{"id":"W2887525176","doi":"10.1109/ectc.2018.00247","title":"Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package","year":2018,"lang":"en","type":"preprint","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":5,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada); Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Flip chip; Delamination (geology); Materials science; Moisture; Reliability (semiconductor); Interconnection; System in package; Integrated circuit packaging; Carbon nanotube; Chip; Printed circuit board; Electronic engineering; Composite material; Integrated circuit; Optoelectronics; Computer science; Electrical engineering; Telecommunications; Layer (electronics); Engineering","routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00006861863,0.0002624842,0.0001831778,0.0001868624,0.0000880118,0.0001989462,0.0002355548,0.0003772319,0.0006407309],"category_scores_gemma":[0.0001247351,0.0001658796,0.00008556931,0.0001435548,0.000229755,0.0003858991,0.0001915189,0.0001276334,0.0001810027],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001602292,"about_ca_system_score_gemma":0.00004625426,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0002218625,"about_ca_topic_score_gemma":0.0004242365,"domain_scores_codex":[0.9999167,0.000007955104,0.000002366557,0.00002884963,0.00003523015,0.000008829834],"domain_scores_gemma":[0.9999231,0.00001253036,0.00002559125,0.00001632345,0.00001569128,0.000006668266],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002421547,0.0000117959,0.0006463849,0.00003065438,0.000006374651,0.00005988719,0.00001620365,0.000786701,0.9944152,0.0001564003,0.00008438951,0.003761839],"study_design_scores_gemma":[0.000006484608,0.0002484279,0.01092959,0.000006150015,0.00001861849,0.000324233,0.00003300368,0.02041978,0.965219,0.0001462596,0.00263399,0.00001458942],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.947023,0.0008897266,0.04801054,0.00007304818,0.00008568777,0.0000395884,0.0002691975,0.0005993457,0.003009771],"genre_scores_gemma":[0.9819941,0.0002182933,0.01657959,0.00003154633,0.00001436962,0.00001393582,0.00005346294,0.00001176382,0.001082778],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0006407309,"threshold_uncertainty_score":0.002143443,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.008133899266339088,"score_gpt":0.2248510453820721,"score_spread":0.216717146115733,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}