{"id":"W4416877975","doi":"10.37665/smgvlzz35389","title":"Converting High Volume IC Manufacturing to CU Wire Packaging","year":2013,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Wire bonding; Original equipment manufacturer; Integrated circuit packaging; Lead frame; Reliability (semiconductor); Electronic packaging; Manufacturing cost; Die (integrated circuit); Integrated circuit; Wafer","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"metacan-v3-hybrid-931329e0061c","candidate_categories":[],"consensus_categories":[],"category_scores_codex":[0.0006731761,0.0007164157,0.0003527669,0.001033489,0.0004339206,0.001938559,0.000946708,0.0005581984,0.006720888],"category_scores_gemma":[0.001256043,0.0003956589,0.000505053,0.0009484713,0.0002853917,0.0009325285,0.0008094527,0.0008642557,0.003434482],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0007781179,"about_ca_system_score_gemma":0.0003803935,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.001047963,"about_ca_topic_score_gemma":0.001202765,"domain_scores_codex":[0.998857,0.0001048926,0.0000369316,0.0001316412,0.0007646572,0.0001048219],"domain_scores_gemma":[0.9990501,0.00009138345,0.00009980766,0.0002799725,0.0004463094,0.00003250996],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"not_applicable","study_design_scores_codex":[0.0002154994,0.0002260843,0.001776905,0.0009130923,0.00009553077,0.0009574798,0.0003314829,0.01511426,0.5021556,0.01645685,0.02814621,0.433611],"study_design_scores_gemma":[0.00005803397,0.00200605,0.007837984,0.0002161552,0.0001197433,0.001271935,0.0002588812,0.03594871,0.7100213,0.005434419,0.2367408,0.00008594649],"study_design_candidate":"not_applicable","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"methods","genre_scores_codex":[0.3001092,0.003703878,0.4106427,0.001019663,0.002532595,0.001266151,0.001197371,0.01644798,0.2630805],"genre_scores_gemma":[0.7589137,0.002049355,0.1854559,0.0006576251,0.000271637,0.0003015646,0.001263416,0.001253589,0.04983321],"genre_candidate":"methods","genre_consensus":"methods","teacher_disagreement_score":0.006720888,"threshold_uncertainty_score":0.02248365,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.007042090314165701,"score_gpt":0.2097320657973602,"score_spread":0.2026899754831945,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}