{"id":"W4225260020","doi":"10.5104/jiep.25.191","title":"Introduction of Multi-Wiring Board Suitable for SDGs","year":2022,"lang":"en","type":"article","venue":"Journal of The Japan Institute of Electronics Packaging","topic":"Physics and Engineering Research Articles","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":false,"ca_institutions":"Optech (Canada)","funders":"","keywords":"On board; Printed circuit board; Business; Computer science; Engineering; Electrical engineering; Aerospace engineering","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":{"n_in":0,"stratum":"aff_core","weight":5595.2375,"opus":{"tier":"OUT","genre":"other","about_ca":false,"confidence":"high","reason":"Electronics packaging article introducing a multi-wiring board; a technology introduction with no research-practice object."},"gpt":{"tier":"OUT","genre":"other","about_ca":false,"confidence":"high","reason":"This technical article concerns multi-wiring boards and contains no indication that research itself is the object."},"grok":{"tier":"T3","genre":"infrastructure/announcement","about_ca":false,"confidence":"low","reason":"Title announces a multi-wiring board for SDGs; infrastructure/product introduction, abstract missing."}}}