{"id":"W2298091904","doi":"10.1149/ma2014-02/34/1741","title":"Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding","year":2014,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Dalsa Corporation; Université de Montréal; Polytechnique Montréal","funders":"","keywords":"Materials science; Wafer bonding; Wafer; Tin; Thermocompression bonding; Anodic bonding; Wafer-level packaging; Context (archaeology); Nanotechnology; Diffusion bonding; Optoelectronics; Layer (electronics); Mechanical engineering; Composite material; Metallurgy; Engineering","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.001151479,0.000457928,0.000312312,0.0003505399,0.0004419726,0.000895415,0.0006320203,0.000861613,0.0006581026],"category_scores_gemma":[0.001166363,0.0007730916,0.0002785895,0.0002887077,0.0005091567,0.0009276271,0.0003989251,0.0005225492,0.0005053616],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003910189,"about_ca_system_score_gemma":0.0003864036,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003270544,"about_ca_topic_score_gemma":0.0007413921,"domain_scores_codex":[0.9992311,0.0001509135,0.00005645052,0.0001146371,0.0003763301,0.00007054579],"domain_scores_gemma":[0.9994138,0.0002430421,0.0001454861,0.00007624929,0.0001044205,0.00001708437],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0000694052,0.00005516551,0.00059992,0.0003432552,0.00001687714,0.0002109513,0.0001522017,0.001941567,0.9808635,0.002571019,0.0001910412,0.01298514],"study_design_scores_gemma":[0.00001253101,0.0006144812,0.001934999,0.00002399569,0.00003751458,0.0003695512,0.0001198876,0.004939848,0.986517,0.0003960257,0.005011941,0.00002230462],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9299847,0.01426358,0.04201475,0.0008704187,0.0002475611,0.0001859468,0.00008899484,0.0003290428,0.01201507],"genre_scores_gemma":[0.9373424,0.004707977,0.05404438,0.0001392776,0.00006504071,0.000166796,0.00008548886,0.0001019764,0.003346684],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001151479,"threshold_uncertainty_score":0.006089628,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.03194863733589564,"score_gpt":0.2763928861654112,"score_spread":0.2444442488295156,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}