{"id":"W2146393746","doi":"10.1109/tepm.2005.863266","title":"Characteristics of Sn–Cu Solder Bump Formed by Electroplating for Flip Chip","year":2006,"lang":"en","type":"article","venue":"IEEE Transactions on Electronics Packaging Manufacturing","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":23,"is_retracted":false,"has_abstract":true,"ca_institutions":"University of Waterloo","funders":"","keywords":"Electroplating; Flip chip; Plating (geology); Materials science; Soldering; Substrate (aquarium); Analytical Chemistry (journal); Metallurgy; Physics; Nanotechnology; Chemistry; Chromatography; Adhesive","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000269764,0.0005600343,0.0004601293,0.0005331311,0.0001909413,0.0003064049,0.0005454451,0.0007877906,0.001881833],"category_scores_gemma":[0.0007047249,0.0003264429,0.0002277219,0.0006912648,0.0001607916,0.0005043268,0.0001367633,0.0002694101,0.0005013979],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004324078,"about_ca_system_score_gemma":0.0001858077,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001044289,"about_ca_topic_score_gemma":0.001374571,"domain_scores_codex":[0.999537,0.00003088313,0.00002689042,0.0001256902,0.0002105469,0.00006898399],"domain_scores_gemma":[0.9992719,0.0001396082,0.0001463536,0.00005849973,0.0003418844,0.0000416294],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0003430041,0.00003325818,0.001995701,0.0002585605,0.00003147722,0.0005791439,0.0002775129,0.0011602,0.9792629,0.0002114278,0.001318587,0.0145282],"study_design_scores_gemma":[0.00003018722,0.0009779203,0.01817331,0.00002479692,0.00005413986,0.0006587407,0.0001408863,0.01026804,0.9650096,0.0000823501,0.004545541,0.00003451173],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9866701,0.001211755,0.00721912,0.0001223487,0.000141947,0.00007195633,0.000641486,0.0006396472,0.003281673],"genre_scores_gemma":[0.9923873,0.0003490662,0.003844196,0.00004231774,0.00002243063,0.00004661518,0.0002878512,0.000056657,0.002963568],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001881833,"threshold_uncertainty_score":0.006295383,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.006306673522306281,"score_gpt":0.2002486619927317,"score_spread":0.1939419884704254,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}