{"id":"W2064861594","doi":"10.4028/www.scientific.net/kem.297-300.887","title":"Chip Warpage Damage Model for ACA Film Type Electronic Packages","year":2005,"lang":"en","type":"article","venue":"Key engineering materials","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"ca_institutions":"Kootenay Association for Science & Technology","funders":"","keywords":"Materials science; Delamination (geology); Chip; Flip chip; Interconnection; Composite material; Adhesive; Reliability (semiconductor); Electronic engineering; Electrical engineering; Computer science; Engineering","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0002757403,0.0003316732,0.0003518432,0.0001518336,0.00006411098,0.00008966107,0.0003450796,0.0002041179,0.00003322389],"category_scores_gemma":[0.0001023669,0.0003473411,0.00006434112,0.0001450902,0.00001943796,0.0001719448,0.00005021525,0.0002160363,0.00004958915],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001944774,"about_ca_system_score_gemma":0.00003304465,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000002127821,"about_ca_topic_score_gemma":0.000003212871,"domain_scores_codex":[0.9984105,0.000008382089,0.0002989586,0.0002586598,0.0001131068,0.0009104036],"domain_scores_gemma":[0.999387,0.0000520041,0.00003109172,0.0004381636,0.00002941488,0.00006227024],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.000006986753,0.000008438167,0.000002341278,0.0001360317,0.00005078407,8.837324e-7,0.0001143643,0.5112596,0.4826057,0.003536541,0.001895967,0.0003824262],"study_design_scores_gemma":[0.0002694151,0.00004622345,0.00005302271,0.00004203619,0.00002441597,0.000005784417,0.000005375446,0.5782588,0.4138877,0.0005576162,0.006468842,0.0003807753],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9093298,0.0009099127,0.08390589,0.0001509628,0.0004675708,0.000330994,0.00005499268,0.0045939,0.0002560126],"genre_scores_gemma":[0.9880625,0.0003537518,0.01054152,0.00002364342,0.0002435588,0.0001160012,0.00004401683,0.0001383498,0.0004766401],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.07873276,"threshold_uncertainty_score":0.9998978,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01041725875926076,"score_gpt":0.2108361384158838,"score_spread":0.2004188796566231,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}