{"id":"W2124104377","doi":"10.1109/ectc.2009.5074129","title":"Underfill delamination to chip sidewall in advanced flip chip packages","year":2009,"lang":"en","type":"article","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":33,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Flip chip; Materials science; Delamination (geology); Composite material; Ball grid array; Passivation; Chip; Interconnection; Chip-scale package; Integrated circuit packaging; Material properties; Die (integrated circuit); Adhesive; Soldering; Integrated circuit; Optoelectronics; Layer (electronics); Nanotechnology; Computer science; Electrical engineering; Engineering","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009560879,0.0001375943,0.0001379903,0.0001583418,0.00002642323,0.00002208869,0.0001620345,0.00008794694,0.000006702414],"category_scores_gemma":[0.00007041171,0.0001351193,0.00002504827,0.0003207988,0.000009075182,0.0001013676,0.00001568994,0.0001931187,0.00003377232],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001414643,"about_ca_system_score_gemma":0.000008435897,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000008195067,"about_ca_topic_score_gemma":0.0001323782,"domain_scores_codex":[0.9992285,0.000008432998,0.0001503447,0.0001666808,0.00009118624,0.0003548599],"domain_scores_gemma":[0.9996776,0.00003002814,0.00001028408,0.0002327802,0.00001178691,0.00003753033],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001931167,0.0001102254,0.002101596,0.00005358976,0.00003425631,0.00003016038,0.001327009,0.1957195,0.1593338,0.03585846,0.004411349,0.6010007],"study_design_scores_gemma":[0.00178144,0.0007773633,0.1891879,0.0002850855,0.00001628504,0.00002453904,0.0008335456,0.04580832,0.6777908,0.0773006,0.004505546,0.001688501],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.971788,0.0003433774,0.007371659,0.001337321,0.00006995404,0.0001397162,6.928363e-7,0.002064536,0.01688471],"genre_scores_gemma":[0.9948837,0.00009945395,0.004455061,0.0001331146,0.00001525864,0.00001285419,0.000003072639,0.00001564002,0.0003818979],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.5993122,"threshold_uncertainty_score":0.5510005,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.007185287801610181,"score_gpt":0.22293163040628,"score_spread":0.2157463426046698,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}