{"id":"W2076295025","doi":"10.1109/itherm.2008.4544347","title":"Effect of integrated heat spreader on thermal performance and bump joint reliability for flip chip packages","year":2008,"lang":"en","type":"article","venue":"I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":2,"is_retracted":false,"has_abstract":true,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Heat spreader; Flip chip; Materials science; Soldering; Thermal grease; Composite material; Thermal; Joint (building); Reliability (semiconductor); Electronic packaging; Heat sink; Integrated circuit packaging; Mechanical engineering; Structural engineering; Layer (electronics); Thermal conductivity; Engineering; Integrated circuit; Optoelectronics; Thermodynamics","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001242968,0.0007936577,0.001110209,0.0001977089,0.0001744659,0.00005748712,0.0006188834,0.0004119131,0.00003384447],"category_scores_gemma":[0.00007687003,0.0006361538,0.0002501791,0.0003120189,0.000448692,0.0001867846,0.00006429356,0.001203286,0.00001463143],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001004539,"about_ca_system_score_gemma":0.0001583951,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001981798,"about_ca_topic_score_gemma":0.00001305241,"domain_scores_codex":[0.9964455,0.0002674268,0.0007825215,0.0007432355,0.0003631826,0.001398112],"domain_scores_gemma":[0.9984058,0.0003870672,0.0001731249,0.0008257212,0.00009949945,0.0001087724],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.003672707,0.001035517,0.01314409,0.005350987,0.002140961,0.00002219506,0.02201748,0.1480056,0.711934,0.009524532,0.0008058481,0.08234605],"study_design_scores_gemma":[0.01072997,0.02118278,0.01142399,0.004572099,0.0002002071,0.0001066418,0.003513613,0.5954323,0.3475931,0.0005178486,0.001076768,0.003650685],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9927532,0.001524028,0.0002572201,0.000114156,0.0003038597,0.00144984,0.00003771919,0.0007072377,0.002852719],"genre_scores_gemma":[0.9981807,0.0007756331,0.00002150026,0.00004219726,0.0001309735,0.0004975848,0.00002125767,0.0001386067,0.0001915804],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4474266,"threshold_uncertainty_score":0.999609,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01654936836482215,"score_gpt":0.2193801874118187,"score_spread":0.2028308190469965,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}