron microscope","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"Polina Snugovsky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0167763599922387,"gpt":0.2142631200061217,"spread":0.197486760013883,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003377849,0.0002108322,0.0003356673,0.0004497094,0.0002495802,0.0002365525,0.0002053933,0.0002236659,0.000719183],"category_scores_gemma":[0.0004860529,0.0001965654,0.0001730553,0.0002565305,0.0002074582,0.0002163127,0.0001631298,0.0001515472,0.0001687483],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002549712,"about_ca_system_score_gemma":0.0001163319,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00184506,"about_ca_topic_score_gemma":0.003389566,"domain_scores_codex":[0.9997209,0.00006240438,0.00003140347,0.0000387651,0.0001028206,0.00004360747],"domain_scores_gemma":[0.9996105,0.0000426847,0.00008902026,0.00003469808,0.0001818936,0.0000413329],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0004114315,0.000027752,0.00395452,0.00005703558,0.00002851367,0.00007920396,0.00006574754,0.0004130221,0.9921528,0.00003358017,0.00003221349,0.002744114],"study_design_scores_gemma":[0.00001714016,0.001405786,0.1384116,0.00001321701,0.00009644333,0.0002631486,0.0001696709,0.002748077,0.8551173,0.00004504144,0.001694527,0.00001794636],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9983636,0.0008264639,0.0003067341,0.000007727142,0.0000102022,0.000005801415,0.00006011059,0.00001322674,0.000406239],"genre_scores_gemma":[0.9988565,0.0001612407,0.0003121714,0.00001151477,0.000003888593,0.000005824375,0.00009465643,0.000008922352,0.0005451667],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00184506,"threshold_uncertainty_score":0.003668666,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885449","doi":"10.37665/srbtame35156","title":"Two Methods of Evaluating a Printed Wiring Board’s Dielectric Performance in a Lead Free Assembly Environment","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Intertek (Canada)","funders":"","keywords":"Rework; Reliability (semiconductor); Delamination (geology); Plating (geology); Test method; Printed circuit board; Quality (philosophy); Dielectric","authors":[{"name":"Paul B. Reid","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0419782895807453,"gpt":0.3063671222416546,"spread":0.2643888326609093,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008305419,0.0006806919,0.0002678166,0.001821024,0.0002634211,0.0005103396,0.0005246483,0.0003871949,0.001132375],"category_scores_gemma":[0.001546217,0.000277623,0.0002206074,0.0008473034,0.0003574503,0.0004260834,0.0004878746,0.0003670886,0.0003947282],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003043541,"about_ca_system_score_gemma":0.0001343775,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004997546,"about_ca_topic_score_gemma":0.001166742,"domain_scores_codex":[0.9987343,0.000301361,0.00007751002,0.0001591968,0.0006633886,0.00006423209],"domain_scores_gemma":[0.9975666,0.0006610546,0.0004472439,0.0002728963,0.0009424187,0.0001097673],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006985693,0.0001591625,0.009659481,0.0002146892,0.00004753375,0.0001936757,0.0002476077,0.002119471,0.9410868,0.0002848271,0.000139857,0.04514829],"study_design_scores_gemma":[0.00001910693,0.001636047,0.02467238,0.00001642813,0.00003973316,0.0003783922,0.0001255592,0.01060214,0.9612361,0.0001220397,0.001106861,0.00004529632],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"methods","genre_scores_codex":[0.8973897,0.001238197,0.09726435,0.0000361655,0.00007436825,0.0001294728,0.0002237761,0.0004832238,0.003160832],"genre_scores_gemma":[0.9424964,0.0003667512,0.05422299,0.00003007327,0.0000137199,0.0001184619,0.0001633622,0.00004850194,0.002539817],"genre_candidate":"methods","genre_consensus":null,"teacher_disagreement_score":0.001821024,"threshold_uncertainty_score":0.004392385,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884512","doi":"10.37665/srxvnif74622","title":"Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys","year":2013,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Microstructure; Reliability (semiconductor); Temperature cycling; Alloy; Electronic packaging; Electronics","authors":[{"name":"Eva Kosiba","is_ca":false},{"name":"Simin Bagheri","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.008839019141546781,"gpt":0.2157415179447142,"spread":0.2069024988031674,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002094635,0.0001727377,0.0001609189,0.0005226284,0.0002210001,0.0002120792,0.0003173763,0.000274557,0.0008581831],"category_scores_gemma":[0.0003185418,0.0001616937,0.000129212,0.0003419429,0.0001549318,0.0001469497,0.0001042772,0.0001201077,0.0002261981],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000302584,"about_ca_system_score_gemma":0.0001524206,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002918146,"about_ca_topic_score_gemma":0.003839785,"domain_scores_codex":[0.9997583,0.00003300055,0.00001928039,0.00004076282,0.0001162807,0.00003235883],"domain_scores_gemma":[0.9996763,0.00002178203,0.00004314546,0.00002366486,0.0002124447,0.00002261746],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003135976,0.00003541851,0.002499972,0.00003695228,0.000007554857,0.00008881137,0.00006302031,0.000790467,0.994153,0.00005289128,0.00006034,0.001898002],"study_design_scores_gemma":[0.00001467374,0.001818217,0.04873946,0.000008575375,0.00003926499,0.0002345815,0.0001212832,0.005797777,0.9421071,0.00003242844,0.001074791,0.00001177289],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9989895,0.0001646389,0.0003113625,0.000003977866,0.000004769044,0.000005453846,0.00006115593,0.00001753613,0.0004416099],"genre_scores_gemma":[0.9985973,0.00004894379,0.0004213282,0.000003231091,0.000001317458,0.000005653754,0.0001061506,0.000006016696,0.0008100633],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002918146,"threshold_uncertainty_score":0.005802274,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885374","doi":"10.37665/srrsbli35892","title":"Investigation of a Connector Electrical Failure","year":2010,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Interface Biologics (Canada); North Toronto Eye Care","funders":"","keywords":"Cable gland; Soldering; Potting; Coating; Electrical contacts; Stack (abstract data type); Catastrophic failure; Solder paste","authors":[{"name":"P. Arrowsmith","is_ca":true},{"name":"Al Hawley","is_ca":false},{"name":"Prakash Kapadia","is_ca":false},{"name":"Mustafa Al-Salman","is_ca":false},{"name":"R. N. S. Sodhi","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01245177984892095,"gpt":0.2165319519998465,"spread":0.2040801721509255,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003545028,0.0004160849,0.0002954299,0.001770702,0.0004127049,0.0003372318,0.0003431557,0.0005599383,0.00296668],"category_scores_gemma":[0.0007852453,0.000158441,0.00018696,0.000782439,0.0003548693,0.0003254758,0.0003605842,0.0003441221,0.0006546901],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000301073,"about_ca_system_score_gemma":0.000182112,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001502339,"about_ca_topic_score_gemma":0.001261125,"domain_scores_codex":[0.999588,0.00004942263,0.00001832701,0.00006242316,0.0002309028,0.00005093737],"domain_scores_gemma":[0.9990836,0.0001653004,0.00009435113,0.0001192455,0.0004738397,0.00006356741],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"case_report","study_design_scores_codex":[0.0003011147,0.00007644962,0.02268211,0.0002028177,0.00001550686,0.002773386,0.0003671462,0.0006655447,0.9415105,0.0002173281,0.0007373371,0.03045077],"study_design_scores_gemma":[0.00002942753,0.002989272,0.2228699,0.00003158706,0.0000733128,0.005798835,0.0006177465,0.01235822,0.7442388,0.0001633517,0.01078087,0.00004874696],"study_design_candidate":"case_report","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9866228,0.0006099065,0.008723295,0.00004885543,0.00004745931,0.00004886642,0.0002285964,0.000389191,0.003281021],"genre_scores_gemma":[0.9958459,0.000119536,0.001911871,0.0000269009,0.000007027726,0.000007888,0.0002610403,0.00002502375,0.001794855],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00296668,"threshold_uncertainty_score":0.009924531,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885036","doi":"10.37665/srmqrka94151","title":"Device Sensitivity to Post Solder Attach Processes","year":2011,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Surface-mount technology; Soldering; Electronics; SMT placement equipment; Printed circuit board; Electronic component; Process (computing); Reliability (semiconductor); Electronic packaging","authors":[{"name":"Curtis Grosskopf","is_ca":false},{"name":"Paul Krystek","is_ca":false},{"name":"Giacomo Catucci","is_ca":false},{"name":"Michael Lauri","is_ca":false},{"name":"A. K. S. Ang","is_ca":false},{"name":"W. Löw","is_ca":false},{"name":"Matt Kelly","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03310342092758268,"gpt":0.2468211244550768,"spread":0.2137177035274941,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008408958,0.0005055013,0.0004728184,0.0009889379,0.0003750934,0.0008589771,0.0009602088,0.0009121756,0.005343804],"category_scores_gemma":[0.003486892,0.0003470041,0.0004450421,0.0006894391,0.0002706138,0.0008507359,0.0006373012,0.0005876088,0.001621186],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007082272,"about_ca_system_score_gemma":0.0002119755,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007394821,"about_ca_topic_score_gemma":0.0009004059,"domain_scores_codex":[0.9980285,0.0001638546,0.000130918,0.0004950172,0.0009740182,0.0002076922],"domain_scores_gemma":[0.9967134,0.001125286,0.0004282113,0.0006714927,0.0009845222,0.00007715044],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0006517186,0.0001487482,0.016807,0.0005471341,0.0001525971,0.0009305645,0.000660326,0.006459006,0.9247509,0.001197907,0.002864909,0.04482915],"study_design_scores_gemma":[0.00001294821,0.001613717,0.02392979,0.00004978889,0.0001118001,0.0007385475,0.000209009,0.01185534,0.949903,0.0003018042,0.01122716,0.00004725683],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9653755,0.002988425,0.01475191,0.0004109249,0.0008568626,0.0002312059,0.002648751,0.002034405,0.01070196],"genre_scores_gemma":[0.9913413,0.000397519,0.002192803,0.000161084,0.00004250956,0.00005529771,0.001065651,0.0001266132,0.004617169],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.005343804,"threshold_uncertainty_score":0.0178768,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884954","doi":"10.37665/srhixpf48764","title":"Microstructural Improvements of SAC Alloys with Bi Additions During Accelerated Thermal Cycling","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto; Canadian Celiac Association","funders":"","keywords":"Temperature cycling; Microstructure; Eutectic system; Alloy; Soldering; Thermal","authors":[{"name":"Eva Kosiba","is_ca":false},{"name":"Polina Snugovsky","is_ca":true},{"name":"John McMahon","is_ca":true},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0125462648776572,"gpt":0.2214875022092574,"spread":0.2089412373316002,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001258766,0.0002284771,0.0002185661,0.0003437995,0.0001964351,0.0002915657,0.0002289917,0.0002271224,0.00131708],"category_scores_gemma":[0.0003146836,0.0002047895,0.0001163859,0.0002903778,0.000177996,0.0001947164,0.0001286948,0.0001674752,0.0002642678],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001799086,"about_ca_system_score_gemma":0.0001801331,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001682939,"about_ca_topic_score_gemma":0.003854282,"domain_scores_codex":[0.9998766,0.00001181335,0.000009061436,0.00002103725,0.000055869,0.00002559626],"domain_scores_gemma":[0.9998286,0.00002087695,0.00003563101,0.00001840853,0.00007709565,0.00001940033],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002163771,0.0000141797,0.0005211323,0.0000332724,0.000004719048,0.00005026163,0.00005213743,0.0003024731,0.9966556,0.00003540113,0.00003915933,0.002075224],"study_design_scores_gemma":[0.00001016906,0.000653823,0.01520522,0.000006113093,0.00002312077,0.0000832973,0.00008407368,0.001667195,0.980904,0.00002076295,0.001334781,0.000007271812],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9982565,0.0003172878,0.0003175921,0.00001225926,0.00001073729,0.000007715276,0.00009377124,0.00004036245,0.0009438106],"genre_scores_gemma":[0.9976273,0.0001208213,0.0005309088,0.000006471183,0.000004045463,0.000008634941,0.00009895926,0.0000196549,0.001583211],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001682939,"threshold_uncertainty_score":0.004406095,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884800","doi":"10.37665/srlytfn28917","title":"Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Variety (cybernetics); Printed circuit board; Flash (photography); Component (thermodynamics); Integrated circuit; Computer data storage; Class (philosophy); Flash memory; Reliability (semiconductor)","authors":[{"name":"Matt Kelly","is_ca":true},{"name":"Mark Jeanson","is_ca":false},{"name":"Timothy Younger","is_ca":false},{"name":"Jim Bielick","is_ca":false},{"name":"Theron Lewis","is_ca":false},{"name":"Mitch Ferrill","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02888450832714165,"gpt":0.2381083751604874,"spread":0.2092238668333457,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003989196,0.0005242012,0.0002179111,0.0005210059,0.0003344941,0.001327599,0.001350993,0.0006933635,0.009673195],"category_scores_gemma":[0.0007720804,0.0002363791,0.0002346109,0.0002625738,0.0002205824,0.0008998887,0.0004837056,0.0004280448,0.002591811],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005994419,"about_ca_system_score_gemma":0.0004110822,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007772127,"about_ca_topic_score_gemma":0.001455759,"domain_scores_codex":[0.9996582,0.00007404172,0.00001641681,0.0000518596,0.0001272133,0.00007214688],"domain_scores_gemma":[0.9993255,0.00007813371,0.0000821941,0.0001148699,0.0003284505,0.00007085913],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"theoretical_or_conceptual","study_design_scores_codex":[0.001166191,0.0003687888,0.009686397,0.001922643,0.0001538471,0.00242562,0.000656364,0.09329614,0.4709939,0.06235669,0.05291568,0.3040578],"study_design_scores_gemma":[0.0001784672,0.005164303,0.01199587,0.0003336853,0.0003191519,0.004128016,0.0007609281,0.3729644,0.2624606,0.009895699,0.3316681,0.0001307821],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.3942759,0.003101043,0.4253757,0.002984121,0.001570638,0.0007072778,0.0008090094,0.009514899,0.1616615],"genre_scores_gemma":[0.9054302,0.0003942935,0.06786162,0.000328861,0.00008350882,0.00008366418,0.0001849781,0.0004201782,0.02521266],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.009673195,"threshold_uncertainty_score":0.03236008,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884911","doi":"10.37665/srsmqdf66744","title":"Microstructural Evaluation of Low and No-Ag, Bi-Containing Pb-Free Solders","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Eutectic system; Microstructure; Supercooling; Alloy; Solder paste; Ball grid array; Joint (building)","authors":[{"name":"Eva Kosiba","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03448871134688929,"gpt":0.2642768257024994,"spread":0.2297881143556101,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001582995,0.0001264241,0.0001293048,0.0004864617,0.0001964101,0.0002365143,0.000151049,0.0001982076,0.0008614899],"category_scores_gemma":[0.0002772117,0.0001399282,0.0001028725,0.0001969156,0.000235467,0.0001704937,0.0001295545,0.0001495305,0.0001307826],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001804709,"about_ca_system_score_gemma":0.000103388,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001453077,"about_ca_topic_score_gemma":0.003117624,"domain_scores_codex":[0.9998376,0.00001515759,0.00001063498,0.00002347184,0.00009335753,0.00001981351],"domain_scores_gemma":[0.9997842,0.00004255059,0.00003781883,0.00001979656,0.00009443178,0.00002137703],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007441216,0.00001115849,0.0009206239,0.00002890534,0.000003569801,0.00004320039,0.00004638156,0.000516707,0.996733,0.00004956403,0.00001426991,0.001558287],"study_design_scores_gemma":[0.000006484897,0.0003421038,0.02968894,0.00000460228,0.00002145583,0.0001935312,0.0001051048,0.003509472,0.9653872,0.00002817832,0.0007069523,0.000006160822],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.996729,0.0002590338,0.001834258,0.000005941506,0.000004961304,0.00001085545,0.00007270308,0.00003895842,0.001044356],"genre_scores_gemma":[0.998275,0.00004049853,0.00110325,0.000003574452,0.000001375259,0.000005045969,0.00005624734,0.000008884122,0.000506168],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001453077,"threshold_uncertainty_score":0.002889276,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885111","doi":"10.37665/srwkwai63018","title":"Ultra Thin Fluorinated Polymer Coating for Protection of LED and Electronics","year":2018,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Structural Analysis of Composite Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"3M (Canada)","funders":"","keywords":"Coating; Polymer; Compatibility (geochemistry); Corrosion; Electronics; Conformal coating; Curing (chemistry); Salt spray test; Printed circuit board","authors":[{"name":"Greg Marszalek","is_ca":false},{"name":"Weixing Hou","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01296400393173835,"gpt":0.2361787332868134,"spread":0.223214729355075,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002188236,0.0003208756,0.0001579461,0.0003132471,0.000199438,0.0002742135,0.0002671337,0.000436235,0.001796397],"category_scores_gemma":[0.0003743714,0.0001407526,0.000259359,0.0001928657,0.000122579,0.000277303,0.0001648047,0.000256389,0.0003765352],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002502789,"about_ca_system_score_gemma":0.0001998549,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007754272,"about_ca_topic_score_gemma":0.001004189,"domain_scores_codex":[0.9997752,0.00002127791,0.00001197351,0.00003960431,0.0001258187,0.00002617113],"domain_scores_gemma":[0.9997641,0.00004706329,0.00005456241,0.00002296317,0.00009261634,0.00001858947],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002520579,0.00001349076,0.0004613521,0.00008565347,0.000004193724,0.00007717084,0.00002254858,0.000203859,0.9890119,0.0001075251,0.0001635464,0.009823386],"study_design_scores_gemma":[0.000003894536,0.0003761463,0.004283365,0.00001597182,0.00001470826,0.0004203106,0.00001876971,0.00120254,0.9882239,0.00004042371,0.005391311,0.000008505265],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9273658,0.006394431,0.05227088,0.0002177595,0.0002361647,0.0001193738,0.0003110764,0.0005333045,0.01255122],"genre_scores_gemma":[0.9722947,0.001527105,0.01936496,0.00008915922,0.00001904059,0.0000214296,0.0001546635,0.00004657763,0.006482437],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001796397,"threshold_uncertainty_score":0.006009519,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884894","doi":"10.37665/srhazdj41438","title":"Comparing Mechanical and Soldering Properties of Castin™, Babbitt and Alternative Lead-Free Alloys","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"McGill University","funders":"","keywords":"Soldering; Babbitt; Creep; Wetting; Alloy; Ultimate tensile strength","authors":[{"name":"Mehran Maalekian","is_ca":false},{"name":"Yuan Xu","is_ca":false},{"name":"Amir Hossein Nobari","is_ca":true},{"name":"Karl Seelig","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.07032399713195124,"gpt":0.2436391330806808,"spread":0.1733151359487296,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003342069,0.0004185411,0.0003942919,0.0008115225,0.0001469826,0.0003144715,0.0003057069,0.0003494444,0.001199893],"category_scores_gemma":[0.000738355,0.0001874713,0.0002718999,0.0005146602,0.0001736443,0.0002747528,0.0002026804,0.000134177,0.0004023149],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000153921,"about_ca_system_score_gemma":0.0001131474,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000431899,"about_ca_topic_score_gemma":0.001060697,"domain_scores_codex":[0.9993383,0.0001122882,0.00005933742,0.00006819978,0.0003769625,0.00004486646],"domain_scores_gemma":[0.999598,0.00005316423,0.00006672786,0.00004429711,0.0001882727,0.00004961163],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001421556,0.0000952672,0.005038621,0.0003537112,0.00009712255,0.000244489,0.0001565697,0.001737903,0.9714184,0.0001750767,0.0001494033,0.01911182],"study_design_scores_gemma":[0.00007414985,0.009080235,0.039528,0.00003208229,0.000262032,0.001075637,0.0002664987,0.004258606,0.9380915,0.00009577208,0.007194839,0.00004072231],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9963617,0.001554867,0.0009918557,0.00001764785,0.00003248048,0.00001178323,0.0000672451,0.00003295948,0.000929579],"genre_scores_gemma":[0.9957349,0.0004878516,0.001749724,0.00001098759,0.00001014883,0.00001110347,0.0001904785,0.00002008031,0.001784743],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001199893,"threshold_uncertainty_score":0.004014075,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885094","doi":"10.37665/srqxgvf57000","title":"Fine Feature Stencil Printing 0.3mm Pitch Components","year":2009,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Stencil; Miniaturization; Solder paste; Feature (linguistics); Electronic component; Process (computing); Component (thermodynamics)","authors":[{"name":"Chris Anglin","is_ca":false},{"name":"Ed Briggs","is_ca":false},{"name":"Ron Lasky","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02033796615497261,"gpt":0.2248821747381652,"spread":0.2045442085831926,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002249805,0.0002281031,0.0002206604,0.0002657543,0.0001278091,0.0004276633,0.0002194753,0.0003173929,0.003557605],"category_scores_gemma":[0.0006252298,0.0001161944,0.0001535552,0.000232707,0.0001841452,0.0003514792,0.0001643073,0.0002267193,0.0007611227],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001984463,"about_ca_system_score_gemma":0.00008771328,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003054648,"about_ca_topic_score_gemma":0.0006653459,"domain_scores_codex":[0.999791,0.00001093492,0.00001607037,0.00003086704,0.0001265057,0.00002465737],"domain_scores_gemma":[0.9994662,0.0001294853,0.0001262775,0.0001150777,0.000133407,0.00002951059],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00007043357,0.00003364204,0.0004882717,0.0000861467,0.000005797468,0.0002371316,0.00005272821,0.001023848,0.9829617,0.000344447,0.0003156168,0.01438029],"study_design_scores_gemma":[0.000007561678,0.0003486703,0.003110965,0.00000601839,0.000007306363,0.0002387213,0.0000252263,0.00270607,0.989108,0.0001013657,0.004329573,0.00001055296],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9467964,0.0009127107,0.03526492,0.0001141823,0.0002575977,0.0001600551,0.0003871311,0.001662588,0.01444445],"genre_scores_gemma":[0.967501,0.0001654458,0.02456656,0.00003366509,0.00001137645,0.00002165475,0.0001063234,0.00009235937,0.007501679],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003557605,"threshold_uncertainty_score":0.01190132,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884552","doi":"10.37665/srqmrkk46393","title":"Microstructure and Hardness of Bi-Containing Solder Alloys After Solidification and Ageing","year":2014,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Rockwell scale; Soldering; Alloy; Precipitation hardening; Quenching (fluorescence); Indentation hardness; Hardening (computing)","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"L. Snugovsky","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Eva Kosiba","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009142957653681356,"gpt":0.2164068103525518,"spread":0.2072638526988704,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001613661,0.0001397027,0.0002338447,0.0005587424,0.0001762411,0.0002618254,0.0001577571,0.0002500186,0.001187608],"category_scores_gemma":[0.0003105874,0.0001829138,0.0001527764,0.000401171,0.0001975759,0.0002241606,0.0001290918,0.0001590492,0.0002937084],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002455043,"about_ca_system_score_gemma":0.00008134662,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001794642,"about_ca_topic_score_gemma":0.002137062,"domain_scores_codex":[0.9998255,0.00001676101,0.00001292116,0.00002529621,0.00009843808,0.00002114112],"domain_scores_gemma":[0.9997426,0.00002688987,0.00005837766,0.00002344104,0.0001217662,0.00002693348],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001602446,0.00000990513,0.002304305,0.00003234547,0.000008160639,0.00009382736,0.00008955434,0.0001623679,0.9955168,0.00002730112,0.00002440039,0.001570829],"study_design_scores_gemma":[0.00001638243,0.0009140231,0.3228638,0.00000921313,0.00005598563,0.0005237405,0.0002465303,0.002461533,0.6710362,0.00005011489,0.001798215,0.00002424988],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9984856,0.0003617915,0.0004183624,0.000005070654,0.000006101334,0.000005345463,0.0001198145,0.00001691156,0.000581068],"genre_scores_gemma":[0.9976498,0.0001060245,0.0003748398,0.000005977876,0.00000376847,0.000006512948,0.0002332598,0.00001219853,0.00160758],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001794642,"threshold_uncertainty_score":0.003973007,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884595","doi":"10.37665/srnphdv26679","title":"Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation","year":2014,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Conformal coating; Tin; Nanoparticle; Microstructure; Ultimate tensile strength","authors":[{"name":"Junghyun Cho","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Suraj Maganty","is_ca":false},{"name":"Dale Starkey","is_ca":false},{"name":"Mario A. Goméz","is_ca":false},{"name":"David G. Edwards","is_ca":false},{"name":"Abdullah Ekin","is_ca":false},{"name":"Kevin Elsken","is_ca":false},{"name":"Jason Keeping","is_ca":true},{"name":"Polina Snugovsky","is_ca":true},{"name":"Jeff Kennedy","is_ca":true},{"name":"Marianne Romansky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01061779101293506,"gpt":0.213873587798777,"spread":0.203255796785842,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001101726,0.0002433871,0.0001264568,0.0001637627,0.0000980503,0.0001807363,0.0001608443,0.0001792972,0.0006228405],"category_scores_gemma":[0.0002296499,0.0001397973,0.0001514696,0.00009390632,0.0001293936,0.0001748,0.0001505793,0.0002007529,0.0001590635],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001302408,"about_ca_system_score_gemma":0.00007609791,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004119573,"about_ca_topic_score_gemma":0.0009536553,"domain_scores_codex":[0.9999006,0.00001073856,0.000006362707,0.00002418043,0.000041778,0.00001647308],"domain_scores_gemma":[0.9998478,0.00003201494,0.00004887235,0.00002099884,0.00003166762,0.00001858158],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0000149433,0.000009813474,0.0000502097,0.00001990404,0.000002030908,0.00001370403,0.000007388817,0.0001073145,0.9986327,0.00001977821,0.00001772286,0.001104405],"study_design_scores_gemma":[0.000002112595,0.00008556723,0.000341234,0.000001145041,0.000003948951,0.00001648164,0.000004206552,0.0006478773,0.9985849,0.000004065164,0.0003069106,0.000001654846],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9940799,0.0006199616,0.003918549,0.00002184949,0.00003629615,0.00001705595,0.00002881367,0.00008410728,0.001193499],"genre_scores_gemma":[0.9952414,0.0002072343,0.003548402,0.00001572593,0.000006781349,0.000007748725,0.00002229175,0.00001958315,0.0009308758],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0006228405,"threshold_uncertainty_score":0.0020836,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885440","doi":"10.37665/srtieqg12046","title":"Correlation of Wetting Forces and Solder Spread for Conditioned Enig Circuit Boards","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo; Blackberry (Canada)","funders":"","keywords":"Soldering; Wetting; Printed circuit board; Surface-mount technology; Positive correlation; Solder paste","authors":[{"name":"Bev Christian","is_ca":true},{"name":"Matthew Stevens","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02244336037278625,"gpt":0.2350926301965436,"spread":0.2126492698237573,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003587612,0.0003488071,0.0002366075,0.0006951384,0.0001371161,0.0003195998,0.000151051,0.0002871187,0.002552377],"category_scores_gemma":[0.0020835,0.0001928973,0.0001582579,0.0004323204,0.0002385185,0.00027605,0.0001646399,0.0003952399,0.0002185042],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000193391,"about_ca_system_score_gemma":0.00008867243,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001922256,"about_ca_topic_score_gemma":0.003591281,"domain_scores_codex":[0.9994481,0.00004892032,0.00003215897,0.00008231975,0.0003353798,0.00005301704],"domain_scores_gemma":[0.9985179,0.0005828381,0.0002974412,0.0001034227,0.0004078487,0.00009049653],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0006136133,0.0000840118,0.03703576,0.00004072767,0.0000657627,0.0002457756,0.0001049547,0.002108843,0.950238,0.0000451721,0.00005378904,0.009363608],"study_design_scores_gemma":[0.00001581501,0.0009783404,0.2532101,0.000007040068,0.00005645743,0.0002888693,0.0001232856,0.006335534,0.7384804,0.0000345124,0.0004441607,0.00002547776],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9990038,0.00007559005,0.0007102881,0.00000299966,0.000003750158,0.000003542883,0.00004929925,0.00001598265,0.0001347762],"genre_scores_gemma":[0.9985418,0.00004141977,0.0007424166,0.000004520397,0.000002112496,0.000003183482,0.0001224417,0.000008230838,0.0005337033],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002552377,"threshold_uncertainty_score":0.008538604,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885079","doi":"10.37665/srddpsp77036","title":"Confessions of a Neophyte in Temperature Profiling a Batch Reflow Oven","year":2009,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Heat Transfer and Numerical Methods","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Blackberry (Canada)","funders":"","keywords":"Thermocouple; Profiling (computer programming); Sample (material); Temperature measurement; Maximum temperature","authors":[{"name":"Bev Christian","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01791831585784271,"gpt":0.2883356046258009,"spread":0.2704172887679582,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.003606287,0.0003061546,0.00042318,0.0003898712,0.0008963754,0.001071527,0.0007314326,0.0006909842,0.001281958],"category_scores_gemma":[0.006211824,0.0003447357,0.0002573912,0.0002521682,0.0009466278,0.001447128,0.0008537027,0.001442665,0.000610018],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005947888,"about_ca_system_score_gemma":0.0002773802,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004239334,"about_ca_topic_score_gemma":0.001332139,"domain_scores_codex":[0.9980689,0.000457758,0.00007541423,0.0003447398,0.0008910993,0.0001621209],"domain_scores_gemma":[0.995997,0.001612267,0.0002022704,0.0008737502,0.001079266,0.0002354321],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.001125513,0.0001655714,0.005130641,0.0001387816,0.00004109024,0.0008084808,0.005213905,0.001448967,0.9188927,0.002612084,0.001532566,0.06288964],"study_design_scores_gemma":[0.00002626748,0.001476249,0.006532183,0.00002709499,0.00003423149,0.0008989022,0.00133538,0.004512449,0.9685841,0.0007912241,0.01572412,0.00005804577],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"commentary","genre_scores_codex":[0.9356611,0.0004498305,0.05699921,0.0006492582,0.0001551192,0.0001137559,0.00006222998,0.0003934545,0.005515998],"genre_scores_gemma":[0.9425432,0.0001499768,0.04314917,0.0002255758,0.00003360763,0.00008242752,0.00006650124,0.0004004912,0.01334911],"genre_candidate":"commentary","genre_consensus":null,"teacher_disagreement_score":0.003606287,"threshold_uncertainty_score":0.01907212,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884757","doi":"10.37665/srdteng22424","title":"How to Cope with the Next Wave in Substance Regulations","year":2011,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Photovoltaic Systems and Sustainability","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Intertek (Canada)","funders":"","keywords":"Directive; Carbon footprint; Conformity assessment; Sustainability; European union; Electronics; Legislature; Declaration; Hazardous waste","authors":[{"name":"Walter Jäger","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04281571616340393,"gpt":0.2161770390444017,"spread":0.1733613228809978,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0575695,0.001257257,0.001040743,0.002753678,0.005383952,0.01462907,0.004818074,0.02011853,0.01994852],"category_scores_gemma":[0.08841626,0.001340773,0.002717319,0.00147904,0.008636817,0.02401751,0.006635129,0.02245457,0.01324063],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.003757657,"about_ca_system_score_gemma":0.01893749,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.007040459,"about_ca_topic_score_gemma":0.005245944,"domain_scores_codex":[0.9473221,0.01359563,0.004859497,0.003654725,0.02735638,0.00321165],"domain_scores_gemma":[0.8655205,0.04242564,0.007871692,0.0212252,0.05646649,0.006490586],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00007574462,0.0005094823,0.003081857,0.0007323425,0.0001009541,0.001208722,0.0027951,0.003990268,0.006325273,0.2745726,0.4753001,0.2313075],"study_design_scores_gemma":[0.00002245333,0.0000940609,0.000714812,0.0004858304,0.00002553216,0.0005100995,0.001270768,0.0009394799,0.001890714,0.04530859,0.9486223,0.0001153969],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"commentary","genre_gemma":"commentary","genre_scores_codex":[0.01269527,0.008764002,0.1291799,0.6457365,0.03018216,0.0008414488,0.0004353758,0.003916753,0.1682485],"genre_scores_gemma":[0.09980378,0.01150339,0.2796982,0.3924601,0.01044818,0.00126572,0.001295718,0.002824877,0.2007001],"genre_candidate":"commentary","genre_consensus":"commentary","teacher_disagreement_score":0.0575695,"threshold_uncertainty_score":0.3044602,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884912","doi":"10.37665/srahbja97260","title":"Implementing PEDOT:PSS as a Co-Filler for Electrically Conductive Adhesive Applications","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Conducting polymers and applications","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Waterloo","funders":"","keywords":"Adhesive; Electrical conductor; Shear strength (soil); Soldering; Electrical resistivity and conductivity; Conductivity; Epoxy","authors":[{"name":"Josh Trinidad","is_ca":true},{"name":"Wei Zhang","is_ca":true},{"name":"Boxin Zhao","is_ca":true},{"name":"Alex Chen","is_ca":true},{"name":"John Persic","is_ca":false},{"name":"Robert Lyn","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03182651719541851,"gpt":0.3279295090844108,"spread":0.2961029918889923,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001763913,0.0006302864,0.0001969302,0.0003140895,0.0001591381,0.0003075621,0.00022273,0.0003951412,0.0004413057],"category_scores_gemma":[0.0002128742,0.0001948871,0.0002305775,0.000217096,0.0001559532,0.0003758103,0.0001962992,0.0002650177,0.0003335649],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001515977,"about_ca_system_score_gemma":0.0001262971,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000304794,"about_ca_topic_score_gemma":0.000631195,"domain_scores_codex":[0.9998807,0.00001740075,0.00001405567,0.00003299974,0.00003178279,0.00002297307],"domain_scores_gemma":[0.9998629,0.00002802386,0.00003753503,0.00001301878,0.00004407801,0.00001432674],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000008978125,0.000008199083,0.00005050859,0.00003657234,0.000002961237,0.00004248907,0.000006798173,0.00009967868,0.9985902,0.00004103876,0.00001431236,0.001098242],"study_design_scores_gemma":[0.000001517659,0.00007692438,0.0002232215,0.000002438027,0.000009965682,0.00003517773,0.000007279952,0.001188355,0.997611,0.00001358026,0.0008280906,0.000002443752],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.975767,0.002416928,0.0199589,0.00006757469,0.0000963915,0.00004361602,0.00006685414,0.0001843012,0.001398409],"genre_scores_gemma":[0.9822114,0.0008396167,0.01556107,0.00002777782,0.00001378992,0.00002421764,0.00003882748,0.00001835387,0.001264917],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0006302864,"threshold_uncertainty_score":0.001476347,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884844","doi":"10.37665/srnmslt74196","title":"Accelerated Life Testing Solder Reliability in Combined Environments: ISO Temperatures with Harmonic Vibration","year":2017,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Reliability (semiconductor); Vibration; Temperature cycling; Protocol (science); Harmonic; Accelerated life testing; Thermal; Physics of failure","authors":[{"name":"Chee Kiang Ivan Tan","is_ca":false},{"name":"Joseph Juarez","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Jeffrey Kennedy","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"David Hillman","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Subramaniam Suthakaran","is_ca":false},{"name":"Russell Brush","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.04399856891704623,"gpt":0.2583201915603539,"spread":0.2143216226433077,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001237376,0.0006154411,0.0006519526,0.0007657632,0.0003206774,0.0004610505,0.0007861823,0.0004378041,0.002588016],"category_scores_gemma":[0.000873009,0.0003286852,0.0006271522,0.0005555763,0.0005485171,0.0007029373,0.001237505,0.0005998388,0.0004880294],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004104246,"about_ca_system_score_gemma":0.0002969324,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007336875,"about_ca_topic_score_gemma":0.002019248,"domain_scores_codex":[0.9976655,0.00037967,0.00007955568,0.0002773384,0.001431621,0.0001663306],"domain_scores_gemma":[0.9990964,0.0002015241,0.0001450191,0.0001925221,0.0003036189,0.00006093169],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.001167415,0.0002429375,0.007512222,0.000201655,0.00007008982,0.0001828257,0.0002939011,0.004862257,0.946548,0.00041702,0.0002134755,0.03828818],"study_design_scores_gemma":[0.0001157137,0.01337887,0.05071474,0.00005632153,0.0001722739,0.0005069905,0.0002783666,0.02263204,0.9060751,0.0006297275,0.005325585,0.000114302],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.94031,0.001028201,0.05462786,0.00005430565,0.00009801333,0.0001478489,0.0001444901,0.0003421957,0.003247131],"genre_scores_gemma":[0.9758446,0.0002694953,0.02027575,0.00003539124,0.00003005043,0.0001319616,0.000179783,0.0001024564,0.003130595],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002588016,"threshold_uncertainty_score":0.008657753,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884870","doi":"10.37665/srmfrtf10605","title":"In-Situ Resistance Characterization During Cure Progression of a Conductive Adhesive","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Smart Materials for Construction","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); Public Health Ontario; University of Waterloo","funders":"","keywords":"Thermosetting polymer; Adhesive; Electrical conductor; Filler (materials); Conductivity; Epoxy; Electrical resistivity and conductivity; Conductive polymer","authors":[{"name":"Geoffrey Rivers","is_ca":true},{"name":"Pearl Lee‐Sullivan","is_ca":true},{"name":"Boxin Zhao","is_ca":true},{"name":"Alex Chen","is_ca":true},{"name":"John Persic","is_ca":true},{"name":"Robert Lyn","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009985121654303753,"gpt":0.2337995882394358,"spread":0.223814466585132,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002798706,0.0003629041,0.0002766739,0.0003866118,0.0001841373,0.0003179726,0.0003079024,0.0003174928,0.001512528],"category_scores_gemma":[0.0004358769,0.0002007355,0.0001431166,0.0002656332,0.0002307926,0.0002833426,0.000124481,0.0005114583,0.000325859],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001370813,"about_ca_system_score_gemma":0.00008971868,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002526132,"about_ca_topic_score_gemma":0.0004387828,"domain_scores_codex":[0.9997899,0.00003068205,0.000008748788,0.00005784838,0.00007779014,0.00003510549],"domain_scores_gemma":[0.9995875,0.0001316756,0.0001060272,0.0000517212,0.0000973167,0.00002568974],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001751553,0.00001012725,0.0001189439,0.00002122604,0.000001989074,0.00002699995,0.00005860904,0.00004795022,0.9987722,0.00002346523,0.00002076523,0.0008800651],"study_design_scores_gemma":[0.000001349579,0.00007901127,0.001254156,0.000002109422,0.000004922922,0.00004312195,0.00002856369,0.0006253165,0.9972905,0.0000127399,0.0006552248,0.000003079482],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9772282,0.0006170966,0.01975502,0.00003870764,0.00003042512,0.00003304682,0.0003167125,0.0002775982,0.001703228],"genre_scores_gemma":[0.990123,0.0003387407,0.006771477,0.00002908544,0.00001105421,0.0000360288,0.0001563241,0.00008062064,0.00245369],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001512528,"threshold_uncertainty_score":0.005059898,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885319","doi":"10.37665/srmheyk54094","title":"Polyimide Restructuring, An Application for Low-K/Ultra-Low-K Die and Lead-Free Bump Integrity Improvement","year":2010,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Polyimide; Die (integrated circuit); Brittleness; Thermal expansion; Passivation; Temperature cycling; Layer (electronics); Eutectic system","authors":[{"name":"Roden Topacio","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01095868310884264,"gpt":0.2466778994614554,"spread":0.2357192163526128,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0000785247,0.0003859979,0.000105011,0.0002519755,0.0001928765,0.0002767465,0.0002758784,0.0002309218,0.00294701],"category_scores_gemma":[0.000118407,0.0001731088,0.000178526,0.000312412,0.0001298387,0.0004077682,0.0001933512,0.0002631445,0.000764213],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001693552,"about_ca_system_score_gemma":0.0001176709,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003604081,"about_ca_topic_score_gemma":0.0007805352,"domain_scores_codex":[0.9999276,0.000002736209,0.000003285597,0.00002295934,0.00003122712,0.00001210599],"domain_scores_gemma":[0.9999245,0.000005775504,0.00001710832,0.00001372442,0.0000280915,0.00001070692],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00004457125,0.00002597588,0.00033506,0.0001035078,0.000005383391,0.0001235528,0.00003151151,0.0002375906,0.967364,0.0004048048,0.0005683672,0.03075562],"study_design_scores_gemma":[0.00001328049,0.0001489713,0.002893861,0.000007929492,0.00001859718,0.0003000834,0.00002041024,0.003174425,0.9749245,0.00008800881,0.0183998,0.00001025562],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8508332,0.008762986,0.09877874,0.0005377197,0.0006128324,0.0001953827,0.0003712648,0.002403382,0.03750452],"genre_scores_gemma":[0.9403348,0.00273892,0.03057788,0.0001307559,0.00007671611,0.00005663395,0.0002381742,0.0001807299,0.02566541],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00294701,"threshold_uncertainty_score":0.009858727,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884734","doi":"10.37665/sryxiad78610","title":"Solder Pastes and Their Marine Pollutant Hazards","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Effects and risks of endocrine disrupting chemicals","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"ON Semiconductor (Canada)","funders":"","keywords":"Soldering; Pollutant; Hazard; Electronic equipment; Solder paste; Particle (ecology); Aqueous medium; Chemical toxicity","authors":[{"name":"Michel Hachey","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01752803551140917,"gpt":0.2931732078122355,"spread":0.2756451723008264,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000611474,0.0004105763,0.0002156289,0.001125177,0.0004688026,0.001176937,0.0002232469,0.0008065865,0.004210923],"category_scores_gemma":[0.000734999,0.0001328517,0.0002920656,0.0006348859,0.0005368944,0.0003672524,0.0009164184,0.0004419688,0.0007900964],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005398662,"about_ca_system_score_gemma":0.0004654091,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001940195,"about_ca_topic_score_gemma":0.002222552,"domain_scores_codex":[0.9990491,0.0001644391,0.00005958259,0.00008490236,0.0005826806,0.00005919496],"domain_scores_gemma":[0.999243,0.0001415803,0.0002408539,0.00003201243,0.0002840189,0.00005857039],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"observational","study_design_scores_codex":[0.0005984178,0.0002496981,0.04576701,0.003196618,0.0002305265,0.003326045,0.0009442939,0.002957411,0.6878234,0.01018909,0.008398619,0.2363189],"study_design_scores_gemma":[0.00003645741,0.002307668,0.07601324,0.0007940787,0.0002641673,0.005471324,0.002039248,0.001377832,0.5708936,0.01393898,0.326789,0.00007436884],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7532083,0.1494007,0.01140073,0.004684554,0.0009394881,0.0001065463,0.0006828599,0.0002314078,0.07934539],"genre_scores_gemma":[0.9418036,0.03848857,0.00199744,0.0006799881,0.0002887696,0.00001817871,0.0002332983,0.0000284106,0.01646173],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.004210923,"threshold_uncertainty_score":0.0140869,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884696","doi":"10.37665/srwooxo62529","title":"Lead-Free Assembly Design for Manufacturability Considerations","year":2012,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Design for manufacturability; Reliability (semiconductor); Key (lock); Quality (philosophy); Product design; Component (thermodynamics); Product (mathematics)","authors":[{"name":"Matt Kelly","is_ca":true},{"name":"Mark Hoffmeyer","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05155473414764197,"gpt":0.2698451335970006,"spread":0.2182903994493587,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000908859,0.000926866,0.0003609947,0.000698996,0.0008006323,0.001325551,0.00123149,0.0008247017,0.006795339],"category_scores_gemma":[0.001650614,0.0004494182,0.0003929553,0.0002576989,0.0005295653,0.0009626317,0.0007782555,0.0007205289,0.002047417],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0008678602,"about_ca_system_score_gemma":0.0009194862,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008628906,"about_ca_topic_score_gemma":0.002031252,"domain_scores_codex":[0.9987015,0.0002613476,0.0000723972,0.000125105,0.0007290412,0.0001105696],"domain_scores_gemma":[0.998657,0.0002450108,0.0002060062,0.0001615303,0.0006882739,0.00004229716],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"theoretical_or_conceptual","study_design_scores_codex":[0.0005101992,0.0001482366,0.002810327,0.001092404,0.0000711695,0.001352608,0.001055496,0.0545133,0.5557242,0.1427074,0.009485339,0.2305294],"study_design_scores_gemma":[0.0001851584,0.002879499,0.006164471,0.0003511756,0.0002742761,0.003080399,0.0004482105,0.2256841,0.4070698,0.05579609,0.2979169,0.0001499815],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.08281913,0.001886508,0.8410791,0.001412498,0.0005530009,0.0002384517,0.0001029937,0.00249721,0.06941105],"genre_scores_gemma":[0.6546534,0.0009948176,0.2902105,0.0006308682,0.0002244563,0.0002942058,0.0001431313,0.0004851564,0.05236347],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.006795339,"threshold_uncertainty_score":0.02273268,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885199","doi":"10.37665/srjodrw10699","title":"Control of “Spalling” in SAC Pb-Free Solder Alloys when used with a Ni Substrate","year":2009,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Intermetallic; Soldering; Layer (electronics); Substrate (aquarium); Spall; Alloy; Solder paste","authors":[{"name":"L. Snugovsky","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"J. W. Rutter","is_ca":true},{"name":"Polina Snugovsky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01239927387706836,"gpt":0.2137574035688164,"spread":0.2013581296917481,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004258566,0.0005245996,0.000424949,0.0002536077,0.0002183742,0.0004564423,0.0004066031,0.000240266,0.00115989],"category_scores_gemma":[0.0008154907,0.0003347145,0.0001558667,0.0002815298,0.0003082746,0.0003258531,0.0002389918,0.0003473256,0.000368164],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003931755,"about_ca_system_score_gemma":0.0002845958,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000736398,"about_ca_topic_score_gemma":0.001346069,"domain_scores_codex":[0.999464,0.0001019507,0.00006331711,0.0001204193,0.0001569912,0.0000933367],"domain_scores_gemma":[0.9993156,0.0001705926,0.0002004475,0.0001043583,0.0001404372,0.00006853035],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001396707,0.00002201907,0.00009418391,0.00004346442,0.000004468793,0.00003988343,0.00003127434,0.0001353469,0.9984464,0.00003118407,0.00002817558,0.0009838995],"study_design_scores_gemma":[0.00000480174,0.0001886772,0.0005329974,0.000001775856,0.000004714199,0.00001640264,0.000006436864,0.0006721229,0.9981956,0.000003646142,0.0003704446,0.000002463128],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9957722,0.0005950025,0.002391896,0.00004585496,0.00003560204,0.00003539935,0.00007899744,0.0001586038,0.0008865157],"genre_scores_gemma":[0.9956983,0.0003204533,0.002531984,0.0000245385,0.0000166548,0.00003638351,0.00009673913,0.00008894298,0.001185965],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00115989,"threshold_uncertainty_score":0.003880203,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884457","doi":"10.37665/srdvfqd28287","title":"Investigation of Field Failures of Power Systems: A Different Whisker Story","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electrostatic Discharge in Electronics","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"North Toronto Eye Care","funders":"","keywords":"Printed circuit board; Component (thermodynamics); Power (physics); Busbar; Short circuit; Bridging (networking); Failure mode and effects analysis; Whisker; Soldering","authors":[{"name":"P. Arrowsmith","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01855853457348987,"gpt":0.2254128470499759,"spread":0.2068543124764861,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001813014,0.0004429863,0.000408576,0.002758809,0.001681954,0.003067213,0.0007473729,0.003039876,0.002303803],"category_scores_gemma":[0.003358216,0.0002584811,0.0004564479,0.001032105,0.003096516,0.004218591,0.00120804,0.003886078,0.0005667461],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001348592,"about_ca_system_score_gemma":0.0005453023,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002279636,"about_ca_topic_score_gemma":0.00201578,"domain_scores_codex":[0.9989649,0.0002211387,0.00004956669,0.0001944685,0.0004887247,0.0000812674],"domain_scores_gemma":[0.9955325,0.002147703,0.000415309,0.0004031314,0.001252254,0.0002491539],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"observational","study_design_scores_codex":[0.0009353128,0.0009499304,0.07280214,0.003279057,0.0004272608,0.03853873,0.03156803,0.00379459,0.1370624,0.08855276,0.12942,0.4926697],"study_design_scores_gemma":[0.0001078912,0.002035516,0.0844548,0.002080342,0.0001680134,0.03643853,0.0355817,0.004420163,0.09220473,0.07595918,0.6661549,0.000394149],"study_design_candidate":"observational","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6527018,0.08520963,0.02769218,0.1558545,0.0045996,0.0002752409,0.0009246315,0.0008064395,0.07193597],"genre_scores_gemma":[0.9051318,0.02449625,0.0154832,0.01676551,0.002703078,0.00004058373,0.0002897808,0.000185733,0.03490415],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.003067213,"threshold_uncertainty_score":0.009784698,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885174","doi":"10.37665/sresmuc55378","title":"Stretchable Polyurethane-Based Conductive Ink for E-Textile Applications","year":2018,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Advanced Sensor and Energy Harvesting Materials","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Electrical conductor; Inkwell; Coating; Conductive ink; Textile; Conductive polymer; Porosity; Adhesion","authors":[{"name":"Pengxiang Si","is_ca":true},{"name":"Li Chen","is_ca":true},{"name":"Boxin Zhao","is_ca":true},{"name":"Alex Chen","is_ca":false},{"name":"John Persic","is_ca":false},{"name":"Robert Lyn","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02625544839296987,"gpt":0.2696512692354426,"spread":0.2433958208424728,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000123488,0.0003080654,0.00009596212,0.0002391513,0.0001090051,0.0002621071,0.0001839694,0.000335806,0.001564115],"category_scores_gemma":[0.0002166399,0.00009856693,0.0001883943,0.0002244697,0.0001353684,0.000417946,0.0001979342,0.0003181327,0.0006405681],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00009956202,"about_ca_system_score_gemma":0.00006956336,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001019298,"about_ca_topic_score_gemma":0.0001826621,"domain_scores_codex":[0.9998994,0.00001462729,0.0000123547,0.00002132708,0.00003750065,0.00001468891],"domain_scores_gemma":[0.9998664,0.00002673106,0.00003916152,0.00001603355,0.0000349639,0.00001674104],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002491662,0.00002777641,0.0001248861,0.0001244281,0.000003335959,0.0001147985,0.00002020763,0.0002081967,0.9870667,0.0002018256,0.0001969617,0.01188598],"study_design_scores_gemma":[0.00000359612,0.00009806103,0.0003944012,0.000006282693,0.000005624503,0.0001527724,0.000009889636,0.001299636,0.9935824,0.00005293524,0.004387979,0.000006535784],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8603226,0.01854101,0.1010969,0.0006006777,0.0006538057,0.0001131186,0.0002933381,0.001067361,0.01731113],"genre_scores_gemma":[0.9641155,0.003081252,0.02507527,0.0001214037,0.00005091235,0.00002722085,0.0001081132,0.0000606184,0.007359733],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001564115,"threshold_uncertainty_score":0.005232513,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884562","doi":"10.37665/srbqspx21537","title":"The Study of Corrosion Behaviour of Cu In Some Commercial Beverages By Chemical and Electrochemical Measurement","year":2013,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Corrosion Behavior and Inhibition","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo; Blackberry (Canada)","funders":"","keywords":"Tafel equation; Corrosion; Copper; Electrochemistry; Metal; Polarization (electrochemistry); Phosphoric acid","authors":[{"name":"Xiaonan Wang","is_ca":true},{"name":"Bev Christian","is_ca":true},{"name":"Mark Pritzgker","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.02164737018215122,"gpt":0.2519285927953601,"spread":0.2302812226132089,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004904447,0.0004851456,0.0004151592,0.0009097527,0.0003172731,0.0003793543,0.0003585299,0.000555278,0.001039902],"category_scores_gemma":[0.001286182,0.0002338393,0.0002996789,0.001174652,0.0002345013,0.0004057126,0.0002540781,0.0002433488,0.0003133253],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002818419,"about_ca_system_score_gemma":0.0001887474,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002286466,"about_ca_topic_score_gemma":0.00285316,"domain_scores_codex":[0.9993782,0.0001801933,0.00004928171,0.0001124049,0.0002360846,0.000043667],"domain_scores_gemma":[0.9990662,0.00009140715,0.0001705761,0.00003457537,0.0005958028,0.00004147651],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.000556925,0.00007177459,0.007351919,0.0006035162,0.00009062634,0.0001682963,0.000328233,0.0001457154,0.977476,0.00007689781,0.00008647642,0.01304366],"study_design_scores_gemma":[0.00001768972,0.00171402,0.05404672,0.00004733722,0.0001790973,0.0007299336,0.0008341479,0.002728843,0.9352583,0.00006592963,0.004337056,0.00004101166],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9914136,0.004006597,0.003159651,0.0000420336,0.00003178044,0.00004634968,0.0002242788,0.00004449603,0.001031281],"genre_scores_gemma":[0.9878007,0.001271929,0.009117201,0.0000246981,0.00002122911,0.00004574969,0.0002324545,0.00002154079,0.001464508],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002286466,"threshold_uncertainty_score":0.004546344,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885228","doi":"10.37665/srbbfwo59413","title":"RoHS2 and REACH: The Next Steps for Restricted Substances Solutions and services for Environmental Compliance","year":2009,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Effects and risks of endocrine disrupting chemicals","field":"Environmental Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Intertek (Canada)","funders":"","keywords":"Directive; Commission; European commission; Conformity assessment; European union; Agency (philosophy); Scope (computer science); Product (mathematics)","authors":[{"name":"Walter Jäger","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.0436868754997214,"gpt":0.3186276694955617,"spread":0.2749407939958403,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.01726252,0.000697338,0.0004644367,0.001135767,0.002098271,0.006928319,0.002802106,0.01185165,0.06972267],"category_scores_gemma":[0.01903488,0.0004071037,0.001094569,0.000655747,0.002544938,0.007663474,0.007424271,0.004578074,0.0138756],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002227027,"about_ca_system_score_gemma":0.0139777,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.003684981,"about_ca_topic_score_gemma":0.005442077,"domain_scores_codex":[0.9833176,0.005474171,0.0006255991,0.0007023999,0.008316503,0.001563717],"domain_scores_gemma":[0.9860319,0.003071071,0.0008112775,0.001737872,0.005363197,0.002984673],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"not_applicable","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002114429,0.0004948585,0.0009516714,0.0005537097,0.00003393116,0.0006721862,0.0005718146,0.001905923,0.006094581,0.1659663,0.6243021,0.1982415],"study_design_scores_gemma":[0.00003092082,0.0001850441,0.0005167532,0.000190734,0.000007950464,0.0002047101,0.0004663463,0.0007950477,0.001772635,0.01607474,0.979715,0.00003996016],"study_design_candidate":"not_applicable","study_design_consensus":"not_applicable","genre_codex":"other","genre_gemma":"review","genre_scores_codex":[0.01672255,0.007211761,0.05942285,0.4088334,0.008945285,0.001123148,0.001146995,0.007655181,0.4889388],"genre_scores_gemma":[0.1559936,0.007244383,0.1514441,0.2164766,0.003204523,0.001234789,0.003721179,0.001831529,0.4588493],"genre_candidate":"review","genre_consensus":null,"teacher_disagreement_score":0.06972267,"threshold_uncertainty_score":0.2332456,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885289","doi":"10.37665/srgogts63540","title":"PTH Connector Temperature Mass Study: Plastic Housing Survival After Elevated Lead-Free Process Temperature Exposures","year":2010,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Cable gland; Ball grid array; Reliability (semiconductor); Soldering; Work (physics)","authors":[{"name":"Matthew Kelly","is_ca":true},{"name":"Curtis Grosskopf","is_ca":true},{"name":"Paul Krystek","is_ca":true},{"name":"Brian Littell","is_ca":true},{"name":"Craig Hamilton","is_ca":false},{"name":"Jose Traya","is_ca":false},{"name":"R. Trivedi","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.009027773297421637,"gpt":0.2324086803402134,"spread":0.2233809070427918,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002262841,0.0003212148,0.0002706262,0.0005013332,0.0003356053,0.0002594097,0.0002383514,0.0003608958,0.002579738],"category_scores_gemma":[0.0005166639,0.0001534086,0.0003157047,0.0003603804,0.0002942302,0.0003452441,0.0002523748,0.0004072199,0.0004207581],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002613687,"about_ca_system_score_gemma":0.0001098339,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001057496,"about_ca_topic_score_gemma":0.001111473,"domain_scores_codex":[0.9997703,0.00002257631,0.00001172849,0.00005145305,0.0001096857,0.00003428807],"domain_scores_gemma":[0.99945,0.00009890614,0.0001411753,0.00008539963,0.0001877142,0.00003666099],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0008243446,0.0001015895,0.00655431,0.00003329288,0.00001359177,0.0002592603,0.0002177315,0.0004700097,0.9868252,0.00004594829,0.00006801853,0.004586638],"study_design_scores_gemma":[0.000007869196,0.002551869,0.0368476,0.000003048305,0.00002848209,0.0002059762,0.0001261906,0.001372208,0.9582695,0.00002778431,0.0005482948,0.00001113613],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9968243,0.0001591463,0.002169525,0.0000118127,0.00001022941,0.00002778347,0.0001309424,0.00005599264,0.0006103327],"genre_scores_gemma":[0.9982936,0.00005360859,0.0005818986,0.0000083474,0.000005812859,0.000014146,0.00009698998,0.00001396913,0.0009316306],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002579738,"threshold_uncertainty_score":0.008630097,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885177","doi":"10.37665/srbaznx55665","title":"The Relative World of Harsh Environments","year":2018,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":false,"ca_fund":false,"ca_venue":false,"about_ca":true},"ca_institutions":"","funders":"","keywords":"Montreal Protocol; Treaty; Protocol (science); Process (computing); Flux (metallurgy)","authors":[{"name":"Michael Konrad","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01549097628316173,"gpt":0.2252711397839222,"spread":0.2097801635007605,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002419125,0.0008599599,0.000868844,0.0008124777,0.006098276,0.009485341,0.001162711,0.004041404,0.02089798],"category_scores_gemma":[0.002734325,0.0002985311,0.0003876221,0.0008707466,0.01902289,0.01165728,0.009103902,0.009152175,0.005794681],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.002700448,"about_ca_system_score_gemma":0.002995914,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002911292,"about_ca_topic_score_gemma":0.003139485,"domain_scores_codex":[0.9980115,0.0007395236,0.00005505333,0.0003577924,0.000553377,0.0002827805],"domain_scores_gemma":[0.9981141,0.0005015566,0.0001882537,0.0003254438,0.000414154,0.000456484],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"not_applicable","study_design_scores_codex":[0.00007705179,0.00004293104,0.0009005395,0.0005515987,0.00004546403,0.0006658551,0.007504071,0.0005822094,0.001815542,0.6153156,0.3054756,0.06702348],"study_design_scores_gemma":[0.000003963666,0.00002635439,0.0003529992,0.0002611793,0.000005957254,0.0002989325,0.002652062,0.00007272774,0.0001937855,0.06493196,0.9311767,0.00002344341],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"other","genre_gemma":"commentary","genre_scores_codex":[0.0158736,0.1332338,0.0181809,0.3883864,0.02598945,0.00006131949,0.001093979,0.0008415677,0.416339],"genre_scores_gemma":[0.4494689,0.1518468,0.0125574,0.1813791,0.02421585,0.0002401272,0.0009186761,0.0008328047,0.1785402],"genre_candidate":"commentary","genre_consensus":null,"teacher_disagreement_score":0.02089798,"threshold_uncertainty_score":0.06991071,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884930","doi":"10.37665/srdbeox90765","title":"The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-Rich Alloys – Part 2","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); University of Toronto","funders":"","keywords":"Microstructure; Carbide; Soldering; Recrystallization (geology); Rockwell scale; Precipitation hardening","authors":[{"name":"André M. Delhaise","is_ca":true},{"name":"Doug D. Perovic","is_ca":true},{"name":"Polina Snugovsky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01081457724902644,"gpt":0.2003926063087955,"spread":0.1895780290597691,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003355025,0.0002282473,0.0002371905,0.0005192539,0.0001967602,0.0002412142,0.0002164029,0.0002076975,0.001243833],"category_scores_gemma":[0.0003781689,0.0001725577,0.0002315073,0.0003197284,0.0001886684,0.0001731258,0.0001427561,0.0001377306,0.0002797094],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003022844,"about_ca_system_score_gemma":0.0001458238,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.002641083,"about_ca_topic_score_gemma":0.003396963,"domain_scores_codex":[0.9998004,0.00003632706,0.00002298332,0.00003202973,0.00008145125,0.00002691349],"domain_scores_gemma":[0.9995931,0.00005185335,0.0000977285,0.00003501313,0.0001865426,0.00003587634],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0006099493,0.00006852968,0.005599196,0.00007616061,0.0000257728,0.00009805064,0.00004689676,0.0007709332,0.987044,0.00003864464,0.00008500058,0.005536809],"study_design_scores_gemma":[0.00001432478,0.002038903,0.2285951,0.0000099497,0.00007899162,0.0002653389,0.00008044725,0.003817673,0.7635205,0.00004604492,0.00151292,0.00001980437],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9980095,0.0007910795,0.0003467013,0.000007111494,0.00000996012,0.00001206544,0.0001508512,0.0000171032,0.0006556471],"genre_scores_gemma":[0.9977689,0.0002063121,0.000541486,0.00001174913,0.000006326555,0.00001035553,0.0002242168,0.00001171685,0.00121896],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002641083,"threshold_uncertainty_score":0.005251408,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884884","doi":"10.37665/srqljpg23359","title":"Evaluating Solderability of Surface Finishes","year":2012,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Waterloo","funders":"","keywords":"Solderability; Wetting; Soldering; Surface finishing; Immersion (mathematics); Surface roughness","authors":[{"name":"Bev Christian","is_ca":false},{"name":"Numaira Obaid","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05647100497574914,"gpt":0.3136368324843999,"spread":0.2571658275086508,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008075478,0.0006060006,0.0003188155,0.0009298411,0.0002134518,0.0004377479,0.0002365967,0.0003784367,0.001574483],"category_scores_gemma":[0.002249967,0.0001530928,0.0003209653,0.0003447462,0.0002171776,0.0003986618,0.0002676218,0.0002477022,0.0002999954],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001714772,"about_ca_system_score_gemma":0.0001190505,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001146958,"about_ca_topic_score_gemma":0.001145311,"domain_scores_codex":[0.9992645,0.0001146511,0.0000512755,0.0001228214,0.0003654202,0.00008127061],"domain_scores_gemma":[0.9983494,0.0005085503,0.0002203965,0.0002010499,0.0006563855,0.00006421873],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001365726,0.00002151704,0.004036661,0.00009644206,0.00002653078,0.00004422883,0.00006731316,0.0003749579,0.9822764,0.00002990817,0.00001806687,0.01287143],"study_design_scores_gemma":[0.000005983813,0.0009924449,0.01865989,0.00000959824,0.00004740124,0.00009990852,0.00006338295,0.001275534,0.9780865,0.000035073,0.0007149247,0.000009303465],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9887621,0.0008005042,0.009151178,0.000009205763,0.00001775517,0.00003762844,0.000122168,0.0001125191,0.0009869804],"genre_scores_gemma":[0.9891871,0.0003632242,0.008686319,0.00001167432,0.000005740717,0.00001744737,0.0002911038,0.00004699294,0.001390353],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001574483,"threshold_uncertainty_score":0.005267203,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884460","doi":"10.37665/srrtfip90689","title":"The Use of Graphene to Replace Silver in Electricaly Conductive Adhesives - A Study on Electrical Conductivity and Mechanical Properties","year":2015,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Nanomaterials and Printing Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada); Public Health Ontario; University of Waterloo","funders":"","keywords":"Graphene; Electrical resistivity and conductivity; Electrical conductor; Adhesive; Nanocomposite; Modulus; Dispersion (optics); Filler (materials)","authors":[{"name":"Behnam Meschi Amoli","is_ca":true},{"name":"Josh Trinidad","is_ca":true},{"name":"Y. Zhou","is_ca":true},{"name":"Boxin Zhao","is_ca":true},{"name":"Alex Chen","is_ca":true},{"name":"John Persic","is_ca":true},{"name":"Robert Lyn","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.1080281129151948,"gpt":0.2705036267041362,"spread":0.1624755137889415,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001811282,0.000450707,0.0001553514,0.0003973087,0.0001510735,0.0003003957,0.0002594458,0.0004422419,0.0003903364],"category_scores_gemma":[0.000248157,0.0001362053,0.0002849249,0.0002865799,0.0001941769,0.0003937426,0.0001963513,0.0003755764,0.0001913264],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001107666,"about_ca_system_score_gemma":0.00006937674,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001884832,"about_ca_topic_score_gemma":0.000337673,"domain_scores_codex":[0.9998721,0.00002916099,0.000008098217,0.00002432114,0.00004392559,0.00002229939],"domain_scores_gemma":[0.9998814,0.00003330143,0.00002413527,0.00001693984,0.00003215798,0.00001214973],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002605732,0.0000266834,0.0001062929,0.00008557452,0.000009192147,0.00007811947,0.00001628259,0.0001202242,0.9951153,0.0001920428,0.00003361915,0.004190576],"study_design_scores_gemma":[0.000002778964,0.0002328139,0.0006497063,0.000008803727,0.00001821322,0.0001221056,0.00001685174,0.0006105415,0.9958618,0.00004703928,0.002423788,0.000005751412],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9723141,0.01525286,0.009271959,0.0001662982,0.0001242006,0.0000347255,0.00005340059,0.00005608901,0.002726333],"genre_scores_gemma":[0.9823636,0.005308393,0.01002594,0.00006398887,0.00002044012,0.00001547949,0.00005384252,0.00002093608,0.002127359],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.000450707,"threshold_uncertainty_score":0.001305878,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884864","doi":"10.37665/srnrawb12457","title":"Protocol Development for Testing Solder Reliability in Combined Environments","year":2016,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Reliability (semiconductor); Protocol (science); Stress testing (software); Soldering; Field (mathematics); Point (geometry); Phase (matter)","authors":[{"name":"John J. McMahon","is_ca":false},{"name":"Joseph Juarez","is_ca":false},{"name":"Polina Snugovsky","is_ca":false},{"name":"Jeffrey Kennedy","is_ca":false},{"name":"Milea Kammer","is_ca":false},{"name":"Ivan Straznicky","is_ca":false},{"name":"David Hillman","is_ca":false},{"name":"David Adams","is_ca":false},{"name":"Stephan Meschter","is_ca":false},{"name":"Subramaniam Suthakaran","is_ca":false},{"name":"Russell Brush","is_ca":false},{"name":"Doug D. Perovic","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03350821178554178,"gpt":0.2611508651360914,"spread":0.2276426533505496,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.03786595,0.001669631,0.001046651,0.003436998,0.001550431,0.002060985,0.002993454,0.001783735,0.01831066],"category_scores_gemma":[0.03728557,0.001577874,0.001028293,0.001430291,0.001616019,0.002542753,0.003314352,0.002161197,0.009703724],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001313233,"about_ca_system_score_gemma":0.004378999,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001050397,"about_ca_topic_score_gemma":0.001562306,"domain_scores_codex":[0.9731185,0.01317494,0.00413196,0.001517418,0.007076617,0.0009804351],"domain_scores_gemma":[0.9644212,0.0110129,0.001974146,0.008904716,0.01292133,0.0007657287],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"theoretical_or_conceptual","study_design_scores_codex":[0.002491888,0.001243941,0.0040859,0.005845317,0.0002289924,0.002022395,0.002924341,0.007598586,0.3154817,0.1014464,0.04430073,0.5123298],"study_design_scores_gemma":[0.0007036269,0.003956375,0.003153566,0.001875467,0.0002832547,0.002087575,0.0008428687,0.02138713,0.4255679,0.01464726,0.5251673,0.0003277834],"study_design_candidate":"theoretical_or_conceptual","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"protocol","genre_scores_codex":[0.005312214,0.0002468253,0.9515239,0.0002610448,0.0002951254,0.02682707,0.00158593,0.00494018,0.00900766],"genre_scores_gemma":[0.02245824,0.0007789518,0.8650672,0.0003549179,0.0000775959,0.09587768,0.004428193,0.0009159351,0.01004124],"genre_candidate":"protocol","genre_consensus":null,"teacher_disagreement_score":0.03786595,"threshold_uncertainty_score":0.2002567,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885400","doi":"10.37665/srxvdud48188","title":"A Study of the Process Performance of Alternative Lead Free Wave Alloys","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Metallurgical and Alloy Processes","field":"Materials Science","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Alloy; Lead (geology); Electronics; Ball grid array; Soldering; Reliability (semiconductor); Manufacturing","authors":[{"name":"Craig Hamilton","is_ca":false}],"retraction":null,"screen_n_in":null,"score":{"opus":0.05750374173475903,"gpt":0.2693089540746639,"spread":0.2118052123399049,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000899458,0.0004052543,0.0005582024,0.001058838,0.0005063615,0.001039263,0.0007059519,0.0007247052,0.002496927],"category_scores_gemma":[0.001772999,0.0002709259,0.0004965173,0.00105795,0.0003022207,0.0007706353,0.0003049821,0.0004907264,0.0009215996],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005185254,"about_ca_system_score_gemma":0.0003657613,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00178004,"about_ca_topic_score_gemma":0.002091255,"domain_scores_codex":[0.9987761,0.0001407627,0.00008275028,0.0001859238,0.0007083149,0.0001060749],"domain_scores_gemma":[0.9988443,0.0002355335,0.000165957,0.000131466,0.0005695404,0.00005321405],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.002123972,0.0003322347,0.004410701,0.0007049806,0.00007015517,0.0003174538,0.0004915976,0.003085493,0.9545246,0.0005364896,0.0005527911,0.03284937],"study_design_scores_gemma":[0.00004145431,0.005276772,0.01214335,0.00003631592,0.0001188892,0.0001979578,0.0003573317,0.006055234,0.9692063,0.0001469237,0.006377017,0.00004239174],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9906433,0.003138147,0.002232618,0.00005400981,0.00009615516,0.00006948078,0.0003648178,0.0001515933,0.003249876],"genre_scores_gemma":[0.9909247,0.0009465822,0.003295057,0.00003529886,0.00001764392,0.00004097606,0.0003588275,0.00008723978,0.00429369],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002496927,"threshold_uncertainty_score":0.008353055,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416884566","doi":"10.37665/sremokq40825","title":"Intermediate and High Strain-Rate Fracture of Lead-Free Solder Joints as a Function of Mode Ratio","year":2014,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"University of Toronto","funders":"","keywords":"Soldering; Joint (building); Fracture (geology); Failure mode and effects analysis; Strain energy; Strain energy release rate; Strain gauge; Strain energy density function; Strain rate","authors":[{"name":"Amir Nourani","is_ca":true},{"name":"J.K. Spelt","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.00957153523447742,"gpt":0.2228112005300308,"spread":0.2132396652955534,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004503102,0.0003716357,0.0002846881,0.0004397046,0.00009341947,0.000160761,0.0002882641,0.0002707157,0.00169461],"category_scores_gemma":[0.0008037438,0.0002075349,0.0001668057,0.0001890129,0.0002115714,0.0002396635,0.0001513085,0.0002724742,0.0002126743],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001177969,"about_ca_system_score_gemma":0.00005141808,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004401349,"about_ca_topic_score_gemma":0.0006630171,"domain_scores_codex":[0.9997075,0.00004552385,0.00001900014,0.00005669026,0.000128601,0.00004276125],"domain_scores_gemma":[0.9990529,0.0003452278,0.0001686822,0.00009214578,0.0002429691,0.00009812404],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003460603,0.00002577616,0.002936859,0.00003316331,0.000009614146,0.00008580893,0.00005086164,0.000698548,0.9933766,0.00001898428,0.00002133498,0.002396488],"study_design_scores_gemma":[0.00001359805,0.001591582,0.08475054,0.00001118949,0.00002132987,0.0001995342,0.0001148199,0.006991448,0.9059678,0.00003330962,0.0002822042,0.0000226833],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9986755,0.0001335188,0.0009213952,0.000003495589,0.000002200654,0.000003636377,0.00004779402,0.00002687101,0.0001856458],"genre_scores_gemma":[0.9990845,0.00004024534,0.0004765315,0.000005104631,0.00000157873,0.000005617296,0.00006394066,0.000008486184,0.0003140149],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.00169461,"threshold_uncertainty_score":0.005669057,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885180","doi":"10.37665/srlvrhq74201","title":"Development of Novel Activators for use in Halogen Free and Water Soluble Solder Pastes","year":2018,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Artificial Intelligence in Medicine (Canada)","funders":"","keywords":"Soldering; Water soluble; Solder paste; Activator (genetics); Printed circuit board","authors":[{"name":"Julia Del Re","is_ca":true},{"name":"Mitra Matloobi","is_ca":true},{"name":"Mehran Maalekian","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.03916933100550158,"gpt":0.247099825768496,"spread":0.2079304947629944,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0003038823,0.000349772,0.0002779424,0.0003093586,0.0001419231,0.0005156064,0.0004406663,0.00038148,0.001321039],"category_scores_gemma":[0.0003596429,0.0001753195,0.0002422455,0.000182832,0.0002230054,0.000372883,0.0002391155,0.000410762,0.000638268],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000160631,"about_ca_system_score_gemma":0.0002214582,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001237451,"about_ca_topic_score_gemma":0.000256097,"domain_scores_codex":[0.9997988,0.00004311076,0.00001778401,0.00003113561,0.00009000483,0.00001914934],"domain_scores_gemma":[0.9997873,0.00005128086,0.00005996438,0.00001716115,0.00005726585,0.00002708927],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003245164,0.00003597063,0.00008063769,0.00009802798,0.000003738915,0.00005830703,0.00002086784,0.0001516494,0.9956488,0.0002483652,0.00004170195,0.00357943],"study_design_scores_gemma":[0.000008247239,0.0002324779,0.0001636275,0.00000666231,0.00000871673,0.00005804,0.00001319068,0.0004546992,0.9969361,0.0000324878,0.002082766,0.000003140744],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9447978,0.005445442,0.04142751,0.0002170386,0.0001440997,0.0003178172,0.0001887599,0.0003616379,0.007100004],"genre_scores_gemma":[0.9557545,0.003047236,0.0338465,0.00008885072,0.00003919259,0.0001695373,0.0001520081,0.00006997531,0.006832305],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001321039,"threshold_uncertainty_score":0.004419327,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null},{"id":"W4416885421","doi":"10.37665/srhdais67220","title":"Whisker Growth on Sac Solder Joints: Microstructure Analysis","year":2008,"lang":"","type":"article","venue":"Soldering and Reliability Conferences","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false},"ca_institutions":"Hain Celestial (Canada)","funders":"","keywords":"Whisker; Whiskers; Microstructure; Soldering; Plating (geology); Lead frame; Monocrystalline whisker; Scanning electron microscope","authors":[{"name":"Polina Snugovsky","is_ca":true},{"name":"Zohreh Bagheri","is_ca":true},{"name":"Marianne Romansky","is_ca":true}],"retraction":null,"screen_n_in":null,"score":{"opus":0.01372187772483716,"gpt":0.2173338350514215,"spread":0.2036119573265843,"validation_status":"score_only:v0-immature-baseline"},"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00008840192,0.00009397655,0.000138835,0.000405718,0.0001375987,0.0001515651,0.00008796901,0.0001541037,0.0006500026],"category_scores_gemma":[0.0001229606,0.00009984335,0.0001167022,0.0002091041,0.00009819889,0.0001189605,0.00006809837,0.00007812034,0.0001418664],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001385385,"about_ca_system_score_gemma":0.00008736717,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001928913,"about_ca_topic_score_gemma":0.003212512,"domain_scores_codex":[0.9999434,0.000003912159,0.000002589142,0.00001418911,0.00002615677,0.00000983059],"domain_scores_gemma":[0.9998528,0.00001761928,0.00003047302,0.00001295147,0.00007454149,0.00001157667],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002215312,0.000004904281,0.002735999,0.00002678836,0.000002853375,0.00007586737,0.00005362172,0.0001824814,0.995016,0.00002628962,0.00002779344,0.001825113],"study_design_scores_gemma":[0.000006379624,0.000503237,0.2548983,0.000009241147,0.00003305046,0.0007293171,0.000222597,0.005004403,0.7363364,0.00005320308,0.002192223,0.00001157629],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9981104,0.0002201711,0.001030739,0.000003912417,0.000003416759,0.000006788022,0.0001023997,0.00003922184,0.0004829278],"genre_scores_gemma":[0.9977715,0.00009536475,0.001213863,0.00000348181,0.000002333247,0.000004711535,0.0001129403,0.000005959212,0.0007897561],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001928913,"threshold_uncertainty_score":0.00383538,"prediction_status":"machine_predicted_unvalidated"},"labels":[],"label_agreement":null}]}