{"id":"W2113940391","doi":"10.1108/09540910410517068","title":"Design, materials and process for lead‐free assembly of high‐density packages","year":2004,"lang":"en","type":"article","venue":"Soldering and Surface Mount Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":true,"ca_institutions":"Hewlett-Packard (Canada); Nortel (Canada)","funders":"","keywords":"Soldering; Surface-mount technology; Printed circuit board; Lead (geology); Reliability (semiconductor); Solder paste; Process (computing); Circuit reliability; Dip soldering; Electronic packaging; Materials science; Chip-scale package; Wave soldering; Manufacturing engineering; Mechanical engineering; Engineering; Chip; Computer science; Metallurgy; Composite material; Electrical engineering; Geology","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006852415,0.0007093289,0.000380061,0.0008049817,0.0005354936,0.0009395575,0.001081512,0.0006607415,0.001658631],"category_scores_gemma":[0.0007318844,0.0009508337,0.0004217039,0.0003078886,0.0003803819,0.000720253,0.0003380561,0.0006553009,0.001296746],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005232146,"about_ca_system_score_gemma":0.0007743248,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004267435,"about_ca_topic_score_gemma":0.000881282,"domain_scores_codex":[0.9992689,0.0001051731,0.00003387413,0.00006654597,0.0004803063,0.00004514511],"domain_scores_gemma":[0.9996715,0.00004478107,0.00009557825,0.00003225764,0.0001297933,0.00002621883],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001338223,0.0001983975,0.0005656364,0.0009859181,0.00004132868,0.0004531505,0.0003086583,0.0134852,0.8857492,0.0165071,0.0027483,0.07882348],"study_design_scores_gemma":[0.0002382671,0.003027928,0.004321215,0.00008652702,0.0001464724,0.001583475,0.00009124036,0.05022479,0.8463315,0.005106633,0.08873656,0.0001053582],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.0890267,0.004937162,0.8836752,0.0003828506,0.0007140089,0.0010451,0.0001843331,0.002233107,0.01780154],"genre_scores_gemma":[0.3972418,0.003567599,0.5785538,0.0002009195,0.0002137419,0.001097526,0.0002749151,0.0005705183,0.01827924],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.001658631,"threshold_uncertainty_score":0.005548656,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01449132847782031,"score_gpt":0.2310214078525033,"score_spread":0.216530079374683,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}