{"id":"W3010531757","doi":"10.1109/tcpmt.2020.2978432","title":"A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior","year":2020,"lang":"en","type":"article","venue":"IEEE Transactions on Components Packaging and Manufacturing Technology","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":1,"is_retracted":false,"has_abstract":true,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada","keywords":"Bumping; Plating (geology); Materials science; Intermetallic; Electroplating; Flip chip; Metallurgy; Alloy; Layer (electronics); Composite material; Mechanical engineering; Engineering; Physics","routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.00006992886,0.0003008847,0.000415231,0.0003938623,0.0002100153,0.00003334983,0.0002172167,0.0001873878,0.000003865705],"category_scores_gemma":[0.00000709346,0.0003118404,0.00004388288,0.0002270459,0.00009012707,0.00009954806,0.00001246981,0.0008036484,0.000002414517],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.00004254942,"about_ca_system_score_gemma":0.00001005569,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.000008325937,"about_ca_topic_score_gemma":0.000007678087,"domain_scores_codex":[0.998609,0.0000250719,0.0003274413,0.000420974,0.0001683378,0.0004491879],"domain_scores_gemma":[0.9995742,0.00004194435,0.00006478434,0.0002088792,0.00001968856,0.00009047115],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0002913997,0.001801971,0.001881727,0.002133452,0.001676893,0.0004500553,0.007321918,0.178525,0.6463752,0.000314424,0.00001578986,0.1592121],"study_design_scores_gemma":[0.001361904,0.0004219599,0.0002895536,0.0001311664,0.0001269006,0.0001214858,0.001358769,0.03958079,0.9560581,0.0001077861,0.00002069583,0.0004208354],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9593991,0.0001579834,0.03772345,0.0002151957,0.00009993844,0.0004577177,0.000006223592,0.001923843,0.00001654062],"genre_scores_gemma":[0.9994705,0.0001129329,0.0002194879,0.00001411651,0.00001262637,0.000118699,0.000001270611,0.0000467948,0.000003622196],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3096829,"threshold_uncertainty_score":0.9999334,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.02715650784077665,"score_gpt":0.2559434605735102,"score_spread":0.2287869527327336,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}