{"id":"W4416877975","doi":"10.37665/smgvlzz35389","title":"Converting High Volume IC Manufacturing to CU Wire Packaging","year":2013,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Wire bonding; Original equipment manufacturer; Integrated circuit packaging; Lead frame; Reliability (semiconductor); Electronic packaging; Manufacturing cost; Die (integrated circuit); Integrated circuit; Wafer","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow","insufficient_payload"],"consensus_categories":["insufficient_payload"],"category_scores_codex":[0.0002218452,0.0004931687,0.0003786974,0.0004716137,0.0002165535,0.0004441935,0.001116425,0.0002501004,0.002096731],"category_scores_gemma":[0.0002017121,0.0005694527,0.0001541003,0.0001959448,0.00008454113,0.0005721101,0.0004974679,0.0008557686,0.003033852],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.000780944,"about_ca_system_score_gemma":0.00005478555,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0007667583,"about_ca_topic_score_gemma":0.00002724127,"domain_scores_codex":[0.9971151,0.00002826957,0.0006321633,0.0006363659,0.0005254242,0.001062677],"domain_scores_gemma":[0.9988756,0.00008439788,0.0001255118,0.0005790552,0.0001372623,0.0001982425],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"design_other","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.00005864802,0.0003743009,0.05238079,0.0007778353,0.003333016,0.0002015805,0.005579202,0.08488794,0.1164414,0.02171968,0.09631794,0.6179277],"study_design_scores_gemma":[0.0024934,0.0003991599,0.1021297,0.002390346,0.0001482295,0.0001906314,0.00194806,0.3808291,0.4218369,0.02120993,0.06239834,0.004026076],"study_design_candidate":"design_other","study_design_consensus":null,"genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9543414,0.0004375216,0.02344184,0.009872939,0.004067711,0.0004061092,0.00002295914,0.001542698,0.005866889],"genre_scores_gemma":[0.9904286,0.0001108759,0.00332106,0.0002932857,0.0005730737,0.0001071837,0.00002538313,0.0001062631,0.005034248],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.6139016,"threshold_uncertainty_score":0.9996757,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.007042090314165701,"score_gpt":0.2097320657973602,"score_spread":0.2026899754831945,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}