{"id":"W2759096899","doi":"10.1149/ma2006-02/35/1644","title":"High Rate Copper Filling Within High Aspect Ratio Through Silicon Vias for 3-D Chip Stacking","year":2006,"lang":"en","type":"article","venue":"ECS Meeting Abstracts","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":10,"is_retracted":false,"has_abstract":true,"ca_institutions":"Mitel (Canada)","funders":"","keywords":"Stacking; Copper; Materials science; Silicon; Chip; Through-silicon via; Optoelectronics; Three-dimensional integrated circuit; Electrical engineering; Metallurgy; Integrated circuit; Engineering; Chemistry","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0001476042,0.000222068,0.0001882332,0.0002315327,0.0002136851,0.0004259475,0.0002581816,0.0002553879,0.0007567443],"category_scores_gemma":[0.0003440086,0.0001472119,0.0001396908,0.0002163921,0.0002200675,0.0003270488,0.000243228,0.0001314128,0.0003099668],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002334766,"about_ca_system_score_gemma":0.0002176764,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0004518752,"about_ca_topic_score_gemma":0.001264588,"domain_scores_codex":[0.9999304,0.00001059754,0.000003376995,0.000009036368,0.00002867466,0.00001792761],"domain_scores_gemma":[0.9998283,0.00003833257,0.00004087804,0.00004418866,0.00003375432,0.0000145139],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001466748,0.000026667,0.0005862252,0.0001255681,0.00001048701,0.0002272871,0.00009498746,0.003937678,0.9763888,0.001788222,0.001357128,0.01531036],"study_design_scores_gemma":[0.00002975618,0.0004974208,0.002219878,0.00001793442,0.0000261315,0.0003185449,0.00006276942,0.02380369,0.9626056,0.0006146451,0.009782078,0.00002155435],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9442204,0.002544307,0.04186787,0.0002010824,0.000287396,0.00005857196,0.0002571959,0.001209133,0.009354108],"genre_scores_gemma":[0.9862308,0.0004129837,0.01151243,0.00001575153,0.00001889381,0.00001211183,0.00005790799,0.0000497808,0.001689327],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0007567443,"threshold_uncertainty_score":0.002531528,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01571941621324131,"score_gpt":0.2223226932061056,"score_spread":0.2066032769928643,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}