{"id":"W2970709580","doi":"10.1109/ectc.2019.00053","title":"Package-on-Package Micro-BGA Microstructure Interaction with Bond and Assembly Parameter","year":2019,"lang":"en","type":"article","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interposer; Ball grid array; Soldering; Die (integrated circuit); Integrated circuit packaging; Package on package; Materials science; Wire bonding; Chip-scale package; System in package; Microstructure; Process (computing); Computer science; Mechanical engineering; Optoelectronics; Chip; Etching (microfabrication); Integrated circuit; Composite material; Layer (electronics); Nanotechnology; Engineering; Wafer; Telecommunications; Operating system","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.000178097,0.0003776977,0.0002220608,0.0001704151,0.0001391085,0.0003610377,0.0003188572,0.0002208846,0.002200108],"category_scores_gemma":[0.0003903705,0.000234734,0.0001771632,0.0002098785,0.0001462567,0.0002550762,0.0002736687,0.0002448329,0.0006608139],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002319846,"about_ca_system_score_gemma":0.0001862995,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005277057,"about_ca_topic_score_gemma":0.001153003,"domain_scores_codex":[0.9998122,0.0000181116,0.000004925731,0.00004037718,0.00007773411,0.00004680803],"domain_scores_gemma":[0.9997712,0.00006594849,0.00004815187,0.00005113036,0.00005169519,0.0000119277],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00009236979,0.00004041846,0.001978919,0.00008076984,0.00001382645,0.0001087097,0.00007106105,0.001687604,0.9822845,0.0001759437,0.0002839348,0.0131819],"study_design_scores_gemma":[0.000008093377,0.0004871043,0.03011306,0.000005816612,0.00002923858,0.0001587187,0.00005076416,0.008873959,0.9563567,0.00008779494,0.003811203,0.00001760226],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9630895,0.0003748697,0.0299553,0.00006603372,0.00006471526,0.00006538625,0.0004468732,0.001142252,0.004795013],"genre_scores_gemma":[0.9888341,0.0001488673,0.008754582,0.00003119086,0.00001176087,0.00005597252,0.0001745643,0.0001988422,0.001790138],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.002200108,"threshold_uncertainty_score":0.007360041,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.005612358838035673,"score_gpt":0.2052094080571328,"score_spread":0.1995970492190971,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}