{"id":"W2555209850","doi":"10.4071/isom-2016-tp25","title":"Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect","year":2016,"lang":"en","type":"article","venue":"IMAPSource Proceedings","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"ca_institutions":"Université de Sherbrooke","funders":"","keywords":"Microelectronics; Interconnection; Flip chip; Soldering; Mechanical engineering; Die (integrated circuit); Integrated circuit; Flux (metallurgy); Computer science; Engineering physics; Manufacturing engineering; Engineering; Materials science; Nanotechnology; Electrical engineering; Telecommunications; Composite material","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004015754,0.0002425041,0.0002312424,0.000324148,0.0002526503,0.0005987033,0.0002751094,0.000461484,0.0004781753],"category_scores_gemma":[0.0003438008,0.0001335914,0.0001009439,0.0002270893,0.0002648129,0.0005405521,0.0003376295,0.0003387499,0.0001972924],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002486489,"about_ca_system_score_gemma":0.0001232328,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001630136,"about_ca_topic_score_gemma":0.0005355664,"domain_scores_codex":[0.9998287,0.00002446372,0.000009199785,0.00002416776,0.00008537962,0.0000280752],"domain_scores_gemma":[0.9996839,0.00007536299,0.00008463767,0.00003709237,0.0000999593,0.00001910238],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002449367,0.00002089233,0.001025722,0.0001058013,0.000005567646,0.0002214422,0.00007034779,0.001962334,0.9842321,0.0007327138,0.0001944226,0.01140425],"study_design_scores_gemma":[0.000005700345,0.0005888949,0.006182906,0.00002337172,0.00001186867,0.0005848337,0.0001557585,0.01445541,0.9690492,0.0004426993,0.008480382,0.00001897098],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9082229,0.002179136,0.08373544,0.0002813104,0.00007618577,0.0000779156,0.0001015169,0.0004231023,0.004902485],"genre_scores_gemma":[0.9639428,0.001019513,0.0333168,0.00008261684,0.00003365153,0.00002552767,0.00009259198,0.00003811156,0.001448286],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0005987033,"threshold_uncertainty_score":0.002123713,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.03749970856220621,"score_gpt":0.2569367603674947,"score_spread":0.2194370518052885,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}