{"id":"W2161311496","doi":"10.1109/iemt.1997.626936","title":"Silicon device pad design considerations for solder flip chip applications","year":2002,"lang":"en","type":"article","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Nortel (Canada)","funders":"","keywords":"Flip chip; Soldering; Passivation; Reliability (semiconductor); Materials science; Die (integrated circuit); Silicon; Chip; Mechanical engineering; Electronic engineering; Computer science; Reliability engineering; Optoelectronics; Electrical engineering; Engineering; Composite material; Nanotechnology; Layer (electronics)","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0005492967,0.0007214266,0.0005308816,0.0004958156,0.0005380597,0.001282702,0.001095177,0.001373356,0.0136572],"category_scores_gemma":[0.001175739,0.0003703656,0.0004251681,0.0003510065,0.0001912957,0.0008862646,0.0003434478,0.0004984518,0.006142091],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0004960837,"about_ca_system_score_gemma":0.0005325645,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005164066,"about_ca_topic_score_gemma":0.001554539,"domain_scores_codex":[0.9994792,0.00008461349,0.00003574495,0.00005277977,0.0002995858,0.00004810283],"domain_scores_gemma":[0.9994418,0.0001525864,0.0000336933,0.00003914444,0.0003066308,0.00002610205],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0004558631,0.0001549875,0.002967862,0.004216565,0.0001407643,0.002456071,0.0005344202,0.0293849,0.4617242,0.09247308,0.07714713,0.3283441],"study_design_scores_gemma":[0.0001243096,0.001634925,0.002957616,0.0004269613,0.0002409841,0.005246886,0.0003488574,0.04223323,0.1116178,0.01930802,0.8157938,0.00006659825],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.05417543,0.02371488,0.5954947,0.008480807,0.004758463,0.0008182853,0.0008043518,0.003570752,0.3081822],"genre_scores_gemma":[0.5157756,0.02277008,0.2737397,0.003096655,0.002137654,0.0005203641,0.001198562,0.0009629547,0.1797984],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.0136572,"threshold_uncertainty_score":0.04568791,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.06495612067180018,"score_gpt":0.2438823796719519,"score_spread":0.1789262590001518,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}