{"id":"W2002748415","doi":"10.1109/ipfa.2012.6306300","title":"Failure analysis challenges and solution for thin package","year":2012,"lang":"en","type":"article","venue":"","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Soldering; Flip chip; Joint (building); Materials science; Integrated circuit packaging; Die (integrated circuit); Electronic packaging; Mechanical engineering; Packaging engineering; Structural engineering; Integrated circuit; Engineering; Composite material; Optoelectronics; Layer (electronics)","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.002626752,0.001138876,0.001346153,0.002235609,0.0009729502,0.002599507,0.002246943,0.001998784,0.008225188],"category_scores_gemma":[0.006447779,0.0006919602,0.001180318,0.0009261038,0.001257503,0.004152371,0.002147399,0.002850947,0.002833276],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001022843,"about_ca_system_score_gemma":0.001699566,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00224517,"about_ca_topic_score_gemma":0.001569954,"domain_scores_codex":[0.9979132,0.0003698165,0.00009533056,0.0004714036,0.00102993,0.0001203736],"domain_scores_gemma":[0.9935967,0.002689173,0.0004217468,0.0008206879,0.002303083,0.0001685513],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0001563418,0.0002598259,0.006121346,0.001282577,0.0002083565,0.0008236119,0.001051731,0.1325146,0.02301229,0.1772023,0.03219243,0.6251746],"study_design_scores_gemma":[0.00003802638,0.0002343968,0.004647749,0.0004851308,0.000106217,0.001329706,0.001064902,0.5607163,0.009383256,0.3386283,0.08319036,0.0001755119],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.01414121,0.004326987,0.9663993,0.00462562,0.0002205234,0.00009215581,0.000265318,0.0008573477,0.009071479],"genre_scores_gemma":[0.3003779,0.01027001,0.6540729,0.001396469,0.001172281,0.0004591182,0.0011303,0.0006001225,0.03052092],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.008225188,"threshold_uncertainty_score":0.02751595,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.02164322480016713,"score_gpt":0.2198153983661786,"score_spread":0.1981721735660114,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}