{"id":"W4285103141","doi":"10.1109/ectc51906.2022.00224","title":"Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections","year":2022,"lang":"en","type":"article","venue":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada); Université de Sherbrooke","funders":"","keywords":"Curing (chemistry); Materials science; Flip chip; Electrical conductor; Composite material; Adhesive; Electrical resistivity and conductivity; Optoelectronics; Polymerization; Radiation; Thermal conductivity; Thermal; Wavelength; Polymer; Electrical engineering; Optics","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0002252307,0.0003906031,0.0002029734,0.0002890581,0.0001798683,0.0003376901,0.0003058882,0.0002211415,0.0009564023],"category_scores_gemma":[0.000522813,0.0001794236,0.0001766788,0.0002175359,0.0002231064,0.0002819795,0.0002580512,0.0005182672,0.0003127917],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001322005,"about_ca_system_score_gemma":0.0001776836,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0001554398,"about_ca_topic_score_gemma":0.0003753341,"domain_scores_codex":[0.9997712,0.00003341075,0.00001385346,0.00005252329,0.000100881,0.00002822195],"domain_scores_gemma":[0.9996262,0.0001032791,0.0001303446,0.00004960698,0.00007105641,0.00001956145],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00001023969,0.000004820597,0.00009022244,0.00003492332,0.000001838292,0.00004131145,0.00001629131,0.0001438576,0.9966165,0.00009803964,0.00002473486,0.002917206],"study_design_scores_gemma":[0.000002577281,0.0001385675,0.00125356,0.000004782151,0.000006493536,0.0001702365,0.000009720714,0.0007653039,0.9961648,0.0000243303,0.00145497,0.000004662987],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9217444,0.002282014,0.07036531,0.00008223275,0.00009671041,0.00007277716,0.0001120621,0.0003469418,0.004897556],"genre_scores_gemma":[0.9517738,0.0008662122,0.0442418,0.00004673493,0.00002410025,0.00004810565,0.00007108917,0.00006828257,0.002859871],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.0009564023,"threshold_uncertainty_score":0.003199518,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.01298956906218561,"score_gpt":0.2072445611972006,"score_spread":0.194254992135015,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}