{"id":"W4289782695","doi":"","title":"Challenges and Research for High Density. Highly Integrated Microelectronic Packaging.","year":2018,"lang":"en","type":"preprint","venue":"HAL (Le Centre pour la Communication Scientifique Directe)","topic":"3D IC and TSV technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Institut interdisciplinaire d'innovation technologique; Université de Sherbrooke","funders":"","keywords":"Microelectronics; Integrated circuit packaging; Electronic packaging; Computer science; Materials science; Integrated circuit; Optoelectronics; Engineering; Electrical engineering","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.004259102,0.0003084798,0.0003623407,0.0003472038,0.0002555312,0.0002298994,0.000919092,0.0004769458,0.00001473026],"category_scores_gemma":[0.00108355,0.0003176603,0.00008389491,0.0002339517,0.0004514646,0.00007770608,0.00100939,0.001016325,0.00002234776],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0001916798,"about_ca_system_score_gemma":0.0001340198,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003995819,"about_ca_topic_score_gemma":0.002252943,"domain_scores_codex":[0.9971488,0.001090339,0.0003117452,0.0006494307,0.0002484203,0.0005512501],"domain_scores_gemma":[0.9951495,0.001177289,0.00009783616,0.00151855,0.001961521,0.00009528517],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00002914617,0.0002493849,0.0002052632,0.00135412,0.000392264,0.000006210257,0.00892633,0.00003473331,0.01399144,0.2791103,0.01264129,0.6830596],"study_design_scores_gemma":[0.001064334,0.000004616256,0.003585218,0.003705414,0.0000912806,0.00002370404,0.0007533577,0.02223722,0.7352607,0.1512896,0.08077656,0.001207974],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.7661919,0.04902729,0.1217989,0.02283225,0.0006390131,0.001749821,0.0001189448,0.003170713,0.03447114],"genre_scores_gemma":[0.9576092,0.01509942,0.02495914,0.00001137999,0.00003388404,0.00016583,0.0002099134,0.00007430127,0.001836919],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.7212692,"threshold_uncertainty_score":0.9999275,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.03326266128066457,"score_gpt":0.2603942583360754,"score_spread":0.2271315970554108,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}