{"id":"W2047656416","doi":"10.5539/mas.v3n12p50","title":"The Quality Test of Wire Bonding","year":2009,"lang":"en","type":"article","venue":"Modern Applied Science","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":42,"is_retracted":false,"has_abstract":true,"ca_institutions":"","funders":"","keywords":"Wire bonding; Interconnection; Bond; Reliability (semiconductor); Quality (philosophy); Materials science; Dependability; Bond strength; Chip; Reliability engineering; Composite material; Computer science; Engineering; Layer (electronics); Telecommunications; Physics; Power (physics)","routes":{"ca_aff":false,"ca_fund":false,"ca_venue":true,"about_ca":false,"invisible_to_affiliation_only":true},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001027447,0.0004414406,0.0003833813,0.001212333,0.0004387324,0.0008572535,0.0009148865,0.001078475,0.002576523],"category_scores_gemma":[0.004841477,0.0001987095,0.0002952317,0.0008781931,0.00112895,0.001081965,0.0007220329,0.0005098367,0.000783185],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003614017,"about_ca_system_score_gemma":0.0003800727,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007467737,"about_ca_topic_score_gemma":0.0004147947,"domain_scores_codex":[0.9974114,0.0004022655,0.00009628973,0.0003470805,0.001594367,0.0001485759],"domain_scores_gemma":[0.9975554,0.0006133168,0.0003410638,0.0003155935,0.001066101,0.0001085605],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0007813807,0.0002183705,0.0232306,0.001310754,0.0001477714,0.001432662,0.0009742751,0.005393764,0.5603269,0.05052203,0.006591562,0.3490699],"study_design_scores_gemma":[0.0001085623,0.003973999,0.03266273,0.0002509604,0.0001580196,0.0036261,0.0007153364,0.03001912,0.8158737,0.01957873,0.0928304,0.000202283],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.3776613,0.0158875,0.5377714,0.001349622,0.002091584,0.0005180609,0.0009860175,0.001874385,0.06186014],"genre_scores_gemma":[0.9351261,0.00249281,0.05142901,0.0003964728,0.0002627096,0.0001502315,0.0005207809,0.000169394,0.009452344],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.002576523,"threshold_uncertainty_score":0.008619368,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.0160992696230776,"score_gpt":0.2596943890389978,"score_spread":0.2435951194159202,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}