{"id":"W1985336684","doi":"10.1109/eptc.2008.4763590","title":"Copper-Pillar Bump-Joint Thermo-Mechanical and Thermal Modeling for Flip-Chip Packages","year":2008,"lang":"en","type":"article","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":4,"is_retracted":false,"has_abstract":true,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Flip chip; Materials science; Temperature cycling; Composite material; Thermal copper pillar bump; Soldering; Thermal expansion; Stress (linguistics); Creep; Joint (building); Die (integrated circuit); Strain energy; Thermal; Finite element method; Structural engineering; Layer (electronics); Thermodynamics; Nanotechnology","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001222183,0.0001792875,0.0002099116,0.00005825576,0.0001410645,0.0000200844,0.0001248173,0.0001421989,0.000007068321],"category_scores_gemma":[0.00004132842,0.0001511687,0.00006275311,0.00005811278,0.00004680214,0.00006104272,0.00004681051,0.0001949813,0.000006162425],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00003488076,"about_ca_system_score_gemma":0.00001459768,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001148996,"about_ca_topic_score_gemma":0.000004881645,"domain_scores_codex":[0.9991314,0.000008552984,0.0001659428,0.0002003768,0.00008806377,0.0004056749],"domain_scores_gemma":[0.999626,0.00004599563,0.00001190866,0.0002458133,0.00002009633,0.00005019883],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00005359666,0.000102383,0.000464408,0.0003271611,0.0004501879,0.00004832142,0.001767803,0.1405925,0.7653632,0.03934482,0.005818219,0.04566742],"study_design_scores_gemma":[0.0004631957,0.0001023559,0.0001106019,0.00002893324,0.00001386742,0.0000583111,0.0001538805,0.9202543,0.07530625,0.002842846,0.0003276491,0.0003378319],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.917317,0.001205579,0.0778432,0.0002747084,0.00008094088,0.0001551409,0.000003180039,0.00189032,0.00122988],"genre_scores_gemma":[0.9917661,0.0007729008,0.007166417,0.00004286795,0.00005376889,0.00003489396,0.00000252627,0.00004616858,0.0001143406],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7796618,"threshold_uncertainty_score":0.6164479,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.03549360076408423,"score_gpt":0.213255191141616,"score_spread":0.1777615903775317,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}