{"id":"W4289782695","doi":"","title":"Challenges and Research for High Density. Highly Integrated Microelectronic Packaging.","year":2018,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microelectronics; Integrated circuit packaging; Electronic packaging; Computer science; Materials science; Integrated circuit; Optoelectronics; Engineering; Electrical engineering","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.003521685,0.0009305244,0.0009890265,0.000671964,0.0007259992,0.005082899,0.00248636,0.004115855,0.01427971],"category_scores_gemma":[0.003405966,0.0005497243,0.0005038086,0.001073156,0.001586118,0.007368399,0.001573308,0.001840329,0.005962196],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001633282,"about_ca_system_score_gemma":0.001588785,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0008466569,"about_ca_topic_score_gemma":0.001261485,"domain_scores_codex":[0.9990137,0.0001694838,0.00003146282,0.0001189933,0.0004943365,0.0001719967],"domain_scores_gemma":[0.9980172,0.0006946184,0.0001567276,0.0001787232,0.000736573,0.0002162518],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002344735,0.0003253024,0.00164975,0.004729573,0.0000948589,0.0005239947,0.0004391601,0.01186759,0.06248127,0.3329532,0.1030422,0.4816587],"study_design_scores_gemma":[0.00004800387,0.0007606704,0.003009629,0.001193312,0.00007224993,0.001704633,0.001579816,0.02827153,0.03016425,0.2355338,0.697571,0.00009107919],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"review","genre_gemma":"empirical","genre_scores_codex":[0.0364787,0.6129872,0.1201102,0.1026788,0.00774146,0.0002044555,0.0006354058,0.001264575,0.1178992],"genre_scores_gemma":[0.3498596,0.4255462,0.1222016,0.01140931,0.005592322,0.0004214288,0.001200554,0.0003417737,0.08342723],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.01427971,"threshold_uncertainty_score":0.04777032,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.03326266128066457,"score_gpt":0.2603942583360754,"score_spread":0.2271315970554108,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}