{"id":"W2112405522","doi":"10.1109/iscas.2008.4542056","title":"Dynamic compact thermal model of a package","year":2008,"lang":"en","type":"article","venue":"","topic":"Heat Transfer and Optimization","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"ca_institutions":"Toronto Metropolitan University","funders":"National Science Council","keywords":"Ball grid array; Thermal; Electronic packaging; Heat sink; Integrated circuit packaging; Electronic engineering; Computer science; Chip-scale package; Heat flux; Junction temperature; Grid; Thermal resistance; Mechanical engineering; Materials science; Engineering; Heat transfer; Integrated circuit; Optoelectronics; Mechanics; Physics; Thermodynamics; Composite material","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00001219455,0.00003949796,0.0000592955,0.0000203394,0.00001055838,0.000001153196,0.00002873626,0.00002115734,0.0000673361],"category_scores_gemma":[5.898539e-7,0.00003418463,0.00002142883,0.00003836233,0.000009939979,0.00004540406,9.800261e-7,0.00002828266,0.000008351045],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000008337321,"about_ca_system_score_gemma":0.000005586975,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000006356055,"about_ca_topic_score_gemma":0.000004216911,"domain_scores_codex":[0.9997941,0.000002428557,0.00006768038,0.00002948253,0.00004137263,0.0000649318],"domain_scores_gemma":[0.9999042,0.000004632737,0.000001169104,0.00006160951,0.00000759895,0.0000207814],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.000001248714,0.000006480837,0.0001577091,0.000009997038,0.000005357382,5.032887e-7,0.0002417903,0.9710453,0.02824783,0.00008806672,0.00007591993,0.0001198411],"study_design_scores_gemma":[0.0001096927,0.000005245372,0.00187331,0.000002261886,0.000002047549,0.000001236933,0.000004740135,0.9877282,0.01021731,0.00001238598,0.000003372611,0.00004021064],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.5021918,0.00001598548,0.4631462,0.000008269036,0.0000120244,0.00002652393,0.000004027552,0.00008994876,0.03450521],"genre_scores_gemma":[0.9972996,0.00004115506,0.002505292,0.00001069784,0.000002234594,4.76678e-7,0.000004302799,0.00000951428,0.0001267932],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.4951077,"threshold_uncertainty_score":0.1394009,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01535961728417236,"score_gpt":0.2067211478430072,"score_spread":0.1913615305588348,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}