{"id":"W2093143482","doi":"10.1115/ipack2007-33687","title":"Effect of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array Package","year":2007,"lang":"en","type":"article","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"ca_institutions":"Advanced Micro Devices (Canada)","funders":"","keywords":"Ball grid array; Heat sink; Materials science; Integrated circuit packaging; Printed circuit board; Mechanical engineering; Chip-scale package; Electronic packaging; Finite element method; Composite material; Adhesive; Quad Flat No-leads package; Ball (mathematics); Wire bonding; Soldering; Structural engineering; Integrated circuit; Engineering; Wafer; Electrical engineering; Chip; Optoelectronics","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0008282056,0.0002031584,0.0004061926,0.0001135052,0.00002307468,0.000005560667,0.0002139484,0.0002023446,0.00001001561],"category_scores_gemma":[0.0005723417,0.0001609382,0.0001141019,0.000212371,0.00005313605,0.00004143243,0.00003012826,0.0003384239,0.000007926518],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001113061,"about_ca_system_score_gemma":0.00001445295,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00002100385,"about_ca_topic_score_gemma":0.00001794314,"domain_scores_codex":[0.9988002,0.00003819088,0.0003369628,0.0002121036,0.0002150039,0.0003975731],"domain_scores_gemma":[0.9983323,0.001059111,0.00002971859,0.0004992684,0.00002660813,0.00005305001],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001451058,0.00008359587,0.0006569565,0.0005416531,0.00005968341,0.000007885653,0.00004007971,0.003096204,0.9901969,0.002619052,0.000560181,0.001992656],"study_design_scores_gemma":[0.00041559,0.001236961,0.0009703643,0.0001143699,0.00002246975,0.000003893082,0.00001499071,0.003372671,0.9933094,0.0003333325,0.00005639548,0.0001495132],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9711381,0.00006283308,0.02439563,0.00004008055,0.0002322518,0.0001522356,0.000004326176,0.0009587608,0.003015744],"genre_scores_gemma":[0.9990504,0.00001765629,0.0008466693,0.000005391756,0.00002366623,0.000005816211,0.000002691788,0.00002580595,0.00002189316],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.02791227,"threshold_uncertainty_score":0.6562869,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.005527108610170006,"score_gpt":0.2279325021762917,"score_spread":0.2224053935661217,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}