{"id":"W2742359771","doi":"10.1109/ectc.2017.140","title":"Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package","year":2017,"lang":"en","type":"preprint","venue":"","topic":"Electrostatic Discharge in Electronics","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microelectronics; Materials science; Flip chip; Wafer; Reliability (semiconductor); Integrated circuit packaging; Quad Flat No-leads package; System in package; Humidity; Electronics; Electronic packaging; Chip-scale package; Optoelectronics; Chip; Electronic engineering; Integrated circuit; Electrical engineering; Nanotechnology; Composite material; Engineering; Layer (electronics)","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000138945,0.0003653958,0.0003431614,0.0001585727,0.0001040098,0.0002475886,0.0004535241,0.0005050636,0.001075306],"category_scores_gemma":[0.0001333331,0.0001995921,0.0001776575,0.0001462319,0.000174666,0.0003529872,0.0002314416,0.0002318526,0.0003538745],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001767165,"about_ca_system_score_gemma":0.00009755499,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001547893,"about_ca_topic_score_gemma":0.0002825734,"domain_scores_codex":[0.9998559,0.00001505826,0.000004985932,0.00004703188,0.00006267447,0.00001426575],"domain_scores_gemma":[0.9999135,0.00001787201,0.00001995496,0.00001915325,0.00001936416,0.00001032069],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005436325,0.00003274678,0.0005826969,0.00006820572,0.00001288836,0.00008215192,0.00001840277,0.0004356142,0.990505,0.0002431411,0.0002648207,0.007700087],"study_design_scores_gemma":[0.00001140095,0.0005722284,0.004951027,0.000004617389,0.00003559173,0.0003378544,0.0000197462,0.01339673,0.9764435,0.0001170778,0.00409616,0.00001392468],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8644935,0.002106398,0.1249663,0.000337595,0.0004169235,0.0001502073,0.0005818567,0.001873537,0.005073607],"genre_scores_gemma":[0.9326156,0.0005634925,0.06242768,0.0001790744,0.00006511128,0.00007408307,0.0001914125,0.00004122097,0.003842296],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.001075306,"threshold_uncertainty_score":0.0035972,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01167416119705883,"score_gpt":0.250217478096482,"score_spread":0.2385433168994232,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}