{"id":"W2970709580","doi":"10.1109/ectc.2019.00053","title":"Package-on-Package Micro-BGA Microstructure Interaction with Bond and Assembly Parameter","year":2019,"lang":"en","type":"article","venue":"","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":7,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Interposer; Ball grid array; Soldering; Die (integrated circuit); Integrated circuit packaging; Package on package; Materials science; Wire bonding; Chip-scale package; System in package; Microstructure; Process (computing); Computer science; Mechanical engineering; Optoelectronics; Chip; Etching (microfabrication); Integrated circuit; Composite material; Layer (electronics); Nanotechnology; Engineering; Wafer; Telecommunications; Operating system","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.00004534817,0.0002051568,0.0001811731,0.000100888,0.00003668275,0.00008709546,0.0001101531,0.0001243432,0.00002193784],"category_scores_gemma":[0.00001322841,0.0001544822,0.00002764685,0.0001062241,0.00003473023,0.0001333479,0.00002851274,0.0003722018,0.00006997673],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00005801134,"about_ca_system_score_gemma":0.000007607258,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000009347362,"about_ca_topic_score_gemma":0.00001330049,"domain_scores_codex":[0.9992603,0.000007405803,0.0001105551,0.0002335909,0.00008297604,0.0003051788],"domain_scores_gemma":[0.9995028,0.00007495326,0.00002308179,0.0003489891,0.00001425457,0.00003593463],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00006048014,0.00002941779,0.01289906,0.0002054137,0.0002187986,0.00001972554,0.0004609902,0.0009585741,0.9628227,0.001660774,0.009768517,0.0108956],"study_design_scores_gemma":[0.0008397522,0.0003789919,0.009673153,0.0001544215,0.0000252283,0.0001542586,0.0004652282,0.002821265,0.9784072,0.0009211181,0.005547621,0.0006117657],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9928927,0.0001806444,0.001474991,0.0001744566,0.000147376,0.0001422964,0.000003859699,0.0009295917,0.004054111],"genre_scores_gemma":[0.995086,0.00005717309,0.004047232,0.00009121007,0.00001686613,0.000007976499,0.000006166869,0.00003983823,0.0006475422],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.01558454,"threshold_uncertainty_score":0.6299601,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.005612358838035673,"score_gpt":0.2052094080571328,"score_spread":0.1995970492190971,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}