{"id":"W2667104373","doi":"10.1109/tdmr.2017.2716943","title":"Wet Metallization of High Aspect Ratio TSV Using Electrografted Polymer Insulator to Suppress Residual Stress in Silicon","year":2017,"lang":"en","type":"article","venue":"IEEE Transactions on Device and Materials Reliability","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":9,"is_retracted":false,"has_abstract":true,"ca_institutions":"Dalsa Corporation; Institut National de la Recherche Scientifique; Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Microsystem; Materials science; Residual stress; Silicon; Through-silicon via; Silicon on insulator; Reliability (semiconductor); Stress (linguistics); Fabrication; Polymer; Optoelectronics; Composite material; Electronic engineering; Nanotechnology; Engineering","routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00005381141,0.0002526382,0.0001232651,0.0001380033,0.000122136,0.0002215636,0.0002350159,0.0001509502,0.0005006283],"category_scores_gemma":[0.0001362621,0.0001220429,0.000158297,0.0001224802,0.000246606,0.0002194347,0.0001847382,0.000186453,0.0001200146],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001431206,"about_ca_system_score_gemma":0.0001074002,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003483617,"about_ca_topic_score_gemma":0.0006699003,"domain_scores_codex":[0.9999394,0.000003907267,0.000002764913,0.00001589966,0.00002225254,0.00001572469],"domain_scores_gemma":[0.9999173,0.00001398198,0.00003482983,0.00001371958,0.00001211243,0.00000801569],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001476603,0.00000652228,0.0002602666,0.00003393049,0.000007251663,0.00008075011,0.00002985316,0.0003935519,0.9965425,0.0001208244,0.00005732936,0.002452418],"study_design_scores_gemma":[0.000003180436,0.0001613375,0.001985235,0.000002775269,0.000007687014,0.0001017104,0.00003656914,0.001614221,0.9950009,0.00003751312,0.001045237,0.000003667501],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9917729,0.000471546,0.006344931,0.00002780778,0.00004584352,0.00001435753,0.00004308317,0.0001292461,0.00115026],"genre_scores_gemma":[0.9959673,0.0002284377,0.002908072,0.0000121165,0.000007187264,0.000006998964,0.00003658093,0.00002261281,0.0008107366],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0005006283,"threshold_uncertainty_score":0.001674712,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01470847322138608,"score_gpt":0.250142572607168,"score_spread":0.2354340993857819,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}