{"id":"W2102464802","doi":"10.1109/tepm.2009.2019123","title":"Low-Stress Thermosonic Copper Ball Bonding","year":2009,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":45,"is_retracted":false,"has_abstract":true,"ca_institutions":"University of Waterloo","funders":"","keywords":"Ball (mathematics); Materials science; Copper; Ultrasonic sensor; Composite material; Shear stress; Shear (geology); Ultrasound; Electrical engineering; Metallurgy; Acoustics; Physics; Engineering; Mathematics; Geometry","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0001799252,0.0005342709,0.0003755104,0.0004236728,0.000434622,0.0001813339,0.000506591,0.0002152987,0.00003421797],"category_scores_gemma":[0.000003707903,0.0005689679,0.000211284,0.0002183028,0.00007126036,0.0002928257,0.000002205407,0.001464654,0.00007070778],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007206246,"about_ca_system_score_gemma":0.00005789332,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000006930285,"about_ca_topic_score_gemma":0.00003852417,"domain_scores_codex":[0.9973829,0.00003160988,0.0003609644,0.000502103,0.0003220603,0.001400366],"domain_scores_gemma":[0.999018,0.00008191805,0.00005568305,0.0006914135,0.00002346907,0.0001295143],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005476962,0.0003496462,0.00001229748,0.0001964724,0.0004568644,0.00005641468,0.001250297,0.6293992,0.08028035,0.003548023,0.0008714707,0.2835242],"study_design_scores_gemma":[0.0004425797,0.0001971692,0.00003779921,0.0001881698,0.0000505998,0.00003469818,0.00008339397,0.01458537,0.9797826,0.001838214,0.002075,0.0006843497],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.758431,0.00141324,0.2244917,0.0009863654,0.0009278371,0.0003897269,0.00002078514,0.007456134,0.005883193],"genre_scores_gemma":[0.9981008,0.0007111615,0.0003311135,0.0001358859,0.0000801869,0.00003329708,0.000004559339,0.0001052453,0.0004978135],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.8995023,"threshold_uncertainty_score":0.9996762,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.007038754233577107,"score_gpt":0.2076295932135606,"score_spread":0.2005908389799835,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}