{"id":"W2134577393","doi":"10.1109/ectc.2010.5490833","title":"Development of an 18 × 18 mm package-on-package using C4NP flip chip attach and back side grind","year":2010,"lang":"en","type":"article","venue":"","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Flip chip; Quad Flat No-leads package; Package on package; Die (integrated circuit); Chip-scale package; Grind; Integrated circuit packaging; Soldering; Grinding; Chip; Materials science; Wafer; Packaging engineering; Engineering drawing; Computer science; Mechanical engineering; Integrated circuit; Optoelectronics; Electrical engineering; Engineering; Composite material; Wafer dicing; Layer (electronics); Nanotechnology","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001475652,0.0002305764,0.000246705,0.0001387658,0.00008052519,0.00004046436,0.0002046732,0.0002019103,0.0005414317],"category_scores_gemma":[0.00004524991,0.0002004289,0.00003204435,0.0001533596,0.00009473789,0.0001619163,0.00009670525,0.0003146133,0.0001236599],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00002803082,"about_ca_system_score_gemma":0.00002769173,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.00001936098,"about_ca_topic_score_gemma":0.0002360208,"domain_scores_codex":[0.9989827,0.000008788837,0.0002971633,0.0002373653,0.0001610296,0.0003129211],"domain_scores_gemma":[0.9993536,0.0000449632,0.00004176003,0.0004416367,0.00002864054,0.00008939781],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001950325,0.0001460138,0.01199447,0.000271714,0.0001587467,0.00001098348,0.001319563,0.0006249238,0.9126956,0.001835798,0.001575743,0.06934694],"study_design_scores_gemma":[0.0009758564,0.00007928425,0.05761653,0.0001091831,0.00003076092,0.00004732766,0.000813446,0.004534793,0.9082949,0.0006825548,0.02584722,0.0009681173],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9719919,0.00003527806,0.006067499,0.00001952735,0.0001916495,0.0001410559,0.000006163249,0.0003912339,0.02115573],"genre_scores_gemma":[0.8310097,0.00000907914,0.1683874,0.00001579927,0.00003821862,0.000004628366,0.000009405915,0.00003590433,0.0004898322],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.1623199,"threshold_uncertainty_score":0.8173254,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.04527938184958245,"score_gpt":0.273495145407526,"score_spread":0.2282157635579436,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}