{"id":"W2161130272","doi":"10.1109/tcpmt.2011.2177269","title":"Electroless Ni Plating to Compensate for Bump Height Variation in Cu–Cu 3-D Packaging","year":2012,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":19,"is_retracted":false,"has_abstract":true,"ca_institutions":"","funders":"University of Waterloo; Nanyang Technological University","keywords":"Materials science; Plating (geology); Microstructure; Shear strength (soil); Metallurgy; Electroless plating; Copper; Contact resistance; Pillar; Copper plating; Composite material; Daisy chain; Flip chip; Layer (electronics); Electroplating; Adhesive; Structural engineering","routes":{"ca_aff":false,"ca_fund":true,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":true},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002262501,0.0004020666,0.0002228657,0.0001903888,0.0001281017,0.0002737595,0.0006203886,0.0002926811,0.0002980835],"category_scores_gemma":[0.0004763034,0.0003154158,0.0001509213,0.0002030239,0.0001731527,0.0003147895,0.0002260405,0.0002565787,0.0001285002],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002959845,"about_ca_system_score_gemma":0.0001593722,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0006752396,"about_ca_topic_score_gemma":0.001524285,"domain_scores_codex":[0.999757,0.00002717301,0.00001466155,0.00005919794,0.0001117545,0.000030187],"domain_scores_gemma":[0.9997112,0.00005489752,0.00009666208,0.0000607888,0.00006294116,0.00001348692],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00003275654,0.00001004792,0.0004081799,0.00003141013,0.00000429126,0.00006627119,0.00002239014,0.0005611737,0.9930315,0.00006109848,0.00006998051,0.005700947],"study_design_scores_gemma":[0.000008319859,0.0001469314,0.003879175,0.000003469454,0.00001432759,0.0002059107,0.00001536349,0.006291972,0.9883298,0.00003128219,0.001063887,0.000009556912],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9445356,0.000842489,0.052256,0.00007609682,0.00006961552,0.00004059941,0.0000850306,0.0005487238,0.001545878],"genre_scores_gemma":[0.9692971,0.0002306337,0.0290475,0.00003545417,0.000009574494,0.00002396274,0.0000446774,0.00004789251,0.00126322],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0006752396,"threshold_uncertainty_score":0.002147496,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01469833692879095,"score_gpt":0.2261363404971476,"score_spread":0.2114380035683566,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}