{"id":"W2324019639","doi":"10.1109/tcpmt.2014.2375635","title":"Thermomechanical Characteristics of Copper Through-Silicon via Structures","year":2015,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":8,"is_retracted":false,"has_abstract":true,"ca_institutions":"University of Saskatchewan","funders":"Natural Sciences and Engineering Research Council of Canada; Canada Research Chairs; Cisco Systems","keywords":"Materials science; Electron backscatter diffraction; Misorientation; Copper; Wafer; Finite element method; Through-silicon via; Residual stress; Composite material; Silicon; Metallurgy; Substrate (aquarium); Optoelectronics; Electronic engineering; Microstructure; Structural engineering","routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00009107938,0.0002525204,0.0001400706,0.0004122226,0.0001314567,0.0002007659,0.0002195681,0.0002541622,0.0009822961],"category_scores_gemma":[0.0004714729,0.0001388626,0.0001282204,0.0003365063,0.0001960179,0.0002528951,0.0001051194,0.00008560587,0.0001251302],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0003987268,"about_ca_system_score_gemma":0.0001421644,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001581916,"about_ca_topic_score_gemma":0.001941756,"domain_scores_codex":[0.9998984,0.000006342875,0.000004729916,0.00002388135,0.00004709552,0.00001948827],"domain_scores_gemma":[0.9997162,0.000049671,0.00008640451,0.00003057598,0.0001011443,0.00001592837],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00009608647,0.00001848705,0.005442488,0.00005441248,0.00002116294,0.0002758249,0.000231816,0.003979938,0.9836568,0.0003951383,0.0002768173,0.005551173],"study_design_scores_gemma":[0.00002248339,0.001371958,0.1175573,0.00003054468,0.00007028792,0.0006937578,0.0004525101,0.05892782,0.8148544,0.0002908697,0.005674106,0.00005396078],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9981213,0.0001660601,0.0006271094,0.00001824334,0.000007183107,0.000005643605,0.000115617,0.00004826304,0.0008906483],"genre_scores_gemma":[0.9990941,0.00005739984,0.0002824242,0.000002940774,0.000002248216,0.000005190015,0.00006055403,0.000004594925,0.0004904696],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001581916,"threshold_uncertainty_score":0.003286064,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.02229779971607198,"score_gpt":0.2280479209746731,"score_spread":0.2057501212586011,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}