{"id":"W4226175265","doi":"10.1016/j.microrel.2022.114533","title":"Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables","year":2022,"lang":"en","type":"article","venue":"Microelectronics Reliability","topic":"Integrated Circuits and Semiconductor Failure Analysis","field":"Engineering","cited_by":12,"is_retracted":false,"has_abstract":false,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"Natural Sciences and Engineering Research Council of Canada; IBM Canada; International Business Machines Corporation","keywords":"Flip chip; Delamination (geology); Wafer dicing; Materials science; Composite material; Chip; Structural engineering; Finite element method; Engineering; Adhesive; Electrical engineering; Layer (electronics)","routes":{"ca_aff":true,"ca_fund":true,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0004654945,0.0008502371,0.000809175,0.0004461403,0.000464408,0.0009284446,0.001775193,0.002022404,0.003611355],"category_scores_gemma":[0.00101286,0.0006181296,0.0009523737,0.0005477781,0.0007682102,0.0007451731,0.0004478539,0.0006746147,0.0003994979],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001036764,"about_ca_system_score_gemma":0.00112788,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.01963839,"about_ca_topic_score_gemma":0.01100502,"domain_scores_codex":[0.9997962,0.00004421506,0.00000592999,0.00004031863,0.00005327853,0.0000600582],"domain_scores_gemma":[0.9995378,0.0002510373,0.00007468178,0.00003416381,0.00007898235,0.00002323617],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.00001548145,0.00001053594,0.0001812224,0.00001180053,0.000005501978,0.00002833474,0.000009430651,0.9977407,0.0006924986,0.0006454454,0.00003604294,0.0006229293],"study_design_scores_gemma":[0.000002483635,0.000009705702,0.00009202237,0.000001010328,0.000003894984,0.000003272444,0.00000299298,0.9994786,0.0002935897,0.00006518708,0.00004580543,0.000001411496],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.6939889,0.000637401,0.2663793,0.0003698129,0.000109051,0.0001376045,0.0007243594,0.0009317827,0.03672178],"genre_scores_gemma":[0.9866568,0.0001348405,0.005676544,0.00002503926,0.00000860032,0.00005558466,0.0001030109,0.00004833435,0.007291237],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.01963839,"threshold_uncertainty_score":0.03904814,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.004998448562828437,"score_gpt":0.1803305768519856,"score_spread":0.1753321282891571,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}