{"id":"W2113940391","doi":"10.1108/09540910410517068","title":"Design, materials and process for lead‐free assembly of high‐density packages","year":2004,"lang":"en","type":"article","venue":"Soldering and Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"ca_institutions":"Hewlett-Packard (Canada); Nortel (Canada)","funders":"","keywords":"Soldering; Surface-mount technology; Printed circuit board; Lead (geology); Reliability (semiconductor); Solder paste; Process (computing); Circuit reliability; Dip soldering; Electronic packaging; Materials science; Chip-scale package; Wave soldering; Manufacturing engineering; Mechanical engineering; Engineering; Chip; Computer science; Metallurgy; Composite material; Electrical engineering; Geology","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002254894,0.0002344766,0.0004300555,0.0001591563,0.0001094604,0.00002894499,0.0002365915,0.0003398421,5.724499e-7],"category_scores_gemma":[0.0001068235,0.000234217,0.00002089139,0.0001750565,0.0002417792,0.00008484282,0.0001085437,0.0001892468,6.90436e-7],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0000678396,"about_ca_system_score_gemma":0.00002498967,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00004832442,"about_ca_topic_score_gemma":0.00001978777,"domain_scores_codex":[0.9989318,0.000009311047,0.0002409279,0.0002973897,0.00008166446,0.00043887],"domain_scores_gemma":[0.9994276,0.00005844229,0.00005535179,0.0003779129,0.00005126884,0.00002944848],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001750988,0.00002058307,0.0001886934,0.0005258056,0.00008001328,0.000005542476,0.0002038933,0.01299436,0.9751108,0.008411499,0.0000273773,0.002413891],"study_design_scores_gemma":[0.0007229894,0.0001858193,0.0001602557,0.0001037204,0.00002325934,0.0000327845,0.0002573381,0.0007550603,0.9503763,0.04711142,0.00002535441,0.0002456914],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9156156,0.001546253,0.08013888,0.0006258625,0.0001152279,0.0002686738,0.000013983,0.001666961,0.000008548831],"genre_scores_gemma":[0.9842384,0.0005743172,0.01507607,0.000005720251,0.00001027442,0.00003778418,0.000002199067,0.00004172555,0.00001344897],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.06862286,"threshold_uncertainty_score":0.9551092,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01449132847782031,"score_gpt":0.2310214078525033,"score_spread":0.216530079374683,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}