{"id":"W2102936509","doi":"10.1115/1.1287928","title":"Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution","year":2000,"lang":"en","type":"article","venue":"Journal of Electronic Packaging","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":47,"is_retracted":false,"has_abstract":true,"ca_institutions":"University of Waterloo","funders":"","keywords":"Printed circuit board; Laplace transform; Electronic packaging; Component (thermodynamics); Thermal conduction; Integrated circuit packaging; Electronic component; Fourier series; Series (stratigraphy); Boundary value problem; Heat equation; Characterization (materials science); Laplace's equation; Computer science; Electronic engineering; Integrated circuit; Mechanical engineering; Materials science; Mathematical analysis; Mathematics; Engineering; Physics","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006301434,0.0003111203,0.0005086226,0.0003265826,0.0001393932,0.00004079365,0.0003238717,0.0001688965,0.0001015056],"category_scores_gemma":[0.00003264084,0.0002954236,0.0002083143,0.0004342842,0.0001073507,0.0006626134,0.00002755102,0.0008982159,0.000005113187],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005657203,"about_ca_system_score_gemma":0.0003672059,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00000938683,"about_ca_topic_score_gemma":0.00002342817,"domain_scores_codex":[0.9975686,0.0000623518,0.0007059773,0.0001866395,0.0004166514,0.001059752],"domain_scores_gemma":[0.9991509,0.0000436771,0.0003058942,0.0002995731,0.0001310652,0.00006889504],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001299743,0.00006669312,0.001109167,0.00007797671,0.0004247604,0.00001669019,0.0002239959,0.05444852,0.914665,0.001093217,0.00005787501,0.02768612],"study_design_scores_gemma":[0.003095029,0.001919583,0.009624405,0.001074446,0.0005663388,0.002017424,0.0001292438,0.4149941,0.5461304,0.01373193,0.005011937,0.001705164],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.985842,0.002750347,0.01051558,0.000224171,0.000147522,0.0001188206,0.000003872364,0.0002284115,0.0001692162],"genre_scores_gemma":[0.9982706,0.0005376235,0.0008279388,0.00001817003,0.0001839658,0.000003723475,0.000006430639,0.00006648237,0.00008505632],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3685346,"threshold_uncertainty_score":0.9999498,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.008190354954137651,"score_gpt":0.2072206201886563,"score_spread":0.1990302652345187,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}